WO2012165141A1 - Alignment device, and alignment method - Google Patents

Alignment device, and alignment method Download PDF

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Publication number
WO2012165141A1
WO2012165141A1 PCT/JP2012/062479 JP2012062479W WO2012165141A1 WO 2012165141 A1 WO2012165141 A1 WO 2012165141A1 JP 2012062479 W JP2012062479 W JP 2012062479W WO 2012165141 A1 WO2012165141 A1 WO 2012165141A1
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WO
WIPO (PCT)
Prior art keywords
alignment
spin chuck
substrate
target object
rotating
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PCT/JP2012/062479
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French (fr)
Japanese (ja)
Inventor
瀧本泰弘
月本浩明
藤田大輔
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タツモ株式会社
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Application filed by タツモ株式会社 filed Critical タツモ株式会社
Priority to KR1020137032932A priority Critical patent/KR20140025513A/en
Priority to JP2013517950A priority patent/JP5763759B2/en
Publication of WO2012165141A1 publication Critical patent/WO2012165141A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Definitions

  • the present invention relates to an alignment apparatus and an alignment method, and more particularly to an alignment apparatus provided with a suction rotation means and an alignment method using the suction rotation means.
  • dicing can be successfully performed by aligning a dicing tape as described in Patent Document 1 before dicing.
  • the alignment object for example, a substrate
  • the position of the rotating alignment object is detected
  • the alignment object is moved based on the difference between the target position and the detected position.
  • an alignment apparatus that performs alignment.
  • the alignment apparatus will be described in detail.
  • a spin chuck adsorbs near the center of a substrate (alignment target), and the substrate is rotated.
  • the substrate is irradiated with light from the front surface side of the substrate, and light is detected on the back surface side to determine whether or not the substrate exists at the position where the light is irradiated. Since the substrate is rotating, the position of the entire substrate can be confirmed by continuously performing the above-described irradiation and detection of light.
  • the alignment apparatus performs alignment by detecting the position of the substrate and moving the alignment object based on the difference between the target position and the detected position.
  • the alignment accuracy may decrease.
  • the spin chuck normally adsorbs only the vicinity of the center of the alignment target, deformation such as bending due to its own weight may occur in the outer peripheral portion of the alignment target. In this case, since the position of the end of the alignment object is shifted with the deformation, the above-described alignment apparatus cannot accurately detect the position of the substrate. As a result, the alignment accuracy decreases.
  • Patent Document 2 proposes providing a support means for supporting the outer peripheral portion of the dicing tape from the back side.
  • Patent Document 2 since the support means of Patent Document 2 is in contact with the back surface of the dicing tape and is stationary, there is a problem that friction acts when the alignment target object is rotated, a load is applied to the spin chuck, and power consumption increases. It was.
  • This invention is made in view of the said subject, and it aims at providing the alignment technique which suppresses a deformation
  • the alignment apparatus of the present invention includes suction rotation means and support means.
  • the suction rotation means rotates by sucking the alignment object.
  • the support means supports the rotating alignment target object at a position different from the position where the suction rotation means is sucked.
  • the alignment apparatus of the present invention is characterized in that the support means is configured to rotate in synchronization with the alignment object.
  • the alignment method of the present invention includes an adsorption step for adsorbing an alignment object by an adsorption rotation unit, a rotation step for rotating the alignment object by rotating the adsorption rotation unit, and the rotating alignment object.
  • the support means and the alignment object are supported by the support means while supporting the alignment object at a position different from the position where the suction rotation means is attracted. It is characterized by being rotated synchronously.
  • the present invention it is possible to support the portion where the suction rotation means on the alignment target object is not attracted by the support means, and to suppress deformation such as bending due to the weight of the alignment target object in that portion. Further, since the support means rotates in synchronization with the alignment object, there is almost no friction acting on the alignment object, and the load applied to the suction rotation means is reduced.
  • the present invention it is possible to suppress the deformation of the alignment object and perform highly accurate alignment with a low load.
  • FIG. 2A is a top view schematically showing a schematic configuration of the alignment apparatus 100.
  • FIG. 2A shows a state where the alignment target object 10 is not mounted
  • FIG. 2B shows a state where the alignment target object 10 is mounted.
  • FIG. 2 is sectional drawing which shows typically schematic operation
  • FIG. 2 is a block diagram schematically illustrating an outline function of an alignment apparatus according to an embodiment of the present invention.
  • the alignment apparatus 100 is an apparatus that performs alignment (position alignment) of the alignment target object 10.
  • FIG. 1 is a cross-sectional view schematically showing a schematic configuration of the alignment apparatus 100.
  • 2A and 2B are top views schematically showing a schematic configuration of the alignment apparatus 100.
  • FIG. 2A shows a state in which the alignment target object 10 is not mounted
  • FIG. 2B shows a state in which the alignment target object 10 is mounted. .
  • the casing 101 of the alignment apparatus 100 includes a spin chuck (adsorption rotation means) 110 that adsorbs and rotates the alignment target object 10.
  • the housing 101 is also provided with a bridge 102 that is a structure that is a structure that supports the imaging unit 120.
  • the imaging unit 120 constitutes a position detection unit of the alignment object 10 (strictly, the substrate 11) of the image recognition unit 156 of the main control unit 150 (not shown) provided in the housing 101.
  • the image recognition unit 156 recognizes the image captured by the imaging unit 120 and detects the position of the alignment target object 10.
  • the alignment apparatus 100 further includes a support member (support means) 130 that supports the rotating alignment object 10 at a position different from the position where the spin chuck 110 is attracted.
  • the support member 130 has a tray shape whose periphery is formed one step higher than the inside thereof.
  • the support member 130 has a mounting hole 130A at the center, and the spin chuck 110 is mounted in the mounting hole 130A.
  • the support member 130 is fixed to the outer periphery of the spin chuck 110.
  • the support member 130 rotates together with the spin chuck 110.
  • the support member 130 is configured to support the outer peripheral portion of the alignment target object 10 from below with the outer peripheral contact portion 130B.
  • the alignment apparatus 100 includes such a support member 130, the alignment device 100 supports the outer peripheral portion of the rotating alignment object 10 that is not attracted by the spin chuck 110, and the alignment object 10 is bent by its own weight. Etc. can be suppressed. Thereby, the alignment apparatus 100 can avoid the fall of the precision in the position detection of the alignment target object 10 resulting from a deformation
  • an alignment target object 10 has a configuration in which a substrate 11 is attached to a dicing tape (film) 12 that is larger than the substrate 11. It is held by a dicing frame 13 that is a frame (see FIG. 1 and FIGS. 2A and 2B). Therefore, as shown in FIG. 2B, the support member 130 supports at least a portion of the dicing tape 12 to which the substrate 11 is not attached, and the dicing frame 13 presses the support portion. preferable. Accordingly, it is possible to support the dicing tape 12 that is flexible and easily deformed, and to suppress deformation of the alignment target object 10.
  • the alignment apparatus 100 employs the imaging unit 120 and the image recognition unit 156 as position detection means, so that the material of the substrate 11 that is the position detection target is glass or silicon (In some cases, even a laminated substrate of glass and silicon) can be used.
  • the dicing tape 12 may be an opaque material or color.
  • the spin chuck 110 only needs to be capable of vacuum-sucking the alignment target object 10 by a mechanism such as a vacuum pump and rotating the suctioned alignment target object 10 in the in-plane direction of the suction surface.
  • a spin chuck composed of a general vacuum chuck and a motor can be used.
  • the alignment apparatus 100 includes a spin chuck position adjusting unit 111 that moves the spin chuck 110 in the in-plane direction of the suction surface.
  • the alignment apparatus 100 aligns the alignment target object 10 to a target position by moving the spin chuck 110 by the spin chuck position adjusting unit 111 based on the position of the alignment target object 10 detected by the position detection unit.
  • the alignment object 10 is transported to the alignment apparatus 100 using a robot arm 50.
  • the robot arm 50 holds the dicing frame 13 portion at the end of the alignment target object 10 with a sucker or the like, and conveys the alignment target object 10 from the processing apparatus in the previous process to the alignment apparatus 100.
  • FIG. 4 is a top view schematically showing a schematic configuration of the spin chuck position adjusting unit 111.
  • the spin chuck position adjusting unit 111 for example, as shown in FIG. 4, a tray 115 that supports the spin chuck 110, an L-shaped movable plate 114 that horizontally supports the tray 115, and the movable plate 114 are arranged on the surface of the suction surface.
  • First linear moving means 112 that linearly moves in the first direction (x-axis direction) in the inward direction (direction along the paper surface), and second that moves the movable plate 114 in the second direction (y-axis direction).
  • the structure provided with the linear movement means 113 is mentioned.
  • the movable plate 114 is moved linearly in the x-axis direction and the y-axis direction by the first linear moving unit 112 and the second linear moving unit 113, thereby moving the movable plate 114.
  • the spin chuck 110 supported by the tray 115 moves in the in-plane direction of the suction surface according to the movement distance.
  • the position detection means for detecting the position of the alignment object 10 includes the imaging unit 120 and the image recognition unit 156.
  • the imaging unit 120 is provided on the bridge 102 and images the alignment object 10 from above.
  • the imaging unit 120 images a region including the end portion of the substrate 11 of the alignment target object 10.
  • the imaging unit 120 captures an angle detection mark such as an orientation flat provided on the substrate 11.
  • the image recognizing unit 156 calculates a deviation and a rotation angle between the center of the alignment object 10 and the rotation center (that is, the rotation center of the spin chuck 110) based on the image captured by the imaging unit 120. Thereby, the position of the alignment target object 10 can be detected.
  • FIG. 5 is a block diagram schematically illustrating the schematic function of the alignment apparatus.
  • the main control unit 150 of the alignment apparatus 100 includes a spin chuck control unit 154 and an image recognition unit 156.
  • the spin chuck control unit 154 causes the spin chuck 110 to attract the alignment target object 10 and rotate it.
  • the support member 130 also rotates together with the spin chuck 110.
  • the support member 130 supports the outer periphery of the alignment target object 10 to prevent the alignment target object 10 from being deformed. Further, since the support member 130 rotates in synchronization with the alignment target object 10, there is almost no friction acting on the alignment target object 10, and the load applied to the spin chuck 110 is reduced.
  • the image recognition unit 156 images the substrate 11 by the imaging unit 120.
  • the image recognizing unit 156 acquires an image captured by the image capturing unit 120 and calculates a difference between the position of the alignment target object 10 and the target position of alignment input in advance to the main control unit 150 based on the image.
  • information indicating the difference is transmitted to the spin chuck controller 154.
  • the spin chuck control unit 154 controls the spin chuck 110 and the spin chuck position adjustment unit 111 so that the received difference is eliminated.
  • the alignment apparatus 100 can perform alignment of the alignment target object 10.
  • the main control unit 150 of the alignment apparatus 100 may be configured by hardware logic. Alternatively, it may be realized by software using a CPU (Central Processing Unit) as follows.
  • CPU Central Processing Unit
  • the main control unit 150 includes a CPU such as an MPU that executes instructions of a program that implements each function, a ROM (Read Only Memory) that stores the program, and a RAM (Random Access that expands the program into an executable format). Memory) and a storage device (storage medium) such as a memory for storing the program and various data.
  • a CPU such as an MPU that executes instructions of a program that implements each function
  • ROM Read Only Memory
  • RAM Random Access that expands the program into an executable format
  • Memory and a storage device (storage medium) such as a memory for storing the program and various data.
  • the object of the present invention is not limited to the case where the program is stored in the program memory of the main control unit 150, but the program code of the program (executable program, intermediate code program, or source program) is recorded. This can also be achieved by supplying a recording medium to the apparatus, and reading and executing the program code recorded on the recording medium.
  • 10-Alignment object 11-Substrate 12-Dicing tape (film) 13-Dicing frame 50-Robot arm 100-Alignment device 101-Case 102-Bridge 110-Spin chuck (adsorption rotation means) 111-Spin chuck position adjustment unit 120-Image pickup unit 130-Support member (support means) 150—Main control unit 154—Spin chuck control unit 156—Image recognition unit

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The present invention inhibits the deformation of an object to be aligned and aligns the object to be aligned with high precision at a light load. This alignment device (100) is provided with a spin chuck (110) and a supporting member (130). The spin chuck (110) sticks to and rotates an object (10) to be aligned. The supporting member (130) supports the rotating object (10) to be aligned at a position that is different from the position at which the spin chuck (110) sticks to the object (10) to be aligned. Moreover, the supporting body (130) is configured so as to rotate in synchronization with the object (10) to be aligned.

Description

アライメント装置およびアライメント方法Alignment apparatus and alignment method
　本発明は、アライメント装置およびアライメント方法に関し、より詳しくは、吸着回転手段を備えるアライメント装置、および吸着回転手段を用いたアライメント方法に関する。 The present invention relates to an alignment apparatus and an alignment method, and more particularly to an alignment apparatus provided with a suction rotation means and an alignment method using the suction rotation means.
　基板等に精密な加工を行う際、加工前に加工対象の基板等のアライメント（位置の調整）をしておくことは有用である。例えば、特許文献１に記載のようなダイシングテープが貼付された基板について、ダイシング前にアライメントすることにより、首尾よくダイシングを行うことが出来る。 When performing precise processing on a substrate or the like, it is useful to align the substrate to be processed (position adjustment) before processing. For example, dicing can be successfully performed by aligning a dicing tape as described in Patent Document 1 before dicing.
　アライメントのためのアライメント装置にはいくつか種類がある。そのうちの一つとして、アライメント対象物（例えば、基板）を回転させ、回転中のアライメント対象物の位置を検出して、目的とする位置と検出した位置との差に基づいてアライメント対象物を移動させることにより、アライメントを行うアライメント装置がある。 There are several types of alignment devices for alignment. As one of them, the alignment object (for example, a substrate) is rotated, the position of the rotating alignment object is detected, and the alignment object is moved based on the difference between the target position and the detected position. Thus, there is an alignment apparatus that performs alignment.
　前記アライメント装置について詳しく説明する。前記アライメント装置では、まず、基板（アライメント対象物）の中央付近をスピンチャックが吸着し、当該基板を回転させる。そして、前記基板に対して、基板の表面側から光を照射し、裏面側において光を検出することにより、光を照射した位置に基板が存在するか否かを判定する。前記基板は回転しているので、上述の光の照射および検出を継続して行うことにより、前記基板全体の位置を確認することが出来る。前記アライメント装置は、以上のように、前記基板の位置を検出して、目的とする位置と検出した位置との差に基づいてアライメント対象物を移動させることにより、アライメントを行う。 The alignment apparatus will be described in detail. In the alignment apparatus, first, a spin chuck adsorbs near the center of a substrate (alignment target), and the substrate is rotated. Then, the substrate is irradiated with light from the front surface side of the substrate, and light is detected on the back surface side to determine whether or not the substrate exists at the position where the light is irradiated. Since the substrate is rotating, the position of the entire substrate can be confirmed by continuously performing the above-described irradiation and detection of light. As described above, the alignment apparatus performs alignment by detecting the position of the substrate and moving the alignment object based on the difference between the target position and the detected position.
　しかしながら、上述したアライメント装置において、アライメントの精度が低下する場合がある。 However, in the alignment apparatus described above, the alignment accuracy may decrease.
　すなわち、スピンチャックは、通常、アライメント対象物の中央付近のみを吸着するため、アライメント対象物の外周部分において自重による撓み等の変形が生じる場合がある。この場合には、前記変形に伴いアライメント対象物の端部の位置等がずれるため、上述したアライメント装置では前記基板の位置を正確に検出することができない。そのため、アライメントの精度が低下する。 That is, since the spin chuck normally adsorbs only the vicinity of the center of the alignment target, deformation such as bending due to its own weight may occur in the outer peripheral portion of the alignment target. In this case, since the position of the end of the alignment object is shifted with the deformation, the above-described alignment apparatus cannot accurately detect the position of the substrate. As a result, the alignment accuracy decreases.
　特に、特許文献１に記載のような、ダイシングテープが貼付された基板は、ダイシングテープのみからなる部分が自重で撓み易く、この問題が顕著となる。そこで、特許文献２には、ダイシングテープの外周部を裏側から支持する支持手段を設けることが提案されている。 In particular, as described in Patent Document 1, a substrate on which a dicing tape is affixed is easily bent due to its own weight, and this problem becomes significant. Therefore, Patent Document 2 proposes providing a support means for supporting the outer peripheral portion of the dicing tape from the back side.
　しかしながら、特許文献２の支持手段はダイシングテープの裏面に接触し、しかも静止しているため、アライメント対象物の回転時に摩擦が作用し、スピンチャックに負荷が掛かり、消費電力が大きくなる問題があった。 However, since the support means of Patent Document 2 is in contact with the back surface of the dicing tape and is stationary, there is a problem that friction acts when the alignment target object is rotated, a load is applied to the spin chuck, and power consumption increases. It was.
特開２００６－１３５２７２号公報JP 2006-135272 A 特開２０１１－３８３７号公報JP 2011-3837 A
　本発明は前記課題に鑑みてなされたものであり、アライメント対象物の変形を抑制し、高精度のアライメントを低負荷で行うアライメント技術を提供することを目的とする。 This invention is made in view of the said subject, and it aims at providing the alignment technique which suppresses a deformation | transformation of an alignment target object and performs highly accurate alignment with a low load.
　本発明のアライメント装置は、吸着回転手段および支持手段を備える。吸着回転手段は、アライメント対象物を吸着して回転する。支持手段は、前記吸着回転手段が吸着している位置とは異なる位置において、回転する前記アライメント対象物を支持する。そして、本発明のアライメント装置は、前記支持手段が前記アライメント対象物と同期して回転するように構成されたことを特徴としている。 The alignment apparatus of the present invention includes suction rotation means and support means. The suction rotation means rotates by sucking the alignment object. The support means supports the rotating alignment target object at a position different from the position where the suction rotation means is sucked. The alignment apparatus of the present invention is characterized in that the support means is configured to rotate in synchronization with the alignment object.
　また、本発明のアライメント方法は、アライメント対象物を吸着回転手段により吸着させる吸着工程と、前記吸着回転手段を回転させることにより、前記アライメント対象物を回転させる回転工程と、回転する前記アライメント対象物の位置を検出する位置検出工程と、前記アライメント対象物を移動させる位置調整工程と、を含む。そして、本発明のアライメント方法は、前記回転工程では、支持手段によって、前記吸着回転手段が吸着している位置とは異なる位置において前記アライメント対象物を支持しながら前記支持手段も前記アライメント対象物と同期して回転させることを特徴とする。 The alignment method of the present invention includes an adsorption step for adsorbing an alignment object by an adsorption rotation unit, a rotation step for rotating the alignment object by rotating the adsorption rotation unit, and the rotating alignment object. A position detecting step for detecting the position of the alignment object, and a position adjusting step for moving the alignment object. Then, in the alignment method of the present invention, in the rotation step, the support means and the alignment object are supported by the support means while supporting the alignment object at a position different from the position where the suction rotation means is attracted. It is characterized by being rotated synchronously.
　本発明によると、支持手段によりアライメント対象物におる吸着回転手段が吸着されていない部分を支持して、その部分におけるアライメント対象物の自重による撓み等の変形を抑制することが出来る。また、支持手段がアライメント対象物と同期して回転することにより、アライメント対象物に作用する摩擦がほとんどなく、吸着回転手段へ掛かる負荷が軽減される。 According to the present invention, it is possible to support the portion where the suction rotation means on the alignment target object is not attracted by the support means, and to suppress deformation such as bending due to the weight of the alignment target object in that portion. Further, since the support means rotates in synchronization with the alignment object, there is almost no friction acting on the alignment object, and the load applied to the suction rotation means is reduced.
　本発明によれば、アライメント対象物の変形を抑制し、高精度のアライメントを低負荷で行うことが出来る。 According to the present invention, it is possible to suppress the deformation of the alignment object and perform highly accurate alignment with a low load.
本発明の一実施形態に係るアライメント装置の概略構成を模式的に示す断面図である。It is sectional drawing which shows typically schematic structure of the alignment apparatus which concerns on one Embodiment of this invention. アライメント装置１００の概略構成を模式的に示す上面図であり、図２（Ａ）はアライメント対象物１０の未搭載状態、図２（Ｂ）はアライメント対象物１０を搭載した状態を現わしている。FIG. 2A is a top view schematically showing a schematic configuration of the alignment apparatus 100. FIG. 2A shows a state where the alignment target object 10 is not mounted, and FIG. 2B shows a state where the alignment target object 10 is mounted. . 本発明の一実施形態に係るアライメント装置にアライメント対象物を搬送する概略動作を模式的に示す断面図である。It is sectional drawing which shows typically schematic operation | movement which conveys an alignment target object to the alignment apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るアライメント装置のスピンチャック位置調整部の概略構成を模式的に示す上面図である。It is a top view which shows typically schematic structure of the spin chuck position adjustment part of the alignment apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るアライメント装置の概略機能を模式的に説明するブロック図である。FIG. 2 is a block diagram schematically illustrating an outline function of an alignment apparatus according to an embodiment of the present invention.
　本発明の一実施形態に係るアライメント装置について、図１～図５を参照して説明する。アライメント装置１００は、アライメント対象物１０のアライメント（位置合わせ）を行う装置である。図１は、アライメント装置１００の概略構成を模式的に示す断面図である。図２は、アライメント装置１００の概略構成を模式的に示す上面図であり、（Ａ）はアライメント対象物１０の未搭載状態、（Ｂ）はアライメント対象物１０を搭載した状態を現わしている。 An alignment apparatus according to an embodiment of the present invention will be described with reference to FIGS. The alignment apparatus 100 is an apparatus that performs alignment (position alignment) of the alignment target object 10. FIG. 1 is a cross-sectional view schematically showing a schematic configuration of the alignment apparatus 100. 2A and 2B are top views schematically showing a schematic configuration of the alignment apparatus 100. FIG. 2A shows a state in which the alignment target object 10 is not mounted, and FIG. 2B shows a state in which the alignment target object 10 is mounted. .
　図１に示すように、アライメント装置１００の筐体１０１は、アライメント対象物１０を吸着して回転させるスピンチャック（吸着回転手段）１１０を備えている。 As shown in FIG. 1, the casing 101 of the alignment apparatus 100 includes a spin chuck (adsorption rotation means) 110 that adsorbs and rotates the alignment target object 10.
　筐体１０１にはまた、撮像部１２０を支える構造体である構造体であるブリッジ１０２が設けられている。撮像部１２０は、筐体１０１内に設けられた主制御部１５０（図示せず）の画像認識部１５６のアライメント対象物１０（厳密には、基板１１）の位置検出手段を構成している。画像認識部１５６は、撮像部１２０の撮像した画像を認識して、アライメント対象物１０の位置を検出する。 The housing 101 is also provided with a bridge 102 that is a structure that is a structure that supports the imaging unit 120. The imaging unit 120 constitutes a position detection unit of the alignment object 10 (strictly, the substrate 11) of the image recognition unit 156 of the main control unit 150 (not shown) provided in the housing 101. The image recognition unit 156 recognizes the image captured by the imaging unit 120 and detects the position of the alignment target object 10.
　アライメント装置１００はさらに、スピンチャック１１０が吸着している位置とは異なる位置において、回転するアライメント対象物１０を支持する支持部材（支持手段）１３０を備えている。支持部材１３０は、図１、図２（Ａ），（Ｂ）に示すように、周囲がその内側よりも一段高く形成された盆状を呈している。支持部材１３０は、中心に取付穴１３０Ａを有し、取付穴１３０Ａにスピンチャック１１０が装着される。換言すれば、支持部材１３０がスピンチャック１１０の外周に固定される。これにより、支持部材１３０はスピンチャック１１０と共に回転することになる。支持部材１３０は、外周の接触部１３０Ｂでアライメント対象物１０の外周部分を下から支持するようになっている。 The alignment apparatus 100 further includes a support member (support means) 130 that supports the rotating alignment object 10 at a position different from the position where the spin chuck 110 is attracted. As shown in FIGS. 1, 2A, and 2B, the support member 130 has a tray shape whose periphery is formed one step higher than the inside thereof. The support member 130 has a mounting hole 130A at the center, and the spin chuck 110 is mounted in the mounting hole 130A. In other words, the support member 130 is fixed to the outer periphery of the spin chuck 110. As a result, the support member 130 rotates together with the spin chuck 110. The support member 130 is configured to support the outer peripheral portion of the alignment target object 10 from below with the outer peripheral contact portion 130B.
　アライメント装置１００は、このような支持部材１３０を備えているため、回転するアライメント対象物１０におけるスピンチャック１１０によって吸着されてない外周部分を支持して、その部分におけるアライメント対象物１０の自重による撓み等の変形を抑制することが出来る。これにより、アライメント装置１００は、アライメント対象物の変形に起因するアライメント対象物１０の位置検出における精度の低下を回避し、高精度のアライメントを行うことが出来る。 Since the alignment apparatus 100 includes such a support member 130, the alignment device 100 supports the outer peripheral portion of the rotating alignment object 10 that is not attracted by the spin chuck 110, and the alignment object 10 is bent by its own weight. Etc. can be suppressed. Thereby, the alignment apparatus 100 can avoid the fall of the precision in the position detection of the alignment target object 10 resulting from a deformation | transformation of the alignment target object, and can perform highly accurate alignment.
　図１に示すように、本実施形態に係るアライメント対象物１０は、基板１１が、基板１１よりも大きいダイシングテープ（フィルム）１２に貼付された構成を有しており、ダイシングテープ１２は、外枠であるダイシングフレーム１３によって保持されている（以上、図１および図２（Ａ），（Ｂ）参照。）。したがって、図２（Ｂ）に示すように、支持部材１３０は、ダイシングテープ１２における基板１１が貼付されていない部分を少なくとも支持し、ダイシングフレーム１３はその支持部分を押えるようになっていることが好ましい。これにより、柔軟で変形の起こりやすいダイシングテープ１２を支持してアライメント対象物１０の変形を抑制することが可能となる。 As shown in FIG. 1, an alignment target object 10 according to the present embodiment has a configuration in which a substrate 11 is attached to a dicing tape (film) 12 that is larger than the substrate 11. It is held by a dicing frame 13 that is a frame (see FIG. 1 and FIGS. 2A and 2B). Therefore, as shown in FIG. 2B, the support member 130 supports at least a portion of the dicing tape 12 to which the substrate 11 is not attached, and the dicing frame 13 presses the support portion. preferable. Accordingly, it is possible to support the dicing tape 12 that is flexible and easily deformed, and to suppress deformation of the alignment target object 10.
　前記のように、アライメント装置１００は、位置検出手段に撮像部１２０および画像認識部１５６を採用することで、位置検出対象であるの基板１１の素材がガラスであってもシリコンであっても（場合によってはガラスとシリコンの積層基板であっても）対応可能である。また、光学的な位置検出ではないので、ダイシングテープ１２が不透光な素材や色でも良い。 As described above, the alignment apparatus 100 employs the imaging unit 120 and the image recognition unit 156 as position detection means, so that the material of the substrate 11 that is the position detection target is glass or silicon ( (In some cases, even a laminated substrate of glass and silicon) can be used. In addition, since the optical position is not detected, the dicing tape 12 may be an opaque material or color.
　スピンチャック１１０は、真空ポンプ等の機構によりアライメント対象物１０を真空吸着して、吸着された状態のアライメント対象物１０を吸着面の面内方向に回転させることが出来るものであれば良い。例えば、一般的な真空チャックおよびモータから構成されるスピンチャックを用いることが出来る。 The spin chuck 110 only needs to be capable of vacuum-sucking the alignment target object 10 by a mechanism such as a vacuum pump and rotating the suctioned alignment target object 10 in the in-plane direction of the suction surface. For example, a spin chuck composed of a general vacuum chuck and a motor can be used.
　また、アライメント装置１００は、スピンチャック１１０を前記吸着面の面内方向に移動させるスピンチャック位置調整部１１１を備えている。アライメント装置１００は、位置検出手段が検出したアライメント対象物１０の位置に基づいて、スピンチャック位置調整部１１１によりスピンチャック１１０を移動させることによって、アライメント対象物１０を目的の位置へとアライメントする。 Also, the alignment apparatus 100 includes a spin chuck position adjusting unit 111 that moves the spin chuck 110 in the in-plane direction of the suction surface. The alignment apparatus 100 aligns the alignment target object 10 to a target position by moving the spin chuck 110 by the spin chuck position adjusting unit 111 based on the position of the alignment target object 10 detected by the position detection unit.
　図３に示すように、アライメント装置１００に対するアライメント対象物１０の搬送は、ロボットアーム５０を用いて行われる。ロボットアーム５０は、吸盤等によりアライメント対象物１０の端のダイシングフレーム１３部分を保持して、前工程の処理装置からアライメント装置１００へとアライメント対象物１０を搬送する。 As shown in FIG. 3, the alignment object 10 is transported to the alignment apparatus 100 using a robot arm 50. The robot arm 50 holds the dicing frame 13 portion at the end of the alignment target object 10 with a sucker or the like, and conveys the alignment target object 10 from the processing apparatus in the previous process to the alignment apparatus 100.
　図４は、スピンチャック位置調整部１１１の概略構成を模式的に示す上面図である。スピンチャック位置調整部１１１としては、例えば、図４に示すように、スピンチャック１１０を支持するトレー１１５、トレー１１５を水平に支持するＬ字形の可動板１１４、可動板１１４を前記吸着面の面内方向（紙面に沿う方向。）における第１方向（ｘ軸方向。）に直線移動させる第１直線移動手段１１２、および可動板１１４を第２方向（ｙ軸方向。）方向に移動させる第２直線移動手段１１３を備えた構成が挙げられる。このようなスピンチャック位置調整部１１１によると、第１直線移動手段１１２および第２直線移動手段１１３により可動板１１４をｘ軸方向およびｙ軸方向に直線移動させることにより、可動板１１４の動きに同期してその移動距離に応じてトレー１１５に支持されたスピンチャック１１０が吸着面の面内方向に移動する。 FIG. 4 is a top view schematically showing a schematic configuration of the spin chuck position adjusting unit 111. As the spin chuck position adjusting unit 111, for example, as shown in FIG. 4, a tray 115 that supports the spin chuck 110, an L-shaped movable plate 114 that horizontally supports the tray 115, and the movable plate 114 are arranged on the surface of the suction surface. First linear moving means 112 that linearly moves in the first direction (x-axis direction) in the inward direction (direction along the paper surface), and second that moves the movable plate 114 in the second direction (y-axis direction). The structure provided with the linear movement means 113 is mentioned. According to such a spin chuck position adjusting unit 111, the movable plate 114 is moved linearly in the x-axis direction and the y-axis direction by the first linear moving unit 112 and the second linear moving unit 113, thereby moving the movable plate 114. Synchronously, the spin chuck 110 supported by the tray 115 moves in the in-plane direction of the suction surface according to the movement distance.
　上述したように、アライメント対象物１０の位置を検出する位置検出手段は、撮像部１２０および画像認識部１５６を含んで構成される。撮像部１２０はブリッジ１０２に設けられており、アライメント対象物１０を上方から撮像する。 As described above, the position detection means for detecting the position of the alignment object 10 includes the imaging unit 120 and the image recognition unit 156. The imaging unit 120 is provided on the bridge 102 and images the alignment object 10 from above.
　本実施形態においては、撮像部１２０は、アライメント対象物１０の基板１１の端部を含む領域を撮像する。また、撮像部１２０は、基板１１に設けられたオリフラ等の角度検出用の印を撮像する。画像認識部１５６は、撮像部１２０の撮像した画像に基づいて、アライメント対象物１０の中心と、回転中心（すなわち、スピンチャック１１０の回転中心）とのずれ、および回転角度を算出する。これにより、アライメント対象物１０の位置を検出することが出来る。 In the present embodiment, the imaging unit 120 images a region including the end portion of the substrate 11 of the alignment target object 10. The imaging unit 120 captures an angle detection mark such as an orientation flat provided on the substrate 11. The image recognizing unit 156 calculates a deviation and a rotation angle between the center of the alignment object 10 and the rotation center (that is, the rotation center of the spin chuck 110) based on the image captured by the imaging unit 120. Thereby, the position of the alignment target object 10 can be detected.
　アライメント装置１００の概略動作を以下に説明する。図５は、アライメント装置の概略機能を模式的に説明するブロック図である。図５に示すように、アライメント装置１００の主制御部１５０は、スピンチャック制御部１５４および画像認識部１５６を備えている。 Schematic operation of the alignment apparatus 100 will be described below. FIG. 5 is a block diagram schematically illustrating the schematic function of the alignment apparatus. As shown in FIG. 5, the main control unit 150 of the alignment apparatus 100 includes a spin chuck control unit 154 and an image recognition unit 156.
　まず、アライメント装置１００に、アライメント対象物１０が搬入されると、スピンチャック制御部１５４は、スピンチャック１１０にアライメント対象物１０を吸着させ、回転させる。このとき、スピンチャック１１０と共に支持部材１３０も回転する。支持部材１３０はアライメント対象物１０の外周部を支持して、アライメント対象物１０が変形することを防ぐ。また、支持部材１３０がアライメント対象物１０と同期して回転することにより、アライメント対象物１０に作用する摩擦がほとんどなく、スピンチャック１１０へ掛かる負荷が軽減される。 First, when the alignment target object 10 is carried into the alignment apparatus 100, the spin chuck control unit 154 causes the spin chuck 110 to attract the alignment target object 10 and rotate it. At this time, the support member 130 also rotates together with the spin chuck 110. The support member 130 supports the outer periphery of the alignment target object 10 to prevent the alignment target object 10 from being deformed. Further, since the support member 130 rotates in synchronization with the alignment target object 10, there is almost no friction acting on the alignment target object 10, and the load applied to the spin chuck 110 is reduced.
　続いて、画像認識部１５６は、撮像部１２０により基板１１を撮像する。画像認識部１５６は、撮像部１２０の撮像した画像を取得して、当該画像に基づき、アライメント対象物１０の位置と、主制御部１５０にあらかじめ入力されたアライメントの目的の位置との差を算出して、当該差を示す情報をスピンチャック制御部１５４に送信する。スピンチャック制御部１５４は、受信した前記差が解消されるように、スピンチャック１１０およびスピンチャック位置調整部１１１を制御する。以上により、アライメント装置１００は、アライメント対象物１０のアライメントを行うことが出来る。 Subsequently, the image recognition unit 156 images the substrate 11 by the imaging unit 120. The image recognizing unit 156 acquires an image captured by the image capturing unit 120 and calculates a difference between the position of the alignment target object 10 and the target position of alignment input in advance to the main control unit 150 based on the image. Then, information indicating the difference is transmitted to the spin chuck controller 154. The spin chuck control unit 154 controls the spin chuck 110 and the spin chuck position adjustment unit 111 so that the received difference is eliminated. As described above, the alignment apparatus 100 can perform alignment of the alignment target object 10.
　アライメント装置１００の主制御部１５０は、ハードウエアロジックによって構成すればよい。または、次のように、ＣＰＵ（Central Processing Unit）を用いてソフトウエアによって実現しても良い。 The main control unit 150 of the alignment apparatus 100 may be configured by hardware logic. Alternatively, it may be realized by software using a CPU (Central Processing Unit) as follows.
　すなわち、主制御部１５０は、各機能を実現するプログラムの命令を実行するＭＰＵなどのＣＰＵ、このプログラムを格納したＲＯＭ（Read Only Memory）、前記プログラムを実行可能な形式に展開するＲＡＭ（Random Access Memory）、および、前記プログラムおよび各種データを格納するメモリ等の記憶装置（記憶媒体）を備えている。 That is, the main control unit 150 includes a CPU such as an MPU that executes instructions of a program that implements each function, a ROM (Read Only Memory) that stores the program, and a RAM (Random Access that expands the program into an executable format). Memory) and a storage device (storage medium) such as a memory for storing the program and various data.
　そして、本発明の目的は、主制御部１５０のプログラムメモリに固定的に担持されている場合に限らず、前記プログラムのプログラムコード（実行形式プログラム、中間コードプログラム、または、ソースプログラム）を記録した記録媒体を装置に供給し、装置が前記記録媒体に記録されている前記プログラムコードを読み出して実行することによっても、達成可能である。 The object of the present invention is not limited to the case where the program is stored in the program memory of the main control unit 150, but the program code of the program (executable program, intermediate code program, or source program) is recorded. This can also be achieved by supplying a recording medium to the apparatus, and reading and executing the program code recorded on the recording medium.
　上述の実施形態の説明は、すべての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The description of the above-described embodiment is an example in all respects, and should be considered as not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.
　１０－アライメント対象物
　１１－基板
　１２－ダイシングテープ（フィルム）
　１３－ダイシングフレーム
　５０－ロボットアーム
　１００－アライメント装置
　１０１－筐体
　１０２－ブリッジ
　１１０－スピンチャック（吸着回転手段）
　１１１－スピンチャック位置調整部
　１２０－撮像部
　１３０－支持部材（支持手段）
　１５０－主制御部
　１５４－スピンチャック制御部
　１５６－画像認識部 10-Alignment object 11-Substrate 12-Dicing tape (film)
13-Dicing frame 50-Robot arm 100-Alignment device 101-Case 102-Bridge 110-Spin chuck (adsorption rotation means)
111-Spin chuck position adjustment unit 120-Image pickup unit 130-Support member (support means)
150—Main control unit 154—Spin chuck control unit 156—Image recognition unit

Claims (5)

  1. 　アライメント対象物を吸着して回転する吸着回転手段と、
    　前記吸着回転手段が吸着している位置とは異なる位置において、回転する前記アライメント対象物を支持する支持手段と、を備え、
    　前記支持手段が前記アライメント対象物と同期して回転するように構成されたことを特徴とするアライメント装置。     A suction rotating means for sucking and rotating the alignment object;
    A support means for supporting the rotating alignment object at a position different from the position where the suction rotation means is sucked;
    An alignment apparatus, wherein the support means is configured to rotate in synchronization with the alignment object.
  2. 　前記支持手段が前記吸着回転手段によって回転される請求項１に記載のアライメント装置。 The alignment apparatus according to claim 1, wherein the support means is rotated by the suction rotation means.
  3. 　前記アライメント対象物は基板が当該基板よりも大きいフィルムに貼付された構成を有しており、前記支持手段は、前記フィルムにおける基板が貼付されていない部分を少なくとも支持する請求項１または２に記載のアライメント装置。 The alignment object has a configuration in which a substrate is attached to a film larger than the substrate, and the support means supports at least a portion of the film where the substrate is not attached. Alignment equipment.
  4. 　前記アライメント対象物の位置を検出する位置検出手段を備えている請求項１または２に記載のアライメント装置。 3. The alignment apparatus according to claim 1, further comprising position detection means for detecting a position of the alignment object.
  5. 　アライメント対象物を吸着回転手段により吸着させる吸着工程と、
    　前記吸着回転手段を回転させることにより、前記アライメント対象物を回転させる回転工程と、
    　回転する前記アライメント対象物の位置を検出する位置検出工程と、
    　前記アライメント対象物を移動させる位置調整工程と、を含むアライメント方法であって、
    　前記回転工程では、支持手段によって、前記吸着回転手段が吸着している位置とは異なる位置において前記アライメント対象物を支持しながら前記支持手段も前記アライメント対象物と同期して回転させることを特徴とするアライメント方法。     An adsorption process for adsorbing an alignment object by an adsorption rotation means;
    A rotation step of rotating the alignment object by rotating the suction rotation means;
    A position detecting step for detecting the position of the rotating alignment object;
    A position adjustment step of moving the alignment object, and an alignment method comprising:
    In the rotation step, the support means is rotated in synchronization with the alignment object while the alignment object is supported at a position different from the position where the adsorption rotation means is attracted by the support means. Alignment method.
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