WO2012159395A1

WO2012159395A1 - Sealed water-cooling method and device for cooling electronic device

Info

Publication number: WO2012159395A1
Application number: PCT/CN2011/079781
Authority: WO
Inventors: 周哲明
Original assignee: Zhou Zheming
Priority date: 2011-05-20
Filing date: 2011-09-16
Publication date: 2012-11-29
Also published as: CN102791107B; CN102791107A

Abstract

The present invention relates to a sealed water-cooling method and device for cooling an electronic device, and more particularly, to a method and device for cooling computer devices such as a server cabinet, a server, a network device, a PC, a laptop and so on. The sealed water-cooling device in the present technical solution includes a water-cooling system, a sealing system and an internal hot and cold exchanger. The water cooling system is used to dissipate the heat of the computer device, and the computer device is sealed by means of the sealing system to be isolated from the water-cooling system, so as to prevent the leakage of the cooling system damaging the computer device. The hot and cold exchanger installed in the sealed chassis, mainly a heat-conductive hot and cold exchanger, exchanges the heat from the computer device inside the chassis into the housing of the chassis, then exchanges the heat from the housing of the chassis into the water-cooling system by way of the water-cooling system connected to the chassis. The water-cooling system can be connected to the water-cooling system in the machine room. The advantages of the present technical solution are that heat dissipation efficiency of the computer device can be improved significantly, the loss of the heat dissipation can be reduced, and the computer device can be water-proof protected.

Description

说明书 Description

一种用于冷却电子设备的密封水冷方法和设备技术领域 Sealed water cooling method and device for cooling electronic equipment

[0001]本发明涉及电子设备，特别是涉及服务器机柜、服务器、网络设备、 PC、笔记本电脑等电脑设备产生的热量的排散。 [0001] The present invention relates to electronic devices, and more particularly to the dissipation of heat generated by computer equipment such as server cabinets, servers, network devices, PCs, and notebook computers.

背景技术 Background technique

[0002]随着信息技术的发展，电子设备的集成度越来越高，计算机和服务器的性能越来越强，其相应的功率也越来越大，在带来性能提升的同时也带来了不断上升的发热量。当前，数据中心和高性能计算服务器也在朝着更高密度、更高计算能力的方向发展，与此同时也带来了更高的能耗和热量密度，为这些设备进行冷却和降低能耗成了很大的挑战。 [0002] With the development of information technology, the integration of electronic devices is getting higher and higher, the performance of computers and servers is getting stronger and stronger, and the corresponding power is getting larger and larger, which brings about performance improvement. The rising heat. Today, data centers and high-performance computing servers are also moving toward higher density and higher computing power, while at the same time bringing higher energy and heat densities, cooling and reducing energy consumption for these devices. It has become a big challenge.

[0003]目前数据中心普遍采取风冷散热的方法，其弊端是散热效率低和能耗高。例如传统机房普遍采用的精密空调开孔地板下送风进行制冷的方式，单台机柜的最大散热量为 3KW ~ 5KW，而现在 42U高的刀片式服务器机架功率可高达 15KW。有关统计表明，制冷设备的能源消耗要占到整个数据中心能耗的 50%左右。 [0003] At present, data centers generally adopt air cooling and heat dissipation methods, and the disadvantages are low heat dissipation efficiency and high energy consumption. For example, the precision air conditioning in the traditional machine room is used to cool the air under the floor. The maximum heat dissipation of a single cabinet is 3KW ~ 5KW, and now the 42U high blade server rack power can be as high as 15KW. Statistics show that the energy consumption of refrigeration equipment accounts for about 50% of the energy consumption of the entire data center.

[0004] 另外风冷散热的发展也存在一定的限制。根据散热的基本公式为 Q=G*AT*C (Q : 总冷量， G : 流量， ΔΤ : 温差， C : 比热系数)。使用风冷，在比热系数 C相对不变的情况下，总散热量的提高需要提高流量 G和 ΔΤ，即需要提高风速和降低冷风温度。其限制在于，一方面风速受到设备承受能力的限制，难以满足更高密度的计算需求。另一方面更高风速和更低冷风温度需要消耗更多的能源。 [0004] In addition, there are certain limitations in the development of air-cooling heat dissipation. According to the basic formula of heat dissipation, Q=G*AT*C (Q: total cooling capacity, G: flow rate, ΔΤ: temperature difference, C: specific heat coefficient). With air cooling, in the case where the specific heat coefficient C is relatively constant, the increase in total heat dissipation requires an increase in the flow rates G and ΔΤ, that is, an increase in the wind speed and a decrease in the cold air temperature. The limitation is that, on the one hand, the wind speed is limited by the ability of the equipment to withstand, and it is difficult to meet the higher density computing requirements. On the other hand, higher wind speeds and lower cold air temperatures require more energy.

[0005]水的比热系数是空气的 3500倍之多，使用水冷能大幅提高散热效率和降低能耗。 [0005] The specific heat coefficient of water is 3,500 times that of air. The use of water cooling can greatly improve heat dissipation efficiency and reduce energy consumption.

[0006]现有的水冷技术方面，一部份方案是通过直接在发热量大的电脑部件 (如 CPU )上安装冷媒置换管道，将设备散发的热量通过管道接触直接带走，一部分方案是通过水冷门***对服务器机柜进行冷却。但是这些方案都存在冷却水泄露的风险，冷却水泄露可能会直接对设备造成损坏。发明内容 [0006] In the existing water-cooling technology, a part of the solution is to directly install a refrigerant replacement pipe on a computer component (such as a CPU) that generates a large amount of heat, and directly remove the heat radiated from the device through the pipe contact. The water-cooled door system cools the server cabinet. However, these solutions all have the risk of leakage of cooling water, which may directly damage the equipment. Summary of the invention

[0007]为解决现有散热方法中风冷散热效率低、能耗高和水冷对设备保护不足的问题，本发明提供一种能将电子设备密封起来用水冷散热的方法和设备，该方法和设备不仅散热效率高、能耗低，而且能对电子设备进行防水保护。 [0007] In order to solve the problem that the existing heat dissipation method has low air cooling efficiency, high energy consumption, and insufficient water cooling to protect the equipment, the present invention provides a method and a device capable of sealing an electronic device by water cooling, and the method and device The device not only has high heat dissipation efficiency, low energy consumption, but also waterproofs the electronic equipment.

[0008] 从方法的方面，本发明使用水冷***给电脑设备散热，并通过密封*** 将电脑设备密封起来与水冷***相隔离，防止水冷***泄漏造成所述电脑设备的损坏。其散热方法是：通过所述密封***的机箱内安装的冷热交换器，主要是热传导冷热交换器，将机箱内电脑设备的热量交换到机箱壳体上，然后通过与所述机箱相连接的水冷***，将机箱壳体上的热量交换到水冷***中。 From a method aspect, the present invention uses a water cooling system to dissipate heat from a computer device, and seals the computer device from the water cooling system through a sealing system to prevent damage to the computer device caused by leakage of the water cooling system. The heat dissipation method is: a cold heat exchanger installed in the chassis of the sealing system, mainly a heat conduction cold heat exchanger, exchanging heat of the computer equipment in the chassis to the chassis casing, and then connecting with the chassis The water cooling system exchanges heat from the chassis housing into the water cooling system.

[0009]从设备的方面，本发明解决其技术问题所采用的技术方案是： [0009] From the aspect of the device, the technical solution adopted by the present invention to solve the technical problem thereof is:

一种用于冷却电子设备的密封水冷设备，包括水冷***、密封***和内部冷热交换器。水冷***包括水冷板、冷却水管道和外部冷水源；水冷板上安装有冷却水槽，水冷板与冷却水管道相连接，在连接处设置有水泵、温度和流量传感器以及泄漏传感器，在冷却水的出口连接处设置有防倒流片；水泵能根据所述温度和流量传感器以及泄漏传感器的反馈而自动调节水流速度和关闭水流，泄漏传感器能在发生泄漏时自动发出警报信号，防倒流片能阻止冷却水倒流。外部冷水源通过冷却水管道与水冷板相连接，外部冷水源可以是机房的或建筑物内的水冷 ***，或者可以由安装在水冷板附近的散热水箱和风扇组成。 A sealed water-cooling apparatus for cooling electronic equipment, including a water cooling system, a sealing system, and an internal cold heat exchanger. The water cooling system includes a water cooling plate, a cooling water pipe and an external cold water source; a water cooling plate is installed with a cooling water tank, and the water cooling plate is connected with the cooling water pipe, and a water pump, a temperature and a flow sensor, and a leakage sensor are disposed at the connection, in the cooling water The outlet connection is provided with an anti-backflow piece; the water pump can automatically adjust the water flow speed and close the water flow according to the feedback of the temperature and flow sensor and the leakage sensor, and the leakage sensor can automatically generate an alarm signal when the leakage occurs, and the anti-backflow plate can prevent the cooling. The water is flowing backwards. The external cold water source is connected to the water cooling plate through the cooling water pipe. The external cold water source may be a water cooling system in the machine room or in the building, or may be composed of a heat dissipating water tank and a fan installed near the water cooling plate.

[0010]所述密封***包括密封机箱、隔水接口挡板和电缆防水管道。所述密封机箱，在其机壳结合处以及机壳与其可拆卸部件的结合处安装有密封垫圈进行密封防水；密封机箱内安装有气密泄露传感器，气密泄露传感器上安装有微型压縮空气罐，并与机箱电源接入点相连接，气密泄露传感器在机箱密闭通电后通过释放压縮空气将机箱内气压增加到若干个标准大气压，并监控机箱内气压，当气压偏高或偏低时自动发出警报信号，当气压低于一定值时自动切断机箱电源。所述隔水接口挡板上含有数据和电源接口，每个接***有内外两个接头，外部接头通过电源线或数据线透过隔水接口挡板的密封层后连接到内部接头，内部接头可以连接到机箱内部的电脑设备上。隔水接口挡板的外部安装有防水基座，防水基座上可以安装电缆防水管道，电缆防水管道将连接到接口的电源线和数据线包裹在内，防水基座上可以安装防水封盖，将未使用的接口密封起来。 [0010] The sealing system includes a sealed enclosure, a water barrier interface baffle, and a cable waterproof conduit. The sealed casing is sealed and waterproofed at a joint of the casing and a joint of the casing and the detachable component thereof; a sealed leaking sensor is installed in the sealed casing, and the compressed air is mounted on the airtight leak sensor The tank is connected to the power supply access point of the chassis. The airtight leak sensor increases the air pressure in the chassis to a certain standard atmospheric pressure by releasing compressed air after the chassis is sealed, and monitors the air pressure in the chassis. When the air pressure is high or low The alarm signal is automatically issued, and the power of the chassis is automatically cut off when the air pressure is lower than a certain value. The water-proof interface baffle has a data and power interface, each interface has two inner and outer joints, and the outer joint is connected to the inner joint through the sealing layer of the water-proof interface baffle through the power line or the data line, and the inner joint can be Connect to a computer device inside the chassis. A waterproof base is installed on the outside of the water-proof interface baffle, and a waterproof pipe can be installed on the waterproof base. The waterproof pipe of the cable is connected to the power cable and the data cable of the interface, and the waterproof cover can be installed on the waterproof base. Seal the unused interface.

[0011]所述内部冷热交换器包括热传导冷热交换器和对流冷热交换器。热传导冷热交换器与密封机箱内壁和密封机箱内的发热量大的电脑部件紧密接触，能快速的传导热量，热传导冷热交换器由上下两片耦合在一起的导热体组成，上下两片导热体之间安装有弹簧；发热量大的电脑部件是 CPU、主板南北桥芯片、显卡、内存、硬盘等部件。对流冷热交换器安装在密封机箱内壁上，通过空气流动吸收密封机箱内的余热；对流冷热交换器由安装有温度传感器和风扇的散热片组成，风扇能根据温度传感器的反馈而自动调节风速。 [0011] The internal cold heat exchanger includes a heat transfer cold heat exchanger and a convection heat heat exchanger. The heat conduction cold heat exchanger is in close contact with the inner wall of the sealed case and the computer component with large heat generation in the sealed case, which can be fast The heat conduction heat conduction, the heat conduction cold heat exchanger is composed of a heat conductor coupled with two upper and lower pieces, and a spring is installed between the upper and lower heat conductors; the computer component with large heat generation is CPU, motherboard north and south bridge chip, graphics card, memory , hard disk and other components. The convection cooling heat exchanger is installed on the inner wall of the sealed casing, and absorbs the residual heat in the sealed air through the air flow; the convection cooling heat exchanger is composed of a heat sink mounted with a temperature sensor and a fan, and the fan can automatically adjust the wind speed according to the feedback of the temperature sensor. .

[0012]所述密封机箱的机箱体外一侧安装有机箱状况监控***，可以显示机箱内气压，温度和风扇速度等信息。 [0012] The outer casing side of the sealed chassis is equipped with a chassis condition monitoring system, which can display information such as air pressure, temperature and fan speed in the chassis.

[0013] 本发明的有益效果是，能显著提高电脑设备的散热效率，降低散热能耗，还能对电脑设备进行防水保护。 [0013] The beneficial effects of the present invention are that the heat dissipation efficiency of the computer device can be significantly improved, the heat dissipation energy can be reduced, and the computer device can be waterproof protected.

附图说明 DRAWINGS

[0014]图 1是本发明的散热原理图。 1 is a schematic diagram of heat dissipation of the present invention.

[0015]图 2是本发明的密封结构平面示意图。 2 is a schematic plan view of a sealing structure of the present invention.

[0016]图 3是本发明的密封结构侧面示意图。 Figure 3 is a side elevational view of the sealing structure of the present invention.

[0017]图 4是一种用于冷却刀片式服务器机柜的密封机箱结构正面示意图。 [0017] FIG. 4 is a front elevational view of a sealed enclosure structure for cooling a blade server cabinet.

[0018]图 5是一种用于冷却刀片式服务器机柜的密封机箱结构背面示意图。 [0018] FIG. 5 is a rear elevational view of a sealed enclosure structure for cooling a blade server cabinet.

[0019]图 6是一种用于冷却刀片式服务器机柜的水冷机柜单元结构示意图。 6 is a schematic structural view of a water-cooled cabinet unit for cooling a blade server cabinet.

[0020]图 7是一种用于冷却刀片式服务器机柜的水冷机柜整体结构示意图。 7 is a schematic overall structural view of a water-cooled cabinet for cooling a blade server cabinet.

[0021]各图中， 1.水冷板， 2.冷却水槽， 3.冷却水管道， 4.冷却水开关， 5.电缆管道， 6.水泵， 7.温度和流量传感器， 8.泄漏传感器， 9.防倒流片， 10.散热水箱和风扇， 11.机箱壳， 12.密封垫圈， 13.气密泄露传感器， 14.机箱电源接入点， 15.隔水接口挡板， 16.电源线或数据线， 17.密封层， 18.外部接头， 19.内部接头， 20.热传导冷热交换器， 21.导热体， 22.弹簧， 23.对流冷热交换器， 24.温度传感器， 25.风扇， 26.散热片， 27.电源和数据接口， 28.防水基座， 29.电缆防水管道， 30.防水封盖， 31.机箱状况监控面板， 32.发热量大的电脑部件。 [0021] In each figure, 1. water-cooled plate, 2. cooling water tank, 3. cooling water pipe, 4. cooling water switch, 5. cable pipe, 6. water pump, 7. temperature and flow sensor, 8. leak sensor, 9. Anti-backflow film, 10. Cooling water tank and fan, 11. Chassis shell, 12. Sealing washer, 13. Airtight leak sensor, 14. Chassis power access point, 15. Waterproof interface baffle, 16. Power cord Or data line, 17. sealing layer, 18. external joint, 19. internal joint, 20. heat transfer cold heat exchanger, 21. heat conductor, 22. spring, 23. convection cold heat exchanger, 24. temperature sensor, 25 Fan, 26. Heat sink, 27. Power and data interface, 28. Waterproof base, 29. Cable waterproof pipe, 30. Waterproof cover, 31. Case condition monitoring panel, 32. Computer parts with large heat.

具体实施方式 detailed description

[0022]下面结合附图和实施例对本发明进一步说明。 [0022] The present invention is further described below in conjunction with the drawings and embodiments.

[0023]如图 1所示，本发明的散热方法是： [0023] As shown in FIG. 1, the heat dissipation method of the present invention is:

密封机箱内安装有热传导冷热交换器（ 20 )和对流冷热交换器（ 23 )。热传导冷热交换器（ 20 )与机箱壳（ 11 )和机箱内的 CPU等发热量大的电脑部件（ 32 ) 紧密接触，能快速的传导热量。热传导冷热交换器（20 )由上下两片耦合在一起的导热体（ 21 )组成，上下两片导热体（ 21 )之间安装有弹簧（ 22 )。对流冷热交换器（23 )安装在机箱内壁上，通过空气流动吸收机箱内的余热。对流冷热交换器（ 23 )由安装有温度传感器（ 24 )和风扇（ 25 )的散热片（ 26 )组成，风扇（25 )能根据温度传感器（24 )的反馈而自动调节风速；通过热传导冷热交换器（ 20 )和对流冷热交换器（ 23 )，主要是热传导冷热交换器（ 20 )，将密封机箱内电脑设备的热量交换到机箱壳（ 11 )上，然后通过密封机箱上的水冷板（ 1 )，将机箱壳（ 11 )上的热量交换到冷却水中，然后通过机房的水冷*** 散热，或者通过安装在密封机箱附近的散热水箱和风扇（ 10 )将水冷***中的热量交换到空气中。 A heat transfer cold heat exchanger (20) and a convection cold heat exchanger (23) are installed in the sealed enclosure. The heat conduction cold heat exchanger (20) is in close contact with the computer casing (32), which is a large heat source such as a CPU in the casing, and can quickly conduct heat. The heat conduction cold heat exchanger (20) is composed of a heat conductor (21) coupled together with two upper and lower plates, and a spring (22) is mounted between the upper and lower heat conductors (21). Convection hot and cold The exchanger (23) is mounted on the inner wall of the chassis and absorbs residual heat from the chassis through air flow. The convection cooling heat exchanger (23) is composed of a heat sink (26) equipped with a temperature sensor (24) and a fan (25), and the fan (25) can automatically adjust the wind speed according to the feedback of the temperature sensor (24); The heat exchanger (20) and the convection cooling heat exchanger (23), mainly the heat conduction cold heat exchanger (20), exchange heat of the computer equipment in the sealed enclosure to the casing (11), and then pass through the sealed casing The water-cooled plate (1) exchanges heat from the casing (11) into the cooling water, then dissipates heat through the water cooling system in the equipment room, or exchanges heat in the water-cooled system through a cooling water tank and a fan (10) installed near the sealed casing. Into the air.

[0024]如图 2， 3所示，本发明的密封方法是: [0024] As shown in Figures 2 and 3, the sealing method of the present invention is:

密封机箱的机箱壳（ 11 )分上下两部分，上下两部分结合处以及机箱壳（ 11 ) 与安装在机箱壳（ 11 )上的隔水接口挡板（ 15 )和机箱状况监控面板（ 31 )等可拆卸部件之间具有密封垫圈（ 12 )。密封机箱的机箱内安装有气密泄露传感器 ( 13 ) , 所述气密泄露传感器（ 13 )上安装有微型压縮空气罐，并与机箱电源接入点（ 14 )相连接。所述气密泄露传感器（ 13 )在机箱密闭通电后通过释放压縮空气将机箱内气压增加到若干个标准大气压，并监控机箱内气压，当气压偏高或偏低时自动发出警报信号，当气压低于一定值时自动切断机箱电源。密封机箱的机箱壳（ 11 )上安装有隔水接口挡板（ 15 )。隔水接口挡板（ 15 )上含有电源和数据接口（27 )，每个接***有内外两个接头，外部接头（18 )通过电源线或数据线（ 16 )透过挡板的密封层（ 17 )后连接到内部接头（ 19 )，内部接头（ 19 )可以连接到机箱内部的电脑设备上，隔水接口挡板（ 15 )外部安装有多个防水基座（ 28 )，防水基座（ 28 )上可以安装电缆防水管道（ 29 )，将连接到电源和数据接口（27 )的电源线和数据线封装在内。防水基座（28 )上也可以安装防水封盖（30 )，将未使用的电源和数据接口（27 )密封起来。 The chassis case (11) of the sealed chassis is divided into upper and lower parts, the upper and lower parts and the chassis case (11) and the water-proof interface baffle (15) and the chassis condition monitoring panel (31) mounted on the chassis case (11). There are sealing gaskets ( 12 ) between the detachable parts. A hermetic leak sensor (13) is installed in the sealed chassis, and a micro-compressed air tank is installed on the airtight leak sensor (13) and connected to the chassis power supply access point (14). The airtight leak sensor (13) increases the air pressure in the chassis to a plurality of standard atmospheric pressures by releasing compressed air after the enclosure is energized, and monitors the air pressure in the chassis, and automatically sends an alarm signal when the air pressure is high or low. When the air pressure is lower than a certain value, the power of the chassis is automatically cut off. A watertight interface baffle ( 15 ) is mounted on the casing ( 11 ) of the sealed enclosure. The water-proof interface baffle (15) contains a power supply and data interface (27), each interface has two internal and external connectors, and the external connector (18) passes through the sealing layer of the baffle through the power or data line (16) (17) ) is connected to the internal connector ( 19 ), the internal connector ( 19 ) can be connected to the computer device inside the chassis, and the waterproof interface baffle ( 15 ) is externally mounted with a plurality of waterproof bases ( 28 ), waterproof base ( 28 ) Cable waterproof tubing ( 29 ) can be installed to enclose the power and data cables connected to the power and data interface (27). A waterproof cover (30) can also be attached to the waterproof base (28) to seal the unused power supply and data interface (27).

[0025]在图 4， 5， 6， 7中，本发明的实施例是一种用于刀片式服务器机柜的密封水冷设备。 In Figures 4, 5, 6, 7, an embodiment of the present invention is a sealed water cooling apparatus for a blade server cabinet.

[0026]如图 4， 5所示: [0026] As shown in Figures 4 and 5:

密封机箱的机箱壳（ 11 )由铝合金压祷而成，分上下两部分，机箱壳（ 11 )结合处以及机箱壳（ 11 )与安装在机箱壳（ 11 )上的隔水接口挡板（ 15 )和机箱状况监控面板（ 31 )等可拆卸部件之间具有密封垫圈（ 12 )。密封机箱的机箱内安装有气密泄露传感器（ 13 )，所述气密泄露传感器（ 13 )上安装有微型压縮空气罐，并与机箱电源接入点（14 )相连接。所述气密泄露传感器（ 13 )在机箱密闭通电后通过释放压縮空气将机箱内气压增加到若干个标准大气压，并监控机箱内气压，当气压偏高或偏低时自动发出 RFID警报信号，当气压低于一定值时自动切断机箱电源。密封机箱的机箱壳（ 11 )上安装有隔水接口挡板（ 15 )。隔水接口挡板（15 )上含有电源和数据接口（27 )，所述接口通过电源线或数据线（ 16 )透过挡板的密封层（ 17 )后连接到挡板后的机箱内设备上。隔水接口挡板（ 15 )外部安装有多个防水基座（ 28 )，防水基座（ 28 )上可以安装电缆防水管道（29 )，将连接到电源和数据接口（27 )的电源线和数据线封装在内。防水基座（28 )上也可以安装防水封盖（30 ) ，将未使用的电源和数据接口 ( 27 )密封起来。 The chassis case (11) of the sealed chassis is made of aluminum alloy, which is divided into upper and lower parts, the joint of the case shell (11) and the case shell (11) and the water-proof interface baffle mounted on the case shell (11) ( 15) There is a sealing gasket ( 12 ) between the detachable parts such as the chassis condition monitoring panel ( 31 ). A hermetic leak sensor (13) is installed in the sealed chassis, and the airtight leak sensor (13) is mounted with a miniature compressed air tank and connected to the chassis power access point (14). The airtight leak sensor (13) is in the chassis After the power is sealed, the air pressure in the chassis is increased to several standard atmospheric pressures by releasing compressed air, and the air pressure in the chassis is monitored. When the air pressure is high or low, the RFID alarm signal is automatically sent out. When the air pressure is lower than a certain value, the power of the chassis is automatically cut off. . A water-proof interface baffle ( 15 ) is mounted on the chassis casing ( 11 ) of the sealed enclosure. The water-proof interface baffle (15) includes a power supply and a data interface (27), and the interface is connected to the device inside the baffle through the sealing layer (17) of the baffle through the power or data line (16) on. A waterproof base (28) is mounted on the outside of the water-proof interface baffle (15), and a waterproof pipe (29) can be installed on the waterproof base (28), which will be connected to the power supply and the data interface (27). The data line is encapsulated. A waterproof cover (30) can also be attached to the waterproof base (28) to seal the unused power supply and data interface (27).

[0027]密封机箱的机箱内安装有热传导冷热交换器（ 20 )和对流冷热交换器 [0027] A heat conduction cold heat exchanger (20) and a convection cooling heat exchanger are installed in the sealed chassis

( 23 )。热传导冷热交换器（ 20 )与机箱壳（ 11 )和机箱内的 CPU等发热量大的电脑部件（ 32 )紧密接触，能快速的传导热量。热传导冷热交换器（ 20 )由上下两片耦合在一起的导热体（ 21 )组成，上下两片导热体（ 21 )之间安装有弹簧( twenty three ). The heat conduction cold heat exchanger (20) is in close contact with the computer casing (32), which generates heat such as a CPU in the casing, and can quickly conduct heat. The heat conduction cold heat exchanger (20) is composed of a heat conductor (21) coupled together with two upper and lower plates, and a spring is installed between the upper and lower heat conductors (21)

( 22 )。对流冷热交换器（ 23 )安装在机箱内壁上，通过空气流动吸收机箱内的余热。对流冷热交换器（ 23 )由安装有温度传感器（ 24 )和风扇（ 25 )的散热片( twenty two ). The convection cooled heat exchanger (23) is mounted on the inner wall of the enclosure and absorbs residual heat from the enclosure through air flow. The convection cooling heat exchanger (23) consists of a heat sink with a temperature sensor (24) and a fan (25)

( 26 )组成，风扇（ 25 )能根据温度传感器（ 24 )的反馈而自动调节风速。热传导冷热交换器（ 20 )的导热体（ 21 )和对流冷热交换器（ 23 )的散热片（ 26 ) 由导热性能良好的铜合金或铝合金压祷而成。机箱前侧安装有机箱状况监控面板(26) Composition, the fan (25) can automatically adjust the wind speed according to the feedback of the temperature sensor (24). The heat transfer body (21) of the heat transfer cold heat exchanger (20) and the heat sink (26) of the convection heat exchanger (23) are prayed from a copper alloy or an aluminum alloy having good thermal conductivity. Chassis status monitoring panel is installed on the front side of the chassis

( 31 )，可以显示机箱内气压，温度和风扇速度等信息。 ( 31 ), can display information such as air pressure, temperature and fan speed in the chassis.

[0028] 如图 6， 7所示: [0028] As shown in Figure 6, 7:

每个服务器机柜单元都安装有由铝合金压祷而成的水冷板（ 1 )，水冷板（ 1 ) 上安装有冷却水槽（ 2 )，水冷板（ 1 )与冷却水管道（ 3 )相连接。连接处安装有冷却水开关（4 )，当该单元中没有放置服务器时，可以关闭该单元的冷却水，減轻水冷***的负荷。在水冷板（ 1 )与冷却水管道（ 3 )的连接处附近设置有水泵（ 6 )、温度和流量传感器（ 7 )和泄漏传感器（ 8 )，在其冷却水出口连接处设置有防倒流片（ 9 )，所述水泵（ 6 )能根据温度和流量传感器（ 7 )以及泄漏传感器（8 )的反馈而自动调节水流速度和关闭水流。泄漏传感器（8 )能在发生泄漏时自动发出 RFID警报信号。防倒流片（9 )，能阻止热水倒流。外部冷水源可以是机房的水冷***，通过冷却水管道（ 3 )与机柜上的水冷板（ 1 )相连接。密封机箱的尺寸被设计为机柜单元的内尺寸相当，刀片式服务器***机柜后能与水冷板（ 1 )紧密地接触，确保热量能快速的传导到冷却水中。 [0029]机柜内安装有电缆管道（ 5 )，电缆管道（ 5 )在每个服务器单元安装有多个开口处，每个开口处安装有防水基座（28)，防水基座（28)上可以安装电缆防水管道（29)，让连接到服务器的电缆从管道中通过。防水基座上（28) 可以安装防水封盖（30)，将未使用的开口处封起来。 Each server cabinet unit is equipped with a water-cooled plate (1) pours from aluminum alloy. The water-cooled plate (1) is equipped with a cooling water tank (2), and the water-cooled plate (1) is connected with the cooling water pipe (3). . A cooling water switch (4) is installed at the connection. When no server is placed in the unit, the cooling water of the unit can be turned off to reduce the load on the water cooling system. A water pump (6), a temperature and flow sensor (7) and a leakage sensor (8) are arranged near the junction of the water-cooled plate (1) and the cooling water pipe (3), and an anti-backflow piece is arranged at the connection of the cooling water outlet. (9), the water pump (6) can automatically adjust the water flow speed and close the water flow according to the feedback of the temperature and flow sensor (7) and the leakage sensor (8). The leak sensor (8) automatically sends an RFID alert signal when a leak occurs. Anti-backflow sheet (9), can prevent hot water from flowing backwards. The external cold water source can be a water cooling system in the equipment room, and is connected to the water cooling plate (1) on the cabinet through the cooling water pipe (3). The size of the sealed enclosure is designed to be equivalent to the internal dimensions of the cabinet unit. The blade server is inserted into the cabinet and is in intimate contact with the water-cooled panel (1) to ensure that heat is quickly transferred to the cooling water. [0029] A cable duct (5) is installed in the cabinet, and the cable duct (5) is installed with a plurality of openings in each server unit, and each of the openings is provided with a waterproof base (28) on the waterproof base (28). A cable gland (29) can be installed to allow the cable connected to the server to pass through the pipe. A waterproof cover (30) can be attached to the waterproof base (28) to seal the unused openings.

Claims

权利要求书 Claim

1.一种用于冷却电子设备的密封水冷方法，具体的用于冷却电脑设备的方法，使用水冷***给电脑设备散热，其特征是：通过密封***将电脑设备密封起来，使电脑设备与水冷***隔离，防止水冷***泄漏造成所述电脑设备的损坏。 1. A sealed water cooling method for cooling an electronic device, a method for cooling a computer device, using a water cooling system to dissipate heat from a computer device, characterized by: sealing a computer device through a sealing system, and cooling the computer device with water The system is isolated to prevent damage to the computer equipment caused by leakage of the water cooling system.

2.根据权利要求 1所述的密封水冷方法，其特征是：通过所述密封***的机箱内安装的冷热交换器，主要是热传导冷热交换器，将机箱内电脑设备的热量交换到机箱壳体上，然后通过与所述机箱相连接的水冷***，将机箱壳体上的热量交换到水冷***中，由水冷***散热。 2 . The sealed water cooling method according to claim 1 , wherein: the cold heat exchanger installed in the casing of the sealing system, mainly a heat conduction cold heat exchanger, exchanges heat of the computer equipment in the chassis to the chassis. The housing then transfers heat from the chassis housing to the water cooling system through a water cooling system coupled to the chassis for heat dissipation by the water cooling system.

3.—种用于冷却电子设备的密封水冷设备，其特征是：包括水冷***、密封*** 和内部冷热交换器，所述水冷***包括水冷板、冷却水管道和外部冷水源；所述密封***包括密封机箱、隔水接口挡板和电缆防水管道；所述内部冷热交换器包括热传导冷热交换器和对流冷热交换器。 3. A sealed water-cooling apparatus for cooling an electronic device, comprising: a water cooling system, a sealing system, and an internal cold heat exchanger, the water cooling system comprising a water cooling plate, a cooling water pipe, and an external cold water source; The system includes a sealed enclosure, a water barrier interface baffle, and a cable waterproof conduit; the internal cold heat exchanger includes a heat transfer cold heat exchanger and a convection cold heat exchanger.

4.根据权利要求 3所述的密封水冷设备，其特征是：所述水冷板上安装有冷却水槽，所述水冷板与所述冷却水管道相连接，所述水冷板与所述冷却水管道的连接处设置有水泵、温度和流量传感器以及泄漏传感器，所述水冷板与所述冷却水管道的连接处的冷却水出口端设置有防倒流片，所述水泵能根据所述温度和流量传感器以及泄漏传感器的反馈而自动调节水流速度和关闭水流，所述泄漏传感器，能在发生泄漏时自动发出警报信号，所述防倒流片，能阻止冷却水倒 The sealed water-cooling device according to claim 3, wherein: the water-cooling plate is provided with a cooling water tank, the water-cooling plate is connected to the cooling water pipe, the water-cooling plate and the cooling water pipe a water pump, a temperature and flow sensor, and a leakage sensor are disposed at the connection, and a cooling water outlet end of the connection between the water cooling plate and the cooling water pipe is provided with an anti-backflow piece, and the water pump can be based on the temperature and flow sensor And the feedback of the leakage sensor automatically adjusts the water flow speed and the closed water flow, and the leakage sensor can automatically issue an alarm signal when the leakage occurs, and the anti-backflow sheet can prevent the cooling water from falling

5.根据权利要求 3所述的密封水冷设备，其特征是：所述外部冷水源通过冷却水管道与所述水冷板相连接，所述外部冷水源可以是机房的或建筑物内的水冷 ***，或者可以由安装在所述水冷板附近的散热水箱和风扇组成。 The sealed water-cooling device according to claim 3, wherein: the external cold water source is connected to the water-cooled plate through a cooling water pipe, and the external cold water source may be a water cooling system in a machine room or in a building. Or it may consist of a cooling water tank and a fan installed near the water-cooled plate.

6.根据权利要求 3所述的密封水冷设备，其特征是：所述密封机箱在其机壳结合处以及机壳与其可拆卸部件的结合处安装有密封垫圈进行密封防水。 The sealed water-cooling apparatus according to claim 3, wherein: the sealed casing is sealed and waterproofed at a joint of the casing and a joint of the casing and the detachable member thereof.

7.根据权利要求 3所述的密封水冷设备，其特征是：所述密封机箱内安装有气密泄露传感器，所述气密泄露传感器上安装有微型压縮空气罐，并与机箱电源接入点相连接，所述气密泄露传感器在机箱密闭通电后通过释放压縮空气将机箱内气压增加到若干个标准大气压，并监控机箱内气压，当气压偏高或偏低时自动发出警报信号，当气压低于一定值时自动切断机箱电源。 The sealed water-cooling device according to claim 3, wherein: the sealed case is provided with a gas leak detection sensor, and the airtight leak sensor is mounted with a micro compressed air tank and is connected to the chassis power supply. Point-to-phase connection, the airtight leak sensor increases the air pressure in the chassis to a plurality of standard atmospheric pressures by releasing compressed air after the chassis is sealed, and monitors the air pressure in the chassis when the air pressure is high or low. The alarm signal is automatically sent out, and the power of the chassis is automatically cut off when the air pressure is lower than a certain value.

8.根据权利要求 3所述的密封水冷设备，其特征是：所述隔水接口挡板上含有数据和电源接口，所述数据和电源接口的每个接***有内外两个接头，外部接头通过电源线或数据线透过所述隔水接口挡板的密封层后连接到所述隔水接口挡板后的内部接头，所述内部接头可以连接到机箱内部的电脑设备上。 The sealed water-cooling device according to claim 3, wherein: the water-proof interface baffle includes a data and a power interface, and each interface of the data and power interface includes two inner and outer joints, and the outer joint passes The power cable or the data cable is connected to the internal connector behind the water blocking interface baffle through the sealing layer of the water blocking interface baffle, and the internal connector can be connected to the computer device inside the chassis.

9.根据权利要求 3所述的密封水冷设备，其特征是：所述隔水接口挡板的外部安装有防水基座，所述防水基座上可以安装电缆防水管道，所述电缆防水管道将连接到接口的电源线和数据线包裹在内，所述防水基座上可以安装防水封盖，所述防水封盖可以将未使用的接口密封起来。 The sealed water-cooling device according to claim 3, wherein: the water-proof interface baffle is externally mounted with a waterproof base, and the waterproof base can be provided with a cable waterproof pipe, and the cable waterproof pipe A waterproof cover can be attached to the waterproof base, and the waterproof cover can seal the unused interface.

10.根据权利要求 3所述的密封水冷设备，其特征是：所述热传导冷热交换器与所述密封机箱内壁和所述密封机箱内的发热量大的电脑设备部件紧密接触，能快速的传导热量，所述热传导冷热交换器由上下两片耦合在一起的导热体组成，所述上下两片导热体之间安装有弹簧。 The sealed water-cooling device according to claim 3, wherein: the heat conduction cold heat exchanger is in close contact with the inner wall of the sealed casing and the computer equipment component having a large amount of heat generated in the sealed casing, and can be quickly Conducting heat, the heat conduction cold heat exchanger is composed of a heat conductor coupled with two upper and lower plates, and a spring is mounted between the upper and lower heat conductors.

11.根据权利要求 3所述的密封水冷设备，其特征是：所述对流冷热交换器安装在所述密封机箱内壁上，通过空气流动吸收所述密封机箱内的余热，所述对流冷热交换器由安装有温度传感器和风扇的散热片组成，所述风扇能根据所述温度传感器的反馈而自动调节风速。 The sealed water-cooling device according to claim 3, wherein: the convection-cooling heat exchanger is mounted on an inner wall of the sealed casing, and absorbs waste heat in the sealed casing by air flow, the convection heat and cold The switch consists of a heat sink mounted with a temperature sensor and a fan that automatically adjusts the wind speed based on feedback from the temperature sensor.

12.根据权利要求 3所述的密封水冷设备，其特征是：所述密封机箱的机箱体外一侧安装有机箱状况监控***。 The sealed water-cooling device according to claim 3, wherein: the outer casing side of the sealed casing is equipped with a chassis condition monitoring system.