WO2012139279A1 - Mobile phone, vacuum plating antenna and manufacture method thereof - Google Patents

Mobile phone, vacuum plating antenna and manufacture method thereof Download PDF

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Publication number
WO2012139279A1
WO2012139279A1 PCT/CN2011/072662 CN2011072662W WO2012139279A1 WO 2012139279 A1 WO2012139279 A1 WO 2012139279A1 CN 2011072662 W CN2011072662 W CN 2011072662W WO 2012139279 A1 WO2012139279 A1 WO 2012139279A1
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WO
WIPO (PCT)
Prior art keywords
antenna
conductive layer
metal conductive
vacuum
underlayer
Prior art date
Application number
PCT/CN2011/072662
Other languages
French (fr)
Chinese (zh)
Inventor
王荣福
Original Assignee
深圳市厚泽真空技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市厚泽真空技术有限公司 filed Critical 深圳市厚泽真空技术有限公司
Priority to PCT/CN2011/072662 priority Critical patent/WO2012139279A1/en
Publication of WO2012139279A1 publication Critical patent/WO2012139279A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material

Definitions

  • the present invention relates to the field of antennas, and in particular, to a vacuum coated antenna and a method of fabricating the same.
  • the manufacturing process of mobile phone antennas is made of stainless steel or water plating.
  • the water plating process is to fully plate the products.
  • the water plating process can only be applied to ABS. After the water plating, the substrate will be denatured, resulting in products. Unable to do the limit test.
  • the plastic is usually coated with anti-plating solution, but the field of the specified area is difficult to control during the anti-plating process, which affects the RF effect of the antenna.
  • the part that does not need to be plated is plated after plating, the product is susceptible to corrosion during the deplating process, and the thickness of the plating layer is limited, and the material for water plating may have certain limitations.
  • the Chinese invention patent application number is: "200710122188.7”
  • the patent application file entitled "A built-in mobile phone antenna and its manufacturing method” discloses a method for manufacturing a whole-body electroplating process using a two-color injection mold for a built-in mobile phone antenna. Because of the need to use two-color injection molds and multiple injection moldings, the method has high mold cost and process cost, and is not suitable for large-scale promotion. Summary of the invention
  • the technical problem to be solved by the present invention is to provide a mobile phone, a vacuum coated antenna and a manufacturing method thereof, which are capable of saving mold cost and process cost and are suitable for mass promotion.
  • a technical solution adopted by the present invention is: providing a mobile phone, comprising a vacuum coated antenna formed on a casing of a mobile phone, wherein the vacuum coated antenna comprises a UV underlayer and a metal conductive layer sequentially attached to a casing of the mobile phone. And a UV protective layer, the UV underlayer is closely adhered to the outer casing by ultraviolet light curing; the pattern distribution of the metal conductive layer is determined according to an antenna function and is formed by a vacuum sputtering process by a cover fixture, the covering The hollow shape of the jig is adapted to the antenna pattern.
  • the mobile phone casing is made of ABS material, nylon material or PC material.
  • the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering device, and the material thereof is aluminum, copper or nickel-copper alloy, and the thickness thereof is 5-20 micrometers.
  • Providing a vacuum coating antenna manufacturing method comprising the following steps:
  • the covering fixture is used to cover the portion of the antenna substrate that does not need to be coated with a conductive layer, and the portion where the conductive layer needs to be plated is exposed;
  • the process parameters of the UV underlayer include: coating film thickness of 8 ⁇ 12 um, leveling time of 5-10 min, baking temperature of 55-70 ° C, baking time For 10-15min, the peak energy of UV light curing is 800-1200mj, and the cumulative energy is 900-1300mj;
  • the process parameters of the metal conductive layer include: a voltage of 100-120V, a voltage of 220-250V, a voltage of 300-350V, and a current of 20-25 A.
  • the current two segments are 40-50A
  • the current three segments are 75-90A
  • the vacuum value is 4 ⁇ 2 X 10-2pa;
  • the process parameters of the UV protective layer include: a coating film thickness of 15-28 um, a leveling time of 5-10 min, a baking temperature of 55-70 ° C, baking The time is 15-25min, the peak energy of UV light curing is 1000-1500mj, and the accumulated energy is 1000-1500mj.
  • the mobile phone shell is made of ABS material, nylon material or PC material.
  • the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering device, and the material thereof is aluminum, copper or nickel-copper alloy, and the thickness thereof is 5-20 micrometers.
  • another technical solution adopted by the present invention is: providing a vacuum coated antenna comprising a UV underlayer, a metal conductive layer and a UV protective layer sequentially attached to an antenna substrate, wherein the UV underlayer is ultraviolet light The curing is closely adhered to the antenna substrate; the pattern distribution of the metal conductive layer is determined according to the function of the antenna and is formed by a vacuum sputtering process by the covering fixture, and the hollow shape of the covering fixture is adapted to the antenna pattern.
  • the antenna substrate is made of ABS material, nylon material or PC material.
  • the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering device, and the material thereof is aluminum, copper or nickel-copper alloy, and the thickness thereof is 5-20 micrometers.
  • the mobile phone antenna is made by using the two-color mold or the water plating process, which has high mold cost and process cost, and is not suitable for large-scale promotion.
  • the invention is coated by vacuum coating technology.
  • the metal antenna layer conforming to the antenna pattern line, combined with the UV bottom layer and the UV protection layer, the handset antenna has low mold cost and process cost, and the antenna pattern line can be plated only by a cover fixture, eliminating the need for a shield. Mold development costs, and low process costs are suitable for large-scale promotion.
  • the UV underlayer and the UV protective layer are translucent, which can expose the shape of the metal conductive layer, and the mobile phone antenna is crystal clear. Due to the high leveling and high smoothness of the UV material, the surface of the mobile phone antenna is smooth.
  • FIG. 1 is a flow chart showing the steps of an embodiment of a method for fabricating a vacuum coated antenna according to the present invention
  • FIG. 2 is a schematic structural view of an embodiment of a vacuum coated antenna according to the present invention. detailed description
  • a mobile phone includes a vacuum coated antenna formed on a casing of a mobile phone, the vacuum coated antenna including a UV underlayer, a metal conductive layer and a UV protective layer sequentially attached to a casing of the mobile phone, the UV The bottom layer is closely adhered to the outer casing by ultraviolet light curing; the pattern distribution of the metal conductive layer is determined according to the function of the antenna and is formed by a vacuum sputtering process by the covering fixture, and the hollow shape and the antenna pattern of the covering fixture Fitted.
  • the existing mobile phone antenna generally has an antenna structural member, and the antenna structural member can be removed through the setting of the vacuum coating antenna formed on the outer casing of the mobile phone, thereby saving space occupied by the lower antenna structural member, and providing a possibility for making an ultra-thin mobile phone.
  • the antenna can be fabricated in any part of the outer casing of the mobile phone, and provides a wider area for the structure of the mobile phone antenna requiring a large area, which can effectively improve the radiation signal or the performance of the signal received by the antenna.
  • the outer casing of the mobile phone is made of ABS material, nylon material or PC material.
  • the outer casing of the mobile phone can also be made of other plastic materials, such as: polyamide, polyformaldehyde, polysulfone, polyphenylene ether, fluoroplastic, and the like.
  • the phone case is only used as a carrier, and other materials can be used to make the phone case.
  • the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering apparatus, and is made of aluminum, copper or nickel-copper alloy having a thickness of 5 to 20 ⁇ m.
  • a method for fabricating a vacuum coated antenna according to an embodiment of the present invention includes the following steps:
  • Step 101 Preparing an antenna substrate 10
  • Step 102 spraying a UV underlayer 11 on the surface of the antenna substrate 10, and curing the UV underlayer 11 by ultraviolet light, so that the UV underlayer 11 is closely attached to the antenna substrate 10;
  • Step 103 Making a cover fixture according to the distribution of the antenna pattern lines
  • Step 104 using the cover fixture to cover the portion of the antenna substrate that does not need to be coated with a conductive layer, and expose the portion 15 to be coated with a conductive layer;
  • Step 105 using a vacuum sputtering process to plate the antenna substrate with a metal conductive layer 12 conforming to the antenna pattern line;
  • Step 106 Remove the cover fixture and spray the UV protective layer on the surface of the antenna substrate.
  • step 102 the UV colloid on the antenna substrate is sprayed by ultraviolet light curing, so that the UV colloid acts as an intermediate bridge to enhance the adhesion of the antenna substrate to the metal plating layer, and the metal layer is strongly adhered to the ultraviolet light curing paint.
  • step 103 before making the covering fixture, the distribution problem of the antenna pattern line and the unstable factors in the process should be known.
  • the shape of the antenna pattern line is determined according to these problems and factors, and the corresponding mask is made according to the antenna pattern line.
  • step 104 the covering jig is used to cover the size control points of the mobile phone parts, thereby avoiding dimensional deviation caused by paint splash during the manufacturing process.
  • the fixture needs to be designed according to the structure of the product. The design of the adhesion and the shielding angle should be considered, and the shielding effect should be confirmed during assembly.
  • the thickness of the metallic conductive layer should be designed in accordance with the electrical conductivity requirements and the resistance to thick and wear.
  • step 106 in order to improve the VU protective layer sprayed by the environmental test and the chemical test, the overall appearance effect, the final performance test level and the feel can be improved.
  • the two-color mold or the water-plating process is used to manufacture the mobile phone antenna, and the mold cost and the process cost are high, which is not suitable for the large-scale promotion.
  • the invention adopts the vacuum coating technology to plate the metal conductive wire conforming to the antenna pattern line.
  • the mobile phone antenna obtained from the layer and combined with the UV underlayer and the UV protective layer has low mold cost and process cost, and the antenna pattern circuit can be plated only by a covering fixture, which saves the mold development cost and the process cost. Low for large-scale promotion.
  • the UV underlayer and the UV protective layer are translucent, which can expose the shape of the metal conductive layer, and the mobile phone antenna is crystal clear. Due to the high leveling and high smoothness of the UV material, the surface of the mobile phone antenna is smooth and flat.
  • the process parameters of the UV underlayer include: coating film thickness of 8 ⁇ 12 um, leveling time of 5-10 min, baking temperature of 55-70 ° C, baking time of 10 -15min, the peak energy of UV light curing is 800-1200mj, and the accumulated energy is 900-1300mj;
  • the process parameters of the metal conductive layer include: a voltage of 100-120V, a voltage of 220-250V, a voltage of 300-350V, and a current of 20-25 A.
  • the current two segments are 40-50A
  • the current three segments are 75-90A
  • the vacuum value is 4 ⁇ 2 X 10-2pa;
  • the process parameters of the UV protective layer include: a coating film thickness of 15-28 um, a leveling time of 5-10 min, a baking temperature of 55-70 ° C, baking The time is 15-25min, the peak energy of UV light curing is 1000-1500mj, and the accumulated energy is 1000-1500mj.
  • the antenna substrate is made of ABS (a ternary copolymer of acrylonitrile, butadiene, and styrene), nylon, or PC (polycarbonate).
  • ABS a ternary copolymer of acrylonitrile, butadiene, and styrene
  • nylon or PC (polycarbonate).
  • PC polycarbonate
  • the antenna substrate is only used as a carrier, and other materials can also be used as the antenna substrate.
  • the metal conductive layer is made of aluminum, copper or nickel-copper alloy.
  • other metals that can conduct electricity can also be made into the metal conductive layer of the present invention by vacuum coating technology, and are not limited to aluminum, copper or nickel-copper alloys, as long as materials capable of conducting conductive functions should be input. An equivalent replacement of the invention.
  • the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering apparatus.
  • the process of forming a metal conductive plating layer under vacuum conditions by a magnetron sputtering apparatus is one of the main implementations of the present invention.
  • the metal conductive layer of the present invention can also be obtained by an evaporation process.
  • the metal conductive layer has a thickness of 5 to 20 microns.
  • the thickness of the metal conductive layer can be arbitrarily designed according to actual needs or conductive requirements and wear resistance requirements. 5 to 20 microns is only the thickness of the preferred embodiment of the invention, and other thicknesses are also within the scope of the invention.
  • a vacuum coated antenna includes a UV underlayer 11, a metal conductive layer 12, and a UV protective layer 13 which are sequentially attached to an antenna substrate 10.
  • the UV underlayer 11 is cured by UV curing.
  • the pattern distribution of the metal conductive layer 12 is determined according to the function of the antenna and is formed by a vacuum sputtering process by the cover fixture, and the hollow shape of the cover fixture is adapted to the antenna pattern.
  • the function of the antenna determines the layout of the antenna pattern and the direction of the line.
  • Each antenna has different functions and different requirements. Of course, the shape and layout of the metal conductive layer are different.
  • the vacuum coated film antenna manufactured by the vacuum coating technology of the present invention the mobile phone antenna obtained by sequentially attaching the UV underlayer, the metal conductive layer and the UV protective layer on the antenna substrate, the performance of which is determined according to the function of the antenna, can be good
  • the antenna effect is completed, and the effect of radiating the received signal of the antenna can be better achieved at the bend or the profiled figure.
  • the vacuum coated antenna of the present invention has low mold cost and process cost, and the antenna pattern line can be plated only by a covering fixture, thereby eliminating the mold development cost.
  • the UV underlayer and the UV protective layer are translucent, which can expose the shape of the metal conductive layer, and the mobile phone antenna made is crystal clear. Due to the high leveling and high smoothness of the UV material, the surface of the mobile phone antenna is obtained. Smooth and flat.
  • the antenna substrate is made of ABS (a ternary copolymer of acrylonitrile, butadiene, and styrene), nylon, or PC (polycarbonate).
  • ABS a ternary copolymer of acrylonitrile, butadiene, and styrene
  • nylon or PC (polycarbonate).
  • PC polycarbonate
  • other plastic materials such as polyamide, polyoxymethylene, polysulfone, polyphenylene ether, fluoroplastic, etc. can also be used.
  • the antenna substrate is only used as a carrier, and other materials can also be used as the antenna substrate.
  • the metal conductive layer is made of aluminum, copper or nickel-copper alloy.
  • other metals that can conduct electricity can also be made into the metal conductive layer of the present invention by vacuum coating technology, and are not limited to aluminum, copper or nickel-copper alloys, as long as materials capable of conducting conductive functions should be input. An equivalent replacement of the invention.
  • the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron vacuum sputtering apparatus.
  • the process of forming a metal conductive plating layer under vacuum conditions in a magnetron sputtering apparatus is one of the main implementations of the present invention.
  • the metal conductive layer according to the present invention can also be obtained by an evaporation process.
  • the metal conductive layer has a thickness of 5 to 20 microns.
  • the thickness of the metal conductive layer can be arbitrarily designed according to actual needs or conductive requirements and wear resistance requirements. 5 to 20 microns is only the thickness of the preferred embodiment of the invention, and other thicknesses are also within the scope of the invention.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
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Abstract

The present invention discloses a mobile phone, a vacuum plating antenna and a manufacture method thereof. The method includes the following steps of: preparing an antenna substrate, spraying an UltraViolet (UV) bottom layer on a surface of the antenna substrate, and solidifying the UV bottom layer by using UV to attach the UV bottom layer closely to the antenna substrate; making a shielding jig according to distribution of an antenna pattern; shielding the part needless to plate conductive layer on the antenna substrate by using the shielding jig, but revealing the part which needs to plate the conductive layer; plating the metal conductive layer according with the antenna pattern by utilizing vacuum sputtering technology; and removing the shielding jig and spraying a UV protection layer on the whole antenna substrate. The present invention utilizes vacuum plating technology to plate the metal conductive layer according with the antenna pattern, and combines the UV bottom layer and the UV protection layer to manufacture the mobile phone antenna of which the mold cost and flow cost both are greatly low, and plates the antenna pattern merely by a shielding jig, thus saving the cost of mold development.

Description

手机、 真空镀膜天线及其制作方法 技术领域  Mobile phone, vacuum coated antenna and manufacturing method thereof
本发明涉及天线领域， 尤其涉及一种真空镀膜天线及其制作方法。 背景技术 说  The present invention relates to the field of antennas, and in particular, to a vacuum coated antenna and a method of fabricating the same. Background art
目前手机天线的制作工艺均采用不锈钢钢片或水镀， 水镀工艺是将 产品进行全镀，水镀制程通常只能应用到在 ABS上，做完水镀后通常基 材会变性， 导致产品无法做极限测试。 如果要将产品进行局部镀， 通常 塑胶要涂防镀液， 但涂防镀液过程中规定区书域不易控制， 影响天线 RF 效果。 如果采取镀好后再将不需要镀的部分进行退镀， 在退镀的过程中 产品易受腐蚀， 同时镀层厚度受限，可做水镀的素材也有一定的局限性。  At present, the manufacturing process of mobile phone antennas is made of stainless steel or water plating. The water plating process is to fully plate the products. The water plating process can only be applied to ABS. After the water plating, the substrate will be denatured, resulting in products. Unable to do the limit test. If the product is to be partially plated, the plastic is usually coated with anti-plating solution, but the field of the specified area is difficult to control during the anti-plating process, which affects the RF effect of the antenna. If the part that does not need to be plated is plated after plating, the product is susceptible to corrosion during the deplating process, and the thickness of the plating layer is limited, and the material for water plating may have certain limitations.
中国发明专利申请号为： "200710122188.7" , 名称为： "一种内置式 手机天线及其制造方法 " 的专利申请文件中公开了运用双色注塑模具进 行内置式手机天线的整体电镀的工艺制作的方法， 该方法由于需要用到 双色注塑模具且需要进行多次注塑， 其模具成本和流程成本都很高， 不 适合大规模推广。 发明内容  The Chinese invention patent application number is: "200710122188.7", and the patent application file entitled "A built-in mobile phone antenna and its manufacturing method" discloses a method for manufacturing a whole-body electroplating process using a two-color injection mold for a built-in mobile phone antenna. Because of the need to use two-color injection molds and multiple injection moldings, the method has high mold cost and process cost, and is not suitable for large-scale promotion. Summary of the invention
本发明主要解决的技术问题是提供一种节省模具成本和流程成本 且适合大规模推广的手机、 真空镀膜天线及其制作方法。  The technical problem to be solved by the present invention is to provide a mobile phone, a vacuum coated antenna and a manufacturing method thereof, which are capable of saving mold cost and process cost and are suitable for mass promotion.
为解决上述技术问题， 本发明采用的一个技术方案是： 提供一种手 机， 包括形成在手机外壳上的真空镀膜天线， 所述真空镀膜天线包括依 次附着在手机外壳上的 UV底层、 金属导电层和 UV防护层， 所述 UV 底层经紫外光固化紧密贴合在所述外壳上； 所述金属导电层的图形分布 根据天线功能确定且是通过遮盖治具经真空溅镀工艺形成， 所述遮盖治 具的镂空形状与天线图形相适配。 其中， 所述手机外壳为 ABS材质、 尼龙材质或 PC材质。 In order to solve the above technical problem, a technical solution adopted by the present invention is: providing a mobile phone, comprising a vacuum coated antenna formed on a casing of a mobile phone, wherein the vacuum coated antenna comprises a UV underlayer and a metal conductive layer sequentially attached to a casing of the mobile phone. And a UV protective layer, the UV underlayer is closely adhered to the outer casing by ultraviolet light curing; the pattern distribution of the metal conductive layer is determined according to an antenna function and is formed by a vacuum sputtering process by a cover fixture, the covering The hollow shape of the jig is adapted to the antenna pattern. The mobile phone casing is made of ABS material, nylon material or PC material.
其中， 所述金属导电层是通过磁控溅射设备在真空条件下溅射制 成， 其材质为铝、 铜或者镍铜合金， 其厚度为 5~20微米。  Wherein, the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering device, and the material thereof is aluminum, copper or nickel-copper alloy, and the thickness thereof is 5-20 micrometers.
为解决上述技术问题， 本发明采用的另一个技术方案是： 提供一种 真空镀膜天线制作方法， 包括以下步骤：  In order to solve the above technical problem, another technical solution adopted by the present invention is: Providing a vacuum coating antenna manufacturing method, comprising the following steps:
准备天线基材；  Preparing an antenna substrate;
在天线基材表面喷涂 UV底层， 并利用紫外光固化所述 UV底层， 使得 UV底层紧密附着在天线基材上；  Spraying a UV underlayer on the surface of the antenna substrate, and curing the UV underlayer by ultraviolet light, so that the UV underlayer is closely attached to the antenna substrate;
根据天线图形线路的分布制作遮盖治具；  Making a cover fixture according to the distribution of the antenna pattern lines;
运用所述遮盖治具遮盖住天线基材上无需镀上导电层的部位， 而露 出需要镀上导电层的部位；  The covering fixture is used to cover the portion of the antenna substrate that does not need to be coated with a conductive layer, and the portion where the conductive layer needs to be plated is exposed;
利用真空溅镀工艺在天线基材上镀上符合天线图形线路的金属导 电层；  Applying a metal conductive layer conforming to the antenna pattern line on the antenna substrate by a vacuum sputtering process;
去掉遮盖治具， 在天线基材表面上整体喷涂 UV防护层。  Remove the cover fixture and apply a UV protection layer on the surface of the antenna substrate.
其中， 在所述喷涂 UV底层的步骤中， UV底层的工艺参数包括： 涂层膜厚为 8~12 um, 流平时间为 5-10min, 烘烤温度为 55-70°C , 烘烤 时间为 10-15min, U V光固化的峰值能量为 800-1200mj , 累计能量为 900-1300mj;  Wherein, in the step of spraying the UV underlayer, the process parameters of the UV underlayer include: coating film thickness of 8~12 um, leveling time of 5-10 min, baking temperature of 55-70 ° C, baking time For 10-15min, the peak energy of UV light curing is 800-1200mj, and the cumulative energy is 900-1300mj;
在所述溅镀金属导电层的步骤中， 金属导电层的工艺参数包括： 电 压一段为 100-120V, 电压二段为 220-250V, 电压三段为 300-350V, 电 流一段为 20-25 A , 电流二段为 40-50A, 电流三段为 75-90A, 真空值为 4 ± 2 X 10-2pa;  In the step of sputtering the metal conductive layer, the process parameters of the metal conductive layer include: a voltage of 100-120V, a voltage of 220-250V, a voltage of 300-350V, and a current of 20-25 A. , the current two segments are 40-50A, the current three segments are 75-90A, and the vacuum value is 4 ± 2 X 10-2pa;
在所述喷涂 UV防护层的步骤中，所述 UV防护层的工艺参数包括： 涂层膜厚为 15-28um, 流平时间为 5-10min, 烘烤温度为 55-70°C , 烘烤 时间为 15-25min, U V光固化的峰值能量为 1000-1500mj , 累计能量为 1000-1500mj。  In the step of spraying the UV protective layer, the process parameters of the UV protective layer include: a coating film thickness of 15-28 um, a leveling time of 5-10 min, a baking temperature of 55-70 ° C, baking The time is 15-25min, the peak energy of UV light curing is 1000-1500mj, and the accumulated energy is 1000-1500mj.
其中， 所述手机外壳为 ABS材质、 尼龙材质或 PC材质。  Wherein, the mobile phone shell is made of ABS material, nylon material or PC material.
其中，所述金属导电层是通过磁控溅射设备在真空条件下溅射制成， 其材质为铝、 铜或者镍铜合金， 其厚度为 5~20微米。 为解决上述技术问题， 本发明采用的另一个技术方案是： 提供一种 真空镀膜天线， 包括依次附着在天线基材上的 UV底层、 金属导电层和 UV防护层， 所述 UV底层经紫外光固化紧密贴合在所述天线基材上； 所述金属导电层的图形分布根据天线功能确定且是通过遮盖治具经真 空溅镀工艺形成， 遮盖治具的镂空形状与天线图形相适配。 Wherein, the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering device, and the material thereof is aluminum, copper or nickel-copper alloy, and the thickness thereof is 5-20 micrometers. In order to solve the above technical problem, another technical solution adopted by the present invention is: providing a vacuum coated antenna comprising a UV underlayer, a metal conductive layer and a UV protective layer sequentially attached to an antenna substrate, wherein the UV underlayer is ultraviolet light The curing is closely adhered to the antenna substrate; the pattern distribution of the metal conductive layer is determined according to the function of the antenna and is formed by a vacuum sputtering process by the covering fixture, and the hollow shape of the covering fixture is adapted to the antenna pattern.
其中， 所述天线基材为 ABS材质、 尼龙材质或 PC材质。  The antenna substrate is made of ABS material, nylon material or PC material.
其中， 所述金属导电层是通过磁控溅射设备在真空条件下溅射制 成， 其材质为铝、 铜或者镍铜合金， 其厚度为 5~20微米。  Wherein, the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering device, and the material thereof is aluminum, copper or nickel-copper alloy, and the thickness thereof is 5-20 micrometers.
本发明的有益效果是： 区别于现有技术的采用双色模具或者水镀工 艺制作手机天线， 其模具成本和流程成本都很高， 不适合大规模推广的 缺陷， 本发明采用真空镀膜技术镀上符合天线图形线路的金属导电层， 并结合 UV底层和 UV防护层得到的手机天线， 模具成本和流程成本都 很低， 而且仅仅通过一个遮盖治具就可以将天线图形线路镀成， 省去了 模具开发费用， 且流程成本低适合大规模推广。 UV底层和 UV防护层 呈半透明状， 可以露出金属导电层的图形形状， 制作的手机天线晶莹剔 透， 因 UV材料具有的高流平性和高爽滑性， 得到的手机天线表面光滑  The invention has the beneficial effects that: the mobile phone antenna is made by using the two-color mold or the water plating process, which has high mold cost and process cost, and is not suitable for large-scale promotion. The invention is coated by vacuum coating technology. The metal antenna layer conforming to the antenna pattern line, combined with the UV bottom layer and the UV protection layer, the handset antenna has low mold cost and process cost, and the antenna pattern line can be plated only by a cover fixture, eliminating the need for a shield. Mold development costs, and low process costs are suitable for large-scale promotion. The UV underlayer and the UV protective layer are translucent, which can expose the shape of the metal conductive layer, and the mobile phone antenna is crystal clear. Due to the high leveling and high smoothness of the UV material, the surface of the mobile phone antenna is smooth.
附图说明 DRAWINGS
图 1是本发明真空镀膜天线制作方法实施例的步骤流程图； 图 2是本发明真空镀膜天线实施例的结构示意图。 具体实施方式  1 is a flow chart showing the steps of an embodiment of a method for fabricating a vacuum coated antenna according to the present invention; and FIG. 2 is a schematic structural view of an embodiment of a vacuum coated antenna according to the present invention. detailed description
为详细说明本发明的技术内容、 构造特征、 所实现目的及效果， 以 下结合实施方式并配合附图详予说明。  The technical contents, structural features, objects and effects achieved by the present invention will be described in detail below with reference to the embodiments.
请参阅图 2, 本发明实施例的手机， 包括形成在手机外壳上的真空 镀膜天线， 所述真空镀膜天线包括依次附着在手机外壳上的 UV底层、 金属导电层和 UV防护层， 所述 UV底层经紫外光固化紧密贴合在所述 外壳上； 所述金属导电层的图形分布根据天线功能确定且是通过遮盖治 具经真空溅镀工艺形成， 所述遮盖治具的镂空形状与天线图形相适配。 现有的手机天线一般具有天线结构件， 通过形成在手机外壳上的真 空镀膜天线的设置， 可以去掉天线结构件， 从而可以节省下天线结构件 所占据的空间， 为制作超薄手机提供了可能。 另外， 天线可以制作在手 机外壳的任意部位， 对于需要大面积设置的手机天线结构提供了更加广 阔的面积， 可以有效提高天线的辐射信号或者接受信号的性能。 Referring to FIG. 2, a mobile phone according to an embodiment of the present invention includes a vacuum coated antenna formed on a casing of a mobile phone, the vacuum coated antenna including a UV underlayer, a metal conductive layer and a UV protective layer sequentially attached to a casing of the mobile phone, the UV The bottom layer is closely adhered to the outer casing by ultraviolet light curing; the pattern distribution of the metal conductive layer is determined according to the function of the antenna and is formed by a vacuum sputtering process by the covering fixture, and the hollow shape and the antenna pattern of the covering fixture Fitted. The existing mobile phone antenna generally has an antenna structural member, and the antenna structural member can be removed through the setting of the vacuum coating antenna formed on the outer casing of the mobile phone, thereby saving space occupied by the lower antenna structural member, and providing a possibility for making an ultra-thin mobile phone. . In addition, the antenna can be fabricated in any part of the outer casing of the mobile phone, and provides a wider area for the structure of the mobile phone antenna requiring a large area, which can effectively improve the radiation signal or the performance of the signal received by the antenna.
在一具体实施例中， 所述手机外壳为 ABS材质、 尼龙材质或 PC材 质。 当然， 手机外壳也可以采用其它的塑料材料， 如： 聚酰胺、、 聚甲 醛、 聚砜、 聚苯醚、 氟塑料等。 手机外壳仅仅是作为一个承载体， 其它 的材料也可以用来做手机外壳。  In a specific embodiment, the outer casing of the mobile phone is made of ABS material, nylon material or PC material. Of course, the outer casing of the mobile phone can also be made of other plastic materials, such as: polyamide, polyformaldehyde, polysulfone, polyphenylene ether, fluoroplastic, and the like. The phone case is only used as a carrier, and other materials can be used to make the phone case.
在一具体实施例中， 所述金属导电层是通过磁控溅射设备在真空条 件下溅射制成， 其材质为铝、 铜或者镍铜合金， 其厚度为 5~20微米。  In one embodiment, the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering apparatus, and is made of aluminum, copper or nickel-copper alloy having a thickness of 5 to 20 μm.
请参阅图 1及图 2, 本发明实施例的真空镀膜天线制作方法， 包括 以下步骤：  Referring to FIG. 1 and FIG. 2, a method for fabricating a vacuum coated antenna according to an embodiment of the present invention includes the following steps:
步骤 101: 准备天线基材 10;  Step 101: Preparing an antenna substrate 10;
步骤 102: 在天线基材 10表面喷涂 UV底层 11 ,并利用紫外光固化 所述 UV底层 11 , 使得 UV底层 11紧密附着在天线基材 10上；  Step 102: spraying a UV underlayer 11 on the surface of the antenna substrate 10, and curing the UV underlayer 11 by ultraviolet light, so that the UV underlayer 11 is closely attached to the antenna substrate 10;
步骤 103: 根据天线图形线路的分布制作遮盖治具；  Step 103: Making a cover fixture according to the distribution of the antenna pattern lines;
步骤 104: 运用所述遮盖治具遮盖住天线基材上无需镀上导电层的 部位 14, 而露出需要镀上导电层的部位 15;  Step 104: using the cover fixture to cover the portion of the antenna substrate that does not need to be coated with a conductive layer, and expose the portion 15 to be coated with a conductive layer;
步骤 105: 利用真空溅镀工艺在天线基材上镀上符合天线图形线路 的金属导电层 12;  Step 105: using a vacuum sputtering process to plate the antenna substrate with a metal conductive layer 12 conforming to the antenna pattern line;
步骤 106: 去掉遮盖治具， 在天线基材表面上整体喷涂 UV防护层 Step 106: Remove the cover fixture and spray the UV protective layer on the surface of the antenna substrate.
13。 13.
在步骤 102中， 将天线基材上的 UV胶体通过紫外线光固化喷涂， 使得 UV胶体作为中间桥梁增强天线基材与金属镀层的附着性， 使其金 属层强力附着于紫外线光固化涂料上。  In step 102, the UV colloid on the antenna substrate is sprayed by ultraviolet light curing, so that the UV colloid acts as an intermediate bridge to enhance the adhesion of the antenna substrate to the metal plating layer, and the metal layer is strongly adhered to the ultraviolet light curing paint.
在步骤 103中， 制作遮盖治具之前， 应先了解天线图形线路的分布 问题点及制程上的不稳定因素， 根据这些问题和因素确定天线图形线路 的形状， 并依据天线图形线路制作相应的遮镀治具。 在步骤 104中， 遮盖治具用于将手机零件的尺寸管控点遮喷， 避免 在制作过程中油漆飞溅导致尺寸偏差。 治具需根据产品的结构设计， 需 考虑其密合性、 遮蔽角的设计， 组装时确认遮蔽效果。 In step 103, before making the covering fixture, the distribution problem of the antenna pattern line and the unstable factors in the process should be known. The shape of the antenna pattern line is determined according to these problems and factors, and the corresponding mask is made according to the antenna pattern line. Plating fixture. In step 104, the covering jig is used to cover the size control points of the mobile phone parts, thereby avoiding dimensional deviation caused by paint splash during the manufacturing process. The fixture needs to be designed according to the structure of the product. The design of the adhesion and the shielding angle should be considered, and the shielding effect should be confirmed during assembly.
在步骤 105中， 应该依据导电需求及耐厚耐磨需求设计金属导电层 的厚度。  In step 105, the thickness of the metallic conductive layer should be designed in accordance with the electrical conductivity requirements and the resistance to thick and wear.
在步骤 106中， 为提升环境测试及化学测试所喷涂的 VU保护层， 可以提升整体外观效果、 最终性能测试水准及手感等等。  In step 106, in order to improve the VU protective layer sprayed by the environmental test and the chemical test, the overall appearance effect, the final performance test level and the feel can be improved.
区别于现有技术的采用双色模具或者水镀工艺制作手机天线， 其模 具成本和流程成本都艮高， 不适合大规模推广的缺陷， 本发明采用真空 镀膜技术镀上符合天线图形线路的金属导电层， 并结合 UV底层和 UV 防护层得到的手机天线， 模具成本和流程成本都很低， 而且仅仅通过一 个遮盖治具就可以将天线图形线路镀成， 省去了模具开发费用， 且流程 成本低适合大规模推广。 UV底层和 UV防护层呈半透明状， 可以露出 金属导电层的图形形状， 制作的手机天线晶莹剔透， 因 UV材料具有的 高流平性和高爽滑性， 得到的手机天线表面光滑平整。  Different from the prior art, the two-color mold or the water-plating process is used to manufacture the mobile phone antenna, and the mold cost and the process cost are high, which is not suitable for the large-scale promotion. The invention adopts the vacuum coating technology to plate the metal conductive wire conforming to the antenna pattern line. The mobile phone antenna obtained from the layer and combined with the UV underlayer and the UV protective layer has low mold cost and process cost, and the antenna pattern circuit can be plated only by a covering fixture, which saves the mold development cost and the process cost. Low for large-scale promotion. The UV underlayer and the UV protective layer are translucent, which can expose the shape of the metal conductive layer, and the mobile phone antenna is crystal clear. Due to the high leveling and high smoothness of the UV material, the surface of the mobile phone antenna is smooth and flat.
在所述喷涂 UV底层的步骤中， UV底层的工艺参数包括： 涂层膜 厚为 8~12 um, 流平时间为 5-10min, 烘烤温度为 55-70°C , 烘烤时间为 10-15min , U V光固化的峰值能量为 800-1200mj , 累计能量为 900-1300mj;  In the step of spraying the UV underlayer, the process parameters of the UV underlayer include: coating film thickness of 8~12 um, leveling time of 5-10 min, baking temperature of 55-70 ° C, baking time of 10 -15min, the peak energy of UV light curing is 800-1200mj, and the accumulated energy is 900-1300mj;
在所述溅镀金属导电层的步骤中， 金属导电层的工艺参数包括： 电 压一段为 100-120V, 电压二段为 220-250V, 电压三段为 300-350V, 电 流一段为 20-25 A , 电流二段为 40-50A, 电流三段为 75-90A, 真空值为 4 ± 2 X 10-2pa;  In the step of sputtering the metal conductive layer, the process parameters of the metal conductive layer include: a voltage of 100-120V, a voltage of 220-250V, a voltage of 300-350V, and a current of 20-25 A. , the current two segments are 40-50A, the current three segments are 75-90A, and the vacuum value is 4 ± 2 X 10-2pa;
在所述喷涂 UV防护层的步骤中，所述 UV防护层的工艺参数包括： 涂层膜厚为 15-28um, 流平时间为 5-10min, 烘烤温度为 55-70°C , 烘烤 时间为 15-25min, U V光固化的峰值能量为 1000-1500mj , 累计能量为 1000-1500mj。  In the step of spraying the UV protective layer, the process parameters of the UV protective layer include: a coating film thickness of 15-28 um, a leveling time of 5-10 min, a baking temperature of 55-70 ° C, baking The time is 15-25min, the peak energy of UV light curing is 1000-1500mj, and the accumulated energy is 1000-1500mj.
在一具体实施例中，所述天线基材为 ABS (丙烯腈、丁二烯和苯乙烯 的三元共聚物)材质、 尼龙材质或 PC (聚碳酸酯)材质。 当然， 也可以采 用其它的塑料材料， 如： 聚酰胺、、 聚甲醛、 聚砜、 聚苯醚、 氟塑料等。 天线基材仅仅是作为一个承载体， 其它的材料也可以用来做天线基材。 In one embodiment, the antenna substrate is made of ABS (a ternary copolymer of acrylonitrile, butadiene, and styrene), nylon, or PC (polycarbonate). Of course, you can also Use other plastic materials, such as: polyamide, polyoxymethylene, polysulfone, polyphenylene ether, fluoroplastic, etc. The antenna substrate is only used as a carrier, and other materials can also be used as the antenna substrate.
在一具体实施例中，所述金属导电层的材质为铝、铜或者镍铜合金。 当然， 可以导电的其它金属也可以通过真空镀膜技术制成本发明的金属 导电层， 并不局限于铝、 铜或者镍铜合金这几种金属材质， 只要能够导 电实现导电功能的材料都应该输入本发明的等同替换。  In a specific embodiment, the metal conductive layer is made of aluminum, copper or nickel-copper alloy. Of course, other metals that can conduct electricity can also be made into the metal conductive layer of the present invention by vacuum coating technology, and are not limited to aluminum, copper or nickel-copper alloys, as long as materials capable of conducting conductive functions should be input. An equivalent replacement of the invention.
在一具体实施例中， 所述金属导电层是通过磁控溅射设备在真空条 件下溅射制成。 磁控溅射设备在真空条件下制作成金属导电镀层的工艺 是本发明的主要实现方式之一， 当然， 也可以采用蒸镀工艺得到本发明 所述的金属导电层。  In a specific embodiment, the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering apparatus. The process of forming a metal conductive plating layer under vacuum conditions by a magnetron sputtering apparatus is one of the main implementations of the present invention. Of course, the metal conductive layer of the present invention can also be obtained by an evaporation process.
在一具体实施例中， 所述金属导电层的厚度为 5~20微米。 当然， 根据实际需要或者导电需求及耐磨需求等因素可以任意设计金属导电 层的厚度。 5~20微米仅是本发明的优选实施例的厚度， 其它厚度应该也 属于本发明的保护范围。  In a specific embodiment, the metal conductive layer has a thickness of 5 to 20 microns. Of course, the thickness of the metal conductive layer can be arbitrarily designed according to actual needs or conductive requirements and wear resistance requirements. 5 to 20 microns is only the thickness of the preferred embodiment of the invention, and other thicknesses are also within the scope of the invention.
参见图 2, 本发明实施例的真空镀膜天线， 包括依次附着在天线基 材 10上的 UV底层 11、金属导电层 12和 UV防护层 13, 所述 UV底层 11经紫外光固化紧密贴合在所述天线基材 10上；所述金属导电层 12的 图形分布根据天线功能确定且是通过遮盖治具经真空溅镀工艺形成， 遮 盖治具的镂空形状与天线图形相适配。 天线的功能确定了天线图形的布 局及线路的走向， 每种天线的功能不同特征不同需求不同， 当然其金属 导电层的形状布局及走线也不同。  Referring to FIG. 2, a vacuum coated antenna according to an embodiment of the present invention includes a UV underlayer 11, a metal conductive layer 12, and a UV protective layer 13 which are sequentially attached to an antenna substrate 10. The UV underlayer 11 is cured by UV curing. The pattern distribution of the metal conductive layer 12 is determined according to the function of the antenna and is formed by a vacuum sputtering process by the cover fixture, and the hollow shape of the cover fixture is adapted to the antenna pattern. The function of the antenna determines the layout of the antenna pattern and the direction of the line. Each antenna has different functions and different requirements. Of course, the shape and layout of the metal conductive layer are different.
本发明采用真空镀膜技术制作而成的真空镀膜天线， 通过依次附着 在天线基材上的 UV底层、 金属导电层和 UV防护层得到的手机天线， 其性能根据天线的功能确定， 能够 4艮好地完成天线效果， 在折弯处或者 异形图形处可以更好地实现天线的辐射接收信号的效果。 本发明的真空 镀膜天线， 其模具成本和流程成本都很低， 而且仅仅通过一个遮盖治具 就可以将天线图形线路镀成， 省去了模具开发费用。 UV底层和 UV防 护层呈半透明状， 可以露出金属导电层的图形形状， 制作的手机天线晶 莹剔透， 因 UV材料具有的高流平性和高爽滑性， 得到的手机天线表面 光滑平整。 The vacuum coated film antenna manufactured by the vacuum coating technology of the present invention, the mobile phone antenna obtained by sequentially attaching the UV underlayer, the metal conductive layer and the UV protective layer on the antenna substrate, the performance of which is determined according to the function of the antenna, can be good The antenna effect is completed, and the effect of radiating the received signal of the antenna can be better achieved at the bend or the profiled figure. The vacuum coated antenna of the present invention has low mold cost and process cost, and the antenna pattern line can be plated only by a covering fixture, thereby eliminating the mold development cost. The UV underlayer and the UV protective layer are translucent, which can expose the shape of the metal conductive layer, and the mobile phone antenna made is crystal clear. Due to the high leveling and high smoothness of the UV material, the surface of the mobile phone antenna is obtained. Smooth and flat.
在一具体实施例中，所述天线基材为 ABS (丙烯腈、丁二烯和苯乙烯 的三元共聚物)材质、 尼龙材质或 PC (聚碳酸酯)材质。 当然， 也可以采 用其它的塑料材料， 如： 聚酰胺、、 聚甲醛、 聚砜、 聚苯醚、 氟塑料等。 天线基材仅仅是作为一个承载体， 其它的材料也可以用来做天线基材。  In one embodiment, the antenna substrate is made of ABS (a ternary copolymer of acrylonitrile, butadiene, and styrene), nylon, or PC (polycarbonate). Of course, other plastic materials such as polyamide, polyoxymethylene, polysulfone, polyphenylene ether, fluoroplastic, etc. can also be used. The antenna substrate is only used as a carrier, and other materials can also be used as the antenna substrate.
在一具体实施例中，所述金属导电层的材质为铝、铜或者镍铜合金。 当然， 可以导电的其它金属也可以通过真空镀膜技术制成本发明的金属 导电层， 并不局限于铝、 铜或者镍铜合金这几种金属材质， 只要能够导 电实现导电功能的材料都应该输入本发明的等同替换。  In a specific embodiment, the metal conductive layer is made of aluminum, copper or nickel-copper alloy. Of course, other metals that can conduct electricity can also be made into the metal conductive layer of the present invention by vacuum coating technology, and are not limited to aluminum, copper or nickel-copper alloys, as long as materials capable of conducting conductive functions should be input. An equivalent replacement of the invention.
在一具体实施例中， 所述金属导电层是通过磁控真空溅射设备在真 空条件下溅射制成。 磁控溅射设备在真空条件下制作成金属导电镀层的 工艺是本发明的主要实现方式之一， 当然， 也可以采用蒸镀工艺得到本 发明所述的金属导电层。  In a specific embodiment, the metal conductive layer is formed by sputtering under vacuum conditions by a magnetron vacuum sputtering apparatus. The process of forming a metal conductive plating layer under vacuum conditions in a magnetron sputtering apparatus is one of the main implementations of the present invention. Of course, the metal conductive layer according to the present invention can also be obtained by an evaporation process.
在一具体实施例中， 所述金属导电层的厚度为 5~20微米。 当然， 根据实际需要或者导电需求及耐磨需求等因素可以任意设计金属导电 层的厚度。 5~20微米仅是本发明的优选实施例的厚度， 其它厚度应该也 属于本发明的保护范围。  In a specific embodiment, the metal conductive layer has a thickness of 5 to 20 microns. Of course, the thickness of the metal conductive layer can be arbitrarily designed according to actual needs or conductive requirements and wear resistance requirements. 5 to 20 microns is only the thickness of the preferred embodiment of the invention, and other thicknesses are also within the scope of the invention.
以上所述仅为本发明的实施例， 并非因此限制本发明的专利范围， 凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换， 或 直接或间接运用在其他相关的技术领域， 均同理包括在本发明的专利保 护范围内。  The above is only the embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformations made by the specification and the drawings of the present invention may be directly or indirectly applied to other related technologies. The scope of the invention is included in the scope of patent protection of the present invention.

Claims

权 利 要 求 书 Claim
1、 一种手机， 其特征在于， 包括形成在手机外壳上的真空镀膜天 线， 所述真空镀膜天线包括依次附着在手机外壳上的 UV底层、 金属导 电层和 UV防护层，所述 UV底层经紫外光固化紧密贴合在所述外壳上； 所述金属导电层的图形分布根据天线功能确定且是通过遮盖治具经真 空溅镀工艺形成， 所述遮盖治具的镂空形状与天线图形相适配。 What is claimed is: 1. A mobile phone, comprising: a vacuum coated antenna formed on a casing of a mobile phone, the vacuum coated antenna comprising a UV underlayer, a metal conductive layer and a UV protective layer sequentially attached to a casing of the mobile phone, wherein the UV underlayer is The ultraviolet curing is closely adhered to the outer casing; the pattern distribution of the metal conductive layer is determined according to the function of the antenna and is formed by a vacuum sputtering process by using a covering fixture, and the hollow shape of the covering fixture is compatible with the antenna pattern Match.
2、 根据权利要求 1所述的手机， 其特征在于：  2. The mobile phone according to claim 1, wherein:
所述手机外壳为 ABS材质、 尼龙材质或 PC材质。  The phone case is made of ABS material, nylon material or PC material.
3、 根据权利要求 2所述的手机， 其特征在于：  3. The mobile phone according to claim 2, wherein:
所述金属导电层是通过磁控溅射设备在真空条件下溅射制成， 其材 质为铝、 铜或者镍铜合金， 其厚度为 5~20微米。  The metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering apparatus, and the material thereof is aluminum, copper or nickel-copper alloy, and has a thickness of 5 to 20 μm.
4、 一种真空镀膜天线制作方法， 其特征在于， 包括以下步骤： 准备天线基材；  A method for fabricating a vacuum coated antenna, comprising the steps of: preparing an antenna substrate;
在天线基材表面喷涂 UV底层， 并利用紫外光固化所述 UV底层， 使得 UV底层紧密附着在天线基材上；  Spraying a UV underlayer on the surface of the antenna substrate, and curing the UV underlayer by ultraviolet light, so that the UV underlayer is closely attached to the antenna substrate;
根据天线图形线路的分布制作遮盖治具；  Making a cover fixture according to the distribution of the antenna pattern lines;
运用所述遮盖治具遮盖住天线基材上无需镀上导电层的部位， 而露 出需要镀上导电层的部位；  The covering fixture is used to cover the portion of the antenna substrate that does not need to be coated with a conductive layer, and the portion where the conductive layer needs to be plated is exposed;
利用真空溅镀工艺在天线基材上镀上符合天线图形线路的金属导 电层；  Applying a metal conductive layer conforming to the antenna pattern line on the antenna substrate by a vacuum sputtering process;
去掉遮盖治具， 在天线基材表面上整体喷涂 UV防护层。  Remove the cover fixture and apply a UV protection layer on the surface of the antenna substrate.
5、 根据权利要求 4所述的真空镀膜天线制作方法， 其特征在于： 在所述喷涂 UV底层的步骤中， UV底层的工艺参数包括： 涂层膜 厚为 8~12 um, 流平时间为 5-10min, 烘烤温度为 55-70°C , 烘烤时间为 10-15min , U V光固化的峰值能量为 800-1200mj , 累计能量为 900-1300mj;  5. The method of fabricating a vacuum coated antenna according to claim 4, wherein in the step of spraying the UV underlayer, the process parameters of the UV underlayer include: a coating film thickness of 8 to 12 um, and a leveling time of 5-10min, baking temperature is 55-70 ° C, baking time is 10-15min, peak energy of UV light curing is 800-1200mj, cumulative energy is 900-1300mj;
在所述溅镀金属导电层的步骤中， 金属导电层的工艺参数包括： 电 压一段为 100-120V, 电压二段为 220-250V, 电压三段为 300-350V, 电 流一段为 20-25 A, 电流二段为 40-50A, 电流三段为 75-90A, 真空值为 4 ± 2 X 10-2pa; In the step of sputtering the metal conductive layer, the process parameters of the metal conductive layer include: a voltage of 100-120V, a voltage of 220-250V, and a voltage of 300-350V. The flow is 20-25 A, the current is 40-50A, the current is 75-90A, and the vacuum is 4 ± 2 X 10-2pa.
在所述喷涂 UV防护层的步骤中，所述 UV防护层的工艺参数包括： 涂层膜厚为 15-28um, 流平时间为 5-10min, 烘烤温度为 55-70°C , 烘烤 时间为 15-25min, U V光固化的峰值能量为 1000-1500mj , 累计能量为 1000-1500mj。  In the step of spraying the UV protective layer, the process parameters of the UV protective layer include: a coating film thickness of 15-28 um, a leveling time of 5-10 min, a baking temperature of 55-70 ° C, baking The time is 15-25min, the peak energy of UV light curing is 1000-1500mj, and the accumulated energy is 1000-1500mj.
6、 根据权利要求 5所述的真空镀膜天线制作方法， 其特征在于： 所述天线基材为 ABS材质、 尼龙材质或 PC材质。  The method of manufacturing a vacuum coated antenna according to claim 5, wherein the antenna substrate is made of ABS material, nylon material or PC material.
7、 根据权利要求 6所述的真空镀膜天线制作方法， 其特征在于： 所述金属导电层是通过磁控溅射设备在真空条件下溅射制成， 其材 质为铝、 铜或者镍铜合金， 其厚度为 5~20微米。  7. The method of fabricating a vacuum coated antenna according to claim 6, wherein: said metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering device, and is made of aluminum, copper or nickel-copper alloy. , its thickness is 5~20 microns.
8、 一种真空镀膜天线， 其特征在于， 包括依次附着在天线基材上的 UV底层、 金属导电层和 UV防护层， 所述 UV底层经紫外光固化紧密 贴合在所述天线基材上； 所述金属导电层的图形分布根据天线功能确定 且是通过遮盖治具经真空溅镀工艺形成， 遮盖治具的镂空形状与天线图 形相适配。  8. A vacuum coated antenna, comprising: a UV underlayer, a metal conductive layer, and a UV protective layer sequentially attached to an antenna substrate, wherein the UV underlayer is cured by UV curing and closely attached to the antenna substrate. The pattern distribution of the metal conductive layer is determined according to the function of the antenna and is formed by a vacuum sputtering process by the cover fixture, and the hollow shape of the cover fixture is adapted to the antenna pattern.
9、 根据权利要求 8所述的真空镀膜天线， 其特征在于：  9. The vacuum coated antenna of claim 8 wherein:
所述天线基材为 ABS材质、 尼龙材质或 PC材质。  The antenna substrate is made of ABS material, nylon material or PC material.
10、 根据权利要求 8所述的真空镀膜天线， 其特征在于：  10. The vacuum coated antenna of claim 8 wherein:
所述金属导电层是通过磁控溅射设备在真空条件下溅射制成， 其材 质为铝、 铜或者镍铜合金， 其厚度为 5~20微米。  The metal conductive layer is formed by sputtering under vacuum conditions by a magnetron sputtering apparatus, and the material thereof is aluminum, copper or nickel-copper alloy, and has a thickness of 5 to 20 μm.
PCT/CN2011/072662 2011-04-12 2011-04-12 Mobile phone, vacuum plating antenna and manufacture method thereof WO2012139279A1 (en)

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CN101375463A (en) * 2006-01-24 2009-02-25 艾利丹尼森公司 Radio frequency (RF) antenna containing element and methods of making the same
CN101217215A (en) * 2007-01-02 2008-07-09 三星电机株式会社 Film antenna and mobile communication system using same
CN101051358A (en) * 2007-05-23 2007-10-10 北京德鑫泉科技发展有限公司 Intelligent label and its glueing method and device
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