WO2012129459A1 - Self cleaning solutions for carbon implantation - Google Patents
Self cleaning solutions for carbon implantation Download PDFInfo
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- WO2012129459A1 WO2012129459A1 PCT/US2012/030228 US2012030228W WO2012129459A1 WO 2012129459 A1 WO2012129459 A1 WO 2012129459A1 US 2012030228 W US2012030228 W US 2012030228W WO 2012129459 A1 WO2012129459 A1 WO 2012129459A1
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- WO
- WIPO (PCT)
- Prior art keywords
- solution
- benzyl
- ion source
- cleaning agent
- torr
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 16
- 238000002513 implantation Methods 0.000 title claims abstract description 13
- 229910052799 carbon Inorganic materials 0.000 title claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000012459 cleaning agent Substances 0.000 claims abstract description 18
- 150000002500 ions Chemical class 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 19
- 239000000243 solution Substances 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- UYWQUFXKFGHYNT-UHFFFAOYSA-N Benzylformate Chemical compound O=COCC1=CC=CC=C1 UYWQUFXKFGHYNT-UHFFFAOYSA-N 0.000 claims description 6
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- UNDXPKDBFOOQFC-UHFFFAOYSA-N 4-[2-nitro-4-(trifluoromethyl)phenyl]morpholine Chemical compound [O-][N+](=O)C1=CC(C(F)(F)F)=CC=C1N1CCOCC1 UNDXPKDBFOOQFC-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 229940007550 benzyl acetate Drugs 0.000 claims description 3
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 claims description 3
- 229940073608 benzyl chloride Drugs 0.000 claims description 3
- UENWRTRMUIOCKN-UHFFFAOYSA-N benzyl thiol Chemical compound SCC1=CC=CC=C1 UENWRTRMUIOCKN-UHFFFAOYSA-N 0.000 claims description 3
- 238000001819 mass spectrum Methods 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000012159 carrier gas Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 238000005280 amorphization Methods 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 16
- 239000002019 doping agent Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 150000002430 hydrocarbons Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 230000005465 channeling Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- WDAXFOBOLVPGLV-UHFFFAOYSA-N ethyl isobutyrate Chemical compound CCOC(=O)C(C)C WDAXFOBOLVPGLV-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- -1 toluene ion Chemical class 0.000 description 2
- SQCZQTSHSZLZIQ-UHFFFAOYSA-N 1-chloropentane Chemical compound CCCCCCl SQCZQTSHSZLZIQ-UHFFFAOYSA-N 0.000 description 1
- GPDFVOVLOXMSBT-UHFFFAOYSA-N 1-propan-2-yloxybutane Chemical compound CCCCOC(C)C GPDFVOVLOXMSBT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910005898 GeSn Inorganic materials 0.000 description 1
- 229910003811 SiGeC Inorganic materials 0.000 description 1
- 229910020328 SiSn Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001793 charged compounds Chemical class 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthene Chemical compound C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7848—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the source/drain region, e.g. SiGe source and drain
Definitions
- the present invention relates to self cleaning compounds for use as carbon implantation sources.
- US J ultra-shallow junctions
- Aromatic Carbon implant technology is also available from Axcelis Technologies. Those heavy carbon-based PAI methods have displayed advantages in performance and cost. They are also useful in making source and drain stressor materials. However, formation of hydrocarbon film residue in ion source chambers is a critical issue in this technology.
- the present invention provides improved methods and formulas for use in the PAI of substrates used in semiconductor manufacturing.
- the present invention relates to methods and formulas for providing implantation ions to accomplish PAI of substrates, particularly for the formation of ultra-shallow junctions.
- This source may be provided in a liquid sub-atmospheric pressure package, such as the Genii technology available from the Linde Group.
- the compound liquid vapor pressure should be greater than 1 Torr at temperatures below 100°C, and the preferable vapor pressure is greater than 5 Torr and less than lOOTorr at temperatures between 10°C and 100°C.
- the C7 ions upon ionization, the C7 ions are highly concentrated in mass spectra with the C7 ion (with a mass about 91 amu, C 7 H 7 + ) being the most abundant ion peak in the mass spectra.
- the cleaning agent(s) dissociates from the parent molecule upon ionization and produces highly concentrated and reactive neutral or charged radicals. These radicals then react with hydrocarbon residue to form volatile gas produces, such as, C0 2 , CO, H 2 0, H 2 S, CH 4 , NH 3 , CC14, or the like.
- the cleaning agent compound could contain reactive oxygen function groups but it is not a source for C7 ion.
- the cleaning agent produces volatile products that help to avoid the formation of hydrocarbon film residue inside of the chamber.
- the cleaning agent may also produce oxygen, chlorine, nitrogen, or fluorine radicals to remove the hydrocarbon residue.
- the cleaning capacity of the cleaning agent may be reduced, leading to the need for downtime cleaning of the chamber.
- a number of cleaning agents having comparable vapor pressures may be used in the present invention.
- the vapor pressures of 1-chloropentane, cyclo entylamine, isopropyl butyl ether, ethyl isobutyrate, peracetic acid, 3-methyl-2-butanol and 2- methyl- l-propanol have vapor pressures near enough to that of toluene to be useful according to the present invention.
- Examples of single self-cleaning compounds useful as PAI sources according to the present invention include compounds having a C7 ion source portion with a composition of C7 or C7Hx, selected from benzyl chloride (C6H5CH2CI), benzyl acetate (C 9 Hio0 2 ), benzyl ethyl ether (C 9 Hi 2 0), benzyl formate (C 6 H 5 CH 2 OOCH), or benzyl mercaptan (C 6 HsCH 2 SH). These compounds may also be useful as carbon sources for other carbon implantation purposes.
- benzyl chloride C6H5CH2CI
- benzyl acetate C 9 Hio0 2
- benzyl ethyl ether C 9 Hi 2 0
- benzyl formate C 6 H 5 CH 2 OOCH
- benzyl mercaptan C 6 HsCH 2 SH
- the compounds according to the present invention may be packaged for use in several different ways.
- the Genii technology from the Linde Group provides the compounds as standard sub-atmospheric pressure ion implantation sources in a cylinder with a membrane separator and with temperature control on the cylinder wall and delivery line up to 100°C.
- an inert carrier gas may be used, wherein the inert gas flows through the source liquid in a bubbler configuration at room temperature.
- the source compound may be delivered by direct liquid injection with a bubbler and liquid mass flow controller at room temperature.
- the compounds of the present invention will require heating between 50°C and 100°C if the pure vapor phase of liquid is delivered.
- the present invention provides many advantages.
- the compounds of the present invention are self-cleaning C7 implantation sources that provide high C7H7 ion beam intensity as well as self-cleaning radicals with high concentration.
- component separation is not necessary making processing simpler and less expensive.
- the single molecule liquid compounds of the present invention exhibit a single vapor pressure curve, reducing operation parameters and simplifying processing.
- the compounds of the present invention provide self- cleaning properties and therefore, longer ion chamber life can be achieved and the need for shutdown for cleaning can be reduced or eliminated. Consequently, manufacturing and operation costs are reduced.
- the compounds of the present invention may be useful for implantation of semiconductor devices, for implantation of structural engineered materials, or for implantation of photovoltaic materials.
- the variations of the present invention also include other carbon-based molecules other than C7.
Abstract
Compounds and methods for use as source materials for pre-amorphization implantation in the formation of ultra-shallow junctions. Some compounds exhibit self-cleaning Cn (n= 5 - 30) ion source properties wherein each molecule of the compound includes a Cn (n= 5 - 30) ion source portion and a cleaning agent portion. Other compounds comprise binary solutions that exhibit self-cleaning Cn (n= 5 - 30) source properties wherein the solution contains a Cn (n= 5 - 30) ion source component and a cleaning agent component.
Description
SELF CLEANING SOLUTIONS FOR CARBON IMPLANTATION
FIELD OF THE INVENTION
(001) The present invention relates to self cleaning compounds for use as carbon implantation sources.
BACKGROUND OF THE INVENTION
(002) The use of semiconductors in our society is becoming more ubiquitous. For example, semiconductors are used in everyday items ranging from
programmable coffee makers, to telecommunication devices to faster computers. The ability to scale down device structures, especially in trying to reach the <32 nm device technology, remains a goal. However, the requirements to achieve smaller and smaller sizes become more and more difficult to meet.
(003) One component of achieving smaller device sizes in the production of reduced junction depth, known as ultra-shallow junctions (US J). However, forming USJ features present many challenges. In particular, dopants channeling penetration, transient enhanced diffusion, and clustering via interstitial sites or vacancies all present potential problems. These tendencies are recognized as causing an increase in the final junction depth and in sheet resistance. The basic challenge of forming high dopant actuation and high junction steepness with a shallow penetration dopant profile remains. In addition, the elimination of residual effects, strong control of lateral diffusion, junction stability after post annealing and junction formation in new source and drain materials, such as
SiGe/SiGeC/SiC/SiSn/GeSn, presents further challenges.
(004) To meet these challenges, there are several proposed processes and techniques. One of these is the pre-amorphization implant (PAI) of heavy ions, such as Ge and Xe ions or heavy C, F or N containing molecular ions, followed by dopant ions, e.g. B+, BF2 +, implantation. The PAI process helps to overcome the problems associated with channeling of the dopant ion as well as the limitation of solid solubility of the dopant ion. Cluster Carbon implant materials are available, such as from SemEquip, Inc. that can be used for PAI processes. Aromatic Carbon implant technology is also available from Axcelis Technologies. Those heavy carbon-based PAI methods have displayed advantages in performance and cost. They are also useful in making source and drain stressor materials. However, formation of hydrocarbon film residue in ion source chambers is a critical issue in this technology.
(005) There remains a need in the art for improvements related to PAI for use in the formation of ultra-shallow junctions.
SUMMARY OF THE PRESENT INVENTION
(006) The present invention provides improved methods and formulas for use in the PAI of substrates used in semiconductor manufacturing.
DETAILED DESCRIPTION OF THE INVENTION
(007) The present invention relates to methods and formulas for providing implantation ions to accomplish PAI of substrates, particularly for the formation of ultra-shallow junctions.
(008) In accordance with the present invention, the source ions are preferably carbon atoms, supplied from a Cn (n=5— 30) molecular source. This source may
be provided in a liquid sub-atmospheric pressure package, such as the Genii technology available from the Linde Group. A preferred Cn (n=5 - 30) source is toluene which has shown promising results in both beam current and wafer characteristics. However, use of this Cn (n=5 - 30) source also resulted in the production of a large amount of hydrocarbon film residue inside the ionization chamber. This residue must be cleaned periodically from the chamber, requiring tool downtime with a resultant increase in semiconductor manufacturing time and cost.
(009) The present invention relates to compounds that exhibit self-cleaning Cn (n=5 - 30) ion source properties. According to one embodiment of the present invention, the compounds are single molecule liquid compound that exhibit self- cleaning Cn (n=5 - 30) ion source properties. Each molecule of the compounds of the present invention has a Cn (n=5 - 30) ion source portion and at least one cleaning agent portion, e.g. the portion containing reactive oxygen, chlorine, nitrogen, sulfur, fluorine, or the like species. The Cn (n=5 - 30) ion portion of the compound is preferable a toluene ion (C7H7 +), when n=7. The compound liquid vapor pressure should be greater than 1 Torr at temperatures below 100°C, and the preferable vapor pressure is greater than 5 Torr and less than lOOTorr at temperatures between 10°C and 100°C. In case of C7 compound, upon ionization, the C7 ions are highly concentrated in mass spectra with the C7 ion (with a mass about 91 amu, C7H7 +) being the most abundant ion peak in the mass spectra. The cleaning agent(s) dissociates from the parent molecule upon ionization and produces highly concentrated and reactive neutral or charged radicals. These radicals then react with hydrocarbon residue to form volatile gas produces, such as, C02, CO, H20, H2S, CH4, NH3, CC14, or the like.
(010) In accordance with a second embodiment of the present invention, a binary liquid mixture may be used, the binary liquid mixture comprising a Cn (n=5 - 30)
source, e.g. toluene, mixed with a different cleaning agent compound, if C7 ion is required. For example, the cleaning agent compound could contain reactive oxygen function groups but it is not a source for C7 ion. In operation, the cleaning agent produces volatile products that help to avoid the formation of hydrocarbon film residue inside of the chamber. The cleaning agent may also produce oxygen, chlorine, nitrogen, or fluorine radicals to remove the hydrocarbon residue.
(011) For the binary liquid system to be viable, the vapor pressures of the Cn (n=5 - 30) source compound and the cleaning agent compound must be a good match to prevent concentration changes in the gas phase. Without the proper balance, results are compromised. For example, if cleaning agent concentration is increased, the chamber will remain clean, but the Cn (n=5— 30) ion beam intensity is reduced, causing problems with the effectiveness of the PAI procedure.
Alternatively, if the Cn (n=5 - 30) source concentration is raised higher than necessary for the beam intensity to be sufficient, then the cleaning capacity of the cleaning agent may be reduced, leading to the need for downtime cleaning of the chamber.
(012) For a binary liquid system using toluene as the C7 source, a number of cleaning agents having comparable vapor pressures may be used in the present invention. In particular, the vapor pressures of 1-chloropentane, cyclo entylamine, isopropyl butyl ether, ethyl isobutyrate, peracetic acid, 3-methyl-2-butanol and 2- methyl- l-propanol have vapor pressures near enough to that of toluene to be useful according to the present invention. These solutions provide results better than the use of toluene alone.
(013) Examples of single self-cleaning compounds useful as PAI sources according to the present invention include compounds having a C7 ion source portion with a composition of C7 or C7Hx, selected from benzyl chloride
(C6H5CH2CI), benzyl acetate (C9Hio02), benzyl ethyl ether (C9Hi20), benzyl formate (C6H5CH2OOCH), or benzyl mercaptan (C6HsCH2SH). These compounds may also be useful as carbon sources for other carbon implantation purposes.
(014) The compounds according to the present invention may be packaged for use in several different ways. For example, the Genii technology from the Linde Group provides the compounds as standard sub-atmospheric pressure ion implantation sources in a cylinder with a membrane separator and with temperature control on the cylinder wall and delivery line up to 100°C. Alternatively, an inert carrier gas may be used, wherein the inert gas flows through the source liquid in a bubbler configuration at room temperature. In addition, the source compound may be delivered by direct liquid injection with a bubbler and liquid mass flow controller at room temperature. In general the compounds of the present invention will require heating between 50°C and 100°C if the pure vapor phase of liquid is delivered.
(015) The present invention provides many advantages. The compounds of the present invention are self-cleaning C7 implantation sources that provide high C7H7 ion beam intensity as well as self-cleaning radicals with high concentration. For the single molecule liquid compound embodiment of the present invention, component separation is not necessary making processing simpler and less expensive. In addition, the single molecule liquid compounds of the present invention exhibit a single vapor pressure curve, reducing operation parameters and simplifying processing. The compounds of the present invention provide self- cleaning properties and therefore, longer ion chamber life can be achieved and the need for shutdown for cleaning can be reduced or eliminated. Consequently, manufacturing and operation costs are reduced.
(016) It is anticipated that other embodiments and variations of the present invention will become readily apparent to the skilled artisan in the light of the foregoing description, and it is intended that such embodiments and variations likewise be included within the scope of the invention as set out in the appended claims. For example, the compounds of the present invention may be useful for implantation of semiconductor devices, for implantation of structural engineered materials, or for implantation of photovoltaic materials. The variations of the present invention also include other carbon-based molecules other than C7.
Claims
1. A self cleaning solution for carbon implantation comprising a single molecule compound having a Cn (n=5 - 30) ion source portion and a cleaning agent portion.
2. The solution of claim 1, wherein the Cn (n=5 - 30) ion source portion is a C7 ion source having a composition of C7 or C7Hx selected from benzyl chloride (C6HsCH2Cl), benzyl acetate (CgHioCh), benzyl ethyl ether (C9H12O), benzyl formate (C6H5CH2OOCH), or benzyl mercaptan (C6H5CH2SH).
3. The solution of claim 1 , wherein the cleaning agent portion contains oxygen, chlorine, nitrogen, sulfur or fluorine.
4. The solution of claim 1 , wherein the compound has a liquid vapor pressure greater than 1 Torr at temperatures below 100°C.
5. The solution of claim 4, wherein the liquid vapor pressure is greater than 5 Torr and less than 100 Torr at temperatures between 10°C and 100°C.
6. A method of carbon implantation comprising:
delivering a self cleaning solution of a single molecule compound having a Cn (n=5 - 30) ion source portion and a cleaning agent portion to an ionization chamber; dissociating the solution to produce a Cn (n=5— 30) source ion and highly concentrated cleaning agent radicals;
implanting the Cn (n=5 - 30) source ions; and
reacting the cleaning agent radicals with hydrocarbon residue within the ionization chamber.
7. The method of claim 6, wherein the Cn (n=5 - 30) ion source portion is a C7 ion source having a composition of C7 or C7Hx selected from benzyl chloride (C6H5CH2CI), benzyl acetate (Ο9Η10Ο2), benzyl ethyl ether (C9H120), benzyl formate (C6H5CH2OOCH), or benzyl mercaptan (C6H5CH2SH).
8. The method of claim 7, wherein the C7 ion source selected is the source having the highest ion intensity in mass spectra produced in the ionization chamber.
9. The method of claim 6, wherein the cleaning agent portion contains oxygen, chlorine, nitrogen, sulfur or fluorine.
10. The method of claim 6, wherein the compound has a liquid vapor pressure greater than 1 Torr at temperatures below 100°C.
11. The method of claim 10, wherein the liquid vapor pressure is greater than 5 Torr and less than 100 Torr at temperatures between 10°C and 100°C.
12. The method of claim 6 wherein delivering comprises delivering the compound from a cylinder with a membrane separator having temperature control on the cylinder wall and the delivery line.
13. The method of claim 6 wherein delivering comprises flowing an inert carrier gas through the solution in a bubbler configuration at room temperature.
14. The method of claim 6 wherein delivering comprises direct liquid injection of the solution with a bubbler and liquid mass flow controller at room temperature.
15. The method of claim 6 wherein dissociating comprises heating the ionization chamber to a temperature between 50°C and 100°C.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161467042P | 2011-03-24 | 2011-03-24 | |
US201161467038P | 2011-03-24 | 2011-03-24 | |
US61/467,038 | 2011-03-24 | ||
US61/467,042 | 2011-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012129459A1 true WO2012129459A1 (en) | 2012-09-27 |
Family
ID=46879752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2012/030228 WO2012129459A1 (en) | 2011-03-24 | 2012-03-23 | Self cleaning solutions for carbon implantation |
Country Status (2)
Country | Link |
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TW (1) | TW201245112A (en) |
WO (1) | WO2012129459A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020070672A1 (en) * | 1999-12-13 | 2002-06-13 | Horsky Thomas N. | Electron beam ion source with integral low-temperature vaporizer |
US20050233529A1 (en) * | 2001-02-12 | 2005-10-20 | Pomarede Christophe F | Integration of high k gate dielectric |
US20090081874A1 (en) * | 2007-09-21 | 2009-03-26 | Cook Kevin S | Method for extending equipment uptime in ion implantation |
US20090206281A1 (en) * | 2006-06-12 | 2009-08-20 | Dror Oved | Vapor delivery system useful with ion sources and vaporizers for use in such system |
US20090252887A1 (en) * | 2008-04-02 | 2009-10-08 | Raytheon Company | System and method for growing nanotubes with a specified isotope composition via ion implantation using a catalytic transmembrane |
-
2012
- 2012-03-23 WO PCT/US2012/030228 patent/WO2012129459A1/en active Application Filing
- 2012-03-26 TW TW101110424A patent/TW201245112A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020070672A1 (en) * | 1999-12-13 | 2002-06-13 | Horsky Thomas N. | Electron beam ion source with integral low-temperature vaporizer |
US20050233529A1 (en) * | 2001-02-12 | 2005-10-20 | Pomarede Christophe F | Integration of high k gate dielectric |
US20090206281A1 (en) * | 2006-06-12 | 2009-08-20 | Dror Oved | Vapor delivery system useful with ion sources and vaporizers for use in such system |
US20090081874A1 (en) * | 2007-09-21 | 2009-03-26 | Cook Kevin S | Method for extending equipment uptime in ion implantation |
US20090252887A1 (en) * | 2008-04-02 | 2009-10-08 | Raytheon Company | System and method for growing nanotubes with a specified isotope composition via ion implantation using a catalytic transmembrane |
Also Published As
Publication number | Publication date |
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TW201245112A (en) | 2012-11-16 |
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