WO2012123109A2 - Method for producing flexible thin film solar cells - Google Patents
Method for producing flexible thin film solar cells Download PDFInfo
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- WO2012123109A2 WO2012123109A2 PCT/EP2012/001129 EP2012001129W WO2012123109A2 WO 2012123109 A2 WO2012123109 A2 WO 2012123109A2 EP 2012001129 W EP2012001129 W EP 2012001129W WO 2012123109 A2 WO2012123109 A2 WO 2012123109A2
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- Prior art keywords
- layer
- substrate
- contact layer
- film
- layer structure
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- 239000010409 thin film Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000010408 film Substances 0.000 claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract description 5
- 239000012876 carrier material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03921—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
- H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method for producing flexible thin-film solar cells and to a flexible thin-film solar module produced by the method.
- Flexible thin-film solar cells are known, for example, from DE 100 05 680 B4 and DE 100 06 823 C2.
- a flexible substrate or flexible carrier material for example, a strip-shaped copper foil is used for the production.
- the prior art on manufacturing problems in the Use of flexible films made of plastics or metals.
- Claim 1 features and at a thereafter
- the inventive measures is a
- Manufacturing process for flexible thin-film solar cells achieved in which problems in the construction of the individual layers are avoided directly on a flexible film and in that the individual layers first in a conventional manner on a rigid substrate, such as a glass substrate constructed or superimposed and then the entire layer structure is removed as a unit from the glass substrate and placed on a flexible film.
- FIGS. 1 to 6 The individual and successive method steps illustrated in FIGS. 1 to 6 lead to a finished flexible thin-film solar cell 10 shown in FIG. 7, which leads to a thin-film solar module individually or in a multiplicity of correspondingly interconnected thin-film solar cells. It is understood that the shape and size of the thin-film solar cell 10 may be arbitrary.
- a preliminary carrier material 11 is a rigid carrier material, for example in the form of a
- a front contact layer 12 in the form of a TCO layer is brought.
- a photoactive layer 13 is made of, for example, silicon in a thin film.
- a back contact layer 14 is brought. This from the
- Layer structure 15 may be of conventional design.
- the back contact layer 14 may be made of, for example, thin-film aluminum.
- Layer structure 15 is shown in FIG.
- a flexible film 16 is applied to the back contact layer 14, preferably laminated.
- the flexible film 16 is the
- the film 16 may be transparent or opaque. This consisting of the glass substrate 11, the layer structure 15 and the laminated film 16 Rohzellenhoff 17 is optionally after turning of the free
- Laser beam is adjusted so that the boundary layer 19 between the inner surface of the glass substrate 11 and the
- the laser light may have a wavelength in the range of 532 nm
- the glass substrate 11 for example, has a thickness of 4 mm.
- This transparent film 22 also has a partially electrically conductive surface in the form of conductor tracks, in particular contact wires, wherein this transparent film 22 as well as the film 16 is constructed according to DE 102 39 845 C1. In both cases, it is a
- Solar cell 10 in the form of a thin-film solar cell, whose light incident side for the photoactive layer 13, the exposed surface 21 of the transparent film 22 is.
- the finished very thin flexible thin-film solar cell 10 can be produced in various geometries or in particular be tailored later. Several such
- Thin-film solar cells 10 may become larger
- Thin-film solar cell module summarized or electrically interconnected.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to a method for producing flexible thin film solar cells, comprising the following steps: e. applying a photoactive layer construction to a rigid substrate preferably made of glass and having the front contact layer thereof facing outward, f. applying a flexible film to the back contact layer of the layer construction facing away from the substrate, g. releasing the photoactive layer construction from the substrate by means of a laser beam, h. applying a flexible film to the front contact layer.
Description
Verfahren zum Herstellen von flexiblen Dünnschicht Solarzellen Method for producing flexible thin-film solar cells
BeSchreibung Description
Die vorliegende Erfindung bezieht sich auf ein Verfahren zum Herstellen von flexiblen Dünnschicht-Solarzellen sowie auf ein nach dem Verfahren hergestelltes flexibles Dünnschicht- Solarmodul . The present invention relates to a method for producing flexible thin-film solar cells and to a flexible thin-film solar module produced by the method.
Flexible Dünnschicht-Solarzellen sind beispielsweise aus der DE 100 05 680 B4 sowie DE 100 06 823 C2 bekannt. Als flexibles Substrat bzw. flexibles Trägermaterial wird zur Herstellung beispielsweise eine bandförmige Kupferfolie verwendet. Dabei weist der Stand der Technik auf Herstellungsprobleme bei der
Verwendung von flexiblen Folien aus Kunststoffen oder Metallen hin. Flexible thin-film solar cells are known, for example, from DE 100 05 680 B4 and DE 100 06 823 C2. As a flexible substrate or flexible carrier material, for example, a strip-shaped copper foil is used for the production. In this case, the prior art on manufacturing problems in the Use of flexible films made of plastics or metals.
Aufgabe der vorliegenden Erfindung ist es, ein Verfahren zum Herstellen von flexiblen Dünnschicht-Solarzellen zu schaffen, bei dem ein vom Stand der Technik unterschiedlicher Weg zu deren Verwirklichung gegangen werden soll. The object of the present invention is to provide a method for producing flexible thin-film solar cells, in which a different way from the prior art to their realization is to be gone.
Zur Lösung dieser Aufgabe sind bei einem Verfahren zum To solve this problem are in a method for
Herstellen von flexiblen Dünnschicht-Solarzellen die im Manufacture of flexible thin-film solar cells in the
Anspruch 1 angegebenen Merkmale und bei einem danach Claim 1 features and at a thereafter
hergestellten Dünnschicht-Solarmodul die im Anspruch 6 angegebenen Merkmale vorgesehen. produced thin-film solar module provided in claim 6 features.
Durch die erfindungsgemäßen Maßnahmen ist ein The inventive measures is a
Herstellungsverfahren für flexible Dünnschicht-Solarzellen erreicht, bei dem Probleme beim Aufbau der einzelnen Schichten unmittelbar auf einer flexiblen Folie vermieden sind und zwar dadurch, dass die einzelnen Schichten zunächst in an sich bekannter Weise auf ein starres Substrat, wie beispielsweise ein Glassubstrat aufgebaut bzw. übereinandergelegt werden und danach der gesamte Schichtaufbau als Einheit vom Glassubstrat abgenommen und auf eine flexible Folie gebracht wird. Manufacturing process for flexible thin-film solar cells achieved in which problems in the construction of the individual layers are avoided directly on a flexible film and in that the individual layers first in a conventional manner on a rigid substrate, such as a glass substrate constructed or superimposed and then the entire layer structure is removed as a unit from the glass substrate and placed on a flexible film.
Vorteilhafte Ausgestaltungen hinsichtlich des Schichtaufbaus und des Ablösens des Schichtaufbaus vom Substrat und der Verwendung entsprechender Folien als Trägermaterial und/oder
als Abdeckung ergeben sich aus den Merkmalen eines oder mehrerer der Ansprüche 2 bis 5. Advantageous embodiments with regard to the layer structure and the detachment of the layer structure from the substrate and the use of corresponding films as a carrier material and / or as a cover resulting from the features of one or more of claims 2 to 5.
Weitere Einzelheiten der Erfindung sind der folgenden Further details of the invention are the following
Beschreibung zu entnehmen, in der die Erfindung anhand des in der Zeichnung dargestellten Ausführungsbeispieles näher beschrieben und erläutert ist. Es zeigen: Described description in which the invention with reference to the embodiment shown in the drawing is described and explained in more detail. Show it:
Figuren characters
1 bis 6 jeweils in schematischer geschnittener Darstellung die einzelnen Verfahrensschritte zum . Herstellen einer flexiblen Dünnschicht-Solarzelle und 1 to 6 each show a schematic sectional representation of the individual method steps for . Producing a flexible thin-film solar cell and
Figur 7 in den vorhergehenden Figuren entsprechender Figure 7 in the previous figures corresponding
Darstellung eine fertig hergestellte Dünnschicht- Solarzelle zum Aufbau eines Solarmoduls. Representation of a ready-made thin-film solar cell for the construction of a solar module.
Die in den Figuren 1 bis 6 dargestellten einzelnen und aufeinanderfolgenden Verfahrensschritte führen zu einer in Figur 7 dargestellten fertigen flexiblen Dünnschicht- Solarzelle 10, die einzeln oder in einer Vielzahl entsprechend verschalteter Dünnschicht-Solarzellen zu einem Dünnschicht- Solarmodul führt. Es versteht sich, dass Form und Größe der Dünnschicht-Solarzelle 10 beliebig sein kann. The individual and successive method steps illustrated in FIGS. 1 to 6 lead to a finished flexible thin-film solar cell 10 shown in FIG. 7, which leads to a thin-film solar module individually or in a multiplicity of correspondingly interconnected thin-film solar cells. It is understood that the shape and size of the thin-film solar cell 10 may be arbitrary.
Gemäß Figur 1 wird als vorläufiges Trägermaterial 11 ein starres Trägermaterial beispielsweise in Form eines According to FIG. 1, a preliminary carrier material 11 is a rigid carrier material, for example in the form of a
Glassubstrats verwendet. In einem ersten Herstellungsschritt
wird auf das Glassubstrat 11 eine Frontkontakt-Schicht 12 in Form einer TCO-Schicht gebracht. Auf die Frontkontakt-Schicht 12 wird eine fotoaktive Schicht 13 aus beispielsweise Silizium in Dünnschicht gebracht. Auf die fotoaktive Schicht 13 wird eine Rückkontaktschicht 14 gebracht. Dieser aus den Glass substrate used. In a first manufacturing step On the glass substrate 11, a front contact layer 12 in the form of a TCO layer is brought. On the front contact layer 12, a photoactive layer 13 is made of, for example, silicon in a thin film. On the photoactive layer 13, a back contact layer 14 is brought. This from the
aufeinander gelegten Schichten 12 bis 14 hergestellte superimposed layers 12 to 14 produced
Schichtaufbau 15 kann üblicher Bauart sein. Die Rückkontakt- Schicht 14 kann aus beispielsweise Dünnschicht-Aluminium sein. Der auf dem Glassubstrat 11 angeordnete fotoaktive Layer structure 15 may be of conventional design. The back contact layer 14 may be made of, for example, thin-film aluminum. The arranged on the glass substrate 11 photoactive
Schichtaufbau 15 ist in Figur 2 gezeigt. Layer structure 15 is shown in FIG.
In einem weiteren Herstellungsschritt wird gemäß Figur 3 auf die Rückkontakt-Schicht 14 eine flexible Folie 16 aufgebracht, vorzugsweise auflaminiert . Die flexible Folie 16 ist der In a further production step, according to FIG. 3, a flexible film 16 is applied to the back contact layer 14, preferably laminated. The flexible film 16 is the
Rückkontakt-Schicht 14 zugewandt mit Leiterbahnen, Back contact layer 14 facing with conductor tracks,
insbesondere Kontaktdrähten versehen, wie dies in der DE 102 39 845 C1 beschrieben ist. Die Folie 16 kann transparent oder opak sein. Dieser aus dem Glassubstrat 11, dem Schichtaufbau 15 und der auflaminierten Folie 16 bestehende Rohzellenaufbau 17 wird gegebenenfalls nach Wenden von der freien in particular contact wires provided, as described in DE 102 39 845 C1. The film 16 may be transparent or opaque. This consisting of the glass substrate 11, the layer structure 15 and the laminated film 16 Rohzellenaufbau 17 is optionally after turning of the free
Glassubstrat-Oberfläche 18 her mit einem Laserstrahl 20 beaufschlagt (Figur 4). Vor dem von einem nicht dargestellten Laser ausgehende Laserstrahl 20 wird die gesamte freie dem Schichtaufbau 15 abgewandte Oberfläche 18 des Glassubstrats 11 scannend abgetastet. Die Energie des Lasers bzw. des Glass substrate surface 18 ago with a laser beam 20 applied (Figure 4). In front of the laser beam 20 emanating from a laser, not shown, the entire free surface 18 of the glass substrate 11 facing away from the layer structure 15 is scanned. The energy of the laser or the
Laserstrahles ist so eingestellt, dass die Grenzschicht 19 zwischen der Innenfläche des Glassubstrats 11 und der Laser beam is adjusted so that the boundary layer 19 between the inner surface of the glass substrate 11 and the
gegenüberliegenden Fläche der Frontkontakt-Schicht 12 derart
behandelt wird, dass sich ein Ablöseprozess des Glassubstrats 11 von der Frontkontakt-Schicht 12 ergibt. Beispielsweise kann das Laserlicht eine Wellenlänge im Bereich von 532 nm opposite surface of the front contact layer 12 such that a peeling process of the glass substrate 11 from the front contact layer 12 is treated. For example, the laser light may have a wavelength in the range of 532 nm
besitzen, wobei das Glassubstrat 11 beispielsweise eine Dicke von 4 mm aufweist. have, wherein the glass substrate 11, for example, has a thickness of 4 mm.
Gemäß Figur 5 wird das Glassubstrat 11 nach seinem Ab- bzw. Loslösen aufgrund des Laserstrahls 20 abgehoben und bei Seite gelegt. Das Glassubstrat 11 kann nach einer Reinigung wieder verwendet werden. According to FIG. 5, the glass substrate 11 is lifted off after its detachment due to the laser beam 20 and set aside. The glass substrate 11 can be reused after cleaning.
Anstelle des Glassubstrats 11 wird gemäß Figur 6 auf die Frontkontakt-Schicht 12 eine transparente Folie 22 auf die Frontkontakt-Schicht 12 des erhalten gebliebenen Instead of the glass substrate 11, according to FIG. 6, a transparent film 22 has been retained on the front contact layer 12 on the front contact layer 12
Schichtaufbaus 15 aufgebracht, vorzugsweise laminiert. Diese transparente Folie 22 besitzt ebenfalls eine teilweise elektrisch leitende Oberfläche in Form von Leiterbahnen, insbesondere Kontaktdrähten, wobei diese transparente Folie 22 ebenso wie die Folie 16 entsprechend der DE 102 39 845 C1 aufgebaut ist. In beiden Fällen handelt es sich um eine Layer structure 15 applied, preferably laminated. This transparent film 22 also has a partially electrically conductive surface in the form of conductor tracks, in particular contact wires, wherein this transparent film 22 as well as the film 16 is constructed according to DE 102 39 845 C1. In both cases, it is a
Kunststofffolie . Plastic film.
Gemäß Figur 7 ergibt sich damit die fertige flexible According to Figure 7, this results in the finished flexible
Solarzelle 10 in Form einer Dünnschicht-Solarzelle, deren Lichteinfallseite für die fotoaktive Schicht 13 die frei liegende Oberfläche 21 der transparenten Folie 22 ist.
Die fertige sehr dünne flexible Dünnschicht-Solarzelle 10 kann in verschiedenen Geometrien hergestellt oder insbesondere nachträglich zugeschnitten werden. Mehrere solcher Solar cell 10 in the form of a thin-film solar cell, whose light incident side for the photoactive layer 13, the exposed surface 21 of the transparent film 22 is. The finished very thin flexible thin-film solar cell 10 can be produced in various geometries or in particular be tailored later. Several such
Dünnschicht-Solarzellen 10 können zu einem größeren Thin-film solar cells 10 may become larger
Dünnschicht-Solarzellenmodul zusammengefasst bzw. elektrisch verschaltet werden. Thin-film solar cell module summarized or electrically interconnected.
Alternativ ist es möglich, das Ablösen des Glassubstrats 11 von der Frontkontakt-Schicht 12 mittels Laserstrahl statt nach Figur 5 von der dem Glassubstrat 11 abgewandten Seite des Schichtaufbaus 15 vorzunehmen.
Alternatively, it is possible to carry out the detachment of the glass substrate 11 from the front contact layer 12 by means of a laser beam instead of according to FIG. 5 from the side of the layer structure 15 facing away from the glass substrate 11.
Claims
1. Verfahren zum Herstellen von flexiblen Dunnschicht- Solarzellen (10), gekennzeichnet durch folgende Schritte: a. Aufbringen eines fotoaktiven Schichtaufbaus (15) auf ein starres Substrat (11) aus vorzugsweise Glas mit dessen Frontkontakt-Schicht (12) voraus, b. Aufbringen einer flexiblen Folie (16) auf die dem Substrat (11) abgewandte Rückkontakt-Schicht (14) des Schichtaufbaus (15), c. Ablöser, des fotoaktiven Schichtaufbaus (15) vom A method of making flexible thin film solar cells (10) characterized by the steps of: a. Applying a photoactive layer structure (15) to a rigid substrate (11) preferably made of glass with its front contact layer (12), b. Applying a flexible film (16) to the substrate (11) facing away from the back contact layer (14) of the layer structure (15), c. Stripper, the photoactive layer structure (15) of
Substrat (11) mittels Laserstrahl (20), d. Aufbringen einer flexiblen Folie (22) auf die Substrate (11) by means of laser beam (20), d. Applying a flexible film (22) on the
Frontkontakt-Schicht (12). Front contact layer (12).
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass der Schichtaufbau (15) dadurch gebildet wird, dass die Frontkontakt-Schicht (12), vorzugsweise in Form einer TCO-Schicht auf das Substrat (11), dann auf die 2. The method according to claim 1, characterized in that the layer structure (15) is formed by the front contact layer (12), preferably in the form of a TCO layer on the substrate (11), then on the
Frontkontakt-Schicht (12) die Schicht (13) aus Front contact layer (12) of the layer (13)
fotoaktivem Metall, beispielsweise Silizium, und danach auf die fotoaktive Schicht (13) die Rückkontakt-Schicht (14) aus elektrisch leitendem Material gebracht wird. photoactive metal, for example silicon, and then the photoactive layer (13), the back contact layer (14) is made of electrically conductive material.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die flexiblen Folien (16, 22) auf die betreffende Schicht {14, 1.2) aufgebracht, vorzugsweise laminiert werden . 3. The method according to claim 1 or 2, characterized in that the flexible films (16, 22) to the relevant Layer {14, 1.2) are applied, preferably laminated.
4. Verfahren nach mindestens einem der vorhergehenden 4. The method according to at least one of the preceding
Ansprüche, dadurch gekennzeichnet, dass zum Ablösen des Substrats (11) das Laserlicht (20) auf die dem Claims, characterized in that for detaching the substrate (11), the laser light (20) on the the
Schichtaufbau (15) abgewandte Oberfläche (18) des Substrats (11) gerichtet wird. Layer structure (15) facing away from the surface (18) of the substrate (11) is directed.
5. Verfahren nach mindestens einem der vorhergehenden 5. The method according to at least one of the preceding
Ansprüche, dadurch gekennzeichnet, dass für die das Substrat (11) ersetzende Folie (22) eine transparente Folie vorzugsweise mit Leiterbahnen verwendet wird. Claims, characterized in that for the substrate (11) replacing film (22), a transparent film is preferably used with conductor tracks.
6. Nach dem Verfahren nach Anspruch 1 und ggf. mindestens einem der ünteransprüche hergestelltes flexibles 6. By the method according to claim 1 and optionally at least one of the claims ünteransprüche produced flexible
Dünnschicht-Solarmodul , gekennzeichnet durch eine lichteinfallsseitige transparente Folie (22), einen darunterliegenden fotoaktiven Schichtaufbau (15) aus Frontkontakt-Schicht (12), fotoaktiver Schicht (13) und Rückkontakt-Schicht (14) sowie eine unter dem Thin-film solar module, characterized by a light incident side transparent film (22), an underlying photoactive layer structure (15) of front contact layer (12), photoactive layer (13) and back contact layer (14) and one under the
Schichtaufbau (15) angeordnete rückseitige Folie (16) . Layer structure (15) arranged rear foil (16).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011014795.0 | 2011-03-15 | ||
DE102011014795.0A DE102011014795B4 (en) | 2011-03-15 | 2011-03-15 | Process for the production of flexible thin-film solar cells |
Publications (2)
Publication Number | Publication Date |
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WO2012123109A2 true WO2012123109A2 (en) | 2012-09-20 |
WO2012123109A3 WO2012123109A3 (en) | 2013-06-20 |
Family
ID=45954588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2012/001129 WO2012123109A2 (en) | 2011-03-15 | 2012-03-14 | Method for producing flexible thin film solar cells |
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DE (1) | DE102011014795B4 (en) |
WO (1) | WO2012123109A2 (en) |
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DE102014202985B4 (en) * | 2014-02-19 | 2018-07-12 | 4Jet Microtech Gmbh & Co. Kg | Production of electronic components on a substrate |
Citations (3)
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DE10006823C2 (en) | 2000-02-08 | 2003-10-02 | Cis Solartechnik Gmbh | Process for producing a flexible metallic substrate for a CIS solar cell and CIS solar cell |
DE10239845C1 (en) | 2002-08-29 | 2003-12-24 | Day4 Energy Inc | Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
DE10005680B4 (en) | 2000-02-07 | 2005-03-31 | Cis Solartechnik Gmbh | Support material for a flexible, band-shaped CIS solar cell |
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EP0797258B1 (en) * | 1996-03-18 | 2011-07-20 | Sony Corporation | Method for making thin film semiconductor, solar cell, and light emitting diode |
JPH1126733A (en) * | 1997-07-03 | 1999-01-29 | Seiko Epson Corp | Transfer method of thin film device, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display and electronic equipment |
DE10127255A1 (en) * | 2001-06-05 | 2003-01-16 | Univ Stuttgart | Conditioning of glass surfaces for the transfer of CIGS solar cells to flexible plastic substrates |
WO2006033822A2 (en) * | 2004-09-07 | 2006-03-30 | Massachusetts Institute Of Technology | Fabrication of electronic and photonic systems on flexible substrates by layer transfer method |
WO2007011742A2 (en) * | 2005-07-14 | 2007-01-25 | Konarka Technologies, Inc. | Cigs photovoltaic cells |
JP5352824B2 (en) * | 2007-07-20 | 2013-11-27 | 独立行政法人 宇宙航空研究開発機構 | Manufacturing method of solar cell |
KR20100111117A (en) * | 2009-04-06 | 2010-10-14 | 삼성전기주식회사 | Manufacturing method of thin film device and the thin film device manufactured thereof |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10005680B4 (en) | 2000-02-07 | 2005-03-31 | Cis Solartechnik Gmbh | Support material for a flexible, band-shaped CIS solar cell |
DE10006823C2 (en) | 2000-02-08 | 2003-10-02 | Cis Solartechnik Gmbh | Process for producing a flexible metallic substrate for a CIS solar cell and CIS solar cell |
DE10239845C1 (en) | 2002-08-29 | 2003-12-24 | Day4 Energy Inc | Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
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DE102011014795B4 (en) | 2021-05-06 |
WO2012123109A3 (en) | 2013-06-20 |
DE102011014795A1 (en) | 2012-09-20 |
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