WO2012120756A1 - Method for manufacturing adhesive sheet for optical semiconductor device, and adhesive sheet for optical semiconductor device - Google Patents

Method for manufacturing adhesive sheet for optical semiconductor device, and adhesive sheet for optical semiconductor device Download PDF

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Publication number
WO2012120756A1
WO2012120756A1 PCT/JP2012/000076 JP2012000076W WO2012120756A1 WO 2012120756 A1 WO2012120756 A1 WO 2012120756A1 JP 2012000076 W JP2012000076 W JP 2012000076W WO 2012120756 A1 WO2012120756 A1 WO 2012120756A1
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WIPO (PCT)
Prior art keywords
optical semiconductor
adhesive
semiconductor device
sheet
semiconductor devices
Prior art date
Application number
PCT/JP2012/000076
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French (fr)
Japanese (ja)
Inventor
嘉幸 塩野
Original Assignee
信越化学工業株式会社
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Publication date
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Publication of WO2012120756A1 publication Critical patent/WO2012120756A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/2901—Shape
    • H01L2224/29011—Shape comprising apertures or cavities
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/29078—Plural core members being disposed next to each other, e.g. side-to-side arrangements
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
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    • H01L2224/838—Bonding techniques
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Definitions

  • the present invention relates to a method for producing an adhesive sheet for a semiconductor device, and particularly relates to a method for producing an adhesive sheet for an optical semiconductor device.
  • a liquid, paste-like curable adhesive (also referred to as a die bond agent) for bonding an optical semiconductor element to an element mounting portion, and a curable adhesive for sealing the optical semiconductor element from above.
  • Agents have been used.
  • an optical semiconductor device having a blue LED (light emission diode) element or an LED element that emits white light by performing wavelength conversion by light emission from an LED element having an emission wavelength equal to or less than a blue wavelength an optical semiconductor element is used.
  • Liquid and paste-like silicone adhesives have been used as curable adhesives for sealing from above.
  • Patent Document 1 liquid and pasty silicone materials are also used as the die bond agent, and the silicone die bond agent generally has low internal stress, excellent adhesiveness, and excellent light transmittance
  • Patent Document 2 a light emitting semiconductor device is produced by potting an epoxy / silicone hybrid resin composition and curing at 180 ° C. for 1 hour.
  • Patent Document 2 an epoxy / silicone hybrid resin composition is prepared. The object is bonded and sealed by injecting it into a cup, cavity, package recess or the like in which a light emitting element is arranged at the bottom by a dispenser or other method and curing it by heating or the like.
  • an optical semiconductor element 13 ′ such as an LED element is cut out in large quantities from one wafer 12 ′ by a dicer 11 ′ (Step 1 ′) and collected, but the optical semiconductor element 13 ′ has a large variation in emission wavelength. Each of the emission wavelengths is measured, and an operation called sorting is performed (step 2 ′). Next, the optical semiconductor elements 13 ′ sorted into the respective layers are bonded together on one adhesive tape 21 for each layer (Step 3 ′).
  • step 4-1 ′ an operation of picking up the optical semiconductor elements 13 ′ one by one from the adhesive tape 21 to which the optical semiconductor elements 13 ′ having the selected emission wavelength layer are attached is performed (step 4-1 ′) and arranged separately.
  • a liquid, paste-like die bonding agent 22 is applied to the element mounting portion 15 ′ in the optical semiconductor device 14 ′ thus prepared by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is applied to the element mounting portion 15 ′.
  • the die bonding agent 22 is cured by heating or the like, and the optical semiconductor element 13 ′ and the element mounting portion 15 ′ in the optical semiconductor device 14 ′ are cured and bonded (step 5 ′).
  • the above method for manufacturing an optical semiconductor device has a problem that it takes time because it is necessary to stamp a die bond agent on each of the element mounting portions of the optical semiconductor device. This problem has been a problem that cannot be avoided as long as a liquid or paste die bond agent is applied and used.
  • an optical semiconductor device adhesive that replaces the liquid and paste die-bonding agent and a method for manufacturing the optical semiconductor device using the same.
  • an adhesive sheet for optical semiconductor devices in which this is disposed on a base sheet can be considered.
  • an optical semiconductor device can be efficiently manufactured.
  • an optical semiconductor device also referred to as a die, a die, or a chip
  • a light emission diode hereinafter referred to as an LED
  • a laser diode hereinafter referred to as an LD
  • the work up to fixing to the mounting portion can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be improved.
  • it has an appropriate uniform shape, area, and film thickness according to the high throughput of the production of the adhesive sheet for an optical semiconductor device itself, or the adhesion area of the optical semiconductor element to be cured and bonded to the element mounting portion. If it is difficult to form the adhesive for optical semiconductor devices on the base sheet, it will also be difficult to improve the productivity of manufacturing the optical semiconductor device.
  • the present invention has been made in order to solve the above-described problem, and can produce a high-throughput production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device, and For an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate, uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the optical semiconductor element to be cured and bonded to the element mounting portion. It aims at providing the manufacturing method of an adhesive agent sheet.
  • an optical semiconductor element cut out and sorted from a wafer is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device, and then the optical semiconductor element is mounted.
  • a method for producing an adhesive sheet for an optical semiconductor device in which an adhesive for an optical semiconductor device used for curing and bonding a semiconductor element to the element mounting portion is disposed, At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided.
  • an optical semiconductor device is produced by dividing the adhesive for an optical semiconductor device uniformly formed on a base sheet into an arbitrary shape according to the bonding area of the optical semiconductor element to be cured and bonded.
  • the production of the adhesive sheet for optical semiconductor devices capable of enhancing the properties can be made high-throughput, and suitable and uniform shape and area according to the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion
  • the adhesive for optical semiconductor devices having a film thickness can be formed on the substrate sheet.
  • the adhesive dividing step it is preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by irradiation with laser light.
  • the adhesive for optical semiconductor devices can be easily divided by irradiation with laser light, and the side surfaces of the adhesive divided on the part irradiated with the laser light are separated,
  • the divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet.
  • An optical semiconductor device adhesive sheet manufacturing method capable of forming an optical semiconductor device adhesive having a more appropriate and more uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the element. .
  • Any laser beam may be used as long as it can divide the adhesive for an optical semiconductor device, and a carbon dioxide laser, a YAG laser, a YVO 4 laser, or the like is applicable.
  • the adhesive dividing step it is also preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by a cutter blade.
  • the adhesive for optical semiconductor devices can be easily divided by the cutter blade, and the side surfaces of the adhesive divided by the portion cut by the cutter blade are separated from each other, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet.
  • the cutter blade it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor element to be cured and bonded to the element mounting portion. It becomes the manufacturing method of the adhesive sheet for optical semiconductor devices which can form the adhesive agent for optical semiconductor devices which has a more suitable and more uniform shape, area, and film thickness according to the adhesion area on a base material sheet.
  • Any cutter blade may be used as long as it can divide the adhesive for optical semiconductor devices, and a BIK blade (Thomson blade), a pinnacle blade, or the like can be applied.
  • the present invention provides an adhesive sheet for an optical semiconductor device, which is manufactured by the method for manufacturing an adhesive sheet for an optical semiconductor device and has the adhesive for an optical semiconductor device divided into the arbitrary shape.
  • the adhesive for optical semiconductor devices divided into a plurality of arbitrary shapes is arranged on the base sheet, it is for one optical semiconductor device.
  • a plurality of optical semiconductor elements can be attached on the adhesive sheet.
  • the optical semiconductor element and the optical semiconductor device adhesive are both peeled off and picked up at the time of pickup, and can be directly mounted on the element mounting portion and cured and bonded via the optical semiconductor device adhesive. It becomes. Therefore, stamping of the die bond agent to the element mounting portion is not required, and the optical semiconductor device can be efficiently manufactured.
  • stamping of the die bond agent to the element mounting portion is not required, and the optical semiconductor device can be efficiently manufactured.
  • an optical semiconductor device that can efficiently perform the work until it is fixed to the element mounting portion of the optical semiconductor device. It becomes an adhesive sheet.
  • the production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device can be made high-throughput, and the element mounting portion is cured.
  • Manufacture of an adhesive sheet for an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate and uniform shape, area and film thickness on the base sheet in accordance with the adhesive area of the optical semiconductor element to be bonded A method can be provided.
  • the manufacturing method of the adhesive agent sheet for optical semiconductor devices of this invention is demonstrated in detail, this invention is not limited to these.
  • the present inventors have obtained an optical semiconductor device divided into an arbitrary shape on a base sheet. If the adhesive sheet for an optical semiconductor device having the adhesive for use in a peelable state is used, the operation until the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device can be efficiently performed. It has been found that the time for stamping on the mounting portion can be reduced.
  • the present inventors have increased the throughput of the production of the adhesive sheet for an optical semiconductor device itself, and an appropriate and uniform shape, area in accordance with the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion, If an adhesive for an optical semiconductor device having a film thickness can be formed on a base sheet, the inventors have conceived that the production of the optical semiconductor device can be made more efficient, and earnestly studied in order to achieve this problem. As a result, the present invention was completed by finding that the adhesive for an optical semiconductor device uniformly formed on the base sheet was divided into arbitrary shapes according to the adhesive area of the optical semiconductor element to be cured and bonded. .
  • an optical semiconductor element cut out from a wafer and sorted is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device, and then the optical semiconductor element is inserted into the element.
  • a method for producing an adhesive sheet for an optical semiconductor device in which an adhesive for an optical semiconductor device used for curing and bonding to an attachment portion is disposed, At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided. The present invention will be described in detail below.
  • the optical semiconductor element in the present invention is an optical semiconductor element cut out from a wafer and sorted, and is not particularly limited as long as it is generally handled as an optical semiconductor element, and examples thereof include LEDs and LDs. .
  • Such optical semiconductor elements generally have large variations in light quantity, emission wavelength, etc., as a particular problem. For this reason, a sorting operation is performed in which the layers are classified for each emission wavelength and the like before being fixed to the optical semiconductor device. Since the sorting is performed by measuring the emission wavelength of each optical semiconductor element, the optical semiconductor element after sorting usually needs to be attached to an adhesive sheet or the like for each layer.
  • the optical semiconductor device according to the present invention is an optical semiconductor device in which the adhesive for an optical semiconductor device according to the present invention is attached to the surface to be bonded to the element mounting portion after being cut out from the wafer and sorted. After being mounted on the inner element mounting portion, it is cured and bonded to the element mounting portion by the optical semiconductor device adhesive according to the present invention. Accordingly, in the step of pasting the sorted optical semiconductor element to the adhesive for optical semiconductor devices on the base sheet, the sorted optical semiconductor element is stuck to each layer, and the adhesive for optical semiconductor devices It is possible to simultaneously press and paste the.
  • the substrate sheet in the present invention is particularly suitable if the adhesive for optical semiconductor devices according to the present invention is disposed thereon and the adhesive for optical semiconductor devices according to the present invention can be peeled from the adhesive.
  • a base sheet for example, a PET separator in which a release agent is coated on a PET film can be used.
  • the optical semiconductor element cut out from the wafer and sorted is affixed to the divided adhesive for an optical semiconductor device arranged on the base sheet, picked up from the base sheet, and within the optical semiconductor device. It is mounted on the element mounting part.
  • the base material sheet is one from which the adhesive for optical semiconductor devices in the present invention can be peeled off, the adhesive for optical semiconductor devices is integrated with the picked-up optical semiconductor element from above the base material sheet. Peel off and pick up.
  • the element mounting portion in the optical semiconductor device according to the present invention is a portion on which the optical semiconductor element is mounted.
  • An adhesive for an optical semiconductor device is an adhesive for an optical semiconductor device used for curing and bonding the optical semiconductor element to an element mounting portion in the optical semiconductor device, and is formed into a film shape. It is arrange
  • the optical semiconductor element is mounted on the element mounting portion and cured and bonded via the adhesive for an optical semiconductor device according to the present invention (Die bonding process).
  • Die bonding process the adhesive for an optical semiconductor device according to the present invention
  • the adhesive for optical semiconductor devices according to the present invention is formed into a film shape. Therefore, it is easy to form on a base material sheet and to peel easily.
  • the optical semiconductor element can be attached with a film of an adhesive for an optical semiconductor device having a uniform shape, area and thickness, the quality of the optical semiconductor device after curing and bonding is kept constant. It is.
  • the adhesive molding process and the adhesive dividing process of the present invention the optical semiconductor device adhesion having an appropriate uniform shape, area, and film thickness according to the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion.
  • the agent can be formed on the base sheet.
  • the adhesive for optical semiconductor devices according to the present invention is formed into a film shape, and the thickness thereof is preferably in the range of 1 ⁇ m to 150 ⁇ m, particularly preferably 3 ⁇ m to 100 ⁇ m. If the thickness is 1 ⁇ m or more, it is preferable because sufficient adhesive strength can be obtained after curing. If the thickness is 150 ⁇ m or less, the optical semiconductor device to which the optical semiconductor element is cured and bonded can be prevented from becoming too thick. preferable.
  • the adhesive for optical semiconductor devices arrange
  • the adhesive agent for optical semiconductor devices concerning this invention is arrange
  • the adhesive for optical semiconductor devices according to the present invention can be peeled off from the base sheet. Therefore, the adhesive for optical semiconductor devices is peeled off from the substrate sheet and picked up together with the picked optical semiconductor element. Thereafter, in the die bonding step, the optical semiconductor element is mounted on the element mounting portion via the optical semiconductor device adhesive in the present invention and cured and bonded.
  • the adhesive sheet for an optical semiconductor device manufactured according to the present invention the optical semiconductor element can be cured and bonded without stamping a die bond agent to the element mounting portion, and fixed to the element mounting portion of the optical semiconductor device. The operations up to this can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.
  • the method for molding the adhesive for optical semiconductor devices is not particularly limited, and can be carried out by applying a curable silicone composition and heating and drying.
  • the adhesive sheet for optical semiconductor devices manufactured by this invention arranges the adhesive agent for optical semiconductor devices divided
  • FIG. 3 illustrates a top view of the adhesive sheet for optical semiconductor devices according to the present invention
  • FIG. 4 illustrates a side view.
  • the adhesive sheet 3 for optical semiconductor devices according to the present invention is obtained by arranging the adhesive 1 for optical semiconductor devices divided into a plurality of film-like shapes on the base sheet 2. is there.
  • the optical semiconductor elements cut out from the wafer and sorted are individually attached to the adhesive for optical semiconductor devices divided into a plurality of arbitrary shapes of the adhesive sheet for optical semiconductor devices (attaching step). Therefore, a plurality of optical semiconductor elements are bonded on one adhesive sheet for an optical semiconductor device. Further, at the time of picking up the optical semiconductor element, the adhesive for the optical semiconductor device is peeled off from the base sheet together with the optical semiconductor element and picked up (pickup process). Thereafter, in the step of mounting the optical semiconductor element on the element mounting part and curing and bonding, the optical semiconductor element is mounted on the element mounting part and cured and bonded via the adhesive for optical semiconductor devices in the present invention (die bonding). Process).
  • the optical semiconductor element can be cured and bonded without stamping the die bonding agent on the element mounting portion, and fixed to the element mounting portion of the optical semiconductor device.
  • the operations up to this can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.
  • the optical semiconductor element having a specific layer is the same adhesive for an optical semiconductor device. It can also be set as the usage form which affixes on a sheet
  • an adhesive sheet for an optical semiconductor device in which an optical semiconductor element for each layer is attached can be obtained.
  • the optical semiconductor device adhesive sheet to which the specific layer of the optical semiconductor element is bonded can be placed on the die bonder as it is, and the optical semiconductor elements having the specific layer can be collectively bonded to the element mounting portion.
  • Such usage is preferable from the viewpoint of productivity.
  • an optical semiconductor element cut out from a wafer and sorted is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device.
  • a method of manufacturing an optical semiconductor device adhesive sheet in which an optical semiconductor device adhesive used for curing and bonding is disposed, At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided.
  • the adhesive forming step according to the present invention is a step of forming a film-like adhesive for an optical semiconductor device on a substrate sheet so as to be peelable.
  • the optical semiconductor device adhesive molded in this step can be in a semi-cured state.
  • FIG. 1 illustrates a top view of a base material sheet and an adhesive for an optical semiconductor device before the adhesive dividing step
  • FIG. 2 illustrates a side view.
  • the optical semiconductor device adhesive sheet 3 ′ before the adhesive dividing step is obtained by forming the film-shaped optical semiconductor device adhesive 1 ′ on the base sheet 2 ′.
  • an adhesive for an optical semiconductor device having an area corresponding to a plurality of optical semiconductor elements can be formed.
  • the adhesive dividing step according to the present invention is a step of dividing the formed optical semiconductor device adhesive into an arbitrary shape.
  • the adhesive dividing step it is preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by laser light irradiation.
  • the adhesive for optical semiconductor devices can be easily divided by irradiation with laser light, and the side surfaces of the adhesive divided on the part irradiated with the laser light are separated,
  • the divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet.
  • the adhesive sheet for optical semiconductor devices by laser light irradiation, it becomes possible to further increase the throughput of manufacturing the adhesive sheet for optical semiconductor devices, and the optical semiconductor that is cured and bonded to the element mounting portion
  • Manufacture of an adhesive sheet for an optical semiconductor device capable of forming a divided adhesive for an optical semiconductor device having a more suitable and more uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the element Become a method. Any laser beam may be used as long as it can divide the adhesive for an optical semiconductor device, and a carbon dioxide laser, a YAG laser, a YVO 4 laser, or the like is applicable.
  • the adhesive for optical semiconductor devices can be easily divided by the cutter blade, and the side surfaces of the adhesive divided by the portion cut by the cutter blade are separated from each other,
  • the divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet.
  • a method for producing an adhesive sheet for an optical semiconductor device which can form a divided adhesive for an optical semiconductor device having a more suitable and more uniform shape, area, and film thickness according to the adhesive area on a base sheet, and Become.
  • Any cutter blade may be used as long as it can divide the adhesive for optical semiconductor devices, and a BIK blade (Thomson blade), a pinnacle blade, or the like can be applied.
  • FIG. 3 illustrates a top view of an adhesive sheet for an optical semiconductor device manufactured according to the present invention
  • FIG. 4 illustrates a side view.
  • the adhesive sheet 3 for an optical semiconductor device manufactured according to the present invention has an adhesive 1 for an optical semiconductor device 1 divided into a plurality of film-like arbitrary shapes arranged on the base sheet 2. It will be a thing. In particular, when divided by laser light irradiation and a cutter blade, the width of the adhesive for an optical semiconductor device can be narrowed, so that the sheet surface can be used more efficiently. Further, as the optical semiconductor element becomes smaller and the viscosity of the optical semiconductor device adhesive increases, another method, for example, screen printing or the like, has a uniform shape, area, and film thickness on the base sheet.
  • an adhesive for an optical semiconductor device is molded and then divided by laser light irradiation and a cutter blade, etc.
  • a uniform shape, area, and film thickness can be accurately obtained.
  • the adhesive for optical semiconductor devices which has can be formed on a base material sheet.
  • FIG. 5B shows a flowchart of a conventional method for manufacturing an optical semiconductor device.
  • an optical semiconductor element 13 ' such as an LED element is cut out from the wafer 12' by the dicer 11 '(step 1'). Since the cut out optical semiconductor element 13 ′ has a large variation in light quantity, emission wavelength, etc., the emission wavelength is measured, sorted (by layer) (step 2 ′), and the optical semiconductor element 13 ′ sorted in each layer is An affixing process (process 3 ′) to be affixed on the adhesive sheet 21 for each layer is performed.
  • a pick-up step (step 4-1 ′) for picking up the attached optical semiconductor element 13 ′ from the adhesive sheet 21 of the selected light emission wavelength layer is performed, and at the same time, an optical semiconductor device 14 ′ arranged separately.
  • the die bonding agent 22 is applied to the inner element mounting portion 15 ′ by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is mounted on the element mounting portion 15 ′ via the die bonding agent 22.
  • a die-bonding step (step 5 ′) is performed in which is cured and bonded.
  • the above optical semiconductor device manufacturing method has a problem that it takes time to stamp the die bond agent (step 4-2 ′). This problem is caused by using a liquid, paste-like die bond agent. It was a problem that could not be avoided. Therefore, there has been a demand for an optical semiconductor device adhesive that replaces a liquid, paste-like die bond agent and a method of manufacturing an optical semiconductor device using the same.
  • FIG. 5A shows a flowchart of a method for manufacturing an optical semiconductor device using the adhesive sheet for optical semiconductor devices.
  • an optical semiconductor element having a specific layer is attached to the same adhesive sheet for an optical semiconductor device, and an optical semiconductor element having a layer different from the specific layer is different from the optical semiconductor device. It can also be affixed to an adhesive sheet.
  • the adhesive sheet for optical semiconductor device to which the optical semiconductor element of the specific layer is bonded is directly installed on the die bonder, and the optical semiconductor elements having the specific layer are collectively bonded to the element mounting portion. This is preferable.
  • the optical semiconductor element 13 sorted into each layer is attached to the optical semiconductor device adhesive 1 divided into an arbitrary film-like shape disposed on the base sheet 2 for each layer (step 3). ) Is done.
  • this affixing process it is possible to simultaneously affix the sorted optical semiconductor element and affix the adhesive for the optical semiconductor device to the optical semiconductor element.
  • the film-like adhesive for an optical semiconductor device can be made into a semi-cured state before this attaching step.
  • the method to make a semi-hardened state is not specifically limited, Performing using a hot-air circulation type oven is illustrated. Although it does not specifically limit as temperature dried using a hot-air circulation type oven, 40 to 150 degreeC is preferable and 40 to 140 degreeC is more preferable. If the temperature is 40 ° C. or higher, it is possible to suppress an increase in the time required for curing, and if the temperature is less than 150 ° C., it is preferable because the curing speed is too high to completely cure.
  • time to dry using a hot-air circulation type oven 10 second or more and less than 2 hours are preferable, and 10 second or more and 1 hour and a half or less are more preferable. If the time is 10 seconds or more, the optical semiconductor element can be satisfactorily attached (crimped), and the optical semiconductor element and the film-like adhesive for an optical semiconductor device can be easily picked up together. Moreover, since it can suppress that it hardens
  • the pasted optical semiconductor element 13 is peeled from the base sheet 2 together with the adhesive 1 for an optical semiconductor device. Then, a pick-up step (step 4) for picking up is performed, whereby the optical semiconductor element 13 to which the film-like adhesive 1 for optical semiconductor devices is adhered is picked up.
  • a die bonding step (step 5) is performed in which the optical semiconductor element 13 is cured and bonded to the optical semiconductor device 14 by curing. Thereby, the work up to fixing the optical semiconductor element to the element mounting portion of the optical semiconductor device can be efficiently performed without stamping the die bond agent, and the light that can increase the productivity of manufacturing the optical semiconductor device.
  • a method for manufacturing a semiconductor device is provided.
  • Example 1 KER-3000-M4 (manufactured by Shin-Etsu Chemical Co., Ltd.), a curable silicone composition as an adhesive molding composition for optical semiconductor devices, PET separator, FL2-01, 38 ⁇ m (Takaline Corporation, as a base sheet) And a coating machine using blade separator (also referred to as knife coating), PET separator, FL1-01, 38 ⁇ m (manufactured by Takaline Corporation) as a cover sheet.
  • a CO 2 laser marker, ML-Z9550T manufactured by Keyence Corporation
  • a solution-form composition for forming an adhesive for an optical semiconductor device is uniformly coated on a base sheet, and the PET separator is continuously bonded together with an optical semiconductor device in a hot air circulation oven at 110 ° C.
  • a 30- ⁇ m thick semi-cured film-like adhesive for an optical semiconductor device was formed on the substrate sheet so as to be peelable.
  • a cover sheet was affixed to the surface of this film-like adhesive for optical semiconductor devices.
  • the cover sheet is peeled off, laser light is irradiated at a laser power of 70% and a scanning speed of 900 mm / s, and a semi-cured film-like adhesive for an optical semiconductor device formed on a base sheet is formed into an arbitrary shape. It divided
  • the adhesive sheet for optical semiconductor devices manufactured as described in Example 1 is obtained by arranging a plurality of divided adhesives for optical semiconductor devices. Moreover, the adhesive agent for optical semiconductor devices divided
  • Example 2 Moreover, as Example 2, it carried out similarly to Example 1 except having dried for 90 second in a 120 degreeC hot-air circulation oven at the time of the coating of the said adhesive agent formation process, and the adhesive sheet for optical semiconductor devices of this invention The adhesive sheet for optical semiconductor devices manufactured by this manufacturing method was obtained.
  • Example 3 Further, as Example 3, the adhesive sheet for optical semiconductor devices of the present invention was carried out in the same manner as in Example 1 except that it was dried in a hot air circulation oven at 100 ° C. for 240 seconds at the time of coating in the adhesive molding step. The adhesive sheet for optical semiconductor devices manufactured by this manufacturing method was obtained.
  • Example 4 Moreover, as Example 4, it carries out similarly to Example 1 until the time of the coating of the said adhesive agent formation process, and peels a cover sheet
  • Comparative Example 1 an adhesive sheet for an optical semiconductor device was produced by screen printing without performing the adhesive molding step and the adhesive dividing step.
  • KER-3000-M4 manufactured by Shin-Etsu Chemical Co., Ltd.
  • PET separator as a base sheet
  • PET # 38x-41-3035 38 ⁇ m (stock) (Takaline Corporation)
  • 10 screens with 10 1mm x 1mm square openings arranged as a screen plate a screen plate with a total of 100 openings regularly arranged at intervals of 0.5mm
  • screen printing machine A screen printer manufactured by Mino Group was used.
  • the adhesive for the optical semiconductor device is molded and dried to a semi-cured state in the adhesive molding step, and then the adhesive is divided.
  • Comparative Example 1 light is obtained by screen printing. After disposing the adhesive for a semiconductor device, it is dried to a semi-cured state. That is, in Examples 1 to 4, a semi-cured adhesive having a certain shape can be divided in accordance with the adhesion area of the optical semiconductor element, so that the adhesive for an optical semiconductor device having an appropriate uniform shape, area, and film thickness The adhesive can be formed on the base sheet, whereas in Comparative Example 1, the adhesive is in an uncured state with an unstable shape, and then cured, so the shape, area, and film thickness of the adhesive Tends to be uneven. Actually, when the adhesive sheet for optical semiconductor devices produced in Examples 1 to 4 and Comparative Example 1 was visually confirmed, the adhesive for optical semiconductor devices produced in Examples 1 to 4 rather than Comparative Example 1 was used. The adhesive sheet had a more uniform shape, area and film thickness.
  • Comparative Example 1 when the viscosity of the adhesive is high, the squeegee speed may have to be reduced, and the throughput is reduced. In particular, when the adhesive has a high viscosity and the optical semiconductor element is small, the throughput is significantly reduced, making it difficult to meet the demand for downsizing. Further, when the distance between the openings of the screen plate is too narrow, the throughput may be lowered due to the cause that the adhesives for optical semiconductor devices adjoin each other. On the other hand, according to Examples 1 to 4 of the present invention, as in Comparative Example 1, the influence of the decrease in throughput caused by the viscosity of the adhesive, the size of the optical semiconductor element, the interval between the openings of the screen plate, and the like. Therefore, it is possible to increase the throughput of the production of the adhesive sheet for optical semiconductor devices. Next, the adhesive strength of the adhesive sheet for optical semiconductor devices manufactured according to the present invention and the manufacturing efficiency compared with the case of using a conventional die bond agent were evaluated.
  • this film-like optical semiconductor element with an adhesive for optical semiconductor devices was pressure-bonded so as to adhere to a silver-plated copper plate (corresponding to the element mounting portion) via the adhesive for film-like optical semiconductor devices. Thereafter, it was heated and cured in a hot air circulating oven at 150 ° C. for 2 hours to be cured and adhered.
  • the shear bond strength after curing and bonding was 4.0 MPa.
  • the shear bond strength was measured using a strength tester (manufactured by Daisy).
  • the production efficiency was 1/5 when the time required when using a paste-like die bonding agent described later was defined as production efficiency 1.
  • stamping of the die bond agent is necessary.
  • the manufacturing time (manufacturing efficiency 1) was five times longer than the manufacturing time of the optical semiconductor device using the adhesive.
  • stamping of the die bond agent can be omitted, and a paste-like die bond.
  • the production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device can be made high-throughput, and the element mounting portion is cured.
  • Manufacture of an adhesive sheet for an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate and uniform shape, area and film thickness on the base sheet in accordance with the adhesive area of the optical semiconductor element to be bonded A method can be provided.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits the same function and effect. Are included in the technical scope.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
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Abstract

The present invention relates to a method for manufacturing an adhesive sheet for an optical semiconductor device, the adhesive sheet having an adhesive for the optical semiconductor device, the adhesive sheet being used to bond an optical semiconductor element to an element mounting portion of the optical semiconductor device by a hardening adhesion method after the optical semiconductor element is cut from a wafer, picked up from a base sheet, and disposed on the element mounting portion. The method of the present invention is characterized by comprising: at least an adhesive forming process in which the film-shaped adhesive for the optical semiconductor device is formed on the base sheet in a separable manner; and an adhesive division process in which the formed adhesive for the optical semiconductor device is divided in a predetermined shape. According to the present invention, manufacturing throughput of the adhesive sheet for the optical semiconductor device can be increased, and the adhesive for the optical semiconductor device having an adequate uniformity, area, and film thickness can be formed on the base sheet.

Description

光半導体装置用接着剤シートの製造方法及び光半導体装置用接着剤シートManufacturing method of adhesive sheet for optical semiconductor device and adhesive sheet for optical semiconductor device
　本発明は、半導体装置用接着剤シートの製造方法に関し、特に光半導体装置用接着剤シートの製造方法に関するものである。
　 The present invention relates to a method for producing an adhesive sheet for a semiconductor device, and particularly relates to a method for producing an adhesive sheet for an optical semiconductor device.
　光半導体装置の製造においては、光半導体素子を素子取付部に接着するための液状、ペースト状の硬化性接着剤（ダイボンド剤ともいう）と、光半導体素子を上から封止等する硬化性接着剤とが用いられてきた。青色ＬＥＤ（ライトエミッションダイオード）素子や、青色波長以下の発光波長を有するＬＥＤ素子からの発光により波長変換を行うことで白色光を発するＬＥＤ素子を有する光半導体装置の製造においては、光半導体素子を上から封止等する硬化性接着剤として液状、ペースト状のシリコーン系接着剤が用いられてきた。 In the production of an optical semiconductor device, a liquid, paste-like curable adhesive (also referred to as a die bond agent) for bonding an optical semiconductor element to an element mounting portion, and a curable adhesive for sealing the optical semiconductor element from above. Agents have been used. In manufacturing an optical semiconductor device having a blue LED (light emission diode) element or an LED element that emits white light by performing wavelength conversion by light emission from an LED element having an emission wavelength equal to or less than a blue wavelength, an optical semiconductor element is used. Liquid and paste-like silicone adhesives have been used as curable adhesives for sealing from above.
　また、ダイボンド剤にも液状、ペースト状のシリコーン系のものが用いられており、シリコーン系ダイボンド剤は一般に内部応力が小さく、接着性に優れ、しかも光透過性に優れている（特許文献１、特許文献２）。具体的には、特許文献１ではエポキシ・シリコーン混成樹脂組成物をポッティングし、１８０℃で１時間硬化することで発光半導体装置を作製しており、また、特許文献２ではエポキシ・シリコーン混成樹脂組成物を底部に発光素子を配置させたカップ、キャビティ、パッケージ凹部等にディスペンサーその他の方法にて注入して加熱等により硬化させることで接着、封止している。 In addition, liquid and pasty silicone materials are also used as the die bond agent, and the silicone die bond agent generally has low internal stress, excellent adhesiveness, and excellent light transmittance (Patent Document 1, Patent Document 2). Specifically, in Patent Document 1, a light emitting semiconductor device is produced by potting an epoxy / silicone hybrid resin composition and curing at 180 ° C. for 1 hour. In Patent Document 2, an epoxy / silicone hybrid resin composition is prepared. The object is bonded and sealed by injecting it into a cup, cavity, package recess or the like in which a light emitting element is arranged at the bottom by a dispenser or other method and curing it by heating or the like.
　このような、液状、ペースト状のシリコーン系ダイボンド剤の塗布方法としては、一般的にはスタンピングにより塗布する方法が用いられている。以下、ダイボンド剤をスタンピングすることにより光半導体装置を製造する方法について図５（Ｂ）を用いて説明する。まず、ＬＥＤ素子等の光半導体素子１３’は１枚のウエーハ１２’からダイサー１１’により大量に切り出され（工程１’）、採取されるが、発光波長のばらつきが大きいため光半導体素子１３’の１つ１つの発光波長を測定し、発光波長ごとに層別するソーティングという作業が行われる（工程２’）。次に、各層にソーティングされた光半導体素子１３’は層ごとに１枚の粘着テープ２１にまとめて貼り付けられる（工程３’）。その後、選択した発光波長層を有する光半導体素子１３’が貼り付けられた粘着テープ２１から光半導体素子１３’を１個ずつ取り出すピックアップという作業を行う（工程４－１’）と同時に、別に配置された光半導体装置１４’内の素子取付部１５’に液状、ペースト状のダイボンド剤２２をスタンピングにより塗布し（工程４－２’）、ピックアップした光半導体素子１３’を素子取付部１５’に置くという作業が行われ、加熱などによりダイボンド剤２２が硬化され、光半導体素子１３’と光半導体装置１４’内の素子取付部１５’が硬化接着させられる（工程５’）。 As a method of applying such a liquid, paste-like silicone die bond agent, a method of applying by stamping is generally used. Hereinafter, a method for manufacturing an optical semiconductor device by stamping a die bond agent will be described with reference to FIG. First, an optical semiconductor element 13 ′ such as an LED element is cut out in large quantities from one wafer 12 ′ by a dicer 11 ′ (Step 1 ′) and collected, but the optical semiconductor element 13 ′ has a large variation in emission wavelength. Each of the emission wavelengths is measured, and an operation called sorting is performed (step 2 ′). Next, the optical semiconductor elements 13 ′ sorted into the respective layers are bonded together on one adhesive tape 21 for each layer (Step 3 ′). Thereafter, an operation of picking up the optical semiconductor elements 13 ′ one by one from the adhesive tape 21 to which the optical semiconductor elements 13 ′ having the selected emission wavelength layer are attached is performed (step 4-1 ′) and arranged separately. A liquid, paste-like die bonding agent 22 is applied to the element mounting portion 15 ′ in the optical semiconductor device 14 ′ thus prepared by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is applied to the element mounting portion 15 ′. The die bonding agent 22 is cured by heating or the like, and the optical semiconductor element 13 ′ and the element mounting portion 15 ′ in the optical semiconductor device 14 ′ are cured and bonded (step 5 ′).
　しかし、上記光半導体装置の製造方法では、光半導体装置の素子取付部の一つ一つにダイボンド剤をスタンピングする必要があるため、時間がかかるという問題があった。この問題は液状、ペースト状のダイボンド剤を塗布等して使用する以上回避できない問題となっていた。
　 However, the above method for manufacturing an optical semiconductor device has a problem that it takes time because it is necessary to stamp a die bond agent on each of the element mounting portions of the optical semiconductor device. This problem has been a problem that cannot be avoided as long as a liquid or paste die bond agent is applied and used.
特許第４４７９８８３号公報Japanese Patent No. 4479883 特開平２００４－２６６１３４号公報Japanese Patent Laid-Open No. 2004-266134
　その為、高効率生産性、生産コストダウンの観点から液状、ペースト状のダイボンド剤に代わる光半導体装置用接着剤及びそれを用いた光半導体装置の製造方法が望まれていた。そのような光半導体装置用接着剤の使用形態として、これを基材シート上に配置した光半導体装置用接着剤シートが考えられる。これにより光半導体装置を効率よく製造でき、特にライトエミッションダイオード（以下ＬＥＤという）、レーザーダイオード（以下ＬＤという）をはじめとした光半導体素子（ダイ、ダイスまたはチップともいう）を光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができると考えられる。しかしながら、他方で光半導体装置用接着剤シート自体の製造のハイスループット化、又は、素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することが困難であれば、光半導体装置の製造の生産性向上も困難となる。 Therefore, from the viewpoint of high efficiency productivity and reduction in production cost, there has been a demand for an optical semiconductor device adhesive that replaces the liquid and paste die-bonding agent and a method for manufacturing the optical semiconductor device using the same. As an application form of such an adhesive for optical semiconductor devices, an adhesive sheet for optical semiconductor devices in which this is disposed on a base sheet can be considered. As a result, an optical semiconductor device can be efficiently manufactured. In particular, an optical semiconductor device (also referred to as a die, a die, or a chip) such as a light emission diode (hereinafter referred to as an LED) or a laser diode (hereinafter referred to as an LD) is used as an element of the optical semiconductor device. It is considered that the work up to fixing to the mounting portion can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be improved. However, on the other hand, it has an appropriate uniform shape, area, and film thickness according to the high throughput of the production of the adhesive sheet for an optical semiconductor device itself, or the adhesion area of the optical semiconductor element to be cured and bonded to the element mounting portion. If it is difficult to form the adhesive for optical semiconductor devices on the base sheet, it will also be difficult to improve the productivity of manufacturing the optical semiconductor device.
　本発明は、上記問題を解決するためになされたものであり、光半導体装置の製造の生産性を高めることができる光半導体装置用接着剤シートの製造をハイスループット化することができ、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法を提供することを目的とする。 The present invention has been made in order to solve the above-described problem, and can produce a high-throughput production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device, and For an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate, uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the optical semiconductor element to be cured and bonded to the element mounting portion. It aims at providing the manufacturing method of an adhesive agent sheet.
　上記課題を解決するため、本発明では、ウエーハから切り出されソーティングされた光半導体素子を基材シート上からピックアップし、前記光半導体素子を光半導体装置内の素子取付部に搭載した後、前記光半導体素子を前記素子取付部に硬化接着するために用いる光半導体装置用接着剤が配置された光半導体装置用接着剤シートを製造する方法であって、
　少なくとも、前記基材シート上にフィルム状の前記光半導体装置用接着剤を剥離可能に成形する接着剤成形工程、及び前記成形された光半導体装置用接着剤を任意の形状に分割する接着剤分割工程を有することを特徴とする光半導体装置用接着剤シートの製造方法を提供する。 In order to solve the above problems, in the present invention, an optical semiconductor element cut out and sorted from a wafer is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device, and then the optical semiconductor element is mounted. A method for producing an adhesive sheet for an optical semiconductor device in which an adhesive for an optical semiconductor device used for curing and bonding a semiconductor element to the element mounting portion is disposed,
At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided.
　このように、基材シート上に一様に成形した光半導体装置用接着剤を硬化接着される光半導体素子の接着面積に合わせて任意の形状に分割することで、光半導体装置の製造の生産性を高めることができる光半導体装置用接着剤シートの製造をハイスループット化することができ、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる。 In this way, production of an optical semiconductor device is produced by dividing the adhesive for an optical semiconductor device uniformly formed on a base sheet into an arbitrary shape according to the bonding area of the optical semiconductor element to be cured and bonded. The production of the adhesive sheet for optical semiconductor devices capable of enhancing the properties can be made high-throughput, and suitable and uniform shape and area according to the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion The adhesive for optical semiconductor devices having a film thickness can be formed on the substrate sheet.
　また、前記接着剤分割工程において、レーザー光の照射により、成形された光半導体装置用接着剤を任意の形状に分割することが好ましい。 In the adhesive dividing step, it is preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by irradiation with laser light.
　このように、光半導体装置用接着剤はレーザー光の照射により容易に分割することができ、レーザー光の照射した部分を境に分割された接着剤同士の側面が離れている状態となるため、分割された個々の光半導体装置用接着剤は容易に基材シート上から剥離できるものとなる。このように、レーザー光の照射による光半導体装置用接着剤の分割で、光半導体装置用接着剤シートの製造の更なるハイスループット化が可能となり、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせてより適当でより均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法となる。ここで言うレーザー光は光半導体装置用接着剤を分割することができればどのようなものでも良く、炭酸ガスレーザー、ＹＡＧレーザー、ＹＶＯ４レーザーなどが適用できる。 In this way, the adhesive for optical semiconductor devices can be easily divided by irradiation with laser light, and the side surfaces of the adhesive divided on the part irradiated with the laser light are separated, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. In this way, by dividing the adhesive for optical semiconductor devices by laser light irradiation, it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor that is cured and bonded to the element mounting portion. An optical semiconductor device adhesive sheet manufacturing method capable of forming an optical semiconductor device adhesive having a more appropriate and more uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the element. . Any laser beam may be used as long as it can divide the adhesive for an optical semiconductor device, and a carbon dioxide laser, a YAG laser, a YVO 4 laser, or the like is applicable.
　さらに、前記接着剤分割工程において、カッター刃により、成形された光半導体装置用接着剤を任意の形状に分割することも好ましい。 Furthermore, in the adhesive dividing step, it is also preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by a cutter blade.
　このように、光半導体装置用接着剤はカッター刃により容易に分割することができ、カッター刃による切断を行った部分を境に分割された接着剤同士の側面が離れている状態となるため、分割された個々の光半導体装置用接着剤は容易に基材シート上から剥離できるものとなる。このように、カッター刃による光半導体装置用接着剤の分割で、光半導体装置用接着剤シートの製造の更なるハイスループット化が可能となり、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせてより適当でより均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法となる。ここで言うカッター刃は光半導体装置用接着剤を分割することができればどのようなものでも良く、ビク刃（トムソン刃）、ピナクル刃などが適用できる。 In this way, the adhesive for optical semiconductor devices can be easily divided by the cutter blade, and the side surfaces of the adhesive divided by the portion cut by the cutter blade are separated from each other, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. Thus, by dividing the adhesive for optical semiconductor devices by the cutter blade, it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor element to be cured and bonded to the element mounting portion. It becomes the manufacturing method of the adhesive sheet for optical semiconductor devices which can form the adhesive agent for optical semiconductor devices which has a more suitable and more uniform shape, area, and film thickness according to the adhesion area on a base material sheet. Any cutter blade may be used as long as it can divide the adhesive for optical semiconductor devices, and a BIK blade (Thomson blade), a pinnacle blade, or the like can be applied.
　また、本発明では、前記光半導体装置用接着剤シートの製造方法により製造され、前記任意の形状に分割された光半導体装置用接着剤を有する光半導体装置用接着剤シートを提供する。 Also, the present invention provides an adhesive sheet for an optical semiconductor device, which is manufactured by the method for manufacturing an adhesive sheet for an optical semiconductor device and has the adhesive for an optical semiconductor device divided into the arbitrary shape.
　このような光半導体装置用接着剤シートであれば、基材シート上に複数個の任意の形状に分割された光半導体装置用接着剤が配置したものであるため、一枚の光半導体装置用接着剤シート上に複数の光半導体素子が貼り付けられることができる。さらに、ピックアップ時に光半導体素子と光半導体装置用接着剤は共に一体となって剥離しピックアップされ、そのまま素子取付部に搭載され、光半導体装置用接着剤を介して硬化接着されることができるものとなる。そのため、素子取付部へのダイボンド剤のスタンピングが不要となり、光半導体装置を効率よく製造でき、特に、光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができる光半導体装置用接着剤シートとなる。 In such an adhesive sheet for optical semiconductor devices, since the adhesive for optical semiconductor devices divided into a plurality of arbitrary shapes is arranged on the base sheet, it is for one optical semiconductor device. A plurality of optical semiconductor elements can be attached on the adhesive sheet. In addition, the optical semiconductor element and the optical semiconductor device adhesive are both peeled off and picked up at the time of pickup, and can be directly mounted on the element mounting portion and cured and bonded via the optical semiconductor device adhesive. It becomes. Therefore, stamping of the die bond agent to the element mounting portion is not required, and the optical semiconductor device can be efficiently manufactured. In particular, for an optical semiconductor device that can efficiently perform the work until it is fixed to the element mounting portion of the optical semiconductor device. It becomes an adhesive sheet.
　以上説明したように、本発明によれば、光半導体装置の製造の生産性を高めることができる光半導体装置用接着剤シートの製造をハイスループット化することができ、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法を提供することができる。
　 As described above, according to the present invention, the production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device can be made high-throughput, and the element mounting portion is cured. Manufacture of an adhesive sheet for an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate and uniform shape, area and film thickness on the base sheet in accordance with the adhesive area of the optical semiconductor element to be bonded A method can be provided.
本発明にかかる接着剤分割工程前の基材シートと光半導体装置用接着剤を示す上面図である。It is a top view which shows the base material sheet before the adhesive agent division | segmentation process concerning this invention, and the adhesive agent for optical semiconductor devices. 本発明にかかる接着剤分割工程前の基材シートと光半導体装置用接着剤を示す側面図である。It is a side view which shows the base material sheet and the adhesive agent for optical semiconductor devices before the adhesive agent division | segmentation process concerning this invention. 本発明により製造された光半導体装置用接着剤シートの上面図である。It is a top view of the adhesive agent sheet for optical semiconductor devices manufactured by this invention. 本発明により製造された光半導体装置用接着剤シートの側面図である。It is a side view of the adhesive agent sheet for optical semiconductor devices manufactured by this invention. （Ａ）本発明により製造された光半導体装置用接着剤シートを用いた光半導体装置の製造フローと、（Ｂ）従来の光半導体装置の製造フローを並べて示した図である。(A) It is the figure which arranged and showed the manufacturing flow of the optical semiconductor device using the adhesive agent sheet for optical semiconductor devices manufactured by this invention, and the manufacturing flow of the (B) conventional optical semiconductor device.
　以下、本発明の光半導体装置用接着剤シートの製造方法について詳細に説明するが、本発明はこれらに限定されるものではない。
　前述のように、光半導体装置の製造の生産性を高めることができる光半導体装置用接着剤シート自体の製造のハイスループット化、及び素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法が必要とされていた。 Hereinafter, although the manufacturing method of the adhesive agent sheet for optical semiconductor devices of this invention is demonstrated in detail, this invention is not limited to these.
As described above, it is possible to increase the manufacturing throughput of the optical semiconductor device adhesive sheet itself that can increase the productivity of the optical semiconductor device manufacturing, and to match the bonding area of the optical semiconductor element that is cured and bonded to the element mounting portion. Therefore, there is a need for a method for producing an adhesive sheet for optical semiconductor devices, which can form an adhesive for optical semiconductor devices having an appropriate and uniform shape, area and film thickness on a base sheet.
　本発明者らは、まず、ＬＥＤ装置をはじめとした光半導体素子を有する光半導体装置の高効率な製造方法について検討を重ねた結果、基材シート上に任意の形状に分割された光半導体装置用接着剤を剥離可能な状態で有する光半導体装置用接着剤シートを用いれば、光半導体素子を光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、ダイボンド剤を素子取付部にスタンピングする時間を削減することができることを見出した。 First, as a result of studying a highly efficient manufacturing method of an optical semiconductor device having an optical semiconductor element such as an LED device, the present inventors have obtained an optical semiconductor device divided into an arbitrary shape on a base sheet. If the adhesive sheet for an optical semiconductor device having the adhesive for use in a peelable state is used, the operation until the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device can be efficiently performed. It has been found that the time for stamping on the mounting portion can be reduced.
　さらに、本発明者らは、この光半導体装置用接着剤シート自体の製造のハイスループット化、及び素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができれば、光半導体装置の製造を更に効率化できることに想到し、この課題を達成するため鋭意検討を重ねた。その結果、基材シート上に一様に成形した光半導体装置用接着剤を硬化接着される光半導体素子の接着面積に合わせて任意の形状に分割することを見出して、本発明を完成させた。 Furthermore, the present inventors have increased the throughput of the production of the adhesive sheet for an optical semiconductor device itself, and an appropriate and uniform shape, area in accordance with the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion, If an adhesive for an optical semiconductor device having a film thickness can be formed on a base sheet, the inventors have conceived that the production of the optical semiconductor device can be made more efficient, and earnestly studied in order to achieve this problem. As a result, the present invention was completed by finding that the adhesive for an optical semiconductor device uniformly formed on the base sheet was divided into arbitrary shapes according to the adhesive area of the optical semiconductor element to be cured and bonded. .
　すなわち、本発明では、ウエーハから切り出されソーティングされた光半導体素子を基材シート上からピックアップし、前記光半導体素子を光半導体装置内の素子取付部に搭載した後、前記光半導体素子を前記素子取付部に硬化接着するために用いる光半導体装置用接着剤が配置された光半導体装置用接着剤シートを製造する方法であって、
　少なくとも、前記基材シート上にフィルム状の前記光半導体装置用接着剤を剥離可能に成形する接着剤成形工程、及び前記成形された光半導体装置用接着剤を任意の形状に分割する接着剤分割工程を有することを特徴とする光半導体装置用接着剤シートの製造方法を提供する。以下本発明について詳細に説明する。 That is, in the present invention, an optical semiconductor element cut out from a wafer and sorted is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device, and then the optical semiconductor element is inserted into the element. A method for producing an adhesive sheet for an optical semiconductor device in which an adhesive for an optical semiconductor device used for curing and bonding to an attachment portion is disposed,
At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided. The present invention will be described in detail below.
［光半導体素子］
　本発明における光半導体素子は、ウエーハから切り出されソーティングされた光半導体素子であり、一般的に光半導体素子として扱われているものであれば特に制限されず、ＬＥＤ、ＬＤを例示することができる。このような光半導体素子は、特有の問題として、一般に光量や発光波長等のばらつきが大きい。そのため、光半導体装置に固着される前に発光波長等ごとに層別するソーティング作業が行われる。ソーティングは一つ一つの光半導体素子の発光波長を測定して行うため、ソーティングされた後の光半導体素子は、通常、粘着シートなどに層ごとに貼り付けておく必要がある。その点、本発明にかかる光半導体素子は、ウエーハから切り出されソーティングされた後、素子取付部に接着される面に本発明における光半導体装置用接着剤が貼り付けられるものであり、光半導体装置内の素子取付部に搭載された後、本発明における光半導体装置用接着剤により前記素子取付部に硬化接着されるものである。従って、ソーティングされた光半導体素子が基材シート上の光半導体装置用接着剤に貼り付けられる工程において、ソーティングされた光半導体素子を層ごとに貼り付けておくことと、光半導体装置用接着剤を圧着し貼り付けることが同時に達せられることとなる。 [Optical semiconductor device]
The optical semiconductor element in the present invention is an optical semiconductor element cut out from a wafer and sorted, and is not particularly limited as long as it is generally handled as an optical semiconductor element, and examples thereof include LEDs and LDs. . Such optical semiconductor elements generally have large variations in light quantity, emission wavelength, etc., as a particular problem. For this reason, a sorting operation is performed in which the layers are classified for each emission wavelength and the like before being fixed to the optical semiconductor device. Since the sorting is performed by measuring the emission wavelength of each optical semiconductor element, the optical semiconductor element after sorting usually needs to be attached to an adhesive sheet or the like for each layer. In that respect, the optical semiconductor device according to the present invention is an optical semiconductor device in which the adhesive for an optical semiconductor device according to the present invention is attached to the surface to be bonded to the element mounting portion after being cut out from the wafer and sorted. After being mounted on the inner element mounting portion, it is cured and bonded to the element mounting portion by the optical semiconductor device adhesive according to the present invention. Accordingly, in the step of pasting the sorted optical semiconductor element to the adhesive for optical semiconductor devices on the base sheet, the sorted optical semiconductor element is stuck to each layer, and the adhesive for optical semiconductor devices It is possible to simultaneously press and paste the.
［基材シート］
　本発明における基材シートは、その上に本発明における光半導体装置用接着剤が配置されるものであり、かつ本発明にかかる光半導体装置用接着剤がその上から剥離できるものであれば特に制限はされない。このような基材シートとしては、例えばＰＥＴフィルム上に離型剤がコートされたＰＥＴセパレーターを使用することができる。前記ウエーハから切り出されソーティングされた光半導体素子は、前記基材シート上に配置された分割された光半導体装置用接着剤に貼り付けられ、前記基材シート上からピックアップされ、光半導体装置内の素子取付部に搭載される。この際に、前記基材シートは、本発明における光半導体装置用接着剤が剥離できるものであるため、光半導体装置用接着剤はピックアップされた光半導体素子と共に一体となって基材シート上から剥離してピックアップされる。 [Base material sheet]
The substrate sheet in the present invention is particularly suitable if the adhesive for optical semiconductor devices according to the present invention is disposed thereon and the adhesive for optical semiconductor devices according to the present invention can be peeled from the adhesive. There are no restrictions. As such a base sheet, for example, a PET separator in which a release agent is coated on a PET film can be used. The optical semiconductor element cut out from the wafer and sorted is affixed to the divided adhesive for an optical semiconductor device arranged on the base sheet, picked up from the base sheet, and within the optical semiconductor device. It is mounted on the element mounting part. At this time, since the base material sheet is one from which the adhesive for optical semiconductor devices in the present invention can be peeled off, the adhesive for optical semiconductor devices is integrated with the picked-up optical semiconductor element from above the base material sheet. Peel off and pick up.
［光半導体装置内の素子取付部］
　本発明における光半導体装置内の素子取付部は、前記光半導体素子が搭載される部分である。 [Element mounting part in optical semiconductor device]
The element mounting portion in the optical semiconductor device according to the present invention is a portion on which the optical semiconductor element is mounted.
［光半導体装置用接着剤］
　本発明にかかる光半導体装置用接着剤は、前記光半導体素子を前記光半導体装置内の素子取付部に硬化接着するために用いる光半導体装置用接着剤であって、フィルム状に成形されており、前記基材シート上に配置されており、前記基材シートから剥離できるものである。そのため、まず、前記ウエーハから切り出されソーティングされた光半導体素子は、前記基材シート上に配置されフィルム状に成形された光半導体装置用接着剤に貼り付けられる（貼り付け工程）。さらに、光半導体装置用接着剤はピックアップされた光半導体素子と共に一体となって基材シート上から剥離してピックアップされる（ピックアップ工程）。その後、光半導体素子が素子取付部に搭載され、硬化接着される工程において、本発明にかかる光半導体装置用接着剤を介して前記光半導体素子が素子取付部に搭載され、硬化接着される（ダイボンド工程）。これにより、光半導体装置用接着剤を有する光半導体装置用接着剤シートによれば、前記素子取付部にダイボンド剤をスタンピングせずに前記光半導体素子を硬化接着でき、光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができる。 [Adhesive for optical semiconductor devices]
An adhesive for an optical semiconductor device according to the present invention is an adhesive for an optical semiconductor device used for curing and bonding the optical semiconductor element to an element mounting portion in the optical semiconductor device, and is formed into a film shape. It is arrange | positioned on the said base material sheet, and can peel from the said base material sheet. Therefore, first, the optical semiconductor element cut out from the wafer and sorted is attached to an adhesive for an optical semiconductor device that is disposed on the base sheet and formed into a film (attaching step). Furthermore, the adhesive for optical semiconductor devices is peeled off from the substrate sheet and picked up together with the optical semiconductor element picked up (pickup process). Thereafter, in the step of mounting the optical semiconductor element on the element mounting portion and curing and bonding, the optical semiconductor element is mounted on the element mounting portion and cured and bonded via the adhesive for an optical semiconductor device according to the present invention ( Die bonding process). Thereby, according to the adhesive sheet for optical semiconductor devices having the adhesive for optical semiconductor devices, the optical semiconductor element can be cured and bonded without stamping the die bonding agent to the element mounting portion, and the element mounting portion of the optical semiconductor device It is possible to efficiently perform the work up to fixing to the optical semiconductor device, and to increase the productivity of manufacturing the optical semiconductor device.
・フィルム状の光半導体装置用接着剤
　本発明にかかる光半導体装置用接着剤は、フィルム状に成形されているものである。そのため、基材シート上に成形しやすく、また剥離しやすい。その上、前記光半導体素子には均一な形状、面積及び厚みの光半導体装置用接着剤のフィルムが貼り付けられることができるため、硬化接着後の光半導体装置の品質は一定のものに保たれる。本発明の接着剤成形工程と接着剤分割工程によれば、素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することが出来る。 -Film-like adhesive for optical semiconductor devices The adhesive for optical semiconductor devices according to the present invention is formed into a film shape. Therefore, it is easy to form on a base material sheet and to peel easily. In addition, since the optical semiconductor element can be attached with a film of an adhesive for an optical semiconductor device having a uniform shape, area and thickness, the quality of the optical semiconductor device after curing and bonding is kept constant. It is. According to the adhesive molding process and the adhesive dividing process of the present invention, the optical semiconductor device adhesion having an appropriate uniform shape, area, and film thickness according to the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion. The agent can be formed on the base sheet.
　また、本発明にかかる光半導体装置用接着剤は、フィルム状に成形されており、その厚さは１μｍ以上１５０μｍ以下の範囲が好ましく、特に３μｍ以上１００μｍ以下であることが好ましい。厚さが１μｍ以上であれば、硬化後に充分な接着強度を得ることができるため好ましく、１５０μｍ以下であれば、光半導体素子が硬化接着された光半導体装置が厚くなりすぎること等を回避できるため好ましい。 The adhesive for optical semiconductor devices according to the present invention is formed into a film shape, and the thickness thereof is preferably in the range of 1 μm to 150 μm, particularly preferably 3 μm to 100 μm. If the thickness is 1 μm or more, it is preferable because sufficient adhesive strength can be obtained after curing. If the thickness is 150 μm or less, the optical semiconductor device to which the optical semiconductor element is cured and bonded can be prevented from becoming too thick. preferable.
・前記基材シート上に配置された光半導体装置用接着剤
　本発明にかかる光半導体装置用接着剤は、前記基材シート上に配置されているものである。そのため、ウエーハから切り出された後、光量や発光波長等に応じてソーティングされた光半導体素子は、層ごとに基材シート上に配置された光半導体装置用接着剤に個々貼り付けられることができる。 -The adhesive for optical semiconductor devices arrange | positioned on the said base material sheet The adhesive agent for optical semiconductor devices concerning this invention is arrange | positioned on the said base material sheet. Therefore, after being cut out from the wafer, the optical semiconductor elements sorted according to the light amount, emission wavelength, etc. can be individually attached to the adhesive for optical semiconductor devices arranged on the base sheet for each layer. .
・前記基材シートから剥離できる光半導体装置用接着剤
　本発明にかかる光半導体装置用接着剤は、前記基材シートから剥離できるものである。そのため、光半導体装置用接着剤はピックアップされた光半導体素子と共に一体となって基材シート上から剥離してピックアップされる。その後、ダイボンド工程において、本発明における光半導体装置用接着剤を介して前記光半導体素子が素子取付部に搭載され、硬化接着される。以上により、本発明により製造された光半導体装置用接着剤シートによれば、前記素子取付部にダイボンド剤をスタンピングせずに前記光半導体素子を硬化接着でき、光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができる。 -Adhesive for optical semiconductor devices that can be peeled off from the base sheet The adhesive for optical semiconductor devices according to the present invention can be peeled off from the base sheet. Therefore, the adhesive for optical semiconductor devices is peeled off from the substrate sheet and picked up together with the picked optical semiconductor element. Thereafter, in the die bonding step, the optical semiconductor element is mounted on the element mounting portion via the optical semiconductor device adhesive in the present invention and cured and bonded. As described above, according to the adhesive sheet for an optical semiconductor device manufactured according to the present invention, the optical semiconductor element can be cured and bonded without stamping a die bond agent to the element mounting portion, and fixed to the element mounting portion of the optical semiconductor device. The operations up to this can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.
　光半導体装置用接着剤の成型方法としては、特に限定されないが硬化性シリコーン組成物を塗工、加熱乾燥することにより行うことができる。 The method for molding the adhesive for optical semiconductor devices is not particularly limited, and can be carried out by applying a curable silicone composition and heating and drying.
［光半導体装置用接着剤シート］
　本発明により製造される光半導体装置用接着剤シートは、前記基材シート上に、複数個の前記任意の形状に分割された光半導体装置用接着剤を配置したものとなる。図３に、本発明にかかる光半導体装置用接着剤シートの上面図を例示し、図４に側面図を例示する。このように、本発明にかかる光半導体装置用接着剤シート３は基材シート２上に、複数個のフィルム状の前記任意の形状に分割された光半導体装置用接着剤１を配置したものである。 [Adhesive sheet for optical semiconductor devices]
The adhesive sheet for optical semiconductor devices manufactured by this invention arranges the adhesive agent for optical semiconductor devices divided | segmented into the said some arbitrary shape on the said base material sheet. FIG. 3 illustrates a top view of the adhesive sheet for optical semiconductor devices according to the present invention, and FIG. 4 illustrates a side view. As described above, the adhesive sheet 3 for optical semiconductor devices according to the present invention is obtained by arranging the adhesive 1 for optical semiconductor devices divided into a plurality of film-like shapes on the base sheet 2. is there.
　ウエーハから切り出されソーティングされた前記光半導体素子は、光半導体装置用接着剤シートの複数個の任意の形状に分割された光半導体装置用接着剤に個々貼り付けられる（貼り付け工程）。よって、一枚の光半導体装置用接着剤シート上に複数の光半導体素子が貼り付けられることとなる。さらに、光半導体素子のピックアップ時において、光半導体装置用接着剤は光半導体素子と共に一体となって基材シート上から剥離してピックアップされる（ピックアップ工程）。その後、光半導体素子が素子取付部に搭載され、硬化接着される工程において、本発明における光半導体装置用接着剤を介して前記光半導体素子が素子取付部に搭載され、硬化接着される（ダイボンド工程）。これにより、本発明により製造される光半導体装置用接着剤シートによれば、前記素子取付部にダイボンド剤をスタンピングせずに前記光半導体素子を硬化接着でき、光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができる。 The optical semiconductor elements cut out from the wafer and sorted are individually attached to the adhesive for optical semiconductor devices divided into a plurality of arbitrary shapes of the adhesive sheet for optical semiconductor devices (attaching step). Therefore, a plurality of optical semiconductor elements are bonded on one adhesive sheet for an optical semiconductor device. Further, at the time of picking up the optical semiconductor element, the adhesive for the optical semiconductor device is peeled off from the base sheet together with the optical semiconductor element and picked up (pickup process). Thereafter, in the step of mounting the optical semiconductor element on the element mounting part and curing and bonding, the optical semiconductor element is mounted on the element mounting part and cured and bonded via the adhesive for optical semiconductor devices in the present invention (die bonding). Process). Thereby, according to the adhesive sheet for optical semiconductor devices manufactured according to the present invention, the optical semiconductor element can be cured and bonded without stamping the die bonding agent on the element mounting portion, and fixed to the element mounting portion of the optical semiconductor device. The operations up to this can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.
　また、この際、ウエーハから切り出された後、光半導体素子を光量や発光波長等に応じてソーティング（層別）したときに、特定の層を有する光半導体素子を同一の光半導体装置用接着剤シートに貼り付け、特定の層と異なる層を有する光半導体素子を異なる光半導体装置用接着剤シートに貼り付ける使用形態とすることもできる。結果、層ごとの光半導体素子が貼り付けられた光半導体装置用接着剤シートができる。これにより、特定の層の光半導体素子が接着された光半導体装置用接着剤シートをそのままダイボンダーに設置して、特定の層を有する光半導体素子をまとめて素子取付部にダイボンドすることができる。このような使用形態であれば、生産性の観点から好ましい。 In this case, when the optical semiconductor element is sorted (by layer) after being cut out from the wafer according to the amount of light, emission wavelength, or the like, the optical semiconductor element having a specific layer is the same adhesive for an optical semiconductor device. It can also be set as the usage form which affixes on a sheet | seat and affixes the optical semiconductor element which has a layer different from a specific layer to the adhesive agent sheet for different optical semiconductor devices. As a result, an adhesive sheet for an optical semiconductor device in which an optical semiconductor element for each layer is attached can be obtained. Thus, the optical semiconductor device adhesive sheet to which the specific layer of the optical semiconductor element is bonded can be placed on the die bonder as it is, and the optical semiconductor elements having the specific layer can be collectively bonded to the element mounting portion. Such usage is preferable from the viewpoint of productivity.
［光半導体装置用接着剤シートの製造方法］
　本発明は、ウエーハから切り出されソーティングされた光半導体素子を基材シート上からピックアップし、前記光半導体素子を光半導体装置内の素子取付部に搭載した後、前記光半導体素子を前記素子取付部に硬化接着するために用いる光半導体装置用接着剤が配置された光半導体装置用接着剤シートを製造する方法であって、
　少なくとも、前記基材シート上にフィルム状の前記光半導体装置用接着剤を剥離可能に成形する接着剤成形工程、及び前記成形された光半導体装置用接着剤を任意の形状に分割する接着剤分割工程を有することを特徴とする光半導体装置用接着剤シートの製造方法を提供する。 [Method for producing adhesive sheet for optical semiconductor device]
According to the present invention, an optical semiconductor element cut out from a wafer and sorted is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device. A method of manufacturing an optical semiconductor device adhesive sheet in which an optical semiconductor device adhesive used for curing and bonding is disposed,
At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided.
　（接着剤成形工程）
　本発明にかかる接着剤成形工程は、基材シート上にフィルム状の光半導体装置用接着剤を剥離可能に成形する工程である。特に制限されないが、この工程において成形された光半導体装置用接着剤を半硬化状態としておくことができる。光半導体装置用接着剤を半硬化状態にすることで続く接着剤分割工程において任意の形状に分割しやすく、素子取付部に硬化接着される光半導体素子の接着面積に合わせてより適当でより均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成しやすいため好ましい。 (Adhesive molding process)
The adhesive forming step according to the present invention is a step of forming a film-like adhesive for an optical semiconductor device on a substrate sheet so as to be peelable. Although not particularly limited, the optical semiconductor device adhesive molded in this step can be in a semi-cured state. By making the adhesive for optical semiconductor devices into a semi-cured state, it is easy to divide into any shape in the subsequent adhesive splitting process, more suitable and more uniform according to the adhesive area of the optical semiconductor element to be cured and bonded to the element mounting part It is preferable because an adhesive for optical semiconductor devices having an appropriate shape, area, and film thickness can be easily formed on a substrate sheet.
　図１に、接着剤分割工程前の基材シートと光半導体装置用接着剤の上面図を例示し、図２に側面図を例示する。このように、接着剤分割工程前の光半導体装置用接着剤シート３’は基材シート２’上に、フィルム状の光半導体装置用接着剤１’を成形したものである。接着剤成形工程では光半導体素子複数個分の面積の光半導体装置用接着剤を成形することができる。 FIG. 1 illustrates a top view of a base material sheet and an adhesive for an optical semiconductor device before the adhesive dividing step, and FIG. 2 illustrates a side view. As described above, the optical semiconductor device adhesive sheet 3 ′ before the adhesive dividing step is obtained by forming the film-shaped optical semiconductor device adhesive 1 ′ on the base sheet 2 ′. In the adhesive forming step, an adhesive for an optical semiconductor device having an area corresponding to a plurality of optical semiconductor elements can be formed.
　（接着剤分割工程）
　本発明にかかる接着剤分割工程は、成形された光半導体装置用接着剤を任意の形状に分割する工程である。接着剤分割工程においては、レーザー光の照射により、前記成形された光半導体装置用接着剤を任意の形状に分割することが好ましい。 (Adhesive splitting process)
The adhesive dividing step according to the present invention is a step of dividing the formed optical semiconductor device adhesive into an arbitrary shape. In the adhesive dividing step, it is preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by laser light irradiation.
　このように、光半導体装置用接着剤はレーザー光の照射により容易に分割することができ、レーザー光の照射した部分を境に分割された接着剤同士の側面が離れている状態となるため、分割された個々の光半導体装置用接着剤は容易に基材シート上から剥離できるものとなる。このように、レーザー光の照射による光半導体装置用接着剤の分割で、光半導体装置用接着剤シートの製造の更なるハイスループット化が可能となり、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせてより適当でより均一な形状、面積、膜厚を有する分割された光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法となる。ここで言うレーザー光は光半導体装置用接着剤を分割することができればどのようなものでも良く、炭酸ガスレーザー、ＹＡＧレーザー、ＹＶＯ４レーザーなどが適用できる。 In this way, the adhesive for optical semiconductor devices can be easily divided by irradiation with laser light, and the side surfaces of the adhesive divided on the part irradiated with the laser light are separated, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. In this way, by dividing the adhesive for optical semiconductor devices by laser light irradiation, it becomes possible to further increase the throughput of manufacturing the adhesive sheet for optical semiconductor devices, and the optical semiconductor that is cured and bonded to the element mounting portion Manufacture of an adhesive sheet for an optical semiconductor device capable of forming a divided adhesive for an optical semiconductor device having a more suitable and more uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the element Become a method. Any laser beam may be used as long as it can divide the adhesive for an optical semiconductor device, and a carbon dioxide laser, a YAG laser, a YVO 4 laser, or the like is applicable.
　さらに、カッター刃により、成形された光半導体装置用接着剤を任意の形状に分割することも好ましい。 Furthermore, it is also preferable to divide the molded adhesive for optical semiconductor devices into an arbitrary shape by a cutter blade.
　このように、光半導体装置用接着剤はカッター刃により容易に分割することができ、カッター刃による切断を行った部分を境に分割された接着剤同士の側面が離れている状態となるため、分割された個々の光半導体装置用接着剤は容易に基材シート上から剥離できるものとなる。このように、カッター刃による光半導体装置用接着剤の分割で、光半導体装置用接着剤シートの製造の更なるハイスループット化が可能となり、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせてより適当でより均一な形状、面積、膜厚を有する分割された光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法となる。ここで言うカッター刃は光半導体装置用接着剤を分割することができればどのようなものでも良く、ビク刃（トムソン刃）、ピナクル刃などが適用できる。 In this way, the adhesive for optical semiconductor devices can be easily divided by the cutter blade, and the side surfaces of the adhesive divided by the portion cut by the cutter blade are separated from each other, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. Thus, by dividing the adhesive for optical semiconductor devices by the cutter blade, it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor element to be cured and bonded to the element mounting portion. A method for producing an adhesive sheet for an optical semiconductor device, which can form a divided adhesive for an optical semiconductor device having a more suitable and more uniform shape, area, and film thickness according to the adhesive area on a base sheet, and Become. Any cutter blade may be used as long as it can divide the adhesive for optical semiconductor devices, and a BIK blade (Thomson blade), a pinnacle blade, or the like can be applied.
　図３に、本発明により製造された光半導体装置用接着剤シートの上面図を例示し、図４に側面図を例示する。このように、本発明により製造された光半導体装置用接着剤シート３は基材シート２上に、複数のフィルム状の前記任意の形状に分割された光半導体装置用接着剤１が配置されたものとなる。特に、レーザー光の照射及びカッター刃により分割された場合は、隣り合う光半導体装置用接着剤の幅を狭くすることができるため、シート面をより効率よく使用することができる。さらに、光半導体素子が小さくなり、光半導体装置用接着剤の粘度が大きくなるほど他の方法、例えばスクリーン印刷などで均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することは困難となるが、光半導体装置用接着剤成形してからレーザー光の照射及びカッター刃等により分割する本発明の方法によれば、精度良く均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる。 FIG. 3 illustrates a top view of an adhesive sheet for an optical semiconductor device manufactured according to the present invention, and FIG. 4 illustrates a side view. As described above, the adhesive sheet 3 for an optical semiconductor device manufactured according to the present invention has an adhesive 1 for an optical semiconductor device 1 divided into a plurality of film-like arbitrary shapes arranged on the base sheet 2. It will be a thing. In particular, when divided by laser light irradiation and a cutter blade, the width of the adhesive for an optical semiconductor device can be narrowed, so that the sheet surface can be used more efficiently. Further, as the optical semiconductor element becomes smaller and the viscosity of the optical semiconductor device adhesive increases, another method, for example, screen printing or the like, has a uniform shape, area, and film thickness on the base sheet. However, according to the method of the present invention in which an adhesive for an optical semiconductor device is molded and then divided by laser light irradiation and a cutter blade, etc., a uniform shape, area, and film thickness can be accurately obtained. The adhesive for optical semiconductor devices which has can be formed on a base material sheet.
［光半導体装置の製造方法］
　以下、本発明により製造された光半導体装置用接着剤シートを用いて、ウエーハから切り出されソーティングされた光半導体素子を光半導体装置内の素子取付部に硬化接着させて光半導体装置を製造する方法について例示する。 [Method for Manufacturing Optical Semiconductor Device]
Hereinafter, a method of manufacturing an optical semiconductor device by using an adhesive sheet for an optical semiconductor device manufactured according to the present invention to cure and bond an optical semiconductor element cut out from a wafer and sorted to an element mounting portion in the optical semiconductor device. It illustrates about.
　比較として、はじめに、液状、ペースト状のダイボンド剤を使用する従来の光半導体装置の製造方法について、図５（Ｂ）を用いて説明する。図５（Ｂ）には従来の光半導体装置の製造方法のフロー図が示してある。まず、ＬＥＤ素子等の光半導体素子１３’がダイサー１１’によりウエーハ１２’から切り出される（工程１’）。切り出された光半導体素子１３’は光量や発光波長等のばらつきが大きいため発光波長などを測定し、ソーティング（層別）され（工程２’）、各層にソーティングされた光半導体素子１３’は、層ごとに粘着シート２１上に貼り付けられる貼り付け工程（工程３’）がされる。続いて、選択した発光波長層の粘着シート２１上から、前記貼り付けられた光半導体素子１３’をピックアップするピックアップ工程（工程４－１’）をすると同時に、別に配置された光半導体装置１４’内の素子取付部１５’にダイボンド剤２２をスタンピングにより塗布し（工程４－２’）、ピックアップした光半導体素子１３’をダイボンド剤２２を介して素子取付部１５’に搭載し、ダイボンド剤２２を硬化させて接着するダイボンド工程（工程５’）を行う。しかし、前述のように、上記光半導体装置の製造方法ではダイボンド剤のスタンピング（工程４－２’）に時間がかかるという問題を有しており、この問題は液状、ペースト状のダイボンド剤を使用する以上回避できない問題となっていた。その為、液状、ペースト状のダイボンド剤に代わる光半導体装置用接着剤及びそれを用いた光半導体装置の製造方法が望まれていた。 As a comparison, first, a conventional method of manufacturing an optical semiconductor device using a liquid, paste-like die bond agent will be described with reference to FIG. FIG. 5B shows a flowchart of a conventional method for manufacturing an optical semiconductor device. First, an optical semiconductor element 13 'such as an LED element is cut out from the wafer 12' by the dicer 11 '(step 1'). Since the cut out optical semiconductor element 13 ′ has a large variation in light quantity, emission wavelength, etc., the emission wavelength is measured, sorted (by layer) (step 2 ′), and the optical semiconductor element 13 ′ sorted in each layer is An affixing process (process 3 ′) to be affixed on the adhesive sheet 21 for each layer is performed. Subsequently, a pick-up step (step 4-1 ′) for picking up the attached optical semiconductor element 13 ′ from the adhesive sheet 21 of the selected light emission wavelength layer is performed, and at the same time, an optical semiconductor device 14 ′ arranged separately. The die bonding agent 22 is applied to the inner element mounting portion 15 ′ by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is mounted on the element mounting portion 15 ′ via the die bonding agent 22. A die-bonding step (step 5 ′) is performed in which is cured and bonded. However, as described above, the above optical semiconductor device manufacturing method has a problem that it takes time to stamp the die bond agent (step 4-2 ′). This problem is caused by using a liquid, paste-like die bond agent. It was a problem that could not be avoided. Therefore, there has been a demand for an optical semiconductor device adhesive that replaces a liquid, paste-like die bond agent and a method of manufacturing an optical semiconductor device using the same.
　本発明により製造された光半導体装置用接着剤シートを用いれば上記問題を回避し、光半導体装置の製造の生産性を高めることができる。本発明により製造された光半導体装置用接着剤シートを用いた光半導体装置の製造方法の一実施態様について、図５（Ａ）を用いて説明する。図５（Ａ）には、光半導体装置用接着剤シートを用いた光半導体装置の製造方法のフロー図が示してある。まず、ＬＥＤ素子等の光半導体素子１３がダイサー１１によりウエーハ１２から切り出される（工程１）。切り出された光半導体素子１３は光量や発光波長等のばらつきが大きいため発光波長などを測定し、ソーティングされる（工程２）。この際、ソーティング（層別）したときに、特定の層を有する光半導体素子を同一の光半導体装置用接着剤シートに貼り付け、特定の層と異なる層を有する光半導体素子を異なる光半導体装置用接着剤シートに貼り付けることもできる。その場合は続く工程において、特定の層の光半導体素子が接着された光半導体装置用接着剤シートをそのままダイボンダーに設置して、特定の層を有する光半導体素子をまとめて素子取付部にダイボンドすることができるため好ましい。 If the adhesive sheet for an optical semiconductor device manufactured according to the present invention is used, the above problems can be avoided and the productivity of manufacturing the optical semiconductor device can be increased. One embodiment of a method for manufacturing an optical semiconductor device using the adhesive sheet for an optical semiconductor device manufactured according to the present invention will be described with reference to FIG. FIG. 5A shows a flowchart of a method for manufacturing an optical semiconductor device using the adhesive sheet for optical semiconductor devices. First, an optical semiconductor element 13 such as an LED element is cut out from the wafer 12 by the dicer 11 (step 1). Since the cut out optical semiconductor element 13 has a large variation in light quantity, emission wavelength, and the like, the emission wavelength is measured and sorted (step 2). In this case, when sorting (by layer), an optical semiconductor element having a specific layer is attached to the same adhesive sheet for an optical semiconductor device, and an optical semiconductor element having a layer different from the specific layer is different from the optical semiconductor device. It can also be affixed to an adhesive sheet. In that case, in the subsequent process, the adhesive sheet for optical semiconductor device to which the optical semiconductor element of the specific layer is bonded is directly installed on the die bonder, and the optical semiconductor elements having the specific layer are collectively bonded to the element mounting portion. This is preferable.
（貼り付け工程）
　各層にソーティングされた光半導体素子１３は、層ごとに基材シート２上に配置されたフィルム状の任意の形状に分割された光半導体装置用接着剤１に貼り付けられる貼り付け工程（工程３）がされる。この貼り付け工程により、ソーティングされた光半導体素子を一時貼り付けておくことと、光半導体素子に光半導体装置用接着剤を圧着し貼り付けることが同時に達せられることとなる。 (Attaching process)
The optical semiconductor element 13 sorted into each layer is attached to the optical semiconductor device adhesive 1 divided into an arbitrary film-like shape disposed on the base sheet 2 for each layer (step 3). ) Is done. By this affixing process, it is possible to simultaneously affix the sorted optical semiconductor element and affix the adhesive for the optical semiconductor device to the optical semiconductor element.
　この貼り付け工程の前に、フィルム状の光半導体装置用接着剤を半硬化状態にすることもできる。半硬化状態にする方法は特に限定されないが、熱風循環式オーブンを用いて行うことが例示される。熱風循環式オーブンを用いて乾燥させる温度としては特に限定されないが４０℃以上１５０℃未満が好ましく４０℃以上１４０℃以下がより好ましい。温度が４０℃以上であれば、硬化に要する時間が長くなることを抑制でき、また温度が１５０度未満であれば硬化速度が速すぎて完全に硬化してしまうことを抑制できるため好ましい。また、熱風循環式オーブンを用いて乾燥させる時間としては、１０秒以上２時間未満が好ましく、１０秒以上１時間半以下がより好ましい。時間が１０秒以上であれば、光半導体素子が良好に貼り付け（圧着）でき、また光半導体素子とフィルム状の光半導体装置用接着剤とが共に一体となってピックアップしやすくなるため好ましく、また時間が２時間未満であれば完全に硬化してしまうことを抑制できるため好ましい。 The film-like adhesive for an optical semiconductor device can be made into a semi-cured state before this attaching step. Although the method to make a semi-hardened state is not specifically limited, Performing using a hot-air circulation type oven is illustrated. Although it does not specifically limit as temperature dried using a hot-air circulation type oven, 40 to 150 degreeC is preferable and 40 to 140 degreeC is more preferable. If the temperature is 40 ° C. or higher, it is possible to suppress an increase in the time required for curing, and if the temperature is less than 150 ° C., it is preferable because the curing speed is too high to completely cure. Moreover, as time to dry using a hot-air circulation type oven, 10 second or more and less than 2 hours are preferable, and 10 second or more and 1 hour and a half or less are more preferable. If the time is 10 seconds or more, the optical semiconductor element can be satisfactorily attached (crimped), and the optical semiconductor element and the film-like adhesive for an optical semiconductor device can be easily picked up together. Moreover, since it can suppress that it hardens | cures completely if time is less than 2 hours, it is preferable.
（ピックアップ工程）
　続いて、選択した発光波長層の光半導体装置用接着剤シート３において、前記貼り付けられた光半導体素子１３を前記フィルム状の光半導体装置用接着剤１と共に前記基材シート２上から剥離してピックアップするピックアップ工程（工程４）をし、これによりフィルム状の光半導体装置用接着剤１が接着した光半導体素子１３がピックアップされる。 (Pickup process)
Subsequently, in the adhesive sheet 3 for an optical semiconductor device having the selected emission wavelength layer, the pasted optical semiconductor element 13 is peeled from the base sheet 2 together with the adhesive 1 for an optical semiconductor device. Then, a pick-up step (step 4) for picking up is performed, whereby the optical semiconductor element 13 to which the film-like adhesive 1 for optical semiconductor devices is adhered is picked up.
（ダイボンド工程）
　前記ピックアップされた光半導体素子１３を前記フィルム状の光半導体装置用接着剤１が光半導体装置１４の素子取付部１５と接着するように搭載し、該フィルム状の光半導体装置用接着剤１を硬化させ該光半導体素子１３を前記光半導体装置１４に硬化接着するダイボンド工程（工程５）を行う。これにより、ダイボンド剤をスタンピングすることなく、光半導体素子を光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができる光半導体装置の製造方法となる。
　 (Die bond process)
The optical semiconductor element 13 thus picked up is mounted so that the film-like adhesive 1 for an optical semiconductor device adheres to the element mounting portion 15 of the optical semiconductor device 14, and the film-like adhesive 1 for an optical semiconductor device is attached. A die bonding step (step 5) is performed in which the optical semiconductor element 13 is cured and bonded to the optical semiconductor device 14 by curing. Thereby, the work up to fixing the optical semiconductor element to the element mounting portion of the optical semiconductor device can be efficiently performed without stamping the die bond agent, and the light that can increase the productivity of manufacturing the optical semiconductor device. A method for manufacturing a semiconductor device is provided.
　以下、本発明の光半導体装置用接着剤シートの製造方法の実施例及び比較例を示して本発明をより詳細に説明するが、本発明はこれらに限定されるものではない。
　 EXAMPLES Hereinafter, although the Example and comparative example of the manufacturing method of the adhesive agent sheet for optical semiconductor devices of this invention are shown and this invention is demonstrated in detail, this invention is not limited to these.
［光半導体装置用接着剤シートの製造方法］
（実施例１）
　光半導体装置用接着剤成形用組成物として硬化性シリコーン組成物であるＫＥＲ－３０００－Ｍ４（信越化学工業株式会社製）、基材シートとしてＰＥＴセパレーター、ＦＬ２－０１、３８μｍ（株式会社タカラインコーポレーション製）、カバーシートとしてＰＥＴセパレーター、ＦＬ１－０１、３８μｍ（株式会社タカラインコーポレーション製）ブレードコーティング（ナイフコーティングともいう）による塗工機を用いた。レーザー光の照射はＣＯ２レーザーマーカー、ＭＬ－Ｚ９５５０Ｔ（株式会社キーエンス製）を用いた。 [Method for producing adhesive sheet for optical semiconductor device]
Example 1
KER-3000-M4 (manufactured by Shin-Etsu Chemical Co., Ltd.), a curable silicone composition as an adhesive molding composition for optical semiconductor devices, PET separator, FL2-01, 38 μm (Takaline Corporation, as a base sheet) And a coating machine using blade separator (also referred to as knife coating), PET separator, FL1-01, 38 μm (manufactured by Takaline Corporation) as a cover sheet. For the laser light irradiation, a CO 2 laser marker, ML-Z9550T (manufactured by Keyence Corporation) was used.
［接着剤成形工程］
　これらを用い、基材シート上に溶液状の光半導体装置用接着剤成形用組成物を均一に塗工するとともに、１１０℃の熱風循環式オーブン中で連続的にＰＥＴセパレーターごと光半導体装置用接着剤を１２０秒間乾燥することにより、基材シート上に厚さ３０μｍの半硬化状態のフィルム状の光半導体装置用接着剤を剥離可能に成形した。このフィルム状の光半導体装置用接着剤の表面にカバーシートを貼り付けた。 [Adhesive molding process]
Using these, a solution-form composition for forming an adhesive for an optical semiconductor device is uniformly coated on a base sheet, and the PET separator is continuously bonded together with an optical semiconductor device in a hot air circulation oven at 110 ° C. By drying the agent for 120 seconds, a 30-μm thick semi-cured film-like adhesive for an optical semiconductor device was formed on the substrate sheet so as to be peelable. A cover sheet was affixed to the surface of this film-like adhesive for optical semiconductor devices.
［接着剤分割工程］
　カバーシートを剥し、レーザーパワー７０％、スキャンスピード９００ｍｍ／ｓにてレーザー光の照射を行い、基材シート上に成形された半硬化状態のフィルム状の光半導体装置用接着剤を任意の形状に分割し、本発明の光半導体装置用接着剤シートの製造方法により製造された光半導体装置用接着剤シートを得た。実施例１では光半導体装置用接着剤は１ｍｍ×１ｍｍの四角形状に分割した。レーザー光の照射部分からは半硬化状態のフィルム状の光半導体装置用接着剤は除去されていた。 [Adhesive splitting process]
The cover sheet is peeled off, laser light is irradiated at a laser power of 70% and a scanning speed of 900 mm / s, and a semi-cured film-like adhesive for an optical semiconductor device formed on a base sheet is formed into an arbitrary shape. It divided | segmented and the adhesive sheet for optical semiconductor devices manufactured by the manufacturing method of the adhesive sheet for optical semiconductor devices of this invention was obtained. In Example 1, the adhesive for optical semiconductor devices was divided into a 1 mm × 1 mm square shape. The semi-cured film-like adhesive for an optical semiconductor device was removed from the irradiated portion of the laser beam.
　上記実施例１のようにして製造された光半導体装置用接着剤シートは、複数個の分割された光半導体装置用接着剤を配置したものとなる。また、基材シート上の分割された光半導体装置用接着剤は、フィルム状に成形されており、前記基材シート上に配置されており、前記基材シートから剥離できるものである。
　 The adhesive sheet for optical semiconductor devices manufactured as described in Example 1 is obtained by arranging a plurality of divided adhesives for optical semiconductor devices. Moreover, the adhesive agent for optical semiconductor devices divided | segmented on the base material sheet is shape | molded in the film form, is arrange | positioned on the said base material sheet, and can peel from the said base material sheet.
（実施例２）
　また、実施例２として、前記接着剤成形工程の塗工時に１２０℃の熱風循環式オーブン中で９０秒間乾燥とした以外は実施例１と同様に行い、本発明の光半導体装置用接着剤シートの製造方法により製造された光半導体装置用接着剤シートを得た。
　 (Example 2)
Moreover, as Example 2, it carried out similarly to Example 1 except having dried for 90 second in a 120 degreeC hot-air circulation oven at the time of the coating of the said adhesive agent formation process, and the adhesive sheet for optical semiconductor devices of this invention The adhesive sheet for optical semiconductor devices manufactured by this manufacturing method was obtained.
（実施例３）
　さらに、実施例３として、前記接着剤成形工程の塗工時に１００℃の熱風循環式オーブン中で２４０秒間乾燥とした以外は実施例１と同様に行い、本発明の光半導体装置用接着剤シートの製造方法により製造された光半導体装置用接着剤シートを得た。
　 (Example 3)
Further, as Example 3, the adhesive sheet for optical semiconductor devices of the present invention was carried out in the same manner as in Example 1 except that it was dried in a hot air circulation oven at 100 ° C. for 240 seconds at the time of coating in the adhesive molding step. The adhesive sheet for optical semiconductor devices manufactured by this manufacturing method was obtained.
（実施例４）
　また、実施例４として、前記接着剤成形工程の塗工時までは実施例１と同様に行い、接着剤分割工程では、カバーシートを剥し、裁断機とカッター刃にビク刃を使用し、基材シート上に成形された半硬化状態のフィルム状の光半導体装置用接着剤を任意の形状に分割した。具体的には、４回の裁断により１ｍｍ×１ｍｍの四角形状が形成できるようなビク刃を使用し、裁断機の送り量を１ｍｍ、送り速度を２ｍ／ｍｉｎにて分割を行い、本発明の光半導体装置用接着剤シートの製造方法により製造された光半導体装置用接着剤シートを得た。この光半導体装置用接着剤のカッター刃により裁断された部分では、隣り合う分割された光半導体装置用接着剤は離れていた。
　 Example 4
Moreover, as Example 4, it carries out similarly to Example 1 until the time of the coating of the said adhesive agent formation process, and peels a cover sheet | seat in an adhesive division | segmentation process, uses a big blade for a cutting machine and a cutter blade, A semi-cured film-like adhesive for an optical semiconductor device formed on a material sheet was divided into arbitrary shapes. Specifically, using a big blade that can form a 1 mm × 1 mm square shape by cutting four times, the cutting machine feed amount is 1 mm, and the feed speed is 2 m / min. The adhesive sheet for optical semiconductor devices manufactured by the manufacturing method of the adhesive sheet for optical semiconductor devices was obtained. In the portion of the adhesive for optical semiconductor device cut by the cutter blade, the adjacent adhesive for optical semiconductor device was separated.
（比較例１）
　さらに、比較例１として、接着剤成形工程及び接着剤分割工程を行わず、スクリーン印刷によって光半導体装置用接着剤シートを作製した。光半導体装置用接着剤成形用組成物として硬化性シリコーン組成物であるＫＥＲ－３０００－Ｍ４（信越化学工業株式会社製）、基材シートとしてＰＥＴセパレーター、ＰＥＴ＃３８ｘ－４１－３０３５、３８μｍ（株式会社タカラインコーポレーション製）、スクリーン版として１ｍｍ×１ｍｍの四角開口部が１０個並んだ行を１０行、合計１００個の開口部を間隔０．５ｍｍで規則的に配列したスクリーン版、スクリーン印刷機としてミノグループ製のスクリーン印刷機を用いた。 (Comparative Example 1)
Further, as Comparative Example 1, an adhesive sheet for an optical semiconductor device was produced by screen printing without performing the adhesive molding step and the adhesive dividing step. KER-3000-M4 (manufactured by Shin-Etsu Chemical Co., Ltd.) as a curable silicone composition as an adhesive molding composition for optical semiconductor devices, PET separator as a base sheet, PET # 38x-41-3035, 38 μm (stock) (Takaline Corporation), 10 screens with 10 1mm x 1mm square openings arranged as a screen plate, a screen plate with a total of 100 openings regularly arranged at intervals of 0.5mm, screen printing machine A screen printer manufactured by Mino Group was used.
　これらを用い、スキージ角度７０°、スキージ速度３００ｍｍ／ｓｅｃ、クリアランス量１ｍｍにて、基材シート上にスクリーン印刷により１００個の光半導体装置用接着剤を配置した。その後、１２０℃の熱風循環式オーブン中でＰＥＴセパレーターごと印刷された光半導体装置用接着剤を１２０秒間乾燥することにより、ＰＥＴセパレーター上に半硬化状態のフィルム状の光半導体装置用接着剤が配置された光半導体装置用接着剤シートを得た。この光半導体装置用接着剤は１ｍｍ×１ｍｍの四角形状となった。 Using these, 100 adhesives for an optical semiconductor device were arranged on a base sheet by screen printing at a squeegee angle of 70 °, a squeegee speed of 300 mm / sec, and a clearance of 1 mm. Thereafter, the adhesive for an optical semiconductor device printed together with the PET separator in a hot air circulation oven at 120 ° C. is dried for 120 seconds, whereby a semi-cured adhesive for an optical semiconductor device is disposed on the PET separator. Thus obtained optical semiconductor device adhesive sheet was obtained. This adhesive for optical semiconductor devices has a square shape of 1 mm × 1 mm.
　このように、実施例１～４が接着剤成形工程において光半導体装置用接着剤を成形し半硬化状態に乾燥させ、その後に接着剤を分割するのに対し、比較例１ではスクリーン印刷により光半導体装置用接着剤を配置したあとに半硬化状態に乾燥させる。すなわち、実施例１～４はある程度形の決まった半硬化状態の接着剤を光半導体素子の接着面積に合わせて分割できるので、適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができるのに対して、比較例１では形状が不安定な未硬化状態の接着剤を印刷してから硬化させるので、接着剤の形状、面積、膜厚が不均一になりやすい。実際に、目視にて、実施例１～４及び比較例１で作製された光半導体装置用接着剤シートを確認したところ比較例１よりも実施例１～４で作製された光半導体装置用接着剤シートの方が接着剤の形状、面積、膜厚が均一であった。 As described above, in Examples 1 to 4, the adhesive for the optical semiconductor device is molded and dried to a semi-cured state in the adhesive molding step, and then the adhesive is divided. In Comparative Example 1, light is obtained by screen printing. After disposing the adhesive for a semiconductor device, it is dried to a semi-cured state. That is, in Examples 1 to 4, a semi-cured adhesive having a certain shape can be divided in accordance with the adhesion area of the optical semiconductor element, so that the adhesive for an optical semiconductor device having an appropriate uniform shape, area, and film thickness The adhesive can be formed on the base sheet, whereas in Comparative Example 1, the adhesive is in an uncured state with an unstable shape, and then cured, so the shape, area, and film thickness of the adhesive Tends to be uneven. Actually, when the adhesive sheet for optical semiconductor devices produced in Examples 1 to 4 and Comparative Example 1 was visually confirmed, the adhesive for optical semiconductor devices produced in Examples 1 to 4 rather than Comparative Example 1 was used. The adhesive sheet had a more uniform shape, area and film thickness.
　さらに、比較例１では、接着剤の粘度が高い場合にはスキージ速度を低下させざるを得ないことがあり、スループットが低下する。また、特に接着剤の粘度が高く、光半導体素子が小さい場合にはスループットの低下が顕著となり、小型化の要求に応えることが困難となる。さらに、スクリーン版の開口部の間隔狭すぎる場合は隣り合う光半導体装置用接着剤同士がくっつくなどの原因によるスループットの低下も起こりうる。一方で、本発明の実施例１～４によれば、比較例１のように接着剤の粘度、光半導体素子の小ささ、スクリーン版の開口部の間隔等に由来するスループットの低下の影響を受けず、光半導体装置用接着剤シートの作製のハイスループット化が可能となる。次に、本発明により製造された光半導体装置用接着剤シートの接着強度と従来のダイボンド剤を使用した場合と比べた製造効率を評価した。 Furthermore, in Comparative Example 1, when the viscosity of the adhesive is high, the squeegee speed may have to be reduced, and the throughput is reduced. In particular, when the adhesive has a high viscosity and the optical semiconductor element is small, the throughput is significantly reduced, making it difficult to meet the demand for downsizing. Further, when the distance between the openings of the screen plate is too narrow, the throughput may be lowered due to the cause that the adhesives for optical semiconductor devices adjoin each other. On the other hand, according to Examples 1 to 4 of the present invention, as in Comparative Example 1, the influence of the decrease in throughput caused by the viscosity of the adhesive, the size of the optical semiconductor element, the interval between the openings of the screen plate, and the like. Therefore, it is possible to increase the throughput of the production of the adhesive sheet for optical semiconductor devices. Next, the adhesive strength of the adhesive sheet for optical semiconductor devices manufactured according to the present invention and the manufacturing efficiency compared with the case of using a conventional die bond agent were evaluated.
［接着強度及び製造効率の評価］
　実施例１で得られた光半導体装置用接着剤シートを用いて、光半導体素子の接着強度を評価した。このフィルム状の分割された光半導体装置用接着剤に１ｍｍ×１ｍｍの接着面積を有する青色ＬＥＤ素子を圧着した後、ピンセットで素子をつかみながら持ち上げたところ、ＰＥＴセパレーターから光半導体装置用接着剤を容易に剥すことができた。このときにはフィルム状の光半導体装置用接着剤は素子の一面（素子取付部に接着される面）にきれいに貼り付いたまま光半導体素子と共に一体となってピックアップされた。その後、このフィルム状の光半導体装置用接着剤付き光半導体素子を、銀メッキを施した銅板（素子取付部に相当）にフィルム状の光半導体装置用接着剤を介して接着するように圧着した後、１５０℃の熱風循環式オーブン中で２時間加熱して硬化接着させた。硬化接着後のせん断接着強度は４．０ＭＰａであった。せん断接着強度は強度テスター（デイジ社製）を用いて測定した。製造効率は後述するペースト状のダイボンド剤を用いた場合に要した時間を製造効率１としたとき、１／５であった。 [Evaluation of adhesive strength and production efficiency]
Using the adhesive sheet for optical semiconductor devices obtained in Example 1, the adhesive strength of the optical semiconductor element was evaluated. A blue LED element having an adhesive area of 1 mm × 1 mm was pressure-bonded to the film-shaped adhesive for an optical semiconductor device, and then lifted while holding the element with tweezers. The adhesive for the optical semiconductor device was removed from the PET separator. It was easy to peel off. At this time, the film-like adhesive for an optical semiconductor device was picked up together with the optical semiconductor element while being adhered cleanly to one surface of the element (surface to be bonded to the element mounting portion). Thereafter, this film-like optical semiconductor element with an adhesive for optical semiconductor devices was pressure-bonded so as to adhere to a silver-plated copper plate (corresponding to the element mounting portion) via the adhesive for film-like optical semiconductor devices. Thereafter, it was heated and cured in a hot air circulating oven at 150 ° C. for 2 hours to be cured and adhered. The shear bond strength after curing and bonding was 4.0 MPa. The shear bond strength was measured using a strength tester (manufactured by Daisy). The production efficiency was 1/5 when the time required when using a paste-like die bonding agent described later was defined as production efficiency 1.
［ペースト状のダイボンド剤を使用した光半導体装置の製造比較例］
　上記実施例１で作成された光半導体装置用接着剤シートとの比較のため、ペースト状のダイボンド剤を用いた従来の光半導体装置の製造方法の製造効率を実施例１と同じダイボンダー（エーエスエム・アッセンブリー・テクノロジー株式会社製）にて評価した。１ｍｍ×１ｍｍの青色ＬＥＤ素子１００個を粘着フィルムＥＬＰ　Ｖ－８Ｓ（日東電工株式会社製）の上に圧着固定してダイボンダーに設置してダイボンドを行った。ダイボンド剤のスタンピングに時間がかかり、光半導体装置用接着剤シートを使用する時間よりも５倍の製造時間（製造効率１）がかかった。硬化接着後のせん断接着強度は４．０ＭＰａであった。 [Production Comparative Example of Optical Semiconductor Device Using Paste Die Bonding Agent]
For comparison with the adhesive sheet for optical semiconductor devices prepared in Example 1, the manufacturing efficiency of the conventional method for manufacturing an optical semiconductor device using a paste-like die bond agent is the same as that of Example 1. -Assessed by Assembly Technology Co., Ltd. 100 blue LED elements of 1 mm × 1 mm were pressure-bonded and fixed on an adhesive film ELP V-8S (manufactured by Nitto Denko Corporation) and placed on a die bonder for die bonding. Stamping of the die bond agent took time, and the manufacturing time (manufacturing efficiency 1) was five times longer than the time for using the adhesive sheet for optical semiconductor devices. The shear bond strength after curing and bonding was 4.0 MPa.
　同様にして実施例２～４で得られた光半導体装置用接着剤シート光半導体素子の接着強度と製造効率を評価した。実施例１～４の結果を表１にまとめて示す。 Similarly, the adhesive strength and production efficiency of the optical semiconductor device adhesive sheet optical semiconductor elements obtained in Examples 2 to 4 were evaluated. The results of Examples 1 to 4 are summarized in Table 1.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　このように、本発明の製造方法により製造された光半導体装置用接着剤シートを用いない従来法による光半導体装置の製造比較例では、ダイボンド剤のスタンピングが必要であり、本発明における光半導体装置用接着剤を使用した光半導体装置の製造時間よりも５倍の製造時間（製造効率１）がかかった。一方で、本発明の実施例１～４により作製された光半導体装置用接着剤シートを用いて光半導体装置を製造した場合には、ダイボンド剤のスタンピングを省略することができ、ペースト状のダイボンド剤を用いた場合との比較に比べて１／５の製造時間（製造効率１／５）で光半導体装置を製造できることが明らかとなった。これにより、本発明にかかる光半導体装置用接着剤シートにより、光半導体素子を光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができることも明らかとなった。 As described above, in the comparative example of manufacturing the optical semiconductor device by the conventional method that does not use the adhesive sheet for the optical semiconductor device manufactured by the manufacturing method of the present invention, stamping of the die bond agent is necessary. The manufacturing time (manufacturing efficiency 1) was five times longer than the manufacturing time of the optical semiconductor device using the adhesive. On the other hand, when an optical semiconductor device is manufactured using the adhesive sheet for an optical semiconductor device manufactured according to Examples 1 to 4 of the present invention, stamping of the die bond agent can be omitted, and a paste-like die bond It has become clear that an optical semiconductor device can be manufactured in a manufacturing time of 1/5 (manufacturing efficiency 1/5) as compared with the case where an agent is used. Thereby, the adhesive sheet for an optical semiconductor device according to the present invention can efficiently perform the work until the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device, and the productivity of manufacturing the optical semiconductor device can be increased. It became clear that it could be increased.
　以上説明したように、本発明によれば、光半導体装置の製造の生産性を高めることができる光半導体装置用接着剤シートの製造をハイスループット化することができ、かつ、素子取付部に硬化接着される光半導体素子の接着面積に合わせて適当で均一な形状、面積、膜厚を有する光半導体装置用接着剤を基材シート上に形成することができる光半導体装置用接着剤シートの製造方法を提供することができる。 As described above, according to the present invention, the production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device can be made high-throughput, and the element mounting portion is cured. Manufacture of an adhesive sheet for an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate and uniform shape, area and film thickness on the base sheet in accordance with the adhesive area of the optical semiconductor element to be bonded A method can be provided.
　なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 Note that the present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits the same function and effect. Are included in the technical scope.

Claims (4)

  1. 　ウエーハから切り出されソーティングされた光半導体素子を基材シート上からピックアップし、前記光半導体素子を光半導体装置内の素子取付部に搭載した後、前記光半導体素子を前記素子取付部に硬化接着するために用いる光半導体装置用接着剤が配置された光半導体装置用接着剤シートを製造する方法であって、
    　少なくとも、前記基材シート上にフィルム状の前記光半導体装置用接着剤を剥離可能に成形する接着剤成形工程、及び前記成形された光半導体装置用接着剤を任意の形状に分割する接着剤分割工程を有することを特徴とする光半導体装置用接着剤シートの製造方法。
    　     The optical semiconductor element cut out from the wafer and sorted is picked up from the base sheet, the optical semiconductor element is mounted on the element mounting portion in the optical semiconductor device, and then the optical semiconductor element is cured and bonded to the element mounting portion. A method of manufacturing an optical semiconductor device adhesive sheet in which an optical semiconductor device adhesive to be used is disposed,
    At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive agent sheet for optical semiconductor devices characterized by having a process.
  2. 　前記接着剤分割工程において、レーザー光の照射により、前記成形された光半導体装置用接着剤を任意の形状に分割することを特徴とする請求項１に記載の光半導体装置用接着剤シートの製造方法。
    　     2. The production of an adhesive sheet for optical semiconductor devices according to claim 1, wherein, in the adhesive dividing step, the molded adhesive for optical semiconductor devices is divided into arbitrary shapes by irradiation with laser light. Method.
  3. 　前記接着剤分割工程において、カッター刃により、前記成形された光半導体装置用接着剤を任意の形状に分割することを特徴とする請求項１に記載の光半導体装置用接着剤シートの製造方法。
    　     2. The method for producing an adhesive sheet for an optical semiconductor device according to claim 1, wherein in the adhesive dividing step, the molded adhesive for an optical semiconductor device is divided into an arbitrary shape by a cutter blade.
  4. 　請求項１乃至請求項３のいずれか１項に記載の光半導体装置用接着剤シートの製造方法により製造され、前記任意の形状に分割された光半導体装置用接着剤を有するものであることを特徴とする光半導体装置用接着剤シート。
     
          It is manufactured with the manufacturing method of the adhesive sheet for optical semiconductor devices of any one of Claim 1 thru | or 3, and has the adhesive agent for optical semiconductor devices divided | segmented into the said arbitrary shapes. An adhesive sheet for optical semiconductor devices.

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