WO2012098901A1 - 加速度センサ - Google Patents
加速度センサ Download PDFInfo
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- WO2012098901A1 WO2012098901A1 PCT/JP2012/000334 JP2012000334W WO2012098901A1 WO 2012098901 A1 WO2012098901 A1 WO 2012098901A1 JP 2012000334 W JP2012000334 W JP 2012000334W WO 2012098901 A1 WO2012098901 A1 WO 2012098901A1
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- Prior art keywords
- acceleration sensor
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- weight
- acceleration
- axis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
Definitions
- the present invention relates to an acceleration sensor used for a vehicle, a portable terminal or the like.
- FIG. 19 is a top view of the conventional acceleration sensor 1 described in Patent Document 1.
- FIG. 20A and 20B are cross-sectional views of the acceleration sensor 1 shown in FIG. 19 taken along line 20A-20A.
- the acceleration sensor 1 comprises a frame portion 3 in which a hollow area 2 is formed, beam portions 4, 5, 6, 7 each having one end connected to the frame portion 3, and beam portions 4, 5, 6, 7.
- the weight 8 connected to the other end, the auxiliary weights 9, 10, 11, 12 connected to the weight 8, and the detectors 13, 14 provided on the beams 4, 5, 6, 7 respectively. , 15, 16 are provided.
- Beams 4, 5, 6, 7 extend from frame 3 to hollow area 2.
- the acceleration sensor 1 when the frame 3 is bonded to the substrate 18 using the adhesive 17, stress remains in the beam portions 4, 5, 6, 7, and the shape of the acceleration sensor 1 is caused by the stress.
- a changing buckling phenomenon may occur.
- the weight 8 since the weight 8 is connected to the frame 3 by the four beams 4, 5, 6, 7, the four beams 4, 5, 6, 7 bend in different buckling modes. Since the buckling phenomenon affects the sensitivity of the acceleration detected by the detectors 13, 14, 15, 16, the buckling mode of the four beam parts 4, 5, 6, 7 is different and the reliability of the acceleration sensor 1 is obtained. Is degraded.
- FIG. 20A and FIG. 20B show different buckling modes of the acceleration sensor 1.
- the stress generated when the frame 3 is bonded to the substrate 18 using the adhesive 17 remains on the beam portions 4, 5, 6, 7 and is accumulated. Due to the residual stress, the beams 4, 5, 6, 7 have a buckling mode in which the upper surface of the weight 8 is positioned above the upper surface of the frame 3 as shown in FIG. As shown, the upper surface of the weight 8 has a buckling mode located below the upper surface of the frame 3. Due to these buckling modes, the sensitivity of the acceleration detected by the detection units 13, 14, 15, and 16 varies. Further, the application of an impact to the acceleration sensor 1 and the release of stress due to the passage of time cause the mode of buckling shown in FIG. 20A and the mode of buckling shown in FIG. 20B to transition, and the sensitivity changes with time.
- FIG. 21 is a top view of another conventional acceleration sensor 101 described in Patent Document 2.
- the acceleration sensor 101 includes a frame portion 102, a flexible portion 103 whose one end is connected to the frame portion 102, a flexible portion 104 whose one end is connected to the frame portion 102, and an upper portion of the flexible portions 103 and 104.
- the strain resistors 105 and 106 are provided.
- the flexible portion 103 extends from the frame portion 102 in the positive direction of the Y axis.
- the flexible portion 104 extends from the frame portion 102 in the negative direction of the Y axis.
- the acceleration sensor 101 detects an acceleration in the Y-axis direction based on the strain resistors 105 and 106.
- the temperature characteristic of the acceleration sensor 101 is degraded due to the difference between the temperature characteristics of the strain resistors 105 and 106.
- the acceleration sensor includes a frame having a hollow area formed therein, four beams extending from the frame to the hollow area, four weights connected to the other ends of the four beams, and four weights. And four detection units respectively provided to the beam portion.
- One ends of the two beam portions are respectively connected to portions on opposite sides of the hollow region.
- the two weight parts face each other across the center of the hollow area.
- One ends of the other two beam portions are respectively connected to opposite sides of the hollow region.
- the other two weight parts are opposed to each other across the center of the hollow area.
- the acceleration sensor can suppress the sensitivity variation and can suppress the temporal change of the sensitivity.
- FIG. 1 is a top view of an acceleration sensor according to a first embodiment of the present invention.
- FIG. 2 is a top view of another acceleration sensor according to the first embodiment.
- FIG. 3A is a top view of the acceleration sensor in the first embodiment.
- FIG. 3B is a cross-sectional view of the acceleration sensor shown in FIG. 3A taken along line 3B-3B.
- FIG. 3C is a cross-sectional view of the acceleration sensor shown in FIG. 3A taken along line 3C-3C.
- FIG. 3D is a circuit diagram of the acceleration sensor in the first embodiment.
- FIG. 3E is a circuit diagram of an acceleration sensor according to Embodiment 1.
- FIG. 3F is a circuit diagram of an acceleration sensor according to Embodiment 1.
- FIG. 3E is a circuit diagram of an acceleration sensor according to Embodiment 1.
- FIG. 4 is a diagram showing output fluctuation when an impact is applied to the acceleration sensor in the first embodiment.
- FIG. 5A is a view showing a temporal change of the sensitivity of the acceleration sensor of the comparative example.
- FIG. 5B is a diagram showing the change with time of the sensitivity of the acceleration sensor in the first embodiment.
- FIG. 6 is a top view of still another acceleration sensor according to the first embodiment.
- FIG. 7 is a top view of still another acceleration sensor according to the first embodiment.
- FIG. 8 is a top view of still another acceleration sensor according to the first embodiment.
- FIG. 9 is a top view of still another acceleration sensor according to the first embodiment.
- FIG. 10 is a top view of the acceleration sensor according to the second embodiment of the present invention.
- FIG. 11 is a top view of the acceleration sensor according to the third embodiment of the present invention.
- FIG. 12 is a diagram showing the characteristics of the acceleration sensor in the third embodiment.
- FIG. 13 is a top view of another acceleration sensor in the third embodiment.
- FIG. 14 is a top view of still another acceleration sensor according to the third embodiment.
- FIG. 15 is a top view of still another acceleration sensor according to the third embodiment.
- FIG. 16 is a top view of still another acceleration sensor according to the third embodiment.
- FIG. 17 is a top view of still another acceleration sensor according to the third embodiment.
- FIG. 18 is a top view of still another acceleration sensor according to the third embodiment.
- FIG. 19 is a top view of a conventional acceleration sensor.
- FIG. 20A is a sectional view taken along line 20A-20A of the conventional acceleration sensor shown in FIG.
- FIG. 20B is a cross-sectional view of the conventional acceleration sensor shown in FIG. 19 taken along line 20A-20A.
- FIG. 21 is a top view
- FIG. 1 is a top view of the acceleration sensor 20 according to the first embodiment.
- the acceleration sensor 20 includes a frame 22 having a hollow area 21 formed therein, beams 23, 24, 25, 26 each having one end connected to the frame 22, and beams 23, 24, 25, 26. It includes weight portions 27, 28, 29, 30 connected to the other end, and detection portions 31, 32, 33, 34 provided on beam portions 23, 24, 25, 26, respectively. Beams 23, 24, 25, 26 extend from frame 22 into hollow region 21. Further, the weight portion 27 and the weight portion 28 face each other in the direction of the X-axis via the central portion 91A of the hollow region 21, and the weight portion 29 and the weight portion 30 via the central portion 91A in the direction of the Y-axis They face each other.
- the acceleration sensor 20 is configured to be fixed to the substrate 1002.
- the weight portions 27, 28, 29, 30 are connected to the frame portion 22 only by the beam portions 23, 24, 25, 26.
- the weight portions 27, 28, 29, 30 are supported by the beam portions 23, 24, 25, 26 only in one direction. That is, the weight portion 27 has a cantilever structure supported by the beam portion 23 only from the frame portion 22 in the positive direction of the X axis.
- the weight portion 28 has a cantilever structure supported by the beam portion 24 only from the frame portion 22 in the negative direction of the X axis.
- the weight 29 has a cantilever structure supported by the beam 25 only from the frame 22 in the negative direction of the Y axis.
- the weight 30 has a cantilever structure supported by the beam 26 only in the positive direction of the Y-axis from the frame 22. Therefore, the transition to the mode of different buckling can be suppressed, the sensitivity variation can be suppressed, and the change with time of the sensitivity can be suppressed.
- the frame portion 22 has a rectangular shape as viewed from the top, and a hollow region 21 is formed in the central portion and surrounds the hollow region 21.
- the hollow area 21 may have a square shape or a circular shape.
- One ends of the beam portions 23 and 24 are respectively connected to portions on the opposite sides of the hollow area 21 of the frame portion 22.
- the weight portions 27 and 28 oppose each other with the central portion 91A of the hollow area 21 interposed therebetween.
- One ends of the beam portions 25 and 26 are respectively connected to portions on the opposite sides of the hollow area 21 of the frame portion 22.
- the weight portions 29 and 30 oppose each other with the central portion 91A of the hollow area 21 interposed therebetween.
- FIG. 2 is a top view of another acceleration sensor 35 according to the first embodiment.
- the acceleration sensor 35 is provided on the lower surface of the upper lid 36 provided on the upper portion of the frame 22, the counter electrodes 227 A, 228 A, 229 A, and 230 A provided on the upper surfaces of the weight portions 27, 28, 29, and 30. It further includes counter electrodes 227B, 228B, 229B, 230B provided and respectively facing the counter electrodes 227A, 228A, 229A, 230A.
- the weight portions 27, 28, 29, 30 are displaced in the direction of the Z axis, and the acceleration sensor 35 and the detection circuit fail You can make a diagnosis.
- the outer edge of the hollow area 21 has four long sides 21A, 21B, 21C, and 21D. It is preferable that the four long sides 21A, 21B, 21C, and 21D face the corners 22A, 22B, 22C, and 22D of the frame 22, respectively. As a result, bonding portions 37A, 37B, 37C, 37D bonded to the upper lid 36 can be provided in the region between the four long sides 21A, 21B, 21C, 21D and the corner portions 22A, 22B, 22C, 22D, As a result, the area of the upper lid 36 can be made smaller than the area of the frame 22.
- the electrode pad 37 provided at the end of the frame 22 can be exposed from the upper cover 36.
- the connection between the pad 37 and the package or IC can be easily made.
- the outer edge of the hollow area 21 preferably has an octagonal shape having four short sides 21E, 21F, 21G, 21H alternately provided with four long sides 21A, 21B, 21C, 21D. It is preferable to connect the beam portions 23, 24, 25, 26 to the four short sides 21E, 21F, 21G, 21H. With this configuration, the wiring distance between the electrode pads 37 provided on the four sides and the detection units 31, 32, 33, 34 can be shortened, and unnecessary noise can be prevented from being mixed.
- an adhesive such as an epoxy resin or a silicone resin is used as the adhesive.
- an adhesive such as an epoxy resin or a silicone resin is used as the adhesive.
- weight portions 27, 28, 29 and 30 respectively have cantilever beam structures supported by beams 23, 24, 25 and 26 from only one direction, respectively. The transition to different buckling modes can be suppressed.
- the stress by hardening of adhesive agent itself can be made small by using silicone resin as an adhesive agent.
- the thickness of the beam portions 23, 24, 25, 26 is preferably smaller than the thickness of the frame portion 22 and smaller than the thickness of the weight portions 27, 28, 29, 30. As a result, the beam portions 23, 24, 25, 26 can be easily bent, and acceleration detection sensitivity can be improved.
- the weight portions 27, 28, 29, 30 are connected to the other ends of the beam portions 23, 24, 25, 26, respectively.
- the weight portions 27, 28, 29, 30 respectively have convex portions 27A, 28A, 29A, 30A. It is preferable that the convex portion 27A and the convex portion 28A face each other via the central portion 91A, and the convex portion 29A and the convex portion 30A face each other via the central portion 91A. That is, in the central portion 91A of the hollow region 21, it is preferable to form the convex portions 27A, 28A, 29A, and 30A so as to face each other.
- the four weight portions 27, 28, 29, 30 can be formed in proximity to the central portion 91A of the hollow region 21, and the area of the gap portion 91B of the hollow region 21 can be reduced. Therefore, the acceleration sensors 20 and 35 can be miniaturized without reducing the mass of the four weight portions 27, 28, 29 and 30.
- the hollow region 21 is composed of a portion occupied by the weight portions 27 to 30 and a gap portion 91 B not occupied by the weight portions 27 to 30.
- the area of the gap 91 B is smaller than the sum of the areas of the upper surfaces of the weight portions 27, 28, 29, and 30.
- the shape of the outer edge of the weight portion 27, 28, 29, 30 facing the frame portion 22 be similar to the outer edge shape of the hollow region 21.
- the area of the weight portions 27, 28, 29, 30 occupied in the hollow region 21 can be further increased, and the acceleration sensors 20, 35 can be made without reducing the mass of the weight portions 27, 28, 29, 30. Can be miniaturized.
- Silicon, fused quartz, alumina or the like can be used for the frame portion 22, the beam portions 23 to 26 and the weight portions 27 to 30.
- the micro acceleration technology can be used to make the small acceleration sensors 20, 35.
- the strain resistance method, the capacitance method, or the like can be used as the detection units 31, 32, 33, 34.
- the sensitivity of the acceleration sensors 20 and 35 can be improved by using a piezoresistor as a strain resistance method.
- the temperature characteristics of the acceleration sensors 20 and 35 can be improved by using a thin film resistance method using an oxide film strain resistor as a strain resistance method.
- FIG. 3A is a top view of the acceleration sensor 20 showing the arrangement of strain resistances R1 to R8 when the strain resistance method is used as the detection units 31, 32, 33,.
- the detection unit 31 is configured of strain resistances R2 and R4.
- the detection unit 32 is configured of strain resistances R1 and R3.
- the detection unit 33 is composed of strain resistances R5 and R7.
- the detection unit 34 is configured of strain resistances R6 and R8.
- detection portions 38A and 38B respectively configured by strain resistances R9 and R10 are provided on the frame portion 22 which does not deform due to acceleration, and function as fixed resistors whose resistance does not change due to acceleration.
- strain resistances R1 to R10 have the same structure, their resistance values change similarly to each other due to changes in the external environment such as temperature and humidity. Therefore, by bridge-connecting the strain resistances R1 to R10, it is possible to offset the change of the resistance value due to the external environment and to detect the acceleration with high accuracy regardless of the external environment.
- the distortion resistors R1 to R10 are configured to be connected to the detection circuit 1001.
- FIG. 3B is a cross-sectional view of the acceleration sensor 20 shown in FIG. 3A taken along line 3B-3B.
- FIG. 3C is a cross-sectional view of the acceleration sensor 20 shown in FIG. 3A taken along line 3C-3C.
- 3D to 3F are circuit diagrams of a circuit of the acceleration sensor 20 for detecting an acceleration. These circuits are realized by the detection circuit 1001 connected to the strain resistances R1 to R10.
- FIG. 3D shows a circuit for detecting acceleration in the direction of the X axis.
- the detection circuit 1001 connects the distortion resistors R1, R2, R3 and R4 in a bridge connection.
- FIG. 3B when acceleration in the positive direction of the X axis is applied to the acceleration sensor 20, the weight portion 28 is displaced in the negative direction of the Z axis, and the weight portion 27 is displaced in the positive direction of the Z axis.
- the resistance values of the strain resistances R1 and R3 increase, and the resistance values of the strain resistances R2 and R4 decrease.
- the detection circuit 1001 detects an acceleration in the direction of the X axis by applying a voltage between a pair of opposing connection points Vdd and GND and detecting a voltage between the other pair of connection points Vx1 and Vx2. it can.
- FIG. 3E shows a circuit for detecting an acceleration in the direction of the Y axis.
- the detection circuit 1001 connects the distortion resistors R5, R6, R7, and R8 in a bridge connection.
- the weight 29 is displaced in the positive direction of the Z axis
- the weight 30 is displaced in the negative direction of the Z axis.
- the resistance values of the strain resistances R5 and R7 increase, and the resistance values of the strain resistances R6 and R8 decrease.
- the detection circuit 1001 detects an acceleration in the direction of the Y axis by applying a voltage between a pair of opposing connection points Vdd and GND and detecting a voltage between the other pair of connection points Vy1 and Vy2. it can.
- FIG. 3F shows a circuit for detecting an acceleration in the direction of the Z axis.
- the detection circuit 1001 connects the distortion resistors R5, R8, R9, and R10 in a bridge connection.
- the weight portions 28 to 30 are displaced in the positive direction of the Z axis.
- resistance values of the strain resistances R1 to R8 increase.
- the weight portions 27 to 30 are displaced in the opposite direction to the above, and the resistance values of the strain resistances R1 to R8 change in the opposite direction.
- the detection circuit 1001 applies a voltage between a pair of opposing connection points Vdd and GND and detects a voltage between another pair of connection points Vz1 and Vz2 By doing this, acceleration in the Z-axis direction can be detected.
- the detection circuit 1001 can also detect acceleration in the same way even if the strain resistance that changes in the same manner is bridge-connected so as to be different from FIGS. 3D to 3F.
- FIG. 4 shows the output fluctuation of the acceleration sensor 20 when an impact is applied.
- a characteristic 41 indicates the output of the acceleration sensor 20 in the first embodiment
- a characteristic 42 indicates the output of the conventional acceleration sensor 1 shown in FIG.
- the outputs of both the characteristics 41 and 42 are 0 G.
- the outputs of both the characteristics 41 and 42 are approximately 1 G.
- the output of the characteristic 42 is 9 G while the output of the characteristic 41 is almost 1 G without being affected by the impact.
- acceleration sensor 20 in the first embodiment has a cantilever beam structure in which weight portions 27 to 30 are supported from only one direction, so transition to a different buckling mode does not occur even if an impact is applied. The acceleration can be accurately detected without fluctuation of the output.
- FIGS. 5A and 5B respectively show the time-dependent changes of the sensitivity of the conventional acceleration sensor 1 as a comparative example and the sensitivity of the acceleration sensor 20 according to the first embodiment.
- the sensitivity of the conventional acceleration sensor 1 changes with time, and changes of up to 3%. This change is due to the residual stress accumulated in the beam portions 4, 5, 6, 7 of the acceleration sensor 1 being released with time and transitioning to different buckling modes.
- the acceleration sensor 20 according to the first embodiment has a maximum change in sensitivity of ⁇ 0.2% even if the same time has elapsed. Since the acceleration sensor 20 has a cantilever structure in which the weight portions 27 to 30 are supported only in one direction, the influence of the release of the residual stress on the sensitivity is small.
- FIG. 6 is a top view of still another acceleration sensor 70 according to the first embodiment.
- the acceleration sensor 70 further includes beams 71 and 72 extending from the frame 22 to the hollow area 21.
- Each of the beam portions 71 and 72 has one end connected to the frame portion 22 and the other end on the opposite side.
- the other ends of the beam portions 71 and 72 are free ends which are not connected anywhere.
- the beam portions 71 are provided between the beam portions 25, and the beam portions 72 are provided between the beam portions 26.
- the detection units 38A and 38B respectively configured by the strain resistances R9 and R10 are provided not on the frame portion 22 but on the beam portions 71 and 72, respectively.
- the frame portion 22 is fixed to the substrate 1002
- stress is applied to the frame portion 22, and stress is accumulated in the detection portions 38A and 38B made of strain resistances R9 and R10.
- the stress accumulated in the strain resistances R9 and R10 is released as it is used.
- acceleration in the direction of the Z axis may not be detected with high accuracy.
- the acceleration sensor 70 shown in FIG. 6 no stress is generated in the beam portions 71 and 72 respectively having the other end which is a free end. Therefore, a detecting portion including strain resistances R9 and R10 provided on the beam portions 71 and 72 Stress does not act on 38A and 38B. Therefore, the sensitivity to acceleration in the direction of the Z axis of the acceleration sensor 70 does not change with time.
- FIG. 7 is a top view of still another acceleration sensor 70A in the first embodiment.
- the electrode pads 37 connected to the strain resistances R1 to R10 are arranged along the four sides of the frame 22 having a rectangular shape.
- the electrode pads 37 connected to the strain resistances R1 to R10 are disposed along only a pair of two sides facing each other among the four sides of the rectangular frame 22. They are not provided along the other two sides of the four sides facing each other.
- the acceleration sensor 70A when the acceleration sensor 70A is mounted on a package in which the terminals are arranged along only two opposing sides, the bonding wires connected from those terminals to the electrode pad 37 can be shortened, which causes distortion. The noise added to the signals output from the resistors R1 to R10 can be reduced.
- FIG. 8 is a top view of still another acceleration sensor 70C in the first embodiment.
- the same parts as those of the acceleration sensor 20 shown in FIG. 1 are denoted by the same reference numerals.
- the beam portions 23 and 25 extend from the frame portion 22 toward the hollow area 21 in the positive direction of the X axis.
- Beams 24 and 26 extend from frame 22 toward hollow region 21 in the negative direction of the X axis.
- the weight portions 27 and 28 are arranged in the direction of the X axis.
- the weight portions 29 and 30 are arranged in the direction of the X axis.
- the weight portions 27 and 29 are arranged in the direction of the Y axis.
- the weight portions 28, 30 are arranged in the direction of the Y-axis.
- the weight portions 27 to 30 are displaced by the acceleration in the directions of the X axis and the Z axis, but are hardly displaced by the acceleration in the direction of the Y axis. Therefore, the acceleration sensor 70C can suppress the sensitivity of the acceleration in the Y-axis direction while securing high sensitivity to the acceleration in the X-axis and Z-axis directions.
- FIG. 9 is a top view of still another acceleration sensor 70D in the first embodiment.
- the weight portions 29, 30 are smaller than the weight portions 27, 28.
- Accelerations in the direction of the X-axis are detected by detection units 31 and 32 provided on beams 23 and 24 respectively connected to weights 27 and 28, and beams 25 and 26 connected to weights 29 and 30 are detected.
- An acceleration in the direction of the Z-axis is detected by the detection units 33 and 34 provided.
- Weights 27 to 30 are displaced largely by acceleration in the direction of Z-axis from the direction of X-axis. Therefore, acceleration to the direction of X-axis in acceleration sensor 70C shown in FIG.
- weights 27 to 30 have the same size
- the sensitivity is lower than the sensitivity to acceleration in the direction of the Z axis.
- the weight portions 29, 30 for detecting the acceleration in the Z-axis direction are smaller than the weight portions 27, 28 for detecting the acceleration in the X-axis direction.
- the sensitivity to acceleration in the direction can be made the same as the sensitivity to acceleration in the direction of the Z-axis.
- FIG. 10 is a top view of the acceleration sensor 50 according to the second embodiment.
- the acceleration sensor 50 includes a frame 52 having a hollow area 51 formed therein, beams 53 and 54 connected to the frame 52 and extended to the hollow area 51, and weights connected to the beams 53 and 54, respectively. It comprises the parts 55, 56 and the detection parts 57, 58 provided on the beam parts 53, 54 respectively. One end of each of the beam portions 53 and 54 is connected to the frame 52.
- the weight portions 55, 56 are connected to the other ends of the beam portions 53, 54, respectively. Further, the weight 55 and the weight 56 face each other.
- the frame portion 52 has a rectangular shape having four sides 52A to 52D.
- the sides 52A and 52C face each other via the hollow area 51, and the sides 52B and 52D face each other via the hollow area 51.
- Beams 53 and 54 are connected to sides 52A and 52C, respectively.
- the electrode pad 59 is provided on the side 52A to which the beam 53 is connected, and the electrode pad 60 is provided on the side 52C to which the beam 54 is connected.
- the beam portions 53, 54 extend in the hollow area 51 along a predetermined axis 50D.
- One end of each of the beam portions 53 and 54 is connected to the central portion of the frame portion 52, that is, to the mutually opposite portion across the central portion 51C of the hollow region 51.
- the weight parts 55, 56 are opposed along a predetermined axis 50D.
- the area of the gap portion 51B not occupied by the weight portions 55 and 56 and the beam portions 53 and 54 is smaller than the sum of the areas of the upper surfaces of the weight portions 55 and 56.
- the combined shape of the weight portions 55 and 56 is similar to the shape of the hollow area 51.
- the thickness of the beam portions 53 and 54 is smaller than the thickness of the frame portion 52 and smaller than the thickness of the weight portions 55 and 56.
- FIG. 11 is a top view of the acceleration sensor 110 according to the third embodiment of the present invention.
- the acceleration sensor 110 fixes the fixing portion 111 provided at the origin P0, the flexible portion 112 whose one end is connected to the fixing portion 111, and A flexible portion 113 whose one end is connected to the portion 111, a flexible portion 114 whose one end is connected to the fixed portion 111, a flexible portion 115 whose one end is connected to the fixed portion 111, flexible portions 112 and 113 , 114, 115 and strain resistors 116, 117, 118, 119, respectively.
- the flexible portion 112 extends from the fixing portion 111 in the positive direction of the X axis.
- the flexible portion 113 extends from the fixing portion 111 in the negative direction of the X axis.
- the flexible portion 114 extends from the fixed portion 111 in the positive direction of the Y axis.
- the flexible portion 115 extends from the fixed portion 111 in the negative direction of the Y axis.
- the fixing portion 111 is configured to be fixed to the substrate 1110.
- acceleration in the X-axis direction is detected based on the resistance values of the strain resistor 116 and the strain resistor 117
- acceleration in the Y-axis direction is detected based on the resistance values of the strain resistor 118 and the strain resistor 119. It can be detected.
- the strain resistors 116, 117, 118 and 119 are provided on connection points 121, 122, 123 and 124 to which the flexible portions 112, 113, 114 and 115 and the fixed portion 111 are respectively connected. There is.
- the fixed portion 111 supports the flexible portions 112 to 115 and is fixed to the support substrate or the control IC on the lower surface.
- the flexible portion 112 is composed of a beam portion 112A and a weight portion 112B. One end of the beam portion 112A is connected to the fixing portion 111, and the other end is connected to the weight portion 112B.
- the weight portion 112B has substantially the same thickness as the fixing portion 111, but the beam portion 112A is thinner than the weight portion 112B and the fixing portion 111. Thus, the beam portion 112A is easily bent with respect to the acceleration in the X-axis direction, and the detection sensitivity can be improved.
- the flexible portion 113 includes a beam portion 113A and a weight portion 113B. One end of the beam portion 113A is connected to the fixing portion 111, and the other end is connected to the weight portion 113B.
- the weight portion 113B has substantially the same thickness as the fixing portion 111, but the beam portion 113A is thinner than the weight portion 113B and the fixing portion 111. Accordingly, the beam portion 113A is easily bent with respect to the acceleration in the X-axis direction, and the detection sensitivity can be improved.
- the flexible portion 114 is composed of a beam portion 114A and a weight portion 114B. One end of the beam portion 114A is connected to the fixing portion 111, and the other end is connected to the weight portion 114B.
- the weight portion 114B has substantially the same thickness as the fixing portion 111, but the beam portion 114A is thinner than the weight portion 114B and the fixing portion 111.
- the flexible portion 115 is composed of a beam portion 115A and a weight portion 115B. One end of the beam portion 115A is connected to the fixing portion 111, and the other end is connected to the weight portion 115B.
- the weight portion 115B has substantially the same thickness as the fixing portion 111, but the beam portion 115A is thinner than the weight portion 115B and the fixing portion 111.
- the beam portion 115A is easily bent with respect to the acceleration in the Y-axis direction, and the detection sensitivity can be improved.
- the fixed portion 111 and the flexible portions 112 to 115 can be formed using, for example, a non-piezoelectric material such as silicon (Si) or stainless steel, or a piezoelectric material such as quartz crystal or lithium niobate.
- a Silikon-On-Insulator (SOI) substrate composed of an active layer, an intermediate oxide film and a base layer is used. By using the SOI substrate, the base layer and the intermediate oxide film can be removed from the back surface by etching to easily form the beam portions 112A to 115A.
- the strain resistors 116 to 119 are formed of a material such as constantan (copper, nickel alloy), diamond, chromium oxide, aluminum nitride, or the like whose electric resistance changes according to strain. These materials are deposited on the surface of the active layer of the SOI substrate to form a thin film, and then the desired pattern is formed by etching from the surface.
- the weight portion 112B When acceleration is applied to the acceleration sensor 110 in the positive direction of the X axis, the weight portion 112B is displaced in the negative direction of the Z axis, and the flexible portion 112 is bent in the negative direction of the Z axis. The resistance value of the strain resistor 116 provided on the flexible portion 112 is increased.
- the weight portion 113B is displaced in the positive direction of the Z-axis, and the flexible portion 113 bends in the positive direction of the Z-axis, whereby the resistance value of the strain resistor 117 provided on the flexible portion 113 decreases.
- the resistance value of the strain resistor 116 decreases, and the resistance value of the strain resistor 117 increases.
- the detection circuit electrically connected to the strain resistors 116 and 117 can detect the acceleration in the X-axis direction based on the ratio of the resistance value of the strain resistor 116 to the resistance value of the strain resistor 117.
- the weight portion 114B When acceleration is applied to the acceleration sensor 110 in the positive direction of the Y axis, the weight portion 114B is displaced in the negative direction of the Z axis, and the flexible portion 114 is bent in the negative direction of the Z axis.
- the resistance value of the strain resistor 118 provided on the flexible portion 114 is increased.
- the weight portion 115B is displaced in the positive direction of the Z axis, and the flexible portion 115 is bent in the positive direction of the Z axis, whereby the resistance value of the strain resistor 119 provided on the flexible portion 115 decreases.
- the resistance value of the strain resistor 118 decreases, and the resistance value of the strain resistor 119 increases.
- the detection circuit electrically connected to the strain resistors 118 and 119 can detect the acceleration in the Y-axis direction based on the ratio of the resistance value of the strain resistor 118 to the resistance value of the strain resistor 119.
- FIG. 12 is a diagram showing a temperature characteristic P110 of the acceleration sensor 110. As shown in FIG. FIG. 12 also shows the temperature characteristic P101 of the conventional acceleration sensor 101 shown in FIG. In FIG. 12, the horizontal axis indicates the temperature, and the vertical axis indicates the value of the acceleration in the X-axis direction (hereinafter referred to as 0 point output) output by the acceleration sensors 101 and 110 in the state where acceleration is not applied.
- the output at a temperature of ⁇ 40 ° C. is ⁇ 1.24 G
- the output at a temperature of + 140 ° C. is +1.53 G.
- the output at a temperature of -40.degree. C. is +0.02 G, and the output is +0.08 G at a temperature of + 140.degree.
- Zero-point fluctuation amounts D101 and D110 which are fluctuation amounts of zero-point output in a temperature range of ⁇ 40 ° C. to 140 ° C., are defined. While the zero point fluctuation amount D101 of the temperature characteristic P101 of the conventional acceleration sensor 101 is 2.77 G, the zero point fluctuation amount D110 of the temperature characteristic P110 of the acceleration sensor 110 in the third embodiment is 0.11 G. There is. As described above, the zero point fluctuation amount D110 of the acceleration sensor 110 according to the third embodiment is significantly smaller than the zero point fluctuation amount D101 of the conventional acceleration sensor 101 and is improved. The reason is described below.
- a material of the strain resistor is deposited on a substrate such as an SOI substrate to form a thin film. It is very difficult to form the film thickness and film structure of the thin film completely uniformly, and there are variations in film thickness and film structure within the surface of the substrate.
- the strain resistor 105 and the strain resistor are caused due to the dispersion of the thin film in the surface of the substrate. A difference of 106 characteristics occurs.
- the detection circuit detects the acceleration based on the difference between the resistance values of the strain resistors 105 and 106, so that a zero point output occurs.
- the temperature dependency of the resistance value of the strain resistor 105 and that of the strain resistor 106 are different, the amount of zero point fluctuation is large.
- the strain resistances 116 to 119 are provided so as to include connection points 121 to 124 between the flexible portions 112 to 115 and the fixed portion 111.
- the strain resistors 116 to 119 are close to each other. Therefore, variations in the film thickness and film structure of the thin film to be the strain resistors 116 to 119 on the surface of the substrate become relatively small, and variations in the resistance value of the strain resistors 116 to 119 become small. The difference in temperature dependence also decreases. As a result, in the acceleration sensor 110 according to the third embodiment, the zero point output and the zero point fluctuation amount are smaller than in the conventional acceleration sensor 101.
- the conventional acceleration sensor 101 is fixed to a control IC or the like which constitutes a support substrate or a detection circuit on the lower surface of the frame portion 102.
- a control IC or the like which constitutes a support substrate or a detection circuit on the lower surface of the frame portion 102.
- the fixing portion 111 is fixed to the supporting substrate or the control IC or the like constituting the detection circuit at one point on the lower surface side. Aging is reduced.
- FIG. 13 is a top view of another acceleration sensor 110A in the third embodiment.
- the acceleration sensor 110A includes a frame portion 125 having a hollow region 127 inside, and the fixing portion 111 and the flexible portions 112 to 115 are formed in the hollow region 127. Further, a connecting portion 126 for connecting the fixing portion 111 and the frame portion 125 is provided. With this configuration, it is possible to provide an electrode pad on the frame portion 125 to connect to the control IC or to bond the upper lid.
- FIG. 14 is a top view of still another acceleration sensor 110B in the third embodiment.
- the hollow area 127 of the acceleration sensor 110B has a rectangular shape.
- the four rectangular corners 127A, 127B, 127C, and 127D of the hollow area 127 approach the central portions of the four sides 125A, 125B, 125C, and 125D of the frame portion 125, respectively.
- the distance between the fixing portion 111 and the frame portion 125 is shortened, so that the length of the connecting portion 126 can be shortened.
- the shock resistance of the acceleration sensor 110B can be improved.
- FIG. 15 is a top view of still another acceleration sensor 110C in the third embodiment.
- the acceleration sensor 110 ⁇ / b> C includes four connection parts 126, and the four connection parts 126 are connected to the corner of the frame part 125 respectively.
- the flexible portions 112 to 115 are respectively disposed in four regions 128A to 128D formed by the frame portion 125 and the four connecting portions 126. With this configuration, the flexible portions 112 to 115 and the frame portion 125 can be fixed to the fixing portion 111 symmetrically with respect to the axis A10 parallel to the X axis and the axis B10 parallel to the Y axis.
- the flexible portions 114 and 115 do not easily bend with respect to acceleration in the X-axis direction, and the flexible portions 112 and 113 do not easily bend with respect to acceleration in the Y-axis direction. Therefore, sensitivity to acceleration in the direction of the other axis of the acceleration sensor 110C Can be suppressed.
- FIG. 16 is a top view of still another acceleration sensor 110D in the third embodiment.
- the shapes of the weight portions 129A, 129B, 129C, and 129D are substantially similar to the shapes of the regions 128A, 128B, 128C, and 128D surrounded by the frame portion 125, the connecting portion 126, and the fixing portion 111.
- the weight portions 129A, 129B, 129C, and 129D can be increased without increasing the size of the frame portion 125, and the downsizing and high sensitivity of the acceleration sensor 110D can be achieved.
- FIG. 17 is a top view of still another acceleration sensor 110E according to the third embodiment.
- corner portions of regions 128A, 128B, 128C, and 128D surrounded by the frame portion 125, the connecting portion 126, and the fixing portion 111 are close to central portions of four sides of the frame portion 125, respectively.
- the shapes of the weight portions 129A, 129B, 129C, 129D are substantially similar to the shapes of the regions 128A, 128B, 128C, 128D.
- the electrode pad 130 is provided at the corner of the frame portion 125.
- the electrode pads 130 are electrically connected to the strain resistors 116 to 119 by the wires 131, respectively.
- the electrode pad 130 is electrically connected to a control IC that constitutes a detection circuit by wire bonding or the like.
- the electrode pad 130 is formed near the center of each side of the frame portion 125.
- the width of each side of the frame portion 125 is set to form the electrode pad 130. It is necessary to increase the size of the acceleration sensor 110E. By providing the electrode pad 130 at the corner of the frame portion 125, the acceleration sensor 110E can be miniaturized.
- FIG. 18 is a top view of still another acceleration sensor 110F in the third embodiment.
- the weight portion 112B of the flexible portion 112 of the acceleration sensor 110F is connected to the fixed portion 111 by two beam portions 132 and 133.
- the flexible portions 113, 114, and 115 the respective weights are connected to the fixed portion 111 by two beam portions.
- the acceleration sensor according to the present invention can suppress variations in sensitivity and changes with time of the sensitivity, and therefore is useful as an acceleration sensor used for vehicles, portable terminals, and the like.
- acceleration sensor 21 hollow area 22 frame 23 beam (first beam) 24 Beam (second beam) 25 Beam (3rd beam) 26 Beam (4th beam) 27 weight (first weight) 28 weight (second weight) 29 Weight (3rd weight) 30 weight (4th weight) 31 detection unit (first detection unit) 32 detection unit (second detection unit) 33 Detection unit (third detection unit) 34 Detector (fourth detector) 35 acceleration sensor 38A detection unit 38B detection unit 50 acceleration sensor 50D predetermined axis 51 hollow region 51C central portion 52 frame portion 53 beam portion (first beam portion) 54 Beam (second beam) 55 weight (first weight) 56 weight (second weight) 57 Detection unit (first detection unit) 58 Detection unit (second detection unit) 70 acceleration sensor 70A acceleration sensor 70C acceleration sensor 70D acceleration sensor 91A central portion
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Abstract
Description
図1は実施の形態1における加速度センサ20の上面図である。加速度センサ20は、内部に中空領域21が形成された枠部22と、枠部22にそれぞれ一端が接続された梁部23、24、25、26と、梁部23、24、25、26の他端にそれぞれ接続された錘部27、28、29、30と、梁部23、24、25、26の上にそれぞれ設けられた検出部31、32、33、34とを備えている。梁部23、24、25、26は枠部22から中空領域21に延伸する。また、錘部27と錘部28とがX軸の方向で中空領域21の中心部91Aを介して互いに対向し、錘部29と錘部30とがY軸の方向で中心部91Aを介して互いに対向している。枠部22が基板1002に固定されることにより、加速度センサ20は基板1002に固定されるように構成されている。錘部27、28、29、30は梁部23、24、25、26でのみ枠部22に接続されている。
図10は実施の形態2における加速度センサ50の上面図である。加速度センサ50は、内部に中空領域51が形成された枠部52と、枠部52に接続されて中空領域51に延伸した梁部53、54と、梁部53、54にそれぞれ接続された錘部55、56と、梁部53、54上にそれぞれ設けられた検出部57、58とを備えている。梁部53、54のそれぞれの一端が枠部52に接続される。錘部55、56は梁部53、54のそれぞれの他端に接続されている。また、錘部55と錘部56とが対向している。
図11は本発明の実施の形態3における加速度センサ110の上面図である。加速度センサ110は、原点P0で互いに直交するX軸とY軸とを含むXY平面において、原点P0に設けられた固定部111と、固定部111に一端が接続された可撓部112と、固定部111に一端が接続された可撓部113と、固定部111に一端が接続された可撓部114と、固定部111に一端が接続された可撓部115と、可撓部112、113、114、115上にそれぞれ設けられた歪抵抗体116、117、118、119とを備えている。可撓部112は固定部111からX軸の正方向に延伸する。可撓部113は固定部111からX軸の負方向に延伸する。可撓部114は固定部111からY軸の正方向に延伸する。可撓部115は固定部111からY軸の負方向に延伸する。固定部111は基板1110に固定されるように構成されている。
21 中空領域
22 枠部
23 梁部(第1の梁部)
24 梁部(第2の梁部)
25 梁部(第3の梁部)
26 梁部(第4の梁部)
27 錘部(第1の錘部)
28 錘部(第2の錘部)
29 錘部(第3の錘部)
30 錘部(第4の錘部)
31 検出部(第1の検出部)
32 検出部(第2の検出部)
33 検出部(第3の検出部)
34 検出部(第4の検出部)
35 加速度センサ
38A 検出部
38B 検出部
50 加速度センサ
50D 所定の軸
51 中空領域
51C 中心部
52 枠部
53 梁部(第1の梁部)
54 梁部(第2の梁部)
55 錘部(第1の錘部)
56 錘部(第2の錘部)
57 検出部(第1の検出部)
58 検出部(第2の検出部)
70 加速度センサ
70A 加速度センサ
70C 加速度センサ
70D 加速度センサ
91A 中心部
Claims (9)
- 内部に中空領域が形成された枠部と、
前記枠部に接続された一端と、前記一端の反対側の他端とをそれぞれ有し、前記中空領域に延伸した第1、第2、第3、第4の梁部と、
前記第1、第2、第3、第4の梁部の前記他端にそれぞれ接続された第1、第2、第3、第4の錘部と、
前記第1、第2、第3、第4の梁部にそれぞれ設けられた第1、第2、第3、第4の検出部と、
を備え、
前記第1の梁部と前記第2の梁部の前記一端は、前記中空領域を挟んで互いに反対側の部分にそれぞれ接続され、
前記第1の錘部と前記第2の錘部とは前記中空領域の中心部を挟んで対向し、
前記第3の梁部と前記第4の梁部の前記一端は、前記中空領域を挟んで互いに反対側の部分にそれぞれ接続され、
前記第3の錘部と前記第4の錘部とは前記中空領域の前記中心部を挟んで対向した、加速度センサ。 - 前記第1、第2、第3、第4の錘部はそれぞれ凸部を有し、
前記第1の錘部の凸部と前記第2の錘部の凸部とが前記中空領域の前記中心部を挟んで対向し、
前記第3の錘部の凸部と前記第4の錘部の凸部とが前記中空領域の前記中心部を挟んで対向した、請求項1に記載の加速度センサ。 - 前記中空領域において、前記第1、第2、第3、第4の錘部及び前記第1、第2、第3、第4の梁部で占められていない間隙部の面積は、前記第1、第2、第3、第4の錘部の上面の面積の総和よりも小さい、請求項1に記載の加速度センサ。
- 前記第1、第2、第3、第4の錘部を合わせた形状は、前記中空領域の形状と相似である、請求項1に記載の加速度センサ。
- 前記第1、第2、第3、第4の梁部の厚みは前記枠部の厚みよりも小さく、かつ、前記第1、第2、第3、第4の錘部の厚みよりも小さい、請求項1に記載の加速度センサ。
- 内側に中空領域が形成された枠部と、
前記枠部に接続された一端と前記一端の反対側の他端とをそれぞれ有し、前記中空領域に所定の軸に沿って延伸した第1、第2の梁部と、
前記第1、第2の梁部の前記他端にそれぞれ接続された第1、第2の錘部と、
前記第1、第2の梁部にそれぞれ設けられた第1、第2の検出部と、
を備え、
前記第1の梁部と前記第2の梁部の前記一端は前記枠部の中心部を挟んで互いに反対側の部分にそれぞれ接続され、
前記第1の錘部と前記第2の錘部とは前記所定の軸に沿って対向した、加速度センサ。 - 前記中空領域において、前記第1、第2の錘部及び前記第1、第2の梁部で占められていない間隙部の面積は、前記第1、第2の錘部の上面の面積の総和よりも小さい、請求項6に記載の加速度センサ。
- 前記第1、第2の錘部を合わせた形状は、前記中空領域の形状と相似である、請求項6に記載の加速度センサ。
- 前記第1、第2の梁部の厚みは前記枠部の厚みよりも小さく、かつ、前記第1、第2の錘部の厚みよりも小さい、請求項6に記載の加速度センサ。
Priority Applications (3)
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US13/996,876 US20130283914A1 (en) | 2011-01-20 | 2012-01-20 | Acceleration sensor |
JP2012553638A JP5845447B2 (ja) | 2011-01-20 | 2012-01-20 | 加速度センサ |
EP12736604.5A EP2667202B1 (en) | 2011-01-20 | 2012-01-20 | Acceleration sensor |
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JP2011009632 | 2011-01-20 | ||
JP2011-009632 | 2011-04-26 | ||
JP2011119987 | 2011-05-30 | ||
JP2011-119987 | 2011-05-30 |
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EP (1) | EP2667202B1 (ja) |
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CN113933538A (zh) * | 2021-09-18 | 2022-01-14 | 重庆邮电大学 | 一种压阻式高g值加速度计 |
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CN110389237B (zh) * | 2019-07-17 | 2021-01-15 | 西安交通大学 | 一种面内双轴加速度传感器芯片及其制备方法 |
CN110371921B (zh) * | 2019-07-17 | 2022-04-05 | 西安交通大学 | 一种面内双轴压阻加速度传感器芯片及其制备方法 |
CN112611489A (zh) * | 2020-12-21 | 2021-04-06 | 陕西电器研究所 | 一种基于薄膜溅射的抗过载扭矩传感器 |
KR102505956B1 (ko) * | 2021-10-14 | 2023-03-03 | 국방과학연구소 | 가속도 센서 |
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EP2667202A1 (en) | 2013-11-27 |
EP2667202A4 (en) | 2014-02-05 |
US20130283914A1 (en) | 2013-10-31 |
JP5845447B2 (ja) | 2016-01-20 |
EP2667202B1 (en) | 2019-05-08 |
JPWO2012098901A1 (ja) | 2014-06-09 |
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