WO2012094102A3 - Pressure controlled polishing platen - Google Patents
Pressure controlled polishing platen Download PDFInfo
- Publication number
- WO2012094102A3 WO2012094102A3 PCT/US2011/064396 US2011064396W WO2012094102A3 WO 2012094102 A3 WO2012094102 A3 WO 2012094102A3 US 2011064396 W US2011064396 W US 2011064396W WO 2012094102 A3 WO2012094102 A3 WO 2012094102A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- platen
- pressure controlled
- polishing platen
- controlled polishing
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180010227.9A CN102884612B (en) | 2011-01-03 | 2011-12-12 | Pressure controlled polishing platen |
JP2013547510A JP2014501455A (en) | 2011-01-03 | 2011-12-12 | Pressure controlled polishing platen |
KR1020127021056A KR101941586B1 (en) | 2011-01-03 | 2011-12-12 | Pressure controlled polishing platen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161429422P | 2011-01-03 | 2011-01-03 | |
US61/429,422 | 2011-01-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012094102A2 WO2012094102A2 (en) | 2012-07-12 |
WO2012094102A3 true WO2012094102A3 (en) | 2012-10-04 |
Family
ID=46381147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2011/064396 WO2012094102A2 (en) | 2011-01-03 | 2011-12-12 | Pressure controlled polishing platen |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120171933A1 (en) |
JP (1) | JP2014501455A (en) |
KR (1) | KR101941586B1 (en) |
CN (1) | CN102884612B (en) |
WO (1) | WO2012094102A2 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014099812A1 (en) * | 2012-12-18 | 2014-06-26 | Sunedison, Inc. | Double side polisher with platen parallelism control |
US9358658B2 (en) | 2013-03-15 | 2016-06-07 | Applied Materials, Inc. | Polishing system with front side pressure control |
US9751189B2 (en) | 2014-07-03 | 2017-09-05 | Applied Materials, Inc. | Compliant polishing pad and polishing module |
US10207389B2 (en) | 2014-07-17 | 2019-02-19 | Applied Materials, Inc. | Polishing pad configuration and chemical mechanical polishing system |
TWI692385B (en) * | 2014-07-17 | 2020-05-01 | 美商應用材料股份有限公司 | Method, system and polishing pad for chemical mechancal polishing |
US10076817B2 (en) | 2014-07-17 | 2018-09-18 | Applied Materials, Inc. | Orbital polishing with small pad |
US10105812B2 (en) | 2014-07-17 | 2018-10-23 | Applied Materials, Inc. | Polishing pad configuration and polishing pad support |
CN106463384B (en) * | 2014-07-18 | 2020-03-17 | 应用材料公司 | Modifying a substrate thickness profile |
US9662762B2 (en) | 2014-07-18 | 2017-05-30 | Applied Materials, Inc. | Modifying substrate thickness profiles |
CN104369087B (en) * | 2014-10-21 | 2016-09-07 | 青岛橡胶谷知识产权有限公司 | A kind of compress control method of grinder pneumatic servo |
US9873179B2 (en) | 2016-01-20 | 2018-01-23 | Applied Materials, Inc. | Carrier for small pad for chemical mechanical polishing |
KR102535628B1 (en) | 2016-03-24 | 2023-05-30 | 어플라이드 머티어리얼스, 인코포레이티드 | Textured small pad for chemical mechanical polishing |
US20190061098A1 (en) * | 2016-04-01 | 2019-02-28 | Joon Mo Kang | Carrier head for chemical mechanical polishing apparatus comprising substrate receiving member |
KR101900472B1 (en) * | 2016-10-11 | 2018-09-20 | 연세대학교 산학협력단 | Stretchable conductive fiber and method of manufacturing the same |
CN109732472A (en) * | 2017-10-31 | 2019-05-10 | 上海新昇半导体科技有限公司 | Polissoir and method |
US11890717B2 (en) | 2018-12-26 | 2024-02-06 | Applied Materials, Inc. | Polishing system with platen for substrate edge control |
JP7290140B2 (en) * | 2020-09-09 | 2023-06-13 | 株式会社Sumco | Wafer polishing method and wafer polishing apparatus |
DE102021103709A1 (en) * | 2021-02-17 | 2022-08-18 | Lapmaster Wolters Gmbh | Double or single side processing machine |
US11919120B2 (en) | 2021-02-25 | 2024-03-05 | Applied Materials, Inc. | Polishing system with contactless platen edge control |
US20220305613A1 (en) * | 2021-03-26 | 2022-09-29 | Applied Materials, Inc. | Controlled profile polishing platen |
CN116533127B (en) * | 2023-07-06 | 2023-10-31 | 浙江晶盛机电股份有限公司 | Polishing pressure adjusting method, polishing pressure adjusting device, computer equipment and storage medium |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020142704A1 (en) * | 2001-03-28 | 2002-10-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using |
US20040238493A1 (en) * | 2001-12-20 | 2004-12-02 | Lam Research Corporation | Method for chemical mechanical planarization |
US7018273B1 (en) * | 2003-06-27 | 2006-03-28 | Lam Research Corporation | Platen with diaphragm and method for optimizing wafer polishing |
US20060094341A1 (en) * | 2004-10-29 | 2006-05-04 | Gunter Schneider | Polishing tool with several pressure zones |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5961372A (en) * | 1995-12-05 | 1999-10-05 | Applied Materials, Inc. | Substrate belt polisher |
US5980368A (en) * | 1997-11-05 | 1999-11-09 | Aplex Group | Polishing tool having a sealed fluid chamber for support of polishing pad |
JPH11307486A (en) * | 1998-04-23 | 1999-11-05 | Toshiba Corp | Cmp method and cmp equipment used in the method |
US6126527A (en) * | 1998-07-10 | 2000-10-03 | Aplex Inc. | Seal for polishing belt center support having a single movable sealed cavity |
US6186877B1 (en) * | 1998-12-04 | 2001-02-13 | International Business Machines Corporation | Multi-wafer polishing tool |
US6135859A (en) * | 1999-04-30 | 2000-10-24 | Applied Materials, Inc. | Chemical mechanical polishing with a polishing sheet and a support sheet |
JP4402228B2 (en) * | 1999-12-21 | 2010-01-20 | パナソニック株式会社 | Polishing tool, polishing apparatus and polishing method |
US6358118B1 (en) * | 2000-06-30 | 2002-03-19 | Lam Research Corporation | Field controlled polishing apparatus and method |
US20020081945A1 (en) * | 2000-12-21 | 2002-06-27 | Rod Kistler | Piezoelectric platen design for improving performance in CMP applications |
US6776695B2 (en) * | 2000-12-21 | 2004-08-17 | Lam Research Corporation | Platen design for improving edge performance in CMP applications |
US6607425B1 (en) * | 2000-12-21 | 2003-08-19 | Lam Research Corporation | Pressurized membrane platen design for improving performance in CMP applications |
US6561870B2 (en) * | 2001-03-30 | 2003-05-13 | Lam Research Corporation | Adjustable force applying air platen and spindle system, and methods for using the same |
US6656024B1 (en) * | 2001-12-21 | 2003-12-02 | Lam Research Corporation | Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization |
US6749491B1 (en) * | 2001-12-26 | 2004-06-15 | Lam Research Corporation | CMP belt stretch compensation apparatus and methods for using the same |
US6769970B1 (en) * | 2002-06-28 | 2004-08-03 | Lam Research Corporation | Fluid venting platen for optimizing wafer polishing |
JP2004160573A (en) * | 2002-11-11 | 2004-06-10 | Ebara Corp | Polishing device |
US6752898B1 (en) * | 2002-12-20 | 2004-06-22 | Lam Research Corporation | Method and apparatus for an air bearing platen with raised topography |
US7025660B2 (en) * | 2003-08-15 | 2006-04-11 | Lam Research Corporation | Assembly and method for generating a hydrodynamic air bearing |
US20090305610A1 (en) * | 2008-06-06 | 2009-12-10 | Applied Materials, Inc. | Multiple window pad assembly |
US8337279B2 (en) * | 2008-06-23 | 2012-12-25 | Applied Materials, Inc. | Closed-loop control for effective pad conditioning |
US7749052B2 (en) * | 2008-09-08 | 2010-07-06 | Applied Materials, Inc. | Carrier head using flexure restraints for retaining ring alignment |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
-
2011
- 2011-12-12 WO PCT/US2011/064396 patent/WO2012094102A2/en active Application Filing
- 2011-12-12 KR KR1020127021056A patent/KR101941586B1/en active IP Right Grant
- 2011-12-12 CN CN201180010227.9A patent/CN102884612B/en active Active
- 2011-12-12 JP JP2013547510A patent/JP2014501455A/en active Pending
- 2011-12-13 US US13/324,285 patent/US20120171933A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020142704A1 (en) * | 2001-03-28 | 2002-10-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using |
US20040238493A1 (en) * | 2001-12-20 | 2004-12-02 | Lam Research Corporation | Method for chemical mechanical planarization |
US7018273B1 (en) * | 2003-06-27 | 2006-03-28 | Lam Research Corporation | Platen with diaphragm and method for optimizing wafer polishing |
US20060094341A1 (en) * | 2004-10-29 | 2006-05-04 | Gunter Schneider | Polishing tool with several pressure zones |
Also Published As
Publication number | Publication date |
---|---|
CN102884612B (en) | 2017-02-15 |
KR101941586B1 (en) | 2019-01-23 |
US20120171933A1 (en) | 2012-07-05 |
KR20140001733A (en) | 2014-01-07 |
JP2014501455A (en) | 2014-01-20 |
CN102884612A (en) | 2013-01-16 |
WO2012094102A2 (en) | 2012-07-12 |
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