WO2012074255A2 - Apparatus for recovering precious metals and components from pcb substrate and recovering method using same - Google Patents

Apparatus for recovering precious metals and components from pcb substrate and recovering method using same Download PDF

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Publication number
WO2012074255A2
WO2012074255A2 PCT/KR2011/009121 KR2011009121W WO2012074255A2 WO 2012074255 A2 WO2012074255 A2 WO 2012074255A2 KR 2011009121 W KR2011009121 W KR 2011009121W WO 2012074255 A2 WO2012074255 A2 WO 2012074255A2
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WO
WIPO (PCT)
Prior art keywords
pcb substrate
rotating
unit
pcb
valuable metal
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PCT/KR2011/009121
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French (fr)
Korean (ko)
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WO2012074255A3 (en
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박준식
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한밭대학교 산학협력단
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Publication of WO2012074255A2 publication Critical patent/WO2012074255A2/en
Publication of WO2012074255A3 publication Critical patent/WO2012074255A3/en

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/02—Obtaining noble metals by dry processes
    • C22B11/021—Recovery of noble metals from waste materials
    • C22B11/025—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper, or baths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Definitions

  • the present invention is to rotate the PCB board mounted electronic components through the rotating unit and at the same time to heat the PCB substrate through the heating unit to leave the electronic components and solder from the PCB substrate, valuable metal and parts recovery apparatus of the PCB substrate and using the same It relates to a recovery method.
  • the electronic scrap waste such as printed circuit boards and electronic components is generally composed of about 30 of the composition of polyethylene (PE), polypropylene (PP), polyester and polycarbonate in the overall composition.
  • % Plastic components and poorly soluble oxides such as silica, alumina and alkali-alkaline oxides are distributed in about 40%.
  • the above-mentioned precious metals exist in the semiconductor devices such as printed circuits, edge connectors, ICs, and transistors, which are disposed on the surface thereof.
  • Valuable precious metals on such printed circuit boards include Cu pins or terminals, Au and Pb coated on thin plates, Au bonding wires, Au and Ag pastes coated on Ni or Fe, mixed metals and alloys containing platinum group metals, and the like. It is formed in the same various forms and contains a relatively large amount of valuable metals.
  • Electronic scrap made of electronic components such as printed circuit boards of valuable metal printed on the printed circuit board itself, semiconductor devices such as integrated circuits (ICs) and transistors mounted on edge connectors and printed circuit boards (hereinafter referred to as electronic scrap).
  • the conventional pretreatment method before refining valuable metals to recover valuable metals by separating from the printed circuit board is as follows.
  • a general pretreatment method cuts a printed circuit board and an electronic scrap at the same time using a hammer mill or the like while the electronic scrap is placed and mounted on the printed circuit board without separating the electronic scrap from the printed circuit board.
  • the ball mill or the like is pulverized at the same time in a state in which the plastic component containing the valuable metal of the printed circuit board and the valuable metal component of the electronic scrap are mixed together.
  • plastic and valuable metal components are separated and sorted through complex stages of selection, and the selected valuable metal components are again selectively used as refining processes such as wet or dry concentrated smelting or electrochemical processes.
  • valuable metals such as precious metals such as Au, Ag, Pd, Cu, etc. are sorted, recovered, and recycled.
  • the conventional pretreatment method used up to now is a plastic component of the printed circuit board and a valuable metal component of the electronic scrap at the same time while the electronic scrap such as a printed circuit, a semiconductor device is mounted on the printed circuit board as it is. Since cutting and pulverizing method is used, a large amount of dust is generated in the process of cutting and crushing plastic components of printed circuit board during cutting and crushing.
  • the conventional treatment method as described above is subjected to a multi-step complex operation such as cutting, crushing, screening, incineration, and a large amount of pollutants such as dust or treated water is generated, causing environmental pollution.
  • a multi-step complex operation such as cutting, crushing, screening, incineration, and a large amount of pollutants such as dust or treated water is generated, causing environmental pollution.
  • pollutants such as dust or treated water is generated, causing environmental pollution.
  • pollution problems There are various problems such as pollution problems and poor working environment.
  • the printed circuit board is cut, shredded, and disposed of as it is, the recycling of the printed circuit board is hardly expected, resulting in a large amount of industrial waste and a waste of resources.
  • An object of the present invention is to rotate the PCB board mounted electronic components through the rotating part and at the same time to heat the PCB substrate through the heating part, the electronic component and solder can be separated from the PCB substrate to recover valuable metals without pollution, PCB substrate
  • the object of the present invention is to provide a valuable metal and parts recovery device and a method using the same.
  • Valuable metal and parts recovery apparatus of a PCB substrate for achieving the above object, the PCB is mounted on which the electronic component is mounted, the rotating portion to rotate through the external rotational power; A heating unit for heating the PCB board fixed to the interruption of the rotating unit; And a recovery part which is formed on the rotating part to which the PCB substrate is fixed and is separated and the electronic parts and solder are stored therein.
  • Valuable metal and component recovery apparatus of a PCB substrate for achieving the above object, the PCB is mounted on which the electronic component is mounted, the rotating portion is rotated;
  • a motor unit installed at the rotating unit to rotate the rotating unit;
  • a recovery unit formed in the rotating unit to which the PCB board is fixed, to store the separated electronic components and solder;
  • a heating unit for heating the PCB board fixed to the rotating unit.
  • the recovery method using the valuable metal and parts recovery apparatus of the PCB substrate according to the present invention for achieving the above object the first step of fixing the PCB substrate on which the electronic component is mounted to the rotating part; A second step of rotating the rotating unit in one direction; A third step of heating the rotated PCB substrate through a heating unit; And a fourth step of recovering the parts and solder on the PCB board heated by the heating unit through the recovery unit.
  • the valuable metal and component recovery apparatus of the PCB substrate according to the present invention configured as described above, while rotating the PCB substrate and heating the PCB substrate with a heating unit to separate the electronic components and solder on the PCB substrate using centrifugal force and heat. Since the energy consumption due to the melting of the PCB substrate is reduced, there is an advantage that the generation of pollution is reduced because the PCB is not melted.
  • FIG. 1 is an overall configuration diagram of a valuable metal and part recovery apparatus according to the present invention.
  • FIG. 2 is an overall configuration diagram of a valuable metal and part recovery apparatus according to an embodiment of the present invention.
  • FIG 3 is an enlarged view of a rotating part and a heating part according to an embodiment of the present invention.
  • FIG. 4 is a block diagram of a valuable metal and parts recovery apparatus according to another embodiment of the present invention.
  • FIG. 5 is a flow chart showing a valuable metal recovery method according to an embodiment of the present invention.
  • FIG. 1 is an overall configuration diagram of a valuable metal and parts recovery apparatus according to the present invention
  • Figure 2 is an overall configuration diagram of a valuable metal and parts recovery apparatus according to an embodiment of the present invention
  • Figure 3 is an enlarged portion of the rotating and heating The figure shown.
  • the present invention provides a rotating part 10 to which the PCB substrate 1 is fixed, a heating part 40 to heat the PCB substrate 1 fixed to the rotating part 10, and the PCB substrate ( 1) is formed on the rotating part 10 is fixed to the recovery part 13 is stored electronic components and solder is removed, and the motor unit 30 for rotating the rotating part 10 is configured.
  • the rotating unit 10 may not be directly rotated by the motor unit 30 but may be rotated through a predetermined power transmission means.
  • FIG. 1 may be configured as in the embodiment of FIG. 2.
  • the rotating part 10 is composed of an upper portion 11 and a lower portion 12, respectively, the PCB substrate 1 is fixed to the interruption of the upper and lower portions 11 and 12, the outside
  • the upper and lower parts 11 and 12 are respectively formed in the form of pneumatic cylinders so as to be connected to the pneumatics of the pneumatically operated pneumatically, and are conveyed upward and downward.
  • the upper and lower parts 11 and 12 are respectively transferred to the upper and lower sides by 10 to 20 mm, and are fixed by pressing with a force of 100 to 200 Kgf when fixing the PCB substrate 1.
  • the PCB board 1 may not be inserted. Beyond this insertion height can consume more energy and time than necessary.
  • the upper and lower parts 11 and 12 have a small force for fixing the PCB substrate 1, and thus the rotating part 10 when the rotating part 10 is rotated. ), There is a problem that can be separated between the upper and lower (11, 12).
  • the PCB substrate 1 may be damaged.
  • protruding fixing portions 14 are formed at portions in which lower and upper ends of the upper and lower portions 11 and 12 contact, respectively, such that the PCB substrate 1 is fixed through the fixing portions 14. do.
  • the holding unit 20 is connected to the rotating unit 10 through the rotating belt as a rotating power transmitting means for transmitting external rotating power to the rotating unit 10.
  • the holding part 20 is formed with a rod-shaped first winding part 15 formed on the upper and lower sides of the rotating part 10 and a second winding part 21 connected through a rotating belt and formed in a rod shape. It is installed vertically, and rotates through the external rotational power to rotate the rotary unit 10.
  • the recovery part 13 collecting the electronic components and the solder separated from the PCB substrate 1 between the upper part 11 and the lower part 12 is disposed on the upper and lower parts 11 and 12 on the outside of the upper and lower parts 11 and 12. 12) is formed to surround.
  • the second winding portion 21 of the upper and lower sides of the support portion 20 and the upper and lower first winding portion 15 of the rotating part 10 are for the same rotation of the upper and lower parts 11.11 of the rotating part 10. Each is formed with the same diameter.
  • the rotation part 10 connected to the belt is rotated due to the rotation of the support part 20, and the upper and lower parts 11 and 12 of the rotation part 10 are the second winding part of the support part 20. (21) rotates at the same speed.
  • the PCB board fixed between the upper and lower parts may be broken or separated.
  • the motor unit 30 which is an external rotational power, is connected to the support part 20 through the belt by rotating the support part 20 to the support part 20.
  • the rotating unit 10 may be directly connected to the motor unit 30 which is an external rotational power to rotate the rotating unit 10 by the rotation of the motor unit 30.
  • the motor unit 30 is rotated to 600 ⁇ 1300RPM.
  • the heating part 40 applies heat to the PCB substrate 1 fixed through the rotating part 10 so that the electronic component is separated from the PCB substrate 1.
  • the heating unit 40 is used to supply a hot air (hot gun) for heating the object.
  • the heating unit 40 is to heat the PCB substrate 1 at a temperature of 400 ⁇ 1000 °C.
  • the heating unit 40 heats the PCB substrate 1 to 1000 ° C. or more, a problem may occur in which the electronic product and the PCB substrate 1 may be simultaneously melted and separated from each other.
  • FIG. 4 is a block diagram of a valuable metal and parts recovery apparatus according to another embodiment of the present invention.
  • the rotating part 10 to which the PCB substrate 1 on which the electronic component is mounted is fixed to the stop, the motor part 30 for rotating the rotating part 10, the heating part 40 for heating the PCB substrate 1, and And a recovery part which is formed on the rotating part to which the PCB board is fixed and is detached from the electronic component and solder.
  • the rotating part 10 is composed of an upper portion 11 and a lower portion 12, respectively, the PCB substrate 1 is fixed to the middle of the upper and lower portions (11, 12), connected to the external air pressure to the pneumatic
  • the upper and lower parts 11 and 12 are respectively formed in a pneumatic cylinder shape so as to be operated, and are transferred upward and downward.
  • the upper and lower parts 11 and 12 are respectively transferred to the upper and lower sides by 10 to 20 mm, and are fixed by pressing with a force of 100 to 200 Kgf when fixing the PCB substrate 1.
  • the PCB board 1 may not be inserted. Beyond this insertion height can consume more energy and time than necessary.
  • the upper and lower parts 11 and 12 have a small force for fixing the PCB substrate 1, and thus the rotating part 10 when the rotating part 10 is rotated. ), There is a problem that can be separated between the upper and lower (11, 12).
  • the PCB substrate 1 may be damaged.
  • fixing portions 14 are formed in a protruding shape to correspond to portions at which the lower and upper ends of the upper and lower portions 11 and 12 contact, respectively, such that the PCB substrate 1 is fixed through the fixing portions 14. do.
  • a recovery part 13 in which electronic components and solder separated from the PCB substrate 1 are stored, is installed.
  • the motor unit 30 is installed above or below the upper part 11 of the upper part 11 of the rotating part 10 to rotate the rotating part 10.
  • the motor unit 30 may be installed at the upper side of the upper portion 11 and the lower side of the lower portion 12 so as to have the same rotational speed, respectively.
  • the motor unit 30 is rotated to 600 ⁇ 1300RPM.
  • the heating part 40 applies heat to the PCB substrate 1 fixed through the rotating part 10 so that the electronic component is separated from the PCB substrate 1.
  • the heating unit 40 is used to supply a hot air (hot gun) for heating the object.
  • the heating unit 40 is to heat the PCB substrate 1 at a temperature of 400 ⁇ 1000 °C.
  • the heating unit 40 heats the PCB substrate 1 to 1000 ° C. or more, a problem may occur in which the electronic product and the PCB substrate 1 may be simultaneously melted and separated from each other.
  • FIG. 5 is a flow chart showing a valuable metal recovery method according to an embodiment of the present invention.
  • the first step (S10) is a step of fixing the upper and lower parts (11, 12) of the rotating part (10) formed in the pneumatic cylinder form by pressing the PCB board (1) in the vertical direction.
  • the upper and lower parts 11 and 12 are respectively transferred to the upper and lower sides by 10 to 20 mm, and are fixed by pressing with a force of 100 to 200 Kgf when fixing the PCB substrate 1.
  • the PCB board 1 may not be inserted. Beyond this insertion height can consume more energy and time than necessary.
  • the upper and lower parts 11 and 12 have a small force for fixing the PCB substrate 1, and thus the rotating part 10 when the rotating part 10 is rotated. ), There is a problem that can be separated between the upper and lower (11, 12).
  • the PCB substrate 1 may be damaged.
  • fixing portions 14 are formed to correspond to portions at which the lower and upper ends of the upper and lower portions 11 and 12 contact, respectively, so that the PCB substrate 1 is fixed through the fixing portions 14.
  • the second step (S20) is to rotate through the motor unit 30 and the holding unit 20 is connected to the rotating belt to rotate the rotary unit 10.
  • the upper and lower sides of the support portion 20 is formed with a second winding portion 21 is formed of the same diameter, the upper and lower sides of the rotating portion 10, the first winding portion 15 to the same diameter
  • the first and second windings 15 and 21 are connected to each other by a rotation belt, and the rotation unit 10 is rotated by the rotation of the support unit 20.
  • Another method of rotating the rotating unit 10 is to rotate through the motor unit 30 directly installed above or below the rotating unit 10.
  • the third step S30 is a step of heating the PCB substrate 1 rotated through the rotating part 10 through the heating part 40.
  • the heating unit 40 uses a hot gun to supply the hot air to heat the object.
  • the heating unit 40 is to heat the PCB substrate 1 at a temperature of 400 ⁇ 1000 °C.
  • the heating unit 40 heats the PCB substrate 1 to 1000 ° C. or more, a problem may occur in which the electronic product and the PCB substrate 1 may be simultaneously melted and separated from each other.
  • the fourth step S40 is a step of recovering the electronic component and solder separated from the PCB substrate 1 by melting the solder through the third step S30 through the recovery unit 13.
  • the electronic components and the solder recovered through the recovery unit 13 are separated, respectively, and the separation ratio is derived by measuring the weight separately.
  • Separation of electronic components was carried out using the valuable metal and parts recovery device and the recovery method manufactured as described above as in the result of the embodiment.
  • the PCB substrate 1 used was randomly selected from similar sizes among the intermediate sizes of each manufacturer to measure the degree of separation and experiment.
  • the experiment was attempted by setting the rotational speed, the temperature of the hot wind, and the heating time of the hot wind.
  • the rotational speed was set to 1100.
  • the temperature of the hot air was heated to 600 °C and the experiment was carried out by setting the maintenance time of the hot air as the main variable.
  • the weight of the PCB board was 38.1242g, and after 5 minutes, the weight was 38.0275g.
  • the weight of the component dropped after 5 minutes of heating was 7.9655 g.
  • the weight of lead removed by hot air was 0.6300 g.
  • the proportion of separated solder derived through this result is 69.0714 wt%, and the component separation rate is 54.0404 wt%.
  • the weight of the part dropped after 5 minutes of heating was 18.4711g.
  • the weight of lead removed by the hot air was 4.4257g.
  • the ratio of the separated solder derived through this result is 70.7388 wt%, calculated using Equation 4, and the component separation rate is 47.3410 wt%, calculated through Equation 5.
  • the PCB weight was 34.2301g, and the weight after 5 minutes was 34.2301g, the same as the heating time of 3 minutes.
  • the weight of the dropped component after heating for 5 minutes was 9.6973 g.
  • the weight of lead removed by the hot air was 1.2630g.
  • the ratio of the separated solder derived through this result is 86.6255 wt%, calculated using Equation 4, and the component separation rate is 42.8294 wt%, calculated through Equation 5.
  • the PCB substrate weight after 3 minutes was 81.0541g, and after 5 minutes the weight was 76.9023g.
  • the weight of the component dropped after 5 minutes of heating was 19.6517 g.
  • the weight of lead removed by the hot air was 2.5505g.
  • the ratio of the separated solder derived through this result is 64.9147 wt%, calculated using Equation 4, and the component separation rate is 52.1625 wt%, calculated using Equation 5.
  • Table 5 shows the results of arranging the separation rate and the recovery rate of the solder metal of the PCB board 1 of Examples 1 to 4 to the first decimal place.
  • the initial conditions for the results shown in Table 5 are set to a rotational speed of 1100 RPM at a heating temperature of 600 ° C., and the heating time is set to a maximum of 5 minutes so that all are the same. In the second decimal place, it is rounded up.
  • Example 1 As shown in Table 5, in Example 1, the separation rate of the electronic component separated from the PCB substrate 1 is 81.6 wt%, and the recovery rate of the solder metal soldering the PCB substrate 1 and the electronic component is It can be seen that it is 69.1 wt%.
  • Example 2 the separation rate of the electronic component separated from the PCB 1 is 71.9 wt%, and the recovery rate of the solder metal soldering the PCB 1 and the electronic component is 70.7 wt%.
  • Example 3 the separation rate of the electronic component separated from the PCB substrate 1 is 76.6 wt%, and the recovery rate of the solder metal for soldering the PCB substrate 1 and the electronic component is 86.2 wt%.
  • Example 4 the separation rate of the electronic component from the PCB 1 is 77.8 wt%, and the recovery rate of the solder metal for soldering the PCB 1 and the electronic component is 64.9 wt%.
  • the electronic component and the solder may be separated from the PCB 1 by inserting and fixing the PCB 1 between the upper and lower parts of the rotating part 10, and operating the motor part 30 to operate the holding part. Through 20, the upper and lower parts 11 and 12 of the rotating part 10 are rotated at the same speed.
  • the upper and lower parts 11 and 12 of the rotating part 10 are formed in the form of pneumatic cylinders and are operated through an external pneumatic pump, and the PCB substrate 1 is moved up and down by 10 to 20 mm in the vertical direction. To be inserted.
  • the heating temperature of the heating unit 40 has a range of 400 ⁇ 1000 °C.
  • the motor 50 coupled to the upper side of the rotating unit 10 rotating through the motor unit 30 may accelerate or reduce the rotation speed of the rotating unit 10.
  • the rotating unit may be rotated using the motor.
  • the rotation speed is rotated in the range of 600 ⁇ 1300RPM.
  • a method of separating an electronic component and a solder from a PCB is performed by inserting and fixing a PCB substrate 1 between the upper and lower portions of the rotating unit, and operating the motor unit 30 to form an upper portion of the rotating unit 10.
  • the lower parts 11 and 12 are rotated.
  • the upper and lower parts 11 and 12 of the rotating part 10 are formed in the form of pneumatic cylinders and are operated through an external pneumatic pump, and the PCB substrate 1 is moved up and down by 10 to 20 mm in the vertical direction. To be inserted.
  • the rotation speed is rotated in the range of 600 ⁇ 1300RPM.
  • the heating temperature of the heating unit 40 has a range of 400 ⁇ 1000 °C.
  • the present invention configured as described above rotates the PCB substrate 1 and simultaneously heats the PCB substrate 1 with the heating part 40 to separate electronic components and solder on the PCB substrate 1 using centrifugal force and heat. Energy consumption due to the melting of the substrate 1 is reduced, and since the PCB substrate 1 is not melted, there is an advantage of reducing pollution.
  • PCB board 10 rotating part

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Abstract

The present invention pertains to an apparatus for recovering precious metals and components from a PCB substrate, in which the apparatus comprises: a rotating unit which includes a PCB substrate fixed to the rotating unit with electronic components mounted thereon, and is rotated through external rotating power; a heating unit which is fixed to an intermediate portion of the rotating unit and heats the PCB substrate; and a recovering unit which is formed on the rotating unit, to which the PCB substrate is fixed, and stores the separated electronic components and solder.

Description

ＰＣＢ기판의 유가금속 및 부품 회수장치와 이를 이용한 회수방법Valuable metal and parts recovery device of PCC board and recovery method using the same
본 발명은 회전부를 통해 전자부품이 실장된 PCB기판을 회전시킴과 동시에 가열부를 통해 PCB기판을 가열하여 전자부품과 솔더가 PCB기판에서 이탈되도록 하는, PCB기판의 유가금속 및 부품 회수장치와 이를 이용한 회수방법에 관한 것이다.The present invention is to rotate the PCB board mounted electronic components through the rotating unit and at the same time to heat the PCB substrate through the heating unit to leave the electronic components and solder from the PCB substrate, valuable metal and parts recovery apparatus of the PCB substrate and using the same It relates to a recovery method.
일반적으로 인쇄회로기판 및 전자부품 등의 전자스크랩 폐기물은 그 성분구성이 통상적으로 전체 구성 중 폴리에틸렌(PE), 폴리프로필렌(PP), 폴리에스터(Polyester) 및 폴리카네이트(Polycarbonate)로 되는 약 30%의 플라스틱성분과, 실리카, 알루미나, 알칼리-알카리토산화물 등 난용성 산화물이 약 40%정도의 분포로 포함되며, 기타 구리(Cu),철(Fe), 니켈(Ni), 주석(Sn), 납(Pb), 알루미늄(Al), 아연(Zn) 등과 같은 일반금속과 금(Au), 은(Ag), 파라디움(Pd) 등과 같은 귀금속 성분 약 30%가 혼재하여 구성된다.Generally, the electronic scrap waste such as printed circuit boards and electronic components is generally composed of about 30 of the composition of polyethylene (PE), polypropylene (PP), polyester and polycarbonate in the overall composition. % Plastic components and poorly soluble oxides such as silica, alumina and alkali-alkaline oxides are distributed in about 40%. Other copper (Cu), iron (Fe), nickel (Ni), tin (Sn) And about 30% of common metals such as lead (Pb), aluminum (Al), zinc (Zn), and precious metal components such as gold (Au), silver (Ag), and palladium (Pd).
또한, 이러한 전자스크랩 중 인쇄회로기판에는 그 표면에 프린트된 인쇄회로망, 에지컨넥터(edge connectors) 및 이에 배치된 집적회로인 IC, 트랜지스터 등의 반도체소자는 상기한 유가 귀금속이 존재하게 된다.In addition, in the printed circuit board of the electronic scrap, the above-mentioned precious metals exist in the semiconductor devices such as printed circuits, edge connectors, ICs, and transistors, which are disposed on the surface thereof.
이러한 인쇄회로기판 상의 유가 귀금속의 형태는 Cu로 된 핀이나 단자, 박판에 코팅된 Au 및 Pb, Au bonding wires, Ni 또는 Fe에 코팅되는 Au 및 Ag 페이스트, 백금족 금속을 함유한 혼합금속 및 합금 등과 같은 다양한 형태로 형성되어 비교적 많은 양의 유가금속이 포함되어 있다.Valuable precious metals on such printed circuit boards include Cu pins or terminals, Au and Pb coated on thin plates, Au bonding wires, Au and Ag pastes coated on Ni or Fe, mixed metals and alloys containing platinum group metals, and the like. It is formed in the same various forms and contains a relatively large amount of valuable metals.
이들은 상당한 고가의 금속이나 귀금속으로 분류되어 이들을 유효하게 회수하여 재활용하기 위한 기술이 활발히 제안되고 있다.These are classified as considerable expensive metals and precious metals, and techniques for effectively recovering and recycling them have been actively proposed.
이처럼 인쇄회로기판 자체에 프린트된 유가금속의 인쇄회로망, 에지콘넥터와 인쇄회로기판상에 장착된 집적회로(IC), 트랜지스터 등과 같은 반도체소자 등의 전자부품으로 되는 전자스크랩(이하 전자스크랩이라 통칭한다)을 인쇄회로기판으로 부터 분리하여 유가금속을 회수하기 위한 종래의 유가금속 정련 전의 전처리 방법은다음과 같다.Electronic scrap made of electronic components such as printed circuit boards of valuable metal printed on the printed circuit board itself, semiconductor devices such as integrated circuits (ICs) and transistors mounted on edge connectors and printed circuit boards (hereinafter referred to as electronic scrap). The conventional pretreatment method before refining valuable metals to recover valuable metals by separating from the printed circuit board is as follows.
일반적인 전처리 방법은 인쇄회로기판으로부터 전자스크랩을 분리시키지 않고 인쇄회로기판에 전자스크랩이 배치되어 장착된 상태인 채로 해머밀 등을 사용하여 인쇄회로기판과 전자스크랩을 동시에 절단한다. A general pretreatment method cuts a printed circuit board and an electronic scrap at the same time using a hammer mill or the like while the electronic scrap is placed and mounted on the printed circuit board without separating the electronic scrap from the printed circuit board.
그런 다음 1차 선별한 후, 다시 볼밀 등으로 인쇄회로기판의 유가금속이 포함된 플라스틱성분과 전자스크랩의 유가금속성분 등을 섞인 상태에서 같이 동시에 분쇄한다.Then, after the first screening, the ball mill or the like is pulverized at the same time in a state in which the plastic component containing the valuable metal of the printed circuit board and the valuable metal component of the electronic scrap are mixed together.
그뒤 여러단계의 복잡한 선별공정을 거쳐 플라스틱성분과 유가금속성분을 구분하여 선별한 후, 선별된 유가금속성분을 다시 습식 또는 건식농축제련공정이나 전기화학공정 등의 정련공정을 필요에 따라 선택적으로 사용하여 최종적으로 Au,Ag, Pd, Cu 등과 같은 귀금속 등의 유가금속을 분류, 회수하여 재활용하게 된다.After that, the plastic and valuable metal components are separated and sorted through complex stages of selection, and the selected valuable metal components are again selectively used as refining processes such as wet or dry concentrated smelting or electrochemical processes. Finally, valuable metals such as precious metals such as Au, Ag, Pd, Cu, etc. are sorted, recovered, and recycled.
그러나, 지금까지 사용되고 있는 상기와 같은 종래의 전처리방법은 인쇄회로기판상에 인쇄회로망, 반도체소자 등의 전자스크랩이 그대로 장착된 상태로 인쇄회로기판의 플라스틱성분과 전자스크랩의 유가금속성분 등을 동시에 절단하고 분쇄하 는 방법을 취하고 있어 절단 및 분쇄작업시 인쇄회로기판의 플라스틱성분을 절단, 분쇄하는 과정에서 분진이 대량으로 발생하게 된다.However, the conventional pretreatment method used up to now is a plastic component of the printed circuit board and a valuable metal component of the electronic scrap at the same time while the electronic scrap such as a printed circuit, a semiconductor device is mounted on the printed circuit board as it is. Since cutting and pulverizing method is used, a large amount of dust is generated in the process of cutting and crushing plastic components of printed circuit board during cutting and crushing.
이에 따라 고비용의 다중 집진설비가 요구되는 설비상의 불리점과 동력이 커지는 운전상의 불이익이 나타나고 있어 처리비용이 비교적 고비용인 경제적인 부담을 발생하게 된다.As a result, there are disadvantages in equipment that require expensive multi-dust collection equipment and disadvantages in operating power, resulting in an economic burden with a relatively high cost of treatment.
이처럼 인쇄회로기판 자체를 전처리하는 과정에서 완전히 파쇄하고 분쇄하는 방법으로 처리함으로서 인쇄회로기판 자체의 재활용이나 분쇄한 플라스틱류의 회수가 어려워 인쇄회로기판의 재활용율이 저하되어 자원의 낭비를 초래하는 결과를 나타낸다. As the printed circuit board itself is completely crushed and crushed during the pretreatment process, the recycling of the printed circuit board itself or the recovery of pulverized plastics is difficult, resulting in a waste of resources due to reduced recycling rate of the printed circuit board. Indicates.
그리고, 분쇄된 플라스틱류의 분진 내에도 다소의 유가금속이 포함하고 있으므로 분진내의 유가금속을 회수하기 위하여서는 여러 단계의 분진수집 및 선별 등의 복잡한 장치와 처리과정을 별도로 요구하게 되어 설비비용이나 운전 동력비등의 처리비용이 많이 요구되는 반면에 유가금속 회수율은 상대적으로 낮아 처리비용이 회수율에 비하여 상대적으로 높은 문제점이 발생 되었다.In addition, some valuable metals are contained in the dust of the pulverized plastics. Therefore, in order to recover the valuable metals in the dust, complicated equipment such as dust collection and sorting at various stages and processing processes are required separately, thus requiring equipment cost or operation. While the treatment costs such as power costs are high, the recovery of valuable metals is relatively low, resulting in a relatively high treatment cost compared to the recovery rate.
또한, 상기와 같은 종래의 처리방법은 절단과 파쇄 및 선별, 소각 등의 다단계의 복잡한 작업을 거치게되어 분진이나 처리수 등의 공해물질이 다량 발생하게 되어 환경오염을 유발하는 등 주변의 분진으로 인한 공해상의 문제와 작업환경이 열악한 것 등의 여러 가지 문제점을 발생 되고 있다.In addition, the conventional treatment method as described above is subjected to a multi-step complex operation such as cutting, crushing, screening, incineration, and a large amount of pollutants such as dust or treated water is generated, causing environmental pollution. There are various problems such as pollution problems and poor working environment.
또한 인쇄회로기판을 그대로 절단, 파쇄하여 분리 폐기하게 되므로 인쇄회로기판의 재활용을 거의 기대할 수 없어 이로 인한 산업폐기물의 다량발생은 물론 자원의 낭비를 초래하는 등의 여러 가지 문제점이 발생 되었다.In addition, since the printed circuit board is cut, shredded, and disposed of as it is, the recycling of the printed circuit board is hardly expected, resulting in a large amount of industrial waste and a waste of resources.
본 발명의 목적은 회전부를 통해 전자부품이 실장된 PCB기판을 회전시킴과 동시에 가열부를 통해 PCB기판을 가열하여 전자부품과 솔더가 PCB기판에서 이탈시켜 유가금속을 공해 없이 회수할 수 있는, PCB기판의 유가금속 및 부품 회수장치와 이를 이용한 방법을 제공하는데 그 목적이 있다.An object of the present invention is to rotate the PCB board mounted electronic components through the rotating part and at the same time to heat the PCB substrate through the heating part, the electronic component and solder can be separated from the PCB substrate to recover valuable metals without pollution, PCB substrate The object of the present invention is to provide a valuable metal and parts recovery device and a method using the same.
상기의 목적을 달성하기 위한 본 발명에 따른 PCB기판의 유가금속 및 부품 회수장치는, 전자부품이 실장된 PCB기판이 고정되고, 외부의 회전동력을 통해 회전하는 회전부; 상기 회전부의 중단에 고정되는 PCB기판을 가열하는 가열부; 및 상기 PCB기판이 고정되는 회전부에 형성되어 이탈된 전자부품과 솔더가 저장되는 회수부;를 포함하는 것을 특징으로 한다.Valuable metal and parts recovery apparatus of a PCB substrate according to the present invention for achieving the above object, the PCB is mounted on which the electronic component is mounted, the rotating portion to rotate through the external rotational power; A heating unit for heating the PCB board fixed to the interruption of the rotating unit; And a recovery part which is formed on the rotating part to which the PCB substrate is fixed and is separated and the electronic parts and solder are stored therein.
상기의 목적을 달성하기 위한 본 발명의 다른 일실시 예에 따른 PCB기판의 유가금속 및 부품 회수장치는, 전자부품이 실장된 PCB기판이 고정되고, 회전되는 회전부;Valuable metal and component recovery apparatus of a PCB substrate according to another embodiment of the present invention for achieving the above object, the PCB is mounted on which the electronic component is mounted, the rotating portion is rotated;
상기 회전부에 설치되어 상기 회전부를 회전시키는 모터부; 상기 상기 PCB기판이 고정되는 회전부에 형성되어 이탈된 전자부품과 솔더가 저장되는 회수부; 및 상기 회전부에 고정되는 PCB기판을 가열하는 가열부;를 포함하는 것을 특징으로 한다.A motor unit installed at the rotating unit to rotate the rotating unit; A recovery unit formed in the rotating unit to which the PCB board is fixed, to store the separated electronic components and solder; And a heating unit for heating the PCB board fixed to the rotating unit.
상기의 목적을 달성하기 위한 본 발명에 따른 PCB기판의 유가금속 및 부품 회수장치를 이용한 회수방법은, 전자부품이 실장된 PCB기판을 회전부에 고정시키는 제1 단계; 상기 회전부를 일방향으로 회전시키는 제2 단계; 상기 회전되는 PCB기판을 가열부를 통해 가열하는 제3 단계; 및 상기 가열부를 통해 가열된 PCB기판 상의 부품 및 솔더가 회수부를 통해 회수되는 제4 단계;를 포함한다.The recovery method using the valuable metal and parts recovery apparatus of the PCB substrate according to the present invention for achieving the above object, the first step of fixing the PCB substrate on which the electronic component is mounted to the rotating part; A second step of rotating the rotating unit in one direction; A third step of heating the rotated PCB substrate through a heating unit; And a fourth step of recovering the parts and solder on the PCB board heated by the heating unit through the recovery unit.
상기와 같이 구성되는 본 발명에 관련된 PCB기판의 유가금속 및 부품 회수장치에 의하면, PCB기판을 회전시킴과 동시에 가열부로 PCB기판을 가열하여 PCB기판상의 전자부품과 솔더를 원심력과 열을 이용하여 분리하게 되므로 PCB기판의 용융에 따른 에너지 소비가 줄어들게 되며, PCB기판을 용융하지 않으므로 공해 발생이 줄어들게 되는 이점이 있다.According to the valuable metal and component recovery apparatus of the PCB substrate according to the present invention configured as described above, while rotating the PCB substrate and heating the PCB substrate with a heating unit to separate the electronic components and solder on the PCB substrate using centrifugal force and heat. Since the energy consumption due to the melting of the PCB substrate is reduced, there is an advantage that the generation of pollution is reduced because the PCB is not melted.
도 1은 본 발명에 따른 유가금속 및 부품 회수장치의 전체 구성도이다.1 is an overall configuration diagram of a valuable metal and part recovery apparatus according to the present invention.
도 2는 본 발명의 일실시 예에 따른 유가금속 및 부품 회수장치의 전체 구성도이다.2 is an overall configuration diagram of a valuable metal and part recovery apparatus according to an embodiment of the present invention.
도 3은 본 발명의 일실시 예에 따른 회전부와 가열부를 확대하여 나타낸 도면이다.3 is an enlarged view of a rotating part and a heating part according to an embodiment of the present invention.
도 4는 본 발명의 다른 일실시 예에 따른 유가금속 및 부품 회수장치의 구성도이다.4 is a block diagram of a valuable metal and parts recovery apparatus according to another embodiment of the present invention.
도 5는 본 발명의 일실시 예에 따른 유가금속 회수방법을 나타낸 순서도이다.5 is a flow chart showing a valuable metal recovery method according to an embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명한다. 도면들 중 동일한 구성요소들은 가능한 어느 곳에서든지 동일한 부호로 표시한다. 또한 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 기능 및 구성에 대한 상세한 설명은 생략한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention. Like elements in the figures are denoted by the same reference numerals wherever possible. In addition, detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.
도 1은 본 발명에 따른 유가금속 및 부품 회수장치의 전체 구성도이고, 도 2는 본 발명의 일실시 예에 따른 유가금속 및 부품 회수장치의 전체 구성도이며, 도 3은 회전부와 가열부를 확대하여 나타낸 도면이다.1 is an overall configuration diagram of a valuable metal and parts recovery apparatus according to the present invention, Figure 2 is an overall configuration diagram of a valuable metal and parts recovery apparatus according to an embodiment of the present invention, Figure 3 is an enlarged portion of the rotating and heating The figure shown.
도 1을 참조하면, 본 발명은 PCB기판(1)이 고정되는 회전부(10)와, 상기 회전부(10)에 고정되는 PCB기판(1)을 가열하는 가열부(40)와, 상기 PCB기판(1)이 고정되는 회전부(10)에 형성되어 이탈된 전자부품과 솔더가 저장되는 회수부(13)와, 상기 회전부(10)를 회전시키는 모터부(30)를 포함하여 구성된다.Referring to FIG. 1, the present invention provides a rotating part 10 to which the PCB substrate 1 is fixed, a heating part 40 to heat the PCB substrate 1 fixed to the rotating part 10, and the PCB substrate ( 1) is formed on the rotating part 10 is fixed to the recovery part 13 is stored electronic components and solder is removed, and the motor unit 30 for rotating the rotating part 10 is configured.
상기 회전부(10)는 상기 모터부(30)에 의해 직접적으로 회전되는 것이 아니라 소정의 동력전달 수단을 통해 회전될 수도 있다.The rotating unit 10 may not be directly rotated by the motor unit 30 but may be rotated through a predetermined power transmission means.
상기 도 1의 구성요소들은 도 2의 실시예와 같이 구성될 수 있다.The components of FIG. 1 may be configured as in the embodiment of FIG. 2.
도 2와 3을 참조하면, 상기 회전부(10)는 상부(11)와 하부(12)로 각각 구성되며, 상기 상,하부(11,12)의 중단에 PCB기판(1)이 고정되고, 외부의 공압기와 연결되어 공압으로 작동되도록 상기 상,하부(11,12)가 각각 공압 실린더 형태로 형성되어 상하측으로 이송된다.2 and 3, the rotating part 10 is composed of an upper portion 11 and a lower portion 12, respectively, the PCB substrate 1 is fixed to the interruption of the upper and lower portions 11 and 12, the outside The upper and lower parts 11 and 12 are respectively formed in the form of pneumatic cylinders so as to be connected to the pneumatics of the pneumatically operated pneumatically, and are conveyed upward and downward.
이러한 상기 상,하부(11,12)는 상하측으로 각각 10 ~ 20mm로 이송되고, 상기 PCB기판(1)을 고정시킬때 100 ~ 200Kgf의 힘으로 누르며 고정시키게 된다.The upper and lower parts 11 and 12 are respectively transferred to the upper and lower sides by 10 to 20 mm, and are fixed by pressing with a force of 100 to 200 Kgf when fixing the PCB substrate 1.
이때, 상기 상,하부(11,12)가 상하방향으로 승강되는 간격이 10mm 미만이 되면 상기 PCB기판(1)이 삽입되지 못하는 경우가 발생될 수 있고, 20mm 초과로 승강되면 PCB기판(1)이 삽입되는 높이를 넘기 때문에 필요 이상의 에너지와 시간이 소모될 수 있다.In this case, when the interval between the upper and lower portions 11 and 12 is raised and lowered in the vertical direction is less than 10 mm, the PCB board 1 may not be inserted. Beyond this insertion height can consume more energy and time than necessary.
그리고, 상기 PCB기판(1)을 고정시키는 힘이 100Kgf 미만이면, 상기 상,하부(11,12)가 상기 PCB기판(1)을 고정시키는 힘이 작아 상기 회전부(10)의 회전시 회전부(10)의 상,하부(11,12) 간에서 이탈되어 질 수 있는 문제가 있다.In addition, when the force for fixing the PCB substrate 1 is less than 100Kgf, the upper and lower parts 11 and 12 have a small force for fixing the PCB substrate 1, and thus the rotating part 10 when the rotating part 10 is rotated. ), There is a problem that can be separated between the upper and lower (11, 12).
이와 반대로, 상기 PCB기판(1)을 고정시키는 힘이 200Kgf를 초과하면 PCB기판(1)이 파손될 수 있는 문제점이 발생 될 수 있다.On the contrary, if the force for fixing the PCB 1 exceeds 200 Kgf, the PCB substrate 1 may be damaged.
그리고, 상기 상,하부(11,12)의 하단과 상단이 접촉되는 부분에는 각각 대응되도록 돌출 형상의 고정부(14)가 형성되어 PCB기판(1)이 상기 고정부(14)를 통해 고정되도록 한다.In addition, protruding fixing portions 14 are formed at portions in which lower and upper ends of the upper and lower portions 11 and 12 contact, respectively, such that the PCB substrate 1 is fixed through the fixing portions 14. do.
상기 회전부(10)에 외부의 회전동력을 전달하는 회전동력 전달수단으로 지주부(20)가 상기 회전부(10)와 회전벨트를 통해 연결된다.The holding unit 20 is connected to the rotating unit 10 through the rotating belt as a rotating power transmitting means for transmitting external rotating power to the rotating unit 10.
이러한 상기 지주부(20)는 상기 회전부(10)의 상,하측에 형성되는 제1 감김부(15)와 회전용 벨트를 통해 연결되는 제2 감김부(21)가 형성되며, 봉형상으로 형성되어 수직으로 설치되고, 외부의 회전동력을 통해 회전하여 상기 회전부(10)를 연동 회전시킨다.The holding part 20 is formed with a rod-shaped first winding part 15 formed on the upper and lower sides of the rotating part 10 and a second winding part 21 connected through a rotating belt and formed in a rod shape. It is installed vertically, and rotates through the external rotational power to rotate the rotary unit 10.
상기 상부(11)와 하부(12) 간의 PCB기판(1)에서 이탈되는 전자부품과 솔더를 모으는 회수부(13)가 상기 상,하부(11,12)의 외측에 상기 상,하부(11,12)를 감싸도록 형성된다. The recovery part 13 collecting the electronic components and the solder separated from the PCB substrate 1 between the upper part 11 and the lower part 12 is disposed on the upper and lower parts 11 and 12 on the outside of the upper and lower parts 11 and 12. 12) is formed to surround.
이러한 상기 지주부(20) 상하측의 제2 감김부(21)와 상기 회전부(10)의 상하측 제1 감김부(15)는 상기 회전부(10) 상,하부(11.12)의 동일한 회전을 위해 각각 동일한 직경을 가지고 형성된다.The second winding portion 21 of the upper and lower sides of the support portion 20 and the upper and lower first winding portion 15 of the rotating part 10 are for the same rotation of the upper and lower parts 11.11 of the rotating part 10. Each is formed with the same diameter.
이로 인해 상기 지주부(20)의 회전으로 인해 벨트로 연결된 상기 회전부(10)가 회전되며, 상기 회전부(10)의 상,하부(11,12)는 상기 지주부(20)의 제2 감김부(21)로 인해 동일한 속도로 회전하게 된다.As a result, the rotation part 10 connected to the belt is rotated due to the rotation of the support part 20, and the upper and lower parts 11 and 12 of the rotation part 10 are the second winding part of the support part 20. (21) rotates at the same speed.
이때, 상기 회전부(10) 상,하부(11.12)가 각기 다른 속도로 회전하게 되면 상기 상,하부 간에 고정된 PCB기판이 파손되거나 이탈되는 문제점이 발생 될 수 있다.In this case, when the upper and lower parts 11.12 of the rotating part 10 rotate at different speeds, the PCB board fixed between the upper and lower parts may be broken or separated.
상기 지주부(20)에는 외부의 회전동력인 모터부(30)가 상기 지주부(20)와 벨트를 통해 연결되어 상기 지주부(20)를 회전시키게 된다.The motor unit 30, which is an external rotational power, is connected to the support part 20 through the belt by rotating the support part 20 to the support part 20.
이때, 상기 회전부(10)에는 외부의 회전동력인 모터부(30)가 직접 연결되어 상기 모터부(30)의 회전으로 상기 회전부(10)를 회전시킬 수 있다.At this time, the rotating unit 10 may be directly connected to the motor unit 30 which is an external rotational power to rotate the rotating unit 10 by the rotation of the motor unit 30.
이러한 상기 모터부(30)는 600 ~ 1300RPM으로 회전하게 된다.The motor unit 30 is rotated to 600 ~ 1300RPM.
이때 상기 모터부(30)의 회전이 600RPM 미만일 경우 회전력이 부족하여 PCB기판(1) 상의 전자부품이 이탈되지 않게 되는 문제점이 발생 될 수 있다.In this case, when the rotation of the motor unit 30 is less than 600 RPM, a problem may occur in that the electronic component on the PCB 1 is not detached due to insufficient rotational force.
상기 모터부(30)의 회전이 1300RPM을 초과할 경우 이탈되는 전자부품이 빠른속도로 이탈되어 주변에 피해를 줄 수 있는 문제점이 발생 될 수 있다.When the rotation of the motor unit 30 exceeds 1300 RPM, a problem may occur that may cause damage to the surrounding electronic components that are separated at a high speed.
상기 가열부(40)는 상기 회전부(10)를 통해 고정된 상기 PCB기판(1)에 열을 가하여 전자부품이 PCB기판(1) 상에서 이탈되도록 한다.The heating part 40 applies heat to the PCB substrate 1 fixed through the rotating part 10 so that the electronic component is separated from the PCB substrate 1.
이러한 가열부(40)는 열풍을 공급하여 대상물을 가열하는 열풍기(hot gun)를 이용하게 된다.The heating unit 40 is used to supply a hot air (hot gun) for heating the object.
여기서 상기 가열부(40)는 400 ~ 1000℃의 온도로 상기 PCB기판(1)을 가열하게 된다.Here, the heating unit 40 is to heat the PCB substrate 1 at a temperature of 400 ~ 1000 ℃.
이때, 상기 가열부(40)가 400℃이하로 상기 PCB기판(1)을 가열하게 되면 전자부품을 PCB기판(1)과 솔더링한 솔더가 제대로 녹지 않아 전자부품이 PCB기판(1)에서 분리되지 않는 문제점이 발생 될 수 있다.In this case, when the heating unit 40 heats the PCB substrate 1 below 400 ° C., the solder that solders the electronic component to the PCB substrate 1 does not melt properly, so that the electronic component is not separated from the PCB substrate 1. Problem may occur.
그리고, 상기 가열부(40)가 1000℃이상으로 상기 PCB기판(1)을 가열하게 되면 전자제품과 PCB기판(1)이 동시에 녹아 분리가 불가능할 수 있는 문제점이 발생 될 수 있다.In addition, when the heating unit 40 heats the PCB substrate 1 to 1000 ° C. or more, a problem may occur in which the electronic product and the PCB substrate 1 may be simultaneously melted and separated from each other.
도 4는 본 발명의 다른 일실시 예에 따른 유가금속 및 부품 회수장치의 구성도이다.4 is a block diagram of a valuable metal and parts recovery apparatus according to another embodiment of the present invention.
도 4를 참조하면, 본 발명의 다른 구성은 다음과 같다.4, another configuration of the present invention is as follows.
전자부품이 실장된 PCB기판(1)이 중단에 고정되는 회전부(10)와, 상기 회전부(10)를 회전시키는 모터부(30)와, PCB기판(1)을 가열하는 가열부(40)와, 상기 상기 PCB기판이 고정되는 회전부에 형성되어 이탈된 전자부품과 솔더가 저장되는 회수부를 포함하여 구성된다.The rotating part 10 to which the PCB substrate 1 on which the electronic component is mounted is fixed to the stop, the motor part 30 for rotating the rotating part 10, the heating part 40 for heating the PCB substrate 1, and And a recovery part which is formed on the rotating part to which the PCB board is fixed and is detached from the electronic component and solder.
*상기 회전부(10)는 상부(11)와 하부(12)로 각각 구성되며, 상기 상,하부(11,12)의 중단에 PCB기판(1)이 고정되고, 외부의 공압기와 연결되어 공압으로 작동되도록 상기 상,하부(11,12)가 각각 공압 실린더 형태로 형성되어 상하측으로 이송된다.* The rotating part 10 is composed of an upper portion 11 and a lower portion 12, respectively, the PCB substrate 1 is fixed to the middle of the upper and lower portions (11, 12), connected to the external air pressure to the pneumatic The upper and lower parts 11 and 12 are respectively formed in a pneumatic cylinder shape so as to be operated, and are transferred upward and downward.
이러한 상기 상,하부(11,12)는 상하측으로 각각 10 ~ 20mm로 이송되고, 상기 PCB기판(1)을 고정시킬때 100 ~ 200Kgf의 힘으로 누르며 고정시키게 된다.The upper and lower parts 11 and 12 are respectively transferred to the upper and lower sides by 10 to 20 mm, and are fixed by pressing with a force of 100 to 200 Kgf when fixing the PCB substrate 1.
이때, 상기 상,하부(11,12)가 상하방향으로 승강되는 간격이 10mm 미만이 되면 상기 PCB기판(1)이 삽입되지 못하는 경우가 발생될 수 있고, 20mm 초과로 승강되면 PCB기판(1)이 삽입되는 높이를 넘기 때문에 필요 이상의 에너지와 시간이 소모될 수 있다.In this case, when the interval between the upper and lower portions 11 and 12 is raised and lowered in the vertical direction is less than 10 mm, the PCB board 1 may not be inserted. Beyond this insertion height can consume more energy and time than necessary.
그리고, 상기 PCB기판(1)을 고정시키는 힘이 100Kgf 미만이면, 상기 상,하부(11,12)가 상기 PCB기판(1)을 고정시키는 힘이 작아 상기 회전부(10)의 회전시 회전부(10)의 상,하부(11,12) 간에서 이탈되어 질 수 있는 문제가 있다.In addition, when the force for fixing the PCB substrate 1 is less than 100Kgf, the upper and lower parts 11 and 12 have a small force for fixing the PCB substrate 1, and thus the rotating part 10 when the rotating part 10 is rotated. ), There is a problem that can be separated between the upper and lower (11, 12).
이와 반대로, 상기 PCB기판(1)을 고정시키는 힘이 200Kgf를 초과하면 PCB기판(1)이 파손될 수 있는 문제점이 발생 될 수 있다.On the contrary, if the force for fixing the PCB 1 exceeds 200 Kgf, the PCB substrate 1 may be damaged.
그리고, 상기 상,하부(11,12)의 하단과 상단이 접촉되는 부분에는 각각 대응되도록 돌출 형상으로 고정부(14)가 형성되어 PCB기판(1)이 상기 고정부(14)를 통해 고정되도록 한다.In addition, fixing portions 14 are formed in a protruding shape to correspond to portions at which the lower and upper ends of the upper and lower portions 11 and 12 contact, respectively, such that the PCB substrate 1 is fixed through the fixing portions 14. do.
상기 회전부(10)의 중단 외측에는 PCB기판(1)에서 이탈된 전자부품과 솔더가 저장되는 회수부(13)가 설치된다.On the outside of the middle of the rotating part 10, a recovery part 13, in which electronic components and solder separated from the PCB substrate 1 are stored, is installed.
상기 모터부(30)는 상기 회전부(10) 상부(11)의 상측 또는 하부(12)의 하측에 설치되어 상기 회전부(10)를 회전시키게 된다.The motor unit 30 is installed above or below the upper part 11 of the upper part 11 of the rotating part 10 to rotate the rotating part 10.
이때 상기 모터부(30)는 상부(11)의 상측 및 하부(12)의 하측에 동일한 회전속도를 가지도록 각각 설치되어 동시에 작동되어 질 수 있다. In this case, the motor unit 30 may be installed at the upper side of the upper portion 11 and the lower side of the lower portion 12 so as to have the same rotational speed, respectively.
이러한 상기 모터부(30)는 600 ~ 1300RPM으로 회전하게 된다.The motor unit 30 is rotated to 600 ~ 1300RPM.
이때 상기 모터부(30)의 회전이 600RPM 미만일 경우 회전력이 부족하여 PCB기판(1) 상의 전자부품이 이탈되지 않게 되는 문제점이 발생 될 수 있다.In this case, when the rotation of the motor unit 30 is less than 600 RPM, a problem may occur in that the electronic component on the PCB 1 is not detached due to insufficient rotational force.
상기 모터부(30)의 회전이 1300RPM을 초과할 경우 이탈되는 전자부품이 빠른속도로 이탈되어 주변에 피해를 줄 수 있는 문제점이 발생 될 수 있다.When the rotation of the motor unit 30 exceeds 1300 RPM, a problem may occur that may cause damage to the surrounding electronic components that are separated at a high speed.
상기 가열부(40)는 상기 회전부(10)를 통해 고정된 상기 PCB기판(1)에 열을 가하여 전자부품이 PCB기판(1) 상에서 이탈되도록 한다.The heating part 40 applies heat to the PCB substrate 1 fixed through the rotating part 10 so that the electronic component is separated from the PCB substrate 1.
이러한 가열부(40)는 열풍을 공급하여 대상물을 가열하는 열풍기(hot gun)를 이용하게 된다.The heating unit 40 is used to supply a hot air (hot gun) for heating the object.
여기서 상기 가열부(40)는 400 ~ 1000℃의 온도로 상기 PCB기판(1)을 가열하게 된다.Here, the heating unit 40 is to heat the PCB substrate 1 at a temperature of 400 ~ 1000 ℃.
이때, 상기 가열부(40)가 400℃이하로 상기 PCB기판(1)을 가열하게 되면 전자부품을 PCB기판(1)과 솔더링한 솔더가 제대로 녹지 않아 전자부품이 PCB기판(1)에서 분리되지 않는 문제점이 발생 될 수 있다.In this case, when the heating unit 40 heats the PCB substrate 1 below 400 ° C., the solder that solders the electronic component to the PCB substrate 1 does not melt properly, so that the electronic component is not separated from the PCB substrate 1. Problem may occur.
그리고, 상기 가열부(40)가 1000℃이상으로 상기 PCB기판(1)을 가열하게 되면 전자제품과 PCB기판(1)이 동시에 녹아 분리가 불가능할 수 있는 문제점이 발생 될 수 있다.In addition, when the heating unit 40 heats the PCB substrate 1 to 1000 ° C. or more, a problem may occur in which the electronic product and the PCB substrate 1 may be simultaneously melted and separated from each other.
도 5는 본 발명의 일실시 예에 따른 유가금속 회수방법을 나타낸 순서도이다.5 is a flow chart showing a valuable metal recovery method according to an embodiment of the present invention.
도 5를 참조하면, 상기의 본 발명을 이용한 회수방법은 다음과 같다.Referring to Figure 5, the recovery method using the present invention is as follows.
PCB기판(1)을 회전부(10)의 중단에 고정시키는 제1 단계(S10)와, 상기 회전부(10)를 회전시키는 제2 단계(S20), 상기 회전부(10)를 통해 회전하는 PCB기판(1)을 가열부(40)로 가열하는 제3 단계(S30)와, 상기 가열된 PCB기판(1)의 부품과 솔더를 회수부(13)를 통해 회수하는 제4 단계(S40)를 포함하여 이루어진다.The first step (S10) for fixing the PCB substrate 1 to the interruption of the rotary unit 10, the second step (S20) for rotating the rotary unit 10, the PCB substrate rotated through the rotary unit 10 ( Including a third step (S30) for heating the 1) to the heating unit 40, and a fourth step (S40) for recovering the components and solder of the heated PCB substrate 1 through the recovery unit 13 Is done.
상기 제1 단계(S10)는 공압실린더 형태로 형성된 상기 회전부(10)의 상,하부(11,12)가 중단측으로 작동되어 상기 PCB기판(1)을 상하방향에서 눌러 고정하는 단계이다.The first step (S10) is a step of fixing the upper and lower parts (11, 12) of the rotating part (10) formed in the pneumatic cylinder form by pressing the PCB board (1) in the vertical direction.
여기서, 상기 상,하부(11,12)는 상하측으로 각각 10 ~ 20mm로 이송되고, 상기 PCB기판(1)을 고정시킬때 100 ~ 200Kgf의 힘으로 누르며 고정시킨다.Here, the upper and lower parts 11 and 12 are respectively transferred to the upper and lower sides by 10 to 20 mm, and are fixed by pressing with a force of 100 to 200 Kgf when fixing the PCB substrate 1.
이때, 상기 상,하부(11,12)가 상하방향으로 승강되는 간격이 10mm 미만이 되면 상기 PCB기판(1)이 삽입되지 못하는 경우가 발생될 수 있고, 20mm 초과로 승강되면 PCB기판(1)이 삽입되는 높이를 넘기 때문에 필요 이상의 에너지와 시간이 소모될 수 있다.In this case, when the interval between the upper and lower portions 11 and 12 is raised and lowered in the vertical direction is less than 10 mm, the PCB board 1 may not be inserted. Beyond this insertion height can consume more energy and time than necessary.
그리고, 상기 PCB기판(1)을 고정시키는 힘이 100Kgf 미만이면, 상기 상,하부(11,12)가 상기 PCB기판(1)을 고정시키는 힘이 작아 상기 회전부(10)의 회전시 회전부(10)의 상,하부(11,12) 간에서 이탈되어 질 수 있는 문제가 있다.In addition, when the force for fixing the PCB substrate 1 is less than 100Kgf, the upper and lower parts 11 and 12 have a small force for fixing the PCB substrate 1, and thus the rotating part 10 when the rotating part 10 is rotated. ), There is a problem that can be separated between the upper and lower (11, 12).
이와 반대로, 상기 PCB기판(1)을 고정시키는 힘이 200Kgf를 초과하면 PCB기판(1)이 파손될 수 있는 문제점이 발생 될 수 있다.On the contrary, if the force for fixing the PCB 1 exceeds 200 Kgf, the PCB substrate 1 may be damaged.
그리고, 상기 상,하부(11,12)의 하단과 상단이 접촉되는 부분에는 각각 대응되도록 고정부(14)가 형성되어 PCB기판(1)이 상기 고정부(14)를 통해 고정되도록 한다.In addition, fixing portions 14 are formed to correspond to portions at which the lower and upper ends of the upper and lower portions 11 and 12 contact, respectively, so that the PCB substrate 1 is fixed through the fixing portions 14.
상기 제2 단계(S20)는 상기 회전부(10)를 회전시키는 단계로서 회전용 벨트로 연결된 모터부(30)와 지주부(20)를 통해 회전하게 된다.The second step (S20) is to rotate through the motor unit 30 and the holding unit 20 is connected to the rotating belt to rotate the rotary unit 10.
이때, 상기 지주부(20)의 상,하측에는 동일한 직경으로 형성되는 제2 감김부(21)가 형성되고, 상기 회전부(10)의 상,하측에는 제1 감김부(15)가 동일한 직경으로 형성되어 회전용 벨트를 통해 상기 제1,2 감김부(15,21)가 연결되어 상기 지주부(20)의 회전으로 상기 회전부(10)가 회전된다.At this time, the upper and lower sides of the support portion 20 is formed with a second winding portion 21 is formed of the same diameter, the upper and lower sides of the rotating portion 10, the first winding portion 15 to the same diameter The first and second windings 15 and 21 are connected to each other by a rotation belt, and the rotation unit 10 is rotated by the rotation of the support unit 20.
그리고, 상기 회전부(10)를 회전시키는 다른 방법은 상기 회전부(10)의 상측 또는 하측에 직접 설치된 모터부(30)를 통해 회전하게 된다.In addition, another method of rotating the rotating unit 10 is to rotate through the motor unit 30 directly installed above or below the rotating unit 10.
상기 제3 단계(S30)는 상기 회전부(10)를 통해 회전되는 상기 PCB기판(1)을 가열부(40)를 통해 가열하는 단계이다.The third step S30 is a step of heating the PCB substrate 1 rotated through the rotating part 10 through the heating part 40.
이러한 제3 단계(S30)에서 상기 가열부(40)는 열풍을 공급하여 대상물을 가열하는 열풍기(hot gun)를 이용하게 된다.In this third step (S30), the heating unit 40 uses a hot gun to supply the hot air to heat the object.
여기서 상기 가열부(40)는 400 ~ 1000℃의 온도로 상기 PCB기판(1)을 가열하게 된다.Here, the heating unit 40 is to heat the PCB substrate 1 at a temperature of 400 ~ 1000 ℃.
이때, 상기 가열부(40)가 400℃이하로 상기 PCB기판(1)을 가열하게 되면 전자부품을 PCB기판(1)과 솔더링한 솔더가 제대로 녹지 않아 전자부품이 PCB기판(1)에서 분리되지 않는 문제점이 발생 될 수 있다.In this case, when the heating unit 40 heats the PCB substrate 1 below 400 ° C., the solder that solders the electronic component to the PCB substrate 1 does not melt properly, so that the electronic component is not separated from the PCB substrate 1. Problem may occur.
그리고, 상기 가열부(40)가 1000℃이상으로 상기 PCB기판(1)을 가열하게 되면 전자제품과 PCB기판(1)이 동시에 녹아 분리가 불가능할 수 있는 문제점이 발생 될 수 있다.In addition, when the heating unit 40 heats the PCB substrate 1 to 1000 ° C. or more, a problem may occur in which the electronic product and the PCB substrate 1 may be simultaneously melted and separated from each other.
상기 제4 단계(S40)는 상기 제3 단계(S30)를 통해 솔더가 녹아 상기 PCB기판(1)에서 분리되는 전자부품과 솔더를 회수부(13)를 통해 회수하는 단계이다.The fourth step S40 is a step of recovering the electronic component and solder separated from the PCB substrate 1 by melting the solder through the third step S30 through the recovery unit 13.
이때, 상기 회수부(13)를 통해 회수된 전자부품과 솔더는 각각 구분되어 따로 무게를 측정하여 분리비율을 도출하게 된다.At this time, the electronic components and the solder recovered through the recovery unit 13 are separated, respectively, and the separation ratio is derived by measuring the weight separately.
상기의 구성으로 제작된 유가금속 및 부품 회수장치와 회수방법을 이용하여 실시예의 결과처럼 전자부품 분리를 수행하였다. 사용된 PCB기판(1)은 각 제조사의 중간 크기(size) 중 크기가 유사한 기판을 임의 선정하여 분리도를 측정하고 실험을 실시하였다. Separation of electronic components was carried out using the valuable metal and parts recovery device and the recovery method manufactured as described above as in the result of the embodiment. The PCB substrate 1 used was randomly selected from similar sizes among the intermediate sizes of each manufacturer to measure the degree of separation and experiment.
실험의 변수를 설정하기 위하여 회전속도, 열풍의 온도 및 열풍의 가열시간을 설정하여 실험을 시도하였으나, 예비실험 결과 회전속도는 RPM을 1000으로 하였을 경우 분리가 이루어지지 않음으로 RPM을 1100으로 설정하고 열풍의 온도는 600℃ 로 가열하며 열풍의 유지시간을 주된 변수로 설정하여 실험을 수행하였다.In order to set the parameters of the experiment, the experiment was attempted by setting the rotational speed, the temperature of the hot wind, and the heating time of the hot wind. However, as a result of the preliminary experiment, when the RPM was set to 1000, the rotational speed was set to 1100. The temperature of the hot air was heated to 600 ℃ and the experiment was carried out by setting the maintenance time of the hot air as the main variable.
상기 PCB기판(1)이 고정된 회전부를 회전시키면서 상기 PCB기판(1)으로부터 부품이 분리되기 시작한 1분 이후에 부품수거 및 잠시 회전을 멈추고 사진을 찍은 후에 다시 2분 이상을 가열하여 PCB기판(1)이 녹기 직전까지 지속적으로 가열하며 회전하였다.1 minute after the component starts to separate from the PCB 1 while rotating the rotating part on which the PCB 1 is fixed, the parts are collected and temporarily stopped, and after taking a picture, the substrate is heated again for 2 minutes or more ( 1) It was continuously heated and heated until just before melting.
이는 아래의 식을 통해 계산되었다.This is calculated by the following equation.
상기 PCB기판(1)에서 분리된 부품의 중량계산을 위하여 다음의 식 1을 적용하여 계산하였다.In order to calculate the weight of the parts separated from the PCB substrate 1, the following equation 1 was applied.
Figure PCTKR2011009121-appb-I000001
(식 1)
Figure PCTKR2011009121-appb-I000001
(Equation 1)
(원심분리에 의하여 분리된 부품중량 = 회수장치의 회전부로 회전되는 PCB기판을 가열부로 가열하여 분리된 부품의 중량, Total 부품 weight = 원심분리에 의하여 분리된 부품중량 + 인두에 의하여 제거된 부품중량)(Part weight separated by centrifugation = Weight of separated part by heating PCB board rotated by rotating part of recovery device with heating part, Total part weight = Part weight separated by centrifugation + Part weight removed by iron) )
또한, 목표치에 있는 분리된 solder의 중량을 계산하기 위하여 다음의 식 2를 적용하여 계산하였다. In addition, the following equation 2 was applied to calculate the weight of the separated solder in the target value.
Figure PCTKR2011009121-appb-I000002
(식 2)
Figure PCTKR2011009121-appb-I000002
(Equation 2)
(분리전 PCB기판의 중량 (=PCB기판중량 + 총부품중량 + solder 중량): Total weight, 원심분리후 PCB기판(1)에 남은 solder의 무게: (원심분리후 기판의 중량 -(기판의 무게+강제로 제거된 부품))(Weight of PCB board before separation (= PCB board weight + total part weight + solder weight): Total weight, weight of solder remaining on PCB board 1 after centrifugation: (weight of board after centrifugation-(weight of board) + Forcibly removed parts))
또한, 목표치에 있는 PCB기판(1)으로 부터의 분리율을 계산하기 위하여 다음의 식 3을 적용하여 계산하였다.In addition, in order to calculate the separation rate from the PCB substrate (1) at the target value was calculated by applying the following equation 3.
Figure PCTKR2011009121-appb-I000003
(식 3)
Figure PCTKR2011009121-appb-I000003
(Equation 3)
상기의 계산식을 통하여 얻은 실시예 1 내지 4의 실험결과는 다음과 같다. Experimental results of Examples 1 to 4 obtained through the above formula are as follows.
실시예 1Example 1
초기중량 : 46.5960g(기판중량 : 30.9386g, 부품중량 : 14.7399g, 납의 중량 : 0.9121g)Initial weight: 46.5960g (Substrate weight: 30.9386g, Component weight: 14.7399g, Lead weight: 0.9121g)
표 1
가열시간 가열전 1분 3분 5분
무게 46.5906g 41.4650g 38.1242g 38.0275g
Table 1
Heating time Before heating 1 min 3 minutes 5 minutes
weight 46.5906 g 41.4650 g 38.1242 g 38.0275 g
상기의 실시한 결과에 나타난 바와 같이 가열시간 1분, 3분 및 5분으로 설정하여 PCB기판을 가열 후 무게를 측정하면, 1분 후에는 전자부품과 솔더가 일부 이탈되어 남은 PCB기판의 무게는 41.4650g이었다.As shown in the above results, when the PCB substrate is heated after setting the heating time to 1 minute, 3 minutes, and 5 minutes, the weight of the remaining PCB is 41.4650. g.
그리고 3분 후의 PCB기판 무게는 38.1242g이고, 5분 후의 무게는 38.0275g으로 측정되었다.After 3 minutes, the weight of the PCB board was 38.1242g, and after 5 minutes, the weight was 38.0275g.
이처럼 본 실험 결과에 의해서 5분 가열 후 떨어진 부품의 무게는 7.9655g 이었다. 그리고, 열풍으로 인해 제거된 납의 중량는 0.6300g이었다.As a result, the weight of the component dropped after 5 minutes of heating was 7.9655 g. And, the weight of lead removed by hot air was 0.6300 g.
이의 결과를 통해 도출된 분리된 솔더의 비율은 69.0714 wt% 이고, 부품 분리율은 54.0404 wt%이다.The proportion of separated solder derived through this result is 69.0714 wt%, and the component separation rate is 54.0404 wt%.
이때, 상기 솔더의 비율은 식 3을 변형한
Figure PCTKR2011009121-appb-I000004
(식 4)를 이용하여 계산한다. At this time, the solder ratio is modified by Equation 3
Figure PCTKR2011009121-appb-I000004
Calculate using (Equation 4).
또한, 상기 부품의 분리율은
Figure PCTKR2011009121-appb-I000005
(식 5)를 이용하여 계산한다.In addition, the separation rate of the parts
Figure PCTKR2011009121-appb-I000005
Calculate using (Equation 5).
그리고, 전체적인 PCB의 분리율을 상기 식 3를 통해 구하면 81.6205 wt%가 나왔다. In addition, 81.6205 wt% was obtained when the overall separation rate of the PCB was obtained through Equation 3.
실시예 2Example 2
초기중량 : 73.9001g(기판중량 : 28.6266g, 부품중량 : 39.0171g, 납의 중량 : 6.2465g)Initial weight: 73.9001g (Board weight: 28.6266g, Component weight: 39.0171g, Weight of lead: 6.2465g)
표 2
가열시간 가열전 1분 3분 5분
무게 73.9001g 73.9001g(변화없음) 55.0912g 53.1033g
TABLE 2
Heating time Before heating 1 min 3 minutes 5 minutes
weight 73.9001g 73.9001g (no change) 55.0912 g 53.1033g
상기의 실시한 결과에 나타난 바와 같이 가열시간 1분, 3분 및 5분으로 설정하여 PCB기판을 가열 후 무게를 측정하면, 1분 후에는 전자부품과 솔더가 일부 이탈되어 남은 PCB기판의 무게는 73.9001g으로 변화가 없었다.As shown in the above results, when the heating time is set to 1 minute, 3 minutes, and 5 minutes to measure the weight after heating the PCB, after 1 minute, the electronic parts and the solder are partially removed and the weight of the remaining PCB is 73.9001 There was no change in g.
그리고 3분 후의 PCB기판 무게는 55.0912g이고, 5분 후의 무게는 53.1033g으로 측정되었다.After 3 minutes, the PCB weight was 55.0912 g and after 5 minutes was 53.1033 g.
이처럼 본 실험 결과에 의해서 5분 가열 후 떨어진 부품의 무게는 18.4711g 이었다. 그리고, 열풍으로 인해 제거된 납의 중량는 4.4257g이었다.As a result, the weight of the part dropped after 5 minutes of heating was 18.4711g. And, the weight of lead removed by the hot air was 4.4257g.
이의 결과를 통해 도출된 분리된 솔더의 비율은 상기 식 4를 이용하여 계산하면, 70.7388 wt% 이고, 부품 분리율은 상기 식 5를 통해 계산하면 47.3410 wt%이다.The ratio of the separated solder derived through this result is 70.7388 wt%, calculated using Equation 4, and the component separation rate is 47.3410 wt%, calculated through Equation 5.
그리고, 전체적인 PCB의 분리율을 상기 식 3를 통해 구하면, 71.8582 wt%가 나왔다.Then, when the separation rate of the overall PCB is obtained through Equation 3, 71.8582 wt% was obtained.
실시예 3Example 3
초기중량 : 44.6904g(기판중량 : 20.5907g, 부품중량 : 22.6417g, 납의 중량 : 1.4580g)Initial weight: 44.6904g (Substrate weight: 20.5907g, Component weight: 22.6417g, Lead weight: 1.4580g)
표 3
가열시간 가열전 1분 3분 5분
무게 44.6904g 41.9930g 34.2301g 34.2301g(변화없음)
TABLE 3
Heating time Before heating 1 min 3 minutes 5 minutes
weight 44.6904 g 41.9930g 34.2301 g 34.2301 g (no change)
상기의 실시한 결과에 나타난 바와 같이 가열시간 1분, 3분 및 5분으로 설정하여 PCB기판을 가열 후 무게를 측정하면, 1분 후에는 전자부품과 솔더가 일부 이탈되어 남은 PCB기판의 무게는 41.9930g이었다.As shown in the above results, when the heating time is set to 1 minute, 3 minutes, and 5 minutes to measure the weight after heating the PCB, after 1 minute, the electronic component and the solder are partially removed and the remaining PCB weight is 41.9930 g.
그리고 3분 후의 PCB기판 무게는 34.2301g이고, 5분 후의 무게는 3분의 가열시간과 동일하게 34.2301g으로 변화가 없는 것으로 측정되었다.After 3 minutes, the PCB weight was 34.2301g, and the weight after 5 minutes was 34.2301g, the same as the heating time of 3 minutes.
이처럼 본 실험 결과에 의해서 5분 가열 후 떨어진 부품의 무게는 9.6973g 이었다. 그리고, 열풍으로 인해 제거된 납의 중량는 1.2630g이었다.As a result, the weight of the dropped component after heating for 5 minutes was 9.6973 g. And, the weight of lead removed by the hot air was 1.2630g.
이의 결과를 통해 도출된 분리된 솔더의 비율은 상기 식 4를 이용하여 계산하면 86.6255 wt% 이고, 부품 분리율은 상기 식 5를 통해 계산하면 42.8294 wt%이다.The ratio of the separated solder derived through this result is 86.6255 wt%, calculated using Equation 4, and the component separation rate is 42.8294 wt%, calculated through Equation 5.
그리고, 전체적인 PCB의 분리율을 식 3를 통해 구하면, 76.5938 wt%가 나왔다. Then, when the overall separation rate of the PCB is obtained through Equation 3, 76.5938 wt% was obtained.
실시예 4Example 4
초기중량 : 98.9045g(기판중량 : 57.3015g, 부품중량 : 37.6740g, 납의 중량 : 3.9290g)Initial weight: 98.9045g (Substrate weight: 57.3015g, Component weight: 37.6740g, Lead weight: 3.9290g)
표 4
가열시간 가열전 1분 3분 5분
무게 98.9045g 98.9045g(변화없음) 81.0541g 76.9023g
Table 4
Heating time Before heating 1 min 3 minutes 5 minutes
weight 98.9045 g 98.9045g (no change) 81.0541 g 76.9023 g
상기의 실시한 결과에 나타난 바와 같이 가열시간 1분, 3분 및 5분으로 설정하여 PCB기판을 가열 후 무게를 측정하면, 1분 후에는 전자부품과 솔더가 일부 이탈되어 남은 PCB기판의 무게는 98.9045g으로 변화가 없었다.As shown in the above results, when the heating time is set to 1 minute, 3 minutes, and 5 minutes to measure the weight after heating the PCB, after 1 minute, the electronic components and the solder are partially removed and the weight of the remaining PCB is 98.9045. There was no change in g.
그리고 3분 후의 PCB기판 무게는 81.0541g이고, 5분 후의 무게는 76.9023g으로 측정되었다.The PCB substrate weight after 3 minutes was 81.0541g, and after 5 minutes the weight was 76.9023g.
이처럼 본 실험 결과에 의해서 5분 가열 후 떨어진 부품의 무게는 19.6517g 이었다. 그리고, 열풍으로 인해 제거된 납의 중량는 2.5505g이었다.As a result, the weight of the component dropped after 5 minutes of heating was 19.6517 g. And, the weight of lead removed by the hot air was 2.5505g.
이의 결과를 통해 도출된 분리된 솔더의 비율은 상기 식 4를 이용하여 계산하면 64.9147 wt% 이고, 부품 분리율은 상기 식 5를 이용하여 계산하면 52.1625 wt%이다.The ratio of the separated solder derived through this result is 64.9147 wt%, calculated using Equation 4, and the component separation rate is 52.1625 wt%, calculated using Equation 5.
그리고, 전체적인 PCB의 분리율을 식 3를 통해 구하면, 77.7540 wt%가 나왔다. Then, when the overall separation rate of the PCB is obtained through Equation 3, 77.7540 wt% was obtained.
상기의 실시예 1 내지 4의 PCB기판(1)의 분리율 및 솔더금속의 회수율을 소수점 첫번째 자리까지 표시하여 정리한 결과를 다음 표 5에 나타내었다.Table 5 shows the results of arranging the separation rate and the recovery rate of the solder metal of the PCB board 1 of Examples 1 to 4 to the first decimal place.
이러한 표 5의 결과값에 대한 초기 조건은 모두 동일하도록 가열온도 600℃에 회전속도 1100RPM으로 설정하고, 가열시간은 최대인 5분으로 설정한 것이다. 그리고 소수점 둘째 자리에서는 반올림하여 표시한다.The initial conditions for the results shown in Table 5 are set to a rotational speed of 1100 RPM at a heating temperature of 600 ° C., and the heating time is set to a maximum of 5 minutes so that all are the same. In the second decimal place, it is rounded up.
표 5
번호 PCB분리율 (wt%) 솔더금속회수율 (wt%)
실시예 1 81.6 69.1
실시예 2 71.9 70.7
실시예 3 76.6 86.2
실시예 4 77.8 64.9
Table 5
number PCB Separation Rate (wt%) Solder Metal Recovery (wt%)
Example 1 81.6 69.1
Example 2 71.9 70.7
Example 3 76.6 86.2
Example 4 77.8 64.9
이처럼 상기 표 5에 도시된 바와 같이 상기의 실시예 1은 전자부품이 PCB기판(1)에서 분리되는 분리율이 81.6 wt%이고, 상기 PCB기판(1)과 전자부품을 솔더링하는 솔더 금속의 회수율은 69.1 wt%임을 알 수 있다.As shown in Table 5, in Example 1, the separation rate of the electronic component separated from the PCB substrate 1 is 81.6 wt%, and the recovery rate of the solder metal soldering the PCB substrate 1 and the electronic component is It can be seen that it is 69.1 wt%.
그리고, 실시예 2는 전자부품이 PCB기판(1)에서 분리되는 분리율이 71.9 wt%이고, 상기 PCB기판(1)과 전자부품을 솔더링하는 솔더 금속의 회수율은 70.7 wt%임을 알 수 있다.In Example 2, the separation rate of the electronic component separated from the PCB 1 is 71.9 wt%, and the recovery rate of the solder metal soldering the PCB 1 and the electronic component is 70.7 wt%.
또한, 실시예 3은 전자부품이 PCB기판(1)에서 분리되는 분리율이 76.6 wt%이고, 상기 PCB기판(1)과 전자부품을 솔더링하는 솔더 금속의 회수율은 86.2 wt%임을 알 수 있다.In addition, in Example 3, the separation rate of the electronic component separated from the PCB substrate 1 is 76.6 wt%, and the recovery rate of the solder metal for soldering the PCB substrate 1 and the electronic component is 86.2 wt%.
그리고, 실시예 4은 전자부품이 PCB기판(1)에서 분리되는 분리율이 77.8 wt%이고, 상기 PCB기판(1)과 전자부품을 솔더링하는 솔더 금속의 회수율은 64.9 wt%임을 알 수 있다.In Example 4, the separation rate of the electronic component from the PCB 1 is 77.8 wt%, and the recovery rate of the solder metal for soldering the PCB 1 and the electronic component is 64.9 wt%.
상기의 실시예 1 내지 4의 결과에서처럼 물리적인 방법을 통해 전자부품과 솔더를 PCB기판에서 분리할 때의 회수율이 높음을 알 수 있다.As shown in the results of Examples 1 to 4 above, it can be seen that a high recovery rate when the electronic component and the solder are separated from the PCB by the physical method.
여기서 상기 분리율과 회수율은 상기 식 1 내지 식 5를 이용하여 구하게 된다.Here, the separation rate and the recovery rate are obtained using the above Formulas 1 to 5.
이처럼 상기의 구성으로 전자부품과 솔더를 PCB기판(1)에서 분리하는 방법은 상기 회전부(10)의 상하부 간에 PCB기판(1)을 삽입 고정하고, 상기 모터부(30)를 작동시켜 상기 지주부(20)를 통해 상기 회전부(10)의 상,하부(11,12)가 동일한 속도로 회전되도록 한다.As described above, the electronic component and the solder may be separated from the PCB 1 by inserting and fixing the PCB 1 between the upper and lower parts of the rotating part 10, and operating the motor part 30 to operate the holding part. Through 20, the upper and lower parts 11 and 12 of the rotating part 10 are rotated at the same speed.
이때, 상기 회전부(10)의 상,하부(11,12)는 공압 실린더 형태로 형성되어 외부의 공압펌프를 통해 작동되며, 상하 방향으로 10 ~ 20mm 승강되어 상,하부 간에 PCB기판(1)이 삽입될 수 있도록 한다.At this time, the upper and lower parts 11 and 12 of the rotating part 10 are formed in the form of pneumatic cylinders and are operated through an external pneumatic pump, and the PCB substrate 1 is moved up and down by 10 to 20 mm in the vertical direction. To be inserted.
그런 다음 상기 가열부(40)를 작동시켜 상기 PCB기판(1)을 가열하게 되면, 상기 PCB기판(1) 상의 전자부품이 PCB기판(1)에서 이탈되어 회수부(13)에 저장된다.Then, when the heating unit 40 is operated to heat the PCB substrate 1, the electronic components on the PCB substrate 1 are separated from the PCB substrate 1 and stored in the recovery unit 13.
이때, 상기 가열부(40)의 가열온도는 400 ~ 1000℃의 범위를 갖는다.At this time, the heating temperature of the heating unit 40 has a range of 400 ~ 1000 ℃.
그리고, 상기 모터부(30)를 통해 회전하는 회전부(10)의 상측에 결합된 모터(50)가 상기 회전부(10)의 회전속도를 가속하거나 감속할 수 있다.In addition, the motor 50 coupled to the upper side of the rotating unit 10 rotating through the motor unit 30 may accelerate or reduce the rotation speed of the rotating unit 10.
또한, 상기 모터를 통해 상기 모터부가 동작되지 않아도 상기 모터를 이용하여 상기 회전부를 회전시킬 수 있다.In addition, even if the motor unit is not operated through the motor, the rotating unit may be rotated using the motor.
이는 상기 상부(11)가 지주부(20)와 연결되므로 상기 하부(12)의 회전속도 또한 조절할 수 있다.It is also possible to adjust the rotational speed of the lower portion 12 because the upper portion 11 is connected to the holding portion (20).
이때 회전속도는 600 ~ 1300RPM의 범위에서 회전된다.At this time, the rotation speed is rotated in the range of 600 ~ 1300RPM.
다른 일실시 예를 통해 PCB기판의 전자부품과 솔더를 분리하는 방법은, 상기 회전부의 상하부 간에 PCB기판(1)을 삽입 고정하고, 상기 모터부(30)를 작동시켜 상기 회전부(10)의 상,하부(11,12)가 회전되도록 한다.According to another embodiment of the present invention, a method of separating an electronic component and a solder from a PCB is performed by inserting and fixing a PCB substrate 1 between the upper and lower portions of the rotating unit, and operating the motor unit 30 to form an upper portion of the rotating unit 10. The lower parts 11 and 12 are rotated.
이때, 상기 회전부(10)의 상,하부(11,12)는 공압 실린더 형태로 형성되어 외부의 공압펌프를 통해 작동되며, 상하 방향으로 10 ~ 20mm 승강되어 상,하부 간에 PCB기판(1)이 삽입될 수 있도록 한다.At this time, the upper and lower parts 11 and 12 of the rotating part 10 are formed in the form of pneumatic cylinders and are operated through an external pneumatic pump, and the PCB substrate 1 is moved up and down by 10 to 20 mm in the vertical direction. To be inserted.
그런 다음 상기 가열부(40)를 작동시켜 상기 PCB기판(1)을 가열하게 되면, 상기 PCB기판(1) 상의 전자부품이 PCB기판(1)에서 이탈되어 회수부(13)에 저장된다.Then, when the heating unit 40 is operated to heat the PCB substrate 1, the electronic components on the PCB substrate 1 are separated from the PCB substrate 1 and stored in the recovery unit 13.
이때, 회전속도는 600 ~ 1300RPM의 범위에서 회전된다.At this time, the rotation speed is rotated in the range of 600 ~ 1300RPM.
그리고, 상기 가열부(40)의 가열온도는 400 ~ 1000℃의 범위를 갖는다.And, the heating temperature of the heating unit 40 has a range of 400 ~ 1000 ℃.
이와같이 구성된 본 발명은 PCB기판(1)을 회전시킴과 동시에 가열부(40)로 PCB기판(1)을 가열하여 PCB기판(1)상의 전자부품과 솔더를 원심력과 열을 이용하여 분리하게 되므로 PCB기판(1)의 용융에 따른 에너지 소비가 줄어들게 되며, PCB기판(1)을 용융하지 않으므로 공해 발생이 줄어들게 되는 이점이 있다.The present invention configured as described above rotates the PCB substrate 1 and simultaneously heats the PCB substrate 1 with the heating part 40 to separate electronic components and solder on the PCB substrate 1 using centrifugal force and heat. Energy consumption due to the melting of the substrate 1 is reduced, and since the PCB substrate 1 is not melted, there is an advantage of reducing pollution.
상기의 본 발명은 바람직한 실시예를 중심으로 살펴보았으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 본질적 기술 범위 내에서 상기 본 발명의 상세한 설명과 다른 형태의 실시예들을 구현할 수 있을 것이다. 여기서 본 발명의 본질적 기술범위는 특허청구범위에 나타나 있으며, 그와 비슷한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.The present invention has been described with reference to the preferred embodiments, and those skilled in the art to which the present invention pertains to the detailed description of the present invention and other forms of embodiments within the essential technical scope of the present invention. Could be. Here, the essential technical scope of the present invention is shown in the claims, and all differences within the similar scope should be interpreted as being included in the present invention.
<부호의 설명><Description of the code>
1 : PCB기판 10 : 회전부1: PCB board 10: rotating part
11 : 상부 12 : 하부11: top 12: bottom
13 : 회수부 14 : 고정부13: recovery part 14: fixing part
15 : 제1 감김부 20 : 지주부15: first winding portion 20: holding portion
21 : 제2 감김부 30 : 모터부21: second winding 30: motor
40 : 가열부 40: heating unit

Claims (16)

  1. 전자부품이 실장된 PCB기판이 고정되고, 외부의 회전동력에 의해 회전되는 회전부;A rotating part on which a PCB board on which electronic components are mounted is fixed and rotated by external rotational power;
    상기 회전부에 고정되는 PCB기판을 일정온도로 가열하는 가열부; 및A heating unit for heating the PCB substrate fixed to the rotating unit to a predetermined temperature; And
    상기 회전부에 형성되어 PCB기판으로부터 이탈된 전자부품과 솔더가 저장되는 회수부;를 포함하는, PCB기판의 유가금속 및 부품 회수장치.Valuable metal and parts recovery device for a PCB substrate, including; the recovery unit is formed in the rotating portion is stored in the electronic component and solder separated from the PCB substrate.
  2. 제 1항에 있어서,The method of claim 1,
    상기 회전부는 상부와 하부로 각각 구성되고, 상기 상,하부 간에 PCB기판이 고정되도록 고정부가 형성되며, 상기 상,하부는 공압실린더 형태로 이루어져 상,하측으로 각각 승강 되어 상기 PCB기판을 고정하는, PCB기판의 유가금속 및 부품 회수장치.The rotating part is configured as an upper portion and a lower portion, and a fixing portion is formed to fix the PCB substrate between the upper and lower portions, and the upper and lower portions are formed by pneumatic cylinders to be respectively lifted up and down to fix the PCB substrate. Valuable metal and parts recovery device for PCB.
  3. 제 1항에 있어서,The method of claim 1,
    상기 회전부의 상,하측에 형성되는 제1 감김부와 회전용 벨트를 통해 연결되는 제2 감김부가 형성되며, 봉형상을 가지며 수직으로 설치되고, 외부의 회전동력을 통해 회전하여 상기 회전부를 연동 회전시키는 지주부를 더 포함하는, PCB기판의 유가금속 및 부품 회수장치.A first winding portion formed on the upper and lower sides of the rotating portion and a second winding portion connected through the rotating belt are formed, have a rod shape, are vertically installed, and rotate through an external rotational power to interlock the rotating portion. A device for recovering valuable metals and components of a PCB substrate, the apparatus further comprising a support for rotating.
  4. 제 3항에 있어서The method of claim 3
    상기 지주부와 회전용 벨트로 연결되어 상기 지주부를 회전시키는 모터부를 더 포함하는, PCB기판의 유가금속 및 부품 회수장치.And a motor part connected to the support part and the rotating belt to rotate the support part.
  5. 제 3항에 있어서,The method of claim 3, wherein
    상기 지주부의 상하측 제2 감김부와 상기 회전부의 상하측 제1 감김부는 상기 회전부 상,하부의 동일한 회전을 위해 각각 동일한 직경을 가지고 형성되는, PCB기판의 유가금속 및 부품 회수장치.The upper and lower second winding portions of the support portion and the upper and lower first winding portions of the rotating portion are formed with the same diameter for the same rotation of the upper and lower rotation portions, respectively, valuable metal and parts recovery apparatus of the PCB substrate.
  6. 제 1항에 있어서,The method of claim 1,
    상기 가열부는 상기 PCB기판에 열풍을 가하는 열풍기인, PCB기판의 유가금속 및 부품 회수장치.The heating unit is a hot air fan for applying hot air to the PCB substrate, valuable metal and parts recovery device of the PCB substrate.
  7. 전자부품이 실장된 PCB기판이 고정되고, 회전되는 회전부;A rotating unit to which the PCB mounted with electronic components is fixed and rotated;
    상기 회전부를 회전시키는 모터부;A motor unit for rotating the rotating unit;
    상기 PCB기판이 고정되는 회전부에 형성되어 이탈된 전자부품과 솔더가 저장되는 회수부; 및A recovery part which is formed on the rotating part to which the PCB substrate is fixed, and stores the separated electronic parts and solder; And
    상기 회전부에 고정되는 PCB기판을 가열하는 가열부;를 포함하는 PCB기판의 유가금속 및 부품 회수장치.Valuable metal and parts recovery device for a PCB substrate comprising a; heating unit for heating the PCB substrate fixed to the rotating unit.
  8. 제 7항에 있어서,The method of claim 7, wherein
    상기 회전부는 상부와 하부로 각각 구성되고, 상기 상,하부 간에 PCB기판이 개재되어 고정되며, 상기 상,하부는 공압실린더 형태로 이루어져 상,하측으로 각각 승하강 되어 상기 PCB기판을 고정하는, PCB기판의 유가금속 및 부품 회수장치.The rotating part is composed of an upper portion and a lower portion, and the PCB substrate is interposed between the upper and the lower portion is fixed, the upper and lower portions are formed in a pneumatic cylinder, respectively, the upper and lower sides are lifted to fix the PCB substrate, PCB Valuable metal and part recovery device for substrate.
  9. 제 7항에 있어서,The method of claim 7, wherein
    상기 모터부는 상기 회전부의 상측 또는 하측에 설치되는, PCB기판의 유가금속 및 부품 회수장치The motor unit is installed on the upper or lower side of the rotating unit, valuable metal and parts recovery device of the PCB substrate
  10. 제 7항에 있어서, The method of claim 7, wherein
    상기 모터부는 상기 회전부의 상측과 하측에 설치되는, PCB기판의 유가금속 및 부품 회수장치.The motor unit is installed on the upper side and the lower side of the rotating unit, valuable metal and parts recovery device of the PCB substrate.
  11. 제 7항에 있어서,The method of claim 7, wherein
    상기 가열부는 상기 PCB기판에 열풍을 가하는 열풍기인, PCB기판의 유가금속 및 부품 회수장치.The heating unit is a hot air fan for applying hot air to the PCB substrate, valuable metal and parts recovery device of the PCB substrate.
  12. 전자부품이 실장된 PCB기판을 회전부에 고정시키는 제1 단계;A first step of fixing the PCB on which the electronic component is mounted to the rotating unit;
    상기 회전부를 일방향으로 회전시키는 제2 단계;A second step of rotating the rotating unit in one direction;
    상기 회전되는 PCB기판을 가열부를 통해 가열하는 제3 단계; 및A third step of heating the rotated PCB substrate through a heating unit; And
    상기 가열부를 통해 가열된 PCB기판 상의 부품 및 솔더가 회수부를 통해 회수되는 제4 단계;를 포함하는, PCB기판의 유가금속 및 부품 회수장치를 이용한 회수방법.And a fourth step of recovering the parts and the solder on the PCB board heated by the heating unit through the recovery unit.
  13. 제 12항에 있어서,The method of claim 12,
    상기 회전부는 회전용 벨트로 연결된 모터부와 지주부를 통해 회전되는, PCB기판의 유가금속 및 부품 회수장치를 이용한 회수방법.The rotating unit is rotated through the motor and the support portion connected to the belt for rotation, recovery method using a valuable metal and parts recovery device of the PCB substrate.
  14. 제 13항에 있어서,The method of claim 13,
    상기 지주부의 상,하측에는 동일한 직경으로 형성되는 제2 감김부가 형성되고, 상기 회전부의 상,하측에는 제1 감김부가 동일한 직경으로 형성되는, PCB기판의 유가금속 및 부품 회수장치를 이용한 회수방법.The upper and lower sides of the support portion is formed with a second winding portion formed with the same diameter, the upper and lower sides of the rotating portion is formed with the same winding portion, the recovery of the valuable metal of the PCB substrate and parts recovery apparatus Way.
  15. 제 12항에 있어서,The method of claim 12,
    상기 회전부는 상측 또는 하측에 설치된 모터부를 통해 회전하는, PCB기판의 유가금속 및 부품 회수장치를 이용한 회수방법.The rotating unit is rotated through a motor unit installed on the upper or lower side, recovery method using a valuable metal and parts recovery device of the PCB substrate.
  16. 제 12항에 있어서,The method of claim 12,
    상기 회전부는 공압실린더 형태로 형성된 상,하부가 중단측으로 작동되어 상기 PCB기판을 상하방향에서 눌러 고정하는, PCB기판의 유가금속 및 부품 회수장치를 이용한 회수방법.The rotating part is formed in the pneumatic cylinder form, the upper and lower parts are operated to the stop side to press and fix the PCB substrate in the vertical direction, recovery method using a valuable metal and parts recovery device of the PCB substrate.
PCT/KR2011/009121 2010-12-01 2011-11-28 Apparatus for recovering precious metals and components from pcb substrate and recovering method using same WO2012074255A2 (en)

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KR101540104B1 (en) * 2015-02-24 2015-07-30 (주)대흥엠앤티 Rotary type metal recovering device
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KR101691014B1 (en) 2016-10-18 2016-12-29 (주)코어메탈 Apparatus for recovering high-value meatal
KR102001065B1 (en) * 2017-01-13 2019-07-17 주식회사 이알메탈 Apparatus for separating component from printed circuit board assembly
KR102265978B1 (en) 2019-02-25 2021-06-17 주식회사 신화전자 No Thermal Demount System of Chip for Analysis and Method Using Same
KR102106831B1 (en) 2020-02-24 2020-05-06 (주)대룡에이치앤씨 Valuable metal separate extraction collection device of waste PCB
KR102540077B1 (en) 2023-02-10 2023-06-05 (주)코어메탈 Waste metal recovery unit using step grinding method
KR102540080B1 (en) 2023-02-10 2023-06-05 (주)코어메탈 Waste metal recovery unit with iron separation efficiency is improved

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