WO2012064121A2 - 12v or 24v dc led lamp - Google Patents

12v or 24v dc led lamp Download PDF

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Publication number
WO2012064121A2
WO2012064121A2 PCT/KR2011/008549 KR2011008549W WO2012064121A2 WO 2012064121 A2 WO2012064121 A2 WO 2012064121A2 KR 2011008549 W KR2011008549 W KR 2011008549W WO 2012064121 A2 WO2012064121 A2 WO 2012064121A2
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WO
WIPO (PCT)
Prior art keywords
substrate
pair
heat sink
led
leds
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Application number
PCT/KR2011/008549
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French (fr)
Korean (ko)
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WO2012064121A3 (en
Inventor
김주호
박희수
이순홍
김규한
Original Assignee
남경 주식회사
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Publication date
Priority claimed from KR1020100137003A external-priority patent/KR101230976B1/en
Application filed by 남경 주식회사 filed Critical 남경 주식회사
Publication of WO2012064121A2 publication Critical patent/WO2012064121A2/en
Publication of WO2012064121A3 publication Critical patent/WO2012064121A3/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a DC 12V or 24V LED lighting, and more particularly, to facilitate the heat dissipation and diffusion in the substrate on which the LEDs are used as the interior lighting of the vehicle, and to provide a stable fixing structure of the substrate
  • the present invention relates to a DC 12V or 24V LED lighting lamp capable of waterproofing a space in which a substrate is disposed.
  • At least two lamps are installed in the interior of a vehicle to illuminate the interior of the vehicle, for example, a map lamp installed near the top of the driver's seat to illuminate near the driver's seat and a center lamp installed in the center of the vehicle to illuminate the entire interior space.
  • a heat transfer lamp that is conventionally illuminated by heat generated by heating a filament has been mainly used.
  • two electrodes for supply and demand can be divided into a type disposed side by side on one side of the lamp and a type disposed on both sides.
  • the former type is mainly used as a map lamp for low power, and the latter type is above medium power. It is mainly used as a center lamp.
  • the latter type is hereinafter referred to as a double-end cap type.
  • Korean Patent Application Publication No. 10-2009-0059273 mentions a conventional double-end cap type lamp.
  • the double-end cap type heat lamp 30 has a filament 38 housed inside a transparent and vacuum glass tube 36, preferably a cylindrical glass tube 36, and a metal material at both ends of the filament 36.
  • Supply electrode cap 32 is mounted to surround the end of the glass tube 36, the supply electrode cap 32 is also made of a cylindrical.
  • the conventional heat transfer lamp 30 is made of a filament which is a thin heating wire, its limit life is relatively short as about 3,000 hours, and there is a problem that the brightness is relatively low compared to power consumption, and mass production is difficult.
  • an object of the present invention is to securely secure the power sockets disposed on both ends of the substrate on which the LED is mounted on both ends of the substrate, the substrate is sealed through the power socket
  • the present invention provides a DC 12V or 24V LED lamp that can provide a stable assembly structure of the overall lamp configuration.
  • Another object of the present invention is to reduce the power consumption rate, to effectively prevent damage by external shocks, to protect the LED mounted on the substrate, and to waterproof the space in which the substrate on which the LED is mounted is installed. To provide DC 12V or 24V LED lights.
  • Still another object of the present invention is to provide a heat sink and a heat sink, which is a heat sink, and a DC 12V or 24V LED lamp that can easily dissipate heat generated by LEDs to the outside by facilitating heat transfer with each other.
  • the present invention provides a DC 12V or 24V LED lamp.
  • a pair of sealing caps having through holes through which the power sockets pass, and coupled to both ends of the heat sink and the diffusion tube.
  • the substrate is a rectangular plate-shaped LED mounting region portion on which the LEDs are mounted, a width narrower than the width of both ends of the LED mounting region portion protrudes from both ends of the LED mounting region portion of the pair of power sockets It consists of an extension area part of a square plate inserted inside.
  • fixing grooves having end portions of each of the pair of power sockets are fitted and fixed to both ends of the LED mounting area portion at the boundary of the extension area portion.
  • each of the pair of power sockets may further include a fixed end bent toward the center side, and a bending groove into which the fixed end may be inserted may be further formed at each end of each of the fixing grooves.
  • the inner circumference of the fixing grooves may be further provided with a close contact member made of an elastic material to be in close contact with the end of the power socket is inserted.
  • a waterproofing material is further applied to a space between the through hole of each of the pair of sealing caps and the outer surface of each of the pair of power sockets passing through the through hole, and the waterproofing material is formed of any one of epoxy, silicone, and polymer polymer. It is good to be done.
  • each of the pair of power sockets is further formed with a projection line protruding along the circumferential direction of the power socket, the projection groove is fitted into the inner periphery of the through hole of the pair of sealing caps Can be formed.
  • the inner circumference of the through-holes of the pair of sealing caps may further include support grooves through which both ends of the LED mounting area portion of the substrate are supported. Therefore, the pair of sealing caps can fasten the substrate, the heat sink and the diffusion tube at one time.
  • the both sides of the substrate is preferably provided with a fastening pad in close contact with the inner circumference of the sliding groove of the heat sink.
  • the substrate may have one or more fastening pads in a portion including an LED pattern region of the substrate or an upper pattern region of a bridge diode circuit of the substrate.
  • a plurality of via holes may be further formed in the substrate so as to be positioned in the vicinity of the LEDs, and the via holes may be opened toward the heat sink.
  • the heat sink is preferably a longitudinal section of the heat sink is any one of a circle, an ellipse, a square and a polygon, the heat sink is slidingly coupled to the substrate and the diffusion tube.
  • the diffusion tube is made of a resin polymer or a transparent resin containing a diffusing agent, it is preferable to have a pattern of any one of a circle, a semi-circle and a triangle.
  • the substrate is provided with a bridge diode circuit to allow the LEDs to operate regardless of whether + polarity or -polarity is connected to the power socket, electrically connected to the bridge diode circuit, and blinking by applying a constant voltage to the LEDs. It is desirable to have an LDI (LED Driver IC) that can reduce the phenomenon.
  • LDI LED Driver IC
  • the present invention stably secures the power sockets disposed on both ends of the substrate on which the LEDs are mounted on both ends of the substrate, and the substrate is fixed separately using a hermetic cap through which the power sockets pass, thereby providing a stable assembly structure of the overall lighting configuration. It can work.
  • the present invention has an effect that the substrate is provided with a heat sink that is slidingly inserted fixed, and provided with a diffusion tube detachably attached to the outer periphery of the heat sink can easily perform assembly and disassembly.
  • the present invention can reduce the power consumption rate, effectively prevent the damage by the external shock, and protect the LED mounted on the substrate, and also the effect of waterproofing the space in which the substrate on which the LED is mounted There is.
  • the present invention has an effect that can easily heat the heat generated by the light emission of the LEDs to the outside by the heat sink and the heat sink and the substrate to facilitate heat transfer to each other.
  • FIG. 1 is an exploded perspective view showing a DC 12V or 24V LED lamp of the present invention.
  • Figure 2 is a plan view showing a DC 12V or 24V LED lamp of the present invention.
  • Figure 3 is a side view showing a DC 12V or 24V LED lamp of the present invention.
  • FIG. 4 is a cross-sectional view along the line A-A of FIG.
  • FIG. 5 is a view showing the top and bottom of the substrate according to the present invention.
  • Figure 6 shows a substrate and a circuit having a bridge diode circuit according to the present invention.
  • the LED lamp of the present invention includes a substrate 100 on which the LEDs 10 are mounted, and a heat sink 200 that fixes the substrate 100 and covers the bottom of the substrate 100. ), A diffusion tube 300 that covers an upper portion (the LED 10 side) of the substrate 100 and is fixed to the heat sink 200, and a pair of power sockets fixed to both ends of the substrate 100 ( 500 and a pair of sealing caps 400 through which the power socket 500 penetrates and fastened to both ends of the diffusion tube 300 and the heat sink 200.
  • the substrate 100 has a width smaller than both end widths of the LED mounting region 110 formed in a rectangular plate shape, and is formed in a square plate shape from both ends of the LED mounting region 110. It is formed of an extended area portion 120 extending a predetermined length.
  • one or more LEDs 10 are mounted on the top surface of the LED mounting region 110.
  • a signal pattern through which signals are transmitted from the LEDs 10 is formed over the LED mounting region 110 and the extended region 120.
  • the substrate 100 is coupled to the heat sink 200.
  • the heat sink 200 has a predetermined length and is formed in a semicircular cross section.
  • sliding grooves 210 along the longitudinal direction are formed at both ends of the heat sink 200.
  • the substrate 100 may be inserted into the sliding groove 210 to be fixed. Accordingly, the substrate 100 may be fixed to the sliding groove 210 by being inserted into the sliding groove 210 at any one position of one side or the other side of the heat sink 200.
  • the heat sink 200 is formed of a metal material having a predetermined conductivity such as aluminum, and the heat dissipation protrusions 201 are formed on the outer circumference thereof to increase the contact area with air.
  • the heat sink 200 may have a longitudinal cross section of the heat sink 200 may be any one of a circle, an ellipse, a rectangle, and a polygon.
  • the heat sink 200 may be slidingly coupled to the substrate 100 and the diffusion tube 300.
  • fastening grooves 220 are formed along the longitudinal direction of both ends of the heat sink 200.
  • a support groove 411 is formed on the inner circumference of the through-hole 410 of the pair of sealing caps 400, through which both ends of the LED mounting region 110 of the substrate 100 penetrate and are supported. good.
  • both ends of the substrate 100 are inserted into the support grooves 411 formed in the inner circumference of each of the through holes 410 of the cap 400. Therefore, both ends of the substrate 100 may be inserted into the support grooves 411 of the through hole 410, and thus the left and right sides of the substrate 100 may be easily prevented from twisting.
  • the pair of sealing caps 400 according to the present invention may fasten the substrate 100, the heat sink 200, and the diffusion tube 300 at one time.
  • fastening pads 130 may be further provided on both surfaces of the substrate 100 to be in close contact with the inner circumference of the sliding groove 210 of the heat sink 200.
  • an LED pattern region of a lower end of the substrate 100 or an upper end of a bridge diode circuit of the substrate 100 may be used.
  • One or more fastening pads 130 may be provided at a portion having a pattern region.
  • the fastening pad 130 is preferably made of a metal.
  • the LEDs 10 mounted on the substrate 100 emit light
  • a predetermined heat is generated on the substrate 100.
  • the generated heat flows to the edge side of the substrate 100 through the body of the substrate 100.
  • it is in physical contact with the heat sink 200 made of metal through the fastening pad 130 formed on the substrate 100. Therefore, heat in the substrate 100 is easily transferred to the heat sink 200 through the fastening pad 130, and the heat may be radiated by the plurality of heat radiating protrusions 201.
  • a plurality of via holes 140 are further formed in the substrate 100 so as to be located in the vicinity of the LEDs 10, and the via holes 140 are opened toward the heat sink 200.
  • heat generated due to light emission of the LEDs 10 is transferred to the substrate 100 and exposed to the bottom of the substrate 100 through the via hole 140 formed in the peripheral area of the LEDs 10.
  • the internal space of the heat sink 200 is exposed. Therefore, heat generated in the substrate 100 can be easily radiated.
  • a metal material such as copper may be further coated in a thin film form on the inner circumference of the via holes 140 to facilitate heat transfer.
  • both ends of the diffusion tube 300 is fixed to the fastening groove 220 formed on the outer periphery of both ends of the heat sink 200.
  • the diffusion tube 300 forms a predetermined length and its cross section forms a semi-circle shape, and fastening protrusions 310 are formed at both ends thereof.
  • the fastening protrusion 310 is fitted into the fastening groove 220 formed on the outer periphery of both ends of the heat sink 200. Therefore, both ends of the diffusion tube 300 may be fastened and fixed to both ends of the heat sink 200 in a hooked manner. Accordingly, the diffusion tube 300 may cover the upper surface of the substrate 100 to diffuse the light emitted from the LEDs 10 to the outside.
  • an arbitrary diffusion pattern for diffusing light is formed on an outer surface of the diffusion tube 300, and the diffusion pattern forms a predetermined region, and different patterns are mixed in each region. It may be formed.
  • the diffusion tube 300 may be made of a resin polymer or transparent resin containing a diffusion agent.
  • the diffusion pattern may be formed of any one of a circle, a semicircle, and a triangle, and the pattern may be formed in any shape other than the shape.
  • both sides of the substrate 100 along the longitudinal direction thereof are fitted into the sliding groove 210 to be fixed to the heat sink 200, and the diffusion tube 300 covers the upper surface of the substrate 100 while both ends thereof. Hook is fixed to the fastening groove 220 formed on the outer periphery of both ends of the heat sink (200).
  • a pair of power sockets 500 are fixed to both ends of the substrate 100.
  • Each of the pair of power sockets 500 is made of a metal material, one end of which is open, forms a predetermined space therein, and the other end of the pair of power sockets 500 is sharply formed.
  • the portion that is substantially fixed to both ends of the substrate 100, that is, the end is one end of the power socket 500.
  • fixing grooves 111 are formed at both ends of the substrate 100, preferably at the LED mounting region 110, around the extension region 120. Accordingly, one end edge of each of the pair of power sockets 500 is seated and fixed to the fixing grooves 111 at each end of the LED mounting area unit 110. Accordingly, the pair of power sockets 500 may be prevented from flowing left and right up and down while being fixed to the substrate 100.
  • the inner circumference of the fixing grooves 111 in the present invention may be further provided with an elastic contact member in order to increase the adhesion with one end of the power sockets 500.
  • each of the power sockets 500 may be more stably fixed at both ends of the substrate 100.
  • a bending groove (not shown) may be further formed at an inner end of the fixing grooves 111, and one end of each of the pair of power sockets 500 may be bent to be inserted into the bending groove.
  • a fixed end (not shown) may be further formed. Accordingly, each of the power sockets 500 may be efficiently prevented from flowing back and forth, including up, down, left, and right, at both ends of the substrate 100.
  • the pair of sealing caps 400 may have a through hole 410 formed in the center thereof, and the power socket 500 may be penetrated through the through hole 410.
  • the sealing cap 400 may be sealed by being fitted at both ends of the diffusion tube 300 and the heat sink 200 coupled to each other as mentioned above.
  • the space where the substrate 100 is installed may not be waterproofed. have. Therefore, in the present invention, as described above, a predetermined amount of a waterproof material capable of sealing and waterproofing the clearance gap formed between the outer circumference of the through hole 410 and the power socket 500 is applied.
  • the waterproof material may serve to secure the power socket 500 and the sealing cap 400 by using any one of an epoxy, a silicone, and a polymer polymer, as well as performing a waterproof function.
  • a protruding line (not shown) protruding along the circumferential direction of the power socket 500 may be further formed on the outer surface of each of the pair of power sockets 500. Accordingly, a protrusion groove (not shown) into which the protrusion line is fitted may be further formed in the inner circumference of the through hole 410 of the pair of sealing caps 400.
  • each of the pair of sealing cap 400 is fitted to both ends of the diffusion tube 300 and the heat sink 200 while the power socket 500 is penetrated through the through hole 410,
  • the protrusion groove formed in the inner circumference of the through hole 410 of the sealing cap 400 may be fitted with a protrusion line protruding from the outer circumference of the power socket 500.
  • the sealing cap 400 and the power socket 500 may be fixed to each other, and may form a sealing line capable of performing a waterproof function even without applying a waterproofing material due to the fitting between the projection line and the projection groove.
  • an additional waterproofing material may be further applied between the through hole 410 and the outer circumference of the power socket 500 to achieve additional waterproofing.
  • the LED lamp of the present invention includes two power sockets 500 electrically connected to the LEDs 10 of the substrate 100 at both ends of the substrate 100, and the substrate 100 is shown in FIG. 6.
  • the LEDs 10 can operate regardless of whether + polarity or -polarity is applied to the power socket 500. That is, the power socket 500 can be used regardless of the contact direction of the + and-electrodes. Operation of the bridge diode circuit can be understood by those skilled in the art, and thus a detailed description thereof will be omitted.
  • the substrate 100 is electrically connected to the bridge diode circuit and includes an LED driver IC (LDI) 141 that can reduce flicker by applying a constant voltage to the LEDs 10.
  • the LDI receives a voltage of 10V to 40V and converts it into a constant voltage (for example, 9V) in which the LED 10 can operate.
  • a constant voltage for example, 9V
  • the LEDs 10 can operate stably.
  • the constant voltage is applied to the LEDs 10, the flicker phenomenon in which the LEDs 10 flicker due to voltage instability may be eliminated.
  • the present invention can be used in the field of manufacture such as LED lighting.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The present invention relates to a 12V or 24V DC LED lamp. The 12V or 24V DC LED lamp of the present invention comprises: a substrate on which LEDs are mounted; a pair of power sockets coupled to either end of the substrate so as to apply power from an external source to the LEDs; a heat sink, the inner surface of which has a sliding groove for the slidable insertion and fixation of the substrate, and the outer surface of which has coupling grooves, and which covers a bottom surface of the substrate; a diffusion tube which covers the upper portions of the LEDs and both ends of which are inserted into the coupling grooves; and a pair of sealing caps having through-holes for coupling to the power sockets, and being coupled to the ends of the heat sink and diffusion tube, respectively. According to the present invention, heat dissipation and light diffusion are easily carried out at the substrate on which LEDs to be used as vehicle indoor lighting are mounted, a structure of stably fixing the substrate is provided, and a space in which the substrate is arranged is waterproofed.

Description

DC 12V 또는 24V 엘이디 조명등DC 12V or 24V LED lighting
본 발명은 DC 12V 또는 24V 엘이디 조명등에 관한 것으로서, 보다 상세하게는 차량의 실내 조명으로 사용되는 엘이디들이 실장되는 기판에서의 방열 및 확산을 용이하게 실시함과 아울러, 기판의 안정적인 고정 구조를 제공하고, 기판이 배치된 공간을 방수할 수 있는 DC 12V 또는 24V 엘이디 조명등에 관한 것이다.The present invention relates to a DC 12V or 24V LED lighting, and more particularly, to facilitate the heat dissipation and diffusion in the substrate on which the LEDs are used as the interior lighting of the vehicle, and to provide a stable fixing structure of the substrate The present invention relates to a DC 12V or 24V LED lighting lamp capable of waterproofing a space in which a substrate is disposed.
일반적으로 차량의 실내에는 차량 내부를 조명하기 위해 적어도 2개 이상의 램프, 예를 들어 운전석 상부 천장에 설치되어 운전석 부근을 조명하는 맵 램프와 차량의 중앙에 설치되어 실내 공간 전체를 조명하는 센터 램프 등이 구비되어 있다. 이러한 실내등으로 종래에는 필라멘트를 가열하여 발생하는 열에 의해 조명하는 전열 램프가 주로 사용되어왔다. 그리고 이러한 전열 램프에는 수급용의 두 전극이 램프의 일측에 나란히 배치된 타입과 양측에 배치된 타입으로 구분할 수 있는데, 전자의 타입은 저전력용으로 주로 맵 램프로 사용되고 있고 후자의 타입은 중전력 이상으로 주로 센터 램프로 사용되고 있다. 이하 후자의 타입을 더블-엔드 캡(Doubleend Cap) 타입이라 한다.Generally, at least two lamps are installed in the interior of a vehicle to illuminate the interior of the vehicle, for example, a map lamp installed near the top of the driver's seat to illuminate near the driver's seat and a center lamp installed in the center of the vehicle to illuminate the entire interior space. It is provided. In such a room lamp, a heat transfer lamp that is conventionally illuminated by heat generated by heating a filament has been mainly used. In this heat transfer lamp, two electrodes for supply and demand can be divided into a type disposed side by side on one side of the lamp and a type disposed on both sides. The former type is mainly used as a map lamp for low power, and the latter type is above medium power. It is mainly used as a center lamp. The latter type is hereinafter referred to as a double-end cap type.
대한민국특허청 공개특허공보 공개번호 10-2009-0059273에는 종래의 더블-엔드 캡 타입의 램프가 언급된다.Korean Patent Application Publication No. 10-2009-0059273 mentions a conventional double-end cap type lamp.
더블-엔드 캡 타입의 전열 램프(30)는 투명하고 진공인 유리관(36), 바람직하게는 원통형의 유리관(36) 내부에 필라멘트(38)가 수납되고, 이러한 필라멘트(36) 양단에 금속 재질의 수급용 전극 캡(32)이 유리관(36)의 단부를 감싸도록 장착되어 이루어지는데, 수급용 전극 캡(32) 역시 원통형으로 이루어져 있다.The double-end cap type heat lamp 30 has a filament 38 housed inside a transparent and vacuum glass tube 36, preferably a cylindrical glass tube 36, and a metal material at both ends of the filament 36. Supply electrode cap 32 is mounted to surround the end of the glass tube 36, the supply electrode cap 32 is also made of a cylindrical.
이러한 종래의 전열 램프(30)는 가느다란 전열선인 필라멘트로 이루어져 있기 때문에 그 한계 수명이 3,000 시간 정도로 상대적으로 짧을 뿐만 아니라 소비전력 대비 밝기가 상대적으로 낮고, 대량 생산이 어렵다고 하는 문제점이 있었다.Since the conventional heat transfer lamp 30 is made of a filament which is a thin heating wire, its limit life is relatively short as about 3,000 hours, and there is a problem that the brightness is relatively low compared to power consumption, and mass production is difficult.
또한, 유리 커버를 사용하는 제품이기 때문에 외부의 충격에 의하여 쉽게 파소 파손이 심하게 일어나는 문제점이 있었다. 이에 더하여, 발열 현상이 높고, 제품 교체 주기 및 유지 보수가 어려운 문제점도 있다.In addition, since it is a product using a glass cover, there is a problem that breakage easily occurs severely due to external impact. In addition, there is a problem that the heat generation is high, and the product replacement cycle and maintenance is difficult.
본 발명은 상기와 같은 문제점을 해결하기 위하여 창출된 것으로서, 본 발명의 목적은 엘이디들이 실장되는 기판의 양단에 배치되는 전원 소켓을 기판의 양단에 안정적으로 고정시키고, 기판은 전원 소켓이 관통되는 밀폐 캡을 사용하여 별도로 고정함으로써, 전체적인 조명등 구성의 안정적인 조립 구조를 제공할 수 있는 DC 12V 또는 24V 엘이디 조명등을 제공함에 있다.The present invention has been created to solve the above problems, an object of the present invention is to securely secure the power sockets disposed on both ends of the substrate on which the LED is mounted on both ends of the substrate, the substrate is sealed through the power socket By fixing separately using a cap, the present invention provides a DC 12V or 24V LED lamp that can provide a stable assembly structure of the overall lamp configuration.
본 발명의 다른 목적은 기판이 슬라이딩 삽입 고정되는 히트 싱크를 구비하고, 히트 싱크의 외주에 착탈되는 확산 튜브를 구비하여 조립 및 분해를 쉽게 수행할 수 있는 DC 12V 또는 24V 엘이디 조명등을 제공함에 있다.It is another object of the present invention to provide a DC 12V or 24V LED lamp having a heat sink in which a substrate is slidingly inserted and fixed, and having a diffusion tube detachably attached to an outer circumference of the heat sink to facilitate assembly and disassembly.
본 발명의 또 다른 목적은 전력 소모율을 줄일 수 있고, 외부의 충격에 의하여 파손되는 것을 효율적으로 방지하며, 기판에 실장되는 엘이디를 보호함과 아울러, 엘이디가 실장되는 기판이 설치된 공간을 방수할 수 있는 DC 12V 또는 24V 엘이디 조명등을 제공함에 있다.Another object of the present invention is to reduce the power consumption rate, to effectively prevent damage by external shocks, to protect the LED mounted on the substrate, and to waterproof the space in which the substrate on which the LED is mounted is installed. To provide DC 12V or 24V LED lights.
본 발명의 또 다른 목적은 히트 싱크인 히트 싱크와 기판과 서로 열전달이 용이하도록하여 엘이디들의 발광으로 인하여 발생되는 열을 외부로 용이하게 방열시킬 수 있는 DC 12V 또는 24V 엘이디 조명등을 제공함에 있다.Still another object of the present invention is to provide a heat sink and a heat sink, which is a heat sink, and a DC 12V or 24V LED lamp that can easily dissipate heat generated by LEDs to the outside by facilitating heat transfer with each other.
바람직한 양태에 있어서, 본 발명은 DC 12V 또는 24V 엘이디 조명등을 제공한다.In a preferred embodiment, the present invention provides a DC 12V or 24V LED lamp.
상기 DC 12V 또는 24V 엘이디 조명등은 엘이디들이 실장되는 기판과; 상기 기판의 양단과 결합되며, 상기 엘이디들로 외부로부터의 전원을 인가하는 한 쌍의 전원 소켓과; 내주에 상기 기판이 슬라이딩 삽입되어 고정되는 슬라이딩 홈이 형성되고, 외주에 체결홈이 형성되며, 상기 기판의 저면부를 커버하는 히트 싱크와; 상기 엘이디들의 상부를 커버하고, 양측단이 상기 체결홈에 끼워지는 확산 튜브; 및 상기 전원 소켓이 관통하는 관통홀이 형성되며, 상기 히트 싱크 및 상기 확산 튜브의 양단과 결합되는 한 쌍의 밀폐 캡을 포함한다.The DC 12V or 24V LED lighting lamp and the substrate on which the LED is mounted; A pair of power sockets coupled to both ends of the substrate and configured to apply power from the outside to the LEDs; A heat sink in which a sliding groove is formed in which the substrate is slidably inserted and fixed, a fastening groove is formed in the outer circumference, and covers a bottom portion of the substrate; A diffusion tube covering an upper portion of the LEDs, and both ends of which are fitted into the fastening grooves; And a pair of sealing caps having through holes through which the power sockets pass, and coupled to both ends of the heat sink and the diffusion tube.
여기서, 상기 기판은, 상기 엘이디들이 실장되는 사각 판상의 엘이디 실장 영역부와, 상기 엘이디 실장 영역부의 양단 폭보다 좁은 폭을 이루어 상기 엘이디 실장 영역부의 양단으로부터 일정 길이 돌출되고 상기 한 쌍의 전원 소켓의 내부에 삽입되는 사각 판상의 연장 영역부로 이루어진다.Here, the substrate is a rectangular plate-shaped LED mounting region portion on which the LEDs are mounted, a width narrower than the width of both ends of the LED mounting region portion protrudes from both ends of the LED mounting region portion of the pair of power sockets It consists of an extension area part of a square plate inserted inside.
또한, 상기 연장 영역부를 경계로 상기 엘이디 실장 영역부의 양단에는 상기 한 쌍의 전원 소켓 각각의 단부가 끼워져 고정되는 고정홈들이 형성되는 것이 바람직하다.In addition, it is preferable that fixing grooves having end portions of each of the pair of power sockets are fitted and fixed to both ends of the LED mounting area portion at the boundary of the extension area portion.
그리고, 상기 한 쌍의 전원 소켓 각각의 단부는 중앙측으로 벤딩되는 고정단이 더 형성되고, 상기 고정홈들 각각의 끝단에는 상기 고정단이 삽입되는 벤딩홈이 더 형성될 수 있다.The end of each of the pair of power sockets may further include a fixed end bent toward the center side, and a bending groove into which the fixed end may be inserted may be further formed at each end of each of the fixing grooves.
또한, 상기 고정홈들의 내주에는 상기 삽입되는 상기 전원 소켓의 단부와 밀착되도록 탄성의 재질로 이루어지는 밀착 부재가 더 마련될 수도 있다.In addition, the inner circumference of the fixing grooves may be further provided with a close contact member made of an elastic material to be in close contact with the end of the power socket is inserted.
또한, 상기 한 쌍의 밀폐 캡 각각의 관통홀과 상기 관통홀을 관통한 상기 한 쌍의 전원 소켓 각각의 외면 사이의 공간에는 방수재가 더 도포되고, 상기 방수재는 에폭시, 실리콘 및 고분자 폴리머 중 어느 하나로 이루어지는 것이 좋다.In addition, a waterproofing material is further applied to a space between the through hole of each of the pair of sealing caps and the outer surface of each of the pair of power sockets passing through the through hole, and the waterproofing material is formed of any one of epoxy, silicone, and polymer polymer. It is good to be done.
또한, 상기 한 쌍의 전원 소켓 각각의 외면에는 상기 전원 소켓의 원주 방향을 따라 돌출되는 돌기 라인이 더 형성되고, 상기 한 쌍의 밀폐 캡의 관통홀 내주에는 상기 돌기 라인이 끼워지는 돌기홈이 더 형성될 수 있다.In addition, the outer surface of each of the pair of power sockets is further formed with a projection line protruding along the circumferential direction of the power socket, the projection groove is fitted into the inner periphery of the through hole of the pair of sealing caps Can be formed.
또한, 상기 한 쌍의 밀폐 캡의 관통홀의 내주에는 상기 기판의 엘이디 실장 영역부의 양단이 관통하여 지지되는 지지홈이 더 형성되는 것이 바람직하다. 따라서, 상기 한 쌍의 밀폐 캡은, 상기 기판, 상기 히트 싱크 및 상기 확산 튜브를 한번에 체결할 수 있다.In addition, the inner circumference of the through-holes of the pair of sealing caps may further include support grooves through which both ends of the LED mounting area portion of the substrate are supported. Therefore, the pair of sealing caps can fasten the substrate, the heat sink and the diffusion tube at one time.
또한, 상기 기판의 양면에는 상기 히트 싱크의 슬라이딩 홈의 내주와 밀착되는 체결 패드가 더 마련되는 것이 좋다. 그리고, 상기 기판은 상기 소켓과 결합시, 상기 기판의 엘이디 패턴 영역 또는 상기 기판의 브릿지 다이오드 회로 상단부 패턴 영역을 구비하는 부분에 상기 체결 패드를 하나 또는 다수를 가지는 것이 바람직하다.In addition, the both sides of the substrate is preferably provided with a fastening pad in close contact with the inner circumference of the sliding groove of the heat sink. When the substrate is coupled to the socket, the substrate may have one or more fastening pads in a portion including an LED pattern region of the substrate or an upper pattern region of a bridge diode circuit of the substrate.
또한, 상기 기판에는 상기 엘이디들의 인근 영역에 위치되도록 다수개의 비아홀들이 더 형성되되, 상기 비아홀들은 상기 히트 싱크를 향하여 개구되는 것이 바람직하다.In addition, a plurality of via holes may be further formed in the substrate so as to be positioned in the vicinity of the LEDs, and the via holes may be opened toward the heat sink.
또한, 상기 히트 싱크는 상기 히트 싱크의 종단면이 원형과 타원과 사각형 및 다각형 중 어느 하나를 이루고, 상기 히트 싱크는 상기 기판 및 상기 확산 튜브와 슬라이딩 체결되는 것이 바람직하다.In addition, the heat sink is preferably a longitudinal section of the heat sink is any one of a circle, an ellipse, a square and a polygon, the heat sink is slidingly coupled to the substrate and the diffusion tube.
또한, 상기 확산 튜브는 확산제가 포함되는 레진 고분자 폴리머 또는 투명 레진을 사용하여 이루어지며, 원형, 반원 및 삼각형 중 어느 하나의 패턴을 갖는 것이 바람직하다.In addition, the diffusion tube is made of a resin polymer or a transparent resin containing a diffusing agent, it is preferable to have a pattern of any one of a circle, a semi-circle and a triangle.
상기 기판은, 브릿지 다이오드 회로를 구비하여 상기 전원소켓에 +극성 또는 -극성 중 어느것이 연결되어도 상기 엘이디들이 동작하도록 하고, 상기 브릿지 다이오드 회로와 전기적으로 연결되며, 상기 엘이디들에 정전압을 인가하여 깜빡임 현상을 줄일 수 있는 LDI(LED Driver IC)를 구비하는 것이 바람직하다.The substrate is provided with a bridge diode circuit to allow the LEDs to operate regardless of whether + polarity or -polarity is connected to the power socket, electrically connected to the bridge diode circuit, and blinking by applying a constant voltage to the LEDs. It is desirable to have an LDI (LED Driver IC) that can reduce the phenomenon.
본 발명은 엘이디들이 실장되는 기판의 양단에 배치되는 전원 소켓을 기판의 양단에 안정적으로 고정시키고, 기판은 전원 소켓이 관통되는 밀폐 캡을 사용하여 별도로 고정함으로써, 전체적인 조명등 구성의 안정적인 조립 구조를 제공할 수 있는 효과가 있다.The present invention stably secures the power sockets disposed on both ends of the substrate on which the LEDs are mounted on both ends of the substrate, and the substrate is fixed separately using a hermetic cap through which the power sockets pass, thereby providing a stable assembly structure of the overall lighting configuration. It can work.
또한, 본 발명은 기판이 슬라이딩 삽입 고정되는 히트 싱크를 구비하고, 히트 싱크의 외주에 착탈되는 확산 튜브를 구비하여 조립 및 분해를 쉽게 수행할 수 있는 효과가 있다.In addition, the present invention has an effect that the substrate is provided with a heat sink that is slidingly inserted fixed, and provided with a diffusion tube detachably attached to the outer periphery of the heat sink can easily perform assembly and disassembly.
또한, 본 발명은 전력 소모율을 줄일 수 있고, 외부의 충격에 의하여 파손되는 것을 효율적으로 방지하며, 기판에 실장되는 엘이디를 보호함과 아울러, 엘이디가 실장되는 기판이 설치된 공간을 방수할 수 있는 효과가 있다.In addition, the present invention can reduce the power consumption rate, effectively prevent the damage by the external shock, and protect the LED mounted on the substrate, and also the effect of waterproofing the space in which the substrate on which the LED is mounted There is.
또한, 본 발명은 히트 싱크인 히트 싱크와 기판과 서로 열전달이 용이하도록하여 엘이디들의 발광으로 인하여 발생되는 열을 외부로 용이하게 방열시킬 수 있는 효과가 있다.In addition, the present invention has an effect that can easily heat the heat generated by the light emission of the LEDs to the outside by the heat sink and the heat sink and the substrate to facilitate heat transfer to each other.
도 1은 본 발명의 DC 12V 또는 24V 엘이디 조명등을 보여주는 분해 사시도이다.1 is an exploded perspective view showing a DC 12V or 24V LED lamp of the present invention.
도 2는 본 발명의 DC 12V 또는 24V 엘이디 조명등을 보여주는 평면도이다.Figure 2 is a plan view showing a DC 12V or 24V LED lamp of the present invention.
도 3은 본 발명의 DC 12V 또는 24V 엘이디 조명등을 보여주는 측면도이다.Figure 3 is a side view showing a DC 12V or 24V LED lamp of the present invention.
도 4는 도 3의 선 A-A를 따르는 단면도이다.4 is a cross-sectional view along the line A-A of FIG.
도 5는 본 발명에 따르는 기판의 상면과 저면을 보여주는 도면이다.5 is a view showing the top and bottom of the substrate according to the present invention.
도 6은 본 발명에 따르는 브릿지 다이오드 회로를 갖는 기판 및 회로를 보여주는 도면이다.Figure 6 shows a substrate and a circuit having a bridge diode circuit according to the present invention.
이하, 첨부되는 도면들을 참조로 하여, 본 발명의 DC 12V 또는 24V 엘이디 조명등을 설명하도록 한다.Hereinafter, with reference to the accompanying drawings, it will be described the DC 12V or 24V LED lamp of the present invention.
도 1 내지 도 3을 참조 하면, 본 발명의 엘이디 조명등은 크게 엘이디들(10)이 실장되는 기판(100)과, 기판(100)을 고정하고 기판(100)의 저부를 커버하는 히트 싱크(200)와, 기판(100)의 상부(엘이디(10) 측)를 커버하고 히트 싱크(200)에 고정되는 확산 튜브(300)와, 상기 기판(100)의 양단에 고정되는 한 쌍의 전원 소켓(500)과, 전원 소켓(500)이 관통되며 확산 튜브(300) 및 히트 싱크(200)의 양단에 체결되는 한 쌍의 밀폐 캡(400)으로 구성된다.1 to 3, the LED lamp of the present invention includes a substrate 100 on which the LEDs 10 are mounted, and a heat sink 200 that fixes the substrate 100 and covers the bottom of the substrate 100. ), A diffusion tube 300 that covers an upper portion (the LED 10 side) of the substrate 100 and is fixed to the heat sink 200, and a pair of power sockets fixed to both ends of the substrate 100 ( 500 and a pair of sealing caps 400 through which the power socket 500 penetrates and fastened to both ends of the diffusion tube 300 and the heat sink 200.
상기의 구성을 상세하게 설명하도록 한다.The above configuration will be described in detail.
상기 기판(100)은 사각 판상으로 형성되는 엘이디 실장 영역부(110)와, 상기 엘이디 실장 영역부(110)의 양단폭 보다 작은 폭을 갖고 사각 판상으로 이루어져 엘이디 실장 영역부(110)의 양단으로부터 일정 길이 연장되는 연장 영역부(120)로 형성된다. 여기서, 상기 엘이디 실장 영역부(110)의 상면에는 하나 또는 다수의 엘이디들(10)이 실장된다. 그리고, 상기 엘이디들(10)로부터 신호가 전송되는 신호 패턴은 엘이디 실장 영역부(110) 및 연장 영역부(120)에 걸쳐 형성된다.The substrate 100 has a width smaller than both end widths of the LED mounting region 110 formed in a rectangular plate shape, and is formed in a square plate shape from both ends of the LED mounting region 110. It is formed of an extended area portion 120 extending a predetermined length. Here, one or more LEDs 10 are mounted on the top surface of the LED mounting region 110. In addition, a signal pattern through which signals are transmitted from the LEDs 10 is formed over the LED mounting region 110 and the extended region 120.
상기 기판(100)은 히트 싱크(200)와 결합된다. 상기 히트 싱크(200)는 일정 길이를 갖고 단면이 반원 형상으로 형성된다. 그리고, 히트 싱크(200)의 양단 내측에는 길이 방향을 따르는 슬라이딩 홈(210)이 형성된다. 여기서, 상기 슬라이딩 홈(210)에는 기판(100)이 끼워져 고정될 수 있다. 따라서, 상기 기판(100)은 히트 싱크(200)의 일측 또는 타측 중 어느 하나의 위치에서 슬라이딩 홈(210)에 레일식으로 끼워져 고정될 수 있는 것이다.The substrate 100 is coupled to the heat sink 200. The heat sink 200 has a predetermined length and is formed in a semicircular cross section. In addition, sliding grooves 210 along the longitudinal direction are formed at both ends of the heat sink 200. Here, the substrate 100 may be inserted into the sliding groove 210 to be fixed. Accordingly, the substrate 100 may be fixed to the sliding groove 210 by being inserted into the sliding groove 210 at any one position of one side or the other side of the heat sink 200.
상기 히트 싱크(200)는 알루미늄과 같은 일정의 전도율을 갖는 금속 재질로 형성되며, 그 외주에는 공기와의 접촉 면적 증가를 위한 방열 돌기들(201)이 형성된다.The heat sink 200 is formed of a metal material having a predetermined conductivity such as aluminum, and the heat dissipation protrusions 201 are formed on the outer circumference thereof to increase the contact area with air.
여기서, 상기 히트 싱크(200)는 상기 히트 싱크(200)의 종단면이 원형과 타원과 사각형 및 다각형 중 어느 하나를 이룰 수 있다. 또한, 상기 히트 싱크(200)는 상기 기판(100) 및 상기 확산 튜브(300)와 슬라이딩 체결될 수 있다.Here, the heat sink 200 may have a longitudinal cross section of the heat sink 200 may be any one of a circle, an ellipse, a rectangle, and a polygon. In addition, the heat sink 200 may be slidingly coupled to the substrate 100 and the diffusion tube 300.
또한, 상기 히트 싱크(200)의 양단 외주에는 그 길이 방향을 따라 체결홈(220)이 형성된다.In addition, fastening grooves 220 are formed along the longitudinal direction of both ends of the heat sink 200.
또한, 상기 한 쌍의 밀폐 캡(400)의 관통홀(410)의 내주에는 상기 기판(100)의 엘이디 실장 영역부(110)의 양단이 관통하여 지지되는 지지홈(411)이 더 형성되는 것이 좋다.In addition, a support groove 411 is formed on the inner circumference of the through-hole 410 of the pair of sealing caps 400, through which both ends of the LED mounting region 110 of the substrate 100 penetrate and are supported. good.
상기 한 쌍의 밀폐 캡(400)이 기판(100)의 양단측에서 한 쌍의 전원 소켓(500) 각각을 관통하여 히트 싱크(200) 및 확산 튜브(300)의 양단에 끼워져 체결되면, 상기 밀폐 캡(400) 각각의 관통홀(410) 내주에 형성되는 지지홈(411)에는 기판(100)의 양단, 바람직하게는 엘이디 실장 영역부(110)의 양단이 끼워져 고정된다. 따라서, 상기 기판(100)은 그 양단이 관통홀(410)의 지지홈(411)에 끼워짐으로써, 좌우 상하로의 틀어짐이 용이하게 방지될 수 있다.When the pair of sealing caps 400 are fitted to both ends of the heat sink 200 and the diffusion tube 300 through each of the pair of power sockets 500 at both ends of the substrate 100, the sealing is performed. Both ends of the substrate 100, preferably both ends of the LED mounting region 110, are inserted into the support grooves 411 formed in the inner circumference of each of the through holes 410 of the cap 400. Therefore, both ends of the substrate 100 may be inserted into the support grooves 411 of the through hole 410, and thus the left and right sides of the substrate 100 may be easily prevented from twisting.
이에 따라, 본 발명에 따르는 한 쌍의 밀폐 캡(400)은 상기 기판(100), 상기 히트 싱크(200) 및 상기 확산 튜브(300)를 한 번에 체결할 수 있다.Accordingly, the pair of sealing caps 400 according to the present invention may fasten the substrate 100, the heat sink 200, and the diffusion tube 300 at one time.
또한, 상기 기판(100)의 양면에는 상기 히트 싱크(200)의 슬라이딩 홈(210)의 내주와 밀착되는 체결 패드(130)가 더 마련되는 것이 좋다.In addition, fastening pads 130 may be further provided on both surfaces of the substrate 100 to be in close contact with the inner circumference of the sliding groove 210 of the heat sink 200.
여기서, 도 5 및 도 6에 도시되는 바와 같이, 상기 기판(100)은 상기 전원 소켓(500)과 결합시 상기 기판(100)의 하단부의 엘이디 패턴 영역 또는 상기 기판(100)의 브릿지 다이오드 회로 상단부 패턴 영역을 구비하는 부분에 상기 체결 패드(130)를 하나 또는 다수를 가질 수 있다. 여기서, 상기 체결 패드(130)는 금속으로 이루어지는 것이 좋다.5 and 6, when the substrate 100 is coupled to the power socket 500, an LED pattern region of a lower end of the substrate 100 or an upper end of a bridge diode circuit of the substrate 100 may be used. One or more fastening pads 130 may be provided at a portion having a pattern region. Here, the fastening pad 130 is preferably made of a metal.
기판(100)에 실장되는 엘이디들(10)이 발광되면, 기판(100)에 일정의 열이 발생된다, 이와 같이 발생되는 열은 기판(100)의 몸체를 타고 기판(100)의 에지측으로 유동될 수 있는데, 이때, 기판(100)에 형성된 체결 패드(130)를 통하여 금속으로 이루어지는 히트 싱크(200)와 물리적으로 접촉된다. 따라서, 기판(100)에서의 열은 체결 패드(130)를 통하여 히트 싱크(200)로 용이하게 전달되고, 이 열은 다수개의 방열 돌기들(201)에 의하여 방열될 수 있다.When the LEDs 10 mounted on the substrate 100 emit light, a predetermined heat is generated on the substrate 100. The generated heat flows to the edge side of the substrate 100 through the body of the substrate 100. In this case, it is in physical contact with the heat sink 200 made of metal through the fastening pad 130 formed on the substrate 100. Therefore, heat in the substrate 100 is easily transferred to the heat sink 200 through the fastening pad 130, and the heat may be radiated by the plurality of heat radiating protrusions 201.
또한, 상기 기판(100)에는 상기 엘이디들(10)의 인근 영역에 위치되도록 다수개의 비아홀들(140)이 더 형성되되, 상기 비아홀들(140)은 상기 히트 싱크(200)를 향하여 개구된다.In addition, a plurality of via holes 140 are further formed in the substrate 100 so as to be located in the vicinity of the LEDs 10, and the via holes 140 are opened toward the heat sink 200.
상기와 마찬가지로 엘이디들(10)의 발광으로 인하여 발생되는 열은 기판(100)으로 전달되며, 상기 엘이디들(10)의 주변 영역에 형성되는 비아홀(140)을 통하여 기판(100) 저부에 노출되는 히트 싱크(200)의 내부 공간에 노출된다. 따라서, 기판(100)에서 발생되는 열은 용이하게 방열될 수 있다. 이에 더하여, 상기 비아홀들(140)의 내주에는 열 전달을 더 용이하게 할 수 있도록 구리와 같은 금속재가 박막 형태로 더 코팅될 수도 있다.As described above, heat generated due to light emission of the LEDs 10 is transferred to the substrate 100 and exposed to the bottom of the substrate 100 through the via hole 140 formed in the peripheral area of the LEDs 10. The internal space of the heat sink 200 is exposed. Therefore, heat generated in the substrate 100 can be easily radiated. In addition, a metal material such as copper may be further coated in a thin film form on the inner circumference of the via holes 140 to facilitate heat transfer.
한편, 상기 히트 싱크(200)의 양단 외주에 형성되는 체결홈(220)에는 상기 확산 튜브(300)의 양단이 고정된다.On the other hand, both ends of the diffusion tube 300 is fixed to the fastening groove 220 formed on the outer periphery of both ends of the heat sink 200.
상기 확산 튜브(300)는 일정 길이를 이루고 그 단면이 반원 형상을 이루고 그 양단에는 체결 돌기(310)가 형성된다. 여기서, 상기 체결 돌기(310)는 상기 히트 싱크(200)의 양단 외주에 형성되는 체결홈(220)에 끼워진다. 따라서, 상기 확산 튜브(300)의 양단은 상기 히트 싱크(200)의 양단에 후크식으로 체결 및 고정될 수 있다. 이에 따라, 상기 확산 튜브(300)는 기판(100)의 상면을 커버함으로써 엘이디들(10)로부터 발광되는 광을 외부로 확산시킬 수 있다. 여기서, 도면에 도시되지는 않았지만, 상기 확산 튜브(300)의 외면에는 광을 확산시키기 위한 임의의 확산 패턴이 형성되며, 상기 확산 패턴은 일정의 영역을 이루고, 영역들 마다 서로 다른 패턴이 혼용되도록 형성될 수도 있다.The diffusion tube 300 forms a predetermined length and its cross section forms a semi-circle shape, and fastening protrusions 310 are formed at both ends thereof. Here, the fastening protrusion 310 is fitted into the fastening groove 220 formed on the outer periphery of both ends of the heat sink 200. Therefore, both ends of the diffusion tube 300 may be fastened and fixed to both ends of the heat sink 200 in a hooked manner. Accordingly, the diffusion tube 300 may cover the upper surface of the substrate 100 to diffuse the light emitted from the LEDs 10 to the outside. Although not shown in the drawings, an arbitrary diffusion pattern for diffusing light is formed on an outer surface of the diffusion tube 300, and the diffusion pattern forms a predetermined region, and different patterns are mixed in each region. It may be formed.
여기서, 상기 확산 튜브(300)는 확산제가 포함되는 레진 고분자 폴리머 또는 투명 레진을 사용하여 이루어 질 수 있다.Here, the diffusion tube 300 may be made of a resin polymer or transparent resin containing a diffusion agent.
또한, 상기 확산 패턴은 원형, 반원 및 삼각형 중 어느 하나의 패턴으로 이루어 질 수도 있으며, 상기 패턴이 형상 이외의 다른 형상으로도 형성 가능함은 물론이다.In addition, the diffusion pattern may be formed of any one of a circle, a semicircle, and a triangle, and the pattern may be formed in any shape other than the shape.
이에 따라, 상기 기판(100)은 그 길이 방향을 따르는 양측면부가 슬라이딩 홈(210)에 끼워져 히트 싱크(200)에 고정되고, 확산 튜브(300)는 기판(100)의 상면을 커버하면서 그 양단이 히트 싱크(200)의 양단 외주에 형성되는 체결홈(220)에 후크 체결되어 고정된다.Accordingly, both sides of the substrate 100 along the longitudinal direction thereof are fitted into the sliding groove 210 to be fixed to the heat sink 200, and the diffusion tube 300 covers the upper surface of the substrate 100 while both ends thereof. Hook is fixed to the fastening groove 220 formed on the outer periphery of both ends of the heat sink (200).
이어, 상기 기판(100)의 양단에는 한 쌍의 전원 소켓(500)이 고정된다. 상기 한 쌍의 전원 소켓(500) 각각은 금속 재질로 이루어지며, 일단이 개구되고 내부에 일정 공간을 이루고 타단은 뾰족하게 형성되는 형상으로 이루어진다. 여기서, 실질적으로 기판(100)의 양단에 고정되는 부분 즉, 단부는 전원 소켓(500)의 일단인 것이다.Subsequently, a pair of power sockets 500 are fixed to both ends of the substrate 100. Each of the pair of power sockets 500 is made of a metal material, one end of which is open, forms a predetermined space therein, and the other end of the pair of power sockets 500 is sharply formed. Here, the portion that is substantially fixed to both ends of the substrate 100, that is, the end is one end of the power socket 500.
여기서, 상기 기판(100), 바람직하게는 엘이디 실장 영역부(110)의 양단에는 연장 영역부(120)를 경계로 고정홈들(111)이 형성된다. 따라서, 상기 엘이디 실장 영역부(110)의 양단 각각에서의 고정홈들(111)에는 한 쌍의 전원 소켓(500) 각각의 일단 테두리가 끼워져 안착 및 고정된다. 이에 따라, 한 쌍의 전원 소켓(500)은 기판(100)에 고정된 상태로 좌우 상하로의 유동이 방지될 수 있다.Here, fixing grooves 111 are formed at both ends of the substrate 100, preferably at the LED mounting region 110, around the extension region 120. Accordingly, one end edge of each of the pair of power sockets 500 is seated and fixed to the fixing grooves 111 at each end of the LED mounting area unit 110. Accordingly, the pair of power sockets 500 may be prevented from flowing left and right up and down while being fixed to the substrate 100.
이에 더하여, 본 발명에서의 상기 고정홈들(111)의 내주에는 전원 소켓들(500)의 일단 테두리와의 밀착력을 증가시키기 위하여 탄성 재질의 밀착 부재가 더 마련될 수도 있다. 따라서, 전원 소켓들(500) 각각은 기판(100)의 양단에서 더 안정적으로 고정될 수 있다.In addition, the inner circumference of the fixing grooves 111 in the present invention may be further provided with an elastic contact member in order to increase the adhesion with one end of the power sockets 500. Thus, each of the power sockets 500 may be more stably fixed at both ends of the substrate 100.
또한, 상기 고정홈들(111)의 내측단에는 벤딩되는 벤딩홈(미도시)이 더 형성될 수도 있고, 상기 한 쌍의 전원 소켓(500) 각각의 일단 테두리에는 상기 벤딩홈에 삽입되도록 벤딩되는 고정단(미도시)이 더 형성될 수도 있다. 이에 따라, 상기 전원 소켓들(500) 각각은 기판(100)의 양단에 상하좌우를 비롯한 전후로의 유동이 효율적으로 방지될 수 있다.In addition, a bending groove (not shown) may be further formed at an inner end of the fixing grooves 111, and one end of each of the pair of power sockets 500 may be bent to be inserted into the bending groove. A fixed end (not shown) may be further formed. Accordingly, each of the power sockets 500 may be efficiently prevented from flowing back and forth, including up, down, left, and right, at both ends of the substrate 100.
한편, 상기 한 쌍의 밀폐 캡(400)은 그 중앙에 관통홀(410)이 형성되며, 상기 관통홀(410)에는 상기 전원 소켓(500)이 관통되어 위치될 수 있다. 여기서, 상기 밀폐 캡(400)은 상기에 언급된 바와 같이 서로 결합된 확산 튜브(300) 및 히트 싱크(200)의 양단에 끼워져 밀폐할 수 있다.Meanwhile, the pair of sealing caps 400 may have a through hole 410 formed in the center thereof, and the power socket 500 may be penetrated through the through hole 410. Here, the sealing cap 400 may be sealed by being fitted at both ends of the diffusion tube 300 and the heat sink 200 coupled to each other as mentioned above.
여기서, 상기 관통홀(410)의 내주와 상기 관통홀(410)을 관통한 전원 소켓(500)의 외주와 일정의 유격이 형성됨에 따라, 기판(100)이 설치된 공간의 방수가 이루어 지지 않을 수도 있다. 따라서, 본 발명에서는 상기와 같이 관통홀(410)과 전원 소켓(500)의 외주 사이에 형성되는 유격 공간을 밀폐 및 방수할 수 있는 방수재를 일정량 도포한다. 여기서, 상기 방수재는 에폭시, 실리콘 및 고분자 폴리머 중 어느 하나를 사용함으로써, 방수 기능을 수행함과 아울러, 전원 소켓(500)과 밀폐 캡(400)을 서로 고정하는 역할도 할 수 있다.Here, as the inner circumference of the through hole 410 and the outer circumference of the power socket 500 penetrating the through hole 410 and a predetermined clearance are formed, the space where the substrate 100 is installed may not be waterproofed. have. Therefore, in the present invention, as described above, a predetermined amount of a waterproof material capable of sealing and waterproofing the clearance gap formed between the outer circumference of the through hole 410 and the power socket 500 is applied. Here, the waterproof material may serve to secure the power socket 500 and the sealing cap 400 by using any one of an epoxy, a silicone, and a polymer polymer, as well as performing a waterproof function.
한편, 상기 한 쌍의 전원 소켓(500) 각각의 외면에는 상기 전원 소켓(500)의 원주 방향을 따라 돌출되는 돌기 라인(미도시)이 더 형성될 수 있다. 이에 따라, 상기 한 쌍의 밀폐 캡(400)의 관통홀(410) 내주에는 상기 돌기 라인이 끼워지는 돌기홈(미도시)이 더 형성될 수 있다.On the other hand, a protruding line (not shown) protruding along the circumferential direction of the power socket 500 may be further formed on the outer surface of each of the pair of power sockets 500. Accordingly, a protrusion groove (not shown) into which the protrusion line is fitted may be further formed in the inner circumference of the through hole 410 of the pair of sealing caps 400.
이의 구성을 참조 하면, 상기 한 쌍의 밀폐 캡(400) 각각은 관통홀(410)을 통하여 전원 소켓(500)이 관통되면서 확산 튜브(300) 및 히트 싱크(200)의 양단에 끼워지는데, 이때, 상기 밀폐 캡(400)의 관통홀(410) 내주에 형성되는 돌기홈에는 전원 소켓(500) 외주에 돌출 형성되는 돌기 라인이 끼워질 수 있다.Referring to this configuration, each of the pair of sealing cap 400 is fitted to both ends of the diffusion tube 300 and the heat sink 200 while the power socket 500 is penetrated through the through hole 410, The protrusion groove formed in the inner circumference of the through hole 410 of the sealing cap 400 may be fitted with a protrusion line protruding from the outer circumference of the power socket 500.
이에 따라, 상기 밀폐 캡(400)과 전원 소켓(500)은 서로 고정됨과 아울러, 돌기 라인과 돌기홈과의 끼움으로 인하여 방수재를 도포하지 않더라도 방수 기능을 수행할 수 있는 밀폐 라인을 형성할 수 있다. 물론, 이와 같은 상태에서도 관통홀(410)과 전원 소켓(500) 외주 사이에 방수재를 추가적으로 더 도포하여 추가 방수를 이룰 수도 있다.Accordingly, the sealing cap 400 and the power socket 500 may be fixed to each other, and may form a sealing line capable of performing a waterproof function even without applying a waterproofing material due to the fitting between the projection line and the projection groove. . Of course, in such a state, an additional waterproofing material may be further applied between the through hole 410 and the outer circumference of the power socket 500 to achieve additional waterproofing.
이에 더하여, 본 발명의 엘이디 조명등은 기판(100)의 양단에서 기판(100)의 엘이디(10)와 전기적으로 연결되는 두 개의 전원 소켓(500)을 구비하고, 기판(100)에 도 6에 도시되는 바와 같은, 무극성을 위한 브릿지 다이오드 회로를 구성함으로써, 전원 소켓(500)으로 +극성 또는 -극성 중 어느 극성이 인가되어도 엘이디들(10)이 동작할 수 있도록 한다. 즉, 전원 소켓(500)을 +,-전극의 접촉 방향에 관계 없이 사용할 수 있다. 브릿지 다이오드 회로의 동작은 당업자라면 이해할 수 있으므로 상세한 설명을 생략한다. In addition, the LED lamp of the present invention includes two power sockets 500 electrically connected to the LEDs 10 of the substrate 100 at both ends of the substrate 100, and the substrate 100 is shown in FIG. 6. By configuring a bridge diode circuit for non-polarity, the LEDs 10 can operate regardless of whether + polarity or -polarity is applied to the power socket 500. That is, the power socket 500 can be used regardless of the contact direction of the + and-electrodes. Operation of the bridge diode circuit can be understood by those skilled in the art, and thus a detailed description thereof will be omitted.
또한 기판(100)은 브릿지 다이오드 회로와 전기적으로 연결되며, 엘이디들(10)에 정전압을 인가하여 깜빡임 현상을 줄일 수 있는 LDI(LED Driver IC)(141)를 구비한다. LDI는 10V 내지 40V의 전압을 수신하여 이를 엘이디(10)가 동작할 수 있는 정전압(예를 들어 9V)으로 변환하여 인가한다. 따라서, 엘이디들(10)이 안정적으로 동작할 수 있다. 또한 정전압이 엘이디들(10)에 인가되므로 엘이디들(10)이 전압의 불안정으로 인하여 깜빡거리는 플리커 현상도 제거될 수 있다. In addition, the substrate 100 is electrically connected to the bridge diode circuit and includes an LED driver IC (LDI) 141 that can reduce flicker by applying a constant voltage to the LEDs 10. The LDI receives a voltage of 10V to 40V and converts it into a constant voltage (for example, 9V) in which the LED 10 can operate. Thus, the LEDs 10 can operate stably. In addition, since the constant voltage is applied to the LEDs 10, the flicker phenomenon in which the LEDs 10 flicker due to voltage instability may be eliminated.
이상에서와 같이 도면과 명세서에서 최적 실시예가 개시되었다. 여기서 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로 본 기술분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.As described above, optimal embodiments have been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.
본 발명은 엘이디조명등의 제조분야에 이용될 수 있다. The present invention can be used in the field of manufacture such as LED lighting.

Claims (13)

  1. 엘이디들이 실장되는 기판;A substrate on which the LEDs are mounted;
    상기 기판의 양단과 결합되며, 상기 엘이디들로 외부로부터의 전원을 인가하는 한 쌍의 전원 소켓;A pair of power sockets coupled to both ends of the substrate and configured to apply power from the outside to the LEDs;
    내주에 상기 기판이 슬라이딩 삽입되어 고정되는 슬라이딩 홈이 형성되고, 외주에 체결홈이 형성되며, 상기 기판의 저면부를 커버하는 히트 싱크;A heat sink in which a sliding groove is formed in which the substrate is slidably inserted and fixed, a fastening groove is formed in the outer circumference, and covers a bottom surface of the substrate;
    상기 엘이디들의 상부를 커버하고, 양측단이 상기 체결홈에 끼워지는 확산 튜브; 및A diffusion tube covering an upper portion of the LEDs, and both ends of which are fitted into the fastening grooves; And
    상기 전원 소켓이 관통하는 관통홀이 형성되며, 상기 히트 싱크 및 상기 확산 튜브의 양단과 결합되는 한 쌍의 밀폐 캡을 포함하는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.The through-hole through which the power socket is formed is formed, DC 12V or 24V LED lamp, characterized in that it comprises a pair of sealing cap coupled to both ends of the heat sink and the diffusion tube.
  2. 제 1항에 있어서,The method of claim 1,
    상기 기판은, 상기 엘이디들이 실장되는 사각 판상의 엘이디 실장 영역부와, 상기 엘이디 실장 영역부의 양단 폭보다 좁은 폭을 이루어 상기 엘이디 실장 영역부의 양단으로부터 일정 길이 돌출되고 상기 한 쌍의 전원 소켓의 내부에 삽입되는 사각 판상의 연장 영역부로 이루어지되,The substrate may be formed in a rectangular plate-shaped LED mounting region portion on which the LEDs are mounted, and a width narrower than the width of both ends of the LED mounting region portion to protrude from both ends of the LED mounting region portion, and be formed inside the pair of power sockets. It consists of an extension area on the rectangular plate to be inserted,
    상기 연장 영역부를 경계로 상기 엘이디 실장 영역부의 양단에는 상기 한 쌍의 전원 소켓 각각의 단부가 끼워져 고정되는 고정홈들이 형성되는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.DC 12V or 24V LED lighting, characterized in that the fixing grooves are formed at both ends of the LED mounting area portion on the extension area portion is fixed to the end of each of the pair of power sockets.
  3. 제 3항에 있어서, 상기 한 쌍의 전원 소켓 각각의 단부는 중앙측으로 벤딩되는 고정단이 더 형성되고,The method of claim 3, wherein the end of each of the pair of power sockets is further formed with a fixed end bent to the center side,
    상기 고정홈들 각각의 끝단에는 상기 고정단이 삽입되는 벤딩홈이 더 형성되는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.DC 12V or 24V LED lamp, characterized in that the end of each of the fixing grooves is further formed a bending groove into which the fixing end is inserted.
  4. 제 3항에 있어서, 상기 고정홈들의 내주에는 상기 삽입되는 상기 전원 소켓의 단부와 밀착되도록 탄성의 재질로 이루어지는 밀착 부재가 더 마련되는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.4. The DC 12V or 24V LED lamp of claim 3, wherein a close contact member made of an elastic material is further provided on the inner circumference of the fixing grooves to be in close contact with the end of the power socket.
  5. 제 1항에 있어서, 상기 한 쌍의 밀폐 캡 각각의 관통홀과 상기 관통홀을 관통한 상기 한 쌍의 전원 소켓 각각의 외면 사이의 공간에는 방수재가 더 도포되고,The method of claim 1, wherein a waterproofing material is further applied to a space between the through hole of each of the pair of sealing caps and the outer surface of each of the pair of power sockets passing through the through hole,
    상기 방수재는 에폭시, 실리콘 및 고분자 폴리머 중 어느 하나로 이루어지는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.The waterproof material is a DC 12V or 24V LED lighting, characterized in that made of any one of epoxy, silicone and polymer.
  6. 제 1항에 있어서, 상기 한 쌍의 전원 소켓 각각의 외면에는 상기 전원 소켓의 원주 방향을 따라 돌출되는 돌기 라인이 더 형성되고,According to claim 1, The outer surface of each of the pair of power sockets is further formed with a projection line protruding along the circumferential direction of the power socket,
    상기 한 쌍의 밀폐 캡의 관통홀 내주에는 상기 돌기 라인이 끼워지는 돌기홈이 더 형성되는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.DC 12V or 24V LED lamp, characterized in that the projection groove is further formed on the inner circumference of the through-hole of the pair of sealing caps.
  7. 제 2항에 있어서, 상기 한 쌍의 밀폐 캡의 관통홀의 내주에는 상기 기판의 엘이디 실장 영역부의 양단이 관통하여 지지되는 지지홈이 더 형성되되,According to claim 2, The inner periphery of the through-hole of the pair of sealing cap is further formed with support grooves through which both ends of the LED mounting area portion of the substrate is supported,
    상기 한 쌍의 밀폐 캡은, 상기 기판, 상기 히트 싱크 및 상기 확산 튜브를 한번에 체결하는 것을 특징으로 하는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.The pair of sealing caps, the DC 12V or 24V LED lamp, characterized in that for fastening the substrate, the heat sink and the diffusion tube at one time.
  8. 제 1항에 있어서, 상기 기판의 양면에는 상기 히트 싱크의 슬라이딩 홈의 내주와 밀착되는 체결 패드가 더 마련되되,According to claim 1, Both sides of the substrate is further provided with a fastening pad in close contact with the inner circumference of the sliding groove of the heat sink,
    상기 기판은 상기 소켓과 결합시, 상기 기판의 엘이디 패턴 영역 또는 상기 기판의 브릿지 다이오드 회로 상단부 패턴 영역을 구비하는 부분에 상기 체결 패드를 하나 또는 다수를 가지는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.When the substrate is coupled to the socket, DC 12V or 24V LED lighting lamp having one or more of the fastening pad in the portion having the LED pattern region of the substrate or the top pattern region of the bridge diode circuit of the substrate.
  9. 제 1항에 있어서, 상기 기판에는 상기 엘이디들의 인근 영역에 위치되도록 다수개의 비아홀들이 더 형성되되,The method of claim 1, wherein the plurality of via holes are further formed in the substrate to be located in the vicinity of the LEDs,
    상기 비아홀들은 상기 히트 싱크를 향하여 개구되는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.And the via holes are open toward the heat sink.
  10. 제 1항에 있어서, 상기 히트 싱크는 상기 히트 싱크의 종단면이 원형과 타원과 사각형 및 다각형 중 어느 하나를 이루고,The heat sink of claim 1, wherein a longitudinal section of the heat sink forms one of a circle, an ellipse, a rectangle, and a polygon.
    상기 히트 싱크는 상기 기판 및 상기 확산 튜브와 슬라이딩 체결되는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.And the heat sink is in sliding engagement with the substrate and the diffusion tube.
  11. 제 1항에 있어서, 상기 확산 튜브는 확산제가 포함되는 레진 고분자 폴리머 또는 투명 레진을 사용하여 이루어지며, 원형, 반원 및 삼각형 중 어느 하나의 패턴을 갖는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.The DC 12V or 24V LED lamp of claim 1, wherein the diffusion tube is made of a resin polymer or a transparent resin including a diffusion agent, and has any one of a circle, a semicircle, and a triangle.
  12. 제 1항에 있어서, 상기 기판은,The method of claim 1, wherein the substrate,
    브릿지 다이오드 회로를 구비하여 상기 전원소켓에 +극성 또는 -극성 중 어느것이 연결되어도 상기 엘이디들이 동작하도록 하는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.A DC 12V or 24V LED lighting lamp having a bridge diode circuit to allow the LEDs to operate regardless of whether + pole or -polarity is connected to the power socket.
  13. 제 12항에 있어서, 상기 기판은,The method of claim 12, wherein the substrate,
    상기 브릿지 다이오드 회로와 전기적으로 연결되며, 상기 엘이디들에 정전압을 인가하여 깜빡임 현상을 줄일 수 있는 LDI(LED Driver IC)를 구비하는 것을 특징으로 하는 DC 12V 또는 24V 엘이디 조명등.DC 12V or 24V LED lighting lamp electrically connected to the bridge diode circuit, and having an LED driver IC (LDI) to reduce the flicker by applying a constant voltage to the LEDs.
PCT/KR2011/008549 2010-11-12 2011-11-10 12v or 24v dc led lamp WO2012064121A2 (en)

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KR20100112845 2010-11-12
KR10-2010-0112845 2010-11-12
KR1020100137003A KR101230976B1 (en) 2010-11-12 2010-12-28 LED LAMP FOR DC 12V or 24V
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109630983A (en) * 2018-12-24 2019-04-16 广州市莱帝亚照明股份有限公司 A kind of watertight light fitting and its assembly method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833318B1 (en) * 2007-07-27 2008-05-28 에이치케이엠엔에스(주) Led lamp for car interior light
KR20090008551U (en) * 2008-02-21 2009-08-26 최성 LED Lamp for illuminating room of vehicle
KR20090010850U (en) * 2008-04-21 2009-10-26 전황섭 Luminous body using LED module as light source

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833318B1 (en) * 2007-07-27 2008-05-28 에이치케이엠엔에스(주) Led lamp for car interior light
KR20090008551U (en) * 2008-02-21 2009-08-26 최성 LED Lamp for illuminating room of vehicle
KR20090010850U (en) * 2008-04-21 2009-10-26 전황섭 Luminous body using LED module as light source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109630983A (en) * 2018-12-24 2019-04-16 广州市莱帝亚照明股份有限公司 A kind of watertight light fitting and its assembly method

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