WO2012048488A1 - 背光模块及显示装置 - Google Patents

背光模块及显示装置 Download PDF

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Publication number
WO2012048488A1
WO2012048488A1 PCT/CN2010/079033 CN2010079033W WO2012048488A1 WO 2012048488 A1 WO2012048488 A1 WO 2012048488A1 CN 2010079033 W CN2010079033 W CN 2010079033W WO 2012048488 A1 WO2012048488 A1 WO 2012048488A1
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WO
WIPO (PCT)
Prior art keywords
light source
circuit board
reflective layer
backlight module
reflective
Prior art date
Application number
PCT/CN2010/079033
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English (en)
French (fr)
Inventor
吴梅豪
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US12/996,657 priority Critical patent/US20120092887A1/en
Publication of WO2012048488A1 publication Critical patent/WO2012048488A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors

Definitions

  • the present invention relates to a backlight module and a display device, and more particularly to a backlight module and a display device that can improve the utilization of reflected light.
  • Liquid crystal display (Liquid Crystal Display, LCD) has been widely used in a variety of electronic products, most of the liquid crystal display is a backlight type liquid crystal display, which is composed of a liquid crystal display panel and a backlight module (backlight Module).
  • the backlight module can be divided into a side-light type and a direct-light type according to the incident position of the light source (Direct-light) Type) is used to provide backlight for the LCD panel.
  • LED direct-lit light-emitting diode
  • a direct-lit light-emitting diode (LED) backlight module which uses an LED as a light source.
  • LED backlight module a plurality of LEDs are disposed on a circuit board, and a reflective sheet or a reflective sheet can be disposed flat between or around the LEDs to reflect the light of the LEDs.
  • the package height of the LED on the circuit board is significantly larger than the height at which the reflective sheet is flat on the circuit board, there is a height difference between the light emitting surface of the LED and the reflective surface of the reflective sheet. Since the light of the LED is not easily reflected in the region of the height difference, the light of the LED cannot be effectively utilized in the region of the height difference, and the light utilization efficiency of the LED is lowered.
  • a main object of the present invention is to provide a backlight module, where the backlight module includes:
  • a light source having a light emitting surface, wherein the light source is electrically connected to the circuit board;
  • a reflective layer disposed around the light source, the reflective layer and the light emitting surface of the light source being located on a same side of the circuit board;
  • At least one supporting unit disposed between the circuit board and the reflective layer and supporting the reflective layer.
  • Another object of the present invention is to provide a display device, the display device comprising:
  • the backlight module includes:
  • a light source having a light emitting surface, wherein the light source is electrically connected to the circuit board;
  • a reflective layer disposed around the light source, the reflective layer and the light emitting surface of the light source being located on a same side of the circuit board;
  • At least one supporting unit disposed between the circuit board and the reflective layer and supporting the reflective layer.
  • a further object of the present invention is to provide a backlight module, the backlight module comprising:
  • circuit board having a through hole
  • the light source embedded in the through hole, the light source having a light emitting surface and electrically connected to the circuit board;
  • a reflective layer disposed on the circuit board, and the reflective layer and the light emitting surface of the light source are located on a same side of the circuit board.
  • the backlight module includes:
  • circuit board having a through hole
  • the light source embedded in the through hole, the light source having a light emitting surface and electrically connected to the circuit board;
  • a reflective layer disposed on the circuit board, and the reflective layer and the light emitting surface of the light source are located on a same side of the circuit board.
  • the support unit is a columnar unit.
  • the reflective layer is a reflective plate, a reflective sheet or a reflective coating coated on the support unit.
  • the supporting unit is in the shape of a plate and is provided with a plurality of through holes for embedding the light source; the circuit board and the reflective layer are disposed opposite to the supporting unit On both sides.
  • the reflective layer is flush with the light emitting surface of the light source.
  • the circuit board includes a conductive layer and a dielectric layer, the conductive layer is formed on the dielectric layer, and the support unit is the conductive layer disposed on the circuit board on.
  • the height difference between the reflective layer and the light emitting surface of the light source is less than 1 mm.
  • the height difference between the reflective layer and the light emitting surface of the light source is less than 100 microns.
  • the backlight module further includes a light guide plate, and the light source and the circuit board are disposed on one side of the light guide plate.
  • the backlight module and the display device of the present invention can reduce the height difference between the reflective layer and the light emitting surface of the light source, thereby reducing the loss of light in the region of the height difference and improving the utilization of the reflected light.
  • the backlight module and the display device of the present invention can increase the height of the reflective layer by using the supporting unit, and reduce the difference in height between the reflective layer and the light emitting surface of the light source, thereby reducing the loss of light in the region where the height is different, and Improve the utilization of reflected light.
  • FIG. 1 is a cross-sectional view showing a backlight module and a display panel in accordance with a first embodiment of the present invention
  • FIG. 2 is a partial cross-sectional view showing a backlight module in accordance with a first embodiment of the present invention
  • FIG. 3 is a cross-sectional view showing another portion of a backlight module in accordance with a first embodiment of the present invention
  • FIG. 4 is a partial cross-sectional view showing a backlight module in accordance with a second embodiment of the present invention.
  • Figure 5 is a partial cross-sectional view showing a backlight module in accordance with a third embodiment of the present invention.
  • Figure 6 is a partial cross-sectional view showing a backlight module in accordance with a fourth embodiment of the present invention.
  • FIG. 1 is a cross-sectional view showing a backlight module and a display panel according to a first embodiment of the present invention
  • FIG. 2 is a partial cross-sectional view showing the backlight module according to the first embodiment of the present invention.
  • the backlight module 100 of the present embodiment may be a direct type backlight module, which is disposed relative to a display panel 101.
  • the display panel 101 may be a liquid crystal display panel to form a display device such as a liquid crystal display device.
  • the backlight module 100 can include a backplane 110, a plurality of light sources 120, a circuit board 130, a reflective layer 140, at least one support unit 150, and an optical film 160.
  • the back plate 110 of the embodiment is made of an opaque material, such as a plasticized material, a metal material or a combination of the above materials, for carrying the light source 120, the circuit board 130 and the optical film. 160.
  • the circuit board 130 is disposed on the back board 110, and the circuit board 130 can be a printed circuit board (Printed Circuit board, PCB) or flexible printed circuit board (Flexible Printed Circuits, FPC).
  • the circuit board 130 includes a conductive layer 131 and a dielectric layer 132.
  • the conductive layer 131 is formed on the dielectric layer 132 for electrically connecting to the electrode pins 123 of the light source 120.
  • the conductive layer 131 is preferably formed of a metal material such as a copper foil layer.
  • the light source 120 is disposed on the circuit board 130 and electrically connected to the conductive layer 131 of the circuit board 130 for providing light to the display panel 101.
  • the light source 120 of this embodiment may be a light emitting diode (Light-Emitting) Diode, LED), Organic Light Emitting Diode, OLED), Electro-Luminescence (EL) components, LED light bars, etc.
  • the light source 120 includes a light emitting surface 121, a package body 122, and two electrode pins 123.
  • the package body 122 is encapsulated by a light emitting diode chip, and the light emitting surface 121 and the electrode lead 123 are exposed to the package body 122.
  • the electrode pins 123 are disposed on opposite sides of the package body 122 and can utilize surface adhesion technology (Surface) Mount Technology, SMT) is electrically connected to the circuit board 130.
  • the light source 120 is packaged in a small package (small outline).
  • the electrode pins 123 are disposed on both sides of the LED chip and bent outward to be electrically connected to the circuit board 130, as shown in FIG. 2; the electrode pins 123 may also be inward It is bent and electrically connected to the circuit board 130, as shown in FIG.
  • the supporting unit 150 of the present embodiment is disposed between the circuit board 130 and the reflective layer 140 and supports the reflective layer 140.
  • the support unit 150 is made of an insulating material, such as plastic or rubber.
  • the support unit 150 is a plurality of columnar units, and the support unit 150 can be disposed on the circuit board 130 by soldering, adhesive or screwing. In the embodiment, the support unit 150 is disposed on the conductive layer 131 of the circuit board 130.
  • the reflective layer 140 is disposed on the support unit 150 and formed between or around the light source 120 to reduce a height difference between the reflective layer 140 and the light emitting surface 121 of the light source 120.
  • the reflective layer 140 of this embodiment may be a reflective plate or a reflective sheet for reflecting light.
  • the reflective layer 140 is made of a high reflectivity material such as silver, aluminum, gold, chromium, copper, indium, antimony, nickel, platinum, rhodium, iridium, tin, antimony, tungsten, manganese, any combination thereof. Alloy or white reflective paint resistant to yellowing and heat.
  • the reflective surface of the reflective layer 140 may be substantially flush with the light emitting surface 121 of the light source 120 by the support of the support unit 150, or between the reflective surface of the reflective layer 140 and the light emitting surface 121 of the light source 120.
  • the height difference may be less than 1 millimeter (mm), such as preferably less than 100 micrometers ( ⁇ m). Therefore, the difference in height between the reflective surface of the reflective layer 140 and the light-emitting surface 121 of the light source 120 can be eliminated or greatly reduced compared to the existing backlight module to reduce the loss of light in the region of the difference in height. And improve the utilization of reflected light.
  • the optical film 160 is disposed above the light source 120 for improving the uniformity of illumination or the luminous efficiency of the light source 120.
  • the optical film 160 of the present embodiment is, for example, a diffusion sheet, a prism sheet, and a brightness enhancement film (Brightness) Enhancement Film, BEF), Reflective Brightness Enhancement Film (Dual Brightness Enhancement) Film, DBEF), non-multilayer film reflective polarizer (Diffused Reflective Polarizer) Film, DRPF) or any combination of the above, located on light source 120.
  • the backlight module 100 of the present embodiment can utilize the support unit 150 to reduce the height difference between the reflective layer 140 and the light emitting surface 121 of the light source 120 to improve the utilization of the reflected light of the backlight module 100.
  • the supporting unit 250 of the second embodiment may be a plate shape, and is directly used as the supporting unit 250 by the dielectric layer 232 of the circuit board 230.
  • the conductive layer 231 is formed on one side of the support unit 250, and the reflective layer 240 is disposed on the side of the support unit 250 opposite to the conductive layer 231.
  • the support unit 250 is provided with a plurality of through holes 251 for receiving and embedding the light source 220.
  • the package body 222 of the light source 220 is disposed in the through hole 251 of the supporting unit 250, and the electrode pin 223 of the light source 220 is extended from the package body 222 and electrically connected to the conductive layer 231.
  • the light emitting surface 221 of the light source 220 is flush with
  • the difference in height between the reflective surface of reflective layer 240, or the reflective surface of reflective layer 240 and the illuminated surface 221 of light source 220 may be less than 1 millimeter (mm), such as preferably less than 100 micrometers ( ⁇ m).
  • the reflective layer 240 can be a reflective plate or a reflective sheet.
  • the reflective layer 240 can also be a reflective coating that can be directly coated or printed on the support unit 250 and conductive using a high reflectivity material.
  • the opposite side of layer 231. Therefore, the backlight module 200 of the present embodiment can utilize the support layer 250, that is, the dielectric layer of the circuit board 230, and the design of the through hole 251 to reduce the height difference between the reflective layer 240 and the light emitting surface 221 of the light source 220. To improve the utilization of reflected light.
  • the backlight module 300 is a side-lit light-emitting backlight module, which may include a back plate 310, a plurality of light sources 320, a circuit board 330, a reflective layer 340, a support unit 350, an optical film 360, and a light guide plate 370.
  • the light guide plate 370 is disposed on the back plate 310.
  • the light source 320 and the circuit board 330 form a light bar and are disposed on one side of the light guide plate 370 for emitting light to the light guide plate 370.
  • a reflective layer 340 is formed around the light source 320 for reflecting the light of the light source 320.
  • the support unit 350 is formed between the conductive layer 331 of the circuit board 330 and the reflective layer 340 to reduce the height difference between the reflective layer 340 and the light emitting surface 321 of the light source 320.
  • the optical film 360 is disposed above the light guide plate 370 for improving the uniformity or brightness of the light emitted by the light guide plate 370.
  • FIG. 6 is a partial cross-sectional view showing a backlight module according to a fourth embodiment of the present invention. Only the differences between the present embodiment and the first embodiment will be described below, and the similarities are not described herein again.
  • the support unit 450 of the fourth embodiment may be in the form of a plate that is disposed on the circuit board 430.
  • the support unit 450 is provided with a plurality of through holes 451 for receiving and embedding the light source 420.
  • the package body 422 of the light source 420 is disposed in the through hole 451 of the support unit 450, and the electrode pins 423 of the light source 420 are disposed on opposite sides of the package body 422, and may be surface-bonded (SMT) to the circuit board 430.
  • the conductive layer 431 is electrically connected.
  • the electrode lead 423 can be bent inwardly and electrically connected to the circuit board 430, as shown in FIG. 6.
  • the electrode pins 423 may also be disposed on both sides of the LED chip and bent outward to be electrically connected to the circuit board 430.
  • the light emitting surface 421 of the light source 420 can be substantially flush with the reflective surface of the reflective layer 440.
  • the reflective layer 440 may be a reflective plate, a reflective sheet, or a reflective coating coated on the surface of the support unit 450. Therefore, the backlight module 400 of the present embodiment can utilize the plate-shaped support unit 450 to reduce the height difference between the reflective layer 440 and the light-emitting surface 421 of the light source 420 to improve the utilization of the reflected light.
  • the backlight module and the display device of the present invention can increase the height of the reflective layer by using the supporting unit, thereby reducing the difference in height between the reflective layer and the light emitting surface of the light source, thereby reducing the light in the region where the height is different. Loss and improve the utilization of reflected light.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Description

背光模块及显示装置 技术领域
本发明涉及一种背光模块及显示装置，特别是涉及一种可提高反射光的利用率的背光模块及显示装置。
 背景技术
液晶显示器(Liquid Crystal Display，LCD)已被广泛应用于各种电子产品中，液晶显示器大部分为背光型液晶显示器，其是由液晶显示面板及背光模块(backlight module)所组成。背光模块可依照光源入射位置的不同分成侧向式入光(Side-light type)与直下式入光(Direct-light type)两种，用来给液晶显示面板提供背光源。
以直下式的发光二极管(LED)背光模块为例，其是使用LED来作为光源。通常，在此LED背光模块中，多个LED是设置于电路板上，而反射片或反射板可平贴设置于LED之间或其周围，以反射LED的光线。
然而，由于LED在电路板上的封装高度是明显大于反射片平贴在电路板上的高度，因而LED的发光面与反射片的反射表面之间会具有一高度差。由于LED的光线不易在此高度差的区域中被反射，因而LED的光线无法在此高度差的区域中被有效地利用，而降低LED的光线利用率。
故，有必要提供一种背光模块及显示装置，以解决现有技术所存在的问题。
 技术问题
本发明的主要目的在于提供一种背光模块，所述背光模块包括：
电路板；
光源，具有发光面，所述光源与所述电路板电性连接；
反射层，设置在所述光源的周围，所述反射层与所述光源的所述发光面位于所述电路板的同一侧；以及
至少一支撑单元，设置在所述电路板与所述反射层之间，并支撑所述反射层。
本发明的另一目的在于提供一种显示装置，所述显示装置包括：
显示面板；以及
背光模块，包括：
电路板；
光源，具有发光面，所述光源与所述电路板电性连接；
反射层，设置在所述光源的周围，所述反射层与所述光源的所述发光面位于所述电路板的同一侧；以及
至少一支撑单元，设置在所述电路板与所述反射层之间，并支撑所述反射层。
本发明的又一目的在于提供一种背光模块，所述背光模块包括：
电路板，开设有通孔；
光源，嵌设于所述通孔内，所述光源具有发光面，且电性连接于所述电路板；以及
反射层，设置所述电路板上，且所述反射层与所述光源的所述发光面位于所述电路板的同一侧。
本发明的又一目的在于提供一种显示装置，所述显示装置包括：
显示面板；以及
背光模块，包括：
电路板，开设有通孔；
光源，嵌设于所述通孔内，所述光源具有发光面，且电性连接于所述电路板；以及
反射层，设置所述电路板上，且所述反射层与所述光源的所述发光面位于所述电路板的同一侧。
 技术解决方案
在本发明的一实施例中，所述支撑单元为柱状单元。
在本发明的一实施例中，所述反射层为反射板、反射片或涂布在支撑单元上的反射涂层。
在本发明的一实施例中，所述支撑单元为板状，并设有若干个通孔，用以嵌设所述光源；所述电路板与所述反射层设置在所述支撑单元相对的两侧。
在本发明的一实施例中，所述反射层与所述光源的所述发光面齐平。
在本发明的一实施例中，所述电路板包括导电层及介电层，所述导电层形成于所述介电层上，所述支撑单元是设置于所述电路板的所述导电层上。
在本发明的一实施例中，所述反射层与所述光源的所述发光面之间的所述高度差小于1毫米。
在本发明的一实施例中，所述反射层与所述光源的所述发光面之间的所述高度差小于100微米。
在本发明的一实施例中，所述背光模块还包括导光板，所述光源和所述电路板是设置在所述导光板的一侧。
本发明的背光模块和显示装置可减少反射层与光源的发光面之间的高度差，以减少光线在此高度差的区域中的损失，并提高反射光的利用率。
 有益效果
本发明的背光模块和显示装置可利用支撑单元来增加反射层的设置高度，以来减少反射层与光源的发光面之间的高度差异，因而可减少光线在此高度差异的区域中的损失，并提高反射光的利用率。
 附图说明
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
图1显示依照本发明的第一实施例的背光模块与显示面板的剖面示意图；
图2显示依照本发明的第一实施例的背光模块的部分剖面示意图；
图3显示依照本发明的第一实施例的背光模块的另一部分剖面示意图；
图4显示依据本发明的第二实施例的背光模块的部分剖面示意图；
图5显示依据本发明的第三实施例的背光模块的部分剖面示意图；以及
图6显示依据本发明的第四实施例的背光模块的部分剖面示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
在图中，结构相似的单元是以相同标号表示。
请参照图1及图2，图1显示依照本发明的第一实施例的背光模块与显示面板的剖面示意图，图2显示依照本发明的第一实施例的背光模块的部分剖面示意图。本实施例的背光模块100可为直下式背光模块，其相对于一显示面板101来设置，所述显示面板101可为液晶显示面板，而形成一显示装置，如液晶显示装置等。背光模块100可包括背板110、若干个光源120、电路板130、反射层140、至少一支撑单元150及光学膜片160。
如图1所示，本实施例的背板110是由不透光材质所制成，例如：塑化材料、金属材料或上述材料的组合，用以承载光源120、电路板130及光学膜片160。
如图1和图2所示，电路板130设置在背板110上，电路板130可为印刷电路板(Printed circuit board，PCB)或柔性印刷电路板(Flexible Printed Circuits，FPC)。所述电路板130包括导电层131及介电层132，导电层131形成于介电层132上，用来与光源120的电极引脚123电性连接。导电层131优选是由金属材料所形成，例如为铜箔层。
光源120设置在电路板130上，并与电路板130的导电层131电性连接，用来为显示面板101提供光线。本实施例的光源120可为发光二极管(Light-Emitting Diode，LED)、有机发光二极管(Organic Light Emitting Diode，OLED)、电激发光(Electro-Luminescence，EL)组件、LED灯条(light bar)等。
光源120包括发光面121、封装体122及两个电极引脚123。封装体122由发光二极管芯片封装而成，发光面121及电极引脚123露出封装体122。电极引脚123设置在封装体122的相对两侧，并可利用表面黏着技术(Surface Mount Technology，SMT)来与电路板130电性连接。在本实施例中，此光源120的封装方式为小尺寸封装(small outline package)，即电极引脚123是设置在发光二极管芯片的两侧，并朝外弯折，以电性连接在电路板130上，如图2所示；所述电极引脚123也可以向内弯折，并与电路板130电性连接，如图3所示。
如图2所示，本实施例的支撑单元150是设置在电路板130与所述反射层140之间，并支撑反射层140。支撑单元150由绝缘材料所制成，例如塑料或橡胶等，所述支撑单元150为多个柱状单元，支撑单元150可利用焊接、黏着或螺固等方式来设置在电路板130上。在本实施例中，支撑单元150是设置于电路板130的导电层131上。
反射层140设置在支撑单元150上，并形成在光源120之间或其周围，以减小反射层140与光源120的发光面121之间的高度差。本实施例的反射层140可为反射板或反射片，用来反射光线。此反射层140是由高反射率材料所制成，例如银、铝、金、铬、铜、铟、铱、镍、铂、铼、铑、锡、钽、钨、锰、其上述任意组合的合金或耐黄化且耐热的白色反射漆料等。
如图2所示，通过支撑单元150的支撑，反射层140的反射表面可实质地齐平于光源120的发光面121，或者，反射层140的反射表面与光源120的发光面121之间的高度差异可小于1毫米(mm)，例如优选为小于100微米(μm)。因此，相较于现有的背光模块，反射层140的反射表面与光源120的发光面121之间的高度差可被消除或大幅地减小，以减少光线在此高度差异的区域中的损失，并提高反射光的利用率。
光学膜片160是设置在光源120上方，用来改善光源120的发光均匀性或发光效率。本实施例的光学膜片160例如为：扩散片、棱镜片、增亮膜(Brightness Enhancement Film，BEF)、反射式增亮膜(Dual Brightness Enhancement Film，DBEF)、非多层膜式反射偏光片(Diffused Reflective Polarizer Film，DRPF)或上述的任意组合，其位于光源120上。
因此，本实施例的背光模块100可利用支撑单元150来减小反射层140与光源120的发光面121之间的高度差，以改善背光模块100的反射光的利用率。
请参照图4，其显示依据本发明的第二实施例的背光模块的部分剖面示意图。以下仅就本实施例与第一实施例间之相异处进行说明，而其相似处则在此不再赘述。相较于第一实施例，第二实施例的支撑单元250可为板状，由电路板230的介电层232来直接做为支撑单元250使用。此时，导电层231形成于支撑单元250的一侧，而反射层240设置在支撑单元250的与导电层231相对的一侧。支撑单元250设有若干个通孔251，用以容纳及嵌设光源220。光源220的封装体222设置在支撑单元250的通孔251中，而光源220的电极引脚223是伸出封装体222，并与导电层231电性连接，光源220的发光面221齐平于反射层240的反射表面，或者反射层240的反射表面与光源220的发光面221之间的高度差异可小于1毫米(mm)，例如优选为小于100微米(μm)。在本实施例中，反射层240可为反射板或反射片，或者，反射层240也可为一反射涂层，其可利用高反射率材料来直接涂布或印刷在支撑单元250的与导电层231相对的一侧。因此，本实施例的背光模块200可利用支撑单元250，即电路板230的介电层，与通孔251的搭配设计来减小反射层240与光源220的发光面221之间的高度差，以改善反射光的利用率。
请参照图5，其显示依据本发明的第三实施例的背光模块的部分剖面示意图。以下仅就本实施例与第一实施例间之相异处进行说明，而其相似处则在此不再赘述。本实施例中，背光模块300为侧向式入光的背光模块，其可包括背板310、若干个光源320、电路板330、反射层340、支撑单元350、光学膜片360及导光板370。导光板370设置在背板310上，光源320和电路板330组成发光灯条，并设置在导光板370的一侧，用以发光至导光板370。反射层340形成于光源320的周围，用以反射光源320的光线。支撑单元350形成于电路板330的导电层331与反射层340之间，用以减小反射层340与光源320的发光面321之间的高度差。光学膜片360是设置在导光板370的上方，用以改善由导光板370所发出的光线均匀性或亮度。
请参照图6，其显示依据本发明的第四实施例的背光模块的部分剖面示意图。以下仅就本实施例与第一实施例间之相异处进行说明，而其相似处则在此不再赘述。相较于第一实施例，第四实施例的支撑单元450可为板状，其设置于电路板430上。支撑单元450设有若干个通孔451，用以容纳及嵌设光源420。光源420的封装体422设置在支撑单元450的通孔451中，而光源420的电极引脚423设置在封装体422的相对两侧，并可利用表面黏着技术(SMT)来与电路板430的导电层431电性连接。所述电极引脚423例如可向内弯折，并与电路板430电性连接，如图6所示。又，电极引脚423也可以设置在发光二极管芯片的两侧，并朝外弯折，以电性连接在电路板430上。光源420的发光面421可大致齐平于反射层440的反射表面。在本实施例中，反射层440可为反射板、反射片或涂布在支撑单元450表面的反射涂层。因此，本实施例的背光模块400可利用板状的支撑单元450来减小反射层440与光源420的发光面421之间的高度差，以改善反射光的利用率。
由上述可知，本发明的背光模块和显示装置可利用支撑单元来增加反射层的设置高度，以来减少反射层与光源的发光面之间的高度差异，因而可减少光线在此高度差异的区域中的损失，并提高反射光的利用率。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
 本发明的实施方式
工业实用性
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Claims (20)

  1. 一种显示装置，其特征在于：所述显示装置包括：
    显示面板；以及
    背光模块，包括：
    电路板；
    光源，具有发光面，所述光源与所述电路板电性连接；
    反射层，设置在所述光源的周围，所述反射层与所述光源的所述发光面位于所述电路板的同一侧；以及
    至少一支撑单元，设置在所述电路板与所述反射层之间，并支撑所述反射层，所述支撑单元为板状，并设有若干个通孔，用以嵌设所述光源，所述电路板与所述反射层设置在所述支撑单元相对的两侧，所述反射层与所述光源的所述发光面之间的所述高度差小于1毫米。
  2. 根据权利要求1所述的显示装置，其特征在于：所述反射层为反射板、反射片或涂布在支撑单元上的反射涂层。
  3. 根据权利要求1所述的显示装置，其特征在于：所述反射层与所述光源的所述发光面之间的所述高度差小于100微米。
  4. 根据权利要求1所述的显示装置，其特征在于：所述背光模块还包括导光板，所述光源和所述电路板是设置在所述导光板的一侧。
  5. 一种背光模块，其特征在于：所述背光模块包括：
    电路板；
    光源，具有发光面，所述光源与所述电路板电性连接；
    反射层，设置在所述光源的周围，所述反射层与所述光源的所述发光面位于所述电路板的同一侧；以及
    至少一支撑单元，设置在所述电路板与所述反射层之间，并支撑所述反射层。
  6. 根据权利要求5所述的背光模块，其特征在于：所述支撑单元为柱状单元。
  7. 根据权利要求5所述的背光模块，其特征在于：所述反射层为反射板或反射片。
  8. 根据权利要求5所述的背光模块，其特征在于：所述支撑单元为板状，并设有若干个通孔，用以嵌设所述光源；所述电路板与所述反射层设置在所述支撑单元相对的两侧。
  9. 根据权利要求8所述的背光模块，其特征在于：所述反射层为反射板、反射片或涂布在支撑单元上的反射涂层。
  10. 根据权利要求5所述的背光模块，其特征在于：所述反射层与所述光源的所述发光面齐平。
  11. 根据权利要求5所述的背光模块，其特征在于：所述电路板包括导电层及介电层，所述导电层形成于所述介电层上，所述支撑单元是设置于所述电路板的所述导电层上。
  12. 根据权利要求5所述的背光模块，其特征在于：所述反射层与所述光源的所述发光面之间的所述高度差小于1毫米。
  13. 根据权利要求5所述的背光模块，其特征在于：所述反射层与所述光源的所述发光面之间的所述高度差小于100微米。
  14. 根据权利要求5所述的背光模块，其特征在于：还包括导光板，所述光源和所述电路板是设置在所述导光板的一侧。
  15. 一种背光模块，其特征在于：所述背光模块包括：
    电路板，开设有通孔；
    光源，嵌设于所述通孔内，所述光源具有发光面，且电性连接于所述电路板；以及
    反射层，设置所述电路板上，且所述反射层与所述光源的所述发光面位于所述电路板的同一侧。
  16. 根据权利要求15所述的背光模块，其特征在于：所述反射层为反射板、反射片或涂布在电路板表面的反射涂层。
  17. 根据权利要求15所述的背光模块，其特征在于：所述反射层与所述光源的所述发光面齐平。
  18. 根据权利要求15所述的背光模块，其特征在于：所述反射层与所述光源的所述发光面之间的所述高度差小于1毫米。
  19. 根据权利要求15所述的背光模块，其特征在于：所述反射层与所述光源的所述发光面之间的所述高度差小于100微米。
  20. 根据权利要求15所述的背光模块，其特征在于：还包括导光板，所述光源和所述电路板是设置在所述导光板的一侧。
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