WO2012046701A1 - Light emitting device, light emitting module, and planar light source device - Google Patents

Light emitting device, light emitting module, and planar light source device Download PDF

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Publication number
WO2012046701A1
WO2012046701A1 PCT/JP2011/072799 JP2011072799W WO2012046701A1 WO 2012046701 A1 WO2012046701 A1 WO 2012046701A1 JP 2011072799 W JP2011072799 W JP 2011072799W WO 2012046701 A1 WO2012046701 A1 WO 2012046701A1
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Prior art keywords
light emitting
resin container
light
emitting device
lead
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Application number
PCT/JP2011/072799
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French (fr)
Japanese (ja)
Inventor
目見田　裕一
賢司 高瀬
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シャープ株式会社
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Publication of WO2012046701A1 publication Critical patent/WO2012046701A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Definitions

  • the present invention relates to a light emitting device, a light emitting module, and a planar light source device, and more specifically, a light emitting device that can emit light uniformly, a light emitting module including the light emitting device, and the light emitting module.
  • the present invention relates to a planar light source device.
  • a light source configured by arranging light emitting diodes capable of emitting white mixed color light with high luminance is used in various fields.
  • a light-emitting diode is provided as a light-emitting device including a light-emitting element and a support body that includes a lead electrode that protects the light-emitting element from the external environment and is connected to the electrodes. And after making the light of a light emitting diode enter from the light-incidence surface of the translucent member with which the light-emitting device provided with such a light emitting diode was fixed, and guiding the inside of a translucent member, A configuration in which light is extracted from the light exit surface side is known. Examples of such a light source include a backlight for a liquid crystal display.
  • FIG. 16 is a partial plan view of the backlight.
  • a plurality of light source packages 101 are mounted on one side of a printed circuit board 102.
  • the light emitted from the light emitting surface 101a of each light source package 101 is guided through the light guide plate 103 from the light incident surface 103a of the light guide plate 103 disposed to face the light emitting surface 101a, and then emitted from the light guide plate 103. Emits from the surface.
  • the light from the light guide plate 103 is emitted in the front direction of the paper.
  • 17 is a plan view of the light source package 101 as viewed from the light emitting surface side, and FIG.
  • FIG. 18 is a cross-sectional view showing the light source package 101 cut along the cutting line AA ′ shown in FIG. FIG.
  • a light emitting element 107 disposed in a central portion is surrounded by a reflector 105 having a reflective surface 106.
  • the light emitting element 107 and the lead terminal 108 formed on the support 111 are electrically connected via a bonding wire 109.
  • a sealing material 110 made of a transparent resin is provided between the light emitting element 107 and the reflector 105.
  • the gap (space) 104 between the light emitting surface 101a of the light source package 101 and the light incident surface 103a of the light guide plate 103 shown in FIG. 16 is an important factor that influences the backlight performance.
  • the light emitting surface of the light source package and the light incident surface of the light guide plate are small and fixed while maintaining a uniform air gap.
  • the light emitting surface 101 a of the light source package 101 and the light incident surface of the light guide plate 103 due to deformation of members due to heat shrinkage, and restrictions on fixing the printed circuit board and the light guide plate. It is difficult to maintain a uniform gap with 103a. If a uniform gap is not provided, the amount of light entering the light guide plate 103 from the light source package 101 (incident light rate) varies, leading to variations in the brightness of the entire backlight and a decrease in light utilization efficiency.
  • FIG. 19 is a perspective view showing the light emitting device 200 disclosed in Patent Documents 1 and 2, and FIG. 20 is a cross section showing the light emitting device 200 shown in FIG. 19 cut along the light emitting direction.
  • FIG. in the light-emitting device 200 of Patent Document 1 a recess is formed by a package inner wall surface 208 on the main surface side of the package 201, and the light-emitting element 204 is accommodated. Further, there is a step in the side wall portion of the package main surface adjacent to the recess. Specifically, it has at least a first main surface 201a adjacent to the recess and a second main surface 201b that is one step lower than the first main surface 201a.
  • On the bottom surface of the concave portion one end of the positive lead electrode 202 and one end of the negative lead electrode 202 are provided so as to be separated from each other and the main surfaces thereof are exposed. An insulating molding material is filled between the electrodes.
  • the protruding first main surface 201a can function as a spacer for maintaining a gap (space) between the light incident surface of the light guide plate.
  • Japanese Patent Publication Japanese Patent Laid-Open No. 2006-128719 (published on May 18, 2006) Japanese Patent Publication “Japanese Unexamined Patent Application Publication No. 2007-180591 (published July 12, 2007)”
  • the first main surface 201 a that functions as a spacer is formed of the package 201. That is, the first main surface 201a is made of a resin material. Therefore, when the light emitting device and the light guide plate are joined in the initial stage of the assembly stage, the first main surface 201a may come into contact with the light guide plate, and the impact may cause the first main surface 201a to break or chip. is there. Furthermore, there is a possibility that problems such as stress due to heat shrinkage and wear or chipping due to contact with the light guide plate during continuous use may occur. If such a defect occurs in the spacer, the predetermined gap cannot be maintained.
  • the gap between the light emitting device and the light guide plate cannot be made uniform, and variations in backlight performance cannot be sufficiently avoided.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device that maintains a uniform gap between the light-emitting device and the light guide plate and avoids variations in backlight performance. That is.
  • a lead portion disposed with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion exposed outside the resin container;
  • a light emitting device comprising: a light emitting element electrically connected to the lead portion on the bottom surface of the recess;
  • the lead portion is a metal plate having a predetermined thickness,
  • the protruding portion protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end of the lead portion,
  • the protruding length of the protruding portion from the upper surface of the resin container is the same as the predetermined thickness.
  • the said protrusion part comprised from the said other end part of the said lead part protrudes from the said upper surface of the said resin container, and the protrusion length comprises the said lead part. It matches the thickness of the metal plate.
  • the light emitting device according to the present invention when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion.
  • the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
  • the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
  • the light-emitting device can provide a highly reliable light-emitting device that avoids variations in backlight performance by having the above-described configuration.
  • a light emitting module according to the present invention is provided.
  • a printed wiring board The light-emitting device having the above-described structure mounted on the printed wiring board is provided.
  • the protruding portion configured from the other end of the lead portion protrudes from the upper surface of the resin container, and the protruding length is And the thickness of the metal plate constituting the lead portion.
  • the light emitting device according to the present invention when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion.
  • the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
  • the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
  • planar light source device in order to solve the above problems, A light emitting module configured as described above; A light guide plate, The light emitting module is disposed such that the opening side of the concave portion of the light emitting device is opposed to the light incident surface of the light guide plate, and the protruding portion of the lead portion is in contact with the light incident surface of the light guide plate. It is characterized by that.
  • the light emitting device is as described above.
  • a resin container in which a recess including a bottom surface and a wall surface rising from a peripheral edge of the bottom surface is provided on the top surface;
  • a lead portion disposed with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion exposed outside the resin container;
  • a light emitting device comprising: a light emitting element electrically connected to the lead portion on the bottom surface of the recess;
  • the lead portion is a metal plate having a predetermined thickness,
  • the protruding portion protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end of the lead portion,
  • the protruding length of the protruding portion from the upper surface of the resin container is the same as the predetermined thickness.
  • the light emitting module according to the present invention is as described above.
  • the planar light source device is as described above.
  • a light emitting module configured as described above;
  • a light guide plate, The light emitting module is disposed such that the opening side of the concave portion of the light emitting device is opposed to the light incident surface of the light guide plate, and the protruding portion of the lead portion is in contact with the light incident surface of the light guide plate. It is characterized by that.
  • the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be maintained uniformly, and a highly reliable light emitting device, light emitting module, and surface light source that avoids variations in backlight performance An apparatus can be provided.
  • FIG. 3 is a partial cross-sectional view showing a state where the light emitting module shown in FIG. 2 is cut along a cutting line CC ′. It is sectional drawing which shows the structure of one Embodiment of the light-emitting device which concerns on this invention.
  • FIG. 5 is a diagram illustrating a part of a manufacturing process of the light emitting device illustrated in FIG. 4. It is the top view which showed the structure of another embodiment of the light-emitting device based on this invention.
  • FIG. 7 is a partial cross-sectional view showing a state where the light emitting device shown in FIG. 6 is cut along a cutting line CC ′.
  • FIG. 7 is a diagram illustrating a part of a manufacturing process of the light emitting device illustrated in FIG. 6. It is a fragmentary top view which shows the structure of another embodiment of the light emitting module which concerns on this invention.
  • FIG. 10 is a partial cross-sectional view of the light emitting module shown in FIG. 9 cut along a cutting line CC ′. It is the top view which showed the structure of another embodiment of the light-emitting device based on this invention.
  • FIG. 12 is a partial cross-sectional view illustrating a state where the light emitting device illustrated in FIG. 11 is cut along a cutting line CC ′.
  • FIG. 12 is a diagram illustrating a part of a manufacturing process of the light emitting device illustrated in FIG. 11. It is a fragmentary top view which shows the structure of another embodiment of the light emitting module which concerns on this invention.
  • FIG. 15 is a partial cross-sectional view of the light emitting module shown in FIG. 14 cut along a cutting line CC ′. It is a figure which shows a prior art. It is a figure which shows a prior art. It is a figure which shows a prior art. It is a figure which shows a prior art. It is a figure which shows a prior art. It is a figure which shows a prior art. It is a figure which shows a prior art. It is a figure which shows a prior art. It is a figure which shows a prior art.
  • the present invention includes a structural feature of a light emitting device that allows light to enter a light guide plate, and a plurality of light emitting devices provided along a light incident surface of a light guide.
  • the gap between the light emitting devices can be equal to each other, and the same state can be maintained for a long time.
  • the configuration of one embodiment of the planar light source device will be described, then the configuration of the light emitting module included in the planar light source device will be described, and then the light emitting module.
  • a structure of the light emitting device and a method for manufacturing the light emitting device will be described.
  • planar light source device can be applied as a backlight device of a liquid crystal display device including a liquid crystal panel as display means. In addition, it can be applied as a lighting device.
  • FIG. 1 is a perspective view of a planar light source device according to this embodiment.
  • the planar light source device 5 in this embodiment includes a light emitting module 30 and a light guide plate 40 as shown in FIG.
  • the light guide plate 40 is a translucent member made of acrylic resin.
  • the light guide plate 40 has a light incident surface 41 on one side for individually introducing light from a plurality of light emitting devices provided in the light emitting module 30 into the light guide plate, and uses reflection on the inner wall surface of the light guide plate 40. Then, light is emitted in a planar shape from the light emitting surface 42 provided on the other side surface.
  • the light incident surface of the liquid crystal panel is disposed on the light emitting surface 42 side of the light guide plate 40.
  • Light emitted from the light exit surface 42 of the light guide plate 40 is incident on the liquid crystal panel whose light transmittance is controlled by voltage application, thereby displaying a desired image.
  • the light-guide plate 40 is comprised from one transparent member, this invention is not limited to this.
  • the light guide plate 40 may be formed by combining a plurality of light guide portions into which the light guide plate 40 corresponds to each of the light emitting devices 1 provided in the light emitting module.
  • the light incident surface 41 of the light guide plate 40 can be provided with a prism shape (not shown) so that light from the light emitting device is incident on the light guide plate in a wide range.
  • the light emitting module 30 includes a light emitting device 1, a printed wiring board 20, and a heat radiating plate 21, as shown in FIG.
  • the light emitting module 30 will be further described.
  • FIG. 2 is a partial plan view of the light-emitting module 30 of the present embodiment as viewed from the light emitting surface side.
  • 3 is a partial cross-sectional view of the light emitting module 30 taken along the cutting line CC ′ shown in FIG. 2, and FIG. 3 also shows a cross section of the light guide plate 40 for convenience of explanation. .
  • the light emitting module 30 has a printed wiring board 20 at a position facing the light incident surface 41 of the light guide plate 40 as shown in FIG.
  • the printed wiring board 20 is formed with a plurality of holes 20 a that open toward the light incident surface 41 of the light guide plate 40 and the heat radiating plate 21. That is, each hole 20 a is a through-hole penetrating from the front surface to the back surface of the printed wiring board 20.
  • the light emitting device 1 is inserted and arranged with the light emitting side facing the light incident surface 41 of the light guide plate 40.
  • the light emitting device 1 inserted into the hole 20a which is a through hole is exposed on the back side of the printed wiring board 20.
  • the printed wiring board 20 can be made of a conventionally known board material. Although the size of the printed wiring board 20 is not particularly limited, the light emitting module 30 is configured to be compact by using a board having a surface substantially the same size as the light incident surface 41 of the light guide plate 40. be able to.
  • the heat dissipation plate 21 is a thermally conductive plate disposed on the back surface of the printed wiring board 20. In addition to contacting the back surface of the printed wiring board 20, the heat sink 21 is also in contact with the bottom of the light emitting device 1 exposed on the back surface side. By making contact with the bottom of the light emitting device 1, heat generated in the light emitting device 1 can be directly radiated, and the heat radiating effect can be enhanced.
  • the surface of the heat radiating plate 21 opposite to the surface facing the printed wiring board 20 has a saddle structure as shown in FIG. As a result, the surface area can be increased to efficiently dissipate heat.
  • the light emitting device 1 includes a resin container 11 having a light emitting element therein, an anode lead part 12a (lead part) and a cathode lead part 12b (lead part) formed of a lead frame integrated with the resin container 11. Lead portion).
  • a recess is formed in the resin container 11, and the light emitting device 1 is disposed in each hole 20 a of the printed wiring board 20 so that the recess opens toward the light incident surface 41 of the light guide plate 40.
  • the anode lead portion 12a and the cathode lead portion 12b of the light-emitting device 1 are inserted into the resin container at the bottom, which is opposite to the opening side of the resin container 11, The end of the insertion portion is exposed to the side of the resin container 11 and extends to the opening side of the resin container along the side.
  • the side part of the resin container 11 refers to a part facing the wall surface of the hole 20a of the printed wiring board 20.
  • the anode lead portion 12a and the cathode lead portion 12b are arranged at positions where the portions extending along the side portions face each other with the resin container 11 interposed therebetween as shown in FIG.
  • lead portions 12a and 12b may be simply described without distinguishing between the anode portion and the cathode portion.
  • each of the lead portions 12a and 12b is a metal plate having a predetermined thickness, and is arranged with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion. Is disposed in a state of being exposed to the outside of the resin container, and the protruding portion 12c protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end portion of the lead portion.
  • the protruding length of the resin container from the upper surface of the part 12c is that it matches the predetermined thickness.
  • the protruding portion 12c has a light emitting direction along the side portion of the resin container 11 when the length extending in the direction perpendicular to the bottom surface from the bottom surface to the top surface of the resin container 11 is height.
  • the top portion of the lead portions 12a and 12b extending in the parallel direction is the top, which is higher than the upper surface of the resin container 11, and the height difference between the protruding portion 12c and the upper surface of the resin container 11 is It matches the thickness of the lead part.
  • the lead portions 12a and 12b have a first portion extending along the side wall of the resin container, and a direction in which the first portion is separated from the resin container 11 at a position adjacent to the upper surface of the resin container 11.
  • the second portion extends in parallel with the upper surface of the resin container 11, and the protruding portion 12 c is formed with respect to the upper surface of the resin container 11 of the second portion. It is comprised by the surface of the metal plate which comprises the lead part extended in parallel.
  • the light emitting module 30 as described above is disposed on the light guide plate 40 as shown in FIG. 1, the upper surface of the protruding portion 12 c and the light incident surface 41 of the light guide plate 40 are fixed in close contact.
  • a mechanical fixing method such as chassis fixing is used.
  • connection method may be a bonding wire method or a flip chip method.
  • the surface of the printed wiring board 20 and the upper surface of the resin container 11 are flush with each other. Therefore, in the case of the light emitting module 30 of the present embodiment, as shown in FIG. 3, the air gap 70 formed between the upper surface of the resin container 11 and the light incident surface 41 of the light guide plate 40 has a lead portion. It becomes equal to the thickness of the metal plate which comprises 12a, 12b.
  • FIG. 4 is a cross-sectional view showing only the light emitting device 1 of the light emitting module 30 shown in FIG.
  • the light emitting device in the present embodiment is suitable for use as a light source of a backlight of a display device including a liquid crystal panel as a light source module combined with a light guide plate as described above, but is not limited thereto. It can be used for any device equipped with a light source.
  • the light emitting device 1 of the present embodiment will be described in detail.
  • the light emitting device 1 includes a resin container 11 provided with a recess 11 a on the upper surface, the anode lead portion 12 a formed of a lead frame integrated with the resin container 11, and the cathode.
  • the lead part 12b, the light emitting element 14 attached to the bottom face 17 of the recessed part 11a, and the sealing resin 15 provided so that the recessed part 11a may be covered are provided.
  • the resin container 11 is formed by injection-molding a thermoplastic resin (referred to as a white resin in the following description) containing a white pigment in the lead portions 12a and 12b.
  • a thermoplastic resin referred to as a white resin in the following description
  • the white resin constituting the resin container 11 has the white pigment content, particle size, and the like adjusted so that the visible light reflectance is 85% or more. In other words, the visible light absorptance of the resin container 11 is less than 15%.
  • the white pigment include titanium oxide.
  • PPA polyphthalamide
  • the base resin may be a liquid crystal polymer, an epoxy resin, polystyrene, or the like.
  • a semi-crystalline polymer resin containing a high melting point crystal such as a polyphthalamide resin
  • the surface energy is large, and a sealing resin that can be provided inside the opening, a light guide plate that can be attached later, etc. A package with good adhesion can be obtained.
  • the recess 11 a provided in the resin container 11 includes a bottom surface 17 having a rectangular shape and a wall surface 18 that rises from the periphery of the bottom surface 17 toward the upper side of the resin container 11.
  • the bottom surface 17 is constituted by the lead portions 12a and 12b exposed to the concave portion 11a and the white resin of the resin container 11 exposed in the gap between the lead portions 12a and 12b.
  • the wall surface 18 is made of a white resin constituting the resin container 11.
  • the shape of the wall surface 80 is not limited to a rectangle, and may be any of a circle, a rectangle, an ellipse, and a polygon, and may be the same as or different from the bottom shape.
  • Each of the lead portions 12a and 12b is held while being sandwiched in the resin container 11, and the other portion is exposed to the outside of the resin container 11, and is used for applying a current to the light emitting element 14. It is a terminal.
  • the lead portions 12a and 12b that is, the lead frame are configured to have a uniform thickness over the entire metal plate in a thickness range of 0.1 to 0.5 mm, and the surface is plated with metal to form electrodes. A layer in which a layer is formed is used. That is, the metal plating layers (electrode layers) of the lead portions 12a and 12b are exposed on the bottom surface 17 of the recess 11a.
  • the portion exposed to the outside of the resin container 11 in the lead portions 12a and 12b is a first portion extending along the side wall of the resin container 11 as described above.
  • the first portion has a second portion that bends and extends in a direction away from the resin container 11 at a position adjacent to the upper surface of the resin container 11, and a protruding portion 12c is formed in the second portion.
  • each of the lead portions 12a and 12b is a long metal plate, and light is emitted when it is exposed to the outside of the resin container 11 from one end exposed at the bottom surface 17 of the recess 11a beyond the region facing the resin container 11. It has a first portion that is bent toward the emission side and extends to the light emission side along the side wall of the resin container 11, and the other end is protruded from the resin container 11 when protruding from the upper surface of the resin container 11 to the light emission side.
  • the second portion is bent in the direction away from the resin container 11 and extends in the direction away from the resin container 11.
  • the upper surface of the portion bent and extended in the direction away from the resin container 11 is the protrusion 12c.
  • the upper surface is the same surface as the surface on which the light emitting element 14 is mounted exposed at the bottom surface 17 of the recess 11a.
  • the surface opposite to the surface that is, the surface facing the surface of the printed wiring board 20 shown in FIG. 3 is the same surface as the back surface of the surface on which the light emitting element 14 is mounted.
  • the height difference between the upper surface of the resin container 11 and the upper surface of the other end bent in the direction away from the resin container 11 is configured to be equal to the thickness of the lead portion (thickness of the metal plate).
  • the light emitting element 14 is bonded and fixed to the anode lead portion 12a exposed on the bottom surface 17 of the recess 11a with a die bond agent.
  • the light emitting element 14 is provided with a conductive pattern for applying a voltage during light emission.
  • the conductive pattern is provided on the light emitting surface side of the light emitting element 14, and is electrically connected to the above-described metal plating layers (electrode layers) of the lead portions 12 a and 12 b and the bonding wires 16. Connected.
  • the light emitting element 14 used in this embodiment there is an LED chip, and a conventionally known LED chip can be used. By using the LED chip, there are merits such as low power consumption, low calorific value, and long life.
  • a plurality of the light emitting elements 14 may be used according to the size of the bottom surface 17 of the recess 11a, and various shapes can be formed according to the shape of the bottom surface 17 of the recess 11a.
  • the sealing resin 15 is a translucent resin that is filled so as to cover the light emitting element 14 in the recess 11a.
  • the material of the sealing resin 15 is not particularly limited as long as it is translucent. Silicone resin, epoxy resin, urea resin, fluororesin, and hybrid resin including at least one or more of those resins are excellent in weather resistance. A translucent resin can be used. Further, the sealing resin material is not limited to an organic material, and an inorganic material having excellent light resistance such as glass and silica gel can also be used.
  • any member such as a viscosity extender, a light diffusing agent, a pigment, and a fluorescent substance can be added to the sealing resin 15 depending on the intended use.
  • the light diffusing agent include barium titanate, titanium oxide, aluminum oxide, silicon oxide, silicon dioxide, heavy calcium carbonate, light calcium carbonate, and a mixture containing at least one of them.
  • the lens effect can be given by making the light emission surface side of the sealing resin into a desired shape, and the light emission from the light emitting element chip can be focused.
  • FIG. 5 is a flowchart of the manufacturing process showing the manufacturing process of the light emitting device in a cross-sectional view.
  • the first step of the light emitting device of the present embodiment is to arrange the lead portion on the molding die 60 as shown in FIG.
  • the pair of lead portions for the anode and the cathode are formed by stamping (pressing) the metal plate, and the surface is finished by metal plating.
  • the material of the lead portion is not particularly limited as long as it is conductive, but it is required that the adhesive property and electrical conductivity with a bonding wire which is a member electrically connected to the light emitting element are good.
  • the specific electric resistance is preferably 300 ⁇ -cm or less, more preferably 3 ⁇ -cm or less. Suitable materials satisfying these conditions include iron, copper, iron-containing copper, tin-containing copper and copper, gold, silver plated aluminum, iron, copper and the like.
  • the anode lead portion 12a has one end surface of the bottom surface 17 of the concave portion 11a after molding and one end surface of the cathode lead portion 12b. It is separated from the cathode lead portion 12b so as to face each other.
  • no special processing is applied to the lead portion whose end principal surface is exposed at the bottom surface 17 of the concave portion 11a.
  • at least one pair of through holes is provided on the left and right sides with the longitudinal direction of the concave portion 11a as an axis. It is also possible to increase the bond strength with the molding resin.
  • Step 2 Formation of resin container>
  • the long metal plate (lead part) formed in the above step 1 is placed between the molding dies, and these dies are closed ((b) in FIG. 5). At this time, one end of each of the lead portions 12a and 12b is arranged in a hollow portion formed inside the molding die.
  • a molding material is injected into the cavity from a gate (not shown) provided in the molding die to cover the ends of the lead portions 12a and 12b.
  • the hollow portion corresponds to the outer shape of the resin container.
  • the formed molded member is removed from the mold ((c) in FIG. 5).
  • it can take out by providing a pin inside the shaping
  • the resin container is not formed on the back surface (the surface opposite to the side where the light emitting element is mounted) of the lead portions 12a and 12b, the back surface may be exposed, and the resin is also formed on the back surface side. May be.
  • the lead portions 12a and 12b have a bent structure. Specifically, there is a first bent portion at an adjacent portion between the bottom surface of the resin container 11 and the side portion of the resin container 11, and a second portion at an adjacent portion between the side portion of the resin container 11 and the upper surface of the resin container 11. There is a bend. In the first bent portion, the lead portions 12a and 12b extending along the bottom surface of the resin container 11 are refracted so as to extend along the side portion of the resin container 11 (first portion).
  • the lead portions 12a and 12b extending along the side portion of the resin container 11 are along the direction away from the concave portion of the resin container 11 (second portion) and the portion extending along the direction away from the concave portion.
  • the bottom surface is refracted so as to be the same height as the top surface of the resin container 11.
  • the height refers to a length extending in a direction perpendicular to the bottom surface from the bottom surface of the resin container 11 toward the top surface.
  • Such a bent structure can be manufactured by using the mold shown in (d) and (e) of FIG.
  • the said 2nd bending part is produced by arrange
  • Step 4 Formation and connection of light emitting element> Subsequently, the light emitting element 14 is fixed to the lead portions 12a and 12b exposed on the bottom surface 17 of the concave portion 11a of the resin container 11 ((f) in FIG. 5).
  • the above-described die bond agent can be used for fixing.
  • the conductive pattern provided on the light emitting element 14 and the metal plating layer of each lead portion 12a, 12b are each made of a conductive bonding wire. 16 to connect.
  • the anode lead portion 12a occupies the area occupied by the bottom surface 17 of the recess 11a of the resin container 11 rather than the cathode lead portion 12b. Is big.
  • the present invention is not limited to this, and the light-emitting element 14 may be fixed on the cathode lead portion 12b. In that case, the cathode lead portion 12b is more than the anode lead portion 12a. The occupation area may be widened.
  • the bonding member used for die bonding is not particularly limited, and an insulating adhesive such as an epoxy resin, an Au—Sn alloy, a resin or glass containing a conductive material, and the like can be used.
  • the conductive material contained is preferably Ag. When an Ag paste having an Ag content of 80% to 90% is used, a light emitting device having excellent heat dissipation and low stress after bonding can be obtained.
  • the bonding wire 16 is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrode of the light emitting element 14.
  • the diameter of the bonding wire is preferably 10 ⁇ m or more and 45 ⁇ m or less.
  • Specific examples of such a bonding wire include conductive wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof.
  • the conductive pattern and the metal plating of the lead portion are connected using a bonding wire.
  • the present invention is not limited to this, and a pair provided on the same surface side.
  • These electrodes may be mounted by a flip chip method in which the electrodes are opposed to a pair of lead electrodes exposed from the package recess. If the flip chip method is employed, there is no light blocking member on the light emitting surface side, and uniform light emission can be obtained.
  • the material of the bump is not particularly limited as long as it is conductive, but preferably contains at least one of the materials included in the positive and negative electrodes of the light emitting element and the plating material of the lead electrode. For example, Ag, Au, eutectic solder (Au—Sn), Pb—Sn, lead-free solder and the like can be mentioned.
  • Step 5 Filling with sealing resin>
  • a light-transmitting sealing resin 15 is filled in the concave portion 11a of the resin container 11 ((g) in FIG. 5).
  • the material of the sealing resin is as described above.
  • Sealing injection into the recess 11a uses a potting method using a dispenser, and the amount of resin is controlled so as to form a dent (lens) shape by surface tension in the molding of the injected resin.
  • the present invention is not limited to this, and another molding method may be a molding method using a mold such as injection (injection) or compression (compression).
  • the lens effect can be provided by making the light emission surface side of the sealing resin 15 have a desired shape.
  • the light emission surface side of the sealing resin 15 has a structure that is recessed from the upper surface of the resin container 11. Thereby, there exists an effect similar to a concave lens.
  • the light-emitting element 14 and the bonding wire 16 are covered by curing the filled sealing material.
  • the light emitting device 1 of this embodiment has a length that extends from the bottom surface 17 toward the top surface in a direction perpendicular to the bottom surface 17 of the resin container 11.
  • the protruding portion 12c which is the highest portion of the lead portion exposed to the outside of the resin container 11, is located higher than the upper surface of the resin container 11, and the protruding portion 12c and the resin container 11 are located.
  • the height difference from the upper surface of the metal plate coincides with the thickness of the metal plate constituting the lead portions 12a and 12b.
  • the light emitting device 1 is arranged on the surface of the printed wiring board 20 with the end portion of the lead portion including the protruding portion 12 c.
  • the end portion of the lead portion including the protruding portion 12 c is formed between the surface of the printed wiring board 20 and the light incident surface 41 of the light guide plate 40. Try to be sandwiched between them.
  • the light incident surface of the light guide plate 40 is formed on the protruding portions 12c of the lead portions 12a and 12b.
  • the gap between the light incident surface 41 of the light guide plate 40 and the upper surface of the resin container 11 is determined by the thickness of the metal plate constituting the lead portion. Can be unified. Therefore, the gap between the light emitting device 1 and the light guide plate 40 can be made uniform over the entire light emitting device arrangement surface (light incident surface 41) of the light guide plate 40.
  • the gap can be made relatively small.
  • reed parts 12a and 12b comprised by a metal plate and the protrusion part 12c has the high intensity
  • the gap does not change at the time of joining, or the gap is not changed due to wear or chipping caused by any load on the protrusion 12c due to some factor after joining. Can be maintained.
  • FIG. 6 is a plan view when the light emitting side of the light emitting device 1 ′ of the present embodiment is viewed.
  • FIG. 7 is a cross-sectional view taken along the arrow showing the light emitting device 1 ′ shown in FIG. 6 cut along the cutting line CC ′.
  • the difference between the light emitting device 1 ′ of the present embodiment and the light emitting device 1 of the first embodiment is in the structure of the lead portions 12a and 12b. Specifically, the shape of the end portion including the protruding portion 12c ′ of the lead portions 12a and 12b is different from the wiring structure of the lead portions 12a and 12b.
  • the second portion including the protruding portion 12c (FIGS. 3 and 4) is bent in the direction away from the resin container (outward) at the second bent portion.
  • each of the lead portions 12 a and 12 b has a first portion that protrudes in the light emitting direction from the upper surface of the resin container 11.
  • the portion (the portion including the protruding portion) is bent in a direction approaching the concave portion 11 a of the resin container 11. That is, in the present embodiment, the second portion including the protruding portion 12c ′ is bent so as to be inward.
  • the lead portions 12a and 12b have a first portion extending along the side wall of the resin container, and the resin container at a position where the first portion is adjacent to the upper surface of the resin container 11. 11 and a second portion extending in a direction approaching 11, the second portion extending in parallel with the upper surface of the resin container 11, and the projecting portion 12 c of the second portion of the resin container 11. It is comprised by the surface of the metal plate which comprises the lead part extended in parallel with respect to an upper surface.
  • the end including the protruding portion 12c ′ is disposed on the upper surface of the resin container 11 as shown in FIGS. Since the upper surface is a portion that does not emit light, the emitted light is not blocked even if a portion including the protruding portion 12c ′ is disposed on the upper surface.
  • the portion including the protruding portion 12c ′ disposed on the upper surface of the resin container 11 is a metal plate constituting the lead portion
  • the protruding portion 12c ′ is the same surface as the surface opposite to the surface exposed to the bottom surface 17 of the recess 11a in the lead portions 12a and 12b.
  • the light emitting device of the present embodiment is configured as a light emitting module as in the first embodiment, and a uniform gap is formed by joining the light incident surface 41 of the light guide plate 40 to the protruding portion 12c ′. be able to.
  • the lead portions 12a and 12b of the present embodiment are similar to the first embodiment in that the metal plating layer terminals exposed on the bottom surface 17 of the recess 11a of the resin container 11 and the conductive pattern of the light emitting element 14 are provided. Are electrically connected by a bonding wire 16.
  • the difference from the first embodiment is that a terminal 12d is formed on the side opposite to the surfaces of the lead portions 12a and 12b to which the bonding wires 16 are connected (FIG. 7).
  • the manufacturing process of the light emitting device 1 ′ of the present embodiment is different in that the terminal 12 d is formed on the lead portion in the process 1 described in the first embodiment. Other than that, the forming process of the above-described process 3 is different. Differences in step 3 will be described below.
  • the lead portions 12a and 12b have a first bent portion adjacent to the bottom surface of the resin container 11 and the side portion of the resin container 11.
  • a second bent portion is provided in an adjacent portion between the side portion of the resin container 11 and the upper surface of the resin container 11.
  • the lead portions 12a and 12b extending along the bottom surface of the resin container 11 are refracted so as to extend along the side portion of the resin container 11 (first portion).
  • the lead portions 12a and 12b extending along the side portion of the resin container 11 are refracted on the upper surface of the resin container 11 so as to extend along the upper surface (second portion).
  • Such a bent structure can be produced by using a mold shown in FIG. First, the said 2nd bending part is produced by arrange
  • FIG. 9 is a partial plan view of the light-emitting module 30 ′ of the present embodiment as viewed from the light emitting surface side.
  • FIG. 10 is a partial cross-sectional view of the light emitting module 30 ′ taken along the cutting line CC ′ shown in FIG. 9, and FIG. 10 also shows the cross section of the light guide plate 40 for convenience of explanation. Yes.
  • the light emitting module 30 ′ of the present embodiment has the above-described light emitting device of the present embodiment mounted on the surface of the printed wiring board 20.
  • the light emitting device 1 is mounted in the hole 20a provided in the printed wiring board 20, as shown in FIGS.
  • the terminal 12d (FIG. 7) provided on the surface opposite to the surface exposed to the bottom surface 17 of the lead portions 12a and 12b, which is a conductive metal material, is the surface of the printed wiring board 20.
  • the surface mount type (FIGS. 9 and 10) connected to the wiring formed in the wiring formation region 20b provided in FIG.
  • planar light source device of the present embodiment is configured by joining the protrusion 12c ′ of the light emitting device 1 ′ of the present embodiment described above and the light incident surface 41 of the light guide plate 40. Yes. Thereby, it becomes the structure by which the edge part containing protrusion part 12c 'was clamped between the upper surface of the resin container 11 of light-emitting device 1', and the light-incidence surface 41 of the light-guide plate 40.
  • the light emitting device 1 ′ of the present embodiment has a space between the upper surface of the resin container 11 of the light emitting device and the light incident surface 41 of the light guide plate 40.
  • the thickness of the metal plates constituting the lead portions 12a and 12b is unified. Therefore, the gap between the light emitting device and the light guide plate 40 can be made uniform over the entire light emitting device arrangement surface (light incident surface 41) of the light guide plate 40.
  • the gap may change at the time of bonding, or some factor after the bonding.
  • no load is applied to the protruding portion 12c ′ to cause wear or chipping, and the gap does not change, and the gap can be kept uniform over a long period of time.
  • FIG. 11 is a plan view of the light emitting side of the light emitting device 1 ′′ according to the present embodiment as viewed.
  • FIG. 12 is a cross-sectional view taken along the arrow line showing a state where the light emitting device 1 ′′ shown in FIG. 11 is cut along the cutting line CC ′.
  • the difference between the light emitting device 1 ′′ of the present embodiment and the light emitting device 1 of the first embodiment is in the structure of the lead portions 12a and 12b. Specifically, the shape of the end portion of the lead portions 12a and 12b including the protruding portion 12c '' of the portion exposed to the outside of the resin container 11 is different from the wiring structure of the lead portions 12a and 12b. These differences will be described in detail below.
  • the first portion extending along the side portion of the resin container 11 in the lead portions 12a and 12b has the second bent portion at the position protruding from the upper surface of the resin container 11, and faces outward. It is bent.
  • the second portions extending along the side portions of the resin container 11 in the lead portions 12 a and 12 b are in the light emitting direction. It extends straight and does not have the second bent portion, and a protruding portion 12c '' is provided at the end that extends straight.
  • the difference in height between the protruding portion 12c ′′ corresponding to the tip extending straight in the light emitting direction and the upper surface of the resin container 11 (the protruding length of the first portion from the upper surface of the resin container 11) is the lead portion 12a.
  • 12b is equal to the thickness of the metal plate.
  • the light emitting device of the present embodiment is configured as a light emitting module as in the first embodiment, and a uniform gap is formed by joining the light incident surface 41 of the light guide plate 40 to the protruding portion 12c ′′. can do.
  • the terminal 12d is formed on the side opposite to the surface of the lead portions 12a and 12b to which the bonding wires 16 are connected (FIG. 12). .
  • the manufacturing process of the light emitting device 1 ′′ of the present embodiment is different from the forming process of the above process 3. Differences in step 3 will be described below.
  • the lead portions 12a and 12b have a bent portion adjacent to the bottom surface of the resin container 11 and the side portion of the resin container 11. In the bent portion, the lead portions 12a and 12b extending along the bottom surface of the resin container 11 are refracted so as to extend along the side portion of the resin container 11 (first portion).
  • Such a bent structure can be formed using a mold 65 shown in FIG.
  • FIG. 14 is a partial plan view of the light-emitting module 30 ′′ of this embodiment as viewed from the light emitting surface side.
  • 15 is a partial cross-sectional view of the light emitting module 30 ′′ taken along the cutting line CC ′ shown in FIG. 14, and FIG. 15 also shows a cross section of the light guide plate 40 for convenience of explanation. ing.
  • the light emitting module 30 ′′ of the present embodiment has the above-described light emitting device of the present embodiment mounted on the surface of the printed wiring board 20.
  • the mounting method is the same as the method described in the second embodiment.
  • planar light source device The planar light source device of the present embodiment is configured by joining the protruding portion 12 c ′′ of the light emitting device 1 ′′ of the present embodiment described above and the light incident surface 41 of the light guide plate 40.
  • the height difference between the protruding portion 12c ′′ and the upper surface of the resin container 11 is equal to the thickness of the metal plate constituting the lead portions 12a and 12b. Therefore, the thickness between the upper surface of the resin container 11 of the light emitting device 1 ′′ and the light incident surface 41 of the light guide plate 40 is unified by the thickness of the metal plate constituting the lead portions 12 a and 12 b.
  • the light emitting device 1 ′ of the present embodiment has a space between the upper surface of the resin container 11 of the light emitting device and the light incident surface 41 of the light guide plate 40.
  • the thickness of the metal plates constituting the lead portions 12a and 12b is unified. Therefore, the gap between the light emitting device and the light guide plate 40 can be made uniform over the entire light emitting device arrangement surface (light incident surface 41) of the light guide plate 40.
  • a gap changes at the time of joining for the same reason as the above-mentioned Embodiment 1.
  • the gap can be maintained uniformly over a long period of time without causing a gap or a change in the gap due to wear or chipping caused by some factor after joining or due to some factor after joining.
  • the light emitting device is as described above.
  • a lead portion disposed with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion exposed outside the resin container;
  • a light emitting device comprising: a light emitting element electrically connected to the lead portion on the bottom surface of the recess;
  • the lead portion is a metal plate having a predetermined thickness,
  • the protruding portion protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end of the lead portion,
  • the protruding length of the protruding portion from the upper surface of the resin container is the same as the predetermined thickness.
  • the said protrusion part comprised from the said other end part of the said lead part protrudes from the said upper surface of the said resin container, and the protrusion length comprises the said lead part. It matches the thickness of the metal plate.
  • the light emitting device according to the present invention when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion.
  • the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
  • the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
  • the light-emitting device can provide a highly reliable light-emitting device that avoids variations in backlight performance by having the above-described configuration.
  • the light emitting device includes:
  • the other end of the lead portion includes a first portion extending along the side wall of the resin container, and a second portion in which the first portion is bent in a direction away from the resin container in the vicinity of the upper surface of the resin container. And has a part, It is preferable that the protrusion is formed on the second portion.
  • the protruding portion is provided at the second portion of the other end portion of the lead portion that is bent and extends in the direction away from the resin container in the vicinity of the upper surface of the resin container. Therefore, there is no possibility of blocking the light emitted from the upper surface of the resin container.
  • the other end of the lead portion includes a first portion extending along the side wall of the resin container, and the first portion is bent toward the upper surface in the vicinity of the upper surface of the resin container and is on the upper surface.
  • a second portion extending, The protrusion may be formed on the second portion.
  • the said protrusion part is provided in the 2nd part which bend
  • the protruding portion of the second portion disposed on the upper surface of the resin container and the vicinity thereof are structurally stable. Therefore, when the light emitting device according to the present invention is transported or disposed on a printed circuit board as described later, even if an external impact is applied to the protruding portion and the vicinity thereof, deformation is kept to a minimum. be able to.
  • the light emitting device includes:
  • the second portion of the lead portion is configured such that the surface of the metal plate extends in parallel with the upper surface of the resin container, It is preferable that the protrusion is constituted by the surface of the metal plate.
  • the lead portion can be easily formed by press molding by adopting a structure in which the protruding portion is constituted by the surface of the metal plate parallel to the upper surface of the resin container.
  • the other end of the lead portion has a first portion extending along the side wall of the resin container,
  • the projecting portion may include a projecting end in which a tip of the first portion projects from the upper surface of the resin container.
  • the lead portion can be easily molded by press molding.
  • the light emitting device includes: Filled with a sealing resin containing a light-transmitting resin that seals the light-emitting element in the recess,
  • the surface of the sealing resin is preferably recessed from the upper surface of the resin container.
  • the light emitting surface side of the sealing resin is recessed, so that light control such as a lens effect can be provided, and light emitted from the light emitting element chip can be focused.
  • the light emitting module according to the present invention is as described above.
  • the protruding portion configured from the other end of the lead portion protrudes from the upper surface of the resin container, and the protruding length is And the thickness of the metal plate constituting the lead portion.
  • the light emitting device according to the present invention when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion.
  • the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
  • the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
  • the light emitting module includes:
  • the light emitting device is The other end portion of the lead portion extends along the side wall of the resin container, and the first portion is bent toward the upper surface in the vicinity of the upper surface of the resin container and is on the upper surface.
  • a second portion extending, The protrusion is formed in the second portion;
  • the printed wiring board is provided with a hole for inserting the light emitting device, It is preferable that the light emitting device is inserted and disposed in the hole, and the second portion including the protruding portion of the lead portion is disposed on the printed wiring board.
  • the light emitting device since the light emitting device is inserted and disposed in the hole of the printed wiring board, the light emitting module can be thinned.
  • the light emitting module according to the present invention includes: On the opposite side of the printed wiring board from the side where the second part is disposed, a heat sink is provided, It is preferable that the heat dissipation plate is in contact with the opposite surface of the printed wiring board and the bottom of the light emitting device inserted and disposed in the hole.
  • the light emitting module according to the present invention is different from the above configuration,
  • the light emitting device is surface-mounted on the printed wiring board,
  • the structure which provided the heat sink on the opposite side to the mounting side of the said light-emitting device in the said printed wiring board may be sufficient.
  • the heat generated in the light emitting device can be efficiently radiated by the heat radiating plate.
  • the planar light source device is as described above.
  • a light emitting module configured as described above;
  • a light guide plate, The light emitting module is disposed such that the opening side of the concave portion of the light emitting device is opposed to the light incident surface of the light guide plate, and the protruding portion of the lead portion is in contact with the light incident surface of the light guide plate. It is characterized by that.
  • the present invention can be applied, for example, to a backlight of a liquid crystal display device, and also to flat illumination.

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Abstract

This light emitting device provided to a light emitting module or a planar light source device has a light emitting element (14) affixed to one of lead sections (12a, 12b) exposed at the bottom surface of the recess in a resin container. The lead sections (12a, 12b) extend outside the resin container (11) along the sides thereof toward the light emission side of the resin container and protrude further toward the light emission side than the upper surface of the resin container (11). The difference in height between the protrusions (12c) of the lead sections (12a, 12b) and the upper surface of the resin container (11) is equal to the thickness of a metallic plate which forms the lead sections (12a, 12b). The planar light source device is formed by joining the light incident surface (41) of a light guide body (40) to the protrusions (12c).

Description

発光装置、発光モジュール、面状光源装置Light emitting device, light emitting module, planar light source device
　本発明は、発光装置、発光モジュール、面状光源装置に関し、より詳細には、光を均一に出射することを可能にする発光装置、それを備えた発光モジュール、並びに、当該発光モジュールを備えた面状光源装置に関する。 The present invention relates to a light emitting device, a light emitting module, and a planar light source device, and more specifically, a light emitting device that can emit light uniformly, a light emitting module including the light emitting device, and the light emitting module. The present invention relates to a planar light source device.
　白色系の混色光を高輝度に発光可能な発光ダイオードを配列して構成される光源が種々の分野にて利用されている。発光ダイオードは、発光素子と、発光素子を外部環境から保護し、それらの電極と接続するリード電極を備えた支持体と、を備えて発光装置として提供されている。そして、このような発光ダイオードを備える発光装置が固定された透光性部材の光入射面から発光ダイオードの光を入射させ、透光性部材内を導光させた後、該透光性部材の光出射面側から光を取り出す構成が知られている。このような光源として例えば、液晶ディスプレイ用バックライト等が挙げられる。 A light source configured by arranging light emitting diodes capable of emitting white mixed color light with high luminance is used in various fields. A light-emitting diode is provided as a light-emitting device including a light-emitting element and a support body that includes a lead electrode that protects the light-emitting element from the external environment and is connected to the electrodes. And after making the light of a light emitting diode enter from the light-incidence surface of the translucent member with which the light-emitting device provided with such a light emitting diode was fixed, and guiding the inside of a translucent member, A configuration in which light is extracted from the light exit surface side is known. Examples of such a light source include a backlight for a liquid crystal display.
　バックライトの一例を、図１６に示す。図１６は、バックライトの部分平面図である。図１６のバックライト１００は、プリント基板１０２の片面に複数の光源パッケージ１０１が実装されている。各光源パッケージ１０１の光出射面１０１ａから出射した光は、光出射面１０１ａに対向配置されている導光板１０３の光入射面１０３ａから導光板１０３内を導光した後、導光板１０３の光出射面から出射する。図１６では、紙面手前方向に導光板１０３からの光が出射する。図１７は、上記光源パッケージ１０１の光出射面側を見た平面図であり、図１８は、図１７に示した切断線Ａ－Ａ´において光源パッケージ１０１を切断した状態を示した矢視断面図である。光源パッケージ１０１は、中央部分に配設された発光素子１０７を、反射面１０６を有したリフレクタ１０５によって囲んでいる。発光素子１０７と、支持体１１１に形成されたリード端子１０８とは、ボンディングワイヤー１０９を介して電気的に接続している。発光素子１０７とリフレクタ１０５との間には、透明樹脂からなる封止材１１０が設けられている。 An example of the backlight is shown in FIG. FIG. 16 is a partial plan view of the backlight. In the backlight 100 of FIG. 16, a plurality of light source packages 101 are mounted on one side of a printed circuit board 102. The light emitted from the light emitting surface 101a of each light source package 101 is guided through the light guide plate 103 from the light incident surface 103a of the light guide plate 103 disposed to face the light emitting surface 101a, and then emitted from the light guide plate 103. Emits from the surface. In FIG. 16, the light from the light guide plate 103 is emitted in the front direction of the paper. 17 is a plan view of the light source package 101 as viewed from the light emitting surface side, and FIG. 18 is a cross-sectional view showing the light source package 101 cut along the cutting line AA ′ shown in FIG. FIG. In the light source package 101, a light emitting element 107 disposed in a central portion is surrounded by a reflector 105 having a reflective surface 106. The light emitting element 107 and the lead terminal 108 formed on the support 111 are electrically connected via a bonding wire 109. A sealing material 110 made of a transparent resin is provided between the light emitting element 107 and the reflector 105.
　ここで、図１６に示す光源パッケージ１０１の光出射面１０１ａと、導光板１０３の光入射面１０３ａとの間のギャップ（空間）１０４は、バックライト性能を左右する重要なファクターであり、複数の光源パッケージの光出射面と、導光板の光入射面とが、小さく、且つ、均一なエアーギャップを維持して固定されていることが理想である。 Here, the gap (space) 104 between the light emitting surface 101a of the light source package 101 and the light incident surface 103a of the light guide plate 103 shown in FIG. 16 is an important factor that influences the backlight performance. Ideally, the light emitting surface of the light source package and the light incident surface of the light guide plate are small and fixed while maintaining a uniform air gap.
　ところが、図１６に示したバックライト１００の場合、熱収縮などによる部材の変形、プリント基板ならびに導光板の固定上の制約により、光源パッケージ１０１の光出射面１０１ａと、導光板１０３の光入射面１０３ａとの間のギャップを均一に維持することは困難である。均一なギャップが提供されないと、光源パッケージ１０１から導光板１０３に入る光量（入射光率）がばらつき、バックライト全体の明るさのばらつきや光利用効率の低下を招くことなる。 However, in the case of the backlight 100 shown in FIG. 16, the light emitting surface 101 a of the light source package 101 and the light incident surface of the light guide plate 103 due to deformation of members due to heat shrinkage, and restrictions on fixing the printed circuit board and the light guide plate. It is difficult to maintain a uniform gap with 103a. If a uniform gap is not provided, the amount of light entering the light guide plate 103 from the light source package 101 (incident light rate) varies, leading to variations in the brightness of the entire backlight and a decrease in light utilization efficiency.
　図１９は、特許文献１および２に開示されている発光装置２００を示す斜視図であり、図２０は、図１９に示す発光装置２００を、光出射方向に沿って切断した状態を示した断面図である。特許文献１の発光装置２００は、パッケージ２０１の主面側にパッケージ内壁面２０８により凹部が形成され、発光素子２０４を収納している。また、該凹部に隣接するパッケージ主面の側壁部に段差を有している。具体的には、凹部に隣接する第一の主面２０１ａと、該第一の主面２０１ａより一段低い第二の主面２０１ｂとを少なくとも有している。上記凹部の底面には、正のリード電極２０２の一端部と負のリード電極２０２の一端部とが互いに分離されてそれぞれの主面が露出するように設けられ、正のリード電極と負のリード電極の間には絶縁性の成型材料が充填されている。 FIG. 19 is a perspective view showing the light emitting device 200 disclosed in Patent Documents 1 and 2, and FIG. 20 is a cross section showing the light emitting device 200 shown in FIG. 19 cut along the light emitting direction. FIG. In the light-emitting device 200 of Patent Document 1, a recess is formed by a package inner wall surface 208 on the main surface side of the package 201, and the light-emitting element 204 is accommodated. Further, there is a step in the side wall portion of the package main surface adjacent to the recess. Specifically, it has at least a first main surface 201a adjacent to the recess and a second main surface 201b that is one step lower than the first main surface 201a. On the bottom surface of the concave portion, one end of the positive lead electrode 202 and one end of the negative lead electrode 202 are provided so as to be separated from each other and the main surfaces thereof are exposed. An insulating molding material is filled between the electrodes.
　この特許文献１のパッケージ２０１の構成によれば、突出した第一の主面２０１ａを導光板の光入射面との間のギャップ（空間）を維持するためのスペーサーとして機能させることができる。 According to the configuration of the package 201 of Patent Document 1, the protruding first main surface 201a can function as a spacer for maintaining a gap (space) between the light incident surface of the light guide plate.
日本国公開特許公報「特開２００６－１２８７１９号公報（２００６年５月１８日公開）」Japanese Patent Publication “Japanese Patent Laid-Open No. 2006-128719” (published on May 18, 2006) 日本国公開特許公報「特開２００７－１８０５９１号公報（２００７年７月１２日公開）」Japanese Patent Publication “Japanese Unexamined Patent Application Publication No. 2007-180591 (published July 12, 2007)”
　しかしながら、特許文献１の発光装置２００の場合、スペーサーとして機能する第一の主面２０１ａがパッケージ２０１から構成されている。すなわち、第一の主面２０１ａは、樹脂材料からなる。そのため、組み立て段階の初期に発光装置と導光板と接合した際に、第一の主面２０１ａが導光板に接触し、その衝撃で、第一の主面２０１ａが割れたり、欠けたりする虞がある。更には、熱収縮による応力や継続使用における導光板との接触による磨耗や欠けなどの不具合を生じる虞もある。スペーサーにこのような不具合が生じれば、所定のギャップを維持できなくなる。 However, in the case of the light-emitting device 200 of Patent Document 1, the first main surface 201 a that functions as a spacer is formed of the package 201. That is, the first main surface 201a is made of a resin material. Therefore, when the light emitting device and the light guide plate are joined in the initial stage of the assembly stage, the first main surface 201a may come into contact with the light guide plate, and the impact may cause the first main surface 201a to break or chip. is there. Furthermore, there is a possibility that problems such as stress due to heat shrinkage and wear or chipping due to contact with the light guide plate during continuous use may occur. If such a defect occurs in the spacer, the predetermined gap cannot be maintained.
　すなわち、従前のパッケージでは、発光装置と導光板との間のギャップを均一にすることができず、バックライト性能のばらつきを充分に回避することができていない。 That is, in the conventional package, the gap between the light emitting device and the light guide plate cannot be made uniform, and variations in backlight performance cannot be sufficiently avoided.
　本発明は、上記の問題点に鑑みなされたものであり、その目的は、発光装置と導光板との間のギャップを均一に維持して、バックライト性能のばらつきを回避した発光装置を提供することである。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device that maintains a uniform gap between the light-emitting device and the light guide plate and avoids variations in backlight performance. That is.
　すなわち、本発明に係る発光装置は、上記の課題を解決するために、
　底面と当該底面の周縁から立ち上がる壁面とを含む凹部が上面に設けられた樹脂容器と、
　一方の端部が上記樹脂容器の上記凹部の上記底面に露出した状態で配置され、他方の端部が当該樹脂容器の外部に露出している状態で配置されたリード部と、
　上記凹部の前記底面において上記リード部と電気的に接続される発光素子と、を備えた発光装置であって、
　上記リード部は、所定の厚さをもつ金属板であり、
　上記樹脂容器の上記上面よりも光出射方向に突出した突出部を、上記リード部の上記他方の端部によって構成しており、
　上記突出部における上記樹脂容器の上記上面からの突出長は、上記所定の厚さと一致していることを特徴としている。 That is, in order to solve the above problems, the light emitting device according to the present invention
A resin container in which a recess including a bottom surface and a wall surface rising from a peripheral edge of the bottom surface is provided on the top surface;
A lead portion disposed with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion exposed outside the resin container;
A light emitting device comprising: a light emitting element electrically connected to the lead portion on the bottom surface of the recess;
The lead portion is a metal plate having a predetermined thickness,
The protruding portion protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end of the lead portion,
The protruding length of the protruding portion from the upper surface of the resin container is the same as the predetermined thickness.
　上記の構成によれば、上記リード部の上記他方の端部から構成された上記突出部が、上記樹脂容器の上記上面よりも突出していて、且つ、その突出長は、上記リード部を構成する金属板の厚さと一致している。 According to said structure, the said protrusion part comprised from the said other end part of the said lead part protrudes from the said upper surface of the said resin container, and the protrusion length comprises the said lead part. It matches the thickness of the metal plate.
　そのため、本発明に係る発光装置を、導光板の光入射面に配置する際に、上記リード部の他方の端部に形成された上記突出部に、導光板の光入射面を接触させて配置することによって、上記突出部がスペーサーとして機能し、導光板の光入射面と、樹脂容器の上面との間を上記金属板の厚さに相当するギャップで統一することができる。 Therefore, when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion. By doing so, the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
　また、金属板で構成される上記リード部の上記突出部は、樹脂容器に比べて衝撃や摩擦に対する強度が高い。そのため、従来構成において懸念される、光入射面との接触による割れや欠けが生じることがない。また、上述したような熱収縮による応力や継続使用における導光板との接触による磨耗や欠けも生じることがない。そのため、上記ギャップを均一に維持することができる。 Also, the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
　したがって、本発明に係る発光装置は、上記の構成を具備することによって、バックライト性能のばらつきを回避した信頼性の高い発光装置を提供することができる。 Therefore, the light-emitting device according to the present invention can provide a highly reliable light-emitting device that avoids variations in backlight performance by having the above-described configuration.
　また、本発明に係る発光モジュールは、上記の課題を解決するために、
　プリント配線基板と、
　上記プリント配線基板に実装された上述した構成の発光装置とを備えていることを特徴としている。 Moreover, in order to solve the above-described problems, a light emitting module according to the present invention is provided.
A printed wiring board;
The light-emitting device having the above-described structure mounted on the printed wiring board is provided.
　本発明に係る発光モジュールに設けられた発光装置は、上記リード部の上記他方の端部から構成された上記突出部が、上記樹脂容器の上記上面よりも突出していて、且つ、その突出長は、上記リード部を構成する金属板の厚さと一致している。 In the light emitting device provided in the light emitting module according to the present invention, the protruding portion configured from the other end of the lead portion protrudes from the upper surface of the resin container, and the protruding length is And the thickness of the metal plate constituting the lead portion.
　そのため、本発明に係る発光装置を、導光板の光入射面に配置する際に、上記リード部の他方の端部に形成された上記突出部に、導光板の光入射面を接触させて配置することによって、上記突出部がスペーサーとして機能し、導光板の光入射面と、樹脂容器の上面との間を上記金属板の厚さに相当するギャップで統一することができる。 Therefore, when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion. By doing so, the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
　また、金属板で構成される上記リード部の上記突出部は、樹脂容器に比べて衝撃や摩擦に対する強度が高い。そのため、従来構成において懸念される、光入射面との接触による割れや欠けが生じることがない。また、上述したような熱収縮による応力や継続使用における導光板との接触による磨耗や欠けも生じることがない。そのため、上記ギャップを均一に維持することができる。 Also, the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
　したがって、本発明の構成によれば、バックライト性能のばらつきを回避した信頼性の高い発光モジュールを提供することができる。 Therefore, according to the configuration of the present invention, it is possible to provide a highly reliable light emitting module that avoids variations in backlight performance.
　また、本発明に係る面状光源装置は、上記の課題を解決するために、
　上述した構成の発光モジュールと、
　導光板とを備えており、
　上記発光モジュールは、上記発光装置の上記凹部の開口側を上記導光板の光入射面に対向させて、上記リード部の上記突出部を当該導光板の光入射面に接触させて配置されていることを特徴としている。 In addition, the planar light source device according to the present invention, in order to solve the above problems,
A light emitting module configured as described above;
A light guide plate,
The light emitting module is disposed such that the opening side of the concave portion of the light emitting device is opposed to the light incident surface of the light guide plate, and the protruding portion of the lead portion is in contact with the light incident surface of the light guide plate. It is characterized by that.
　本発明の他の目的、特徴、および優れた点は、以下に示す記載によって十分分かるであろう。また、本発明の利点は、添付図面を参照した次の説明で明白になるであろう。 Other objects, features, and superior points of the present invention will be fully understood from the following description. The advantages of the present invention will become apparent from the following description with reference to the accompanying drawings.
　本発明に係る発光装置は、以上のように、
　底面と当該底面の周縁から立ち上がる壁面とを含む凹部が上面に設けられた樹脂容器と、
　一方の端部が上記樹脂容器の上記凹部の上記底面に露出した状態で配置され、他方の端部が当該樹脂容器の外部に露出している状態で配置されたリード部と、
　上記凹部の前記底面において上記リード部と電気的に接続される発光素子と、を備えた発光装置であって、
　上記リード部は、所定の厚さをもつ金属板であり、
　上記樹脂容器の上記上面よりも光出射方向に突出した突出部を、上記リード部の上記他方の端部によって構成しており、
　上記突出部における上記樹脂容器の上記上面からの突出長は、上記所定の厚さと一致していることを特徴としている。 The light emitting device according to the present invention is as described above.
A resin container in which a recess including a bottom surface and a wall surface rising from a peripheral edge of the bottom surface is provided on the top surface;
A lead portion disposed with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion exposed outside the resin container;
A light emitting device comprising: a light emitting element electrically connected to the lead portion on the bottom surface of the recess;
The lead portion is a metal plate having a predetermined thickness,
The protruding portion protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end of the lead portion,
The protruding length of the protruding portion from the upper surface of the resin container is the same as the predetermined thickness.
　また、本発明に係る発光モジュールは、以上のように、
　プリント配線基板と、
　上記プリント配線基板に実装された上述した構成の発光装置とを備えていることを特徴としている。 The light emitting module according to the present invention is as described above.
A printed wiring board;
The light-emitting device having the above-described structure mounted on the printed wiring board is provided.
　また、本発明に係る面状光源装置は、以上のように、
　上述した構成の発光モジュールと、
　導光板とを備えており、
　上記発光モジュールは、上記発光装置の上記凹部の開口側を上記導光板の光入射面に対向させて、上記リード部の上記突出部を当該導光板の光入射面に接触させて配置されていることを特徴としている。 The planar light source device according to the present invention is as described above.
A light emitting module configured as described above;
A light guide plate,
The light emitting module is disposed such that the opening side of the concave portion of the light emitting device is opposed to the light incident surface of the light guide plate, and the protruding portion of the lead portion is in contact with the light incident surface of the light guide plate. It is characterized by that.
　これにより、導光板の光入射面と、樹脂容器の上面との間のギャップを均一に維持することができ、バックライト性能のばらつきを回避した信頼性の高い発光装置、発光モジュール、および面光源装置を提供することができる。 As a result, the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be maintained uniformly, and a highly reliable light emitting device, light emitting module, and surface light source that avoids variations in backlight performance An apparatus can be provided.
本発明に係る面状光源装置の一実施形態の構成を示す斜視図である。It is a perspective view which shows the structure of one Embodiment of the planar light source device which concerns on this invention. 本発明に係る発光モジュールの一実施形態の構成を示す部分平面図である。It is a fragmentary top view which shows the structure of one Embodiment of the light emitting module which concerns on this invention. 図２に示した発光モジュールを切断線Ｃ－Ｃ´において切断した状態を示す部分断面図である。FIG. 3 is a partial cross-sectional view showing a state where the light emitting module shown in FIG. 2 is cut along a cutting line CC ′. 本発明に係る発光装置の一実施形態の構成を示す断面図である。It is sectional drawing which shows the structure of one Embodiment of the light-emitting device which concerns on this invention. 図４に示した発光装置の製造過程の一部を示した図である。FIG. 5 is a diagram illustrating a part of a manufacturing process of the light emitting device illustrated in FIG. 4. 本発明に係る発光装置の別の実施形態の構成を示した平面図である。It is the top view which showed the structure of another embodiment of the light-emitting device based on this invention. 図６に示した発光装置を切断線Ｃ－Ｃ´において切断した状態を示す部分断面図である。FIG. 7 is a partial cross-sectional view showing a state where the light emitting device shown in FIG. 6 is cut along a cutting line CC ′. 図６に示した発光装置の製造過程の一部を示した図である。FIG. 7 is a diagram illustrating a part of a manufacturing process of the light emitting device illustrated in FIG. 6. 本発明に係る発光モジュールの別の実施形態の構成を示す部分平面図である。It is a fragmentary top view which shows the structure of another embodiment of the light emitting module which concerns on this invention. 図９に示した発光モジュールを切断線Ｃ－Ｃ´において切断した部分断面図である。FIG. 10 is a partial cross-sectional view of the light emitting module shown in FIG. 9 cut along a cutting line CC ′. 本発明に係る発光装置の別の実施形態の構成を示した平面図である。It is the top view which showed the structure of another embodiment of the light-emitting device based on this invention. 図１１に示した発光装置を切断線Ｃ－Ｃ´において切断した状態を示す部分断面図である。FIG. 12 is a partial cross-sectional view illustrating a state where the light emitting device illustrated in FIG. 11 is cut along a cutting line CC ′. 図１１に示した発光装置の製造過程の一部を示した図である。FIG. 12 is a diagram illustrating a part of a manufacturing process of the light emitting device illustrated in FIG. 11. 本発明に係る発光モジュールの別の実施形態の構成を示す部分平面図である。It is a fragmentary top view which shows the structure of another embodiment of the light emitting module which concerns on this invention. 図１４に示した発光モジュールを切断線Ｃ－Ｃ´において切断した部分断面図である。FIG. 15 is a partial cross-sectional view of the light emitting module shown in FIG. 14 cut along a cutting line CC ′. 従来技術を示す図である。It is a figure which shows a prior art. 従来技術を示す図である。It is a figure which shows a prior art. 従来技術を示す図である。It is a figure which shows a prior art. 従来技術を示す図である。It is a figure which shows a prior art. 従来技術を示す図である。It is a figure which shows a prior art.
　〔実施形態１〕
　本発明の一実施形態について説明する。本発明は、導光板に光を入射させる発光装置に構造的特徴を具備し、この発光装置が導光体の光入射面に沿って複数設けられた面状光源装置において、当該導光体と各発光装置との間のギャップを互いに等しく、また等しい状態を長期にわたって維持することできるという効果を奏することができる。 [Embodiment 1]
An embodiment of the present invention will be described. The present invention includes a structural feature of a light emitting device that allows light to enter a light guide plate, and a plurality of light emitting devices provided along a light incident surface of a light guide. The gap between the light emitting devices can be equal to each other, and the same state can be maintained for a long time.
　そこで、以下では、まず、上記面状光源装置の一実施形態の構成を説明した後、当該面状光源装置に具備される発光モジュールの構成を説明し、続いて、当該発光モジュールに具備される発光装置の構成、並びに発光装置の製造方法について説明する。 Therefore, in the following, first, the configuration of one embodiment of the planar light source device will be described, then the configuration of the light emitting module included in the planar light source device will be described, and then the light emitting module. A structure of the light emitting device and a method for manufacturing the light emitting device will be described.
　（１）　面状光源装置の構成
　本発明に係る面状光源装置の一実施形態について、図１から図５を参照して以下に説明する。 (1) Configuration of Planar Light Source Device One embodiment of a planar light source device according to the present invention will be described below with reference to FIGS. 1 to 5.
　本発明に係る面状光源装置は、液晶パネルを表示手段として具備する液晶表示装置のバックライト装置として適用することができる。そのほか、照明機器としても適用することができる。 The planar light source device according to the present invention can be applied as a backlight device of a liquid crystal display device including a liquid crystal panel as display means. In addition, it can be applied as a lighting device.
　図１は、本実施形態における面状光源装置の斜視図である。 FIG. 1 is a perspective view of a planar light source device according to this embodiment.
　本実施形態における面状光源装置５は、図１に示すように、発光モジュール３０と、導光板４０とを備えている。 The planar light source device 5 in this embodiment includes a light emitting module 30 and a light guide plate 40 as shown in FIG.
　上記導光板４０は、アクリル樹脂を材料とする透光性部材である。導光板４０は、発光モジュール３０に設けられた複数の発光装置からの光をそれぞれ個別に導光板内部に導入する光入射面４１を一側面に有し、導光板４０の内壁面における反射を利用して他の一側面に設けられた光出射面４２から面状に光を照射する。 The light guide plate 40 is a translucent member made of acrylic resin. The light guide plate 40 has a light incident surface 41 on one side for individually introducing light from a plurality of light emitting devices provided in the light emitting module 30 into the light guide plate, and uses reflection on the inner wall surface of the light guide plate 40. Then, light is emitted in a planar shape from the light emitting surface 42 provided on the other side surface.
　このような上記面状光源装置５を、上述したような液晶表示装置のバックライトとして用いる場合、導光板４０の光出射面４２側に、当該液晶パネルの光入射面を配置する。導光板４０の光出射面４２から出射した光が、電圧印加により光透過率が制御された当該液晶パネルに入射することによって、所望の画像を表示する。 When such a planar light source device 5 is used as a backlight of a liquid crystal display device as described above, the light incident surface of the liquid crystal panel is disposed on the light emitting surface 42 side of the light guide plate 40. Light emitted from the light exit surface 42 of the light guide plate 40 is incident on the liquid crystal panel whose light transmittance is controlled by voltage application, thereby displaying a desired image.
　なお、本実施形態では導光板４０が１枚の透明部材から構成されているが、本発明はこれに限定されるものではない。例えば、後述するように発光モジュールに複数設けられた発光装置１のそれぞれに対応するように導光板４０が複数に分割された導光部を合わせてなるものであってもよい。 In addition, in this embodiment, although the light-guide plate 40 is comprised from one transparent member, this invention is not limited to this. For example, as will be described later, the light guide plate 40 may be formed by combining a plurality of light guide portions into which the light guide plate 40 corresponds to each of the light emitting devices 1 provided in the light emitting module.
　また、導光板４０の光入射面４１には、発光装置からの光が導光板内へ広範囲に入射するようにプリズム形状（図示せず）を設けることもできる。 Also, the light incident surface 41 of the light guide plate 40 can be provided with a prism shape (not shown) so that light from the light emitting device is incident on the light guide plate in a wide range.
　上記発光モジュール３０は、図１に示すように、発光装置１と、プリント配線基板２０と、放熱板２１とを備えている。 The light emitting module 30 includes a light emitting device 1, a printed wiring board 20, and a heat radiating plate 21, as shown in FIG.
　以下に、上記発光モジュール３０について更に説明する。 Hereinafter, the light emitting module 30 will be further described.
　（２）　発光モジュールの構成
　図２は、本実施形態の発光モジュール３０を光出射面側からみた部分平面図である。また図３は、図２に示した切断線Ｃ－Ｃ´において発光モジュール３０を切断した部分断面図であり、なお、図３には、説明の便宜上、上記導光板４０の断面も示している。 (2) Configuration of Light-Emitting Module FIG. 2 is a partial plan view of the light-emitting module 30 of the present embodiment as viewed from the light emitting surface side. 3 is a partial cross-sectional view of the light emitting module 30 taken along the cutting line CC ′ shown in FIG. 2, and FIG. 3 also shows a cross section of the light guide plate 40 for convenience of explanation. .
　発光モジュール３０は、図３に示すように、導光板４０の光入射面４１に対向する位置にプリント配線基板２０を有している。 The light emitting module 30 has a printed wiring board 20 at a position facing the light incident surface 41 of the light guide plate 40 as shown in FIG.
　プリント配線基板２０における導光板４０の光入射面４１との対向面には、発光装置１に設けられたリードフレームからなるリード部と電気的に接続する端子を有した配線が形成された配線形成領域２０ｂ（図２）が形成されている。なお以下では、プリント配線基板２０における導光板４０の光入射面４１との対向面を、プリント配線基板２０の表面と記載することがある。 Wiring formation in which a wiring having a terminal electrically connected to a lead portion made of a lead frame provided in the light emitting device 1 is formed on a surface of the printed wiring board 20 facing the light incident surface 41 of the light guide plate 40. Region 20b (FIG. 2) is formed. Hereinafter, the surface of the printed wiring board 20 that faces the light incident surface 41 of the light guide plate 40 may be referred to as the surface of the printed wiring board 20.
　また、プリント配線基板２０には、導光板４０の光入射面４１、および放熱板２１に向けて開口した複数の孔２０ａが形成されている。すなわち、各孔２０ａは、プリント配線基板２０の表面から裏面に貫通する貫通孔である。 Further, the printed wiring board 20 is formed with a plurality of holes 20 a that open toward the light incident surface 41 of the light guide plate 40 and the heat radiating plate 21. That is, each hole 20 a is a through-hole penetrating from the front surface to the back surface of the printed wiring board 20.
　プリント配線基板２０の各孔２０ａには、発光装置１が、その光出射側を導光板４０の光入射面４１に向けて挿入配置されている。貫通孔である孔２０ａに挿入された発光装置１は、プリント配線基板２０の裏面側に露出している。 In each hole 20 a of the printed wiring board 20, the light emitting device 1 is inserted and arranged with the light emitting side facing the light incident surface 41 of the light guide plate 40. The light emitting device 1 inserted into the hole 20a which is a through hole is exposed on the back side of the printed wiring board 20.
　プリント配線基板２０は、従来周知の基板材料から構成することができる。プリント配線基板２０の大きさは特に限定されるものではないが、導光板４０の光入射面４１と実質的に同じ大きさの表面を有する基板も用いることにより、発光モジュール３０をコンパクトに構成することができる。 The printed wiring board 20 can be made of a conventionally known board material. Although the size of the printed wiring board 20 is not particularly limited, the light emitting module 30 is configured to be compact by using a board having a surface substantially the same size as the light incident surface 41 of the light guide plate 40. be able to.
　上記放熱板２１は、プリント配線基板２０の裏面に配設された熱伝導性を有する板である。放熱板２１は、プリント配線基板２０の裏面に接触するほか、当該裏面側に露出した発光装置１の底部とも接触している。発光装置１の底部と接触することによって、発光装置１に生じる熱を直接放熱することができ、放熱効果を高めることができる。 The heat dissipation plate 21 is a thermally conductive plate disposed on the back surface of the printed wiring board 20. In addition to contacting the back surface of the printed wiring board 20, the heat sink 21 is also in contact with the bottom of the light emitting device 1 exposed on the back surface side. By making contact with the bottom of the light emitting device 1, heat generated in the light emitting device 1 can be directly radiated, and the heat radiating effect can be enhanced.
　また、放熱板２１におけるプリント配線基板２０との対向面とは反対側の面は、図３に示すように、襞構造となっている。これにより、表面積を増やして、効率的に放熱することを可能にしている。 Further, the surface of the heat radiating plate 21 opposite to the surface facing the printed wiring board 20 has a saddle structure as shown in FIG. As a result, the surface area can be increased to efficiently dissipate heat.
　なお、図１では、５個の発光装置１が配設されている発光モジュール３０を示しているが、本発明はその数に限定されるものではない。 In addition, in FIG. 1, although the light emitting module 30 by which the five light-emitting devices 1 are arrange | positioned is shown, this invention is not limited to the number.
　発光装置１は、詳細は後述するが、発光素子を内部に具備した樹脂容器１１と、樹脂容器１１と一体化したリードフレームからなるアノード用リード部１２ａ（リード部）およびカソード用リード部１２ｂ（リード部）とを備えている。樹脂容器１１には凹部が形成されており、当該凹部が導光板４０の光入射面４１に向けて開口するように発光装置１はプリント配線基板２０の各孔２０ａに配設されている。 As will be described in detail later, the light emitting device 1 includes a resin container 11 having a light emitting element therein, an anode lead part 12a (lead part) and a cathode lead part 12b (lead part) formed of a lead frame integrated with the resin container 11. Lead portion). A recess is formed in the resin container 11, and the light emitting device 1 is disposed in each hole 20 a of the printed wiring board 20 so that the recess opens toward the light incident surface 41 of the light guide plate 40.
　発光装置１のアノード用リード部１２ａおよびカソード用リード部１２ｂは、図３に示すように、樹脂容器１１の開口している側とは反対側にあたる底部において樹脂容器内に挿入されていて、当該挿入部分の端部において樹脂容器１１の側部側に露出しており、当該側部に沿って樹脂容器の開口側に延びている。なお、樹脂容器１１の側部とは、プリント配線基板２０の孔２０ａの壁面と対向している部分のことをさす。アノード用リード部１２ａとカソード用リード部１２ｂとは、当該側部に沿って延びている部分が図３に示すように樹脂容器１１を挟んで対向する位置に配設されている。 As shown in FIG. 3, the anode lead portion 12a and the cathode lead portion 12b of the light-emitting device 1 are inserted into the resin container at the bottom, which is opposite to the opening side of the resin container 11, The end of the insertion portion is exposed to the side of the resin container 11 and extends to the opening side of the resin container along the side. In addition, the side part of the resin container 11 refers to a part facing the wall surface of the hole 20a of the printed wiring board 20. The anode lead portion 12a and the cathode lead portion 12b are arranged at positions where the portions extending along the side portions face each other with the resin container 11 interposed therebetween as shown in FIG.
　なお、以下の説明では、アノード用およびカソード用を区別せず、単にリード部１２ａ，１２ｂと記載することがある。 In the following description, the lead portions 12a and 12b may be simply described without distinguishing between the anode portion and the cathode portion.
　本発明は、リード部１２ａ，１２ｂの構造に特徴がある。具体的には、リード部１２ａ，１２ｂはそれぞれ、所定の厚さをもつ金属板であり、一方の端部が上記樹脂容器の上記凹部の上記底面に露出した状態で配置され、他方の端部が当該樹脂容器の外部に露出している状態で配置されており、樹脂容器の上面よりも光出射方向に突出した突出部１２ｃを、リード部の上記他方の端部によって構成しており、突出部１２ｃにおける上記樹脂容器の上記上面からの突出長は、上記所定の厚さと一致している点にある。 The present invention is characterized by the structure of the lead portions 12a and 12b. Specifically, each of the lead portions 12a and 12b is a metal plate having a predetermined thickness, and is arranged with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion. Is disposed in a state of being exposed to the outside of the resin container, and the protruding portion 12c protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end portion of the lead portion. The protruding length of the resin container from the upper surface of the part 12c is that it matches the predetermined thickness.
　換言すれば、突出部１２ｃは、樹脂容器１１の底面から上面に向けて当該底面に対して垂直方向に延びる長さを高さとした場合に、樹脂容器１１の側部に沿って光出射方向と平行な方向に延びたリード部１２ａ，１２ｂにおける最も高い部分である頂上部であり、樹脂容器１１の上面よりも高い位置にあって、突出部１２ｃと樹脂容器１１の上面との高低差が、リード部の厚さと一致している。 In other words, the protruding portion 12c has a light emitting direction along the side portion of the resin container 11 when the length extending in the direction perpendicular to the bottom surface from the bottom surface to the top surface of the resin container 11 is height. The top portion of the lead portions 12a and 12b extending in the parallel direction is the top, which is higher than the upper surface of the resin container 11, and the height difference between the protruding portion 12c and the upper surface of the resin container 11 is It matches the thickness of the lead part.
　特に本実施形態では、リード部１２ａ，１２ｂが、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器１１の上面に隣接した位置において上記樹脂容器１１から離れる方向に折れ曲がって延びる第２部分とを有しており、当該第２部分は樹脂容器１１の上面と平行に延びており、突出部１２ｃは、当該第２部分の、樹脂容器１１の上面に対して平行に延びるリード部を構成する金属板の表面によって構成されている。 In particular, in the present embodiment, the lead portions 12a and 12b have a first portion extending along the side wall of the resin container, and a direction in which the first portion is separated from the resin container 11 at a position adjacent to the upper surface of the resin container 11. The second portion extends in parallel with the upper surface of the resin container 11, and the protruding portion 12 c is formed with respect to the upper surface of the resin container 11 of the second portion. It is comprised by the surface of the metal plate which comprises the lead part extended in parallel.
　以上のような発光モジュール３０を、図１に示すように、導光板４０に配設する際には、突出部１２ｃの上面と導光板４０の光入射面４１とを密着状態にて固定する。接合方法としては、シャーシ固定などの機械的な固定方法を用いる。 When the light emitting module 30 as described above is disposed on the light guide plate 40 as shown in FIG. 1, the upper surface of the protruding portion 12 c and the light incident surface 41 of the light guide plate 40 are fixed in close contact. As a joining method, a mechanical fixing method such as chassis fixing is used.
　密着後は、突出部１２ｃの金属メッキ層の端子と、プリント配線基板２０の配線形成領域２０ｂ（図２）の配線とを電気的に接続する。接続方法は、ボンディングワイヤー方式によるものであってもよいし、フリップチップ方式を用いることができる。 After the close contact, the terminal of the metal plating layer of the protruding portion 12c and the wiring in the wiring forming region 20b (FIG. 2) of the printed wiring board 20 are electrically connected. The connection method may be a bonding wire method or a flip chip method.
　ここで、本実施形態の発光モジュール３０では、プリント配線基板２０の表面と、樹脂容器１１の上面とは面一に構成している。したがって、本実施形態の発光モジュール３０の場合は、図３に示すように、樹脂容器１１の上面と、導光板４０の光入射面４１との間に形成されているエアーギャップ７０が、リード部１２ａ，１２ｂを構成する金属板の厚さと等しくなる。 Here, in the light emitting module 30 of the present embodiment, the surface of the printed wiring board 20 and the upper surface of the resin container 11 are flush with each other. Therefore, in the case of the light emitting module 30 of the present embodiment, as shown in FIG. 3, the air gap 70 formed between the upper surface of the resin container 11 and the light incident surface 41 of the light guide plate 40 has a lead portion. It becomes equal to the thickness of the metal plate which comprises 12a, 12b.
　以下、発光装置１の構成について、更に詳述する。 Hereinafter, the configuration of the light emitting device 1 will be described in more detail.
　（３）　発光装置
　（発光装置の構成）
　本発明に係る発光装置の一実施形態について、図４を参照して以下に説明する。 (3) Light emitting device (Configuration of light emitting device)
An embodiment of a light emitting device according to the present invention will be described below with reference to FIG.
　図４は、図３に示した発光モジュール３０の発光装置１のみを示した断面図である。 FIG. 4 is a cross-sectional view showing only the light emitting device 1 of the light emitting module 30 shown in FIG.
　本実施形態における発光装置は、上述したように導光板と組み合わせてなる光源モジュールとして液晶パネルを備える表示装置のバックライトの光源として用いるのに適しているが、これに限定されるものではなく、光源を具備するあらゆる機器に用いることができる。以下、本実施形態の発光装置１について詳述する。 The light emitting device in the present embodiment is suitable for use as a light source of a backlight of a display device including a liquid crystal panel as a light source module combined with a light guide plate as described above, but is not limited thereto. It can be used for any device equipped with a light source. Hereinafter, the light emitting device 1 of the present embodiment will be described in detail.
　本実施形態における発光装置１は、図４に示すように、上面に凹部１１ａが設けられた樹脂容器１１と、樹脂容器１１と一体化したリードフレームからなる上記アノード用リード部１２ａおよび上記カソード用リード部１２ｂと、凹部１１ａの底面１７に取り付けられた発光素子１４と、凹部１１ａを覆うように設けられた封止樹脂１５とを備えている。 As shown in FIG. 4, the light emitting device 1 according to the present embodiment includes a resin container 11 provided with a recess 11 a on the upper surface, the anode lead portion 12 a formed of a lead frame integrated with the resin container 11, and the cathode. The lead part 12b, the light emitting element 14 attached to the bottom face 17 of the recessed part 11a, and the sealing resin 15 provided so that the recessed part 11a may be covered are provided.
　＜樹脂容器＞
　樹脂容器１１は、リード部１２ａ，１２ｂに、白色顔料が含有された熱可塑性樹脂（以下の説明では白色樹脂と呼ぶ）を射出成型することによって形成されている。 <Resin container>
The resin container 11 is formed by injection-molding a thermoplastic resin (referred to as a white resin in the following description) containing a white pigment in the lead portions 12a and 12b.
　この樹脂容器１１を構成する白色樹脂は、可視光の光反射率が８５％以上となるように白色顔料の含有率、粒径等が調整されている。言い換えると、樹脂容器１１の可視光の光吸収率が１５％未満とされている。白色顔料としては、酸化チタンが挙げられる。 The white resin constituting the resin container 11 has the white pigment content, particle size, and the like adjusted so that the visible light reflectance is 85% or more. In other words, the visible light absorptance of the resin container 11 is less than 15%. Examples of the white pigment include titanium oxide.
　また、製造工程でハンダリフローなどの温度がかかる工程が複数あるので、白色樹脂は、耐熱性も十分考慮された材質が選定されている。基材となる樹脂としてはＰＰＡ（ポリフタルアミド：ｐｏｌｙｐｈｔｈａｌａｍｉｄｅ）が最も一般的であるが、液晶ポリマー、エポキシ樹脂、ポリスチレンなどでもよい。ポリフタルアミド樹脂のように高融点結晶が含有されてなる半結晶性ポリマー樹脂を用いると、表面エネルギーが大きく、開口内部に設けることができる封止樹脂や後付することができる導光板等との密着性が良好なパッケージが得られる。 In addition, since there are a plurality of processes in which a temperature such as solder reflow is applied in the manufacturing process, a material that sufficiently considers heat resistance is selected for the white resin. PPA (polyphthalamide) is most commonly used as the base resin, but may be a liquid crystal polymer, an epoxy resin, polystyrene, or the like. When a semi-crystalline polymer resin containing a high melting point crystal such as a polyphthalamide resin is used, the surface energy is large, and a sealing resin that can be provided inside the opening, a light guide plate that can be attached later, etc. A package with good adhesion can be obtained.
　樹脂容器１１に設けられる凹部１１ａは、長方形状を有する底面１７と、底面１７の周縁から樹脂容器１１の上部側に向けて拡開するように立ち上がる壁面１８とを備えている。 The recess 11 a provided in the resin container 11 includes a bottom surface 17 having a rectangular shape and a wall surface 18 that rises from the periphery of the bottom surface 17 toward the upper side of the resin container 11.
　＜リード部＞
　ここで、底面１７は、凹部１１ａに露出するリード部１２ａ，１２ｂと、リード部１２ａ，１２ｂ同士の間の隙間に露出する樹脂容器１１の白色樹脂とによって構成されている。一方、壁面１８は、樹脂容器１１を構成する白色樹脂によって構成されている。なお、底面１７の形状については、長方形に限らず、円形、矩形、楕円形、多角形のいずれでもよい。また、壁面８０の形状も、長方形に限らず、円形、矩形、楕円形、多角形のいずれでもよく、また、底面形状と同一でもよく、異なっていてもよい。 <Lead part>
Here, the bottom surface 17 is constituted by the lead portions 12a and 12b exposed to the concave portion 11a and the white resin of the resin container 11 exposed in the gap between the lead portions 12a and 12b. On the other hand, the wall surface 18 is made of a white resin constituting the resin container 11. In addition, about the shape of the bottom face 17, not only a rectangle but circular, a rectangle, an ellipse, and a polygon may be sufficient. The shape of the wall surface 80 is not limited to a rectangle, and may be any of a circle, a rectangle, an ellipse, and a polygon, and may be the same as or different from the bottom shape.
　リード部１２ａ，１２ｂは、それぞれの一部が樹脂容器１１内に挟まれて保持されるとともに、他の部分が樹脂容器１１の外部に露出されており、発光素子１４に電流を印加するための端子となっている。 Each of the lead portions 12a and 12b is held while being sandwiched in the resin container 11, and the other portion is exposed to the outside of the resin container 11, and is used for applying a current to the light emitting element 14. It is a terminal.
　また、リード部１２ａ，１２ｂ、すなわちリードフレームは、厚さ０．１～０．５ｍｍの範囲で金属板全体に均一な厚さで構成されており、表面に金属メッキが施されることによって電極層が形成されたものを用いる。すなわち、凹部１１ａの底面１７には、リード部１２ａ，１２ｂの金属メッキ層（電極層）が露出していることになる。 Further, the lead portions 12a and 12b, that is, the lead frame are configured to have a uniform thickness over the entire metal plate in a thickness range of 0.1 to 0.5 mm, and the surface is plated with metal to form electrodes. A layer in which a layer is formed is used. That is, the metal plating layers (electrode layers) of the lead portions 12a and 12b are exposed on the bottom surface 17 of the recess 11a.
　本実施形態では、このリード部１２ａ，１２ｂにおける樹脂容器１１の外部に露出されている部分（上記他方の端部）が、上述したように、樹脂容器１１の側壁に沿って延びる第１部分と、当該第１部分が樹脂容器１１の上面に隣接した位置において樹脂容器１１から離れる方向に折れ曲がって延びる第２部分とを有しており、突出部１２ｃが当該第２部分に形成されている。 In the present embodiment, the portion exposed to the outside of the resin container 11 in the lead portions 12a and 12b (the other end portion) is a first portion extending along the side wall of the resin container 11 as described above. The first portion has a second portion that bends and extends in a direction away from the resin container 11 at a position adjacent to the upper surface of the resin container 11, and a protruding portion 12c is formed in the second portion.
　すなわち、リード部１２ａ，１２ｂはそれぞれ、長尺金属板であり、凹部１１ａの底面１７において露出している一端から、樹脂容器１１との対向領域を超えて樹脂容器１１の外部に露出したところで光出射側に屈曲して樹脂容器１１の側壁に沿って光出射側に延びた第１部分を有し、更に、樹脂容器１１の上面よりも光出射側に突出したところで他端を樹脂容器１１から離れる方向に屈曲して樹脂容器１１から離れる方向に延びる第２部分を有している。樹脂容器１１から離れる方向に屈曲して延びた部分の上面が、突出部１２ｃである。当該上面は、凹部１１ａの底面１７において露出して発光素子１４が実装されている面と同じ面である。一方、当該面とは反対側の面、すなわち、図３に示したプリント配線基板２０の表面と対向する面は、当該発光素子１４が実装されている面の裏面と同じ面である。 That is, each of the lead portions 12a and 12b is a long metal plate, and light is emitted when it is exposed to the outside of the resin container 11 from one end exposed at the bottom surface 17 of the recess 11a beyond the region facing the resin container 11. It has a first portion that is bent toward the emission side and extends to the light emission side along the side wall of the resin container 11, and the other end is protruded from the resin container 11 when protruding from the upper surface of the resin container 11 to the light emission side. The second portion is bent in the direction away from the resin container 11 and extends in the direction away from the resin container 11. The upper surface of the portion bent and extended in the direction away from the resin container 11 is the protrusion 12c. The upper surface is the same surface as the surface on which the light emitting element 14 is mounted exposed at the bottom surface 17 of the recess 11a. On the other hand, the surface opposite to the surface, that is, the surface facing the surface of the printed wiring board 20 shown in FIG. 3 is the same surface as the back surface of the surface on which the light emitting element 14 is mounted.
　また、樹脂容器１１の上面と、樹脂容器１１から離れる方向に屈曲した他端の上面との高低差は、リード部の厚さ（金属板の厚さ）と等しくなるように構成されている。 Further, the height difference between the upper surface of the resin container 11 and the upper surface of the other end bent in the direction away from the resin container 11 is configured to be equal to the thickness of the lead portion (thickness of the metal plate).
　＜発光素子＞
　発光素子１４は、凹部１１ａの底面１７に露出するアノード用リード部１２ａの上にダイボンド剤で接着され、固定されている。 <Light emitting element>
The light emitting element 14 is bonded and fixed to the anode lead portion 12a exposed on the bottom surface 17 of the recess 11a with a die bond agent.
　発光素子１４には、発光に際して電圧を印加するための導電性パターンが設けられている。本実施形態では、導電性パターンは、発光素子１４の光出射面側に設けられており、上述したリード部１２ａ，１２ｂの金属メッキ層（電極層）と、ボンディングワイヤー１６を介して電気的に接続している。 The light emitting element 14 is provided with a conductive pattern for applying a voltage during light emission. In the present embodiment, the conductive pattern is provided on the light emitting surface side of the light emitting element 14, and is electrically connected to the above-described metal plating layers (electrode layers) of the lead portions 12 a and 12 b and the bonding wires 16. Connected.
　本実施形態において使用される発光素子１４としては、ＬＥＤチップがあり、従来周知のＬＥＤチップを用いることができる。ＬＥＤチップを用いることによって、低消費電力、低発熱量、長寿命というメリットがある。 As the light emitting element 14 used in this embodiment, there is an LED chip, and a conventionally known LED chip can be used. By using the LED chip, there are merits such as low power consumption, low calorific value, and long life.
　また、発光素子１４は、凹部１１ａの底面１７の大きさに合わせて複数用いてもよいし、凹部１１ａの底面１７の形状に合わせて種々の形状とすることができる。 Further, a plurality of the light emitting elements 14 may be used according to the size of the bottom surface 17 of the recess 11a, and various shapes can be formed according to the shape of the bottom surface 17 of the recess 11a.
　＜封止樹脂＞
　封止樹脂１５は、凹部１１ａ内の発光素子１４を被覆するように充填される透光性樹脂である。 <Sealing resin>
The sealing resin 15 is a translucent resin that is filled so as to cover the light emitting element 14 in the recess 11a.
　封止樹脂１５の材料は、透光性であれば特に限定されず、シリコン樹脂、エポキシ樹脂、ユリア樹脂、フッ素樹脂、および、それらの樹脂を少なくとも一種以上含むハイブリッド樹脂等、耐候性に優れた透光性樹脂を用いることができる。また、封止樹脂材料は有機物に限られず、ガラス、シリカゲルなどの耐光性に優れた無機物を用いることもできる。 The material of the sealing resin 15 is not particularly limited as long as it is translucent. Silicone resin, epoxy resin, urea resin, fluororesin, and hybrid resin including at least one or more of those resins are excellent in weather resistance. A translucent resin can be used. Further, the sealing resin material is not limited to an organic material, and an inorganic material having excellent light resistance such as glass and silica gel can also be used.
　また封止樹脂１５には、粘度増量剤、光拡散剤、顔料、蛍光物質等、使用用途に応じてあらゆる部材を添加することができる。光拡散剤として例えば、チタン酸バリウム、酸化チタン、酸化アルミニウム、酸化珪素、二酸化珪素、重質炭酸カルシウム、軽質炭酸カルシウム、および、それらを少なくとも一種以上含む混合物等を挙げることができる。 Further, any member such as a viscosity extender, a light diffusing agent, a pigment, and a fluorescent substance can be added to the sealing resin 15 depending on the intended use. Examples of the light diffusing agent include barium titanate, titanium oxide, aluminum oxide, silicon oxide, silicon dioxide, heavy calcium carbonate, light calcium carbonate, and a mixture containing at least one of them.
　更にまた、封止樹脂の光出射面側を所望の形状にすることによってレンズ効果を持たせることができ、発光素子チップからの発光を集束させたりすることができる。 Furthermore, the lens effect can be given by making the light emission surface side of the sealing resin into a desired shape, and the light emission from the light emitting element chip can be focused.
　（発光装置の形成方法）
　次に、本実施形態の発光装置の製造工程について、図５を用いて説明する。図５は、発光装置の製造過程を断面図で示した製造工程のフロー図である。 (Method for forming light emitting device)
Next, the manufacturing process of the light-emitting device of this embodiment is demonstrated using FIG. FIG. 5 is a flowchart of the manufacturing process showing the manufacturing process of the light emitting device in a cross-sectional view.
　＜工程１：成形用型へのリード部の配置＞
　本実施形態の発光装置の第一工程は、図５中の（ａ）に示すように、成形用型６０にリード部を配置することである。 <Step 1: Arrangement of lead portion on molding die>
The first step of the light emitting device of the present embodiment is to arrange the lead portion on the molding die 60 as shown in FIG.
　ここで、成形用型に配置されるリード部１２ａ，１２ｂの形成方法について説明する。まず、アノード用とカソード用の一対のリード部は、金属板に対し打ち抜き加工（プレス加工）を施して形成され、表面に金属メッキが施されて完成する。リード部の材料は、導電性であれば特に限定されないが、発光素子と電気的に接続する部材であるボンディングワイヤーとの接着性および電気伝導性が良いことが求められる。具体的な電気抵抗としては、３００μΩ－ｃｍ以下が好ましく、より好ましくは３μΩ－ｃｍ以下である。これらの条件を満たす材料としては、鉄、銅、鉄入り銅、錫入り銅および銅、金、銀をメッキしたアルミニウム、鉄、銅等が好適に挙げられる。 Here, a method of forming the lead portions 12a and 12b arranged in the molding die will be described. First, the pair of lead portions for the anode and the cathode are formed by stamping (pressing) the metal plate, and the surface is finished by metal plating. The material of the lead portion is not particularly limited as long as it is conductive, but it is required that the adhesive property and electrical conductivity with a bonding wire which is a member electrically connected to the light emitting element are good. The specific electric resistance is preferably 300 μΩ-cm or less, more preferably 3 μΩ-cm or less. Suitable materials satisfying these conditions include iron, copper, iron-containing copper, tin-containing copper and copper, gold, silver plated aluminum, iron, copper and the like.
　プレス加工後の長尺金属板（リード部）の各パッケージに対応する部分において、アノード用リード部１２ａは、成形後の凹部１１ａの底面１７においてその一端面がカソード用リード部１２ｂの一端面と対向するようにカソード用リード部１２ｂとは離間されている。本実施形態では、端部主面が凹部１１ａの底面１７で露出されるリード部に特別な加工を施していないが、凹部１１ａの長手方向を軸とし左右に貫通孔を少なくとも１対設けるなどして成形樹脂との結合強度を強めることも可能である。 In a portion corresponding to each package of the long metal plate (lead portion) after the press working, the anode lead portion 12a has one end surface of the bottom surface 17 of the concave portion 11a after molding and one end surface of the cathode lead portion 12b. It is separated from the cathode lead portion 12b so as to face each other. In the present embodiment, no special processing is applied to the lead portion whose end principal surface is exposed at the bottom surface 17 of the concave portion 11a. However, at least one pair of through holes is provided on the left and right sides with the longitudinal direction of the concave portion 11a as an axis. It is also possible to increase the bond strength with the molding resin.
　＜工程２：樹脂容器の形成＞
　上記工程１で形成した長尺金属板（リード部）を、成形用型の間に配置させてこれらの型を閉じる（図５中の（ｂ））。このとき、リード部１２ａ，１２ｂの一方の端部が成形用型の内部に形成される空洞部内に配置されるようにする。 <Step 2: Formation of resin container>
The long metal plate (lead part) formed in the above step 1 is placed between the molding dies, and these dies are closed ((b) in FIG. 5). At this time, one end of each of the lead portions 12a and 12b is arranged in a hollow portion formed inside the molding die.
　次に、成形用型に設けられたゲート（図示せず）より空洞部内へ成形材料を注入し、リード部１２ａ，１２ｂの端部を被覆する。上記空洞部は、樹脂容器の外形に対応している。 Next, a molding material is injected into the cavity from a gate (not shown) provided in the molding die to cover the ends of the lead portions 12a and 12b. The hollow portion corresponds to the outer shape of the resin container.
　続いて、形成された成形部材を型から取り外す（図５中の（ｃ））。取り出す際には、成形用型内部にピンを設けておき、樹脂容器へ向かって当該ピンを突き出すことによって取り出すことができる。 Subsequently, the formed molded member is removed from the mold ((c) in FIG. 5). When taking out, it can take out by providing a pin inside the shaping | molding die and protruding the said pin toward a resin container.
　なお、リード部１２ａ，１２ｂの裏面（発光素子を実装した側とは反対側の面）は、樹脂容器は形成されず当該裏面が露出していてもよく、裏面側にも樹脂が形成されていてもよい。 In addition, the resin container is not formed on the back surface (the surface opposite to the side where the light emitting element is mounted) of the lead portions 12a and 12b, the back surface may be exposed, and the resin is also formed on the back surface side. May be.
　＜工程３：リード部のフォーミング＞
　続いて、上記工程２によって成形用型から取り外された成形部材（リード部と樹脂容器とが一体化された構造）を用いて、リード部１２ａ，１２ｂの、樹脂容器１１の側面から樹脂容器外部に露出した部分のフォーミングを行なう（図５中の（ｄ））。 <Process 3: Lead Forming>
Subsequently, using the molding member (the structure in which the lead portion and the resin container are integrated) removed from the molding die in the above step 2, the lead portions 12a and 12b are exposed from the side surface of the resin container 11 to the outside of the resin container. Forming is performed on the exposed portion ((d) in FIG. 5).
　本実施形態では、上述したように、リード部１２ａ，１２ｂは折れ曲がった構造を有している。具体的には、樹脂容器１１の底面と樹脂容器１１の側部との隣接部分に第１の屈曲部があり、樹脂容器１１の側部と樹脂容器１１の上面との隣接部分に第２の屈曲部がある。第１の屈曲部では、樹脂容器１１の底面に沿って延びているリード部１２ａ，１２ｂが樹脂容器１１の側部に沿って延びる（第１部分）ように屈折している。第２の屈曲部では、樹脂容器１１の側部に沿って延びているリード部１２ａ，１２ｂが樹脂容器１１の凹部から離れる方向に沿って（第２部分）、離れる方向に沿って延びる部分の下面が樹脂容器１１の上面と同じ高さになるようにして屈折している。ここで、高さとは、樹脂容器１１の底面から上面に向けて当該底面に対して垂直方向に延びる長さをいう。 In this embodiment, as described above, the lead portions 12a and 12b have a bent structure. Specifically, there is a first bent portion at an adjacent portion between the bottom surface of the resin container 11 and the side portion of the resin container 11, and a second portion at an adjacent portion between the side portion of the resin container 11 and the upper surface of the resin container 11. There is a bend. In the first bent portion, the lead portions 12a and 12b extending along the bottom surface of the resin container 11 are refracted so as to extend along the side portion of the resin container 11 (first portion). In the second bent portion, the lead portions 12a and 12b extending along the side portion of the resin container 11 are along the direction away from the concave portion of the resin container 11 (second portion) and the portion extending along the direction away from the concave portion. The bottom surface is refracted so as to be the same height as the top surface of the resin container 11. Here, the height refers to a length extending in a direction perpendicular to the bottom surface from the bottom surface of the resin container 11 toward the top surface.
　このような屈曲構造は、図５中の（ｄ）および（ｅ）に示す金型を用いることによって作製することができる。まず、図５中の（ｄ）に示す上下１対の金型６１の間に上記成形部材を配置して、プレス加工することによって、上記第２の屈曲部を作製する。続いて、当該金型６１から上記第２の屈曲部を有する成形部材を取り出して、これを、図５中の（ｅ）に示す上下１対の金型６２に配置して、プレス加工することによって、上記第１の屈曲部を作製する。 Such a bent structure can be manufactured by using the mold shown in (d) and (e) of FIG. First, the said 2nd bending part is produced by arrange | positioning the said shaping | molding member between a pair of upper and lower metal mold | dies 61 shown to (d) in FIG. 5, and pressing. Subsequently, the molding member having the second bent portion is taken out from the die 61, and placed in a pair of upper and lower dies 62 shown in FIG. 5 (e) and pressed. To produce the first bent portion.
　＜工程４：発光素子の形成および接続＞
　続いて、樹脂容器１１の凹部１１ａの底面１７に露出されたリード部１２ａ，１２ｂに対し、発光素子１４を固定する（図５中の（ｆ））。固定は上述したダイボンド剤を用いることができる。 <Step 4: Formation and connection of light emitting element>
Subsequently, the light emitting element 14 is fixed to the lead portions 12a and 12b exposed on the bottom surface 17 of the concave portion 11a of the resin container 11 ((f) in FIG. 5). The above-described die bond agent can be used for fixing.
　発光素子１４をアノード用リード部１２ａの上にダイボンド剤で固定した後、発光素子１４に設けられている導電性パターンと、各リード部１２ａ，１２ｂの金属メッキ層とをそれぞれ導電性のボンディングワイヤー１６にて接続する。なお、本実施形態では、アノード用リード部１２ａの上に発光素子１４を構成しているため、カソード用リード部１２ｂよりもアノード用リード部１２ａが樹脂容器１１の凹部１１ａの底面１７における占有面積が大きい。しかしながら、本発明はこれに限定されるものではなく、発光素子１４をカソード用リード部１２ｂの上に固定してもよく、その場合には、アノード用リード部１２ａよりもカソード用リード部１２ｂの当該占有面積を広くとればよい。 After the light emitting element 14 is fixed on the anode lead portion 12a with a die bond agent, the conductive pattern provided on the light emitting element 14 and the metal plating layer of each lead portion 12a, 12b are each made of a conductive bonding wire. 16 to connect. In the present embodiment, since the light emitting element 14 is formed on the anode lead portion 12a, the anode lead portion 12a occupies the area occupied by the bottom surface 17 of the recess 11a of the resin container 11 rather than the cathode lead portion 12b. Is big. However, the present invention is not limited to this, and the light-emitting element 14 may be fixed on the cathode lead portion 12b. In that case, the cathode lead portion 12b is more than the anode lead portion 12a. The occupation area may be widened.
　ここで、ダイボンドに用いられる接合部材は特に限定されず、エポキシ樹脂等の絶縁性接着剤、Ａｕ－Ｓｎ合金、導電性材料が含有された樹脂やガラス等を用いることができる。含有される導電性材料はＡｇが好ましく、Ａｇの含有量が８０％～９０％であるＡｇペーストを用いると放熱性に優れて且つ接合後の応力が小さい発光装置が得られる。 Here, the bonding member used for die bonding is not particularly limited, and an insulating adhesive such as an epoxy resin, an Au—Sn alloy, a resin or glass containing a conductive material, and the like can be used. The conductive material contained is preferably Ag. When an Ag paste having an Ag content of 80% to 90% is used, a light emitting device having excellent heat dissipation and low stress after bonding can be obtained.
　ボンディングワイヤー１６としては、発光素子１４の電極とのオーミック性、機械的接続性、電気伝導性、および、熱伝導性がよいものが求められる。熱伝導度としては０．０１ｃａｌ／（ｓ）（ｃｍ２）（℃／ｃｍ）以上が好ましく、より好ましくは０．５ｃａｌ／（ｓ）（ｃｍ２）（℃／ｃｍ）以上である。また、作業性などを考慮してボンディングワイヤーの直径は、好ましくは、１０μｍ以上、４５μｍ以下である。このようなボンディングワイヤーとして具体的には、金、銅、白金、アルミニウム等の金属およびそれらの合金を用いた導電性のワイヤが挙げられる。 The bonding wire 16 is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrode of the light emitting element 14. Preferably 0.01cal / (s) (cm 2 ) (℃ / cm) or higher as heat conductivity, and more preferably 0.5cal / (s) (cm 2 ) (℃ / cm) or more. In consideration of workability and the like, the diameter of the bonding wire is preferably 10 μm or more and 45 μm or less. Specific examples of such a bonding wire include conductive wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof.
　なお、本実施形態では、導電性パターンと、リード部の金属メッキとをボンディングワイヤーを用いて接続しているが、本発明はこれに限定されるものではなく、同一面側に設けられた一対の電極をパッケージ凹部より露出された一対のリード電極と対向させてなるフリップチップ方式にて実装してもよい。フリップチップ方式を採用すれば、発光面側に光を遮るものが存在せず、均一な発光を得ることができる。バンプの材料は、導電性であれば特に限定されないが、発光素子の正負両電極およびリード電極のメッキ材料に含まれる材料の少なくとも一種を含有することが好ましい。例えばＡｇ、Ａｕ、共晶ハンダ（Ａｕ－Ｓｎ）、Ｐｂ－Ｓｎ、鉛フリーハンダ等が挙げられる。 In the present embodiment, the conductive pattern and the metal plating of the lead portion are connected using a bonding wire. However, the present invention is not limited to this, and a pair provided on the same surface side. These electrodes may be mounted by a flip chip method in which the electrodes are opposed to a pair of lead electrodes exposed from the package recess. If the flip chip method is employed, there is no light blocking member on the light emitting surface side, and uniform light emission can be obtained. The material of the bump is not particularly limited as long as it is conductive, but preferably contains at least one of the materials included in the positive and negative electrodes of the light emitting element and the plating material of the lead electrode. For example, Ag, Au, eutectic solder (Au—Sn), Pb—Sn, lead-free solder and the like can be mentioned.
　＜工程５：封止樹脂の充填＞
　次に、発光素子１４を外部環境から保護するため透光性の封止樹脂１５を、樹脂容器１１の凹部１１ａに充填する（図５中の（ｇ））。封止樹脂の材料は、上述した通りである。 <Step 5: Filling with sealing resin>
Next, in order to protect the light emitting element 14 from the external environment, a light-transmitting sealing resin 15 is filled in the concave portion 11a of the resin container 11 ((g) in FIG. 5). The material of the sealing resin is as described above.
　凹部１１ａへの封止注入は、ディスペンサーによるポッティング法を用い、注入樹脂の成型には表面張力により凹み（レンズ）形状を成す様に樹脂量制御を行っている。しかしながら、これに限定されるものではなく、他の成型方法としては、射出（インジェクション）、圧縮（コンプレッション）など、金型を用いた成型方法であってもよい。 Sealing injection into the recess 11a uses a potting method using a dispenser, and the amount of resin is controlled so as to form a dent (lens) shape by surface tension in the molding of the injected resin. However, the present invention is not limited to this, and another molding method may be a molding method using a mold such as injection (injection) or compression (compression).
　上述したように、封止樹脂１５の光出射面側を所望の形状にすることによってレンズ効果を持たせることができる。本実施形態では、図４に示すように、封止樹脂１５の光出射面側が、樹脂容器１１の上面よりも凹んだ構造となっている。これにより、凹レンズと同様の効果を奏する。 As described above, the lens effect can be provided by making the light emission surface side of the sealing resin 15 have a desired shape. In the present embodiment, as shown in FIG. 4, the light emission surface side of the sealing resin 15 has a structure that is recessed from the upper surface of the resin container 11. Thereby, there exists an effect similar to a concave lens.
　充填した封止材料を硬化させることにより発光素子１４およびボンディングワイヤー１６を被覆する。 The light-emitting element 14 and the bonding wire 16 are covered by curing the filled sealing material.
　以上の各工程を経て、本実施形態の発光装置が完成する。 Through the above steps, the light-emitting device of this embodiment is completed.
　（４）　本実施形態の作用効果
　本実施形態の発光装置１は、図４に示したように、樹脂容器１１の底面１７に対して垂直方向に底面１７から上面に向けて延びる長さを高さとした場合に、リード部における樹脂容器１１の外部に露出した部分のうちの最も高い部分である突出部１２ｃが、樹脂容器１１の上面よりも高い位置にあって、突出部１２ｃと樹脂容器１１の上面との高低差が、リード部１２ａ，１２ｂを構成する金属板の厚さと一致している。また、発光モジュール３０においては、この発光装置１を、突出部１２ｃを含むリード部の端部がプリント配線基板２０の表面上に配設される。そして、発光モジュール３０を導光板４０の光入射面４１に配置する際に、突出部１２ｃを含むリード部の端部が、プリント配線基板２０の表面と、導光板４０の光入射面４１との間に挟持されるようにする。上述したように本実施形態では樹脂容器１１の上面がプリント配線基板２０の表面と面一になるように構成されているので、リード部１２ａ，１２ｂの突出部１２ｃに導光板４０の光入射面４１を接合して得られる本実施形態の面状光源装置は、導光板４０の光入射面４１と、樹脂容器１１の上面との間のギャップを、リード部を構成する金属板の厚さで統一することができる。よって、発光装置１と導光板４０とのギャップを、導光板４０における発光装置配設面（光入射面４１）の全体にわたって均一にすることができる。 (4) Effects of this Embodiment As shown in FIG. 4, the light emitting device 1 of this embodiment has a length that extends from the bottom surface 17 toward the top surface in a direction perpendicular to the bottom surface 17 of the resin container 11. In this case, the protruding portion 12c, which is the highest portion of the lead portion exposed to the outside of the resin container 11, is located higher than the upper surface of the resin container 11, and the protruding portion 12c and the resin container 11 are located. The height difference from the upper surface of the metal plate coincides with the thickness of the metal plate constituting the lead portions 12a and 12b. Further, in the light emitting module 30, the light emitting device 1 is arranged on the surface of the printed wiring board 20 with the end portion of the lead portion including the protruding portion 12 c. When the light emitting module 30 is arranged on the light incident surface 41 of the light guide plate 40, the end portion of the lead portion including the protruding portion 12 c is formed between the surface of the printed wiring board 20 and the light incident surface 41 of the light guide plate 40. Try to be sandwiched between them. As described above, since the upper surface of the resin container 11 is configured to be flush with the surface of the printed wiring board 20 in the present embodiment, the light incident surface of the light guide plate 40 is formed on the protruding portions 12c of the lead portions 12a and 12b. In the planar light source device of the present embodiment obtained by joining 41, the gap between the light incident surface 41 of the light guide plate 40 and the upper surface of the resin container 11 is determined by the thickness of the metal plate constituting the lead portion. Can be unified. Therefore, the gap between the light emitting device 1 and the light guide plate 40 can be made uniform over the entire light emitting device arrangement surface (light incident surface 41) of the light guide plate 40.
　また、金属板の厚さは上述したように薄いため、ギャップを比較的小さく構成することができる。 Also, since the thickness of the metal plate is thin as described above, the gap can be made relatively small.
　また、金属板で構成されるリード部１２ａ，１２ｂの突出部１２ｃおよび突出部１２ｃを含む端部は、樹脂容器に比べて衝撃や摩擦に対する強度が高いため、導光板４０の光入射面４１との接触による割れや欠けは生じない。また、上述したような熱収縮による応力や継続使用における導光板との接触による磨耗や欠けも生じない。 Moreover, since the edge part including the protrusion part 12c of the lead | read | reed parts 12a and 12b comprised by a metal plate and the protrusion part 12c has the high intensity | strength with respect to an impact and friction compared with a resin container, the light-incidence surface 41 of the light-guide plate 40 and No cracking or chipping due to contact. Further, neither stress due to heat shrinkage as described above nor wear or chipping due to contact with the light guide plate in continuous use does not occur.
　したがって、接合時にギャップが変化してしまったり、接合後に何らかの要因で上記突出部１２ｃに負荷がかかって磨耗や欠けが生じてギャップが変化してしまったりすることがなく、長期にわたって上記ギャップを均一に維持することができる。 Therefore, the gap does not change at the time of joining, or the gap is not changed due to wear or chipping caused by any load on the protrusion 12c due to some factor after joining. Can be maintained.
　よって、バックライト性能のばらつきを回避した信頼性の高い発光装置を提供することができる。 Therefore, a highly reliable light-emitting device that avoids variations in backlight performance can be provided.
　〔実施形態２〕
　本発明に係る他の実施形態について、図６から図１０に基づいて説明する。尚、本実施形態では、上記実施形態１との相違点について説明するため、説明の便宜上、実施形態１で説明した部材と同一の機能を有する部材には同一の部材番号を付し、その説明を省略する。 [Embodiment 2]
Another embodiment according to the present invention will be described with reference to FIGS. In addition, in this embodiment, in order to explain a difference from the first embodiment, for the sake of convenience of explanation, members having the same functions as the members described in the first embodiment are denoted by the same member numbers, and the description thereof. Is omitted.
　（１）　発光装置
　（発光装置の構成）
　図６は、本実施形態の発光装置１´の光出射側を見たときの平面図である。また、図７は、図６に示す発光装置１´を切断線Ｃ－Ｃ´にて切断した状態を示した矢視断面図である。 (1) Light-emitting device (Configuration of light-emitting device)
FIG. 6 is a plan view when the light emitting side of the light emitting device 1 ′ of the present embodiment is viewed. FIG. 7 is a cross-sectional view taken along the arrow showing the light emitting device 1 ′ shown in FIG. 6 cut along the cutting line CC ′.
　本実施形態の発光装置１´と、上記実施形態１の発光装置１（図２および図３）との差異は、リード部１２ａ，１２ｂの構造にある。具体的には、リード部１２ａ，１２ｂの突出部１２ｃ´を含む端部の形状と、リード部１２ａ，１２ｂの配線構造が異なっている。以下にこれらの差異について、詳述する。 The difference between the light emitting device 1 ′ of the present embodiment and the light emitting device 1 of the first embodiment (FIGS. 2 and 3) is in the structure of the lead portions 12a and 12b. Specifically, the shape of the end portion including the protruding portion 12c ′ of the lead portions 12a and 12b is different from the wiring structure of the lead portions 12a and 12b. These differences will be described in detail below.
　上記実施形態１では突出部１２ｃ（図３および図４）を含む第２部分は第２の屈曲部において樹脂容器から離れる方向（外向き）に折れ曲がっていた。これに対して、本実施形態の発光装置１´では、図６および図７に示すように、リード部１２ａ，１２ｂはそれぞれ、樹脂容器１１の上面よりも光出射方向に突出した第１部分を有していて、且つ、当該部分（突出部を含む部分）が樹脂容器１１の凹部１１ａに近づく方向に折れ曲がっている。すなわち、本実施形態では、突出部１２ｃ´を含む第２部分が、内向きになるように折れ曲がっている。 In the first embodiment, the second portion including the protruding portion 12c (FIGS. 3 and 4) is bent in the direction away from the resin container (outward) at the second bent portion. In contrast, in the light emitting device 1 ′ of the present embodiment, as shown in FIGS. 6 and 7, each of the lead portions 12 a and 12 b has a first portion that protrudes in the light emitting direction from the upper surface of the resin container 11. And the portion (the portion including the protruding portion) is bent in a direction approaching the concave portion 11 a of the resin container 11. That is, in the present embodiment, the second portion including the protruding portion 12c ′ is bent so as to be inward.
　具体的には、本実施形態では、リード部１２ａ，１２ｂが、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器１１の上面に隣接した位置において上記樹脂容器１１に近づく方向に折れ曲がって延びる第２部分とを有しており、当該第２部分は樹脂容器１１の上面と平行に延びており、突出部１２ｃは、当該第２部分の、樹脂容器１１の上面に対して平行に延びるリード部を構成する金属板の表面によって構成されている。 Specifically, in the present embodiment, the lead portions 12a and 12b have a first portion extending along the side wall of the resin container, and the resin container at a position where the first portion is adjacent to the upper surface of the resin container 11. 11 and a second portion extending in a direction approaching 11, the second portion extending in parallel with the upper surface of the resin container 11, and the projecting portion 12 c of the second portion of the resin container 11. It is comprised by the surface of the metal plate which comprises the lead part extended in parallel with respect to an upper surface.
　本実施形態では、突出部１２ｃ´を含む端部は、図６および図７に示すように、樹脂容器１１の上面に配設されている。当該上面は光を出射しない部分であるため、上に突出部１２ｃ´を含む部分が配設されても出射光を遮ることはない。 In the present embodiment, the end including the protruding portion 12c ′ is disposed on the upper surface of the resin container 11 as shown in FIGS. Since the upper surface is a portion that does not emit light, the emitted light is not blocked even if a portion including the protruding portion 12c ′ is disposed on the upper surface.
　樹脂容器１１の上面の上に配設されている突出部１２ｃ´を含む部分は、リード部を構成する金属板であるから、当該上面から突出部１２ｃ´までの幅（厚さ、突出長）は、当該金属板の厚みと等しい。本実施形態では、突出部１２ｃ´は、リード部１２ａ，１２ｂにおける凹１１ａの底面１７に露出した面とは反対側の面と同じ面である。 Since the portion including the protruding portion 12c ′ disposed on the upper surface of the resin container 11 is a metal plate constituting the lead portion, the width (thickness, protruding length) from the upper surface to the protruding portion 12c ′. Is equal to the thickness of the metal plate. In the present embodiment, the protruding portion 12c ′ is the same surface as the surface opposite to the surface exposed to the bottom surface 17 of the recess 11a in the lead portions 12a and 12b.
　よって、本実施形態の発光装置を、上記実施形態１と同様に、発光モジュールとして構成して、突出部１２ｃ´に導光板４０の光入射面４１を接合することにより、均一なギャップを形成することができる。 Therefore, the light emitting device of the present embodiment is configured as a light emitting module as in the first embodiment, and a uniform gap is formed by joining the light incident surface 41 of the light guide plate 40 to the protruding portion 12c ′. be able to.
　また、本実施形態のリード部１２ａ，１２ｂは、上記実施形態１と同様に、樹脂容器１１の凹部１１ａの底面１７に露出した面の金属メッキ層の端子と、発光素子１４の導電性パターンとがボンディングワイヤー１６によって電気的に接続している。一方、上記実施形態１と異なる点は、ボンディングワイヤー１６が接続したリード部１２ａ，１２ｂの面とは反対側に端子１２ｄを形成している点にある（図７）。 In addition, the lead portions 12a and 12b of the present embodiment are similar to the first embodiment in that the metal plating layer terminals exposed on the bottom surface 17 of the recess 11a of the resin container 11 and the conductive pattern of the light emitting element 14 are provided. Are electrically connected by a bonding wire 16. On the other hand, the difference from the first embodiment is that a terminal 12d is formed on the side opposite to the surfaces of the lead portions 12a and 12b to which the bonding wires 16 are connected (FIG. 7).
　（発光装置の形成方法）
　本実施形態の発光装置１´の製造工程は、まず、上記実施形態１で説明した工程１において、リード部に端子１２ｄを形成する点で異なる。そのほかは、上記工程３のフォーミング工程が異なる。工程３の相違点について以下に説明する。 (Method for forming light emitting device)
The manufacturing process of the light emitting device 1 ′ of the present embodiment is different in that the terminal 12 d is formed on the lead portion in the process 1 described in the first embodiment. Other than that, the forming process of the above-described process 3 is different. Differences in step 3 will be described below.
　＜工程３：リード部のフォーミング＞
　成形用型から取り外された成形部材（リード部と樹脂容器とが一体化された構造）を用いて、リード部１２ａ，１２ｂの、樹脂容器１１の側面から樹脂容器外部に露出した部分のフォーミングを行なう。 <Process 3: Lead Forming>
Using the molding member removed from the molding die (the structure in which the lead portion and the resin container are integrated), forming the portions of the lead portions 12a and 12b exposed from the side surface of the resin container 11 to the outside of the resin container. Do.
　本実施形態では、リード部１２ａ，１２ｂには、樹脂容器１１の底面と樹脂容器１１の側部との隣接部分に第１の屈曲部がある。また、樹脂容器１１の側部と樹脂容器１１の上面との隣接部分に第２の屈曲部がある。第１の屈曲部では、樹脂容器１１の底面に沿って延びているリード部１２ａ，１２ｂが樹脂容器１１の側部に沿って延びる（第１部分）ように屈折している。第２の屈曲部では、樹脂容器１１の側部に沿って延びているリード部１２ａ，１２ｂが樹脂容器１１の上面上に当該上面に沿って延びる（第２部分）ように屈折している。 In the present embodiment, the lead portions 12a and 12b have a first bent portion adjacent to the bottom surface of the resin container 11 and the side portion of the resin container 11. In addition, a second bent portion is provided in an adjacent portion between the side portion of the resin container 11 and the upper surface of the resin container 11. In the first bent portion, the lead portions 12a and 12b extending along the bottom surface of the resin container 11 are refracted so as to extend along the side portion of the resin container 11 (first portion). In the second bent portion, the lead portions 12a and 12b extending along the side portion of the resin container 11 are refracted on the upper surface of the resin container 11 so as to extend along the upper surface (second portion).
　このような屈曲構造は、図８に示す金型を用いることによって作製することができる。まず、図８の右側に示した上下１対の金型の間に上記成形部材を配置して、プレス加工することによって、上記第２の屈曲部を作製する。続いて、当該金型から、上記第２の屈曲部を有する成形部材を取り出して、これを、図８の左側に示した上下１対の金型に配置して、プレス加工することによって、上記第１の屈曲部を作製する。 Such a bent structure can be produced by using a mold shown in FIG. First, the said 2nd bending part is produced by arrange | positioning the said shaping | molding member between one pair of upper and lower metal mold | dies shown on the right side of FIG. 8, and pressing. Subsequently, the molding member having the second bent portion is taken out from the mold, and placed in a pair of upper and lower molds shown on the left side of FIG. A first bent portion is produced.
　（２）発光モジュール
　図９は、本実施形態の発光モジュール３０´を光出射面側からみた部分平面図である。また図１０は、図９に示した切断線Ｃ－Ｃ´において発光モジュール３０´を切断した部分断面図であり、なお、図１０には、説明の便宜上、上記導光板４０の断面も示している。 (2) Light-Emitting Module FIG. 9 is a partial plan view of the light-emitting module 30 ′ of the present embodiment as viewed from the light emitting surface side. FIG. 10 is a partial cross-sectional view of the light emitting module 30 ′ taken along the cutting line CC ′ shown in FIG. 9, and FIG. 10 also shows the cross section of the light guide plate 40 for convenience of explanation. Yes.
　図９および図１０に示すように、本実施形態の発光モジュール３０´は、プリント配線基板２０の表面に上述した本実施形態の発光装置を搭載している。 As shown in FIGS. 9 and 10, the light emitting module 30 ′ of the present embodiment has the above-described light emitting device of the present embodiment mounted on the surface of the printed wiring board 20.
　ここで、上記実施形態１の発光モジュール３０は、図２および図３に示したように、プリント配線基板２０に設けた孔２０ａに発光装置１を実装している。これに対して、本実施形態では、導電性金属材であるリード部１２ａ，１２ｂにおける底面１７に露出した面とは反対側の面に設けた端子１２ｄ（図７）をプリント配線基板２０の表面に設けた配線形成領域２０ｂに形成された配線に接続した表面実装型（図９および図１０）を有している。 Here, in the light emitting module 30 according to the first embodiment, the light emitting device 1 is mounted in the hole 20a provided in the printed wiring board 20, as shown in FIGS. On the other hand, in this embodiment, the terminal 12d (FIG. 7) provided on the surface opposite to the surface exposed to the bottom surface 17 of the lead portions 12a and 12b, which is a conductive metal material, is the surface of the printed wiring board 20. The surface mount type (FIGS. 9 and 10) connected to the wiring formed in the wiring formation region 20b provided in FIG.
　（３）面状光源装置
　本実施形態の面状光源装置は、上述した本実施形態の発光装置１´の突出部１２ｃ´と、導光板４０の光入射面４１とが接合して構成されている。これにより、発光装置１´の樹脂容器１１の上面と、導光板４０の光入射面４１との間に突出部１２ｃ´を含む端部が挟持された構成となる。突出部１２ｃ´を含む端部は、リード部１２ａ，１２ｂを構成する金属板の厚さと等しいため、樹脂容器１１の上面と、導光板４０の光入射面４１との間は、リード部１２ａ，１２ｂを構成する金属板の厚さで統一される。 (3) Planar light source device The planar light source device of the present embodiment is configured by joining the protrusion 12c ′ of the light emitting device 1 ′ of the present embodiment described above and the light incident surface 41 of the light guide plate 40. Yes. Thereby, it becomes the structure by which the edge part containing protrusion part 12c 'was clamped between the upper surface of the resin container 11 of light-emitting device 1', and the light-incidence surface 41 of the light-guide plate 40. FIG. Since the end including the protruding portion 12c ′ is equal to the thickness of the metal plate constituting the lead portions 12a and 12b, the lead portions 12a and 12b are formed between the upper surface of the resin container 11 and the light incident surface 41 of the light guide plate 40. The thickness of the metal plate constituting 12b is unified.
　（４）　本実施形態の作用効果
　本実施形態の発光装置１´は、上記実施形態１と同様に、発光装置の樹脂容器１１の上面と、導光板４０の光入射面４１との間が、リード部１２ａ，１２ｂを構成する金属板の厚さで統一される。よって、発光装置と導光板４０とのギャップを、導光板４０における発光装置配設面（光入射面４１）の全体にわたって均一にすることができる。 (4) Effects of this Embodiment As in the first embodiment, the light emitting device 1 ′ of the present embodiment has a space between the upper surface of the resin container 11 of the light emitting device and the light incident surface 41 of the light guide plate 40. The thickness of the metal plates constituting the lead portions 12a and 12b is unified. Therefore, the gap between the light emitting device and the light guide plate 40 can be made uniform over the entire light emitting device arrangement surface (light incident surface 41) of the light guide plate 40.
　また、リード部１２ａ，１２ｂの突出部１２ｃ´を含む端部は金属板で構成されているため、上記実施形態１と同様の理由で、接合時にギャップが変化してしまったり、接合後に何らかの要因で上記突出部１２ｃ´に負荷がかかって磨耗や欠けが生じてギャップが変化してしまったりすることがなく、長期にわたって上記ギャップを均一に維持することができる。 Further, since the ends including the protruding portions 12c ′ of the lead portions 12a and 12b are made of a metal plate, for the same reason as in the first embodiment, the gap may change at the time of bonding, or some factor after the bonding. Thus, no load is applied to the protruding portion 12c ′ to cause wear or chipping, and the gap does not change, and the gap can be kept uniform over a long period of time.
　よって、バックライト性能のばらつきを回避した信頼性の高い発光装置を提供することができる。 Therefore, a highly reliable light-emitting device that avoids variations in backlight performance can be provided.
　〔実施形態３〕
　本発明に係る他の実施形態について、図１１から図１５に基づいて説明する。尚、本実施形態では、上記実施形態１との相違点について説明するため、説明の便宜上、実施形態１で説明した部材と同一の機能を有する部材には同一の部材番号を付し、その説明を省略する。 [Embodiment 3]
Another embodiment according to the present invention will be described with reference to FIGS. In addition, in this embodiment, in order to explain a difference from the first embodiment, for the sake of convenience of explanation, members having the same functions as the members described in the first embodiment are denoted by the same member numbers, and the description thereof. Is omitted.
　（１）　発光装置
　（発光装置の構成）
　図１１は、本実施形態の発光装置１´´の光出射側をみた平面図である。また、図１２は、図１１に示す発光装置１´´を切断線Ｃ－Ｃ´にて切断した状態を示した矢視断面図である。 (1) Light-emitting device (Configuration of light-emitting device)
FIG. 11 is a plan view of the light emitting side of the light emitting device 1 ″ according to the present embodiment as viewed. FIG. 12 is a cross-sectional view taken along the arrow line showing a state where the light emitting device 1 ″ shown in FIG. 11 is cut along the cutting line CC ′.
　本実施形態の発光装置１´´と、上記実施形態１の発光装置１（図２および図３）との差異は、リード部１２ａ，１２ｂの構造にある。具体的には、リード部１２ａ，１２ｂにおける樹脂容器１１の外部に露出した部分の突出部１２ｃ´´を含む端部の形状と、リード部１２ａ，１２ｂの配線構造が異なっている。以下にこれらの差異について、詳述する。 The difference between the light emitting device 1 ″ of the present embodiment and the light emitting device 1 of the first embodiment (FIGS. 2 and 3) is in the structure of the lead portions 12a and 12b. Specifically, the shape of the end portion of the lead portions 12a and 12b including the protruding portion 12c '' of the portion exposed to the outside of the resin container 11 is different from the wiring structure of the lead portions 12a and 12b. These differences will be described in detail below.
　まず、リード部１２ａ，１２ｂにおける樹脂容器１１の外部に露出した部分のうちの最も高い部分である突出部１２ｃ´´を含む端部の形状について説明する。 First, the shape of the end portion including the protruding portion 12c ″ which is the highest portion of the portions exposed to the outside of the resin container 11 in the lead portions 12a and 12b will be described.
　上記実施形態１では、リード部１２ａ，１２ｂにおける樹脂容器１１の側部に沿って延びた第１部分が、樹脂容器１１の上面から突出したところに第２の屈曲部を有して外向きに折り曲がっている。これに対して、本実施形態の発光装置１´では、図１１および図１２に示すように、リード部１２ａ，１２ｂにおける樹脂容器１１の側部に沿って延びた第２部分が光出射方向に真っ直ぐ延びていて、第２の屈曲部を有しておらず、真っ直ぐ延びた先端に突出部１２ｃ´´が設けられている。 In the first embodiment, the first portion extending along the side portion of the resin container 11 in the lead portions 12a and 12b has the second bent portion at the position protruding from the upper surface of the resin container 11, and faces outward. It is bent. In contrast, in the light emitting device 1 ′ of the present embodiment, as shown in FIGS. 11 and 12, the second portions extending along the side portions of the resin container 11 in the lead portions 12 a and 12 b are in the light emitting direction. It extends straight and does not have the second bent portion, and a protruding portion 12c '' is provided at the end that extends straight.
　また、光出射方向に真っ直ぐ延びた先端に相当する突出部１２ｃ´´と、樹脂容器１１の上面との高低差（樹脂容器１１の上面からの上記第１部分の突出長）は、リード部１２ａ，１２ｂを構成する金属板の厚さと等しい。 Further, the difference in height between the protruding portion 12c ″ corresponding to the tip extending straight in the light emitting direction and the upper surface of the resin container 11 (the protruding length of the first portion from the upper surface of the resin container 11) is the lead portion 12a. , 12b is equal to the thickness of the metal plate.
　よって、本実施形態の発光装置を、上記実施形態１と同様に、発光モジュールとして構成して、突出部１２ｃ´´に導光板４０の光入射面４１を接合することにより、均一なギャップを形成することができる。 Therefore, the light emitting device of the present embodiment is configured as a light emitting module as in the first embodiment, and a uniform gap is formed by joining the light incident surface 41 of the light guide plate 40 to the protruding portion 12c ″. can do.
　また、本実施形態の発光装置１´´では、上記実施形態２と同様に、ボンディングワイヤー１６が接続したリード部１２ａ，１２ｂの面とは反対側に端子１２ｄを形成している（図１２）。 Further, in the light emitting device 1 ″ of the present embodiment, similarly to the second embodiment, the terminal 12d is formed on the side opposite to the surface of the lead portions 12a and 12b to which the bonding wires 16 are connected (FIG. 12). .
　（発光装置の形成方法）
　本実施形態の発光装置１´´の製造工程は、上記工程３のフォーミング工程が異なる。工程３の相違点について以下に説明する。 (Method for forming light emitting device)
The manufacturing process of the light emitting device 1 ″ of the present embodiment is different from the forming process of the above process 3. Differences in step 3 will be described below.
　＜工程３：リード部のフォーミング＞
　成形用型から取り外された成形部材（リード部と樹脂容器とが一体化された構造）を用いて、リード部１２ａ，１２ｂの、樹脂容器１１の側面から樹脂容器外部に露出した部分のフォーミングを行なう。 <Process 3: Lead Forming>
Using the molding member removed from the molding die (the structure in which the lead portion and the resin container are integrated), forming the portions of the lead portions 12a and 12b exposed from the side surface of the resin container 11 to the outside of the resin container. Do.
　本実施形態では、リード部１２ａ，１２ｂには、樹脂容器１１の底面と樹脂容器１１の側部との隣接部分に屈曲部がある。当該屈曲部では、樹脂容器１１の底面に沿って延びているリード部１２ａ，１２ｂが樹脂容器１１の側部に沿って延びる（第１部分）ように屈折している。 In the present embodiment, the lead portions 12a and 12b have a bent portion adjacent to the bottom surface of the resin container 11 and the side portion of the resin container 11. In the bent portion, the lead portions 12a and 12b extending along the bottom surface of the resin container 11 are refracted so as to extend along the side portion of the resin container 11 (first portion).
　このような屈曲構造は、図１３に示す金型６５を用いて形成することができる。 Such a bent structure can be formed using a mold 65 shown in FIG.
　（２）発光モジュール
　図１４は、本実施形態の発光モジュール３０´´を光出射面側からみた部分平面図である。また図１５は、図１４に示した切断線Ｃ－Ｃ´において発光モジュール３０´´を切断した部分断面図であり、なお、図１５には、説明の便宜上、上記導光板４０の断面も示している。 (2) Light-Emitting Module FIG. 14 is a partial plan view of the light-emitting module 30 ″ of this embodiment as viewed from the light emitting surface side. 15 is a partial cross-sectional view of the light emitting module 30 ″ taken along the cutting line CC ′ shown in FIG. 14, and FIG. 15 also shows a cross section of the light guide plate 40 for convenience of explanation. ing.
　図１４および図１５に示すように、本実施形態の発光モジュール３０´´は、プリント配線基板２０の表面に上述した本実施形態の発光装置を搭載している。実装方法は上記実施形態２で説明した方法と同じである。 As shown in FIGS. 14 and 15, the light emitting module 30 ″ of the present embodiment has the above-described light emitting device of the present embodiment mounted on the surface of the printed wiring board 20. The mounting method is the same as the method described in the second embodiment.
　（３）面状光源装置
　本実施形態の面状光源装置は、上述した本実施形態の発光装置１´´の突出部１２ｃ´´と、導光板４０の光入射面４１とが接合して構成されている。上述したように、突出部１２ｃ´´と、樹脂容器１１の上面との高低差は、リード部１２ａ，１２ｂを構成する金属板の厚さと等しい。そのため、発光装置１´´の樹脂容器１１の上面と、導光板４０の光入射面４１との間は、リード部１２ａ，１２ｂを構成する金属板の厚さで統一される。 (3) Planar light source device The planar light source device of the present embodiment is configured by joining the protruding portion 12 c ″ of the light emitting device 1 ″ of the present embodiment described above and the light incident surface 41 of the light guide plate 40. Has been. As described above, the height difference between the protruding portion 12c ″ and the upper surface of the resin container 11 is equal to the thickness of the metal plate constituting the lead portions 12a and 12b. Therefore, the thickness between the upper surface of the resin container 11 of the light emitting device 1 ″ and the light incident surface 41 of the light guide plate 40 is unified by the thickness of the metal plate constituting the lead portions 12 a and 12 b.
　（４）　本実施形態の作用効果
　本実施形態の発光装置１´は、上記実施形態１と同様に、発光装置の樹脂容器１１の上面と、導光板４０の光入射面４１との間が、リード部１２ａ，１２ｂを構成する金属板の厚さで統一される。よって、発光装置と導光板４０とのギャップを、導光板４０における発光装置配設面（光入射面４１）の全体にわたって均一にすることができる。 (4) Effects of this Embodiment As in the first embodiment, the light emitting device 1 ′ of the present embodiment has a space between the upper surface of the resin container 11 of the light emitting device and the light incident surface 41 of the light guide plate 40. The thickness of the metal plates constituting the lead portions 12a and 12b is unified. Therefore, the gap between the light emitting device and the light guide plate 40 can be made uniform over the entire light emitting device arrangement surface (light incident surface 41) of the light guide plate 40.
　また、リード部１２ａ，１２ｂの突出部１２ｃ´´および突出部１２ｃ´´を含む端部は金属板で構成されているため、上記実施形態１と同様の理由で、接合時にギャップが変化してしまったり、接合後に何らかの要因で上記突出部１２ｃ´´に負荷がかかって磨耗や欠けが生じてギャップが変化してしまったりすることがなく、長期にわたって上記ギャップを均一に維持することができる。 Moreover, since the edge part including protrusion part 12c '' and protrusion part 12c '' of lead part 12a, 12b is comprised with the metal plate, a gap changes at the time of joining for the same reason as the above-mentioned Embodiment 1. The gap can be maintained uniformly over a long period of time without causing a gap or a change in the gap due to wear or chipping caused by some factor after joining or due to some factor after joining.
　よって、バックライト性能のばらつきを回避した信頼性の高い発光装置を提供することができる。 Therefore, a highly reliable light-emitting device that avoids variations in backlight performance can be provided.
　なお、本発明は上述した各実施形態に限定されるものではない。当業者は、請求項に示した範囲内において、本発明をいろいろと変更できる。すなわち、請求項に示した範囲内において、適宜変更された技術的手段を組み合わせれば、新たな実施形態が得られる。すなわち、発明の詳細な説明の項においてなされた具体的な実施形態は、あくまでも、本発明の技術内容を明らかにするものであって、そのような具体例にのみ限定して狭義に解釈されるべきものではなく、本発明の精神と次に記載する請求の範囲内で、いろいろと変更して実施することができるものである。 In addition, this invention is not limited to each embodiment mentioned above. Those skilled in the art can make various modifications to the present invention within the scope of the claims. That is, a new embodiment can be obtained by combining appropriately changed technical means within the scope of the claims. In other words, the specific embodiments made in the detailed description section of the invention are merely to clarify the technical contents of the present invention, and are limited to such specific examples and are interpreted narrowly. It should be understood that the invention can be practiced with various modifications within the spirit of the invention and within the scope of the following claims.
　（本発明の総括）
　本発明に係る発光装置は、以上のように、
　底面と当該底面の周縁から立ち上がる壁面とを含む凹部が上面に設けられた樹脂容器と、
　一方の端部が上記樹脂容器の上記凹部の上記底面に露出した状態で配置され、他方の端部が当該樹脂容器の外部に露出している状態で配置されたリード部と、
　上記凹部の前記底面において上記リード部と電気的に接続される発光素子と、を備えた発光装置であって、
　上記リード部は、所定の厚さをもつ金属板であり、
　上記樹脂容器の上記上面よりも光出射方向に突出した突出部を、上記リード部の上記他方の端部によって構成しており、
　上記突出部における上記樹脂容器の上記上面からの突出長は、上記所定の厚さと一致していることを特徴としている。 (Summary of the present invention)
The light emitting device according to the present invention is as described above.
A resin container in which a recess including a bottom surface and a wall surface rising from a peripheral edge of the bottom surface is provided on the top surface;
A lead portion disposed with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion exposed outside the resin container;
A light emitting device comprising: a light emitting element electrically connected to the lead portion on the bottom surface of the recess;
The lead portion is a metal plate having a predetermined thickness,
The protruding portion protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end of the lead portion,
The protruding length of the protruding portion from the upper surface of the resin container is the same as the predetermined thickness.
　上記の構成によれば、上記リード部の上記他方の端部から構成された上記突出部が、上記樹脂容器の上記上面よりも突出していて、且つ、その突出長は、上記リード部を構成する金属板の厚さと一致している。 According to said structure, the said protrusion part comprised from the said other end part of the said lead part protrudes from the said upper surface of the said resin container, and the protrusion length comprises the said lead part. It matches the thickness of the metal plate.
　そのため、本発明に係る発光装置を、導光板の光入射面に配置する際に、上記リード部の他方の端部に形成された上記突出部に、導光板の光入射面を接触させて配置することによって、上記突出部がスペーサーとして機能し、導光板の光入射面と、樹脂容器の上面との間を上記金属板の厚さに相当するギャップで統一することができる。 Therefore, when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion. By doing so, the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
　また、金属板で構成される上記リード部の上記突出部は、樹脂容器に比べて衝撃や摩擦に対する強度が高い。そのため、従来構成において懸念される、光入射面との接触による割れや欠けが生じることがない。また、上述したような熱収縮による応力や継続使用における導光板との接触による磨耗や欠けも生じることがない。そのため、上記ギャップを均一に維持することができる。 Also, the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
　したがって、本発明に係る発光装置は、上記の構成を具備することによって、バックライト性能のばらつきを回避した信頼性の高い発光装置を提供することができる。 Therefore, the light-emitting device according to the present invention can provide a highly reliable light-emitting device that avoids variations in backlight performance by having the above-described configuration.
　本発明に係る発光装置は、上記の構成に加えて、
　上記リード部の上記他方の端部は、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器の上記上面近傍において上記樹脂容器から離れる方向に折れ曲がって延びる第２部分とを有しており、
　上記突出部は、上記第２部分に形成されていることが好ましい。 In addition to the above configuration, the light emitting device according to the present invention includes:
The other end of the lead portion includes a first portion extending along the side wall of the resin container, and a second portion in which the first portion is bent in a direction away from the resin container in the vicinity of the upper surface of the resin container. And has a part,
It is preferable that the protrusion is formed on the second portion.
　上記の構成によれば、上記突出部が、上記リード部の上記他方の端部における、上記樹脂容器の上記上面近傍において上記樹脂容器から離れる方向に折れ曲がって延びる第２部分に設けられている。そのため、上記樹脂容器の上面から出射する光を遮る虞が全くない。 According to the above configuration, the protruding portion is provided at the second portion of the other end portion of the lead portion that is bent and extends in the direction away from the resin container in the vicinity of the upper surface of the resin container. Therefore, there is no possibility of blocking the light emitted from the upper surface of the resin container.
　しかしながら、本発明に係る発光装置は、上記の構成とは異なり、
　上記リード部の上記他方の端部は、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器の上記上面近傍において当該上面の側に折れ曲がって当該上面の上に延びる第２部分とを有しており、
　上記突出部は、上記第２部分に形成されていてもよい。 However, the light-emitting device according to the present invention is different from the above configuration,
The other end of the lead portion includes a first portion extending along the side wall of the resin container, and the first portion is bent toward the upper surface in the vicinity of the upper surface of the resin container and is on the upper surface. A second portion extending,
The protrusion may be formed on the second portion.
　上記の構成によれば、上記突出部が、上記リード部の上記他方の端部における、上記樹脂容器の上記上面近傍において当該上面の側に折れ曲がって当該上面の上に延びる第２部分に設けられている。このように、上記樹脂容器の上記上面の上に配設されている上記第２部分の上記突出部およびその近傍は、構造的に安定している。そのため、本発明に係る発光装置を、搬送する場合、および、後述するようなプリント基板に配置する場合などに、上記突出部およびその近傍に外部衝撃が加わったとしても、変形を最小限に留めることができる。 According to said structure, the said protrusion part is provided in the 2nd part which bend | folds to the said upper surface side in the said upper end vicinity of the said resin container in the said other end part of the said lead part, and extends on the said upper surface. ing. As described above, the protruding portion of the second portion disposed on the upper surface of the resin container and the vicinity thereof are structurally stable. Therefore, when the light emitting device according to the present invention is transported or disposed on a printed circuit board as described later, even if an external impact is applied to the protruding portion and the vicinity thereof, deformation is kept to a minimum. be able to.
　また、本発明に係る発光装置は、上記の構成に加えて、
　上記リード部の上記第２部分は、上記金属板の表面が上記樹脂容器の上記上面と平行に延びて構成されており、
　上記突出部が、上記金属板の表面によって構成されていることが好ましい。 In addition to the above configuration, the light emitting device according to the present invention includes:
The second portion of the lead portion is configured such that the surface of the metal plate extends in parallel with the upper surface of the resin container,
It is preferable that the protrusion is constituted by the surface of the metal plate.
　上記突出部を樹脂容器の上面に対して平行な上記金属板の表面によって構成した構造とすることによって、リード部をプレス成型によって容易に成型することができる。 The lead portion can be easily formed by press molding by adopting a structure in which the protruding portion is constituted by the surface of the metal plate parallel to the upper surface of the resin container.
　しかしながら、本発明に係る発光装置は、上記の構成とは異なり、
　上記リード部の上記他方の端部は、上記樹脂容器の側壁に沿って延びる第１部分を有しており、
　上記突出部は、上記第１部分の先端が上記樹脂容器の上記上面よりも突出した突出端から構成されていてもよい。 However, the light-emitting device according to the present invention is different from the above configuration,
The other end of the lead portion has a first portion extending along the side wall of the resin container,
The projecting portion may include a projecting end in which a tip of the first portion projects from the upper surface of the resin container.
　上記の構成によれば、リード部をプレス成型によって容易に成型することができる。 According to the above configuration, the lead portion can be easily molded by press molding.
　また、本発明に係る発光装置は、上記の構成に加えて、
　上記凹部において上記発光素子を封止する、透光性樹脂を含む封止樹脂が充填されており、
　上記封止樹脂の表面は、上記樹脂容器の上記上面よりも凹んでいることが好ましい。 In addition to the above configuration, the light emitting device according to the present invention includes:
Filled with a sealing resin containing a light-transmitting resin that seals the light-emitting element in the recess,
The surface of the sealing resin is preferably recessed from the upper surface of the resin container.
　上記の構成によれば、封止樹脂の発光面側を凹ませたことによってレンズ効果などの光線制御を持たせることができ、発光素子チップからの発光を集束させたりすることができる。 According to the above configuration, the light emitting surface side of the sealing resin is recessed, so that light control such as a lens effect can be provided, and light emitted from the light emitting element chip can be focused.
　また、本発明に係る発光モジュールは、以上のように、
　プリント配線基板と、
　上記プリント配線基板に実装された上述した構成の発光装置とを備えていることを特徴としている。 The light emitting module according to the present invention is as described above.
A printed wiring board;
The light-emitting device having the above-described structure mounted on the printed wiring board is provided.
　本発明に係る発光モジュールに設けられた発光装置は、上記リード部の上記他方の端部から構成された上記突出部が、上記樹脂容器の上記上面よりも突出していて、且つ、その突出長は、上記リード部を構成する金属板の厚さと一致している。 In the light emitting device provided in the light emitting module according to the present invention, the protruding portion configured from the other end of the lead portion protrudes from the upper surface of the resin container, and the protruding length is And the thickness of the metal plate constituting the lead portion.
　そのため、本発明に係る発光装置を、導光板の光入射面に配置する際に、上記リード部の他方の端部に形成された上記突出部に、導光板の光入射面を接触させて配置することによって、上記突出部がスペーサーとして機能し、導光板の光入射面と、樹脂容器の上面との間を上記金属板の厚さに相当するギャップで統一することができる。 Therefore, when the light emitting device according to the present invention is disposed on the light incident surface of the light guide plate, the light incident surface of the light guide plate is placed in contact with the protruding portion formed on the other end of the lead portion. By doing so, the protrusion functions as a spacer, and the gap between the light incident surface of the light guide plate and the upper surface of the resin container can be unified with a gap corresponding to the thickness of the metal plate.
　また、金属板で構成される上記リード部の上記突出部は、樹脂容器に比べて衝撃や摩擦に対する強度が高い。そのため、従来構成において懸念される、光入射面との接触による割れや欠けが生じることがない。また、上述したような熱収縮による応力や継続使用における導光板との接触による磨耗や欠けも生じることがない。そのため、上記ギャップを均一に維持することができる。 Also, the protruding portion of the lead portion made of a metal plate has higher strength against impact and friction than the resin container. Therefore, there is no occurrence of cracking or chipping due to contact with the light incident surface, which is a concern in the conventional configuration. Further, there is no occurrence of wear or chipping due to stress due to thermal shrinkage as described above or contact with the light guide plate in continuous use. Therefore, the gap can be kept uniform.
　したがって、本発明の構成によれば、バックライト性能のばらつきを回避した信頼性の高い発光モジュールを提供することができる。 Therefore, according to the configuration of the present invention, it is possible to provide a highly reliable light emitting module that avoids variations in backlight performance.
　また、本発明に係る発光モジュールは、
　上記発光装置が、
　　上記リード部の上記他方の端部が、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器の上記上面近傍において当該上面の側に折れ曲がって当該上面の上に延びる第２部分とを有しており、
　　上記突出部が、上記第２部分に形成されており、
　上記プリント配線基板には、上記発光装置を挿入する孔が設けられており、
　上記発光装置は上記孔に挿入配置されており、上記リード部の上記突出部を含む上記第２部分は、上記プリント配線基板の上に配設されていることが好ましい。 Moreover, the light emitting module according to the present invention includes:
The light emitting device is
The other end portion of the lead portion extends along the side wall of the resin container, and the first portion is bent toward the upper surface in the vicinity of the upper surface of the resin container and is on the upper surface. A second portion extending,
The protrusion is formed in the second portion;
The printed wiring board is provided with a hole for inserting the light emitting device,
It is preferable that the light emitting device is inserted and disposed in the hole, and the second portion including the protruding portion of the lead portion is disposed on the printed wiring board.
　上記の構成によれば、発光装置がプリント配線基板の上記孔に挿入配置されているため、発光モジュールを薄型化することが可能となる。 According to the above configuration, since the light emitting device is inserted and disposed in the hole of the printed wiring board, the light emitting module can be thinned.
　また、本発明に係る発光モジュールは、上記の構成に加えて、
　上記プリント配線基板における上記第２部分が配設されている側とは反対側には、放熱板が設けられており、
　上記放熱板は、上記プリント配線基板の上記反対側の面と、上記孔に挿入配置された上記発光装置の底部とに接触していることが好ましい。 Moreover, in addition to the above configuration, the light emitting module according to the present invention includes:
On the opposite side of the printed wiring board from the side where the second part is disposed, a heat sink is provided,
It is preferable that the heat dissipation plate is in contact with the opposite surface of the printed wiring board and the bottom of the light emitting device inserted and disposed in the hole.
　上記の構成により、上記発光装置に生じた熱を効率的に放熱することができる。 With the above configuration, heat generated in the light emitting device can be efficiently radiated.
　しかしながら、本発明に係る発光モジュールは、上記の構成とは異なり、
　上記発光装置が、上記プリント配線基板の上に表面実装されており、
　上記プリント配線基板における上記発光装置の実装側とは反対側に、放熱板を備えた構成であってもよい。 However, the light emitting module according to the present invention is different from the above configuration,
The light emitting device is surface-mounted on the printed wiring board,
The structure which provided the heat sink on the opposite side to the mounting side of the said light-emitting device in the said printed wiring board may be sufficient.
　上記の構成によっても、上記発光装置に生じた熱を放熱板によって効率的に放熱することができる。 Also with the above configuration, the heat generated in the light emitting device can be efficiently radiated by the heat radiating plate.
　また、本発明に係る面状光源装置は、以上のように、
　上述した構成の発光モジュールと、
　導光板とを備えており、
　上記発光モジュールは、上記発光装置の上記凹部の開口側を上記導光板の光入射面に対向させて、上記リード部の上記突出部を当該導光板の光入射面に接触させて配置されていることを特徴としている。 The planar light source device according to the present invention is as described above.
A light emitting module configured as described above;
A light guide plate,
The light emitting module is disposed such that the opening side of the concave portion of the light emitting device is opposed to the light incident surface of the light guide plate, and the protruding portion of the lead portion is in contact with the light incident surface of the light guide plate. It is characterized by that.
　本発明は、例えば液晶表示装置のバックライトに適用することができるほか、フラット照明にも適用することができる。 The present invention can be applied, for example, to a backlight of a liquid crystal display device, and also to flat illumination.
１，１´，１´´　発光装置
５　面状光源装置
１１　樹脂容器
１１ａ　凹部
１２ａ　アノード用リード部
１２ｂ　カソード用リード部
１２ｃ，１２ｃ´，１２ｃ´´　突出部
１２ｄ　端子
１４　発光素子
１５　封止樹脂
１６　ボンディングワイヤー
１７　底面
１８　壁面
２０　プリント配線基板
２０ａ　孔
２０ｂ　配線形成領域
２１　放熱板
３０，３０´，３０´´　発光モジュール
４０　導光板
４１　光入射面
４２　光出射面
６０　成形用型
６１，６２，６３，６４，６５　金型
７０　エアーギャップ
８０　壁面 1, 1 ′, 1 ″ Light emitting device 5 Planar light source device 11 Resin container 11a Recess 12a Anode lead portion 12b Cathode lead portion 12c, 12c ′, 12c ″ Protruding portion 12d Terminal 14 Light emitting element 15 Sealing resin 16 Bonding wire 17 Bottom surface 18 Wall surface 20 Printed wiring board 20a Hole 20b Wiring formation region 21 Radiating plate 30, 30 ', 30''Light emitting module 40 Light guide plate 41 Light incident surface 42 Light emitting surface 60 Molds 61, 62, 63, 64, 65 Mold 70 Air gap 80 Wall surface

Claims (11)

  1. 　底面と当該底面の周縁から立ち上がる壁面とを含む凹部が上面に設けられた樹脂容器と、
    　一方の端部が上記樹脂容器の上記凹部の上記底面に露出した状態で配置され、他方の端部が当該樹脂容器の外部に露出している状態で配置されたリード部と、
    　上記凹部の前記底面において上記リード部と電気的に接続される発光素子と、を備えた発光装置であって、
    　上記リード部は、所定の厚さをもつ金属板であり、
    　上記樹脂容器の上記上面よりも光出射方向に突出した突出部を、上記リード部の上記他方の端部によって構成しており、
    　上記突出部における上記樹脂容器の上記上面からの突出長は、上記所定の厚さと一致していることを特徴とする発光装置。     A resin container in which a recess including a bottom surface and a wall surface rising from a peripheral edge of the bottom surface is provided on the top surface;
    A lead portion disposed with one end portion exposed at the bottom surface of the concave portion of the resin container, and the other end portion exposed outside the resin container;
    A light emitting device comprising: a light emitting element electrically connected to the lead portion on the bottom surface of the recess;
    The lead portion is a metal plate having a predetermined thickness,
    The protruding portion protruding in the light emitting direction from the upper surface of the resin container is constituted by the other end of the lead portion,
    The light emitting device according to claim 1, wherein a protrusion length of the resin container from the upper surface of the protrusion coincides with the predetermined thickness.
  2. 　上記リード部の上記他方の端部は、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器の上記上面近傍において上記樹脂容器から離れる方向に折れ曲がって延びる第２部分とを有しており、
    　上記突出部は、上記第２部分に形成されていることを特徴とする請求項１に記載の発光装置。     The other end of the lead portion includes a first portion extending along the side wall of the resin container, and a second portion in which the first portion is bent in a direction away from the resin container in the vicinity of the upper surface of the resin container. And has a part,
    The light emitting device according to claim 1, wherein the protrusion is formed in the second portion.
  3. 　上記リード部の上記他方の端部は、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器の上記上面近傍において当該上面の側に折れ曲がって当該上面の上に延びる第２部分とを有しており、
    　上記突出部は、上記第２部分に形成されていることを特徴とする請求項１に記載の発光装置。     The other end of the lead portion includes a first portion extending along the side wall of the resin container, and the first portion is bent toward the upper surface in the vicinity of the upper surface of the resin container and is on the upper surface. A second portion extending,
    The light emitting device according to claim 1, wherein the protrusion is formed in the second portion.
  4. 　上記リード部の上記第２部分は、上記金属板の表面が上記樹脂容器の上記上面と平行に延びて構成されており、
    　上記突出部が、上記金属板の表面によって構成されていることを特徴とする請求項２または３に記載の発光装置。     The second portion of the lead portion is configured such that the surface of the metal plate extends in parallel with the upper surface of the resin container,
    The light emitting device according to claim 2, wherein the protruding portion is constituted by a surface of the metal plate.
  5. 　上記リード部の上記他方の端部は、上記樹脂容器の側壁に沿って延びる第１部分を有しており、
    　上記突出部は、上記第１部分の先端が上記樹脂容器の上記上面よりも突出した突出端から構成されてなることを特徴とする請求項１に記載の発光装置。     The other end of the lead portion has a first portion extending along the side wall of the resin container,
    2. The light emitting device according to claim 1, wherein the protruding portion includes a protruding end in which a tip of the first portion protrudes from the upper surface of the resin container.
  6. 　上記凹部において上記発光素子を封止する、透光性樹脂を含む封止樹脂が充填されており、
    　上記封止樹脂の表面は、上記樹脂容器の上記上面よりも凹んでいることを特徴とする請求項１から５までの何れか１項に記載の発光装置。     Filled with a sealing resin containing a light-transmitting resin that seals the light-emitting element in the recess,
    The light emitting device according to claim 1, wherein a surface of the sealing resin is recessed from the upper surface of the resin container.
  7. 　プリント配線基板と、
    　請求項１から６までの何れか１項に記載の発光装置とを備えていることを特徴とする発光モジュール。     A printed wiring board;
    A light emitting module comprising the light emitting device according to claim 1.
  8. 　上記発光装置は、
    　　上記リード部の上記他方の端部が、上記樹脂容器の側壁に沿って延びる第１部分と、当該第１部分が上記樹脂容器の上記上面近傍において当該上面の側に折れ曲がって当該上面の上に延びる第２部分とを有しており、
    　　上記突出部が、上記第２部分に形成されており、
    　上記プリント配線基板には、上記発光装置を挿入する孔が設けられており、
    　上記発光装置は上記孔に挿入配置されており、上記リード部の上記突出部を含む上記第２部分は、上記プリント配線基板の上に配設されていることを特徴とする請求項７に記載の発光モジュール。     The light emitting device
    The other end portion of the lead portion extends along the side wall of the resin container, and the first portion is bent toward the upper surface in the vicinity of the upper surface of the resin container and is on the upper surface. A second portion extending,
    The protrusion is formed in the second portion;
    The printed wiring board is provided with a hole for inserting the light emitting device,
    The light emitting device is inserted and disposed in the hole, and the second portion including the projecting portion of the lead portion is disposed on the printed wiring board. Light emitting module.
  9. 　上記プリント配線基板における上記第２部分が配設されている側とは反対側には、放熱板が設けられており、
    　上記放熱板は、上記プリント配線基板の上記反対側の面と、上記孔に挿入配置された上記発光装置の底部とに接触していることを特徴とする請求項８に記載の発光モジュール。     On the opposite side of the printed wiring board from the side where the second part is disposed, a heat sink is provided,
    9. The light emitting module according to claim 8, wherein the heat radiating plate is in contact with the opposite surface of the printed wiring board and the bottom of the light emitting device inserted and disposed in the hole.
  10. 　上記発光装置は、上記プリント配線基板の上に表面実装されており、
    　上記プリント配線基板における上記発光装置の実装側とは反対側に、放熱板を備えていることを特徴とする請求項７に記載の発光モジュール。     The light emitting device is surface-mounted on the printed wiring board,
    The light emitting module according to claim 7, further comprising a heat sink on a side of the printed wiring board opposite to the mounting side of the light emitting device.
  11. 　請求項７から１０までの何れか１項に記載の発光モジュールと、
    　導光板と、を備えた面状光源装置であって、
    　上記発光モジュールは、上記発光装置の上記凹部の開口側を上記導光板の光入射面に対向させて、上記リード部の上記突出部を当該導光板の光入射面に接触させて配置されていることを特徴とする面状光源装置。     A light emitting module according to any one of claims 7 to 10,
    A planar light source device comprising a light guide plate,
    The light emitting module is disposed such that the opening side of the concave portion of the light emitting device is opposed to the light incident surface of the light guide plate, and the protruding portion of the lead portion is in contact with the light incident surface of the light guide plate. A planar light source device.
PCT/JP2011/072799 2010-10-08 2011-10-03 Light emitting device, light emitting module, and planar light source device WO2012046701A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06296045A (en) * 1993-04-08 1994-10-21 Rohm Co Ltd Side light emitting/receiving semiconductor device and double sided light emission indicator
JP2007096240A (en) * 2005-09-30 2007-04-12 Toyoda Gosei Co Ltd Led lighting device
JP2008135701A (en) * 2006-09-01 2008-06-12 Cree Inc Outline of inclusion body for light-emitting diode

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06296045A (en) * 1993-04-08 1994-10-21 Rohm Co Ltd Side light emitting/receiving semiconductor device and double sided light emission indicator
JP2007096240A (en) * 2005-09-30 2007-04-12 Toyoda Gosei Co Ltd Led lighting device
JP2008135701A (en) * 2006-09-01 2008-06-12 Cree Inc Outline of inclusion body for light-emitting diode

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