WO2012032831A1 - Method of cutting out graph within specific time period - Google Patents

Method of cutting out graph within specific time period Download PDF

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Publication number
WO2012032831A1
WO2012032831A1 PCT/JP2011/064759 JP2011064759W WO2012032831A1 WO 2012032831 A1 WO2012032831 A1 WO 2012032831A1 JP 2011064759 W JP2011064759 W JP 2011064759W WO 2012032831 A1 WO2012032831 A1 WO 2012032831A1
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Prior art keywords
time
start time
display start
processing
display
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PCT/JP2011/064759
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French (fr)
Japanese (ja)
Inventor
克己 山根
成年 都築
治郎 猿渡
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株式会社アルバック
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Priority to JP2012532886A priority Critical patent/JP5401610B2/en
Publication of WO2012032831A1 publication Critical patent/WO2012032831A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Definitions

  • the present invention relates to a technical field of a vacuum processing apparatus, and more particularly to a technique capable of effectively graphing and analyzing a measurement value of a mass production process using the vacuum processing apparatus.
  • Vacuum processing techniques include film formation techniques such as sputtering, CVD, and vapor deposition, etching techniques, surface modification techniques, impurity implantation techniques, vacuum drying techniques, etc.
  • film formation techniques such as sputtering, CVD, and vapor deposition, etching techniques, surface modification techniques, impurity implantation techniques, vacuum drying techniques, etc.
  • the physical quantity obtained from the operating vacuum processing device is measured by the sensor device, and the measurement result is obtained. Comparison and verification between lots are performed.
  • An object of the present invention is to provide a technique for easily and accurately graphing a range including a measurement value indicating the cause of occurrence of a defect from a large number of measurement values in order to solve the above-described problems of the prior art. is there.
  • Another object of the present invention is to provide a technique that can effectively change the display range of measurement values related to the vacuum processing after the vacuum processing and find a measurement value indicating the cause of the defect.
  • the inventors of the present invention have found that there are many cases where abnormalities are observed in measured values before the start of vacuum processing when defective products occur. In this case, in graphing the measured values in the normal observation range, even if the cause of the quality variation is known, the cause when there is a major change such as the occurrence of a defective product cannot be found. Even so, we have developed a technology that makes it easy to find measurements that indicate the cause of defects.
  • the present invention operates to vacuum-treat a processing object disposed in the vacuum chamber, and a plurality of processing devices that output an operation state signal indicating an operation state when operated, An operation that is a time at which the operation state signal is changed by operating a plurality of sensor devices that perform measurements associated with the vacuum processing and output the measured values, the processing device, and the sensor device.
  • a display device stored in the control device of a vacuum processing apparatus having a control device that stores the measurement value in correspondence with a change time, and stores the measurement value in correspondence with the measurement time at which the measurement value was measured,
  • the data analysis program is a time after the temporary display start time and the temporary display start time, with the operation change time of the processing device set in advance as the temporary display start time.
  • a display method capable of displaying the measurement value corresponding to the measurement time between display end times as a graph on a display device wherein the display method is configured to display the temporary display start time when a display change instruction is indicated.
  • a display method for displaying the measured value corresponding to the measurement time between the main display start time and the display end time as a graph on a display device, with the operation change time before the main display start time as a main display start time. is there.
  • the present invention is a display method in which the instruction to change the display is input from an input device connected to the arithmetic device.
  • the present invention is an operation change time output by the processing device other than the processing device that output the operation change time set to the temporary display start time, and is earlier than the temporary display start time, In this display method, the operation change time closest to the temporary display start time is set to the main display start time. Further, the present invention is an operation change time output by the processing device other than the processing device that output the operation change time set to the temporary display start time, A display method in which the operation change time closest to the temporary display start time among the operation change times of the operation state signal indicating the operation start before the temporary display start time is used as the main display start time. It is.
  • the present invention is an operation change time output by the processing device other than the processing device that output the operation change time set to the temporary display start time, A display method in which the operation change time closest to the temporary display start time among the operation change times of the operation state signal indicating operation stop before the temporary display start time is used as the main display start time. It is.
  • the present invention is also a display method in which the operation change time after the temporary display start time and the operation change time output by the desired processing device is set as the display end time.
  • Reference numeral 1 in FIG. 1 is an example of a vacuum processing apparatus according to the present invention, and includes one or more vacuum processing units 20 that perform vacuum processing on a film formation target.
  • the vacuum processing part 20 has the vacuum tank 11, and the vacuum processing of a process target object is carried out inside and outside the vacuum tank 11.
  • FIG. A processing device group 24 for performing the above is arranged.
  • the vacuum processing unit 20 includes a control device 21 that controls all or part of the processing equipment group 24 and a sensor group 23 that measures the pressure, temperature, and the like in the vacuum chamber 11.
  • the vacuum processing unit 20 is a vapor deposition apparatus, and the processing equipment group 24 includes a plurality of types.
  • the processing equipment group 24 is a vapor deposition source disposed on the bottom surface of the vacuum chamber 11.
  • EB electron beam
  • the processing equipment group 24 includes a processing equipment 36 that is an evacuation system, a processing equipment 37 that is a gas introduction system, a processing equipment 38 that is a power supply for a heater, and a deposition equipment.
  • a processing device 35 as a power source is also included.
  • Reference numeral 15 in FIG. 1 is a processing object made of a semiconductor substrate or a glass substrate, and is held by a processing device 31 that is a holding device in the vacuum chamber 11 with a film formation surface facing a processing device 34 that is a vapor deposition source. Yes.
  • the processing equipment 36 that is a vacuum exhaust system and the processing equipment 37 that is a gas introduction system are connected to the vacuum chamber 11, and the processing equipment 36 that is a vacuum exhaust system is operated to evacuate the inside of the vacuum chamber 11. it can.
  • the processing equipment 37 that is a gas introduction system can be operated to introduce a gas such as a reactive gas into the vacuum chamber 11 from the processing equipment 37 that is a gas introduction system.
  • the processing device 38 which is a power source for heater and the processing device 35 which is a power source for vapor deposition are connected to the processing device 32 which is a heater and the processing device 33 which is an EB gun, respectively.
  • the processing device 35 serving as a power source supplies power to the processing device 32 serving as a heater and the processing device 33 serving as an EB gun, respectively, in a state controlled by the control device 21.
  • the processing device 32 that is a heater generates heat with the supplied power, and the processing device 31 that is a holding device is heated to heat the processing object 15 in a vacuum atmosphere.
  • the processing equipment 33 which is an EB gun irradiates the processing equipment 34 which is a vapor deposition source with an electron beam with the supplied electric power, heats the vapor deposition material disposed in the processing equipment 34 which is the vapor deposition source, and Vapor of vapor deposition material is released in a vacuum atmosphere.
  • the sensor group 23 includes a sensor device 28 that is a temperature sensor that measures the temperature of the processing object 15, a sensor device 29 that is a vacuum gauge that measures the pressure inside the vacuum chamber 11, and the vapor release rate of the vapor deposition material. And a sensor device 30 that is a film thickness sensor.
  • the sensor group 23 also includes a sensor device that is an ammeter, a sensor device that is a voltmeter, a sensor device that is a thermometer, and the like provided in each of the processing devices 31 to 38 in the processing device group 24.
  • These sensor groups 23 measure physical quantities such as the temperature associated with the vacuum processing of the processing object 15, the pressure in the vacuum chamber 11, the EB current output from the processing device 33, which is an EB gun, and the amount of introduced gas. .
  • the measurement values, which are the results of these measurements, are output to the control device 21 in association with the time at which the measurement was performed.
  • the operating states of the processing devices 31 to 38 included in the processing device group 24 can be divided into two types, for example, operating and stopping operation, energizing and stopping energization, and conducting and interrupting. That is, the operating state can be represented by a binary operating state signal.
  • Each of the processing devices 31 to 38 included in the processing device group 24 associates a binary operation state signal that distinguishes two types of states with an operation change time that is a time when the value of the operation state signal changes. Output.
  • the operation state signal is changed from a value indicating operation stop or operation end to a value indicating operation in progress.
  • a change from middle or end to operation is a signal indicating the start of operation.
  • a high signal is output during operation
  • a low signal is output during operation stop
  • a change in the operation state signal from low to high is a signal indicating the start of operation.
  • a change in the operation state signal from high to low becomes an operation state signal indicating the end of the operation.
  • a sequencer 41 and a computer 40 are arranged in the control device 21, and the measurement value, measurement time, operation state signal, and operation change time input from the vacuum processing unit 20 are transmitted via the sequencer 41. Input to the computer 40.
  • the computer 40 includes an arithmetic device 42, a storage device 43, a display device 44, and an input device 46.
  • the storage device 43 stores the measurement value input to the computer 40 in association with the measurement time obtained by the measurement, and the operation state signal operates at the time when the operation state signal indicates a change. It is stored in association with the change time.
  • the sequencer 41 stores a procedure for operating the processing device group 24 and the sensor group 23 to perform vacuum processing, and the sequencer 41 follows the procedure from the processing device group 24 and the sensor of the vacuum processing unit 20 according to the procedure.
  • a control signal for performing vacuum processing while controlling the group 23 is output, and the vacuum processing of the processing object 15 carried into the vacuum chamber 11 is performed.
  • This control signal includes at least an operation instruction signal for starting an operation by designating an apparatus included in the processing device group 24, and a stop instruction signal for stopping an operation of the apparatus that has started the operation.
  • an operation state signal indicating the operation stop is output from the processing devices 31 to 38 in association with the operation change time.
  • the control signal is also output to the sensor devices included in the sensor group 23 (including the sensor devices not indicated by reference numerals 28 to 30), and the sensor devices are specified.
  • the sensor device specified for measurement is operated, and a physical quantity corresponding to the sensor device is measured to obtain a measurement value.
  • the measured value and the measurement time are associated with each other and output from the sensor device in the sensor group 23.
  • the output operation state signal, operation change time, measurement value, and measurement time are input to the computer 40 via the sequencer 41.
  • the storage device 43 and the input device 46 are connected to the arithmetic device 42, and a manufacturing process for continuously vacuuming a plurality of processing objects 15 is a processing start signal input to the sequencer 41 from a remote location. Alternatively, it is started by a processing start signal input from the input device 46 to the sequencer 41.
  • each processing device 31 to 38 is output from each processing device 31 to 38 together with the operation change time, and the measured value of the sensor device is also It is output together with the measurement time and stored in the storage device 43.
  • a large number of processing objects 15 to be processed in succession are grouped for each predetermined number, and each group is assigned a lot number for each group, and the measured value is obtained when the measured value is obtained. Are stored in association with the lot number on which the vacuum processing is performed.
  • the measured value is stored in the storage device 43 with a file name including a display for distinguishing the lot, such as a lot number and a lot name, and the processing object included in one lot. Even if there is an object to be vacuum processed in a different vacuum chamber, the vacuum chamber that has been vacuum processed can be distinguished from the stored contents, such as the number assigned to the vacuum processing, etc.
  • the stored contents include a display for distinguishing the vacuum processing and a display for distinguishing the type of the measured value.
  • this vacuum processing unit 20 a plurality of lots to be processed are vacuum processed, and the storage device 43 has a measured value of the vacuum processing of the plurality of lots, a measurement time corresponding to the measured value, and a control that controls the vacuum processing. Signal and the output time of the operation instruction signal and stop instruction signal included in the control signal are also stored, and the measurement value and measurement are measured from the storage device 43 by specifying the lot number, the type of vacuum processing, and the type of data. A timing chart related to time and measurement time can be extracted.
  • the storage device 43 stores a data analysis program for analyzing vacuum processing.
  • the data analysis program is activated to analyze the measurement values of a desired lot, vacuum processing, and type.
  • the measurement value to be analyzed here is the processing object processed by the same type of processing equipment 31 to 38, but is the measurement result of the vacuum processing of the processing object of different lots, and the analysis is the physical quantity of the same type. It becomes a comparison.
  • the time at which the processing devices 31 to 38 start operation and the time at which the operation is stopped may be obtained from the stored operation change time. It may be obtained from the output time of the operation instruction signal that specifies 31 to 38 and instructed the operation and the output time of the stop instruction signal.
  • the computer 40 can display an image of a predetermined content on the screen 50 of the display device 44 even in a state where the connection with the sequencer 41 is interrupted, and the computer 40 is located at a position remote from the storage device 43. Even so, it is only necessary to read the storage contents of the storage device 43.
  • the data analysis program has a function of causing the arithmetic unit 42 to operate and displaying the measured values in a graph on the screen 50.
  • the data analysis program is one of the processing devices 31 to 38 in the processing device group 24. Then, a predetermined operation change time of the processing device is searched in the storage device 43, and the operation change time indicating the operation start is set as a temporary display start time. Then, a time after the temporary display start time, for example, an operation change time indicating the end of the operation is set as the temporary display end time. Next, the measurement values included in the range from the temporary display start time to the temporary display end time are displayed as a graph on the screen 50 by the calculation of the calculation device 42.
  • the operation change time of the operation state signal indicating the start of EB release of the processing device 33 that is an EB gun can be set as the temporary display start time. It is also possible to set the output time of the start instruction signal for instructing the start of the temporary display start time.
  • the operation change time indicating the end of electron emission is set as the temporary display end time.
  • the storage device 43 stores a plurality of types of measurement values such as temperature, pressure, and current value.
  • the data analysis program designates specific types of measurement values using the input device 46, and The data analysis program can display the specified measurement values on the screen 50 as a graph.
  • the image displayed on the screen 50 is provided with a graph display area 58 and a timing chart display area 59.
  • the data analysis program displays the X axis extending in the horizontal direction on the screen 50 and the Y axis extending in the vertical direction perpendicular to the X axis in the graph display area 58, and the temporary display start time on the X axis. And a position different from the position where the X-axis and the Y-axis cross each other is set as a temporary display start time position that is zero on the X-axis.
  • the temporary display start time is set to a position on the right side of the position on the screen 50 where the X axis and the Y axis intersect.
  • the position on the X axis of the temporary display end time is to the right of the position of the temporary display start time, and the relationship between the distance on the X axis on the screen 50 and the time depends on the position displayed on the screen 50. Determined. Then, among the measurement values whose measurement time is located between the temporary display start time and the temporary display end time, a specified type of measurement value (here, pressure) is extracted from the stored content.
  • a specified type of measurement value here, pressure
  • the position of the extracted measurement value on the X axis is determined by the measurement time corresponding to each measurement value. Calculation to determine the position of the measured value on the Y-axis is made from the measured value, and the position on the X-axis and the position on the Y-axis are determined by the measurement time and the measured value (pressure). The position of each measurement value on the screen 50 is determined. A graph is displayed by connecting the positions of the measured values whose positions are determined with a curve (including a straight line) and displaying the curve.
  • the X axis of the timing chart display area 59 is different from the X axis of the graph display area 58 in the height direction of the screen 50, but is at the same position in the horizontal direction, and is stored in the storage device 43 together with the measured value.
  • the value of the operation instruction signal between the temporary display start time and the temporary display end time is on the X axis of the timing chart display area 59 based on the operation change time. Determine the position and display.
  • the contents of the operation state signal are high and low, and high and low are indicated by horizontal line segments, and high is a horizontal line segment located above the screen 50 from low, and the operation change time is high. And the horizontal line segment end portions of the row are connected by vertical line segments, and a timing chart is formed and displayed.
  • the graph display area 58 displays a graph 48 composed of two curves L 11 , L 21 , the X axis, and the Y axis, each of which is obtained by connecting the measurement values of the two lots for each lot. Has been.
  • a timing chart display area 59 a timing chart 51 1 indicating the operation state of the apparatus for determining the temporary display start time, a timing chart 52 1 indicating the operation state of the other apparatus, and the X axis are displayed.
  • the operation state signal of the processing device that determines the temporary display start time is such that the operation change time that is the time of the rising portion 61 is set as the temporary display start time, and the time of the falling portion 62 is A certain operation change time is set as the temporary display end time.
  • “0” is displayed below the position of the temporary display start time
  • 60 (60 minutes) is displayed below the position of the temporary display end time.
  • the data analysis program can also display a timing chart of another device in the timing chart area 59.
  • the high signal 63 is output between the temporary display start time and the temporary display end time. It is displayed timing chart 52 1 indicating.
  • Curves L 11 and L 21 in FIG. 2 show substantially the same curve shape, but the difference in the characteristic values between the processing objects 15 is still large as a result of completing the vacuum processing step of the vacuum processing unit 20.
  • an instruction such as inputting a predetermined character string is input to the data analysis program by the input device 46 such as a keyboard.
  • the redisplay of the graph can be instructed.
  • the data analysis program first searches the operation state signals of the processing devices 31 to 38 included in the processing device group 24, and detects the operation change time before the temporary display start time. To do.
  • the operation change time is set as the main display start time.
  • the operation state signal having the operation change time closest to the temporary display start time is extracted, and the operation change time is set as the main display start time.
  • the operation change time closest to the desired time such as the second operation change time or the third operation change time can also be adopted.
  • the relationship between the distance on the screen 50 of the X axis and the time is reset so that the main display start time and the temporary display end time are included in the time indicated by the X axis on the screen 50, and the graph display area 58, the X-axis of the timing chart display area 59, the X-axis position, and the numerical value that correlates the time are displayed again.
  • the positions of the main display start time and the temporary display end time of both X-axes are the same on the horizontal direction of the screen 50.
  • a measured value having a measurement time between the main display start time and the temporary end time is extracted from the selected types of measurement values, and a curve L 11 is displayed with the temporary display start time as the display start time.
  • L 21 was deleted, and the curves L 11 and L 21 created from the measured values were redisplayed. Redisplayed as a timing chart 51 1 indicating the operating state of the apparatus that determines the display start time and a timing chart 52 1 indicating the operating state of the other apparatus.
  • Reference numeral 49 in FIG. 3 indicates a graph of the re-displayed curves L 11 and L 21 .
  • the length of the X-axis on the screen 50 is the same, but the time associated with the X-axis is long, and the time from the main display start time to the temporary display end time is illustrated. Is assigned to the X-axis of the same length as 2. The time at the position “0” on the X axis is the temporary display start time.
  • the value of the operation state signal between the main display start time and the temporary display end time is displayed, and the timing of the operation state signal of the processing apparatus displayed before the redisplay is displayed.
  • an operation state signal of the processing apparatus whose operation change time is the main display start time is also displayed as a timing chart 53, and the pulses included in the timing chart 53 are displayed as the main display start time. It can be seen that the operation change time from the low state to the high state of the signal 64 is detected.
  • the zero position of the X axis is the temporary display time, and the operation change time set as the main display start time is the position of the time before that (here, the position of the time 15 minutes before zero), Between the main display start time and the temporary display start time, a separation is recognized between the displayed measured value curves L 12 and L 22 . It can be seen that the state before the provisional display start time is the cause of the difference in the characteristics of the processing target 15 after the process is completed.
  • the temporary display end time is set as the display end time.
  • the temporary display end time is also later than the temporary display end time and is not a processing device that outputs an operation state signal including the temporary display end time.
  • the processing change time of the operation state signal of the processing equipment is set as the main display end time, and the measured values measured at the measurement time between the main display start time and the main display end time are graphed and displayed on the screen 50. be able to.
  • the operation change time of the operation state signal indicating the start of operation is set as the main display time.
  • the main display time may be selected from the operation change time of the operation state signal indicating the operation stop. You may select from the operation time of both operation state signals which show operation start and operation stop.

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  • Engineering & Computer Science (AREA)
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Abstract

Provided is a technology capable of effectively changing the display area of vacuum-processed measured values. When processing in a vacuum tank an object to be processed, a preliminarily determined operation changing time changed by the operation of a processing device is defined as a temporary display time and the a stored measured value is graphically displayed on a screen from the temporary display time. When no effective information is obtained, if among other operation changing times of the processing device, an operation changing time prior to the temporary display time is defined as the display start time, and curved lines (L12, L22) connecting the measured values are displayed, then the causes of defects and so forth, which could not be found in the measured values after the temporary display start position, can be found.

Description

グラフの特定期間の切り出し方法How to cut out a specific period of a graph
　本発明は、真空処理装置の技術分野に係り、特に、真空処理装置を用いた量産工程の測定値を有効にグラフ化して分析できる技術に関する。 The present invention relates to a technical field of a vacuum processing apparatus, and more particularly to a technique capable of effectively graphing and analyzing a measurement value of a mass production process using the vacuum processing apparatus.
　真空処理技術は、スパッタリング方法、ＣＶＤ方法、蒸着方法等の成膜技術や、エッチング技術、表面改質技術、不純物注入技術、真空乾燥技術等があり、半導体装置、液晶表示装置等の他、食品分野や自動車工業にも用いられている。 Vacuum processing techniques include film formation techniques such as sputtering, CVD, and vapor deposition, etching techniques, surface modification techniques, impurity implantation techniques, vacuum drying techniques, etc. In addition to semiconductor devices, liquid crystal display devices, etc., food It is also used in the field and the automobile industry.
　真空処理技術によって同一品種の製品を量産する場合、同一規格の処理対象物に同じ真空処理を行うことが普通であるが、その工程が終了した仕掛品や製品には、品質のバラツキが発生することがある。 When mass-producing products of the same product type using vacuum processing technology, it is common to perform the same vacuum processing on the processing object of the same standard, but there is a variation in quality of work-in-process products and products that have completed the process. Sometimes.
　品質のバラツキが発生した原因を調査する場合や、バラツキが不良品を発生させないように製造工程を管理する場合は、動作中の真空処理装置から得られる物理量をセンサ装置によって測定し、測定結果をロット間で比較、検証することが行われる。 When investigating the cause of quality variation or managing the manufacturing process so that the variation does not cause defective products, the physical quantity obtained from the operating vacuum processing device is measured by the sensor device, and the measurement result is obtained. Comparison and verification between lots are performed.
　特に、真空処理装置内の処理機器の動作電流量、処理中の雰囲気の温度、雰囲気の圧力等の物理量の差違をロット間や真空処理装置間で定量的に確認しようとする場合は、製造工程中にセンサ装置によって種々の物理量を測定して測定値を記憶しておき、後で、コンピュータによって測定値をグラフ化し、その形の比較を行っていた。 In particular, if you want to quantitatively check the difference in physical quantities such as the operating current amount of processing equipment in the vacuum processing equipment, the temperature of the atmosphere during processing, the pressure of the atmosphere, etc. between lots or between vacuum processing equipment, the manufacturing process Various physical quantities were measured by the sensor device and the measured values were memorized, and later, the measured values were graphed by a computer and their shapes were compared.
　しかしながら、真空処理装置内に配置され、測定対象となる処理機器の数が増加し、また、測定したい物理量の種類も増え、大量の測定値をグラフ化して一緒に画面上に表示して比較することは困難になっている。 However, the number of processing equipment that is placed in the vacuum processing equipment increases and the number of physical quantities to be measured also increases, and a large amount of measured values are graphed and displayed together on the screen for comparison. It has become difficult.
　ところで、品質管理に於いて、真空処理の開始から終了までの工程のうち特性に影響を与えた処理装置の動作を見たところ、日常の品質管理のために見ていた範囲には、その処理装置の動作内容を示す異常な測定値は含まれておらず、通常の品質管理の手法では、異常値は発見できず、大きな不良の原因を特定することができないことが分かった。 By the way, in quality control, when we looked at the operation of the processing equipment that affected the characteristics of the process from the start to the end of vacuum processing, the range we saw for daily quality control was that processing. Abnormal measured values indicating the operation contents of the apparatus are not included, and it has been found that the normal quality control method cannot find abnormal values and cannot identify the cause of a large defect.
　むしろ、通常観察している時刻範囲ではなく、意外な時刻範囲に属する時刻の測定値に異常が認められることがあり、その測定値を見れば、特性のバラツキなどの原因ばかりでなく、不良発生の原因も分かるようになる。 Rather, there may be anomalies in the measured values in the unexpected time range, not the time range that is normally observed, and the measured values may not only cause variations in characteristics but also cause defects. The cause of will be understood.
　従って、日常管理が必要な範囲の測定値をグラフ化して比較することは重要ではあるが、多量の測定値から、異常がある測定値を見つけ易くすることも重要であり、そのような異常で有効な測定値を簡単に発見できる技術が求められている。 Therefore, it is important to compare and measure the measured values in the range that requires daily management, but it is also important to make it easy to find the abnormal measured value from a large amount of measured values. There is a need for a technology that can easily find effective measurements.
特開２００９－８０８４４号公報JP 2009-80844 A
　本発明の課題は、上記従来技術の問題点を解決するために、多種多量の測定値から、不良発生の原因を示す測定値を含む範囲を簡単、正確にグラフ化する技術を提供することにある。
　また、真空処理を行った後、その真空処理に関する測定値の表示範囲を有効に変え、不良の原因を示す測定値を発見できる技術を提供することにある。 An object of the present invention is to provide a technique for easily and accurately graphing a range including a measurement value indicating the cause of occurrence of a defect from a large number of measurement values in order to solve the above-described problems of the prior art. is there.
Another object of the present invention is to provide a technique that can effectively change the display range of measurement values related to the vacuum processing after the vacuum processing and find a measurement value indicating the cause of the defect.
　本発明の発明者等は、不良品が発生する場合等には、真空処理開始前の測定値に異常が認められることが多いことを発見した。
　この場合、通常の観察範囲の測定値のグラフ化では、品質のバラツキ原因は分かっても、不良品の発生等、大きな変化があったときの原因を見つけられないため、真空処理を開始する前であっても、不良の原因を示す測定値を簡単に発見できる技術を開発した。 The inventors of the present invention have found that there are many cases where abnormalities are observed in measured values before the start of vacuum processing when defective products occur.
In this case, in graphing the measured values in the normal observation range, even if the cause of the quality variation is known, the cause when there is a major change such as the occurrence of a defective product cannot be found. Even so, we have developed a technology that makes it easy to find measurements that indicate the cause of defects.
　即ち、本発明は、真空槽と、前記真空槽内に配置された処理対象物を真空処理するために動作し、動作したときの動作状態を示す動作状態信号を出力する複数の処理機器と、前記真空処理に伴う測定を行い、測定した測定値を出力する複数のセンサ装置と、前記処理機器と前記センサ装置とを動作させ、前記動作状態信号を前記動作状態信号が変化した時刻である動作変化時刻と対応させ、前記測定値を、前記測定値が測定された測定時刻と対応させて記憶する制御装置と、を有する真空処理装置の、前記制御装置内に記憶された表示方法であり、前記データ分析プログラムは、前記処理機器のうち、予め設定された前記処理機器の前記動作変化時刻を仮表示開始時刻として、前記仮表示開始時刻と、前記仮表示開始時刻よりも後の時刻である表示終了時刻の間の前記測定時刻に対応する前記測定値を表示装置上にグラフ化して表示できる表示方法であって、前記表示方法は、表示変更の指示が示されると、前記仮表示開始時刻よりも前の前記動作変化時刻を本表示開始時刻とし、前記本表示開始時刻と前記表示終了時刻の間の前記測定時刻に対応する前記測定値を表示装置上にグラフ化して表示する表示方法である。
　また、本発明は、表示変更の前記指示は、演算装置に接続された入力装置から入力される表示方法である。
  また、本発明は、前記仮表示開始時刻に設定された前記動作変化時刻を出力した前記処理機器以外の前記処理機器が出力した動作変化時刻であって、前記仮表示開始時刻よりも前の、前記仮表示開始時刻に最も近い時刻の前記動作変化時刻を前記本表示開始時刻にする表示方法である。
　また、本発明は、前記仮表示開始時刻に設定された前記動作変化時刻を出力した前記処理機器以外の前記処理機器が出力した動作変化時刻であって、
　前記仮表示開始時刻よりも前の、動作開始を示す前記動作状態信号の前記動作変化時刻のうち、前記仮表示開始時刻に最も近い時刻の前記動作変化時刻を前記本表示開始時刻にする表示方法である。
　また、本発明は、前記仮表示開始時刻に設定された前記動作変化時刻を出力した前記処理機器以外の前記処理機器が出力した動作変化時刻であって、
　前記仮表示開始時刻よりも前の、動作停止を示す前記動作状態信号の前記動作変化時刻のうち、前記仮表示開始時刻に最も近い時刻の前記動作変化時刻を前記本表示開始時刻にする表示方法である。
　また、本発明は、前記仮表示開始時刻よりも後の前記動作変化時刻であって、所望の前記処理機器が出力した動作変化時刻を前記表示終了時刻にする表示方法である。 That is, the present invention operates to vacuum-treat a processing object disposed in the vacuum chamber, and a plurality of processing devices that output an operation state signal indicating an operation state when operated, An operation that is a time at which the operation state signal is changed by operating a plurality of sensor devices that perform measurements associated with the vacuum processing and output the measured values, the processing device, and the sensor device. A display device stored in the control device of a vacuum processing apparatus having a control device that stores the measurement value in correspondence with a change time, and stores the measurement value in correspondence with the measurement time at which the measurement value was measured, The data analysis program is a time after the temporary display start time and the temporary display start time, with the operation change time of the processing device set in advance as the temporary display start time. A display method capable of displaying the measurement value corresponding to the measurement time between display end times as a graph on a display device, wherein the display method is configured to display the temporary display start time when a display change instruction is indicated. A display method for displaying the measured value corresponding to the measurement time between the main display start time and the display end time as a graph on a display device, with the operation change time before the main display start time as a main display start time. is there.
Further, the present invention is a display method in which the instruction to change the display is input from an input device connected to the arithmetic device.
Further, the present invention is an operation change time output by the processing device other than the processing device that output the operation change time set to the temporary display start time, and is earlier than the temporary display start time, In this display method, the operation change time closest to the temporary display start time is set to the main display start time.
Further, the present invention is an operation change time output by the processing device other than the processing device that output the operation change time set to the temporary display start time,
A display method in which the operation change time closest to the temporary display start time among the operation change times of the operation state signal indicating the operation start before the temporary display start time is used as the main display start time. It is.
Further, the present invention is an operation change time output by the processing device other than the processing device that output the operation change time set to the temporary display start time,
A display method in which the operation change time closest to the temporary display start time among the operation change times of the operation state signal indicating operation stop before the temporary display start time is used as the main display start time. It is.
The present invention is also a display method in which the operation change time after the temporary display start time and the operation change time output by the desired processing device is set as the display end time.
　真空処理を行った測定値の所望の部分を抽出してグラフ化でき、一旦表示したグラフを表示する時刻の範囲を有効に異ならせて再表示できるので、真空処理間の分析や比較を容易に行うことができる。
　制御信号に基づいて抽出することができるので、比較するグラフデータの作業の時刻を一致させやすい。 Extraction and graphing of the desired portion of the measured values after vacuum processing is possible, and the time range for displaying the graph once displayed can be effectively changed and displayed again, making it easy to analyze and compare between vacuum processing It can be carried out.
Since it can extract based on a control signal, it is easy to make the work time of the graph data to compare compare.
　画面上で見ながら抽出できるので制御信号中のノイズを見ることができ、ノイズによる誤った抽出を防止することができる。
　また、抽出した測定値によるグラフの所望のものを移動できるので、ピーク位置などを同じＸ座標に位置させて正確にグラフを重ね合わせて分析することができる。 Since extraction can be performed while viewing on the screen, noise in the control signal can be seen, and erroneous extraction due to noise can be prevented.
In addition, since the desired graph can be moved based on the extracted measurement values, it is possible to accurately superimpose and analyze the graph by placing the peak position at the same X coordinate.
本発明の真空処理装置を説明するためのブロック図The block diagram for demonstrating the vacuum processing apparatus of this invention 本発明のデータ分析プログラムによる表示を説明するための表示装置の画面(１)Screen of display device for explaining display by data analysis program of the present invention (1) 本発明のデータ分析プログラムによる表示を説明するための表示装置の画面(２)Screen of display device for explaining display by data analysis program of the present invention (2)
　図１の符号１は、本発明の真空処理装置の一例であり、成膜対象物に対して真空処理を行う一乃至複数の真空処理部２０を有している。
　ここでは一台の真空処理部２０を有しているものとして説明すると、真空処理部２０は、真空槽１１を有しており、真空槽１１の内部と外部には、処理対象物の真空処理を行う処理機器群２４が配置されている。
　また、真空処理部２０には、処理機器群２４の全部又は一部を制御する制御装置２１と、真空槽１１内の圧力や温度等を測定するセンサ群２３とが配置されている。 Reference numeral 1 in FIG. 1 is an example of a vacuum processing apparatus according to the present invention, and includes one or more vacuum processing units 20 that perform vacuum processing on a film formation target.
Here, if it demonstrates as what has one vacuum processing part 20, the vacuum processing part 20 has the vacuum tank 11, and the vacuum processing of a process target object is carried out inside and outside the vacuum tank 11. FIG. A processing device group 24 for performing the above is arranged.
The vacuum processing unit 20 includes a control device 21 that controls all or part of the processing equipment group 24 and a sensor group 23 that measures the pressure, temperature, and the like in the vacuum chamber 11.
　この例では、真空処理部２０は、蒸着装置であり、処理機器群２４は複数種類を含んでおり、ここでは、処理機器群２４には、真空槽１１の底面に配置された蒸着源である処理機器３４と、蒸着源である処理機器３４に電子線を照射するＥＢ(エレクトロンビーム)ガンである処理機器３３と、蒸着源である処理機器３４の上方に配置された保持装置である処理機器３１と、保持装置である処理機器３１の内部に配置されたヒータである処理機器３２とが含まれている。 In this example, the vacuum processing unit 20 is a vapor deposition apparatus, and the processing equipment group 24 includes a plurality of types. Here, the processing equipment group 24 is a vapor deposition source disposed on the bottom surface of the vacuum chamber 11. Processing equipment 34, processing equipment 33 that is an EB (electron beam) gun that irradiates the processing equipment 34 that is a vapor deposition source, and processing equipment that is a holding device disposed above the processing equipment 34 that is a vapor deposition source 31 and a processing device 32 that is a heater disposed inside the processing device 31 that is a holding device.
　また、処理機器群２４には、真空槽１１の外部に配置された真空排気系である処理機器３６と、ガス導入系である処理機器３７と、ヒータ用電源である処理機器３８と、蒸着用電源である処理機器３５とも含まれている。
　図１の符号１５は、半導体基板やガラス基板から成る処理対象物であり、成膜面を蒸着源である処理機器３４に向けて真空槽１１内の保持装置である処理機器３１に保持されている。 The processing equipment group 24 includes a processing equipment 36 that is an evacuation system, a processing equipment 37 that is a gas introduction system, a processing equipment 38 that is a power supply for a heater, and a deposition equipment. A processing device 35 as a power source is also included.
Reference numeral 15 in FIG. 1 is a processing object made of a semiconductor substrate or a glass substrate, and is held by a processing device 31 that is a holding device in the vacuum chamber 11 with a film formation surface facing a processing device 34 that is a vapor deposition source. Yes.
　真空排気系である処理機器３６とガス導入系である処理機器３７は真空槽１１に接続されており、真空排気系である処理機器３６を動作させて真空槽１１の内部を真空排気することができる。また、ガス導入系である処理機器３７を動作させて真空槽１１の内部にガス導入系である処理機器３７から反応性ガス等のガスを導入することができる。 The processing equipment 36 that is a vacuum exhaust system and the processing equipment 37 that is a gas introduction system are connected to the vacuum chamber 11, and the processing equipment 36 that is a vacuum exhaust system is operated to evacuate the inside of the vacuum chamber 11. it can. In addition, the processing equipment 37 that is a gas introduction system can be operated to introduce a gas such as a reactive gas into the vacuum chamber 11 from the processing equipment 37 that is a gas introduction system.
　ヒータ用電源である処理機器３８と蒸着用電源である処理機器３５は、ヒータである処理機器３２とＥＢガンである処理機器３３にそれぞれ接続されており、ヒータ用電源である処理機器３８と蒸着用電源である処理機器３５は、制御装置２１に制御された状態で、ヒータである処理機器３２とＥＢガンである処理機器３３にそれぞれ電力を供給する。
　ヒータである処理機器３２は供給された電力で発熱し、保持装置である処理機器３１を昇温させて真空雰囲気中で処理対象物１５を加熱する。 The processing device 38 which is a power source for heater and the processing device 35 which is a power source for vapor deposition are connected to the processing device 32 which is a heater and the processing device 33 which is an EB gun, respectively. The processing device 35 serving as a power source supplies power to the processing device 32 serving as a heater and the processing device 33 serving as an EB gun, respectively, in a state controlled by the control device 21.
The processing device 32 that is a heater generates heat with the supplied power, and the processing device 31 that is a holding device is heated to heat the processing object 15 in a vacuum atmosphere.
　ＥＢガンである処理機器３３は供給された電力で蒸着源である処理機器３４に電子ビームを照射し、蒸着源である処理機器３４内に配置された蒸着材料を加熱し、真空槽１１内の真空雰囲気中に蒸着材料の蒸気を放出させる。 The processing equipment 33 which is an EB gun irradiates the processing equipment 34 which is a vapor deposition source with an electron beam with the supplied electric power, heats the vapor deposition material disposed in the processing equipment 34 which is the vapor deposition source, and Vapor of vapor deposition material is released in a vacuum atmosphere.
　この蒸気は真空雰囲気や反応ガス雰囲気中で処理対象物１５に到達し、処理対象物１５の成膜面に薄膜を形成する。反応ガス雰囲気中で薄膜を形成すれば、反応性蒸着が行われることになる。
　センサ群２３には、処理対象物１５の温度を測定する温度センサであるセンサ装置２８や、真空槽１１内部の圧力を測定する真空計であるセンサ装置２９や、蒸着材料の蒸気放出速度を測定する膜厚センサであるセンサ装置３０とが含まれる。 This vapor reaches the processing object 15 in a vacuum atmosphere or a reaction gas atmosphere, and forms a thin film on the film forming surface of the processing object 15. If a thin film is formed in a reactive gas atmosphere, reactive vapor deposition is performed.
The sensor group 23 includes a sensor device 28 that is a temperature sensor that measures the temperature of the processing object 15, a sensor device 29 that is a vacuum gauge that measures the pressure inside the vacuum chamber 11, and the vapor release rate of the vapor deposition material. And a sensor device 30 that is a film thickness sensor.
　また、センサ群２３には、処理機器群２４内の各処理機器３１～３８に設けられた電流計であるセンサ装置、電圧計であるセンサ装置、温度計であるセンサ装置等も含まれており、それらセンサ群２３によって、処理対象物１５の真空処理に伴う温度、真空槽１１内の圧力、ＥＢガンである処理機器３３が出力するＥＢの電流、導入ガス量等の物理量の測定が行われる。それら測定の結果である測定値は、ここでは測定を行った時刻に関連づけて、制御装置２１に出力される。 The sensor group 23 also includes a sensor device that is an ammeter, a sensor device that is a voltmeter, a sensor device that is a thermometer, and the like provided in each of the processing devices 31 to 38 in the processing device group 24. These sensor groups 23 measure physical quantities such as the temperature associated with the vacuum processing of the processing object 15, the pressure in the vacuum chamber 11, the EB current output from the processing device 33, which is an EB gun, and the amount of introduced gas. . The measurement values, which are the results of these measurements, are output to the control device 21 in association with the time at which the measurement was performed.
　処理機器群２４に含まれる各処理機器３１～３８の動作状態は、例えば動作中と動作停止中、通電中と通電停止中、導通中と遮断中など、二種類の状態に分けることができる。即ち、動作状態は、二値の動作状態信号によって表すことができる。 The operating states of the processing devices 31 to 38 included in the processing device group 24 can be divided into two types, for example, operating and stopping operation, energizing and stopping energization, and conducting and interrupting. That is, the operating state can be represented by a binary operating state signal.
　処理機器群２４に含まれる各処理機器３１～３８は、二種類の状態を区別する二値の動作状態信号を、動作状態信号の値が変化したときの時刻である動作変化時刻と対応付けて出力している。 Each of the processing devices 31 to 38 included in the processing device group 24 associates a binary operation state signal that distinguishes two types of states with an operation change time that is a time when the value of the operation state signal changes. Output.
　例えば、動作停止の状態から、動作を開始するときには、動作状態信号は、動作停止中又は動作終了中を示す値から、動作中を示す値に変更されるから、動作状態信号の値の、停止中又は終了中から動作中への変化は、動作開始を示す信号になる。 For example, when the operation is started from the operation stop state, the operation state signal is changed from a value indicating operation stop or operation end to a value indicating operation in progress. A change from middle or end to operation is a signal indicating the start of operation.
　ここでは、動作中はハイ信号、動作停止中はロー信号が出力され、ローからハイへの動作状態信号の変化が動作開始を示す信号になっている。逆に、ハイからローへの動作状態信号の変化は、動作終了を示す動作状態信号になる。
　動作状態信号が変化した時刻を「動作変化時刻」とすると、動作変化時刻は計測され、動作状態信号は、動作変化時刻と共に制御装置２１に出力される。 Here, a high signal is output during operation, a low signal is output during operation stop, and a change in the operation state signal from low to high is a signal indicating the start of operation. Conversely, a change in the operation state signal from high to low becomes an operation state signal indicating the end of the operation.
When the time when the operation state signal changes is referred to as “operation change time”, the operation change time is measured, and the operation state signal is output to the control device 21 together with the operation change time.
　制御装置２１には、シーケンサ４１とコンピュータ４０とが配置されており、真空処理部２０から入力された測定値と、測定時刻と、動作状態信号と、動作変化時刻とは、シーケンサ４１を介してコンピュータ４０に入力される。 A sequencer 41 and a computer 40 are arranged in the control device 21, and the measurement value, measurement time, operation state signal, and operation change time input from the vacuum processing unit 20 are transmitted via the sequencer 41. Input to the computer 40.
　コンピュータ４０は、演算装置４２と、記憶装置４３と、表示装置４４と、入力装置４６とを有している。記憶装置４３には、コンピュータ４０に入力された測定値は、その測定値が測定によって得られた測定時刻と対応付けて記憶され、動作状態信号は、動作状態信号が変化を示した時刻が動作変化時刻と対応付けて記憶される。 The computer 40 includes an arithmetic device 42, a storage device 43, a display device 44, and an input device 46. The storage device 43 stores the measurement value input to the computer 40 in association with the measurement time obtained by the measurement, and the operation state signal operates at the time when the operation state signal indicates a change. It is stored in association with the change time.
　他方、シーケンサ４１には、処理機器群２４やセンサ群２３を動作させて真空処理を行う手順が記憶されており、その手順に従って、シーケンサ４１からは、真空処理部２０の処理機器群２４やセンサ群２３を制御しながら真空処理を行わせる制御信号が出力され、真空槽１１内に搬入された処理対象物１５の真空処理が行われる。 On the other hand, the sequencer 41 stores a procedure for operating the processing device group 24 and the sensor group 23 to perform vacuum processing, and the sequencer 41 follows the procedure from the processing device group 24 and the sensor of the vacuum processing unit 20 according to the procedure. A control signal for performing vacuum processing while controlling the group 23 is output, and the vacuum processing of the processing object 15 carried into the vacuum chamber 11 is performed.
　この制御信号には、処理機器群２４に含まれる装置を指定して動作を開始させる動作指示信号と、動作を開始させた装置の動作を停止させる停止指示信号とが少なくとも含まれており、真空処理の際に、処理機器３１～３８が動作指示信号に従って動作を開始すると、動作開始を示す動作状態信号の変化が発生し、動作変化時刻と対応付けて処理機器３１～３８から出力されることになる。 This control signal includes at least an operation instruction signal for starting an operation by designating an apparatus included in the processing device group 24, and a stop instruction signal for stopping an operation of the apparatus that has started the operation. During processing, when the processing devices 31 to 38 start operation according to the operation instruction signal, a change in the operation state signal indicating the start of operation occurs, and is output from the processing devices 31 to 38 in association with the operation change time. become.
　他方、処理機器３１～３８が停止指示信号に従って動作を停止すると、動作停止を示す動作状態信号が動作変化時刻と対応付けて処理機器３１～３８から出力される。
　また、制御信号はセンサ群２３に含まれるセンサ装置(符号２８～３０で示されたセンサ装置の他、符号を付されていないセンサ装置を含む)にも出力されており、センサ装置を特定して測定を行うことを求めることを示す制御信号が、各センサ装置に入力されると、測定を求めて特定されたセンサ装置が動作し、そのセンサ装置に対応する物理量が測定されて測定値が求められ、測定値と測定時刻とが対応付けられてセンサ群２３内のセンサ装置から出力される。 On the other hand, when the processing devices 31 to 38 stop operating according to the stop instruction signal, an operation state signal indicating the operation stop is output from the processing devices 31 to 38 in association with the operation change time.
Further, the control signal is also output to the sensor devices included in the sensor group 23 (including the sensor devices not indicated by reference numerals 28 to 30), and the sensor devices are specified. When a control signal indicating that measurement is requested is input to each sensor device, the sensor device specified for measurement is operated, and a physical quantity corresponding to the sensor device is measured to obtain a measurement value. The measured value and the measurement time are associated with each other and output from the sensor device in the sensor group 23.
　出力された動作状態信号及び動作変化時刻と、測定値及び測定時刻は、シーケンサ４１を介してコンピュータ４０に入力される。
　記憶装置４３と、入力装置４６とは演算装置４２に接続されており、複数枚数の処理対象物１５を連続して真空処理を行う製造工程は、遠隔地からシーケンサ４１に入力される処理開始信号や、入力装置４６からシーケンサ４１に入力される処理開始信号によって開始される。 The output operation state signal, operation change time, measurement value, and measurement time are input to the computer 40 via the sequencer 41.
The storage device 43 and the input device 46 are connected to the arithmetic device 42, and a manufacturing process for continuously vacuuming a plurality of processing objects 15 is a processing start signal input to the sequencer 41 from a remote location. Alternatively, it is started by a processing start signal input from the input device 46 to the sequencer 41.
　真空槽１１での一枚の処理対象物１５の真空処理が行われると、その処理対象物１５は真空槽１１の外部に搬出され、未処理の処理対象物が真空槽１１の内部に搬入され、処理対象物の真空処理が行われ、また、次の処理対象物が搬入されて真空処理が行われる。このように、複数枚数の処理対象物１５の真空処理が連続して行われるようになっている。 When a single processing object 15 is vacuum-processed in the vacuum chamber 11, the processing object 15 is carried out of the vacuum tank 11, and an unprocessed processing object is carried into the vacuum tank 11. Then, the vacuum processing of the processing object is performed, and the next processing target is carried in and the vacuum processing is performed. As described above, vacuum processing of a plurality of processing objects 15 is continuously performed.
　但し、真空槽１１内で処理対象物１５を真空処理していないときも、各処理機器３１～３８の動作状態は動作変化時刻と共に各処理機器３１～３８から出力され、センサ装置の測定値も測定時刻と共に出力され、記憶装置４３に記憶される。
　連続して処理される多数の処理対象物１５は、所定枚数ごとに一群にされ、各群には、それぞれ一群毎にロット番号が付与されており、測定値は、測定値が得られたときの真空処理を行ったロット番号と対応付けて記憶される。 However, even when the processing object 15 is not vacuum-processed in the vacuum chamber 11, the operation state of each processing device 31 to 38 is output from each processing device 31 to 38 together with the operation change time, and the measured value of the sensor device is also It is output together with the measurement time and stored in the storage device 43.
A large number of processing objects 15 to be processed in succession are grouped for each predetermined number, and each group is assigned a lot number for each group, and the measured value is obtained when the measured value is obtained. Are stored in association with the lot number on which the vacuum processing is performed.
　このように、測定値は、ロット番号やロット名称等、ロットを区別できる表示を含むファイル名称が付されて記憶装置４３内に記憶されており、また、一つのロット内に含まれる処理対象物であっても、異なる真空槽で真空処理が行われた処理対象物がある場合は、真空処理を行った真空槽を記憶内容から区別できるようになっており、真空処理に付される番号等の真空処理が区別できる表示や測定値の種類を区別できる表示も記憶内容に含まれている。 As described above, the measured value is stored in the storage device 43 with a file name including a display for distinguishing the lot, such as a lot number and a lot name, and the processing object included in one lot. Even if there is an object to be vacuum processed in a different vacuum chamber, the vacuum chamber that has been vacuum processed can be distinguished from the stored contents, such as the number assigned to the vacuum processing, etc. The stored contents include a display for distinguishing the vacuum processing and a display for distinguishing the type of the measured value.
　この真空処理部２０では、複数ロットの処理対象物の真空処理が行われ、記憶装置４３に複数ロットの真空処理の測定値と、測定値に対応した測定時刻と、その真空処理を制御した制御信号とが記憶され、制御信号に含まれる動作指示信号や停止指示信号の出力時刻も記憶されており、ロット番号、真空処理の種類、データの種類を指定して記憶装置４３から測定値と測定時刻、測定時刻に関連したタイミングチャートを抽出することができる。 In this vacuum processing unit 20, a plurality of lots to be processed are vacuum processed, and the storage device 43 has a measured value of the vacuum processing of the plurality of lots, a measurement time corresponding to the measured value, and a control that controls the vacuum processing. Signal and the output time of the operation instruction signal and stop instruction signal included in the control signal are also stored, and the measurement value and measurement are measured from the storage device 43 by specifying the lot number, the type of vacuum processing, and the type of data. A timing chart related to time and measurement time can be extracted.
　次に、測定値を分析するための、コンピュータ４０のデータ分析プログラムについて説明する。
　記憶装置４３には、真空処理の分析を行うデータ分析プログラムが記憶されており、このデータ分析プログラムを起動し、所望のロット、真空処理、種類の測定値を分析する。 Next, a data analysis program of the computer 40 for analyzing measurement values will be described.
The storage device 43 stores a data analysis program for analyzing vacuum processing. The data analysis program is activated to analyze the measurement values of a desired lot, vacuum processing, and type.
　分析する測定値は、ここでは、同じ種類の処理機器３１～３８によって処理された処理対象物であるが、異なるロットの処理対象物の真空処理の測定結果であり、分析は、種類が同じ物理量の比較になる。ここでは、一台のセンサによる測定は一定時間間隔で行われているものとする。データ分析プログラムでは、処理装置３１～３８が動作を開始した時刻と動作を停止した時刻を、記憶された動作変化時刻から求めても良いし、制御信号に関する記憶のうち、制御装置２１が処理機器３１～３８を特定して動作を指示した動作指示信号の出力時刻と停止指示信号の出力時刻から求めても良い。 The measurement value to be analyzed here is the processing object processed by the same type of processing equipment 31 to 38, but is the measurement result of the vacuum processing of the processing object of different lots, and the analysis is the physical quantity of the same type. It becomes a comparison. Here, it is assumed that measurement by one sensor is performed at regular time intervals. In the data analysis program, the time at which the processing devices 31 to 38 start operation and the time at which the operation is stopped may be obtained from the stored operation change time. It may be obtained from the output time of the operation instruction signal that specifies 31 to 38 and instructed the operation and the output time of the stop instruction signal.
　図２の符号５０は、コンピュータ４０に接続された表示装置４４の画面を示している。コンピュータ４０は、シーケンサ４１との接続が遮断された状態でも、表示装置４４の画面５０上に所定内容の画像を表示することができ、また、記憶装置４３とは遠隔した位置に配置されたコンピュータであっても、記憶装置４３の記憶内容を読みとれればよい。 2 indicates a screen of the display device 44 connected to the computer 40. The computer 40 can display an image of a predetermined content on the screen 50 of the display device 44 even in a state where the connection with the sequencer 41 is interrupted, and the computer 40 is located at a position remote from the storage device 43. Even so, it is only necessary to read the storage contents of the storage device 43.
　データ分析プログラムは、演算装置４２を動作させて、測定値を画面５０上にグラフ化して表示させる機能を有しており、データ分析プログラムは、処理機器群２４内の処理機器３１～３８のうち、予め決められた処理機器の動作変化時刻を記憶装置４３で検索し、動作開始を示す動作変化時刻を仮表示開始時刻として設定する。
　そして、仮表示開始時刻よりも後の時刻、例えば動作終了を示す動作変化時刻を仮表示終了時刻として設定する。次いで、演算装置４２の演算により、測定時刻が、仮表示開始時刻以後、仮表示終了時刻までの範囲に含まれる測定値を、画面５０上にグラフにして表示する。 The data analysis program has a function of causing the arithmetic unit 42 to operate and displaying the measured values in a graph on the screen 50. The data analysis program is one of the processing devices 31 to 38 in the processing device group 24. Then, a predetermined operation change time of the processing device is searched in the storage device 43, and the operation change time indicating the operation start is set as a temporary display start time.
Then, a time after the temporary display start time, for example, an operation change time indicating the end of the operation is set as the temporary display end time. Next, the measurement values included in the range from the temporary display start time to the temporary display end time are displayed as a graph on the screen 50 by the calculation of the calculation device 42.
　本データ分析プログラム中では、例えば、ＥＢガンである処理機器３３のＥＢ放出開始を示す動作状態信号の動作変化時刻を仮表示開始時刻に設定することができるし、また、その処理機器３３の動作の開始を指示する開始指示信号の出力時刻を、仮表示開始時刻に設定することもできる。
　また、ここでは、電子放出終了を示す動作変化時刻を仮表示終了時刻に設定している。 In this data analysis program, for example, the operation change time of the operation state signal indicating the start of EB release of the processing device 33 that is an EB gun can be set as the temporary display start time. It is also possible to set the output time of the start instruction signal for instructing the start of the temporary display start time.
Here, the operation change time indicating the end of electron emission is set as the temporary display end time.
　記憶装置４３には、上述したように、温度、圧力、電流値などの複数種類の測定値が記憶されており、データ分析プログラムは、入力装置４６によって特定の種類の測定値を指定して、データ分析プログラムが指定された種類の測定値を画面５０上にグラフ化して表示することができる。
　グラフ表示を説明すると、画面５０に表示される画像には、グラフ表示領域５８とタイミングチャート表示領域５９が設けられている。 As described above, the storage device 43 stores a plurality of types of measurement values such as temperature, pressure, and current value. The data analysis program designates specific types of measurement values using the input device 46, and The data analysis program can display the specified measurement values on the screen 50 as a graph.
Explaining the graph display, the image displayed on the screen 50 is provided with a graph display area 58 and a timing chart display area 59.
　データ分析プログラムは、グラフ表示領域５８に、画面５０上で、水平方向に伸びるＸ軸と、Ｘ軸とは垂直な鉛直方向に伸びるＹ軸とを表示すると共に、仮表示開始時刻をＸ軸上の“０”(ゼロ)となる位置とし、Ｘ軸とＹ軸とが交差する位置とは異なる位置を、Ｘ軸上のゼロである仮表示開始時刻の位置とする。
　ここでは、仮表示開始時刻は、画面５０上のＸ軸とＹ軸とが交差する位置よりも右方の位置に設定した。
　仮表示終了時刻のＸ軸上の位置は、仮表示開始時刻の位置よりも右方であり、画面５０上に表示される位置によって、画面５０上のＸ軸上の距離と時間との関係が決まる。
　そして、仮表示開始時刻と仮表示終了時刻との間に測定時刻が位置する測定値のうち、指定された種類の測定値(ここでは圧力)を記憶内容から抽出する。 The data analysis program displays the X axis extending in the horizontal direction on the screen 50 and the Y axis extending in the vertical direction perpendicular to the X axis in the graph display area 58, and the temporary display start time on the X axis. And a position different from the position where the X-axis and the Y-axis cross each other is set as a temporary display start time position that is zero on the X-axis.
Here, the temporary display start time is set to a position on the right side of the position on the screen 50 where the X axis and the Y axis intersect.
The position on the X axis of the temporary display end time is to the right of the position of the temporary display start time, and the relationship between the distance on the X axis on the screen 50 and the time depends on the position displayed on the screen 50. Determined.
Then, among the measurement values whose measurement time is located between the temporary display start time and the temporary display end time, a specified type of measurement value (here, pressure) is extracted from the stored content.
　抽出した測定値は、各測定値に対応した測定時刻によってＸ軸上の位置が決まる。
　測定値の値から測定値のＹ軸上の位置が決定される計算が成され、測定時刻と測定値の値(圧力)によって、Ｘ軸上の位置とＹ軸上の位置とが決められることで各測定値の画面５０上の位置が決められる。
　位置を決めされた測定値の位置間を曲線(直線も含む)で結んで曲線が表示されることで、グラフ表示が行われる。 The position of the extracted measurement value on the X axis is determined by the measurement time corresponding to each measurement value.
Calculation to determine the position of the measured value on the Y-axis is made from the measured value, and the position on the X-axis and the position on the Y-axis are determined by the measurement time and the measured value (pressure). The position of each measurement value on the screen 50 is determined.
A graph is displayed by connecting the positions of the measured values whose positions are determined with a curve (including a straight line) and displaying the curve.
　タイミングチャート表示領域５９のＸ軸は、グラフ表示領域５８のＸ軸と、画面５０の高さ方向の位置は異なるが、横方向上では同じ位置にあり、測定値と共に記憶装置４３に記憶され、指定された処理機器３１～３８の動作状態信号のうち、仮表示開始時刻と仮表示終了時刻の間の動作指示信号の値は、動作変化時刻に基づいて、タイミングチャート表示領域５９のＸ軸上に位置を決めて表示する。 The X axis of the timing chart display area 59 is different from the X axis of the graph display area 58 in the height direction of the screen 50, but is at the same position in the horizontal direction, and is stored in the storage device 43 together with the measured value. Among the operation state signals of the designated processing devices 31 to 38, the value of the operation instruction signal between the temporary display start time and the temporary display end time is on the X axis of the timing chart display area 59 based on the operation change time. Determine the position and display.
　ここでは動作状態信号の内容はハイとローであり、ハイとローは横線分で示されており、ハイがローよりも画面５０の上方に位置する横線分とされ、また、動作変化時刻のハイとローの横線分端部は、縦線分で結ばれてタイミングチャートが構成されて表示されている。 Here, the contents of the operation state signal are high and low, and high and low are indicated by horizontal line segments, and high is a horizontal line segment located above the screen 50 from low, and the operation change time is high. And the horizontal line segment end portions of the row are connected by vertical line segments, and a timing chart is formed and displayed.
　図２では、グラフ表示領域５８には、二個のロットの測定値がロット毎にそれぞれ結ばれた二本の曲線Ｌ11、Ｌ21と、Ｘ軸と、Ｙ軸とから成るグラフ４８が表示されている。タイミングチャート表示領域５９には、仮表示開始時刻を決定する装置の動作状態を示すタイミングチャート５１1と、他の装置の動作状態を示すタイミングチャート５２1と、Ｘ軸とが表示されている。 In FIG. 2, the graph display area 58 displays a graph 48 composed of two curves L 11 , L 21 , the X axis, and the Y axis, each of which is obtained by connecting the measurement values of the two lots for each lot. Has been. In the timing chart display area 59, a timing chart 51 1 indicating the operation state of the apparatus for determining the temporary display start time, a timing chart 52 1 indicating the operation state of the other apparatus, and the X axis are displayed.
　これらのグラフ上では、仮表示開始時刻を決定する処理機器の動作状態信号は、その立上り部分６１の時刻である動作変化時刻が仮表示開始時刻に設定されており、立下り部分６２の時刻である動作変化時刻が仮表示終了時刻に設定されている。Ｘ軸上では、仮表示開始時刻の位置の下に“０”が表示され、仮表示終了時刻の位置の下に６０(６０分)が表示されている。 On these graphs, the operation state signal of the processing device that determines the temporary display start time is such that the operation change time that is the time of the rising portion 61 is set as the temporary display start time, and the time of the falling portion 62 is A certain operation change time is set as the temporary display end time. On the X axis, “0” is displayed below the position of the temporary display start time, and 60 (60 minutes) is displayed below the position of the temporary display end time.
　データ分析プログラムは、更に他の装置のタイミングチャートをタイミングチャート領域５９に表示することも可能であり、ここでは、仮表示開始時刻と仮表示終了時刻の間に、ハイ信号６３が出力されたことを示すタイミングチャート５２1が表示されている。 The data analysis program can also display a timing chart of another device in the timing chart area 59. Here, the high signal 63 is output between the temporary display start time and the temporary display end time. It is displayed timing chart 52 1 indicating.
　図２の曲線Ｌ11、Ｌ21は、ほぼ同様の曲線形状を示しているが、それでも、この真空処理部２０の真空処理工程を終了した結果、処理対象物１５同士の特性値の差が大きい場合がある。その場合、本発明を用いると、特性値の大きな差の原因を判明させるために、キーボード等の入力装置４６によって例えば所定の文字列を入力する等の指示を入力することで、データ分析プログラムにグラフの再表示を指示することができる。
　データ分析プログラムは、その指示がされると、先ず、処理機器群２４に含まれる各処理機器３１～３８の動作状態信号を検索し、仮表示開始時刻よりも前の時刻の動作変化時刻を検出する。 Curves L 11 and L 21 in FIG. 2 show substantially the same curve shape, but the difference in the characteristic values between the processing objects 15 is still large as a result of completing the vacuum processing step of the vacuum processing unit 20. There is a case. In this case, when the present invention is used, in order to determine the cause of the large difference in the characteristic value, an instruction such as inputting a predetermined character string is input to the data analysis program by the input device 46 such as a keyboard. The redisplay of the graph can be instructed.
When instructed to do so, the data analysis program first searches the operation state signals of the processing devices 31 to 38 included in the processing device group 24, and detects the operation change time before the temporary display start time. To do.
　ここでは、仮表示開始時刻よりも前の時刻に、動作開始を示す動作状態信号が複数出力されたことを検出しており、それらの動作状態信号のうち、所望の動作変化時刻を抽出し、その動作変化時刻を本表示開始時刻として設定する。
　ここでは、最も仮表示開始時刻に一番近い動作変化時刻を有する動作状態信号を抽出し、その動作変化時刻を本表示開始時刻として設定した。二番目に近い動作変化時刻や、三番目に近い動作変化時刻など所望番目に近い動作変化時刻でも採用することができる。
　そして、本表示開始時刻と仮表示終了時刻とが、画面５０上のＸ軸で示す時刻に含まれるように、Ｘ軸の画面５０上の距離と時間との関係を設定し直し、グラフ表示領域５８のＸ軸とタイミングチャート表示領域５９のＸ軸と、Ｘ軸の位置と時間とを対応させる数値を表示し直す。両方のＸ軸の本表示開始時刻の位置と仮表示終了時刻の位置は画面５０の横方向上で同じ位置にする。
　画面５０上には、選択した種類の測定値のうち、本表示開始時刻と仮終了時刻の間に測定時刻を有する測定値を抽出し、仮表示開始時刻を表示開始時刻として表示した曲線Ｌ11、Ｌ21は消去し、測定値から作成された曲線Ｌ11、Ｌ21を再表示した。
　本表示開始時刻を決定する装置の動作状態を示すタイミングチャート５１1と、他の装置の動作状態を示すタイミングチャート５２1として再表示する。 Here, it is detected that a plurality of operation state signals indicating operation start are output at a time prior to the temporary display start time, and a desired operation change time is extracted from these operation state signals, The operation change time is set as the main display start time.
Here, the operation state signal having the operation change time closest to the temporary display start time is extracted, and the operation change time is set as the main display start time. The operation change time closest to the desired time such as the second operation change time or the third operation change time can also be adopted.
Then, the relationship between the distance on the screen 50 of the X axis and the time is reset so that the main display start time and the temporary display end time are included in the time indicated by the X axis on the screen 50, and the graph display area 58, the X-axis of the timing chart display area 59, the X-axis position, and the numerical value that correlates the time are displayed again. The positions of the main display start time and the temporary display end time of both X-axes are the same on the horizontal direction of the screen 50.
On the screen 50, a measured value having a measurement time between the main display start time and the temporary end time is extracted from the selected types of measurement values, and a curve L 11 is displayed with the temporary display start time as the display start time. , L 21 was deleted, and the curves L 11 and L 21 created from the measured values were redisplayed.
Redisplayed as a timing chart 51 1 indicating the operating state of the apparatus that determines the display start time and a timing chart 52 1 indicating the operating state of the other apparatus.
　図３の符号４９は、再表示を行った曲線Ｌ11、Ｌ21のグラフを示している。
　ここでは、Ｘ軸の画面５０上での長さは同じであるが、Ｘ軸上に対応付けられた時間は長時間になっており、本表示開始時刻から仮表示終了時刻までの時間が図２と同じ長さのＸ軸に割り振られている。Ｘ軸上の“０”の位置の時刻は、仮表示開始時刻である。 Reference numeral 49 in FIG. 3 indicates a graph of the re-displayed curves L 11 and L 21 .
Here, the length of the X-axis on the screen 50 is the same, but the time associated with the X-axis is long, and the time from the main display start time to the temporary display end time is illustrated. Is assigned to the X-axis of the same length as 2. The time at the position “0” on the X axis is the temporary display start time.
　そして、タイミングチャート表示領域５９には、本表示開始時刻から仮表示終了時刻の間の動作状態信号の値が表示されており、再表示前にも表示されていた処理装置の動作状態信号のタイミングチャート５１1、５２1に加え、動作変化時刻が本表示開始時刻とされた処理装置の動作状態信号もタイミングチャート５３として表示しており、本表示開始時刻として、このタイミングチャート５３に含まれるパルス状の信号６４のローからハイに転じた動作変化時刻が検出されたことが分かる。 In the timing chart display area 59, the value of the operation state signal between the main display start time and the temporary display end time is displayed, and the timing of the operation state signal of the processing apparatus displayed before the redisplay is displayed. In addition to the charts 51 1 and 52 1 , an operation state signal of the processing apparatus whose operation change time is the main display start time is also displayed as a timing chart 53, and the pulses included in the timing chart 53 are displayed as the main display start time. It can be seen that the operation change time from the low state to the high state of the signal 64 is detected.
　Ｘ軸のゼロの位置は仮表示時刻であり、本表示開始時刻にされた動作変化時刻は、それよりも前の時刻の位置(ここでは、ゼロの１５分前の時刻の位置)であり、本表示開始時刻から仮表示開始時刻までの間に、表示された測定値の曲線Ｌ12、Ｌ22間に離間が認められる。仮表示開始時刻よりも前の状態が、工程が終了した処理対象物１５の特性の差の原因になっていることが分かる。 The zero position of the X axis is the temporary display time, and the operation change time set as the main display start time is the position of the time before that (here, the position of the time 15 minutes before zero), Between the main display start time and the temporary display start time, a separation is recognized between the displayed measured value curves L 12 and L 22 . It can be seen that the state before the provisional display start time is the cause of the difference in the characteristics of the processing target 15 after the process is completed.
　本例では、仮表示終了時刻を表示終了時刻にしていたが、仮表示終了時刻についても、仮表示終了時刻よりも後であって、仮表示終了時刻を含む動作状態信号を出力した処理機器以外の処理機器の動作状態信号の動作変化時刻を本表示終了時刻にして、本表示開始時刻と、本表示終了時刻の間の測定時刻に測定された測定値をグラフ化して画面５０上に表示することができる。
　本例では、動作開始を示す動作状態信号の動作変化時刻を本表示時刻にしたが、動作停止を示す動作状態信号の動作変化時刻から選択して本表示時刻にしてもよい。動作開始と動作停止を示す両方の動作状態信号の動作時刻から選択しても良い。 In this example, the temporary display end time is set as the display end time. However, the temporary display end time is also later than the temporary display end time and is not a processing device that outputs an operation state signal including the temporary display end time. The processing change time of the operation state signal of the processing equipment is set as the main display end time, and the measured values measured at the measurement time between the main display start time and the main display end time are graphed and displayed on the screen 50. be able to.
In this example, the operation change time of the operation state signal indicating the start of operation is set as the main display time. However, the main display time may be selected from the operation change time of the operation state signal indicating the operation stop. You may select from the operation time of both operation state signals which show operation start and operation stop.
１……真空処理装置
１１……真空槽
１５……処理対象物
２０……真空処理部
２１……制御装置
２３……センサ群
２４……処理機器群
３１～３８……処理機器
４０……コンピュータ
４２……演算装置
４３……記憶装置
４４……表示装置
  DESCRIPTION OF SYMBOLS 1 ... Vacuum processing apparatus 11 ... Vacuum tank 15 ... Process target 20 ... Vacuum processing part 21 ... Control apparatus 23 ... Sensor group 24 ... Processing equipment group 31-38 ... Processing equipment 40 ... Computer 42 …… Calculation device 43 …… Storage device 44 …… Display device

Claims (6)

  1. 　真空槽と、前記真空槽内に配置された処理対象物を真空処理するために動作し、動作したときの動作状態を示す動作状態信号を出力する複数の処理機器と、
    　前記真空処理に伴う測定を行い、測定した測定値を出力する複数のセンサ装置と、
    　前記処理機器と前記センサ装置とを動作させ、前記動作状態信号を前記動作状態信号が変化した時刻である動作変化時刻と対応させ、前記測定値を、前記測定値が測定された測定時刻と対応させて記憶する制御装置と、
    　を有する真空処理装置の、前記制御装置内に記憶された表示方法であり、
    　前記データ分析プログラムは、前記処理機器のうち、予め設定された前記処理機器の前記動作変化時刻を仮表示開始時刻として、
    　前記仮表示開始時刻と、前記仮表示開始時刻よりも後の時刻である表示終了時刻の間の前記測定時刻に対応する前記測定値を表示装置上にグラフ化して表示できる表示方法であって、
    　前記表示方法は、表示変更の指示が示されると、前記仮表示開始時刻よりも前の前記動作変化時刻を本表示開始時刻とし、
    　前記本表示開始時刻と前記表示終了時刻の間の前記測定時刻に対応する前記測定値を表示装置上にグラフ化して表示する表示方法。     A plurality of processing devices that operate to vacuum-treat a processing object disposed in the vacuum chamber and output an operation state signal indicating an operation state when the vacuum chamber is operated;
    A plurality of sensor devices that perform measurements associated with the vacuum processing and output the measured values;
    The processing device and the sensor device are operated, the operation state signal is associated with an operation change time that is a time when the operation state signal is changed, and the measurement value is associated with a measurement time when the measurement value is measured. A control device for storing and
    A display method stored in the control device of the vacuum processing apparatus,
    The data analysis program uses, as the temporary display start time, the operation change time of the processing device set in advance among the processing devices.
    The display method can display the measurement value corresponding to the measurement time between the temporary display start time and the display end time which is a time later than the temporary display start time on a display device,
    In the display method, when an instruction to change display is indicated, the operation change time before the temporary display start time is set as the main display start time,
    A display method in which the measurement value corresponding to the measurement time between the main display start time and the display end time is displayed as a graph on a display device.
  2. 　表示変更の前記指示は、演算装置に接続された入力装置から入力される請求項１記載の表示方法。 The display method according to claim 1, wherein the instruction to change the display is input from an input device connected to the arithmetic device.
  3. 　前記仮表示開始時刻に設定された前記動作変化時刻を出力した前記処理機器以外の前記処理機器が出力した動作変化時刻であって、
    　前記仮表示開始時刻よりも前の、前記仮表示開始時刻に最も近い時刻の前記動作変化時刻を前記本表示開始時刻にする請求項１又は２のいずれか１項記載の表示方法。     The operation change time output by the processing device other than the processing device that output the operation change time set as the temporary display start time,
    3. The display method according to claim 1, wherein the operation change time at a time closest to the temporary display start time before the temporary display start time is set as the main display start time.
  4. 　前記仮表示開始時刻に設定された前記動作変化時刻を出力した前記処理機器以外の前記処理機器が出力した動作変化時刻であって、
    　前記仮表示開始時刻よりも前の、動作開始を示す前記動作状態信号の前記動作変化時刻のうち、前記仮表示開始時刻に最も近い時刻の前記動作変化時刻を前記本表示開始時刻にする請求項１又は２のいずれか１項記載の表示方法。     The operation change time output by the processing device other than the processing device that output the operation change time set as the temporary display start time,
    The operation change time closest to the temporary display start time among the operation change times of the operation state signal indicating the operation start before the temporary display start time is set as the main display start time. The display method according to any one of 1 and 2.
  5. 　前記仮表示開始時刻に設定された前記動作変化時刻を出力した前記処理機器以外の前記処理機器が出力した動作変化時刻であって、
    　前記仮表示開始時刻よりも前の、動作停止を示す前記動作状態信号の前記動作変化時刻のうち、前記仮表示開始時刻に最も近い時刻の前記動作変化時刻を前記本表示開始時刻にする請求項１又は２のいずれか１項記載の表示方法。     The operation change time output by the processing device other than the processing device that output the operation change time set as the temporary display start time,
    The operation change time closest to the temporary display start time among the operation change times of the operation state signal indicating operation stop before the temporary display start time is the main display start time. The display method according to any one of 1 and 2.
  6. 　前記仮表示開始時刻よりも後の前記動作変化時刻であって、所望の前記処理機器が出力した動作変化時刻を前記表示終了時刻にする請求項１記載の表示方法。 The display method according to claim 1, wherein the operation change time after the temporary display start time and the operation change time output by the desired processing device is set as the display end time.
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