WO2012030026A1 - Procédé de fabrication de carte à puce à processus de collage de puce amélioré - Google Patents

Procédé de fabrication de carte à puce à processus de collage de puce amélioré Download PDF

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Publication number
WO2012030026A1
WO2012030026A1 PCT/KR2010/009432 KR2010009432W WO2012030026A1 WO 2012030026 A1 WO2012030026 A1 WO 2012030026A1 KR 2010009432 W KR2010009432 W KR 2010009432W WO 2012030026 A1 WO2012030026 A1 WO 2012030026A1
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WO
WIPO (PCT)
Prior art keywords
antenna
heat transfer
smart card
sheet
heat
Prior art date
Application number
PCT/KR2010/009432
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English (en)
Korean (ko)
Inventor
진영범
김선희
노재승
류석훈
Original Assignee
금오공과대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 금오공과대학교 산학협력단 filed Critical 금오공과대학교 산학협력단
Publication of WO2012030026A1 publication Critical patent/WO2012030026A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Definitions

  • the present invention relates to a method for manufacturing a smart card, and more particularly, the appearance of the finished product by connecting the antenna terminal of the antenna coil and the connection terminal of the board through a conductive material using an indirect heat transmitted through the heat transfer path. It relates to a smart card manufacturing method improved chip bonding method that can reduce defects and increase product yield.
  • smart cards have a larger storage capacity and greater security than conventional magnetic cards due to the integrated IC chip equipped with microprocessor, operating system, security module, and memory for storage, operation, and security functions. It is used for various purposes.
  • smart cards are used for a variety of purposes such as credit cards, transportation cards and ID cards in addition to basic banking services.
  • the smart card also functions as an electronic money and pays the fees such as congestion tolls, parking lots and toll gates. It is used as.
  • the smart cards can be classified in various ways according to their classification criteria, but are classified into contact cards, contactless cards, and combination cards according to the manner in which the IC chip reads data from the cards.
  • the smart card 1 such as the contactless card and the combination card may include a first outer sheet 10, a module sheet 20, an antenna coil sheet 30, and a second outer sheet. 40 consists of one laminated board sequentially stacked.
  • the chip 51 constituting the COB modules 150 and 250 and 50 penetrates through the chip arrangement hole 22, and the antenna coil sheet 30 is formed in the COB module 150 and 250.
  • the board arrangement hole 32 is formed to penetrate so that the board 54 on which the chip 51 of the chip 51 is mounted is formed so that the antenna coil 31 is wired in a loop shape along the edge on one side thereof, and the connection terminal of the board
  • the 53 and the antenna terminal 34 on the antenna sheet are electrically connected to each other to manufacture a smart card.
  • induction electromotive force is generated in the antenna coil to activate the RF function of driving the chips of the COB modules 150 and 250, so that the information stored in the IC chip is not directly contacted with the outside of the card. It will be read by the reader.
  • connection terminal and the antenna terminal are connected by direct welding in order to electrically connect the connection terminal and the antenna terminal.
  • connection terminal In addition, in order to connect the connection terminal and the antenna terminal by welding, there is an inconvenience in that the wire is exposed to the outside after the insulation layer such as enamel coated on the antenna terminal is removed by welding.
  • the present invention reduces the appearance defects of the finished product by connecting the antenna terminal of the antenna coil and the connection terminal of the board through a conductive material using indirect heat transferred through the heat transfer path, product yield It is to provide a smart card manufacturing method improved chip bonding method to increase the.
  • the present invention provides a method of manufacturing a smart card including a COB module (150, 250) is mounted on a chip on the board connected to the heat transfer path having the first and second connection terminals on both sides.
  • a method of manufacturing an antenna sheet comprising: providing an antenna sheet having an antenna terminal at an end thereof and having antenna coils wired in a loop along one side edge and through which chip arrangement holes into which the chip is inserted are formed; Stacking conductive balls on the antenna terminals and inserting the chips into the chip placement holes such that the first and second connection terminals correspond to the conductive balls, respectively; Providing heat and pressure to the heat transfer path side with a heating rod such that the first and second connection terminals and the antenna terminal can be connected using indirect heat; Stacking a module sheet having a board placement hole through which the board is placed and formed on the antenna sheet; And stacking first and second outer sheets on the outer surfaces of the antenna sheet and the module sheet, respectively, wherein the heating rod provides heat to the heat transfer path in a range
  • the pressure may be 200 ⁇ 250g / cm2.
  • the conductive ball may be made to contain a weight ratio of Sn 96.5, Ag 3.0, Cu 0.5.
  • the heat transfer paths may have through holes formed in both sides of the board, respectively, and a heat conductive material may be filled in the through holes so as to be connected to the first and second connection terminals, respectively.
  • the heat transfer path may be coated with a thin layer having thermal conductivity so as to be connected to the first and second connection terminals, respectively.
  • the heat and pressure provided on the heat transfer path side of the heating rod may be sequentially provided so that any one of the first and second connection terminals is connected first and the other is connected later.
  • FIG. 1 is an exploded perspective view of a smart card manufactured by a smart card manufacturing method improving the chip bonding method according to the prior art.
  • Figure 2 is a longitudinal sectional view of a smart card manufactured according to the prior art.
  • Figure 3 is an exploded perspective view of a smart card manufactured according to the manufacturing method of the present invention.
  • 4 to 7 is a process flowchart of a smart card manufacturing method improved chip bonding method according to a first embodiment of the present invention.
  • FIG. 8 is a longitudinal sectional view of a smart card manufactured according to the first embodiment of the present invention.
  • 9 to 12 are process flowcharts of a smart card manufacturing method of improving a chip bonding method according to a second embodiment of the present invention.
  • FIG. 13 is a longitudinal sectional view of a smart card manufactured according to the second embodiment of the present invention.
  • Smart card manufacturing method improved the chip bonding method according to an embodiment of the present invention is an antenna coil via a conductive material using an indirect heat transmitted through the heat transfer path (154,254) as shown in Figure 3 to 13
  • the antenna terminal 134 of 132 and the connection terminals 153a and 153b of the boards 152 and 252 are connected to each other.
  • Smart cart manufacturing process according to an embodiment of the present invention, as shown in Figure 4 to 7 or 9 to 12, of the antenna terminal 134 and the COB module (150,250) wired to the antenna coil sheet 130
  • the COB modules 150 and 250 are mounted on the antenna coil sheet 130 so that the connection terminals 153a and 153b are electrically connected to each other via the conductive ball B.
  • the module sheet 120 and a pair of first It is carried out by the process of sequentially stacking the two outer sheets (110, 140), respectively.
  • COB modules 150 and 250 used in the smart card manufacturing process according to the present invention will be described.
  • the COB modules 150 and 250 in the present invention have a heating rod for connecting the first and second connection terminals 153a and 153b to the antenna terminal 134 via the conductive balls B.
  • the heat transfer paths 154 and 254 are provided on the boards 152 and 252 so that heat provided from the 160 may be indirectly transferred to the first and second connection terminals 153a and 153b.
  • the COB modules 150 and 250 used in the present invention include chips 151 and boards 152 and 252, and chips 151 are electrically connected to the boards 152 and 252.
  • first and second connection terminals 153a and 153b are provided at left and right sides of the lower surfaces of the boards 152 and 252 so that the boards 152 and 252 may be electrically connected to the antenna terminals 134.
  • first and second connection terminals 153a and 153b are connected to the first and second connections so that heat or electricity can be transferred from the upper surfaces of the boards 152 and 252 to the lower surfaces as shown in FIGS. 8 and 13.
  • the heat transfer paths 154 and 254 connected to the terminals 153a and 153b are provided.
  • the heat transfer path 154 is provided with through-holes formed on both sides of the board 152, and the material having thermal conductivity is filled in the through-holes.
  • the first and second connection terminals 153a and 153b are provided, respectively.
  • first and second connection terminals 153a and 153b respectively provided on the bottom surface of the board 252 by coating a thin layer of a material having thermal conductivity on both sides of the board 252.
  • the heat transfer paths 254 may be provided to be connected to each other.
  • the COB modules 150 and 250 used in the present invention include the first and second connection terminals 153a, in which heat provided from the heating rods 160 to the upper surfaces of the boards 152 and 252 is provided on the lower surfaces of the boards 152 and 252. 153b) are provided with heat transfer paths (154, 254) to be delivered to the side.
  • an antenna coil sheet 130 having a predetermined length of the antenna coil 132 wired in a loop along an edge thereof is provided.
  • the chip arrangement hole 136 having a shape similar to that of the chip 151 may be formed through the antenna coil sheet 130 so that the chips 151 constituting the COB modules 150 and 250 may be inserted into the antenna coil sheet 130.
  • the antenna terminal 134 provided at the end of the antenna coil 132 is disposed in the vicinity of the through area of the chip arrangement hole 136 rather than being disposed in the through area of the chip arrangement hole 136.
  • the antenna coil 132 includes a wire of copper material having a diameter of about 90 to 150 ⁇ m, and an insulating layer coated on the outer surface of the wire with a predetermined thickness, such antenna coil 132 is a card type And depending on the application, the number of antenna turns, line width and the total length of the wiring can be set.
  • the operation of electrically connecting the first and second connection terminals 153a and 153b of the COB modules 150 and 250 and the antenna terminal 134 of the antenna coil 132 to each other may provide a chip arrangement hole for the antenna terminal 134.
  • conductive conductive balls B having a conductivity are stacked on the antenna terminal 134.
  • the conductive ball (B) is preferably provided so that the weight ratio contains Sn 96.5, Ag 3.0, Cu 0.5.
  • the chips 151 of the COB modules 150 and 250 are positioned such that the first and second connection terminals 153a and 153b are positioned to correspond to the conductive terminals B and the antenna terminals 134 of the antenna coil 132.
  • the first and second connection terminals 153a and 153b are in contact with the conductive balls B by being inserted into the chip arrangement hole 136.
  • first and second connection terminals 153a and 153b may be connected to each other through the antenna terminal 134 and the conductive ball B.
  • the heating rods 160 may be used to form upper portions of the boards 152 and 252.
  • the heat transfer paths 154 and 254 exposed on both sides are pressurized.
  • the heating rod 160 is in contact with the heat transfer path (154,254) for about 1 to 2 seconds in a state heated to a temperature between 350 ⁇ 450 °C, the COB at a pressure of about 200 ⁇ 250g / cm2 Pressurize the modules 150 and 250.
  • the heating temperature of the heating rod is less than 350 °C the heat transfer to the conductive ball through the heat transfer path is not enough to reduce the bonding performance, if the temperature is above 450 °C flux is generated due to high temperature to lower the yield and reliability of the product Thrown away.
  • the heating rod 160 is transferred to the first and second connection terminals 153a and 153b through heat transfer paths 154 and 254 having thermal conductivity, and the conductive balls B are heated by the transferred heat.
  • the first and second connection terminals 153a and 153b are electrically connected to each other by being connected to the antenna terminal 134.
  • the insulating layer such as enamel coated on the outside of the antenna terminal 134 is removed together in the process of melting the conductive ball (B) by the high temperature heat transmitted through the heat transfer path (154,254).
  • the process of electrically connecting the connection terminal and the antenna terminal of the COB modules 150 and 250 in the process of electrically connecting the connection terminal and the antenna terminal of the COB modules 150 and 250, the process of scraping and removing the insulating layer so that the wire of the antenna terminal is exposed to the outside becomes unnecessary. .
  • the COB modules 150 and 250 may be damaged by the excessive heat generated instantaneously during the direct welding process, or the joint may be oxidized to remove impurities. There is no concern.
  • connection process for transferring heat and pressure to the conductive ball (B) side through the heat transfer paths (154,254) by contacting the heating rods 160 to one side of the board (152, 252) the first connection terminal (153a, 153b) And the second connection terminals 153a and 153b are sequentially made.
  • the heating rod 160 is pressurized to the upper side of the heat transfer passages 154 and 254 connected to the first connection terminal 153a and then heated to the upper side of the heat transfer passages 154 and 254 connected to the second connection terminal 153b. Pressurize through 160 or vice versa.
  • the antenna terminal 134 and the first and second connection terminals 153a and 153b are connected to the boards 152 and 252 of the COB modules 150 and 250 with the conductive balls B connected.
  • the board arrangement holes 122 stack the through-shaped module sheet 120 so that the boards 152 and 252 are inserted into the antenna coil sheet 130.
  • the antenna coil sheet 130 and the module sheet 120 are stacked up and down, and the COB modules 150 and 250 are stacked between the antenna coil sheet 130 and the module sheet 120.
  • the antenna terminals 134 are electrically connected to each other, and the other side surfaces of the boards 152 and 252 are exposed to the outside.
  • the pair of first and second outer sheets 110 and 140 may be provided with printing information such as a company logo, a pattern, or letters on an external exposure surface.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention porte sur un procédé de fabrication d'une carte à puce et, plus précisément, sur un procédé de fabrication d'une carte à puce à processus de collage de puce amélioré, ce qui peut réduire des défauts à l'extérieur du produit et peut augmenter un rendement de production par connexion d'une borne d'antenne d'une bobine d'antenne et d'une borne de connexion d'une carte par un matériau conducteur, à l'aide de la chaleur indirecte transmise par un trajet de transfert de chaleur. La présente invention porte sur le procédé de fabrication de la carte à puce comprenant un module COB dans lequel des puces sont montées sur la carte, une première et une seconde borne de connexion étant connectées au trajet de transfert de chaleur possédant une conductivité thermique sur ses deux côtés, ledit procédé comportant les étapes consistant : à agencer la bobine d'antenne sous la forme d'une boucle le long d'un bord d'un côté d'une feuille d'antenne en formant la borne d'antenne au niveau d'une partie d'extrémité et à créer des trous d'agencement de puce dans lesquels les puces sont introduites et agencées ; à stratifier des billes conductrices qui sont connectées de manière conductrice à la borne d'antenne et à introduire et agencer les puces dans les trous d'agencement de puce d'une manière telle que les première et seconde bornes conductrices correspondent aux billes conductrices ; à appliquer de la chaleur et une pression pour le trajet de transfert de chaleur à l'aide d'une barre chauffante, de telle sorte que les première et seconde bornes conductrices sont connectées à la borne d'antenne à l'aide de la chaleur indirecte ; à stratifier une feuille de module comportant un trou d'agencement de carte dans lequel la carte est introduite et agencée, sur la feuille d'antenne, et à stratifier une première et une seconde feuille externe sur des surfaces externes de la feuille d'antenne et de la feuille de module, respectivement, la barre chauffante fournissant la chaleur ayant une plage de températures allant de 350 à ~450°C pour le trajet de transfert de chaleur pendant 1 à 2 secondes.
PCT/KR2010/009432 2010-08-31 2010-12-28 Procédé de fabrication de carte à puce à processus de collage de puce amélioré WO2012030026A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0084767 2010-08-31
KR1020100084767A KR101008459B1 (ko) 2010-08-31 2010-08-31 칩본딩 방식을 개선한 스마트카드 제조방법

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WO2012030026A1 true WO2012030026A1 (fr) 2012-03-08

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Cited By (2)

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CN105117763A (zh) * 2015-08-14 2015-12-02 深圳市源明杰科技有限公司 智能卡及智能卡的制造方法
CN107706287A (zh) * 2017-09-29 2018-02-16 江西新月光电有限公司 Cob光源制作方法

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CN109088162B (zh) * 2018-08-17 2024-02-20 深圳市嘉姆特科技有限公司 散热及辐射兼用无线通信天线结构

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KR20030019481A (ko) * 2003-01-07 2003-03-06 주식회사 제이디씨텍 콤비형 아이씨 카드 및 그 제조 방법

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KR100848465B1 (ko) * 2007-12-03 2008-07-25 진영범 핫 에어를 이용한 와이어 도체 접속 장치

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Publication number Priority date Publication date Assignee Title
JP2000057304A (ja) * 1998-07-20 2000-02-25 St Microelectronics スマ―トカ―ド製造方法およびスマ―トカ―ド
JP2000182017A (ja) * 1998-12-18 2000-06-30 Dainippon Printing Co Ltd 接触型非接触型共用ｉｃカードおよびその製造方法
KR20030019481A (ko) * 2003-01-07 2003-03-06 주식회사 제이디씨텍 콤비형 아이씨 카드 및 그 제조 방법
KR20030019521A (ko) * 2003-02-06 2003-03-06 주식회사 제이디씨텍 납땜 방식에 의한 콤비형 아이씨 카드의 아이씨 칩 부착방법

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CN105117763A (zh) * 2015-08-14 2015-12-02 深圳市源明杰科技有限公司 智能卡及智能卡的制造方法
CN107706287A (zh) * 2017-09-29 2018-02-16 江西新月光电有限公司 Cob光源制作方法

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