WO2012005939A3 - Closed-loop control of cmp slurry flow - Google Patents

Closed-loop control of cmp slurry flow Download PDF

Info

Publication number
WO2012005939A3
WO2012005939A3 PCT/US2011/041255 US2011041255W WO2012005939A3 WO 2012005939 A3 WO2012005939 A3 WO 2012005939A3 US 2011041255 W US2011041255 W US 2011041255W WO 2012005939 A3 WO2012005939 A3 WO 2012005939A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
closed
loop control
slurry flow
cmp slurry
Prior art date
Application number
PCT/US2011/041255
Other languages
French (fr)
Other versions
WO2012005939A2 (en
Inventor
Gregory E. Menk
Stan D. Tsai
Sang J. Cho
Sivakumar Dhandapani
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020127021073A priority Critical patent/KR20130084596A/en
Priority to JP2013518467A priority patent/JP2013529560A/en
Priority to CN201180007344XA priority patent/CN102782815A/en
Publication of WO2012005939A2 publication Critical patent/WO2012005939A2/en
Publication of WO2012005939A3 publication Critical patent/WO2012005939A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include measuring the thickness of a polishing pad having grooves or other slurry transport features on a polishing surface. Once the depth of the grooves on the polishing surface is determined, a flow rate of a polishing slurry is adjusted in response to the determined groove depth. A predetermined number of substrates are polished on the polishing surface. The method can then optionally be repeated.
PCT/US2011/041255 2010-07-06 2011-06-21 Closed-loop control of cmp slurry flow WO2012005939A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020127021073A KR20130084596A (en) 2010-07-06 2011-06-21 Closed-loop control of cmp slurry flow
JP2013518467A JP2013529560A (en) 2010-07-06 2011-06-21 Closed loop control of CMP slurry flow
CN201180007344XA CN102782815A (en) 2010-07-06 2011-06-21 Closed-loop control of CMP slurry flow

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/831,153 US20120009847A1 (en) 2010-07-06 2010-07-06 Closed-loop control of cmp slurry flow
US12/831,153 2010-07-06

Publications (2)

Publication Number Publication Date
WO2012005939A2 WO2012005939A2 (en) 2012-01-12
WO2012005939A3 true WO2012005939A3 (en) 2012-04-05

Family

ID=45438931

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/041255 WO2012005939A2 (en) 2010-07-06 2011-06-21 Closed-loop control of cmp slurry flow

Country Status (6)

Country Link
US (1) US20120009847A1 (en)
JP (1) JP2013529560A (en)
KR (1) KR20130084596A (en)
CN (1) CN102782815A (en)
TW (1) TW201206634A (en)
WO (1) WO2012005939A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
US20140141696A1 (en) * 2012-11-21 2014-05-22 Applied Materials, Inc. Polishing System with In-Sequence Sensor
US9079287B2 (en) * 2013-03-12 2015-07-14 Macronix International Co., Ltd. CMP polishing pad detector and system
CN103223637B (en) * 2013-04-28 2016-06-01 上海华力微电子有限公司 Chemical-mechanical grinding device
US10189143B2 (en) 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
US11693435B2 (en) * 2020-06-25 2023-07-04 Applied Materials, Inc. Ethercat liquid flow controller communication for substrate processing systems
CN115091353B (en) * 2022-07-15 2022-11-08 华海清科股份有限公司 Polishing solution adjusting method and chemical mechanical polishing equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
JP2005340271A (en) * 2004-05-24 2005-12-08 Jsr Corp Pad for polishing chemical machine
JP2006517739A (en) * 2003-02-14 2006-07-27 株式会社ニコン Method for simulating slurry flow for grooved polishing pads
US20070184761A1 (en) * 2005-07-15 2007-08-09 Samsung Electronics Co., Ltd. Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
US6354910B1 (en) * 2000-01-31 2002-03-12 Agere Systems Guardian Corp. Apparatus and method for in-situ measurement of polishing pad thickness loss
US6684704B1 (en) * 2002-09-12 2004-02-03 Psiloquest, Inc. Measuring the surface properties of polishing pads using ultrasonic reflectance
EP1270148A1 (en) * 2001-06-22 2003-01-02 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for conditioning a polishing pad
US6702646B1 (en) * 2002-07-01 2004-03-09 Nevmet Corporation Method and apparatus for monitoring polishing plate condition
US7235488B2 (en) * 2002-08-28 2007-06-26 Micron Technology, Inc. In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
JP2009033038A (en) * 2007-07-30 2009-02-12 Elpida Memory Inc Cmp device, and wafer polishing method by cmp
US8257142B2 (en) * 2008-04-15 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
JP2006517739A (en) * 2003-02-14 2006-07-27 株式会社ニコン Method for simulating slurry flow for grooved polishing pads
JP2005340271A (en) * 2004-05-24 2005-12-08 Jsr Corp Pad for polishing chemical machine
US20070184761A1 (en) * 2005-07-15 2007-08-09 Samsung Electronics Co., Ltd. Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film

Also Published As

Publication number Publication date
US20120009847A1 (en) 2012-01-12
KR20130084596A (en) 2013-07-25
JP2013529560A (en) 2013-07-22
WO2012005939A2 (en) 2012-01-12
TW201206634A (en) 2012-02-16
CN102782815A (en) 2012-11-14

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