WO2011148896A1 - ポリシロキサン系組成物、硬化物、及び、光学デバイス - Google Patents
ポリシロキサン系組成物、硬化物、及び、光学デバイス Download PDFInfo
- Publication number
- WO2011148896A1 WO2011148896A1 PCT/JP2011/061757 JP2011061757W WO2011148896A1 WO 2011148896 A1 WO2011148896 A1 WO 2011148896A1 JP 2011061757 W JP2011061757 W JP 2011061757W WO 2011148896 A1 WO2011148896 A1 WO 2011148896A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- polysiloxane
- compound
- polyhedral
- integer
- Prior art date
Links
- -1 Polysiloxane Polymers 0.000 title claims abstract description 525
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 280
- 239000000203 mixture Substances 0.000 title claims abstract description 155
- 230000003287 optical effect Effects 0.000 title claims description 43
- 239000000463 material Substances 0.000 title description 32
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 80
- 150000001875 compounds Chemical class 0.000 claims abstract description 62
- 125000003118 aryl group Chemical group 0.000 claims abstract description 49
- 230000035699 permeability Effects 0.000 claims abstract description 26
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims abstract description 20
- 150000003961 organosilicon compounds Chemical class 0.000 claims abstract description 17
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 12
- 239000003054 catalyst Substances 0.000 claims description 25
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 21
- 239000011256 inorganic filler Substances 0.000 claims description 16
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 16
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 125000004429 atom Chemical group 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 abstract description 27
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 70
- 229910052697 platinum Inorganic materials 0.000 description 46
- 238000003756 stirring Methods 0.000 description 40
- 239000007789 gas Substances 0.000 description 33
- 238000004519 manufacturing process Methods 0.000 description 30
- 238000012360 testing method Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 26
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 26
- 239000010408 film Substances 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 24
- 238000011156 evaluation Methods 0.000 description 24
- 229920001577 copolymer Polymers 0.000 description 22
- 239000000243 solution Substances 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 21
- 238000001723 curing Methods 0.000 description 21
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 20
- 239000000565 sealant Substances 0.000 description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 17
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 17
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 17
- 238000010998 test method Methods 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 14
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 14
- 229920000435 poly(dimethylsiloxane) Chemical group 0.000 description 14
- 239000010970 precious metal Substances 0.000 description 14
- 239000008096 xylene Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000004205 dimethyl polysiloxane Chemical group 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical class O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 12
- 239000002245 particle Substances 0.000 description 11
- 238000001179 sorption measurement Methods 0.000 description 11
- CRPUJAZIXJMDBK-UHFFFAOYSA-N camphene Chemical compound C1CC2C(=C)C(C)(C)C1C2 CRPUJAZIXJMDBK-UHFFFAOYSA-N 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- 230000035939 shock Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 229910004298 SiO 2 Inorganic materials 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 8
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 7
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 7
- 125000003700 epoxy group Chemical group 0.000 description 7
- ODEXJPXBFISZCB-UHFFFAOYSA-N ethenyl-methyl-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=C)(C)C1=CC=CC=C1 ODEXJPXBFISZCB-UHFFFAOYSA-N 0.000 description 7
- 125000000524 functional group Chemical group 0.000 description 7
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- 229910000077 silane Inorganic materials 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 125000000962 organic group Chemical group 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- PXRCIOIWVGAZEP-UHFFFAOYSA-N Primaeres Camphenhydrat Natural products C1CC2C(O)(C)C(C)(C)C1C2 PXRCIOIWVGAZEP-UHFFFAOYSA-N 0.000 description 5
- 229930006739 camphene Natural products 0.000 description 5
- ZYPYEBYNXWUCEA-UHFFFAOYSA-N camphenilone Natural products C1CC2C(=O)C(C)(C)C1C2 ZYPYEBYNXWUCEA-UHFFFAOYSA-N 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 229910002012 Aerosil® Inorganic materials 0.000 description 4
- 239000002318 adhesion promoter Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 4
- 239000005357 flat glass Substances 0.000 description 4
- 229910021485 fumed silica Inorganic materials 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 125000005641 methacryl group Chemical group 0.000 description 4
- 230000002194 synthesizing effect Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000006267 biphenyl group Chemical group 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000002657 fibrous material Substances 0.000 description 3
- 230000003301 hydrolyzing effect Effects 0.000 description 3
- OKHRRIGNGQFVEE-UHFFFAOYSA-N methyl(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](C)C1=CC=CC=C1 OKHRRIGNGQFVEE-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- POPVULPQMGGUMJ-UHFFFAOYSA-N octasilsesquioxane cage Chemical compound O1[SiH](O[SiH](O2)O[SiH](O3)O4)O[SiH]4O[SiH]4O[SiH]1O[SiH]2O[SiH]3O4 POPVULPQMGGUMJ-UHFFFAOYSA-N 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 229920001843 polymethylhydrosiloxane Chemical group 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 2
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 2
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- VEJOYRPGKZZTJW-FDGPNNRMSA-N (z)-4-hydroxypent-3-en-2-one;platinum Chemical compound [Pt].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O VEJOYRPGKZZTJW-FDGPNNRMSA-N 0.000 description 2
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical group C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 229930006722 beta-pinene Natural products 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- DDJSWKLBKSLAAZ-UHFFFAOYSA-N cyclotetrasiloxane Chemical compound O1[SiH2]O[SiH2]O[SiH2]O[SiH2]1 DDJSWKLBKSLAAZ-UHFFFAOYSA-N 0.000 description 2
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 2
- OIKHZBFJHONJJB-UHFFFAOYSA-N dimethyl(phenyl)silicon Chemical compound C[Si](C)C1=CC=CC=C1 OIKHZBFJHONJJB-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- GCSJLQSCSDMKTP-UHFFFAOYSA-N ethenyl(trimethyl)silane Chemical compound C[Si](C)(C)C=C GCSJLQSCSDMKTP-UHFFFAOYSA-N 0.000 description 2
- OVOIHGSHJGMSMZ-UHFFFAOYSA-N ethenyl(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=C)C1=CC=CC=C1 OVOIHGSHJGMSMZ-UHFFFAOYSA-N 0.000 description 2
- QDEZCOQKJSRQNN-UHFFFAOYSA-N ethenyl-dimethyl-phenylsilane Chemical compound C=C[Si](C)(C)C1=CC=CC=C1 QDEZCOQKJSRQNN-UHFFFAOYSA-N 0.000 description 2
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 150000002898 organic sulfur compounds Chemical class 0.000 description 2
- 150000002903 organophosphorus compounds Chemical class 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 2
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 2
- WDUXKFKVDQRWJN-UHFFFAOYSA-N triethoxysilylmethyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C=C WDUXKFKVDQRWJN-UHFFFAOYSA-N 0.000 description 2
- AQRLNPVMDITEJU-UHFFFAOYSA-N triethylsilane Chemical compound CC[SiH](CC)CC AQRLNPVMDITEJU-UHFFFAOYSA-N 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 2
- JPPHEZSCZWYTOP-UHFFFAOYSA-N trimethoxysilylmethyl prop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C=C JPPHEZSCZWYTOP-UHFFFAOYSA-N 0.000 description 2
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 2
- AKQNYQDSIDKVJZ-UHFFFAOYSA-N triphenylsilane Chemical compound C1=CC=CC=C1[SiH](C=1C=CC=CC=1)C1=CC=CC=C1 AKQNYQDSIDKVJZ-UHFFFAOYSA-N 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- QMBIHWSWOASEFG-UHFFFAOYSA-N 2,2-diphenylethyl(ethenyl)silane Chemical compound C(=C)[SiH2]CC(C1=CC=CC=C1)C1=CC=CC=C1 QMBIHWSWOASEFG-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- OKFAYTDWPOEJQT-UHFFFAOYSA-N 2-ethenyladamantane Chemical compound C1C(C2)CC3CC1C(C=C)C2C3 OKFAYTDWPOEJQT-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- ZKASMXOELCEADR-UHFFFAOYSA-N 2-methyl-3-methylidenebicyclo[2.2.1]heptane Chemical compound C1CC2C(=C)C(C)C1C2 ZKASMXOELCEADR-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- JTCQPLINQYIRDZ-UHFFFAOYSA-N 2-methylideneadamantane Chemical compound C1C(C2)CC3CC1C(=C)C2C3 JTCQPLINQYIRDZ-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- ILVWSPCJQCSHJV-UHFFFAOYSA-N 3-ethenyl-2-methylbicyclo[2.2.1]heptane Chemical compound C1CC2C(C=C)C(C)C1C2 ILVWSPCJQCSHJV-UHFFFAOYSA-N 0.000 description 1
- PFUYSXSIHCSVJJ-UHFFFAOYSA-N 3-ethenylbicyclo[2.2.1]heptane Chemical compound C1CC2C(C=C)CC1C2 PFUYSXSIHCSVJJ-UHFFFAOYSA-N 0.000 description 1
- HTENSGOZPYEMCG-UHFFFAOYSA-N 3-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C(C)=CC1C2 HTENSGOZPYEMCG-UHFFFAOYSA-N 0.000 description 1
- AJQVASAUQUTVJK-UHFFFAOYSA-N 3-methylidenebicyclo[2.2.1]heptane Chemical compound C1CC2C(=C)CC1C2 AJQVASAUQUTVJK-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- 125000004860 4-ethylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004861 4-isopropyl phenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- RMDKEBZUCHXUER-UHFFFAOYSA-N 4-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C=CC1(C)C2 RMDKEBZUCHXUER-UHFFFAOYSA-N 0.000 description 1
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- SUEFRHDDZDWKFN-UHFFFAOYSA-N 6,6-dimethylbicyclo[3.1.1]hept-3-ene Chemical compound C1C2C(C)(C)C1CC=C2 SUEFRHDDZDWKFN-UHFFFAOYSA-N 0.000 description 1
- AVFRNNALLLVPGJ-UHFFFAOYSA-N 7-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C=CC1C2C AVFRNNALLLVPGJ-UHFFFAOYSA-N 0.000 description 1
- JSASFGPUXQDHEC-UHFFFAOYSA-N 7-methylidenebicyclo[2.2.1]heptane Chemical compound C1CC2CCC1C2=C JSASFGPUXQDHEC-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 241001212038 Arcola Species 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- IZAHJBLPVXVYTL-UHFFFAOYSA-N C1CC2CCC1C2C=C Chemical compound C1CC2CCC1C2C=C IZAHJBLPVXVYTL-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- PDSNLYSELAIEBU-UHFFFAOYSA-N Longifolene Chemical compound C1CCC(C)(C)C2C3CCC2C1(C)C3=C PDSNLYSELAIEBU-UHFFFAOYSA-N 0.000 description 1
- ZPUKHRHPJKNORC-UHFFFAOYSA-N Longifolene Natural products CC1(C)CCCC2(C)C3CCC1(C3)C2=C ZPUKHRHPJKNORC-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- UIEXFJVOIMVETD-UHFFFAOYSA-N P([O-])([O-])[O-].[Pt+3] Chemical compound P([O-])([O-])[O-].[Pt+3] UIEXFJVOIMVETD-UHFFFAOYSA-N 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- KVOZXXSUSRZIKD-UHFFFAOYSA-N Prop-2-enylcyclohexane Chemical compound C=CCC1CCCCC1 KVOZXXSUSRZIKD-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- YTEISYFNYGDBRV-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)oxy-dimethylsilyl]oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)(C)O[Si](C)C YTEISYFNYGDBRV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 230000029936 alkylation Effects 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- XSDCTSITJJJDPY-UHFFFAOYSA-N chloro-ethenyl-dimethylsilane Chemical compound C[Si](C)(Cl)C=C XSDCTSITJJJDPY-UHFFFAOYSA-N 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- QWVFZGVJZUJZGG-UHFFFAOYSA-N diethyl(phenyl)silicon Chemical compound CC[Si](CC)C1=CC=CC=C1 QWVFZGVJZUJZGG-UHFFFAOYSA-N 0.000 description 1
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 1
- SLQTWNAJXFHMHM-UHFFFAOYSA-N dimethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OC)OC)CCC2OC21 SLQTWNAJXFHMHM-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- VYKLWEGAUSVCDK-UHFFFAOYSA-N dimethyl-phenyl-prop-2-enylsilane Chemical compound C=CC[Si](C)(C)C1=CC=CC=C1 VYKLWEGAUSVCDK-UHFFFAOYSA-N 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- JOYVQDVIEOPSEE-UHFFFAOYSA-N ethenyl-diethyl-phenylsilane Chemical compound CC[Si](CC)(C=C)C1=CC=CC=C1 JOYVQDVIEOPSEE-UHFFFAOYSA-N 0.000 description 1
- MRRXLWNSVYPSRB-UHFFFAOYSA-N ethenyl-dimethyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C)C=C MRRXLWNSVYPSRB-UHFFFAOYSA-N 0.000 description 1
- PTOQCUYVGKZAFS-UHFFFAOYSA-N ethenylcycloheptane Chemical compound C=CC1CCCCCC1 PTOQCUYVGKZAFS-UHFFFAOYSA-N 0.000 description 1
- UPHVHMSLLBDZEV-UHFFFAOYSA-N ethenylcyclooctane Chemical compound C=CC1CCCCCCC1 UPHVHMSLLBDZEV-UHFFFAOYSA-N 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- MHNBACKYOQMSBS-UHFFFAOYSA-N ethoxy-ethyl-methyl-[1-(7-oxabicyclo[4.1.0]heptan-3-yl)ethoxy]silane Chemical compound O1C2CC(CCC21)C(C)O[Si](OCC)(C)CC MHNBACKYOQMSBS-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- KCWYOFZQRFCIIE-UHFFFAOYSA-N ethylsilane Chemical compound CC[SiH3] KCWYOFZQRFCIIE-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011656 manganese carbonate Substances 0.000 description 1
- 229940093474 manganese carbonate Drugs 0.000 description 1
- 235000006748 manganese carbonate Nutrition 0.000 description 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 1
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- OHZRFQFGSXWZPT-UHFFFAOYSA-N methyl-[3-(oxiran-2-ylmethoxy)propyl]-silylsilane Chemical compound C(C1CO1)OCCC[SiH]([SiH3])C OHZRFQFGSXWZPT-UHFFFAOYSA-N 0.000 description 1
- YULMNMJFAZWLLN-UHFFFAOYSA-N methylenecyclohexane Chemical compound C=C1CCCCC1 YULMNMJFAZWLLN-UHFFFAOYSA-N 0.000 description 1
- WPHGSKGZRAQSGP-UHFFFAOYSA-N methylenecyclohexane Natural products C1CCCC2CC21 WPHGSKGZRAQSGP-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- LDIPAUVCWRHLAM-UHFFFAOYSA-N n',n'-dibutylbutane-1,4-diamine Chemical compound CCCCN(CCCC)CCCCN LDIPAUVCWRHLAM-UHFFFAOYSA-N 0.000 description 1
- PWNDYKKNXVKQJO-UHFFFAOYSA-N n',n'-dibutylethane-1,2-diamine Chemical compound CCCCN(CCN)CCCC PWNDYKKNXVKQJO-UHFFFAOYSA-N 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- DIHKMUNUGQVFES-UHFFFAOYSA-N n,n,n',n'-tetraethylethane-1,2-diamine Chemical compound CCN(CC)CCN(CC)CC DIHKMUNUGQVFES-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical compound P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- PFDGXZLRRGWOKR-UHFFFAOYSA-N prop-2-enylcyclooctane Chemical compound C=CCC1CCCCCCC1 PFDGXZLRRGWOKR-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical group CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- 238000006227 trimethylsilylation reaction Methods 0.000 description 1
- DXJZZRSMGLGFPW-UHFFFAOYSA-N triphenyl(prop-2-enyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(CC=C)C1=CC=CC=C1 DXJZZRSMGLGFPW-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/008—Additives improving gas barrier properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/14—Gas barrier composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- the present invention relates to a polysiloxane composition having high heat resistance and light resistance and excellent gas barrier properties, and a cured product and an optical device using the polysiloxane composition.
- the polysiloxane composition is excellent in heat resistance, cold resistance, weather resistance, light resistance, chemical stability, electrical properties, flame resistance, water resistance, transparency, coloring, non-adhesiveness, and non-corrosion It is used in various industries. Among these, compositions composed of polysiloxanes having a polyhedral structure are known to exhibit even better heat resistance, light resistance, chemical stability, low dielectric properties, etc. due to their specific chemical structure. The application is expected.
- a polysiloxane having a polyhedral structure there is one intended to be used for an optical element sealing agent.
- a polysiloxane having a polyhedral structure containing two or more oxetanyl groups Disclosed is a polysiloxane composition having a polyhedral skeleton containing a resin, an aliphatic hydrocarbon containing one or more epoxy groups, and a cationic polymerization initiator. This material has high refraction and light extraction efficiency. high.
- the polysiloxane composition described here has an oxetanyl group or an epoxy group, it has low heat resistance and light resistance, and in particular, applications where high heat resistance and light resistance such as white LEDs are required. Use with was difficult.
- Patent Document 2 the problem of heat resistance and light resistance is improved by limiting the glass transition temperature of polyorganopolysiloxane having an epoxy group. Even after the impact test, cracks are unlikely to occur. However, it is still difficult to use in applications where high heat resistance and light resistance such as white LEDs are required, and the material is not satisfactory in crack resistance.
- the polysiloxane composition has excellent characteristics, but generally has a problem of low gas barrier properties. Therefore, when a polysiloxane composition having a low gas barrier property is used as a sealing material, there is a problem that the reflector is blackened by sulfides.
- a metal member is previously provided with a gas barrier property. The coating treatment is performed with a high acrylic resin, and then the sealing is performed with the silicone resin.
- the gas barrier property of the silicone resin itself used in the corresponding technology is low, and after coating with an acrylic resin, it takes a lot of work, such as sealing with a silicone resin, resulting in a problem in productivity.
- Patent Document 4 discloses a composition using a polysiloxane modified body having a polyhedral structure. This composition is excellent in molding processability, transparency, heat resistance / light resistance, and adhesiveness, and can be used as an optical sealant. However, there is still room for further improvement in gas barrier properties.
- JP 2008-163260 A JP 2007-169427 A JP 2009-206124 A WO08 / 010545
- the present inventors have completed a polysiloxane composition, a cured product, and an optical device having the following configuration.
- a polysiloxane composition containing Moisture permeability after curing is equal to or less than 30g / m 2 / 24h,
- the organopolysiloxane of the component (B) is an aryl group-containing organopolysiloxane (B1), and / or Further, as component (C), an organosilicon compound (C1) having one alkenyl group or hydrosilyl group in one molecule, or a cyclic olefin compound (C2) having one carbon-carbon double bond in one molecule
- a polysiloxane composition comprising:
- An alkenyl group-containing polyhedral polysiloxane compound (a) has the formula [AR 1 2 SiO—SiO 3/2 ] a [R 2 3 SiO—SiO 3/2 ] b (A + b is an integer of 6 to 24, a is an integer of 1 or more, b is 0 or an integer of 1 or more; A is an alkenyl group; R 1 is an alkyl group or an aryl group; R 2 is a hydrogen atom or an alkyl group , Aryl groups, or groups linked to other polyhedral skeleton polysiloxanes)
- the polysiloxane composition according to any one of (1) to (4), which is an alkenyl group-containing polyhedral polysiloxane compound composed of siloxane units represented by the formula:
- the modified polyhedral polysiloxane (A) has 2.5 to 20 hydrogen atoms directly bonded to Si atoms per alkenyl group of the polyhedral polysiloxane compound (a) containing alkenyl groups.
- the compound (b) according to any one of (1) to (5), which is obtained by adding an excess amount of the compound (b) having a hydrosilyl group within the range, and distilling off the compound (b) having an unreacted hydrosilyl group. Polysiloxane composition.
- the polyhedral polysiloxane modified product (A) is [XR 3 2 SiO—SiO 3/2 ] a [R 4 3 SiO—SiO 3/2 ] b
- a + b is an integer of 6 to 24, a is an integer of 1 or more, b is 0 or an integer of 1 or more;
- R 3 is an alkyl group or an aryl group;
- R 4 is an alkenyl group, a hydrogen atom, an alkyl group, an aryl group; Or a group linked to another polyhedral skeleton polysiloxane;
- X has a structure of either of the following general formula (1) or general formula (2), and when there are a plurality of X, The structure may be the same or different (L is an integer of 2 or more; m is an integer of 0 or more; n is an integer of 2 or more; Y is bonded to a polyhedral polysiloxane through a hydrogen atom, an alken
- Z may be the same or different; Z is a hydrogen atom, an alkenyl group, an alkyl group, an aryl group, or a site bonded to the polyhedral polysiloxane via an alkylene chain And may be the same or different, provided that at least one of Y or Z is a hydrogen atom))) as a structural unit) and the polysiloxane system according to any one of (1) to (7) Composition.
- the cyclic olefin compound (C2) has the formula C n H 2 (nx) (N is an integer of 4 to 20, x is an integer of 1 to 5, and nx is an integer of 3 or more)
- the polysiloxane system according to any one of (1) to (9) and (11) Composition.
- a cured product comprising the polysiloxane composition according to any one of (1) to (16).
- the maximum value of the loss tangent measured at a frequency of 10 Hz is at least one in the temperature range of ⁇ 40 ° C. to 50 ° C., and the storage elastic modulus is 10 MPa or less at 50 ° C. Cured product.
- An optical device comprising the polysiloxane composition according to any one of (1) to (16). (20) The optical device according to (19), comprising an optical element sealant formed using the polysiloxane composition.
- a polysiloxane-based composition having high heat resistance and light resistance and excellent gas barrier properties, and a cured product and an optical device using the polysiloxane-based composition can be provided.
- the polysiloxane composition of the present invention moisture permeability after curing is not more than 30g / m 2 / 24h.
- the moisture permeability is preferably not more than 20g / m 2 / 24h.
- the moisture permeability can be calculated according to the following method.
- a jig is prepared by fixing a 5 cm square polyisobutylene rubber sheet (3 mm thick, 3 cm square inside so as to be a square shape) on top of a 5 cm square plate glass (0.5 mm thick), 1 g of calcium chloride (for moisture measurement) manufactured by Wako Pure Chemical Industries, Ltd. is filled into a square shape and used as a test specimen. Further, a 5 cm square cured product for evaluation (2 mm thickness) is fixed on the upper part, and cured for 24 hours at a temperature of 40 ° C., humidity and 90% RH in a constant temperature and humidity machine (PR-2KP manufactured by ESPEC). The moisture permeability can be calculated according to the following formula.
- Moisture permeability (g / m 2 / 24h) [(total weight of specimen after moisture permeability test (g)) ⁇ (total weight of specimen before moisture permeability test (g))] ⁇ 10000/9 cm 2
- the polysiloxane composition of the present invention moisture permeability and less 30g / m 2 / 24h after curing, for good low moisture permeability, the polysiloxane composition, particularly useful as LED encapsulant is there.
- moisture permeability is less than 30g / m 2 / 24h, water, further, oxygen, are suppressed gas permeability, such as hydrogen sulfide, and silver lead frame in LED, corrosion of the reflector or the like is less likely to occur results, This is because the effect of improving the durability of the LED can be expected.
- alkenyl group-containing polyhedral polysiloxane compound (a) is not particularly limited as long as it is a polysiloxane having an alkenyl group in the molecule and having a polyhedral skeleton.
- alkenyl group examples include a vinyl group, an allyl group, a butenyl group, and a hexenyl group, and a vinyl group is preferable from the viewpoint of heat resistance and light resistance.
- R 1 is an alkyl group or an aryl group.
- the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a cyclohexyl group, and a cyclopentyl group.
- the aryl group include aryl groups such as a phenyl group and a tolyl group. Is done.
- R 1 in the present invention is preferably a methyl group from the viewpoint of heat resistance and light resistance.
- R 2 is a hydrogen atom, an alkyl group, an aryl group, or a group linked to another polyhedral skeleton polysiloxane.
- the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a cyclohexyl group, and a cyclopentyl group.
- the aryl group include aryl groups such as a phenyl group and a tolyl group. Is done.
- R 2 in the present invention is preferably a methyl group from the viewpoint of heat resistance and light resistance.
- the numerical value a is not particularly limited as long as it is an integer of 1 or more, but is preferably 2 or more, and more preferably 3 or more, from the handling property of the compound and the physical properties of the obtained cured product.
- the numerical value b is not particularly limited as long as it is 0 or an integer of 1 or more.
- a and b is preferably an integer of 6 to 24, and is 6 to 12, more preferably 6 to 10 from the viewpoint of the stability of the compound and the stability of the resulting cured product. Is preferred.
- the method for synthesizing the polyhedral polysiloxane (a) containing an alkenyl group is not particularly limited, and can be synthesized using a known method.
- a synthesis method for example, a silane of R 7 SiX a 3 (wherein R 7 represents R 5 and R 6 described above, and X a represents a hydrolyzable functional group such as a halogen atom or an alkoxy group).
- R 7 represents R 5 and R 6 described above
- X a represents a hydrolyzable functional group such as a halogen atom or an alkoxy group.
- a silicate having a polyhedral structure is obtained by a hydrolytic condensation reaction of tetraalkoxysilane, and the obtained silicate is further reacted with a silylating agent such as an alkenyl group-containing silyl chloride.
- a silylating agent such as an alkenyl group-containing silyl chloride.
- the compound having a hydrosilyl group used in the present invention is not particularly limited as long as it has one or more hydrosilyl groups in the molecule, but the obtained polyhedral polysiloxane modified product has transparency, heat resistance, and light resistance. From the viewpoint, it is preferably a siloxane compound having a hydrosilyl group, and more preferably a cyclic siloxane having a hydrosilyl group or a linear polysiloxane. These compounds having a hydrosilyl group may be used alone or in combination of two or more.
- Linear polysiloxanes containing hydrosilyl groups include copolymers of dimethylsiloxane units, methylhydrogensiloxane units, and terminal trimethylsiloxy units, and diphenylsiloxane units, methylhydrogensiloxane units, and terminal trimethylsiloxy units.
- Polymer copolymer of methylphenylsiloxane unit, methylhydrogensiloxane unit and terminal trimethylsiloxy unit, polydimethylsiloxane blocked with dimethylhydrogensilyl group, terminal blocked with dimethylhydrogensilyl group Examples thereof include polydiphenylsiloxane and polymethylphenylsiloxane whose end is blocked with a dimethylhydrogensilyl group.
- a linear polysiloxane containing a hydrosilyl group is a polysiloxane having a molecular end blocked with a dimethylhydrogensilyl group from the viewpoints of reactivity during modification, heat resistance and light resistance of the resulting cured product.
- Polysiloxane having a molecular end blocked with a dimethylhydrogensilyl group can be suitably used, and specific examples thereof include tetramethyldisiloxane and hexamethyltrisiloxane. .
- Cyclic siloxanes containing hydrosilyl groups include 1,3,5,7-tetrahydrogen-1,3,5,7-tetramethylcyclotetrasiloxane, 1-propyl-3,5,7-trihydrogen- 1,3,5,7-tetramethylcyclotetrasiloxane, 1,5-dihydrogen-3,7-dihexyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5-trihydro Gen-1,3,5-trimethylcyclosiloxane, 1,3,5,7,9-pentahydrogen-1,3,5,7,9-pentamethylcyclosiloxane, 1,3,5,7,9 , 11-hexahydrogen-1,3,5,7,9,11-hexamethylcyclosiloxane and the like.
- cyclic siloxane in the present invention specifically from the viewpoint of industrial availability and reactivity when modified, or heat resistance, light resistance, strength, etc. of the obtained cured product, for example, 1, 3, 5, 7-tetrahydrogen-1,3,5,7-tetramethylcyclotetrasiloxane can be preferably used.
- the Si atom is preferably composed of a hydrogen atom, a vinyl group and a methyl group.
- a hydrosilylation catalyst is used when the polyhedral polysiloxane modified product (A) is synthesized and the polysiloxane composition using the compound is cured.
- hydrosilylation catalyst used in the present invention a known hydrosilylation catalyst can be used, and there is no particular limitation.
- a platinum-olefin complex chloroplatinic acid, a simple substance of platinum, a carrier (alumina, silica, carbon black, etc.) supported on solid platinum; a platinum-vinylsiloxane complex such as Pt n ( ViMe 2 SiOSiMe 2 Vi) n , Pt [(MeViSiO) 4 ] m ; platinum-phosphine complex such as Pt (PPh 3 ) 4 , Pt (PBu 3 ) 4 ; platinum-phosphite complex such as Pt [P ( OPh) 3 ] 4 , Pt [P (OBu) 3 ] 4 (wherein Me represents a methyl group, Bu represents a butyl group, Vi represents a vinyl group, Ph represents a phenyl group, and n and m represent an integer), Pt (acac) 2, also platinum described in U.S.
- catalysts other than platinum compounds include RhCl (PPh 3 ) 3 , RhCl 3 , Rh / Al 2 O 3 , RuCl 3 , IrCl 3 , FeCl 3 , AlCl 3 , PdCl 2 .2H 2 O, NiCl 2. , TiCl 4 and the like. These catalysts may be used alone or in combination of two or more. From the viewpoint of catalytic activity, chloroplatinic acid, platinum-olefin complex, platinum-vinylsiloxane complex, Pt (acac) 2 and the like are preferable.
- the modified polyhedral polysiloxane (A) can be synthesized by a hydrosilylation reaction between an alkenyl group-containing polyhedral compound (a) and a compound having a hydrosilyl group (b) in the presence of a hydrosilylation catalyst. . At this time, all the alkenyl groups of the polyhedral polysiloxane compound (a) do not need to react and may partially remain.
- the addition amount of the compound (b) having a hydrosilyl group is such that the number of hydrogen atoms directly bonded to the Si atom is 2.5 to 20 per one alkenyl group of the polyhedral polysiloxane compound (a). It is preferable to use for. If the addition amount is small, gelation proceeds due to a crosslinking reaction, so that the polyhedral polysiloxane modified product (A) has poor handling properties, and if too large, the physical properties of the cured product may be adversely affected.
- the compound (b) having a hydrosilyl group it is preferable to add an excessive amount of the compound (b) having a hydrosilyl group to modify it and distill off the compound (b) having an unreacted hydrosilyl group.
- the compound (b) having an unreacted hydrosilyl group is preferably removed under reduced pressure and heating conditions.
- the addition amount of the hydrosilylation catalyst used in the synthesis of the modified polyhedral polysiloxane (A) is not particularly limited, but is 10 ⁇ 1 to 10 ⁇ 10 mol relative to 1 mol of the alkenyl group of the polyhedral polysiloxane (a). It is good to use in the range. It is preferably used in the range of 10 ⁇ 4 to 10 ⁇ 8 mol. If there are too many hydrosilylation catalysts, depending on the type of hydrosilylation catalyst, it absorbs light with a short wavelength, which may cause coloration or decrease the light resistance of the resulting cured product. May foam. Moreover, when there are too few hydrosilylation catalysts, there exists a possibility that reaction may not progress and a target object may not be obtained.
- the reaction temperature of the hydrosilylation reaction is preferably 30 to 400 ° C., more preferably 40 to 250 ° C., and further preferably 45 to 140 ° C. If the temperature is too low, the reaction does not proceed sufficiently, and if the temperature is too high, gelation may occur and handling properties may deteriorate.
- the modified polyhedral polysiloxane (A) thus obtained can ensure compatibility with various compounds, particularly siloxane compounds, and further, since a hydrosilyl group is introduced into the molecule, It becomes possible to react with a compound having alkenyl.
- a cured product can be obtained by reacting with a compound (B) having an alkenyl group described below.
- the polyhedral polysiloxane modified body (A) in the present invention can be liquefied at a temperature of 20 ° C.
- a modified liquid polyhedral polysiloxane (A) can be obtained, for example, by modifying a polyhedral polysiloxane compound (a) with a cyclic siloxane having a hydrosilyl group or a linear polysiloxane. . It is preferable that the polyhedral polysiloxane-modified product (A) is in a liquid state because of excellent handling properties.
- XR 3 2 SiO—SiO 3/2 a [R 4 3 SiO—SiO 3/2 ] b
- a + b is an integer of 6 to 24, a is an integer of 1 or more, b is 0 or an integer of 1 or more;
- R 3 is an alkyl group or an aryl group;
- R 4 is an alkenyl group, a hydrogen atom, an alkyl group, or an aryl group Or a group linked to another polyhedral skeleton polysiloxane
- X has a structure represented by the following general formula (1) or general formula (2), and when there are a plurality of X, The structure may be the same or different.
- Z may be the same or different; Z is a hydrogen atom, an alkenyl group, an alkyl group, an aryl group, or a site bonded to the polyhedral polysiloxane via an alkylene chain Yes, it may be the same or different, provided that at least one of Y or Z is a hydrogen atom)) is a heat resistance, light resistance, or strength of the resulting cured product From the viewpoint of the above, preferred examples are mentioned.
- the component (B) in the present invention preferably contains 2 or more alkenyl groups in one molecule, and more preferably 2 to 10 alkenyl groups. If the number of alkenyl groups in one molecule is large, a more crosslinked structure is formed, and the gas barrier property of the cured product using the polysiloxane composition of the present invention is improved. However, if it is too much, the heat resistance and light resistance are lowered. There is also a fear.
- the number of siloxane units as the component (B) in the present invention is not particularly limited, but is preferably 2 or more, more preferably 2 to 10.
- the number of siloxane units in one molecule is small, volatilization tends to occur from within the polysiloxane composition, and desired physical properties may not be obtained.
- gas barrier property may become low, such as the water vapor transmission rate of the obtained hardened
- the organopolysiloxane (B) having two or more alkenyl groups in one molecule as the component (B) in the present invention is a linear polysiloxane having two or more alkenyl groups from the viewpoint of heat resistance and light resistance.
- Preferable examples include polysiloxanes having two or more alkenyl groups at the molecular terminals and polysiloxanes having alkenyl groups such as cyclic siloxanes having two or more alkenyl groups. These compounds having an alkenyl group may be used alone or in combination of two or more.
- linear polysiloxane having two or more alkenyl groups include copolymers of dimethylsiloxane units, methylvinylsiloxane units and terminal trimethylsiloxy units, diphenylsiloxane units, methylvinylsiloxane units and terminal trimethylsiloxy units.
- Copolymer methylphenylsiloxane unit, copolymer of methylvinylsiloxane unit and terminal trimethylsiloxy unit, polydimethylsiloxane blocked with dimethylvinylsilyl group, endblocked with dimethylvinylsilyl group
- Polydiphenylsiloxane polymethylphenylsiloxane end-capped with dimethylvinylsilyl groups
- diphenylsiloxy Copolymers of emission units and methylvinylsiloxane units and end triethylsiloxy units and a copolymer of methylphenylsiloxane units and methylvinylsiloxane units and end triethylsiloxy unit is exemplified.
- a copolymer of a dimethylsiloxane unit, a methylvinylsiloxane unit and a terminal trimethylsiloxy unit a copolymer of a diphenylsiloxane unit, a methylvinylsiloxane unit and a terminal trimethylsiloxy unit, methylphenyl Copolymers of siloxane units with methylvinylsiloxane units and terminal trimethylsiloxy units, polydimethylsiloxanes blocked with dimethylvinylsilyl groups, polydiphenylsiloxanes blocked with dimethylvinylsilyl groups, dimethylvinylsilyl groups
- a preferable example is polymethylphenylsiloxane whose end is blocked with a polymethylphenylsiloxane.
- polysiloxane having two or more alkenyl groups at the molecular ends include polysiloxanes whose ends are blocked with the dimethylalkenyl groups exemplified above, dimethylalkenylsiloxane units and SiO 2 units, SiO 3/2 units, SiO 2 In a group consisting of at least one siloxane unit selected from the group consisting of units, a polysiloxane end-capped with a diethyl alkenyl group, a diethyl alkenyl siloxane unit and a SiO 2 unit, a SiO 3/2 unit, a SiO unit Examples thereof include polysiloxane composed of at least one selected siloxane unit.
- At least one siloxane unit selected from the group consisting of a polysiloxane blocked with a dimethylalkenyl group, a dimethylalkenylsiloxane unit, a SiO 2 unit, a SiO 3/2 unit, and a SiO unit.
- a preferred example is polysiloxane consisting of:
- Examples of the cyclic siloxane compound having two or more alkenyl groups include 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7-tetravinyl-1 -Phenyl-3,5,7-trimethylcyclotetrasiloxane, 1,3,5,7-tetravinyl-1,3-diphenyl-5,7-dimethylcyclotetrasiloxane, 1,3,5,7-tetravinyl -1,5-diphenyl-3,7-dimethylcyclotetrasiloxane, 1,3,5,7-tetravinyl-1,3,5-triphenyl-7-methylcyclotetrasiloxane, 1-phenyl-3,5 , 7-trivinyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,3-diphenyl-5,7-divinyl-1,3,5,7-tetramethylcycl
- the amount of the organopolysiloxane having two or more alkenyl groups in one molecule as the component (B) can be variously set, but is included in the modified polyhedral polysiloxane as the component (A) per alkenyl group. It is desirable to add hydrogen atoms directly connected to Si atoms in a ratio of 0.3 to 5, preferably 0.5 to 3. If the ratio of the alkenyl group is too small, appearance defects due to foaming and the like are likely to occur, and if too large, the physical properties of the cured product may be adversely affected.
- the polysiloxane composition of the present invention contains (A) component polyhedral polysiloxane modified, and (B) organopolysiloxane,
- the organopolysiloxane of component (B) is an aryl group-containing organopolysiloxane (B1), and / or, further, as component (C), organosilicon having one alkenyl group or hydrosilyl group in one molecule
- component (C1) or a cyclic olefin compound (C2) having one carbon-carbon double bond in one molecule is contained.
- the component (B) in the present invention is an aryl group-containing organopolysiloxane (B1) having an alkenyl group
- the aryl group-containing organopolysiloxane (B1) may contain at least one aryl group in one molecule.
- the aryl group may be on either the side chain or the terminal of the molecule.
- aryl groups include phenyl group, naphthyl group, 2-methylphenyl group, 3-methylphenyl group, 4-methylphenyl group, 2-ethylphenyl group, 3-ethylphenyl group, 4-ethylphenyl group.
- the weight average molecular weight of the aryl group-containing organopolysiloxane (B1) is preferably 3500 or less, more preferably 150 to 2000, and even more preferably 200 to 1000.
- the component (B1) tends to volatilize from the inside of the polysiloxane composition, and desired physical properties may not be obtained.
- gas barrier properties may become low, such as the water vapor transmission rate of the obtained hardened
- the aryl group content of the component (B1) is preferably in the range of 0.1 to 10 mmol / g, more preferably 1 to 10 mmol / g.
- the molar ratio of the aryl group to a substituted or unsubstituted monovalent hydrocarbon group other than an aryl group is 0. It is preferably within the range of .01 to 30. The greater the amount of this aryl group, the better the gas barrier property of the cured product and the better the adhesion strength to the aromatic substrate.
- the component (C) is an organosilicon compound (C1) having one alkenyl group or hydrosilyl group in one molecule, or one carbon-carbon double bond in one molecule.
- the cyclic olefin compound (C2) which has one piece may be contained.
- the component (C1) in the present invention preferably contains at least one aryl group in one molecule from the viewpoints of gas barrier properties and refractive index, and further, the aryl group is directly bonded to a silicon atom. It is more preferable from the viewpoint of heat resistance and light resistance. As such (C1) component has a larger number of aryl groups in one molecule, the effect of improving the gas barrier property and refractive index of the cured product is greater.
- the component (C1) in the present invention is preferably a silane or polysiloxane from the viewpoint of heat resistance and light resistance.
- the component (C1) is a silane having one alkenyl group in one molecule, specifically, for example, vinyltrimethylsilane, vinyldimethylphenylsilane, vinyldiphenylmethylsilane, vinyltriphenylsilane, vinyltriethyl Examples include silane, vinyldiethylphenylsilane, vinyldiphenylethylsilane, allyldimethylphenylsilane, allyldiphenylmethylsilane, allyltriphenylsilane, allyldiethylphenylsilane, allyldiphenylethylsilane, and the like.
- vinyltrimethylsilane, vinyldimethylphenylsilane, vinyldiphenylmethylsilane, and vinyltriphenylsilane are preferable examples from the viewpoint of heat resistance and light resistance.
- the component (C1) is a silane having one hydrosilyl group in one molecule, specifically, for example, trimethylsilane, dimethylphenylsilane, diphenylmethylsilane, triphenylsilane, triethylsilane, diethylphenylsilane, diphenyl Examples include ethylsilane.
- trimethylsilane, dimethylphenylsilane, diphenylmethylsilane, and triphenylsilane are preferable examples from the viewpoint of heat resistance and light resistance.
- component (C1) is a polysiloxane
- a polysiloxane having a linear structure having one alkenyl group or hydrosilyl group a polysiloxane having one alkenyl group or hydrosilyl group at the molecular end, an alkenyl group or a hydrosilyl group
- Examples include one cyclic siloxane.
- component (C1) is a polysiloxane having a linear structure having one alkenyl group in one molecule, specifically, for example, polydimethyl having one end each blocked with a dimethylvinylsilyl group and a trimethylsilyl group.
- Siloxane polymethylphenylsiloxane blocked with a dimethylvinylsilyl group and a trimethylsilyl group each at one end, polydiphenylsiloxane blocked with a dimethylvinylsilyl group and a trimethylsilyl group, respectively, and a dimethylvinylsilyl group Copolymers of dimethylsiloxane units and methylphenylsiloxane units each blocked with a trimethylsilyl group each at one end, and dimethylsiloxane units and diphenylsilco units each blocked with a dimethylvinylsilyl group and a trimethylsilyl group respectively.
- Copolymer with sun unit polydimethylsiloxane blocked with one each by diethylvinylsilyl group and triethylsilyl group, polymethylsiloxane blocked by one each with diethylvinylsilyl group and triethylsilyl group Phenylsiloxane, polydiphenylsiloxane capped with one each by diethylvinylsilyl group and triethylsilyl group, dimethylsiloxane unit and methylphenylsiloxane capped with one each by diethylvinylsilyl group and triethylsilyl group Examples thereof include a copolymer with a unit, and a copolymer of a dimethylsiloxane unit and a diphenylsiloxane unit each having one end blocked with a diethylvinylsilyl group and a triethylsilyl group.
- polydimethylsiloxane having one end each blocked with a dimethylvinylsilyl group and one trimethylsilyl group and polymethylsiloxane having one end blocked with a dimethylvinylsilyl group and one trimethylsilyl group.
- a preferred example is a copolymer of a dimethylsiloxane unit and a diphenylsiloxane unit each having one end blocked with a dimethylvinylsilyl group and a trimethylsilyl group.
- component (C1) is a polysiloxane having a linear structure having one hydrosilyl group in one molecule, specifically, for example, each end is blocked with a dimethylhydrogensilyl group and a trimethylsilyl group.
- Copolymers of Le siloxane units can be exemplified.
- polydimethylsiloxane having one end blocked with a dimethylhydrogensilyl group and one trimethylsilyl group, and one end each blocked with a dimethylhydrogensilyl group and a trimethylsilyl group.
- copolymers with phenylsiloxane units and copolymers of dimethylsiloxane units and diphenylsiloxane units, each of which is capped with a dimethylhydrogensilyl group and a trimethylsilyl group. It is mentioned as examples.
- the component (C1) is a polysiloxane having one alkenyl group at the molecular end, specifically, for example, a polysiloxane having one end blocked with a dimethylvinylsilyl group, and the polysiloxane is SiO 2.
- Examples thereof include polysiloxane composed of at least one siloxane unit selected from the group consisting of SiO 3/2 units and SiO units.
- a preferred example is polysiloxane comprising two siloxane units.
- the component (C1) is a polysiloxane having one hydrosilyl group at the molecular end, specifically, for example, a polysiloxane having one end blocked with a dimethylhydrogensilyl group, and the polysiloxane is SiO
- a polysiloxane having one end blocked with a dimethylhydrogensilyl group and the polysiloxane is SiO
- Examples thereof include polysiloxanes composed of at least one siloxane unit selected from the group consisting of units, SiO 3/2 units, and SiO units.
- At least one selected from the group consisting of SiO 2 units, SiO 3/2 units, and SiO units is a polysiloxane having one end blocked with a dimethylhydrogensilyl group.
- a preferred example is polysiloxane composed of one siloxane unit.
- the component (C1) is a cyclic siloxane having one alkenyl group, specifically, for example, 1-vinyl-1,3,3,5,5,7,7-heptamethylcyclotetrasiloxane, 1 -Vinyl-3-phenyl-1,3,5,5,7,7-hexamethylcyclotetrasiloxane, 1-vinyl-3,5-diphenyl-1,3,5,7,7-pentamethylcyclotetrasiloxane 1-vinyl-3,5,7-triphenyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1-vinyl-1,3,3,5,5,7,7-heptaethylcyclotetrasiloxane Siloxane, 1-vinyl-3-phenyl-1,3,5,5,7,7-hexamethylcyclotetrasiloxane, 1-vinyl-3,5-diphenyl-1,3,5,7,7-penta Ethyl cyclo
- component (C1) is a cyclic siloxane having one hydrosilyl group, specifically, for example, 1-hydrogen-1,3,3,5,5,7,7-heptamethylcyclotetrasiloxane, 1-hydrogen-3-phenyl-1,3,5,5,7,7-hexamethylcyclotetrasiloxane, 1-hydrogen-3,5-diphenyl-1,3,5,7,7-pentamethyl Cyclotetrasiloxane, 1-hydrogen-3,5,7-triphenyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1-hydrogen-1,3,3,5,5,7,7 -Heptaethylcyclotetrasiloxane, 1-hydrogen-3-phenyl-1,3,5,5,7,7-hexamethylcyclotetrasiloxane, 1-hydrogen-3, -Diphenyl-1,3,5,7,7-pentaethylcyclotetrasiloxane, 1-hydrogen-3
- 1-hydrogen-1,3,3,5,5,7,7-heptamethylcyclotetrasiloxane 1-hydrogen-3-phenyl-1,3,5, 5,7,7-hexamethylcyclotetrasiloxane, 1-hydrogen-3,5-diphenyl-1,3,5,7,7-pentamethylcyclotetrasiloxane, 1-hydrogen-3,5,7-
- a preferred example is triphenyl-1,3,5,7-tetramethylcyclotetrasiloxane.
- the amount of the component (C1) can be variously set, but the component (C1) is preferably 1% relative to the sum (100% by weight) of the component (C1) and the component (A) and the component (B). It is preferably used in the range of from 60% to 60% by weight, more preferably from 5 to 50% by weight.
- the component (C1) is preferably 1% relative to the sum (100% by weight) of the component (C1) and the component (A) and the component (B). It is preferably used in the range of from 60% to 60% by weight, more preferably from 5 to 50% by weight.
- the crosslinking density of a composition may be too high, and there exists a possibility that a crack may arise.
- organosilicon compounds having one alkenyl group or one hydrosilyl group in one molecule as the component (C1) may be used alone or in combination of two or more.
- ⁇ Cyclic olefin compound (C2) having one carbon-carbon double bond in one molecule The cyclic olefin compound (C2) having one carbon-carbon double bond in one molecule in the present invention reacts with the hydrosilyl group of the component (A).
- the component (C2) By using the component (C2), the elastic modulus of the cured product can be reduced, and further, crack resistance including cold and thermal shock resistance, fracture strength, gas barrier properties, and the like can be improved.
- the component (C2) in the present invention may be a cyclic olefin compound having one carbon-carbon double bond in one molecule, and this carbon-carbon double bond may be any of a vinylene group, a vinylidene group, or an alkenyl group. It may be.
- the alkenyl group include a vinyl group, an allyl group, a butenyl group, and a hexenyl group, and a vinyl group is preferable from the viewpoint of heat resistance and light resistance.
- the component (C2) in the present invention preferably has an average molecular weight of 1000 or less. More preferable examples include the following formula C n H 2 (nx)
- a cyclic olefin compound represented by the formula (n is an integer of 4 to 20, x is an integer of 1 to 5, and nx is an integer of 3 or more) is preferable from the viewpoint of reactivity with the component (b). It is done.
- Examples of such cyclic olefin compounds include aliphatic cyclic olefin compounds and substituted aliphatic cyclic olefin compounds.
- aliphatic cyclic olefin compound examples include cyclohexene, cycloheptene, cyclooctene, vinylcyclohexane, vinylcycloheptane, vinylcyclooctane, allylcyclohexane, allylcycloheptane, allylcyclooctane, and methylenecyclohexane. It is done.
- substituted aliphatic cyclic olefin compounds include norbornene, 1-methylnorbornene, 2-methylnorbornene, 7-methylnorbornene, 2-vinylnorbornane, 7-vinylnorbornane, 2-allylnorbornane, 7-allylnorbornane, 2-methylene norbornane, 7-methylene norbornane, camphene, vinyl norcamphene, 6-methyl-5-vinyl-bicyclo [2,2,1] -heptane, 3-methyl-2-methylene-bicyclo [2,2,1 ] -Heptane, ⁇ -pinene, ⁇ -pinene, 6,6-dimethyl-bicyclo [3,1,1] -2-heptaene, longifolene, 2-vinyladamantane, 2-methyleneadamantane and the like.
- cyclohexene vinylcyclohexane, norbornene, camphene, and pinene are preferable examples from the viewpoint of availability.
- cyclic olefin compounds (C2) having one carbon-carbon double bond in one molecule may be used alone or in combination of two or more.
- the amount of the cyclic olefin compound (C2) having one carbon-carbon double bond in one molecule is the carbon-carbon of the component (C2) per hydrosilyl group of the compound (b) having a hydrosilyl group described later. It is preferable to use so that the number of double bonds is 0.01 to 0.5. When the addition amount is small, the thermal shock resistance of the resulting cured product may be lowered, and when the addition amount is large, a curing failure may occur in the resulting cured product.
- a hydrosilylation catalyst is used in curing the polysiloxane composition.
- a known hydrosilylation catalyst can be used, and there is no particular limitation.
- Specific examples of the hydrosilylation catalyst are as described above, and are the same as the hydrosilylation catalyst used in the synthesis of the polyhedral polysiloxane-modified product (A).
- the curing retarder is a component for improving the storage stability of the polysiloxane composition of the present invention or adjusting the reactivity of the hydrosilylation reaction during the curing process, and is an optional component.
- known compounds used in addition-type curable compositions with hydrosilylation catalysts can be used. Specifically, compounds containing aliphatic unsaturated bonds, organophosphorus compounds , Organic sulfur compounds, nitrogen-containing compounds, tin compounds, organic peroxides, and the like. These may be used alone or in combination of two or more.
- the compound containing an aliphatic unsaturated bond examples include 3-hydroxy-3-methyl-1-butyne, 3-hydroxy-3-phenyl-1-butyne, and 3,5-dimethyl-1-hexyne- Examples include propargyl alcohols such as 3-ol and 1-ethynyl-1-cyclohexanol, ene-yne compounds, maleic acid esters such as maleic anhydride and dimethyl maleate, and the like.
- organophosphorus compound examples include triorganophosphine, diorganophosphine, organophosphon, and triorganophosphite.
- organic sulfur compound examples include organomercaptans, diorganosulfides, hydrogen sulfide, benzothiazole, thiazole, benzothiazole disulfide, and the like.
- nitrogen-containing compounds include N, N, N ′, N′-tetramethylethylenediamine, N, N-dimethylethylenediamine, N, N-diethylethylenediamine, N, N-dibutylethylenediamine, and N, N-dibutyl.
- -1,3-propanediamine N, N-dimethyl-1,3-propanediamine
- N, N, N ′, N′-tetraethylethylenediamine, N, N-dibutyl-1,4-butanediamine, 2,2 Examples include '-bipyridine.
- tin compounds include stannous halide dihydrate, stannous carboxylate, and the like.
- organic peroxide examples include di-t-butyl peroxide, dicumyl peroxide, benzoyl peroxide, and t-butyl perbenzoate.
- dimethyl maleate, 3,5-dimethyl-1-hexyn-3-ol, and 1-ethynyl-1-cyclohexanol can be exemplified as particularly preferred retarders.
- the addition amount of the curing retarder is not particularly limited, but is preferably used in the range of 10 ⁇ 1 to 10 3 mol, more preferably in the range of 1 to 100 mol, relative to 1 mol of the hydrosilylation catalyst. preferable. Moreover, these hardening retarders may be used independently and may be used in combination of 2 or more types.
- the adhesion-imparting agent is an optional component used for the purpose of improving the adhesion between the polysiloxane composition and the substrate in the present invention, and is not particularly limited as long as it has such an effect.
- a ring agent can be exemplified as a preferred example.
- the silane coupling agent is not particularly limited as long as it is a compound having at least one functional group reactive with an organic group and one hydrolyzable silicon group in the molecule.
- the group reactive with the organic group is preferably at least one functional group selected from an epoxy group, a methacryl group, an acrylic group, an isocyanate group, an isocyanurate group, a vinyl group, and a carbamate group from the viewpoint of handling. From the viewpoints of properties and adhesiveness, an epoxy group, a methacryl group, and an acrylic group are more preferable.
- the hydrolyzable silicon group an alkoxysilyl group is preferable from the viewpoint of handleability, and a methoxysilyl group and an ethoxysilyl group are more preferable from the viewpoint of reactivity.
- silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldisilane.
- the addition amount of the silane coupling agent is preferably 0.05 to 30 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the mixture of the component (A) and the component (B). Parts by weight. If the addition amount is small, the effect of improving the adhesiveness does not appear, and if the addition amount is large, the physical properties of the cured product may be adversely affected.
- Adhesion promoters include, but are not limited to, epoxy-containing compounds, epoxy resins, boronic ester compounds, organoaluminum compounds, and organotitanium compounds.
- the polysiloxane composition of this invention can add an inorganic filler as needed.
- the strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation, electrical characteristics, light reflectance of the molded product obtained Various physical properties such as flame retardancy, fire resistance, and gas barrier properties can be improved.
- the inorganic filler is not particularly limited as long as it is an inorganic substance or a compound containing an inorganic substance. Specifically, for example, quartz, fumed silica, precipitated silica, silicic anhydride, fused silica, crystalline silica, ultrafine powder amorphous silica, etc.
- Silica-based inorganic filler alumina, zircon, iron oxide, zinc oxide, titanium oxide, silicon nitride, boron nitride, aluminum nitride, silicon carbide, glass fiber, glass flake, alumina fiber, carbon fiber, mica, graphite, carbon black, Examples thereof include ferrite, graphite, diatomaceous earth, white clay, clay, talc, aluminum hydroxide, calcium carbonate, manganese carbonate, magnesium carbonate, barium sulfate, potassium titanate, calcium silicate, inorganic balloon, and silver powder. These may be used alone or in combination of two or more.
- the inorganic filler may be appropriately subjected to a surface treatment.
- the surface treatment include alkylation treatment, trimethylsilylation treatment, silicone treatment, treatment with a coupling agent, and the like, but are not particularly limited.
- the coupling agent examples include silane coupling agents.
- the silane coupling agent is not particularly limited as long as it is a compound having at least one functional group reactive with an organic group and one hydrolyzable silicon group in the molecule.
- the group reactive with the organic group is preferably at least one functional group selected from an epoxy group, a methacryl group, an acrylic group, an isocyanate group, an isocyanurate group, a vinyl group, and a carbamate group from the viewpoint of handleability.
- an epoxy group, a methacryl group, and an acrylic group are particularly preferable.
- As the hydrolyzable silicon group an alkoxysilyl group is preferable from the viewpoint of handleability, and a methoxysilyl group and an ethoxysilyl group are particularly preferable from the viewpoint of reactivity.
- Preferred silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4- Epoxycyclohexyl) alkoxysilanes having an epoxy functional group such as ethyltriethoxysilane: 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyl Methacrylic or acrylic groups such as triethoxysilane, methacryloxymethyltrimethoxysilane, methacryloxymethyltriethoxysilane, acryloxymethyltrimethoxysilane, acryloxymethyltriethoxysilane Examples thereof include alkoxysilanes.
- the shape of the inorganic filler various types such as a crushed shape, a piece shape, a spherical shape, and a rod shape can be used.
- the average particle size and particle size distribution of the inorganic filler are not particularly limited, but the average particle size is preferably 0.005 to 100 ⁇ m, and more preferably 0.01 to 50 ⁇ m.
- the BET specific surface area although not particularly limited, from the viewpoint of gas barrier properties, it is preferably 70m 2 / g or more, more preferably 100 m 2 / g or more, further 200 meters 2 / It is especially preferable that it is g or more.
- the BET specific surface area is the specific surface area of the particles calculated by the gas adsorption method, and the specific surface area of the particles by the gas adsorption method is calculated using a gas molecule whose adsorption occupation area is known like nitrogen gas.
- the specific surface area of the particles is calculated from the amount adsorbed on the particles.
- the BET specific surface area can accurately calculate the amount of gas molecules adsorbed directly on the solid surface (monomolecular layer adsorption amount).
- the BET specific surface area can be calculated using a mathematical formula called a BET formula shown below.
- the BET formula shows the relationship between the adsorption equilibrium pressure P and the adsorption amount V at that pressure when the adsorption equilibrium state is maintained at a constant temperature, and is expressed as follows.
- the addition amount of the inorganic filler is not particularly limited, but is 1 to 1000 parts by weight, more preferably 5 to 500 parts by weight, with respect to 100 parts by weight of the mixture of the components (A), (B) and (C). More preferably, it is 10 to 300 parts by weight.
- the amount of the inorganic filler added is too large, the fluidity may be deteriorated, and when it is small, the physical properties of the obtained molded article may be insufficient.
- the order of mixing the inorganic filler is not particularly limited, but in the point that the storage stability tends to be good, after mixing with the component (B), there is a method of mixing with the component (A) and the component (C). desirable.
- (A) component, (B) component, (C) in that (A) component, (B) component, and (C) component which are reaction components are well mixed and a stable molded product is easily obtained. It is preferable to mix an inorganic filler with a mixture of components.
- the means for mixing these inorganic fillers is not particularly limited, but specifically, for example, a stirrer such as a two-roll or three-roll, a planetary stirring deaerator, a homogenizer, a dissolver, a planetary mixer, etc. And melt kneaders such as a plast mill.
- the mixing of the inorganic filler may be performed at normal temperature, may be performed by heating, may be performed under normal pressure, or may be performed under reduced pressure. If the temperature during mixing is high, the composition may be cured before molding.
- the polysiloxane composition of the present invention is obtained by adding a predetermined component (B) to (C) to the component (A) and, if necessary, a hydrosilylation catalyst, a curing retarder, and an adhesion promoter. be able to.
- the polysiloxane composition of the present invention can be handled as a liquid resin composition. By using a liquid composition, a molded body can be easily obtained by pouring into a mold, a package, a substrate, etc., and curing by heating.
- the cured product obtained by using the polysiloxane-based composition of the present invention has not only excellent heat resistance, weather resistance and gas barrier properties, but also high hardness, low coefficient of thermal expansion, and thermal dimensional stability. Excellent.
- the temperature is preferably 30 to 400 ° C, more preferably 50 to 250 ° C. If the curing temperature is too high, the resulting cured product tends to have poor appearance, and if it is too low, curing is insufficient. Moreover, you may make it harden
- a hydrosilylation catalyst can be additionally used as necessary.
- the curing time can be appropriately selected depending on the curing temperature, the amount of hydrosilylation catalyst to be used and the amount of hydrosilyl group, and other combinations of the composition of the present application.
- a preferable cured product can be obtained by performing the treatment preferably for 10 minutes to 8 hours.
- the polysiloxane composition of the present invention can be used by being injected or applied to, for example, a package or a substrate. After injection or application, a molded body (cured product) corresponding to the application can be easily obtained by curing under the above-mentioned curing conditions.
- the polysiloxane composition of the present invention may optionally contain various additives such as phosphors, colorants, heat resistance improvers, reaction control agents, mold release agents, and dispersants for fillers. Can be added.
- the filler dispersant include diphenylsilane diol, various alkoxysilanes, carbon functional silane, silanol group-containing low molecular weight siloxane, and the like.
- the above-mentioned components are uniformly mixed using a kneader such as a roll, a Banbury mixer, a kneader, or a planetary stirring deaerator, and subjected to heat treatment as necessary. Or you may.
- a kneader such as a roll, a Banbury mixer, a kneader, or a planetary stirring deaerator
- the polysiloxane composition of the present invention can be used as a molded article.
- a molding method any method such as extrusion molding, compression molding, blow molding, calender molding, vacuum molding, foam molding, injection molding, liquid injection molding, and cast molding can be used.
- molded product obtained in the present invention include, for example, substrate materials in the field of liquid crystal displays, light guide plates, prism sheets, deflection plates, retardation plates, viewing angle correction films, adhesives, color filters, polarizers.
- peripheral material of the liquid crystal display device such as a protective film and a film for liquid crystal such as a passivation film. It is also used in PDP (plasma display) sealants, antireflection films, optical correction films, housing materials, front glass protective films, front glass substitute materials, adhesives, color filters, passivation films, and LED display devices.
- PDP plasma display
- LED element mold material front glass protective film, front glass substitute material, adhesive, color filter, passivation film, substrate material for plasma addressed liquid crystal display, light guide plate, prism sheet, deflector plate, retardation plate, field of view Angle correction film, adhesive, color filter, polarizer protective film, passivation film, front glass protective film for organic EL display, front glass substitute material, color filter, adhesive, passivation film, and field emission
- Isupurei FED
- front glass protective films, front glass substitute material, adhesive, a color filter, a passivation film is exemplified.
- automotive lamp reflectors In the field of automobiles and transport equipment, automotive lamp reflectors, bearing retainers, gear parts, anti-corrosion coatings, switch parts, headlamps, engine internal parts, electrical parts, various interior and exterior parts, drive engines, brake oil tanks, automobile protection Examples include rusted steel plates, interior panels, interior materials, protective / bundling wireness, fuel hoses, automobile lamps, and glass substitutes.
- the multilayer glass for rail vehicles is illustrated. Further, examples thereof include a toughness imparting agent for aircraft structural materials, engine peripheral members, wireness for protection and binding, and corrosion-resistant coating.
- Next-generation optical / electronic functional organic materials include next-generation DVDs, organic EL device peripheral materials, organic photorefractive devices, light-to-light conversion devices, optical amplification devices, optical computing devices, substrate materials around organic solar cells, Examples thereof include fiber materials, element sealants, and adhesives.
- the polysiloxane composition obtained in the present invention can be used in the optical device described below.
- cured product comprising the polysiloxane composition in the present invention exhibits a specific viscoelastic behavior.
- the cured product of the present invention is a cured product having a maximum value of at least one loss tangent at ⁇ 40 ° C. to 50 ° C. and a storage elastic modulus at 50 ° C. of 10 MPa or less.
- the maximum value of the loss tangent is more preferably in the range of ⁇ 5 ° C. to 45 ° C., and further preferably in the range of 0 ° C. to 45 ° C. If it has a maximum value at low temperature, the gas barrier property of the cured product may decrease. If it has a maximum value at high temperature, the internal (residual) stress will increase when obtaining the cured product, and the thermal shock resistance of the cured product will deteriorate. There is a case.
- the storage elastic modulus at 50 ° C. is more preferably 8 MPa or less, and further preferably 5 MPa or less.
- the storage elastic modulus at 50 ° C. is larger than 10 MPa, the cold-heat shock resistance of the cured product may be deteriorated.
- the optical device of the present invention is an optical device using the polysiloxane composition of the present invention.
- polysiloxane composition of the present invention has low moisture permeability (excellent gas barrier property), is useful as an optical element sealing agent, and creates an optical device provided with the sealing agent. Is also possible.
- optical device of the present invention specifically, for example, in the optical recording field, VD (video disc), CD / CD-ROM, CD-R / RW, DVD-R / DVD-RAM, MO / MD, PD ( Phase change disk), disk substrate materials for optical cards, pickup lenses, protective films, and sealants.
- optical pickup members such as next-generation DVDs, such as pickup lenses, collimator lenses, objective lenses, sensor lenses, protective films, element sealants, sensor sealants, gratings, adhesives, prisms It can be suitably used for wave plates, correction plates, splitters, holograms, mirrors and the like.
- examples include still camera lens materials, finder prisms, target prisms, finder covers, and light receiving sensor units.
- a photographing lens and a viewfinder of a video camera are exemplified.
- the projection lens of a projection television, a protective film, a sealing agent, an adhesive agent, etc. are illustrated. Examples are materials for lenses of optical sensing devices, sealants, adhesives, and films.
- optical fiber materials, lenses, waveguides, element sealants, adhesives and the like around optical switches in optical communication systems are exemplified.
- Examples include optical fiber materials, ferrules, sealants, adhesives and the like around the optical connector.
- Examples of optical passive components and optical circuit components include lenses, waveguides, LED element sealants, adhesives, and the like.
- Examples include substrate materials, fiber materials, element sealants, adhesives, and the like around an optoelectronic integrated circuit (OEIC).
- OEIC optoelectronic integrated circuit
- examples include sensors for industrial use such as lighting and light guides for decorative displays, displays and signs, and optical fibers for communication infrastructure and for connecting digital devices in the home.
- Examples of the semiconductor integrated circuit peripheral material include an interlayer insulating film, a passivation film, an LSI, and a resist material for microlithography for an LSI material.
- a polysiloxane-based composition is poured into this glass cell, and cured by heating in a convection oven at 80 ° C. ⁇ 2 hours, 100 ° C. ⁇ 1 hour, 150 ° C. ⁇ 6 hours, to obtain a cured product (2 mm thick plate-like molded product). It was created.
- Heat resistance test In a hot air circulating oven set at 200 ° C., a 2 mm thick plate-shaped molded body was cured for 24 hours and visually observed. The case where no change in color due to coloring or the like was observed was evaluated as ⁇ , and the case where it was observed was evaluated as ⁇ .
- the moisture permeability is calculated according to the following method.
- a jig is prepared by fixing a 5 cm square polyisobutylene rubber sheet (3 mm thick, 3 cm square inside so as to be a square shape) on top of a 5 cm square plate glass (0.5 mm thick), 1 g of calcium chloride (for water measurement) manufactured by Wako Pure Chemical Industries, Ltd. was filled into a square shape and used as a test specimen. Further, a 5 cm square evaluation cured product (2 mm thick) was fixed on the upper part, and was cured at a temperature of 40 ° C., a humidity of 90% RH for 24 hours in a thermo-hygrostat (PR-2KP manufactured by Espec). The moisture permeability was calculated according to the following formula.
- Moisture permeability (g / m 2 / 24h) [(total weight of specimen after moisture permeability test (g)) ⁇ (total weight of specimen before moisture permeability test (g))] ⁇ 10000 / 9.0 cm 2
- the solution thus obtained was mixed with 20.62 g of 1,3,5,7-tetrahydrogen-1,3,5,7-tetramethylcyclotetrasiloxane, 1,1,3,3-tetramethyldi-
- the solution was slowly added dropwise to a solution of 11.52 g of siloxane and 32.14 g of toluene, reacted at 95 ° C. for 3 hours, and cooled to room temperature.
- Example 1 Phenylsiloxane containing vinyl group (manufactured by Adeka, FX-T350, weight average molecular weight 460, Vi value) to 5.00 g (SiH valence 4.77 mol / kg) modified polyhedral polysiloxane obtained in Production Example 2 (Several 7.41 mol / kg) 2.56 g was added and mixed well to obtain a polysiloxane composition.
- the composition thus obtained was poured into a mold and an LED package and cured by heating at 80 ° C. for 2 h, at 100 ° C. for 1 h, and at 150 ° C. for 6 h to obtain a molded article for evaluation.
- Example 2 Phenylsiloxane containing vinyl group (manufactured by Adeka, FX-T180, weight average molecular weight 490, Vi value) to 5.00 g (SiH valence 4.77 mol / kg) modified polyhedral polysiloxane obtained in Production Example 2 (Several 5.02 mol / kg) 2.71 g was added and mixed well to obtain a polysiloxane composition.
- the composition thus obtained was poured into a mold and an LED package and cured by heating at 80 ° C. for 2 h, at 100 ° C. for 1 h, and at 150 ° C. for 6 h to obtain a molded article for evaluation.
- Example 3 To the modified polyhedral polysiloxane obtained in Production Example 2, 5.00 g (SiH valence: 4.77 mol / kg) was added 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrimethyl. Add siloxane (Gelest, SID4609.0, weight average molecular weight 385, Vi valence 5.20 mol / kg) 2.23 g, 3-glycidoxypropyltrimethoxysilane (Toray Dow Corning, SH6040) 0.23 g , Stirred.
- a polysiloxane composition 0.56 ⁇ l of ethynylcyclohexanol and 0.64 ⁇ l of dimethyl maleate were added and stirred, followed by stirring and defoaming with a planetary stirring deaerator to obtain a polysiloxane composition.
- the composition thus obtained was poured into a mold and an LED package and cured by heating at 80 ° C. for 2 h, at 100 ° C. for 1 h, and at 150 ° C. for 6 h to obtain a molded article for evaluation.
- Example 4 To the modified polyhedral polysiloxane obtained in Production Example 3, 5.00 g (SiH valence 3.93 mol / kg) was added 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrimethyl. Add siloxane (Gelest, SID4609.0, weight average molecular weight 385, Vi valence 5.20 mol / kg) 2.62 g, 3-glycidoxypropyltrimethoxysilane (Toray Dow Corning, SH6040) 0.23 g , Stirred.
- a polysiloxane composition 0.56 ⁇ l of ethynylcyclohexanol and 0.64 ⁇ l of dimethyl maleate were added and stirred, followed by stirring and defoaming with a planetary stirring deaerator to obtain a polysiloxane composition.
- the composition thus obtained was poured into a mold and an LED package and cured by heating at 80 ° C. for 2 h, at 100 ° C. for 1 h, and at 150 ° C. for 6 h to obtain a molded article for evaluation.
- Example 5 Phenylsiloxane containing a vinyl group at both ends in the polyhedral modified polysiloxane modified in 2.00 g (SiH valence 4.77 mol / kg) obtained in Production Example 2 (trade name PMV9925, manufactured by Gelest Co., Ltd., weight average molecular weight 3000) , Vi valence 0.67 mol / kg) 9.53 g was added and mixed well to obtain a polysiloxane composition. The composition thus obtained was poured into a mold and an LED package and cured by heating at 80 ° C. for 2 h, at 100 ° C. for 1 h, and at 150 ° C. for 6 h to obtain a molded article for evaluation.
- Comparative Example 2 0.50 g of the modified polyhedral polysiloxane obtained in Production Example 2 and phenylsiloxane containing vinyl groups at both ends (manufactured by Gerest, trade name PDV2331, weight average molecular weight 10,000, Vi valence 0.20 mol / kg) 11.90 g was added and mixed well to obtain a polysiloxane composition.
- the composition thus obtained was poured into a mold and an LED package and cured by heating at 80 ° C. for 2 h, at 100 ° C. for 1 h, and at 150 ° C. for 6 h to obtain a molded article for evaluation.
- the polysiloxane composition of the present invention has a low moisture permeability and is suitable for producing a cured product that is also useful as an optical element sealant, and in particular, a sealant for optical devices. It is suitable for doing.
- Example 6 to 12 and Comparative Examples 4 to 6 were evaluated by the following methods. The results are shown in Table 2.
- a polysiloxane-based composition is filled in a mold and thermally cured in a convection oven at 80 ° C. ⁇ 2 hours, 100 ° C. ⁇ 1 hour, 150 ° C. ⁇ 6 hours, and a sample having a length of 35 mm, a width of 5 mm and a thickness of 2 mm is obtained. Created.
- the dynamic viscoelasticity of the sample prepared as described above was measured using a dynamic viscoelasticity measuring device Reogel E4000 manufactured by UBM, measurement temperature ⁇ 40 ° C. to 150 ° C., heating rate 4 ° C. per minute, strain 4 ⁇ m, frequency 10 Hz, Measurement was performed in a tensile mode with a chuck interval of 25 mm.
- Example 6 To the modified polyhedral polysiloxane obtained in Production Example 2, 5.00 g (SiH valence: 4.77 mol / kg) was added 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrimethyl.
- Siloxane (Gelest, SID4609.0, weight average molecular weight 385, Vi valence 5.20 mol / kg) 1.74 g, vinyldiphenylmethylsilane (Shin-Etsu Chemical Co., Ltd., LS5600, weight average molecular weight 225, Vi valence 4 .44 mol / kg) 1.90 g was added and stirred, followed by stirring and defoaming with a planetary stirring deaerator to obtain a polysiloxane composition. Using the polysiloxane-based composition thus obtained, the evaluation was performed according to each test method described above. The results are shown in Table 2.
- Example 7 To the modified polyhedral polysiloxane obtained in Production Example 2, 5.00 g (SiH valence: 4.77 mol / kg) was added 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrimethyl.
- Siloxane (Gelest, SID4609.0, weight average molecular weight 385, Vi valence 5.20 mol / kg) 1.74 g, vinyldiphenylmethylsilane (Shin-Etsu Chemical Co., Ltd., LS5600, weight average molecular weight 225, Vi valence 4 .44 mol / kg) 1.90 g, 0.21 g of SH6040 manufactured by Toray Dow Corning, which is 3-glycidoxypropyltrimethoxysilane, was added and stirred.
- Example 9 Phenylsiloxane (Adeka, FX-T180, weight average molecular weight 490) containing vinyl groups at both ends to 5.00 g (SiH valence 4.77 mol / kg) modified polyhedral polysiloxane obtained in Production Example 2 , Vi valence 5.02 mol / kg) 1.92 g, vinylpentamethyldisiloxane (SIV 9090.0, manufactured by Gelest, Vi valence 5.68 mol / kg) 1.23 g, 3-glycidoxypropyltrimethoxysilane 0.20 g of SH6040 manufactured by Toray Dow Corning was added and stirred.
- SIV 9090.0 vinylpentamethyldisiloxane
- Example 10 To the modified polyhedral polysiloxane obtained in Production Example 3, 5.00 g (SiH valence 3.93 mol / kg) was added 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrimethyl.
- Siloxane (Gelest, SID4609.0, weight average molecular weight 385, Vi valence 5.20 mol / kg) 1.64 g, vinyldiphenylmethylsilane (Shin-Etsu Chemical Co., Ltd., LS5600, weight average molecular weight 225, Vi valence 4 .44 mol / kg) 1.17 g and 0.19 g of 3-glycidoxypropyltrimethoxysilane (manufactured by Toray Dow Corning, SH6040) were added and stirred.
- Example 12 To the modified polyhedral polysiloxane obtained in Production Example 2, 5.00 g (SiH valence: 4.77 mol / kg) was added 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrimethyl.
- Siloxane (Gelest, SID4609.0, weight average molecular weight 385, Vi valence 5.20 mol / kg) 1.96 g, vinyldiphenylmethylsilane (Shin-Etsu Chemical Co., Ltd., LS5600, weight average molecular weight 225, Vi valence 4 .44 mol / kg) 2.03 g, 0.22 g of SH6040 manufactured by Toray Dow Corning, which is 3-glycidoxypropyltrimethoxysilane, was added and stirred.
- fumed silica manufactured by Nippon Aerosil Co., Ltd., R812, primary average particle size 7 nm and BET specific surface area 260 (m 2 / g)
- 0.42 ⁇ l of ethynylcyclohexanol, 0.10 ⁇ l of dimethyl maleate, and 0.007 ⁇ l of N, N, N ′, N′-tetramethylethylenediamine were added and stirred, and a xylene solution of a platinum vinylsiloxane complex was added thereto.
- the molded bodies obtained from the polysiloxane compositions of Examples 6 to 12 have high heat resistance and light resistance, and are excellent in crack resistance and gas barrier properties including thermal shock resistance. I understood. Therefore, the polysiloxane composition of the present invention has a low moisture permeability and is suitable for producing a cured product that is also useful as an optical element sealant, and in particular, a sealant for optical devices. It is suitable for doing.
- Example 13 to 16 and Comparative Examples 7 to 8 were evaluated by the following methods. The results are shown in Table 3.
- Example 15 To the modified polyhedral polysiloxane obtained in Production Example 3, 5.00 g (SiH valence 3.93 mol / kg) was added 1,5-divinyl-3,3-diphenyl-1,1,5,5-tetramethyltrimethyl. 1.45 g of siloxane (weight average molecular weight 385, Vi valence 5.20 mol / kg) and camphene (weight average molecular weight 136, Vi valence 7.35 mol / kg) 0.94 g were added and stirred.
- siloxane weight average molecular weight 385, Vi valence 5.20 mol / kg
- camphene weight average molecular weight 136, Vi valence 7.35 mol / kg
- Example 16 Linear polydimethylsiloxane containing a vinyl group at the end (manufactured by Gelest, DMS-V03, weight) on 5.00 g (SiH valence: 4.77 mol / kg) modified polyhedral polysiloxane obtained in Production Example 2 Toray Dow, which has an average molecular weight of 500, Vi valence 4.00 mol / kg) 2.03 g, camphene (weight average molecular weight 136, Vi valence 7.35 mol / kg) 1.32 g, 3-glycidoxypropyltrimethoxysilane 0.21 g of Corning SH6040 was added and stirred.
- the cured products obtained from the polysiloxane compositions of Examples 13 to 16 have high heat resistance and light resistance, and are excellent in crack resistance and cold barrier properties including thermal shock resistance. I understood. Therefore, the polysiloxane composition of the present invention has a low moisture permeability and is suitable for producing a cured product that is also useful as an optical element sealant, and in particular, a sealant for optical devices. It is suitable for doing.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
(B)1分子中にアルケニル基を2個以上有するオルガノポリシロキサン、
を含有するポリシロキサン系組成物であって、
硬化後の透湿度が30g/m2/24h以下であり、
前記(B)成分のオルガノポリシロキサンが、アリール基含有オルガノポリシロキサン(B1)である、および/または、
更に、(C)成分として、1分子中にアルケニル基またはヒドロシリル基を1個有する有機ケイ素化合物(C1)、もしくは、1分子中に炭素-炭素2重結合を1個有する環状オレフィン化合物(C2)を含有する
ことを特徴とするポリシロキサン系組成物。
(4)ヒドロシリル基を有する化合物(b)が、分子末端にヒドロシリル基を含有する直鎖状シロキサンである(1)~(3)のいずれかに記載のポリシロキサン系組成物。
[AR1 2SiO-SiO3/2]a[R2 3SiO-SiO3/2]b
(a+bは6~24の整数、aは1以上の整数、bは0または1以上の整数;Aは、アルケニル基;R1は、アルキル基またはアリール基;R2は、水素原子、アルキル基、アリール基、または、他の多面体骨格ポリシロキサンと連結している基)
で表されるシロキサン単位から構成されるアルケニル基含有多面体構造ポリシロキサン系化合物である(1)~(4)のいずれかに記載のポリシロキサン系組成物。
[XR3 2SiO-SiO3/2]a[R4 3SiO-SiO3/2]b
(a+bは6~24の整数、aは1以上の整数、bは0または1以上の整数;R3は、アルキル基またはアリール基;R4は、アルケニル基、水素原子、アルキル基、アリール基、または、他の多面体骨格ポリシロキサンと連結している基;Xは、下記一般式(1)あるいは一般式(2)のいずれかの構造を有し、Xが複数ある場合はそれぞれのXの構造は同一であっても良いし異なっていてもよい
(nは4~20の整数、xは1~5の整数、n-xは3以上の整数)で表される(1)~(9)および(11)のいずれかに記載のポリシロキサン系組成物。
(14)硬化遅延剤を含有する(1)~(13)のいずれかに記載のポリシロキサン系組成物。
(15)接着性付与剤を含有する(1)~(14)のいずれかに記載のポリシロキサン系組成物。
(16)無機フィラーを含有する(1)~(15)のいずれかに記載のポリシロキサン系組成物。
(18)周波数10Hzで測定した損失正接の極大値が-40℃~50℃の温度範囲に少なくとも1つあり、貯蔵弾性率が50℃において10MPa以下であることを特徴とする(17)に記載の硬化物。
(20)上記ポリシロキサン系組成物を用いてなる光素子封止剤を備えた(19)に記載の光学デバイス。
本発明におけるアルケニル基含有多面体構造ポリシロキサン系化合物(a)は、分子中にアルケニル基を含有する、多面体骨格を有するポリシロキサンであれば、特に限定はない。
[R5SiO3/2]x[R6SiO3/2]y
(x+yは6~24の整数;xは1以上の整数、yは0または1以上の整数;R5はアルケニル基、または、アルケニル基を有する基;R6は、任意の有機基、または、他の多面体骨格ポリシロキサンと連結している基)
で表されるシロキサン単位から構成されるアルケニル基含有多面体構造ポリシロキサン系化合物を好適に用いることができる。
[AR1 2SiO-SiO3/2]a[R2 3SiO-SiO3/2]b
(a+bは6~24の整数、aは1以上の整数、bは0または1以上の整数;Aは、アルケニル基;R1は、アルキル基またはアリール基;R2は、水素原子、アルキル基、アリール基、または、他の多面体骨格ポリシロキサンと連結している基)
で表されるシロキサン単位から構成されるアルケニル基含有多面体構造ポリシロキサン系化合物が好ましいものとして例示される。
本発明で用いるヒドロシリル基を有する化合物は、分子中に1個以上のヒドロシリル基を有していれば特に制限はないが、得られる多面体構造ポリシロキサン変性体の透明性、耐熱性、耐光性の観点から、ヒドロシリル基を有するシロキサン化合物であることが好ましく、さらには、ヒドロシリル基を有する環状シロキサンまたは直鎖状ポリシロキサンであることが好ましい。これらヒドロシリル基を有する化合物は単独で使用してもよく、2種以上を併用してもよい。
本発明では、多面体構造ポリシロキサン変性体(A)の合成、および、該化合物を用いたポリシロキサン系組成物を硬化させる際に、ヒドロシリル化触媒を用いる。
多面体構造ポリシロキサン変性体(A)は、ヒドロシリル化触媒の存在下、アルケニル基含有多面体構造ポリシロキサン系化合物(a)とヒドロシリル基を有する化合物(b)とのヒドロシリル化反応により合成することができる。この際、多面体構造ポリシロキサン系化合物(a)のアルケニル基は、すべて反応する必要はなく、一部残存していてもよい。
[XR3 2SiO-SiO3/2]a[R4 3SiO-SiO3/2]b
(a+bは6~24の整数、aは1以上の整数、bは0または1以上の整数;R3は、アルキル基またはアリール基;R4は、アルケニル基、水素原子、アルキル基、アリール基、または、他の多面体骨格ポリシロキサンと連結している基、Xは、下記一般式(1)あるいは一般式(2)のいずれかの構造を有し、Xが複数ある場合はそれぞれのXの構造は同一であっても良いし異なっていてもよい。
本発明における(B)成分は、1分子中にアルケニル基を2個以上含有していることが好ましく、より好ましくは2~10個である。1分子中のアルケニル基の数が多いと、より架橋構造をとり、本発明のポリシロキサン系組成物を用いた硬化物のガスバリア性は向上するが、多すぎると、耐熱・耐光性が低下する恐れもある。
(B)成分のオルガノポリシロキサンが、アリール基含有オルガノポリシロキサン(B1)であるか、および/または、更に、(C)成分として、1分子中にアルケニル基またはヒドロシリル基を1個有する有機ケイ素化合物(C1)、もしくは、1分子中に炭素-炭素2重結合を1個有する環状オレフィン化合物(C2)を含有する。
このような構成を備えることにより、ポリシロキサン系組成物を用いた硬化物が、耐熱性及び耐侯性を有し、更にガスバリア性に優れたものとなる。
本発明における(B)成分が、アルケニル基を有するアリール基含有オルガノポリシロキサン(B1)である場合、アリール基含有オルガノポリシロキサン(B1)は、一分子中に少なくとも一個アリール基を含有していればよく、そのアリール基は分子の側鎖または末端いずれにあってもよい。
(C1)成分が1分子中にアルケニル基を有する場合、上記(A)成分のヒドロシリル基と反応する。一方、(C1)成分が1分子中にヒドロシリル基を有する場合、上記(B)成分のアルケニル基と反応する。本発明における(C1)成分を用いることで、硬化物の弾性率を低下することができ、さらに、耐冷熱衝撃性を含む耐クラック性、ガスバリア性等を向上することができる。
本発明における1分子中に炭素-炭素2重結合を1個有する環状オレフィン化合物(C2)は、上記(A)成分のヒドロシリル基と反応する。(C2)成分を用いることで、硬化物の弾性率を低下することができ、さらに、耐冷熱衝撃性を含む耐クラック性、破壊強度、ガスバリア性等を向上することができる。
さらに好ましい例としては、下記式
CnH2(n-x)
(nは4~20の整数、xは1~5の整数、n-xは3以上の整数)で表される環状オレフィン化合物が、(b)成分との反応性の観点から好ましい例として挙げられる。
このような環状オレフィン化合物として、脂肪族環状オレフィン化合物、置換脂肪族環状オレフィン化合物等が挙げられる。
本発明では、ポリシロキサン系組成物を硬化させる際に、ヒドロシリル化触媒を用いる。本発明で用いるヒドロシリル化触媒としては、通常ヒドロシリル化触媒として公知のものを用いることができ特に制限はない。
上記ヒドロシリル化触媒の具体例は、上述した通りであり、多面体構造ポリシロキサン変性体(A)の合成の際に使用するヒドロシリル化触媒と同様である。
硬化遅延剤は、本発明のポリシロキサン系組成物の保存安定性を改良あるいは、硬化過程でのヒドロシリル化反応の反応性を調整するための成分であり、任意成分である。本発明においては、硬化遅延剤としては、ヒドロシリル化触媒による付加型硬化性組成物で用いられている公知のものが使用でき、具体的には脂肪族不飽和結合を含有する化合物、有機リン化合物、有機イオウ化合物、窒素含有化合物、スズ系化合物、有機過酸化物等が挙げられる。これらを単独使用、または2種以上併用してもよい。
接着性付与剤は、本発明におけるポリシロキサン系組成物と基材との接着性を向上する目的で用いる任意成分であり、その様な効果があるものであれば特に制限はないが、シランカップリング剤が好ましい例として例示できる。
本発明のポリシロキサン組成物は、必要に応じて無機フィラーを添加することができる。
同様に、BET比表面積についても、特に限定されるものでないが、ガスバリア性の観点から、70m2/g以上であることが好ましく、100m2/g以上であることがより好ましく、さらに200m2/g以上であることが特に好ましい。
(Po:飽和蒸気圧、Vm:単分子層吸着量、気体分子が固体表面で単分子層を形成した時の吸着量、C:吸着熱などに関するパラメータ(>0))
上式より単分子吸着量Vmを算出し、これにガス分子1個の占める断面積を掛けることにより、粒子の表面積を求めることができる。
本発明のポリシロキサン系組成物は、(A)成分に、所定の(B)~(C)成分、更に必要に応じて、ヒドロシリル化触媒、硬化遅延剤、接着性付与剤を加えることにより得ることができる。本発明のポリシロキサン系組成物は、液状樹脂組成物として取り扱うことが可能である。液状組成物とすることにより、型、パッケージ、基板等に流し込み、加熱して硬化させることで、容易に成形体を得ることができる。
本発明のポリシロキサン系組成物を用いて得られた硬化物は、耐熱性、耐侯性及びガスバリア性に優れることは勿論のこと、高硬度、低熱膨張率を有しており、熱寸法安定性に優れる。
本発明におけるポリシロキサン系組成物からなる硬化物は特定の粘弾性挙動を示すものである。
本発明の光学デバイスは、本発明のポリシロキサン系組成物を用いてなる光学デバイスである。
実施例1~5及び比較例1~3の評価は下記の方法により行った。結果は表1に示した。
10cm×10cmの板ガラス2枚を純水で洗浄し、乾燥させた。その後、フッ素系離型剤(ダイキン工業社製ダイフリー、GA6010)でスプレーし、キムワイプで均一に塗布した後、余剰分を除去した。コの字型に切った2mm厚のシリコーンゴムにテフロン(登録商標)シールを巻いたスペーサーを2枚の上記板ガラスで挟んでクリップで固定し、150℃、1h加熱乾燥してガラスセルを作成した。
2mm厚の板状成形体を目視にて観察した。着色などによる色目の変化が見られなかったものを○、見られたものを×と評価した。
200℃に温度設定した熱風循環オーブン内にて、2mm厚の板状成形体を24時間養生し、目視にて観察した。着色などによる色目の変化が見られなかったものを○、見られたものを×と評価した。
スガ試験機(株)製、メタリングウェザーメーター(形式M6T)を用いた。2mm厚の板状成形体を、ブラックパネル温度120℃、放射照度0.53kW/m2で、積算放射照度50MJ/m2まで照射し、目視にて観察した。着色などによる色目の変化が見られなかったものを○、見られたものを×と評価した。
封止剤を型に充填し、対流式オーブンで80℃×2時間、100℃×1時間、150℃×6時間熱硬化させて厚さ2mmの試料を作成した。この硬化物を室温25℃、湿度55%RHの状態で24時間養生した。
透湿度(g/m2/24h)=[(透湿性試験後の試験体総重量(g))-(透湿性試験前の試験体総重量(g))]×10000/9.0cm2
株式会社エノモト製LEDパッケージ(品名:TOP LED 1-IN-1、外形寸法3528、3.5mm×2.8mm×1.9mm、内径2.4mm)に組成物を注入し、対流式オーブンで80℃×2時間、100℃×1時間、150℃×6時間熱硬化させて試料を作成した。この試料を、フロー式ガス腐食試験機(ファクトケイ株式会社製KG130S)内に入れ、40℃、80%RH、硫化水素3ppmの条件下で、96時間、硫化水素暴露試験を行った。試験後、パッケージのリフレクターが変色していなければ○、わずかに変色している場合は△、黒色化している場合は×とした。
48%コリン水溶液(トリメチル-2ヒドロキシエチルアンモニウムハイドロオキサイド水溶液)1262gにテトラエトキシシラン1083gを加え、室温で2時間激しく攪拌した。反応系内が発熱し、均一溶液になった段階で、攪拌を緩め、さらに12時間反応させた。次に、反応系内に生成した固形物に、メタノール1000mLを加え、均一溶液とした。
製造例1で得られた多面体構造ポリシロキサン系化合物であるトリス(ビニルジメチルシロキシ)ペンタキス(トリメチルシロキシ)オクタシルセスキオキサン80.0gをトルエン120.0gに溶解させ、さらに白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)11.22μLを溶解させた。
製造例1で得られた多面体構造ポリシロキサン系化合物であるトリス(ビニルジメチルシロキシ)ペンタキス(トリメチルシロキシ)オクタシルセスキオキサン20.0gをトルエン40.0gに溶解させ、さらに白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)3.85μLを溶解させた。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を含有するフェニルシロキサン(アデカ社製、FX-T350、重量平均分子量460、Vi価数7.41mol/kg)2.56gを加え、良く混合することによりポリシロキサン系組成物を得た。このようにして得られた組成物を型枠およびLEDパッケージに流し込み、80℃で2h、100℃で1h、150℃で6h加熱して硬化させ、評価用成形体を得た。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を含有するフェニルシロキサン(アデカ社製、FX-T180、重量平均分子量490、Vi価数5.02mol/kg)2.71gを加え、良く混合することによりポリシロキサン系組成物を得た。このようにして得られた組成物を型枠およびLEDパッケージに流し込み、80℃で2h、100℃で1h、150℃で6h加熱して硬化させ、評価用成形体を得た。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、1,5-ジビニル-3,3-ジフェニル-1,1,5,5-テトラメチルトリシロキサン(Gelest社製、SID4609.0、重量平均分子量385、Vi価数5.20mol/kg)2.23g、3-グリシドキシプロピルトリメトキシシラン(東レダウコーニング製、SH6040)0.23gを加え、撹拌した。
製造例3で得た多面体構造ポリシロキサン変性体5.00g(SiH価数3.93mol/kg)に、1,5-ジビニル-3,3-ジフェニル-1,1,5,5-テトラメチルトリシロキサン(Gelest社製、SID4609.0、重量平均分子量385、Vi価数5.20mol/kg)2.62g、3-グリシドキシプロピルトリメトキシシラン(東レダウコーニング製、SH6040)0.23gを加え、撹拌した。
製造例2で得た多面体構造ポリシロキサン変性体2.00g(SiH価数4.77mol/kg)に、ビニル基を両末端に含有するフェニルシロキサン(ゲレスト社製、商品名PMV9925、重量平均分子量3000、Vi価数0.67mol/kg)9.53gを加え、良く混合することによりポリシロキサン系組成物を得た。このようにして得られた組成物を型枠およびLEDパッケージに流し込み、80℃で2h、100℃で1h、150℃で6h加熱して硬化させ、評価用成形体を得た。
製造例2で得た多面体構造ポリシロキサン変性体1.00gに、ビニル基を含有するフェニルシロキサン(アデカ社製、FX-T153、重量平均分子量5000、Vi価数0.40mol/kg)9.52gを加え、良く混合することによりポリシロキサン系組成物を得た。このようにして得られた組成物を型枠およびLEDパッケージに流し込み、80℃で2h、100℃で1h、150℃で6h加熱して硬化させ、評価用成形体を得た。
製造例2で得た多面体構造ポリシロキサン変性体0.50gに、ビニル基を両末端に含有するフェニルシロキサン(ゲレスト社製、商品名PDV2331、重量平均分子量10000、Vi価数0.20mol/kg)11.90gを加え、良く混合することによりポリシロキサン系組成物を得た。このようにして得られた組成物を型枠およびLEDパッケージに流し込み、80℃で2h、100℃で1h、150℃で6h加熱して硬化させ、評価用成形体を得た。
製造例2で得た多面体構造ポリシロキサン変性体5.00gに、ビニル基を両末端に含有する直鎖状ポリジメチルシロキサン(クラリアント製、商品名MVD8V、重量平均分子量780、Vi価数2.56mol/kg)8.33gを加え、良く混合することによりポリシロキサン系組成物を得た。このようにして得られた組成物を型枠およびLEDパッケージに流し込み、80℃で2h、100℃で1h、150℃で6h加熱して硬化させ、評価用成形体を得た。
実施例6~12及び比較例4~6の評価は下記の方法により行った。結果は表2に示した。
実施例1~5及び比較例1~3を対象とした方法と同様の方法により行った。
株式会社エノモト製LEDパッケージ(品名:TOP LED 1-IN-1、外形寸法3528、3.5mm×2.8mm×1.9mm、内径2.4mm)に、0.4mm×0.4mm×0.2mmの単結晶シリコンチップ2個を、株式会社ヘンケルジャパン製エポキシ系接着剤(品名:LOCTITE348)で貼り付け、150℃で30分オーブンに入れた。このLEDパッケージにポリシロキサン系組成物を注入し、対流式オーブンで80℃×2時間、100℃×1時間、150℃×6時間熱硬化させて試料を作成した。硬化後の試料を顕微鏡にて観察し、変化が無ければ○、クラックが入ったり、パッケージとの間に剥離が起きたりした場合は×とした。
上記LEDパッケージにポリシロキサン系組成物を注入し、対流式オーブンで80℃×2時間、100℃×1時間、150℃×6時間熱硬化させて試料を作成した。試料を熱衝撃試験機(エスペック製 TSA-71H-W)によって、高温保持100℃、30分間、低温保持-40℃、30分間のサイクルを100サイクル行った後、試料を顕微鏡にて観察した。試験後、変化が無ければ○、クラックが入ったり、パッケージとの間に剥離が起きたりした場合は×とした。
実施例1~5及び比較例1~3を対象とした方法と同様の方法により行った。
実施例1~5及び比較例1~3を対象とした方法と同様の方法により行った。
ポリシロキサン系組成物を型に充填し、対流式オーブンで80℃×2時間、100℃×1時間、150℃×6時間熱硬化させて、長さ35mm、幅5mm、厚さ2mmのサンプルを作成した。
上記の通り作成したサンプルの動的粘弾性を、UBM社製動的粘弾性測定装置ReogelE4000を用い、測定温度-40℃~150℃、昇温速度4℃毎分、歪み4μメートル、周波数10Hz、チャック間25mm、引張モードで測定した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、1,5-ジビニル-3,3-ジフェニル-1,1,5,5-テトラメチルトリシロキサン(Gelest社製、SID4609.0、重量平均分子量385、Vi価数5.20mol/kg)1.74g、ビニルジフェニルメチルシラン(信越化学工業社製、LS5600、重量平均分子量225、Vi価数4.44mol/kg)1.90gを加え、撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、1,5-ジビニル-3,3-ジフェニル-1,1,5,5-テトラメチルトリシロキサン(Gelest社製、SID4609.0、重量平均分子量385、Vi価数5.20mol/kg)1.74g、ビニルジフェニルメチルシラン(信越化学工業社製、LS5600、重量平均分子量225、Vi価数4.44mol/kg)1.90g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.21g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.21μl、マレイン酸ジメチルを0.10μl、N,N,N′,N′-テトラメチルエチレンジアミンを0.016μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.10μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を両末端に含有するフェニルシロキサン(アデカ社製、FX-T180、重量平均分子量490、Vi価数5.02mol/kg)4.33g、ジフェニルメチルシラン(SID4555.0、Gelest社製、SiH価数5.03mol/kg)1.25g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.32g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.48μl、マレイン酸ジメチルを0.56μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.24μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を両末端に含有するフェニルシロキサン(アデカ社製、FX-T180、重量平均分子量490、Vi価数5.02mol/kg)1.92g、ビニルペンタメチルジシロキサン(SIV9090.0、Gelest社製、Vi価数5.68mol/kg)1.23g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.20g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.21μl、マレイン酸ジメチルを0.10μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.12μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例3で得た多面体構造ポリシロキサン変性体5.00g(SiH価数3.93mol/kg)に、1,5-ジビニル-3,3-ジフェニル-1,1,5,5-テトラメチルトリシロキサン(Gelest社製、SID4609.0、重量平均分子量385、Vi価数5.20mol/kg)1.64g、ビニルジフェニルメチルシラン(信越化学工業社製、LS5600、重量平均分子量225、Vi価数4.44mol/kg)1.17g、3-グリシドキシプロピルトリメトキシシラン(東レダウコーニング製、SH6040)を0.19g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.22μl、マレイン酸ジメチルを0.11μl、N,N,N′,N′-テトラメチルエチレンジアミンを0.016μl添加し撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を末端に含有する直鎖状ポリジメチルシロキサン(DMS-V03、Gelest社製)2.20g、ビニルジフェニルメチルシラン(信越化学工業社製、LS5600、重量平均分子量225、Vi価数4.44mol/kg)2.40g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.24g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.21μl、マレイン酸ジメチルを0.10μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.14μl加え撹拌した。さらにN,N,N′,N′-テトラメチルエチレンジアミンを0.006μl添加し撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、1,5-ジビニル-3,3-ジフェニル-1,1,5,5-テトラメチルトリシロキサン(Gelest社製、SID4609.0、重量平均分子量385、Vi価数5.20mol/kg)1.96g、ビニルジフェニルメチルシラン(信越化学工業社製、LS5600、重量平均分子量225、Vi価数4.44mol/kg)2.03g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.22g加え、撹拌した。さらに、ヒュームドシリカ(日本アエロジル社製、R812、一次平均粒径7nmでBET比表面積が260(m2/g))0.539gを添加し、撹拌した。さらに、エチニルシクロヘキサノールを0.42μl、マレイン酸ジメチルを0.10μl、N,N,N′,N′-テトラメチルエチレンジアミンを0.007μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.35μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を両末端に含有するフェニルシロキサン(FX-T180A、アデカ社製)2.71g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.23g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.56μl、マレイン酸ジメチルを0.64μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.10μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、組成物を得た。このようにして得られた組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を末端に含有する直鎖状ポリジメチルシロキサン(クラリアント社製、MVD8MV、重量平均分子量780、Vi価数2.56mol/kg)5.45gを加え、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.31g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.56μl、マレイン酸ジメチルを0.65μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.10μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、組成物を得た。このようにして得られた組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を末端に含有する直鎖状ポリジメチルシロキサン(クラリアント社製、MVD8MV、重量平均分子量780、Vi価数2.56mol/kg)5.45gを加え、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.31g加え、さらに、ヒュームドシリカ(日本アエロジル社製、商品名アエロジルR812、一次平均粒径7nmでBET比表面積が260(m2/g))1.45gを加え、攪拌した。さらに、エチニルシクロヘキサノールを0.56μl、マレイン酸ジメチルを0.65μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.10μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、組成物を得た。このようにして得られた組成物を用いて、前述の各試験法に従い評価した。その結果を表2に記載した。
実施例13~16及び比較例7~8の評価は下記の方法により行った。結果は表3に示した。
実施例1~5及び比較例1~3を対象とした方法と同様の方法により行った。
実施例6~12及び比較例4~6を対象とした方法と同様の方法により行った。
実施例6~12及び比較例4~6を対象とした方法と同様の方法により行った。
実施例6~12及び比較例4~6を対象とした方法と同様の方法により行った。
実施例6~12及び比較例4~6を対象とした方法と同様の方法により行った。
実施例6~12及び比較例4~6を対象とした方法と同様の方法により行った。
実施例6~12及び比較例4~6を対象とした方法と同様の方法により行った。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を両末端に含有するフェニルシロキサン(アデカ社製、重量平均分子量385、Vi価数5.02mol/kg)1.73g、カンフェン(重量平均分子量136、Vi価数7.35mol/kg)1.25gを加え、撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表3に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を両末端に含有するフェニルシロキサン(アデカ社製、FX-T180、重量平均分子量490、Vi価数5.02mol/kg)1.73g、β―ピネン(重量平均分子量136、Vi価数7.35mol/kg)1.09g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.20g加え、撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表3に記載した。
製造例3で得た多面体構造ポリシロキサン変性体5.00g(SiH価数3.93mol/kg)に、1,5-ジビニル-3,3-ジフェニル-1,1,5,5-テトラメチルトリシロキサン(重量平均分子量385、Vi価数5.20mol/kg)1.45g、カンフェン(重量平均分子量136、Vi価数7.35mol/kg)0.94gを加え、撹拌した。さらに、エチニルシクロヘキサノールを0.21μl、マレイン酸ジメチルを0.11μl、N,N,N′,N′-テトラメチルエチレンジアミンを0.008μl添加し攪拌した後、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.10μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表3に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を末端に含有する直鎖状ポリジメチルシロキサン(Gelest社製、DMS-V03、重量平均分子量500、Vi価数4.00mol/kg)2.03g、カンフェン(重量平均分子量136、Vi価数7.35mol/kg)1.32g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.21g加え、撹拌した。さらに、ヒュームドシリカ(日本アエロジル社製、R812、一次平均粒径7nm、BET比表面積が260(m2/g))0.42gを添加し、撹拌した。さらに、エチニルシクロヘキサノールを0.21μl、マレイン酸ジメチルを0.10μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)0.14μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、ポリシロキサン系組成物を得た。このようにして得られたポリシロキサン系組成物を用いて、前述の各試験法に従い評価した。その結果を表3に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を両末端に含有するフェニルシロキサン(アデカ社製、FX-T180、重量平均分子量490、Vi価数5.02mol/kg)2.71g、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.23g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.56μl、マレイン酸ジメチルを0.64μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.10μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、組成物を得た。このようにして得られた組成物を用いて、前述の各試験法に従い評価した。その結果を表3に記載した。
製造例2で得た多面体構造ポリシロキサン変性体5.00g(SiH価数4.77mol/kg)に、ビニル基を末端に含有する直鎖状ポリジメチルシロキサン(クラリアント社製、MVD8MV、重量平均分子量780、Vi価数2.56mol/kg)5.45gを加え、3-グリシドキシプロピルトリメトキシシランである東レダウコーニング製SH6040を0.31g加え、撹拌した。さらに、エチニルシクロヘキサノールを0.56μl、マレイン酸ジメチルを0.65μl添加し撹拌し、これに、白金ビニルシロキサン錯体のキシレン溶液(白金として3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt-VTSC-3X)を0.10μl加え撹拌した後、遊星式攪拌脱泡機にて攪拌・脱泡を行い、組成物を得た。このようにして得られた組成物を用いて、前述の各試験法に従い評価した。その結果を表3に記載した。
Claims (20)
- (A)アルケニル基含有多面体構造ポリシロキサン系化合物(a)に対して、ヒドロシリル基を有する化合物(b)を変性して得られた多面体構造ポリシロキサン変性体、および、
(B)1分子中にアルケニル基を2個以上有するオルガノポリシロキサン、
を含有するポリシロキサン系組成物であって、
硬化後の透湿度が30g/m2/24h以下であり、
前記(B)成分のオルガノポリシロキサンが、アリール基含有オルガノポリシロキサン(B1)である、および/または、
更に、(C)成分として、1分子中にアルケニル基またはヒドロシリル基を1個有する有機ケイ素化合物(C1)、もしくは、1分子中に炭素-炭素2重結合を1個有する環状オレフィン化合物(C2)を含有する
ことを特徴とするポリシロキサン系組成物。 - 多面体構造ポリシロキサン変性体(A)が、温度20℃において液状である請求項1に記載のポリシロキサン系組成物。
- ヒドロシリル基を有する化合物(b)が、ヒドロシリル基を含有する環状シロキサンである請求項1又は2に記載のポリシロキサン系組成物。
- ヒドロシリル基を有する化合物(b)が、分子末端にヒドロシリル基を含有する直鎖状シロキサンである請求項1~3のいずれか1項に記載のポリシロキサン系組成物。
- アルケニル基含有多面体構造ポリシロキサン系化合物(a)が、式
[AR1 2SiO-SiO3/2]a[R2 3SiO-SiO3/2]b
(a+bは6~24の整数、aは1以上の整数、bは0または1以上の整数;Aは、アルケニル基;R1は、アルキル基またはアリール基;R2は、水素原子、アルキル基、アリール基、または、他の多面体骨格ポリシロキサンと連結している基)
で表されるシロキサン単位から構成されるアルケニル基含有多面体構造ポリシロキサン系化合物である請求項1~4のいずれか1項に記載のポリシロキサン系組成物。 - 多面体構造ポリシロキサン変性体(A)が、アルケニル基を含有する多面体構造ポリシロキサン系化合物(a)のアルケニル基1個あたりSi原子に直結した水素原子が2.5~20個になる範囲で、ヒドロシリル基を有する化合物(b)を過剰量加えて変性し、未反応のヒドロシリル基を有する化合物(b)を留去して得られる請求項1~5のいずれか1項に記載のポリシロキサン系組成物。
- 多面体構造ポリシロキサン変性体(A)が、分子中に少なくとも3個のヒドロシリル基を有する請求項1~6のいずれか1項に記載のポリシロキサン系組成物。
- 多面体構造ポリシロキサン変性体(A)が、
[XR3 2SiO-SiO3/2]a[R4 3SiO-SiO3/2]b
(a+bは6~24の整数、aは1以上の整数、bは0または1以上の整数;R3は、アルキル基またはアリール基;R4は、アルケニル基、水素原子、アルキル基、アリール基、または、他の多面体骨格ポリシロキサンと連結している基;Xは、下記一般式(1)あるいは一般式(2)のいずれかの構造を有し、Xが複数ある場合はそれぞれのXの構造は同一であっても良いし異なっていてもよい
- アリール基含有オルガノポリシロキサン(B1)の重量平均分子量が3500以下である請求項1~8のいずれか1項に記載のポリシロキサン系組成物。
- 有機ケイ素化合物(C1)が、アリール基を少なくとも1個以上含有する有機ケイ素化合物である請求項1~9のいずれか1項に記載のポリシロキサン系組成物。
- 環状オレフィン化合物(C2)の重量平均分子量が1000未満である請求項1~9のいずれか1項に記載のポリシロキサン系組成物。
- 環状オレフィン化合物(C2)が、式CnH2(n-x)
(nは4~20の整数、xは1~5の整数、n-xは3以上の整数)で表される請求項1~9および11のいずれか1項に記載のポリシロキサン系組成物。 - ヒドロシリル化触媒を含有する請求項1~12のいずれか1項に記載のポリシロキサン系組成物。
- 硬化遅延剤を含有する請求項1~13のいずれか1項に記載のポリシロキサン系組成物。
- 接着性付与剤を含有する請求項1~14のいずれか1項に記載のポリシロキサン系組成物。
- 無機フィラーを含有する請求項1~15のいずれか1項に記載のポリシロキサン系組成物。
- 請求項1~16のいずれか1項に記載のポリシロキサン系組成物を用いてなることを特徴とする硬化物。
- 周波数10Hzで測定した損失正接の極大値が-40℃~50℃の温度範囲に少なくとも1つあり、貯蔵弾性率が50℃において10MPa以下であることを特徴とする請求項17に記載の硬化物。
- 請求項1~16のいずれか1項に記載のポリシロキサン系組成物を用いてなることを特徴とする光学デバイス。
- 前記ポリシロキサン系組成物を用いてなる光素子封止剤を備えた請求項19に記載の光学デバイス。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180026405.7A CN102918110B (zh) | 2010-05-28 | 2011-05-23 | 聚硅氧烷类组合物、固化物及光学器件 |
KR1020127030204A KR101774306B1 (ko) | 2010-05-28 | 2011-05-23 | 폴리실록산계 조성물, 경화물, 및, 광학 디바이스 |
US13/700,622 US9822248B2 (en) | 2010-05-28 | 2011-05-23 | Polysiloxane composition, hardened material and optical device |
US14/674,718 US9688851B2 (en) | 2010-05-28 | 2015-03-31 | Polysiloxane composition, hardened material and optical device |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-123277 | 2010-05-28 | ||
JP2010123277A JP5620151B2 (ja) | 2010-05-28 | 2010-05-28 | 光学デバイス |
JP2010-153296 | 2010-07-05 | ||
JP2010153296A JP5643009B2 (ja) | 2010-07-05 | 2010-07-05 | オルガノポリシロキサン系組成物を用いた光学デバイス |
JP2011-038456 | 2011-02-24 | ||
JP2011038456 | 2011-02-24 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/700,622 A-371-Of-International US9822248B2 (en) | 2010-05-28 | 2011-05-23 | Polysiloxane composition, hardened material and optical device |
US14/674,718 Division US9688851B2 (en) | 2010-05-28 | 2015-03-31 | Polysiloxane composition, hardened material and optical device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011148896A1 true WO2011148896A1 (ja) | 2011-12-01 |
Family
ID=45003886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/061757 WO2011148896A1 (ja) | 2010-05-28 | 2011-05-23 | ポリシロキサン系組成物、硬化物、及び、光学デバイス |
Country Status (5)
Country | Link |
---|---|
US (2) | US9822248B2 (ja) |
KR (1) | KR101774306B1 (ja) |
CN (2) | CN102918110B (ja) |
TW (1) | TWI498355B (ja) |
WO (1) | WO2011148896A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012039322A1 (ja) * | 2010-09-22 | 2012-03-29 | 株式会社カネカ | 多面体構造ポリシロキサン変性体、多面体構造ポリシロキサン系組成物、硬化物、及び、光半導体デバイス |
JP2012180513A (ja) * | 2011-02-08 | 2012-09-20 | Kaneka Corp | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を用いてなる封止剤、および光学デバイス |
JP2012188655A (ja) * | 2011-02-24 | 2012-10-04 | Kaneka Corp | ポリシロキサン系組成物、該組成物を用いてなる封止剤、および光学デバイス |
JP2013060556A (ja) * | 2011-09-14 | 2013-04-04 | Kaneka Corp | ポリシロキサン系組成物 |
US20130317183A1 (en) * | 2012-05-24 | 2013-11-28 | Lawrence Livermore National Security, Llc | Hybrid polymer networks as ultra low 'k' dielectric layers |
US9035009B2 (en) | 2007-04-17 | 2015-05-19 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
CN104736640A (zh) * | 2012-10-22 | 2015-06-24 | 捷恩智株式会社 | 热硬化性树脂组合物 |
CN104781345A (zh) * | 2012-11-13 | 2015-07-15 | 捷恩智株式会社 | 热硬化性树脂组合物 |
US9688851B2 (en) | 2010-05-28 | 2017-06-27 | Kaneka Corporation | Polysiloxane composition, hardened material and optical device |
WO2017110468A1 (ja) * | 2015-12-24 | 2017-06-29 | Jnc株式会社 | 熱硬化性樹脂組成物 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104321385B (zh) | 2012-05-25 | 2016-08-24 | 株式会社大赛璐 | 固化性树脂组合物及其固化物、密封剂以及光半导体装置 |
WO2014007231A1 (ja) | 2012-07-04 | 2014-01-09 | 株式会社カネカ | ポジ型感光性組成物、薄膜トランジスタ及び化合物 |
EP3645617A4 (en) * | 2017-06-29 | 2021-02-17 | Dow Global Technologies Llc | POLYOLEFINE COMPOSITION |
JP7457450B2 (ja) * | 2017-10-20 | 2024-03-28 | 信越化学工業株式会社 | シリコーン組成物、シリコーンゴム硬化物、及び電力ケーブル |
CN111247199B (zh) * | 2017-10-31 | 2023-02-17 | 陶氏环球技术有限责任公司 | 用于光伏包封膜的聚烯烃组合物 |
JP7064585B2 (ja) * | 2017-10-31 | 2022-05-10 | ダウ グローバル テクノロジーズ エルエルシー | 太陽光発電封止材フィルムのためのポリオレフィン組成物 |
CN110903695B (zh) * | 2019-12-23 | 2022-06-24 | 江门市阪桥电子材料有限公司 | 一种具有高反射性能的硅胶油墨 |
CN113429911B (zh) * | 2021-08-26 | 2021-11-19 | 杭州福斯特应用材料股份有限公司 | 架桥剂、组合物、母料、封装胶膜及电子元器件 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0267290A (ja) * | 1988-06-29 | 1990-03-07 | Akad Wissenschaften Ddr | 鳥かご状構造を有する親油性二重環ケイ酸誘導体、その製造方法及びその使用方法 |
JPH11124502A (ja) * | 1997-08-21 | 1999-05-11 | Kanegafuchi Chem Ind Co Ltd | 封止材料用硬化性組成物 |
WO2008010545A1 (en) * | 2006-07-21 | 2008-01-24 | Kaneka Corporation | Polysiloxane composition, molded body obtained from the same, and optodevice member |
WO2008133138A1 (ja) * | 2007-04-17 | 2008-11-06 | Kaneka Corporation | 多面体構造ポリシロキサン変性体および該変性体を用いた組成物 |
JP2009173759A (ja) * | 2008-01-23 | 2009-08-06 | Kaneka Corp | 多面体構造ポリシロキサン変性体および該変性体を用いた組成物、硬化物 |
JP2009173789A (ja) * | 2008-01-25 | 2009-08-06 | Momentive Performance Materials Inc | 光半導体封止用シリコーン組成物及びそれを用いた光半導体装置 |
JP2010095616A (ja) * | 2008-10-16 | 2010-04-30 | Kaneka Corp | ポリシロキサン系組成物およびそれから得られる硬化物 |
JP2010265410A (ja) * | 2009-05-15 | 2010-11-25 | Kaneka Corp | Led封止剤 |
JP2011042732A (ja) * | 2009-08-20 | 2011-03-03 | Kaneka Corp | Led封止剤 |
Family Cites Families (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4618657A (en) | 1985-03-11 | 1986-10-21 | Desoto, Inc. | Heat curable polysiloxane release coatings which stratify when baked and paper coated therewith |
DE3837397A1 (de) | 1988-11-03 | 1990-05-10 | Wacker Chemie Gmbh | Neue organooligosilsesquioxane |
US5160787A (en) | 1989-01-12 | 1992-11-03 | Mitsubishi Gas Chemical Company, Inc. | Electrical laminate having ability to absorb ultraviolet rays |
DE4316101A1 (de) | 1993-05-13 | 1994-11-17 | Wacker Chemie Gmbh | Organosiliciumverbindungen mit käfigartiger Struktur |
JPH1171462A (ja) | 1997-08-29 | 1999-03-16 | Toshiba Silicone Co Ltd | 新規な含ケイ素重合体 |
JP3511127B2 (ja) | 1997-11-05 | 2004-03-29 | 信越化学工業株式会社 | 接着性シリコーン組成物 |
US5939576A (en) | 1998-01-05 | 1999-08-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of functionalizing polycyclic silicones and the compounds so formed |
JP2979145B1 (ja) | 1998-11-18 | 1999-11-15 | 工業技術院長 | 新型含シルセスキオキサンポリマー及びその製造方法 |
JP2000265066A (ja) | 1999-03-17 | 2000-09-26 | Dow Corning Asia Ltd | 有機溶剤可溶性の水素化オクタシルセスキオキサン−ビニル基含有化合物共重合体及び同共重合体からなる絶縁材料 |
US6252030B1 (en) | 1999-03-17 | 2001-06-26 | Dow Corning Asia, Ltd. | Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture |
US7553904B2 (en) | 1999-08-04 | 2009-06-30 | Hybrid Plastics, Inc. | High use temperature nanocomposite resins |
WO2002100867A1 (en) | 2000-10-27 | 2002-12-19 | The Regents Of The University Of Michigan | Well-defined nanosized building blocks for organic/inorganic nanocomposites |
US6623711B2 (en) | 2001-03-27 | 2003-09-23 | Samsung Electronics Co., Ltd. | Siloxane-based resin and method for forming insulating film between interconnect layers in semiconductor devices by using the same |
JP2002363414A (ja) | 2001-06-12 | 2002-12-18 | Asahi Kasei Corp | 籠状シルセスキオキサン含有組成物 |
JP4381636B2 (ja) | 2001-11-05 | 2009-12-09 | 新日鐵化学株式会社 | シリコーン樹脂組成物及びシリコーン樹脂成形体 |
WO2003042292A2 (de) | 2001-11-17 | 2003-05-22 | Creavis Gesellschaft Für Technologie Und Innovation Mbh | Polyolefinzusammensetzungen, verfahren zu deren herstellung und verwendung dieser zusammensetzungen |
WO2004011525A1 (en) | 2002-07-30 | 2004-02-05 | University Of Connecticut | Nonionic telechelic polymers incorporating polyhedral oligosilsesquioxane (poss) and uses thereof |
AU2003263308A1 (en) | 2002-09-04 | 2004-03-29 | Johnson Matthey Plc | Catalysts |
AU2003261916A1 (en) | 2002-09-13 | 2004-04-30 | Chisso Corporation | Silsesquioxane derivative and process for producing the same |
JP4256756B2 (ja) | 2002-09-30 | 2009-04-22 | 新日鐵化学株式会社 | 官能基を有するかご型シルセスキオキサン樹脂の製造方法 |
JP4142385B2 (ja) | 2002-10-03 | 2008-09-03 | 新日鐵化学株式会社 | シリコーン樹脂組成物及びシリコーン樹脂成形体 |
JP2004175887A (ja) | 2002-11-26 | 2004-06-24 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物 |
DE10258126B3 (de) | 2002-12-12 | 2004-01-29 | Wacker-Chemie Gmbh | Alkinolgruppen aufweisende Organosiliciumverbindungen sowie diese enthaltend vernetzbare Massen und daraus herstellbare Formkörper |
JP4734832B2 (ja) | 2003-05-14 | 2011-07-27 | ナガセケムテックス株式会社 | 光素子用封止材 |
JP2005023256A (ja) | 2003-07-04 | 2005-01-27 | Toagosei Co Ltd | カチオン硬化性組成物 |
WO2005072031A2 (en) | 2004-01-20 | 2005-08-04 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
JP2005290352A (ja) | 2004-03-12 | 2005-10-20 | Asahi Kasei Corp | カゴ状シルセスキオキサン構造を有する化合物 |
JP4742216B2 (ja) | 2004-07-08 | 2011-08-10 | Jnc株式会社 | ケイ素化合物 |
JP4645803B2 (ja) | 2004-10-05 | 2011-03-09 | 信越化学工業株式会社 | かご状オリゴシロキサン構造を有する一官能性モノマー及びその製造方法 |
JP2006131850A (ja) | 2004-11-09 | 2006-05-25 | Toagosei Co Ltd | 熱硬化性組成物 |
US7915369B2 (en) | 2004-12-07 | 2011-03-29 | Panasonic Electric Works Co., Ltd. | Ultraviolet transmissive polyhedral silsesquioxane polymers |
JP2006265514A (ja) | 2005-02-25 | 2006-10-05 | Asahi Kasei Corp | 共重合体およびその製造方法 |
JP2006233155A (ja) | 2005-02-28 | 2006-09-07 | Chisso Corp | 平坦化膜用塗布液および平坦化膜 |
JP2006269402A (ja) | 2005-02-28 | 2006-10-05 | Fuji Photo Film Co Ltd | 絶縁材料形成用組成物および絶縁膜 |
JP2006299150A (ja) | 2005-04-22 | 2006-11-02 | Asahi Kasei Corp | 封止材用組成物及び光学デバイス |
JP2006299149A (ja) | 2005-04-22 | 2006-11-02 | Asahi Kasei Corp | 封止材用組成物及び光学デバイス |
JP4826160B2 (ja) | 2005-07-28 | 2011-11-30 | ナガセケムテックス株式会社 | 光素子封止用樹脂組成物 |
WO2007022367A2 (en) | 2005-08-16 | 2007-02-22 | Hybrid Plastics, Inc. | Preparation of polyhedral oligomeric silsesquioxane silanols and siloxides functionalized with olefinic groups |
DE602006012593D1 (de) * | 2005-08-24 | 2010-04-15 | Nippon Catalytic Chem Ind | Durch Radiation vernetzbare Zusammensetzungen und daraus hergestelte vernetzte Produkte |
KR101156426B1 (ko) | 2005-08-25 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 실세스퀴옥산계 화합물 및 이를 구비한 유기 발광 소자 |
JP2007091935A (ja) | 2005-09-29 | 2007-04-12 | Fujifilm Corp | ポリマー、膜形成用組成物、絶縁膜およびその製造方法 |
US7576140B2 (en) | 2005-10-18 | 2009-08-18 | Sabic Innovative Plastics Ip B.V. | Method of improving abrasion resistance of plastic article and article produced thereby |
JP4935972B2 (ja) | 2005-12-21 | 2012-05-23 | Jsr株式会社 | 光半導体封止用組成物、その製造法および光半導体封止材 |
TWI361205B (en) | 2006-10-16 | 2012-04-01 | Rohm & Haas | Heat stable aryl polysiloxane compositions |
EP2087532A1 (en) | 2006-11-20 | 2009-08-12 | 3M Innovative Properties Company | Optical bonding composition for led light source |
JP5670616B2 (ja) | 2006-12-01 | 2015-02-18 | 株式会社カネカ | ポリシロキサン系組成物 |
JP2008163260A (ja) | 2006-12-28 | 2008-07-17 | Showa Denko Kk | 発光素子封止用樹脂組成物およびランプ |
JP2008291137A (ja) | 2007-05-25 | 2008-12-04 | Kaneka Corp | 硬化性組成物 |
JP5491197B2 (ja) | 2007-12-10 | 2014-05-14 | 株式会社カネカ | アルカリ現像性を有する硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ |
JP2009206124A (ja) | 2008-02-26 | 2009-09-10 | Shin Etsu Chem Co Ltd | Led装置の封止方法及びled装置 |
JP2010031254A (ja) | 2008-06-27 | 2010-02-12 | Showa Denko Kk | ヒドロシリル化反応物およびその製造方法、該ヒドロシリル化反応物を含有する転写材料用硬化性組成物、ならびに該ヒドロシリル化反応物または該転写材料用硬化性組成物を用いた転写層の製造方法 |
KR101498328B1 (ko) | 2008-07-17 | 2015-03-03 | 쥬오 덴끼 고교 가부시키가이샤 | 혼합 탄소 재료 및 비수계 2차 전지용 음극 |
EP2151433A1 (en) | 2008-08-05 | 2010-02-10 | Institut Pasteur | Alkoxypyrazoles and the process for their preparation |
EP2416413A4 (en) | 2009-03-30 | 2014-10-22 | Nippon Steel & Sumitomo Metal Corp | MIXED CARBON MATERIAL AND NEGATIVE ELECTRODE FOR SECONDARY BATTERY USING NONAQUEOUS ELECTROLYTE |
JP2010254927A (ja) | 2009-04-28 | 2010-11-11 | Kaneka Corp | 光硬化可能な組成物 |
JP5571329B2 (ja) | 2009-06-24 | 2014-08-13 | 株式会社カネカ | 多面体構造ポリシロキサン変性体、及び該変性体を含有する組成物。 |
JP2011016968A (ja) | 2009-07-10 | 2011-01-27 | Kaneka Corp | 多面体構造ポリシロキサン変性体、その製造方法および該変性体を含む組成物 |
JP5616042B2 (ja) | 2009-09-25 | 2014-10-29 | 株式会社カネカ | 多面体構造ポリシロキサン系変性体及び組成物 |
WO2011148896A1 (ja) | 2010-05-28 | 2011-12-01 | 株式会社カネカ | ポリシロキサン系組成物、硬化物、及び、光学デバイス |
JP5877081B2 (ja) | 2011-02-08 | 2016-03-02 | 株式会社カネカ | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を用いてなる封止剤、および光学デバイス |
-
2011
- 2011-05-23 WO PCT/JP2011/061757 patent/WO2011148896A1/ja active Application Filing
- 2011-05-23 US US13/700,622 patent/US9822248B2/en active Active
- 2011-05-23 CN CN201180026405.7A patent/CN102918110B/zh active Active
- 2011-05-23 CN CN201510102503.4A patent/CN104744944B/zh active Active
- 2011-05-23 KR KR1020127030204A patent/KR101774306B1/ko active IP Right Grant
- 2011-05-27 TW TW100118777A patent/TWI498355B/zh active
-
2015
- 2015-03-31 US US14/674,718 patent/US9688851B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0267290A (ja) * | 1988-06-29 | 1990-03-07 | Akad Wissenschaften Ddr | 鳥かご状構造を有する親油性二重環ケイ酸誘導体、その製造方法及びその使用方法 |
JPH11124502A (ja) * | 1997-08-21 | 1999-05-11 | Kanegafuchi Chem Ind Co Ltd | 封止材料用硬化性組成物 |
WO2008010545A1 (en) * | 2006-07-21 | 2008-01-24 | Kaneka Corporation | Polysiloxane composition, molded body obtained from the same, and optodevice member |
WO2008133138A1 (ja) * | 2007-04-17 | 2008-11-06 | Kaneka Corporation | 多面体構造ポリシロキサン変性体および該変性体を用いた組成物 |
JP2009173759A (ja) * | 2008-01-23 | 2009-08-06 | Kaneka Corp | 多面体構造ポリシロキサン変性体および該変性体を用いた組成物、硬化物 |
JP2009173789A (ja) * | 2008-01-25 | 2009-08-06 | Momentive Performance Materials Inc | 光半導体封止用シリコーン組成物及びそれを用いた光半導体装置 |
JP2010095616A (ja) * | 2008-10-16 | 2010-04-30 | Kaneka Corp | ポリシロキサン系組成物およびそれから得られる硬化物 |
JP2010265410A (ja) * | 2009-05-15 | 2010-11-25 | Kaneka Corp | Led封止剤 |
JP2011042732A (ja) * | 2009-08-20 | 2011-03-03 | Kaneka Corp | Led封止剤 |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9035009B2 (en) | 2007-04-17 | 2015-05-19 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
US9422405B2 (en) | 2007-04-17 | 2016-08-23 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
US9416231B2 (en) | 2007-04-17 | 2016-08-16 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
US9688851B2 (en) | 2010-05-28 | 2017-06-27 | Kaneka Corporation | Polysiloxane composition, hardened material and optical device |
US9822248B2 (en) | 2010-05-28 | 2017-11-21 | Kaneka Corporation | Polysiloxane composition, hardened material and optical device |
US9698320B2 (en) | 2010-09-22 | 2017-07-04 | Kaneka Corporation | Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device |
WO2012039322A1 (ja) * | 2010-09-22 | 2012-03-29 | 株式会社カネカ | 多面体構造ポリシロキサン変性体、多面体構造ポリシロキサン系組成物、硬化物、及び、光半導体デバイス |
US20130192491A1 (en) * | 2011-02-08 | 2013-08-01 | Kaneka Corporation | Modified polyhedral polysiloxane, composition containing the modified polyhedral polysiloxane, and cured product obtained by curing the composition |
JP2012180513A (ja) * | 2011-02-08 | 2012-09-20 | Kaneka Corp | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を用いてなる封止剤、および光学デバイス |
JP2012188655A (ja) * | 2011-02-24 | 2012-10-04 | Kaneka Corp | ポリシロキサン系組成物、該組成物を用いてなる封止剤、および光学デバイス |
JP2013060556A (ja) * | 2011-09-14 | 2013-04-04 | Kaneka Corp | ポリシロキサン系組成物 |
US20130317183A1 (en) * | 2012-05-24 | 2013-11-28 | Lawrence Livermore National Security, Llc | Hybrid polymer networks as ultra low 'k' dielectric layers |
US9260571B2 (en) * | 2012-05-24 | 2016-02-16 | Lawrence Livermore National Security, Llc | Hybrid polymer networks as ultra low ‘k’ dielectric layers |
US20150291737A1 (en) * | 2012-10-22 | 2015-10-15 | Jnc Corporation | Thermosetting resin composition |
US9512273B2 (en) * | 2012-10-22 | 2016-12-06 | Jnc Corporation | Thermosetting resin composition |
EP2910606A4 (en) * | 2012-10-22 | 2016-04-27 | Jnc Corp | THERMOSETTING RESIN COMPOSITION |
CN104736640A (zh) * | 2012-10-22 | 2015-06-24 | 捷恩智株式会社 | 热硬化性树脂组合物 |
CN104736640B (zh) * | 2012-10-22 | 2018-07-06 | 捷恩智株式会社 | 热硬化性树脂组合物、硬化物、光半导体用组合物、及光半导体元件 |
EP2921526A4 (en) * | 2012-11-13 | 2016-06-15 | Jnc Corp | THERMOSETTING RESIN COMPOSITION |
JPWO2014077216A1 (ja) * | 2012-11-13 | 2017-01-05 | Jnc株式会社 | 熱硬化性樹脂組成物 |
CN104781345B (zh) * | 2012-11-13 | 2017-06-06 | 捷恩智株式会社 | 热硬化性树脂组合物、硬化物、光半导体用组合物以及光半导体元件 |
CN104781345A (zh) * | 2012-11-13 | 2015-07-15 | 捷恩智株式会社 | 热硬化性树脂组合物 |
WO2017110468A1 (ja) * | 2015-12-24 | 2017-06-29 | Jnc株式会社 | 熱硬化性樹脂組成物 |
JPWO2017110468A1 (ja) * | 2015-12-24 | 2018-10-18 | Jnc株式会社 | 熱硬化性樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
US20130131264A1 (en) | 2013-05-23 |
CN104744944A (zh) | 2015-07-01 |
CN104744944B (zh) | 2017-12-19 |
KR20130094715A (ko) | 2013-08-26 |
CN102918110A (zh) | 2013-02-06 |
US20150203677A1 (en) | 2015-07-23 |
KR101774306B1 (ko) | 2017-09-04 |
CN102918110B (zh) | 2015-08-12 |
US9688851B2 (en) | 2017-06-27 |
TWI498355B (zh) | 2015-09-01 |
TW201213396A (en) | 2012-04-01 |
US9822248B2 (en) | 2017-11-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9688851B2 (en) | Polysiloxane composition, hardened material and optical device | |
JP5784618B2 (ja) | 多面体構造ポリシロキサン変性体、多面体構造ポリシロキサン系組成物、硬化物、及び、光半導体デバイス | |
JP5643009B2 (ja) | オルガノポリシロキサン系組成物を用いた光学デバイス | |
JP5965195B2 (ja) | ポリシロキサン系組成物 | |
JP2012201706A (ja) | ポリシロキサン系組成物 | |
JP2011246652A (ja) | ポリシロキサン系組成物 | |
JP5715828B2 (ja) | オルガノポリシロキサン系組成物および硬化物 | |
JP5972544B2 (ja) | オルガノポリシロキサン系組成物および硬化物 | |
JP2013209565A (ja) | 多面体構造ポリシロキサン変性体を含有するポリシロキサン系組成物、該組成物を硬化させてなる硬化物 | |
JP6161252B2 (ja) | ポリオルガノシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP5620151B2 (ja) | 光学デバイス | |
JP5829466B2 (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP5923331B2 (ja) | ポリシロキサン系組成物、該組成物を用いてなる封止剤、および光学デバイス | |
JP5616147B2 (ja) | オルガノポリシロキサン系組成物および、それを用いてなる光学デバイス。 | |
JP5912352B2 (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP5919361B2 (ja) | オルガノポリシロキサン系組成物および硬化物 | |
JP5819089B2 (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP5710998B2 (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP5695372B2 (ja) | オルガノポリシロキサン系組成物および硬化物 | |
JP5873677B2 (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP2012224744A (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、硬化物、および該組成物を用いた光学デバイス | |
JP2013194184A (ja) | 多面体構造ポリシロキサン変性体、該変性体の製造方法、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP6075939B2 (ja) | ポリシロキサン系組成物 | |
JP2013071944A (ja) | オルガノポリシロキサン系組成物からなる光素子封止剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201180026405.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11786595 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20127030204 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13700622 Country of ref document: US |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11786595 Country of ref document: EP Kind code of ref document: A1 |