WO2011139524A3 - Automatic generation of reference spectra for optical monitoring - Google Patents

Automatic generation of reference spectra for optical monitoring Download PDF

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Publication number
WO2011139524A3
WO2011139524A3 PCT/US2011/032650 US2011032650W WO2011139524A3 WO 2011139524 A3 WO2011139524 A3 WO 2011139524A3 US 2011032650 W US2011032650 W US 2011032650W WO 2011139524 A3 WO2011139524 A3 WO 2011139524A3
Authority
WO
WIPO (PCT)
Prior art keywords
spectra
reference spectra
automatic generation
sequence
optical monitoring
Prior art date
Application number
PCT/US2011/032650
Other languages
French (fr)
Other versions
WO2011139524A2 (en
Inventor
Jeffrey Drue David
Harry Q. Lee
Jun Qian
Jimin Zhang
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to JP2013508010A priority Critical patent/JP2013526058A/en
Priority to KR1020127031076A priority patent/KR101762837B1/en
Publication of WO2011139524A2 publication Critical patent/WO2011139524A2/en
Publication of WO2011139524A3 publication Critical patent/WO2011139524A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra.
PCT/US2011/032650 2010-04-28 2011-04-15 Automatic generation of reference spectra for optical monitoring WO2011139524A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013508010A JP2013526058A (en) 2010-04-28 2011-04-15 Automatic generation of reference spectra for optical monitors
KR1020127031076A KR101762837B1 (en) 2010-04-28 2011-04-15 Automatic generation of reference spectra for optical monitoring

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US32901110P 2010-04-28 2010-04-28
US61/329,011 2010-04-28
US35232510P 2010-06-07 2010-06-07
US61/352,325 2010-06-07

Publications (2)

Publication Number Publication Date
WO2011139524A2 WO2011139524A2 (en) 2011-11-10
WO2011139524A3 true WO2011139524A3 (en) 2012-03-08

Family

ID=44904301

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/032650 WO2011139524A2 (en) 2010-04-28 2011-04-15 Automatic generation of reference spectra for optical monitoring

Country Status (4)

Country Link
JP (1) JP2013526058A (en)
KR (1) KR101762837B1 (en)
TW (1) TWI496661B (en)
WO (1) WO2011139524A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10429320B2 (en) * 2013-06-04 2019-10-01 Kla-Tencor Corporation Method for auto-learning tool matching
TWI487888B (en) * 2013-09-30 2015-06-11 Ind Tech Res Inst Scanning grating spectrometer
WO2018071302A1 (en) * 2016-10-10 2018-04-19 Applied Materials, Inc. Real time profile control for chemical mechanical polishing
JP7083279B2 (en) * 2018-06-22 2022-06-10 株式会社荏原製作所 How to identify the trajectory of the eddy current sensor, how to calculate the progress of polishing the substrate, how to stop the operation of the substrate polishing device and how to equalize the progress of polishing the substrate, to execute these methods. The program and the non-transient recording medium on which the program is recorded
JP7341022B2 (en) * 2019-10-03 2023-09-08 株式会社荏原製作所 Substrate polishing equipment and film thickness map creation method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080042895A (en) * 2005-08-22 2008-05-15 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
KR20090112765A (en) * 2007-02-23 2009-10-28 어플라이드 머티어리얼스, 인코포레이티드 Using spectra to determine polishing endpoints
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra
US20100056023A1 (en) * 2008-09-04 2010-03-04 Jeffrey Drue David Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6709314B2 (en) 2001-11-07 2004-03-23 Applied Materials Inc. Chemical mechanical polishing endpoinat detection
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
KR101593927B1 (en) * 2005-08-22 2016-02-15 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US7952708B2 (en) * 2007-04-02 2011-05-31 Applied Materials, Inc. High throughput measurement system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080042895A (en) * 2005-08-22 2008-05-15 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
KR20090112765A (en) * 2007-02-23 2009-10-28 어플라이드 머티어리얼스, 인코포레이티드 Using spectra to determine polishing endpoints
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra
US20100056023A1 (en) * 2008-09-04 2010-03-04 Jeffrey Drue David Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing

Also Published As

Publication number Publication date
KR20130055616A (en) 2013-05-28
KR101762837B1 (en) 2017-08-04
TWI496661B (en) 2015-08-21
TW201141662A (en) 2011-12-01
WO2011139524A2 (en) 2011-11-10
JP2013526058A (en) 2013-06-20

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