WO2011138883A1 - Coating apparatus and coating method - Google Patents

Coating apparatus and coating method Download PDF

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Publication number
WO2011138883A1
WO2011138883A1 PCT/JP2011/058070 JP2011058070W WO2011138883A1 WO 2011138883 A1 WO2011138883 A1 WO 2011138883A1 JP 2011058070 W JP2011058070 W JP 2011058070W WO 2011138883 A1 WO2011138883 A1 WO 2011138883A1
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Prior art keywords
solution
head
temperature
heater
coating
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PCT/JP2011/058070
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French (fr)
Japanese (ja)
Inventor
宏晃 新畑
唯史 塩崎
健一 向井
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シャープ株式会社
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Publication of WO2011138883A1 publication Critical patent/WO2011138883A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing

Definitions

  • the present invention relates to a coating apparatus and a coating method.
  • a film forming process for forming various thin films on the surface of a glass substrate or a semiconductor substrate is performed.
  • the “thin film” here is, for example, an alignment film, a resist film, or the like. These thin films may be collectively referred to as “functional thin films”.
  • a solution may be applied to the substrate surface by an ink jet method or the like.
  • an ink jet type coating apparatus it is common to scan a head capable of ejecting a solution along the substrate surface.
  • Patent Document 1 An example of such a technique is disclosed in Japanese Patent Laid-Open No. 2005-40670.
  • Patent Document 2 a configuration in which a heater is provided inside the head main body in order to reduce the viscosity of the solution so that the liquid can be discharged well is disclosed in Japanese Patent Laid-Open No. 2003-103207 (Patent Document 2). Has been.
  • a work of applying polyimide (also referred to as “PI”) resin to the surface of a glass substrate is performed.
  • the “solution” corresponds to a liquid obtained by dissolving a polyimide resin in a solvent.
  • discharge omission means that a part of a large number of ejection holes provided in the head is clogged and the solution is not supplied only to that part. This is a phenomenon in which a portion having no stripe appears in a streak shape parallel to the scanning direction of the head.
  • PI repellency means that the wettability of the solution is insufficient, so that the solution is repelled due to dirt or structures on the substrate surface, and in the area where the solution should be originally applied on the substrate. This is a phenomenon in which a region where no solution is present locally occurs.
  • the solvent volatilizes from the solution adhering to the ejection holes provided in the head, the remaining components such as polyimide resin are solidified, causing clogging of the ejection holes.
  • the temperature of the member constituting the head rises, in particular, the volatilization of the solvent is promoted, and the residual components of the solution are easily solidified.
  • the present invention provides a coating apparatus and a coating method that can reduce the viscosity of the solution, make clogging less likely, can sufficiently increase the wettability of the solution, and do not cause unevenness for each head as much as possible.
  • the purpose is to provide.
  • a coating apparatus is an ink jet type coating apparatus for coating a substrate by discharging a solution for forming a thin film on the substrate, and stores the solution.
  • Supply tank a head for discharging the solution toward the substrate, a solution supply pipe for guiding the solution from the supply tank to the head, and a temperature of the solution when discharged from the head
  • a heater provided at a position avoiding the head is provided.
  • the heater for raising the temperature of the solution when discharged from the head since the heater for raising the temperature of the solution when discharged from the head is provided, the viscosity of the solution is lowered, clogging is less likely to occur, and the wettability of the solution is improved. Can be high enough. Furthermore, since this heater is provided at a position avoiding the head, it is possible to prevent the temperature of the members constituting the head from rising more than necessary, and as a result, to prevent unevenness of each head as much as possible. Can be.
  • Embodiment 1 It is a conceptual diagram of the coating device in Embodiment 1 based on this invention. It is a conceptual diagram of the coating device in Embodiment 2 based on this invention. It is a conceptual diagram of the coating device in Embodiment 3 based on this invention. It is a flowchart of the coating method in Embodiment 4 based on this invention. It is a flowchart of the preferable 1st example of the coating method in Embodiment 4 based on this invention. It is a flowchart of the preferable 2nd example of the coating method in Embodiment 4 based on this invention. It is a flowchart of the coating method in Embodiment 5 based on this invention.
  • the coating apparatus 101 is an ink jet type coating apparatus for coating the surface 6 a of the substrate 6 by discharging the solution 10 for forming a thin film on the substrate 6 toward the substrate 6.
  • the coating apparatus 101 includes a supply tank 18 for storing the solution 10, a head 7 for spraying the solution 10 toward the substrate 6, and a solution supply pipe 8 for guiding the solution 10 from the supply tank 18 to the head 7. And a heater 21 provided at a position avoiding the head 7 in order to increase the temperature of the solution 10 when discharged from the head 7.
  • the thin film formed on the substrate 6 may be a functional thin film such as an alignment film or a resist film.
  • the solution 10 is obtained by dissolving a thin film material in a solvent.
  • the solution 10 is stored in the lower part of the internal space of the supply tank 18, and the upper part of the internal space is filled with, for example, nitrogen.
  • the coating apparatus 101 includes a pressurized tank 17 in addition to the supply tank 18. Also in the pressurized tank 17, the solution 10 is stored in the lower part of the internal space, and the upper part of the internal space is filled with, for example, nitrogen.
  • the solution 10 is stored frozen in a place not shown, the solution 10 is thawed outside the coating apparatus 101 before use.
  • the thawed solution 10 is first introduced into the pressurized tank 17.
  • the pressurized tank 17 serves to send the solution 10 to the supply tank 18 by applying pressure to the solution 10. Delivery of the solution 10 from the supply tank 18 to the head 7 is performed using a water head difference. A part of the solution 10 that has reached the head 7 through the solution supply pipe 8 is discharged toward the main surface 6 a of the substrate 6 by the operation of a piezoelectric element or the like provided in the head 7. The solution 10 that has not been discharged from the head 7 is returned to the pressurized tank 17 through the solution recovery pipe 9.
  • the coating apparatus 101 includes a support portion 5 that supports the substrate 6 as an object so that the main surface 6a is horizontal.
  • the coating apparatus 101 includes a plurality of heads 7, but the number of heads 7 may be any number as long as it is 1 or more.
  • Each head 7 has a discharge hole for the solution 10 at the lower end.
  • the ejection holes provided in each head 7 may be dot-like holes. It may be a slit-shaped hole.
  • the support portion 5 includes a table 3 and support pins 4.
  • the table 3 is placed on the base 1 via the rail 2 and can be translated using the rail 2.
  • the plurality of heads 7 do not necessarily need to move themselves, and may be stationary.
  • the plurality of heads 7 can be scanned relative to each other in the direction perpendicular to the paper surface in FIG.
  • individual supply pipes 28 branched from the solution supply pipe 8 are connected to the plurality of heads 7, respectively.
  • an individual recovery pipe 29 is connected to each head 7.
  • the individual recovery pipe 29 is connected to the solution recovery pipe 9.
  • the remainder of the solution supplied to each head 7 is recovered through the individual recovery pipe 29 and the solution recovery pipe 9.
  • the valve in the middle of the piping is not shown in FIG. 1, it is preferable that the valve is actually provided in various places in practice.
  • the heater 21 for increasing the temperature of the solution 10 when being ejected from the head 7 is provided. Therefore, by increasing the temperature of the solution 10 with the heater 21, the viscosity of the solution is increased. Can be lowered. As a result, clogging is less likely to occur. Further, the wettability of the solution can be sufficiently increased by increasing the temperature of the solution 10. Further, since the heater 21 is provided at a position avoiding the head 7, it is possible to prevent the temperature of the members constituting the head from rising more than necessary. Therefore, it is possible to avoid the occurrence of temperature variations for each head. As a result, the coating apparatus 101 can minimize the occurrence of unevenness for each head.
  • the heater 21 may be provided at a position avoiding the head 7, that is, at a position other than the head 7. More specifically, as shown in FIG. 1, the heater 21 is preferably provided in the supply tank 18. Considering that the solution 10 toward all the heads 7 is always collected and stored in the supply tank 18 in advance, if the heater 21 is provided in the supply tank 18 as shown in FIG. Since the heating required for the solution 10 can be performed while the solution 10 is intensively stored, the temperature can be increased efficiently. If the heater 21 is provided in the supply tank 18, even when a plurality of heads 7 are used, the solution 10 before being distributed to each head 7 can be heated in a lump. Therefore, it is possible to avoid the occurrence of temperature variations for each head.
  • the heater 21 may be based on a known technique. In this case, as illustrated in FIG. 1, the heater 21 may be provided so as to surround the outer periphery of the supply tank 18.
  • Embodiment 2 With reference to FIG. 2, the coating apparatus 102 in Embodiment 2 based on this invention is demonstrated.
  • a heater 22 is provided along the solution supply pipe 8 instead of the heater 21 provided in the supply tank 18 in the coating apparatus 101 described in the first embodiment.
  • Other configurations are the same as those of the coating apparatus 101 described in the first embodiment.
  • the effects described in the first embodiment can be obtained. Furthermore, since the heater 22 is provided along the solution supply pipe 8 in the coating apparatus 102, the solution 10 passing through the solution supply pipe 8 can be heated. In other words, the solution 10 can be heated at a position close to the head 7, and the degree to which the temperature is lowered due to heat dissipation while the heated solution 10 moves toward the head 7 is reduced. be able to. Therefore, the degree of wasting the heat energy given to the solution 10 can be reduced, and the temperature of the solution 10 can be efficiently raised to a desired temperature.
  • the heater 22 may be based on a known technique.
  • the heater 22 may be provided so as to surround the outer periphery of the solution supply pipe 8.
  • the heater 22 may be provided so as to wrap around the solution supply pipe 8 in a certain section of the solution supply pipe 8.
  • the heaters are located at positions different from the supply tank and the solution supply piping as long as they are located away from the head. It may be provided.
  • the coating apparatus 103 in Embodiment 3 based on this invention includes a sensor 25 for detecting the temperature of the solution 10 in the head 7 and a control unit 26 for controlling the heater 21 based on the detection result of the sensor 25.
  • the control unit 26 is connected to the sensor 25 so that the detection result of the sensor 25 can be received. It is good. How much heating is performed in the heater 21 is determined by the output from the control unit 26.
  • the connection between the heater 21 and the control unit 26 may be wired or wireless.
  • the coating apparatus 103 is illustrated as a configuration in which the heater 21 is provided in the supply tank 18 in the same manner as the coating apparatus 101 described in the first embodiment. It is. Also in the coating apparatus 103, similarly to the coating apparatus 102 shown in the second embodiment, a heater 22 may be provided in the solution supply pipe 8 instead of the supply tank 18. Alternatively, a heater may be provided at a position that is neither the supply tank 18 nor the solution supply pipe 8 as long as the position is away from the head.
  • the temperature of the solution 10 in the head 7 can be detected by providing the sensor 25, and the heater 21 can be controlled by the control unit 26 based on the detection result of the sensor 25. Therefore, the actual temperature of the solution 10 in the head 7 can be brought close to the desired temperature efficiently.
  • the heater is preferably for heating the solution so that the temperature of the solution when it reaches the head is 23 ° C. or higher and 40 ° C. or lower. If the temperature of the solution in the head is less than 23 ° C., the viscosity of the solution increases, and defects such as ejection failure and PI repellency tend to occur. On the other hand, when the temperature of the solution in the head exceeds 40 ° C., the solvent in the solution starts to volatilize, and the concentration of the solution becomes higher than it should be.
  • the viscosity of the solution does not decrease as the temperature rises, and the viscosity of the solution decreases as the temperature rises to some extent, but when the solvent in the solution starts to volatilize, the viscosity of the solution increases again. start. Therefore, as described above, the temperature of the solution in the head is preferably 23 ° C. or higher and 40 ° C. or lower. Even when the heater is installed at a location far away from the head, heating should be performed so that the temperature of the solution at the time of reaching the head is within the above range as a result. .
  • the heating in the heater when it is known in advance that the temperature of the solution is lowered to some extent by heat dissipation before the solution reaches the head, it is preferable to set the heating in the heater higher than the final target temperature. This is true whether the heater is provided in the supply tank or the solution supply pipe.
  • the heater is preferably for heating the solution 10 so that the temperature of the solution when it reaches the head is 28 ° C. or more and 35 ° C. or less. If the temperature of the solution in the head is within this range, the viscosity of the solution can be reduced more reliably, and the volatilization of the solvent in the solution can be more reliably prevented.
  • the coating method in Embodiment 4 is a method for applying the solution to the substrate by discharging a solution for forming a thin film on the substrate toward the surface of the substrate from the head, It includes a step S3 of heating the solution at the avoidance position and a step S4 of discharging the solution from the head.
  • Such a coating method can be performed using a coating apparatus as described in the first to third embodiments.
  • the step S4 is not necessarily performed after the step S3 is completed, and the period in which the step S3 is performed and the period in which the step S4 is performed may overlap. However, the start of step S3 is before the start of step S4.
  • step S3 for heating the solution since step S3 for heating the solution is included in addition to step S4, the viscosity of the solution is lowered to prevent clogging and the wettability of the solution. Can be made high enough. Furthermore, in step S3, the heating location is set at a position avoiding the head, so that it is possible to prevent the temperature of the members constituting the head from rising more than necessary. Therefore, it is possible to minimize the occurrence of unevenness for each head.
  • the coating method in the present embodiment includes step S21 of holding the solution in the supply tank before supplying it to the head, and the heating step 3 is performed in the supply tank. It is preferred that In FIG. 5, step S3 of heating the solution at a position avoiding the head is performed as step S31 of heating the solution in the supply tank. With such an application method, the temperature required for the solution can be increased while the solution is concentrated in the supply tank, so that the temperature can be increased efficiently. Even in the case where a plurality of heads are used in step S4, since the solution before being distributed to each head can be heated in a batch in step S31, variations in temperature occur between heads. You can avoid that.
  • the coating method in the present embodiment includes a step S22 of supplying the solution to the head through a solution supply pipe, and the heating step S3 is performed in the solution supply pipe.
  • step S3 for heating the solution at a position avoiding the head is performed as step S32 for heating the solution in the solution supply pipe.
  • the coating method in Embodiment 5 is demonstrated.
  • the coating method in the present embodiment is based on step S5 in which the temperature of the solution is detected by a sensor provided on the head and the detection result of the sensor. And a step S1 for controlling the heater.
  • Such a coating method can be performed using a coating apparatus as described in the third embodiment.
  • the step S5 is not necessarily performed after the step S3 is completed, and the period in which the step S3 is performed and the period in which the step S5 is performed may overlap. About another part, it is the same as that of the coating method demonstrated in Embodiment 4.
  • step S5 the temperature of the solution can be detected by a sensor provided in the head, and in step S1, the heater can be controlled based on the detection result of the sensor.
  • the actual temperature of the solution in can be brought close to the desired temperature efficiently.
  • the solution in any of the coating methods of Embodiments 4 and 5, in the heating step S3, the solution is heated so that the temperature of the solution when reaching the head is 23 ° C. or higher and 40 ° C. or lower. Heating is preferred.
  • the structure of the apparatus may be designed in advance so that the temperature is within this range.
  • the temperature of the solution may be detected by a sensor in step S5, and the heater may be controlled in step S1 so that the solution reaches the temperature in this range when it reaches the head.
  • the reason why the temperature of the solution at the time of reaching the head is preferably within this range is as described in the third embodiment.
  • the solution is heated so that the temperature of the solution when it reaches the head is 28 ° C. or higher and 35 ° C. or lower.
  • the reason why the temperature of the solution when reaching the head is preferably within this range is as described in the third embodiment.
  • the present invention can be used for a coating apparatus and a coating method.

Abstract

Disclosed is an inkjet type coating apparatus (101), which coats a substrate (6) with a solution (10) by jetting the solution, said solution forming a thin film on the substrate (6). The coating apparatus (101) is provided with: a supply tank (18) for storing the solution (10); a head (7) for jetting the solution (10) toward the substrate (6); solution supply piping (8), for guiding the solution (10) from the supply tank (18) to the head (7); and a heater (21) which is provided at a position where there is no head (7) so as to increase the temperature of the solution (10) at the time of jetting the solution from the head (7).

Description

塗布装置および塗布方法Coating apparatus and coating method
　本発明は、塗布装置および塗布方法に関するものである。 The present invention relates to a coating apparatus and a coating method.
　液晶表示装置や半導体装置の製造方法においては、ガラス基板や半導体基板の表面に各種の薄膜を形成するための成膜工程が行なわれる。ここでいう「薄膜」とは、たとえば配向膜、レジスト膜などである。これらの薄膜は「機能性薄膜」と総称される場合もある。これらの薄膜の成膜工程として、溶液をインクジェット方式などにより基板表面に塗布する場合がある。インクジェット方式の塗布装置の場合、溶液を噴射することができるヘッドを基板表面に沿って走査することが一般的である。そのような技術の一例は、特開２００５－４０６７０号公報（特許文献１）に示されている。 In a manufacturing method of a liquid crystal display device or a semiconductor device, a film forming process for forming various thin films on the surface of a glass substrate or a semiconductor substrate is performed. The “thin film” here is, for example, an alignment film, a resist film, or the like. These thin films may be collectively referred to as “functional thin films”. As a process for forming these thin films, a solution may be applied to the substrate surface by an ink jet method or the like. In the case of an ink jet type coating apparatus, it is common to scan a head capable of ejecting a solution along the substrate surface. An example of such a technique is disclosed in Japanese Patent Laid-Open No. 2005-40670 (Patent Document 1).
　さらに、塗布装置において、溶液の粘度を低下させて液切れ良く吐出できるようにするために、ヘッド本体の内部にヒータを設けた構成が、特開２００３－１０３２０７号公報（特許文献２）に示されている。 Further, in a coating apparatus, a configuration in which a heater is provided inside the head main body in order to reduce the viscosity of the solution so that the liquid can be discharged well is disclosed in Japanese Patent Laid-Open No. 2003-103207 (Patent Document 2). Has been.
特開２００５－４０６７０号公報Japanese Patent Laid-Open No. 2005-40670 特開２００３－１０３２０７号公報JP 2003-103207 A
　液晶表示装置の製造現場においては、ポリイミド（「ＰＩ」ともいう。）樹脂をガラス基板の表面に塗布する作業が行なわれる。この場合、「溶液」に相当するのは、ポリイミド樹脂を溶媒に溶かして得られた液体である。塗布装置によって溶液を基板表面に塗布する際に、吐出抜けやＰＩはじきと呼ばれる現象が生じる場合がある。「吐出抜け」とは、ヘッドに設けられた多数の吐出孔のうちの一部に目詰まりが生じてその部分だけ溶液が供給されないために、基板上の溶液が塗布された領域の中に溶液の無い部分が、ヘッドの走査方向と平行に筋状に現れてしまう現象である。「ＰＩはじき」とは、溶液の濡れ性が不十分であるために、基板表面の汚れや構造物に起因して溶液がはじかれてしまい、基板上の本来溶液が塗布されるべき領域の中に溶液がない領域が局所的に生じてしまう現象である。 In the manufacturing site of a liquid crystal display device, a work of applying polyimide (also referred to as “PI”) resin to the surface of a glass substrate is performed. In this case, the “solution” corresponds to a liquid obtained by dissolving a polyimide resin in a solvent. When a solution is applied to the substrate surface by a coating apparatus, a phenomenon called discharge omission or PI repellency may occur. “Discharge omission” means that a part of a large number of ejection holes provided in the head is clogged and the solution is not supplied only to that part. This is a phenomenon in which a portion having no stripe appears in a streak shape parallel to the scanning direction of the head. “PI repellency” means that the wettability of the solution is insufficient, so that the solution is repelled due to dirt or structures on the substrate surface, and in the area where the solution should be originally applied on the substrate. This is a phenomenon in which a region where no solution is present locally occurs.
　吐出抜けの原因となる目詰まりは、溶液の粘性が高い場合に生じやすくなる。ＰＩはじきは溶液の濡れ性が不十分である場合に生じやすくなる。これらの現象の発生を防止するために、特許文献２に示されているようにヘッドの内部にヒータを設けて溶液の粘度を低下させることも考えられる。しかし、ヘッドの内部にヒータを設けた場合、溶液自体の温度が上がるだけでなく、ヘッドを構成する部材にもヒータから熱が伝わってしまい、ヘッドを構成する部材自体の温度が上がってしまう。 Clogging that causes discharge omission tends to occur when the viscosity of the solution is high. PI repellency is likely to occur when the wettability of the solution is insufficient. In order to prevent the occurrence of these phenomena, it is also conceivable to reduce the viscosity of the solution by providing a heater inside the head as shown in Patent Document 2. However, when a heater is provided inside the head, not only does the temperature of the solution itself rise, but heat is also transmitted from the heater to the members constituting the head, and the temperature of the member constituting the head itself rises.
　ヘッドに設けられた吐出孔に付着した溶液から溶媒が揮発すると残ったポリイミド樹脂などの成分が固化してしまい、吐出孔の目詰まりの原因となる。ヘッドを構成する部材の温度が上がった場合は、特に溶媒の揮発が促進され、溶液の残留成分の固化が起こりやすくなる。 When the solvent volatilizes from the solution adhering to the ejection holes provided in the head, the remaining components such as polyimide resin are solidified, causing clogging of the ejection holes. When the temperature of the member constituting the head rises, in particular, the volatilization of the solvent is promoted, and the residual components of the solution are easily solidified.
　また、大型のガラス基板を用いる場合などは複数のヘッドを並べて使用することが通常であるが、複数のヘッドの各々の内部にヒータを設けた場合、個々のヘッドにおける溶液の温度を一定にすることは難しい。ヘッド毎に温度が不揃いになると、塗布の対象となったガラス基板全体としては得られる薄膜にムラが生じてしまうおそれがある。 In addition, when a large glass substrate is used, it is normal to use a plurality of heads side by side. However, when a heater is provided inside each of the plurality of heads, the temperature of the solution in each head is kept constant. It ’s difficult. If the temperature is uneven for each head, there is a possibility that unevenness occurs in the thin film obtained as the entire glass substrate to be coated.
　そこで、本発明は、溶液の粘性を低くして、目詰まりを生じにくくし、かつ、溶液の濡れ性を十分高くすることができ、かつ、ヘッド毎のムラをなるべく発生させない塗布装置および塗布方法を提供することを目的とする。 Accordingly, the present invention provides a coating apparatus and a coating method that can reduce the viscosity of the solution, make clogging less likely, can sufficiently increase the wettability of the solution, and do not cause unevenness for each head as much as possible. The purpose is to provide.
　上記目的を達成するため、本発明に基づく塗布装置は、基板に薄膜を形成するための溶液を吐出することによって上記基板に塗布するためのインクジェット方式の塗布装置であって、上記溶液を溜めるための供給タンクと、上記溶液を基板に向けて吐出するためのヘッドと、上記供給タンクから上記ヘッドへと上記溶液を導くための溶液供給配管と、上記ヘッドから吐出される際の上記溶液の温度を上げるために、上記ヘッドを避けた位置に設けられたヒータとを備える。 In order to achieve the above object, a coating apparatus according to the present invention is an ink jet type coating apparatus for coating a substrate by discharging a solution for forming a thin film on the substrate, and stores the solution. Supply tank, a head for discharging the solution toward the substrate, a solution supply pipe for guiding the solution from the supply tank to the head, and a temperature of the solution when discharged from the head In order to increase the temperature, a heater provided at a position avoiding the head is provided.
　本発明によれば、ヘッドから吐出される際の溶液の温度を上げるためのヒータが設けられているので、溶液の粘性を低くして、目詰まりを生じにくくし、かつ、溶液の濡れ性を十分高くすることができる。さらに、このヒータはヘッドを避けた位置に設けられているので、ヘッドを構成する部材自体の温度が必要以上に上がることを防止することができ、その結果、ヘッド毎のムラをなるべく発生させないようにすることができる。 According to the present invention, since the heater for raising the temperature of the solution when discharged from the head is provided, the viscosity of the solution is lowered, clogging is less likely to occur, and the wettability of the solution is improved. Can be high enough. Furthermore, since this heater is provided at a position avoiding the head, it is possible to prevent the temperature of the members constituting the head from rising more than necessary, and as a result, to prevent unevenness of each head as much as possible. Can be.
本発明に基づく実施の形態１における塗布装置の概念図である。It is a conceptual diagram of the coating device in Embodiment 1 based on this invention. 本発明に基づく実施の形態２における塗布装置の概念図である。It is a conceptual diagram of the coating device in Embodiment 2 based on this invention. 本発明に基づく実施の形態３における塗布装置の概念図である。It is a conceptual diagram of the coating device in Embodiment 3 based on this invention. 本発明に基づく実施の形態４における塗布方法のフローチャートである。It is a flowchart of the coating method in Embodiment 4 based on this invention. 本発明に基づく実施の形態４における塗布方法の好ましい第１の例のフローチャートである。It is a flowchart of the preferable 1st example of the coating method in Embodiment 4 based on this invention. 本発明に基づく実施の形態４における塗布方法の好ましい第２の例のフローチャートである。It is a flowchart of the preferable 2nd example of the coating method in Embodiment 4 based on this invention. 本発明に基づく実施の形態５における塗布方法のフローチャートである。It is a flowchart of the coating method in Embodiment 5 based on this invention.
　（実施の形態１）
　図１を参照して、本発明に基づく実施の形態１における塗布装置１０１について説明する。塗布装置１０１は、基板６に薄膜を形成するための溶液１０を基板６に向けて吐出することによって基板６の表面６ａに塗布するためのインクジェット方式の塗布装置である。塗布装置１０１は、溶液１０を溜めるための供給タンク１８と、溶液１０を基板６に向けて噴射するためのヘッド７と、供給タンク１８からヘッド７へと溶液１０を導くための溶液供給配管８と、ヘッド７から吐出される際の溶液１０の温度を上げるために、ヘッド７を避けた位置に設けられたヒータ２１とを備える。 (Embodiment 1)
With reference to FIG. 1, the coating apparatus 101 in Embodiment 1 based on this invention is demonstrated. The coating apparatus 101 is an ink jet type coating apparatus for coating the surface 6 a of the substrate 6 by discharging the solution 10 for forming a thin film on the substrate 6 toward the substrate 6. The coating apparatus 101 includes a supply tank 18 for storing the solution 10, a head 7 for spraying the solution 10 toward the substrate 6, and a solution supply pipe 8 for guiding the solution 10 from the supply tank 18 to the head 7. And a heater 21 provided at a position avoiding the head 7 in order to increase the temperature of the solution 10 when discharged from the head 7.
　基板６に形成される薄膜は、たとえば配向膜、レジスト膜などの機能性薄膜であってよい。溶液１０は、薄膜の材料を溶媒に溶解したものである。塗布装置１０１の使用時には、供給タンク１８の内部空間の下部に溶液１０が溜められ、内部空間の上部にはたとえば窒素が充填される。塗布装置１０１は、供給タンク１８の他に加圧タンク１７を備えている。加圧タンク１７においても内部空間の下部に溶液１０が溜められ、内部空間の上部にはたとえば窒素が充填される。溶液１０が図示しない場所で冷凍保存されていた場合、使用前に塗布装置１０１外で溶液１０の解凍が行なわれる。解凍された溶液１０はまず加圧タンク１７に導入される。加圧タンク１７は溶液１０に圧力を加えることによって溶液１０を供給タンク１８に送り込む役割を果たす。供給タンク１８からヘッド７への溶液１０の送出は、水頭差を利用して行なわれる。溶液供給配管８を通ってヘッド７に到達した溶液１０の一部は、ヘッド７内に設けられた圧電素子などの動作により基板６の主表面６ａに向けて吐出される。ヘッド７において吐出されなかった溶液１０は、溶液回収配管９を通って加圧タンク１７に戻される。 The thin film formed on the substrate 6 may be a functional thin film such as an alignment film or a resist film. The solution 10 is obtained by dissolving a thin film material in a solvent. When the coating apparatus 101 is used, the solution 10 is stored in the lower part of the internal space of the supply tank 18, and the upper part of the internal space is filled with, for example, nitrogen. The coating apparatus 101 includes a pressurized tank 17 in addition to the supply tank 18. Also in the pressurized tank 17, the solution 10 is stored in the lower part of the internal space, and the upper part of the internal space is filled with, for example, nitrogen. When the solution 10 is stored frozen in a place not shown, the solution 10 is thawed outside the coating apparatus 101 before use. The thawed solution 10 is first introduced into the pressurized tank 17. The pressurized tank 17 serves to send the solution 10 to the supply tank 18 by applying pressure to the solution 10. Delivery of the solution 10 from the supply tank 18 to the head 7 is performed using a water head difference. A part of the solution 10 that has reached the head 7 through the solution supply pipe 8 is discharged toward the main surface 6 a of the substrate 6 by the operation of a piezoelectric element or the like provided in the head 7. The solution 10 that has not been discharged from the head 7 is returned to the pressurized tank 17 through the solution recovery pipe 9.
　図１に示した例では、塗布装置１０１は、対象物としての基板６を主表面６ａが水平となるように支持する支持部５を含む。塗布装置１０１は複数のヘッド７を備えているが、ヘッド７の個数は１以上であれば何個であってもよい。各ヘッド７は下端に溶液１０の吐出孔を備える。各ヘッド７に設けられた吐出孔は、点状の孔であってもよく。スリット状の孔であってもよい。 In the example shown in FIG. 1, the coating apparatus 101 includes a support portion 5 that supports the substrate 6 as an object so that the main surface 6a is horizontal. The coating apparatus 101 includes a plurality of heads 7, but the number of heads 7 may be any number as long as it is 1 or more. Each head 7 has a discharge hole for the solution 10 at the lower end. The ejection holes provided in each head 7 may be dot-like holes. It may be a slit-shaped hole.
　図１に示すように、支持部５はテーブル３と支持ピン４とを含む。テーブル３は、ベース１の上にレール２を介して載置されており、レール２を利用して平行移動することができる。この構成においては、複数のヘッド７自体は必ずしも自ら移動する必要はなく、静止していてもよい。複数のヘッド７は、支持部５がレール５を利用して移動することによって、図１における紙面垂直方向に関する相対的な走査が可能となっている。 As shown in FIG. 1, the support portion 5 includes a table 3 and support pins 4. The table 3 is placed on the base 1 via the rail 2 and can be translated using the rail 2. In this configuration, the plurality of heads 7 do not necessarily need to move themselves, and may be stationary. The plurality of heads 7 can be scanned relative to each other in the direction perpendicular to the paper surface in FIG.
　図１に示すように、複数のヘッド７に対しては、溶液供給配管８から枝分かれした個別供給配管２８がそれぞれ接続されている。各ヘッド７には個別供給配管２８の他に個別回収配管２９が接続されている。個別回収配管２９は溶液回収配管９に接続されている。各ヘッド７に供給された溶液のうち余ったものは個別回収配管２９および溶液回収配管９を通じて回収されることとなっている。図１では配管の途中における弁を図示していないが、実際には弁が各所に適宜設けられていることが好ましい。 As shown in FIG. 1, individual supply pipes 28 branched from the solution supply pipe 8 are connected to the plurality of heads 7, respectively. In addition to the individual supply pipe 28, an individual recovery pipe 29 is connected to each head 7. The individual recovery pipe 29 is connected to the solution recovery pipe 9. The remainder of the solution supplied to each head 7 is recovered through the individual recovery pipe 29 and the solution recovery pipe 9. Although the valve in the middle of the piping is not shown in FIG. 1, it is preferable that the valve is actually provided in various places in practice.
　本実施の形態における塗布装置１０１では、ヘッド７から吐出される際の溶液１０の温度を上げるためのヒータ２１が設けられているので、ヒータ２１で溶液１０の温度を上げることによって、溶液の粘性を低くすることができる。その結果、目詰まりを生じにくくなる。また、溶液１０の温度が上がることにより、溶液の濡れ性を十分高くすることができる。さらに、このヒータ２１はヘッド７を避けた位置に設けられているので、ヘッドを構成する部材自体の温度が必要以上に上がることを防止することができる。したがって、ヘッド毎の温度のばらつきが生じることを回避することができる。その結果、塗布装置１０１は、ヘッド毎のムラをなるべく発生させないようにすることができる。 In the coating apparatus 101 according to the present embodiment, the heater 21 for increasing the temperature of the solution 10 when being ejected from the head 7 is provided. Therefore, by increasing the temperature of the solution 10 with the heater 21, the viscosity of the solution is increased. Can be lowered. As a result, clogging is less likely to occur. Further, the wettability of the solution can be sufficiently increased by increasing the temperature of the solution 10. Further, since the heater 21 is provided at a position avoiding the head 7, it is possible to prevent the temperature of the members constituting the head from rising more than necessary. Therefore, it is possible to avoid the occurrence of temperature variations for each head. As a result, the coating apparatus 101 can minimize the occurrence of unevenness for each head.
　本実施の形態では、ヒータ２１は、ヘッド７を避けた位置すなわちヘッド７以外の位置に設けられていればよい。より具体的には図１に示すように、ヒータ２１は供給タンク１８に設けられることが好ましい。全てのヘッド７に向かう溶液１０が必ず事前に供給タンク１８に集められ貯留されることを考慮すれば、図１に示すようにヒータ２１が供給タンク１８に設けられていれば、供給タンク１８に溶液１０が集中的に貯留されている間に溶液１０に必要な加温を施せるので、効率良く温度を上げることができる。ヒータ２１を供給タンク１８に設けることとすれば、複数のヘッド７が用いられている場合であっても、各ヘッド７に分配される前の溶液１０に対して一括して加熱することができるので、ヘッド毎の温度のばらつきが生じることを回避することができる。 In the present embodiment, the heater 21 may be provided at a position avoiding the head 7, that is, at a position other than the head 7. More specifically, as shown in FIG. 1, the heater 21 is preferably provided in the supply tank 18. Considering that the solution 10 toward all the heads 7 is always collected and stored in the supply tank 18 in advance, if the heater 21 is provided in the supply tank 18 as shown in FIG. Since the heating required for the solution 10 can be performed while the solution 10 is intensively stored, the temperature can be increased efficiently. If the heater 21 is provided in the supply tank 18, even when a plurality of heads 7 are used, the solution 10 before being distributed to each head 7 can be heated in a lump. Therefore, it is possible to avoid the occurrence of temperature variations for each head.
　なお、ヒータ２１は公知技術によるものであってよい。この場合、ヒータ２１は、図１に例示するように、供給タンク１８の外周を取囲むように設けられていてもよい。 In addition, the heater 21 may be based on a known technique. In this case, as illustrated in FIG. 1, the heater 21 may be provided so as to surround the outer periphery of the supply tank 18.
　（実施の形態２）
　図２を参照して、本発明に基づく実施の形態２における塗布装置１０２について説明する。塗布装置１０２では、実施の形態１で説明した塗布装置１０１において供給タンク１８に設けられていたヒータ２１の代わりに、ヒータ２２が溶液供給配管８に沿うように設けられている。他の構成は、実施の形態１で説明した塗布装置１０１と同様である。 (Embodiment 2)
With reference to FIG. 2, the coating apparatus 102 in Embodiment 2 based on this invention is demonstrated. In the coating apparatus 102, a heater 22 is provided along the solution supply pipe 8 instead of the heater 21 provided in the supply tank 18 in the coating apparatus 101 described in the first embodiment. Other configurations are the same as those of the coating apparatus 101 described in the first embodiment.
　本実施の形態における塗布装置１０２では、実施の形態１で説明した作用効果を得ることができる。さらに、塗布装置１０２では、ヒータ２２が溶液供給配管８に沿うように設けられているので、溶液供給配管８を通過中の溶液１０を加熱することができる。これは言い換えれば、ヘッド７に近い位置で溶液１０を加熱することができるということであり、加熱後の溶液１０がヘッド７に向かって移動する間に放熱して温度が下がってしまう度合いを減らすことができる。したがって、溶液１０に与えた熱エネルギを無駄にする度合いを減らすことができ、効率良く、溶液１０の温度を所望の温度にまで上げることができる。 In the coating apparatus 102 in the present embodiment, the effects described in the first embodiment can be obtained. Furthermore, since the heater 22 is provided along the solution supply pipe 8 in the coating apparatus 102, the solution 10 passing through the solution supply pipe 8 can be heated. In other words, the solution 10 can be heated at a position close to the head 7, and the degree to which the temperature is lowered due to heat dissipation while the heated solution 10 moves toward the head 7 is reduced. be able to. Therefore, the degree of wasting the heat energy given to the solution 10 can be reduced, and the temperature of the solution 10 can be efficiently raised to a desired temperature.
　なお、ヒータ２２は公知技術によるものであってよい。この場合、ヒータ２２は、溶液供給配管８の外周を取囲むように設けられていてもよい。ヒータ２２が管状または線状のものである場合は、ヒータ２２が溶液供給配管８の一定区間においての溶液供給配管８の周りに巻き付くように設けられていてもよい。 In addition, the heater 22 may be based on a known technique. In this case, the heater 22 may be provided so as to surround the outer periphery of the solution supply pipe 8. When the heater 22 is tubular or linear, the heater 22 may be provided so as to wrap around the solution supply pipe 8 in a certain section of the solution supply pipe 8.
　なお、実施の形態１，２では、ヒータを設ける場所として代表的な２つの例を示したが、ヒータは、ヘッドを避けた位置でありさえすれば、供給タンクとも溶液供給配管とも異なる位置に設けられていてもよい。 In the first and second embodiments, two typical examples of locations where heaters are provided are shown. However, the heaters are located at positions different from the supply tank and the solution supply piping as long as they are located away from the head. It may be provided.
　（実施の形態３）
　図３を参照して、本発明に基づく実施の形態３における塗布装置１０３について説明する。塗布装置１０３は、ヘッド７において溶液１０の温度を検出するためのセンサ２５と、センサ２５の検出結果に基づいてヒータ２１を制御するための制御部２６とを備える。図３に示した例においては、制御部２６はセンサ２５の検出結果を受け取ることができるようにセンサ２５と接続されているが、センサ２５からの出力は有線方式に限らず無線方式で受け取ることとしてもよい。ヒータ２１においてどの程度の加熱を行なうかは、制御部２６からの出力によって決定される。ヒータ２１と制御部２６との接続は、有線方式であっても無線方式であってもよい。 (Embodiment 3)
With reference to FIG. 3, the coating apparatus 103 in Embodiment 3 based on this invention is demonstrated. The coating device 103 includes a sensor 25 for detecting the temperature of the solution 10 in the head 7 and a control unit 26 for controlling the heater 21 based on the detection result of the sensor 25. In the example illustrated in FIG. 3, the control unit 26 is connected to the sensor 25 so that the detection result of the sensor 25 can be received. It is good. How much heating is performed in the heater 21 is determined by the output from the control unit 26. The connection between the heater 21 and the control unit 26 may be wired or wireless.
　他の部分の構成は、実施の形態１で説明した塗布装置１０１と同様である。図３では、塗布装置１０３は、実施の形態１で示した塗布装置１０１と同様に供給タンク１８にヒータ２１が設けられた構成として図示しているが、これはヒータの設置位置に関してはあくまで一例である。塗布装置１０３においても、実施の形態２で示した塗布装置１０２と同様に、供給タンク１８の代わりに溶液供給配管８にヒータ２２を設けることとしてもよい。あるいは、ヘッドを避けた位置でありさえすれば、供給タンク１８でも溶液供給配管８でもない位置にヒータが設けられていてもよい。 The configuration of other parts is the same as that of the coating apparatus 101 described in the first embodiment. In FIG. 3, the coating apparatus 103 is illustrated as a configuration in which the heater 21 is provided in the supply tank 18 in the same manner as the coating apparatus 101 described in the first embodiment. It is. Also in the coating apparatus 103, similarly to the coating apparatus 102 shown in the second embodiment, a heater 22 may be provided in the solution supply pipe 8 instead of the supply tank 18. Alternatively, a heater may be provided at a position that is neither the supply tank 18 nor the solution supply pipe 8 as long as the position is away from the head.
　本実施の形態における塗布装置１０３では、センサ２５を備えることによってヘッド７における溶液１０の温度を検出することができ、センサ２５の検出結果に基づいて、制御部２６によってヒータ２１を制御することができるので、ヘッド７における溶液１０の現実の温度を所望の温度に効率良く近づけることができる。 In the coating apparatus 103 in the present embodiment, the temperature of the solution 10 in the head 7 can be detected by providing the sensor 25, and the heater 21 can be controlled by the control unit 26 based on the detection result of the sensor 25. Therefore, the actual temperature of the solution 10 in the head 7 can be brought close to the desired temperature efficiently.
　なお、ヒータはヘッドに到達した時点での溶液の温度が２３℃以上４０℃以下になるように溶液を加熱するためのものであることが好ましい。ヘッドにおける溶液の温度が２３℃未満であれば、溶液の粘性が高くなり、吐出抜けやＰＩはじきといった不良が生じやすくなる。一方、ヘッドにおける溶液の温度が４０℃を超えた場合は、溶液中の溶媒が揮発し始め、溶液の濃度が本来あるべき濃度より高まってしまう。また、溶液の粘性は温度が上がれば上がるほど低くなるわけではなく、ある程度までは温度の上昇につれて溶液の粘性が低下するが、溶液中の溶媒の揮発が始まると、溶液の粘性は再び高くなり始める。したがって、上述のように、ヘッドにおける溶液の温度は２３℃以上４０℃以下となることが好ましい。ヒータがヘッドから遠く離れた場所に設置されている場合であっても、結果的にヘッドに到達した時点での溶液の温度が上述の範囲内となるように調整して加熱をするべきである。したがって、溶液がヘッドに到達するまでに放熱によって溶液の温度がある程度下がることが予めわかっている場合には、ヒータにおける加熱は最終的に目的とする温度より高めに設定しておくことが好ましい。ヒータが供給タンクに設けられている場合であっても、溶液供給配管に設けられている場合であっても、これはあてはまることである。 The heater is preferably for heating the solution so that the temperature of the solution when it reaches the head is 23 ° C. or higher and 40 ° C. or lower. If the temperature of the solution in the head is less than 23 ° C., the viscosity of the solution increases, and defects such as ejection failure and PI repellency tend to occur. On the other hand, when the temperature of the solution in the head exceeds 40 ° C., the solvent in the solution starts to volatilize, and the concentration of the solution becomes higher than it should be. In addition, the viscosity of the solution does not decrease as the temperature rises, and the viscosity of the solution decreases as the temperature rises to some extent, but when the solvent in the solution starts to volatilize, the viscosity of the solution increases again. start. Therefore, as described above, the temperature of the solution in the head is preferably 23 ° C. or higher and 40 ° C. or lower. Even when the heater is installed at a location far away from the head, heating should be performed so that the temperature of the solution at the time of reaching the head is within the above range as a result. . Therefore, when it is known in advance that the temperature of the solution is lowered to some extent by heat dissipation before the solution reaches the head, it is preferable to set the heating in the heater higher than the final target temperature. This is true whether the heater is provided in the supply tank or the solution supply pipe.
　温度範囲をより特定すれば、ヒータはヘッドに到達した時点での溶液の温度が２８℃以上３５℃以下になるように溶液１０を加熱するためのものであることが好ましい。ヘッドにおける溶液の温度がこの範囲内であれば、溶液の粘度をより確実に低くすることができ、なおかつ、溶液中の溶媒の揮発をより確実に防止することができる。 More specifically, the heater is preferably for heating the solution 10 so that the temperature of the solution when it reaches the head is 28 ° C. or more and 35 ° C. or less. If the temperature of the solution in the head is within this range, the viscosity of the solution can be reduced more reliably, and the volatilization of the solvent in the solution can be more reliably prevented.
　（実施の形態４）
　図４を参照して、本発明に基づく実施の形態４における塗布方法について説明する。本実施の形態における塗布方法は、基板に薄膜を形成するための溶液を前記基板の表面に向けてヘッドから吐出することによって前記基板に前記溶液を塗布するための方法であって、前記ヘッドを避けた位置において前記溶液を加熱する工程Ｓ３と、前記ヘッドから前記溶液を吐出する工程Ｓ４とを含む。このような塗布方法は、実施の形態１～３で説明したような塗布装置を用いて行なうことができる。工程Ｓ４は必ずしも工程Ｓ３が終了した後に行なわれるとは限らず、工程Ｓ３が行なわれている期間と工程Ｓ４が行なわれている期間とが重なっていてもよい。ただし、工程Ｓ３の開始は、工程Ｓ４の開始より前である。 (Embodiment 4)
With reference to FIG. 4, the coating method in Embodiment 4 based on this invention is demonstrated. The coating method in the present embodiment is a method for applying the solution to the substrate by discharging a solution for forming a thin film on the substrate toward the surface of the substrate from the head, It includes a step S3 of heating the solution at the avoidance position and a step S4 of discharging the solution from the head. Such a coating method can be performed using a coating apparatus as described in the first to third embodiments. The step S4 is not necessarily performed after the step S3 is completed, and the period in which the step S3 is performed and the period in which the step S4 is performed may overlap. However, the start of step S3 is before the start of step S4.
　本実施の形態における塗布方法によれば、工程Ｓ４のほかに、溶液を加熱する工程Ｓ３を含んでいるので、溶液の粘性を低くして、目詰まりを生じにくくし、かつ、溶液の濡れ性を十分高くすることができる。さらに、工程Ｓ３において、加熱を行なう場所をヘッドを避けた位置としているので、ヘッドを構成する部材自体の温度が必要以上に上がることを防止することができる。したがって、ヘッド毎のムラをなるべく発生させないようにすることができる。 According to the coating method in the present embodiment, since step S3 for heating the solution is included in addition to step S4, the viscosity of the solution is lowered to prevent clogging and the wettability of the solution. Can be made high enough. Furthermore, in step S3, the heating location is set at a position avoiding the head, so that it is possible to prevent the temperature of the members constituting the head from rising more than necessary. Therefore, it is possible to minimize the occurrence of unevenness for each head.
　なお、本実施の形態における塗布方法としては、図５に示すように、前記溶液を前記ヘッドに供給する前に供給タンクに保持する工程Ｓ２１を含み、前記加熱する工程３は前記供給タンクにおいて行なわれることが好ましい。図５では、ヘッドを避けた位置において溶液を加熱する工程Ｓ３は、供給タンクにおいて溶液を加熱する工程Ｓ３１として行なわれている。このような塗布方法とすれば、供給タンクに溶液が集中的に貯留されている間に溶液に必要な加温を施せるので、効率良く温度を上げることができる。工程Ｓ４で複数のヘッドが用いられている場合であっても、工程Ｓ３１では各ヘッドに分配される前の溶液に対して一括して加熱することができるので、ヘッド毎の温度のばらつきが生じることを回避することができる。 As shown in FIG. 5, the coating method in the present embodiment includes step S21 of holding the solution in the supply tank before supplying it to the head, and the heating step 3 is performed in the supply tank. It is preferred that In FIG. 5, step S3 of heating the solution at a position avoiding the head is performed as step S31 of heating the solution in the supply tank. With such an application method, the temperature required for the solution can be increased while the solution is concentrated in the supply tank, so that the temperature can be increased efficiently. Even in the case where a plurality of heads are used in step S4, since the solution before being distributed to each head can be heated in a batch in step S31, variations in temperature occur between heads. You can avoid that.
　なお、本実施の形態における塗布方法としては、図６に示すように、前記溶液を溶液供給配管を通じて前記ヘッドに供給する工程Ｓ２２を含み、前記加熱する工程Ｓ３は前記溶液供給配管において行なわれることが好ましい。図６では、ヘッドを避けた位置において溶液を加熱する工程Ｓ３は、溶液供給配管において溶液を加熱する工程Ｓ３２として行なわれている。このような塗布方法とすれば、ヘッドに近い位置で溶液を加熱することができるので、加熱後の溶液がヘッドに向かって移動する間に放熱して温度が下がってしまう度合いを減らすことができる。したがって、溶液に与えた熱エネルギを無駄にする度合いを減らすことができ、効率良く、溶液の温度を所望の温度にまで上げることができる。 As shown in FIG. 6, the coating method in the present embodiment includes a step S22 of supplying the solution to the head through a solution supply pipe, and the heating step S3 is performed in the solution supply pipe. Is preferred. In FIG. 6, step S3 for heating the solution at a position avoiding the head is performed as step S32 for heating the solution in the solution supply pipe. With such a coating method, the solution can be heated at a position close to the head, so that the degree to which the temperature is lowered by releasing heat while the heated solution moves toward the head can be reduced. . Therefore, the degree of wasting the heat energy given to the solution can be reduced, and the temperature of the solution can be efficiently raised to a desired temperature.
　（実施の形態５）
　図７を参照して、本発明に基づく実施の形態５における塗布方法について説明する。本実施の形態における塗布方法は、実施の形態４で述べた工程Ｓ３，Ｓ４に加えて、前記ヘッドに設けたセンサによって前記溶液の温度を検出する工程Ｓ５と、前記センサの検出結果に基づいて前記ヒータを制御する工程Ｓ１とを含む。このような塗布方法は、実施の形態３で説明したような塗布装置を用いて行なうことができる。工程Ｓ５は必ずしも工程Ｓ３が終了した後に行なわれるとは限らず、工程Ｓ３が行なわれている期間と工程Ｓ５が行なわれている期間とが重なっていてもよい。他の部分については、実施の形態４で説明した塗布方法と同様である。 (Embodiment 5)
With reference to FIG. 7, the coating method in Embodiment 5 based on this invention is demonstrated. In addition to steps S3 and S4 described in the fourth embodiment, the coating method in the present embodiment is based on step S5 in which the temperature of the solution is detected by a sensor provided on the head and the detection result of the sensor. And a step S1 for controlling the heater. Such a coating method can be performed using a coating apparatus as described in the third embodiment. The step S5 is not necessarily performed after the step S3 is completed, and the period in which the step S3 is performed and the period in which the step S5 is performed may overlap. About another part, it is the same as that of the coating method demonstrated in Embodiment 4. FIG.
　本実施の形態における塗布方法では、工程Ｓ５において、ヘッドに設けたセンサによって溶液の温度を検出することができ、工程Ｓ１において、センサの検出結果に基づいてヒータを制御することができるので、ヘッドにおける溶液の現実の温度を所望の温度に効率良く近づけることができる。 In the coating method in the present embodiment, in step S5, the temperature of the solution can be detected by a sensor provided in the head, and in step S1, the heater can be controlled based on the detection result of the sensor. The actual temperature of the solution in can be brought close to the desired temperature efficiently.
　なお、実施の形態４，５のいずれの塗布方法においても、前記加熱する工程Ｓ３においては、前記ヘッドに到達した時点での前記溶液の温度が２３℃以上４０℃以下になるように前記溶液が加熱されることが好ましい。予めこの範囲の温度になるように装置の構造を設計してもよい。実施の形態５の塗布方法のように工程Ｓ５によってセンサで溶液の温度を検出し、ヘッドに到達した時点での溶液がこの範囲の温度になるように工程Ｓ１によりヒータを制御してもよい。ヘッドに到達した時点での前記溶液の温度がこの範囲内となることが好ましい理由は、実施の形態３で述べたとおりである。 In any of the coating methods of Embodiments 4 and 5, in the heating step S3, the solution is heated so that the temperature of the solution when reaching the head is 23 ° C. or higher and 40 ° C. or lower. Heating is preferred. The structure of the apparatus may be designed in advance so that the temperature is within this range. As in the coating method of the fifth embodiment, the temperature of the solution may be detected by a sensor in step S5, and the heater may be controlled in step S1 so that the solution reaches the temperature in this range when it reaches the head. The reason why the temperature of the solution at the time of reaching the head is preferably within this range is as described in the third embodiment.
　なお、前記加熱する工程Ｓ３においては、前記ヘッドに到達した時点での前記溶液の温度が２８℃以上３５℃以下になるように前記溶液が加熱されることがさらに好ましい。ヘッドに到達した時点での前記溶液の温度がこの範囲内となることが好ましい理由は、理由は、実施の形態３で述べたとおりである。 In the heating step S3, it is more preferable that the solution is heated so that the temperature of the solution when it reaches the head is 28 ° C. or higher and 35 ° C. or lower. The reason why the temperature of the solution when reaching the head is preferably within this range is as described in the third embodiment.
　なお、今回開示した上記実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更を含むものである。 It should be noted that the above-described embodiment disclosed herein is illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　本発明は、塗布装置および塗布方法に利用可能である。 The present invention can be used for a coating apparatus and a coating method.
　１　ベース、２　レール、３　テーブル、４　支持ピン、５　支持部、６　基板、６ａ　主表面、７　ヘッド、８　溶液供給配管、９　溶液回収配管、１０　溶液、１７　加圧タンク、１８　供給タンク、２１，２２　ヒータ、２５　センサ、２６　制御部、２８　個別供給配管、２９　個別回収配管、１０１，１０２，１０３　塗布装置。 1 base, 2 rails, 3 tables, 4 support pins, 5 support parts, 6 substrates, 6a main surface, 7 heads, 8 solution supply piping, 9 solution recovery piping, 10 solutions, 17 pressurized tanks, 18 supply tanks, 21 , 22 heater, 25 sensor, 26 control unit, 28 individual supply piping, 29 individual recovery piping, 101, 102, 103 coating device.

Claims (12)

  1. 　基板（６）に薄膜を形成するための溶液（１０）を吐出することによって前記基板に塗布するためのインクジェット方式の塗布装置（１０１，１０２，１０３）であって、
    　前記溶液を溜めるための供給タンク（１８）と、
    　前記溶液を基板に向けて吐出するためのヘッド（７）と、
    　前記供給タンクから前記ヘッドへと前記溶液を導くための溶液供給配管（８）と、
    　前記ヘッドから吐出される際の前記溶液の温度を上げるために、前記ヘッドを避けた位置に設けられたヒータ（２１，２２）とを備える、塗布装置。     An inkjet type coating apparatus (101, 102, 103) for coating a substrate (6) by applying a solution (10) for forming a thin film on the substrate,
    A supply tank (18) for storing the solution;
    A head (7) for discharging the solution toward the substrate;
    A solution supply pipe (8) for guiding the solution from the supply tank to the head;
    A coating apparatus, comprising: heaters (21, 22) provided at positions away from the head in order to raise the temperature of the solution when discharged from the head.
  2. 　前記ヒータ（２１）は前記供給タンクに設けられる、請求項１に記載の塗布装置。 The coating device according to claim 1, wherein the heater (21) is provided in the supply tank.
  3. 　前記ヒータ（２２）は前記溶液供給配管に沿うように設けられる、請求項１に記載の塗布装置。 The coating device according to claim 1, wherein the heater (22) is provided along the solution supply pipe.
  4. 　前記ヘッドにおいて前記溶液の温度を検出するためのセンサ（２５）と、
    　前記センサの検出結果に基づいて前記ヒータを制御するための制御部（２６）とを備える、請求項１から３のいずれかに記載の塗布装置。     A sensor (25) for detecting the temperature of the solution in the head;
    The coating apparatus according to any one of claims 1 to 3, further comprising a control unit (26) for controlling the heater based on a detection result of the sensor.
  5. 　前記ヒータは前記ヘッドに到達した時点での前記溶液の温度が２３℃以上４０℃以下になるように前記溶液を加熱するためのものである、請求項１から４のいずれかに記載の塗布装置。 The coating apparatus according to claim 1, wherein the heater is for heating the solution so that the temperature of the solution when reaching the head is 23 ° C. or more and 40 ° C. or less. .
  6. 　前記ヒータは前記ヘッドに到達した時点での前記溶液の温度が２８℃以上３５℃以下になるように前記溶液を加熱するためのものである、請求項５に記載の塗布装置。 6. The coating apparatus according to claim 5, wherein the heater is for heating the solution so that the temperature of the solution at the time of reaching the head is 28 ° C. or more and 35 ° C. or less.
  7. 　基板（６）に薄膜を形成するための溶液（１０）を前記基板の表面に向けてヘッド（７）から吐出することによって前記基板に前記溶液を塗布するための方法であって、
    　前記ヘッドを避けた位置において前記溶液を加熱する工程と、
    　前記ヘッドから前記溶液を吐出する工程とを含む、塗布方法。     A method for applying the solution to the substrate by discharging the solution (10) for forming a thin film on the substrate (6) from the head (7) toward the surface of the substrate,
    Heating the solution at a position away from the head;
    And a step of discharging the solution from the head.
  8. 　前記溶液を前記ヘッドに供給する前に供給タンク（１８）に保持する工程を含み、
    　前記加熱する工程は前記供給タンクにおいて行なわれる、請求項７に記載の塗布方法。     Holding the solution in a supply tank (18) before supplying it to the head;
    The coating method according to claim 7, wherein the heating step is performed in the supply tank.
  9. 　前記溶液を溶液供給配管（８）を通じて前記ヘッドに供給する工程を含み、
    　前記加熱する工程は前記溶液供給配管において行なわれる、請求項７に記載の塗布方法。     Supplying the solution to the head through a solution supply pipe (8),
    The coating method according to claim 7, wherein the heating step is performed in the solution supply pipe.
  10. 　前記ヘッドに設けたセンサ（２５）によって前記溶液の温度を検出する工程と、
    　前記センサの検出結果に基づいて前記ヒータを制御する工程とを含む、請求項７から９のいずれかに記載の塗布方法。     Detecting the temperature of the solution by a sensor (25) provided on the head;
    The coating method according to claim 7, further comprising a step of controlling the heater based on a detection result of the sensor.
  11. 　前記加熱する工程においては、前記ヘッドに到達した時点での前記溶液の温度が２３℃以上４０℃以下になるように前記溶液が加熱される、請求項７から１０のいずれかに記載の塗布方法。 11. The coating method according to claim 7, wherein, in the heating step, the solution is heated so that a temperature of the solution when reaching the head is 23 ° C. or more and 40 ° C. or less. .
  12. 　前記加熱する工程においては、前記ヘッドに到達した時点での前記溶液の温度が２８℃以上３５℃以下になるように前記溶液が加熱される、請求項１１に記載の塗布方法。 The coating method according to claim 11, wherein, in the heating step, the solution is heated so that a temperature of the solution when reaching the head is 28 ° C or more and 35 ° C or less.
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KR102045729B1 (en) * 2012-12-03 2019-11-18 엘지디스플레이 주식회사 Jetting Valve For Dispensing Apparatus
CN108146068A (en) * 2016-12-05 2018-06-12 塔工程有限公司 Inkjet type liquid is coated with module and its degasification method
CN108146068B (en) * 2016-12-05 2021-07-06 塔工程有限公司 Ink-jet type liquid coating module and degassing method thereof

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