WO2011136430A1 - Procédé de détection d'une erreur d'événement d'équipement à semi-conducteurs et système de commande d'équipement à semi-conducteurs utilisant ce procédé - Google Patents

Procédé de détection d'une erreur d'événement d'équipement à semi-conducteurs et système de commande d'équipement à semi-conducteurs utilisant ce procédé Download PDF

Info

Publication number
WO2011136430A1
WO2011136430A1 PCT/KR2010/003401 KR2010003401W WO2011136430A1 WO 2011136430 A1 WO2011136430 A1 WO 2011136430A1 KR 2010003401 W KR2010003401 W KR 2010003401W WO 2011136430 A1 WO2011136430 A1 WO 2011136430A1
Authority
WO
WIPO (PCT)
Prior art keywords
event
semiconductor
error
semiconductor device
facility
Prior art date
Application number
PCT/KR2010/003401
Other languages
English (en)
Korean (ko)
Inventor
백원인
이건우
이헌주
김원범
황정호
Original Assignee
주식회사 미라콤아이앤씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미라콤아이앤씨 filed Critical 주식회사 미라콤아이앤씨
Publication of WO2011136430A1 publication Critical patent/WO2011136430A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Definitions

  • the present invention relates to a semiconductor equipment event error detection method and a semiconductor equipment control system using the same. More specifically, the semiconductor equipment event error detection method for detecting and monitoring the abnormality of the semiconductor equipment in real time and quickly taking a corresponding action, so as to proactively monitor and control the mass accidents that may occur in the semiconductor process; The present invention relates to a semiconductor facility control system using the same.
  • the invention stores the operation scenario data defining the operating scenario of the semiconductor equipment, and based on the defined operating scenario, defining one or more events occurring in the semiconductor equipment
  • An automation management server storing event association data defining an association between event data and the one or more events; And storing action data defining actions to be performed when an event error is detected for each event error type, and whenever the event is received from the semiconductor device, the defined operation scenario, the defined event, and the defined event association.
  • a semiconductor equipment control system including an event detection server detecting whether an event error related to the received event is generated based on one or more of the relationships, and performing a corresponding action defined in the action data when the event error is detected.
  • the present invention provides a method for a semiconductor equipment control system to detect an event error for a semiconductor equipment, the method comprising: storing operation scenario data defining an operating scenario of the semiconductor equipment; Storing event correlation data defining event relationships defining one or more events occurring in the semiconductor device and the one or more events based on the defined operation scenarios; Storing action data defining actions to be performed when event errors are detected for each event error type; Whenever an event is received from the semiconductor device, detecting whether an event error related to the received event is generated based on at least one of the defined operation scenario, the defined event, and the defined event correlation; And performing a corresponding action defined in the action data when it is detected that the event error has occurred.
  • the present invention it is possible to detect and monitor the abnormality of the semiconductor equipment in real time and to take a corresponding action promptly so that it is possible to proactively monitor and control the mass accidents that may occur in the semiconductor process. have.
  • FIG. 1 is a diagram illustrating a semiconductor facility control system according to an exemplary embodiment.
  • FIG. 2 is an exemplary view illustrating an event error detection method of a semiconductor device according to an embodiment.
  • FIG. 3 is an exemplary diagram illustrating an event error detection procedure and message transfer according to a semiconductor device according to an embodiment.
  • FIG. 4 is a flowchart illustrating a method for detecting an event error of a semiconductor device according to an exemplary embodiment.
  • FIG. 1 is a diagram illustrating a semiconductor facility control system 100 according to an exemplary embodiment.
  • the semiconductor equipment control system 100 manages and controls the state or operation of the semiconductor equipment 101 required in a semiconductor production process, and takes necessary measures when a problem occurs in the semiconductor equipment 101.
  • the semiconductor facility 101 is also called semiconductor equipment.
  • the semiconductor equipment control system 100 includes an automation management server 110, an event detection server 120, and the like.
  • the automation management server 110 stores operation scenario data defining an operation scenario of the semiconductor facility 101 in a database, and based on the operation scenario defined in the operation scenario data, one or more events occurring in the semiconductor facility 101.
  • Manage and manage event association data that defines the relationship between the event data that defines and one or more events.
  • the event detection server 120 stores action data defining actions to be performed when event errors are detected for each event error type, and defines predefined operation scenarios and definitions each time an event is received from the semiconductor device 101. Detects whether an event error related to the received event occurs based on one or more of the defined event and the defined event association. If an event error is detected, the corresponding action defined in the previously stored action data is performed.
  • the above-mentioned event refers to information related to the semiconductor processing process or the state and operation of the semiconductor equipment 101, which the semiconductor equipment 101 proceeds in a semiconductor cooperative work, and the semiconductor equipment control system 100 includes the semiconductor equipment 101.
  • the semiconductor facility 101 should inform the semiconductor facility control system 100 of such an event periodically or aperiodically.
  • an event related to a predefined operation scenario from the semiconductor device 101 is transmitted to the semiconductor device control system.
  • the semiconductor equipment control system 100 detects events coming up from each semiconductor facility 101 in advance by defining events and relationships between the events coming up from each semiconductor facility 101 in advance, and whether there are any missing events. It is to detect an event error such as whether there is an event that went wrong. In order to define what kind of events are in these events in the event data, to manage and control the semiconductor equipment 101 and to detect the occurrence of a problem, the semiconductor equipment 101 and the semiconductor equipment control system 100 perform these events. The data is shared and stored.
  • the relationship between the above-mentioned events the relationship between the event transmitted from the semiconductor device 101, that is, before and after a specific event which event is transferred from the semiconductor device 101 to the event detection server 120.
  • Information related to this information is defined as event association data.
  • the event correlation data like the event data, also stores and shares the event data by the semiconductor facility 101 and the semiconductor facility control system 100 in order to manage and control the semiconductor facility 101 and detect a problem occurrence. Doing.
  • the above-mentioned action performed when detecting an event error for each event error type means an action that the semiconductor equipment control system 100 should perform on the detected event error when the event error is detected.
  • the data defining the action is the action data mentioned above.
  • the action defined in this action data may vary depending on the type of event error detected (event error type). For example, some event error types store only information about the event error, some event error types generate a beep, some event error types send a warning message, and in some event error types, 101 may be taken, or a combination of two or more of the foregoing.
  • event error type For example, some event error types store only information about the event error, some event error types generate a beep, some event error types send a warning message, and in some event error types, 101 may be taken, or a combination of two or more of the foregoing.
  • the event detection server 120 When the event detection server 120 detects that an event error has occurred, the event detection server 120 stores the contents of the event error in an internal or other device or a database, or alarms the event error (e.g., generates a warning sound or a warning). Send a message to an administrator, or the like, or send an Interlock command message to the semiconductor device 101 to the semiconductor device 101 to stop the semiconductor device 101.
  • the semiconductor facility control system 100 may further include an automation server 130 that delivers events and interlock commands between the event detection server 120 and the semiconductor facility 101.
  • the event detection server 120 may detect an event error and the automation server 130 may perform an action according to the detected event error.
  • the above-described automation management server 110 detects one or more events occurring in the semiconductor device 101 from the semiconductor device 101 and the required events that must be transmitted from the semiconductor device 101 to the event detection server 120.
  • Event data defined by classifying general events that do not necessarily need to be transmitted to the server 120 may be stored.
  • the event detection server 120 checks whether the received event is a required event or a general event, and when the event is a required event, a predefined operation scenario and a predefined event.
  • the occurrence of an event error related to the received event may be detected based on one or more of an event and a predefined event association.
  • the event detection server 120 checks whether the received event is a required event or a general event, and if the event is a required event, an event ID (CEID: Collected) of the received event. ID) to determine whether the identified event ID is appropriate based on the event correlation or operation scenario defined in the event correlation data, thereby detecting whether an event error related to the received event has occurred.
  • an event ID CEID: Collected
  • the event detection server 120 detects whether an event error related to the received event has occurred, and if it is detected that an event error has occurred, determines the event error type of the event error, and determines the event error type according to the detected event error type. You can perform the corresponding actions that you define.
  • the event error type is a first type corresponding to the case where the event detection server 120 receives a content or an event ID different from the event ID or an event ID that the event detection server 120 receives from the semiconductor device 101, and the event.
  • the second type corresponding to the case where the event that the detection server 120 should receive from the semiconductor facility 101 is missing, and the order of the events that the event detection server 120 receives from the semiconductor facility 101 It may include one or more of the third type corresponding to the changed case.
  • the event detection server 120 further includes a state change of the semiconductor facility 101, a wafer movement in the semiconductor facility 101, an alert occurrence in the semiconductor facility 101, and an operation of the semiconductor facility 101.
  • An event may be received from the semiconductor facility 101 at one or more of the start, progress, and end of the facility process.
  • the semiconductor facility 101 illustrated in FIG. 1 may be a semiconductor facility of 300 mm or more.
  • the automation management server 110 may include SECS (SEMI Equipment Communications Standard) protocol, GEM (Generic model for communications and control of Manufactuing). Operation of the semiconductor equipment 101 of 300 mm or more defined by the Semiconductor Standards Association (eg, SEMI (Semiconductor Equipment and Materials International), etc.) using semiconductor protocols such as equipment protocols and high-speed SECS message services (HSMS) protocols. You can save operation scenario data that defines a scenario.
  • SECS SEMI Equipment Communications Standard
  • GEM Generic model for communications and control of Manufactuing
  • HSMS high-speed SECS message services
  • the semiconductor device 101 illustrated in FIG. 1 may be a semiconductor device of one or more types of a fixed buffer type and an internal buffer type. Accordingly, the automation management server 110 may store operation scenario data defining an operation scenario of the semiconductor device 101 of one or more types of the fixed buffer type and the internal buffer type.
  • the semiconductor facility control system 100 is a production inquiry managing client 140, such as a computer or a terminal for inquiring an event occurring in the semiconductor facility 101, and a semiconductor production process.
  • Management system 150 may be further included.
  • FIG. 2 is a diagram illustrating an event error detection method of a semiconductor device 101 according to an exemplary embodiment.
  • a specific semiconductor device 101 generates nine events including five mandatory events (mandatory event 1, mandatory event 2, ..., mandatory event 5) and four general events. It is assumed that five mandatory events among the four events must be transmitted to the event detection server 120 in the order of mandatory event 1, mandatory event 2, mandatory event 3, mandatory event 4, and mandatory event 5.
  • the required event 2 is not transmitted from the specific semiconductor equipment 101. It is the case that the required event 2 is not received by the event detection server 120 because it is not lost or lost during transmission.
  • the event detection server 120 may confirm that the required event 2 is missing based on the association between the predefined events, detect this situation as an event error, and as an action, interlock By sending a command to a specific semiconductor device 101 and transmitting information (mandatory event 2 missing information) related to an action for warning an event error detection to the specific semiconductor device 101 through the automation server 130. The operation of the semiconductor device 101 is stopped and a warning sound or the like is generated.
  • the semiconductor equipment control system 100 including the automation management server 110, the event detection server 120, and the automation server 130 detects an event error of the semiconductor equipment 101.
  • Detecting procedure (1 ⁇ 2 ⁇ 3 ⁇ 4 ⁇ 5 ⁇ 6 ⁇ 7 ⁇ 8 ⁇ 9 ⁇ 10 ⁇ 11 ⁇ 12 ⁇ 13 ⁇ 14 ⁇ 15) and the apparatus 110, 120, 130, 101 according to these procedures Exemplary diagrams illustrating message passing between the mobile station are shown.
  • FIG. 4 is a flowchart illustrating an event error detection method of the semiconductor device 101 according to an exemplary embodiment.
  • the method for detecting an event error of the semiconductor facility 101 by the semiconductor facility control system 100 may include storing operation scenario data defining an operation scenario of the semiconductor facility 101 (S400). Based on the defined operation scenario, storing event data defining one or more events occurring in the semiconductor device 101 and event correlation data defining an association between one or more events (S402), and event by event error type.
  • (S404) storing action data defining actions to be performed when an error is detected, among predefined operation scenarios, predefined events, and predefined event associations each time an event is received from the semiconductor device 101; Detecting whether an event error related to the received event is based on at least one (S406), and S40; If it is detected that an event error occurs in step 6, and performing the corresponding action defined in the previously stored action data (S408) and the like.
  • the present invention by automatically detecting an event error related to an event coming up from the semiconductor device 101, the automatic indication of abnormality of the semiconductor device 101 is automatically detected in real time, and the corresponding action is promptly taken. In this way, it is possible to proactively monitor and control mass accidents that may occur in the semiconductor process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • General Factory Administration (AREA)

Abstract

La présente invention porte sur un procédé de détection d'une erreur d'événement d'un équipement à semi-conducteurs, et sur un système de commande d'équipement à semi-conducteurs utilisant celui-ci. De manière plus spécifique, l'invention porte sur un procédé de détection d'une erreur d'événement d'un équipement à semi-conducteurs et sur un système de commande d'équipement à semi-conducteurs utilisant celui-ci, dans lesquels : une erreur d'événement relative à un événement généré par l'équipement à semi-conducteurs est automatiquement détectée pour saisir automatiquement un signe d'anomalie de l'équipement à semi-conducteurs en temps réel ; et des mesures correspondant à celle-ci sont rapidement prises pour surveiller et commander, à l'avance, des accidents importants qui peuvent survenir durant un processus à semi-conducteurs.
PCT/KR2010/003401 2010-04-26 2010-05-28 Procédé de détection d'une erreur d'événement d'équipement à semi-conducteurs et système de commande d'équipement à semi-conducteurs utilisant ce procédé WO2011136430A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100038327A KR101145804B1 (ko) 2010-04-26 2010-04-26 반도체 설비 이벤트 오류 검출 방법 및 이를 이용한 반도체 설비 제어 시스템
KR10-2010-0038327 2010-04-26

Publications (1)

Publication Number Publication Date
WO2011136430A1 true WO2011136430A1 (fr) 2011-11-03

Family

ID=44861702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/003401 WO2011136430A1 (fr) 2010-04-26 2010-05-28 Procédé de détection d'une erreur d'événement d'équipement à semi-conducteurs et système de commande d'équipement à semi-conducteurs utilisant ce procédé

Country Status (2)

Country Link
KR (1) KR101145804B1 (fr)
WO (1) WO2011136430A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101512071B1 (ko) * 2013-12-26 2015-04-16 주식회사 포스코 상태 차트를 이용한 가상공장 시퀀스 오류 검출 방법
KR102238648B1 (ko) 2014-06-03 2021-04-09 삼성전자주식회사 반도체 공정 관리 시스템, 이를 포함하는 반도체 제조 시스템 및 반도체 제조 방법
KR102269175B1 (ko) * 2019-06-24 2021-06-24 이상호 반도체 공정 장비에서의 오류 발생 시 대응기능을 원터치 버튼으로 구현한 일체형 입력장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
KR19990026068A (ko) * 1997-09-22 1999-04-15 윤종용 반도체 제조용 설비의 관리방법
KR100625323B1 (ko) * 2005-08-23 2006-09-15 세메스 주식회사 급변하는 공정에서 실시간으로 인터락 제어를 위한 반도체제조 설비 및 그 방법
KR20060125997A (ko) * 2005-06-03 2006-12-07 삼성전자주식회사 공정 시간 비교에 의한 반도체 공정 오류 제어 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
KR19990026068A (ko) * 1997-09-22 1999-04-15 윤종용 반도체 제조용 설비의 관리방법
KR20060125997A (ko) * 2005-06-03 2006-12-07 삼성전자주식회사 공정 시간 비교에 의한 반도체 공정 오류 제어 방법
KR100625323B1 (ko) * 2005-08-23 2006-09-15 세메스 주식회사 급변하는 공정에서 실시간으로 인터락 제어를 위한 반도체제조 설비 및 그 방법

Also Published As

Publication number Publication date
KR20110118927A (ko) 2011-11-02
KR101145804B1 (ko) 2012-05-16

Similar Documents

Publication Publication Date Title
EP2916345B1 (fr) Dispositif de communication, équipement de communication et système de communication
KR101179738B1 (ko) 안전 제어 장치
US20090071762A1 (en) Remote informing system for elevator
JP2008276792A (ja) 安全性関連プロセス情報の単一信号送信
US20060271216A1 (en) Short-range wireless communication system for manufacturing production line
WO2011136430A1 (fr) Procédé de détection d'une erreur d'événement d'équipement à semi-conducteurs et système de commande d'équipement à semi-conducteurs utilisant ce procédé
CN102571492A (zh) 检测路由设备故障的方法和装置
KR20190031385A (ko) 인터페이스 장치와, 이를 이용한 반도체 제조 시스템 및 관리 방법
CN108861911B (zh) 电梯数据通信布置件
CN113539879B (zh) 半导体制造过程中的故障监测***及方法
KR20160141113A (ko) 유무선 네트워크 기반의 산업용 네트워크 시스템 및 그의 운용 방법
KR20010003296A (ko) 반도체 라인관리용 통합 자동화시스템의 감시 시스템 및 방법
CN110989514A (zh) 生产控制***
JP3481339B2 (ja) 駆動制御システム
CN110980458B (zh) 一种控制机器人出梯的方法及机器人
US10599117B2 (en) Safety-oriented automation system
JP2010063010A (ja) 障害監視システム及び障害監視方法
US6990421B2 (en) Method of displaying measurement result in inspection process and system thereof, and computer program
WO2011136431A1 (fr) Procédé de détection automatique d'erreur de processus de connexion de fils, système et support de stockage
CN116153831B (zh) 一种假片更换方法、装置、电子设备及存储介质
KR102344471B1 (ko) 데이지 체인 방식을 통한 스마트 eocr용 데이터 통신 시스템
JP2005524155A (ja) アクセス管理方法及びその装置並びに移動管理方法
CN115053462B (zh) 线缆异常判定***、从机装置及线缆异常判定方法
CN114764230A (zh) 加工管理***、加工管理方法及存储有程序的计算机可读介质
JP2006119756A (ja) 異常監視システム、異常監視装置および異常監視方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10850796

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10850796

Country of ref document: EP

Kind code of ref document: A1