WO2011118069A1 - Diode module and terminal box for solar cell module - Google Patents

Diode module and terminal box for solar cell module Download PDF

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Publication number
WO2011118069A1
WO2011118069A1 PCT/JP2010/068367 JP2010068367W WO2011118069A1 WO 2011118069 A1 WO2011118069 A1 WO 2011118069A1 JP 2010068367 W JP2010068367 W JP 2010068367W WO 2011118069 A1 WO2011118069 A1 WO 2011118069A1
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WO
WIPO (PCT)
Prior art keywords
diode
resin layer
terminal
solar cell
diode module
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PCT/JP2010/068367
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French (fr)
Japanese (ja)
Inventor
吉川　裕之
東小薗　誠
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住友電装株式会社
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Publication of WO2011118069A1 publication Critical patent/WO2011118069A1/en

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a diode module and a terminal box for a solar cell module.
  • a conventional diode module and solar cell module terminal box are disclosed in Patent Document 1.
  • the diode module includes a plurality of terminal boards, a reverse load bypass diode connected to the corresponding two terminal boards, and a resin portion that holds the terminal boards in parallel at a predetermined interval.
  • the terminal box for a solar cell module is constituted by the above diode module and a housing that accommodates the entire diode module.
  • a silicon resin is introduced into the casing so as to cover the diode, and after the silicone resin is cured, a cover is placed on the casing.
  • the diode when the diode generates heat during use, the heat is released to the atmosphere through the silicon resin.
  • the silicon resin having low thermal conductivity since the silicon resin having low thermal conductivity is thickly enclosed in the housing, the heat generated by the diode may be trapped in the silicon resin and not sufficiently released to the atmosphere. As a result, there is a concern that the diode is damaged by heat.
  • the present invention has been completed based on the above circumstances, and an object thereof is to provide a diode module and a solar cell module terminal box having excellent heat dissipation.
  • the present invention is a diode module connected to a solar cell panel, a plurality of terminal plates, a reverse load bypass diode connected to two corresponding terminal plates of each terminal plate, at least, It is characterized in that it is provided with a resin portion having an outer shape along the outer shape of the diode by being thinly attached to the surface of the diode.
  • the diode module of the present invention may be configured as follows. (1) The resin part is mold-coated around the diode. Thereby, the integrity of the resin part and the diode is enhanced. (2) The diode and each terminal plate are integrated via the resin portion. Therefore, the handling property of the diode module is excellent. (3) The terminal board has a lead connection portion to which a lead from the solar cell panel is connected and a cable connection portion to which a cable for taking out power from the solar cell panel is connected, and the lead connection portion and the cable connection portion are exposed. is doing. If it carries out like this, after shaping
  • Portions other than the lead connection portion and the cable connection portion of the terminal board are covered with the resin portion. Therefore, parts other than the connection part of a terminal board are protected by the resin part.
  • the terminal boards are arranged in a line, and the cable connecting parts are integrally connected to positions adjacent to the lead connecting parts of the terminal boards located at both ends in the arranging direction. If it carries out like this, a diode module will be divided into the area
  • the terminal board is an injection-molded product integrated with the resin portion by an insert. According to this, it is easy to mold and the amount of the resin portion to be adhered to the terminal board can be finely adjusted.
  • the present invention also provides a solar cell module terminal box including the diode module according to the above (3), wherein a tubular enclosure is retrofitted to the tip of the diode module, and the lead is placed in the opening of the enclosure. It is characterized in that it is arranged so that the connection portion faces.
  • the solar cell module terminal box can be easily manufactured from the diode module by retrofitting the cylindrical enclosure to the tip of the diode module.
  • the resin part is composed of a primary resin layer and a secondary resin layer made of a resin different from the primary resin layer, and the primary resin layer has better heat resistance than the secondary resin layer.
  • the periphery is covered with a primary resin layer, and the surrounding portion is formed of a secondary resin layer. According to this, the progress of the deterioration of the primary resin layer due to the heat generation of the diode is suppressed, and the heat dissipation is improved.
  • the function which cannot be covered with a primary resin layer can be supplemented with a secondary resin layer.
  • An insulating sealing material is introduced into the opening of the surrounding portion, and a cover is placed on the surrounding portion so as to cover the sealing material. Therefore, the introduction amount of the sealing material can be reduced only to the surrounding portion.
  • a diode module and a solar cell module terminal box excellent in heat dissipation are provided.
  • Embodiment 1 of this invention it is a top view of the terminal box for solar cell modules to which the cable was connected. It is a top view of the diode module before coat
  • FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. It is a top view of a diode module. It is a top view of the terminal box for solar cell modules.
  • FIG. 6 is a sectional view taken along line BB in FIG. 5. It is a conceptual diagram for demonstrating the thermal radiation path
  • it is a top view of the terminal box for solar cell modules. It is CC sectional drawing of FIG.
  • a terminal box for a solar cell module according to Embodiment 1 (hereinafter simply referred to as a terminal box 10) is provided on the back side of a solar cell panel 100 (see FIG. 7) in which a large number of solar cells connected in series are arranged.
  • this terminal box 10 is completed by carrying out the primary shaping
  • the terminal plate 21 is formed in a band shape by cutting a conductive metal plate or the like, and is arranged side by side in the width direction as shown in FIG.
  • a lead connection portion 24 is formed at the front end portion of each terminal plate 21 to which a lead (not shown) from the solar cell group is connected by soldering.
  • the lead connection portion 24 is formed with a horizontally long connection hole 25 into which a lead is inserted.
  • each terminal plate 21 two terminal plates 21 positioned at both ends in the width direction are cable connection terminals 21A to which both a plus side cable 90 and a minus side cable 90 for taking out an electromotive force from the solar cell group are respectively connected.
  • a pair of cable connection portions 26 are formed at the front end portion of the cable connection terminal 21 ⁇ / b> A so as to protrude outward in the width direction at positions adjacent to the lead connection portion 24.
  • a bent portion 27 is formed at the middle portion of the cable connecting portion 26 and is shifted forward in a stepwise manner.
  • an open barrel-shaped barrel portion 28 is formed at the distal end portion of both cable connection portions 26.
  • a pair of barrel pieces 29 are formed to rise on the barrel portion 28 (see FIG. 9), and both the barrel pieces 29 are wound around the core wire portion 91 in the end portion of the cable 90, so that the cable connection terminal 21 ⁇ / b> A is attached to the cable 90. It is designed to be connected by caulking.
  • the diode 22 includes a flat bare chip 22A and a metal plate-like conductor piece 22B connected to the bare chip 22A, which is not packaged by a resin.
  • the bare chip 22 ⁇ / b> A is formed by stacking a P-side region (anode region) and an N-side region (cathode region), and is directly mounted on the center of the surface of the terminal board 21 in the width direction.
  • the bottom surface of the bare chip 22A is connected to the surface of the terminal board 21 by soldering.
  • the bare chip 22A is supported by the three terminal plates 21 on the right side of the four terminal plates 21 as shown in the drawing.
  • the conductor piece 22B is elongated in the width direction from one end to the other end, and one end in the width direction is soldered to the top surface of the bare chip 22A (polarity different from the bottom surface of the bare chip 22A).
  • the other end in the width direction is connected by soldering to the terminal board 21 adjacent to the terminal board 21 that supports the bare chip 22A. That is, the conductor pieces 22B are bridged between the terminal plates 21 adjacent to each other, and three conductor pieces 22B are arranged between the four terminal plates 21 as a whole.
  • each terminal board 21 also has a function as a heat radiating plate for releasing the heat when the bare chip 22A generates heat.
  • Each terminal plate 21 has a step 31 formed between a portion supporting the bare chip 22A and a portion having the lead connection portion 24 and the cable connection portion 26, and a portion supporting the bare chip 22A with the step 31 as a boundary.
  • the heat dissipation area has been expanded.
  • the cable connection terminal 21 ⁇ / b> A on the left side in the drawing that does not support the bare chip 22 ⁇ / b> A has a smaller area than the other terminal plates 21 because the demand for heat dissipation is low. As a result, space efficiency is improved.
  • the diode module 20 includes a primary resin layer 23 that is mold-coated so as to cover each diode 22 in addition to each terminal plate 21 and each diode 22 described above.
  • the diode module 20 has a configuration in which each diode 22 and each terminal plate 21 are integrally packaged through a primary resin layer 23.
  • the primary resin layer 23 is not formed on the front end portion of each terminal plate 21, and is attached to the entire portion of each terminal plate 21 except the front end portion. Thus, the lead connection portion 24 and the cable connection portion 26 are exposed and disposed in the diode module 20.
  • the primary resin layer 23 has a flat mat shape with a rectangular shape in plan view, and is thinly applied to both the front and back surfaces of each terminal board 21 from the position immediately before the step 31 to the rear part.
  • the primary resin layer 23 maintains a predetermined distance between the terminal plates 21, avoids excessive stress acting between the terminal plates 21 and the diodes 22, and prevents each terminal plate 21 and each It plays a role of insulatingly covering the diode 22.
  • a deposition portion 32 having a convex outer shape along the outer shape of the diode 22 is formed on the surface of the primary resin layer 23 .
  • the adherend portion 32 is configured to extend linearly over substantially the entire width in the width direction at the substantially central portion in the front-rear direction of the primary resin layer 23.
  • the thickness of the primary resin layer 23 including the adherend portion 32 is substantially constant from the surface of the terminal board 21 to the surface of the diode 22 (see FIG. 6).
  • a claw-shaped protrusion 33 is formed on the surface of the primary resin layer 23 in front of the adherend 32.
  • the protrusion 33 has a form extending linearly over substantially the entire width in the width direction.
  • a horizontally elongated slit 34 is formed at the front end portion in front of the protrusion portion 33.
  • the concave groove 34 has a form extending linearly over substantially the entire width in the width direction, and the surface of each terminal plate 21 is exposed through the concave groove 34.
  • the primary resin layer 23 is made of a thermoplastic resin such as polyphenylene sulfide (hereinafter referred to as PPS), and has better heat resistance than the secondary resin layer 41 described later.
  • the primary resin layer 23 contains glass fibers, thereby improving heat resistance.
  • the terminal box 10 includes a surrounding portion 42 made of the secondary resin layer 41 in addition to the diode module 20 described above. Furthermore, the surrounding part 42 surrounds the periphery of each lead connection part 24 and both the cable connection parts 26 in front of the connection part 43 and the flat connection part 43 integrally connected to the front end part of the primary resin layer 23. And a cylindrical tube portion 44 standing up.
  • the resin part 50 is configured by the primary resin layer 23 and the secondary resin layer 41.
  • the connecting portion 43 is thinly attached to the surface of the front end portion of the primary resin layer 23, and its rear end is in close contact with the protruding portion 33, and its surface is substantially the same as the protruding end of the protruding portion 33. They are arranged at the same height.
  • the secondary resin layer 41 is made of a thermoplastic resin having excellent weather resistance and mechanical properties such as polyphenylene ether (hereinafter referred to as PPE), and does not include glass fibers.
  • the PPS that constitutes the primary resin layer 23 has a smaller linear expansion coefficient than the PPE that constitutes the secondary resin layer 41, and is made of a metal such as a copper alloy that constitutes the conductor pieces 22B of the terminal plates 21 and the diodes 22. It has a close linear expansion coefficient.
  • the cylindrical portion 44 has an opening 45 that is horizontally long in plan view and exceeds the entire width of the diode module 20, and the lead connection portions 24 and both cable connection portions 26 are disposed in the opening 45 so as to face each other. .
  • the root portion of the rear portion of the cylindrical portion 44 enters the concave groove 34, whereby the secondary resin layer 41 is brought into close contact with the primary resin layer 23.
  • cylindrical cable insertion portions 46 are formed on the outer surfaces of both ends in the width direction of the cylindrical portion 44 so as to protrude.
  • An insertion hole 47 into which the cable 90 is inserted is formed in the cable insertion portion 46 so as to penetrate in the width direction.
  • the cable 90 is drawn out from the insertion hole 47 of the cylindrical portion 44 outward at both ends in the width direction.
  • an annular groove 48 is formed over the entire outer peripheral surface of the cable insertion portion 46, and a rubber plug 80 is fitted (see FIG. 1).
  • the rubber plug 80 serves to prevent water from entering the cylindrical portion 44 by filling a gap between the insertion hole 47 and the cable 90.
  • the opening portion 45 of the cylindrical portion 44 is closed at the bottom surface portions at both ends in the width direction by a closing plate 49, and the barrel portion 28 of both cable connection terminals 21 ⁇ / b> A is placed on the closing plate 49.
  • a jig hole 61 is formed in the closing plate 49 at a position corresponding to the barrel portion 28.
  • a stepped receiving portion 62 is formed over the entire circumference, and the receiving portion 62 can support a peripheral portion of a cover (not shown). .
  • the diode 22 is connected to each terminal board 21 by soldering (see FIG. 2).
  • the terminal plates 21 are integrally connected by a carrier so that excessive stress does not act on a connection portion between each terminal plate 21 and each diode 22.
  • a carrier can be cut and removed after forming the primary resin layer 23.
  • the integrated terminal plate 21 and each diode 22 are set in a primary molding die (not shown), and molten resin is injected and filled into the die. Then, the molten resin is thinly deposited around the portions of each terminal plate 21 excluding the lead connection portion 24 and the cable connection portion 26 and around each diode 22, and the primary resin layer 23 is formed after the molten resin is cured. Thus, the diode module 20 is manufactured (see FIG. 4).
  • the diode module 20 is set in a mold (not shown) for secondary molding, and molten resin is injected and filled into the mold. After the molten resin is cured, a surrounding portion 42 as a secondary resin layer 41 is integrally formed at the front end portion of the primary resin layer 23 so as to surround the lead connection portion 24 and the cable connection portion 26. Thus, the terminal box 10 is manufactured (see FIGS. 5 and 6).
  • the cable 90 is inserted into the insertion hole 47 of the cable insertion portion 46 from both sides outside.
  • a caulking jig (not shown) is inserted into the jig hole 61 from below, and the barrel piece 29 is bent by the operation of the caulking jig.
  • the cable 90 is connected and fixed to the cable connecting portion 26.
  • the rubber plug 80 previously penetrated through the cable 90 is pulled up to the cable insertion portion 46 side, and the rubber plug 80 is fitted to the outer peripheral surface of the cable insertion portion 46 (see FIG. 1).
  • the inner peripheral portion of the rubber plug 80 enters the annular groove 48 of the cable insertion portion 46, the adhesion of the rubber plug 80 to the cable insertion portion 46 is enhanced.
  • the bottom surface of the terminal box 10 is attached to the back surface of the solar cell panel 100 with an adhesive or the like.
  • the lead is drawn into the opening 45 of the cylindrical portion 44, and the tip end portion of the lead is connected to the lead connection portion 24 of the corresponding terminal plate 21 through the connection hole 25 by soldering.
  • a sealing material made of an insulating resin such as silicon resin is introduced and filled into the cylindrical portion 44, and after the sealing material is cured, a cover is fitted to the receiving portion 62, and the cylindrical portion 44 is closed with a lid. .
  • the mounting of the terminal box 10 to the solar cell panel 100 is completed.
  • the adherend portion 32 is attached around the diode 22 and the adherend portion 32 has an outer shape along the outer shape of the diode 22, the thickness of the adherend portion 32 can be suppressed to be extremely small, and heat dissipation can be achieved. Is significantly improved.
  • the lead connection part 24 and the cable connection part 26 are exposed and disposed in the diode module 20, the lead connection work and the cable 90 connection work can be smoothly performed after the diode module 20 is formed. it can.
  • the diode module 20 since the terminal plates 21 are arranged in a horizontal row and the cable connection portions 26 are integrally connected adjacent to the lead connection portions 24 of the cable connection terminals 21A located at both ends in the arrangement direction, the diode module 20 However, it is divided into a region that is mold-coated with the primary resin layer 23 and a region that has the lead connection portion 24 and the cable connection portion 26 and is excellent in moldability.
  • each terminal plate 21 is an injection-molded product integrated with the primary resin layer 23 by an insert, molding is easy and a small amount of the primary resin layer 23 is attached to each terminal plate 21. Can be adjusted.
  • the terminal box 10 can be easily manufactured from the diode module 20.
  • an insulating sealing material is introduced into the opening 45 of the cylindrical portion 44, and a cover is placed on the cylindrical portion 44 so as to cover the sealing material. It can be reduced to the inside only.
  • the resin part 50 since the resin part 50 has the secondary resin layer 41 separately from the primary resin layer 23, the secondary resin layer 41 supplements a function that cannot be covered by the primary resin layer 23. can do.
  • the diode 22 itself is composed of the bare chip 22A and the conductor piece 22B, and is not packaged by the resin. Therefore, the heat generated by the diode 22 is directly transmitted to the primary resin layer 23, and the heat dissipation is further improved.
  • the primary resin layer 23 has higher heat resistance than the secondary resin layer 41 and has an expansion coefficient closer to the expansion coefficient of the diode 22, it can dissipate heat even when the diode 22 becomes hot, The load applied to the diode 22 due to thermal expansion can be reduced.
  • the secondary resin layer 41 which does not require such characteristics strongly can be cheaper than the primary resin layer 23.
  • each terminal plate 21 has a lead connection portion 24, the lead connection portion 24 is disposed so as to face the opening 45 of the cylindrical portion 44, and the surrounding portion 42 including the cylindrical portion 44 is only the secondary resin layer 41. Therefore, the periphery of the lead connection portion 24 with low heat dissipation requirement is surrounded by the secondary resin layer 41, and the primary resin layer 23 is covered with the diode 22 with high heat dissipation requirement. Thereby, the primary resin layer 23 and the secondary resin layer 41 are appropriately distributed to the necessary portions.
  • Embodiment 2> 8 and 9 show Embodiment 2 of the present invention.
  • the terminal box 10A according to the second embodiment has a shape that approximates that of the first embodiment. For this reason, in the following, differences from the first embodiment will be mainly described, and the same reference numerals are given to the same configurations as those of the first embodiment.
  • the area of the closing plate 49A is larger than that of the first embodiment, and the bent portions 27 of both cable connection portions 26 are also supported by the closing plate 49A.
  • the integral resin part 50A surrounding each diode 22 is molded without distinguishing the primary resin layer 23 and the secondary resin layer 41 and forming.
  • the resin portion 50 ⁇ / b> A is made of the same resin as a whole, and does not have portions corresponding to the protruding portion 33 and the recessed groove 34 of the first embodiment.
  • the adherend 32A is formed slightly thicker than the first embodiment.
  • the basic configuration of the cylindrical portion 44 is substantially the same as that of the first embodiment.
  • the diode module 20 when the terminal box 10A is manufactured, the diode module 20 is not taken out as an intermediate product, and the diode module 20A itself constitutes the terminal box 10A.
  • the present invention is not limited to the embodiments described with reference to the above description and drawings.
  • the resin part may be configured to be attached only around the diode.
  • the cable connection portion may be formed at the front end portion of the cable connection terminal opposite to the formation side of the lead connection portion.
  • thermosetting resins such as epoxy resins and unsaturated polyester resins can be used instead of PPS.
  • As the diode it is possible to use a package diode in which a bare chip and a conductor piece are packaged in a resin package.
  • Each terminal plate may be composed of only two cable connection terminals, and only one diode may be formed by bridging between both cable connection terminals.
  • Terminal box for solar cell modules DESCRIPTION OF SYMBOLS 20 ... Diode module 21 ... Terminal board 22 ... Diode 23 ... Primary resin layer 24 ... Lead connection part 26 ... Cable connection part 41 ... Secondary resin layer 42 ... Surrounding part 50 ... Resin part 90 ... Cable 100 ... Solar cell panel

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Abstract

Provided is a terminal box for a solar cell module and a diode module with excellent heat radiation. The diode module is (20) is connected to a solar panel (100) and is provided with: multiple terminal boards (21); a reverse load bypass diode (22) that is connected to two corresponding terminal boards (21); and a resin (50) that has a shape that follows the shape of the diode (22) and is formed by thinly covering, at least, the surface of the diode (22). The terminal box (10) for the solar cell module is configured to include the diode module (20).

Description

ダイオードモジュール及び太陽電池モジュール用端子ボックスTerminal box for diode module and solar cell module
　本発明は、ダイオードモジュール及び太陽電池モジュール用端子ボックスに関する。 The present invention relates to a diode module and a terminal box for a solar cell module.
　従来のダイオードモジュール及び太陽電池モジュール用端子ボックスが特許文献１に開示されている。ダイオードモジュールは、複数の端子板と、各端子板のうちの対応する２つの端子板に接続される逆負荷時バイパス用のダイオードと、各端子板を所定間隔をあけて並列に保持する樹脂部とを備えている。一方、太陽電池モジュール用端子ボックスは、上記のダイオードモジュールと、このダイオードモジュール全体を収容する筐体とによって構成されている。また、筐体内には、ダイオードを覆うようにしてシリコン樹脂が導入され、さらにシリコン樹脂の硬化後、筐体にカバーが被せ付けられるようになっている。 A conventional diode module and solar cell module terminal box are disclosed in Patent Document 1. The diode module includes a plurality of terminal boards, a reverse load bypass diode connected to the corresponding two terminal boards, and a resin portion that holds the terminal boards in parallel at a predetermined interval. And. On the other hand, the terminal box for a solar cell module is constituted by the above diode module and a housing that accommodates the entire diode module. In addition, a silicon resin is introduced into the casing so as to cover the diode, and after the silicone resin is cured, a cover is placed on the casing.
特開２００７－３１１７１４号公報JP 2007-31714 A
　ところで、上記の場合、使用時にダイオードが発熱すると、該熱がシリコン樹脂を介して大気に逃がされるようになっている。しかし、上記の構成では、熱伝導率の低いシリコン樹脂が筐体内に厚く封入されているため、ダイオードが発生する熱がシリコン樹脂内にこもって大気に充分に放出されないおそれがある。その結果、ダイオードが熱ダメージを受けることが懸念される。 In the above case, when the diode generates heat during use, the heat is released to the atmosphere through the silicon resin. However, in the above configuration, since the silicon resin having low thermal conductivity is thickly enclosed in the housing, the heat generated by the diode may be trapped in the silicon resin and not sufficiently released to the atmosphere. As a result, there is a concern that the diode is damaged by heat.
　本発明は上記のような事情に基づいて完成されたものであって、放熱性に優れたダイオードモジュール及び太陽電池モジュール用端子ボックスを提供することを目的とする。 The present invention has been completed based on the above circumstances, and an object thereof is to provide a diode module and a solar cell module terminal box having excellent heat dissipation.
　本発明は、太陽電池パネルに接続されるダイオードモジュールであって、複数の端子板と、各端子板のうちの対応する２つの端子板に接続される逆負荷時バイパス用のダイオードと、少なくとも、前記ダイオードの表面に薄く被着されることにより、前記ダイオードの外形に沿った外形を有する樹脂部とを備えているところに特徴を有する。 The present invention is a diode module connected to a solar cell panel, a plurality of terminal plates, a reverse load bypass diode connected to two corresponding terminal plates of each terminal plate, at least, It is characterized in that it is provided with a resin portion having an outer shape along the outer shape of the diode by being thinly attached to the surface of the diode.
　これにより、ダイオードで発生した熱が樹脂部を介して大気等に迅速に放出される。 This allows heat generated in the diode to be quickly released to the atmosphere through the resin part.
　本発明のダイオードモジュールは、次のような構成としてもよい。
　（１）樹脂部がダイオードの周りにモールド被覆されている。これにより、樹脂部とダイオードとの一体性が高められる。
　（２）ダイオード及び各端子板が樹脂部を介して一体化されている。したがって、ダイオードモジュールの取り扱い性に優れる。
　（３）端子板が、太陽電池パネルからのリードが接続されるリード接続部及び太陽電池パネルからの電力を取り出すケーブルが接続されるケーブル接続部を有し、リード接続部及びケーブル接続部が露出している。こうすると、ダイオードモジュールの成形後に、リードの接続作業及びケーブルの接続作業を円滑に行うことができる。
　（４）端子板のうちリード接続部及びケーブル接続部以外の部分が、樹脂部で被覆されている。したがって、端子板の接続部以外の部分が樹脂部で保護される。
　（５）端子板が、一列に並んで配置され、並び方向両端に位置する端子板のリード接続部と隣接する位置に、ケーブル接続部が一体に連結されている。こうすると、ダイオードモジュールが、樹脂部でモールド被覆される領域と、リード接続部及びケーブル接続部を有する領域とに、二分割され、成形性に優れる。
　（６）端子板がインサートによって樹脂部と一体化された射出成形品とされている。これによれば、成形が容易であるとともに、樹脂部の端子板への被着量を微少に調整できる。 The diode module of the present invention may be configured as follows.
(1) The resin part is mold-coated around the diode. Thereby, the integrity of the resin part and the diode is enhanced.
(2) The diode and each terminal plate are integrated via the resin portion. Therefore, the handling property of the diode module is excellent.
(3) The terminal board has a lead connection portion to which a lead from the solar cell panel is connected and a cable connection portion to which a cable for taking out power from the solar cell panel is connected, and the lead connection portion and the cable connection portion are exposed. is doing. If it carries out like this, after shaping | molding a diode module, the connection operation | work of a lead and the connection operation | work of a cable can be performed smoothly.
(4) Portions other than the lead connection portion and the cable connection portion of the terminal board are covered with the resin portion. Therefore, parts other than the connection part of a terminal board are protected by the resin part.
(5) The terminal boards are arranged in a line, and the cable connecting parts are integrally connected to positions adjacent to the lead connecting parts of the terminal boards located at both ends in the arranging direction. If it carries out like this, a diode module will be divided into the area | region which is mold-coated with the resin part, and the area | region which has a lead connection part and a cable connection part, and is excellent in a moldability.
(6) The terminal board is an injection-molded product integrated with the resin portion by an insert. According to this, it is easy to mold and the amount of the resin portion to be adhered to the terminal board can be finely adjusted.
　また、本発明は、上記（３）記載のダイオードモジュールを含む太陽電池モジュール用端子ボックスであって、ダイオードモジュールの先端部に、筒状の包囲部が後付けされ、包囲部の開口内に、リード接続部が臨むように配置されているところに特徴を有する。 The present invention also provides a solar cell module terminal box including the diode module according to the above (3), wherein a tubular enclosure is retrofitted to the tip of the diode module, and the lead is placed in the opening of the enclosure. It is characterized in that it is arranged so that the connection portion faces.
　こうしてダイオードモジュールの先端部に筒状の包囲部を後付けすることにより、ダイオードモジュールから太陽電池モジュール用端子ボックスを容易に製造できる。 Thus, the solar cell module terminal box can be easily manufactured from the diode module by retrofitting the cylindrical enclosure to the tip of the diode module.
　この場合、次のような構成としてもよい。
　（１）樹脂部が、一次樹脂層と、一次樹脂層とは異なる樹脂からなる二次樹脂層とによって構成され、一次樹脂層のほうが二次樹脂層よりも耐熱性が優れており、ダイオードの周りが一次樹脂層で被覆され、包囲部が二次樹脂層で形成されている。これによれば、ダイオードの発熱に起因する一次樹脂層の劣化の進行が抑えられ、放熱性が良好となる。また、一次樹脂層で賄うことができない機能を二次樹脂層で補完することができる。
　（２）包囲部の開口内に、絶縁性の封止材が導入され、かつ、包囲部に、封止材を覆うようにカバーが被せ付けられる。したがって、封止材の導入量を包囲部の部分のみに少なく抑えることができる。 In this case, the following configuration may be used.
(1) The resin part is composed of a primary resin layer and a secondary resin layer made of a resin different from the primary resin layer, and the primary resin layer has better heat resistance than the secondary resin layer. The periphery is covered with a primary resin layer, and the surrounding portion is formed of a secondary resin layer. According to this, the progress of the deterioration of the primary resin layer due to the heat generation of the diode is suppressed, and the heat dissipation is improved. Moreover, the function which cannot be covered with a primary resin layer can be supplemented with a secondary resin layer.
(2) An insulating sealing material is introduced into the opening of the surrounding portion, and a cover is placed on the surrounding portion so as to cover the sealing material. Therefore, the introduction amount of the sealing material can be reduced only to the surrounding portion.
　本発明によれば、放熱性に優れたダイオードモジュール及び太陽電池モジュール用端子ボックスが提供される。 According to the present invention, a diode module and a solar cell module terminal box excellent in heat dissipation are provided.
本発明の実施形態１において、ケーブルが接続された太陽電池モジュール用端子ボックスの平面図である。In Embodiment 1 of this invention, it is a top view of the terminal box for solar cell modules to which the cable was connected. 各端子板を樹脂部で被覆する前のダイオードモジュールの平面図である。It is a top view of the diode module before coat | covering each terminal board with a resin part. 図２のＡ－Ａ断面図である。FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. ダイオードモジュールの平面図である。It is a top view of a diode module. 太陽電池モジュール用端子ボックスの平面図である。It is a top view of the terminal box for solar cell modules. 図５のＢ－Ｂ断面図である。FIG. 6 is a sectional view taken along line BB in FIG. 5. ダイオードの放熱経路を説明するための概念図である。It is a conceptual diagram for demonstrating the thermal radiation path | route of a diode. 実施形態２において、太陽電池モジュール用端子ボックスの平面図である。In Embodiment 2, it is a top view of the terminal box for solar cell modules. 図８のＣ－Ｃ断面図である。It is CC sectional drawing of FIG.
　＜実施形態１＞
　本発明の実施形態１を図１ないし図７によって説明する。実施形態１に係る太陽電池モジュール用端子ボックス（以下、単に端子ボックス１０という）は、相互に直列接続された多数の太陽電池セルを配する太陽電池パネル１００（図７を参照）の裏面側に取り付けられるものであって、複数の端子板２１と、対応する２つの端子板２１間に架橋される逆負荷時バイパス用のダイオード２２と、各端子板２１及びダイオード２２の周りを覆う一次樹脂層２３とを備えている。そして、この端子ボックス１０は、ダイオードモジュール２０を中間品として一次成形され、その後、二次成形されることによって完成させられる。 <Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. A terminal box for a solar cell module according to Embodiment 1 (hereinafter simply referred to as a terminal box 10) is provided on the back side of a solar cell panel 100 (see FIG. 7) in which a large number of solar cells connected in series are arranged. A plurality of terminal plates 21, a reverse load bypass diode 22 bridged between two corresponding terminal plates 21, and a primary resin layer covering each terminal plate 21 and the diode 22. 23. And this terminal box 10 is completed by carrying out the primary shaping | molding by using the diode module 20 as an intermediate | middle product, and carrying out secondary shaping | molding after that.
　端子板２１は、導電性の金属板を切断等して帯状に形成され、図２に示すように、幅方向に４つ横並びで配置されている。各端子板２１の前端部には、太陽電池セル群からの図示しないリードが半田付けにより接続されるリード接続部２４が形成されている。リード接続部２４には、リードが挿入される横長の接続孔２５が開口して形成されている。 The terminal plate 21 is formed in a band shape by cutting a conductive metal plate or the like, and is arranged side by side in the width direction as shown in FIG. A lead connection portion 24 is formed at the front end portion of each terminal plate 21 to which a lead (not shown) from the solar cell group is connected by soldering. The lead connection portion 24 is formed with a horizontally long connection hole 25 into which a lead is inserted.
　各端子板２１のうち、幅方向両端に位置する２つの端子板２１は、太陽電池セル群から起電力を取り出すためのプラス側及びマイナス側の両ケーブル９０がそれぞれ接続されるケーブル接続端子２１Ａとされている。ケーブル接続端子２１Ａの前端部には、リード接続部２４と隣接する位置に、一対のケーブル接続部２６が幅方向両端外方に突出して形成されている。ケーブル接続部２６の中間部には、前方へ段違い状にシフトした屈曲部２７が形成されている。また、両ケーブル接続部２６の先端部には、オープンバレル状のバレル部２８が形成されている。バレル部２８には一対のバレル片２９が立ち上げ形成され（図９を参照）、両バレル片２９がケーブル９０の端末部における芯線部９１に巻き付けられることにより、ケーブル接続端子２１Ａがケーブル９０にかしめ接続されるようになっている。 Of each terminal plate 21, two terminal plates 21 positioned at both ends in the width direction are cable connection terminals 21A to which both a plus side cable 90 and a minus side cable 90 for taking out an electromotive force from the solar cell group are respectively connected. Has been. A pair of cable connection portions 26 are formed at the front end portion of the cable connection terminal 21 </ b> A so as to protrude outward in the width direction at positions adjacent to the lead connection portion 24. A bent portion 27 is formed at the middle portion of the cable connecting portion 26 and is shifted forward in a stepwise manner. Further, an open barrel-shaped barrel portion 28 is formed at the distal end portion of both cable connection portions 26. A pair of barrel pieces 29 are formed to rise on the barrel portion 28 (see FIG. 9), and both the barrel pieces 29 are wound around the core wire portion 91 in the end portion of the cable 90, so that the cable connection terminal 21 </ b> A is attached to the cable 90. It is designed to be connected by caulking.
　ダイオード２２は、扁平なベアチップ２２Ａと、ベアチップ２２Ａに接続される金属板状の導体片２２Ｂとからなり、これ自体は樹脂によってパッケージ化されていない。ベアチップ２２Ａは、Ｐ側領域（アノード領域）とＮ側領域（カソード領域）とを積層してなり、端子板２１の表面の幅方向略中央部に直接載せられている。ベアチップ２２Ａの底面は端子板２１の表面に半田付けにより接続されている。本実施形態の場合、４つの端子板２１のうち図示向かって右側３つの端子板２１にベアチップ２２Ａが支持されるようになっている。 The diode 22 includes a flat bare chip 22A and a metal plate-like conductor piece 22B connected to the bare chip 22A, which is not packaged by a resin. The bare chip 22 </ b> A is formed by stacking a P-side region (anode region) and an N-side region (cathode region), and is directly mounted on the center of the surface of the terminal board 21 in the width direction. The bottom surface of the bare chip 22A is connected to the surface of the terminal board 21 by soldering. In the case of the present embodiment, the bare chip 22A is supported by the three terminal plates 21 on the right side of the four terminal plates 21 as shown in the drawing.
　導体片２２Ｂは、図３に示すように、一端から他端にかけて幅方向に細長く延びる形態とされ、その幅方向一端部が、ベアチップ２２Ａの天面（ベアチップ２２Ａの底面とは異なる極性）に半田付けにより接続され、その幅方向他端部が、ベアチップ２２Ａを支持する端子板２１と隣接する端子板２１に半田付けにより接続されている。つまり、導体片２２Ｂは、互いに隣接する端子板２１間に架橋され、全体として４つの端子板２１間に３つ配置されている。 As shown in FIG. 3, the conductor piece 22B is elongated in the width direction from one end to the other end, and one end in the width direction is soldered to the top surface of the bare chip 22A (polarity different from the bottom surface of the bare chip 22A). The other end in the width direction is connected by soldering to the terminal board 21 adjacent to the terminal board 21 that supports the bare chip 22A. That is, the conductor pieces 22B are bridged between the terminal plates 21 adjacent to each other, and three conductor pieces 22B are arranged between the four terminal plates 21 as a whole.
　ここで、各端子板２１は、ベアチップ２２Ａが発熱した場合にその熱を逃がす放熱板としての機能を兼備している。各端子板２１には、ベアチップ２２Ａを支持する部分と、リード接続部２４及びケーブル接続部２６を有する部分との間に、段差３１が形成され、段差３１を境として、ベアチップ２２Ａを支持する部分の放熱面積が拡張されている。もっとも、ベアチップ２２Ａを支持しない図示向かって左側のケーブル接続端子２１Ａは、放熱の要請が低いため、他の端子板２１よりも面積が小さくされている。これにより、スペース効率の向上が図られるようになっている。 Here, each terminal board 21 also has a function as a heat radiating plate for releasing the heat when the bare chip 22A generates heat. Each terminal plate 21 has a step 31 formed between a portion supporting the bare chip 22A and a portion having the lead connection portion 24 and the cable connection portion 26, and a portion supporting the bare chip 22A with the step 31 as a boundary. The heat dissipation area has been expanded. However, the cable connection terminal 21 </ b> A on the left side in the drawing that does not support the bare chip 22 </ b> A has a smaller area than the other terminal plates 21 because the demand for heat dissipation is low. As a result, space efficiency is improved.
　ダイオードモジュール２０は、図４に示すように、上記した各端子板２１及び各ダイオード２２に加え、各ダイオード２２の周りを覆うようにモールド被覆された一次樹脂層２３を備えてなる。言い換えれば、ダイオードモジュール２０は、各ダイオード２２と各端子板２１とが一次樹脂層２３を介して一体に樹脂パッケージ化された形態になっている。 As shown in FIG. 4, the diode module 20 includes a primary resin layer 23 that is mold-coated so as to cover each diode 22 in addition to each terminal plate 21 and each diode 22 described above. In other words, the diode module 20 has a configuration in which each diode 22 and each terminal plate 21 are integrally packaged through a primary resin layer 23.
　一次樹脂層２３は、各端子板２１の前端部には形成されておらず、各端子板２１のうち前端部を除く部分の全体に被着されている。これにより、ダイオードモジュール２０には、リード接続部２４及びケーブル接続部２６が露出して配置される。そして、一次樹脂層２３は、平面視矩形の扁平マット状をなし、各端子板２１のうち段差３１の直前方位置から後方の部分に表裏両面に亘って薄く被着されている。かかる一次樹脂層２３は、各端子板２１間を所定間隔に保つとともに、各端子板２１と各ダイオード２２との間に過大な応力が作用するのを回避し、かつ、各端子板２１及び各ダイオード２２を絶縁被覆する役割をになっている。 The primary resin layer 23 is not formed on the front end portion of each terminal plate 21, and is attached to the entire portion of each terminal plate 21 except the front end portion. Thus, the lead connection portion 24 and the cable connection portion 26 are exposed and disposed in the diode module 20. The primary resin layer 23 has a flat mat shape with a rectangular shape in plan view, and is thinly applied to both the front and back surfaces of each terminal board 21 from the position immediately before the step 31 to the rear part. The primary resin layer 23 maintains a predetermined distance between the terminal plates 21, avoids excessive stress acting between the terminal plates 21 and the diodes 22, and prevents each terminal plate 21 and each It plays a role of insulatingly covering the diode 22.
　一次樹脂層２３の表面には、ダイオード２２の外形に沿った凸状の外形をなす被着部３２が形成されている。被着部３２は、一次樹脂層２３の前後方向略中央部において幅方向の略全幅に亘って直線状に延びる形態とされている。被着部３２を含む一次樹脂層２３の厚みは、端子板２１の表面からダイオード２２の表面にかけてほぼ一定とされている（図６を参照）。 On the surface of the primary resin layer 23, a deposition portion 32 having a convex outer shape along the outer shape of the diode 22 is formed. The adherend portion 32 is configured to extend linearly over substantially the entire width in the width direction at the substantially central portion in the front-rear direction of the primary resin layer 23. The thickness of the primary resin layer 23 including the adherend portion 32 is substantially constant from the surface of the terminal board 21 to the surface of the diode 22 (see FIG. 6).
　また、一次樹脂層２３の表面には、被着部３２よりも前方に、爪状の突条部３３が形成されている。突条部３３は、幅方向の略全幅に亘って直線状に延びる形態をなしている。さらに、一次樹脂層２３の表面には、突条部３３よりも前方となる前端部に、横長スリット状の凹溝３４が形成されている。凹溝３４は、幅方向の略全幅に亘って直線状に延びる形態をなし、凹溝３４を通して各端子板２１の表面が露出している。 Further, a claw-shaped protrusion 33 is formed on the surface of the primary resin layer 23 in front of the adherend 32. The protrusion 33 has a form extending linearly over substantially the entire width in the width direction. Further, on the surface of the primary resin layer 23, a horizontally elongated slit 34 is formed at the front end portion in front of the protrusion portion 33. The concave groove 34 has a form extending linearly over substantially the entire width in the width direction, and the surface of each terminal plate 21 is exposed through the concave groove 34.
　一次樹脂層２３は、ポリフェニレンサルファイド（以下、ＰＰＳ）等の熱可塑性樹脂で構成され、後述する二次樹脂層４１よりも耐熱性に優れている。また、一次樹脂層２３には、ガラス繊維が含有されており、これによって耐熱性の向上が実現されている。 The primary resin layer 23 is made of a thermoplastic resin such as polyphenylene sulfide (hereinafter referred to as PPS), and has better heat resistance than the secondary resin layer 41 described later. In addition, the primary resin layer 23 contains glass fibers, thereby improving heat resistance.
　続いて、端子ボックス１０について説明すると、端子ボックス１０は、上記したダイオードモジュール２０に加え、二次樹脂層４１からなる包囲部４２を備えてなる。さらに、包囲部４２は、一次樹脂層２３の前端部に一体に連結される平板状の連結部４３と、連結部４３の前方において各リード接続部２４及び両ケーブル接続部２６の周りを取り囲むようにして立ち上がる筒状の筒部４４とからなる。本実施形態においては、一次樹脂層２３と二次樹脂層４１とによって樹脂部５０が構成される。 Subsequently, the terminal box 10 will be described. The terminal box 10 includes a surrounding portion 42 made of the secondary resin layer 41 in addition to the diode module 20 described above. Furthermore, the surrounding part 42 surrounds the periphery of each lead connection part 24 and both the cable connection parts 26 in front of the connection part 43 and the flat connection part 43 integrally connected to the front end part of the primary resin layer 23. And a cylindrical tube portion 44 standing up. In the present embodiment, the resin part 50 is configured by the primary resin layer 23 and the secondary resin layer 41.
　連結部４３は、図６に示すように、一次樹脂層２３の前端部の表面に薄く被着され、その後端が突条部３３に密着するとともに、その表面が突条部３３の突端とほぼ同一高さで配置されている。二次樹脂層４１の成形時には、突条部３３によって溶融樹脂が塞き止められるようになっている。
　二次樹脂層４１は、ポリフェニレンエーテル（以下、ＰＰＥ）等の対候性、機械的性質に優れた熱可塑性樹脂によって構成され、ここにガラス繊維は含まれていない。一次樹脂層２３を構成するＰＰＳは、二次樹脂層４１を構成するＰＰＥに比べ、線膨張係数が小さく、かつ各端子板２１及び各ダイオード２２の導体片２２Ｂを構成する銅合金等の金属により近い線膨張係数を有している。 As shown in FIG. 6, the connecting portion 43 is thinly attached to the surface of the front end portion of the primary resin layer 23, and its rear end is in close contact with the protruding portion 33, and its surface is substantially the same as the protruding end of the protruding portion 33. They are arranged at the same height. When the secondary resin layer 41 is molded, the molten resin is blocked by the protrusions 33.
The secondary resin layer 41 is made of a thermoplastic resin having excellent weather resistance and mechanical properties such as polyphenylene ether (hereinafter referred to as PPE), and does not include glass fibers. The PPS that constitutes the primary resin layer 23 has a smaller linear expansion coefficient than the PPE that constitutes the secondary resin layer 41, and is made of a metal such as a copper alloy that constitutes the conductor pieces 22B of the terminal plates 21 and the diodes 22. It has a close linear expansion coefficient.
　筒部４４は、ダイオードモジュール２０の全幅を越える平面視横長円形の開口部４５を有し、この開口部４５内に、各リード接続部２４及び両ケーブル接続部２６が臨むように配置されている。筒部４４の後部の根元部分は凹溝３４内に入り込み、これによって二次樹脂層４１が一次樹脂層２３に緊密に密着されるようになっている。 The cylindrical portion 44 has an opening 45 that is horizontally long in plan view and exceeds the entire width of the diode module 20, and the lead connection portions 24 and both cable connection portions 26 are disposed in the opening 45 so as to face each other. . The root portion of the rear portion of the cylindrical portion 44 enters the concave groove 34, whereby the secondary resin layer 41 is brought into close contact with the primary resin layer 23.
　筒部４４の幅方向両端部の外面には、図５に示すように、円筒状のケーブル挿入部４６が突出して形成されている。ケーブル挿入部４６内には、ケーブル９０が挿入される挿入孔４７が幅方向に貫通して形成されている。ケーブル９０は、筒部４４の挿入孔４７から幅方向両端外方に引き出されるようになっている。また、ケーブル挿入部４６の外周面には、環状溝４８が全周に亘って形成され、さらにゴム栓８０が嵌着されるようになっている（図１を参照）。ゴム栓８０は、挿入孔４７とケーブル９０との間の隙間を埋めることにより、筒部４４内に水が浸入するのを阻止する役割をになっている。 As shown in FIG. 5, cylindrical cable insertion portions 46 are formed on the outer surfaces of both ends in the width direction of the cylindrical portion 44 so as to protrude. An insertion hole 47 into which the cable 90 is inserted is formed in the cable insertion portion 46 so as to penetrate in the width direction. The cable 90 is drawn out from the insertion hole 47 of the cylindrical portion 44 outward at both ends in the width direction. In addition, an annular groove 48 is formed over the entire outer peripheral surface of the cable insertion portion 46, and a rubber plug 80 is fitted (see FIG. 1). The rubber plug 80 serves to prevent water from entering the cylindrical portion 44 by filling a gap between the insertion hole 47 and the cable 90.
　筒部４４の開口部４５は、その幅方向両端側の底面部が閉止板４９によって閉止され、閉止板４９には両ケーブル接続端子２１Ａのバレル部２８が載せられている。閉止板４９には、バレル部２８と対応する位置に、治具孔６１が開口して形成されている。筒部４４の開口部４５の上端には、段付き状の受け部６２が全周に亘って形成され、受け部６２には、カバー（図示せず）の周縁部が支持可能とされている。 The opening portion 45 of the cylindrical portion 44 is closed at the bottom surface portions at both ends in the width direction by a closing plate 49, and the barrel portion 28 of both cable connection terminals 21 </ b> A is placed on the closing plate 49. A jig hole 61 is formed in the closing plate 49 at a position corresponding to the barrel portion 28. At the upper end of the opening 45 of the cylindrical portion 44, a stepped receiving portion 62 is formed over the entire circumference, and the receiving portion 62 can support a peripheral portion of a cover (not shown). .
　次に、本実施形態に係るダイオードモジュール２０及び端子ボックス１０の製造方法等について説明する。
　まず、各端子板２１にダイオード２２を半田付けにより接続させる（図２を参照）。このとき、各端子板２１と各ダイオード２２との接続部位に過剰な応力が作用しないよう、各端子板２１間がキャリアで一体に連結されているとよい。かかるキャリアは一次樹脂層２３の成形後に切断して除去され得る。 Next, a method for manufacturing the diode module 20 and the terminal box 10 according to the present embodiment will be described.
First, the diode 22 is connected to each terminal board 21 by soldering (see FIG. 2). At this time, it is preferable that the terminal plates 21 are integrally connected by a carrier so that excessive stress does not act on a connection portion between each terminal plate 21 and each diode 22. Such a carrier can be cut and removed after forming the primary resin layer 23.
　続いて、上記の各端子板２１と各ダイオード２２とが一体化されたものを一次成形用の金型（図示せず）内にセットし、この金型内に溶融樹脂を射出充填する。すると、リード接続部２４及びケーブル接続部２６を除く各端子板２１の部分及び各ダイオード２２の周りに溶融樹脂が薄く被着され、溶融樹脂の硬化後、一次樹脂層２３が形成される。かくしてダイオードモジュール２０が製造される（図４を参照）。 Subsequently, the integrated terminal plate 21 and each diode 22 are set in a primary molding die (not shown), and molten resin is injected and filled into the die. Then, the molten resin is thinly deposited around the portions of each terminal plate 21 excluding the lead connection portion 24 and the cable connection portion 26 and around each diode 22, and the primary resin layer 23 is formed after the molten resin is cured. Thus, the diode module 20 is manufactured (see FIG. 4).
　次に、ダイオードモジュール２０を二次成形用の金型（図示せず）内にセットし、この金型内に溶融樹脂を射出充填する。溶融樹脂の硬化後、一次樹脂層２３の前端部には、リード接続部２４及びケーブル接続部２６の周りを取り囲むようにして二次樹脂層４１としての包囲部４２が一体に形成される。かくして、端子ボックス１０が製造される（図５及び図６を参照）。 Next, the diode module 20 is set in a mold (not shown) for secondary molding, and molten resin is injected and filled into the mold. After the molten resin is cured, a surrounding portion 42 as a secondary resin layer 41 is integrally formed at the front end portion of the primary resin layer 23 so as to surround the lead connection portion 24 and the cable connection portion 26. Thus, the terminal box 10 is manufactured (see FIGS. 5 and 6).
　その後、ケーブル挿入部４６の挿入孔４７に両側外方からケーブル９０を挿入する。バレル部２８にケーブル９０の芯線部９１を支持させた状態で、治具孔６１に下方からかしめ治具（図示せず）を挿入し、このかしめ治具の操作によってバレル片２９に曲げ加工を施すことにより、ケーブル接続部２６にケーブル９０を接続固定する。そして、ケーブル９０に予め貫通させたゴム栓８０をケーブル挿入部４６側に引き上げ、ケーブル挿入部４６の外周面にゴム栓８０を嵌着させる（図１を参照）。このとき、ケーブル挿入部４６の環状溝４８にゴム栓８０の内周部が入り込むことで、ケーブル挿入部４６に対するゴム栓８０の密着性が高められる。 Thereafter, the cable 90 is inserted into the insertion hole 47 of the cable insertion portion 46 from both sides outside. With the core portion 91 of the cable 90 supported by the barrel portion 28, a caulking jig (not shown) is inserted into the jig hole 61 from below, and the barrel piece 29 is bent by the operation of the caulking jig. As a result, the cable 90 is connected and fixed to the cable connecting portion 26. Then, the rubber plug 80 previously penetrated through the cable 90 is pulled up to the cable insertion portion 46 side, and the rubber plug 80 is fitted to the outer peripheral surface of the cable insertion portion 46 (see FIG. 1). At this time, since the inner peripheral portion of the rubber plug 80 enters the annular groove 48 of the cable insertion portion 46, the adhesion of the rubber plug 80 to the cable insertion portion 46 is enhanced.
　次いで、太陽電池パネル１００の裏面に端子ボックス１０の底面を接着剤等で取り付ける。取り付けの過程で、筒部４４の開口部４５内にリードを引き込み、接続孔２５を介して、対応する端子板２１のリード接続部２４にリードの先端部を半田付けにより接続させる。続いて、筒部４４内にシリコン樹脂等の絶縁樹脂からなる封止材を導入充填し、封止材の硬化後、受け部６２にカバーを嵌着して、筒部４４の蓋締めを行う。かくして、端子ボックス１０の太陽電池パネル１００への装着が完了する。 Next, the bottom surface of the terminal box 10 is attached to the back surface of the solar cell panel 100 with an adhesive or the like. In the process of attachment, the lead is drawn into the opening 45 of the cylindrical portion 44, and the tip end portion of the lead is connected to the lead connection portion 24 of the corresponding terminal plate 21 through the connection hole 25 by soldering. Subsequently, a sealing material made of an insulating resin such as silicon resin is introduced and filled into the cylindrical portion 44, and after the sealing material is cured, a cover is fitted to the receiving portion 62, and the cylindrical portion 44 is closed with a lid. . Thus, the mounting of the terminal box 10 to the solar cell panel 100 is completed.
　ところで、ダイオード２２は、使用時に高温になるため、自身の熱によってダメージを受け、整流機能に支障を来たすことが懸念される。しかるに本実施形態によれば、図７に概略的に示すように、ダイオード２２で発生した熱が、各端子板２１を介して一次樹脂層２３の底面から太陽電池パネル１００側へ迅速に逃がされるとともに、一次樹脂層２３の天面から大気側へ迅速に逃がされるため、ダイオードモジュール２０（端子ボックス１０）内に熱がこもるのが回避される。しかも、ダイオード２２の周りに被着部３２が被着され、この被着部３２がダイオード２２の外形に沿った外形をなしているから、被着部３２の厚みが極小さく抑えられ、放熱性が格段に向上する。 Incidentally, since the diode 22 becomes high temperature during use, there is a concern that the diode 22 may be damaged by its own heat and interfere with the rectifying function. However, according to the present embodiment, as schematically shown in FIG. 7, heat generated in the diode 22 is quickly released from the bottom surface of the primary resin layer 23 to the solar cell panel 100 side via each terminal plate 21. At the same time, since heat is quickly released from the top surface of the primary resin layer 23 to the atmosphere side, it is avoided that heat is trapped in the diode module 20 (terminal box 10). Moreover, since the adherend portion 32 is attached around the diode 22 and the adherend portion 32 has an outer shape along the outer shape of the diode 22, the thickness of the adherend portion 32 can be suppressed to be extremely small, and heat dissipation can be achieved. Is significantly improved.
　また、ダイオードモジュール２０には、リード接続部２４及びケーブル接続部２６が露出して配置されているから、ダイオードモジュール２０の成形後に、リードの接続作業及びケーブル９０の接続作業を円滑に行うことができる。 Moreover, since the lead connection part 24 and the cable connection part 26 are exposed and disposed in the diode module 20, the lead connection work and the cable 90 connection work can be smoothly performed after the diode module 20 is formed. it can.
　また、各端子板２１が横一列に並んで配置され、並び方向両端に位置するケーブル接続端子２１Ａのリード接続部２４に隣接してケーブル接続部２６が一体に連結されているから、ダイオードモジュール２０が、一次樹脂層２３でモールド被覆される領域と、リード接続部２４及びケーブル接続部２６を有する領域とに、二分割され、成形性に優れる。 Further, since the terminal plates 21 are arranged in a horizontal row and the cable connection portions 26 are integrally connected adjacent to the lead connection portions 24 of the cable connection terminals 21A located at both ends in the arrangement direction, the diode module 20 However, it is divided into a region that is mold-coated with the primary resin layer 23 and a region that has the lead connection portion 24 and the cable connection portion 26 and is excellent in moldability.
　また、各端子板２１がインサートによって一次樹脂層２３と一体化された射出成形品とされているから、成形が容易であるとともに、一次樹脂層２３の各端子板２１への被着量を微少に調整できる。 Further, since each terminal plate 21 is an injection-molded product integrated with the primary resin layer 23 by an insert, molding is easy and a small amount of the primary resin layer 23 is attached to each terminal plate 21. Can be adjusted.
　また、ダイオードモジュール２０の先端部に筒状の包囲部４２が後付けで形成されているから、ダイオードモジュール２０から端子ボックス１０を容易に製造できる。 Further, since the cylindrical surrounding portion 42 is formed later on the tip portion of the diode module 20, the terminal box 10 can be easily manufactured from the diode module 20.
　さらに、筒部４４の開口部４５内に絶縁性の封止材が導入され、筒部４４に封止材を覆うようにカバーが被せ付けられるから、封止材の導入量を筒部４４の内部のみに少なく抑えることができる。 Further, an insulating sealing material is introduced into the opening 45 of the cylindrical portion 44, and a cover is placed on the cylindrical portion 44 so as to cover the sealing material. It can be reduced to the inside only.
　さらに、本実施形態によれば、樹脂部５０が一次樹脂層２３とは別に二次樹脂層４１を有しているから、一次樹脂層２３で賄うことができない機能を二次樹脂層４１で補完することができる。 Furthermore, according to this embodiment, since the resin part 50 has the secondary resin layer 41 separately from the primary resin layer 23, the secondary resin layer 41 supplements a function that cannot be covered by the primary resin layer 23. can do.
　また、ダイオード２２自体はベアチップ２２Ａと導体片２２Ｂとからなり、樹脂によってパッケージ化されていないため、ダイオード２２の発熱が一次樹脂層２３にダイレクトに伝わり、放熱性にいっそう優れる。 Further, the diode 22 itself is composed of the bare chip 22A and the conductor piece 22B, and is not packaged by the resin. Therefore, the heat generated by the diode 22 is directly transmitted to the primary resin layer 23, and the heat dissipation is further improved.
　また、一次樹脂層２３が、二次樹脂層４１に比べ、耐熱性が高く、かつダイオード２２の膨張係数により近い膨張係数を有しているから、ダイオード２２が高熱になっても放熱できるとともに、熱膨張によってダイオード２２に加わる負荷を低減できる。一方、このような特性が強く必要とされない二次樹脂層４１については一次樹脂層２３よりも安価に済ますことができる。 Moreover, since the primary resin layer 23 has higher heat resistance than the secondary resin layer 41 and has an expansion coefficient closer to the expansion coefficient of the diode 22, it can dissipate heat even when the diode 22 becomes hot, The load applied to the diode 22 due to thermal expansion can be reduced. On the other hand, the secondary resin layer 41 which does not require such characteristics strongly can be cheaper than the primary resin layer 23.
　また、各端子板２１がリード接続部２４を有し、リード接続部２４が筒部４４の開口部４５内に臨むように配置され、筒部４４を含む包囲部４２が二次樹脂層４１のみで構成されているから、放熱の要請が低いリード接続部２４の周りが二次樹脂層４１で包囲され、放熱の要請が高いダイオード２２に一次樹脂層２３が被覆されることとなる。これにより、一次樹脂層２３と二次樹脂層４１とがそれぞれ必要部位に適宜分配される。 Further, each terminal plate 21 has a lead connection portion 24, the lead connection portion 24 is disposed so as to face the opening 45 of the cylindrical portion 44, and the surrounding portion 42 including the cylindrical portion 44 is only the secondary resin layer 41. Therefore, the periphery of the lead connection portion 24 with low heat dissipation requirement is surrounded by the secondary resin layer 41, and the primary resin layer 23 is covered with the diode 22 with high heat dissipation requirement. Thereby, the primary resin layer 23 and the secondary resin layer 41 are appropriately distributed to the necessary portions.
　＜実施形態２＞
　図８及び図９は、本発明の実施形態２を示す。実施形態２に係る端子ボックス１０Ａは、実施形態１と近似する形状とされている。このため、以下においては、実施形態１と異なる点を重点的に説明するものとし、実施形態１と同様の構成には同一符合を付す。 <Embodiment 2>
8 and 9 show Embodiment 2 of the present invention. The terminal box 10A according to the second embodiment has a shape that approximates that of the first embodiment. For this reason, in the following, differences from the first embodiment will be mainly described, and the same reference numerals are given to the same configurations as those of the first embodiment.
　閉止板４９Ａの面積は、実施形態１よりも大きくされ、両ケーブル接続部２６の屈曲部２７も閉止板４９Ａに支持されている。 The area of the closing plate 49A is larger than that of the first embodiment, and the bent portions 27 of both cable connection portions 26 are also supported by the closing plate 49A.
　そして、実施形態２では、一次樹脂層２３及び二次樹脂層４１が区別して形成されることなく、各ダイオード２２を包囲する一体の樹脂部５０Ａがモールド成形されている。このため、樹脂部５０Ａは、図９に示すように、全体として同一樹脂で構成され、実施形態１の突条部３３及び凹溝３４に相当する部分を有していない。被着部３２Ａは、実施形態１よりも少し厚めに形成されている。筒部４４の基本的構成は、実施形態１とほぼ同様である。 And in Embodiment 2, the integral resin part 50A surrounding each diode 22 is molded without distinguishing the primary resin layer 23 and the secondary resin layer 41 and forming. For this reason, as shown in FIG. 9, the resin portion 50 </ b> A is made of the same resin as a whole, and does not have portions corresponding to the protruding portion 33 and the recessed groove 34 of the first embodiment. The adherend 32A is formed slightly thicker than the first embodiment. The basic configuration of the cylindrical portion 44 is substantially the same as that of the first embodiment.
　このように実施形態２では、端子ボックス１０Ａを製造する際に、ダイオードモジュール２０が中間品として取り出されるわけではなく、ダイオードモジュール２０Ａそのものが端子ボックス１０Ａを構成することとなる。 Thus, in the second embodiment, when the terminal box 10A is manufactured, the diode module 20 is not taken out as an intermediate product, and the diode module 20A itself constitutes the terminal box 10A.
　＜他の実施形態＞
　本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
　（１）樹脂部が、ダイオードの周りのみに被着される構成であってもよい。
　（２）ケーブル接続部がケーブル接続端子のうちリード接続部の形成側とは反対側の前端部に形成されるものであってもよい。
　（３）実施形態１では、ＰＰＳに代えて、エポキシ樹脂、不飽和ポリエステル樹脂等の熱硬化性樹脂を用いることも可能である。
　（４）ダイオードとしては、ベアチップと導体片とを樹脂パッケージ化したパッケージダイオードを用いることも可能である。
　（５）各端子板が、２つのケーブル接続端子のみで構成され、ダイオードが両ケーブル接続端子間に橋絡して１つだけ形成されるものであってもよい。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) The resin part may be configured to be attached only around the diode.
(2) The cable connection portion may be formed at the front end portion of the cable connection terminal opposite to the formation side of the lead connection portion.
(3) In Embodiment 1, thermosetting resins such as epoxy resins and unsaturated polyester resins can be used instead of PPS.
(4) As the diode, it is possible to use a package diode in which a bare chip and a conductor piece are packaged in a resin package.
(5) Each terminal plate may be composed of only two cable connection terminals, and only one diode may be formed by bridging between both cable connection terminals.
　１０…太陽電池モジュール用端子ボックス（端子ボックス）
　２０…ダイオードモジュール
　２１…端子板
　２２…ダイオード
　２３…一次樹脂層
　２４…リード接続部
　２６…ケーブル接続部
　４１…二次樹脂層
　４２…包囲部
　５０…樹脂部
　９０…ケーブル
　１００…太陽電池パネル 10 ... Terminal box for solar cell modules (terminal box)
DESCRIPTION OF SYMBOLS 20 ... Diode module 21 ... Terminal board 22 ... Diode 23 ... Primary resin layer 24 ... Lead connection part 26 ... Cable connection part 41 ... Secondary resin layer 42 ... Surrounding part 50 ... Resin part 90 ... Cable 100 ... Solar cell panel

Claims (10)

  1. 　太陽電池パネルに接続されるダイオードモジュールであって、
    　複数の端子板と、
    　各端子板のうちの対応する２つの端子板に接続される逆負荷時バイパス用のダイオードと、
    　少なくとも、前記ダイオードの表面に薄く被着されることにより、前記ダイオードの外形に沿った外形を有する樹脂部とを備えていることを特徴とするダイオードモジュール。     A diode module connected to a solar panel,
    A plurality of terminal boards;
    Reverse load bypass diodes connected to the corresponding two of the terminal boards;
    A diode module comprising: a resin portion having an outer shape along the outer shape of the diode by being thinly attached to the surface of the diode.
  2. 　前記樹脂部が前記ダイオードの周りにモールド被覆されている請求項１記載のダイオードモジュール。 The diode module according to claim 1, wherein the resin portion is mold-coated around the diode.
  3. 　前記ダイオード及び前記各端子板が前記樹脂部を介して一体化されている請求項１記載のダイオードモジュール。 The diode module according to claim 1, wherein the diode and each terminal plate are integrated via the resin portion.
  4. 　前記端子板が、前記太陽電池パネルからのリードが接続されるリード接続部及び前記太陽電池パネルからの電力を取り出すケーブルが接続されるケーブル接続部を有し、前記リード接続部及び前記ケーブル接続部が露出している請求項３記載のダイオードモジュール。 The terminal plate includes a lead connection portion to which a lead from the solar cell panel is connected and a cable connection portion to which a cable for taking out electric power from the solar cell panel is connected, and the lead connection portion and the cable connection portion. The diode module according to claim 3, wherein is exposed.
  5. 　前記端子板のうち前記リード接続部及び前記ケーブル接続部以外の部分が、前記樹脂部で被覆されている請求項４記載のダイオードモジュール。 The diode module according to claim 4, wherein a portion of the terminal board other than the lead connection portion and the cable connection portion is covered with the resin portion.
  6. 　前記端子板が、一列に並んで配置され、並び方向両端に位置する前記端子板の前記リード接続部と隣接する位置に、前記ケーブル接続部が一体に連結されている請求項２記載のダイオードモジュール。 3. The diode module according to claim 2, wherein the terminal plates are arranged in a line, and the cable connection portions are integrally connected to positions adjacent to the lead connection portions of the terminal plates located at both ends in the arrangement direction. .
  7. 　前記端子板がインサートによって前記樹脂部と一体化された射出成形品とされている請求項１記載のダイオードモジュール。 The diode module according to claim 1, wherein the terminal board is an injection-molded product integrated with the resin portion by an insert.
  8. 　請求項４項記載のダイオードモジュールを含む太陽電池モジュール用端子ボックスであって、
    　前記ダイオードモジュールの先端部に、筒状の包囲部が後付けされ、前記包囲部の開口内に、前記リード接続部が臨むように配置されている太陽電池モジュール用端子ボックス。     A solar cell module terminal box comprising the diode module according to claim 4,
    A solar cell module terminal box in which a cylindrical surrounding portion is retrofitted to a tip portion of the diode module, and the lead connection portion faces the opening of the surrounding portion.
  9. 　前記樹脂部が、一次樹脂層と、前記一次樹脂層とは異なる樹脂からなる二次樹脂層とによって構成され、前記一次樹脂層のほうが前記二次樹脂層よりも耐熱性が優れており、前記ダイオードの周りが前記一次樹脂層で被覆され、前記包囲部が前記二次樹脂層で形成されている請求項８記載の太陽電池モジュール用端子ボックス。 The resin part is composed of a primary resin layer and a secondary resin layer made of a resin different from the primary resin layer, and the primary resin layer has better heat resistance than the secondary resin layer, The terminal box for a solar cell module according to claim 8, wherein a diode is covered with the primary resin layer, and the surrounding portion is formed of the secondary resin layer.
  10. 　前記包囲部の開口内に、絶縁性の封止材が導入され、かつ、前記包囲部に、前記封止材を覆うようにカバーが被せ付けられる請求項８記載の太陽電池モジュール用端子ボックス。 The solar cell module terminal box according to claim 8, wherein an insulating sealing material is introduced into the opening of the surrounding portion, and a cover is placed on the surrounding portion so as to cover the sealing material.
PCT/JP2010/068367 2010-03-23 2010-10-19 Diode module and terminal box for solar cell module WO2011118069A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010066025A JP2011199115A (en) 2010-03-23 2010-03-23 Diode module and terminal box for solar cell module
JP2010-066025 2010-03-23

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298206A (en) * 2000-04-12 2001-10-26 Yukita Electric Wire Co Ltd Terminal box structure for solar cell module
JP2004134717A (en) * 2002-10-10 2004-04-30 Sumisho Metalex Corp Terminal box for solar cell module, and its forming method
JP2005310888A (en) * 2004-04-19 2005-11-04 Sumitomo Wiring Syst Ltd Terminal box for solar battery module and rectifying element unit
DE102007006900A1 (en) * 2006-03-27 2007-10-18 Solarworld Industries Deutschland Gmbh Electrical connection unit e.g. socket, for connecting solar cells, has plate accommodated in housing, where plate stays in electrically conducting contact with input or output wire and in electrical and thermal contact with diode
WO2010137188A1 (en) * 2009-05-27 2010-12-02 住友電装株式会社 Terminal box for solar cell module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4515817B2 (en) * 2004-05-18 2010-08-04 株式会社三社電機製作所 Solar cell module connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298206A (en) * 2000-04-12 2001-10-26 Yukita Electric Wire Co Ltd Terminal box structure for solar cell module
JP2004134717A (en) * 2002-10-10 2004-04-30 Sumisho Metalex Corp Terminal box for solar cell module, and its forming method
JP2005310888A (en) * 2004-04-19 2005-11-04 Sumitomo Wiring Syst Ltd Terminal box for solar battery module and rectifying element unit
DE102007006900A1 (en) * 2006-03-27 2007-10-18 Solarworld Industries Deutschland Gmbh Electrical connection unit e.g. socket, for connecting solar cells, has plate accommodated in housing, where plate stays in electrically conducting contact with input or output wire and in electrical and thermal contact with diode
WO2010137188A1 (en) * 2009-05-27 2010-12-02 住友電装株式会社 Terminal box for solar cell module

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