WO2011114983A1 - Module de cellule solaire et son procédé de fabrication - Google Patents

Module de cellule solaire et son procédé de fabrication Download PDF

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Publication number
WO2011114983A1
WO2011114983A1 PCT/JP2011/055630 JP2011055630W WO2011114983A1 WO 2011114983 A1 WO2011114983 A1 WO 2011114983A1 JP 2011055630 W JP2011055630 W JP 2011055630W WO 2011114983 A1 WO2011114983 A1 WO 2011114983A1
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Prior art keywords
electrode
layer
solar cell
current collecting
cell module
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PCT/JP2011/055630
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English (en)
Japanese (ja)
Inventor
弘樹 高梨
道寛 高山
敏秀 大勝
寛人 内田
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株式会社アルバック
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Publication of WO2011114983A1 publication Critical patent/WO2011114983A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a solar cell module and a manufacturing method thereof.
  • This application claims priority based on Japanese Patent Application No. 2010-060995 filed on Mar. 17, 2010, the contents of which are incorporated herein by reference.
  • a solar cell using a silicon single crystal is excellent in energy conversion efficiency per unit area.
  • a solar cell using a silicon single crystal uses a silicon wafer obtained by slicing a silicon single crystal ingot, a large amount of energy is consumed for manufacturing the ingot and the manufacturing cost is high.
  • a solar cell using an amorphous (amorphous) silicon thin film that can be manufactured at a lower cost is widely used as a low-cost solar cell.
  • Amorphous silicon solar cells use a semiconductor film having a layer structure called a pin junction in which an amorphous silicon film (i-type) that generates electrons and holes when receiving light is sandwiched between p-type and n-type silicon films. . Electrodes are formed on both sides of the semiconductor film. Electrons and holes generated by sunlight move actively due to the potential difference between the p-type and n-type semiconductors, and this is continuously repeated, causing a potential difference between the electrodes on both sides.
  • i-type amorphous silicon film
  • a transparent electrode such as TCO (Transparent Conductive Oxide) is formed on a glass substrate as a lower electrode, and a semiconductor film made of amorphous silicon, an upper electrode, A structure in which an Ag thin film or the like is formed is employed.
  • TCO Transparent Conductive Oxide
  • an amorphous silicon solar cell including a photoelectric conversion body composed of such upper and lower electrodes and a semiconductor film there is a problem that a potential difference is small and a resistance value is large only by depositing each layer uniformly over a wide area on a substrate. .
  • an amorphous silicon solar cell is configured by forming partition elements in which photoelectric conversion bodies are electrically partitioned for each predetermined size and electrically connecting partition elements adjacent to each other.
  • partition elements in which photoelectric conversion bodies are electrically partitioned for each predetermined size and electrically connecting partition elements adjacent to each other.
  • a large number of strip-shaped partition elements are obtained by forming grooves called scribe lines with a laser beam or the like in a photoelectric converter uniformly formed over a large area on a substrate.
  • a structure in which the partition elements are electrically connected in series is employed.
  • a solar cell is usually provided with a collecting electrode used for efficiently collecting electrons and an extraction electrode used for taking out electricity outside the solar cell, regardless of the type (for example, , See Patent Document 1).
  • Such current collecting electrodes and extraction electrodes have been conventionally joined to solar cells by the following method.
  • preliminary solder is formed on both ends of the photoelectric conversion body 112 formed on the substrate 111.
  • the solder 120 is arranged in a dot shape on the second electrode at a predetermined interval.
  • a ribbon-shaped collecting electrode 104 is placed on the preliminary solder 120.
  • the current collecting electrode 104 is made of, for example, a ribbon-shaped copper foil and a plating layer provided around the copper foil.
  • the current collecting electrode 104 is soldered to both ends of the photoelectric conversion body 112 while pressing the upper surface of the current collecting electrode 104 using a soldering iron.
  • the extraction electrode 103 is soldered to the current collecting electrode 104.
  • the insulating sheet 102 is disposed between the extraction electrode 103 and the photoelectric conversion body 112 so that the extraction electrode 103 and the photoelectric conversion body 112 do not contact each other.
  • the current collecting electrode 104 disposed on the preliminary solder is soldered to the photoelectric conversion body 112 after the preliminary solder is disposed. I lifted up. For this reason, there is a possibility that solder protrusions may occur in the production of the solar cell. In this case, the protruding solder penetrates and penetrates the back sheet, which may affect the reliability of the solar cell. When the back sheet contains an Al layer, there is a possibility of short circuit.
  • the protruding solder can be a cause of substrate cracking in the sealing process.
  • the spare solder is arranged in the form of dots, unevenness occurs between the portion with and without the solder, resulting in variations in thickness, which hinders the manufacture of a thin solar cell module.
  • the take-out electrode 103 is further soldered on the current collecting electrode 104, solder protrusion easily occurs at this portion, and the electrode overlaps to increase the thickness of the electrode, resulting in the same problem as described above. Also, the process of joining the collecting electrode and the extraction electrode is often a manual operation by an operator, and such an operation can cause disconnection and heat generation due to poor soldering.
  • the present invention has been made in view of the above-described circumstances, and prevents the poor connection in both the collecting electrode and the taking-out electrode or one of the collecting electrode and the taking-out electrode, and the disconnection and heat generation resulting therefrom, It is a first object of the present invention to provide a solar cell module capable of flattening and reducing the unevenness at the joint portion of both the electric electrode and the extraction electrode or one of the collector electrode and the extraction electrode. In addition, the present invention prevents both of the collecting electrode and the extracting electrode or one of the collecting electrode and the extracting electrode from being poorly bonded, and disconnection and heat generation caused by the same. It is a second object of the present invention to provide a method for manufacturing a solar cell module capable of manufacturing a thinned solar cell module in which unevenness at a joint portion in one of the electrode and the extraction electrode is flattened.
  • the solar cell module includes a solar cell in which at least a first electrode layer, a semiconductor layer, and a second electrode layer are stacked in this order on a substrate, and a ribbon-shaped copper And a current collecting electrode disposed on the second electrode layer, the plating layer facing the second electrode layer, and the current collecting electrode. It has a part expanded in the width direction.
  • the solar cell module includes a solar cell in which at least a first electrode layer, a semiconductor layer, and a second electrode layer are stacked in this order on a substrate, and a ribbon-shaped copper A foil and a plating layer provided around the copper foil, a collector electrode disposed on the second electrode layer, a ribbon-like copper foil, and a plating layer provided around the copper foil; A take-out electrode disposed on the second electrode layer and having one end electrically connected to the collector electrode, an insulating sheet disposed between the take-out electrode and the solar cell, and the collector A first region in which only the electric electrode is disposed on the second electrode layer, and a second region disposed on the second electrode layer so that the collecting electrode and the extraction electrode overlap, In any of the first region and the second region, the plating layer is the second region. Having an extended portion in the width direction of the collector electrode toward the electrode layer.
  • the extraction electrode and the current collecting electrode are arranged on the second electrode layer so as to overlap in order.
  • the manufacturing method of the solar cell module according to the third aspect of the present invention provides a solar cell in which a photoelectric conversion body in which at least a first electrode layer, a semiconductor layer, and a second electrode layer are stacked in this order is formed on a substrate.
  • a current collecting electrode comprising a ribbon-like copper foil and a plating layer provided around the copper foil is disposed on the second electrode layer, and the current collecting electrode is superposed on the current collecting electrode in a longitudinal direction of the current collecting electrode.
  • the plating layer is melted by sliding a sonic soldering iron, the plating layer is expanded in the width direction of the current collecting electrode toward the second electrode layer, and the current collecting electrode is moved to the second electrode. Join on the layer.
  • the method for manufacturing a solar cell module provides a solar cell in which a photoelectric conversion body in which at least a first electrode layer, a semiconductor layer, and a second electrode layer are stacked in this order is formed on a substrate.
  • a current collecting electrode comprising a ribbon-like copper foil and a plating layer provided around the copper foil, comprising a ribbon-like copper foil and a plating layer provided around the copper foil.
  • An extraction electrode whose one end is electrically connected to the current collecting electrode is prepared, the current collecting electrode and the current extracting electrode are arranged on the second electrode layer, and an insulating sheet is provided between the current extracting electrode and the solar cell.
  • the plating layer is melted by sliding an ultrasonic soldering iron on the current collecting electrode in the longitudinal direction of the current collecting electrode, and only the current collecting electrode is disposed on the second electrode layer.
  • the first region, and the collecting electrode and the collector In any of the second regions disposed on the second electrode layer so that the electrodes overlap, the plating layer is expanded in the width direction of the current collecting electrode toward the second electrode layer, and The electric electrode and the extraction electrode are joined on the second electrode layer.
  • the extraction electrode and the collecting electrode are formed so as to overlap with each other on the second electrode layer.
  • the ultrasonic soldering iron when the ultrasonic soldering iron is slid on the current collecting electrode, the sliding with the ultrasonic soldering iron is completed. It is preferable to release the ultrasonic soldering iron from the current collecting electrode so that the ultrasonic soldering iron is rubbed against the second electrode layer at the side end of the current collecting electrode.
  • the collecting electrode is formed of a ribbon-like copper foil and a plating layer provided around the copper foil.
  • the plating layer has a portion extended in the width direction of the current collecting electrode toward the second electrode layer.
  • a solar cell module can be provided.
  • each of the collector electrode and the extraction electrode is formed of a ribbon-like copper foil and a plating layer provided around the copper foil.
  • the first region where only the collecting electrode is arranged on the second electrode layer, and the collecting electrode and the extraction electrode A second region is provided on the second electrode layer so as to overlap the electrode.
  • the plating layer has a portion extended in the width direction of the current collecting electrode toward the second electrode layer.
  • the current collecting electrode is joined by the extended plating layer on the second electrode layer, so that no protrusion due to the pre-solder as in the prior art is generated.
  • the plating layer part melts at the junction (second region) between the collector electrode and the extraction electrode, and the adhesion of the collector electrode, the extraction electrode, and the second electrode layer is good, and the conductivity is reliable. Secured.
  • both the current collecting electrode and the takeout electrode or one of the current collecting electrode and the takeout electrode are prevented from being poorly bonded, and disconnection and heat generation due to this, and both the second electrode layer, the current collecting electrode and the takeout electrode,
  • corrugation in the junction part in one side of a current collection electrode and an extraction electrode is planarized, and the solar cell module which can be reduced in thickness can be provided.
  • the solar cell module according to the second aspect of the present invention can obtain high connection reliability at the joint portion (second region) of the extraction electrode.
  • the manufacturing method of the solar cell module of the 3rd aspect of this invention arrange
  • the plating layer is melted by sliding an ultrasonic soldering iron on the collecting electrode in the longitudinal direction of the electrode, the plating layer is expanded in the width direction of the collecting electrode toward the second electrode layer, and the collecting electrode is Bonded on the second electrode layer.
  • the adhesiveness between a 2nd electrode layer and a current collection electrode is favorable, and electroconductivity is ensured reliably.
  • the manufacturing method of a solar cell module which can manufacture a solar cell module can be provided.
  • the collecting electrode and the extraction electrode are formed using a ribbon-like copper foil and a plating layer provided around the copper foil. Further, the collector electrode and the extraction electrode are arranged on the second electrode layer, and the plating layer is melted by sliding an ultrasonic soldering iron on the collector electrode in the longitudinal direction of the collector electrode. Further, plating is performed in any of the first region where only the collecting electrode is disposed on the second electrode layer and the second region disposed on the second electrode layer so that the collecting electrode and the extraction electrode overlap each other. The layer is expanded in the width direction of the collecting electrode toward the second electrode layer, and the collecting electrode and the extraction electrode are joined on the second electrode layer.
  • the plating layer part melts at the junction (second region) between the current collecting electrode and the extraction electrode, and the adhesion between the current collection electrode, the extraction electrode, and the second electrode layer is good, and the conductivity is reliable. Secured. Moreover, the thickness of the layer and electrode in the first region and the thickness of the layer and electrode in the second region can be made substantially uniform.
  • the manufacturing method of a solar cell module which can manufacture a battery module can be provided.
  • the second region when the extraction electrode and the collecting electrode are formed so as to overlap each other on the second electrode layer, a configuration in which the extraction electrode is difficult to come off can be realized. Therefore, the method for manufacturing the solar cell module according to the fourth aspect of the present invention can remarkably reduce the occurrence of manufacturing defects at the joining portion (second region) of the extraction electrode, and thus contributes to the construction of a manufacturing line that realizes a high yield. To do.
  • FIG. 2B is an enlarged cross-sectional view showing a portion indicated by a symbol E in FIG. 2A. It is a perspective view explaining the manufacturing method of the solar cell module shown to FIG. 1, FIG. 2A and FIG. 2B. It is a perspective view explaining the next process of FIG. FIG. 5 is an enlarged cross-sectional view illustrating a main part for explaining a next step of FIG. 4. It is a figure explaining the manufacturing method of the solar cell module which concerns on this invention, Comprising: It is an expanded sectional view which shows the principal part of a solar cell module.
  • FIG. 13 is an enlarged sectional view showing a main part for explaining a next step of FIG. 12.
  • FIG. 13 is an enlarged sectional view showing a main part for explaining a next step of FIG. 12.
  • FIG. 13 is an enlarged sectional view showing a main part for explaining a next step of FIG. 12.
  • FIG. 1, FIG. 2A, and FIG. 2B are figures which show typically the structural example of solar cell module 1A (1) of 1st embodiment.
  • 1 is a perspective view showing a solar cell module 1A (1)
  • FIG. 2A is a cross-sectional view showing the solar cell module 1A (1) taken along line X1-X2 in FIG. 1
  • FIG. 2B is a symbol E in FIG. FIG.
  • the solar cell module 1 ⁇ / b> A (1) of the first embodiment includes a solar cell 10 and a collecting electrode 4.
  • the photoelectric conversion body 12 in which at least the first electrode layer 13, the semiconductor layer 14, and the second electrode layer 15 are stacked in this order is formed on the first surface 11 a of the substrate 11.
  • the collecting electrode 4 is disposed on the second electrode layer 15.
  • two ribbon-shaped current collecting electrodes 4 are provided on the photoelectric conversion body 12 of the solar cell 10.
  • the surface shape of the photoelectric conversion body 12 is substantially rectangular as shown in FIG.
  • the collecting electrode 4 is disposed along two peripheral portions (peripheral portions of the substrate 11) that are substantially parallel to each other.
  • the collector electrode 4 is a ribbon-shaped copper foil 20 and a plating provided around the copper foil 20. And the layer 21.
  • the plated layer 21 has a portion S (extended portion) that is extended in the width direction of the collecting electrode 4 toward the second electrode layer 15.
  • the collecting electrode 4 is extended on the second electrode layer 15 by manufacturing the solar cell module 1A (1) by a specific method described later. Bonded by the plating layer 21. With this structure, there is no protrusion due to the preliminary solder as in the prior art. In addition, the plating layer 21 is melted at the joint between the current collecting electrode 4 and the second electrode layer 15, the adhesion between the current collecting electrode 4 and the second electrode layer 15 is good, and the conductivity is high. Secured surely. As a result, in the solar cell module 1A (1) of the first embodiment, the unevenness at the junction between the second electrode layer 15 and the collector electrode 4 is flattened, and the solar cell 10 can be thinned. Is possible.
  • the thickness of the copper foil 20 constituting the current collecting electrode 4 is not particularly limited, but is, for example, 30 to 300 [ ⁇ m].
  • the width of the copper foil 20 is not particularly limited, but is, for example, 0.1 to 10 [mm].
  • the plated layer 21 is made of, for example, a material such as Ag (silver), Sn (tin), or Cu (copper), and the thickness thereof is not particularly limited, but is, for example, 1 to 100 [ ⁇ m].
  • the structure of the solar cell 10 a known structure is adopted. For example, an amorphous type, a nanocrystal type, etc. can be adopted, and further, a thin film type, a tandem type, etc. can be adopted. It is not limited to such a structure.
  • the solar cell 10 has at least a first electrode (lower electrode) layer 13, a semiconductor layer 14, and a second electrode layer 15 on the first surface 11 a (one surface of the substrate 11) of the substrate 11.
  • the (upper electrode) layer 15 is provided with the photoelectric conversion body 12 laminated in this order.
  • the material of the substrate 11 for example, an insulating material having excellent sunlight permeability and durability such as glass and transparent resin may be used.
  • the solar cell 10 can generate power.
  • the first electrode layer 13 may be formed of a transparent conductive material, for example, a light transmissive metal oxide such as TCO or ITO.
  • the 2nd electrode layer 15 should just be formed with electroconductive metal films, such as silver (Ag) and copper (Cu).
  • the semiconductor layer 14 has an i-type silicon film 16 sandwiched between a p-type silicon film 17 and an n-type silicon film 18 as shown in FIG. 2B. It has a configured pin junction structure.
  • sunlight enters the semiconductor layer 14 electrons and holes are generated, and the electrons and holes move actively due to the potential difference between the p-type silicon film 17 and the n-type silicon film 18, and this is repeated continuously.
  • a potential difference is generated between the first electrode layer 13 and the second electrode layer 15 (photoelectric conversion).
  • the silicon film may be either an amorphous type or a nano cristal type.
  • the photoelectric converter 12 is usually divided by a scribe line 19 into a large number of partition elements 12 a having, for example, a strip shape.
  • the partition elements 12a are electrically partitioned from each other and are electrically connected in series between the partition elements 12 adjacent to each other.
  • the photoelectric conversion body 12 has a structure in which all the many partition elements 12a are electrically connected in series. In this structure, a high potential difference current can be extracted.
  • the scribe line 19 may be formed by, for example, forming the photoelectric conversion body 12 uniformly on the first surface 11a of the substrate 11 and then forming grooves in the photoelectric conversion body 12 at a predetermined interval with a laser or the like. .
  • the semiconductor layer 14 has a single pin junction structure as the structure, but the present invention is not limited to such a structure.
  • the pin junction structure may be a tandem type having a structure composed of a plurality of layers such as two layers or three layers.
  • the layer that performs photoelectric conversion can be adjusted in accordance with the wavelength of light irradiated on the solar cell.
  • the solar cell module 1A (1) of the first embodiment is not limited to the structure illustrated in FIG. 1, FIG. 2A, and FIG. 2B. It may be changed.
  • a protective layer (not shown) made of an insulating resin or the like may be further formed on the second electrode layer 15 constituting the photoelectric conversion body 12.
  • FIGS. 3 and 4 are perspective views, and FIGS. 5 and 6 are enlarged views taken along line X3-X4 in FIG. It is sectional drawing.
  • the solar cell 10 can be manufactured according to a known method. For example, the first electrode layer 13, the semiconductor layer 14, and the second electrode layer 15 are stacked in this order on the first surface 11 a of the substrate 11 to form the photoelectric conversion body 12. Then, what is necessary is just to manufacture the solar cell 10 with the manufacturing method which has the process of forming the scribe line 19 suitably and laminating
  • the thickness of each layer which comprises the solar cell 10 is the same as that of the conventional solar cell.
  • the manufacturing method of the solar cell module of 1st embodiment uses the current collection electrode 4 which consists of the copper foil 20 of ribbon shape, and the plating layer 21 provided around the copper foil 20.
  • the collector electrode 4 is disposed on the second electrode layer 15, and the plating layer 21 is melted by sliding an ultrasonic soldering iron on the collector electrode 4 in the longitudinal direction of the collector electrode 4. 21 is expanded in the width direction of the current collecting electrode 4 toward the second electrode layer 15, and the current collecting electrode 4 is joined to the second electrode layer 15.
  • the current collecting electrode 4 is joined to the second electrode layer 15 by the plating layer 21 extended on the second electrode layer 15, a protrusion due to the preliminary solder as in the conventional case is generated. do not do.
  • the plating layer 21 is melted at the joint portion between the second electrode layer 15 and the collecting electrode 4 to obtain good adhesion, and the conductivity is reliably ensured.
  • the solar cell is reduced in thickness by preventing the bonding failure of the current collecting electrode 4 and the disconnection, heat generation, and the like resulting from it, and the unevenness in the bonded portion of the current collecting electrode 4 being flattened. Module 1 can be manufactured.
  • the joining method of the current collection electrode 4 in 1st embodiment is demonstrated in order.
  • a ribbon-like current collecting electrode 4 is disposed on the second electrode layer 15 of the photoelectric conversion body 12.
  • the collector electrode 4 includes a ribbon-like copper foil 20 and a plating layer 21 provided around the copper foil 20.
  • the ultrasonic soldering iron 30 is slid on the current collecting electrode 4 along the longitudinal direction of the current collecting electrode 4 to melt the plating layer 21 of the current collecting electrode 4.
  • 21 is expanded in the width direction of the current collecting electrode 4 toward the second electrode layer 15, and the current collecting electrode 4 is electrically joined to the second electrode layer 15 through the expanded portion.
  • the ultrasonic soldering iron 30 it is possible to melt the plating layer 21 of the collecting electrode 4 and to electrically join the collecting electrode 4 to the second electrode layer 15.
  • the molten plating layer 21 expands in the width direction of the current collecting electrode 4 toward the second electrode layer 15 and becomes a portion S (expansion portion).
  • the ultrasonic soldering conditions are not particularly limited, but the tip temperature of the ultrasonic soldering iron 30 is, for example, 200 to 600 [° C.].
  • the ultrasonic output of the ultrasonic soldering iron 30 is, for example, 0.1 to 10 [W].
  • the ultrasonic frequency of the ultrasonic soldering iron 30 is, for example, 5 to 100 [kHz].
  • the moving (sliding) speed of the ultrasonic soldering iron 30 is, for example, 0.05 to 1 [m / s].
  • the ultrasonic soldering iron 30 when the ultrasonic soldering iron 30 is slid on the current collecting electrode 4, the ultrasonic soldering iron 30 is attached to the side end portion of the current collecting electrode 4 where the sliding by the ultrasonic soldering iron 30 is finished. It is preferable to release the ultrasonic soldering iron 30 from the current collecting electrode 4 so as to rub toward the second electrode layer 15 (downward direction in FIG. 6).
  • the ultrasonic soldering iron 30 is lifted above the substrate 11 and released from the current collecting electrode 4 at the end of the sliding operation, the molten plating layer 21 may be pulled to form protrusions. When this protrusion penetrates the back sheet, the reliability of the solar cell module may be reduced or a short circuit may be caused.
  • the ultrasonic soldering iron 30 is not lifted above the substrate 11 but is rubbed downward (toward the lower side of the substrate 11).
  • the soldering iron 30 is released from the second electrode layer 15.
  • no protrusion is generated.
  • the fall of the reliability of a solar cell module or the short circuit by the protrusion penetrating the back sheet can be eliminated.
  • the solar cell module has a sealing structure in which two glass substrates are bonded to each other, it is possible to prevent substrate cracking in the sealing step.
  • the conventional spare solder was arranged in the form of dots, unevenness was generated between the part with and without the solder, which caused variations in thickness. Since the plating layer 21 is bonded to the entire surface of the electrode 4, the above unevenness or thickness variation does not occur. Further, on the second electrode layer 15, the current collecting electrode 4 is joined to the second electrode layer 15 not at a point (point contact) but at a surface (surface contact), so that sufficient joining strength and conductivity can be ensured. And the reliability of the solar cell module can be improved.
  • the plating layer 21 is melted at the joint between the current collecting electrode 4 and the second electrode layer 15, the adhesion between the current collecting electrode 4 and the second electrode layer 15 is good, Conductivity is ensured reliably. Further, the molten plating layer 21 hangs down on the second electrode layer 15, and the space between the side portion of the copper foil 20 constituting the current collecting electrode 4 and the second electrode layer 15 is also covered with the plating layer 21. The plating layer 21 formed on the side portion of the copper foil 20 is joined to the second electrode layer 15 so as to have an inclined surface. Such a plating layer 21 also constitutes the collecting electrode 4. Therefore, since the lateral side (side part) of the copper foil 20 is also covered with the plating layer 21 and the current collecting electrode 4 is pressed by the second electrode layer 15, it is possible to ensure sufficient bonding strength and conductivity. it can.
  • the collector electrode 4 is secondly formed by the plating layer 21 extended on the second electrode layer 15. Since it is joined to the electrode layer 15, there is no projection due to the preliminary solder as in the prior art. In addition, the plating layer 21 is melted at the joint between the second electrode layer 15 and the current collecting electrode 4, so that good adhesion is obtained and the conductivity is reliably ensured.
  • solar cell module 1A (1) manufactured by the method of 1st embodiment as mentioned above prevents the joining defect of the current collection electrode 4, a disconnection, heat_generation
  • the solar cell 10 can be thinned by being flattened.
  • FIG. 7 and 8 are diagrams schematically showing a configuration example of the solar cell module 1B (1) of the second embodiment, FIG. 7 is a perspective view, and FIG. 8 is an enlarged view taken along line X5-X6 in FIG. It is sectional drawing.
  • the solar cell module 1 ⁇ / b> B (1) of the second embodiment includes a solar cell 10, a current collecting electrode 4, a take-out electrode 3, and an insulating sheet 2.
  • the photoelectric conversion body 12 in which at least the first electrode layer 13, the semiconductor layer 14, and the second electrode layer 15 are stacked in this order is formed on the first surface 11 a of the substrate 11.
  • the collecting electrode 4 is disposed on the second electrode layer 15.
  • the extraction electrode 3 is electrically connected to one end of the current collecting electrode 4.
  • the insulating sheet 2 is disposed between the extraction electrode 3 and the solar cell 10.
  • two ribbon-shaped current collecting electrodes 4 are provided on the photoelectric conversion body 12 of the solar cell 10.
  • Ribbon-shaped extraction electrodes 3 are connected to the collector electrode 4, and electricity generated by the solar cell 10 is extracted to the outside of the solar cell 10 by the extraction electrode 3 through the collector electrode 4.
  • One end portion (first end portion) of the extraction electrode 3 is disposed on the current collection electrode 4, and the extraction electrode 3 and the current collection electrode 4 are electrically connected.
  • the other end (second end) of the extraction electrode 3 is bent so as to rise from the back surface 12a of the photoelectric conversion body 12 so that electricity can be easily extracted.
  • the insulating sheet 2 is disposed between the extraction electrode 3 and the photoelectric conversion body 12, so that the extraction electrode 3 and the photoelectric conversion body 12 do not contact each other.
  • each of the collecting electrode 4 and the extraction electrode 3 includes a ribbon-shaped copper foil 20 and a plating layer 21 provided around the copper foil 20. It consists of.
  • the solar cell module 1B (1) includes a first electrode layer in which only the collecting electrode 4 is disposed on the second electrode layer 15, and the second electrode layer so that the collecting electrode 4 and the extraction electrode 3 overlap each other. 15 has a second region ⁇ disposed on the surface. In both the first region ⁇ and the second region ⁇ , the plating layer 21 has a portion S that extends in the width direction of the current collecting electrode 4 toward the second electrode layer 15.
  • the current collecting electrode 4 is extended on the second electrode layer 15 by manufacturing the solar cell module 1B (1) by a specific method described later. Bonded by the plating layer 21. With this structure, there is no protrusion due to the preliminary solder as in the prior art. In addition, the plating layer 21 is melted at the junction (second region ⁇ ) between the collector electrode 4 and the extraction electrode 3, and the adhesion between the collector electrode 4, the extraction electrode 3, and the second electrode layer 15 is good. In addition, conductivity is reliably ensured.
  • the solar cell module 1B (1) of the second embodiment has the unevenness at the junction between the second electrode layer 15, the collector electrode 4 and the extraction electrode 3, or the second electrode layer 15 and the collector electrode 4 or It is possible to flatten the unevenness at the joint portion of the extraction electrode 3 and to reduce the thickness of the solar cell 10.
  • FIGS. 9 to 15 are views for explaining a method of manufacturing the solar cell module according to the second embodiment.
  • FIGS. 9 to 11 are perspective views, and FIGS. 12 and 13 are enlarged views taken along line X7-X8 in FIG. It is sectional drawing.
  • 14 and 15 are enlarged plan views showing a portion (near the joint) including the joint (second region ⁇ ) between the collecting electrode 4 and the extraction electrode 3.
  • the collector electrode 4 and the extraction electrode 3 including the ribbon-like copper foil 20 and the plating layer 21 provided around the copper foil 20 are prepared. .
  • the collector electrode 4 and the extraction electrode 3 are arranged on the second electrode layer 15, and the plating layer 21 is formed by sliding an ultrasonic soldering iron on the collector electrode 4 in the longitudinal direction of the collector electrode 4. Melting.
  • the first region ⁇ in which only the collecting electrode 4 is arranged on the second electrode layer 15 and the second region arranged on the second electrode layer 15 so that the collecting electrode 4 and the extraction electrode 3 overlap each other. ⁇ is formed.
  • the plating layer 21 is extended in the width direction of the current collecting electrode 4 toward the second electrode layer 15, and the current collecting electrode 4 and the take-out are extracted on the second electrode layer 15.
  • the electrode 3 is bonded to the second electrode layer 15.
  • the current collecting electrode 4 is joined by the plated layer 21 extended on the second electrode layer 15, no protrusion due to the pre-solder as in the prior art is generated.
  • the plating layer 21 is melted at the junction (second region ⁇ ) between the current collecting electrode 4 and the extraction electrode 3, good adhesion is obtained, and conductivity is reliably ensured.
  • the thickness of the layer and electrode in the first region ⁇ and the thickness of the layer and electrode in the second region ⁇ can be made substantially uniform.
  • the second embodiment it is possible to prevent a bonding failure between the collecting electrode 4 and the extraction electrode 3 and disconnection / heat generation caused by the bonding, and flatten the unevenness at the bonding portion (second region ⁇ ) of the extraction electrode 3.
  • the thinned solar cell module 1B (1) can be manufactured.
  • the joining method of the current collecting electrode 4 and the extraction electrode 3 in the second embodiment will be described in order.
  • the ribbon-shaped extraction electrode 3 is disposed on the second electrode layer 15 of the photoelectric conversion body 12.
  • the extraction electrode 3 includes a ribbon-like copper foil 20 and a plating layer 21 provided around the copper foil 20.
  • the insulating sheet 2 is disposed between the photoelectric converter 12 and the extraction electrode 3.
  • the material of the insulating sheet 2 is preferably a resin, and more preferably a synthetic resin.
  • a resin preferably a resin, and more preferably a synthetic resin.
  • a silicon resin, a fluorine resin, or a polyimide resin can be employed.
  • As a material of the insulating sheet 2 a well-known material may be used and a commercial item may be used.
  • a ribbon-like current collecting electrode 4 is disposed on the extraction electrode 3. 13 and 15, the ultrasonic soldering iron 30 is slid on the current collecting electrode 4 on the current collecting electrode 4, so that the plating layer 21 constituting the current collecting electrode 4 and the extraction electrode 3 is formed. And the plating layer 21 is expanded in the width direction of the collector electrode 4 toward the second electrode layer 15, and the collector electrode 4 and the extraction electrode 3 are electrically connected to the second electrode layer 15 through the expanded portion.
  • the take-out electrode 3 is further soldered onto the collector electrode 4.
  • the extraction electrode 3 is first disposed on the photoelectric conversion body 12, the current collecting electrode 4 is disposed on the extraction electrode 3, and the electrodes 3 and 4 are ultrasonically soldered together. ing. Thereby, joining of the current collection electrode 4 and the photoelectric conversion body 12, and joining of the current collection electrode 4 and the taking-out electrode 3 can be performed by one process, and a man-hour can be reduced.
  • the ultrasonic soldering iron 30 when the ultrasonic soldering iron 30 is slid on the current collecting electrode 4, the ultrasonic soldering iron 30 is attached to the side end portion of the current collecting electrode 4 where the sliding by the ultrasonic soldering iron 30 ends. It is preferable to release the ultrasonic soldering iron 30 from the collecting electrode 4 so as to rub toward the two-electrode layer 15 (downward in FIG. 13). At the end (last) of the sliding operation, the ultrasonic soldering iron 30 is not lifted above the substrate 11 but is rubbed downward (toward the lower side of the substrate 11). By releasing from the two-electrode layer 15, it is possible to avoid the occurrence of protrusions.
  • the fall of the reliability of a solar cell module or a short circuit by a protrusion penetrating the back sheet can be eliminated. Furthermore, when the solar cell module has a sealing structure in which two glass substrates are bonded to each other, it is possible to prevent substrate cracking in the sealing step.
  • the conventional spare solder was arranged in the form of dots, irregularities were produced between the part with and without the solder, which caused variations in thickness. Since the plating layer 21 is bonded to the entire surface of the electrode 4, the above unevenness or thickness variation does not occur. Further, on the second electrode layer 15, the current collecting electrode 4 and the extraction electrode 3 are bonded to the second electrode layer 15 not at a point (point contact) but at a surface (surface contact), so that sufficient bonding strength and conductivity are obtained. Can be ensured, and the reliability of the solar cell module can be improved.
  • the plating layer 21 is melted at the junction (second region ⁇ ) between the current collecting electrode 4 and the extraction electrode 3, the adhesion between the current collection electrode 4 and the extraction electrode 3 is good. In addition, conductivity is reliably ensured. Moreover, since the copper foil 20 is sufficiently thin, the thickness in the first region ⁇ of only the collecting electrode 4 and the thickness in the second region ⁇ can be made substantially uniform. Further, the molten plating layer 21 hangs down on the second electrode layer 15, and the side of the copper foil 20 constituting the current collecting electrode 4 and the extraction electrode 3 and the second electrode layer 15 are also covered with the plating layer 21. It has been broken.
  • the plating layer 21 formed on the side portion of the copper foil 20 is joined to the second electrode layer 15 so as to have an inclined surface.
  • Such a plating layer 21 also constitutes the current collecting electrode 4 and the extraction electrode 3. Accordingly, since the lateral side (side portion) of the copper foil 20 is also covered with the plating layer 21 and the collecting electrode 4 and the extraction electrode 3 are pressed by the second electrode layer 15, sufficient bonding strength and conductivity are obtained. Can be secured.
  • the collector electrode is formed by the plating layer 21 extended on the second electrode layer 15 in the junction structure of the photoelectric converter 12, the collector electrode 4, and the extraction electrode 3. 4 and the extraction electrode 3 are joined to the second electrode layer 15, so that no projection due to the pre-solder is generated.
  • the plating layer 21 is melted at the joint (second region ⁇ ) between the current collecting electrode 4 and the extraction electrode 3, good adhesion is obtained, and conductivity is reliably ensured.
  • the thickness of the layer and electrode in the first region ⁇ and the thickness of the layer and electrode in the second region ⁇ can be made substantially uniform.
  • the solar cell module 1 ⁇ / b> B (1) manufactured by the method of the second embodiment prevents a defective connection between the collector electrode 4 and the extraction electrode 3, and disconnection / heat generation caused by the failure.
  • the unevenness in the joint portion (second region ⁇ ) is flattened, and the solar cell 10 can be thinned.
  • the present invention is widely applicable to a solar cell module and a manufacturing method thereof.
  • 1A, 1B (1) Solar cell module, 2 insulating sheet, 3 extraction electrode, 4 collector electrode, 10 solar cell, 11 substrate, 11a substrate 1st surface, 12 photoelectric conversion body, 13 first electrode layer, 14 semiconductor Layer, 15 second electrode layer, 20 copper foil, 21 plated layer, ⁇ first region, ⁇ second region, S expanded part.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un module de cellule solaire qui comprend une cellule solaire (10) comportant un convertisseur photoélectrique (12) formé sur un substrat (11), une feuille de cuivre en forme de ruban (20) et une couche de revêtement (21) disposée autour de la feuille de cuivre (20). Le convertisseur photoélectrique (12) comprend au moins une première couche d'électrode (13), une couche de semi-conducteur (14) et une deuxième couche d'électrode (15), laminées dans cet ordre. Le module de cellule solaire comprend également une électrode de collecte de courant (4) disposée sur la deuxième couche d'électrode (15). La couche de revêtement (21) contient une partie (S) qui est étendue dans la direction de la largeur de l'électrode de collecte de courant (4) vers la deuxième couche d'électrode (15).
PCT/JP2011/055630 2010-03-17 2011-03-10 Module de cellule solaire et son procédé de fabrication WO2011114983A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004289A (ja) * 2010-06-16 2012-01-05 Toshiba Mitsubishi-Electric Industrial System Corp 部材接合方法
JP2014207467A (ja) * 2010-04-01 2014-10-30 ゾモント・ゲーエムベーハー 太陽電池および太陽電池を製造する方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020129410A1 (fr) * 2018-12-18 2020-06-25 アートビーム有限会社 Procédé de brasage par ultrasons et dispositif de brasage par ultrasons

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077385A (ja) * 1999-09-06 2001-03-23 Kanegafuchi Chem Ind Co Ltd 薄膜太陽電池モジュール及びその製造方法
JP2002263880A (ja) * 2001-03-06 2002-09-17 Hitachi Cable Ltd Ｐｂフリー半田、およびこれを使用した接続用リード線ならびに電気部品
JP2003142711A (ja) * 2001-11-06 2003-05-16 Sony Corp 集積型太陽電池の製造方法
JP2004140100A (ja) * 2002-10-16 2004-05-13 Mitsubishi Heavy Ind Ltd 薄膜太陽電池モジュール
JP2007305876A (ja) * 2006-05-12 2007-11-22 Matsushita Electric Ind Co Ltd 太陽電池モジュール
JP2008168339A (ja) * 2006-12-14 2008-07-24 Hitachi Cable Ltd 太陽電池用めっき線及びその製造方法
JP2009130020A (ja) * 2007-11-21 2009-06-11 Mitsubishi Heavy Ind Ltd 太陽電池パネル及び太陽電池パネルの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077385A (ja) * 1999-09-06 2001-03-23 Kanegafuchi Chem Ind Co Ltd 薄膜太陽電池モジュール及びその製造方法
JP2002263880A (ja) * 2001-03-06 2002-09-17 Hitachi Cable Ltd Ｐｂフリー半田、およびこれを使用した接続用リード線ならびに電気部品
JP2003142711A (ja) * 2001-11-06 2003-05-16 Sony Corp 集積型太陽電池の製造方法
JP2004140100A (ja) * 2002-10-16 2004-05-13 Mitsubishi Heavy Ind Ltd 薄膜太陽電池モジュール
JP2007305876A (ja) * 2006-05-12 2007-11-22 Matsushita Electric Ind Co Ltd 太陽電池モジュール
JP2008168339A (ja) * 2006-12-14 2008-07-24 Hitachi Cable Ltd 太陽電池用めっき線及びその製造方法
JP2009130020A (ja) * 2007-11-21 2009-06-11 Mitsubishi Heavy Ind Ltd 太陽電池パネル及び太陽電池パネルの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207467A (ja) * 2010-04-01 2014-10-30 ゾモント・ゲーエムベーハー 太陽電池および太陽電池を製造する方法
JP2012004289A (ja) * 2010-06-16 2012-01-05 Toshiba Mitsubishi-Electric Industrial System Corp 部材接合方法

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