WO2011107697A1 - Cellule photovoltaïque - Google Patents
Cellule photovoltaïque Download PDFInfo
- Publication number
- WO2011107697A1 WO2011107697A1 PCT/FR2011/050400 FR2011050400W WO2011107697A1 WO 2011107697 A1 WO2011107697 A1 WO 2011107697A1 FR 2011050400 W FR2011050400 W FR 2011050400W WO 2011107697 A1 WO2011107697 A1 WO 2011107697A1
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- WIPO (PCT)
- Prior art keywords
- layer
- layers
- tco
- substrate
- photovoltaic
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 96
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical class [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000011521 glass Substances 0.000 claims abstract description 34
- 230000004888 barrier function Effects 0.000 claims abstract description 33
- 239000011787 zinc oxide Substances 0.000 claims abstract description 29
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 18
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 15
- 238000000137 annealing Methods 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 13
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 9
- 229910052796 boron Inorganic materials 0.000 claims abstract description 7
- 239000003989 dielectric material Substances 0.000 claims abstract description 7
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052738 indium Inorganic materials 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 6
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 5
- 239000003513 alkali Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 16
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 11
- 238000010791 quenching Methods 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 9
- 230000000171 quenching effect Effects 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- 229910005091 Si3N Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- 229910021425 protocrystalline silicon Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229910004613 CdTe Inorganic materials 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910052793 cadmium Inorganic materials 0.000 claims 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 1
- 238000005496 tempering Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 156
- 210000004027 cell Anatomy 0.000 description 37
- 238000000034 method Methods 0.000 description 19
- 235000014692 zinc oxide Nutrition 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 13
- 238000000151 deposition Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000001755 magnetron sputter deposition Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910020286 SiOxNy Inorganic materials 0.000 description 2
- -1 T1O2 Inorganic materials 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000004630 atomic force microscopy Methods 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 210000002381 plasma Anatomy 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- OANVFVBYPNXRLD-UHFFFAOYSA-M propyromazine bromide Chemical compound [Br-].C12=CC=CC=C2SC2=CC=CC=C2N1C(=O)C(C)[N+]1(C)CCCC1 OANVFVBYPNXRLD-UHFFFAOYSA-M 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- ZQRRBZZVXPVWRB-UHFFFAOYSA-N [S].[Se] Chemical class [S].[Se] ZQRRBZZVXPVWRB-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052951 chalcopyrite Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3435—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising a nitride, oxynitride, boronitride or carbonitride
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3678—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/90—Other aspects of coatings
- C03C2217/94—Transparent conductive oxide layers [TCO] being part of a multilayer coating
- C03C2217/944—Layers comprising zinc oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a novel photovoltaic cell, comprising a glass substrate coated with a transparent layer of electrically conductive oxide, often called TCO in the field.
- glass substrate refers to a substrate made of mineral glass.
- a photovoltaic module consists of a set of photovoltaic cells, also called photovoltaic modules, often coupled in series with each other. These cells or modules generate a direct current when exposed to light. To provide a suitable power which corresponds to sufficient and expected energy, sufficiently large areas of a multitude of photovoltaic modules are produced. These modules can be integrated on the roofs of houses or commercial premises or placed in fields for centralized energy production.
- a photovoltaic module thus comprises a support substrate and a so-called photovoltaic material which is most often constituted by a stack of doped semiconductors n and p, forming in their electrical contact zone a pn junction.
- Another substrate on the opposite side, protects the photovoltaic material.
- This front face substrate is preferably a transparent mineral glass having a very high light transmittance in the 300 to 1250 nm radiation range.
- the photovoltaic material On each side of the photovoltaic material are electrodes constituted by electrically conductive materials which constitute the positive and negative terminals of the photovoltaic cell.
- the two electrodes (anode and cathode) of the photovoltaic module make it possible to collect the current produced under the effect of light in the photovoltaic material, the transport and the segregation of the charges being due to the difference of potential created between the respectively p-doped and n-doped portions of the semiconductors.
- An example of such a module is for example described in the application WO2006 / 005889, to which reference will be made for the details of the embodiment.
- the material is the seat of the photovoltaic activity, comprising or consisting of amorphous (a-Si) or microcrystalline ( ⁇ - ⁇ ) silicon, or cadmium telluride (CdTe) or chalcopyrite (CIS, CIGS, CiGSe2), is this time directly deposited on the substrate in the form of more or less thick layers.
- a-Si amorphous
- ⁇ - ⁇ microcrystalline
- CdTe cadmium telluride
- CIS, CIGS, CiGSe2 chalcopyrite
- the manufacture of modules on glass substrates, cut at the final size of the modules thus comprises the deposition of a succession of thin layers deposited and formed directly one after the other on the substrate, of which at least:
- a thin layer serving as a reflecting rear electrode.
- the photovoltaic cells are performed by intermediate laser etching steps between each layer deposition step. These substrates glassmakers often hardened and integrating the photovoltaic cells thus constitute the substrates of the front of the modules. A backside support substrate is then laminated to the face provided with the stack of layers of the front face substrate.
- the electrode arranged against the front glass substrate of the module is of course transparent to let the light energy to the active photovoltaic layer.
- This electrode usually comprises a transparent electrically conductive oxide which is often called in the TCO (for "Transparent Conductive Oxide”) range.
- AZO aluminum oxide-doped zinc oxide
- ITO indium-doped tin oxide
- aluminum oxide oxide and aluminum oxide are used as the material for the production of these TCO layers.
- these layers constituting the electrodes are essential functional components of thin-film solar cells, because they serve to collect and evacuate the electrons or holes formed by the incident electromagnetic radiation in the photovoltaic semiconductor layers.
- their resistivity is as low as possible.
- the TCO-based electrode coating must be deposited at a relatively large physical thickness, of the order of a few hundred nanometers, which is expensive in view of the the price of these materials when they are deposited in thin layers, in particular by the magnetron sputtering technique.
- TCO-based electrode coatings thus lies particularly in the fact that the physical thickness of the material is necessarily a compromise between its final electrical conduction and its final transparency after deposition. In other words, the greater the physical thickness of the material, the higher its conductivity will be, but the lower the transparency and vice versa. In the end, it is not possible with TCO coatings current to independently and satisfactorily optimize the conductivity of the electrode coating and its transparency, including its light absorption and light transmission.
- TCO photovoltaic layer
- substrates coated with the TCO layer must often undergo a final heat treatment, especially a quench.
- the deposition of certain photovoltaic layers such as CdTe layers requires an operating temperature of at least 400 ° C and even up to 700 ° C. During successive quenching and / or heating, the stack is thus carried, under ambient or other conditions, at temperatures greater than 500 degrees, or even higher than 600.degree. C., for a few minutes.
- a layer disposed above the electrode layer (TCO) with reference to the front face glass substrate and as a sub-layer a layer disposed beneath the electrode layer (TCO) is designated as an on-layer. compared to the front face glass substrate.
- the present invention therefore aims at overcoming the drawbacks of the preceding techniques by proposing a solution comprising a stack such that the optical and electrical conduction properties of the TCO layer are not substantially affected by the successive heat treatment and heating phases. of the manufacture of the photovoltaic cell, and are even improved by the latter.
- the object of the present invention is more particularly to provide a new photovoltaic cell comprising a transparent glass substrate, coated with a transparent layer of electrically conductive oxide TCO whose optical properties are improved, especially after an annealing for the recrystallization of the layer TCO.
- the present invention relates in the first place to a photovoltaic cell comprising at least one transparent glass substrate, protecting a stack of layers comprising at least:
- said lower electrode layer being a TCO comprising or consisting of a substituted zinc oxide, in particular by a chosen element; in the group of the group Al, Ga, In, B, Ti, V, Y, Zr, Ge or by a combination of these different elements, said cell being characterized in that it further comprises, between said substrate and said lower electrode layer, a succession of at least two layers of dielectric materials, of which:
- a second layer comprising or consisting of aluminum nitride AlN, gallium nitride GaN or a mixture of the two compounds,
- said AlN, GaN or a mixture of these two compounds being in contact with said lower electrode layer.
- the second layer in contact with said lower electrode layer consists of aluminum nitride AlN.
- Substituted zinc oxide type means a zinc oxide substituted by an element of the Periodic Table, in particular by doping, up to a level which makes it possible to increase its electrical conductivity substantially, according to well-known principles. in the field for obtaining TCO.
- the lower electrode layer may be a TCO comprising or consisting of zinc oxide ZnO doped with an element selected from the group of the group Al, Ga, In, B, Ti, V, Y, Zr, Ge or by a combination of these different dopants.
- This layer is preferably a TCO consisting of ZnO oxide doped with aluminum AZO or zinc oxide ZnO doped with gallium GZO or zinc oxide ZnO co-doped with gallium and aluminum.
- the alkali barrier forming material comprises at least one layer of a material selected from the group consisting of Si 3 N, Zn x Sn y O z, S1O2, SiOxNy, T1O2, Al2O3, said material optionally being doped by one element selected in particular among Al, Zr Sb.
- the alkaline barrier layer may consist solely of Si 3 N 4 .
- the physical thickness of the alkaline barrier layer or layers is in total between 15 and 100 nm, preferably between 20 and 80 nm.
- the physical thickness of the AlN, GaN or a mixture of the two layers may be between 30 and 200 nm, preferably between 40 and 150 nm.
- the thickness of the second layer of AlN, GaN or a mixture of both is preferably greater than the physical thickness of the first alkali barrier layer.
- the ratio between the physical thickness of said second layer of AlN, GaN or of the mixture of the two and the first alkaline barrier layer is between 1, 1 and 20.0, preferably between 1, 2 and 10. .
- the lower electrode layer could be covered on its other side by one or more protective layers against oxidation.
- the photovoltaic layer comprises or consists of semiconductor materials of the amorphous silicon (a-Si), or microcrystalline silicon (pc-Si), or cadmium telluride (CdTe) type, or based on an assembly of amorphous silicon thin films on microcrystalline silicon so as to form a tandem cell.
- a-Si amorphous silicon
- pc-Si microcrystalline silicon
- CdTe cadmium telluride
- the invention also relates to the transparent substrate as just described, capable in particular of constituting the front face of a photovoltaic cell as described above, comprising on one of its faces a transparent coating constituted by a conductive metal oxide TCO of the aforementioned type, and further comprising, between said substrate and said TCO layer, a succession of at least two layers of dielectric materials, including a first layer or set of first layers of at least one alkaline barrier material from the glass substrate, in particular during quenching or annealing of said substrate, and a second layer comprising or consisting of aluminum nitride AlN, gallium nitride GaN or a mixture of the two compounds, said AlN layer , in GaN or a mixture of the two compounds being in contact with said conductive metal oxide TCO.
- a transparent substrate as described above:
- the alkaline barrier layer may consist exclusively of Si3N,
- the second layer in contact with said TCO layer may consist of aluminum nitride AIN,
- the TCO may comprise or consist of zinc oxide doped with aluminum AZO.
- FIG. 1 It is shown schematically in Figure 1 a photovoltaic cell 100 according to the present invention.
- This cell comprises on the front face, that is to say on the side exposed to solar radiation, a first transparent glass substrate 10 said front face.
- This substrate may for example be entirely in a glass containing alkalis such as a silico-soda-lime glass.
- the glass-function substrate is preferably made of material (x) having the best possible transparency to the radiation in the part of the solar spectrum useful for application as a solar module, i.e. generally the portion of the spectrum ranging from about 300 to about 1250 or 1300 nm.
- the transparent substrate 10 chosen according to the invention has a high transmission for electromagnetic radiation with a wavelength of 300 to 1300 nm and in particular for sunlight.
- the glass substrate is generally chosen so that its transmission in this range is greater than 75% and in particular greater than 85% or even greater than 95%.
- This substrate is advantageously an extra-clear glass, such as Diamant® glass sold by Saint-Gobain, or a glass having surface texturing, such as Albarino® glass, also sold by Saint-Gobain.
- the substrate may have a total thickness ranging from 0.5 to 10 mm and is used in particular as a protective plate for a photovoltaic cell. It may for this purpose be advantageous to subject it to prior heat treatment such as quenching.
- the front face of the substrate 10 directed towards the light rays (the outer face)
- the rear face of the substrate directed towards the rest of the solar module layers (inner face)
- the face B of the substrate 10 is coated with a stack 30 of thin layers according to the methods of the invention.
- At least one surface portion of the substrate is coated on its side B with at least one layer 1 of a material known for its alkali diffusion barrier properties through the various layers of the stack 30, in particular when the assembly is heated to high temperature, for example during the various phases of quenching or annealing or hot deposition, essential during the manufacturing cycle of the cell.
- This barrier layer 1 on the B side of the substrate makes it possible in particular to avoid, or even to block, the diffusion of sodium from the glass towards the upper active layers.
- this alkali barrier layer may be based on a dielectric material chosen from nitrides, oxides or oxynitrides of silicon, or nitrides, oxides or oxynitrides of zirconium. It may especially be Si3N, Sn x Zn y O z , S1O2, SiOxNy, ⁇ 2. Among all these, silicon nitride Si3N 4 allows in particular to obtain an excellent barrier effect to alkali.
- This alkali barrier layer especially when based on silicon nitride, may not be stoichiometric. It can be substoichiometric in nature, or even superstoichiometric.
- the layer 1 is however not necessarily unique and it is envisaged in the context of the present invention to replace it with a set of layers having the same purpose of barrier to alkali.
- the thickness of the barrier layer 1 (or of all the barrier layers) is included in total between 3 and 200 nm, preferably between 10 and 100 nm and in particular between 20 and 50 nm.
- a second layer 2 is deposited comprising and preferably constituted by a material chosen from aluminum nitride AlN, gallium nitride GaN or a mixture of these two compounds.
- the layer 2 may in particular consist exclusively of aluminum nitride AlN.
- an electroconductive layer 3 of the type "Transparent Conductive Oxide” TCO is deposited according to the invention.
- This layer 3 constitutes the lower electrode of the photovoltaic cell.
- the layer 3 is preferably constituted by a material chosen from zinc oxides doped with or substituted by at least one of the elements of the group Al, Ga. Alternatively, it is also possible to choose a dopant or substituent element chosen from In, B , Ti, V, Y, Zr.
- This conductive layer 3 must be as transparent as possible, and have a high transmission of light throughout the wavelengths corresponding to the absorption spectrum of the material constituting the functional layer, so as not to unnecessarily reduce the efficiency of the solar module.
- the thickness of this electroconductive layer is between 50 and 1500 nm, preferably between 200 and 800 nm, and substantially close to 700 nm.
- the TCO layer of the substrates according to the invention must have a high electrical conductivity, a high transparency to electromagnetic radiation and in particular to sunlight.
- the electroconductive layer 3 in TCO according to the invention must have a resistance per square of at most 30 ohms / square, in particular at most 20 ohms / square, or even at most 10 ohms / square in the photovoltaic module. .
- At least the transparent layer of electrically conductive oxide TCO and preferably at least layers 1 to 3 of the stack 30, are deposited, in particular successively and in one and the same apparatus, by the known techniques for deposition of thin layers under vacuum, in particular by the usual spraying techniques in the field of deposition of thin layers, especially magnetron sputtering techniques as will be described in more detail later.
- the surface of the transparent layer of electrically conductive oxide may be provided with a texturing whose roughness (RMS) is between 1 nm to 250 nm, especially if the photovoltaic layer 5 of the cell 10 is at silicon base.
- the roughness of the layer 3 is then preferably between about 20 nm and about 180 nm and particularly preferably between 40 nm and 140 nm.
- the size of the texturing can be determined for example by scanning electron microscopy (SEM) or atomic force microscopy (AFM).
- the roughness (root-mean-squared roughness or RMS) is for example determined according to the ISO 25178 standard using an atomic force microscope.
- the electroconductive layer serving as the lower electrode may then be covered with a layer 4 of protection against oxidation.
- the invention may also be provided to incorporate in the stack above the lower electrode (3) at least one blocking layer.
- metal which will have the opportunity to oxidize, to create an oxide layer of the metal in question during the heat treatment of the lower electrode, more precisely for example a quenching or annealing substrate coated with said electrode.
- the metal blocking layer may be based on titanium, nickel, chromium or niobium, used alone or as a mixture.
- the thin-film primary stack 40 thus formed on the front-face substrate 10 is covered with a functional layer 5 comprising the materials enabling energy conversion between the light rays and the electrical energy, as previously described.
- Examples of semiconductor materials with photovoltaic properties which are suitable for use for the thin layer in the solar cells according to the invention are for example and without this being restrictive, amorphous silicon (a-Si), microcrystalline silicon (pc-Si), poly stallin silicon (pc-Si), gallium arsenide (monolayer), gallium arsenide (two-layer) gallium arsenide (in three layers), gallium and indium nitride, cadmium telluride and copper-indium (gallium) sulfur-selenium compounds.
- the photovoltaic semiconductor layer of the thin-film solar cells according to the invention can use a single semiconductor transition (single junction) or several semiconductor transitions (multi-junction).
- Semiconductor layers that have the same interband transition can only use a portion of the sunlight; on the other hand, semiconductor layers with different interband transitions are sensitive to a larger part of the solar spectrum.
- the functional layer 5 is covered with a conductive layer 6, possibly transparent, TCO type as previously described or non-transparent type, such as molybdenum or other metallic material.
- this electrode layer may be based on ITO (indium tin oxide) or metal (silver, gold, copper, aluminum, molybdenum), fluorine doped tin oxide or zinc oxide doped Al.
- the set of thin layers 1 -6 of the stack 30 is finally trapped between the front face substrate 10 and a rear face substrate 20 in the form of a laminated structure, via a thermoplastic interlayer 7 for example PU, PVB or EVA, to form the final solar cell 100.
- a thermoplastic interlayer 7 for example PU, PVB or EVA
- the photovoltaic cell according to the invention as just described can be obtained using a method comprising the following steps:
- Step a) comprising vacuum deposition by spraying, is a conventional and known method of producing thin layers of materials that vaporize with difficulty.
- the surface of a solid body of suitable composition, called a target is sprayed by firing energy-rich ions from low-pressure plasmas, for example oxygen ions (O + ) and / or ions of Argon (Ar + ) or neutral particles, after which the pulverized materials are deposited in thin layers on the substrates (see Rômpp Online, 2008, "Sputtering").
- Magnetic field supported spraying often referred to as magnetron sputtering, is preferably used.
- the partial pressure of oxygen or argon can vary widely and thus be easily adapted to the needs of each particular case.
- the partial pressure levels of the gases in the plasma and the electric power required for the spraying can be defined according to the dimensions of the transparent substrates and the thickness of the layers (in particular TCO) to be deposited.
- the layers are sprayed successively in continuous installations and already dimensioned accordingly, by means of appropriate sputtering targets.
- a target which has a composition substantially corresponding to that of the layer is preferably used.
- TCO finally obtained on the substrate.
- the spraying technique supported by the action of a magnetic field often called magnetron sputtering.
- the drawback of such techniques is however that the layers obtained have a low degree of crystallinity of the constituent materials, in particular TCOs, and therefore requires an annealing step to recrystallize said materials.
- Step b) is therefore an essential step for the final performance of the photovoltaic cell and determines in particular its final performance.
- the substrate coated with the stack 40 is heated between 300 ° C and 750 ° C, preferably between 500 ° C and 700 ° C and in particular between 600 ° C and 700 ° C under different atmospheres and for example under an atmosphere containing oxygen.
- an atmosphere containing atmosphere it is possible to use air or a mixture of gases whose oxygen content is lower or greater than that of air.
- the treatment step may be carried out by means of usual and known devices, for example furnaces usually used in the glass industry (quench furnace) continuously traversed by the glass ribbon and suitably dimensioned. These continuously traversed furnaces usually use air or an inert gas as a heat transfer fluid. Thanks to this heat treatment b) of the coated and heated substrate, the oxide layer is thus made crystalline and its resistivity then decreases sharply. This gives the TCO layer according to the invention described above.
- the transparent substrates covered with the TCO layer are cooled, preferably before carrying out the following treatment step c), for example by cold air or cold inert gas flows, but they can also be allowed to cool. passively.
- the coated substrate preferably has a temperature of 20 ° C to 30 ° C. In this way, the risk of damaging the substrates by thermal stresses and / or the risk of uncontrolled evaporation or decomposition of liquids which are brought into contact with the coated substrates during or possibly before the processing step c) which follows.
- the transparent layer of electrically conductive oxide can be etched with an etching agent and the etching agent is then rinsed. Etching agents may be gaseous or liquid; they are preferably liquid.
- Liquid etching agents may contain liquid organic compounds, liquid inorganic compounds, solutions of organic or inorganic solid, liquid or gaseous compounds in organic solvents, as well as aqueous solutions of organic or inorganic, solid, liquid or gaseous compounds. .
- Aqueous solutions of acids or bases of organic or inorganic origin are preferably used.
- Volatile organic or inorganic acids, and in particular inorganic acids, are preferably used.
- the substrate carrying the transparent electrode TCO can also be manufactured and possibly etched independently of the other constituent elements of the module in order to be delivered to an assembler having the semiconductor deposition technology, responsible for the photovoltaic activity itself.
- the lower electrode 6, that is to say facing the interior of the cell relative to the incident radiation, is preferably reflective of said radiation.
- Its deposition (step e)) is carried out in a known manner, in particular by a vacuum deposition technique.
- step f) the rear-face substrate 20 is laminated to the assembly by means of a plastic film 16 of the polyvinyl butyral (PBV) or ethylene-vinyl-acetate (EVA) type. according to well known techniques for obtaining a laminated glazing.
- PBV polyvinyl butyral
- EVA ethylene-vinyl-acetate
- Examples 1 to 3 comprise only an alkali barrier layer between the substrate and the TCO layer.
- Examples 4 and 5 in accordance with the invention, comprise a succession of two layers: a first alkali metal barrier layer 1 made of silicon nitride and a second aluminum nitride layer 2 AIN.
- the silicon nitride layer is obtained from a silicon target containing 8 percent by weight of aluminum, sprayed in a nitrogen atmosphere (reactive sputtering).
- Example 6 Another comparative stack was prepared according to Example 6 also comprising two protective layers but not in accordance with the invention.
- Table 1 below indicates in more detail the composition of the various stacks prepared and their physical thicknesses (real).
- Table 1 The variations of the resistances per square of the different TCO layers of the substrates of Examples 1, 2 and 5 (according to the invention), as well as the light transmission T L of said substrates (layer side), were measured before and after 550 annealing. ° C for 5 and 9 minutes of cooking respectively.
- the square resistance of the TCO layers was carried out according to conventional techniques, using the four-point method or Van Der Paw method.
- the measurements of T L were carried out according to the illuminant D65, in a wavelength range of between 300 and 2500 nm on a Perkin Elmer lambda 900 type spectrometer. The results are reported in Table 2.
- the resistivity properties according to Examples 1 and 2 are relatively similar, which indicates that a thickness of 50 nm of the Si 3 N layer is sufficient to effectively barrier alkali from the glass substrate.
- Table 2 a significant difference in behavior between the stacks of Examples 1 to 3 according to the prior art, the stack of Comparative Example 6 and the stacks according to Examples 4 and 4.
- the TCO layers according to Examples 1 to 3 and 6 have variations of their resistance per square much higher than those of the TCO layers incorporated in the stacks of the examples. 4 and 5 according to the invention.
- the evolution of the resistance per square as a function of the duration of the annealing time was also measured on the substrates according to Example 2 according to the prior art and Examples 4 and 5 according to the invention. at 550 ° C.
- the results obtained are shown in Table 3 and in FIG. 2.
- the annealing was extended for each of the substrates until the maximum possible value of the duration of the heat treatment with respect to a maximum target value of 10 ohms / square was determined. , representative of an acceptable conductivity in the cell of the TCO layers for the photovoltaic application.
- the light transmission T L and the light reflection RL were also measured under the same conditions as previously described. The results obtained are also visible in FIG.
- the absorption A L (A L (%) 100-T L (%) -RL (%)) was also determined, and the AsQE parameter of the substrates according to Examples 2 and 5 and whose TCO layer was annealed. and recrystallized to have an identical square resistance equal to 10 ohms / square. More particularly, the method consists in determining the AsQE parameter by carrying out the product of integrating the absorption spectrum of the substrate comprising the TCO layer, over the entire considered domain (300-2500 microns), with the efficiency spectrum. QE quantum of the considered material (that is to say, a-Si, CdTE or tandem between a-Si / ⁇ - ⁇ ) for this same domain.
- the quantum efficiency QE is in a known manner the expression of the probability (between 0 and 1) that an incident photon with a wavelength according to the abscissa is transformed into an electron-hole pair for the photovoltaic material considered.
- the quantum efficiency curve QE of said materials is presented in FIG.
Abstract
Description
Claims
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CN201180011885XA CN102781867A (zh) | 2010-03-01 | 2011-02-28 | 光伏电池 |
US13/582,127 US20130133734A1 (en) | 2010-03-01 | 2011-02-28 | Photovoltaic cell |
EP11712649A EP2542510A1 (fr) | 2010-03-01 | 2011-02-28 | Cellule photovoltaïque |
KR1020127022884A KR20130033348A (ko) | 2010-03-01 | 2011-02-28 | 광기전력 전지 |
JP2012555467A JP2013521642A (ja) | 2010-03-01 | 2011-02-28 | 光電池セル |
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FR1051456A FR2956925B1 (fr) | 2010-03-01 | 2010-03-01 | Cellule photovoltaique |
FR1051456 | 2010-03-01 |
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EP (1) | EP2542510A1 (fr) |
JP (1) | JP2013521642A (fr) |
KR (1) | KR20130033348A (fr) |
CN (1) | CN102781867A (fr) |
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CN102403378A (zh) * | 2011-11-17 | 2012-04-04 | 华中科技大学 | 一种具有量子点结构的柔性薄膜太阳能电池及其制备方法 |
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JP5788701B2 (ja) * | 2011-04-11 | 2015-10-07 | 関東化学株式会社 | 透明導電膜用エッチング液組成物 |
FR2976439A1 (fr) * | 2011-06-07 | 2012-12-14 | Saint Gobain | Element chauffant a couche |
WO2013180539A1 (fr) * | 2012-05-31 | 2013-12-05 | 주식회사 엘지화학 | Diode électroluminescente organique |
CN105322035A (zh) * | 2014-06-05 | 2016-02-10 | 中物院成都科学技术发展中心 | 不锈钢箔太阳能电池及其制备方法 |
JP6703783B2 (ja) | 2015-12-04 | 2020-06-03 | キヤノン株式会社 | 印刷装置とその制御方法、及びプログラム |
KR20210031908A (ko) * | 2018-07-10 | 2021-03-23 | 넥스트 바이오메트릭스 그룹 에이에스에이 | 전자 장치용 열전도성 및 보호성 코팅 |
FR3095523B1 (fr) * | 2019-04-25 | 2022-09-09 | Centre Nat Rech Scient | Miroir pour cellule photovoltaïque, cellule et module photovoltaïques |
US11522069B2 (en) | 2019-05-23 | 2022-12-06 | University Of Utah Research Foundation | Thin-film semiconductors |
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US20070029186A1 (en) * | 2005-08-02 | 2007-02-08 | Alexey Krasnov | Method of thermally tempering coated article with transparent conductive oxide (TCO) coating using inorganic protective layer during tempering and product made using same |
FR2922886A1 (fr) * | 2007-10-25 | 2009-05-01 | Saint Gobain | Substrat verrier revetu de couches a resistivite amelioree. |
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US4656101A (en) * | 1984-11-07 | 1987-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device with a protective film |
JPH09159803A (ja) * | 1995-12-04 | 1997-06-20 | Olympus Optical Co Ltd | 反射防止膜 |
US5756192A (en) * | 1996-01-16 | 1998-05-26 | Ford Motor Company | Multilayer coating for defrosting glass |
US20080105293A1 (en) * | 2006-11-02 | 2008-05-08 | Guardian Industries Corp. | Front electrode for use in photovoltaic device and method of making same |
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2010
- 2010-03-01 FR FR1051456A patent/FR2956925B1/fr not_active Expired - Fee Related
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- 2011-02-28 EP EP11712649A patent/EP2542510A1/fr not_active Withdrawn
- 2011-02-28 CN CN201180011885XA patent/CN102781867A/zh active Pending
- 2011-02-28 JP JP2012555467A patent/JP2013521642A/ja not_active Withdrawn
- 2011-02-28 KR KR1020127022884A patent/KR20130033348A/ko not_active Application Discontinuation
- 2011-02-28 WO PCT/FR2011/050400 patent/WO2011107697A1/fr active Application Filing
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US20070029186A1 (en) * | 2005-08-02 | 2007-02-08 | Alexey Krasnov | Method of thermally tempering coated article with transparent conductive oxide (TCO) coating using inorganic protective layer during tempering and product made using same |
FR2922886A1 (fr) * | 2007-10-25 | 2009-05-01 | Saint Gobain | Substrat verrier revetu de couches a resistivite amelioree. |
Cited By (1)
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CN102403378A (zh) * | 2011-11-17 | 2012-04-04 | 华中科技大学 | 一种具有量子点结构的柔性薄膜太阳能电池及其制备方法 |
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KR20130033348A (ko) | 2013-04-03 |
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FR2956925A1 (fr) | 2011-09-02 |
FR2956925B1 (fr) | 2012-03-23 |
US20130133734A1 (en) | 2013-05-30 |
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