WO2011083611A1 - コンポジット圧電体とそのコンポジット圧電体の製造方法およびそのコンポジット圧電体を用いたコンポジット圧電素子 - Google Patents
コンポジット圧電体とそのコンポジット圧電体の製造方法およびそのコンポジット圧電体を用いたコンポジット圧電素子 Download PDFInfo
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- H10N30/00—Piezoelectric or electrostrictive devices
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- the present invention relates to a composite piezoelectric body, and more particularly to a composite piezoelectric body that does not cause electrode defects, disconnection, and peeling, a method for manufacturing the composite piezoelectric body, and a composite piezoelectric element using the composite piezoelectric body.
- Patent Document 1 a composite piezoelectric element described in Patent Document 1 that includes a piezoelectric ceramic and an organic polymer body in which bubbles are mixed.
- the composite piezoelectric element described in Patent Document 1 is manufactured through the processing steps shown in FIG. That is, first, a groove is formed in the ceramic by forming a plurality of grooves by machining, and then a filling process is performed in which the groove is filled with a resin that vaporizes at a predetermined temperature, and then the resin is vaporized. Perform foaming to form an organic polymer mixed with bubbles by heat treatment at temperature, then perform thickness processing to polish the ceramic and organic polymer composite material to the required thickness, then polish An electrode forming process is performed on the processed surface, that is, a surface on which an electrode is formed, and finally, a polarization process is performed.
- the composite piezoelectric element described in Patent Document 1 contains bubbles in the organic polymer body, the acoustic impedance is lowered while maintaining a high electromechanical coupling coefficient indicating the performance of the piezoelectric element. It has the advantage of being able to.
- composite piezoelectric materials are “number of XYZ directions in which piezoelectric ceramics can come out on the end face—organic polymer, such as 1-3 type, 2-2 type, 0-3 type, 3-0 type, etc. Expressed by expressing the number of XYZ directions that the body can exit at the end face.
- the composite piezoelectric element described in Patent Document 1 is mainly used as a probe of a transceiver such as an ultrasonic diagnostic machine or an ultrasonic flaw detector. Conventionally, as described in paragraph [0037] of Patent Document 1, it is usually used after being cut and processed to about 0.1 mm even if it is narrow. It was.
- the composite piezoelectric element described in Patent Document 1 has air bubbles mixed inside the organic polymer body, so that the vicinity of the surface of the organic polymer body is polished during thickness processing. As shown in FIG. 5, the bubbles 4 existing near the surface of the organic polymer body 3 may be polished to form the depressed holes 5.
- the present invention has been made in view of the above-described conventional problems, and is a composite piezoelectric body that does not cause electrode defects, disconnection, and peeling, a method of manufacturing the composite piezoelectric body, and a composite using the composite piezoelectric body.
- An object is to provide a piezoelectric element.
- a composite piezoelectric body of the present invention is a composite piezoelectric body comprising a piezoelectric ceramic and an organic polymer body in which bubbles are mixed, and forms an electrode of the piezoelectric ceramic and the organic polymer body.
- an insulating layer is provided on all or part of the surface on which the organic polymer electrode is formed.
- the composite piezoelectric material of the present invention is characterized in that the insulating layer has a thickness of 50 ⁇ m or less.
- the composite piezoelectric material of the present invention is characterized in that the average bulk density of the organic polymer and the insulating layer is 0.6 g / cm 3 or less.
- the composite piezoelectric material of the present invention is characterized in that the insulating layer is made of an epoxy resin.
- the composite piezoelectric element of the present invention is characterized in that an electrode is formed on the composite piezoelectric body according to claims 1 to 4.
- the method for manufacturing a composite piezoelectric body of the present invention includes a step of forming a plurality of grooves in a ceramic by machining, a step of filling the grooves with a resin that evaporates at a predetermined temperature, and a heat treatment at a temperature at which the resin evaporates.
- insulation is performed on all or part of the surface on which the electrode of the organic polymer body is formed. It has the process of forming a layer, It is characterized by the above-mentioned.
- the method for manufacturing a composite piezoelectric material of the present invention is characterized by having an electroless plating step as a step of forming an electrode.
- the method for producing a composite piezoelectric material of the present invention is characterized in that the electroless plating step is performed at 70 ° C. or lower.
- Piezoelectric ceramics used in the present invention are limited to materials and types as long as they can convert externally applied displacement into electricity, or conversely, convert applied electricity into displacement. Not. Examples of those having these properties include barium titanate ceramics, lead titanate ceramics, lead zirconate titanate (PZT) ceramics, lead niobate ceramics, lithium niobate single crystals, titanic acid Examples thereof include lead zinc niobate (PZNT) single crystal, lead magnesium niobate titanate (PMNT) single crystal, bismuth titanate ceramics, and lead metaniobate ceramics.
- PZNT lead zinc niobate
- PMNT lead magnesium niobate titanate
- thermosetting resins such as unsaturated polyester resins, allyl resins, epoxy resins, urethane resins, urea resins, melamine resins, phenol resins, acrylonitrile-based copolymer resins
- thermoplastic resin such as acrylonitrile styrene copolymer resin, polyethylene resin, polypropylene resin, polystyrene resin, polyamide resin, polyacetal resin, polycarbonate resin, polyethylene terephthalate resin, polybutylene terephthalate resin, PMMA resin is solidified.
- thermoplastic resin when used for the organic polymer, a melting point equal to or higher than the processing temperature of these processing steps so that the organic polymer does not soften during the electroless plating process described later.
- a melting point equal to or higher than the processing temperature of these processing steps so that the organic polymer does not soften during the electroless plating process described later.
- bubbles are mixed in the organic polymer used in the present invention.
- vibration restraint of the piezoelectric ceramics can be reduced. There is an effect that the acoustic impedance can be lowered while maintaining the electromechanical coupling coefficient indicating the performance of the piezoelectric element in a high state.
- the method of mixing bubbles is not particularly limited as long as it is a method in which bubbles are filled in the organic polymer when it finally becomes a composite piezoelectric body, and the bubbles are mixed in advance. It may be filled with an organic polymer, or filled with a resin mixed with an agent that generates bubbles, and then heated to form an organic polymer by solidification or curing. Bubbles may be generated in the organic polymer. Further, for example, a method using a polymer resin powder enclosing a liquid as described in Japanese Patent No. 4222467 may be used.
- the liquid encapsulated when the polymer is softened by heating to a predetermined temperature such as an acrylonitrile copolymer encapsulating a liquid such as normal pentane, normal hexane, isobutane, or isopentane.
- a predetermined temperature such as an acrylonitrile copolymer encapsulating a liquid such as normal pentane, normal hexane, isobutane, or isopentane.
- the insulating layer in the present invention fills the depressed holes appearing on the surface of the organic polymer body by thickness processing, and is not particularly limited as long as it does not substantially contain bubbles, but is easy to handle and process. It is preferable to use a resin material such as a thermosetting resin or a thermoplastic resin. In composite piezoelectric bodies, it is generally preferable that the parts other than the piezoelectric ceramics are made of an insulator in order to more efficiently transmit electric signals from the electrodes to the piezoelectric ceramics. However, in the case where good performance such as an electromechanical coupling coefficient can be secured, the insulating layer is not necessarily limited, and a conductive resin or the like can also be used.
- thermoplastic resin used for the insulating layer in the present invention
- thermoplastic resin in order to prevent the insulating layer from being softened during the electroless plating process described later as in the case of the organic polymer, It is preferable to use one having a melting point or glass transition temperature higher than the processing temperature.
- this insulating layer can ensure adhesion with the electrode formed in the electrode forming process.
- an insulating layer is formed by applying and curing these resins on all or a part of the surface on which the organic polymer electrode is formed before polishing by thickness processing.
- the thickness of the insulating layer in the present invention is preferably 50 ⁇ m or less, and more preferably 30 ⁇ m or less, because if the thickness is too thick, the electromechanical coupling coefficient decreases and the acoustic impedance increases. .
- the average bulk density of the organic polymer and the insulating layer in the present invention is too high, vibrations of ceramics in the composite piezoelectric element are restrained, the electromechanical coupling coefficient is lowered, and the acoustic impedance is increased. Therefore, the average bulk density is preferably 0.6 g / cm 3 or less, and more preferably 0.5 g / cm 3 or less.
- the processing step for forming the insulating layer in the method for manufacturing a composite piezoelectric material of the present invention is to prevent electrode defects, disconnection, and peeling, it is necessary to perform the processing before electrode formation processing.
- the processing step for forming the insulating layer is preferably performed before the thickness processing step in order to easily adjust the thickness according to the specification. That is, as shown in FIG. 2 (a), a composite polishing is performed by first performing a preliminary polishing process for generating a recessed hole on the surface of the organic polymer, followed by a process for forming an insulating layer, followed by a thickness process. Polish the piezoelectric body to a thickness according to the specifications. Note that if the thickness according to the specifications can be secured even after the processing for forming the insulating layer, the processing step for forming the insulating layer may be performed after the thickness processing step.
- the composite piezoelectric element of the present invention is manufactured by forming an electrode on the polished surface, ie, the surface on which the electrode is to be formed, after the thickness processing for polishing the composite piezoelectric body to a required thickness.
- the process for forming the electrode in the method of manufacturing the composite piezoelectric material of the present invention includes a sputtering method, a vapor deposition method, etc., but electroless plating with nickel or the like is performed from the viewpoint of cost and electrode adhesion. It is preferable.
- the electroless plating process is performed at a very high temperature, the bubbles formed by the foaming process expand, and unevenness is generated again on the surface of the organic polymer body polished with the thickness process.
- the electroless plating process is preferably performed at a temperature at which bubbles do not expand, and more specifically at 70 ° C. or less.
- the composite piezoelectric element of the present invention is manufactured by performing an electrode forming process such as electrolytic plating using gold, if necessary.
- the composite piezoelectric body of the present invention includes piezoelectric ceramics and an organic polymer body in which bubbles are mixed.
- an insulating layer is provided on all or part of the surface on which the organic polymer electrode is formed, so that the composite piezoelectric body does not cause electrode defects, disconnection, or peeling.
- a composite piezoelectric element can be produced.
- the strength of the piezoelectric element such as the ability to adhere the electrodes to the organic polymer body more strongly, can be increased As a result, it is possible to improve the handling properties and to provide an advantageous effect by preventing electrode disconnection during processing.
- the thickness of the insulating layer is 50 ⁇ m or less, so that the electromechanical coupling coefficient is maintained in a high state, the acoustic impedance is lowered, and the electrode defect or disconnection is maintained. , Peeling can be prevented.
- the electromechanical coupling coefficient is maintained in a high state. It is possible to prevent electrode defects, disconnection, and peeling while lowering the acoustic impedance.
- the insulating layer is made of an epoxy resin, not only electrode defects and disconnections are prevented, but also electrode peeling is more effectively prevented, and the electrode The effect of improving the strength of the composite piezoelectric element can be imparted when forming the composite piezoelectric element.
- the ceramic is formed with a plurality of grooves by machining, a step of filling the grooves with a resin that evaporates at a predetermined temperature, and a temperature at which the resin evaporates.
- a method of manufacturing a composite piezoelectric material that passes through a step of forming an organic polymer body in which bubbles are mixed by heat treatment and a step of forming an electrode, all or part of the surface on which the electrode of the organic polymer body is formed Since the method includes the step of forming an insulating layer, a composite piezoelectric body that does not cause electrode defects, disconnection, or peeling can be manufactured.
- the electroless plating process is performed as a process for forming the electrode, and the electroless plating process is performed at 70 ° C. or lower, the softening of the resin is suppressed.
- FIG. 1 is a schematic view showing a cross section of a composite piezoelectric element of the present invention.
- the depressed holes 5 generated by polishing the bubbles 4 near the surface of the organic polymer body 3 are filled with the insulating layer 7. It has been.
- FIG. 2 is a flowchart showing the present invention and a conventional method of manufacturing a composite piezoelectric body and a composite piezoelectric element
- FIG. 3 is a schematic view showing a manufacturing process of the composite piezoelectric body and the composite piezoelectric element of the present invention.
- FIG. 2A which is a manufacturing flow of the composite piezoelectric material of the present invention, is a pre-polishing process and formation of an insulating layer which are not in FIG. 2B, which is a manufacturing flow diagram of a conventional composite piezoelectric material. It has a processing step.
- Example 1 First, soft lead zirconate titanate ceramic powder (manufactured by Teika Co., Ltd .: L-155N, electromechanical coupling coefficient k 33 : 77%, relative dielectric constant: 5700, Curie temperature: 155 ° C.) was molded and degreased. Thereafter, firing was performed at 1200 ° C. to obtain a lead zirconate titanate ceramic sintered body. The obtained lead zirconate titanate ceramic sintered body was processed with a surface grinder and a double-side polisher, and the piezoelectric ceramic having dimensions of 60 mm in length, 10 mm in width, and 0.80 mm in thickness as shown in FIG. 8a was obtained.
- a groove 9 having a depth of 0.60 mm is formed at a pitch of 100 ⁇ m by using a blade having a width of 30 ⁇ m by a dicing machine in parallel with one side of the piezoelectric ceramic 8a having the rectangular plate shape produced above, and 70 ⁇ m.
- FIG. 3B A composite piezoelectric body 1a filled with an organic polymer body 3 which is a solidified body of an acrylonitrile copolymer resin in which bubbles 4 are dispersed in the inside shown in (c) was produced.
- the thickness of the organic polymer 3 and the piezoelectric ceramic 7b was removed by using a double-side polishing machine to adjust the thickness, thereby producing a composite piezoelectric body 1b.
- the front and back surfaces of the composite piezoelectric body 1b are formed with recessed holes 5a formed by polishing the bubbles 4 existing in the vicinity of the surface of the organic polymer body 3 by polishing.
- an epoxy resin (bulk density 1.3 g / cm 3 ) is applied to the front and back surfaces of the composite piezoelectric body 1b by a squeegee method and cured by heating at 150 ° C. for 60 minutes.
- an epoxy resin layer 6 was produced.
- a nickel electroless plating 10 having a thickness of 0.5 ⁇ m is applied to the composite piezoelectric body 1c.
- Application was performed at 65 ° C., and gold electrolytic plating 11 having a thickness of 0.5 ⁇ m was further applied.
- the electrode provided on the outer peripheral four side surfaces of the composite piezoelectric body 1c and the outer peripheral unnecessary portion were cut by a dicing machine, and an electrode was formed on the surface of the composite piezoelectric body 1, 45 mm shown in FIG.
- a rectangular plate-shaped 2-2 type composite piezoelectric element 2a of ⁇ 5 mm ⁇ 0.35 mm was obtained.
- the geometric size of the obtained composite piezoelectric element 2 was measured with a micrometer and a caliper, the weight was measured with a precision balance, and the bulk density of the composite piezoelectric element 2b was calculated to be 5.72 g / cm. 3 .
- the bulk density of the polymer component in the composite piezoelectric body 1c was calculated to be 0.37 g / cm 3 . Moreover, it was 30 micrometers when the thickness of the epoxy resin layer was measured with the laser microscope.
- Example 2 A 2-2 type composite piezoelectric element having a volume ratio of piezoelectric ceramics of 70% was obtained in the same manner as in Example 1 except that the thickness dimension was changed to 0.45 mm with respect to Example 1.
- Example 3 A 2-2 type composite piezoelectric element in which the volume ratio of the piezoelectric ceramic is 60% is obtained through the same process as in Example 1 except that a piezoelectric ceramic in which a plurality of ceramic prisms of 45 ⁇ m ⁇ 60 mm ⁇ 0.6 mm are erected is formed. Obtained.
- Example 4 A 2-2 type composite piezoelectric element having a volume ratio of piezoelectric ceramics of 70% was obtained in the same manner as in Example 1, except that the thickness dimension was changed to 0.14 mm with respect to Example 1.
- Examples 5 to 7 As shown in Table 1, the same steps as in Example 1 were performed except that the heat treatment conditions after filling with acrylonitrile-based copolymer resin in which normal hexane and normal pentane were encapsulated were changed. A 2-2 type composite piezoelectric element having an epoxy resin layer with different thickness and a volume ratio of piezoelectric ceramics of 70% was obtained.
- Example 1 A piezoelectric ceramic in which a plurality of 70 ⁇ m ⁇ 60 mm ⁇ 0.6 mm ceramic prisms obtained in the same manner as in Example 1 were upright was prepared, and normal hexane and normal pentane were sealed in the groove formed in the piezoelectric ceramic.
- An acrylonitrile copolymer resin was filled and heat-treated at 160 ° C. for 5 minutes to produce a composite piezoelectric body filled with an organic polymer body in which acrylonitrile copolymer resin in which bubbles were dispersed was solidified.
- the thickness is adjusted by removing excess resin and piezoelectric ceramics with a double-side polishing machine, the thickness is 0.35 mm, the size of each column of the columnar piezoelectric ceramics is 70 ⁇ m ⁇ 60 mm, and the volume ratio of the columnar piezoelectric ceramics is 70. % 2-2 type composite piezoelectric material was obtained. Thereafter, through the same steps as in Example 1 except that no insulating layer was provided, a rectangular plate-shaped 2-2 type composite piezoelectric element having a volume ratio of piezoelectric ceramic of 70% and a size of 45 mm ⁇ 5 mm ⁇ 0.35 mm was obtained. .
- the electromechanical coupling coefficient (k t ) in the thickness direction of the 2-2 type composite piezoelectric elements of Examples 1 to 3 and Comparative Example 1 obtained as described above was calculated. Specifically, frequency-impedance characteristics are measured by an impedance analyzer 4294A manufactured by Agilent Technologies, and the obtained longitudinal vibration (thickness vibration) resonance frequency (f r ) and anti-resonance frequency (f a ) are used. , Calculated according to JEITA standard EM-4501 (Test method for piezoelectric ceramic vibrator). Moreover, the acoustic impedance was calculated from the resonance frequency (f a ) and the element thickness. The results are summarized in Table 1.
- the electromechanical coupling coefficient is a coefficient indicating the efficiency of converting electrical energy applied to the piezoelectric element into mechanical energy such as vibration, or conversely converting mechanical energy such as vibration into electrical energy. The higher this coefficient, the more efficiently electrical energy and mechanical energy can be converted into each other.
- the depth of cut was set to the element thickness at a pitch of 50 ⁇ m. Then, grooves were cut at a depth of 1/2 to form an element-divided array. Then, each array was subjected to a continuity test by a tester, and the number of occurrences of the continuity failure array was confirmed.
- the composite piezoelectric elements of Examples 1 to 3 maintain a high electromechanical coupling coefficient, reduce acoustic impedance, and suppress the occurrence of electrode defects, disconnection, and peeling. You can see that it is done.
- the composite piezoelectric element of Comparative Example 1 since the composite piezoelectric element of Comparative Example 1 has a small number of elements that cause poor conduction, it is difficult to suppress the occurrence of electrode defects, disconnection, and peeling in fine pitch processing. I know that there is.
- the composite piezoelectric elements of Examples 1 to 7 and Comparative Example 1 are both in a state where the acoustic impedance is low and the electromechanical coupling coefficient can be maintained at a high state of about 60% or more, the composite piezoelectric element It can be seen that it has good performance.
- the composite piezoelectric material of the present invention is a sensing material that converts electrical signals into displacement, such as an acceleration sensor, a medical ultrasonic device, an aerial ultrasonic device, an underwater ultrasonic device, a solid ultrasonic device, and other ultrasonic devices. It can be used as a sensing material that converts displacement into an electrical signal.
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Abstract
Description
すなわち、まず、セラミックスに機械加工にて複数の溝を形成する溝加工を行い、次に、この溝に所定の温度で気化する樹脂を充填する充填加工を行い、次に、この樹脂が気化する温度で熱処理して気泡が混入した有機高分子体を形成する発泡加工を行い、次に、上記セラミックスと有機高分子体のコンポジット材を必要な厚みに研磨する厚み加工を行い、次に、研磨した面、すなわち電極を形成する面に電極形成加工を行い、最後に、分極処理加工を行うことによって作製される。
そして、これらの性質を持つものとしては、例えば、チタン酸バリウム系セラミックス、チタン酸鉛系セラミックス、チタン酸ジルコン酸鉛(PZT)系セラミックス、ニオブ酸鉛系セラミックス、ニオブ酸リチウム単結晶、チタン酸亜鉛酸ニオブ酸鉛(PZNT)単結晶、マグネシウム酸ニオブ酸チタン酸鉛(PMNT)単結晶、チタン酸ビスマス系セラミックス、メタニオブ酸鉛系セラミックスなどが挙げられる。
そして、これらの性質を持つものとしては、例えば、不飽和ポリエステル樹脂、アリル樹脂、エポキシ樹脂、ウレタン樹脂、ユリア樹脂、メラミン樹脂、フェノール樹脂などの熱硬化性樹脂や、アクリロニトリル系共重合体樹脂、アクリロニトリルスチレン系共重合体樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、ポリスチレン樹脂、ポリアミド樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、ポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、PMMA樹脂などの熱可塑性樹脂が固化した状態のものが挙げられる。
なお、有機高分子体に熱可塑性樹脂を用いた場合には、後記する無電解メッキ加工の際などに有機高分子体が軟化することがないように、これらの加工工程の加工温度以上の融点またはガラス転移点温度を有するものを用いることが好ましい。
また、例えば特許第4222467号に記載されているような液体を封入した高分子樹脂粉体を用いる方法を用いてもよい。本方法は具体的には、ノルマルペンタン、ノルマルヘキサン、イソブタン、イソペンタンなどの液体を封入したアクリロニトリル系共重合体など、所定温度に加熱されることによって高分子が軟化した際に封入された液体が気化するように設計された高分子樹脂粉体を、予め圧電セラミックスの間に充填しておき、所定の温度に加熱することによって、封入された液体が気化すると共に高分子樹脂が軟化した後、冷却されることによって有機高分子体として固化することで、気化した気体を有機高分子体内に気泡として内在させる方法である。
なお、コンポジット圧電体においては、一般的に電極からの電気信号をより効率的に圧電セラミックスに伝えるために圧電セラミックス以外の部分は絶縁体で構成することが好ましいが、コンポジット圧電体を作製した際においても電気機械結合係数など良好な性能が確保できる場合には必ずしも絶縁層に限定されるものではなく、導電性樹脂などを用いることもできる。
ここで、絶縁層を形成する加工工程は、仕様に応じた厚みに調整しやすくするために厚み加工工程の前に行うことが好ましい。すなわち、図2(a)に示すように、まず有機高分子体の表面に陥没孔を発生させる予備研磨加工を行った後に絶縁層を形成する加工を行い、その後に厚み加工を行うことによってコンポジット圧電体を仕様に応じた厚みに研磨する。
なお、絶縁層を形成する加工をした後であっても仕様に応じた厚みが確保できる場合には、絶縁層を形成する加工工程を厚み加工工程の後に行っても良い。
ここで、あまり高温で無電解メッキ加工を行うと発泡加工で形成した気泡が膨張し、厚み加工によってせっかく研磨した有機高分子体の表面に再度凹凸が発生してしまうことになることから、この無電解メッキ加工は気泡が膨張しない温度で行うことが好ましく、より具体的には70℃以下で行うことが好ましい。
また、厚み加工によって電極を形成する面に生じる陥没孔を絶縁層で埋めていることから、電極をより強固に有機高分子体に接着できる等圧電素子の強度をより高めることができ、切断加工などのハンドリング性を向上させるとともに、加工時の電極断線防止により有利な効果を持たせることができる。
図2に示すように本発明のコンポジット圧電体の製造フローである図2(a)は、従来のコンポジット圧電体の製造フロー図である図2(b)にはない予備研磨加工と絶縁層形成加工の工程を有している。
まず、ソフト系のチタン酸ジルコン酸鉛系セラミックス粉末(テイカ株式会社製:L-155N、電気機械結合係数k33:77%、比誘電率:5700、キュリー温度:155℃)を成形、脱脂した後、1200℃で焼成し、チタン酸ジルコン酸鉛系セラミックス焼結体を得た。得られたチタン酸ジルコン酸鉛系セラミックス焼結体を平面研削盤および両面研磨機にて加工して、図3(a)に示す長さ60mm、幅10mm、厚み0.80mmの寸法の圧電セラミックス8aを得た。
なお、コンポジット圧電体1cにおける高分子成分の嵩密度は計算上0.37g/cm3であった。また、エポキシ樹脂層の厚みをレーザー顕微鏡により測定したところ、30μmであった。
実施例1に対し、厚み寸法を0.45mmに変更した以外は、実施例1と同様の工程にて、圧電セラミックスの体積率が70%の2-2型コンポジット圧電素子を得た。
45μm×60mm×0.6mmのセラミックスの角柱が複数本直立した圧電セラミックスを形成した以外は実施例1と同様の工程を経て、圧電セラミックスの体積率が60%の2-2型コンポジット圧電素子を得た。
実施例1に対し、厚み寸法を0.14mmに変更した以外は、実施例1と同様の工程にて、圧電セラミックスの体積率が70%の2-2型コンポジット圧電素子を得た。
実施例4に対し、ノルマルヘキサンおよびノルマルペンタンが封入されたアクリロニトリル系共重合樹脂の充填後の熱処理条件を変更した以外は、実施例1と同様の工程を行なうことにより、表1に示すような厚みの異なるエポキシ樹脂層を有する、圧電セラミックスの体積率が70%の2-2型コンポジット圧電素子を得た。
実施例1と同様にして得られた70μm×60mm×0.6mmのセラミックスの角柱が複数本直立した圧電セラミックスを作製し、この圧電セラミックスに形成した溝に、ノルマルヘキサンおよびノルマルペンタンが封入されたアクリロニトリル系共重合樹脂を充填し、160℃で5分間熱処理することによって、内部に気泡が分散したアクリロニトリル系共重合樹脂が固化した有機高分子体が充填されたコンポジット圧電体を作製した。
その後、絶縁層を設けない以外は実施例1と同様の工程を経て、圧電セラミックスの体積率が70%で、45mm×5mm×0.35mmの矩形板状2-2型コンポジット圧電素子を得た。
なお、電気機械結合係数とは、圧電素子に印加された電気エネルギーを振動などの機械エネルギーに変換したり、逆に振動などの機械エネルギーを電気エネルギーに変換したりする効率を示す係数であり、この係数が高いほど効率よく電気エネルギーと機械エネルギーを相互に変換できることを示している。
そして、各アレイについて、テスターにて導通検査を行い、導通不良アレイの発生個数を確認した。
導通検査は、図4に示すようにコンポジット圧電素子2の上端部に薄い銅箔12を半田付けして途中までカットした後、コンポジット圧電素子2の各下端部1つ1つに電極13を接触させて導通が確保されるか否かを検査することによって行った。その結果を表1にまとめた。
一方、比較例1のコンポジット圧電素子は、僅かではあるが、導通不良をおこしている素子が認められることから、ファインピッチ加工においては電極の欠陥、断線、剥離の発生を抑制することが困難であることがわかる。
なお、実施例1~7、および比較例1のコンポジット圧電素子はいずれも音響インピーダンスが低い状態で、かつ電気機械結合係数が約60%以上の高い状態を維持することができることから、コンポジット圧電素子としては良好な性能を有していることがわかる。
1a コンポジット圧電体
1b コンポジット圧電体
2 コンポジット圧電素子
2a コンポジット圧電素子
3 有機高分子体
4 気泡
5 陥没孔
5a 陥没孔
6 エポキシ樹脂層
7 絶縁層
8 圧電セラミックス
8a 圧電セラミックス
8b 圧電セラミックス
9 溝
10 無電解メッキ層
11 金メッキ層
12 銅箔
13 電極
Claims (8)
- 圧電セラミックスと内部に気泡を混入した有機高分子体を備えるコンポジット圧電体であって、
前記圧電セラミックスおよび前記有機高分子体の電極を形成する面のうち、
前記有機高分子体の電極を形成する面の全部または一部に絶縁層を設けたことを特徴とするコンポジット圧電体。 - 前記絶縁層の厚みが50μm以下であることを特徴とする請求項1に記載のコンポジット圧電体。
- 前記有機高分子体と前記絶縁層の平均嵩密度が0.6g/cm3以下であることを特徴とする請求項1または請求項2に記載のコンポジット圧電体。
- 前記絶縁層がエポキシ樹脂からなることを特徴とする請求項1から請求項3のいずれか一項に記載のコンポジット圧電体。
- 請求項1から請求項4のコンポジット圧電体に電極を形成したことを特徴とするコンポジット圧電素子。
- セラミックスに機械加工にて複数の溝を形成する工程と、
前記溝に所定の温度で気化する樹脂を充填する工程と、
前記樹脂が気化する温度で熱処理して気泡が混入した有機高分子体を形成する工程と、
電極を形成する工程とを経由するコンポジット圧電体の製造方法において、
有機高分子体の電極を形成する面の全部または一部に絶縁層を形成する工程を有することを特徴とするコンポジット圧電体の製造方法。 - 前記電極を形成する工程として、
無電解メッキ工程を有することを特徴とする請求項6に記載のコンポジット圧電体の製造方法。 - 前記無電解メッキ工程を、
70℃以下で行うことを特徴とする請求項7に記載のコンポジット圧電体の製造方法。
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