WO2011082156A3 - Organic particulate loaded polishing pads and method of making and using the same - Google Patents
Organic particulate loaded polishing pads and method of making and using the same Download PDFInfo
- Publication number
- WO2011082156A3 WO2011082156A3 PCT/US2010/062205 US2010062205W WO2011082156A3 WO 2011082156 A3 WO2011082156 A3 WO 2011082156A3 US 2010062205 W US2010062205 W US 2010062205W WO 2011082156 A3 WO2011082156 A3 WO 2011082156A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- making
- polishing pads
- same
- pads
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080060309XA CN102686361A (en) | 2009-12-30 | 2010-12-28 | Organic particulate loaded polishing pads and method of making and using the same |
JP2012547232A JP5671554B2 (en) | 2009-12-30 | 2010-12-28 | Organic fine particle loaded polishing pad, and method for producing and using the same |
US13/517,367 US20130102231A1 (en) | 2009-12-30 | 2010-12-28 | Organic particulate loaded polishing pads and method of making and using the same |
SG2012046538A SG181889A1 (en) | 2009-12-30 | 2010-12-28 | Organic particulate loaded polishing pads and method of making and using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29118209P | 2009-12-30 | 2009-12-30 | |
US61/291,182 | 2009-12-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011082156A2 WO2011082156A2 (en) | 2011-07-07 |
WO2011082156A3 true WO2011082156A3 (en) | 2011-11-17 |
Family
ID=44227136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/062205 WO2011082156A2 (en) | 2009-12-30 | 2010-12-28 | Organic particulate loaded polishing pads and method of making and using the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130102231A1 (en) |
JP (1) | JP5671554B2 (en) |
KR (1) | KR20120112662A (en) |
CN (1) | CN102686361A (en) |
SG (1) | SG181889A1 (en) |
TW (1) | TW201143984A (en) |
WO (1) | WO2011082156A2 (en) |
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CN102159361B (en) * | 2008-07-18 | 2014-11-05 | 3M创新有限公司 | Polishing pad with floating elements and method of making and using same |
JP6196773B2 (en) * | 2012-12-28 | 2017-09-13 | ニッタ・ハース株式会社 | Polishing pad |
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EP2859997B1 (en) | 2013-10-08 | 2015-09-30 | Valentini, Guido | Method for manufacturing a polishing pad and polishing pad |
CN106132630B (en) * | 2014-04-03 | 2019-11-26 | 3M创新有限公司 | The method of polishing pad and system and manufacture and use such polishing pad and system |
JP2017514704A (en) * | 2014-05-01 | 2017-06-08 | スリーエム イノベイティブ プロパティズ カンパニー | Flexible abrasive article and method of use thereof |
KR102440303B1 (en) * | 2014-05-07 | 2022-09-05 | 씨엠씨 머티리얼즈, 인코포레이티드 | Multi-layer polishing pad for cmp |
JP6426403B2 (en) * | 2014-08-27 | 2018-11-21 | 株式会社フジミインコーポレーテッド | Polishing method |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
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US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
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KR101600393B1 (en) * | 2015-05-20 | 2016-03-07 | 에프엔에스테크 주식회사 | Polishing pad and preparing method thereof |
CN112059937B (en) * | 2015-10-16 | 2022-11-01 | 应用材料公司 | Method and apparatus for forming advanced polishing pads using additive manufacturing processes |
JP6940495B2 (en) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Equipment and methods for forming abrasive articles with the desired zeta potential |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10688621B2 (en) * | 2016-08-04 | 2020-06-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-defect-porous polishing pad |
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CN107344336B (en) * | 2017-07-24 | 2023-04-11 | 东莞金太阳研磨股份有限公司 | Composite substrate polishing grinding tool and preparation method thereof |
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US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
CN112654655A (en) | 2018-09-04 | 2021-04-13 | 应用材料公司 | Advanced polishing pad formulations |
TW202023805A (en) * | 2018-09-28 | 2020-07-01 | 日商福吉米股份有限公司 | Polishing pad, and polishing method using same |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578098A (en) * | 1990-10-09 | 1996-11-26 | Minnesota Mining And Manufacturing Company | Coated abrasive containing erodible agglomerates |
US20060258276A1 (en) * | 2005-05-16 | 2006-11-16 | Chien-Min Sung | Superhard cutters and associated methods |
US20070128991A1 (en) * | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
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US6099954A (en) * | 1995-04-24 | 2000-08-08 | Rodel Holdings, Inc. | Polishing material and method of polishing a surface |
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US6121143A (en) * | 1997-09-19 | 2000-09-19 | 3M Innovative Properties Company | Abrasive articles comprising a fluorochemical agent for wafer surface modification |
US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
JP2000301450A (en) * | 1999-04-19 | 2000-10-31 | Rohm Co Ltd | Cmp polishing pad and cmp processing device using it |
JP3615134B2 (en) * | 2000-08-24 | 2005-01-26 | 三共理化学株式会社 | Abrasive |
US6645624B2 (en) * | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
JP3762943B2 (en) * | 2001-04-17 | 2006-04-05 | 株式会社ユニバーサルエアー | suspension |
JP2003136397A (en) * | 2001-11-01 | 2003-05-14 | Roki Techno Co Ltd | Polishing pad |
US7160173B2 (en) * | 2002-04-03 | 2007-01-09 | 3M Innovative Properties Company | Abrasive articles and methods for the manufacture and use of same |
KR100465649B1 (en) * | 2002-09-17 | 2005-01-13 | 한국포리올 주식회사 | Integral polishing pad and manufacturing method thereof |
US20080318505A1 (en) * | 2004-11-29 | 2008-12-25 | Rajeev Bajaj | Chemical mechanical planarization pad and method of use thereof |
WO2006057714A2 (en) * | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
US7846008B2 (en) * | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
ZA200710367B (en) * | 2005-05-16 | 2009-07-29 | Sung Chien-Min | Superhard cutters and associated methods |
JP2008290197A (en) * | 2007-05-25 | 2008-12-04 | Nihon Micro Coating Co Ltd | Polishing pad and method |
KR20100082770A (en) * | 2007-09-03 | 2010-07-19 | 세미퀘스트, 인코포레이티드 | Polishing pad |
WO2009140622A2 (en) * | 2008-05-15 | 2009-11-19 | 3M Innovative Properties Company | Polishing pad with endpoint window and systems and method using the same |
US8821214B2 (en) * | 2008-06-26 | 2014-09-02 | 3M Innovative Properties Company | Polishing pad with porous elements and method of making and using the same |
-
2010
- 2010-12-28 SG SG2012046538A patent/SG181889A1/en unknown
- 2010-12-28 JP JP2012547232A patent/JP5671554B2/en not_active Expired - Fee Related
- 2010-12-28 WO PCT/US2010/062205 patent/WO2011082156A2/en active Application Filing
- 2010-12-28 CN CN201080060309XA patent/CN102686361A/en active Pending
- 2010-12-28 US US13/517,367 patent/US20130102231A1/en not_active Abandoned
- 2010-12-28 KR KR1020127019846A patent/KR20120112662A/en not_active Application Discontinuation
- 2010-12-29 TW TW099146709A patent/TW201143984A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578098A (en) * | 1990-10-09 | 1996-11-26 | Minnesota Mining And Manufacturing Company | Coated abrasive containing erodible agglomerates |
US20060258276A1 (en) * | 2005-05-16 | 2006-11-16 | Chien-Min Sung | Superhard cutters and associated methods |
US20070128991A1 (en) * | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
Also Published As
Publication number | Publication date |
---|---|
JP5671554B2 (en) | 2015-02-18 |
TW201143984A (en) | 2011-12-16 |
KR20120112662A (en) | 2012-10-11 |
CN102686361A (en) | 2012-09-19 |
JP2013516328A (en) | 2013-05-13 |
WO2011082156A2 (en) | 2011-07-07 |
US20130102231A1 (en) | 2013-04-25 |
SG181889A1 (en) | 2012-07-30 |
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