WO2011074837A2 - Probe apparatus for a wafer solder bump - Google Patents

Probe apparatus for a wafer solder bump Download PDF

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Publication number
WO2011074837A2
WO2011074837A2 PCT/KR2010/008877 KR2010008877W WO2011074837A2 WO 2011074837 A2 WO2011074837 A2 WO 2011074837A2 KR 2010008877 W KR2010008877 W KR 2010008877W WO 2011074837 A2 WO2011074837 A2 WO 2011074837A2
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
flexible circuit
wafer
support
Prior art date
Application number
PCT/KR2010/008877
Other languages
French (fr)
Korean (ko)
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WO2011074837A3 (en
Inventor
임이빈
허남중
조준수
Original Assignee
주식회사 프로이천
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Application filed by 주식회사 프로이천 filed Critical 주식회사 프로이천
Publication of WO2011074837A2 publication Critical patent/WO2011074837A2/en
Publication of WO2011074837A3 publication Critical patent/WO2011074837A3/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Definitions

  • the present invention relates to a probe device for a wafer solder bump, and when performing the electrical test of the wafer through the solder bump formed on the bottom surface of the wafer, it is possible to eliminate the electrical connection defect by preventing the solder bumps and the flexible circuit board distortion.
  • a probe device for wafer solder bumps is a probe device for wafer solder bumps.
  • a probe card for testing a semiconductor wafer has a circular sacrificial circuit board having a predetermined thickness, and a plurality of probes are arranged in holes formed in the center of the printed circuit board.
  • the probes may be energized in contact with a pad of the device formed on the semiconductor wafer. Therefore, the probes perform an electrical test by playing a role of transmitting electrical signals between the printed circuit board and the device.
  • solder bumps are formed on a wafer
  • electrical signals were detected using a connection pattern formed on a flexible circuit board in addition to the probes.
  • the flexible circuit board is a substrate made of a flexible material, and the ends of the flexible circuit board are electrically connected to the printed circuit board so that the substrate can transmit signals to the printed circuit board.
  • a flexible circuit board may be formed of a flexible material so as to be bent and extend a signal line to a predetermined length.
  • connection position is shifted by the impact force generated when the solder bumps of the wafer and the connection pattern of the flexible circuit board are connected. Therefore, there is a problem in that the electrical test on the wafer is not normally performed.
  • the ends of the flexible circuit boards extending to a certain length are electrically connected to the printed circuit boards. Even in this case, there is no conventional fixing means, or the fixing force cannot be evenly applied to the entire surface of the flexible circuit board. For this reason, when the impact force is applied from the outside as in the above, there is a problem that the end of the flexible circuit board and the predetermined portion of the printed circuit board is misaligned with each other and thus the normal electrical test is not performed.
  • the present invention was created to solve the above problems, and an object of the present invention is to compare the solder bumps with the connection pattern of the flexible circuit board when performing electrical test of the wafer through the solder bumps formed on the bottom surface of the wafer.
  • the present invention provides a probe device for a wafer solder bump that can improve the accuracy of the connection position, prevent the connection position from being distorted due to external impact that can be generated during the test, and solve the poor connection with the flexible circuit board.
  • the present invention provides a probe device for wafer solder bumps.
  • the wafer solder bump probe device may include a support stacked on an upper surface of a printed circuit board; A flexible circuit board having a connection pattern connected to solder bumps formed on the wafer, the flexible circuit board having a predetermined length, a bottom surface of which is seated on an upper surface of the support portion, and both ends of which are electrically connected to a portion of the printed circuit board; A main fixing part fitted to an edge of the support part and fixing the flexible circuit board to be in close contact with an outer surface of the support part; And a sub fixing part provided on the printed circuit board and closely fixing both ends of the flexible circuit board by using an elastic force.
  • the support portion a rectangular plate-shaped support block made of ceramic and fixed to the upper surface of the printed circuit board, laminated on the upper surface of the support block and made of an elastic material, the upper surface is in close contact with the bottom surface of the flexible circuit board It is preferable to have an elastic pad.
  • a mounting groove having a predetermined depth is further formed on an upper surface of the printed circuit board, and a lower end portion of the support block is fitted into the mounting groove to be seated.
  • the main fixing part may be formed of a body in which a hole fitted into the edge of the support part is formed, and the flexible circuit board is pressed between the inner surface of the hole and the edge of the support part.
  • both ends of the flexible circuit board are connected to an electrode formed on an upper surface of the printed circuit board, and the sub-fixing part includes a first rubber member laminated on both upper surfaces of the flexible circuit board, and the first rubber member. It is preferable to have a first fixing block laminated on the upper surface and fixed to the printed circuit board.
  • first reinforcement block is further disposed on the bottom of the printed circuit board, the first reinforcement block is preferably bolted to the bottom of the printed circuit board is fixed.
  • the printed circuit board further includes a pair of through holes penetrating the printed circuit board at both sides of the main fixing part, and both ends of the flexible circuit board penetrate through the pair of through holes. It may be electrically connected to an electrode formed on the bottom surface of the circuit board.
  • the pair of through holes is preferably formed in a slit shape so that the flexible circuit board having a predetermined width and width passes therethrough.
  • the sub fixing part includes a second rubber member that is in close contact with bottom surfaces of both ends of the flexible circuit board, and a second fixing block that is in close contact with the bottom surface of the second rubber member and fixed to the printed circuit board. .
  • a second reinforcement block may be further disposed on the bottom of the printed circuit board, and the second reinforcement block may be fixed by bolting to the bottom of the printed circuit board.
  • the present invention improves the accuracy of the connection position between the solder bumps and the connection pattern of the flexible circuit board when performing the wafer electrical test through the solder bumps formed on the bottom surface of the wafer, and the external impact that may be generated during the test. This can prevent the connection position from being distorted.
  • FIG. 1 is a combined perspective view showing a probe device for a wafer solder bump according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view illustrating the probe apparatus for the wafer solder bumps of FIG. 1.
  • FIG. 3 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 2.
  • FIG. 4 is an enlarged cross-sectional view illustrating a symbol A of FIG. 3.
  • FIG. 5 is an enlarged cross-sectional view showing a display B of FIG. 3.
  • FIG. 6 is a partial cross-sectional view showing a state in which a support block according to the present invention is seated in a seating groove formed in a substrate.
  • FIG. 7 is an exploded perspective view showing a probe device for a wafer solder bump according to a second embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 7.
  • FIG. 9 is an enlarged cross-sectional view showing a display symbol C of FIG. 8.
  • FIG. 10 is an enlarged cross-sectional view showing a display symbol D of FIG. 8.
  • FIG. 1 is a combined perspective view showing a probe device for a wafer solder bump according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view illustrating the probe apparatus for the wafer solder bumps of FIG. 1.
  • 3 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 2.
  • 4 is an enlarged cross-sectional view illustrating a symbol A of FIG. 3.
  • a probe apparatus for a wafer solder bump according to a first embodiment of the present invention will be described.
  • the probe device of the present invention has a disk-shaped printed circuit board 100.
  • a pair of electrode portions 101 are formed at predetermined positions on both sides of the printed circuit board 100.
  • the pair of electrode portions 101 are formed at the same distance from the center of the printed circuit board 100.
  • the support part 200 is stacked at the center of the upper surface of the printed circuit board 100.
  • the support part 200 includes a support block 210 stacked on an upper surface of the printed circuit board 100 and an elastic pad 220 stacked on an upper surface of the support block 210.
  • the support block 210 is made of a ceramic material.
  • the support block 210 is insulative.
  • the four corners of the support block 210 may be formed to be tapered. Therefore, the tapered load may be guided so that the main fixing part 300 to be described below can be easily inserted when the main fixing part 300 to be wrapped to surround the outer circumference of the support part 200.
  • the elastic pad 220 is preferably made of a rubber.
  • the thickness of the elastic pad 220 is formed to be a predetermined thickness thinner than the thickness of the support block 210.
  • the upper surface of the elastic pad 220 is a portion where the bottom surface of the flexible circuit board 400 is in close contact. Therefore, the bottom surface of the flexible circuit board 400 may be prevented from being twisted by being in close contact with the top surface of the elastic pad 220.
  • the four corners of the elastic pad 220 are formed to be tapered to be the same as the support block 210.
  • the lower end of the support block 210 of the support part 200 may be seated and fixed to the seating groove 110 formed in the printed circuit board 100. Therefore, the support block 210 can be prevented from being inserted into the seating groove 110 and seated in the seated state.
  • connection patterns 410 are formed on the top surface of the flexible circuit board 400 having a predetermined length to be seated on the top surface of the elastic pad 220 to contact the solder bumps formed on the bottom surface of the wafer.
  • Both ends of the flexible circuit board 400 seated on the upper surface of the support portion 200, that is, the upper surface of the elastic pad 220 may extend a predetermined length to both sides of the support portion 200.
  • both ends of the flexible circuit board 400 are portions connected to the pair of electrode portions 101 formed on the upper surface of the printed circuit board 100.
  • the main fixing part 300 may be fitted into the support part 200.
  • the main fixing part 300 is formed of a body in which a hole 310 into which the support part 200 can be fitted is formed, and the hole 310 is formed of a hole having a square shape, and the inner side of the hole 310.
  • the four corners are formed to be tapered so that the square corners of the tapered support block 210 are fitted to each other.
  • the support part 200 may be inserted into the hole 310 of the main fixing part 300, and the outer circumference of the support part 200 may be surrounded by the inner circumference of the hole 310.
  • the upper surface of the flexible circuit board 400 forms a state seated on the elastic pad 220, the flexible circuit board 400 on both sides except for the portion seated on the elastic pad 220 is the main fixing portion 300 It may be fitted between the inner surface of the hole 310 and the edge of the support portion 200).
  • both ends of the flexible circuit board 400 extend a predetermined length along a pair of electrode portions 101 formed on the upper surface of the printed circuit board 100 through lower ends of both sides of the main fixing part 300. Can be. That is, both ends of the flexible circuit board 400 may extend outwardly between the lower ends of both sides of the main fixing part 300 and the upper surface of the printed circuit board 100.
  • first positioning holes 10 penetrating up and down are formed at four edges of the main fixing part 300, and upper and lower parts are formed on the printed circuit board 100.
  • First 'positioning holes 11 penetrating are formed.
  • the main fixing part 300, the supporting part 200, and the printed circuit board 100 may be fixedly coupled to each other by the first positioning pins 21. That is, the first positioning pins 21 pass through the first and first 'positioning holes 10 and 11 and serve to couple them together.
  • the lower end of the main fixing part 300 may press the upper surface of the flexible circuit board 400 by pressing the upper surface, and at this time, the main fixing part 300
  • the flexible circuit board 400 exposed to the outside through the hole 310 of FIG. 1 may be pulled with a predetermined force to both sides.
  • the flexible circuit board 400 since the flexible circuit board 400 is in close contact with the elastic pad 220, the flexible circuit board 400 may be pressed against the upper surface of the elastic pad 220 by a predetermined force according to the pulling force. Accordingly, the flexible circuit board 400 may be primarily tightly fixed on the elastic pad 220.
  • the connection pattern 410 formed on the upper surface of the flexible circuit board 400 is exposed through the hole.
  • a pair of both ends of the flexible circuit board 400 which is in close contact between the lower end of the main fixing part 300 and the upper surface of the printed circuit board 100 protrudes to both sides of the main fixing part 300. It can be connected to the electrode portion 101 of.
  • both ends of the flexible circuit board 400 positioned in the pair of electrode units 101 may be tightly fixed by the sub fixing unit 510.
  • the sub fixing part 510 may include a first rubber member 511 positioned on an upper surface of one end of the flexible circuit board 400 connected to the electrode part 101 formed on the upper surface of the printed circuit board 100, and The first fixing block 512 is positioned on the upper surface of the first rubber member 511.
  • the first fixing block 512 is fixed to the printed circuit board 100.
  • Second positioning holes 20 are formed in the first fixing block 512.
  • the printed circuit board 100 is formed with second 'positioning holes 21 that are aligned with the second positioning holes 20.
  • Second positioning pins 22 may be inserted into and fixed to the second and second positioning holes 20 and 21.
  • the second fixing pins 22 are inserted into and fixed to the second and second 'positioning holes 20 and 21, so that the first fixing block 512 is pressed against the printed circuit board 100.
  • one end of the flexible circuit board 400 positioned between the bottom surface of the first rubber member 511 and the electrode portion 101 may be disposed between the electrode portions 101 by the first rubber member 511. Can be crimp fixed.
  • the other end of the flexible circuit board 400 may also be crimped and fixed in the same manner as the one end.
  • both ends of the flexible circuit board 400 may be pressed and fixed to the electrode unit 101 of the printed circuit board 100 by the sub fixing part 510 according to the present invention. 400 may be fixed secondary.
  • a first reinforcement block 610 is further provided on the bottom of the printed circuit board 100.
  • Third positioning holes 30 are formed in the first reinforcing block 610, and a third position in which bottom positions of the printed circuit board 100 coincide with the third positioning holes 30 is provided.
  • 'Positioning holes 31 are formed.
  • third positioning pins 23 may be inserted into the third and third 'positioning holes 30 and 31.
  • the first reinforcing blocks 610 are formed on the bottom surface of the printed circuit board 100 by inserting the third positioning pins 23 into the third and third 'positioning holes 30 and 31.
  • the support part 200 and the bottom of the main fixing part 300 are fixedly installed.
  • the solder bumps of the wafer are connected to the connection pattern 410 of the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. A warpage phenomenon of the printed circuit board 100, which may be generated, may be prevented.
  • the elastic pad 220 and the support block 210 may be fixed to each other by fixing means composed of protrusions and protrusion grooves into which the protrusions are fitted.
  • the protrusions may be formed on the bottom surface of the elastic pad 220
  • the protrusion grooves may be formed on the upper surface of the support block 210, or may be formed in the reverse direction.
  • a lattice-shaped scratch may be further formed on the upper surface of the elastic pad 220 and the upper and lower surfaces of the first rubber member 511.
  • the probe device configured as described above may be in contact with the wafer solder bumps to perform electrical inspection.
  • a wafer having a plurality of solder bumps formed on a bottom surface thereof may be seated on the main fixing part 300.
  • the solder bumps formed on the bottom surface of the wafer may be physically connected to the connection pattern 410 formed on the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. Therefore, the solder bumps and the connection pattern 410 may be in a state where they are energized with each other.
  • the bottom surface of the flexible circuit board 400 having the connection pattern 410 is in close contact with the elastic pad 200, the impact force generated when the wafer is seated on the main fixing part 300 is easy.
  • the flexible circuit board 400 may be prevented from being twisted on the upper surface of the elastic pad 220 due to the impact.
  • connection accuracy of the solder bumps and the connection pattern 410 may be improved.
  • the flexible circuit board 400 is tightly fixed between the hole 310 of the main fixing part 300 and the edge of the support part 200, and the lower end of the main fixing part 300 and the printed circuit board 100. Since the compression is fixed between the upper surface of the), the distortion inside the main fixing part 300 can be prevented due to multiple fixing forces.
  • both ends of the flexible circuit board 400 connected to the pair of electrode parts 101 formed on the upper surface of the printed circuit board 100 are elastic by the first rubber member 511 of the sub fixing part 510. Since it is compressed, both ends of the flexible circuit board 400 may also be easily prevented from being twisted.
  • the portion directly connected to the wafer (the flexible circuit board 400 having the connection pattern 410 exposed through the hole 310 of the main fixing part 300) and the flexible circuit board 400 Since both ends are easily crimped and fixed as described above, it is possible to provide a stable test environment in the case of performing the electrical test to enable a more precise electrical test.
  • a probe apparatus for a wafer solder bump according to a second embodiment of the present invention will be described.
  • FIG. 7 is an exploded perspective view showing a probe device for a wafer solder bump according to a second embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 7.
  • FIG. 9 is an enlarged cross-sectional view showing a display symbol C of FIG. 8.
  • FIG. 10 is an enlarged cross-sectional view showing a display symbol D of FIG. 8.
  • the probe device according to the second embodiment has a printed circuit board 100.
  • a pair of electrode portions 101 are formed on both side portions of the bottom surface of the printed circuit board 100.
  • the pair of electrode portions 101 are positioned at the same distance from each other from the center of the printed circuit board 100.
  • main fixing part 300 and the supporting part 200 mentioned in the first embodiment are located on the upper surface of the central part of the printed circuit board 100.
  • the configuration of the main fixing part 300 and the support 200 may be the same as the configuration of the first embodiment.
  • the lower end of the support block 210 of the support 200 may also be fixed to the seating groove 110 formed in the printed circuit board 100 shown in FIG.
  • a pair of slit-shaped through holes 120 penetrating the top and bottom of the printed circuit board 100 are formed at both sides of the main fixing part 300.
  • Each of the through holes 120 is sandwiched and fixed between the main fixing part 300 and the supporting part 200, and protrudes from both sides of the main fixing part 300 through a lower end of the main fixing part 300.
  • the flexible circuit board 400 is inserted into and guides through.
  • both ends of the flexible circuit board 400 may pass through each of the pair of through holes 120 to protrude toward the bottom of the printed circuit board 100.
  • both ends of the flexible circuit board 400 protruding to the bottom portion of the printed circuit board 100 may be pressed and fixed through the sub fixing part 520 in each of the electrode parts 101 of the printed circuit board 100. have.
  • one end of the flexible circuit board 400 is connected to the electrode portion 101 formed on the bottom surface of the printed circuit board 100.
  • the second rubber member 521 of the sub fixing part 520 may be in close contact with the bottom of one end of the printed circuit board 100.
  • the second fixing block 522 of the sub fixing part 520 may press the second rubber member 521 in a state of being in close contact with the bottom surface of the second rubber member 521. It is fixed to the bottom part of 100). Therefore, one end of the flexible circuit board 400 may be fixed to the electrode unit 101 by compression.
  • fourth positioning holes 40 are formed in the second fixing block 522, and the fourth positioning holes are formed in the bottom portion of the printed circuit board 100.
  • Fourth positioning holes 41 are formed to coincide with the positions 40.
  • the fourth positioning pins 24 may be inserted into and fixed to the fourth and fourth 'positioning holes 40 and 41.
  • the fourth fixing pins 24 are inserted into and fixed to the fourth and fourth 'positioning holes 40 and 41, so that the sub fixing part 520 has one end of the flexible circuit board 400 as an electrode.
  • the part 101 can be fixed by compression.
  • a second reinforcement block 620 is further provided on the bottom of the printed circuit board 100.
  • Fifth positioning holes 50 are formed in the second reinforcement block 620, and a fifth position in which the bottom portion of the printed circuit board 100 coincides with the fifth positioning holes 50.
  • 'Positioning holes 51 are formed.
  • the fifth positioning pins 25 may be inserted into the fifth and fifth 'positioning holes 50 and 51. Therefore, the fifth reinforcing pins 25 are inserted into the fifth and fifth 'positioning holes 50 and 51 so that the second reinforcement block 620 is formed on the bottom surface of the printed circuit board 100.
  • the support part 200 and the bottom of the main fixing part 300 are fixedly installed.
  • connection pattern 410 of the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300 as the second reinforcement block 620 is installed.
  • a warpage phenomenon of the printed circuit board 100, which may be generated, may be prevented.
  • the flexible circuit board 400 may be crimped and fixed in multiple. That is, the flexible circuit board 400 is crimped and fixed by the elastic pad 220 in the main fixing part 300, and the inner surface of the hole 310 of the main fixing part 300 and the edge of the support part 200. It is tightly fixed between, and tightly fixed between the lower end of the main fixing part 300 and the upper surface of the printed circuit board 100, and penetrates through the through hole 120 to the bottom of the printed circuit board 100 to print In the state of being in close contact with the bottom surface of the circuit board 100 is pressed by the sub fixing part 520 in the electrode portion 101.
  • an elastic layer having a predetermined thickness may be further formed on the inner wall of the through hole 120.
  • the bottom edges of the through holes 120 may be bent at a predetermined curvature. Therefore, the outer surface of the flexible circuit board 400 may be protected by the elastic layer and the outer surface of the flexible circuit board 400 bent through the through hole 120 may be prevented through the bent portion. have.
  • the probe device configured as described above may be in contact with the wafer solder bumps to perform electrical inspection.
  • a wafer having a plurality of solder bumps formed on a bottom surface thereof may be seated on the main fixing part 300.
  • the solder bumps formed on the bottom surface of the wafer may be physically connected to the connection pattern 410 formed on the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. Therefore, the solder bumps and the connection pattern 410 may be in a state where they are energized with each other.
  • the flexible circuit board 400 on which the connection pattern 410 is formed is elastically contacted with the elastic pad 220, the impact force generated when the wafer is seated on the main fixing part 300 is easily absorbed. In addition, a phenomenon in which the flexible circuit board 400 is distorted due to the impact may be prevented. Therefore, the connection accuracy of the solder bumps and the connection pattern 410 may be improved.
  • the flexible circuit board 400 is tightly fixed between the hole 310 of the main fixing part 300 and the edge of the support part 200, and the lower end of the main fixing part 300 and the printed circuit board 100. Since the compression is fixed between the upper surface of the), the distortion inside the main fixing part 300 can be prevented due to multiple fixing forces.
  • both ends of the flexible circuit board 400 connected to the pair of electrode portions 101 formed on the bottom surface of the printed circuit board 100 may pass through the through holes 120 to the bottom surface portion of the printed circuit board 100. Since it is elastically compressed by the second rubber member 521 of the sub fixing part 520 in the penetrating state, both ends of the flexible circuit board 400 may also be easily prevented from twisting.
  • both ends of the flexible circuit board 400 are connected to the electrode unit 101 through the bottom surface of the printed circuit board 100, both ends of the electrode unit 101 and the flexible circuit board 400 are connected to the printed circuit board. It may not be exposed to the upper surface of the (100). Accordingly, the foreign matter can be prevented from being easily caught between the electrode portion 101 and both ends of the flexible circuit board 400, thereby preventing the deterioration of electrical characteristics due to the foreign matter.
  • the portion directly connected to the wafer (the flexible circuit board 400 having the connection pattern 410 exposed through the hole 310 of the main fixing part 300) and the flexible circuit board 400 Since both ends are easily pressed and fixed on the bottom of the printed circuit board 100 as described above, it is possible to provide a stable test environment in the case of performing the electrical test to enable a more precise electrical test.
  • the invention can be used in the field of development of probe devices for semiconductor testing.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention provides a probe apparatus for a wafer solder bump. The probe apparatus for a wafer solder bump comprises: a support unit mounted on an upper surface of a printed circuit board; a flexible circuit board which has a connection pattern connected to solder bumps formed on a wafer, and which has a predetermined length, and a bottom surface mounted on an upper surface of the support unit, and both ends electrically connected to predetermined portions of the printed circuit board; a main fixing unit which is fitted into a rim of the support unit so as to fix the flexible circuit board tightly to an outer surface of the support unit; and a sub fixing unit which is arranged on the printed circuit board so as to tightly fix both ends of the flexible circuit board using an elastic force. Accordingly, the apparatus of the present invention prevents the solder bumps and the flexible circuit board from being warped, and thus prevents faults in the electrical connection of the wafer, when an electrical test for the wafer is performed using the solder bumps formed on a lower surface of the wafer.

Description

웨이퍼 솔더 범프용 프로브 장치Probe Device for Wafer Solder Bump
본 발명은 웨이퍼 솔더 범프용 프로브 장치에 관한 것으로서, 웨이퍼의 저면에 형성되는 솔더 범프를 통한 웨이퍼 전기적 테스를 실시하는 경우에 솔더 범프들과 연성 회로 기판의 틀어짐을 방지하여 전기적 접속 불량을 해소할 수 있는 웨이퍼 솔더 범프용 프로브 장치에 관한 것이다.The present invention relates to a probe device for a wafer solder bump, and when performing the electrical test of the wafer through the solder bump formed on the bottom surface of the wafer, it is possible to eliminate the electrical connection defect by preventing the solder bumps and the flexible circuit board distortion. A probe device for wafer solder bumps.
전형적으로, 반도체 웨이퍼 검사용 프로브 카드(Probe Card)는 일정의 두께를 갖는 원형의 인새 회로 기판을 갖고, 상기 인쇄 회로 기판의 중앙부에 형성되는 홀에 탐침이 다수개로 배열된다. 여기서, 상기 탐침들은 반도체 웨이퍼 상에 형성되는 디바이스의 패드에 접촉되어 통전될 수 있다. 따라서, 상기 탐침들은 인쇄 회로 기판과 디바이스 간의 전기적 신호를 전달할 수 있는 역할을 수행하여 전기적 테스트를 수행한다.Typically, a probe card for testing a semiconductor wafer has a circular sacrificial circuit board having a predetermined thickness, and a plurality of probes are arranged in holes formed in the center of the printed circuit board. Here, the probes may be energized in contact with a pad of the device formed on the semiconductor wafer. Therefore, the probes perform an electrical test by playing a role of transmitting electrical signals between the printed circuit board and the device.
이에 더하여, 웨이퍼 상에는 솔더 범프들이 형성되는 경우에, 종래에는 상기 탐침들 이외에 연성 회로 기판에 형성되는 접속 패턴을 사용하여 전기적 신호를 검출하였다.In addition, when solder bumps are formed on a wafer, conventionally, electrical signals were detected using a connection pattern formed on a flexible circuit board in addition to the probes.
여기서, 상기 연성 회로 기판은 유연성의 재질로 이루어지는 기판이고, 이 기판이 인쇄 회로 기판으로 신호를 전송할 수 있도록 상기 연성 회로 기판의 단부는 인쇄 회로 기판과 전기적으로 접속된다.Here, the flexible circuit board is a substrate made of a flexible material, and the ends of the flexible circuit board are electrically connected to the printed circuit board so that the substrate can transmit signals to the printed circuit board.
따라서, 종래에는 유연성의 재질로 이루어져 벤딩 가능하고 일정 길이로 신호선을 연장할 수 있도록 연성 회로 기판을 사용하였다.Therefore, in the related art, a flexible circuit board may be formed of a flexible material so as to be bent and extend a signal line to a predetermined length.
그러나, 종래에는 상기 웨이퍼의 솔더 범프들과 상기 연성 회로 기판의 접속 패턴과 접속되는 경우에 발생되는 충격력에 의하여, 접속 위치가 틀어지는 문제점이 있다. 따라서, 종래에는 웨이퍼에 대한 전기적 테스트가 정상적으로 이루어지지 않는 문제점이 있다.However, in the related art, there is a problem in that the connection position is shifted by the impact force generated when the solder bumps of the wafer and the connection pattern of the flexible circuit board are connected. Therefore, there is a problem in that the electrical test on the wafer is not normally performed.
이에 더하여, 일정 길이로 연장되는 연성 회로 기판의 단부가 인쇄 회로 기판과 전기적으로 접속되는데, 이러한 경우에 있어서도, 종래에는 별도의 고정 수단이 없거나, 연성 회로 기판의 전면에 대하여 골고루 고정력을 가할 수 없는 이유로, 상기와 마찬가지로 외부로부터 충격력이 가해지는 경우에, 연성 회로 기판의 단부와 인쇄 회로 기판의 일정 부분이 서로 틀어져 정상적인 전기적 테스트가 이루어지지 않는 문제점이 있다.In addition, the ends of the flexible circuit boards extending to a certain length are electrically connected to the printed circuit boards. Even in this case, there is no conventional fixing means, or the fixing force cannot be evenly applied to the entire surface of the flexible circuit board. For this reason, when the impact force is applied from the outside as in the above, there is a problem that the end of the flexible circuit board and the predetermined portion of the printed circuit board is misaligned with each other and thus the normal electrical test is not performed.
본 발명은 상기와 같은 문제점을 해결할 수 있도록 창출된 것으로서, 본 발명의 목적은 웨이퍼의 저면에 형성되는 솔더 범프를 통한 웨이퍼 전기적 테스를 실시하는 경우에 솔더 범프들과 연성 회로 기판의 접속 패턴과의 접속 위치의 정확도를 향상시키고, 테스트 도중에 발생될 수 있는 외부 충격에 의하여 접속 위치가 틀어지는 것을 방지하여 연성 회로 기판과의 접속 불량을 해소할 수 있는 웨이퍼 솔더 범프용 프로브 장치를 제공함에 있다.SUMMARY OF THE INVENTION The present invention was created to solve the above problems, and an object of the present invention is to compare the solder bumps with the connection pattern of the flexible circuit board when performing electrical test of the wafer through the solder bumps formed on the bottom surface of the wafer. The present invention provides a probe device for a wafer solder bump that can improve the accuracy of the connection position, prevent the connection position from being distorted due to external impact that can be generated during the test, and solve the poor connection with the flexible circuit board.
바람직한 양태에 있어서, 본 발명은 웨이퍼 솔더 범프용 프로브 장치를 제공한다.In a preferred embodiment, the present invention provides a probe device for wafer solder bumps.
상기 웨이퍼 솔더 범프용 프로브 장치는 인쇄 회로 기판의 상면에 적층되는 지지부와; 웨이퍼에 형성되는 솔더 범프들에 접속되는 접속 패턴이 형성되고, 일정 길이를 갖고, 저면이 상기 지지부의 상면에 안착되고 양단이 상기 인쇄 회로 기판의 일정 부분에 전기적으로 접속되는 연성 회로 기판과; 상기 지지부의 테두리에 끼워지고, 상기 연성 회로 기판이 상기 지지부의 외면에 밀착되도록 고정하는 메인 고정부; 및 상기 인쇄 회로 기판에 마련되며, 상기 연성 회로 기판의 양단을 탄성력을 사용하여 밀착 고정하는 서브 고정부를 포함한다.The wafer solder bump probe device may include a support stacked on an upper surface of a printed circuit board; A flexible circuit board having a connection pattern connected to solder bumps formed on the wafer, the flexible circuit board having a predetermined length, a bottom surface of which is seated on an upper surface of the support portion, and both ends of which are electrically connected to a portion of the printed circuit board; A main fixing part fitted to an edge of the support part and fixing the flexible circuit board to be in close contact with an outer surface of the support part; And a sub fixing part provided on the printed circuit board and closely fixing both ends of the flexible circuit board by using an elastic force.
여기서, 상기 지지부는, 세라믹으로 이루어지며 상기 인쇄 회로 기판의 상면에 고정되는 사각 판상의 지지 블럭과, 상기 지지 블럭의 상면에 적층되고 탄성재로 이루어지며 상면이 상기 연성 회로 기판의 저면에 밀착되는 탄성 패드를 구비하는 것이 바람직하다.Here, the support portion, a rectangular plate-shaped support block made of ceramic and fixed to the upper surface of the printed circuit board, laminated on the upper surface of the support block and made of an elastic material, the upper surface is in close contact with the bottom surface of the flexible circuit board It is preferable to have an elastic pad.
그리고, 상기 인쇄 회로 기판의 상면에는 일정 깊이의 안착홈이 더 형성되고, 상기 지지 블럭의 하단부는 상기 안착홈에 끼워져 안착되는 것이 바람직하다.In addition, a mounting groove having a predetermined depth is further formed on an upper surface of the printed circuit board, and a lower end portion of the support block is fitted into the mounting groove to be seated.
또한, 상기 메인 고정부는, 상기 지지부의 테두리에 끼워지는 홀이 형성되는 몸체로 형성되고, 상기 연성 회로 기판은 상기 홀의 내측면과 상기 지지부의 테두리의 사이에서 압착되는 것이 바람직하다.The main fixing part may be formed of a body in which a hole fitted into the edge of the support part is formed, and the flexible circuit board is pressed between the inner surface of the hole and the edge of the support part.
또한, 상기 연성 회로 기판의 양단은 상기 인쇄 회로 기판의 상면에 형성되는 전극에 접속되고, 상기 서브 고정부는, 상기 연성 회로 기판의 양단 상면에 적층되는 제 1러버 부재와, 상기 제 1러버 부재의 상면에 적층되며 상기 인쇄 회로 기판에 고정되는 제 1고정 블럭을 구비하는 것이 바람직하다.In addition, both ends of the flexible circuit board are connected to an electrode formed on an upper surface of the printed circuit board, and the sub-fixing part includes a first rubber member laminated on both upper surfaces of the flexible circuit board, and the first rubber member. It is preferable to have a first fixing block laminated on the upper surface and fixed to the printed circuit board.
또한, 상기 인쇄 회로 기판의 저면에는 제 1보강 블럭이 더 배치되되, 상기 제 1보강 블럭은 상기 인쇄 회로 기판의 저면부와 볼트 체결되어 고정되는 것이 바람직하다.In addition, the first reinforcement block is further disposed on the bottom of the printed circuit board, the first reinforcement block is preferably bolted to the bottom of the printed circuit board is fixed.
한편, 상기 인쇄 회로 기판에는 상기 메인 고정부의 양측부에서 상기 인쇄 회로 기판을 관통하는 한 쌍의 관통홀이 더 형성되고, 상기 연성 회로 기판의 양단은 상기 한 쌍의 관통홀을 관통하여 상기 인쇄 회로 기판의 저면에 형성되는 전극에 전기적으로 접속될 수도 있다.Meanwhile, the printed circuit board further includes a pair of through holes penetrating the printed circuit board at both sides of the main fixing part, and both ends of the flexible circuit board penetrate through the pair of through holes. It may be electrically connected to an electrode formed on the bottom surface of the circuit board.
이러한 경우에, 상기 한 쌍의 관통홀은 일정 폭과 너비를 갖는 상기 연성 회로 기판이 관통되도록 슬릿 형상으로 형성되는 것이 바람직하다.In this case, the pair of through holes is preferably formed in a slit shape so that the flexible circuit board having a predetermined width and width passes therethrough.
그리고, 상기 서브 고정부는, 상기 연성 회로 기판의 양단 저면에 밀착되는 제 2러버 부재와, 상기 제 2러버 부재의 저면에 밀착되며 상기 인쇄 회로 기판에 고정되는 제 2고정 블럭을 구비하는 것이 바람직하다.Preferably, the sub fixing part includes a second rubber member that is in close contact with bottom surfaces of both ends of the flexible circuit board, and a second fixing block that is in close contact with the bottom surface of the second rubber member and fixed to the printed circuit board. .
또한, 상기 인쇄 회로 기판의 저면에는 제 2보강 블럭이 더 배치되되, 상기 제 2보강 블럭은 상기 인쇄 회로 기판의 저면부와 볼트 체결되어 고정되는 것이 바람직하다.In addition, a second reinforcement block may be further disposed on the bottom of the printed circuit board, and the second reinforcement block may be fixed by bolting to the bottom of the printed circuit board.
본 발명은 웨이퍼의 저면에 형성되는 솔더 범프를 통한 웨이퍼 전기적 테스를 실시하는 경우에 솔더 범프들과 연성 회로 기판의 접속 패턴과의 접속 위치의 정확도를 향상시키고, 테스트 도중에 발생될 수 있는 외부 충격에 의하여 접속 위치가 틀어지는 것을 방지할 수 있다.The present invention improves the accuracy of the connection position between the solder bumps and the connection pattern of the flexible circuit board when performing the wafer electrical test through the solder bumps formed on the bottom surface of the wafer, and the external impact that may be generated during the test. This can prevent the connection position from being distorted.
도 1은 본 발명의 제 1실시예를 따르는 웨이퍼 솔더 범프용 프로브 장치를 보여주는 결합 사시도이다.1 is a combined perspective view showing a probe device for a wafer solder bump according to a first embodiment of the present invention.
도 2는 도 1의 웨이퍼 솔더 범프용 프로브 장치를 보여주는 분해 사시도이다.FIG. 2 is an exploded perspective view illustrating the probe apparatus for the wafer solder bumps of FIG. 1.
도 3은 도 2의 웨이퍼 솔더 범프용 프로브 장치를 보여주는 단면도이다.3 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 2.
도 4는 도 3의 표시 부호 A를 보여주는 확대 단면도이다.4 is an enlarged cross-sectional view illustrating a symbol A of FIG. 3.
도 5는 도 3의 표시 부호 B를 보여주는 확대 단면도이다.FIG. 5 is an enlarged cross-sectional view showing a display B of FIG. 3.
도 6은 본 발명에 따르는 지지 블럭이 기판에 형성되는 안착홈에 안착된 상태를 보여주는 부분 단면도이다.6 is a partial cross-sectional view showing a state in which a support block according to the present invention is seated in a seating groove formed in a substrate.
도 7은 본 발명의 제 2실시예를 따르는 웨이퍼 솔더 범프용 프로브 장치를 보여주는 분해 사시도이다.7 is an exploded perspective view showing a probe device for a wafer solder bump according to a second embodiment of the present invention.
도 8은 도 7의 웨이퍼 솔더 범프용 프로브 장치를 보여주는 단면도이다.FIG. 8 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 7.
도 9는 도 8의 표시 부호 C를 보여주는 확대 단면도이다.FIG. 9 is an enlarged cross-sectional view showing a display symbol C of FIG. 8.
도 10은 도 8의 표시 부호 D를 보여주는 확대 단면도이다.FIG. 10 is an enlarged cross-sectional view showing a display symbol D of FIG. 8.
이하, 첨부되는 도면들을 참조로 하여, 본 발명의 웨이퍼 솔더 범프용 프로브 장치를 설명하도록 한다.Hereinafter, a probe apparatus for a wafer solder bump of the present invention will be described with reference to the accompanying drawings.
[제 1실시예][First Embodiment]
도 1은 본 발명의 제 1실시예를 따르는 웨이퍼 솔더 범프용 프로브 장치를 보여주는 결합 사시도이다. 도 2는 도 1의 웨이퍼 솔더 범프용 프로브 장치를 보여주는 분해 사시도이다. 도 3은 도 2의 웨이퍼 솔더 범프용 프로브 장치를 보여주는 단면도이다. 도 4는 도 3의 표시 부호 A를 보여주는 확대 단면도이다. 도 5는 도 3의 표시 부호 B를 보여주는 확대 단면도이다. 도 6은 본 발명에 따르는 지지 블럭이 기판에 형성되는 안착홈에 안착된 상태를 보여주는 부분 단면도이다.1 is a combined perspective view showing a probe device for a wafer solder bump according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view illustrating the probe apparatus for the wafer solder bumps of FIG. 1. 3 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 2. 4 is an enlarged cross-sectional view illustrating a symbol A of FIG. 3. FIG. 5 is an enlarged cross-sectional view showing a display B of FIG. 3. 6 is a partial cross-sectional view showing a state in which a support block according to the present invention is seated in a seating groove formed in a substrate.
본 발명의 제 1실시예를 따르는 웨이퍼 솔더 범프용 프로브 장치를 설명하도록 한다.A probe apparatus for a wafer solder bump according to a first embodiment of the present invention will be described.
도 1 내지 도 3을 참조 하면, 본 발명의 프로브 장치는 원판 형상의 인쇄 회로 기판(100)을 갖는다. 상기 인쇄 회로 기판(100)의 양측부 일정 위치에는 한 쌍의 전극부(101)가 형성된다. 여기서, 상기 한 쌍의 전극부(101)는 상기 인쇄 회로 기판(100)의 중심으로 부터 동일 거리에 형성된다.1 to 3, the probe device of the present invention has a disk-shaped printed circuit board 100. A pair of electrode portions 101 are formed at predetermined positions on both sides of the printed circuit board 100. Here, the pair of electrode portions 101 are formed at the same distance from the center of the printed circuit board 100.
상기 인쇄 회로 기판(100)의 상면 중앙부에는 지지부(200)가 적층된다. 상기 지지부(200)는 상기 인쇄 회로 기판(100)의 상면에 적층되는 지지 블럭(210)과, 상기 지지 블럭(210)의 상면에 적층되는 탄성 패드(220)로 구성된다.The support part 200 is stacked at the center of the upper surface of the printed circuit board 100. The support part 200 includes a support block 210 stacked on an upper surface of the printed circuit board 100 and an elastic pad 220 stacked on an upper surface of the support block 210.
여기서, 상기 지지 블럭(210)은 세라믹 재질로 이루어진다. 따라서, 상기 지지 블럭(210)은 절연성을 갖는다. 또한, 상기 지지 블럭(210)의 사방 모서리부는 테이퍼 지도록 형성되는 것이 좋다. 따라서, 상기 테이퍼 짐은 하기에 기술되는 메인 고정부(300)가 상기 지지부(200)의 외주를 감싸도록 끼워지는 경우에 용이하게 끼워질 수 있도록 안내할 수 있다.Here, the support block 210 is made of a ceramic material. Thus, the support block 210 is insulative. In addition, the four corners of the support block 210 may be formed to be tapered. Therefore, the tapered load may be guided so that the main fixing part 300 to be described below can be easily inserted when the main fixing part 300 to be wrapped to surround the outer circumference of the support part 200.
또한, 상기 탄성 패드(220)는 러버로 이루어지는 것이 좋다. 그리고, 상기 탄성 패드(220)의 두께는 상기 지지 블럭(210)의 두께 보다 일정 두께 얇게 형성된다. 여기서, 상기 탄성 패드(220)의 상면은 연성 회로 기판(400)의 저면이 밀착되는 부분이다. 따라서, 상기 연성 회로 기판(400)의 저면은 상기 탄성 패드(220)의 상면에서 밀착됨을 통하여 틀어짐이 방지될 수 있다. 그리고, 상기 탄성 패드(220)의 사방 모서리부는 상기 지지 블럭(210)과 동일하도록 테이퍼 지도록 형성된다.In addition, the elastic pad 220 is preferably made of a rubber. In addition, the thickness of the elastic pad 220 is formed to be a predetermined thickness thinner than the thickness of the support block 210. Here, the upper surface of the elastic pad 220 is a portion where the bottom surface of the flexible circuit board 400 is in close contact. Therefore, the bottom surface of the flexible circuit board 400 may be prevented from being twisted by being in close contact with the top surface of the elastic pad 220. In addition, the four corners of the elastic pad 220 are formed to be tapered to be the same as the support block 210.
또한, 도 6에 도시되는 바와 같이, 상기 지지부(200)의 지지 블럭(210) 하단부는 상기 인쇄 회로 기판(100)에 형성되는 안착홈(110)에 안착되어 고정될 수도 있다. 따라서, 상기 지지 블럭(210)은 상기 안착홈(110)에 끼워져 안착된 상태로 틀어짐이 방지될 수 있다.In addition, as shown in FIG. 6, the lower end of the support block 210 of the support part 200 may be seated and fixed to the seating groove 110 formed in the printed circuit board 100. Therefore, the support block 210 can be prevented from being inserted into the seating groove 110 and seated in the seated state.
그리고, 상기 탄성 패드(220)의 상면에 안착되는 일정 길이를 갖는 연성 회로 기판(400)의 상면에는 웨이퍼의 저면에 형성되는 솔더 범프들이 접촉되는 접속 패턴들(410)이 형성된다.In addition, connection patterns 410 are formed on the top surface of the flexible circuit board 400 having a predetermined length to be seated on the top surface of the elastic pad 220 to contact the solder bumps formed on the bottom surface of the wafer.
상기 지지부(200)의 상면, 즉, 상기 탄성 패드(220)의 상면에 안착된 연성 회로 기판(400)의 양단은 상기 지지부(200)의 양측으로 일정 길이 연장될 수 있다. 여기서, 상기 연성 회로 기판(400)의 양단은 상기 인쇄 회로 기판(100)의 상면에 형성되는 한 쌍의 전극부(101)에 접속되는 부분이다.Both ends of the flexible circuit board 400 seated on the upper surface of the support portion 200, that is, the upper surface of the elastic pad 220 may extend a predetermined length to both sides of the support portion 200. Here, both ends of the flexible circuit board 400 are portions connected to the pair of electrode portions 101 formed on the upper surface of the printed circuit board 100.
이어, 상기 지지부(200)에는 메인 고정부(300)가 끼워질 수 있다. Subsequently, the main fixing part 300 may be fitted into the support part 200.
상기 메인 고정부(300)는 상기 지지부(200)가 끼워질 수 있는 홀(310)이 형성되는 몸체로 이루어지고, 상기 홀(310)은 사각 형상의 홀로 이루어지고, 상기 홀(310)의 내측 사방 모서리부는 상기 테이퍼 지는 지지 블럭(210)의 사각 모서리부가 끼워져 밀착되도록 테이퍼 지도록 형성된다.The main fixing part 300 is formed of a body in which a hole 310 into which the support part 200 can be fitted is formed, and the hole 310 is formed of a hole having a square shape, and the inner side of the hole 310. The four corners are formed to be tapered so that the square corners of the tapered support block 210 are fitted to each other.
따라서, 상기 메인 고정부(300)의 홀(310)에는 상기 지지부(200)가 끼워져, 상기 지지부(200)의 외주가 홀(310)의 내주에 에워싸일 수 있다.Accordingly, the support part 200 may be inserted into the hole 310 of the main fixing part 300, and the outer circumference of the support part 200 may be surrounded by the inner circumference of the hole 310.
이때. 상기 연성 회로 기판(400)의 상면은 상기 탄성 패드(220)에 안착되는 상태를 이루고, 상기 탄성 패드(220)에 안착된 부분을 제외한 양측의 연성 회로 기판(400)은 상기 메인 고정부(300)의 홀(310) 내측면과 상기 지지부(200)의 테두리의 사이에 끼워져 밀착될 수 있다.At this time. The upper surface of the flexible circuit board 400 forms a state seated on the elastic pad 220, the flexible circuit board 400 on both sides except for the portion seated on the elastic pad 220 is the main fixing portion 300 It may be fitted between the inner surface of the hole 310 and the edge of the support portion 200).
그리고, 상기 연성 회로 기판(400)의 양단은 상기 메인 고정부(300)의 양측 하단을 통하여 인쇄 회로 기판(100)의 상면에 형성되는 한 쌍의 전극부(101)를 따라 일정 길이 연장되어 돌출될 수 있다. 즉, 상기 연성 회로 기판(400)의 양단은 상기 메인 고정부(300)의 양측 하단과 인쇄 회로 기판(100)의 상면의 사이를 통하여 외부로 연장될 수 있다.In addition, both ends of the flexible circuit board 400 extend a predetermined length along a pair of electrode portions 101 formed on the upper surface of the printed circuit board 100 through lower ends of both sides of the main fixing part 300. Can be. That is, both ends of the flexible circuit board 400 may extend outwardly between the lower ends of both sides of the main fixing part 300 and the upper surface of the printed circuit board 100.
여기서, 도 3 내지 도 5를 참조 하면, 상기 메인 고정부(300)의 사방 테두리부에는 상하를 관통하는 제 1위치 결정홀들(10)이 형성되고, 상기 인쇄 회로 기판(100)에는 상하를 관통하는 제 1'위치 결정홀들(11)이 형성된다.3 to 5, first positioning holes 10 penetrating up and down are formed at four edges of the main fixing part 300, and upper and lower parts are formed on the printed circuit board 100. First 'positioning holes 11 penetrating are formed.
그리고, 상기 메인 고정부(300)와 지지부(200) 및 인쇄 회로 기판(100)은 제 1위치 결정핀들(21)에 의하여 서로 고정 결합될 수 있다. 즉, 상기 제 1위치 결정핀들(21)은 상기 제 1,1'위치 결정홀들(10,11)을 관통하여 이들을 서로 결합시키는 역할을 한다.The main fixing part 300, the supporting part 200, and the printed circuit board 100 may be fixedly coupled to each other by the first positioning pins 21. That is, the first positioning pins 21 pass through the first and first 'positioning holes 10 and 11 and serve to couple them together.
이에 따라, 상기 제 1위치 결정핀들(21)의 결합력에 따라, 상기 메인 고정부(300)의 하단은 상기 연성 회로 기판(400)을 상면을 눌러 가압할 수 있고, 이때, 메인 고정부(300)의 홀(310)을 통하여 외부로 노출되는 연성 회로 기판(400)은 양측으로 일정 힘으로 당겨질 수 있다. 이에 더하여, 상기 연성 회로 기판(400)은 탄성 패드(220)에 밀착되어 안착된 상태이므로 상기 당겨지는 힘에 따라 상기 탄성 패드(220)의 상면에 일정 힘으로 가압되어 밀착될 수 있다. 이에 따라, 상기 연성 회로 기판(400)은 상기 탄성 패드(220) 상에서 1차적으로 밀착 고정될 수 있다. 여기서 상기 연성 회로 기판(400)의 상면에 형성되는 접속 패턴(410)은 홀을 통하여 노출된다.Accordingly, according to the coupling force of the first positioning pins 21, the lower end of the main fixing part 300 may press the upper surface of the flexible circuit board 400 by pressing the upper surface, and at this time, the main fixing part 300 The flexible circuit board 400 exposed to the outside through the hole 310 of FIG. 1 may be pulled with a predetermined force to both sides. In addition, since the flexible circuit board 400 is in close contact with the elastic pad 220, the flexible circuit board 400 may be pressed against the upper surface of the elastic pad 220 by a predetermined force according to the pulling force. Accordingly, the flexible circuit board 400 may be primarily tightly fixed on the elastic pad 220. Here, the connection pattern 410 formed on the upper surface of the flexible circuit board 400 is exposed through the hole.
그리고, 상기 메인 고정부(300)의 하단과 인쇄 회로 기판(100)의 상면의 사이에서 밀착되어 상기 메인 고정부(300)의 양측부로 돌출되어 연장되는 연성 회로 기판(400)의 양단은 한 쌍의 전극부(101)에 접속될 수 있다.In addition, a pair of both ends of the flexible circuit board 400 which is in close contact between the lower end of the main fixing part 300 and the upper surface of the printed circuit board 100 protrudes to both sides of the main fixing part 300. It can be connected to the electrode portion 101 of.
여기서, 상기 한 쌍의 전극부(101)에 위치되는 연성 회로 기판(400)의 양단은 서브 고정부(510)에 의하여 밀착 고정될 수 있다.Here, both ends of the flexible circuit board 400 positioned in the pair of electrode units 101 may be tightly fixed by the sub fixing unit 510.
상기 서브 고정부(510)는 상기 인쇄 회로 기판(100)의 상면에 형성되는 전극부(101)에 접속되는 연성 회로 기판(400)의 일단 상면에 위치되는 제 1러버 부재(511)와, 상기 제 1러버 부재(511)의 상면에 위치되는 제 1고정 블럭(512)으로 구성된다.The sub fixing part 510 may include a first rubber member 511 positioned on an upper surface of one end of the flexible circuit board 400 connected to the electrode part 101 formed on the upper surface of the printed circuit board 100, and The first fixing block 512 is positioned on the upper surface of the first rubber member 511.
여기서, 상기 제 1고정 블럭(512)은 상기 인쇄 회로 기판(100)에 고정된다. 상기 제 1고정 블럭(512)에는 제 2위치 결정홀들(20)이 형성된다. 상기 인쇄 회로 기판(100)에는 상기 제 2위치 결정홀들(20)과 위치가 일치되는 제 2'위치 결정홀들(21)이 형성된다. 그리고, 상기 제 2,2'위치 결정홀들(20,21)에는 제 2위치 결정핀들(22)이 끼워져 고정될 수 있다.Here, the first fixing block 512 is fixed to the printed circuit board 100. Second positioning holes 20 are formed in the first fixing block 512. The printed circuit board 100 is formed with second 'positioning holes 21 that are aligned with the second positioning holes 20. Second positioning pins 22 may be inserted into and fixed to the second and second positioning holes 20 and 21.
따라서, 상기 제 2위치 결정핀들(22)이 상기 제 2,2'위치 결정홀들(20,21)에 끼워져 고정됨으로써, 상기 제 1고정 블럭(512)은 인쇄 회로 기판(100)과 압착된다. 이때, 상기 제 1러버 부재(511)의 저면과 전극부(101)의 사이에 위치되는 연성 회로 기판(400)의 일단은 상기 제 1러버 부재(511)에 의하여 전극부(101)의 사이에서 압착 고정될 수 있다.Accordingly, the second fixing pins 22 are inserted into and fixed to the second and second 'positioning holes 20 and 21, so that the first fixing block 512 is pressed against the printed circuit board 100. . In this case, one end of the flexible circuit board 400 positioned between the bottom surface of the first rubber member 511 and the electrode portion 101 may be disposed between the electrode portions 101 by the first rubber member 511. Can be crimp fixed.
이에 더하여, 상기 연성 회로 기판(400)의 타단 역시, 상기 일단과 동일한 방식으로 압착 고정될 수 있다.In addition, the other end of the flexible circuit board 400 may also be crimped and fixed in the same manner as the one end.
따라서, 상기 연성 회로 기판(400)의 양단은 본 발명에 따르는 서브 고정부(510)에 의하여 인쇄 회로 기판(100)의 전극부(101)에 압착 고정될 수 있고, 이에 따라, 연성 회로 기판(400)은 2차적으로 고정될 수 있다.Accordingly, both ends of the flexible circuit board 400 may be pressed and fixed to the electrode unit 101 of the printed circuit board 100 by the sub fixing part 510 according to the present invention. 400 may be fixed secondary.
한편, 상기 인쇄 회로 기판(100)의 저면에는 제 1보강 블럭(610)이 더 설치된다. 상기 제 1보강 블럭(610)에는 제 3위치 결정홀들(30)이 형성되고, 상기 인쇄 회로 기판(100)의 저면부에는 상기 제 3위치 결정홀들(30)과 위치가 일치되는 제 3'위치 결정홀들(31)이 형성된다. 그리고, 상기 제 3,3'위치 결정홀들(30,31)에는 제 3위치 결정핀들(23)이 끼워질 수 있다. 따라서, 상기 제 3위치 결정핀들(23)이 상기 제 3,3'위치 결정홀들(30,31)에 끼워짐으로써, 상기 제 1보강 블럭(610)은 상기 인쇄 회로 기판(100)의 저면, 바람직하게는 지지부(200) 및 메인 고정부(300)의 저부에 고정 설치된다.Meanwhile, a first reinforcement block 610 is further provided on the bottom of the printed circuit board 100. Third positioning holes 30 are formed in the first reinforcing block 610, and a third position in which bottom positions of the printed circuit board 100 coincide with the third positioning holes 30 is provided. 'Positioning holes 31 are formed. In addition, third positioning pins 23 may be inserted into the third and third 'positioning holes 30 and 31. Accordingly, the first reinforcing blocks 610 are formed on the bottom surface of the printed circuit board 100 by inserting the third positioning pins 23 into the third and third 'positioning holes 30 and 31. Preferably, the support part 200 and the bottom of the main fixing part 300 are fixedly installed.
상기 제 1보강 블럭(610)이 설치됨에 따라, 상기 메인 고정부(300)의 홀(310)을 통하여 노출되는 연성 회로 기판(400)의 접속 패턴(410)에 웨이퍼의 솔더 범프들이 접속되는 경우에 발생될 수 있는 인쇄 회로 기판(100)의 휨 현상이 방지될 수 있다.As the first reinforcement block 610 is installed, the solder bumps of the wafer are connected to the connection pattern 410 of the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. A warpage phenomenon of the printed circuit board 100, which may be generated, may be prevented.
이에 더하여, 도면에 도시되지는 않았지만, 상기 탄성 패드(220)와 상기 지지 블럭(210)은 서로 돌기들 및 돌기들이 끼워지는 돌기홈으로 구성되는 고정 수단에 의하여 서로 고정 위치가 결정될 수 있다. 여기서, 상기 돌기들은 상기 탄성 패드(220)의 저면에, 상기 돌기홈들은 상기 지지 블럭(210)의 상면에 형성될 수도 있고, 상기와 역으로 형성될 수도 있다.In addition, although not shown in the drawings, the elastic pad 220 and the support block 210 may be fixed to each other by fixing means composed of protrusions and protrusion grooves into which the protrusions are fitted. Here, the protrusions may be formed on the bottom surface of the elastic pad 220, the protrusion grooves may be formed on the upper surface of the support block 210, or may be formed in the reverse direction.
또한, 상기 탄성 패드(220)의 상면과 상기 제 1러버 부재(511)의 상하면에는 격자 형상의 스크레치가 더 형성될 수도 있다.In addition, a lattice-shaped scratch may be further formed on the upper surface of the elastic pad 220 and the upper and lower surfaces of the first rubber member 511.
상기와 같이 구성되는 프로브 장치는 웨이퍼 솔더 범프들과 접촉되어 전기적 검사를 수행할 수 있다.The probe device configured as described above may be in contact with the wafer solder bumps to perform electrical inspection.
도 2 및 도 3을 참조 하면, 저면에 다수의 솔더 범프들이 형성되는 웨이퍼는 메인 고정부(300) 상에 안착될 수 있다. 이때, 상기 웨이퍼의 저면에 형성되는 솔더 범프들은 메인 고정부(300)의 홀(310)을 통하여 노출되는 연성 회로 기판(400) 상에 형성된 접속 패턴(410)에 물리적으로 접속될 수 있다. 따라서, 상기 솔더 범프들과 상기 접속 패턴(410)은 서로 통전되는 상태를 이룰 수 있다.2 and 3, a wafer having a plurality of solder bumps formed on a bottom surface thereof may be seated on the main fixing part 300. In this case, the solder bumps formed on the bottom surface of the wafer may be physically connected to the connection pattern 410 formed on the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. Therefore, the solder bumps and the connection pattern 410 may be in a state where they are energized with each other.
이때, 상기 접속 패턴(410)이 형성된 연성 회로 기판(400)의 저면은 탄성 패드(200)와 탄성 접촉되어 밀착되기 때문에, 웨이퍼가 메인 고정부(300)에 안착되는 경우에 발생되는 충격력이 용이하게 흡수될 수 있고, 이와 아울러, 상기 충격으로 인하여 연성 회로 기판(400)이 탄성 패드(220)의 상면에서 틀어지는 현상이 방지될 수 있다.At this time, since the bottom surface of the flexible circuit board 400 having the connection pattern 410 is in close contact with the elastic pad 200, the impact force generated when the wafer is seated on the main fixing part 300 is easy. The flexible circuit board 400 may be prevented from being twisted on the upper surface of the elastic pad 220 due to the impact.
따라서, 상기 솔더 범프들과 접속 패턴(410)의 접속 정확도는 향상될 수 있다. 이에 더하여, 상기 연성 회로 기판(400)은 메인 고정부(300)의 홀(310)과 지지부(200)의 테두리의 사이에 밀착 고정되고, 메인 고정부(300)의 하단과 인쇄 회로 기판(100)의 상면의 사이에서 압착 고정되기 때문에, 메인 고정부(300) 내부에서의 틀어짐은 다중의 고정력으로 인하여 방지될 수 있다.Therefore, the connection accuracy of the solder bumps and the connection pattern 410 may be improved. In addition, the flexible circuit board 400 is tightly fixed between the hole 310 of the main fixing part 300 and the edge of the support part 200, and the lower end of the main fixing part 300 and the printed circuit board 100. Since the compression is fixed between the upper surface of the), the distortion inside the main fixing part 300 can be prevented due to multiple fixing forces.
또한, 인쇄 회로 기판(100)의 상면에 형성되는 한 쌍의 전극부(101)와 접속되는 연성 회로 기판(400)의 양단은 서브 고정부(510)의 제 1러버 부재(511)에 의하여 탄성 압착되기 때문에, 상기 연성 회로 기판(400)의 양단 역시 틀어짐이 용이하게 방지될 수 있다.In addition, both ends of the flexible circuit board 400 connected to the pair of electrode parts 101 formed on the upper surface of the printed circuit board 100 are elastic by the first rubber member 511 of the sub fixing part 510. Since it is compressed, both ends of the flexible circuit board 400 may also be easily prevented from being twisted.
상기와 같이, 웨이퍼와 직접적으로 접속되는 부분(메인 고정부(300)의 홀(310)을 통하여 노출되는 접속 패턴(410)이 형성된 연성 회로 기판(400))과, 연성 회로 기판(400)의 양단이 상기와 같이 용이하게 압착 고정되기 때문에, 전기적 테스트를 수행하는 경우에 안정적인 테스트 환경을 제공하여 보다 정밀한 전기적 테스트를 가능하게 할 수 있다.As described above, the portion directly connected to the wafer (the flexible circuit board 400 having the connection pattern 410 exposed through the hole 310 of the main fixing part 300) and the flexible circuit board 400 Since both ends are easily crimped and fixed as described above, it is possible to provide a stable test environment in the case of performing the electrical test to enable a more precise electrical test.
[제 2실시예]Second Embodiment
본 발명의 제 2실시예를 따르는 웨이퍼 솔더 범프용 프로브 장치를 설명하도록 한다.A probe apparatus for a wafer solder bump according to a second embodiment of the present invention will be described.
도 7은 본 발명의 제 2실시예를 따르는 웨이퍼 솔더 범프용 프로브 장치를 보여주는 분해 사시도이다. 도 8은 도 7의 웨이퍼 솔더 범프용 프로브 장치를 보여주는 단면도이다. 도 9는 도 8의 표시 부호 C를 보여주는 확대 단면도이다. 도 10은 도 8의 표시 부호 D를 보여주는 확대 단면도이다. 7 is an exploded perspective view showing a probe device for a wafer solder bump according to a second embodiment of the present invention. FIG. 8 is a cross-sectional view illustrating the probe apparatus for the wafer solder bumps of FIG. 7. FIG. 9 is an enlarged cross-sectional view showing a display symbol C of FIG. 8. FIG. 10 is an enlarged cross-sectional view showing a display symbol D of FIG. 8.
도 7 및 도 8을 참조 하면, 상기 제 2실시예를 따르는 프로브 장치는 인쇄 회로 기판(100)을 갖는다. 여기서, 상기 인쇄 회로 기판(100)의 저면의 양측 일정 부분에는 한 쌍의 전극부(101)가 형성된다. 상기 한 쌍의 전극부(101)는 상기 인쇄 회로 기판(100)의 중앙으로부터 서로 동일 거리에 위치된다.7 and 8, the probe device according to the second embodiment has a printed circuit board 100. Here, a pair of electrode portions 101 are formed on both side portions of the bottom surface of the printed circuit board 100. The pair of electrode portions 101 are positioned at the same distance from each other from the center of the printed circuit board 100.
그리고, 상기 제 1실시예에서 언급된 메인 고정부(300)와 지지부(200)는 상기 인쇄 회로 기판(100)의 중앙부 상면에 위치된다. 여기서, 상기 메인 고정부(300)와 상기 지지부(200)의 구성은 상기 제 1실시예의 구성과 동일할 수 있다.In addition, the main fixing part 300 and the supporting part 200 mentioned in the first embodiment are located on the upper surface of the central part of the printed circuit board 100. Here, the configuration of the main fixing part 300 and the support 200 may be the same as the configuration of the first embodiment.
또한, 상기 지지부(200)의 지지 블럭(210) 하단부 역시 도 6에 도시되는 상기 인쇄 회로 기판(100)에 형성되는 안착홈(110)에 안착되어 고정될 수 있다.In addition, the lower end of the support block 210 of the support 200 may also be fixed to the seating groove 110 formed in the printed circuit board 100 shown in FIG.
특히, 상기 메인 고정부(300)의 양측부에는 상기 인쇄 회로 기판(100)의 상하를 관통하는 슬릿 형상의 한 쌍의 관통홀(120)이 형성된다. 상기 관통홀들(120) 각각은 상기 메인 고정부(300) 및 지지부(200)의 사이에 끼워져 고정되고 메인 고정부(300)의 하단을 통하여 메인 고정부(300)의 양측부로부터 돌출 연장되는 연성 회로 기판(400)이 끼워져 관통하도록 안내하는 홀이다.In particular, a pair of slit-shaped through holes 120 penetrating the top and bottom of the printed circuit board 100 are formed at both sides of the main fixing part 300. Each of the through holes 120 is sandwiched and fixed between the main fixing part 300 and the supporting part 200, and protrudes from both sides of the main fixing part 300 through a lower end of the main fixing part 300. The flexible circuit board 400 is inserted into and guides through.
따라서, 상기 연성 회로 기판(400)의 양단은 상기 한 쌍의 관통홀(120) 각각을 관통하여 인쇄 회로 기판(100)의 저면부로 돌출될 수 있다.Accordingly, both ends of the flexible circuit board 400 may pass through each of the pair of through holes 120 to protrude toward the bottom of the printed circuit board 100.
그리고, 상기 인쇄 회로 기판(100)의 저면부로 돌출되는 연성 회로 기판(400)의 양단은 상기 인쇄 회로 기판(100)의 전극부들(101) 각각에서 서브 고정부(520)를 통하여 압착 고정될 수 있다.In addition, both ends of the flexible circuit board 400 protruding to the bottom portion of the printed circuit board 100 may be pressed and fixed through the sub fixing part 520 in each of the electrode parts 101 of the printed circuit board 100. have.
여기서, 상기 연성 회로 기판(400)의 일단은 상기 인쇄 회로 기판(100)의 저면에 형성되는 전극부(101)에 접속된다. 그리고, 서브 고정부(520)의 제 2러버 부재(521)는 상기 인쇄 회로 기판(100)의 일단 저면에 밀착될 수 있다. 또한, 상기 서브 고정부(520)의 제 2고정 블럭(522)은 상기 제 2러버 부재(521)의 저면에 밀착되는 상태로 상기 제 2러버 부재(521)를 압착할 수 있도록 인쇄 회로 기판(100)의 저면부에 고정된다. 따라서, 상기 연성 회로 기판(400)의 일단은 전극부(101)와 압착 고정될 수 있다.Here, one end of the flexible circuit board 400 is connected to the electrode portion 101 formed on the bottom surface of the printed circuit board 100. In addition, the second rubber member 521 of the sub fixing part 520 may be in close contact with the bottom of one end of the printed circuit board 100. Also, the second fixing block 522 of the sub fixing part 520 may press the second rubber member 521 in a state of being in close contact with the bottom surface of the second rubber member 521. It is fixed to the bottom part of 100). Therefore, one end of the flexible circuit board 400 may be fixed to the electrode unit 101 by compression.
여기서, 도 8 내지 도 10을 참조 하면, 상기 제 2고정 블럭(522)에는 제 4위치 결정홀들(40)이 형성되고, 상기 인쇄 회로 기판(100)의 저면부에는 상기 제 4위치 결정홀들(40)과 위치가 일치되는 제 4'위치 결정홀들(41)이 형성된다. 그리고, 상기 제 4,4'위치 결정홀들(40,41)에는 제 4위치결정핀들(24)이 끼워져 고정될 수 있다.8 to 10, fourth positioning holes 40 are formed in the second fixing block 522, and the fourth positioning holes are formed in the bottom portion of the printed circuit board 100. Fourth positioning holes 41 are formed to coincide with the positions 40. The fourth positioning pins 24 may be inserted into and fixed to the fourth and fourth 'positioning holes 40 and 41.
따라서, 상기 제 4위치 결정핀들(24)이 상기 제 4,4'위치 결정홀들(40,41)에 끼워져 고정됨으로써 상기 서브 고정부(520)는 상기 연성 회로 기판(400)의 일단을 전극부(101)와 압착 고정시킬 수 있다.Accordingly, the fourth fixing pins 24 are inserted into and fixed to the fourth and fourth 'positioning holes 40 and 41, so that the sub fixing part 520 has one end of the flexible circuit board 400 as an electrode. The part 101 can be fixed by compression.
또한, 상기 연성 회로 기판(400)의 타단 역시 상기와 동일한 방식으로 압착 고정되기 때문에, 이하의 설명을 생략하기로 한다.In addition, since the other end of the flexible circuit board 400 is also crimped and fixed in the same manner as described above, the following description will be omitted.
한편, 상기 인쇄 회로 기판(100)의 저면에는 제 2보강 블럭(620)이 더 설치된다. 상기 제 2보강 블럭(620)에는 제 5위치 결정홀들(50)이 형성되고, 상기 인쇄 회로 기판(100)의 저면부에는 상기 제 5위치 결정홀들(50)과 위치가 일치되는 제 5'위치 결정홀들(51)이 형성된다. 그리고, 상기 제 5,5'위치 결정홀들(50,51)에는 제 5위치 결정핀들(25)이 끼워질 수 있다. 따라서, 상기 제 5위치 결정핀들(25)이 상기 제 5,5'위치 결정홀들(50,51)에 끼워짐으로써, 상기 제 2보강 블럭(620)은 상기 인쇄 회로 기판(100)의 저면, 바람직하게는 지지부(200) 및 메인 고정부(300)의 저부에 고정 설치된다.Meanwhile, a second reinforcement block 620 is further provided on the bottom of the printed circuit board 100. Fifth positioning holes 50 are formed in the second reinforcement block 620, and a fifth position in which the bottom portion of the printed circuit board 100 coincides with the fifth positioning holes 50. 'Positioning holes 51 are formed. The fifth positioning pins 25 may be inserted into the fifth and fifth 'positioning holes 50 and 51. Therefore, the fifth reinforcing pins 25 are inserted into the fifth and fifth 'positioning holes 50 and 51 so that the second reinforcement block 620 is formed on the bottom surface of the printed circuit board 100. Preferably, the support part 200 and the bottom of the main fixing part 300 are fixedly installed.
상기 제 2보강 블럭(620)이 설치됨에 따라, 상기 메인 고정부(300)의 홀(310)을 통하여 노출되는 연성 회로 기판(400)의 접속 패턴(410)에 웨이퍼의 솔더 범프들이 접속되는 경우에 발생될 수 있는 인쇄 회로 기판(100)의 휨 현상이 방지될 수 있다.When the solder bumps of the wafer are connected to the connection pattern 410 of the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300 as the second reinforcement block 620 is installed. A warpage phenomenon of the printed circuit board 100, which may be generated, may be prevented.
따라서, 상기 연성 회로 기판(400)은 다중으로 압착 고정될 수 있다. 즉, 상기 연성 회로 기판(400)은 메인 고정부(300) 내에서 탄성 패드(220)에 의하여 압착 고정되고, 메인 고정부(300)의 홀(310) 내측면과 지지부(200)의 테두리의 사이에서 밀착 고정되며, 상기 메인 고정부(300)의 하단과 인쇄 회로 기판(100)의 상면 사이에서 밀착 고정되고, 상기 관통홀(120)을 통하여 인쇄 회로 기판(100)의 저면부로 관통되어 인쇄 회로 기판(100)의 저면에 밀착되는 상태로 전극부(101)에서 서브 고정부(520)에 의하여 압착 고정된다.Therefore, the flexible circuit board 400 may be crimped and fixed in multiple. That is, the flexible circuit board 400 is crimped and fixed by the elastic pad 220 in the main fixing part 300, and the inner surface of the hole 310 of the main fixing part 300 and the edge of the support part 200. It is tightly fixed between, and tightly fixed between the lower end of the main fixing part 300 and the upper surface of the printed circuit board 100, and penetrates through the through hole 120 to the bottom of the printed circuit board 100 to print In the state of being in close contact with the bottom surface of the circuit board 100 is pressed by the sub fixing part 520 in the electrode portion 101.
한편, 도면에 도시되지는 않았지만, 상기 관통홀(120)의 내벽에는 일정 두께의 탄성층이 더 형성될 수도 있다. 그리고, 상기 관통홀들(120)의 하단 모서리는 일정 곡률로 벤딩 형성될 수도 있다. 따라서, 상기 탄성층에 의하여 연성 회로 기판(400)의 외면을 보호함과 아울러, 상기 벤딩되는 부분을 통하여 관통홀(120)을 관통하여 벤딩되는 연성 회로 기판(400)의 외면 손상을 방지할 수도 있다.Although not shown in the drawings, an elastic layer having a predetermined thickness may be further formed on the inner wall of the through hole 120. The bottom edges of the through holes 120 may be bent at a predetermined curvature. Therefore, the outer surface of the flexible circuit board 400 may be protected by the elastic layer and the outer surface of the flexible circuit board 400 bent through the through hole 120 may be prevented through the bent portion. have.
상기와 같이 구성되는 프로브 장치는 웨이퍼 솔더 범프들과 접촉되어 전기적 검사를 수행할 수 있다.The probe device configured as described above may be in contact with the wafer solder bumps to perform electrical inspection.
도 7 및 도 8을 참조 하면, 저면에 다수의 솔더 범프들이 형성되는 웨이퍼는 메인 고정부(300) 상에 안착될 수 있다. 이때, 상기 웨이퍼의 저면에 형성되는 솔더 범프들은 메인 고정부(300)의 홀(310)을 통하여 노출되는 연성 회로 기판(400) 상에 형성된 접속 패턴(410)에 물리적으로 접속될 수 있다. 따라서, 상기 솔더 범프들과 상기 접속 패턴(410)은 서로 통전되는 상태를 이룰 수 있다.7 and 8, a wafer having a plurality of solder bumps formed on a bottom surface thereof may be seated on the main fixing part 300. In this case, the solder bumps formed on the bottom surface of the wafer may be physically connected to the connection pattern 410 formed on the flexible circuit board 400 exposed through the hole 310 of the main fixing part 300. Therefore, the solder bumps and the connection pattern 410 may be in a state where they are energized with each other.
이때, 상기 접속 패턴(410)이 형성된 연성 회로 기판(400)의 저면은 탄성 패드(220)와 탄성 접촉되기 때문에, 웨이퍼가 메인 고정부(300)에 안착되는 경우에 발생되는 충격력이 용이하게 흡수될 수 있고, 이와 아울러, 상기 충격으로 인하여 연성 회로 기판(400)이 틀어지는 현상이 방지될 수 있다. 따라서, 상기 솔더 범프들과 접속 패턴(410)의 접속 정확도는 향상될 수 있다. 이에 더하여, 상기 연성 회로 기판(400)은 메인 고정부(300)의 홀(310)과 지지부(200)의 테두리의 사이에 밀착 고정되고, 메인 고정부(300)의 하단과 인쇄 회로 기판(100)의 상면의 사이에서 압착 고정되기 때문에, 메인 고정부(300) 내부에서의 틀어짐은 다중의 고정력으로 인하여 방지될 수 있다.At this time, since the bottom surface of the flexible circuit board 400 on which the connection pattern 410 is formed is elastically contacted with the elastic pad 220, the impact force generated when the wafer is seated on the main fixing part 300 is easily absorbed. In addition, a phenomenon in which the flexible circuit board 400 is distorted due to the impact may be prevented. Therefore, the connection accuracy of the solder bumps and the connection pattern 410 may be improved. In addition, the flexible circuit board 400 is tightly fixed between the hole 310 of the main fixing part 300 and the edge of the support part 200, and the lower end of the main fixing part 300 and the printed circuit board 100. Since the compression is fixed between the upper surface of the), the distortion inside the main fixing part 300 can be prevented due to multiple fixing forces.
또한, 인쇄 회로 기판(100)의 저면에 형성되는 한 쌍의 전극부(101)와 접속되는 연성 회로 기판(400)의 양단은 관통홀들(120)을 통하여 인쇄 회로 기판(100)의 저면부로 관통되는 상태에서 서브 고정부(520)의 제 2러버 부재(521)에 의하여 탄성 압착되기 때문에, 상기 연성 회로 기판(400)의 양단 역시 틀어짐이 용이하게 방지될 수 있다.In addition, both ends of the flexible circuit board 400 connected to the pair of electrode portions 101 formed on the bottom surface of the printed circuit board 100 may pass through the through holes 120 to the bottom surface portion of the printed circuit board 100. Since it is elastically compressed by the second rubber member 521 of the sub fixing part 520 in the penetrating state, both ends of the flexible circuit board 400 may also be easily prevented from twisting.
특히, 상기 연성 회로 기판(400)의 양단이 인쇄 회로 기판(100)의 저면을 통하여 전극부(101)와 접속되기 때문에, 전극부(101) 및 연성 회로 기판(400)의 양단이 인쇄 회로 기판(100)의 상면에 노출되지 않을 수 있다. 이에 따라, 외부의 이물질은 전극부(101) 및 연성 회로 기판(400)의 양단의 사이에 쉽게 끼이지 않도록 할 수 있기 때문에, 이물질로 인한 전기적 특성의 하락을 방지할 수 있다.In particular, since both ends of the flexible circuit board 400 are connected to the electrode unit 101 through the bottom surface of the printed circuit board 100, both ends of the electrode unit 101 and the flexible circuit board 400 are connected to the printed circuit board. It may not be exposed to the upper surface of the (100). Accordingly, the foreign matter can be prevented from being easily caught between the electrode portion 101 and both ends of the flexible circuit board 400, thereby preventing the deterioration of electrical characteristics due to the foreign matter.
상기와 같이, 웨이퍼와 직접적으로 접속되는 부분(메인 고정부(300)의 홀(310)을 통하여 노출되는 접속 패턴(410)이 형성된 연성 회로 기판(400))과, 연성 회로 기판(400)의 양단이 인쇄 회로 기판(100)의 저면에서 상기와 같이 용이하게 압착 고정되기 때문에, 전기적 테스트를 수행하는 경우에 안정적인 테스트 환경을 제공하여 보다 정밀한 전기적 테스트를 가능하게 할 수 있다.As described above, the portion directly connected to the wafer (the flexible circuit board 400 having the connection pattern 410 exposed through the hole 310 of the main fixing part 300) and the flexible circuit board 400 Since both ends are easily pressed and fixed on the bottom of the printed circuit board 100 as described above, it is possible to provide a stable test environment in the case of performing the electrical test to enable a more precise electrical test.
이상 설명한 바와 같이, 본 발명의 상세한 설명에서는 본 발명의 바람직한 실시예에 관하여 설명하였으나, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형 가능함은 물론이다.As described above, in the detailed description of the present invention has been described with respect to preferred embodiments of the present invention, those skilled in the art to which the present invention pertains various modifications can be made without departing from the scope of the invention Of course.
따라서 본 발명의 권리 범위는 설명된 실시 예에 국한되어 정해져서는 아니되며, 후술하는 특허 청구 범위뿐만 아니라, 이 특허 청구 범위와 균등한 것들에 의해 정해져야 한다.Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by the equivalents of the claims.
본 발명은 반도체 테스트를 위한 프로브 장치의 개발 분야에 이용될 수있다. The invention can be used in the field of development of probe devices for semiconductor testing.

Claims (10)

  1. 인쇄 회로 기판의 상면에 적층되는 지지부;A support part laminated on an upper surface of the printed circuit board;
    웨이퍼에 형성되는 솔더 범프들에 접속되는 접속 패턴이 형성되고, 일정 길이를 갖고, 저면이 상기 지지부의 상면에 안착되고 양단이 상기 인쇄 회로 기판의 일정 부분에 전기적으로 접속되는 연성 회로 기판;A flexible circuit board having a connection pattern connected to solder bumps formed on the wafer, the flexible circuit board having a predetermined length, a bottom surface of which is seated on an upper surface of the support, and both ends of which are electrically connected to a portion of the printed circuit board;
    상기 지지부의 테두리에 끼워지고, 상기 연성 회로 기판이 상기 지지부의 외면에 밀착되도록 고정하는 메인 고정부; 및A main fixing part fitted to an edge of the support part and fixing the flexible circuit board to be in close contact with an outer surface of the support part; And
    상기 인쇄 회로 기판에 마련되며, 상기 연성 회로 기판의 양단을 탄성력을 사용하여 밀착 고정하는 서브 고정부를 포함하는 웨이퍼 솔더 범프용 프로브 장치.Probe apparatus for a wafer solder bump provided on the printed circuit board, including a sub-fixing portion for tightly fixing both ends of the flexible circuit board using an elastic force.
  2. 제 1항에 있어서, 상기 지지부는,The method of claim 1, wherein the support portion,
    세라믹으로 이루어지며 상기 인쇄 회로 기판의 상면에 고정되는 사각 판상의 지지 블럭과, 상기 지지 블럭의 상면에 적층되고 탄성재로 이루어지며 상면이 상기 연성 회로 기판의 저면에 밀착되는 탄성 패드를 구비하는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.A rectangular plate support block made of ceramic and fixed to an upper surface of the printed circuit board, and an elastic pad laminated on an upper surface of the support block and made of an elastic material, the upper surface of which is in close contact with the bottom surface of the flexible circuit board. A probe device for wafer solder bumps, characterized by the above-mentioned.
  3. 제 2항에 있어서,The method of claim 2,
    상기 인쇄 회로 기판의 상면에는 일정 깊이의 안착홈이 더 형성되고,A mounting groove having a predetermined depth is further formed on the upper surface of the printed circuit board,
    상기 지지 블럭의 하단부는 상기 안착홈에 끼워져 안착되는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.The lower end of the support block is probe device for wafer solder bumps, characterized in that seated in the mounting groove.
  4. 제 1항에 있어서, 상기 메인 고정부는,The method of claim 1, wherein the main fixing unit,
    상기 지지부의 테두리에 끼워지는 홀이 형성되는 몸체로 형성되고,Is formed of a body formed with a hole to be fitted to the edge of the support,
    상기 연성 회로 기판은 상기 홀의 내측면과 상기 지지부의 테두리의 사이에서 압착되는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.And said flexible circuit board is crimped between the inner surface of said hole and the edge of said support portion.
  5. 제 1항에 있어서,The method of claim 1,
    상기 연성 회로 기판의 양단은 상기 인쇄 회로 기판의 상면에 형성되는 전극에 접속되고,Both ends of the flexible circuit board are connected to an electrode formed on an upper surface of the printed circuit board,
    상기 서브 고정부는,The sub fixing part,
    상기 연성 회로 기판의 양단 상면에 적층되는 제 1러버 부재와, 상기 제 1러버 부재의 상면에 적층되며 상기 인쇄 회로 기판에 고정되는 제 1고정 블럭을 구비하는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.And a first rubber member laminated on upper surfaces of both ends of the flexible circuit board, and a first fixing block laminated on the upper surface of the first rubber member and fixed to the printed circuit board. .
  6. 제 1항에 있어서,The method of claim 1,
    상기 인쇄 회로 기판의 저면에는 제 1보강 블럭이 더 배치되되,The first reinforcement block is further disposed on the bottom surface of the printed circuit board,
    상기 제 1보강 블럭은 상기 인쇄 회로 기판의 저면부와 볼트 체결되어 고정되는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.And the first reinforcing block is bolted to and fixed to the bottom of the printed circuit board.
  7. 제 1항에 있어서,The method of claim 1,
    상기 인쇄 회로 기판에는 상기 메인 고정부의 양측부에서 상기 인쇄 회로 기판을 관통하는 한 쌍의 관통홀이 더 형성되고,The printed circuit board further includes a pair of through holes penetrating the printed circuit board at both sides of the main fixing part.
    상기 연성 회로 기판의 양단은 상기 한 쌍의 관통홀을 관통하여 상기 인쇄 회로 기판의 저면에 형성되는 전극에 전기적으로 접속되는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.And both ends of the flexible circuit board are electrically connected to electrodes formed on a bottom surface of the printed circuit board through the pair of through holes.
  8. 제 7항에 있어서,The method of claim 7, wherein
    상기 한 쌍의 관통홀은 일정 폭과 너비를 갖는 상기 연성 회로 기판이 관통되도록 슬릿 형상으로 형성되는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.And the pair of through holes is formed in a slit shape so that the flexible circuit board having a predetermined width and width passes therethrough.
  9. 제 7항에 있어서,The method of claim 7, wherein
    상기 서브 고정부는 The sub fixing part
    상기 연성 회로 기판의 양단 저면에 밀착되는 제 2러버 부재와, 상기 제 2러버 부재의 저면에 밀착되며 상기 인쇄 회로 기판에 고정되는 제 2고정 블럭을 구비하는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.And a second rubber member in close contact with bottom surfaces of both ends of the flexible circuit board, and a second fixing block in close contact with the bottom surface of the second rubber member and fixed to the printed circuit board. .
  10. 제 7항에 있어서,The method of claim 7, wherein
    상기 인쇄 회로 기판의 저면에는 제 2보강 블럭이 더 배치되되,The second reinforcement block is further disposed on the bottom of the printed circuit board,
    상기 제 2보강 블럭은 상기 인쇄 회로 기판의 저면부와 볼트 체결되어 고정되는 것을 특징으로 하는 웨이퍼 솔더 범프용 프로브 장치.And the second reinforcing block is bolted to and fixed to the bottom of the printed circuit board.
PCT/KR2010/008877 2009-12-15 2010-12-13 Probe apparatus for a wafer solder bump WO2011074837A2 (en)

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KR1020090124547A KR101108479B1 (en) 2009-12-15 2009-12-15 Probe apparatus for wafer solder bump

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CN106679433A (en) * 2016-12-24 2017-05-17 信宜市翔胜家电科技有限公司 Fixing structure for ceramic stove and circuit board

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JP2005140677A (en) * 2003-11-07 2005-06-02 Japan Electronic Materials Corp Probe sheet and probe sheet unit using the same
KR20090017385A (en) * 2007-12-06 2009-02-18 주식회사 파이컴 Apparatus for inspecting electric condition
KR20090019384A (en) * 2007-08-21 2009-02-25 주식회사 세지 Probe card of semiconductor wafer inspector

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JP2005140677A (en) * 2003-11-07 2005-06-02 Japan Electronic Materials Corp Probe sheet and probe sheet unit using the same
KR20090019384A (en) * 2007-08-21 2009-02-25 주식회사 세지 Probe card of semiconductor wafer inspector
KR20090017385A (en) * 2007-12-06 2009-02-18 주식회사 파이컴 Apparatus for inspecting electric condition

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