WO2011062222A1 - Procédé de production de poudre de brasage - Google Patents

Procédé de production de poudre de brasage Download PDF

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Publication number
WO2011062222A1
WO2011062222A1 PCT/JP2010/070563 JP2010070563W WO2011062222A1 WO 2011062222 A1 WO2011062222 A1 WO 2011062222A1 JP 2010070563 W JP2010070563 W JP 2010070563W WO 2011062222 A1 WO2011062222 A1 WO 2011062222A1
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WIPO (PCT)
Prior art keywords
solder powder
mixture
aqueous solvent
solder
melting point
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PCT/JP2010/070563
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English (en)
Japanese (ja)
Inventor
雄一 石川
Original Assignee
Ｄｏｗａホールディングス株式会社
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Publication of WO2011062222A1 publication Critical patent/WO2011062222A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B22F2009/041—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by mechanical alloying, e.g. blending, milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B22F2009/042—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling using a particular milling fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B22F2009/049—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by pulverising at particular temperature

Definitions

  • the present invention relates to a method for producing solder powder having a fine particle size.
  • the downsizing of electronic devices such as mobile communication devices is progressing, and the downsizing of electronic components and electronic circuits incorporated therein is expected, and this trend will continue in the future.
  • the size of parts and circuits that use solder paste mixed with solder powder is becoming smaller, and it is necessary for fine pitch soldering technology that supports line widths and diameters of about 100 ⁇ m in substrate through holes and IC chip wiring.
  • a suitable solder paste is needed.
  • the average particle size of the solder powder blended in the solder paste used may be desired to be 5 ⁇ m or less.
  • solder powder having an average particle size of less than 3 ⁇ m and an average particle size of less than 1 ⁇ m is required as a solder powder to be blended in the solder paste. Is thought to increase.
  • solder powders have been manufactured by a disk atomizing method or a gas atomizing method, but it has been difficult to obtain a solder powder having an average particle size of 10 ⁇ m or less by these methods.
  • Patent Document 1 describes that solder powder having an average particle size of 5 ⁇ m or less can be obtained by adjusting the manufacturing conditions even in the gas atomization method.
  • solder powder having an average particle size of 4 ⁇ m or less was obtained by the disk atomizing method or the gas atomizing method.
  • Patent Document 2 describes a method of obtaining solder powder by stirring oil and solder melt.
  • Patent Document 3 describes a method for producing a reflow solder having a fine particle shape, but no solder powder having an average particle diameter of less than 3 ⁇ m is obtained in any of the documents.
  • JP 2004-098118 A Japanese translation of PCT publication No. 2002-519509 German Patent Application Publication No. 4402042
  • an object of the present invention is to provide a method for producing solder powder, which can efficiently obtain solder powder having an average particle size of 0.05 ⁇ m or more and less than 3 ⁇ m with a stable yield.
  • the present inventors put a solid or liquid metal, a non-aqueous solvent, and a grinding ball having a diameter of 0.05 mm to 5 mm in a container, The mixture is heated to 150 ° C. or higher and stirred, and then the balls for pulverization are separated from the mixture to obtain a mixture of solder powder and non-aqueous solvent, and the mixture of solder powder and non-aqueous solvent.
  • a solder powder having an average particle size of 0.05 ⁇ m or more and less than 3 ⁇ m can be obtained, and the present invention has been completed.
  • a method for producing solder powder which includes a step of solid-liquid separation of a mixture of solder powder and a non-aqueous solvent to obtain solder powder.
  • the boiling point of the non-aqueous solvent may be 150 ° C. or higher.
  • the non-aqueous solvent may be an organic solvent having an aldehyde group or a hydroxy group.
  • the non-aqueous solvent may be an organic solvent containing at least one of a primary amino group, a secondary amino group, or a tertiary amino group.
  • the stirring step may be performed by rotating the blade at a peripheral speed of 200 cm / second to 20000 cm / second.
  • the solid-liquid separation may be performed by centrifugation or a filter press. Further, after solid-liquid separation of the mixture of the solder powder and the non-aqueous solvent, the solder powder may be washed with an organic solvent having a boiling point of 150 ° C. or less.
  • the volume of the metal may be 0.1 volume% to 20 volume% of the volume of the non-aqueous solvent.
  • the solder powder that can be used as a solder paste material that meets the requirements of fine pitch soldering technology, which has an average particle size of less than 3 ⁇ m and is expected to become more sophisticated in the future, is stable. Can be obtained efficiently with a high yield.
  • alloy composition of the solder powder in the present invention various solder alloys can be used.
  • an alloy containing 90 mass% to 99.9 mass% of Sn and 0.05 mass% to 10 mass% of Ag can be cited. In this case, it is also possible to obtain lead-free solder powder that does not contain lead.
  • an alloy containing 50 mass% to 90 mass% of Sn and 10 mass% to 50 mass% of Pb can be mentioned.
  • solder powder having a low melting point can be obtained. The low melting point is advantageous in applying the production method of the present invention in which stirring is performed in a solvent.
  • the alloy may contain one or more elements such as copper, zinc, bismuth, indium, and antimony as necessary.
  • the average particle size of the solder powder is preferably 0.05 ⁇ m or more and less than 3 ⁇ m. If it is 3 ⁇ m or more, it may not fully meet the requirements of fine pitch soldering technology, and solder powder of less than 0.05 ⁇ m has high surface activity and may cause problems due to alteration such as oxidation. In order to meet the demand level of fine pitch soldering technology due to further miniaturization of electronic components and electronic circuits, the average particle size of the solder powder is more preferably less than 1 ⁇ m, and 0.7 ⁇ m or less. More preferably.
  • solder powder having an average particle size of less than 3 ⁇ m can be efficiently produced with a stable yield by going through the following steps.
  • a solder alloy having the same metal composition as the solder powder to be obtained for example, Sn containing 90 mass% to 99.9 mass% and Ag containing 0.05 mass% to 10 mass%, A solder alloy containing 50% by mass to 90% by mass of Sn and 10% by mass to 50% by mass of Pb, or a mixture of metals used as raw materials for these solder alloys can be used.
  • an alloy In order to make it easier to obtain solder powder having a uniform metal composition, it is preferable to use an alloy.
  • the non-aqueous solvent in the present invention preferably has a boiling point of 150 ° C. or higher, and particularly preferably has a boiling point of 200 ° C. or higher.
  • a boiling point higher than the melting point of the solder powder to be obtained it is preferable to have a boiling point higher than the melting point of the solder powder to be obtained as a non-aqueous solvent, but by using a pressure vessel as a vessel for stirring, the atmospheric pressure It is possible to use a non-aqueous solvent whose boiling point at normal pressure is lower than the melting point of the solder powder.
  • the boiling point is desirably higher by 10 ° C. than the melting temperature of the solder powder to be obtained.
  • the solder powder reacts with oxygen and easily forms an oxide on the surface, so that a solvent having a reducing property is more preferable.
  • an alcohol solvent having a boiling point in the range of 150 ° C. to 400 ° C. is an example of such a non-aqueous solvent.
  • a non-aqueous solvent has a boiling point of 220 in order to obtain finely divided solder powder. It is preferable that the temperature is higher than or equal to ° C, more preferably higher than or equal to 250 ° C.
  • the non-aqueous solvent includes a monohydric alcohol or a dihydric alcohol glycol.
  • the monohydric alcohol include butyl alcohol, amyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, decyl alcohol, nonyl alcohol, cyclopentanol, benzyl alcohol, and cinnamyl alcohol.
  • glycol solvents include glycerin, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, trimethylene glycol, butanediol, pentanediol, hexanediol, heptanediol, octanediol, nonanediol, decanediol, benzpinacol, hydro Benzoyl, cyclopentadiol, cyclohexanediol, cyclohexanediol, glycolic acid amide, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol monoethyl ether, diethylene glycol dibutyl ether, acetic acid diethylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, etc.
  • glycol solvents include glycerin, ethylene glycol, diethylene glycol, triethylene glyco
  • glycols and diols are preferable because they have two hydroxyl groups and thus have polarity and contribute to the dispersibility of the powder.
  • examples of such a solvent include —CH 2 —CHOH, or —CHR—CHOH, —CR 1 R 2 —CHOH, ⁇ CHCHOH, ⁇ CRCHOH (R, R 1 , R 2 : side chain) in the molecule.
  • the boiling point of the solvent is at least 100 ° C. or higher.
  • organic compounds having an aldehyde group —CHO have the same effect.
  • aliphatic saturated aldehydes such as lauric aldehyde, tridecyl aldehyde, myristic aldehyde, capron aldehyde, heptaldehyde, pentadecyl aldehyde, palmitic aldehyde, marga aldehyde
  • aliphatic aldehydes such as succindialdehyde, aliphatic unsaturated aldehydes such as crotonaldehyde, and aromatic aldehydes such as benzaldehyde, tolualdehyde, salicylaldehyde, and cinnamaldehyde.
  • amine-based reducing solvents include hexylamine, hebutinamine, octylamine, undecylamine, tridecylamine, tetradecylamine, pentadecylamine, cetylamine, dibutylamine, diamylamine, cyclohexylamine, aniline, naphthylamine, and toluidine. is there.
  • ⁇ Crushing ball> As the grinding balls used in the present invention, alumina balls, zirconia balls, mullite balls, glass balls, metallic stainless balls, iron balls, etc. using ceramics can be used, and the material is not particularly limited. Nonetheless, zirconia, alumina, and stainless steel are particularly suitable as the material for the ball for pulverization, which has the advantages of high durability and low contamination of solder powder.
  • the grinding balls preferably have a particle size of 0.05 mm to 5 mm. If only pulverizing balls having a particle diameter of more than 15 mm are used, it becomes difficult to obtain solder powder having a desired fine particle diameter. If only pulverizing balls having a particle diameter of less than 0.05 mm are used, solidification after stirring is difficult. Liquid separation may take time.
  • the particle diameter of the ball for grinding is more preferably 0.1 to 5 mm, still more preferably 0.1 to 3 mm, and still more preferably 0.1 to 1 mm. . It is also possible to use a pulverizing ball in combination of a large particle size and a small particle size.
  • the large ball size need not be particularly concerned with the particle size of 15 mm, and may be, for example, a particle size of 30 mm. It is necessary that at least 50% by mass of grinding balls having a particle size of 0.05 mm to 15 mm be contained.
  • Diamond-like carbon (DLC) or a compound such as B, C, or N, which is a material to which solder is difficult to adhere, can be formed on the surface of the grinding ball.
  • the volume ratio of the mixture is preferably 0.1% by volume to 20% by volume, and more preferably 0.1% by volume to 10% by volume with respect to the volume of the non-aqueous solvent used.
  • the grinding balls are preferably 20% by volume to 600% by volume with respect to the volume of the non-aqueous solvent used.
  • the metal raw material is less than 0.1% by volume, the productivity is low, and when it exceeds 20% by volume, the particle size of the obtained solder powder may not be sufficiently small.
  • the pulverizing ball is less than 20% by volume, the particle size of the obtained solder powder may not be sufficiently small.
  • the pulverizing ball is more than 600% by volume, a large amount of raw material metal adheres to the surface of the pulverizing ball.
  • the volume ratio of the grinding ball to the non-aqueous solvent is set so that the height of the top surface of the grinding ball and the top surface of the non-aqueous solvent are substantially the same. By adjusting, it becomes easier to obtain fine solder powder, which is more preferable.
  • the atmosphere for heating and stirring is preferably an inert gas or a reducing gas.
  • the atmosphere is air, a thick oxide film may be formed on the surface of the generated solder powder, and it is preferable that the oxygen concentration in the atmosphere is low.
  • the inert gas include nitrogen and argon
  • the reducing gas include hydrogen or a mixed gas of hydrogen and an inert gas.
  • the heating temperature of the mixture may be higher than the melting point of the alloy composition of the solder powder to be obtained, but it is heated to a temperature 5 ° C. lower than the melting point to 20 ° C. higher than the melting point. It is preferable to do. More preferably, the temperature may be the same temperature as the melting point to 17 ° C. higher than the melting point. More preferably, the temperature may be 7 ° C. higher than the melting point to 12 ° C. higher than the melting point.
  • the heating temperature is set to a temperature lower than the boiling point of the non-aqueous solvent to be used (in the case of heating and stirring under pressure, the boiling point under pressure).
  • Stirring can be performed by rotating a stirring blade, and may be performed using a pulverizer that can use pulverizing balls such as a mill.
  • the pulverization conditions such as the number of revolutions may be appropriately selected according to the content of the mixture and the average particle diameter of the solder powder to be obtained.
  • the particle size can be reduced.
  • the rotational speed is 100 to 100,000.
  • the range of rpm and the peripheral speed of the stirring blade can be set in the range of 100 to 5000 cm / sec.
  • Solid-liquid separation of the mixture of the solder powder and non-aqueous solvent obtained in the above step is performed.
  • Solid-liquid separation can be performed by a known method such as centrifugation or filtration with a filter press.
  • the used non-aqueous solvent does not have a trouble as a dispersion medium of solder powder, it is not necessary to perform solid-liquid separation.
  • the solid-liquid separated solder powder can be washed with a solvent.
  • a solvent is an organic solvent of alcohol having a low boiling point such as methanol or ethanol. After washing, drying by a method that does not perform high-temperature heating, such as vacuum drying, can yield a solder powder with little residual non-aqueous solvent used.
  • Example 1 10 g of solder alloy wire 1 mm ⁇ having a composition of Sn 99% by mass, Ag 0.3% by mass and Cu 0.7% by mass was weighed, and this solder wire was put into a 300 mL separable flask. As a result of measuring the melting point of the solder alloy wire with a differential scanning calorimeter (DSC) (manufactured by Rigaku Corporation, Thermo plus DSC 8230), the melting point was 218 ° C. Next, 300 g of 0.3 mm ⁇ zirconia balls were charged into the separable flask, and 100 mL of tetraethylene glycol was further charged to obtain a mixture.
  • DSC differential scanning calorimeter
  • the upper lid of the separable flask was sealed and sealed, and nitrogen gas was allowed to flow at 100 mL / min to perform gas replacement for 10 minutes.
  • the mixture was subjected to 14 kinds of temperatures (heating temperature) shown in Table 1 ). The temperature of the mixture was measured with a thermocouple installed in a separable flask. After maintaining the mixture at the heating temperature for 1 hour, the mixture was cooled at a cooling rate of 5 ° C./min while maintaining the stirring state. When the mixture became 40 ° C. or lower, the rotation of the stirring blade was stopped.
  • the mixture was then passed through a mesh of 250 mesh nylon fabric to separate 0.3 mm ⁇ zirconia balls from the mixture.
  • a solvent tetraethylene glycol
  • finely divided solder powder was dispersed was recovered.
  • the solvent in which the solder powder was dispersed was centrifuged at 3000 rpm for 5 minutes and subjected to solid-liquid separation, and the supernatant liquid was removed to collect the solder powder. Thereafter, cleaning was performed in the following manner.
  • the collected solder powder was stirred and mixed with 100 mL of ethanol and redispersed, and then centrifuged at 3000 rpm for 5 minutes to perform solid-liquid separation, and the supernatant liquid was removed to collect the solder powder.
  • the collected solder powder was dispersed in ethanol and then subjected to solid-liquid separation by centrifugation five times.
  • the obtained solder powder was vacuum-dried at 60 ° C. to obtain 14 types of dried solder powder having different heating temperatures.
  • the average particle diameter D50 of the dried solder powder is shown in Table 1.
  • 0.3 g of a solder powder sample is placed in 30 mL of isopropyl alcohol, treated with a 45 W ultrasonic cleaner for 5 minutes, and then treated with the microtrac 9320-X100 (Honeywell-Nikkiso Co., Ltd.).
  • the cumulative 50% by mass particle diameter (D50) when the diameter was measured was defined as the average particle diameter of the silver powder.
  • the average particle diameter D50 will be described.
  • the cumulative curve is, for example, 10%, 50%, and 90% when the cumulative curve is obtained with the total volume of the silver powder as 100%.
  • D50 which is an accumulation median diameter (Median diameter) is made into the average particle diameter.
  • the yield of the solder powder was calculated by dividing the mass of the obtained dried solder powder by the mass of the solder alloy wire used. The results are shown in Table 1.
  • Example 2 The composition of the solder alloy wire was changed from Sn 99 mass%, Ag 0.3 mass%, Cu 0.7 mass% to Sn 96.5 mass%, Ag 3.0 mass%, Cu 0.5 mass%, and the heating temperature was changed to Table 1.
  • the dry solder powder was obtained by the same method as in Example 1 except that the 14 types were changed from 13 types to 13 types shown in Table 2, and evaluated.
  • fusing point of a solder alloy wire it was 223 degreeC.
  • the dried solder powder was examined for the presence or absence of a hydroxy group peak of tetraethylene glycol by a reflective FT-IR, but the peak was not observed.
  • Example 3 The composition of the solder alloy wire was changed from Sn 99 mass%, Ag 0.3 mass%, Cu 0.7 mass% to five types shown in Table 3, and the heating temperature was changed from 14 types in Table 1 to Table 3, Table 4, A dried solder powder was obtained in the same manner as in Example 1 except that the heating temperatures in Table 5 were changed (melting point of solder alloy + 5 ° C., melting point of solder alloy ⁇ 10 ° C., melting point of solder alloy ⁇ 10 ° C.). And evaluated. Tables 3 to 5 show the results of measuring the melting points of the solder alloy wires having five compositions. Tables 3 to 5 show the yield of solder powder and the average particle diameter D50 of the solder powder in each sample.
  • the dried solder powder was examined by reflection-type FT-IR for the presence or absence of a tetraethylene glycol hydroxy group peak, but the peak was not observed.
  • the particle shape was spherical.
  • Table 3 shows the average particle diameter D50 of the dried solder powder and the yield of the solder powder. As shown in Tables 4 and 5, when the heating temperatures were the melting point ⁇ 10 ° C. and the melting point + 30 ° C., the yield of the solder powder was less than 1%.
  • Example 4 Solder that has been dried in the same manner as in Example 1 except that the mass of the solder alloy wire was changed from 10 g to the value shown in Table 6, and the heating temperature was changed from the value shown in Table 1 to the value shown in Table 6. Powder was obtained and evaluated.
  • the dried solder powder was examined by reflection-type FT-IR for the presence or absence of a tetraethylene glycol hydroxy group peak, but the peak was not observed.
  • Table 6 shows the average particle diameter D50 of the dried solder powder and the yield of the solder powder. From the results in Table 6, it was found that the heating temperature range for obtaining a suitable solder powder yield did not change even when the alloy concentration during pulverization was changed.
  • Example 5 The heating temperature was changed from the value shown in Table 1 to 250 ° C., and the cooling rate was changed from 5 ° C./min to 0.2 ° C./min until reaching 200 ° C., as in Example 1.
  • the dried solder powder was obtained by the method and evaluated.
  • the dried solder powder was examined by reflection-type FT-IR for the presence or absence of a tetraethylene glycol hydroxy group peak, but the peak was not observed.
  • the average particle diameter D50 of the dried solder powder was 0.9 ⁇ m, and the yield of the solder powder was 30% by mass.
  • Example 6 The heating temperature was changed from the value described in Table 2 to 255 ° C, and the cooling rate was changed from 5 ° C / min to 0.2 ° C / min until reaching 210 ° C, which was the same as in Example 2.
  • the dried solder powder was obtained by the method and evaluated.
  • the dried solder powder was examined by reflection-type FT-IR for the presence or absence of a tetraethylene glycol hydroxy group peak, but the peak was not observed.
  • the average particle diameter D50 of the dried solder powder was 0.9 ⁇ m, and the yield of the solder powder was 32% by mass.
  • the present invention can be applied to a method for producing solder powder having a fine particle size.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)

Abstract

L'invention concerne un procédé de production d'une poudre de brasage grâce auquel il est possible d'obtenir de manière efficace une poudre de brasage présentant un diamètre de particules moyen supérieur ou égal à 0,05 μm mais inférieur à 3 μm avec un rendement stable. Le procédé de production d'une poudre de brasage comprend : une étape dans laquelle un métal solide ou liquide, un solvant non aqueux, et des billes pour la pulvérisation présentant un diamètre de 0,05-5 mm sont introduits dans un récipient pour obtenir un mélange ; une étape dans laquelle le mélange est chauffé à une température comprise entre (le point de fusion du métal)-5°C et (le point de fusion du métal)+20°C et agité ; une étape dans laquelle les billes pour la pulvérisation sont séparées du mélange agité pour obtenir un mélange d'une poudre de brasage et du solvant non aqueux ; et une étape dans laquelle le mélange d'une poudre de brasage et du solvant non aqueux est soumis à une séparation solides-liquides afin d'obtenir la poudre de brasage.
PCT/JP2010/070563 2009-11-19 2010-11-18 Procédé de production de poudre de brasage WO2011062222A1 (fr)

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JP2009263519A JP5813917B2 (ja) 2009-11-19 2009-11-19 はんだ粉の製造方法
JP2009-263519 2009-11-19

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WO2011062222A1 true WO2011062222A1 (fr) 2011-05-26

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CN111432980A (zh) * 2017-12-22 2020-07-17 积水化学工业株式会社 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体以及连接结构体的制造方法

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JP6126426B2 (ja) * 2013-03-28 2017-05-10 新日鉄住金化学株式会社 接合方法
KR102489828B1 (ko) * 2022-08-12 2023-01-18 오컴퍼니 주식회사 솔더 입자에 활성도막을 형성하는 방법
KR102535911B1 (ko) * 2022-08-12 2023-05-30 오컴퍼니 주식회사 활성도막이 형성된 솔더 입자, 이를 포함한 접속용 필름을 제조하기 위한 혼합물 및 접속용 필름

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JPS64204A (en) * 1987-06-22 1989-01-05 Fukuda Metal Foil & Powder Co Ltd Production of low melting point metal powder
JPH0533017A (ja) * 1991-07-15 1993-02-09 Minnesota Mining & Mfg Co <3M> 低融点金属微粒子及びそれを含有する組成物の製造方法
WO2009011981A2 (fr) * 2007-05-31 2009-01-22 The Administrators Of The Tulane Educational Fund Procédé de formation de nanoparticules fonctionnalisées stables

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Publication number Priority date Publication date Assignee Title
JPS64204A (en) * 1987-06-22 1989-01-05 Fukuda Metal Foil & Powder Co Ltd Production of low melting point metal powder
JPH0533017A (ja) * 1991-07-15 1993-02-09 Minnesota Mining & Mfg Co <3M> 低融点金属微粒子及びそれを含有する組成物の製造方法
WO2009011981A2 (fr) * 2007-05-31 2009-01-22 The Administrators Of The Tulane Educational Fund Procédé de formation de nanoparticules fonctionnalisées stables

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111432980A (zh) * 2017-12-22 2020-07-17 积水化学工业株式会社 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体以及连接结构体的制造方法

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