WO2011060186A3 - Integrated bubble generation, transport and extraction for enhanced liquid cooling in a microchannel heat exchanger - Google Patents

Integrated bubble generation, transport and extraction for enhanced liquid cooling in a microchannel heat exchanger Download PDF

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Publication number
WO2011060186A3
WO2011060186A3 PCT/US2010/056407 US2010056407W WO2011060186A3 WO 2011060186 A3 WO2011060186 A3 WO 2011060186A3 US 2010056407 W US2010056407 W US 2010056407W WO 2011060186 A3 WO2011060186 A3 WO 2011060186A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
channel
extraction
transport
heat exchanger
Prior art date
Application number
PCT/US2010/056407
Other languages
French (fr)
Other versions
WO2011060186A2 (en
Inventor
Daniel Attinger
Amy Rachel Betz
Regis Vaillant
Jie Xu
Original Assignee
The Trustees Of Columbia University In The City Of New York
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Trustees Of Columbia University In The City Of New York filed Critical The Trustees Of Columbia University In The City Of New York
Priority to US13/508,471 priority Critical patent/US20130025831A1/en
Priority to EP10830740A priority patent/EP2499447A2/en
Publication of WO2011060186A2 publication Critical patent/WO2011060186A2/en
Publication of WO2011060186A3 publication Critical patent/WO2011060186A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

One embodiment can include a heat exchange system for heat exchange with a heat source and a cold source. The system can include a circulation loop. The circulation loop can include a heat emission portion configured to exchange heat with the cold source and a heat absorption portion configured to exchange heat with the heat source, the heat absorption portion comprising a channel. The embodiment can include a liquid pump configured to circulate a liquid through the circulation loop, from an inlet of the channel to an outlet of the channel and a bubble injector coupled to the circulation loop proximal to the inlet of the channel and configured to flow a gas to form a plurality of gas bubbles in the channel, with each of the plurality of gas bubbles monodispersed across the channel, with segments of liquid separating successive gas bubbles of the plurality of gas bubbles.
PCT/US2010/056407 2009-11-12 2010-11-11 Integrated bubble generation, transport and extraction for enhanced liquid cooling in a microchannel heat exchanger WO2011060186A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/508,471 US20130025831A1 (en) 2009-11-12 2010-11-11 Integrated bubble generation, transport and extraction for enhanced liquid cooling in a microchannel heat exchanger
EP10830740A EP2499447A2 (en) 2009-11-12 2010-11-11 Integrated bubble generation, transport and extraction for enhanced liquid cooling in a microchannel heat exchanger

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28102209P 2009-11-12 2009-11-12
US61/281,022 2009-11-12

Publications (2)

Publication Number Publication Date
WO2011060186A2 WO2011060186A2 (en) 2011-05-19
WO2011060186A3 true WO2011060186A3 (en) 2012-04-12

Family

ID=43992404

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/056407 WO2011060186A2 (en) 2009-11-12 2010-11-11 Integrated bubble generation, transport and extraction for enhanced liquid cooling in a microchannel heat exchanger

Country Status (3)

Country Link
US (1) US20130025831A1 (en)
EP (1) EP2499447A2 (en)
WO (1) WO2011060186A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6031920B2 (en) * 2011-09-30 2016-11-24 ブラザー工業株式会社 Substrate unit, cartridge, and manufacturing method thereof
EP2775517B1 (en) * 2011-11-04 2019-02-27 Fujitsu Limited Microchannel cooling device, microchannel cooling system, and electronic instrument
CN104427090A (en) * 2013-08-21 2015-03-18 中兴通讯股份有限公司 Mobile terminal device and liquid-state metal heat dissipation method thereof
US9941189B2 (en) 2015-12-21 2018-04-10 International Business Machines Corporation Counter-flow expanding channels for enhanced two-phase heat removal
US9847275B2 (en) 2015-12-21 2017-12-19 International Business Machines Corporation Distribution and stabilization of fluid flow for interlayer chip cooling
WO2017197318A1 (en) * 2016-05-13 2017-11-16 Kansas State University Research Foundation Nanopatterned surfaces and methods for accelerated freezing and liquid recovery
JP6571711B2 (en) * 2017-04-03 2019-09-04 ファナック株式会社 Laser equipment
DE112017007390T5 (en) * 2017-04-04 2019-12-12 Mitsubishi Electric Corporation Semiconductor cooling device, power control system and moving body
US20190162455A1 (en) * 2017-11-29 2019-05-30 Lennox Industries, Inc. Microchannel heat exchanger
US12010816B2 (en) 2018-11-12 2024-06-11 Michigan Technological University Nucleation control system and method leading to enhanced boiling based electronic cooling
US10923876B1 (en) 2019-08-09 2021-02-16 Lockheed Martin Corporation Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof
US11015880B2 (en) * 2019-12-31 2021-05-25 Chiang-Sen Hung Thin heat exchange panel
CN115083635B (en) * 2022-06-28 2023-08-22 华能核能技术研究院有限公司 Air-cooled reactor heat transfer system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
US6843308B1 (en) * 2000-12-01 2005-01-18 Atmostat Etudes Et Recherches Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device
US7261144B2 (en) * 2004-06-18 2007-08-28 Ecole polytechnique fédérale de Lausanne (EPFL) Bubble generator
US20090101308A1 (en) * 2007-10-22 2009-04-23 The Peregrine Falcon Corporation Micro-channel pulsating heat pump
US7585355B2 (en) * 2004-02-10 2009-09-08 Mitsubishi Denki Kabushiki Kaisha Temperature/humidity exchanger

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
US6843308B1 (en) * 2000-12-01 2005-01-18 Atmostat Etudes Et Recherches Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device
US7585355B2 (en) * 2004-02-10 2009-09-08 Mitsubishi Denki Kabushiki Kaisha Temperature/humidity exchanger
US7261144B2 (en) * 2004-06-18 2007-08-28 Ecole polytechnique fédérale de Lausanne (EPFL) Bubble generator
US20090101308A1 (en) * 2007-10-22 2009-04-23 The Peregrine Falcon Corporation Micro-channel pulsating heat pump

Also Published As

Publication number Publication date
US20130025831A1 (en) 2013-01-31
EP2499447A2 (en) 2012-09-19
WO2011060186A2 (en) 2011-05-19

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