WO2011050830A1 - Dispositif de test pour le test électrique de pièces électriques à tester - Google Patents

Dispositif de test pour le test électrique de pièces électriques à tester Download PDF

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Publication number
WO2011050830A1
WO2011050830A1 PCT/EP2009/008900 EP2009008900W WO2011050830A1 WO 2011050830 A1 WO2011050830 A1 WO 2011050830A1 EP 2009008900 W EP2009008900 W EP 2009008900W WO 2011050830 A1 WO2011050830 A1 WO 2011050830A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
test
testing
contact device
testing machine
Prior art date
Application number
PCT/EP2009/008900
Other languages
German (de)
English (en)
Inventor
Gunther Böhm
Berislav Kopilas
Original Assignee
Feinmetall Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Feinmetall Gmbh filed Critical Feinmetall Gmbh
Publication of WO2011050830A1 publication Critical patent/WO2011050830A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Definitions

  • the invention relates to a test device for the electrical testing of electrical specimens, in particular wafers, with a testing machine (Prober) and a replaceable in the testing machine einbringbar, an electrical contact contacting to the test specimen producing contact device, wherein the testing machine a displacement device for pressing and thereby electrical contact contacting of the Test specimens to the contact device and further comprises a supporting device for taking place on its side facing away from the specimen side supporting the contact device.
  • a testing machine Prober
  • einbringbar an electrical contact contacting to the test specimen producing contact device
  • the testing machine a displacement device for pressing and thereby electrical contact contacting of the Test specimens to the contact device and further comprises a supporting device for taking place on its side facing away from the specimen side supporting the contact device.
  • Electrical test equipment of the type mentioned serve the electrical testing of an electrical device under test, for example a wafer.
  • the contact device of the test device is brought into contact with the electrical test specimen.
  • the contact device preferably has a plurality of test contacts, which are in particular designed as buckling needles.
  • the one ends of the buckling needles serve for the contact contacting of the test object.
  • the other ends of the probes contact contacting pads of a wiring substrate of the contactor.
  • the test apparatus has a displacement device, which presses the test object for contact-contacting with the bending needles of the contact device.
  • the contact device is connected via electrical connections to a tester.
  • the electrical test of the test object is carried out, that is, electrical test circuits are set up with the test object in order to carry out the functional test.
  • the test Current paths run from the tester via the contact device to the DUT and from there back to the tester. Proper testing requires that contact-proof test current paths be formed between the tester and the device under test. For this purpose, it is necessary to position the specimen very precisely relative to the contact device (X, Y) and then press it with a pressing movement (Z) with a suitable contact pressure to the test contacts of the contact device.
  • the contact device is preferably held via an intermediate ring in the testing machine.
  • the intermediate ring is preferably fastened to a so-called head plate (headplate) of the testing machine.
  • the test specimen in particular wafer, is preferably held on a vacuum device (chuck vacuum plate).
  • a vacuum device chuck vacuum plate
  • the displacement device of the so-held test piece is pressed against the contacts of the contact device.
  • This deflection is undesirable because it is difficult to determine in size and results in the touch contact not being made in the same way for all contacts of the contactor.
  • the test machine has a support (support device), which supports the contact device centrally on the tester side, ie on the side facing away from the test object.
  • the usual method consists of the following steps:
  • the intermediate ring is first mounted on a linearly movable device (drawer technology). In the extended position of this device, the intermediate ring protrudes almost completely from the front of the testing machine. It then takes place the contact device, that is, the contact device is placed on the intermediate ring.
  • the linearly movable device then retracts, taking with it the intermediate ring with contact device, so that these components are located inside the testing machine.
  • the intermediate ring is now raised and locked in its upper end position. Now, ideally, the side of the contactor facing the tester would abut with its center on the support.
  • the preferably vertical distance between the central contact point of the support and the annular contact point of the intermediate ring to make the same size as the distance between the back and the front of the contact device, so that the contact device without play between said two investment sites is located. Also, no angle errors between the intermediate ring and the flat contact point of the support may occur, otherwise tilting of the contact device could take place. In many hundreds in use such systems with a corresponding number of contact devices of various types and manufacturers can not be avoided inaccuracies. In order nevertheless to create a reasonably defined situation, so far the following way was followed: The intermediate ring is moved not only so far up, until the contact device rests against the support, but approximately still approximately 0.3 mm.
  • the contact device has as an essential component to a wiring support, which is designed in particular as a printed circuit board. Such components must not be exposed to changing mechanical stress, since then breaks may occur on individual conductor tracks, which in turn lead to interruptions of the electrical connections. Such errors actually occur in practice. These errors should be avoided.
  • the object of the invention is to provide a safe and error-free and durable test device for electrical testing of electrical specimens.
  • This object is achieved in that at least one contact device is pressed against the supporting device displacement element.
  • the contact device is pressed in a defined manner against the supporting device by means of the displacement element, so that there is no play and no impermissible deformations / deflections between these components. This creates a reproducible situation.
  • the displacement element accordingly assumes a displacement of the contact device, so that it preferably bears against the support device with defined parameters, in particular plane-parallel. This takes place before the test object is pressed against the contact device by means of the displacement device.
  • the contact device does not form a nachgiebi- ges element to realize the mentioned deflection of the prior art, but preferably now very stiff designed contact device is particularly pressed by means of the displacement element evenly to the support. Due to the rigid design of the contact device, twisting of its wiring carrier, in particular its printed circuit board, is prevented and it is preferably also prevented that the wiring carrier, in particular the printed circuit board, is subjected to an impermissible deflection.
  • at least one displacement element is used, in particular it is provided that at least three displacement elements are present in order to press the contact device against the support device. These three (or other) elements are preferably arranged distributed uniformly over the circumference of the contact device.
  • the at least one displacement element can be designed as a separate, independent component or else can be designed to be integrated on the contact device and / or supporting device, in particular on the intermediate component.
  • the displacement element can be realized in particular by appropriate design and / or corresponding shaping of the contact device and / or the support device or by corresponding components of the contact device and / or the support device, for example, characterized in that at least a portion of the respective component, ie the contact device and / or the support means is elastically deformable or has corresponding, elastically deformable components / have.
  • the displacement element is arranged in particular directly or indirectly between testing machine and contact device and / or between supporting device and contact device.
  • Direct means that the displacement element is located directly between the named components.
  • Indirectly means that the displacement element is located between the abovementioned components with the interposition of at least one further component.
  • the displacement element is a spring element, in particular a tension spring element or a compression spring element. Additionally or alternatively, it can be provided that the displacement element is a hydraulically and / or pneumatically operated path-setting element. In any case, irrespective of the specific embodiment, it is provided that the displacement element has the ability to press the contact device in a defined manner against the support device, so that there is no play and impermissible deflections and the like are prevented. It is preferably provided that an intermediate component, in particular an intermediate ring, is arranged between the testing machine and the contact device. On the intermediate ring has already been discussed above. It is advantageous if the displacement element is arranged between testing machine and intermediate component and / or between intermediate component and contact device.
  • the contact device is designed as a probe card, in particular as a vertical probe card.
  • the contact device has a contact region preferably located in a central region, which has test contacts, in particular test needles, preferably buckling needle, for the contact contacting with the test object.
  • the test contacts are preferably in electrical contact with contact surfaces of a wiring substrate of the contact device, in particular by touch contact.
  • the support device supports - according to an embodiment of the invention - the wiring carrier, in particular in the central region. This can also be done within a part of the central area.
  • the wiring carrier is preferably designed as a printed circuit board.
  • the wiring carrier prefferably has a stiffening device on its side facing away from the test object. This will cause the contact mechanically stiffened.
  • the support device preferably supports the stiffening device in the central area. This can also be done on a part of the central area. It is preferably provided that the central regions of the wiring carrier and the stiffening device are aligned with each other or approximately aligned. This also applies to shares of the central areas or to a share of at least one of the central areas.
  • FIG. 1 shows a cross section through a test device according to a first exemplary embodiment of the invention
  • FIG. 2 shows a cross section through a test device according to a second embodiment of the invention
  • FIG. 3 shows a cross section through a test device according to a third embodiment of the invention.
  • FIG 4 shows a cross section through a test device according to a fourth embodiment of the invention.
  • FIG. 1 shows an electrical test device 1 which serves to test a test object which does not originate from FIG.
  • the test apparatus 1 has a testing machine 2 (prober) into which a contact device 3 is inserted.
  • the contact device 3 is preferably inserted into the testing machine 2 by means of a drawer construction not shown in detail, similar to that of a CD-ROM drive.
  • the contact device 3 is designed as a test card 4, in particular vertical test card 5.
  • the latter means that she in a contact head 6, a plurality of test contacts 7, which are formed as needles, in particular buckling needles 8, which extend transversely, in particular vertically, preferably horizontal test plane.
  • Knick needles means that they each have a slight deflection, so they from If the test object is forced against the preferably pointed ends of the free ends of the bending needles 8, these can easily deflect due to the deflection and thereby compensate for irregularities in the spacing and contact very well.
  • the one ends of the test contacts serve for contact-contacting the test object and the other ends of the test contacts are in contact surfaces 12 of a wiring substrate 10, preferably a circuit board 11, of the contact device 3.
  • the contact surfaces 12 of the circuit board 11 are on the other side of the conductor
  • the contacts 13 are connected to a tester which is not shown in FIG. 1 and which serves to connect test current paths to the test object in order to test the test object for electrical functionality.
  • a stiffening device 14 consisting of a front stiffening element 15 and a rear stiffening element 16, is provided.
  • the stiffening device 15 serves to bring about a torsional rigidity of the contact device 3 and to absorb the contact pressure, which arises when the specimen - as will be described in more detail below - is urged against the buckling needles 8 to the touch contact.
  • the testing machine 2 has a beaulingsmba 17 (chuck), which has a fixed base plate 18. Further, the sketchlingslic 17 includes a Y-positioning device 19, an X-positioning device 20 and a Z-positioning device 21. On the Z-positioning device 21, a vacuum holder 22 is arranged, with which the test object can be held positionally immutable by negative pressure. If the test object, for example a wafer, is placed flat on the vacuum fixture 22 and held by negative pressure, it can be positioned precisely below the contact device 3 by means of the X and Y positioning devices 20 and 19 with the aid of cameras. that when touching contact the buckling needles 8 contact exact position corresponding contacts of the specimen.
  • the X and Y positioning devices 20 and 19 It is possible with the X and Y positioning devices 20 and 19 and a compensation of rotational errors.
  • For contacting the Z-positioning device 21 moves upward and urges the DUT against the free ends of the bending needles 8. This movement is indicated in the figure 1 by means of an arrow 23.
  • the front stiffening element 15 is designed in particular as a stiffening ring 24 and the rear stiffening element 14 as a stiffening plate 25, from which - distributed over the circumference - emanating a plurality of support arms.
  • a receptacle 27 is provided for holding the contact device 3 in the testing machine 2.
  • For receiving 27 includes an intermediate member 30 which is formed as an intermediate ring 31, and in the testing machine 2 can be fixed / locked in positional accuracy.
  • the intermediate component 30 receives the contact device 3, wherein it is important that at least one displacement element 32 is located between the testing machine 2 and the contact device 3.
  • the displacement element 32 is located between the intermediate component 30 and the contact device 3.
  • a plurality of displacement elements 32 are provided, which are arranged around the sketchchante 7 around, preferably at a uniform angular distance.
  • the displacement elements 32 are spring elements 33, in particular compression spring elements 34.
  • a supporting device 35 is arranged which is in particular plate-like and / or in particular has a multiplicity of support arms wherein the outer edge region 36 may be firmly connected to the testing machine 2 and in the central region 37 of the support device 35, a support member 38 may be provided which is aligned with a corresponding central region of the stiffening device 14 and with a central region of the probe 6 or approximately aligned. Due to the displacement forces acting in the direction of arrow 23 of the displacement element 32 and the displacement elements 32, the contact device 3 is urged against the support device 35 so that there is no gap between these two components, but a play-free system is present.
  • the central region of the wiring substrate 10 is supported on the central region of the stiffening device 14 and the central region of the stiffening device 14 on the central region of the support device 35, in particular on the centrally located support element 38. If, for testing a test object, it is held by means of the vacuum holder 22 and urged against the test contacts 7 by means of the Z-positioning device 21, the supporting device 35 prevents the contact device 3 from bending, in particular a bending of its wiring carrier 10, whereby already Before the test piece is pressed against the contact device 3, the at least one displacement element 32 has ensured a defined, reproducible support of the contact device 3, in particular in the central region, on the support device 35.
  • At least three uniformly distributed over the circumference displacement elements 32, in particular compression spring elements 34, are provided.
  • a plurality of resilient elements can be provided as far as a continuous, annular, resilient support of the contact device 3.
  • resilient elements come a variety of types of springs into consideration, for example helical compression springs, leaf springs, structures made of rubber or other elastomers.
  • resilient elements and pneumatic and / or hydraulic components are possible, which bring a Wegverlagerung with it and thereby cause a defined pressing of the contact device 3 to the supporting device 35.
  • a planar contact of the stiffening device 14 of the contact device 3 may be provided on the supporting device 35. Due to tolerances, however, it is not clearly defined when two surfaces are placed together at which points they exactly touch each other. Thus, it can happen that, at the moment in which additional forces act on the above interface due to the contacting of the test object, a shift of the contact device 3 is triggered. For example, it may be that at least one of the two contacting surfaces has an asymmetrical, convex curvature, so that a slight tilting of the contact device could be the result.
  • multipoint contacting is provided on the supporting device 35 and / or on the stiffening device 14, for example, in particular three abutment surfaces of slightly increased design on the stiffening device 14, so that now the contact device 3 is always accurate preferably three points on the support device 35 is supported, regardless of the size of the additionally introduced by the contact force.
  • the raised abutment surfaces are preferably formed so that they are removable.
  • FIG. 2 shows a further exemplary embodiment of a test apparatus 1.
  • the structure of the test apparatus 1 of FIG. 2 largely corresponds to the structure of the test apparatus 1 of FIG. 1, so that reference is made to the associated description of FIG.
  • the intermediate component 30, which is formed as an intermediate ring 31, not - as in the embodiment of Figure 1 - via at least one Verlagerungsele- element 32 is connected to the contact device 3, but is firmly connected to the contact device 3, so not wegverlagernd.
  • at least one displacement element 32 which is preferably designed as a spring element 33, in particular as a compression spring element 34, between the testing machine 2 and the intermediate component 30 provided such that the contact device 3 is pressed against the support device 35 without play.
  • the testing machine 2 has a holding component 39 fastened to it. Between the holding member 39 and the intermediate member 30 at least one compression spring element 34 is arranged as a displacement element 32. Preferably, a plurality of distributed over the circumference compression spring elements 34 are provided. Instead of the compression spring elements 34, the other aforementioned embodiments of a displacement element 32 or of displacement elements 32 can also be provided.
  • FIG. 3 relates to a third exemplary embodiment of the invention, wherein again below only differences between the exemplary embodiment of FIG. 3 and the exemplary embodiment of FIG. 1 are discussed, and insofar as the statements relating to FIG. 1 also apply correspondingly to FIG.
  • at least one displacement element 32 is arranged between the testing machine 2 and the intermediate component 30, wherein the intermediate component 30 is fixedly arranged on the contact device 3.
  • the at least one displacement element 32 is not a pressure spring element but a tension spring element 40, that is, this spring element pulls and urges the contact device 3 against the support device 35.
  • FIG. 4 shows a further embodiment of the invention, wherein again only differences to FIG. 1 are discussed and, moreover, the explanations concerning FIG. 1 also apply to FIG.
  • the at least one displacement element 32 is located between the contact device 3 and the support device 35, whereby the contact device 3 is urged against the support device 35.
  • the at least one displacement element 32 is designed as a tension spring element 40.
  • a plurality of tension spring elements 40 are provided, which are arranged uniformly circumferentially distributed around the support element 38 around.
  • the individual tension spring elements 40 engage on the one hand on the supporting device 35 and on the other hand on the stiffening device 14 of the contact device 3.
  • the contact device 3 is guided on the intermediate component 30, which is designed as an intermediate ring 31.
  • the intermediate ring 31 is located between the testing machine 2 and the contact device 3.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention concerne un dispositif de test pour le test électrique de pièces électriques à tester, en particulier de tranches. Le dispositif de test selon l'invention comprend un testeur et un dispositif de contact insérable de manière interchangeable dans le testeur et établissant un contact physique électrique avec la pièce à tester. Le testeur comporte un dispositif de déplacement qui presse la pièce contre le dispositif de contact, et établit donc un contact électrique, ainsi qu'un dispositif d'appui qui soutient le dispositif de contact sur sa face opposée à la pièce. L'invention est caractérisée par au moins un élément de déplacement (32) pressant le dispositif de contact (3) contre le dispositif d'appui (35).
PCT/EP2009/008900 2009-10-28 2009-12-12 Dispositif de test pour le test électrique de pièces électriques à tester WO2011050830A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200920014987 DE202009014987U1 (de) 2009-10-28 2009-10-28 Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen
DE202009014987.0 2009-10-28

Publications (1)

Publication Number Publication Date
WO2011050830A1 true WO2011050830A1 (fr) 2011-05-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/008900 WO2011050830A1 (fr) 2009-10-28 2009-12-12 Dispositif de test pour le test électrique de pièces électriques à tester

Country Status (2)

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DE (1) DE202009014987U1 (fr)
WO (1) WO2011050830A1 (fr)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5506498A (en) * 1992-03-20 1996-04-09 Xandex, Inc. Probe card system and method
WO2001071779A2 (fr) * 2000-03-17 2001-09-27 Formfactor, Inc. Procede et appareil de planarisation d'un contacteur a semi-conducteurs
EP1391738A2 (fr) * 2002-08-09 2004-02-25 Nihon Denshizairyo Kabushiki Kaisha Carte sonde
US20040257098A1 (en) * 2003-06-19 2004-12-23 Katsuhiko Satou Probe card
US20050156611A1 (en) * 2004-01-16 2005-07-21 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
EP1793232A2 (fr) * 2005-12-05 2007-06-06 Feinmetall GmbH Dispositif de contact electrique et appareil de test pour tester un échantillon de test
US20080150558A1 (en) * 2005-07-12 2008-06-26 Takashi Amemiya Probe Card
EP1959260A1 (fr) * 2005-12-05 2008-08-20 NHK Spring Company Limited Carte sonde
US20080252327A1 (en) * 2007-04-11 2008-10-16 Cho Chang-Hyun Substrate test probing equipment having forcing part for test head and force-receiving pattern for probe card and methods of using the same
US20090066349A1 (en) * 2007-09-06 2009-03-12 Powerchip Semiconductor Corp. Probe system

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5506498A (en) * 1992-03-20 1996-04-09 Xandex, Inc. Probe card system and method
WO2001071779A2 (fr) * 2000-03-17 2001-09-27 Formfactor, Inc. Procede et appareil de planarisation d'un contacteur a semi-conducteurs
EP1391738A2 (fr) * 2002-08-09 2004-02-25 Nihon Denshizairyo Kabushiki Kaisha Carte sonde
US20040257098A1 (en) * 2003-06-19 2004-12-23 Katsuhiko Satou Probe card
US20050156611A1 (en) * 2004-01-16 2005-07-21 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
US20080150558A1 (en) * 2005-07-12 2008-06-26 Takashi Amemiya Probe Card
EP1793232A2 (fr) * 2005-12-05 2007-06-06 Feinmetall GmbH Dispositif de contact electrique et appareil de test pour tester un échantillon de test
EP1959260A1 (fr) * 2005-12-05 2008-08-20 NHK Spring Company Limited Carte sonde
US20080252327A1 (en) * 2007-04-11 2008-10-16 Cho Chang-Hyun Substrate test probing equipment having forcing part for test head and force-receiving pattern for probe card and methods of using the same
US20090066349A1 (en) * 2007-09-06 2009-03-12 Powerchip Semiconductor Corp. Probe system

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