WO2011025229A3 - Conductive metal ink composition and method for forming a conductive pattern - Google Patents

Conductive metal ink composition and method for forming a conductive pattern Download PDF

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Publication number
WO2011025229A3
WO2011025229A3 PCT/KR2010/005652 KR2010005652W WO2011025229A3 WO 2011025229 A3 WO2011025229 A3 WO 2011025229A3 KR 2010005652 W KR2010005652 W KR 2010005652W WO 2011025229 A3 WO2011025229 A3 WO 2011025229A3
Authority
WO
WIPO (PCT)
Prior art keywords
ink composition
conductive metal
metal ink
forming
conductive
Prior art date
Application number
PCT/KR2010/005652
Other languages
French (fr)
Korean (ko)
Other versions
WO2011025229A2 (en
Inventor
성지현
허수연
이종택
전경수
김상호
황지영
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to US13/392,831 priority Critical patent/US8883046B2/en
Priority to CN201080038429XA priority patent/CN102482522A/en
Priority to JP2012526639A priority patent/JP2013503234A/en
Priority claimed from KR1020100081972A external-priority patent/KR101221780B1/en
Publication of WO2011025229A2 publication Critical patent/WO2011025229A2/en
Publication of WO2011025229A3 publication Critical patent/WO2011025229A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser

Abstract

The present invention relates to a conductive metal ink composition, which can be suitably applied to a roll printing process to enable a good conductive pattern to be formed, and to a method for forming a conductive pattern using same. The conductive metal ink composition includes: a conductive metal powder; a non-aqueous solvent containing a first non-aqueous solvent with a vapor pressure of 3 torr or less at 25˚C and a second non-aqueous solvent with a vapor pressure of more than 3 torr at 25˚C; and a polymeric coatability improver, said conductive metal ink composition being printed on a substrate through a roll printing process so as to be used for forming a conductive pattern.
PCT/KR2010/005652 2009-08-28 2010-08-24 Conductive metal ink composition and method for forming a conductive pattern WO2011025229A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/392,831 US8883046B2 (en) 2009-08-28 2010-08-24 Conductive metal ink composition and method for forming a conductive pattern
CN201080038429XA CN102482522A (en) 2009-08-28 2010-08-24 Conductive metal ink composition and method for forming a conductive pattern
JP2012526639A JP2013503234A (en) 2009-08-28 2010-08-24 Conductive metal ink composition and method for forming conductive pattern

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2009-0080374 2009-08-28
KR20090080374 2009-08-28
KR1020100081972A KR101221780B1 (en) 2009-08-28 2010-08-24 Conductive metal ink composition and preparation method for conductive pattern
KR10-2010-0081972 2010-08-24

Publications (2)

Publication Number Publication Date
WO2011025229A2 WO2011025229A2 (en) 2011-03-03
WO2011025229A3 true WO2011025229A3 (en) 2011-06-16

Family

ID=43628576

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/005652 WO2011025229A2 (en) 2009-08-28 2010-08-24 Conductive metal ink composition and method for forming a conductive pattern

Country Status (1)

Country Link
WO (1) WO2011025229A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101093075B1 (en) * 2011-04-04 2011-12-13 한국기계연구원 Pattern printing apparatus
CN102775849A (en) * 2011-05-13 2012-11-14 深圳市信濠精密组件有限公司 Metal printing ink composition
CN102573313A (en) * 2012-02-13 2012-07-11 苏州晶讯科技股份有限公司 Method for utilizing base metal catalytic ink to manufacture printed circuit
CN102585602A (en) * 2012-02-13 2012-07-18 苏州晶讯科技股份有限公司 Noble metal replacing catalysis ink for printing circuit
WO2023104849A1 (en) * 2021-12-08 2023-06-15 Ferro Gmbh Environmentally friendly medium for ceramic colours for indirect decoration of glass, porcelain, bone china, enamel, and ceramics

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4853036A (en) * 1986-11-25 1989-08-01 Canon Kabushiki Kaisha Ink for ink-jet recording and ink-jet recording process using the same
JP2006147202A (en) * 2004-11-16 2006-06-08 Hitachi Chem Co Ltd Insulator ink, printed circuit board and multilayer printed circuit board
KR20060130568A (en) * 2003-11-25 2006-12-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Solution containing surface-modified nanoparticles
KR20080088712A (en) * 2007-03-30 2008-10-06 삼성전자주식회사 Conductive ink composition and method of forming conductive pattern using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4853036A (en) * 1986-11-25 1989-08-01 Canon Kabushiki Kaisha Ink for ink-jet recording and ink-jet recording process using the same
KR20060130568A (en) * 2003-11-25 2006-12-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Solution containing surface-modified nanoparticles
JP2006147202A (en) * 2004-11-16 2006-06-08 Hitachi Chem Co Ltd Insulator ink, printed circuit board and multilayer printed circuit board
KR20080088712A (en) * 2007-03-30 2008-10-06 삼성전자주식회사 Conductive ink composition and method of forming conductive pattern using the same

Also Published As

Publication number Publication date
WO2011025229A2 (en) 2011-03-03

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