WO2011016650A2 - Method and apparatus for packaging a light-transmitting unit for an optical element - Google Patents
Method and apparatus for packaging a light-transmitting unit for an optical element Download PDFInfo
- Publication number
- WO2011016650A2 WO2011016650A2 PCT/KR2010/005032 KR2010005032W WO2011016650A2 WO 2011016650 A2 WO2011016650 A2 WO 2011016650A2 KR 2010005032 W KR2010005032 W KR 2010005032W WO 2011016650 A2 WO2011016650 A2 WO 2011016650A2
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- WIPO (PCT)
- Prior art keywords
- light
- screen
- transmitting
- optical element
- transmitting unit
- Prior art date
Links
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
- G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
Definitions
- the present invention relates to a method and apparatus for packaging a light transmitting part of an optical element, and more particularly, by applying a vacuum screen printing process, it is uniform to a large area substrate (particularly applied to the production of a BLU for an LCD composed of LEDs) within a short time.
- the organic film dome-shaped light-transmitting part
- the light transmitting part can be formed. Accordingly, the present invention relates to a light emitting unit package method and apparatus for controlling light extraction efficiency and diffusivity according to formation of a light transmitting unit to realize uniform light characteristics.
- An optical element is a generic term for a device that receives or emits light, and is composed of a light receiving unit or a light emitting unit that substantially receives or emits light, and a package that surrounds some or all of its surroundings to protect it. In order to receive external light or the device itself to emit light, some or all of these packages must be encapsulated with a light-transmissive material.
- the optical element examples include an LED (which includes inorganic LEDs and organic LEDs) or a BLU equipped with an LED using such an LED as a light source of the BLU (which is mainly applied to LCD panels recently). And dye-sensitized solar cells.
- the LED Light Emitting Diode
- the LED has high efficiency, high-speed response, long life, miniaturization, light weight, and energy saving due to low power consumption. It is an eco-friendly light source that has excellent characteristics and is applied to many applications. In recent years, it also plays a role as a light source applied to the BLU of an LCD display panel.
- the encapsulant forming the light-transmitting part of the LED optical semiconductor device has optical transparency, light resistance to UV, heat resistance and heat dissipation for LED heat emission, high refractive index for improving light extraction efficiency, and a silver coating surface for reflection. It requires strict physical properties such as reliability of adhesive force, viscosity (level applicable to process), low shrinkage material for thermal stress relief, moisture resistance, and high flame resistance to heat generation.
- a mold method or a dotting (or dispensing) process is applied as a method of forming the light-transmitting part with such an encapsulant, but in the case of the mold method or the DOTTING method, it takes a long time to form an organic film (dome-shaped light-transmitting part).
- the doted light-transmitting part uses a high viscosity organic material in order to have a uniform shape, which makes it difficult to remove and handle bubbles. Since the injection pattern is different for each LED, there is a problem in that the shape of each organic film (dome) is not constant so that the overall light characteristics are different. This is particularly the case for the LCD BLU using the LED as a light source, even if the entire panel requires a light emission characteristic can cause a problem that each of the arrayed LED is different in light characteristics.
- Korean Patent Laid-Open Publication No. 2004-105063 proposes a method of forming a light transmitting part using a screen printing method, but in the case of a conventional screen printing, as shown in FIG. There is a problem that pores are formed while passing through the wire portion formed by the reticulated through portion, and when the viscosity is low, shape control is difficult.
- an object of the present invention is to provide a method and apparatus for packaging a light emitting part of an optical device capable of controlling light extraction efficiency and diffusivity according to formation of a light transmitting part, thereby implementing uniform light characteristics.
- a light transmitting part packaging method for forming a light transmitting part for encapsulating all or part of a light receiving part or a periphery of a light emitting part with respect to an optical element having a light receiving part or a light emitting part,
- It provides a light emitting unit package method of the optical element comprising the step of forming the light transmitting portion by screen printing the transparent resin through the screen in a vacuum state.
- a light-transmitting part package apparatus for an optical element comprising a screen printing apparatus which forms a light-transmitting portion for encapsulating all or a portion of the light-receiving portion or the light emitting portion surrounding the light-receiving portion or the light-emitting portion.
- a screen having a line portion respectively corresponding to the optical elements on the work table
- a vacuum forming module connected to the vacuum chamber
- control unit for controlling the screen, the printing work unit, and the vacuum forming apparatus to screen-print the translucent resin through the screen in a vacuum state to form the transmissive portion.
- the method and apparatus for transmitting light package of the optical element of the present invention By applying the vacuum screen printing process, it is possible to form a uniform organic film (dome-shaped light-transmitting part) on a large area substrate (particularly applied to the production of LCD BLU made of LED) within a short time, and thus shorten the process time. In addition, it is possible to minimize the occurrence of pore that may exist in the light-transmitting portion, and to form the light-transmitting portion with less porosity in spite of various shapes according to the screen mesh and the pattern. Therefore, the light extraction efficiency and the degree of diffusion can also be adjusted according to the formation of the light-transmitting part, thereby achieving the effect of realizing uniform light characteristics.
- FIG. 1 is a cross-sectional view schematically illustrating the concept of pore generation in a general screen printing process.
- FIG. 2 is a plan view (a) of an optical element array to which the light emitting unit package method of the optical element of the present invention can be applied, a plan view (b) of a screen printing screen corresponding thereto, and an optical element array having a light emitting unit package manufactured thereby
- FIG. 3 is a system schematic diagram schematically showing an embodiment of a light emitting unit package apparatus of an optical device according to the present invention.
- FIG. 4 is a plan view illustrating various embodiments of a wire pattern of a screen that may be applied to a light emitting unit package apparatus of an optical device of the present invention.
- light-transmitting part 7 base (PCB board
- the light-transmitting part packaging method of the optical element of the present invention is a light-transmitting part packaging method for forming a light-transmitting part 5 for encapsulating all or part of the light-receiving part or the periphery of the light-receiving part with respect to an optical element having a light-receiving part or a light-emitting part.
- the screen printing is applied in a method of forming a light-transmitting part which is a portion through which light passes in the light-receiving part that receives light or the light-emitting part that emits light. Is carried out in a vacuum.
- the optical element broadly means an element that receives light or emits light, and thus has a light receiving portion or a light emitting portion.
- an encapsulation (package) is required.
- a path from the outside to the light-receiving unit is packaged with a light-transmitting material for receiving the light-receiving unit.
- the light emitting element package is a light emitting element, and in the case of a light emitting element, a path from the light emitting portion to the outside is packaged with a light transmitting material so that the emitted light of the light emitting portion is irradiated to the outside. It becomes a package.
- Examples include LEDs (which include inorganic LEDs and organic LEDs) or BLUs with LEDs that use these LEDs as light sources for BLUs (which have recently been applied to LCD panels). And dye-sensitized solar cells.
- LEDs which include inorganic LEDs and organic LEDs
- BLUs with LEDs that use these LEDs as light sources for BLUs (which have recently been applied to LCD panels).
- dye-sensitized solar cells Preferably, when the present invention is applied to an LCD panel BLU (BACK LIGHT UNIT) in which the LEDs requiring high uniformity of the light emitting part package of each LED are arranged in an ARRAY shape, the BLU of good quality may be provided. . Detailed drawings thereof are as shown in FIG.
- an optical element array in which a plurality of the optical elements are arranged on a plane is prepared.
- the optical device is as described above, and in the case of screen printing, it is possible to simultaneously perform a plurality of optical device encapsulation, thereby improving productivity, so that the plurality of optical devices can be screen-printed.
- the optical elements may be arranged in a form in which each independently implements an independent function.
- the optical elements may be integrated so that a plurality of optical elements may be connected to each other and controlled by a single controller. It may be. In the case where each is independent, after the package is completed, it may be operated as an individual device through a process of separating each device.
- the substrate 7 material of the optical element array used in the present invention may be glass, plastics, or the like.
- a material constituting the PCB may be used.
- the substrate 7 is used.
- a step of preparing the screen 20 having the line portion 22 corresponding to each of the optical elements is performed.
- This may correspond to a screen printing screen applied to a conventional LCD process or a package process, and the wire portion refers to an open portion of the screen through which the resin may move downward from the top of the screen and move downward. Specific examples thereof are as shown in FIG.
- the wire line part may have various shapes according to the required characteristics of the optical element, and as shown in FIG. It may have a different shape for each region.
- a specific example of the shape of the wire portion is as shown in FIG. 4. That is, the wire part may be configured in the form of a circle, an ellipse or a polygon.
- the printing process is performed in a vacuum state to prevent pore generation. That is, the step of forming the light transmitting portion by screen-printing the transparent resin through the screen in a vacuum state.
- the light-transmissive resin may be applied to all of the conventional light-transmitting part forming resins.
- the organic film material may be applied to a printing process such as silicone resin or epoxy resin or PMMA (poly methyl methacrylate) resin, PC (polycarbonate), and the like. As long as it is possible and it has a high refractive index, and can be hardened
- Components of the silicone resin composition which is a typical resin can be largely configured as follows.
- the silicone resin of the present resin composition is preferably a polyorganosiloxane containing an alkyl group or a phenyl group at the terminal, and particularly the present polyorganosiloxane may have a linear, branched, cyclic or dendritic siloxane structure.
- the polyorganosiloxane of the alkenyl functional functional group may be a single component or may be a combination comprising one or more alkenyl functional phenyl containing polyorganosiloxanes.
- the phenyl containing polyorganosiloxane which has the terminal alkenyl functional group is preferable.
- organohydrogenpolysiloxanes having two or more Si—H bonds in one molecule examples thereof include organohydrogenpolysiloxanes having two or more Si—H bonds in one molecule, and the content thereof is preferably 2 to 100 parts by weight, particularly preferably 100 parts by weight of the sealing resin. May be 10 to 50 parts by weight.
- the filler may be used to improve the coating film strength (strength) during the curing of the silicone-based encapsulation composition or to adjust the refractive index of light emitted from the light emitting device.
- Fillers for the purpose of improving the coating film strength at the time of curing are preferably organosilicates having alkenyl functional groups or SiH functional groups.
- SiO2 or SiO2 and B2O3 are main components, and ZnO or TiO2 is mix
- the filler has a feature that can impart low shrinkage or thixotropy after curing of the sealing resin together with a conventional flake.
- the other additives may include other components for modifying the curing properties or non-curing properties according to the specific implementation requirements of the composition of the sealing resin of the present invention, if necessary, thermal conductivity enhancers, flexible additives, antioxidants , Compounding agent such as plasticizer, lubricant, silane-based coupling agent, surface filler of inorganic filler, flame retardant, antistatic agent, leveling agent, inorganic ion exchanger, antifoaming agent, light diffusing agent, etc. can do.
- thermal conductivity enhancers such as plasticizer, lubricant, silane-based coupling agent, surface filler of inorganic filler, flame retardant, antistatic agent, leveling agent, inorganic ion exchanger, antifoaming agent, light diffusing agent, etc.
- Compounding agent such as plasticizer, lubricant, silane-based coupling agent, surface filler of inorganic filler, flame retardant, antistatic agent, leveling agent, inorganic ion exchanger,
- antioxidants include phenol, sulfur, and phosphorus antioxidants.
- Representative examples thereof include triphenyl phosphate and diphenyl decyl phosphate. Palladium Cresol etc. can be mentioned.
- fillers may be included to improve refractive index, and the filler used is not particularly limited in size, but in order to improve light extraction efficiency of light in the visible wavelength band, it is most preferable to use a filler having a size of 1/4 in the wavelength band. In the case of applying this filler, it can be applied to a vacuum screen printing process after being dispersed in an organic film material.
- the phosphor may use a blue LED chip + yellow phosphor, UV-LED and RGB phosphor.
- the curing process may be performed according to the properties of the printed resin, which may include light curing or thermal curing, and thus, the optical element array having the light-transmitter package completed.
- the properties of the printed resin which may include light curing or thermal curing, and thus, the optical element array having the light-transmitter package completed.
- Specific examples are as shown in FIG. 2C, and the shape of the light-transmitting part package is preferably in the shape of a dome as shown in the figure.
- the present invention provides a light-transmitting part package device of the optical element that can proceed the method of forming the light-transmitting portion of the optical element of the present invention, which is all around the light-receiving portion or the light-emitting portion for the optical element having a light receiving portion or Or a light emitting part package device of an optical element comprising a screen printing apparatus for forming a light transmitting portion 5 to seal a portion, the worktable 10 configured to mount an optical element array in which a plurality of the optical elements are arranged on a plane; A screen (20) having a line portion (22) corresponding to each of the optical elements on the work table (10); A print working part 30 for supplying and applying a light transmitting resin on the screen; A vacuum chamber 40 containing the screen 20 and the print working part 30; A vacuum forming module 50 connected to the vacuum chamber 40; And a control unit which controls the screen 20, the print work unit 30, and the vacuum forming module 50 to screen-transmit the translucent resin through the screen 20 to form the light transmit
- a feature of the device of the present invention is that it has a vacuum chamber 40 containing such a screen 20 and a print working portion 30, thereby enabling screen printing in a vacuum as described above.
- a vacuum forming module 50 (vacuum pump and valve, etc.) connected to the vacuum chamber 40, and a translucent resin in a vacuum state through the screen 20
- a control unit (not shown) for controlling the screen 20, the print working unit 30, and the vacuum forming module 50 to screen print to form the light transmitting unit 5.
- the movement guide and the driving unit thereof which are usually required for screen printing, are additionally included.
- the screen printing equipment which is a light-transmitter package apparatus of the present invention, includes a work table (table) on which an optical element array substrate is mounted, a screen (mask) located on the upper surface of the table, a frame supporting the mask, and A fixing part spaced apart from a table and a mask, a squeegee for scanning and driving the mask image, a scraper for applying a translucent resin (organic membrane material) to the entire surface of the mask, and a driving part for driving the squeegee and the scraper.
- a work table on which an optical element array substrate is mounted
- a screen located on the upper surface of the table
- a frame supporting the mask and A fixing part spaced apart from a table and a mask
- a squeegee for scanning and driving the mask image
- a scraper for applying a translucent resin (organic membrane material) to the entire surface of the mask
- a driving part for driving the squeegee and the scraper.
- It can be composed of a vacuum chamber that can contain all the above components and a vacuum forming module (pump and trap) that can maintain the vacuum conditions, and can maintain a proper vacuum state to proceed in the vacuum screen printing process It can be configured to control the pressure of about 10-7 torr.
- a vacuum forming module pump and trap
- the optical element is a BLU for an LCD panel in which LEDs are arranged in an array form
- the wire portion 22 is a circle or an ellipse, as shown in FIG. Or you can construct it with polygons.
- the method and apparatus for transmitting light package of the optical element of the present invention By applying the vacuum screen printing process, it is possible to form a uniform organic film (dome-shaped light-transmitting part) on a large area substrate (particularly applied to the production of LCD BLU made of LED) within a short time, and thus shorten the process time. In addition, it is possible to minimize the occurrence of pore that may exist in the light-transmitting portion, and to form the light-transmitting portion with less porosity in spite of various shapes according to the screen mesh and the pattern. Therefore, the light extraction efficiency and the degree of diffusion can also be adjusted according to the formation of the light-transmitting part, thereby achieving the effect of realizing uniform light characteristics.
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Abstract
The present invention relates to a method and apparatus for packaging a light-transmitting unit for an optical element, and more particularly, to a method and apparatus for packaging a light-transmitting unit, which involve forming a light-transmitting unit for encapsulating a portion or the entirety of a periphery of a light-receiving unit or a light-emitting unit for an optical element having the light-receiving unit or the light-emitting unit, wherein the method for packaging a light-transmitting unit comprises: a step of preparing an optical element array in which a plurality of optical elements are arranged on a plane; a step of preparing a screen having image units corresponding to the respective optical elements; and a step of screen-printing a light-transmitting resin in a vacuum state through the screen to form the light-transmitting unit. As described above, the method of the present invention involves implementing a vacuum screen-printing process to form a uniform organic film (i.e., a dome-shaped light-transmitting unit) on a substrate with a large area (in particular, a substrate applied in fabricating a BLU for an LCD consisting of LEDs) in a short amount of time, to thereby shorten a process time, minimize the generation of pores in the light-transmitting unit, and form the light-transmitting unit with fewer pores even when the light-transmitting unit may have various shapes in accordance with meshes of the screen and patterns. Accordingly, the formation of the light-transmitting unit enables light extraction efficiency and the diffusivity of light to be controlled, thereby obtaining optical elements with uniform light characteristics.
Description
본 발명은 광학소자의 투광부 패키지 방법 및 장치에 관한 것으로, 더욱 상세하게는 진공 스크린 인쇄 공정을 적용하여 대 면적 substrate(특히, LED로 이루어진 LCD용 BLU제작에 적용되는)에 짧은 시간 내에 균일한 유기막(돔형상의 투광부)을 형성할 수 있어 공정시간을 단축할 수 있고, 투광부내에 존재할 수 있는 pore의 발생을 최소화하고, 스크린 메시 및 패턴에 따라 다양한 형상에도 불구하고 기공의 발생이 적은 투광부를 형성할 수 있다. 따라서 투광부의 형성에 따라 광 추출효율 및 확산도 또한 조절이 가능하여 균일한 빛의 특성을 구현할 수 있는 광학소자의 투광부 패키지 방법 및 장치에 관한 것이다.The present invention relates to a method and apparatus for packaging a light transmitting part of an optical element, and more particularly, by applying a vacuum screen printing process, it is uniform to a large area substrate (particularly applied to the production of a BLU for an LCD composed of LEDs) within a short time. The organic film (dome-shaped light-transmitting part) can be formed to shorten the process time, minimize the occurrence of pore that may exist in the light-transmitting part, and generate less pores despite various shapes depending on the screen mesh and pattern. The light transmitting part can be formed. Accordingly, the present invention relates to a light emitting unit package method and apparatus for controlling light extraction efficiency and diffusivity according to formation of a light transmitting unit to realize uniform light characteristics.
광학소자는 빛을 받아들이거나, 빛을 발하는 소자를 포괄적으로 의미하는 것으로 실질적으로 빛을 받아들이거나 발하는, 수광부 또는 발광부와, 이를 보호하기 위하여 이의 주위에 대하여 일부 또는 전부를 감싸는 패키지로 이루어지는데, 외부의 빛을 받거나, 소자자체가 빛을 내보내기 위해서는 이러한 패키지의 일부 또는 전부는 빛을 통과시키는 투광성을 가지는 물질로 봉지되어져야 한다.An optical element is a generic term for a device that receives or emits light, and is composed of a light receiving unit or a light emitting unit that substantially receives or emits light, and a package that surrounds some or all of its surroundings to protect it. In order to receive external light or the device itself to emit light, some or all of these packages must be encapsulated with a light-transmissive material.
상기 광학소자의 구체적인 예로는 LED (이에는 무기LED 및 유기LED를 포함한다.)나 이러한 LED를 BLU의 광원으로 사용하는 LED를 탑재한 BLU(이는 최근에 LCD 패널에 주로 적용되고 있다.), 염료감응 태양전지 등을 들 수 있다.Specific examples of the optical element include an LED (which includes inorganic LEDs and organic LEDs) or a BLU equipped with an LED using such an LED as a light source of the BLU (which is mainly applied to LCD panels recently). And dye-sensitized solar cells.
특히, LED(Light Emitting Diode:발광다이오드)는 고효율, 고속응답, 장 수명, 소형화, 경량, 저 소비 전력에 의한 에너지 절감 등의 장점과 함께, 일산화탄소 발생이 전혀 없고 무 수은 광원이므로, 폐기물처리가 간편한 친환경 광원으로 우수한 특징을 가지고 있어, 많은 용도에 응용되고 있으며, 근래에 들어서는 LCD 디스플레이 패널의 BLU에 적용되는 광원으로서의 역할도 수행하고 있다.In particular, the LED (Light Emitting Diode) has high efficiency, high-speed response, long life, miniaturization, light weight, and energy saving due to low power consumption. It is an eco-friendly light source that has excellent characteristics and is applied to many applications. In recent years, it also plays a role as a light source applied to the BLU of an LCD display panel.
이와 같은 LED 광 반도체 소자의 투광부를 형성하는 봉지재는 광학적인 투명성, UV에 대한 내광성, LED의 열 방출에 대한 내열성 및 방열성, 광 추출효율의 향상을 위한 고 굴절성, 반사를 위한 은 코팅 면에 대한 접착력의 신뢰성, 점도(공정적용 가능한 수준), 열응력 완화를 위한 저수축력의 재료, 내습성, 발열에 대한 고난연성 등의 엄격한 물성을 요구한다.The encapsulant forming the light-transmitting part of the LED optical semiconductor device has optical transparency, light resistance to UV, heat resistance and heat dissipation for LED heat emission, high refractive index for improving light extraction efficiency, and a silver coating surface for reflection. It requires strict physical properties such as reliability of adhesive force, viscosity (level applicable to process), low shrinkage material for thermal stress relief, moisture resistance, and high flame resistance to heat generation.
또한 이와 같은 봉지재로 상기 투광부를 형성하는 방법으로 몰드 방법 또는 dotting(또는 dispensing)공정이 적용되나, 몰드 방법이나 DOTTING 방법의 경우에는 유기막(돔형상의 투광부)을 형성하는데 공정시간이 많이 소요되고, 몰드방법의 경우에는 몰드 제작 등의 비용이 증가하고, DOTTING공정의 경우에는 dotting된 투광부가 일정한 형태를 가지기 위하여 고점도의 유기재료를 사용하게 되어 기포의 제거 및 핸들링에 어려움이 있으며, 주입량 및 주입양상이 각 LED마다 달라 각각의 유기막(돔)의 형상이 일정하지 않아 전체적인 빛의 특성이 달라지는 문제점이 있다. 이는 특히 LED를 광원으로 하는 LCD용 BLU의 경우, 전체 패널에 대하여 고른 발광 특성을 요구하는데 배열된 LED가 각각 광 특성이 달라지는 문제를 일으킬 수 있다.In addition, a mold method or a dotting (or dispensing) process is applied as a method of forming the light-transmitting part with such an encapsulant, but in the case of the mold method or the DOTTING method, it takes a long time to form an organic film (dome-shaped light-transmitting part). In the case of the mold method, the cost of mold production, etc. increases, and in the case of the DOTTING process, the doted light-transmitting part uses a high viscosity organic material in order to have a uniform shape, which makes it difficult to remove and handle bubbles. Since the injection pattern is different for each LED, there is a problem in that the shape of each organic film (dome) is not constant so that the overall light characteristics are different. This is particularly the case for the LCD BLU using the LED as a light source, even if the entire panel requires a light emission characteristic can cause a problem that each of the arrayed LED is different in light characteristics.
이러한 문제를 해결하기 위하여 대한민국 공개특허 제2004-105063호에서는 스크린 인쇄법을 이용하여 투광부를 형성하는 방법을 제안하고 있으나, 통상의 스크린 인쇄의 경우에는 도 1에 도시한 바와 같이, 점도가 높은 경우에는 망상의 관통부로 이루어진 화선부를 지나면서 기공(PORE)이 형성되고, 점도가 낮은 경우에는 형상제어가 어려운 문제점이 있다.In order to solve such a problem, Korean Patent Laid-Open Publication No. 2004-105063 proposes a method of forming a light transmitting part using a screen printing method, but in the case of a conventional screen printing, as shown in FIG. There is a problem that pores are formed while passing through the wire portion formed by the reticulated through portion, and when the viscosity is low, shape control is difficult.
따라서 실질적으로는 스크린 인쇄법을 적용하지 못하고 현재까지도 LED 패키지 공정은 단위 셀을 dispensing공정으로 진행하는 방식으로 이를 진행하고 있으며, 이에 따라 여전히 공정시간이 많이 소요되고 각각의 유기막(돔)의 형상이 일정하지 않아 전체적이 빛의 특성이 달라지는 문제점을 가지고 있어서, 이러한 문제점을 해결할 수 있는 방법 및 장치의 개발이 절실한 실정이다.Therefore, the screen printing method is not practically applied, and until now, LED package process is proceeding by dispensing the unit cell. Thus, the process time is still high and the shape of each organic film (dome) Since it is not constant, there is a problem that the overall characteristics of the light is different, the development of a method and apparatus that can solve this problem is urgently needed.
상기와 같은 종래기술의 문제점을 해결하고자, 본 발명은 진공 스크린 인쇄 공정을 적용하여 대 면적 substrate(특히, LED로 이루어진 LCD용 BLU제작에 적용되는)에 짧은 시간 내에 균일한 유기막(돔형상의 투광부)을 형성할 수 있어 공정시간을 단축할 수 있고, 투광부내에 존재할 수 있는 pore의 발생을 최소화하고, 스크린 메시 및 패턴에 따라 다양한 형상에도 불구하고 기공의 발생이 적은 투광부를 형성할 수 있다. 따라서 투광부의 형성에 따라 광 추출효율 및 확산도 또한 조절이 가능하여 균일한 빛의 특성을 구현할 수 있는 광학소자의 투광부 패키지 방법 및 장치를 제공하는 것을 목적으로 한다.In order to solve the problems of the prior art as described above, the present invention is applied to a large area substrate (particularly applied to the production of BLU for LCD made of LED) by applying a vacuum screen printing process in a uniform organic film (dome-shaped osmosis) within a short time Miner), which can shorten the process time, minimize the occurrence of pore that may exist in the light-transmitting part, and form a light-transmitting part with less pore generation despite various shapes depending on the screen mesh and pattern. . Accordingly, an object of the present invention is to provide a method and apparatus for packaging a light emitting part of an optical device capable of controlling light extraction efficiency and diffusivity according to formation of a light transmitting part, thereby implementing uniform light characteristics.
상기 목적을 달성하기 위하여, 본 발명은In order to achieve the above object, the present invention
수광부 또는 발광부를 가지는 광학소자에 대하여 상기 수광부 또는 발광부 주위의 전부 또는 일부를 봉지하는 투광부를 형성하는 투광부 패키지 방법에 있어서, A light transmitting part packaging method for forming a light transmitting part for encapsulating all or part of a light receiving part or a periphery of a light emitting part with respect to an optical element having a light receiving part or a light emitting part,
다수의 상기 광학소자가 평면상에 배열되는 광학소자 어레이를 준비하는 단계; Preparing an optical element array in which a plurality of the optical elements are arranged on a plane;
상기 광학소자들에 각각 대응하는 화선부를 가지는 스크린을 준비하는 단계; 및, Preparing a screen having a line portion corresponding to each of the optical elements; And,
진공상태에서 투광성 수지를 상기 스크린을 통하여 스크린 인쇄하여 상기 투광부를 형성하는 단계를 포함하는 것을 특징으로 하는 광학소자의 투광부 패키지 방법을 제공한다.It provides a light emitting unit package method of the optical element comprising the step of forming the light transmitting portion by screen printing the transparent resin through the screen in a vacuum state.
또한 본 발명은 In addition, the present invention
수광부 또는 발광부를 가지는 광학소자에 대하여 상기 수광부 또는 발광부 주위의 전부 또는 일부를 봉지하는 투광부를 형성하는 스크린 인쇄 장치로 이루어진 광학소자의 투광부 패키지 장치에 있어서, A light-transmitting part package apparatus for an optical element comprising a screen printing apparatus which forms a light-transmitting portion for encapsulating all or a portion of the light-receiving portion or the light emitting portion surrounding the light-receiving portion or the light-emitting portion.
다수의 상기 광학소자가 평면상에 배열되는 광학소자 어레이를 거치하는 작업대;A work table for mounting an optical element array in which a plurality of the optical elements are arranged on a plane;
상기 작업대 상의 상기 광학소자들에 각각 대응하는 화선부를 가지는 스크린; A screen having a line portion respectively corresponding to the optical elements on the work table;
상기 스크린 상에서 투광성 수지를 공급하고 도포하는 인쇄 작업부;A printing working part for supplying and applying a light transmitting resin on the screen;
상기 스크린 및 인쇄 작업부를 내포하는 진공챔버;A vacuum chamber containing the screen and print working portion;
상기 진공챔버에 연결되는 진공 형성 모듈; 및, A vacuum forming module connected to the vacuum chamber; And,
진공상태에서 투광성 수지를 상기 스크린을 통하여 스크린 인쇄하여 상기 투광부를 형성하도록 상기 스크린과 인쇄 작업부 및 진공 형성 장치를 제어하는 제어부를 포함하는 것을 특징으로 하는 광학소자의 투광부 패키지 장치를 제공한다.And a control unit for controlling the screen, the printing work unit, and the vacuum forming apparatus to screen-print the translucent resin through the screen in a vacuum state to form the transmissive portion.
본 발명의 광학소자의 투광부 패키지 방법 및 장치에 따르면. 진공 스크린 인쇄 공정을 적용하여 대 면적 substrate(특히, LED로 이루어진 LCD용 BLU제작에 적용되는)에 짧은 시간 내에 균일한 유기막(돔형상의 투광부)을 형성할 수 있어 공정시간을 단축할 수 있고, 투광부내에 존재할 수 있는 pore의 발생을 최소화하고, 스크린 메시 및 패턴에 따라 다양한 형상에도 불구하고 기공의 발생이 적은 투광부를 형성할 수 있다. 따라서 투광부의 형성에 따라 광 추출효율 및 확산도 또한 조절이 가능하여 균일한 빛의 특성을 구현할 수 있는 효과를 얻을 수 있다.According to the method and apparatus for transmitting light package of the optical element of the present invention. By applying the vacuum screen printing process, it is possible to form a uniform organic film (dome-shaped light-transmitting part) on a large area substrate (particularly applied to the production of LCD BLU made of LED) within a short time, and thus shorten the process time. In addition, it is possible to minimize the occurrence of pore that may exist in the light-transmitting portion, and to form the light-transmitting portion with less porosity in spite of various shapes according to the screen mesh and the pattern. Therefore, the light extraction efficiency and the degree of diffusion can also be adjusted according to the formation of the light-transmitting part, thereby achieving the effect of realizing uniform light characteristics.
도 1은 일반적인 스크린 인쇄공정에서 기공(Pore)발생에 대한 개념을 개략적으로 도시한 단면도이다.1 is a cross-sectional view schematically illustrating the concept of pore generation in a general screen printing process.
도 2는 본 발명의 광학소자의 투광부 패키지 방법이 적용될 수 있는 광학소자 어레이의 평면도(a)와 이에 대응하는 스크린 인쇄용 스크린의 평면도(b)와 이에 의하여 제작된 투광부 패키지가 형성된 광학소자 어레이의 단면도(c)를 개략적으로 도시한 도면이다.FIG. 2 is a plan view (a) of an optical element array to which the light emitting unit package method of the optical element of the present invention can be applied, a plan view (b) of a screen printing screen corresponding thereto, and an optical element array having a light emitting unit package manufactured thereby A schematic cross-sectional view (c) of FIG.
도 3은 본 발명의 광학소자의 투광부 패키지 장치에 대한 일 실시예를 개략적으로 도시한 시스템 개략도이다.3 is a system schematic diagram schematically showing an embodiment of a light emitting unit package apparatus of an optical device according to the present invention.
도 4는 본 발명의 광학소자의 투광부 패키지 장치에 적용될 수 있는 스크린의 화선부 패턴의 다양한 실시예를 도시한 평면도 도면이다.4 is a plan view illustrating various embodiments of a wire pattern of a screen that may be applied to a light emitting unit package apparatus of an optical device of the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
5: 투광부 7: 기지(PCB 기판)5: light-transmitting part 7: base (PCB board | substrate)
10: 작업대 20: 스크린10: Workbench 20: Screen
22: 스크린의 화선부(인쇄가 이루어지는 부분)22: wire part of screen (printing part)
30: 인쇄 작업부 40: 진공챔버30: printing work part 40: vacuum chamber
50: 진공 형성 모듈50: vacuum forming module
이하 본 발명을 상세하게 설명한다. Hereinafter, the present invention will be described in detail.
본 발명의 광학소자의 투광부 패키지 방법은 수광부 또는 발광부를 가지는 광학소자에 대하여 상기 수광부 또는 발광부 주위의 전부 또는 일부를 봉지하는 투광부(5)를 형성하는 투광부 패키지 방법에 있어서, 다수의 상기 광학소자가 평면상에 배열되는 광학소자 어레이를 준비하는 단계; 상기 광학소자들에 각각 대응하는 화선부(22)를 가지는 스크린(20)을 준비하는 단계; 및, 진공상태에서 투광성 수지를 상기 스크린을 통하여 스크린 인쇄하여 상기 투광부를 형성하는 단계를 포함하는 구성으로 이루어진다.The light-transmitting part packaging method of the optical element of the present invention is a light-transmitting part packaging method for forming a light-transmitting part 5 for encapsulating all or part of the light-receiving part or the periphery of the light-receiving part with respect to an optical element having a light-receiving part or a light-emitting part. Preparing an optical element array in which the optical elements are arranged on a plane; Preparing a screen 20 having a line portion 22 corresponding to each of the optical elements; And screen printing the translucent resin through the screen to form the translucent portion in a vacuum state.
이에 대한 상세한 설명은 도면을 참고하여 설명한다. Detailed description thereof will be described with reference to the accompanying drawings.
즉, 본 발명의 광학소자의 투광부 패키지 방법은 광학소자에서 빛을 받아들이는 수광부 또는 빛을 발하는 발광부에서 빛이 통과하는 부위인 투광부를 형성하는 방법으로 스크린 인쇄를 적용함에 있어서, 이러한 스크린 인쇄를 진공상태에서 수행하는 것이다.That is, in the method of packaging a light-transmitting part of the optical element of the present invention, the screen printing is applied in a method of forming a light-transmitting part which is a portion through which light passes in the light-receiving part that receives light or the light-emitting part that emits light. Is carried out in a vacuum.
즉, 도 1에 도시한 바와 같이, 통상의 스크린 인쇄로 투광성 수지를 인쇄하여 투광부 패키지를 형성하는 경우에는, 수지가 스크린 위에서 아래로 통과하여 스크린 아래쪽으로 이동할 수 있는 화선부가 망상구조로 이루어지므로, 상기 망상구조를 이루고 있는 와이어를 지나면서 기공(PORE)이 형성되는 경우가 자주 발생하게 되고, 이와 같이 기공을 가지는 투광부가 형성되면 광 특성이 떨어지는 문제점이 있다.That is, as shown in Figure 1, in the case of forming the light-transmissive part package by printing the light-transmissive resin by the usual screen printing, since the wire portion that the resin passes through the top of the screen to move below the screen is made of a network structure In some cases, pores are frequently formed while passing through the wires forming the network structure, and thus, when the light-transmitting part having the pores is formed, there is a problem in that optical characteristics are deteriorated.
그런데 이와 같은 스크린 인쇄공정을 진공상태에서 수행하게 되면, 도 1에 도시한 바와 같이 와이어 사이를 통과함에 따라 수지가 와이어에 의하여 분리된 후 다시 결합하는 사이에 PORE가 형성되더라도, PORE의 내부에 아무것도 존재하지 않아 결합 후에 PORE가 없어지거나 아주 미세한 기공으로만 존재하게 되어 기공발생에 따른 광 특성 저하를 최소화할 수 있는 것이다.However, when the screen printing process is performed in a vacuum state, as shown in FIG. 1, even though PORE is formed between the resins separated by the wires and then re-bonded as they pass between the wires, nothing is inside the PORE. Since there is no PORE after binding or only very small pores after bonding, it is possible to minimize the deterioration of optical properties due to pore generation.
여기서 상기 광학소자는 상기 기술한 바와 같이, 빛을 받아들이거나, 빛을 발하는 소자를 포괄적으로 의미하는 것으로 따라서 수광부 또는 발광부를 가진다. 또한 상기 수광부 또는 발광부의 보호를 위하여 이에 대한 봉지(패키지)가 필요한데, 먼저 수광 소자의 경우에는 상기 수광부의 수광을 위하여 외부로부터 수광부까지의 경로는 투광성을 가지는 물질로 패키지 되고, 이 부분이 수광 소자의 투광부 패키지가 되고, 다음으로 발광소자의 경우에는 상기 발광부의 발광된 빛이 외부로 조사되기 위하여 발광부로부터 외부까지의 경로는 투광성을 가지는 물질로 패키지 되고, 이 부분이 발광소자의 투광부 패키지가 된다.As described above, the optical element broadly means an element that receives light or emits light, and thus has a light receiving portion or a light emitting portion. In addition, in order to protect the light-receiving unit or the light-emitting unit, an encapsulation (package) is required. First, in the case of the light-receiving element, a path from the outside to the light-receiving unit is packaged with a light-transmitting material for receiving the light-receiving unit. The light emitting element package is a light emitting element, and in the case of a light emitting element, a path from the light emitting portion to the outside is packaged with a light transmitting material so that the emitted light of the light emitting portion is irradiated to the outside. It becomes a package.
이에 대한 예로는 LED (이에는 무기LED 및 유기LED(OLED)를 포함한다.)나 이러한 LED를 BLU의 광원으로 사용하는 LED를 탑재한 BLU(이는 최근에 LCD 패널에 주로 적용되고 있다.), 염료감응 태양전지 등을 들 수 있다. 바람직하게는 각 LED의 투광부 패키지가 균일할 것을 높게 요구하는 LED가 ARRAY형태로 배열된 LCD패널용 BLU(BACK LIGHT UNIT)에 본 발명을 적용하는 경우에 우수한 품질의 BLU를 제공할 수 있으므로 좋다. 이에 대한 구체적인 도면은 도 2의 (c)에 도시한 바와 같다.Examples include LEDs (which include inorganic LEDs and organic LEDs) or BLUs with LEDs that use these LEDs as light sources for BLUs (which have recently been applied to LCD panels). And dye-sensitized solar cells. Preferably, when the present invention is applied to an LCD panel BLU (BACK LIGHT UNIT) in which the LEDs requiring high uniformity of the light emitting part package of each LED are arranged in an ARRAY shape, the BLU of good quality may be provided. . Detailed drawings thereof are as shown in FIG.
이러한 투광부 패키지를 pore의 형성 없이 스크린 인쇄로 제작하기 위하여 먼저, 다수의 상기 광학소자가 평면상에 배열되는 광학소자 어레이를 준비한다. 상기 광학소자는 상기 기술한 바와 같으며, 스크린 인쇄의 경우에 다수의 광학소자 봉지를 동시에 수행할 수 있고, 이를 통하여 생산성을 향상할 수 있으므로, 다수의 상기 광학소자가 스크린 인쇄가 이루어질 수 있도록 평면상에 배열되는 광학소자 어레이를 준비한다. 이에 대한 구체적인 예는 도 2의 (a)에 도시한 바와 같다. 여기서 상기 광학소자는 각각이 별도로 독립적인 기능을 구현하는 형태로 어레이 배열할 수도 있고, LCD 패널의 BLU 등에 적용되기 위하여 다수의 광학소자가 서로 연결되어 하나의 제어부에 의하여 제어되어질 수 있도록 집적된 형태일 수도 있다. 각각이 독립된 경우에는 패키지가 완료된 이후에 각 소자별로 분리하는 공정을 통하여 개별소자로서 작동할 수 있다.In order to manufacture such a light-transmitter package by screen printing without forming a pore, first, an optical element array in which a plurality of the optical elements are arranged on a plane is prepared. The optical device is as described above, and in the case of screen printing, it is possible to simultaneously perform a plurality of optical device encapsulation, thereby improving productivity, so that the plurality of optical devices can be screen-printed. Prepare an optical element array arranged on the. Specific examples thereof are as shown in FIG. In this case, the optical elements may be arranged in a form in which each independently implements an independent function. In order to be applied to a BLU of an LCD panel, the optical elements may be integrated so that a plurality of optical elements may be connected to each other and controlled by a single controller. It may be. In the case where each is independent, after the package is completed, it may be operated as an individual device through a process of separating each device.
여기서 본 발명에 사용되는 상기 광학소자 어레이의 기판(7)재료로서는 glass류, 플라스틱류 등이 모두 가능하며, LCD BLU를 COB(Chip On Board)공정에 적용하기 위해서는 PCB를 구성하는 재료로 제작된 substrate(7)를 사용하는 것이 가장 바람직하다.Here, the substrate 7 material of the optical element array used in the present invention may be glass, plastics, or the like. In order to apply the LCD BLU to a chip on board (COB) process, a material constituting the PCB may be used. Most preferably, the substrate 7 is used.
다음으로, 상기 광학소자들에 각각 대응하는 화선부(22)를 가지는 스크린(20)을 준비하는 단계를 수행한다. 이는 통상의 LCD공정이나 패키지 공정에 적용되는 스크린 인쇄용 스크린이 이에 해당할 수 있으며, 상기 화선부는 수지가 스크린 위에서 아래로 통과하여 스크린 아래쪽으로 이동할 수 있는 스크린 중의 개방부분을 지칭하는 부분이다. 이에 대한 구체적인 예는 도 2의 (b)에 도시한 바와 같다.Next, a step of preparing the screen 20 having the line portion 22 corresponding to each of the optical elements is performed. This may correspond to a screen printing screen applied to a conventional LCD process or a package process, and the wire portion refers to an open portion of the screen through which the resin may move downward from the top of the screen and move downward. Specific examples thereof are as shown in FIG.
여기서 상기 화선부의 형상에 따라 투광부의 형상이 결정되므로, 상기 화선부는 광학소자의 요구되는 특성에 따라 다양한 형상을 가질 수 있으며, 도 2의 (b)에 도시한 바와 같이 전체 화선부의 형상이 동일할 수도 있고, 영역별로 다른 형상을 가질 수도 있다. 이러한 화선부의 형상에 대한 구체적인 예는 도 4에 도시한 바와 같다. 즉, 상기 화선부는 원 또는 타원 또는 다각형의 형태로 이를 구성할 수 있다.Since the shape of the light transmitting part is determined according to the shape of the wire line part, the wire line part may have various shapes according to the required characteristics of the optical element, and as shown in FIG. It may have a different shape for each region. A specific example of the shape of the wire portion is as shown in FIG. 4. That is, the wire part may be configured in the form of a circle, an ellipse or a polygon.
다음으로, 상기 준비되어진 광학소자 어레이에 상기 스크린을 적용하여 스크린 인쇄를 수행함에 있어서, 상기 인쇄공정은 기공 생성을 막기 위하여 진공상태에서 이를 수행한다. 즉, 진공상태에서 투광성 수지를 상기 스크린을 통하여 스크린 인쇄하여 상기 투광부를 형성하는 단계를 수행한다.Next, in performing screen printing by applying the screen to the prepared optical element array, the printing process is performed in a vacuum state to prevent pore generation. That is, the step of forming the light transmitting portion by screen-printing the transparent resin through the screen in a vacuum state.
여기서 상기 투광성 수지는 통상의 투광부 형성수지가 모두 여기에 적용될 수 있으며, 바람직하게는 유기막 재료로서는 실리콘수지 또는 에폭시수지 또는 PMMA(poly methyl methacrylate) 수지, PC(polycarbonate) 등 인쇄공정에 적용이 가능하고 고 굴절률을 가지며 열 경화 또는 광 경화 공정으로 경화할 수 있는 수지조성물이면 모두 가능하다. Here, the light-transmissive resin may be applied to all of the conventional light-transmitting part forming resins. Preferably, the organic film material may be applied to a printing process such as silicone resin or epoxy resin or PMMA (poly methyl methacrylate) resin, PC (polycarbonate), and the like. As long as it is possible and it has a high refractive index, and can be hardened | cured by the thermosetting or photocuring process, it is all possible.
대표적인 수지인 실리콘 수지조성물의 구성성분은 크게 하기와 같이 구성될 수 있다. Components of the silicone resin composition which is a typical resin can be largely configured as follows.
1. 실리콘계 수지(밀봉용 수지)1. Silicone resin (sealing resin)
본 수지 조성물의 실리콘 수지는 말단이 알케닐 작용성 관능기를 가지는 알킬기 또는 페닐기를 함유한 폴리오가노실록산이 바람직하며, 특히 본 폴리오가노실록산은 직쇄, 측쇄, 사이클릭 또는 수지상 실록산 구조를 가질 수 있다. 알케닐 작용성 관능기의 폴리오가노실록산은 단일 성분일 수 있거나, 하나 이상의 알케닐 작용성 페닐 함유 폴리오가노실록산을 포함하는 조합물일 수 있다. The silicone resin of the present resin composition is preferably a polyorganosiloxane containing an alkyl group or a phenyl group at the terminal, and particularly the present polyorganosiloxane may have a linear, branched, cyclic or dendritic siloxane structure. The polyorganosiloxane of the alkenyl functional functional group may be a single component or may be a combination comprising one or more alkenyl functional phenyl containing polyorganosiloxanes.
특히 말단이 알케닐 작용성 관능기를 가지는 페닐 함유 폴리오가노실록산이 바람직하다.In particular, the phenyl containing polyorganosiloxane which has the terminal alkenyl functional group is preferable.
2. 가교수지2. Crosslinked resin
이에 대한 예로는 1개 분자 중에 2개 이상의 Si-H결합을 가지는 오르가노하이드로젠폴리실록산을 들 수 있으며, 이의 함량은 상기 밀봉용 수지 100중량부에 대해 2~100 중량부가 바람직하며, 특히 바람직하게는 10~50 중량부일 수 있다.Examples thereof include organohydrogenpolysiloxanes having two or more Si—H bonds in one molecule, and the content thereof is preferably 2 to 100 parts by weight, particularly preferably 100 parts by weight of the sealing resin. May be 10 to 50 parts by weight.
본 성분의 배합양이 지나치게 적으면 점도가 높아 작업성이 열악해질 우려가 있고, 또한 가교가 불충분하고 경화물의 강도가 열악해질 우려가 있다. 또한, 지나치게 많으면 상기 밀봉용 수지 성분의 레진의 보강 효과가 불충분해지고, 역시 경화물의 강도가 저하될 우려가 있다.When there is too little compounding quantity of this component, a viscosity may be high and workability may become inferior, crosslinking may become inadequate and the strength of hardened | cured material may become inferior. Moreover, when too much, the reinforcement effect of the resin of the said resin component for sealing may become inadequate, and there also exists a possibility that the intensity | strength of hardened | cured material may fall.
3. 부가 반응 촉매3. Addition reaction catalyst
여기에 부가반응 촉매를 더 포함 시킬 수 있는, 이는 상기 실리콘계 수지와 가교수지 중 Si-H기와의 히드로실릴화 부가 반응을 촉진하기 위한 촉매이고, 이 부가 반응 촉매로서는 백금흑, 염화제2백금, 염화백금산과 올레핀류와의 착체, 백금 비스아세토아세테이트 등의 백금계 촉매, 팔라듐계 촉매, 로듐계 촉매 등의 백금족 금속 촉매를 들 수 있다. 이 들 중에서도, 동등한 효과를 발휘할 수 있는 백금계 화합물이면, 바람직하다.It may further include an addition reaction catalyst, which is a catalyst for promoting hydrosilylation addition reaction between the silicone-based resin and the Si-H group in the crosslinking resin, and as the addition reaction catalyst, platinum black, platinum chloride, chloride Platinum group metal catalysts, such as a complex of a platinum acid and olefins, platinum-based catalysts such as platinum bisacetoacetate, palladium-based catalysts, and rhodium-based catalysts. Among these, it is preferable if it is a platinum compound which can exhibit the equivalent effect.
4. 충진제 : 오가노실리케이트류의 충진4. Filler: Filling of organosilicates
상기 충진제는 실리콘계 봉지 조성물의 경화시 도막강도(Strength)를 향상시키거나 발광 소자에서 나오는 광의 굴절률을 조정하기 위해 사용할 수 있다. 경화시 도막강도를 향상시킬 목적의 충진제는 말단이 알케닐 작용성기를 가지거나 SiH 관능기를 지니는 오가노실리케이트류면 바람직하다. 또한 광 추출시 굴절률을 조정하기 위한 충진제로서는 SiO2 또는 SiO2 및 B2O3을 주성분으로 하고, 통상적으로 ZnO또는 TiO2를 배합한다. The filler may be used to improve the coating film strength (strength) during the curing of the silicone-based encapsulation composition or to adjust the refractive index of light emitted from the light emitting device. Fillers for the purpose of improving the coating film strength at the time of curing are preferably organosilicates having alkenyl functional groups or SiH functional groups. In addition, as a filler for adjusting refractive index at the time of light extraction, SiO2 or SiO2 and B2O3 are main components, and ZnO or TiO2 is mix | blended normally.
특히, 상기 충진제는 종래의 프레이크(flake)와 함께, 밀봉용 수지의 경화 후, 저 수축률(low shrinkage) 또는 요변성(Thixotropy) 등을 부여할 수 있는 특징을 가지고 있다.In particular, the filler has a feature that can impart low shrinkage or thixotropy after curing of the sealing resin together with a conventional flake.
5. 기타 첨가제(개질제)5. Other additives (modifiers)
상기 기타 첨가제는 본 발명의 밀봉용 수지의 조성물의 구체적인 구현 요건에 따라 경화특성 또는 비경화 특성을 개질시키기 위한 기타 성분을 포함할 수 있는데, 필요에 따라, 열전도성 강화제, 가요성부여제, 산화방지제, 가소제, 윤활제, 실란계 등의 커플링제, 무기충전제의 표면처리제, 난연제, 대전방지제, 레벨링제, 무기이온교환체, 소포제, 광확산제 등의 첨가제를 얻어지는 경화체의 특성을 해치지 않는 범위에서 배합할 수 있다.The other additives may include other components for modifying the curing properties or non-curing properties according to the specific implementation requirements of the composition of the sealing resin of the present invention, if necessary, thermal conductivity enhancers, flexible additives, antioxidants , Compounding agent such as plasticizer, lubricant, silane-based coupling agent, surface filler of inorganic filler, flame retardant, antistatic agent, leveling agent, inorganic ion exchanger, antifoaming agent, light diffusing agent, etc. can do.
예를 들어, 접착 촉진제로서, (메트)아크릴옥시프로필트리메톡시실란, 트리알킬 또는 트리알릴 이소시아누레이트, 글리시독시프로필트리메톡시실란 및 비닐트리메톡시실란 등을 밀봉용 약 5 중량% 이하의 양으로 첨가 할 수 있다.For example, about 5 weights for sealing (meth) acryloxypropyltrimethoxysilane, trialkyl or triallyl isocyanurate, glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, etc. as an adhesion promoter. It can be added in an amount of less than or equal to%.
또한, 산화방지제로서, 예를 들어 페놀(phenol)계, 유황계, 인계 산화 방지제 등을 들 수 있으며, 이 중 대표적인예로서는 트리페닐 포스페이트(triphenyl phosphate), 디페닐 데실 포스페이트(diphenyl decyl phosphate) 등의 팔라듐 크레졸(palladium Cresol) 등을 들 수 있다.In addition, examples of the antioxidants include phenol, sulfur, and phosphorus antioxidants. Representative examples thereof include triphenyl phosphate and diphenyl decyl phosphate. Palladium Cresol etc. can be mentioned.
또한 굴절률을 향상시키기 위하여 filler를 포함할 수도 있으며 사용되는 필러는 특별히 크기를 한정하지는 않으나 가시광선 파장대의 빛의 광 추출효율을 향상시키기 위하여 파장대의 1/4크기의 필러를 사용하는 것이 가장 바람직하며 본 필러를 적용할 경우 유기막재료에 분산 시킨 후 진공 스크린 인쇄 공정에 적용할 수 있다. In addition, fillers may be included to improve refractive index, and the filler used is not particularly limited in size, but in order to improve light extraction efficiency of light in the visible wavelength band, it is most preferable to use a filler having a size of 1/4 in the wavelength band. In the case of applying this filler, it can be applied to a vacuum screen printing process after being dispersed in an organic film material.
또한 본 발명에 사용된 광학소자 중 LED chip의 종류와 구성에 따라 백색광을 구현할 경우 형광체는 Blue LED chip + Yellow 형광체, UV-LED와 RGB형광체를 사용할 수 있다.In addition, when the white light is implemented according to the type and configuration of the LED chip among the optical elements used in the present invention, the phosphor may use a blue LED chip + yellow phosphor, UV-LED and RGB phosphor.
이와 같은 형태의 투광성 수지를 인쇄한 후에는 인쇄된 수지의 특성에 따라 경화과정을 진행할 수 있는데, 이에는 광 경화 또는 열 경화 등을 들 수 있고, 이에 따라 투광부 패키지가 완료된 광학소자 어레이에 대한 구체적인 예는 도 2의 (c)에 도시한 바와 같으며, 상기 투광부 패키지의 형상은 바람직하게는 도시한 바와 같이 돔 형상을 가지는 것이 광 특성상 바람직하다.After printing the light-transmissive resin of this type, the curing process may be performed according to the properties of the printed resin, which may include light curing or thermal curing, and thus, the optical element array having the light-transmitter package completed. Specific examples are as shown in FIG. 2C, and the shape of the light-transmitting part package is preferably in the shape of a dome as shown in the figure.
또한 본 발명은 이와 같은 본 발명의 광학소자의 투광부 형상방법을 진행할 수 있는 광학소자의 투광부 패키지 장치를 제공하는 바, 이는 수광부 또는 발광부를 가지는 광학소자에 대하여 상기 수광부 또는 발광부 주위의 전부 또는 일부를 봉지하는 투광부(5)를 형성하는 스크린 인쇄 장치로 이루어진 광학소자의 투광부 패키지 장치에 있어서, 다수의 상기 광학소자가 평면상에 배열되는 광학소자 어레이를 거치하는 작업대(10); 상기 작업대(10) 상의 상기 광학소자들에 각각 대응하는 화선부(22)를 가지는 스크린(20); 상기 스크린 상에서 투광성 수지를 공급하고 도포하는 인쇄 작업부(30); 상기 스크린(20) 및 인쇄 작업부(30)를 내포하는 진공챔버(40); 상기 진공챔버(40)에 연결되는 진공 형성 모듈(50); 및, 진공상태에서 투광성 수지를 상기 스크린(20)을 통하여 스크린 인쇄하여 상기 투광부(5)를 형성하도록 상기 스크린(20)과 인쇄 작업부(30) 및 진공 형성 모듈(50)을 제어하는 제어부를 포함하여 구성된다. In another aspect, the present invention provides a light-transmitting part package device of the optical element that can proceed the method of forming the light-transmitting portion of the optical element of the present invention, which is all around the light-receiving portion or the light-emitting portion for the optical element having a light receiving portion or Or a light emitting part package device of an optical element comprising a screen printing apparatus for forming a light transmitting portion 5 to seal a portion, the worktable 10 configured to mount an optical element array in which a plurality of the optical elements are arranged on a plane; A screen (20) having a line portion (22) corresponding to each of the optical elements on the work table (10); A print working part 30 for supplying and applying a light transmitting resin on the screen; A vacuum chamber 40 containing the screen 20 and the print working part 30; A vacuum forming module 50 connected to the vacuum chamber 40; And a control unit which controls the screen 20, the print work unit 30, and the vacuum forming module 50 to screen-transmit the translucent resin through the screen 20 to form the light transmitting unit 5 in a vacuum state. It is configured to include.
이에 대한 구체적인 예는 도 3에 도시한 바와 같으며, 상기 작업대, 스크린 및 인쇄 작업부(스크래퍼, 스퀴지 등을 포함하는 부분)는 통상의 스크린 인쇄에 적용되는 다양한 형태가 이에 적용될 수 있으며, 이에 대한 자세한 설명은 생략하도록 한다. 본 발명의 장치의 특징은 이러한 스크린(20) 및 인쇄 작업부(30)를 내포하는 진공챔버(40)를 가지는 것으로, 이를 통하여 상기 기술한 바와 같은 진공 상태의 스크린 인쇄가 가능하도록 한다. 상기 진공챔버에서 스크린 인쇄동안의 진공형성을 위하여, 상기 진공챔버(40)에 연결되는 진공 형성 모듈(50)(진공 펌프 및 밸브 등) 및, 진공상태에서 투광성 수지를 상기 스크린(20)을 통하여 스크린 인쇄하여 상기 투광부(5)를 형성하도록 상기 스크린(20)과 인쇄 작업부(30) 및 진공 형성 모듈(50)을 제어하는 제어부(미도시)를 가진다. 물론 여기에 스크린 인쇄를 위하여 통상적으로 요구되어지는 이동 가이드 및 이의 구동부 등이 추가적으로 포함되어짐은 물론이다.Specific examples thereof are as shown in FIG. 3, and the work table, the screen, and the printing work unit (a part including a scraper, a squeegee, etc.) may be applied to various forms applied to conventional screen printing. Detailed description will be omitted. A feature of the device of the present invention is that it has a vacuum chamber 40 containing such a screen 20 and a print working portion 30, thereby enabling screen printing in a vacuum as described above. In order to form a vacuum during screen printing in the vacuum chamber, a vacuum forming module 50 (vacuum pump and valve, etc.) connected to the vacuum chamber 40, and a translucent resin in a vacuum state through the screen 20 And a control unit (not shown) for controlling the screen 20, the print working unit 30, and the vacuum forming module 50 to screen print to form the light transmitting unit 5. Of course, the movement guide and the driving unit thereof, which are usually required for screen printing, are additionally included.
즉, 본 발명의 투광부 패키지 장치인 스크린 인쇄 장비는 광학소자 어레이 기판이 안착되는 작업대(테이블)와, 상기의 테이블 상면에 위치하는 스크린(마스크)과, 상기의 마스크를 지지하는 프레임과, 상기 테이블과 마스크를 이격시키는 고정부와, 상기 마스크 상을 스캔 구동하는 스퀴지와, 투광성 수지(유기막재료)를 상기 마스크 전면에 도포하는 스크래퍼(Scraper)와, 상기 스퀴지와 스크래퍼를 구동하는 구동부로 구성되어질 수 있고, 진공 스크린 인쇄 공정에 진행될 수 있도록 상기 모든 구성요소들이 포함될 수 있는 진공챔버와 진공조건을 유지시킬 수 있는 진공형성모듈(펌프 및 트랩)로 구성될 수 있으며, 적절한 진공상태를 유지할 수 있도록 10-7 torr정도의 압력을 제어 할 수 있도록 구성할 수 있다.That is, the screen printing equipment, which is a light-transmitter package apparatus of the present invention, includes a work table (table) on which an optical element array substrate is mounted, a screen (mask) located on the upper surface of the table, a frame supporting the mask, and A fixing part spaced apart from a table and a mask, a squeegee for scanning and driving the mask image, a scraper for applying a translucent resin (organic membrane material) to the entire surface of the mask, and a driving part for driving the squeegee and the scraper. It can be composed of a vacuum chamber that can contain all the above components and a vacuum forming module (pump and trap) that can maintain the vacuum conditions, and can maintain a proper vacuum state to proceed in the vacuum screen printing process It can be configured to control the pressure of about 10-7 torr.
물론 여기서도, 상기 기술한 바와 같이, 바람직하게는 상기 광학소자는 LED가 어레이 형태로 배열된 LCD패널용 BLU이고, 상기 화선부(22)는 도 4에 그 구체적인 예를 도시한 바와 같이, 원 또는 타원 또는 다각형으로 이를 구성할 수 있다.Of course, also, as described above, preferably, the optical element is a BLU for an LCD panel in which LEDs are arranged in an array form, and the wire portion 22 is a circle or an ellipse, as shown in FIG. Or you can construct it with polygons.
이상에서 설명한 본 발명은 전술한 상세한 설명, 실시예에 의하여 한정되는 것은 아니고, 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 해당 기술분야의 당업자가 다양하게 수정 및 변경시킨 것 또한 본 발명의 범위 내에 포함됨은 물론이다.The present invention described above is not limited to the above detailed description and examples, and various modifications and changes of those skilled in the art are possible without departing from the spirit and scope of the present invention as set forth in the claims below. Of course it is also included within the scope of the present invention.
본 발명의 광학소자의 투광부 패키지 방법 및 장치에 따르면. 진공 스크린 인쇄 공정을 적용하여 대 면적 substrate(특히, LED로 이루어진 LCD용 BLU제작에 적용되는)에 짧은 시간 내에 균일한 유기막(돔형상의 투광부)을 형성할 수 있어 공정시간을 단축할 수 있고, 투광부내에 존재할 수 있는 pore의 발생을 최소화하고, 스크린 메시 및 패턴에 따라 다양한 형상에도 불구하고 기공의 발생이 적은 투광부를 형성할 수 있다. 따라서 투광부의 형성에 따라 광 추출효율 및 확산도 또한 조절이 가능하여 균일한 빛의 특성을 구현할 수 있는 효과를 얻을 수 있다.According to the method and apparatus for transmitting light package of the optical element of the present invention. By applying the vacuum screen printing process, it is possible to form a uniform organic film (dome-shaped light-transmitting part) on a large area substrate (particularly applied to the production of LCD BLU made of LED) within a short time, and thus shorten the process time. In addition, it is possible to minimize the occurrence of pore that may exist in the light-transmitting portion, and to form the light-transmitting portion with less porosity in spite of various shapes according to the screen mesh and the pattern. Therefore, the light extraction efficiency and the degree of diffusion can also be adjusted according to the formation of the light-transmitting part, thereby achieving the effect of realizing uniform light characteristics.
Claims (6)
- 수광부 또는 발광부를 가지는 광학소자에 대하여 상기 수광부 또는 발광부 주위의 전부 또는 일부를 봉지하는 투광부를 형성하는 투광부 패키지 방법에 있어서, A light transmitting part packaging method for forming a light transmitting part for encapsulating all or part of a light receiving part or a periphery of a light emitting part with respect to an optical element having a light receiving part or a light emitting part,다수의 상기 광학소자가 평면상에 배열되는 광학소자 어레이를 준비하는 단계; Preparing an optical element array in which a plurality of the optical elements are arranged on a plane;상기 광학소자들에 각각 대응하는 화선부를 가지는 스크린을 준비하는 단계; 및, Preparing a screen having a line portion corresponding to each of the optical elements; And,진공상태에서 투광성 수지를 상기 스크린을 통하여 스크린 인쇄하여 상기 투광부를 형성하는 단계를 포함하는 것을 특징으로 하는 광학소자의 투광부 패키지 방법.And printing the light-transmitting resin through the screen to form the light-transmitting part in a vacuum state.
- 제1항에 있어서, The method of claim 1,상기 광학소자는 LED 또는 OLED 또는 LED를 BLU의 광원으로 탑재하는 LCD패널용 BLU 또는 염료감응태양전지인 것을 특징으로 하는 광학소자의 투광부 패키지 방법.The optical device is a light emitting unit package method for an optical device, characterized in that the LED panel or BLU or dye-sensitized solar cell for the LCD panel mounting the LED as a light source of the BLU.
- 제2항에 있어서,The method of claim 2,상기 광학소자는 LED가 어레이 형태로 배열되어 집적된 LCD패널용 BLU이고,The optical element is an LCD panel BLU integrated with LEDs arranged in an array form,상기 화선부는 원 또는 타원 또는 다각형인 것을 특징으로 하는 광학소자의 투광부 패키지 방법.The line unit is a light emitting unit package method of the optical element, characterized in that the circle or ellipse or polygon.
- 제1항에 있어서,The method of claim 1,상기 투광성 수지는 실리콘 수지 또는 에폭시 수지 또는 PMMA수지이고, 선택적으로 상기 투광성 수지에 충진제 또는 개질제를 더 포함하는 것을 특징으로 하는 광학소자의 투광부 패키지 방법.The light-transmitting resin is a silicone resin or epoxy resin or PMMA resin, and optionally the light-transmitting part package method of the optical element, characterized in that the light-transmitting resin further comprises a filler or modifier.
- 수광부 또는 발광부를 가지는 광학소자에 대하여 상기 수광부 또는 발광부 주위의 전부 또는 일부를 봉지하는 투광부를 형성하는 스크린 인쇄 장치로 이루어진 광학소자의 투광부 패키지 장치에 있어서, A light-transmitting part package apparatus for an optical element comprising a screen printing apparatus which forms a light-transmitting portion for encapsulating all or a portion of the light-receiving portion or the light emitting portion surrounding the light-receiving portion or the light-emitting portion.다수의 상기 광학소자가 평면상에 배열되는 광학소자 어레이를 거치하는 작업대;A work table for mounting an optical element array in which a plurality of the optical elements are arranged on a plane;상기 작업대 상의 상기 광학소자들에 각각 대응하는 화선부를 가지는 스크린; A screen having a line portion respectively corresponding to the optical elements on the work table;상기 스크린 상에서 투광성 수지를 공급하고 도포하는 인쇄 작업부;A printing working part for supplying and applying a light transmitting resin on the screen;상기 스크린 및 인쇄 작업부를 내포하는 진공챔버;A vacuum chamber containing the screen and print working portion;상기 진공챔버에 연결되는 진공 형성 모듈; 및, A vacuum forming module connected to the vacuum chamber; And,진공상태에서 투광성 수지를 상기 스크린을 통하여 스크린 인쇄하여 상기 투광부를 형성하도록 상기 스크린과 인쇄 작업부 및 진공 형성 모듈을 제어하는 제어부를 포함하는 것을 특징으로 하는 광학소자의 투광부 패키지 장치.And a control unit for controlling the screen, the printing work unit, and the vacuum forming module to screen-transmit the translucent resin through the screen to form the light-transmitting unit in a vacuum state.
- 제5항에 있어서,The method of claim 5,상기 광학소자는 LED가 어레이 형태로 배열된 LCD패널용 BLU이고, The optical device is a BLU for LCD panel in which the LEDs are arranged in an array form,상기 화선부는 원 또는 타원 또는 다각형인 것을 특징으로 하는 광학소자의 투광부 패키지 장치.The line unit is a light emitting unit package device, characterized in that the circle or ellipse or polygon.
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KR1020090071148A KR20110013607A (en) | 2009-08-03 | 2009-08-03 | Method and device for preparing a transparent package of optical devices |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
CN110797448A (en) * | 2018-08-02 | 2020-02-14 | 深圳光峰科技股份有限公司 | Wavelength conversion element and method for manufacturing same |
CN114253027A (en) * | 2020-09-24 | 2022-03-29 | 京东方科技集团股份有限公司 | Light source component, display module and manufacturing method of light source component |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020029611A (en) * | 2000-10-13 | 2002-04-19 | 추후기재 | Stenciling phosphor layers on light emitting diodes |
WO2008001430A1 (en) * | 2006-06-27 | 2008-01-03 | Mitsubishi Electric Corporation | Screen printing machine and solar battery cell |
KR20080051756A (en) * | 2006-12-06 | 2008-06-11 | 삼성에스디아이 주식회사 | Organic light emitting display apparatus and method of manufacturing thereof |
KR20080083377A (en) * | 2007-03-12 | 2008-09-18 | (주) 아모센스 | Semiconductor package and method for manufacturing semiconductor package |
JP2009038177A (en) * | 2007-08-01 | 2009-02-19 | Sanyu Rec Co Ltd | Resin sealing method and resin sealing device |
JP2009147281A (en) * | 2007-12-18 | 2009-07-02 | Sanyu Rec Co Ltd | Method and apparatus for manufacturing light-emitting device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2851589B2 (en) * | 1996-08-15 | 1999-01-27 | 日本レック株式会社 | Optoelectronic component manufacturing method |
-
2009
- 2009-08-03 KR KR1020090071148A patent/KR20110013607A/en not_active Application Discontinuation
-
2010
- 2010-07-30 WO PCT/KR2010/005032 patent/WO2011016650A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020029611A (en) * | 2000-10-13 | 2002-04-19 | 추후기재 | Stenciling phosphor layers on light emitting diodes |
WO2008001430A1 (en) * | 2006-06-27 | 2008-01-03 | Mitsubishi Electric Corporation | Screen printing machine and solar battery cell |
KR20080051756A (en) * | 2006-12-06 | 2008-06-11 | 삼성에스디아이 주식회사 | Organic light emitting display apparatus and method of manufacturing thereof |
KR20080083377A (en) * | 2007-03-12 | 2008-09-18 | (주) 아모센스 | Semiconductor package and method for manufacturing semiconductor package |
JP2009038177A (en) * | 2007-08-01 | 2009-02-19 | Sanyu Rec Co Ltd | Resin sealing method and resin sealing device |
JP2009147281A (en) * | 2007-12-18 | 2009-07-02 | Sanyu Rec Co Ltd | Method and apparatus for manufacturing light-emitting device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
CN110797448A (en) * | 2018-08-02 | 2020-02-14 | 深圳光峰科技股份有限公司 | Wavelength conversion element and method for manufacturing same |
CN114253027A (en) * | 2020-09-24 | 2022-03-29 | 京东方科技集团股份有限公司 | Light source component, display module and manufacturing method of light source component |
CN114253027B (en) * | 2020-09-24 | 2023-10-20 | 京东方科技集团股份有限公司 | Light source assembly, display module and manufacturing method of light source assembly |
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