WO2010142271A3 - Screen printing frame - Google Patents

Screen printing frame Download PDF

Info

Publication number
WO2010142271A3
WO2010142271A3 PCT/DE2010/000637 DE2010000637W WO2010142271A3 WO 2010142271 A3 WO2010142271 A3 WO 2010142271A3 DE 2010000637 W DE2010000637 W DE 2010000637W WO 2010142271 A3 WO2010142271 A3 WO 2010142271A3
Authority
WO
WIPO (PCT)
Prior art keywords
screen printing
printing template
cavities
height
designed
Prior art date
Application number
PCT/DE2010/000637
Other languages
German (de)
French (fr)
Other versions
WO2010142271A2 (en
Inventor
Mike Becker
Dietmar LÜTKE-NOTARP
Original Assignee
Nb Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nb Technologies Gmbh filed Critical Nb Technologies Gmbh
Priority to CN2010800253096A priority Critical patent/CN102458856A/en
Publication of WO2010142271A2 publication Critical patent/WO2010142271A2/en
Publication of WO2010142271A3 publication Critical patent/WO2010142271A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/24Stencils; Stencil materials; Carriers therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

The invention relates to a screen printing frame comprising: a screen printing template carrier designed as a foil provided with first cavities, which are designed such that they reach from an upper side to a bottom side of the foil, a screen printing template designed as a masking layer, which is rigidly connected to the bottom side of the screen printing template carrier, wherein the masking layer is provided with second cavities which at least partially overlap the first cavities of the screen printing template carrier such that a printing medium can be guided through the first cavities of the screen printing template carrier from the upper side thereof through the second cavities of the masking layer in the direction of the bottom side and onto a substrate placed beneath. Said screen printing template carrier and/or the masking layer is/are designed in such a way that a projection projects into the region of at least one first and one second cavity thus reducing the passage surface thereof for a printing medium, the height of the projection in the region of the first cavity being lower than the height of the screen printing template carrier, and/or the height of the projection in the second cavity being lower than the height of the screen printing template.
PCT/DE2010/000637 2009-06-09 2010-06-09 Screen printing frame WO2010142271A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010800253096A CN102458856A (en) 2009-06-09 2010-06-09 Screen printing frame

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910024874 DE102009024874A1 (en) 2009-06-09 2009-06-09 Screen printing form for use in printing medium, during screen printing and porous printing, has lug whose height in area of recesses is less than height of screen printing pattern carrier and pattern, respectively
DE102009024874.9 2009-06-09

Publications (2)

Publication Number Publication Date
WO2010142271A2 WO2010142271A2 (en) 2010-12-16
WO2010142271A3 true WO2010142271A3 (en) 2011-07-21

Family

ID=42675482

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2010/000637 WO2010142271A2 (en) 2009-06-09 2010-06-09 Screen printing frame

Country Status (4)

Country Link
CN (2) CN201824659U (en)
DE (2) DE102009024874A1 (en)
TW (1) TW201105517A (en)
WO (1) WO2010142271A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008012829U1 (en) * 2008-09-26 2008-12-04 Nb Technologies Gmbh screen printing forme
DE102009024874A1 (en) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Screen printing form for use in printing medium, during screen printing and porous printing, has lug whose height in area of recesses is less than height of screen printing pattern carrier and pattern, respectively
DE102011003287A1 (en) * 2011-01-27 2012-08-02 Christian Koenen Gmbh Printing template for applying a printing pattern to a substrate and method for producing a printing stencil
TWI485755B (en) * 2012-11-05 2015-05-21 Inventec Solar Energy Corp A multi-layer screen and related method thereof
CN108511899B (en) * 2018-04-02 2020-02-14 Oppo广东移动通信有限公司 Manufacturing method of printed antenna assembly, printed antenna assembly and electronic equipment
CN110126439B (en) * 2019-06-04 2020-09-29 沃苏特电子科技(苏州)有限公司 Manufacturing method of complementary screen printing plate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (en) * 1969-12-03 1971-06-09 Siemens Ag Printed circuit screen printing template
US6095041A (en) * 1999-07-22 2000-08-01 International Business Corporation Stencil mask with channels including depressions
EP1482547A2 (en) * 2003-05-27 2004-12-01 Xerox Corporation Standoff/mask structure for electrical interconnect

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1192452A (en) * 1967-07-25 1970-05-20 Gestetner Ltd Thermographic Stencil
TW289901B (en) * 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
DE10231698A1 (en) * 2002-03-26 2003-10-23 Fraunhofer Ges Forschung Process for improving the transfer of additive material to support used in the production of printed circuit boards comprises using template having openings with coating for the structured transfer of the additive material to the support
JP4375232B2 (en) * 2005-01-06 2009-12-02 セイコーエプソン株式会社 Mask deposition method
TWI458648B (en) * 2006-04-07 2014-11-01 Mitsubishi Paper Mills Ltd A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin
DE102009024874A1 (en) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Screen printing form for use in printing medium, during screen printing and porous printing, has lug whose height in area of recesses is less than height of screen printing pattern carrier and pattern, respectively

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1960723A1 (en) * 1969-12-03 1971-06-09 Siemens Ag Printed circuit screen printing template
US6095041A (en) * 1999-07-22 2000-08-01 International Business Corporation Stencil mask with channels including depressions
EP1482547A2 (en) * 2003-05-27 2004-12-01 Xerox Corporation Standoff/mask structure for electrical interconnect

Also Published As

Publication number Publication date
TW201105517A (en) 2011-02-16
CN102458856A (en) 2012-05-16
DE102009024874A1 (en) 2010-12-16
DE202010007771U1 (en) 2010-09-02
CN201824659U (en) 2011-05-11
WO2010142271A2 (en) 2010-12-16

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