WO2010136963A1 - Dispositifs électroluminescents - Google Patents
Dispositifs électroluminescents Download PDFInfo
- Publication number
- WO2010136963A1 WO2010136963A1 PCT/IB2010/052307 IB2010052307W WO2010136963A1 WO 2010136963 A1 WO2010136963 A1 WO 2010136963A1 IB 2010052307 W IB2010052307 W IB 2010052307W WO 2010136963 A1 WO2010136963 A1 WO 2010136963A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- electrode
- metal seal
- counter electrode
- electroluminescent device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 229910052751 metal Inorganic materials 0.000 claims abstract description 92
- 239000002184 metal Substances 0.000 claims abstract description 92
- 238000005538 encapsulation Methods 0.000 claims abstract description 90
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000000615 nonconductor Substances 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 4
- 229910000497 Amalgam Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 90
- 239000000463 material Substances 0.000 description 17
- 238000007789 sealing Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052797 bismuth Inorganic materials 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000012777 electrically insulating material Substances 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- -1 poly(p-phenylen-vinylene) Polymers 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 1
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 1
- AWXGSYPUMWKTBR-UHFFFAOYSA-N 4-carbazol-9-yl-n,n-bis(4-carbazol-9-ylphenyl)aniline Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(N(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 AWXGSYPUMWKTBR-UHFFFAOYSA-N 0.000 description 1
- 101000837344 Homo sapiens T-cell leukemia translocation-altered gene protein Proteins 0.000 description 1
- 101500028161 Homo sapiens Tumor necrosis factor-binding protein 1 Proteins 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 102100028692 T-cell leukemia translocation-altered gene protein Human genes 0.000 description 1
- 102400000089 Tumor necrosis factor-binding protein 1 Human genes 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000412 dendrimer Substances 0.000 description 1
- 229920000736 dendritic polymer Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- PFBLRDXPNUJYJM-UHFFFAOYSA-N tert-butyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(C)(C)C PFBLRDXPNUJYJM-UHFFFAOYSA-N 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/872—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8721—Metallic sealing arrangements
Definitions
- the invention furthermore relates to methods for the production of such electroluminescent devices.
- the metal layer is applied with a height that is slightly larger than the height of the EL layer stack and the counter electrode. This way the sensitive structures of the EL device are not touched by the encapsulation layer and/or not damaged during application of such.
- the organic electroluminescent layer stack and the counter electrode are encapsulated by an encapsulation means 5.
- This encapsulation means is a cavity lid known to the skilled person and is made of insulating glass.
- the encapsulation means comprises one electrically conductive feed through 6 comprising a connecting means 9 in the form of an arc-shaped spring to electrically contact the counter electrode 4 to an electrical source (not shown).
- a metal seal 7 is visible contacting both the cavity lid 5 and the substrate electrode 2. In particular, the metal seal contacts the side walls of the cavity lid 5.
Abstract
La présente invention porte sur un dispositif électroluminescent (EL) comprenant un substrat (1) et, sur le dessus du substrat, sont disposés une électrode de substrat (2), une contre-électrode (4), un empilement de couche EL (3) agencé entre l'électrode de substrat et la contre-électrode et un moyen d'encapsulation (5) encapsulant au moins l'empilement de couche EL et la contre-électrode. Le moyen d'encapsulation comprend au moins une traversée électriquement conductrice (6) qui est isolée de l'électrode de substrat et est en outre attachée au dispositif EL au moyen d'un joint métallique (7) agencé entre le moyen d'encapsulation et le substrat. L'invention porte, en outre, sur des procédés de production du dispositif EL de l'invention.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09161454 | 2009-05-29 | ||
| EP09161454.5 | 2009-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010136963A1 true WO2010136963A1 (fr) | 2010-12-02 |
Family
ID=42557011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IB2010/052307 WO2010136963A1 (fr) | 2009-05-29 | 2010-05-25 | Dispositifs électroluminescents |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW201108850A (fr) |
| WO (1) | WO2010136963A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015140004A1 (fr) * | 2014-03-19 | 2015-09-24 | Osram Opto Semiconductors Gmbh | Composant optoélectronique et procédé servant à fabriquer un composant optoélectronique |
| WO2023006671A1 (fr) * | 2021-07-29 | 2023-02-02 | Signify Holding B.V. | Dispositif d'éclairage laser |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998053644A1 (fr) * | 1997-05-22 | 1998-11-26 | Koninklijke Philips Electronics N.V. | Dispositif electroluminescent organique |
| JP2007258070A (ja) * | 2006-03-24 | 2007-10-04 | Kanazawa Univ | 薄膜素子ホルダー |
-
2010
- 2010-05-25 WO PCT/IB2010/052307 patent/WO2010136963A1/fr active Application Filing
- 2010-05-27 TW TW099117076A patent/TW201108850A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998053644A1 (fr) * | 1997-05-22 | 1998-11-26 | Koninklijke Philips Electronics N.V. | Dispositif electroluminescent organique |
| JP2007258070A (ja) * | 2006-03-24 | 2007-10-04 | Kanazawa Univ | 薄膜素子ホルダー |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015140004A1 (fr) * | 2014-03-19 | 2015-09-24 | Osram Opto Semiconductors Gmbh | Composant optoélectronique et procédé servant à fabriquer un composant optoélectronique |
| CN106415874A (zh) * | 2014-03-19 | 2017-02-15 | 欧司朗Oled股份有限公司 | 光电子器件和用于制造光电子器件的方法 |
| US10014488B2 (en) | 2014-03-19 | 2018-07-03 | Osram Oled Gmbh | Optoelectronic component and method for producing an optoelectronic component |
| CN106415874B (zh) * | 2014-03-19 | 2018-10-16 | 欧司朗Oled股份有限公司 | 光电子器件和用于制造光电子器件的方法 |
| WO2023006671A1 (fr) * | 2021-07-29 | 2023-02-02 | Signify Holding B.V. | Dispositif d'éclairage laser |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201108850A (en) | 2011-03-01 |
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