WO2010126214A1 - Pressure-sensitive ink composition, and resistive film and pressure sensing device using the same - Google Patents

Pressure-sensitive ink composition, and resistive film and pressure sensing device using the same Download PDF

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Publication number
WO2010126214A1
WO2010126214A1 PCT/KR2009/006503 KR2009006503W WO2010126214A1 WO 2010126214 A1 WO2010126214 A1 WO 2010126214A1 KR 2009006503 W KR2009006503 W KR 2009006503W WO 2010126214 A1 WO2010126214 A1 WO 2010126214A1
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WO
WIPO (PCT)
Prior art keywords
epoxy resin
weight
pressure
parts
film
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PCT/KR2009/006503
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French (fr)
Korean (ko)
Inventor
김종호
오익균
Original Assignee
한국표준과학연구원
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Priority claimed from KR1020090047386A external-priority patent/KR101095312B1/en
Application filed by 한국표준과학연구원 filed Critical 한국표준과학연구원
Publication of WO2010126214A1 publication Critical patent/WO2010126214A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals

Definitions

  • the present invention relates to a pressure sensitive ink composition, a resistive film and a pressure sensing device using the same.
  • a pressure-sensitive ink when used to form a constant layer or film, and when a force or pressure is applied in the vertical direction on the surface of the formed layer or film, the electrical resistance value is changed. It is useful for detection.
  • the pressure sensitive ink has been applied to various pressure sensing devices such as a pressure transducer, a pressure sensor, a strain gauge, a tactile sensor or a touch sensor to date.
  • such pressure sensitive inks are generally prepared by using a thermoplastic resin as a binder and dispersing a conductive filler such as carbon black or the like together with the thermoplastic resin.
  • the conventional pressure sensitive ink has a problem that the difference between the behavior at room temperature and the temperature at high temperature is large, and the hysteresis phenomenon of the resistance value generated at the time of pressurization and decompression is large. Due to problems such as drift and lack of reproducibility of electrical characteristics, there is a need for developing a pressure sensing device capable of detecting pressure more accurately without being limited to temperature changes.
  • the present invention has been made to solve the above problems, and an object thereof is to provide an excellent pressure sensitive ink composition which is excellent in high temperature stability and can minimize hysteresis and drift.
  • Another object of the present invention is to provide a resistive film that provides excellent high temperature stability and constant output value, including a cured product of a composition having excellent properties as described above.
  • Still another object of the present invention is to provide a pressure sensing device including a resistive film as described above, which is not affected by temperature and pressure changes and provides constant and accurate measurement values within a wider pressure range.
  • the present invention is a means for solving the above problems, epoxy resin; And it provides a pressure sensitive ink composition comprising a conductive filler.
  • This invention provides the resistive film containing the hardened
  • the present invention includes two sensing units each comprising a base film, an electrode formed on the base film, and a resistance film of the present invention formed on the electrode, wherein the two sensing units Provided is a pressure sensing device provided to face a resistive film.
  • the pressure-sensitive ink of the present invention exhibits an excellent pressure sensing function even at a high temperature as well as the high temperature stability, and under the hysteresis phenomenon and the constant load appearing under pressure or decompression.
  • the drift phenomenon can be minimized when left for a long time, and excellent reproducibility of electrical properties can be usefully used in various fields for pressure measurement and sensing purposes.
  • Figure 1 schematically shows a shape in which the conductive filler is uniformly dispersed between the network structure of the epoxy resin in the ink composition according to the present invention
  • Figure 2 schematically shows a side cross-section of the test specimen for pressure sensing according to an embodiment of the present invention
  • Example 4 is a graph showing the output voltage according to the pressure change using the ink composition of Example 1,
  • Example 6 is a graph showing the output voltage according to the pressure change at various temperatures using the ink composition of Example 1,
  • FIG. 7 is a graph showing the output voltage according to the pressure change at various temperatures using a pressure sensor (flexiforce, Tekscan Co.) used in the prior art,
  • FIG. 8 is a graph showing a change that appears when the same pressure is applied at regular intervals using the ink composition of Example 1.
  • the present invention is an epoxy resin; And it relates to a pressure sensitive ink composition comprising a conductive filler.
  • the pressure sensitive ink composition according to the present invention includes an epoxy resin; And conductive fillers.
  • the pressure-sensitive ink composition according to the present invention includes a thermosetting epoxy resin as described above, even when fully cured according to sufficient curing conditions, even at high temperatures. As at room temperature, it can exhibit very stable pressure-resistance characteristics.
  • the epoxy resin is an epoxy resin containing an epoxy ring at the end or side chain of the main chain, it can be used regardless of its kind, and its kind is not particularly limited.
  • bisphenol A type epoxy resin (Diglycidyl Ether of Bisphenol A; DGEBA), bisphenol F type epoxy resin (Diglycidyl Ether of Bisphenol F; DGEBF), phenol novolac epoxy resin (Phenol Novolac Epoxy) or cresol novolac Novolak-type epoxy resins such as Cresol Novolac Epoxy, Halogenated Epoxy such as Brominated Epoxy, Cycloaliphatic Epoxy, Rubber Modified Epoxy , Aliphatic polyglycidyl epoxy resin (Aliphatic polyglycidyl Epoxy), glycidyl amine epoxy resin (Glycidylamine Epoxy), polyglycol Epoxy and cardanol epoxy resin (Cardanol-based Epoxy) alone or one It can mix and use the above.
  • DGEBA bisphenol A type epoxy resin
  • DGEBF bisphenol F type epoxy resin
  • DGEBF phenol novolac epoxy resin
  • Novolak-type epoxy resins such as Cresol Novolac Epoxy
  • the epoxy resin may include at least one selected from a bisphenol A type epoxy resin or a novolak type epoxy resin, and more specifically, a bisphenol A type epoxy resin, a phenol novolak epoxy resin, or a cresol novolac epoxy. It may include one or more selected from the resin.
  • the equivalent of the epoxy resin is not particularly limited, but, for example, when the bisphenol A epoxy resin is a solid epoxy resin, the equivalent may be 700 to 6000 g / eq, more specifically 1700 to 2100 g / eq. In addition, when the bisphenol-A epoxy resin is a liquid epoxy resin, the equivalent weight may be 170 to 250g / eq, specifically 180 to 200g / eq.
  • the phenol novolac epoxy resin and the cresol novolac epoxy resin may each have an equivalent weight of 150 to 250 g / eq, specifically 190 to 220 g / eq.
  • epoxy resin used in the present invention may be made through various combinations of the above-exemplified materials, and the combination is not particularly limited.
  • the composition according to the present invention may be one containing a bisphenol A epoxy resin.
  • the bisphenol A epoxy resin is a typical epoxy resin, and has an epoxy group at the end of the main chain.
  • the bisphenol A-type epoxy resin has an advantage that the epoxy group is formed at the terminal of the molecule and excellent in reactivity, and a wide range of curable properties can be obtained according to the selection of the curing agent and the modified component, and less curing shrinkage than other thermosetting resins, and bisphenol
  • the skeleton of is excellent in symmetry, and made of a rigid structure, has the advantage of excellent toughness and high temperature stability.
  • the equivalent weight of the bisphenol A epoxy resin is not particularly limited, for example, it may include at least one selected from a liquid epoxy resin having an equivalent weight of 170 to 250 g / eq or a solid epoxy resin having an equivalent weight of 700 to 6000 g / eq. have.
  • the weight average molecular weight of the liquid epoxy resin may be 340 to 500, and the weight average molecular weight of the solid epoxy resin may be 1,400 to 12,000, but is not limited thereto.
  • the content of the liquid epoxy resin and the solid epoxy resin contained in the bisphenol A epoxy resin is not particularly limited.
  • the bisphenol A epoxy resin is 2 to 15 parts by weight of a liquid epoxy resin; And 10 to 40 parts by weight of the solid epoxy resin.
  • the crosslinking density is relatively low, there is a fear that the hysteresis phenomenon is increased and the thermal stability is lowered
  • the resistance film may be brittle or crack may occur.
  • the manufacturing method of such a bisphenol A epoxy resin is not particularly limited, but may be prepared through a conventional manufacturing method (ex. Direct method or indirect method) known in the art, for example, sodium hydroxide (NaOH), or the like.
  • a conventional manufacturing method ex. Direct method or indirect method known in the art, for example, sodium hydroxide (NaOH), or the like.
  • BPA bisphenol A
  • EHC epichlorohydrin
  • diglycidyl ether of bisphenol A with bisphenol A to react bisphenol A epoxy Resin can also be manufactured.
  • the bisphenol A epoxy resin may be prepared through a reaction according to the following Chemical Formula 1, but the preparation method shown in Chemical Formula 1 is merely an example of preparing a bisphenol A epoxy resin that can be used in the present invention.
  • the present invention is not limited thereto.
  • the novolak-type epoxy resin is an epoxy resin having an epoxy group in the side chain, it is possible to obtain a cured product excellent in heat resistance at the time of curing, and has the advantage of excellent chemical resistance and adhesion.
  • the novolac-type epoxy resin also has excellent heat resistance when completely cured, it can exhibit excellent pressure sensitivity even at high temperatures when it is contained in the pressure sensitive ink composition according to the present invention.
  • the novolak-type epoxy resin may include at least one selected from a phenol novolak epoxy resin or a cresol novolak epoxy resin, and its equivalent is not particularly limited, but an equivalent weight of the phenol novolak epoxy resin is 150 to 250 g / eq, specifically 190 to 220g / eq.
  • the phenol novolac epoxy resin may have a structure such as the following Chemical Formula 2.
  • the equivalent weight of the cresol novolac epoxy resin is not particularly limited, but for example, the equivalent weight of the cresol novolac epoxy resin may be 150 to 250 g / eq, more specifically 190 to 220 g / eq Can be.
  • Cresol novolac epoxy resin may have a structure such as the formula (3).
  • the epoxy resin is a solid bisphenol A epoxy resin having an equivalent weight of 700 to 6000 g / eq; And a novolak type epoxy resin having an equivalent weight of 150 to 250 g / eq, and more specifically, a bisphenol A type epoxy resin having an equivalent weight of 1700 to 2100 g / eq and a novolak type having a equivalent weight of 190 to 220 g / eq. It may be one containing an epoxy resin.
  • bisphenol A epoxy resin having an equivalent weight of 700 to 6000 g / eq in the present invention As described above, bisphenol A epoxy resin having an equivalent weight of 700 to 6000 g / eq in the present invention; And an epoxy resin containing a novolac epoxy resin having an equivalent weight of 150 to 250 g / eq, the stability to heat is better, the crosslinking density is improved, and the resistance to pressure is kept constant even at a high temperature. In addition, there is an advantage that it can exhibit a uniform resistance value even when a long-term pressure load is applied.
  • the epoxy resin when the epoxy resin includes a bisphenol A type epoxy resin and a novolak type epoxy resin, the epoxy resin is 10 to 30 parts by weight of the bisphenol A type epoxy resin; And it may include 5 to 20 parts by weight of novolac-type epoxy resin.
  • the epoxy resin when the bisphenol A type epoxy resin is contained in less than 10 parts by weight or the novolak type epoxy resin is contained in more than 20 parts by weight, a very high crosslinking density is formed so that the resistance film is brittle. If a crack or the like is generated and the bisphenol A-type epoxy resin is contained in an amount of more than 30 parts by weight or the novolak-type epoxy resin is contained in an amount of less than 5 parts by weight, the crosslinking density is lowered, resulting in poor thermal stability or hysteresis. There is a fear that the phenomenon will increase.
  • the ink composition according to the present invention has a network structure of the epoxy resin 100.
  • the conductive filler 200 may be uniformly dispersed therein, and in this case, the epoxy resin 100 forms a network structure by the reaction of the epoxy group.
  • the point at which each chain is connected to each other is a cross-linking point P, and the average molecular weight Mc between the two crosslinking points may affect the crosslinking density.
  • the conductive filler functions as an operating component in the pressure sensitive ink according to the present invention, is mixed with an epoxy resin to form an electrical network structure, and provides an electron flow in the pressure sensitive ink, thereby providing a constant force or pressure It shows the uniform response (resistance value) to the pressure sensor.
  • the kind of the conductive filler is not particularly limited, and various conductive particles used in this field may be included therein, for example, gold, silver, copper, nickel, platinum, tin, aluminum and alloys thereof, carbon Black, carbon, graphite, and mixtures thereof.
  • the conductive filler may be carbon black
  • the type of the carbon black is not particularly limited, for example, DBP (Dibutylphthalate) wetting rate is 50 to 250 ml / 100g, the particle size is 10 It may be to 80nm.
  • DBP wetting rate means the amount of DBP absorbed per unit weight of particles, and in the case of carbon black having a high DBP wetting rate, the specific surface area is wide, and thus has excellent electrical conductivity. It may be.
  • Such DBP wetting rate can be measured using conventional methods known in the art, and the measuring method is not particularly limited.
  • the pressure sensitive ink composition according to the present invention includes carbon black having a high DBP wetting rate, it may exhibit better pressure sensitivity, and the DBP wetting rate of the carbon black is not particularly limited.
  • the DBP wetting rate of the black may be 50 to 250 ml / 100g, specifically 80 to 200 ml / 100g, and more specifically 80 to 130 ml / 100g.
  • the particle diameter of the carbon black is not particularly limited, but may be, for example, 10 to 80 nm, specifically 10 to 40 nm.
  • the carbon black may exhibit superior sensitivity within the particle size range.
  • the conductive filler may include the carbon black and graphite.
  • the graphite is a lubricant (lubricant) in the ink composition according to the present invention, although the type is not particularly limited, for example, a particle size of 1 to 20 ⁇ m can be used.
  • the content is not particularly limited, for example, 2 to 15 parts by weight of carbon black; And it may include 1 to 10 parts by weight of graphite.
  • the pressure sensitive ink composition of the present invention containing a conductive filler in which carbon black and graphite are appropriately mixed, not only excellent pressure sensitivity but also ink flowability can be improved, thereby providing good workability. And a uniform printing coating film can be formed.
  • the pressure-sensitive ink composition according to the present invention 20 to 50 parts by weight of the epoxy resin; And it may include 3 to 25 parts by weight of the conductive filler.
  • the pressure sensitive ink composition according to the present invention may further include a curing agent, the content of the curing agent is not particularly limited, for example, based on 100 parts by weight of the epoxy resin, the amount of 2 to 20 parts by weight It may be contained as.
  • the curing rate is lowered, the content of the epoxy resin is relatively increased, the ether group (etherification) can be made as the accompanying etherification (etherification) by the self-reaction of the epoxy If this occurs, the hysteresis may be increased, and if the content of the curing agent exceeds 20 parts by weight, cracks may be formed in the coating or the mechanical strength may be lowered to increase the internal deviation.
  • the pressure sensitive ink composition according to the present invention may be cured by further including a curing agent as described above, but may also be cured through a method such as curing through a homopolymerization by a catalyst, using a curing agent as described above
  • the curing agent may include all that can be used as an epoxy curing agent, it is not particularly limited.
  • the curing agent may include one or two or more of amines, acid anhydrides, polyamides, polyamideamines, phenols, carboxylic acid polyesters, and the like, and specifically, alicyclic amines, It may include one or more selected from the group consisting of aromatic amines, aliphatic amines and dicyandiamides, and more specifically, it may not include alicyclic amines having an amine number of 200 to 500.
  • amine value means TAV (total amine value) obtained by 0.1N-HCl method
  • the cycloaliphatic amine having an amine value of 200 to 500 has a slow curing rate, so screen printing, comma coating, or gravure coating at room temperature
  • screen printing, comma coating, or gravure coating at room temperature When performing such as, it can exhibit a stable workability, there is an advantage that can exhibit a stable characteristic even at high temperature by the alicyclic ring of the bulky structure (bulky) that the curing agent itself after the curing is completed.
  • the cycloaliphatic amine having an amine number of 200 to 500 exhibits excellent properties at low temperatures as well as excellent chemical resistance, moisture resistance, solvent resistance, and adhesion compared to aromatic amines.
  • the pressure sensitive ink composition according to the present invention may further comprise one or more additives selected from the group consisting of modifiers, antifoams and flow control agents.
  • the modifier serves to modify the physical properties of the pressure sensitive ink composition according to the present invention.
  • silica, talc, benton, and the like may be used.
  • the antifoaming agent and the flow control agent is a material that functions to improve the accuracy and reproducibility of the electrochemical properties of the ink composition according to the present invention, although the type thereof is not particularly limited, for example, non-silicone based Defoamers can be used, and dispersants such as BYK-103® can be used as flow control agents.
  • the pressure sensitive ink composition as described above may be dissolved in a solvent and used in a liquid phase.
  • Any solvent may be used as long as it is a solvent capable of dissolving the epoxy resin, and the kind thereof is not particularly limited, but, for example, Ketones such as methyl ethyl ketone and the like, glycol-ethyl esters such as glycol ether, butyl cellosol acetate and the like and dipropylene glycol monomethyl and the like can be used, and more specifically, diethylene glycol monobutyl ether acetate and the like can be used. .
  • the present invention also relates to a resistive film containing the cured product of the composition.
  • the resistive film is formed by curing the composition according to the present invention, and may be prepared according to a conventional film production method known in the art, and the method is not particularly limited.
  • the composition may be uniformly coated on a substrate such as an electrode, and cured at a temperature of 90 to 170 ° C. for 5 to 60 minutes, and temperature and time conditions may be adjusted so that curing may be completed completely. .
  • Volume resistance of the resistive film is not particularly limited, but may be, for example, 10 2 to 10 7 ⁇ ⁇ cm, specifically 10 3 to 10 6 ⁇ ⁇ cm.
  • the volume resistance of the resistive film When the volume resistance of the resistive film is less than 10 2 ⁇ ⁇ cm, it can be used as a general electrode material. When the resistive film exceeds 10 7 ⁇ ⁇ cm, the volume resistance of the resistive film is in the limited numerical range because it exhibits characteristics close to an insulating state. If it is outside the, it may not be suitable as a pressure sensitive resistive film.
  • the pressure sensitivity of the resistive film may be variously adjusted according to the purpose of use, and is not particularly limited, but may be, for example, 0.001 to 1 ⁇ S / N.
  • the present invention includes two sensing units each comprising a base film, an electrode formed on the base film, and the resistive film of the present invention formed on the electrode, wherein the two sensing parts are pressure sensing provided to face the resistive film Relates to a device.
  • the base film may include all that can be used as the insulating film in which the electrode and the resistance film is formed in the pressure sensing device, the type is not particularly limited.
  • polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, polyvinyl chloride (PVC) film, thermoplastic polyurethane (TPU) film or polyimide (PI) film and the like can be used as well as textiles
  • a film including an insulator such as a ceramic and specifically, may include a polyimide film, a polyethylene terephthalate film or a polyethylene naphthalate film, and furthermore, the polyimide film, polyethylene terephthalate film or polyethylene
  • a thermoplastic polyurethane film can also be laminated
  • the base film used in the present invention is excellent in high temperature stability and does not involve thermal expansion or structural change at a high temperature, and thus, there is no fear of residual stress, etc., thereby maintaining excellent sensitivity of the pressure sensing device.
  • the electrode is bonded to both sides of the resistive film serves to output the electrical signal transmitted from the resistive film as a measurement value, the conductivity having a low electrical resistance so that the output value can be represented without loss of the electrical signal transmitted as described above
  • the materials may all be used, and specific examples may include gold, silver, copper, aluminum, and the like.
  • the pressure sensing device is excellent in pressure sensitivity at high temperature as well as at room temperature, minimizes hysteresis and drift, and includes a resistive film manufactured using a pressure sensitive ink composition having excellent reproducibility. It can be usefully used as a pressure measuring or sensing device.
  • the pressure sensing device may be applied to any pressure sensitive device, and may be applied to various pressure sensing devices such as a pressure transducer, a pressure sensor, a strain gauge, a tactile sensor, or a touch sensor.
  • the pressure sensing test specimen 1 has two sensing units, and electrodes 13 and 23 are formed on one surface of the insulating base films 11 and 21, respectively.
  • the resistive films 15 and 25 are formed on one surface of the electrodes 13 and 23, and the resistive films 15 and 25 are spaced apart by a predetermined space A to face each other.
  • the test specimen 1 having the above structure may be configured to detect pressure by applying a constant force or pressure in the vertical direction.
  • the test specimen 1 shown in FIG. 2 is merely an example of the present invention, and the present invention is not limited thereto.
  • a pressure sensitive ink composition was prepared in the same manner as in Example 1, except that the ink composition was prepared according to the composition shown in Table 1 below.
  • Example 1 Example 2
  • Example 3 Example 4
  • Example 5 bookbinder A1 17.4 27.9 30.4 25.4 23.8
  • A2 - - - - 3.6 A3 9.2 - - - - solvent
  • B1 43.1 42.4 43.8 39.8 41.7
  • Conductive filler C1 7.3 10.8 11.2 9.5 12.1
  • C2 2.8 - - - - additive
  • D1 2.5 3.5 2.5 3.7 3.5
  • D2 0.9 0.9 0.8 0.9 0.9 D3
  • Hardener E1 4.4 1.7 0.7 4.8
  • solvent F1 11.2 12.8 10.6 15.9 12.2
  • A1 is a solid bisphenol A epoxy resin polymerized at an equivalent weight of 1950 g / eq.
  • A2 is a liquid bisphenol A epoxy resin having an equivalent weight of 190 g / eq.
  • A3 is a solid cresol novolac epoxy resin polymerized in an equivalent weight of 210 g / eq.
  • B1 is BCA (diethylene glycol monobutyl ether acetate)
  • C1 is carbon black with DBP wetting rate of 100 ml / 100g and average particle diameter of 24 nm
  • C2 is a plate-like graphite having an average particle size of 6.67 ⁇ m
  • E1 is an epoxy modified alicyclic amine having an amine number of 365
  • F1 is BCeA (ethylene glycol monobutyl ether acetate)
  • actuator diameter of 3 mm means that a force of 3 mm in diameter of a silicone pad is placed on the specimen when a force is applied to the specimen.
  • the pressure-resistance value was measured by varying the curing conditions for the resistive film. First, the resistive film formed on the electrode was cured at a temperature of 150 ° C. for 30 minutes, and then the pressure resistance in which two sensing units were disposed to face the resistive film. The pressure-resistance value was measured by the test specimen, and the pressure-resistance test specimen including the resistance film further cured for 30 minutes at the temperature of 150 ° C. was further cured for 30 minutes at the temperature of 150 ° C. The resistance value was measured.
  • a potentiometer circuit was formed to increase the pressure applied to the pressure resistance test specimen while measuring the output resistance of the sensor with a reference voltage of 3 V and a fixed resistance of 3 kW. Converted.
  • the size of the sensor means the diameter of the ink composition to be screen printed.
  • Equation 1 Rc is a fixed resistance, Ra is a sensor resistance, and Vg is a reference voltage.
  • the voltage output of the specimen was 3 V and the fixed resistance was 500 W.
  • the pressure resistance test specimen was prepared using the ink composition of Example 1, and the other conditions were all different from those used in the measurement of the output voltage according to the pressure increase. In the same manner, fatigue tests were performed up to 1.2 million cycles while changing the load from 30 g to 600 g. As shown in FIG. 8, reliability and durability were satisfactory.

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Abstract

The present invention relates to a pressure-sensitive ink composition, and a resistive film and pressure sensing device using the same. The present invention provides a pressure-sensitive ink composition with excellent high temperature properties and less hysteresis phenomenon by containing epoxy resin; and conductive fillers. In addition, the resistive film and pressure sensing device manufactured using the ink composition have a constant output value with respect to force or pressure and exhibit pressure-resistance properties of the same behavior at high temperature as in room temperature. Therefore, the film and device can more accurately sense pressure.

Description

압력 감응성 잉크 조성물, 이를 이용한 저항막 및 압력 감지 장치Pressure sensitive ink composition, resistive film and pressure sensing device using same
본 발명은 압력 감응성 잉크 조성물, 이를 이용한 저항막 및 압력 감지 장치에 관한 것이다.The present invention relates to a pressure sensitive ink composition, a resistive film and a pressure sensing device using the same.
일반적으로 압력 감응성 잉크를 이용하여 일정한 층 또는 막을 형성하고, 이에 따라 형성된 층 또는 막의 면상에 수직방향으로 힘 또는 압력을 인가하는 경우, 전기적 저항값이 변화하게 되는데, 이와 같은 특성을 이용하여 압력을 감지하는데 유용하게 사용되고 있다. 상기 압력 감응성 잉크는 현재까지 압력 변환기, 압력 감지기, 스트레인 게이지, 촉각 센서 또는 터치 센서 등과 같은 각종 압력 감지 장치에 적용되고 있다.In general, when a pressure-sensitive ink is used to form a constant layer or film, and when a force or pressure is applied in the vertical direction on the surface of the formed layer or film, the electrical resistance value is changed. It is useful for detection. The pressure sensitive ink has been applied to various pressure sensing devices such as a pressure transducer, a pressure sensor, a strain gauge, a tactile sensor or a touch sensor to date.
종래 이와 같은 압력 감응성 잉크는 일반적으로 열가소성 수지를 바인더로 사용하고, 일반적인 카본블랙 등과 같은 도전성 충진제를 상기 열가소성 수지와 함께 분산시킴으로써 제조되었다.Conventionally, such pressure sensitive inks are generally prepared by using a thermoplastic resin as a binder and dispersing a conductive filler such as carbon black or the like together with the thermoplastic resin.
그러나 종래 압력 감응성 잉크는 상온에서의 거동과 고온에서의 거동 간의 차이가 크고, 가압 시와 감압 시 발생하는 저항값의 히스테리시스(hysteresis) 현상이 크다는 문제점이 있었고, 일정한 하중에서 장시간 방치하는 경우에 발생하는 드리프트 현상 및 전기적 특성의 재연성이 부족하다는 문제점 등으로 인하여 온도 변화 등에 제한 받지 않고 보다 정확하게 압력을 감지할 수 있는 압력 감지 장치에 대한 개발의 필요성이 요구되고 있는 실정이다.However, the conventional pressure sensitive ink has a problem that the difference between the behavior at room temperature and the temperature at high temperature is large, and the hysteresis phenomenon of the resistance value generated at the time of pressurization and decompression is large. Due to problems such as drift and lack of reproducibility of electrical characteristics, there is a need for developing a pressure sensing device capable of detecting pressure more accurately without being limited to temperature changes.
본 발명은 상술한 문제점을 해결하기 위하여 창출된 것으로서, 고온 안정성이 우수하고, 히스테리시스 현상 및 드리프트 현상을 최소화할 수 있는 우수한 압력 감응성 잉크 조성물을 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide an excellent pressure sensitive ink composition which is excellent in high temperature stability and can minimize hysteresis and drift.
본 발명의 다른 목적은 상기한 바와 같은 우수한 특성을 가진 조성물의 경화물을 포함하여 우수한 고온 안정성 및 일정한 출력 값을 제공하는 저항막을 제공하는데 있다.Another object of the present invention is to provide a resistive film that provides excellent high temperature stability and constant output value, including a cured product of a composition having excellent properties as described above.
본 발명의 또 다른 목적은 상기한 바와 같은 저항막을 포함하여 온도 및 압력 변화에 영향을 받지 않고, 보다 광범위한 압력 범위 내에서 일정하고 정확한 측정값을 제공하는 압력 감지 장치를 제공하는데 있다.Still another object of the present invention is to provide a pressure sensing device including a resistive film as described above, which is not affected by temperature and pressure changes and provides constant and accurate measurement values within a wider pressure range.
본 발명은 상기 과제를 해결하기 위한 수단으로서, 에폭시 수지; 및 도전성 충진제를 포함하는 압력 감응성 잉크 조성물을 제공한다.The present invention is a means for solving the above problems, epoxy resin; And it provides a pressure sensitive ink composition comprising a conductive filler.
본 발명은 상기 과제를 해결하기 위한 다른 수단으로서, 상기 조성물의 경화물을 포함하는 저항막을 제공한다.This invention provides the resistive film containing the hardened | cured material of the said composition as another means for solving the said subject.
본 발명은 상기 과제를 해결하기 위한 또 다른 수단으로서, 베이스 필름, 상기 베이스 필름 상에 형성된 전극 및 상기 전극 상에 형성된 본 발명의 저항막을 각각 포함하는 두 개의 감지부를 포함하되, 상기 두 개의 감지부는 저항막이 대향하도록 구비되는 압력 감지 장치를 제공한다.As another means for solving the above problems, the present invention includes two sensing units each comprising a base film, an electrode formed on the base film, and a resistance film of the present invention formed on the electrode, wherein the two sensing units Provided is a pressure sensing device provided to face a resistive film.
본 발명의 압력 감응성 잉크, 이를 이용한 저항막 및 압력 감지 장치에 의하면, 고온에서도 상온에서와 마찬가지로 우수한 압력 감지 기능을 나타내어 고온 안정성이 우수할 뿐 아니라, 가압 또는 감압 시에 나타나는 히스테리시스 현상 및 일정한 하중에서 장시간 방치하는 경우에 나타나는 드리프트 현상을 최소화시킬 수 있으며, 전기적 특성의 재연성이 우수하여 압력 측정 및 감지 용도로 다양한 분야에서 유용하게 사용될 수 있다. According to the pressure-sensitive ink of the present invention, the resistive film and the pressure sensing device using the same, the pressure sensitive ink exhibits an excellent pressure sensing function even at a high temperature as well as the high temperature stability, and under the hysteresis phenomenon and the constant load appearing under pressure or decompression. The drift phenomenon can be minimized when left for a long time, and excellent reproducibility of electrical properties can be usefully used in various fields for pressure measurement and sensing purposes.
도 1은 본 발명에 따른 잉크 조성물 내에서 에폭시 수지의 망상 구조 사이에 도전성 충진제가 균일하게 분산된 형상을 개략적으로 나타낸 것이고,Figure 1 schematically shows a shape in which the conductive filler is uniformly dispersed between the network structure of the epoxy resin in the ink composition according to the present invention,
도 2는 본 발명의 일 예에 따른 압력 감지용 테스트 시편의 측단면을 개략적으로 나타낸 것이며,Figure 2 schematically shows a side cross-section of the test specimen for pressure sensing according to an embodiment of the present invention,
도 3은 실시예 1, 2, 3 및 5의 잉크 조성물을 이용하여 경화 조건의 변화에 따른 저항값을 측정한 그래프이고, 3 is a graph measuring resistance values according to changes in curing conditions using the ink compositions of Examples 1, 2, 3, and 5,
도 4는 실시예 1의 잉크 조성물을 이용하여 압력 변화에 따른 출력 전압을 나타낸 그래프이며,4 is a graph showing the output voltage according to the pressure change using the ink composition of Example 1,
도 5는 전위차 회로를 나타낸 것이고,5 shows a potential difference circuit,
도 6은 실시예 1의 잉크 조성물을 이용하여 다양한 온도에서 압력 변화에 따른 출력 전압을 나타낸 그래프이며,6 is a graph showing the output voltage according to the pressure change at various temperatures using the ink composition of Example 1,
도 7은 종래 사용되던 압력센서(flexiforce, Tekscan Co.)를 이용하여 다양한 온도에서 압력 변화에 따른 출력 전압을 나타낸 그래프이고,7 is a graph showing the output voltage according to the pressure change at various temperatures using a pressure sensor (flexiforce, Tekscan Co.) used in the prior art,
도 8은 실시예 1의 잉크 조성물을 이용하여 일정 주기로 동일한 압력을 인가하였을 때, 나타나는 변화를 나타낸 그래프이다.8 is a graph showing a change that appears when the same pressure is applied at regular intervals using the ink composition of Example 1. FIG.
본 발명은 에폭시 수지; 및 도전성 충진제를 포함하는 압력 감응성 잉크 조성물에 관한 것이다.The present invention is an epoxy resin; And it relates to a pressure sensitive ink composition comprising a conductive filler.
이하, 본 발명의 압력 감응성 잉크 조성물에 대하여 보다 상세하게 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, the pressure sensitive ink composition of this invention is demonstrated in detail.
본 발명에 따른 압력 감응성 잉크 조성물은 전술한 바와 같이, 에폭시 수지; 및 도전성 충진제를 포함한다.As described above, the pressure sensitive ink composition according to the present invention includes an epoxy resin; And conductive fillers.
종래에는 바인더 수지로서, 주로 열가소성 수지를 사용하였으나, 본 발명에 따른 압력 감응성 잉크 조성물은 상기한 바와 같이, 열경화성의 에폭시 수지를 포함함으로써 충분한 경화조건에 따라 완전히 경화(full curing)되는 경우, 고온에서도 상온에서와 마찬가지로 매우 안정적인 압력-저항 특성을 나타낼 수 있다.Conventionally, although a thermoplastic resin is mainly used as the binder resin, the pressure-sensitive ink composition according to the present invention includes a thermosetting epoxy resin as described above, even when fully cured according to sufficient curing conditions, even at high temperatures. As at room temperature, it can exhibit very stable pressure-resistance characteristics.
상기 에폭시 수지는 주쇄의 말단 또는 측쇄에 에폭시 고리(epoxy ring)를 포함하는 에폭시 수지이기만 하면, 그 종류에 관계 없이 모두 사용할 수 있으며, 그 종류가 특별히 제한되는 것은 아니다.As long as the epoxy resin is an epoxy resin containing an epoxy ring at the end or side chain of the main chain, it can be used regardless of its kind, and its kind is not particularly limited.
구체적인 예를 들면, 비스페놀 A형 에폭시 수지((Diglycidyl Ether of Bisphenol A; DGEBA), 비스페놀 F형 에폭시 수지(Diglycidyl Ether of Bisphenol F; DGEBF), 페놀 노볼락 에폭시 수지(Phenol Novolac Epoxy) 또는 크레졸 노볼락 에폭시 수지(Cresol Novolac Epoxy) 등과 같은 노볼락형 에폭시 수지, 브롬화 에폭시 수지(Brominated Epoxy) 등과 같은 할로겐화 에폭시 수지(Halogenated Epoxy), 지환족 에폭시 수지(Cycloaliphatic Epoxy), 고무 변성 에폭시 수지(Rubber modified Epoxy), 지방족 폴리글리시딜형 에폭시 수지(Aliphatic polyglycidyl Epoxy), 글리시딜 아민형 에폭시 수지(Glycidylamine Epoxy), 폴리글리콜 에폭시 수지(Polyglycol Epoxy) 및 카다놀 에폭시 수지(Cardanol-based Epoxy) 등을 단독 또는 하나 이상 혼합하여 사용할 수 있다.Specific examples include bisphenol A type epoxy resin (Diglycidyl Ether of Bisphenol A; DGEBA), bisphenol F type epoxy resin (Diglycidyl Ether of Bisphenol F; DGEBF), phenol novolac epoxy resin (Phenol Novolac Epoxy) or cresol novolac Novolak-type epoxy resins such as Cresol Novolac Epoxy, Halogenated Epoxy such as Brominated Epoxy, Cycloaliphatic Epoxy, Rubber Modified Epoxy , Aliphatic polyglycidyl epoxy resin (Aliphatic polyglycidyl Epoxy), glycidyl amine epoxy resin (Glycidylamine Epoxy), polyglycol Epoxy and cardanol epoxy resin (Cardanol-based Epoxy) alone or one It can mix and use the above.
구체적인 예를 들면, 상기 에폭시 수지는 비스페놀 A형 에폭시 수지 또는 노볼락형 에폭시 수지 중 선택된 하나 이상을 포함할 수 있으며, 보다 구체적으로, 비스페놀 A형 에폭시 수지, 페놀 노볼락 에폭시 수지 또는 크레졸 노볼락 에폭시 수지 중 선택된 하나 이상을 포함할 수 있다.For example, the epoxy resin may include at least one selected from a bisphenol A type epoxy resin or a novolak type epoxy resin, and more specifically, a bisphenol A type epoxy resin, a phenol novolak epoxy resin, or a cresol novolac epoxy. It may include one or more selected from the resin.
본 발명에서, 상기 에폭시 수지의 당량은 특별히 제한되는 것은 아니지만, 예를 들어 비스페놀 A형 에폭시 수지가 고상 에폭시 수지인 경우, 당량이 700 내지 6000g/eq일 수 있으며, 보다 구체적으로는 1700 내지 2100g/eq일 수 있다. 또한, 상기 비스페놀 A형 에폭시 수지가 액상 에폭시 수지인 경우, 당량이 170 내지 250g/eq일 수 있고, 구체적으로는 180 내지 200g/eq일 수 있다.In the present invention, the equivalent of the epoxy resin is not particularly limited, but, for example, when the bisphenol A epoxy resin is a solid epoxy resin, the equivalent may be 700 to 6000 g / eq, more specifically 1700 to 2100 g / eq. In addition, when the bisphenol-A epoxy resin is a liquid epoxy resin, the equivalent weight may be 170 to 250g / eq, specifically 180 to 200g / eq.
또한, 페놀 노볼락 에폭시 수지 및 크레졸 노볼락 에폭시 수지는 각각 당량이 150 내지 250g/eq일 수 있고, 구체적으로는 190 내지 220g/eq일 수 있다.In addition, the phenol novolac epoxy resin and the cresol novolac epoxy resin may each have an equivalent weight of 150 to 250 g / eq, specifically 190 to 220 g / eq.
다만, 본 발명에서 사용되는 에폭시 수지는 상기 예시된 물질들의 다양한 조합을 통하여 이루어질 수 있으며, 그 조합이 특별히 제한되는 것은 아니다.However, the epoxy resin used in the present invention may be made through various combinations of the above-exemplified materials, and the combination is not particularly limited.
예를 들면, 본 발명에 따른 조성물은 비스페놀 A형 에폭시 수지를 포함하는 것일 수 있다. 상기 비스페놀 A형 에폭시 수지는 대표적인 에폭시형 수지로서, 주쇄의 말단에 에폭시기(epoxy ring)를 가진다.For example, the composition according to the present invention may be one containing a bisphenol A epoxy resin. The bisphenol A epoxy resin is a typical epoxy resin, and has an epoxy group at the end of the main chain.
상기 비스페놀 A형 에폭시 수지는 분자의 말단에 에폭시기가 형성되어 반응성이 우수하고, 경화제와 변성 성분의 선택에 따라 광범위한 경화물성을 얻을 수 있다는 장점이 있으며, 다른 열경화성 수지에 비하여 경화수축이 적고, 비스페놀의 골격이 대칭성이 우수하고, 강직한 구조로 이루어져 있어, 강인성과 고온 안정성이 우수하다는 장점이 있다.The bisphenol A-type epoxy resin has an advantage that the epoxy group is formed at the terminal of the molecule and excellent in reactivity, and a wide range of curable properties can be obtained according to the selection of the curing agent and the modified component, and less curing shrinkage than other thermosetting resins, and bisphenol The skeleton of is excellent in symmetry, and made of a rigid structure, has the advantage of excellent toughness and high temperature stability.
따라서 본 발명에 따른 압력 감응성 잉크 조성물에 함유되는 경우, 고온에서도 상온에서와 유사한 안정적인 압력 감응성을 나타낼 수 있다는 장점이 있다.Therefore, when contained in the pressure sensitive ink composition according to the present invention, there is an advantage that can exhibit a stable pressure sensitivity similar to that at room temperature even at high temperatures.
상기 비스페놀 A형 에폭시 수지의 당량은 특별히 제한되는 것은 아니지만, 예를 들면, 당량이 170 내지 250g/eq인 액상 에폭시 수지 또는 당량이 700 내지 6000g/eq인 고상 에폭시 수지 중에서 선택된 하나 이상을 포함할 수 있다.Although the equivalent weight of the bisphenol A epoxy resin is not particularly limited, for example, it may include at least one selected from a liquid epoxy resin having an equivalent weight of 170 to 250 g / eq or a solid epoxy resin having an equivalent weight of 700 to 6000 g / eq. have.
여기서, 상기 액상 에폭시 수지의 무게평균분자량(weight average molecular weight)은 340 내지 500일 수 있고, 고상 에폭시 수지의 무게평균분자량은 1,400 내지 12,000일 수 있으나, 이에 제한되는 것은 아니다.Here, the weight average molecular weight of the liquid epoxy resin may be 340 to 500, and the weight average molecular weight of the solid epoxy resin may be 1,400 to 12,000, but is not limited thereto.
또한, 상기 비스페놀 A형 에폭시 수지가 액상 에폭시 수지 및 고상 에폭시 수지를 포함하는 화합물인 경우, 상기 비스페놀 A형 에폭시 수지에 함유되는 액상 에폭시 수지 및 고상 에폭시 수지의 함량도 특별히 제한되는 것은 아니지만, 예를 들면, 상기 비스페놀 A형 에폭시 수지는 액상 에폭시 수지 2 내지 15 중량부; 및 고상 에폭시 수지 10 내지 40 중량부를 포함하는 것일 수 있다.In addition, when the bisphenol A epoxy resin is a compound containing a liquid epoxy resin and a solid epoxy resin, the content of the liquid epoxy resin and the solid epoxy resin contained in the bisphenol A epoxy resin is not particularly limited. For example, the bisphenol A epoxy resin is 2 to 15 parts by weight of a liquid epoxy resin; And 10 to 40 parts by weight of the solid epoxy resin.
상기 비스페놀 A형 에폭시 수지 내에서, 액상 에폭시 수지가 2 중량부 미만으로 함유되거나 고상 에폭시 수지가 40 중량부를 초과하여 함유되는 경우, 상대적으로 가교밀도가 낮아져 히스테리시스 현상이 커지고 열 안정성이 저하될 우려가 있으며, 상기 액상 에폭시 수지가 15 중량부를 초과하여 함유되거나 고상 에폭시 수지가 10 중량부 미만으로 함유되는 경우, 저항막이 브리틀(brittle)해지거나 크랙(crack) 등이 발생할 우려가 있다.In the bisphenol A type epoxy resin, when the liquid epoxy resin is contained in less than 2 parts by weight or the solid epoxy resin is contained in more than 40 parts by weight, the crosslinking density is relatively low, there is a fear that the hysteresis phenomenon is increased and the thermal stability is lowered When the liquid epoxy resin is contained in an amount of more than 15 parts by weight or the solid epoxy resin is contained in an amount of less than 10 parts by weight, the resistance film may be brittle or crack may occur.
이와 같은 비스페놀 A형 에폭시 수지의 제조방법도 특별히 제한되는 것은 아니며, 이 분야에서 공지된 통상의 제조방법(ex. 직접법, 간접법)을 통하여 제조될 수 있지만, 예를 들면, 수산화나트륨(NaOH) 등을 촉매로 이용하고, 비스페놀 A(Bisphenol A; BPA)와 에피클로로하이드린(Epichlorohydrin; ECH)을 반응시켜 제조할 수 있고, 비스페놀 A의 디글리시딜 에테르와 비스페놀 A를 반응시켜 비스페놀 A형 에폭시 수지를 제조할 수도 있다.The manufacturing method of such a bisphenol A epoxy resin is not particularly limited, but may be prepared through a conventional manufacturing method (ex. Direct method or indirect method) known in the art, for example, sodium hydroxide (NaOH), or the like. Can be prepared by reacting bisphenol A (BPA) and epichlorohydrin (ECH), and reacting diglycidyl ether of bisphenol A with bisphenol A to react bisphenol A epoxy Resin can also be manufactured.
구체적인 예를 들면, 비스페놀 A형 에폭시 수지는 하기 화학식 1에 따른 반응을 통하여 제조될 수도 있으나, 하기 화학식 1에 나타낸 제조방법은 본 발명에서 사용 가능한 비스페놀 A형 에폭시 수지를 제조하는 일 예에 불과하며, 이에 제한되는 것은 아니다.For example, the bisphenol A epoxy resin may be prepared through a reaction according to the following Chemical Formula 1, but the preparation method shown in Chemical Formula 1 is merely an example of preparing a bisphenol A epoxy resin that can be used in the present invention. However, the present invention is not limited thereto.
화학식 1
Figure PCTKR2009006503-appb-C000001
 Formula 1
Figure PCTKR2009006503-appb-C000001
한편, 노볼락형 에폭시 수지는 측쇄에 에폭시기를 가지는 에폭시 수지로서, 경화 시에 내열도가 우수한 경화물을 얻을 수 있으며, 내약품성 및 접착력이 우수하다는 장점이 있다.On the other hand, the novolak-type epoxy resin is an epoxy resin having an epoxy group in the side chain, it is possible to obtain a cured product excellent in heat resistance at the time of curing, and has the advantage of excellent chemical resistance and adhesion.
따라서, 상기 노볼락형 에폭시 수지도 완전 경화 시에 내열도가 우수한 특성을 가지므로 본 발명에 따른 압력 감응성 잉크 조성물에 함유되는 경우, 고온에서도 우수한 압력 감응성을 나타낼 수 있다.Therefore, since the novolac-type epoxy resin also has excellent heat resistance when completely cured, it can exhibit excellent pressure sensitivity even at high temperatures when it is contained in the pressure sensitive ink composition according to the present invention.
상기 노볼락형 에폭시 수지는 페놀 노볼락 에폭시 수지 또는 크레졸 노볼락 에폭시 수지 중 선택된 하나 이상을 포함할 수 있으며, 그 당량이 특별히 제한되는 것은 아니지만, 페놀 노볼락 에폭시 수지의 당량은 150 내지 250 g/eq일 수 있고, 구체적으로는 190 내지 220g/eq일 수 있다.The novolak-type epoxy resin may include at least one selected from a phenol novolak epoxy resin or a cresol novolak epoxy resin, and its equivalent is not particularly limited, but an equivalent weight of the phenol novolak epoxy resin is 150 to 250 g / eq, specifically 190 to 220g / eq.
페놀 노볼락 에폭시 수지는 하기 화학식 2와 같은 구조로 이루어질 수 있다.The phenol novolac epoxy resin may have a structure such as the following Chemical Formula 2.
화학식 2
Figure PCTKR2009006503-appb-C000002
 Formula 2
Figure PCTKR2009006503-appb-C000002
또한, 크레졸 노볼락 에폭시 수지의 경우에도 그 당량이 특별히 제한되는 것은 아니지만, 예를 들면, 상기 크레졸 노볼락 에폭시 수지의 당량은 150 내지 250g/eq일 수 있고, 보다 구체적으로는 190 내지 220g/eq일 수 있다.In addition, the equivalent weight of the cresol novolac epoxy resin is not particularly limited, but for example, the equivalent weight of the cresol novolac epoxy resin may be 150 to 250 g / eq, more specifically 190 to 220 g / eq Can be.
크레졸 노볼락 에폭시 수지는 하기 화학식 3과 같은 구조로 이루어질 수 있다.Cresol novolac epoxy resin may have a structure such as the formula (3).
화학식 3
Figure PCTKR2009006503-appb-C000003
 Formula 3
Figure PCTKR2009006503-appb-C000003
또한, 본 발명에서, 상기 에폭시 수지는 당량이 700 내지 6000g/eq인 고상 비스페놀 A형 에폭시 수지; 및 당량이 150 내지 250g/eq인 노볼락형 에폭시 수지를 포함하는 것일 수 있고, 보다 구체적으로는 당량이 1700 내지 2100g/eq인 비스페놀 A형 에폭시 수지 및 당량이 190 내지 220g/eq인 노볼락형 에폭시 수지를 포함하는 것일 수 있다.Further, in the present invention, the epoxy resin is a solid bisphenol A epoxy resin having an equivalent weight of 700 to 6000 g / eq; And a novolak type epoxy resin having an equivalent weight of 150 to 250 g / eq, and more specifically, a bisphenol A type epoxy resin having an equivalent weight of 1700 to 2100 g / eq and a novolak type having a equivalent weight of 190 to 220 g / eq. It may be one containing an epoxy resin.
상기한 바와 같이, 본 발명에서 당량이 700 내지 6000g/eq인 비스페놀 A형 에폭시 수지; 및 당량이 150 내지 250g/eq인 노볼락형 에폭시 수지를 포함하는 에폭시 수지를 사용하는 경우, 열에 대한 안정성이 보다 우수하고, 가교 밀도가 향상되어 고온에서도 압력에 대한 저항값이 일정하게 유지될 뿐 아니라 장기간의 압력 하중 인가 시에도 균일한 저항값을 나타낼 수 있다는 장점이 있다.As described above, bisphenol A epoxy resin having an equivalent weight of 700 to 6000 g / eq in the present invention; And an epoxy resin containing a novolac epoxy resin having an equivalent weight of 150 to 250 g / eq, the stability to heat is better, the crosslinking density is improved, and the resistance to pressure is kept constant even at a high temperature. In addition, there is an advantage that it can exhibit a uniform resistance value even when a long-term pressure load is applied.
또한, 상기 에폭시 수지가 비스페놀 A형 에폭시 수지 및 노볼락형 에폭시 수지를 포함하는 경우, 상기 에폭시 수지는 비스페놀 A형 에폭시 수지 10 내지 30 중량부; 및 노볼락형 에폭시 수지 5 내지 20 중량부를 포함할 수 있다.In addition, when the epoxy resin includes a bisphenol A type epoxy resin and a novolak type epoxy resin, the epoxy resin is 10 to 30 parts by weight of the bisphenol A type epoxy resin; And it may include 5 to 20 parts by weight of novolac-type epoxy resin.
상기 에폭시 수지 내에서, 비스페놀 A형 에폭시 수지가 10 중량부 미만으로 함유되거나 노볼락형 에폭시 수지가 20 중량부를 초과하여 함유되는 경우, 매우 높은 가교밀도를 형성하여 저항막이 브리틀(brittle)해지거나 크랙(crack) 등이 발생할 우려가 있고, 상기 비스페놀 A형 에폭시 수지가 30 중량부를 초과하여 함유되거나 노볼락형 에폭시 수지가 5 중량부 미만으로 함유되는 경우, 가교밀도가 낮아져 열 안정성이 떨어지거나 히스테리시스 현상이 커질 우려가 있다.In the epoxy resin, when the bisphenol A type epoxy resin is contained in less than 10 parts by weight or the novolak type epoxy resin is contained in more than 20 parts by weight, a very high crosslinking density is formed so that the resistance film is brittle. If a crack or the like is generated and the bisphenol A-type epoxy resin is contained in an amount of more than 30 parts by weight or the novolak-type epoxy resin is contained in an amount of less than 5 parts by weight, the crosslinking density is lowered, resulting in poor thermal stability or hysteresis. There is a fear that the phenomenon will increase.
이하, 도 1을 참고하여 상기 에폭시 수지 및 도전성 충진제를 포함하는 본 발명에 따른 잉크 조성물의 구조를 설명하면, 본 발명에 따른 잉크 조성물은 도 1에 나타난 바와 같이, 에폭시 수지(100)의 망상 구조 내에 도전성 충진제(200)가 균일하게 분산되어 있는 형태로 이루어질 수 있으며, 이때, 에폭시 수지(100)는 에폭시기의 반응에 의하여 망상 구조를 형성한다.Hereinafter, referring to FIG. 1, the structure of the ink composition according to the present invention including the epoxy resin and the conductive filler will be described. As shown in FIG. 1, the ink composition according to the present invention has a network structure of the epoxy resin 100. The conductive filler 200 may be uniformly dispersed therein, and in this case, the epoxy resin 100 forms a network structure by the reaction of the epoxy group.
상기 망상 구조에 있어서, 각 사슬을 서로 연결하는 지점이 가교 포인트(cross-linking point)(P)이며, 두 개의 가교 포인트 사이의 평균분자량(Mc)이 가교 밀도에 영향을 미칠 수 있다.In the network structure, the point at which each chain is connected to each other is a cross-linking point P, and the average molecular weight Mc between the two crosslinking points may affect the crosslinking density.
일반적으로 당량이 작은 에폭시 수지를 사용할수록 에폭시 링 사이의 사슬 길이가 짧기 때문에 가교 밀도가 상대적으로 높아지며, 당량이 큰 에폭시 수지를 사용하는 경우, 가교 밀도는 상대적으로 낮아진다.In general, the use of epoxy resins having a small equivalent weight results in a relatively high crosslinking density because of the shorter chain length between the epoxy rings, and a relatively low crosslinking density when an epoxy resin having a large equivalent weight is used.
따라서, 당량이 너무 작은 에폭시 수지를 사용하는 경우, 상대적으로 가교 밀도를 높일 수 있고, 이에 따라 에폭시 수지 자체의 열적, 기계적 특성을 향상시킬 수 있으나, 상기 가교 밀도가 너무 높아지면, 이에 따라 형성된 저항막이 브리틀해지거나 크랙 등이 발생하기 쉬우므로 상기한 바와 같이, 당량을 바람직한 범위 내로 조절하는 것이 바람직하다.Therefore, when using an epoxy resin having an equivalent weight that is too small, it is possible to relatively increase the crosslinking density, thereby improving the thermal and mechanical properties of the epoxy resin itself, but if the crosslinking density is too high, the resistance formed accordingly Since the membrane is brittle or cracked easily, it is preferable to adjust the equivalent within the desired range as described above.
한편, 상기 도전성 충진제는 본 발명에 따른 압력 감응성 잉크 내에서 작동 성분으로서 기능을 하며, 에폭시 수지와 혼합되어 전기적 망상 구조를 형성하고, 압력 감응성 잉크 내에 전자 흐름을 제공하며, 이에 따라 일정한 힘 또는 압력에 대하여 균일한 반응(저항값)을 나타냄으로써 압력을 감지할 수 있도록 해주는 역할을 한다.On the other hand, the conductive filler functions as an operating component in the pressure sensitive ink according to the present invention, is mixed with an epoxy resin to form an electrical network structure, and provides an electron flow in the pressure sensitive ink, thereby providing a constant force or pressure It shows the uniform response (resistance value) to the pressure sensor.
이와 같은 도전성 충진제의 종류도 특별히 제한되는 것은 아니며, 이 분야에서 사용되는 다양한 도전성 입자들이 이에 포함될 수 있으나, 예를 들면, 금, 은, 구리, 니켈, 백금, 주석, 알루미늄 및 이들의 합금, 카본블랙, 탄소, 그래파이트 및 이들의 혼합물 등을 들 수 있다.The kind of the conductive filler is not particularly limited, and various conductive particles used in this field may be included therein, for example, gold, silver, copper, nickel, platinum, tin, aluminum and alloys thereof, carbon Black, carbon, graphite, and mixtures thereof.
이 중에서도 예를 들면, 상기 도전성 충진제는 카본블랙일 수 있으며, 상기 카본블랙의 종류도 특별히 제한되는 것은 아니지만, 예를 들면, DBP(Dibutylphthalate) 습윤율이 50 내지 250 ml/100g이고, 입경은 10 내지 80nm인 것일 수 있다.Among these, for example, the conductive filler may be carbon black, the type of the carbon black is not particularly limited, for example, DBP (Dibutylphthalate) wetting rate is 50 to 250 ml / 100g, the particle size is 10 It may be to 80nm.
본 발명에서, 『DBP 습윤율』이란, 입자의 단위 무게당 흡수되는 DBP의 양을 의미하는 것으로서, 상기 DBP 습윤율이 높은 카본블랙의 경우, 비표면적이 넓다는 것을 의미하므로 우수한 전기 전도성을 가지는 것일 수 있다.In the present invention, "DBP wetting rate" means the amount of DBP absorbed per unit weight of particles, and in the case of carbon black having a high DBP wetting rate, the specific surface area is wide, and thus has excellent electrical conductivity. It may be.
이러한 DBP 습윤율은 이 분야에서 공지된 통상적인 방법을 이용하여 측정할 수 있고, 그 측정 방법이 특별히 제한되는 것은 아니다.Such DBP wetting rate can be measured using conventional methods known in the art, and the measuring method is not particularly limited.
본 발명에 따른 압력 감응성 잉크 조성물이 DBP 습윤율이 높은 카본블랙을 포함하는 경우, 보다 우수한 압력 감응성을 나타낼 수 있으며, 상기 카본블랙의 DBP 습윤율이 특별히 제한되는 것은 아니지만, 예를 들면, 상기 카본 블랙의 DBP 습윤율은 50 내지 250 ml/100g일 수 있고, 구체적으로는 80 내지 200 ml/100g일 수 있으며, 보다 구체적으로는 80 내지 130 ml/100g일 수 있다.When the pressure sensitive ink composition according to the present invention includes carbon black having a high DBP wetting rate, it may exhibit better pressure sensitivity, and the DBP wetting rate of the carbon black is not particularly limited. The DBP wetting rate of the black may be 50 to 250 ml / 100g, specifically 80 to 200 ml / 100g, and more specifically 80 to 130 ml / 100g.
또한, 상기 카본블랙의 입경도 특별히 제한되는 것은 아니지만, 예를 들면, 10 내지 80 nm일 수 있고, 구체적으로는 10 내지 40 nm일 수 있다. 상기 카본블랙은 상기 입경 범위 내에서 보다 우수한 감도를 나타낼 수 있다.In addition, the particle diameter of the carbon black is not particularly limited, but may be, for example, 10 to 80 nm, specifically 10 to 40 nm. The carbon black may exhibit superior sensitivity within the particle size range.
나아가, 상기 도전성 충진제는 상기 카본블랙 및 그래파이트를 포함하는 것일 수 있다. 상기 그래파이트는 본 발명에 따른 잉크 조성물 내에서 윤활제(lubricant)의 역할을 하는 것으로서, 그 종류가 특별히 제한되는 것은 아니지만, 예를 들면, 입자 크기가 1 내지 20 ㎛인 그래파이트를 사용할 수 있다. Furthermore, the conductive filler may include the carbon black and graphite. The graphite is a lubricant (lubricant) in the ink composition according to the present invention, although the type is not particularly limited, for example, a particle size of 1 to 20 ㎛ can be used.
또한, 상기 도전성 충진제가 카본블랙 및 그래파이트를 포함하는 경우, 그 함량도 특별히 제한되는 것은 아니지만, 예를 들면, 카본블랙 2 내지 15 중량부; 및 그래파이트 1 내지 10 중량부를 포함할 수 있다.In addition, when the conductive filler includes carbon black and graphite, the content is not particularly limited, for example, 2 to 15 parts by weight of carbon black; And it may include 1 to 10 parts by weight of graphite.
상기 카본블랙이 2 중량부 미만으로 함유되고, 그래파이트가 10 중량부를 초과하여 함유되는 경우, 저항막의 표면이 불균일하거나 거칠어질 우려가 있고, 상기 카본블랙이 15 중량부를 초과하고, 그래파이트가 1 중량부 미만으로 함유되는 경우, 잉크의 흐름성이 현저히 저하되어 작업성이 저하될 우려가 있다.When the carbon black is contained in less than 2 parts by weight, graphite is contained in excess of 10 parts by weight, there is a fear that the surface of the resist film is uneven or rough, the carbon black is more than 15 parts by weight, graphite is 1 part by weight When contained below, there exists a possibility that the flowability of ink may fall remarkably and workability may fall.
상기한 바와 같이, 카본블랙 및 그래파이트가 적절하게 혼합된 도전성 충진제를 포함하는 본 발명의 압력 감응성 잉크 조성물을 사용하는 경우, 우수한 압력 감응성을 나타낼 뿐 아니라 잉크 흐름성이 향상될 수 있으므로 양호한 작업성을 가지고, 균일한 인쇄 도막을 형성할 수 있도록 할 수 있다.As described above, in the case of using the pressure sensitive ink composition of the present invention containing a conductive filler in which carbon black and graphite are appropriately mixed, not only excellent pressure sensitivity but also ink flowability can be improved, thereby providing good workability. And a uniform printing coating film can be formed.
한편, 본 발명에 따른 압력 감응성 잉크 조성물은 에폭시 수지 20 내지 50 중량부; 및 도전성 충진제 3 내지 25 중량부를 포함할 수 있다.On the other hand, the pressure-sensitive ink composition according to the present invention 20 to 50 parts by weight of the epoxy resin; And it may include 3 to 25 parts by weight of the conductive filler.
상기 에폭시 수지 및 도전성 충진제의 함량이 상기 범위를 벗어나는 경우, 전기 저항값이 압력 감지 장치용 저항막으로 사용되기에 너무 높거나 낮아질 우려가 있다.When the content of the epoxy resin and the conductive filler is outside the above range, there is a fear that the electrical resistance value is too high or too low to be used as a resistance film for the pressure sensing device.
한편, 본 발명에 따른 압력 감응성 잉크 조성물은 경화제를 추가로 포함할 수 있으며, 상기 경화제의 함량은 특별히 제한되는 것은 아니지만, 예를 들면, 상기 에폭시 수지 100 중량부에 대하여, 2 내지 20 중량부의 양으로 함유될 수 있다. On the other hand, the pressure sensitive ink composition according to the present invention may further include a curing agent, the content of the curing agent is not particularly limited, for example, based on 100 parts by weight of the epoxy resin, the amount of 2 to 20 parts by weight It may be contained as.
상기 경화제의 함량이 2 중량부 미만인 경우, 경화속도가 느려지고, 상대적으로 에폭시 수지의 함량이 커져 에폭시의 자가반응에 의한 에테르화(etherification)가 수반됨에 따라 에테르기(ether group)가 만들어 질 수 있으며, 이로 인해 히스테리시스 현상이 커질 우려가 있고, 경화제의 함량이 20 중량부를 초과하는 경우, 도막에 크랙을 형성하거나 기계적 강도를 떨어뜨려서 내부 편차가 커질 우려가 있다.When the content of the curing agent is less than 2 parts by weight, the curing rate is lowered, the content of the epoxy resin is relatively increased, the ether group (etherification) can be made as the accompanying etherification (etherification) by the self-reaction of the epoxy If this occurs, the hysteresis may be increased, and if the content of the curing agent exceeds 20 parts by weight, cracks may be formed in the coating or the mechanical strength may be lowered to increase the internal deviation.
또한, 본 발명에 따른 압력 감응성 잉크 조성물은 상기한 바와 같이 경화제를 추가로 포함하여 경화될 수도 있지만, 촉매에 의한 homopolymerization을 통하여 경화시키는 방법 등을 통해서도 경화될 수 있으며, 상기한 바와 같이 경화제를 사용하여 경화시키는 경우, 상기 경화제는 에폭시 경화제로 사용될 수 있는 것은 모두 포함할 수 있으며, 특별히 제한되는 것은 아니다.In addition, the pressure sensitive ink composition according to the present invention may be cured by further including a curing agent as described above, but may also be cured through a method such as curing through a homopolymerization by a catalyst, using a curing agent as described above In the case of curing by using, the curing agent may include all that can be used as an epoxy curing agent, it is not particularly limited.
예를 들면, 상기 경화제는, 아민계, 산무수물계, 폴리아미드계, 폴리아미드아민계, 페놀계 및 카복실산 폴리에스테르 등을 하나 또는 2종 이상 포함하는 것일 수 있고, 구체적으로는 지환족 아민, 방향족 아민, 지방족 아민 및 디시안디아미드로 이루어진 군으로부터 선택된 하나 이상을 포함하는 것일 수 있으며, 보다 구체적으로는 아민가가 200 내지 500인 지환족 아민을 포함하는 것일 수 없다. For example, the curing agent may include one or two or more of amines, acid anhydrides, polyamides, polyamideamines, phenols, carboxylic acid polyesters, and the like, and specifically, alicyclic amines, It may include one or more selected from the group consisting of aromatic amines, aliphatic amines and dicyandiamides, and more specifically, it may not include alicyclic amines having an amine number of 200 to 500.
여기서, 『아민가』란, 0.1N-HCl 방식으로 얻어진 TAV(total amine value)를 의미하며, 상기 아민가가 200 내지 500인 지환족 아민은 경화 속도가 느리기 때문에 상온에서 스크린 인쇄, 콤마 코팅 또는 그라비아 코팅 등을 수행할 때, 안정적인 작업성을 나타낼 수 있으며, 경화가 완료된 후에 경화제 자체가 가지는 벌키(bulky)한 구조의 지환족 고리에 의하여 고온에서도 안정적인 특성을 나타낼 수 있다는 장점이 있다.Here, "amine value" means TAV (total amine value) obtained by 0.1N-HCl method, and the cycloaliphatic amine having an amine value of 200 to 500 has a slow curing rate, so screen printing, comma coating, or gravure coating at room temperature When performing such as, it can exhibit a stable workability, there is an advantage that can exhibit a stable characteristic even at high temperature by the alicyclic ring of the bulky structure (bulky) that the curing agent itself after the curing is completed.
또한, 상기 아민가가 200 내지 500인 지환족 아민은 방향족 아민과 비교하여 저온에서도 우수한 특성을 나타낼 뿐 아니라 우수한 내화학성, 내습성, 내용제성 및 접착력을 가진다는 장점이 있다.In addition, the cycloaliphatic amine having an amine number of 200 to 500 exhibits excellent properties at low temperatures as well as excellent chemical resistance, moisture resistance, solvent resistance, and adhesion compared to aromatic amines.
나아가, 본 발명에 따른 압력 감응성 잉크 조성물은 개질제, 소포제 및 흐름성 조절제로 이루어진 군으로부터 선택된 하나 이상의 첨가제를 추가로 포함할 수 있다.Furthermore, the pressure sensitive ink composition according to the present invention may further comprise one or more additives selected from the group consisting of modifiers, antifoams and flow control agents.
상기 개질제는 본 발명에 따른 압력 감응성 잉크 조성물의 물리적 특성을 개질하는 기능을 하는 것으로서, 예를 들면, 실리카, 활석, 벤톤 등이 사용할 수 있다.The modifier serves to modify the physical properties of the pressure sensitive ink composition according to the present invention. For example, silica, talc, benton, and the like may be used.
또한, 상기 소포제 및 흐름성 조절제는 본 발명에 따른 잉크 조성물의 전기화학적 특성의 정확성 및 재연성을 향상시켜주는 기능을 하는 물질로서, 특별히 그 종류가 제한되는 것은 아니지만, 예를 들면, 소포제로서는 비 실리콘계 소포제가 사용될 수 있고, 흐름성 조절제로서는 BYK-103® 등과 같은 분산제가 사용될 수 있다.In addition, the antifoaming agent and the flow control agent is a material that functions to improve the accuracy and reproducibility of the electrochemical properties of the ink composition according to the present invention, although the type thereof is not particularly limited, for example, non-silicone based Defoamers can be used, and dispersants such as BYK-103® can be used as flow control agents.
상기한 바와 같은 압력 감응성 잉크 조성물은 용매 내에 용해되어 액상으로 사용될 수 있는데, 상기 용매도 상기 에폭시 수지를 용해시킬 수 있는 용매라면 모두 사용할 수 있으며, 그 종류가 특별히 제한되는 것은 아니지만, 예를 들면, 메틸에틸케톤 등과 같은 케톤류, 글리콜 에테르, 부틸 셀로솔 아세테이트 등과 같은 글리콜-에틸 에스테르류 및 디프로필렌 글리콜 모노메틸 등을 사용할 수 있으며, 보다 구체적으로는, 디에틸렌 글리콜 모노부틸 에테르 아세테이트 등을 사용할 수 있다.The pressure sensitive ink composition as described above may be dissolved in a solvent and used in a liquid phase. Any solvent may be used as long as it is a solvent capable of dissolving the epoxy resin, and the kind thereof is not particularly limited, but, for example, Ketones such as methyl ethyl ketone and the like, glycol-ethyl esters such as glycol ether, butyl cellosol acetate and the like and dipropylene glycol monomethyl and the like can be used, and more specifically, diethylene glycol monobutyl ether acetate and the like can be used. .
뿐만 아니라, 본 발명은 또한, 상기 조성물의 경화물을 포함하는 저항막에 관한 것이다.In addition, the present invention also relates to a resistive film containing the cured product of the composition.
상기 저항막은 본 발명에 따른 조성물을 경화시킴으로써 형성되는 것으로서, 이 분야에서 공지된 통상적인 막의 제조방법에 따라 제조될 수 있으며, 그 방법이 특별히 제한되는 것은 아니다.The resistive film is formed by curing the composition according to the present invention, and may be prepared according to a conventional film production method known in the art, and the method is not particularly limited.
예를 들면, 전극 등과 같은 기재 상에 상기 조성물을 균일하게 코팅하고, 90 내지 170℃의 온도에서 5 내지 60 분 동안 경화시킬 수 있으며, 경화가 완전하게 이루어질 수 있도록 온도 및 시간 조건을 조절할 수 있다.For example, the composition may be uniformly coated on a substrate such as an electrode, and cured at a temperature of 90 to 170 ° C. for 5 to 60 minutes, and temperature and time conditions may be adjusted so that curing may be completed completely. .
상기 저항막의 체적저항(Volume resistance)은 특별히 제한되는 것은 아니지만, 예를 들면, 102 내지 107Ω·cm일 수 있고, 구체적으로는 103내지 106Ω·cm일 수 있다.Volume resistance of the resistive film is not particularly limited, but may be, for example, 10 2 to 10 7 Ω · cm, specifically 10 3 to 10 6 Ω · cm.
상기 저항막의 체적저항이 102Ω·cm 미만인 경우, 일반적인 전극 재료로 사용될 수 있으며, 107Ω·cm을 초과하는 경우, 절연상태에 가까운 특성을 나타내므로 상기 저항막의 체적저항이 상기 한정된 수치범위를 벗어나는 경우, 압력 감지성 저항막으로 적합하지 않을 수 있다.When the volume resistance of the resistive film is less than 10 2 Ω · cm, it can be used as a general electrode material. When the resistive film exceeds 10 7 Ω · cm, the volume resistance of the resistive film is in the limited numerical range because it exhibits characteristics close to an insulating state. If it is outside the, it may not be suitable as a pressure sensitive resistive film.
또한, 상기 저항막의 압력 감도는 사용 목적에 따라 다양하게 조절될 수 있으며, 특별히 제한되는 것은 아니지만, 예를 들면, 0.001 내지 1μS/N일 수 있다.In addition, the pressure sensitivity of the resistive film may be variously adjusted according to the purpose of use, and is not particularly limited, but may be, for example, 0.001 to 1 μS / N.
뿐만 아니라, 본 발명은 베이스 필름, 상기 베이스 필름 상에 형성된 전극 및 상기 전극 상에 형성된 본 발명의 저항막을 각각 포함하는 두 개의 감지부를 포함하되, 상기 두 개의 감지부는 저항막이 대향하도록 구비되는 압력 감지 장치에 관한 것이다.In addition, the present invention includes two sensing units each comprising a base film, an electrode formed on the base film, and the resistive film of the present invention formed on the electrode, wherein the two sensing parts are pressure sensing provided to face the resistive film Relates to a device.
여기서, 상기 베이스 필름은 상기 압력 감지 장치 내에서 전극 및 저항막이 형성되는 절연 필름으로 사용될 수 있는 것은 모두 포함할 수 있으며, 그 종류가 특별히 제한되는 것은 아니다.Here, the base film may include all that can be used as the insulating film in which the electrode and the resistance film is formed in the pressure sensing device, the type is not particularly limited.
예를 들면, 폴리에틸렌테레프탈레이트(PET) 필름, 폴리에틸렌나프탈레이트(PEN) 필름, 폴리염화비닐(PVC) 필름, 열가소성 폴리우레탄(TPU) 필름 또는 폴리이미드(PI) 필름 등을 사용할 수 있을 뿐 아니라 텍스타일 또는 세라믹과 같은 절연체를 포함하는 필름 등을 사용할 수 있고, 구체적으로는 폴리이미드 필름, 폴리에틸렌테레프탈레이트 필름 또는 폴리에틸렌나프탈레이트 필름을 포함할 수 있으며, 나아가 상기 폴리이미드 필름, 폴리에틸렌테레프탈레이트 필름 또는 폴리에틸렌나프탈레이트 필름 등에 열가소성 폴리우레탄 필름을 적층하여 사용할 수도 있다.For example, polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, polyvinyl chloride (PVC) film, thermoplastic polyurethane (TPU) film or polyimide (PI) film and the like can be used as well as textiles Or a film including an insulator such as a ceramic, and specifically, may include a polyimide film, a polyethylene terephthalate film or a polyethylene naphthalate film, and furthermore, the polyimide film, polyethylene terephthalate film or polyethylene A thermoplastic polyurethane film can also be laminated | stacked and used for a phthalate film.
본 발명에서 사용되는 베이스 필름은 고온 안정성이 우수하여 고온에서 열팽창 혹은 구조적 변화가 수반되지 않고, 이에 따라 잔류응력 등이 발생할 염려가 없어, 압력 감지 장치의 감도를 우수하게 유지시킬 수 있다. The base film used in the present invention is excellent in high temperature stability and does not involve thermal expansion or structural change at a high temperature, and thus, there is no fear of residual stress, etc., thereby maintaining excellent sensitivity of the pressure sensing device.
또한, 상기 전극은 저항막의 양면에 접착되어 저항막으로부터 전달되는 전기적 신호를 측정값으로 출력하는 역할을 하는 것으로서, 이와 같이 전달되는 전기적 신호의 손실이 없이 출력값을 나타낼 수 있도록 낮은 전기저항을 가지는 전도성 물질은 모두 사용될 수 있으며, 구체적인 예를 들면, 금, 은, 구리, 또는 알루미늄 등을 포함하는 것일 수 있다.In addition, the electrode is bonded to both sides of the resistive film serves to output the electrical signal transmitted from the resistive film as a measurement value, the conductivity having a low electrical resistance so that the output value can be represented without loss of the electrical signal transmitted as described above The materials may all be used, and specific examples may include gold, silver, copper, aluminum, and the like.
본 발명에 따른 압력 감지 장치는 상기한 바와 같이 상온뿐만 아니라 고온에서의 압력 감응성이 우수하고, 히스테리시스 현상 및 드리프트 현상 등이 최소화되며, 재연성이 우수한 압력 감응성 잉크 조성물을 이용하여 제조된 저항막을 포함하므로 압력 측정 또는 감응 장치로 유용하게 사용될 수 있다.As described above, the pressure sensing device according to the present invention is excellent in pressure sensitivity at high temperature as well as at room temperature, minimizes hysteresis and drift, and includes a resistive film manufactured using a pressure sensitive ink composition having excellent reproducibility. It can be usefully used as a pressure measuring or sensing device.
상기 압력 감지 장치는, 압력을 감응하는 모든 장치에 적용될 수 있으며, 예를 들면, 압력 변환기, 압력 감지기, 스트레인 게이지, 촉각 센서 또는 터치 센서 등과 같은 다양한 압력 감지 장치에 적용될 수 있다.The pressure sensing device may be applied to any pressure sensitive device, and may be applied to various pressure sensing devices such as a pressure transducer, a pressure sensor, a strain gauge, a tactile sensor, or a touch sensor.
도 2를 참고하면, 본 발명의 일 예에 따른 압력 감지 테스트 시편(1)은 두 개의 감지부로서, 절연성 베이스 필름(11, 21)의 일면에 각각 전극(13, 23)이 형성되고, 상기 전극(13, 23)의 일면에 저항막(15, 25)이 형성되며, 상기 저항막(15, 25)이 일정한 공간(A)만큼 이격되어 대향하도록 구비되는 구조를 가진다.Referring to FIG. 2, the pressure sensing test specimen 1 according to an embodiment of the present invention has two sensing units, and electrodes 13 and 23 are formed on one surface of the insulating base films 11 and 21, respectively. The resistive films 15 and 25 are formed on one surface of the electrodes 13 and 23, and the resistive films 15 and 25 are spaced apart by a predetermined space A to face each other.
상기 구조를 가지는 테스트 시편(1)에 도 2에 도시된 바와 같이, 상하 방향으로 일정한 힘 또는 압력을 가하여 출력되는 저항값으로 압력을 감지할 수 있다. 다만, 도 2에 도시된 테스트 시편(1)은 본 발명의 일 예에 불과하며, 본 발명이 이에 제한되는 것은 아니다.As illustrated in FIG. 2, the test specimen 1 having the above structure may be configured to detect pressure by applying a constant force or pressure in the vertical direction. However, the test specimen 1 shown in FIG. 2 is merely an example of the present invention, and the present invention is not limited thereto.
이하, 하기 실시예를 통하여 본 발명을 보다 상세하게 설명하도록 한다. 다만, 본 발명이 하기 실시예에 기재된 것으로 제한되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the present invention is not limited to those described in the following Examples.
[실시예 1] 잉크 조성물의 제조Example 1 Preparation of Ink Composition
4-neck 원형 플라스크에 BCA (디에틸렌 글리콜 모노부틸 에테르 아세테이트) 43.1 중량부, 당량(EEW)이 1950g/eq으로 중합된 고상의 비스페놀 A형 에폭시 수지 17.4 중량부 및 당량(EEW)이 210g/eq으로 중합된 고상의 크레졸 노볼락 에폭시 수지 9.2 중량부를 함께 투입한 후, 히팅 맨틀(heating mantle)에 장착하여 100℃ 내지 140℃ 사이에서 온도를 조절함으로써 바인더를 제조하였다.43.1 parts by weight of BCA (diethylene glycol monobutyl ether acetate), 17.4 parts by weight of solid state bisphenol A epoxy resin polymerized with an equivalent weight (EEW) of 1950 g / eq and 210g / eq weight of an equivalent weight (EEW) of a 4-neck round flask. 9.2 parts by weight of the solid-solvent cresol novolac epoxy resin polymerized together was added to the heating mantle, and then a binder was prepared by controlling the temperature between 100 ° C and 140 ° C.
상기 바인더에 DBP 습윤율이 100 ml/100g이고, 평균 입경이 24nm인 카본블랙(Mitsubishi Chemical) 7.3 중량부, 평균 입자 크기가 6.67㎛인 판상의 그래파이트(Chuetsu Graphite Works Co., Ltd.) 2.8 중량부, A300(silica, Degussa) 2.5 중량부, A980(소포제, Tego) 0.9 중량부, BYK-103(흐름성 조절제, BYK) 1.2중량부를 첨가하여 습윤(wetting)한 후, 3-Roll Mill을 사용하여 10회 hard milling 작업을 거쳐 도전성 충진제를 에폭시 바인더에 균일하게 분산시킴으로써 페이스트 상태의 잉크 조성물을 제조하였다.2.8 parts by weight of carbon black (Mitsubishi Chemical) having a DBP wetting rate of 100 ml / 100g and an average particle diameter of 24 nm in the binder and 2.8 weight of plate-like graphite having an average particle size of 6.67 μm. Part, A300 (silica, Degussa) 2.5 parts by weight, A980 (foaming agent, Tego) 0.9 parts by weight, BYK-103 (flow control agent, BYK) by adding 1.2 parts by weight of the wet (wetting), then using 3-Roll Mill The paste composition was prepared by uniformly dispersing the conductive filler in the epoxy binder after 10 hard milling operations.
이어서, 제조된 페이스트에 아민가가 365인 에폭시 변성 지환족 아민(cycloaliphatic amine modified type) 4.4 중량부 및 BCeA(에틸렌 글리콜 모노부틸 에테르 아세테이트) 11.2 중량부를 첨가하고 교반하여 압력 감응성 잉크 조성물을 제조하였다.Subsequently, 4.4 parts by weight of epoxy-modified cycloaliphatic amine modified type having an amine number of 365 and 11.2 parts by weight of BCeA (ethylene glycol monobutyl ether acetate) were added to the prepared paste, followed by stirring to prepare a pressure sensitive ink composition.
[실시예 2 내지 5] 잉크 조성물의 제조[Examples 2 to 5] Preparation of Ink Composition
하기 표 1에 나타낸 조성에 따라 잉크 조성물을 제조하였다는 점을 제외하고는, 상기 실시예 1과 동일한 방법으로 압력 감응성 잉크 조성물을 제조하였다.A pressure sensitive ink composition was prepared in the same manner as in Example 1, except that the ink composition was prepared according to the composition shown in Table 1 below.
표 1
실시예1 실시예2 실시예3 실시예4 실시예5
바인더 A1 17.4 27.9 30.4 25.4 23.8
A2 - - - - 3.6
A3 9.2 - - - -
용제 B1 43.1 42.4 43.8 39.8 41.7
도전성 충진제 C1 7.3 10.8 11.2 9.5 12.1
C2 2.8 - - - -
첨가제 D1 2.5 3.5 2.5 3.7 3.5
D2 0.9 0.9 0.8 0.9 0.9
D3 1.2 - - - -
경화제 E1 4.4 1.7 0.7 4.8 2.2
용제 F1 11.2 12.8 10.6 15.9 12.2
Table 1
Example 1 Example 2 Example 3 Example 4 Example 5
bookbinder A1 17.4 27.9 30.4 25.4 23.8
A2 - - - - 3.6
A3 9.2 - - - -
solvent B1 43.1 42.4 43.8 39.8 41.7
Conductive filler C1 7.3 10.8 11.2 9.5 12.1
C2 2.8 - - - -
additive D1 2.5 3.5 2.5 3.7 3.5
D2 0.9 0.9 0.8 0.9 0.9
D3 1.2 - - - -
Hardener E1 4.4 1.7 0.7 4.8 2.2
solvent F1 11.2 12.8 10.6 15.9 12.2
(단위: 중량부)(Unit: parts by weight)
A1은 당량이 1950g/eq으로 중합된 고상의 비스페놀 A형 에폭시 수지A1 is a solid bisphenol A epoxy resin polymerized at an equivalent weight of 1950 g / eq.
A2는 당량이 190g/eq인 액상의 비스페놀 A형 에폭시 수지A2 is a liquid bisphenol A epoxy resin having an equivalent weight of 190 g / eq.
A3는 당량이 210g/eq으로 중합된 고상의 크레졸 노볼락 에폭시 수지A3 is a solid cresol novolac epoxy resin polymerized in an equivalent weight of 210 g / eq.
B1은 BCA(디에틸렌 글리콜 모노부틸 에테르 아세테이트)B1 is BCA (diethylene glycol monobutyl ether acetate)
C1은 DBP 습윤율이 100 ml/100g이고, 평균 입경이 24nm인 카본블랙C1 is carbon black with DBP wetting rate of 100 ml / 100g and average particle diameter of 24 nm
C2는 평균 입자 크기가 6.67㎛인 판상의 그래파이트C2 is a plate-like graphite having an average particle size of 6.67 μm
D1은 A300D1 is A300
D2는 A980D2 is A980
D3는 BYK-103D3 BYK-103
E1은 아민가가 365인 에폭시 변성 지환족 아민E1 is an epoxy modified alicyclic amine having an amine number of 365
F1은 BCeA(에틸렌 글리콜 모노부틸 에테르 아세테이트)F1 is BCeA (ethylene glycol monobutyl ether acetate)
[시험예][Test Example]
1. 경화조건에 따른 저항값 측정1. Measurement of resistance value according to curing conditions
두께 50㎛ 이고, 면 치수가 18mm * 18mm인 폴리이미드 필름 상에 체적저항이 10-7Ω·cm이고, 일반적인 유연성 기판(flexible printed circuit board)의 금으로 도금된 두 개의 감지부를 포함하는 압력-저항 테스트용 시편을 준비하였다.Pressure-comprising two sensing sections with a gold plating of a typical flexible printed circuit board with a volume resistivity of 10 −7 Ω · cm on a polyimide film having a thickness of 50 μm and a surface dimension of 18 mm * 18 mm. Specimens for resistance test were prepared.
이어서, 실시예 1, 2, 3 및 5에 따른 잉크 조성물을 이용하여 상기 전극 상의 일측부에 직경이 4mm인 원 모양으로 스크린 인쇄하여 두께 15㎛의 저항막을 형성하고, 상기 저항막이 대향하도록 구비된 두 개의 감지부를 포함하는 압력 저항 테스트용 시편을 가지고 액츄에이터 직경을 3mm로 하여 압력-저항값을 측정하였다.Subsequently, screen printing is performed in a circular shape having a diameter of 4 mm on one side of the electrode using the ink compositions according to Examples 1, 2, 3, and 5 to form a resistive film having a thickness of 15 μm, and the resistive films are provided to face each other. The pressure-resistance value was measured with an actuator diameter of 3 mm with the pressure resistance test specimen including two sensing units.
여기서, 『액츄에이터 직경이 3mm』라 함은, 시편에 힘을 가할 때 시편 상에 직경 3mm의 실리콘 패드를 놓고 힘을 가한 것을 의미한다.Here, "actuator diameter of 3 mm" means that a force of 3 mm in diameter of a silicone pad is placed on the specimen when a force is applied to the specimen.
저항막에 대한 경화조건을 다르게 하여 압력-저항값을 측정하였는데, 우선, 전극 상에 형성된 저항막을 150℃의 온도에서 30분 동안 경화시킨 후, 상기 저항막이 대향하도록 두 개의 감지부를 배치한 압력 저항 테스트용 시편으로 압력-저항값을 측정하였고, 상기 150℃의 온도에서 30분 동안 경화시킨 저항막을 다시 150℃의 온도에서 30분 동안 더 경화시킨 저항막을 포함하는 압력 저항 테스트용 시편을 가지고, 압력-저항값을 측정하였다.The pressure-resistance value was measured by varying the curing conditions for the resistive film. First, the resistive film formed on the electrode was cured at a temperature of 150 ° C. for 30 minutes, and then the pressure resistance in which two sensing units were disposed to face the resistive film. The pressure-resistance value was measured by the test specimen, and the pressure-resistance test specimen including the resistance film further cured for 30 minutes at the temperature of 150 ° C. was further cured for 30 minutes at the temperature of 150 ° C. The resistance value was measured.
그 결과, 도 3에 나타난 바와 같이, 경화가 보다 많이 진행된 후에 측정된 압력-저항값의 경우에 하중 증가 및 감소 시의 편차가 더 적게 나타났고, 특히, 실시예 1 및 3에 따른 잉크 조성물을 이용하여 준비된 압력 감지 테스트 시편을 통하여 측정한 경우, 하중 증가 및 감소 시에 편차가 다른 경우에 비하여 더 적게 나타났다. 여기서, 도 3에 표시된 『하중 증가시』라 함은, 하중을 점진적으로 증가시키면서 저항값을 측정한 것이고, 『하중 감소시』라 함은, 최고 하중을 기준으로 점진적으로 줄이면서 저항값을 측정한 값을 의미한다. As a result, as shown in Fig. 3, less variation in load increase and decrease in the case of the pressure-resistance value measured after curing proceeded more, and in particular, the ink compositions according to Examples 1 and 3 When measured through pressure-sensing test specimens prepared using the device, the variation in load increase and decrease was less than in the other cases. Here, "when the load increases" as shown in Figure 3, the resistance value is measured while gradually increasing the load, "when the load decreases", the resistance value is measured while gradually reducing the reference to the maximum load One value.
2. 압력 증가에 따른 출력전압 측정2. Output voltage measurement with increasing pressure
실시예 1에 따른 잉크 조성물을 이용하여 액츄에이터 직경을 1.5 mm로 하고, 저항막을 150℃의 온도에서 30분 동안 두 차례에 걸쳐 경화시켰다는 점을 제외하고는, 상술한 경화조건에 따른 저항값 측정 시 사용된 압력 저항 테스트용 시편과 동일한 조건으로 압력 저항 테스트용 시편을 준비하였다.When measuring the resistance value according to the above-mentioned curing conditions, except that the actuator diameter was 1.5 mm using the ink composition according to Example 1, and the resist film was cured twice at a temperature of 150 ° C. for 30 minutes. The pressure resistance test specimen was prepared under the same conditions as the pressure resistance test specimen used.
이어서, 전위차회로(potentiometer circuit)를 구성하여 상기 압력 저항 테스트용 시편에 인가되는 압력을 증가시키면서 기준 전압을 3V로 하고, 고정저항을 3kW으로 하여 센서의 출력저항을 측정한 후, 이를 출력전압으로 변환하였다.Subsequently, a potentiometer circuit was formed to increase the pressure applied to the pressure resistance test specimen while measuring the output resistance of the sensor with a reference voltage of 3 V and a fixed resistance of 3 kW. Converted.
그 결과, 도 4에 나타난 바와 같이, 편차가 적고, 히스테리시스 현상도 적게 나타났다. 여기서, 도4에 표시된 『센서의 크기』라 함은, 스크린 인쇄되는 잉크 조성물의 직경을 의미한다. As a result, as shown in FIG. 4, the variation was small and the hysteresis phenomenon was also small. Here, "the size of the sensor" shown in FIG. 4 means the diameter of the ink composition to be screen printed.
여기서 상기 전위차 회로는 도 5에 나타난 바와 같이 구성되고, 출력전압(Vout)은 하기 수학식 1에 따라 계산하였다.Wherein the potential difference circuit is configured as shown in Figure 5, the output voltage (V out ) was calculated according to the following equation (1).
수학식 1
Figure PCTKR2009006503-appb-M000001
 Equation 1
Figure PCTKR2009006503-appb-M000001
상기 수학식 1에서, Rc는 고정저항이며, Ra는 센서저항이며, Vg는 기준전압이다.In Equation 1, Rc is a fixed resistance, Ra is a sensor resistance, and Vg is a reference voltage.
3. 열안정성 평가3. Thermal stability evaluation
실시예 1에 따른 잉크 조성물을 이용하여 제조된 압력 저항 테스트용 시편 및 종래 상용화되어 있는 압력센서(flexiforce, Tekscan Co.; 이하, '비교예 1에 따른 시편' 이라 함)를 가지고 다른 조건은 상기 압력 증가에 따른 출력전압 측정에서 사용된 조건과 모두 동일하게 하여, 핫 플레이트의 온도를 변화시키면서 각 설정 온도에서 압력 증가에 따른 출력전압의 변화를 측정하였다.A pressure resistance test specimen prepared using the ink composition according to Example 1 and a pressure sensor (flexiforce, Tekscan Co .; hereafter referred to as "Comparative Example 1") commercially available, and other conditions are The same conditions used in the measurement of the output voltage at increasing pressures are made, and at each set temperature while varying the temperature of the hot plate The change in output voltage with increasing pressure was measured.
그 결과, 실시예 1에 따른 조성물을 이용하여 제조한 테스트 시편을 가지고 압력변화에 따른 출력전압을 측정한 경우, 도 6에 나타난 바와 같이, 온도가 변화하더라도 편차가 크지 않았다.As a result, in the case of measuring the output voltage according to the pressure change with the test specimen prepared using the composition according to Example 1, as shown in Figure 6, even if the temperature changes, the deviation was not large.
반면에 비교예 1에 따른 시편을 가지고 압력변화에 따른 출력전압을 측정한 경우, 도 7에 나타난 바와 같이, 온도 변화에 따라 편차가 크게 나타났다. 여기서, 도 6과 7에 표시된 『복원』이라 함은, 온도와 압력변화에 따른 출력전압의 복원상태를 보기 위한 것으로 최고 온도를 기준으로 해당 온도로 감온하여 측정함을 의미한다. On the other hand, when the output voltage according to the pressure change was measured with the specimen according to Comparative Example 1, as shown in Figure 7, the deviation was large according to the temperature change. Here, "restoration" shown in Figures 6 and 7 is for viewing the restored state of the output voltage according to the temperature and pressure changes, it means that the temperature is measured by reducing the temperature.
4. 피로실험4. Fatigue Experiment
시편의 전압출력은 기준 전압을 3V, 고정저항을 500W으로 하고 실시예 1의 잉크 조성물을 이용하여 제조된 압력 저항 테스트 시편을 가지고 다른 조건은 상기 압력 증가에 따른 출력전압 측정에서 사용된 조건과 모두 동일하게 하여, 하중을 30g 내지 600g으로 변화시키면서, 피로실험을 120만 주기까지 수행한 결과, 도 8에 나타난 바와 같이, 신뢰성 및 내구성이 양호하게 나타났다.The voltage output of the specimen was 3 V and the fixed resistance was 500 W. The pressure resistance test specimen was prepared using the ink composition of Example 1, and the other conditions were all different from those used in the measurement of the output voltage according to the pressure increase. In the same manner, fatigue tests were performed up to 1.2 million cycles while changing the load from 30 g to 600 g. As shown in FIG. 8, reliability and durability were satisfactory.

Claims (22)

  1. 에폭시 수지; 및 도전성 충진제를 포함하는 압력 감응성 잉크 조성물.Epoxy resins; And a conductive filler.
  2. 제 1 항에 있어서,The method of claim 1,
    에폭시 수지는 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 노볼락형 에폭시 수지, 할로겐화 에폭시 수지, 지환족 에폭시 수지, 고무 변성 에폭시 수지, 지방족 폴리글리시딜형 에폭시 수지, 글리시딜 아민형 에폭시 수지, 폴리글리콜 에폭시 수지 및 카다놀 에폭시 수지로 이루어진 군으로부터 선택된 하나 이상을 포함하는 것을 특징으로 하는 조성물.Epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, novolac type epoxy resins, halogenated epoxy resins, cycloaliphatic epoxy resins, rubber modified epoxy resins, aliphatic polyglycidyl type epoxy resins, and glycidyl amine type epoxy resins. At least one selected from the group consisting of polyglycol epoxy resin and cardanol epoxy resin.
  3. 제 1 항에 있어서,The method of claim 1,
    에폭시 수지는 비스페놀 A형 에폭시 수지 또는 노볼락형 에폭시 수지 중 선택된 하나 이상을 포함하는 것을 특징으로 하는 조성물.The epoxy resin composition comprising at least one selected from bisphenol A type epoxy resin or novolak type epoxy resin.
  4. 제 3 항에 있어서,The method of claim 3, wherein
    비스페놀 A형 에폭시 수지는 당량이 170 내지 250g/eq인 액상 에폭시 수지 또는 당량이 700 내지 6000g/eq인 고상 에폭시 수지 중 선택된 하나 이상을 포함하는 것을 특징으로 하는 조성물.The bisphenol A type epoxy resin composition comprising at least one selected from a liquid epoxy resin having an equivalent weight of 170 to 250 g / eq or a solid epoxy resin having an equivalent weight of 700 to 6000 g / eq.
  5. 제 4 항에 있어서,The method of claim 4, wherein
    비스페놀 A형 에폭시 수지는 액상 에폭시 수지 2 내지 15 중량부; 및 고상 에폭시 수지 10 내지 40 중량부를 포함하는 것을 특징으로 하는 조성물.Bisphenol A epoxy resin is 2 to 15 parts by weight of the liquid epoxy resin; And 10 to 40 parts by weight of the solid epoxy resin.
  6. 제 3 항에 있어서,The method of claim 3, wherein
    에폭시 수지는 당량이 700 내지 6000g/eq인 비스페놀 A형 에폭시 수지; 및 당량이 150 내지 250g/eq인 노볼락형 에폭시 수지를 포함하는 것을 특징으로 하는 조성물.Epoxy resins include bisphenol A epoxy resins having an equivalent weight of 700 to 6000 g / eq; And a novolak-type epoxy resin having an equivalent weight of 150 to 250 g / eq.
  7. 제 3 항에 있어서,The method of claim 3, wherein
    에폭시 수지는 비스페놀 A형 에폭시 수지 10 내지 30 중량부; 및 노볼락형 에폭시 수지 5 내지 20 중량부를 포함하는 것을 특징으로 하는 조성물.The epoxy resin is 10 to 30 parts by weight of bisphenol A type epoxy resin; And 5 to 20 parts by weight of a novolac-type epoxy resin.
  8. 제 1 항에 있어서,The method of claim 1,
    도전성 충진제는 금, 은, 구리, 니켈, 백금, 주석, 알루미늄, 카본블랙, 탄소, 그래파이트 및 이들의 혼합물로 이루어진 군으로부터 선택된 하나 이상을 포함하는 것을 특징으로 하는 조성물.The conductive filler comprises at least one selected from the group consisting of gold, silver, copper, nickel, platinum, tin, aluminum, carbon black, carbon, graphite and mixtures thereof.
  9. 제 8 항에 있어서,The method of claim 8,
    카본블랙은 DBP 습윤율이 50 내지 250 ml/100g 이고, 입경이 10 내지 80nm인 것을 특징으로 하는 조성물. Carbon black has a DBP wetting rate of 50 to 250 ml / 100g, the composition characterized in that the particle size of 10 to 80nm.
  10. 제 8 항에 있어서,The method of claim 8,
    도전성 충진제는 카본블랙 및 그래파이트를 포함하는 것을 특징으로 하는 조성물.The conductive filler comprises carbon black and graphite.
  11. 제 10 항에 있어서,The method of claim 10,
    도전성 충진제는 카본블랙 2 내지 15 중량부; 및 그래파이트 1 내지 10 중량부를 포함하는 것을 특징으로 하는 조성물.Conductive fillers 2 to 15 parts by weight of carbon black; And 1 to 10 parts by weight of graphite.
  12. 제 1 항에 있어서,The method of claim 1,
    에폭시 수지 20 내지 50 중량부; 및 도전성 충진제 3 내지 25 중량부를 포함하는 것을 특징으로 하는 조성물.20 to 50 parts by weight of an epoxy resin; And 3 to 25 parts by weight of the conductive filler.
  13. 제 1 항에 있어서,The method of claim 1,
    에폭시 수지 100 중량부에 대하여, 2 내지 20 중량부의 경화제를 추가로 포함하는 것을 특징으로 하는 조성물.A composition comprising 2 to 20 parts by weight of a curing agent based on 100 parts by weight of an epoxy resin.
  14. 제 13 항에 있어서,The method of claim 13,
    경화제는 아민계, 산무수물계, 폴리아미드계, 폴리아미드아민계, 페놀계 및 카복실산 폴리에스테르로 이루어진 군으로부터 선택된 하나 이상을 포함하는 것을 특징으로 하는 조성물.The curing agent is characterized in that it comprises at least one selected from the group consisting of amines, acid anhydrides, polyamides, polyamideamines, phenols and carboxylic acid polyesters.
  15. 제 13 항에 있어서,The method of claim 13,
    경화제는 지환족 아민, 방향족 아민, 지방족 아민 및 디시안디아미드로 이루어진 군으로부터 선택된 하나 이상을 포함하는 것을 특징으로 하는 조성물.And the curing agent comprises at least one selected from the group consisting of cycloaliphatic amines, aromatic amines, aliphatic amines and dicyandiamides.
  16. 제 13 항에 있어서, The method of claim 13,
    경화제는 아민가가 200 내지 500인 지환족 아민을 포함하는 것을 특징으로 하는 조성물. The curing agent comprises a cycloaliphatic amine having an amine number of 200 to 500.
  17. 제 1 항에 있어서,The method of claim 1,
    개질제, 소포제 및 흐름성 조절제로 이루어진 군으로부터 선택된 하나 이상의 첨가제를 추가로 포함하는 것을 특징으로 하는 조성물.And at least one additive selected from the group consisting of modifiers, antifoams and flow control agents.
  18. 제 1 항 내지 제 17 항 중 어느 한 항에 따른 조성물의 경화물을 포함하는 저항막.The resistive film containing the hardened | cured material of the composition of any one of Claims 1-17.
  19. 제 18 항에 있어서, The method of claim 18,
    압력 감도는 0.001 내지 1μS/N인 것을 특징으로 하는 저항막. Pressure sensitivity is a resistance film, characterized in that 0.001 ~ 1μS / N.
  20. 베이스 필름, 상기 베이스 필름 상에 형성된 전극 및 상기 전극 상에 형성된 제 18 항에 따른 저항막을 각각 포함하는 두 개의 감지부를 포함하되, Including two sensing units each comprising a base film, an electrode formed on the base film and the resistance film according to claim 18 formed on the electrode,
    상기 두 개의 감지부는 저항막이 대향하도록 구비되는 압력 감지 장치.The two sensing units are provided with a pressure-sensitive film facing the resistance.
  21. 제 20 항에 있어서,The method of claim 20,
    베이스 필름은 폴리이미드 필름, 폴리에틸렌테레프탈레이트 필름 또는 폴리에틸렌나프탈레이트 필름을 포함하는 것을 특징으로 하는 압력 감지 장치.Pressure sensor, characterized in that the base film comprises a polyimide film, polyethylene terephthalate film or polyethylene naphthalate film.
  22. 제 20 항에 있어서, The method of claim 20,
    전극은 금, 은, 구리 또는 알루미늄을 포함하는 것을 특징으로 하는 압력 감지 장치. Pressure sensing device, characterized in that the electrode comprises gold, silver, copper or aluminum.
PCT/KR2009/006503 2009-04-27 2009-11-06 Pressure-sensitive ink composition, and resistive film and pressure sensing device using the same WO2010126214A1 (en)

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KR20090036767 2009-04-27
KR10-2009-0036767 2009-04-27
KR10-2009-0047386 2009-05-29
KR1020090047386A KR101095312B1 (en) 2009-04-27 2009-05-29 Pressure sensitive ink composition, resist membrane and pressure sensitive device using the same

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013015A (en) * 1999-07-01 2001-01-19 Furukawa Electric Co Ltd:The Filmy pressure sensitive sensor and semiconductor pressure sensitive ink for it
JP2001184944A (en) * 1999-12-28 2001-07-06 Nitta Ind Corp Pressure-sensitive conductive ink composition
JP2004294074A (en) * 2003-03-25 2004-10-21 Denso Corp Pressure sensitive resistor and pressure sensitive sensor
KR100456045B1 (en) * 1996-01-05 2004-12-16 텍스캔, 인크. Pressure Sensitive Ink, Pressure Sensitive Ink Device, and Methods of Use

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100456045B1 (en) * 1996-01-05 2004-12-16 텍스캔, 인크. Pressure Sensitive Ink, Pressure Sensitive Ink Device, and Methods of Use
JP2001013015A (en) * 1999-07-01 2001-01-19 Furukawa Electric Co Ltd:The Filmy pressure sensitive sensor and semiconductor pressure sensitive ink for it
JP2001184944A (en) * 1999-12-28 2001-07-06 Nitta Ind Corp Pressure-sensitive conductive ink composition
JP2004294074A (en) * 2003-03-25 2004-10-21 Denso Corp Pressure sensitive resistor and pressure sensitive sensor

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