WO2010119642A1 - ヒートポンプ式暖房装置 - Google Patents
ヒートポンプ式暖房装置 Download PDFInfo
- Publication number
- WO2010119642A1 WO2010119642A1 PCT/JP2010/002542 JP2010002542W WO2010119642A1 WO 2010119642 A1 WO2010119642 A1 WO 2010119642A1 JP 2010002542 W JP2010002542 W JP 2010002542W WO 2010119642 A1 WO2010119642 A1 WO 2010119642A1
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- WIPO (PCT)
- Prior art keywords
- liquid
- heat exchanger
- radiator
- heat pump
- refrigerant
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 91
- 239000003507 refrigerant Substances 0.000 claims abstract description 145
- 239000007788 liquid Substances 0.000 claims abstract description 105
- 238000001816 cooling Methods 0.000 claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 183
- 238000011084 recovery Methods 0.000 claims description 6
- 239000008399 tap water Substances 0.000 claims description 6
- 235000020679 tap water Nutrition 0.000 claims description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical group O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 6
- 238000005057 refrigeration Methods 0.000 description 6
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000002528 anti-freeze Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/10—Arrangement or mounting of control or safety devices
- F24D19/1006—Arrangement or mounting of control or safety devices for water heating systems
- F24D19/1009—Arrangement or mounting of control or safety devices for water heating systems for central heating
- F24D19/1039—Arrangement or mounting of control or safety devices for water heating systems for central heating the system uses a heat pump
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D11/00—Central heating systems using heat accumulated in storage masses
- F24D11/02—Central heating systems using heat accumulated in storage masses using heat pumps
- F24D11/0214—Central heating systems using heat accumulated in storage masses using heat pumps water heating system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/10—Arrangement or mounting of control or safety devices
- F24D19/1006—Arrangement or mounting of control or safety devices for water heating systems
- F24D19/1009—Arrangement or mounting of control or safety devices for water heating systems for central heating
- F24D19/1015—Arrangement or mounting of control or safety devices for water heating systems for central heating using a valve or valves
- F24D19/1024—Arrangement or mounting of control or safety devices for water heating systems for central heating using a valve or valves a multiple way valve
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/08—Hot-water central heating systems in combination with systems for domestic hot-water supply
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/18—Hot-water central heating systems using heat pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/10—Control of fluid heaters characterised by the purpose of the control
- F24H15/156—Reducing the quantity of energy consumed; Increasing efficiency
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/30—Control of fluid heaters characterised by control outputs; characterised by the components to be controlled
- F24H15/375—Control of heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/40—Control of fluid heaters characterised by the type of controllers
- F24H15/414—Control of fluid heaters characterised by the type of controllers using electronic processing, e.g. computer-based
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B30/00—Heat pumps
- F25B30/02—Heat pumps of the compression type
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B40/00—Subcoolers, desuperheaters or superheaters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B6/00—Compression machines, plants or systems, with several condenser circuits
- F25B6/04—Compression machines, plants or systems, with several condenser circuits arranged in series
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
- F25B9/008—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant the refrigerant being carbon dioxide
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/10—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point with several cooling stages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2309/00—Gas cycle refrigeration machines
- F25B2309/06—Compression machines, plants or systems characterised by the refrigerant being carbon dioxide
- F25B2309/061—Compression machines, plants or systems characterised by the refrigerant being carbon dioxide with cycle highest pressure above the supercritical pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/04—Details of condensers
- F25B2339/047—Water-cooled condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2341/00—Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves
- F25B2341/001—Ejectors not being used as compression device
- F25B2341/0012—Ejectors with the cooled primary flow at high pressure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/23—Separators
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/12—Hot water central heating systems using heat pumps
Definitions
- the present invention relates to a heat pump type heating apparatus that performs heating using a heated liquid generated by a heat pump (refrigeration cycle apparatus).
- Patent Document 1 discloses a heat pump heating device 100 as shown in FIG.
- the heat pump heating apparatus 100 includes a heat pump 200 having a refrigerant circuit 10 that circulates refrigerant and a circulation path 16 that circulates water.
- the refrigerant circuit 10 is configured by connecting a compressor 11, a radiator 12, an expansion valve 13, and an evaporator 14 in this order by piping.
- the circulation path 16 has a hot water storage tank 15. Water extracted from the hot water storage tank 15 is sent to the radiator 12 to generate hot water, and the hot water is stored in the hot water storage tank 15. The hot water stored in the hot water storage tank 15 is sent to, for example, the heater 17 disposed in the living room, where it is radiated and then returned to the hot water storage tank 15.
- Patent Document 2 discloses a heat pump 201 including an internal heat exchanger 18 as shown in FIG. 11 as a heat pump for hot water supply.
- the internal heat exchanger 18 is for causing heat exchange between the high-pressure refrigerant flowing out of the radiator 12 and the low-pressure refrigerant flowing out of the evaporator 14. With this configuration, the temperature of the low-pressure refrigerant sucked into the compressor 11 increases, and hot water having a higher temperature is generated.
- Patent Document 3 discloses a heat pump 202 as shown in FIG. 12A.
- the first radiator 12A and the second radiator 12B are provided as radiators for radiating the refrigerant, and after the high-pressure refrigerant radiated by the first radiator 12A radiates heat by the internal heat exchanger 18, The heat is further guided by being guided to the second radiator 12B.
- the water flowing through the flow passage 19 is further heated by the first radiator 12A after being heated by the second radiator 12B.
- the heat pump type heating apparatus 100 shown in FIG. 10 for example, when the heating operation is performed for a long time, the temperature of water does not decrease so much in the heater 17, and the medium temperature (for example, 40 (About 60 ° C. to 60 ° C.) may be supplied.
- the medium temperature for example, 40 (About 60 ° C. to 60 ° C.)
- the heat exchange efficiency in the radiator 12 is lowered, and the COP (Coefficient of Performance) of the heat pump 200 is lowered.
- This problem is the same even when the heat pump 201 shown in FIG. 11 or the heat pump 202 shown in FIG. 12A is adopted as the heat pump of the heat pump heating device 100 shown in FIG.
- the present invention has been made in view of such a point, and an object of the present invention is to improve the COP of the heat pump even in the case where an intermediate temperature liquid is sent to the heat pump in the heat pump type heating device.
- the present invention provides a compressor that converts a low-pressure refrigerant into a high-pressure refrigerant, a radiator that dissipates the high-pressure refrigerant, an expansion means that converts the high-pressure refrigerant into a low-pressure refrigerant, and an evaporator that absorbs heat from the low-pressure refrigerant.
- a refrigerant circuit including: a circulation path that circulates the liquid via the radiator to generate heated liquid; a heater that releases heat of the heated liquid; and the heat dissipation provided in the refrigerant circuit
- An internal heat exchanger that transfers heat from the high-pressure refrigerant radiated by the radiator to the low-pressure refrigerant, and a liquid that cools the liquid flowing through the circulation path before flowing into the radiator by the high-pressure refrigerant that has flowed out of the internal heat exchanger
- a heat pump type heating device including a cooling heat exchanger.
- the low temperature liquid can be introduced into the radiator, and the COP of the heat pump can be improved.
- the schematic block diagram of the heat pump type heating apparatus which concerns on 1st Embodiment of this invention. Mollier diagram of the heat pump used in the heat pump heating system shown in FIG. The schematic block diagram of the heat pump type heating apparatus which concerns on the modification of 1st Embodiment of this invention. The schematic block diagram of the heat pump type heating apparatus which concerns on 2nd Embodiment of this invention. Mollier diagram of the heat pump used in the heat pump heater shown in FIG. The schematic block diagram of the heat pump type heating apparatus which concerns on 3rd Embodiment of this invention. The schematic block diagram of the heat pump type heating apparatus which concerns on 4th Embodiment of this invention. The schematic block diagram of the heat pump type heating apparatus which concerns on 5th Embodiment of this invention.
- FIG. 12A Schematic configuration diagram of a conventional heat pump heating system
- FIG. 12B is a graph showing the temperature of refrigerant and water passing through the first and second radiators in the heat pump shown in FIG. 12A.
- FIG. 1 shows a heat pump heating device 1A according to the first embodiment of the present invention.
- This heat pump heating device 1A includes a heat pump 20A having a refrigerant circuit 3 for circulating a refrigerant, a circulation path 5 for circulating a liquid, and a control device 6 that performs overall control of the device.
- the circulation path 5 circulates the liquid via a radiator 22 described later in order to generate a heated liquid.
- the heater 4 that releases the heat of the heating liquid is incorporated in the circulation path 5, the liquid circulates without stopping, and the generated heating liquid directly radiates heat in the heater 4. ing. That is, the circulation path 5 also functions as a heating circuit.
- water is used as the liquid that is the heat medium.
- the liquid of the present invention is not necessarily limited thereto, and any liquid may be used as long as it can receive heat from the refrigerant circulating in the refrigeration circuit 3 and can radiate heat to the atmosphere by the heater 4.
- an antifreeze liquid in which propylene glycol or the like is mixed in water can be used as the liquid.
- the liquid is water and the heated liquid is hot water.
- the refrigerant circuit 3 includes a compressor 21 that converts low-pressure refrigerant into high-pressure refrigerant, a radiator 22 that dissipates high-pressure refrigerant, an expansion valve 25A that is an expansion unit that converts high-pressure refrigerant into low-pressure refrigerant, an evaporator 26 that absorbs heat from the low-pressure refrigerant, and The first to fourth pipes 31 to 34 connect these devices in this order.
- heat heat is exchanged between the water passing through the radiator 22 and the refrigerant to heat the water.
- the evaporator 26 heat is exchanged between the air blown by the fan 26a and the refrigerant, and the refrigerant absorbs heat.
- the refrigerant circuit 3 is filled with oxygen dioxide that becomes a supercritical state on the high-pressure side as a refrigerant.
- the refrigerant circuit 3 is provided with an internal heat exchanger 23A straddling the second pipe 32 and the fourth pipe 34, and the second pipe 32 is liquid-cooled downstream of the internal heat exchanger 23A.
- An industrial heat exchanger 24 is provided.
- the internal heat exchanger 23A performs heat exchange between the high-pressure refrigerant flowing out of the radiator 22 and the low-pressure refrigerant flowing out of the evaporator 26, and transfers heat from the high-pressure refrigerant radiated by the radiator 22 to the low-pressure refrigerant. It is something to be made.
- the liquid cooling heat exchanger 24 cools the water flowing through the circulation path 5 before flowing into the radiator 22 with the high-pressure refrigerant flowing out from the internal heat exchanger 23A.
- the heater 4 is for heating a living room, for example, by heat radiation.
- a radiator installed in a living room may be adopted, or a hot water panel laid on the floor may be adopted.
- the circulation path 5 includes a supply pipe 51 that leads water from the heater 4 to the liquid cooling heat exchanger 24, a relay pipe 52 that leads water from the liquid cooling heat exchanger 24 to the radiator 22, and heating from the radiator 22. And a recovery pipe 53 that guides the hot water to the machine 4.
- the supply pipe 51 is provided with a pump 62. Further, the supply pipe 51 is provided with a temperature sensor 61 that detects the temperature of the water flowing into the supply pipe 51 from the heater 4.
- the portion of the supply pipe 51 downstream of the pump 62 and the relay pipe 52 are connected by a bypass pipe 54.
- the supply pipe 51 is provided with a three-way valve 63, and the upstream end of the bypass pipe 54 is connected to the three-way valve 63.
- the downstream end of the bypass pipe 54 is connected in the middle of the relay pipe 52.
- the three-way valve 63 circulates water without passing through the bypass pipe 54, that is, circulates water through both the liquid heat exchanger 24 and the radiator 22, or circulates water through the bypass pipe 54, that is, It switches whether water is circulated only through the radiator 22 and constitutes the switching means of the present invention.
- the switching means of the present invention does not need to be configured by the three-way valve 63, and is provided, for example, on the downstream side of the position where the bypass pipe 54 in the supply pipe 51 and the on-off valve provided in the bypass pipe 54 are connected.
- the on-off valve may be configured.
- the control device 6 includes a microcomputer or a DSP (digital signal processor) and is connected to the heat pump 20A, the pump 62, the temperature sensor 61, and the three-way valve 63 described above.
- a microcomputer or a DSP digital signal processor
- control performed by the control device 6 will be specifically described.
- the control device 6 When the heating switch (not shown) is turned ON by the user, for example, the control device 6 operates the heat pump 20A and rotates the pump 62. Thereby, water is heated by the radiator 22 to generate hot water, and this hot water is sent to the heater 4 for heating.
- the control device 6 monitors the temperature of the water flowing into the supply pipe 51 by the temperature sensor 61.
- the control device 6 causes the water to circulate through the bypass pipe 54.
- the three-way valve 63 is controlled as described above. Specifically, the control device 6 sets the three-way valve 63 in a state where the upstream portion 51 a and the bypass pipe 54 communicate with each other than the three-way valve 63 of the supply pipe 51. As a result, the first route that passes only through the radiator 22 is selected.
- the refrigerant circulating in the refrigerant circuit 3 operates as follows.
- the refrigerant is compressed to high temperature and high pressure by the compressor 21 and then flows into the radiator 22 where it dissipates heat to the water flowing through the circulation path 5.
- the refrigerant that has flowed out of the radiator 22 flows into the internal heat exchanger 23A, where it further dissipates heat to the refrigerant that has flowed out of the evaporator 26.
- the refrigerant flowing out of the internal heat exchanger 23A passes through the liquid cooling heat exchanger 24 as it is, is decompressed by the expansion valve 25A, and expands to a low temperature and a low pressure.
- the expanded refrigerant flows into the evaporator 26 and absorbs heat from the air.
- the refrigerant that has flowed out of the evaporator 26 flows into the internal heat exchanger 23 ⁇ / b> A, and further absorbs heat from the refrigerant that has flowed out of the radiator 22.
- the refrigerant flowing out from the internal heat exchanger 23A is again sucked into the compressor 21 and compressed.
- the water circulating through the circulation path 5 (first route) is heated by the radiator 22 to be warm water, and then flows into the heater 4 to radiate heat to the atmosphere.
- the water radiated by the heater 4 flows into the radiator 22 again to become hot water.
- the control device 6 causes the water to circulate without passing through the bypass pipe 54.
- the valve 63 is controlled. Specifically, the control device 6 sets the three-way valve 63 so that the upstream portion 51a and the downstream portion 51b communicate with each other with respect to the three-way valve 63 of the supply pipe 51. Thereby, the second route passing through both the liquid heat exchanger 24 and the radiator 22 is selected.
- the temperature of the water flowing into the liquid cooling heat exchanger 24 is higher than the temperature of the refrigerant flowing into the liquid cooling heat exchanger 24.
- the refrigerant circulating in the refrigerant circuit 3 operates as follows. The refrigerant is compressed to high temperature and high pressure by the compressor 21 and then flows into the radiator 22 where it dissipates heat to the water flowing through the circulation path 5. The refrigerant that has flowed out of the radiator 22 flows into the internal heat exchanger 23A, where it further dissipates heat to the refrigerant that has flowed out of the evaporator 26.
- the refrigerant that has flowed out of the internal heat exchanger 23A flows into the liquid cooling heat exchanger 24, where the refrigerant flows near the temperature of the water flowing into the liquid cooling heat exchanger 24 by exchanging heat with the water flowing through the circulation path 5. Until heated.
- the refrigerant that has flowed out of the liquid cooling heat exchanger 24 is decompressed by the expansion valve 25A, expanded to a low temperature and low pressure, and then flows into the evaporator 26 where it absorbs heat from the air.
- the refrigerant that has flowed out of the evaporator 26 flows into the internal heat exchanger 23 ⁇ / b> A, and further absorbs heat from the refrigerant that has flowed out of the radiator 22.
- the refrigerant flowing out from the internal heat exchanger 23A is again sucked into the compressor 21 and compressed.
- the water circulating through the circulation path 5 (second route) is heated by the radiator 22 to be warm water, and then flows into the heater 4 to dissipate heat into the atmosphere, thereby becoming medium warm water.
- the medium-temperature water that has flowed out of the heater 4 flows into the liquid cooling heat exchanger 24, where it is cooled and cooled to low temperature by exchanging heat with the refrigerant that has flowed out of the internal heat exchanger 23A.
- the water which became low temperature flows into the radiator 22 again, and becomes warm water.
- FIG. 2 shows a Mollier diagram in the middle temperature state of the heat pump 20A used in the present embodiment.
- the broken line in the figure is a Mollier diagram of the heat pump 201 that does not have the liquid cooling heat exchanger as shown in FIG. Note that the points A to F in FIG. 2 represent the states of the marks A to F in FIG.
- the temperature of the refrigerant that passes through the radiator is changed from Td ′ (point B ′), which has become high by the compressor, to the returning hot water from the heater.
- the temperature drops to T GC ′ (point C ′) near the temperature Tw1.
- the refrigerant that has exited the radiator is reduced in temperature by passing through the internal heat exchanger, and then decompressed by the expansion valve.
- the enthalpy of the decompressed refrigerant increases from H2 ′ (F ′ point) to H1 ′ (G ′ point) by passing through the evaporator, and further increases by passing through the internal heat exchanger.
- the water flowing into the radiator 22 is cooled by the liquid cooling heat exchanger 24, so the temperature becomes Tw2 ( ⁇ Tw1).
- Tw2 the temperature becomes lower than T GC (point C) and the conventional heat pump 201.
- the refrigerant exiting the radiator 22 is cooled to T IH (point D) by the internal heat exchanger 23A, and then heated to T EX (point E) by the liquid cooling heat exchanger 24. Thereafter, the refrigerant is decompressed by the expansion valve 3.
- the enthalpy H2 (F point) of the refrigerant after decompression is higher than the H2 ′ of the conventional heat pump 201 because the refrigerant is depressurized after being heated by the liquid cooling heat exchanger 24. (H2> H2 ′).
- the heat pump heating device 1A of the present embodiment low-temperature water can be introduced into the radiator 22 even when medium-temperature water is sent to the heat pump 20A. Therefore, the COP of the heat pump 20A can be improved.
- the outlet refrigerant temperature of the radiator 22 can be lowered as compared with the conventional heat pump 201, the optimum high pressure with respect to the outlet refrigerant temperature of the radiator 22 (high pressure at which the COP of the heat pump is maximized) can be obtained. Can be lowered. For this reason, since the differential pressure between the high pressure and the low pressure in the refrigeration cycle can be reduced, the differential pressure applied to the compression section of the compressor 21 can be reduced. Thereby, the leakage loss and the sliding loss of the refrigerant are reduced, so that the efficiency of the compressor 21 can be improved. Further, since the high pressure of the refrigeration cycle can be lowered, the reliability of the refrigerant circuit 3 can also be improved. In addition, since the pressure resistance of the constituent members can be lowered, the heating device can be manufactured at low cost.
- the discharge pressure of the compressor 21 is lowered, so that the discharge refrigerant temperature of the compressor 21 can be lowered, the deterioration of the members due to the high temperature discharge refrigerant can be reduced, and the reliability of the device can be improved.
- it is effective for measures to increase the temperature of refrigerant discharged from the compressor when the outside air temperature drops extremely (about -5 ° C to 15 ° C).
- the enthalpy width in the evaporator 26 becomes smaller, the low pressure rises compared to the conventional heat pump 201. For this reason, since the differential pressure between the high pressure and the low pressure in the refrigeration cycle can be further reduced, the differential pressure applied to the compression portion of the compressor 21 can be further reduced. Moreover, the average temperature of the evaporator 26 increases as the pressure inside the evaporator 26 increases. As a result, since the load of the defrost operation accompanying frost formation can be reduced, the energy consumption of the heat pump 20A can be reduced, and the efficiency of the device can be improved.
- the heat pump 202 shown in FIG. 12A disclosed in Patent Document 3 seems to have a configuration similar to the heat pump 20A of the present embodiment at first glance.
- the first radiator 12A and the second radiator 12B are arranged with the internal heat exchanger 18 interposed therebetween, and the temperatures of the refrigerant and water decrease or increase as shown in FIG. 12B.
- Patent Document 3 does not describe not only the circulation of water, but also does not describe that the water becomes medium temperature water and is returned to the heat pump.
- the bypass pipe 54 and the three-way valve 63 that is a switching means are provided, so that it is possible to select whether the water circulation is performed by the first route or the second route. These may be omitted so that water always passes through both the liquid cooling heat exchanger 24 and the radiator 22.
- the bypass pipe 54 and the switching means are provided in the circulation path 5 when the water temperature detected by the temperature sensor 61 is lower than a preset temperature. It is possible to prevent the liquid cooling heat exchanger 24 from being heated by the refrigerant through the two routes, and the first route and the second route so that the temperature of the water flowing into the radiator 22 is as low as possible. Is preferable in that the efficiency of the refrigeration cycle can be kept high.
- both the liquid cooling heat exchanger 24 and the radiator 22 used in this embodiment are heat exchangers for exchanging heat between water and the refrigerant
- the 24 and 22 are manufactured as an integrated water-refrigerant heat exchanger. It is also possible.
- the refrigerant flow path and the water flow path constituting the water refrigerant heat exchanger may be divided into two parts. If it does in this way, since it becomes possible to design a heat exchanger compactly, in addition to miniaturizing the unit (for example, heat pump unit) which constitutes a heating device, manufacturing cost can be reduced.
- the hot water heated by the refrigerant circuit 3 is radiated to the atmosphere by the heater 4, but the heater 4 may be used as a heating source such as hot water supply or snow melting, for example. Needless to say, the same effects as described above can be obtained in these applications.
- the refrigerant of the present invention may be any refrigerant as long as it has a characteristic that the optimum high pressure is lowered as the temperature of the outlet refrigerant of the radiator 22 decreases. Moreover, since the temperature difference between the inlet refrigerant and the outlet refrigerant of the radiator 22 is widened as the outlet refrigerant temperature of the radiator 22 is lowered, the heat exchange efficiency in the radiator 22 is improved, and as a result, the high pressure is reduced. For this reason, it goes without saying that the same effect as described above can be obtained even in the case of a refrigerant that does not become a supercritical state on the high-pressure side in a normal operation like a chlorofluorocarbon refrigerant.
- the compressor 21 can be constituted by a main compressor and a sub compressor connected in parallel to the main compressor.
- FIG. 4 shows a heat pump heating device 1B according to the second embodiment of the present invention.
- the heat pump heating device 1 ⁇ / b> B of the second embodiment has substantially the same configuration as the heat pump heating device 1 ⁇ / b> A of the first embodiment. Therefore, the same functional parts are denoted by the same reference numerals, and the description of the same configuration and the operation thereof is omitted. This also applies to third to fifth embodiments described later.
- the heat pump heating device 1B of the present embodiment is different from the heat pump heating device 1A of the first embodiment only in that an expander 25B that recovers power from the expanding refrigerant is used as the expansion means. Also in this embodiment, the same effect as the first embodiment can be obtained.
- FIG. 5 shows a Mollier diagram in the middle temperature state of the heat pump 20B used in the present embodiment.
- the broken line in the figure is a Mollier diagram of a heat pump using an expander that does not have a liquid cooling heat exchanger.
- the enthalpy of the expander inlet refrigerant is H3 ′, from which the adiabatic expansion change (isentropic change) of D ′ ⁇ F ′
- the enthalpy is H2 ′.
- the heat pump 20B used in this embodiment after the temperature of the refrigerant that has exited the radiator 22 is lowered by the internal heat exchanger 23A, it is heated to the point E by the liquid cooling heat exchanger 24 and expanded. Inhaled into machine 25B.
- the enthalpy of the refrigerant at the inlet of the expander 25B is H3
- the enthalpy of the refrigerant at the outlet of the expander 25B after the D ⁇ F adiabatic expansion change is H2.
- the motive energy that can be recovered by the expander is proportional to the enthalpy change width, the larger the enthalpy of the refrigerant sucked into the expander, the larger the motive energy that can be recovered by the expander.
- the expansion energy that can be recovered by the expander 25A used in the present embodiment is significantly larger than the expansion energy that can be recovered by the expander in the heat pump that does not include the liquid cooling heat exchanger.
- the COP of the heat pump 20B can be dramatically improved by using the recovered expansion energy as a part of the input of the compressor 21.
- the optimum high pressure can be lowered, so that the difference between the high pressure and the low pressure acting on the expander 25B can be reduced. For this reason, by reducing the leakage loss and sliding loss of the refrigerant, the efficiency of the expander 25B can be improved, and more expansion energy can be obtained.
- FIG. 6 shows a heat pump heating device 1C according to the third embodiment of the present invention.
- the heat pump heating device 1C of the present embodiment is different from the heat pump heating device 1A of the first embodiment in that an ejector 25C is used as the expansion means.
- the ejector 25 ⁇ / b> C is connected to the radiator 22 by the second pipe 32 and is connected to the evaporator 26 by the third pipe 33.
- a gas-liquid separator 27 is provided in the middle of the third pipe 33.
- the evaporator 26 is connected to the ejector 25C by the divided fourth pipe 34A, and the gas phase portion of the gas-liquid separator 27 is connected to the compressor 21 by the divided fourth pipe 34B.
- the internal heat exchanger 23A is provided across the second pipe 32 and the divided fourth pipe 34B.
- the refrigerant that has passed through the internal heat exchanger 23A and the liquid cooling heat exchanger 24 flows into the ejector 25C, where it expands.
- the refrigerant flowing out of the ejector 25C is separated into a gas refrigerant and a liquid refrigerant by the gas-liquid separator 27, and the liquid refrigerant is sent to the evaporator 26 and evaporated, and then flows into the ejector 25C again.
- the gas refrigerant separated by the gas-liquid separator 27 flows into the internal heat exchanger 23 ⁇ / b> A and is heated by the refrigerant radiated by the radiator 22.
- the other refrigerant and water operations are the same as in the first embodiment.
- the same effect as in the first embodiment can be obtained.
- the refrigerant flow rate in the ejector 25C can be increased, and the pressure of the refrigerant sucked into the compressor 21 can be further increased. Can do. For this reason, since the compression power required by the compressor 21 can be made smaller, the COP of the heat pump 20C can be improved.
- FIG. 7 shows a heat pump heating device 1D according to the fourth embodiment of the present invention.
- the heat pump type heating device 1D of the present embodiment is different from the heat pump type heating device 1A of the first embodiment in that the circulation path 5 is configured by a hot water storage tank 50 instead of the heater 4.
- the hot water storage tank 50 is a cylindrical sealed container extending in the vertical direction, and the inside is filled with water.
- the lower part of the hot water storage tank 50 is connected to the liquid cooling heat exchanger 24 by a supply pipe 51, and the upper part of the hot water storage tank 50 is connected to the radiator 22 by a recovery pipe 53.
- the pump 62 When the pump 62 is rotated, water is led from the lower part of the hot water storage tank 50 to the liquid cooling heat exchanger 24 by the supply pipe 31, and hot water is supplied from the radiator 22 to the upper part of the hot water storage tank 50 by the recovery pipe 53.
- the temperature sensor 61 provided in the supply pipe 51 detects the temperature of the water flowing into the supply pipe 51 from the hot water storage tank 50.
- the heater 4 is connected to the upper part of the hot water storage tank 50 by a feed pipe 81 and is connected to the lower part of the hot water storage tank 50 by a return pipe 82.
- the heating pipe 65 is provided in the return pipe 82, but the heating pump 65 may be provided in the feed pipe 81.
- the heating pump 65 is connected to the control device 6. When the heating pump 65 is rotated, the hot water stored in the hot water storage tank 50 is sent to the heater 4 through the feed pipe 81, and the hot water radiated by the heater 4 is returned to the hot water storage tank 50 through the return pipe 82. It is. That is, the hot water storage tank 50, the feed pipe 81, the heater 4 and the return pipe 82 constitute a heating circuit 8.
- control performed by the control device 6 will be specifically described.
- the control device 6 monitors the temperature of the water flowing into the supply pipe 51 by the temperature sensor 61.
- the control device 6 controls the three-way valve 63 so that water is circulated through the bypass pipe 54.
- the control device 6 sets the three-way valve 63 in a state where the upstream portion 51 a and the bypass pipe 54 communicate with each other than the three-way valve 63 of the supply pipe 51. As a result, the first route that passes only through the radiator 22 is selected.
- the refrigerant circulating in the refrigerant circuit 3 operates in the same manner as in the first embodiment.
- the water circulating through the circulation path 5 (first route) is heated by the radiator 22 to be hot water, and then stored in the hot water storage tank 50.
- the water extracted from the lower part of the hot water storage tank 50 flows into the radiator 22 again and becomes hot water.
- the control device 6 controls the three-way valve 63 so that water is circulated without passing through the bypass pipe 54. . Specifically, the control device 6 sets the three-way valve 63 so that the upstream portion 51a and the downstream portion 51b communicate with each other with respect to the three-way valve 63 of the supply pipe 51. Thereby, the second route passing through both the liquid heat exchanger 24 and the radiator 22 is selected.
- the temperature of the water flowing into the liquid cooling heat exchanger 24 is higher than the temperature of the refrigerant flowing into the liquid cooling heat exchanger 24.
- the refrigerant circulating in the refrigerant circuit 3 operates in the same manner as in the first embodiment.
- the water circulating through the circulation path 5 (second route) is heated by the radiator 22 to be warm water and then stored in the hot water storage tank 50.
- the hot water storage tank 50 In the lower part of the hot water storage tank 50, water that has not been sufficiently radiated by the heater 4 and becomes medium-temperature water is stored.
- the medium-temperature water extracted from the lower part of the hot water storage tank 50 flows into the liquid cooling heat exchanger 24, where it is cooled by heat exchange with the refrigerant that has flowed out of the internal heat exchanger 23A and becomes a low temperature.
- the water which became low temperature flows into the radiator 22 again, and becomes warm water.
- ⁇ Heating operation> For example, when a heating switch (not shown) is turned on by the user, the control device 6 rotates the heating pump 65. Thereby, the hot water stored in the hot water storage tank 50 is sent to the heater 4 for heating.
- the same effect as in the first embodiment can be obtained.
- the heated hot water can be temporarily stored in the hot water storage tank 50, for example, when the heating is temporarily stopped and then restarted, the water cooled by the heating operation is stopped.
- the heating operation can be quickly restarted by sending the hot water stored in the hot water storage tank 50 to the heater 4 before reheating with the heat pump 20A.
- high-temperature hot water can be generated at an inexpensive electric charge at night, and this hot water can be stored in the hot water storage tank 50, so that the running cost for heating operation can be reduced.
- the hot water storage tank 50 may be provided with a water supply pipe 91 (see FIG. 8) for supplying tap water to the hot water storage tank 50.
- a water supply pipe 91 see FIG. 8 for supplying tap water to the hot water storage tank 50.
- a mixing valve may be provided in the feed pipe 81, and the water supply pipe 91 may be connected to the mixing valve.
- the hot water storage tank 50 may be provided with a hot water discharge pipe 92 (see FIG. 8) for extracting hot water from the hot water storage tank 50. By doing in this way, hot water supply can also be performed while performing heating operation.
- FIG. 8 shows a heat pump heating device 1E according to the fifth embodiment of the present invention.
- the heat pump heating device 1E of the present embodiment is different from the heat pump heating device 1D of the fourth embodiment in that a tank heat exchanger 83 is provided in the hot water storage tank 50. Further, a water supply pipe 91 is connected to the lower part of the hot water storage tank 50, and a hot water discharge pipe 92 is connected to the upper part of the hot water storage tank 50.
- the in-tank heat exchanger 83 is for heating the heat medium that is the second liquid by the hot water stored in the hot water storage tank 50.
- the in-tank heat exchanger 83 is connected to the heater 4 by a feed pipe 81 and a return pipe 82.
- the heat medium heated by the in-tank heat exchanger 83 is sent to the heater 4 through the feed pipe 81, and the heat medium radiated by the heater 4 is sent to the tank through the return pipe 82. It is returned to the internal heat exchanger 83.
- the heat medium for example, an antifreeze liquid can be used, but it is preferable to use inexpensive and available water.
- the control which the control apparatus 6 performs is the same as 4th Embodiment, the description is abbreviate
- the heat medium exchanged with the hot water stored in the hot water storage tank 50 dissipates heat in the heater 4, that is, the heat of the hot water is released in the heater 4 through the heat medium. Heating is performed.
- FIG. 9 shows a heat pump heating device 1F according to the sixth embodiment of the present invention.
- the heat pump heating device 1F of the present embodiment is obtained by adding a configuration for hot water supply to the heat pump heating device 1D of the fourth embodiment.
- a hot water supply heat exchanger 93 is disposed in the hot water storage tank 50, and a hot water supply pipe 91 and a hot water discharge pipe 92 are connected to the hot water supply heat exchanger 93. That is, in the present embodiment, hot water can be generated by heating tap water with hot water in the hot water storage tank 50 while flowing tap water from the water supply pipe 91 to the hot water outlet pipe 92.
- the heat pump type heating device of the present invention is useful as a means for improving the COP of the heat pump while using medium temperature water generated by the heater.
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Abstract
Description
図1は、本発明の第1実施形態に係るヒートポンプ式暖房装置1Aを示している。このヒートポンプ式暖房装置1Aは、冷媒を循環させる冷媒回路3を有するヒートポンプ20Aと、液体を循環させる循環路5と、機器の全体的な制御を行う制御装置6とを備えている。
なお、前記実施形態では、冷媒回路3で加熱した温水を暖房機4で大気中に放熱させているが、暖房機4は、例えば給湯もしくは融雪などの加熱源として用いられてもよい。これらの用途においても、上記と同様の効果が得られることは言うまでもない。
図4は、本発明の第2実施形態に係るヒートポンプ式暖房装置1Bを示している。図4に示すように、第2実施形態のヒートポンプ式暖房装置1Bは、第1実施形態のヒートポンプ式暖房装置1Aとほぼ同様な構成である。そのため、同一機能部品については同一の符号を付し、同様な構成およびその動作についての説明を省略する。なお、この点は、後述する第3~第5実施形態においても同様である。
図6は、本発明の第3実施形態に係るヒートポンプ式暖房装置1Cを示している。本実施形態のヒートポンプ式暖房装置1Cが第1実施形態のヒートポンプ式暖房装置1Aと異なる点は、膨張手段として、エジェクタ25Cが用いられている点である。
図7は、本発明の第4実施形態に係るヒートポンプ式暖房装置1Dを示している。本実施形態のヒートポンプ式暖房装置1Dが第1実施形態のヒートポンプ式暖房装置1Aと異なる点は、循環路5が暖房機4の代わりに貯湯タンク50で構成されている点である。
制御装置6は、貯湯タンク50に設けられた図略のセンサによって貯湯タンク50内の温水量が少ないと判定すると、ヒートポンプ20Aを稼働させるとともにポンプ62を回転させる。これにより、放熱器22で水が加熱されて温水が生成されるとともに、この温水が貯湯タンク50に送られて貯湯が行われる。
制御装置6は、例えばユーザーによって図略の暖房スイッチがONにされると、暖房用ポンプ65を回転させる。これにより、貯湯タンク50内に貯められた温水が暖房機4に送られて暖房が行われる。
貯湯タンク50には、貯湯タンク50に水道水を供給する給水管91(図8参照)を設けてもよい。このようにすることで、暖房機4に流入する温水と水道水とを混ぜたり熱交換させたりして暖房機4に流入する温水の温度を自由に制御することがでる。さらに、水道水によって暖房機4へ流入する水の温度を制御可能となるため、貯湯タンク50には暖房機4で使用する温水より高い温度の温水を貯留しておいても、暖房機4には最適な温度を流入させることができる。このため、貯湯タンク50に蓄える蓄熱量を増加させるこができるので、ヒートポンプ20Aの運転を長時間停止しても暖房回路8での暖房運転を持続することができる。あるいは、送り管81に混合弁を設け、この混合弁に給水管91を接続してもよい。
図8は、本発明の第5実施形態に係るヒートポンプ式暖房装置1Eを示している。本実施形態のヒートポンプ式暖房装置1Eが第4実施形態のヒートポンプ式暖房装置1Dと異なる点は、貯湯タンク50内にタンク内熱交換器83が配設されている点である。また、貯湯タンク50の下部には給水管91が接続されており、貯湯タンク50の上部には出湯管92が接続されている。
図9は、本発明の第6実施形態に係るヒートポンプ式暖房装置1Fを示している。本実施形態のヒートポンプ式暖房装置1Fは、第4実施形態のヒートポンプ式暖房装置1Dに給湯用の構成を加えたものである。具体的には、貯湯タンク50内に給湯用熱交換器93が配設されており、この給湯用熱交換器93に給水管91および出湯管92が接続されている。すなわち、本実施形態では、給水管91から出湯管92に水道水を流しながら、貯湯タンク50内の温水で水道水を加熱して温水を生成できるようになっている。
Claims (12)
- 低圧冷媒を高圧冷媒にする圧縮機、高圧冷媒を放熱させる放熱器、高圧冷媒を低圧冷媒にする膨張手段、および低圧冷媒を吸熱させる蒸発器、を含む冷媒回路と、
加熱液体を生成するために前記放熱器を経由して液体を循環させる循環路と、
前記加熱液体の熱を放出する暖房機と、
前記冷媒回路に設けられた、前記放熱器で放熱した高圧冷媒から低圧冷媒へ熱を移動させる内部熱交換器と、
前記内部熱交換器から流出した高圧冷媒によって、前記循環路を流れる液体を前記放熱器へ流入する前に冷却する液体冷却用熱交換器と、
を備えたヒートポンプ式暖房装置。 - 前記液体冷却用熱交換器へ流入する液体の温度は、前記液体冷却用熱交換器へ流入する高圧冷媒の温度よりも高い、請求項1に記載のヒートポンプ式暖房装置。
- 前記内部熱交換器は、前記放熱器から流出した高圧冷媒と前記蒸発器から流出した低圧冷媒との間で熱交換を行わせるものである、請求項1または2に記載のヒートポンプ式暖房装置。
- 前記内部熱交換器は、前記放熱器から流出した高圧冷媒と前記蒸発器へ流入する前の低圧冷媒との間で熱交換を行わせるものである、請求項1または2に記載のヒートポンプ式暖房装置。
- 前記膨張手段は、膨張弁、膨張する冷媒から動力を回収する膨張機、またはエジェクタである、請求項1~4のいずれか一項に記載のヒートポンプ式暖房装置。
- 前記循環路は、前記暖房機から前記液体冷却用熱交換器へ液体を導く供給管と、前記液体冷却用熱交換器から前記放熱器へ液体を導く中継管と、前記放熱器から前記暖房機へ加熱液体となった液体を導く回収管とを含む、請求項1~5のいずれか一項に記載のヒートポンプ式暖房装置。
- 前記循環路は、前記加熱液体を貯めるタンクと、前記タンクから前記液体冷却用熱交換器へ液体を導く供給管と、前記液体冷却用熱交換器から前記放熱器へ液体を導く中継管と、前記放熱器から前記タンクへ加熱液体となった液体を導く回収管とを含み、
前記タンクに貯められた加熱液体を前記暖房機に送る送り管と、
前記暖房機で放熱した加熱液体を前記タンクに戻す戻し管と、をさらに備える、請求項1~5のいずれか一項に記載のヒートポンプ式暖房装置。 - 前記循環路は、前記加熱液体を貯めるタンクと、前記タンクから前記液体冷却用熱交換器へ液体を導く供給管と、前記液体冷却用熱交換器から前記放熱器へ液体を導く中継管と、前記放熱器から前記タンクへ加熱液体となった液体を導く回収管とを含み、
前記タンク内に配設され、前記タンクに貯められた加熱液体によって熱媒体を加熱するタンク内熱交換器と、
前記タンク内熱交換器で加熱された熱媒体を前記暖房機に送る送り管と、
前記暖房機で放熱した熱媒体を前記タンク内熱交換器に戻す戻し管と、をさらに備える、請求項1~5のいずれか一項に記載のヒートポンプ式暖房装置。 - 前記液体は水であり、前記加熱液体は温水であり、
前記タンクに水道水を供給する給水管と、前記タンクから温水を取り出す出湯管と、
をさらに備える、請求項7または8に記載のヒートポンプ式暖房装置。 - 前記循環路は、前記供給管と前記中継管とを接続するバイパス管と、前記液体を前記バイパス管を通さずに循環させるか前記バイパス管を通して循環させるかを切り替える切り替え手段をさらに含む、請求項6~9のいずれか一項に記載のヒートポンプ式暖房装置。
- 前記供給管には、当該供給管に流入した液体の温度を検出する温度センサが設けられており、
前記温度センサで検出される液体温度が所定温度未満のときは前記液体が前記バイパス管を通して循環され、前記温度センサで検出される液体温度が前記所定温度以上のときは前記液体が前記バイパス管を通さずに循環されるように、前記切り替え手段を制御する制御装置をさらに備える、請求項10に記載のヒートポンプ式暖房装置。 - 前記冷媒は二酸化炭素である、請求項1~11のいずれかに記載のヒートポンプ式暖房装置。
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JP2011509197A JP5470374B2 (ja) | 2009-04-13 | 2010-04-07 | ヒートポンプ式暖房装置 |
CN201080014403.1A CN102369397B (zh) | 2009-04-13 | 2010-04-07 | 热泵式供暖装置 |
US13/257,205 US20120000236A1 (en) | 2009-04-13 | 2010-04-07 | Heat pump heating system |
EP10764229.0A EP2420746B8 (en) | 2009-04-13 | 2010-04-07 | Heat pump heating system |
US15/456,073 US20170184314A1 (en) | 2009-04-13 | 2017-03-10 | Heat pump heating system |
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US13/257,205 A-371-Of-International US20120000236A1 (en) | 2009-04-13 | 2010-04-07 | Heat pump heating system |
US15/456,073 Continuation US20170184314A1 (en) | 2009-04-13 | 2017-03-10 | Heat pump heating system |
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Also Published As
Publication number | Publication date |
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EP2420746B8 (en) | 2016-04-06 |
EP2420746A4 (en) | 2014-03-12 |
US20170184314A1 (en) | 2017-06-29 |
JP5470374B2 (ja) | 2014-04-16 |
US20120000236A1 (en) | 2012-01-05 |
CN102369397A (zh) | 2012-03-07 |
EP2420746A1 (en) | 2012-02-22 |
EP2420746B1 (en) | 2016-01-13 |
JPWO2010119642A1 (ja) | 2012-10-22 |
CN102369397B (zh) | 2014-03-26 |
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