WO2010082693A1 - Pad for manufacturing a touch panel, method for manufacturing a touch panel using same, and touch panel thus manufactured - Google Patents

Pad for manufacturing a touch panel, method for manufacturing a touch panel using same, and touch panel thus manufactured Download PDF

Info

Publication number
WO2010082693A1
WO2010082693A1 PCT/KR2009/000181 KR2009000181W WO2010082693A1 WO 2010082693 A1 WO2010082693 A1 WO 2010082693A1 KR 2009000181 W KR2009000181 W KR 2009000181W WO 2010082693 A1 WO2010082693 A1 WO 2010082693A1
Authority
WO
WIPO (PCT)
Prior art keywords
touch panel
pad
coating layer
layer
conductive material
Prior art date
Application number
PCT/KR2009/000181
Other languages
French (fr)
Korean (ko)
Inventor
박준영
Original Assignee
신와전공주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신와전공주식회사 filed Critical 신와전공주식회사
Priority to PCT/KR2009/000181 priority Critical patent/WO2010082693A1/en
Publication of WO2010082693A1 publication Critical patent/WO2010082693A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Definitions

  • the present invention relates to a pad for manufacturing a touch panel, a method for manufacturing a touch panel using the same, and a touch panel manufactured by the same, which can be manufactured by a simpler process than a conventional silver paste process, thereby facilitating manufacturing and reducing manufacturing costs.
  • finer wire formation is possible, making it possible to manufacture a compact device.
  • minimizing the level difference prevents defects such as bubbles in the mating surface when bonding the adhesive layer.
  • the present invention relates to a touch panel manufacturing pad capable of implementing a touch panel having a high resolution, a touch panel manufacturing method using the same, and a touch panel manufactured thereby.
  • a pad used for manufacturing a general touch panel it is made of glass coated with ITO (for resistive type) or insulating resin (for capacitive type). In general, silver paste is used for electrical connection.
  • the thickness of the conducting wire becomes thick because there is a limit in applying the silver paste thinly, and a step difference occurs in the up and down direction, and the width of the conducting wire in the planar direction becomes wide. Therefore, the durability of the touch panel is reduced, and the density of devices is decreased.
  • a process of curing the silver paste after applying it at a high temperature is needed.
  • an annealing process is a complicated process, there is a problem that the cost increases.
  • the panel includes a screening part that is coupled to the upper surface of the touch pad upper housing 50 made of an upper dielectric (insulator) and the lower edge thereof to cover the silver paste electrode. 55) and a portion of the window that is to be touch-sensitive (a portion of the window that is not a screening portion) is coated with a transparent conductive material such as ITO on the upper portion of the dielectric film 10 made of PET bonded to the lower portion thereof.
  • a transparent conductive material such as ITO
  • the lower panel portion and the adhesive layer (OCA) 40 for coupling the window portion (corresponding to the upper panel portion) and the lower panel portion are laminated and bonded as shown in the figure.
  • the touch panel of the type is required to be transparent because the LCD is additionally coupled to the bottom thereof, and in addition to the touch pad of the notebook, the screen is not required to be transparent.
  • a silver paste is added to the upper portion of the ITO layer, a layer having a high step is formed on the PET as shown. Therefore, bubbles remain in the process of bonding the adhesive layer and the window portion, there is a problem that often causes a defect, there is a difficulty in manufacturing a thin device by increasing the overall height of the touch panel.
  • the present invention can be manufactured in a simpler process than the conventional process to apply the silver paste, to facilitate the manufacturing, to reduce the manufacturing cost, it is possible to form a finer wire It is possible to manufacture a compact device, improve durability by minimizing step, and in particular, in case of capacitive touch panel, minimizing such step prevents defects such as bubbles in the mating surface when bonding the adhesive layer, and high resolution.
  • An object of the present invention is to provide a touch panel manufacturing pad capable of implementing a touch panel having a touch panel, a touch panel manufacturing method using the same, and a touch panel manufactured by the same.
  • An insulator layer made of an organic insulator or an inorganic insulator
  • It provides a touch panel manufacturing pad comprising a metal coating layer formed on the upper surface of the conductive material coating layer.
  • the insulator layer having a thickness of 10 to 3000 ⁇ m, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 ⁇ m, and the conductive material
  • a capacitive touch panel comprising a dielectric layer made of an insulating resin bonded to an upper surface of the adhesive layer;
  • an insulator layer manufactured by a method of manufacturing a touch panel and having a thickness of 10 to 3000 ⁇ m, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 ⁇ m, and the conductive material A lower surface pad formed on the top surface of the coating layer in a thickness of 0.01 to 10 ⁇ m and formed of a metal coating layer on which a pattern is formed;
  • a separation film layer bonded to the top edge of the pad
  • the insulator layer having a thickness of 10 to 3000 ⁇ m, formed on the lower surface of the insulator layer with a thickness of 0.005 to 0.1 ⁇ m pattern
  • the formed conductive material coating layer, and a lower surface of the conductive material coating layer is formed to a thickness of 0.01 to 10 ⁇ m provides a resistive touch panel comprising a top pad made of a metal coating layer pattern is formed.
  • the touch panel manufacturing method using the same and the touch panel manufactured by the same, the high temperature curing process and the annealing process can be omitted as compared to the process using the conventional silver paste, it is manufactured in a simpler process It is possible to facilitate the manufacturing, to reduce the manufacturing cost and to obtain the effect of reducing the defective rate according to the simplification of the process.
  • the metal layer by patterning the metal layer through a photolithography method, it is possible to form finer conductors and to manufacture a compact device. Since wiring can be arranged at a narrow pitch, the display area can be minimized by minimizing the margin margin of the panel. It is possible to increase the durability by minimizing the step, and in particular in the case of capacitive touch panels, through the minimization of the step to prevent defects such as bubbles in the bonding surface when the adhesive layer is bonded, and the metal layer photolithography method Through the patterning through it is possible to implement a touch panel having a high resolution.
  • FIG. 1 is a schematic cross-sectional view of a conventional analog type capacitive touch panel.
  • FIG. 2 is a view schematically showing an embodiment of the case of the capacitive touch panel of the touch panel manufacturing pad and a touch panel manufacturing method using the same of the present invention.
  • FIG. 3 is a view schematically showing an embodiment of the case of the resistive touch panel of the touch panel manufacturing pad and a touch panel manufacturing method using the same of the present invention.
  • FIG. 4 is a schematic view showing an embodiment of the touch panel of the present invention shown in FIG. 2 from the front.
  • dielectric film 20 ITO layer
  • insulator layer 200 conductive material coating layer
  • dielectric layer (touch pad) 550 blocking layer
  • the present invention relates to a pad for manufacturing a touch panel, and includes an insulator layer 100 made of an organic insulator or an inorganic insulator, a conductive material coating layer 200 formed on an upper surface of the insulator layer 100, and the conductive material coating layer 200. It is configured to include a metal coating layer 300 is formed on the upper surface.
  • FIGS. 2 to 4 Specific embodiments thereof are as shown in FIGS. 2 to 4. That is, for example, in the case of a conventional touch panel, i) in the case of a capacitance method, in a dielectric film (organic insulator), for example in a PET film, ii) in the case of a resistive method, in the case of glass (inorganic insulator),
  • a conductive material coating layer on the upper surface thereof, for example, ITO, IZO or ATO, ITO film annealing, PR coating for pattern formation on the ITO layer, exposure, development, etching, strip, etc.
  • Photolithography process including a guide processing for holding a standard to form a silver paste pattern on the upper surface formed with the ITO pattern, silver paste printing based on the processed guide and a high temperature curing process for curing the silver paste
  • the pad is supplied according to the present invention Since the conductive material coating layer including ITO on the upper surface of the insulator layer, and the metal coating layer is already formed on the upper surface of the insulator layer, the above-described guide processing, silver paste, which has been performed in the case of using the conventional silver face, is cured.
  • annealing process which is a pretreatment process for preventing film deformation during curing, and a pattern is formed directly by each or a separate photolithography process for two layers of the upper surface. Since the process is completed, when using the pad for manufacturing a touch panel of the present invention, the process can be greatly shortened, and it can be seen that the number of equipment to be provided can be significantly reduced.
  • the display panel such as the lower LCD should be seen, so that the dielectric film and the conductive material are made of a transparent material, and the metal coating layer is In the future etching process, it is located at the edge part and the outer part of the device, and only the connection line for transmitting electrical signals from the electrode and the wire to the outside should be left, and if it is not necessary to have a translucent like the touch panel of the notebook PC, the dielectric film and The conductive material may be made of an opaque material, and the metal coating layer may form various electrode patterns and connecting lines drawn out from the entire pad area in order to increase the sensitivity and accuracy of the touch panel in an etching process in the future. have.
  • the insulator layer 100 is a transparent material as an organic insulator or an inorganic insulator, and the organic insulator is more preferably polyimide or polyethylene terephthalate (PET). Or a transparent or opaque organic insulator comprising polycarbonate (PC) or made of polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), and the inorganic insulator is more preferably made of glass.
  • the conductive material of the conductive material coating layer 200 is a transparent material, more preferably it is a transparent conductive material containing ITO or IZO or made of ITO or IZO in terms of excellent properties and ease of manufacture.
  • the metal coating layer 300 may correspond to a variety of known metals as the material, preferably copper or aluminum in consideration of ease of manufacture and electrical conductivity.
  • various known methods may be applied to the formation of such a metal coating layer, and in order to be coated with a thin thickness, it is preferable that the coating is performed through deposition or sputtering including conventional vapor deposition. .
  • the pad for manufacturing a touch panel formed as described above is as shown in FIG. 2A and FIG. 3A, and specific examples thereof.
  • the pad for manufacturing a touch panel is a touch panel through a manufacturing method described below. It is formed of a contact panel.
  • the insulator layer, the conductive material coating layer and the metal coating layer is made of 10 to 1000 ⁇ m in the case of an organic insulator, in the case of an inorganic insulator for durability of the panel, ease of manufacturing during etching of each layer, minimizing the step Is made of 100 to 3000 ⁇ m, the conductive material coating layer is made of 0.005 to 0.1 ⁇ m, the metal coating layer is preferably made of 0.01 to 10 ⁇ m, as described above the metal coating layer 300 and the conductive material coating layer 200 In particular, in the case where the thickness of the ITO is formed, it may be easy to manufacture in the etching process, so having the thickness in the above range reduces the process and facilitates the manufacture, and the thickness of the insulator layer 100 is within the above range.
  • the metal coating layer 300 has a thickness of 0.5 to 0.6 ⁇ m, and when the conductive material coating layer 200 is ITO, the thickness of the ITO layer is 0.01 to 0.02 ⁇ m.
  • the thickness of the insulator layer 100 is 50 to 175 ⁇ m when the insulator layer is an organic insulator, which is suitable for easy assembly with the device and manufacturing of a compact size device.
  • the present invention also provides a method for manufacturing a touch panel including a resistive film type and a capacitive type using the touch panel manufacturing pad, which can be applied to both a touch panel having a light transmitting portion and a touch panel not having a light transmitting portion.
  • the first step of manufacturing a pad with a metal pattern by partially etching the metal coating layer on the upper surface of the pad for manufacturing the touch panel described above i) On the upper surface of the pad on which the pattern is formed Bonding the adhesive layer 400 and the dielectric layer (combination of 500 or 500/550) made of an insulating resin, or ii) the other pad is formed on the upper surface of the pad formed with the pattern to be spaced apart from each other by bonding upside down It consists of two steps.
  • the metal coating layer formed on the uppermost surface of the pad for manufacturing the touch panel of the present invention described above may be partially etched to leave only the patterns corresponding to the electrodes and the wires. This is as shown in the specific example in step (b) of FIG. 2 or (b) of FIG.
  • the conductive material exposed to the surface may be further etched according to the etching of the metal coating layer to further form a pattern of the conductive material coating layer.
  • the upper surface of the pad on which the metal pattern is formed is formed.
  • the method may further include manufacturing a pad on which the conductive material coating layer is partially etched to form a metal pattern and a pattern of the conductive material coating layer. This is as shown in the specific example in step (c) of Figure 2 or (c) of FIG. This is not an essential process and may be omitted when the pattern formation of the conductive material coating layer is not required separately.
  • Separate etching of the metal coating layer and the conductive material coating layer may be performed in a variety of known manners, and specific examples thereof include copper when the metal coating layer is ITO and copper etching is etched using an aqueous NaOH solution. , ITO can be etched separately by etching through FeCl 3 aqueous solution. For this partial etching, a conventional photolithography method or other various partial etching methods may be applied, and the pattern formed here generally corresponds to the surface on which the touch panel is touched in the case of a conductive material coating layer.
  • the shape of the conductive material coating layer to the surface corresponds to this, in the case of the metal coating layer having only a transmissive portion to form an electrode on top of the conductive material coating layer only (for example with FIGS. 2 to 4 2 to 4, the electrode shown in FIGS. 2 to 4 are broken in the longitudinal direction and formed into a plurality of electrodes).
  • the electrode does not have a light-transmitting part, a touch position can be detected on the upper surface of the conductive material coating layer.
  • the pattern can be formed in the form.
  • the pad having the pattern formed thereon is an insulator layer 500 or 500 made of an adhesive layer 400 and an insulating resin on the upper surface of the pad on which the pattern is formed. / 550) is performed.
  • 2 and 4 illustrate the case of having a light transmitting unit, otherwise, the blocking unit (screening unit) 550 as shown in the drawing becomes unnecessary and can be combined in a form except for this.
  • the film is a transparent dielectric film comprising polyimide or polyethylene terephthalate (PET) or polycarbonate (PC)
  • the conductive material is a transparent conductive material including ITO or IZO
  • the metal coating layer is formed by deposition or sputtering
  • a pattern is formed by partially etching the upper surface of the pad for manufacturing the capacitive touch panel as aluminum or copper.
  • a second step of inverting other pads having the pattern on the upper surface of the pad on which the pattern is formed and being spaced apart from each other vertically is performed. It can be prepared by performing the.
  • the separation of the two pads formed with the opposite pattern may be configured to include a separation film layer at the edge as shown, or may be configured by arranging spacers in a space at a constant price.
  • the present invention provides a capacitive touch panel and a resistive touch panel manufactured by the manufacturing method as described above, which is manufactured by the manufacturing method of the touch panel as described above, the structure is first
  • the capacitive touch panel is manufactured by the manufacturing method of the touch panel indicated by i) in the second step, and has an insulator layer 100 having a thickness of 10 to 3000 ⁇ m, and the insulator.
  • the conductive material coating layer 200 may be subjected to an etching step or may be omitted.
  • the insulator layer 100 is made of 10 to 1000 ⁇ m in the case of an organic insulator, and of 100 to 3000 ⁇ m in the case of an inorganic insulator.
  • the electrode in Figure 4 may be of integral length in the longitudinal direction, it can be composed of a plurality of electrodes separated into several.
  • a touch panel having a light transmitting portion is a schematic diagram in which the connection line from the electrode to the outside is omitted.
  • the conductive material (ITO) layer preferably has a structure slightly larger than the light transmitting portion of the insulator layer 500, the metal electrode may be disposed on the conductive material (ITO) layer as shown.
  • the blocking layer serves to cover the electrode and the lead wires connected to the electrodes (of course, the lead wires may be formed through partial etching of the metal coating layer).
  • the blocking layer may be treated on the lower part of the insulator layer as shown, or may be treated on the upper part thereof.
  • the insulator layer 100 having a thickness of 10 to 3000 ⁇ m is manufactured by the manufacturing method of the touch panel indicated by ii) of the second step.
  • the conductive material coating is formed of a thickness if 0.01 to 10 ⁇ m to 200 is configured including an upper surface pad formed of a metal coating layer 300, the pattern is formed.
  • the conductive material coating layer 200 may be subjected to an etching step or may be omitted.
  • the insulator layer 100 is made of 10 to 1000 ⁇ m in the case of an organic insulator, and of 100 to 3000 ⁇ m in the case of an inorganic insulator.
  • a specific example of this may correspond to an assembly in which they are assembled in step (d) of FIG. 3.
  • the touch panel manufacturing method using the same and the touch panel manufactured by the same, the high temperature curing process and the annealing process can be omitted as compared to the process using the conventional silver paste, it is manufactured in a simpler process It is possible to facilitate the manufacturing, to reduce the manufacturing cost and to obtain the effect of reducing the defective rate according to the simplification of the process.
  • the metal layer by patterning the metal layer through a photolithography method, it is possible to form finer conductors and to manufacture a compact device. Since wiring can be arranged at a narrow pitch, the display area can be minimized by minimizing the margin margin of the panel. It is possible to increase the durability by minimizing the step, and in particular, in the case of the capacitive touch panel, through the minimization of the step to prevent defects such as bubbles in the bonding surface when the adhesive layer is bonded, and the metal layer photolithography method Through the patterning through it is possible to implement a touch panel having a high resolution.

Abstract

The present invention relates to a pad for manufacturing a touch panel, to a method for manufacturing a touch panel using same, and to a touch panel thus manufactured. More particularly, the present invention relates to a pad for manufacturing a touch panel, comprising an insulator layer made of an organic insulator or an inorganic insulator, a conductive material coating layer formed on the upper surface of the insulator layer, and a metal coating layer formed on the upper surface of the conductive material coating layer. The present invention also relates to a method for manufacturing a touch panel using the pad, and to a touch panel manufactured using the pad. The pad of the present invention enables touch panels to be manufactured through a simplified process as compared to conventional processes in which silver pastes are applied. Thus, the pad of the present invention enables easy manufacture of a touch panel, reduces manufacturing costs, and enables the formation of finer conductors and the manufacture of compact devices. Specifically, the pad of the present invention minimizes the formation of a stepped portion in a capacitive touch panel to prevent defects such as air bubbles or the like which otherwise might formed at an attachment surface when an adhesive layer is attached, thus producing a touch panel having a high resolution.

Description

터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및 이에 의해 제조되는 터치패널Touch panel manufacturing pad, touch panel manufacturing method using same and touch panel manufactured by the same
본 발명은 터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및 이에 의해 제조되는 터치패널에 관한 것으로, 종래의 실버페이스트를 적용한 공정보다 간단한 공정으로 제작이 가능하여, 제조를 용이하게 하고, 제조비용을 절감할 수 있을 뿐만 아니라 보다 미세한 도선형성이 가능하여 콤팩트한 디바이스 제작이 가능하며, 특히 정전용량 터치패널의 경우에 단차를 최소화하여 접착제층의 결합시에 결합면내의 기포발생 등의 결함을 방지하고, 높은 해상도를 가지는 터치패널을 구현할 수 있는 터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및 이에 의해 제조되는 터치패널에 관한 것이다.The present invention relates to a pad for manufacturing a touch panel, a method for manufacturing a touch panel using the same, and a touch panel manufactured by the same, which can be manufactured by a simpler process than a conventional silver paste process, thereby facilitating manufacturing and reducing manufacturing costs. In addition to the reduction, finer wire formation is possible, making it possible to manufacture a compact device.In particular, in the case of a capacitive touch panel, minimizing the level difference prevents defects such as bubbles in the mating surface when bonding the adhesive layer. The present invention relates to a touch panel manufacturing pad capable of implementing a touch panel having a high resolution, a touch panel manufacturing method using the same, and a touch panel manufactured thereby.
일반적인 터치패널의 제작에 사용되는 패드의 경우에, ITO가 코팅되어진 유리(저항막 방식의 경우)나 절연수지(정전용량방식의 경우)를 이용하여 제작되어지는데, 이와 같은 ITO층과 외부와의 전기적 접속을 위하여 일반적으로는 실버페이스트를 사용하게 된다.In the case of a pad used for manufacturing a general touch panel, it is made of glass coated with ITO (for resistive type) or insulating resin (for capacitive type). In general, silver paste is used for electrical connection.
그러나 이와 같은 실버페이스트를 이용한 도선형성의 경우에는 실버페이스트를 얇게 도포하는데 한계가 있으므로 도선의 두께가 두꺼워져, 상하방향으로는 단차가 크게 발생하고, 평면방향으로는 도선의 폭이 넓어지는데, 이에 따라서 터치 패널의 내구성을 떨어뜨리고, 디바이스의 집적도를 떨어뜨리는 문제점이 있고, 실버페이스트 공정의 경우에는 실버페이스트를 도포한 이후에 이를 고온에서 큐어링(curing)하는 공정이 필요하고, 이러한 고온 큐어링 공정에서 패널의 변형을 방지하기 위하여 어닐링 공정 또한 필요하게 되므로 공정이 복잡하고, 비용이 증가하는 문제점이 있다.However, in the case of conducting wire formation using the silver paste, the thickness of the conducting wire becomes thick because there is a limit in applying the silver paste thinly, and a step difference occurs in the up and down direction, and the width of the conducting wire in the planar direction becomes wide. Therefore, the durability of the touch panel is reduced, and the density of devices is decreased. In the case of the silver paste process, a process of curing the silver paste after applying it at a high temperature is needed. In order to prevent deformation of the panel in the process also requires an annealing process is a complicated process, there is a problem that the cost increases.
즉, 저항막 방식의 경우에는 단차가 크게 발생하는 경우에 상판과 하판 사이의 이격거리가 커져 패널의 휘어지는 양이 증가하여 내구성을 떨어뜨리고, 뉴턴 링 발생 등의 문제점이 있으며, 특히 정전용량 방식 터치패널은 도 1에 종래 방식을 도시한 바와 같이 상부의 유전체(절연체)로 이루어진 터치패드 상면 하우징(50)과 이의 하면 가장자리에 결합하여 이후에 결합되는 실버페이스트 전극을 가려주는 스크리닝(SCREENING)부(55)로 이루어지는 윈도우부와, 이의 하부에 결합하는 PET로 이루어진 유전체 필름(10)의 상부에 터치를 감지해야 하는 부분(상기 윈도우부에서 스크리닝부가 아닌 부분)을 ITO 등의 투명 전도성 물질로 코팅한 전도성 물질 코팅층(20)과 이의 전기적 신호를 제어부에 전달하기 위하여 이의 가장자리에 결합하는 실버페이스트 전극부(30)로 이루어진 하부패널부와, 상기 윈도우부(상부 패널부에 해당)와 하부 패널부를 결합하는 접착제층(OCA)(40)을 도시한 바와 같이 적층하고 결합하여 구성되는데,(여기서 도시한 바와 같은 정전용량 방식의 터치패널은 그 하부에 LCD등이 추가로 결합하는 경우이기 때문에 투명할 것이 요구되고, 이외에 노트북의 터치패드와 같은 경우에는 투명할 것이 요구되지 않으므로 상기 스크리닝부 등이 요구되지 않을 수도 있다.) 이와 같은 종래의 정전용량 방식 터치패널의 경우에는 ITO층의 상부에 실버페이스트를 부가하게 되므로 도시한 바와 같이 PET상부에 높은 단차를 가지는 층이 형성된다. 따라서 접착제층과 윈도우부를 결합하는 과정에서 기포가 잔류하게 되어 불량을 자주 발생시키는 문제점이 있으며, 터치패널의 전체 높이를 두껍게 하여 박형의 디바이스를 제작하는데 어려움이 있다.That is, in the case of the resistive film type, when the step height is large, the separation distance between the upper plate and the lower plate increases, thereby increasing the amount of warpage of the panel, thereby deteriorating durability, and generating a Newton ring. As shown in FIG. 1, the panel includes a screening part that is coupled to the upper surface of the touch pad upper housing 50 made of an upper dielectric (insulator) and the lower edge thereof to cover the silver paste electrode. 55) and a portion of the window that is to be touch-sensitive (a portion of the window that is not a screening portion) is coated with a transparent conductive material such as ITO on the upper portion of the dielectric film 10 made of PET bonded to the lower portion thereof. The conductive paste coating layer 20 and the silver paste electrode unit 30 coupled to the edge thereof to transmit the electrical signal to the controller. The lower panel portion and the adhesive layer (OCA) 40 for coupling the window portion (corresponding to the upper panel portion) and the lower panel portion are laminated and bonded as shown in the figure. The touch panel of the type is required to be transparent because the LCD is additionally coupled to the bottom thereof, and in addition to the touch pad of the notebook, the screen is not required to be transparent. In the case of the conventional capacitive touch panel, since a silver paste is added to the upper portion of the ITO layer, a layer having a high step is formed on the PET as shown. Therefore, bubbles remain in the process of bonding the adhesive layer and the window portion, there is a problem that often causes a defect, there is a difficulty in manufacturing a thin device by increasing the overall height of the touch panel.
또한 전극형성에 있어서, 실버페이스트를 사용하게 되므로 전극의 패턴을 미세하게 꾸미는데 한계가 있어서, 높은 해상도의 터치패널을 제조하기 어려운 문제점이 있다.In addition, in forming the electrode, since the silver paste is used, there is a limit in finely decorating the electrode pattern, which makes it difficult to manufacture a touch panel having a high resolution.
상기와 같은 문제점을 해결하고자, 본 발명은 종래의 실버페이스트를 적용한 공정보다 간단한 공정으로 제작이 가능하여, 제조를 용이하게 하고, 제조비용을 절감할 수 있을 뿐만 아니라, 보다 미세한 도선형성이 가능하여 콤팩트한 디바이스 제작이 가능하며, 단차를 최소화하여 내구성을 향상시키며, 특히 정전용량 터치패널의 경우에 이러한 단차 최소화를 통하여 접착제층의 결합시에 결합면내의 기포발생 등의 결함을 방지하고, 높은 해상도를 가지는 터치패널을 구현할 수 있는 터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및 이에 의해 제조되는 터치패널을 제공하는 것을 목적으로 한다.In order to solve the problems as described above, the present invention can be manufactured in a simpler process than the conventional process to apply the silver paste, to facilitate the manufacturing, to reduce the manufacturing cost, it is possible to form a finer wire It is possible to manufacture a compact device, improve durability by minimizing step, and in particular, in case of capacitive touch panel, minimizing such step prevents defects such as bubbles in the mating surface when bonding the adhesive layer, and high resolution. An object of the present invention is to provide a touch panel manufacturing pad capable of implementing a touch panel having a touch panel, a touch panel manufacturing method using the same, and a touch panel manufactured by the same.
상기 목적을 달성하기 위하여, 본 발명은 In order to achieve the above object, the present invention
유기 절연체 또는 무기 절연체로 이루어진 절연체층; An insulator layer made of an organic insulator or an inorganic insulator;
상기 절연체층의 상면에 형성되어지는 전도성 물질 코팅층; 및, A conductive material coating layer formed on an upper surface of the insulator layer; And,
상기 전도성 물질 코팅층의 상면에 형성되어지는 금속 코팅층을 포함하는 것을 특징으로 하는 터치패널 제조용 패드를 제공한다.It provides a touch panel manufacturing pad comprising a metal coating layer formed on the upper surface of the conductive material coating layer.
또한 본 발명은 In addition, the present invention
터치패널의 제조방법에 있어서, In the manufacturing method of the touch panel,
상기 터치패널 제조용 패드의 상면에서 금속 코팅층을 부분적으로 식각하여 금속 패턴이 형성된 패드를 제조하는 제1단계; 및, A first step of manufacturing a pad having a metal pattern by partially etching the metal coating layer on an upper surface of the pad for manufacturing the touch panel; And,
i)상기 패턴이 형성된 패드의 상면에 접착제층과 절연수지로 이루어진 절연체층을 결합하거나, ii)상기 패턴이 형성된 패드의 상면에 상기 패턴이 형성된 다른 패드를 뒤집어 서로 상하로 이격하여 결합하는 제2단계를 포함하는 것을 특징으로 하는 터치패널의 제조방법을 제공한다.i) bonding an insulator layer composed of an adhesive layer and an insulating resin to the upper surface of the pad on which the pattern is formed, or ii) inverting the other pads having the pattern on the upper surface of the pad on which the pattern is formed to be spaced apart from each other vertically It provides a method of manufacturing a touch panel comprising the step.
마지막으로 본 발명은 Finally, the present invention
정전용량 방식 터치패널에 있어서, In the capacitive touch panel,
상기 i) 터치패널의 제조방법에 의하여 제조되어, 10 내지 3000 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 패드;I) manufactured by the method for manufacturing a touch panel, the insulator layer having a thickness of 10 to 3000 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 μm, and the conductive material A pad formed of a metal coating layer having a pattern formed on the top surface of the coating layer in a thickness of 0.01 to 10 μm;
상기 패드의 상면에 결합하는 접착제층; 및, An adhesive layer bonded to an upper surface of the pad; And,
상기 접착제층의 상면에 결합하는 절연수지로 이루어진 유전체층을 포함하는 것을 특징으로 하는 정전용량 방식 터치패널과A capacitive touch panel comprising a dielectric layer made of an insulating resin bonded to an upper surface of the adhesive layer;
또한Also
저항막 방식 터치패널에 있어서, In the resistive touch panel,
상기 ii) 터치패널의 제조방법에 의하여 제조되어, 10 내지 3000 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 하면 패드;Ii) an insulator layer manufactured by a method of manufacturing a touch panel and having a thickness of 10 to 3000 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 μm, and the conductive material A lower surface pad formed on the top surface of the coating layer in a thickness of 0.01 to 10 μm and formed of a metal coating layer on which a pattern is formed;
상기 패드의 상면 가장자리에 결합하는 분리 필름층; 및, A separation film layer bonded to the top edge of the pad; And,
상기 분리 필름층의 상면에 결합하고, 상기 ii) 터치패널의 제조방법에 의하여 제조되어, 10 내지 3000 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 하면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 하면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 상면 패드를 포함하는 것을 특징으로 하는 저항막 방식 터치패널을 제공한다.It is bonded to the upper surface of the separation film layer, and is manufactured by the method of manufacturing the touch panel, the insulator layer having a thickness of 10 to 3000 ㎛, formed on the lower surface of the insulator layer with a thickness of 0.005 to 0.1 ㎛ pattern The formed conductive material coating layer, and a lower surface of the conductive material coating layer is formed to a thickness of 0.01 to 10 ㎛ provides a resistive touch panel comprising a top pad made of a metal coating layer pattern is formed.
본 발명의 터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및 이에 의해 제조되는 터치패널에 따르면, 종래의 실버페이스트를 적용한 공정에 비하여 고온 큐어링 공정 및 어닐링 공정을 생략할 수 있으므로 이보다 간단한 공정으로 제작이 가능하여, 제조를 용이하게 하고, 제조비용을 절감할 수 있을 뿐만 아니라 공정의 단순화에 따른 불량률의 감소효과를 얻을 수 있다.According to the touch panel manufacturing pad of the present invention, the touch panel manufacturing method using the same and the touch panel manufactured by the same, the high temperature curing process and the annealing process can be omitted as compared to the process using the conventional silver paste, it is manufactured in a simpler process It is possible to facilitate the manufacturing, to reduce the manufacturing cost and to obtain the effect of reducing the defective rate according to the simplification of the process.
또한, 금속층을 포토리소그래피 방법을 통하여 패턴닝(patterning)함으로 보다 미세한 도선형성이 가능하여 콤팩트한 디바이스 제작이 가능하며, 협피치로 배선을 배치하는 것이 가능하므로 패널의 가장자리 여백을 최소화하여 표시면적을 증대할 수 있으며, 단차를 최소화하여 내구성을 향상시키며, 특히 정전용량 터치패널의 경우에 이러한 단차 최소화를 통하여 접착제층의 결합시에 결합면내의 기포발생 등의 결함을 방지하고, 금속층을 포토리소그래피 방법을 통하여 패턴닝함으로 높은 해상도를 가지는 터치패널을 구현할 수 있는 효과가 있다.In addition, by patterning the metal layer through a photolithography method, it is possible to form finer conductors and to manufacture a compact device. Since wiring can be arranged at a narrow pitch, the display area can be minimized by minimizing the margin margin of the panel. It is possible to increase the durability by minimizing the step, and in particular in the case of capacitive touch panels, through the minimization of the step to prevent defects such as bubbles in the bonding surface when the adhesive layer is bonded, and the metal layer photolithography method Through the patterning through it is possible to implement a touch panel having a high resolution.
도 1은 종래 아날로그 타입 정전용량 방식 터치패널의 단면을 개략적으로 도시한 도면이다.1 is a schematic cross-sectional view of a conventional analog type capacitive touch panel.
도 2는 본 발명의 터치패널 제조용 패드 및 이를 이용한 터치패널 제조방법 중에서 정전용량 방식 터치패널의 경우에 대한 일실시예를 개략적으로 도시한 도면이다.2 is a view schematically showing an embodiment of the case of the capacitive touch panel of the touch panel manufacturing pad and a touch panel manufacturing method using the same of the present invention.
도 3은 본 발명의 터치패널 제조용 패드 및 이를 이용한 터치패널 제조방법 중에서 저항막 방식 터치패널의 경우에 대한 일실시예를 개략적으로 도시한 도면이다.3 is a view schematically showing an embodiment of the case of the resistive touch panel of the touch panel manufacturing pad and a touch panel manufacturing method using the same of the present invention.
도 4는 도 2에 도시한 본 발명의 터치패널에 대한 일 실시예를 정면에서 나타낸 개략적인 도면이다.FIG. 4 is a schematic view showing an embodiment of the touch panel of the present invention shown in FIG. 2 from the front.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
10: 유전체 필름 20: ITO 층10: dielectric film 20: ITO layer
30: 실버 페이스트 전극 40: 접착제층(OCA)30: silver paste electrode 40: adhesive layer (OCA)
50: 터치패드 상면하우징 55: 스크리닝부50: touch pad top housing 55: screening unit
100: 절연체층 200: 전도성 물질 코팅층100: insulator layer 200: conductive material coating layer
300: 금속 코팅층 400: 접착제층300: metal coating layer 400: adhesive layer
500: 유전체층(터치패드) 550: 차단층500: dielectric layer (touch pad) 550: blocking layer
600: 분리 필름층600: separation film layer
이하 본 발명에 대하여 도면을 참고하여 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
본 발명은 터치패널 제조용 패드에 관한 것으로 유기 절연체 또는 무기 절연체로 이루어진 절연체층(100), 상기 절연체층(100)의 상면에 형성되어지는 전도성 물질 코팅층(200) 및, 상기 전도성 물질 코팅층(200)의 상면에 형성되어지는 금속 코팅층(300)을 포함하여 구성된다.The present invention relates to a pad for manufacturing a touch panel, and includes an insulator layer 100 made of an organic insulator or an inorganic insulator, a conductive material coating layer 200 formed on an upper surface of the insulator layer 100, and the conductive material coating layer 200. It is configured to include a metal coating layer 300 is formed on the upper surface.
이에 대한 구체적인 실시예는 도 2 내지 도 4에 도시한 바와 같다. 즉, 예를 들어 종래의 터치패널의 경우에 i)정전용량 방식의 경우는 유전체 필름(유기 절연체), 예를 들면 PET 필름에, ii)저항막 방식의 경우는 유리 ( 무기 절연체 )에 대하여, 그 상면에 전도성 물질 코팅층, 예를 들면 ITO, IZO 또는 ATO가 입혀져서 제작자에게 자재가 공급되면, 이를 ITO 필름 어닐링, ITO층에 대한 패턴 형성을 위한 PR도포, 노광, 현상, 식각, 스트립 등을 포함하는 포토리소그래피 공정, 상기 ITO패턴이 형성된 상면에 실버페이스트 패턴을 형성하기 위해 기준을 잡기 위한 가이드가공, 가공된 가이드를 기준으로 실버페이스트 프린팅 및 상기 실버페이스트 큐어링을 위한 고온 큐어링 공정 등의 과정을 통하여 도 1에 도시한 바와 같은 하부패널을 완성하게 되나, 본 발명의 터치패널 제조용 패드의 경우에는 본 발명에 따라 공급되어지는 패드는 절연체층의 상면에 ITO 등을 포함하는 전도성 물질 코팅층이, 이의 상면에는 다시 금속 코팅층이 이미 형성되어 있으므로, 종래의 실버페이스를 사용하는 경우에 진행되었던 상기 기술한 가이드 가공, 실버페이스트를 큐어링하는 큐어링 공정 등이 별도로 필요 없고, 따라서 상기 큐어링 시의 필름 변형을 방지하기 위한 전처리 공정인 어닐링 공정 또한 필요 없고, 상면의 2층에 대한 각각 또는 별도의 포토리소그래피 공정으로 바로 패턴을 형성하는 것으로 공정이 완료되므로 본 발명의 터치패널 제조용 패드를 사용하는 경우에는 공정을 대폭 단축할 수 있으며, 구비해야할 장비의 수가 대폭적으로 축소될 수 있음을 알 수 있다.Specific embodiments thereof are as shown in FIGS. 2 to 4. That is, for example, in the case of a conventional touch panel, i) in the case of a capacitance method, in a dielectric film (organic insulator), for example in a PET film, ii) in the case of a resistive method, in the case of glass (inorganic insulator), When the material is supplied to the producer by coating a conductive material coating layer on the upper surface thereof, for example, ITO, IZO or ATO, ITO film annealing, PR coating for pattern formation on the ITO layer, exposure, development, etching, strip, etc. Photolithography process, including a guide processing for holding a standard to form a silver paste pattern on the upper surface formed with the ITO pattern, silver paste printing based on the processed guide and a high temperature curing process for curing the silver paste Through the process to complete the lower panel as shown in Figure 1, in the case of the pad for manufacturing a touch panel of the present invention, the pad is supplied according to the present invention Since the conductive material coating layer including ITO on the upper surface of the insulator layer, and the metal coating layer is already formed on the upper surface of the insulator layer, the above-described guide processing, silver paste, which has been performed in the case of using the conventional silver face, is cured. There is no need for a curing process or the like, and therefore, there is no need for an annealing process, which is a pretreatment process for preventing film deformation during curing, and a pattern is formed directly by each or a separate photolithography process for two layers of the upper surface. Since the process is completed, when using the pad for manufacturing a touch panel of the present invention, the process can be greatly shortened, and it can be seen that the number of equipment to be provided can be significantly reduced.
이와 같은 터치패널 제조용 패드는 이를 이용하여 제작되어지는 터치패널이 LCD 등과 함께 결합하여 사용되어지는 경우에는 하부의 LCD등의 디스플레이가 보여야 하므로 유전체 필름 및 전도성 물질이 투명한 재질로 이루어지고, 금속 코팅층은 향후 식각 공정에서 가장자리 부분과 디바이스의 외곽 부분에 위치하여, 전극 및 전선으로부터 전기적 신호를 외부로 전달하는 연결선 등만을 남겨야 하고, 노트북 PC의 터치패널과 같이 투광성을 가질 필요가 없는 경우에는 유전체 필름 및 전도성 물질이 불투명한 재질로 이루어져도 무관하고, 금속 코팅층은 향후 식각 공정에서 터치패널의 감도 및 정확성을 증대하기 위한 전체 패드 영역에서 다양한 전극 패턴 및 이로부터 외부로 인출되는 연결선의 패턴을 형성할 수 있다.If the touch panel manufactured by using the touch panel manufactured by using this is used in combination with the LCD, the display panel such as the lower LCD should be seen, so that the dielectric film and the conductive material are made of a transparent material, and the metal coating layer is In the future etching process, it is located at the edge part and the outer part of the device, and only the connection line for transmitting electrical signals from the electrode and the wire to the outside should be left, and if it is not necessary to have a translucent like the touch panel of the notebook PC, the dielectric film and The conductive material may be made of an opaque material, and the metal coating layer may form various electrode patterns and connecting lines drawn out from the entire pad area in order to increase the sensitivity and accuracy of the touch panel in an etching process in the future. have.
바람직하게는 터치패널이 LCD 등과 함께 결합하여 사용되어지는 경우, 상기 절연체층(100)은 유기 절연체 또는 무기 절연체로서 투명한 재질이고, 상기 유기 절연체는 더욱 바람직하게는 폴리이미드 또는 폴리에틸렌 테레프탈레이트(PET) 또는 폴리카보네이트(PC)를 포함하거나 폴리이미드 또는 폴리에틸렌 테레프탈레이트(PET) 또는 폴리카보네이트(PC)로 이루어지는 투명 또는 불투명 유기 절연체이고, 상기 무기 절연체는 더욱 바람직하게는 유리로 이루어지는 것이 그 특성상 좋다. 또한 상기 전도성 물질 코팅층(200)의 전도성 물질은 투명한 재질이고, 더욱 바람직하게는 ITO 또는 IZO를 포함하거나 ITO 또는 IZO로 이루어지는 투명 전도성 물질인 것이 우수한 특성 및 제조의 용이성 측면에서 좋다.Preferably, when the touch panel is used in combination with an LCD or the like, the insulator layer 100 is a transparent material as an organic insulator or an inorganic insulator, and the organic insulator is more preferably polyimide or polyethylene terephthalate (PET). Or a transparent or opaque organic insulator comprising polycarbonate (PC) or made of polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), and the inorganic insulator is more preferably made of glass. In addition, the conductive material of the conductive material coating layer 200 is a transparent material, more preferably it is a transparent conductive material containing ITO or IZO or made of ITO or IZO in terms of excellent properties and ease of manufacture.
또한 상기 금속 코팅층(300)은 그 재질로 공지의 다양한 금속이 이에 해당할 수 있으며, 바람직하게는 제조의 용이성 및 전기전도도를 고려하여 구리 또는 알루미늄인 것이 좋다. 또한 이와 같은 금속 코팅층의 형성을 위해서는 공지의 다양한 방법이 이에 적용될 수 있으며, 바람직하게는 얇은 두께로 코팅되기 위하여 종래의 기상증착을 포함한 증착(deposition) 또는 스퍼터링(sputtering)을 통하여 코팅되는 것이 바람직하다.In addition, the metal coating layer 300 may correspond to a variety of known metals as the material, preferably copper or aluminum in consideration of ease of manufacture and electrical conductivity. In addition, various known methods may be applied to the formation of such a metal coating layer, and in order to be coated with a thin thickness, it is preferable that the coating is performed through deposition or sputtering including conventional vapor deposition. .
이와 같이 형성되는 터치패널 제조용 패드는 도 2의 (a) 및 도 3의 (a)에 그 구체적인 예를 도시한 바와 같으며, 이와 같은 터치패널 제조용 패드는 아래에 기술하는 제조방법을 통하여 터치패널의 접촉 패널로 형성되어진다.The pad for manufacturing a touch panel formed as described above is as shown in FIG. 2A and FIG. 3A, and specific examples thereof. The pad for manufacturing a touch panel is a touch panel through a manufacturing method described below. It is formed of a contact panel.
또한 상기 절연체층, 전도성 물질 코팅층 및 금속 코팅층은 패널의 내구성, 각 층의 식각시 제조 용이성, 단차의 최소화를 위하여 상기 절연체층은 유기 절연체의 경우는 10 내지 1000 ㎛로 이루어지고, 무기 절연체의 경우는 100 내지 3000 ㎛로 이루어지고, 상기 전도성 물질 코팅층은 0.005 내지 0.1 ㎛로 이루어지고, 상기 금속 코팅층은 0.01 내지 10 ㎛로 이루어지는 것이 바람직하며, 상기와 같이 금속 코팅층(300)과 전도성 물질 코팅층(200), 특히 ITO의 두께가 형성되는 경우에 식각 공정에서 제작이 용이할 수 있으므로 상기 범위의 두께를 가지는 것이 공정을 줄이고 제작을 용이하게 하고, 상기 절연체층(100)의 두께는 상기 범위 내인 경우에 내구성을 확보할 수 있다. 더욱 바람직하게는 상기 금속 코팅층(300)의 두께는 0.5 내지 0.6 ㎛이고, 상기 전도성 물질 코팅층(200)이 ITO인 경우에 ITO층의 두께는 0.01 내지 0.02 ㎛인 것이 우수한 식각성 및 패턴형성 특성을 갖는 측면에서 좋고, 상기 절연체층(100)의 두께는 절연체층이 유기 절연체인 경우에 50 내지 175 ㎛인 것이 디바이스와의 조립 용이성 측면 및 콤팩트 사이즈 디바이스 제작에 좋다.In addition, the insulator layer, the conductive material coating layer and the metal coating layer is made of 10 to 1000 ㎛ in the case of an organic insulator, in the case of an inorganic insulator for durability of the panel, ease of manufacturing during etching of each layer, minimizing the step Is made of 100 to 3000 ㎛, the conductive material coating layer is made of 0.005 to 0.1 ㎛, the metal coating layer is preferably made of 0.01 to 10 ㎛, as described above the metal coating layer 300 and the conductive material coating layer 200 In particular, in the case where the thickness of the ITO is formed, it may be easy to manufacture in the etching process, so having the thickness in the above range reduces the process and facilitates the manufacture, and the thickness of the insulator layer 100 is within the above range. Durability can be secured. More preferably, the metal coating layer 300 has a thickness of 0.5 to 0.6 μm, and when the conductive material coating layer 200 is ITO, the thickness of the ITO layer is 0.01 to 0.02 μm. The thickness of the insulator layer 100 is 50 to 175 μm when the insulator layer is an organic insulator, which is suitable for easy assembly with the device and manufacturing of a compact size device.
본 발명은 또한 상기 터치패널 제조용 패드를 이용한 저항막 방식 및 정전용량 방식을 포함한 터치패널의 제조방법을 제공하는 바, 이는 투광부를 가지는 터치패널이나, 투광부를 가지지 않는 터치패널이나 모두 적용할 수 있는 것으로, 터치패널의 제조방법에 있어서, 상기 기술한 터치패널 제조용 패드의 상면에서 금속 코팅층을 부분적으로 식각하여 금속 패턴이 형성된 패드를 제조하는 제1단계 및, i)상기 패턴이 형성된 패드의 상면에 접착제층(400)과 절연수지로 이루어진 유전체층(500 또는 500/550의 결합체)을 결합하거나, ii)상기 패턴이 형성된 패드의 상면에 상기 패턴이 형성된 다른 패드를 뒤집어 서로 상하로 이격하여 결합하는 제2단계를 포함하여 구성된다.The present invention also provides a method for manufacturing a touch panel including a resistive film type and a capacitive type using the touch panel manufacturing pad, which can be applied to both a touch panel having a light transmitting portion and a touch panel not having a light transmitting portion. In the method of manufacturing a touch panel, the first step of manufacturing a pad with a metal pattern by partially etching the metal coating layer on the upper surface of the pad for manufacturing the touch panel described above, i) On the upper surface of the pad on which the pattern is formed Bonding the adhesive layer 400 and the dielectric layer (combination of 500 or 500/550) made of an insulating resin, or ii) the other pad is formed on the upper surface of the pad formed with the pattern to be spaced apart from each other by bonding upside down It consists of two steps.
즉, 상기 기술한 본 발명의 터치패널 제조용 패드의 최상면에 형성된 금속 코팅층을 부분적으로 식각하여 전극 및 전선에 해당하는 패턴만을 남기는 단계를 진행할 수 있다. 이는 도 2의 (b)단계 또는 도 3의 (b)단계에 그 구체적인 예를 도시한 바와 같다.That is, the metal coating layer formed on the uppermost surface of the pad for manufacturing the touch panel of the present invention described above may be partially etched to leave only the patterns corresponding to the electrodes and the wires. This is as shown in the specific example in step (b) of FIG. 2 or (b) of FIG.
또한 필요에 따라서는 상기 금속 코팅층의 식각에 따라 표면으로 드러난 전도성 물질을 추가로 식각하여 전도성 물질 코팅층의 패턴을 더 형성할 수 있는데, 따라서 상기 제1단계 공정 이후에 상기 금속 패턴이 형성된 패드의 상면에서 전도성 물질 코팅층을 부분적으로 식각하여 금속 패턴 및 전도성 물질 코팅층의 패턴이 형성된 패드를 제조하는 단계를 더 포함하도록 구성할 수 있다. 이는 도 2의 (c)단계 또는 도 3의 (c)단계에 그 구체적인 예를 도시한 바와 같다. 이는 필수 공정은 아니며, 전도성 물질 코팅층의 패턴 형성이 별도로 필요하지 않은 경우에는 이를 생략할 수 있다.In addition, if necessary, the conductive material exposed to the surface may be further etched according to the etching of the metal coating layer to further form a pattern of the conductive material coating layer. Thus, after the first step process, the upper surface of the pad on which the metal pattern is formed is formed. The method may further include manufacturing a pad on which the conductive material coating layer is partially etched to form a metal pattern and a pattern of the conductive material coating layer. This is as shown in the specific example in step (c) of Figure 2 or (c) of FIG. This is not an essential process and may be omitted when the pattern formation of the conductive material coating layer is not required separately.
상기 금속 코팅층과 전도성 물질 코팅층의 분리된 식각은 공지의 다양한 방식으로 이를 행할 수 있고, 이에 대한 구체적인 예로 금속 코팅층이 구리이고, 전도성 물질 코팅층이 ITO인 경우에 구리 식각은 NaOH 수용액을 이용하여 식각하고, ITO는 FeCl3 수용액을 통하여 식각하면 각각을 구분하여 식각할 수 있다. 이와 같은 부분적인 식각을 위하여 종래의 포토리소그래피 방법이나, 기타 공지의 다양한 부분적 식각 방법을 적용할 수 있으며, 여기서 형성되어지는 패턴은 일반적으로는 전도성 물질 코팅층의 경우에는 터치패널이 터치되는 면에 대응하는 면으로 전도성 물질 코팅층의 형상을 만드는 것이 이에 해당하고, 금속 코팅층의 경우에는 투광부를 가지는 경우에는 이의 가장자리 부분만 상기 전도성 물질 코팅층의 상부에 전극을 형성하는(예를 들면 도 2 내지 도 4와 같은 패턴 또는 도 2 내지 도4에 도시한 전극이 길이방향으로 끊어져 다수의 전극으로 형성되는 등의 패턴) 것이 되고, 투광부를 가지지 않은 경우에는 전도성 물질 코팅층의 상면에 터치위치를 감지할 수 있도록 다양한 형태로 패턴을 형성할 수 있다.Separate etching of the metal coating layer and the conductive material coating layer may be performed in a variety of known manners, and specific examples thereof include copper when the metal coating layer is ITO and copper etching is etched using an aqueous NaOH solution. , ITO can be etched separately by etching through FeCl 3 aqueous solution. For this partial etching, a conventional photolithography method or other various partial etching methods may be applied, and the pattern formed here generally corresponds to the surface on which the touch panel is touched in the case of a conductive material coating layer. To form the shape of the conductive material coating layer to the surface corresponds to this, in the case of the metal coating layer having only a transmissive portion to form an electrode on top of the conductive material coating layer only (for example with FIGS. 2 to 4 2 to 4, the electrode shown in FIGS. 2 to 4 are broken in the longitudinal direction and formed into a plurality of electrodes). When the electrode does not have a light-transmitting part, a touch position can be detected on the upper surface of the conductive material coating layer. The pattern can be formed in the form.
이와 같이 패턴이 형성된 패드는, 정전용량 방식의 경우에는 도 2에 그 구체적인 예를 도시한 바와 같이, 상기 패턴이 형성된 패드의 상면에 접착제층(400)과 절연수지로 이루어진 절연체층(500 또는 500/550)을 결합하는 제2단계를 수행한다. 도 2 및 도 4의 경우는 투광부를 가지는 경우를 나타낸 것이고, 그러하지 않은 경우에는 도면에 도시한 바와 같은 차단부(스크리닝부)(550)는 불필요하게 되어 이를 제외한 형태로 결합할 수 있다.As described above, in the case of the capacitive type, the pad having the pattern formed thereon is an insulator layer 500 or 500 made of an adhesive layer 400 and an insulating resin on the upper surface of the pad on which the pattern is formed. / 550) is performed. 2 and 4 illustrate the case of having a light transmitting unit, otherwise, the blocking unit (screening unit) 550 as shown in the drawing becomes unnecessary and can be combined in a form except for this.
또한 투광부를 가지는 정전용량 방식 터치패널 제조용 패널의 경우는 도면에서 그 구체적인 실시예를 도시한 바와 같이, 정전용량 방식 터치패널의 제조방법에 있어서, 상기 기술한 정전용량 방식 터치패널 제조용 패드로서 상기 유전체 필름은 폴리이미드 또는 폴리에틸렌 테레프탈레이트(PET) 또는 폴리카보네이트(PC)를 포함하는 투명 유전체 필름이고, 상기 전도성 물질은 ITO 또는 IZO를 포함하는 투명 전도성 물질이고, 상기 금속 코팅층은 증착 또는 스퍼터링으로 형성되는 알루미늄 또는 구리로서 상기 정전용량 방식 터치패널 제조용 패드의 상면을 부분적으로 식각하여 패턴을 형성한다.In addition, in the case of a capacitive touch panel manufacturing panel having a light-transmitting part, as shown in the drawings, a method of manufacturing a capacitive touch panel, the dielectric as the pad for manufacturing the capacitive touch panel described above. The film is a transparent dielectric film comprising polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), the conductive material is a transparent conductive material including ITO or IZO, and the metal coating layer is formed by deposition or sputtering A pattern is formed by partially etching the upper surface of the pad for manufacturing the capacitive touch panel as aluminum or copper.
또한 저항막 방식의 터치패널을 제조하는 경우에는 도 3에 그 구체적인 예를 도시한 바와 같이, 상기 패턴이 형성된 패드의 상면에 상기 패턴이 형성된 다른 패드를 뒤집어 서로 상하로 이격하여 결합하는 제2단계를 수행하여 제조할 수 있다. 상기 마주 보는 패턴이 형성된 2개의 패드의 이격은 도시한 바와 같이 분리 필름층을 가장자리에 구비하여 구성할 수도 있고, 스페이서(spacer)를 이격공간에 일정한 가격으로 배치하여 구성할 수도 있음은 물론이다.In the case of manufacturing a resistive touch panel, as illustrated in FIG. 3, a second step of inverting other pads having the pattern on the upper surface of the pad on which the pattern is formed and being spaced apart from each other vertically is performed. It can be prepared by performing the. The separation of the two pads formed with the opposite pattern may be configured to include a separation film layer at the edge as shown, or may be configured by arranging spacers in a space at a constant price.
또한 본 발명은 상기 기술한 바와 같은 제조방법으로 제조되는 정전용량 방식 터치패널 및 저항막 방식 터치패널을 제공하는 바, 이는 상기 기술한 바와 같은 터치패널의 제조방법에 의하여 제조되어, 그 구조는 먼저 정전용량 방식의 경우는 정전용량 방식 터치패널에 있어서, 상기 제2단계에서 i)로 표시되어진 터치패널의 제조방법에 의하여 제조되어, 10 내지 3000 ㎛의 두께를 가지는 절연체층(100), 상기 절연체층(100)의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층(200), 및 상기 전도성 물질 코팅층(200)의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층(300)으로 이루어진 패드, 상기 패드의 상면에 결합하는 접착제층(400) 및, 상기 접착제층(400)의 상면에 결합하는 절연수지로 이루어진 유전체층(500 또는 500/550결합체)을 포함하여 구성된다. 여기서 상기 전도성 물질 코팅층(200)은 식각단계를 거칠 수도 있고 이를 생략할 수도 있다. 또한 바람직하게 절연체층(100)은 유기 절연체의 경우는 10 내지 1000 ㎛로 이루어지고, 무기 절연체의 경우는 100 내지 3000 ㎛로 이루어지는 것이 좋다.In addition, the present invention provides a capacitive touch panel and a resistive touch panel manufactured by the manufacturing method as described above, which is manufactured by the manufacturing method of the touch panel as described above, the structure is first In the case of the capacitive touch panel, the capacitive touch panel is manufactured by the manufacturing method of the touch panel indicated by i) in the second step, and has an insulator layer 100 having a thickness of 10 to 3000 µm, and the insulator. A conductive material coating layer 200 having a pattern formed on the top surface of the layer 100 with a thickness of 0.005 to 0.1 μm, and a metal having a pattern formed on the top surface of the conductive material coating layer 200 with a thickness of 0.01 to 10 μm A pad made of a coating layer 300, an adhesive layer 400 bonded to an upper surface of the pad, and a dielectric layer 500 made of an insulating resin bonded to an upper surface of the adhesive layer 400. Is configured to include a combination 500/550). The conductive material coating layer 200 may be subjected to an etching step or may be omitted. In addition, preferably, the insulator layer 100 is made of 10 to 1000 μm in the case of an organic insulator, and of 100 to 3000 μm in the case of an inorganic insulator.
이는 도 4에 그 구체적인 실시예를 도시한 바와 같으며, 도 4에서 전극은 그 길이가 긴 방향으로 일체형일 수도 있고, 여러 개로 분리된 다수의 전극으로 구성할 수 있음은 물론이다. 상기 도시한 경우는 투광부를 가지는 터치패널로서, 전극으로부터 외부로의 연결선 등은 생략하고 나타낸 개략도이다. 여기서, 상기 전도성 물질(ITO)층은 절연체층(500)의 투광부보다 약간 더 큰 구조를 가지는 것이 바람직하고, 금속 전극은 도시한 바와 같이 전도성 물질(ITO)층의 상부에 배치되어질 수 있다.This is as shown in the specific embodiment in Figure 4, the electrode in Figure 4 may be of integral length in the longitudinal direction, it can be composed of a plurality of electrodes separated into several. In the case shown in the drawing, a touch panel having a light transmitting portion is a schematic diagram in which the connection line from the electrode to the outside is omitted. Here, the conductive material (ITO) layer preferably has a structure slightly larger than the light transmitting portion of the insulator layer 500, the metal electrode may be disposed on the conductive material (ITO) layer as shown.
이를 통하여 상기 차단층은 전극, 전극에 연결되는 인출선(인출선의 경우도 당연히 금속 코팅층의 부분적인 식각을 통하여 형성될 수 있음은 물론이다.) 등이 외부에 노출되지 않도록 가려주는 역할을 한다. 상기 차단층은 도시한 바와 같이 절연체층의 하부에 처리할 수도 있고, 이의 상부에 처리할 수도 있다.Through this, the blocking layer serves to cover the electrode and the lead wires connected to the electrodes (of course, the lead wires may be formed through partial etching of the metal coating layer). The blocking layer may be treated on the lower part of the insulator layer as shown, or may be treated on the upper part thereof.
다음으로 저항막 방식의 경우는 저항막 방식 터치패널에 있어서, 상기 제2단계의 ii)로 표시되어진 터치패널의 제조방법에 의하여 제조되어, 10 내지 3000 ㎛의 두께를 가지는 절연체층(100), 상기 절연체층(100)의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층(200), 및 상기 전도성 물질 코팅층(200)의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층(300)으로 이루어진 하면 패드, 상기 패드의 상면 가장자리에 결합하는 분리 필름층(600) 및, 상기 분리 필름층(600)의 상면에 결합하고, 상기 제2단계의 ii)로 표시되어진 터치패널의 제조방법에 의하여 제조되어, 10 내지 3000 ㎛의 두께를 가지는 절연체층(100), 상기 절연체층(100)의 하면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층(200), 및 상기 전도성 물질 코팅층(200)의 하면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층(300)으로 이루어진 상면 패드를 포함하여 구성되어진다. 여기서 상기 전도성 물질 코팅층(200)은 식각단계를 거칠 수도 있고 이를 생략할 수도 있다. 또한 바람직하게 절연체층(100)은 유기 절연체의 경우는 10 내지 1000 ㎛로 이루어지고, 무기 절연체의 경우는 100 내지 3000 ㎛로 이루어지는 것이 좋다.Next, in the case of the resistive film method, in the resistive touch panel, the insulator layer 100 having a thickness of 10 to 3000 μm is manufactured by the manufacturing method of the touch panel indicated by ii) of the second step. A conductive material coating layer 200 having a pattern formed on the top surface of the insulator layer 100 with a thickness of 0.005 to 0.1 μm, and a pattern having a thickness of 0.01 to 10 μm formed on the top surface of the conductive material coating layer 200. A bottom pad made of the metal coating layer 300 formed thereon, the separation film layer 600 bonded to the top edge of the pad, and the second film bonded to the top surface of the separation film layer 600, and are represented by ii) of the second step. A conductive material coating layer 200 formed by a method of manufacturing a touch panel, having an insulator layer 100 having a thickness of 10 to 3000 μm, and having a thickness of 0.005 to 0.1 μm formed on a lower surface of the insulator layer 100. ), The conductive material coating is formed of a thickness if 0.01 to 10 ㎛ to 200 is configured including an upper surface pad formed of a metal coating layer 300, the pattern is formed. The conductive material coating layer 200 may be subjected to an etching step or may be omitted. In addition, preferably, the insulator layer 100 is made of 10 to 1000 μm in the case of an organic insulator, and of 100 to 3000 μm in the case of an inorganic insulator.
이에 대한 구체적인 예는 도 3의 (d)단계에서 이들을 조립한 조립체가 이에 해당할 수 있다.A specific example of this may correspond to an assembly in which they are assembled in step (d) of FIG. 3.
이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의하여 한정되는 것은 아니고, 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 해당 기술분야의 당업자가 다양하게 수정 및 변경시킨 것 또한 본 발명의 범위 내에 포함됨은 물론이다.The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Changes are also included within the scope of the invention.
본 발명의 터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및 이에 의해 제조되는 터치패널에 따르면, 종래의 실버페이스트를 적용한 공정에 비하여 고온 큐어링 공정 및 어닐링 공정을 생략할 수 있으므로 이보다 간단한 공정으로 제작이 가능하여, 제조를 용이하게 하고, 제조비용을 절감할 수 있을 뿐만 아니라 공정의 단순화에 따른 불량률의 감소효과를 얻을 수 있다.According to the touch panel manufacturing pad of the present invention, the touch panel manufacturing method using the same and the touch panel manufactured by the same, the high temperature curing process and the annealing process can be omitted as compared to the process using the conventional silver paste, it is manufactured in a simpler process It is possible to facilitate the manufacturing, to reduce the manufacturing cost and to obtain the effect of reducing the defective rate according to the simplification of the process.
또한, 금속층을 포토리소그래피 방법을 통하여 패턴닝(patterning)함으로 보다 미세한 도선형성이 가능하여 콤팩트한 디바이스 제작이 가능하며, 협피치로 배선을 배치하는 것이 가능하므로 패널의 가장자리 여백을 최소화하여 표시면적을 증대할 수 있으며, 단차를 최소화하여 내구성을 향상시키며, 특히 정전용량 터치패널의 경우에 이러한 단차 최소화를 통하여 접착제층의 결합시에 결합면내의 기포발생 등의 결함을 방지하고, 금속층을 포토리소그래피 방법을 통하여 패턴닝함으로 높은 해상도를 가지는 터치패널을 구현할 수 있는 효과가 있다.In addition, by patterning the metal layer through a photolithography method, it is possible to form finer conductors and to manufacture a compact device. Since wiring can be arranged at a narrow pitch, the display area can be minimized by minimizing the margin margin of the panel. It is possible to increase the durability by minimizing the step, and in particular, in the case of the capacitive touch panel, through the minimization of the step to prevent defects such as bubbles in the bonding surface when the adhesive layer is bonded, and the metal layer photolithography method Through the patterning through it is possible to implement a touch panel having a high resolution.

Claims (10)

  1. 유기 절연체 또는 무기 절연체로 이루어진 절연체층; An insulator layer made of an organic insulator or an inorganic insulator;
    상기 절연체층의 상면에 형성되어지는 전도성 물질 코팅층; 및, A conductive material coating layer formed on an upper surface of the insulator layer; And,
    상기 전도성 물질 코팅층의 상면에 형성되어지는 금속 코팅층을 포함하는 것을 특징으로 하는 터치패널 제조용 패드.Pad for manufacturing a touch panel comprising a metal coating layer formed on the upper surface of the conductive material coating layer.
  2. 제1항에 있어서, The method of claim 1,
    상기 절연체층의 유기 절연체 또는 무기 절연체는 투명한 재질이고, The organic insulator or the inorganic insulator of the insulator layer is a transparent material,
    상기 전도성 물질 코팅층의 전도성 물질도 투명한 재질이고, The conductive material of the conductive material coating layer is also a transparent material,
    상기 금속 코팅층의 금속은 구리 또는 알루미늄이며,The metal of the metal coating layer is copper or aluminum,
    상기 터치패널 제조용 패드는 터치패널의 접촉 패널로 형성되어지는 것을 특징으로 하는 터치패널 제조용 패드.The touch panel manufacturing pad is a touch panel manufacturing pad, characterized in that formed by the touch panel of the touch panel.
  3. 제1항에 있어서, The method of claim 1,
    상기 유기 절연체는 폴리이미드 또는 폴리에틸렌 테레프탈레이트(PET) 또는 폴리카보네이트(PC)로 이루어지는 투명 또는 불투명 유기 절연체이고, 상기 무기 절연체는 유리로 이루어지는 투명 무기 절연체이며, 상기 전도성 물질은 ITO 또는 IZO로 이루어지는 투명 전도성 물질이고, 상기 금속 코팅층은 증착 또는 스퍼터링으로 형성되는 구리 또는 알루미늄인 것을 특징으로 하는 터치패널 제조용 패드.The organic insulator is a transparent or opaque organic insulator made of polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), the inorganic insulator is a transparent inorganic insulator made of glass, and the conductive material is a transparent made of ITO or IZO. The conductive material, the metal coating layer is a pad for manufacturing a touch panel, characterized in that the copper or aluminum formed by deposition or sputtering.
  4. 제1항에 있어서, The method of claim 1,
    상기 절연체층은 유기 절연체의 경우는 10 내지 1000 ㎛로 이루어지고, 무기 절연체의 경우는 100 내지 3000 ㎛로 이루어지고, The insulator layer is made of 10 to 1000 ㎛ in the case of an organic insulator, of 100 to 3000 ㎛ in the case of an inorganic insulator,
    상기 전도성 물질 코팅층은 0.005 내지 0.1 ㎛로 이루어지고, The conductive material coating layer is made of 0.005 to 0.1 ㎛,
    상기 금속 코팅층은 0.01 내지 10 ㎛로 이루어지는 것을 특징으로 하는 터치패널 제조용 패드.The metal coating layer is a pad for manufacturing a touch panel, characterized in that consisting of 0.01 to 10 ㎛.
  5. 터치패널의 제조방법에 있어서, In the manufacturing method of the touch panel,
    제1항 내지 제4항 중 어느 한 항의 터치패널 제조용 패드의 상면에서 금속 코팅층을 부분적으로 식각하여 금속 패턴이 형성된 패드를 제조하는 제1단계; 및, A first step of manufacturing a pad with a metal pattern by partially etching the metal coating layer on the upper surface of the pad for manufacturing the touch panel of any one of claims 1 to 4; And,
    i)상기 패턴이 형성된 패드의 상면에 접착제층과 절연수지로 이루어진 유전체층을 결합하거나, ii)상기 패턴이 형성된 패드의 상면에 상기 패턴이 형성된 다른 패드를 뒤집어 서로 상하로 이격하여 결합하는 제2단계를 포함하는 것을 특징으로 하는 터치패널의 제조방법.i) bonding a dielectric layer made of an adhesive layer and an insulating resin to an upper surface of the pad on which the pattern is formed, or ii) inverting the other pads having the pattern on the upper surface of the pad on which the pattern is formed to be spaced apart from each other vertically Method of manufacturing a touch panel comprising a.
  6. 제5항에 있어서, The method of claim 5,
    상기 제1단계와 제2단계 사이에 Between the first and second steps
    상기 금속 패턴이 형성된 패드의 상면에서 전도성 물질 코팅층을 부분적으로 식각하여 금속 패턴 및 전도성 물질 코팅층의 패턴이 형성된 패드를 제조하는 단계를 더 포함하는 것을 특징으로 하는 터치패널의 제조방법.And partially etching the conductive material coating layer on the upper surface of the pad on which the metal pattern is formed to manufacture a pad having a pattern of the metal pattern and the conductive material coating layer.
  7. 정전용량 방식 터치패널에 있어서, In the capacitive touch panel,
    제5항의 i) 터치패널의 제조방법에 의하여 제조되어, 10 내지 500 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 패드;I) an insulator layer having a thickness of 10 to 500 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer having a thickness of 0.005 to 0.1 μm, and a pattern formed thereon; A pad formed on a top surface of the conductive material coating layer having a thickness of 0.01 to 10 μm and having a patterned metal coating layer;
    상기 패드의 상면에 결합하는 접착제층; 및, An adhesive layer bonded to an upper surface of the pad; And,
    상기 접착제층의 상면에 결합하는 절연수지로 이루어진 유전체층을 포함하는 것을 특징으로 하는 정전용량 방식 터치패널.Capacitive touch panel comprising a dielectric layer made of an insulating resin coupled to the upper surface of the adhesive layer.
  8. 저항막 방식 터치패널에 있어서, In the resistive touch panel,
    제5항의 ii) 터치패널의 제조방법에 의하여 제조되어, 10 내지 500 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 하면 패드;Ii) an insulator layer having a thickness of 10 to 500 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer having a thickness of 0.005 to 0.1 μm, and a pattern formed thereon; A bottom pad formed on the top surface of the conductive material coating layer with a thickness of 0.01 to 10 μm and formed of a metal coating layer having a pattern formed thereon;
    상기 패드의 상면 가장자리에 결합하는 분리 필름층; 및, A separation film layer bonded to the top edge of the pad; And,
    상기 분리 필름층의 상면에 결합하고, 제5항의 ii) 터치패널의 제조방법에 의하여 제조되어, 10 내지 500 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 하면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 하면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 상면 패드를 포함하는 것을 특징으로 하는 저항막 방식 터치패널.It is bonded to the upper surface of the separation film layer, is prepared by the method of manufacturing the touch panel ii) of claim 5, the insulator layer having a thickness of 10 to 500 ㎛, formed on the lower surface of the insulator layer with a thickness of 0.005 to 0.1 ㎛ And a pattern pad having a conductive material coating layer formed on the bottom surface of the conductive material coating layer, and an upper surface pad formed of a metal coating layer having a pattern formed on the bottom surface of the conductive material coating layer.
  9. 정전용량 방식 터치패널에 있어서, In the capacitive touch panel,
    제6항의 i) 터치패널의 제조방법에 의하여 제조되어, 10 내지 500 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 패드;I) manufactured by the method of manufacturing a touch panel of claim 6, wherein the insulator layer has a thickness of 10 to 500 µm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 µm, and the A pad formed on a top surface of the conductive material coating layer having a thickness of 0.01 to 10 μm and having a patterned metal coating layer;
    상기 패드의 상면에 결합하는 접착제층; 및, An adhesive layer bonded to an upper surface of the pad; And,
    상기 접착제층의 상면에 결합하는 절연수지로 이루어진 유전체층을 포함하는 것을 특징으로 하는 정전용량 방식 터치패널.Capacitive touch panel comprising a dielectric layer made of an insulating resin coupled to the upper surface of the adhesive layer.
  10. 저항막 방식 터치패널에 있어서, In the resistive touch panel,
    제6항의 ii) 터치패널의 제조방법에 의하여 제조되어, 10 내지 500 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 상면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 상면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 하면 패드;Ii) an insulator layer having a thickness of 10 to 500 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer having a thickness of 0.005 to 0.1 μm, and a pattern formed by the method of claim 6 A bottom pad formed on the top surface of the conductive material coating layer with a thickness of 0.01 to 10 μm and formed of a metal coating layer having a pattern formed thereon;
    상기 패드의 상면 가장자리에 결합하는 분리 필름층; 및, A separation film layer bonded to the top edge of the pad; And,
    상기 분리 필름층의 상면에 결합하고, 제6항의 ii) 터치패널의 제조방법에 의하여 제조되어, 10 내지 500 ㎛의 두께를 가지는 절연체층, 상기 절연체층의 하면에 0.005 내지 0.1 ㎛의 두께로 형성되어 패턴이 형성된 전도성 물질 코팅층, 및 상기 전도성 물질 코팅층의 하면에 0.01 내지 10 ㎛의 두께로 형성되어 패턴이 형성된 금속 코팅층으로 이루어진 상면 패드를 포함하는 것을 특징으로 하는 저항막 방식 터치패널.It is bonded to the upper surface of the separation film layer, is prepared by the method of manufacturing the touch panel ii) of claim 6, formed with an insulator layer having a thickness of 10 to 500 ㎛, a thickness of 0.005 to 0.1 ㎛ on the lower surface of the insulator layer And a pattern pad having a conductive material coating layer formed on the bottom surface of the conductive material coating layer, and an upper surface pad formed of a metal coating layer having a pattern formed on the bottom surface of the conductive material coating layer.
PCT/KR2009/000181 2009-01-14 2009-01-14 Pad for manufacturing a touch panel, method for manufacturing a touch panel using same, and touch panel thus manufactured WO2010082693A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2009/000181 WO2010082693A1 (en) 2009-01-14 2009-01-14 Pad for manufacturing a touch panel, method for manufacturing a touch panel using same, and touch panel thus manufactured

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2009/000181 WO2010082693A1 (en) 2009-01-14 2009-01-14 Pad for manufacturing a touch panel, method for manufacturing a touch panel using same, and touch panel thus manufactured

Publications (1)

Publication Number Publication Date
WO2010082693A1 true WO2010082693A1 (en) 2010-07-22

Family

ID=42339932

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/000181 WO2010082693A1 (en) 2009-01-14 2009-01-14 Pad for manufacturing a touch panel, method for manufacturing a touch panel using same, and touch panel thus manufactured

Country Status (1)

Country Link
WO (1) WO2010082693A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990028928A (en) * 1996-05-15 1999-04-15 야스카와 히데아키 Thin film device having a coating film, liquid crystal panel, electronic apparatus and manufacturing method of thin film device
KR20020030487A (en) * 2000-10-18 2002-04-25 구본준, 론 위라하디락사 Fabrication Method for Liquid Crystal Display Panel
KR20040043958A (en) * 2002-11-20 2004-05-27 엘지.필립스 엘시디 주식회사 Touch Panel with Liquid Crystal Display Device
KR100855028B1 (en) * 2007-06-29 2008-08-28 한플렉스 주식회사 Pad for preparing capacitance type touch panel, method of preparing capacitance type touch panel using the same and touch panel thereby
KR100908102B1 (en) * 2008-11-18 2009-07-16 신와전공 주식회사 Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990028928A (en) * 1996-05-15 1999-04-15 야스카와 히데아키 Thin film device having a coating film, liquid crystal panel, electronic apparatus and manufacturing method of thin film device
KR20020030487A (en) * 2000-10-18 2002-04-25 구본준, 론 위라하디락사 Fabrication Method for Liquid Crystal Display Panel
KR20040043958A (en) * 2002-11-20 2004-05-27 엘지.필립스 엘시디 주식회사 Touch Panel with Liquid Crystal Display Device
KR100855028B1 (en) * 2007-06-29 2008-08-28 한플렉스 주식회사 Pad for preparing capacitance type touch panel, method of preparing capacitance type touch panel using the same and touch panel thereby
KR100908102B1 (en) * 2008-11-18 2009-07-16 신와전공 주식회사 Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby

Similar Documents

Publication Publication Date Title
WO2010058929A2 (en) Pad for fabricating touch panel, method for fabricating touch panel using the same, and touch panel fabricated by the same
TWI726659B (en) Touch panel and display
WO2009157645A1 (en) Window panel integrated capacitive-type touch sensor and a fabrication method therefor
KR101029490B1 (en) Capacitive touch sensor integrated with window panel and mathod for manufacturing thereof
US20100053114A1 (en) Touch panel apparatus and method for manufacturing the same
WO2010095798A1 (en) Method for manufacturing touch screen panel of capacitive touch screen
WO2010114261A2 (en) Capacitive touch sensor integrated into a window panel, and method for manufacturing same
WO2010038957A2 (en) Method for manufacturing a touch panel, and touch panel manufactured by same
WO2015065140A1 (en) Touch panel and method of manufacturing the same
JP4926218B2 (en) Input device and display device including the same
WO2014051247A1 (en) Touch panel and manufacturing method thereof
WO2012008759A2 (en) Touch panel and method for manufacturing the same
WO2014117708A1 (en) Touch panel and methods for forming the same
WO2013162241A1 (en) Touch panel and method of manufacturing the same
JP2014071734A (en) Substrate for color filter integrated touch panel sensor, color filter integrated touch panel sensor, and color filter integrated touch panel module
WO2010120073A2 (en) Pad for a touch panel, method for manufacturing a touch panel using same, and touch panel manufactured by the method
KR20090027779A (en) Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby
KR100855028B1 (en) Pad for preparing capacitance type touch panel, method of preparing capacitance type touch panel using the same and touch panel thereby
KR100909873B1 (en) Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby
WO2012008704A2 (en) Capacitative touch sensor and capacitative touch panel integerated into a window panel and including same
WO2015069048A1 (en) Touch panel for implementing touch sensor using one sheet of film and method for manufacturing same
WO2014178545A1 (en) Touch panel and manufacturing method
CN104834422B (en) Touch module and the touch control display apparatus with the touch module
WO2010058928A2 (en) Resistive touch panel
WO2019054780A1 (en) Substrate for touch screen panel, touch screen panel having same and manufacturing method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09838415

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 20/09/2011)

122 Ep: pct application non-entry in european phase

Ref document number: 09838415

Country of ref document: EP

Kind code of ref document: A1