WO2010058109A3 - Procede de fabrication d'objets portatifs sans contact avec pont dielectrique et objets portatifs - Google Patents

Procede de fabrication d'objets portatifs sans contact avec pont dielectrique et objets portatifs Download PDF

Info

Publication number
WO2010058109A3
WO2010058109A3 PCT/FR2009/001340 FR2009001340W WO2010058109A3 WO 2010058109 A3 WO2010058109 A3 WO 2010058109A3 FR 2009001340 W FR2009001340 W FR 2009001340W WO 2010058109 A3 WO2010058109 A3 WO 2010058109A3
Authority
WO
WIPO (PCT)
Prior art keywords
portable devices
bridge
dielectric
chip
substrate
Prior art date
Application number
PCT/FR2009/001340
Other languages
English (en)
Other versions
WO2010058109A2 (fr
Inventor
Yannick Grasset
Original Assignee
Rfideal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rfideal filed Critical Rfideal
Priority to US13/130,938 priority Critical patent/US8723744B2/en
Priority to EP09784348A priority patent/EP2350930A2/fr
Publication of WO2010058109A2 publication Critical patent/WO2010058109A2/fr
Publication of WO2010058109A3 publication Critical patent/WO2010058109A3/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

L'invention concerne un procédé de fabrication d'objets portatifs sans contact à circuit intégré ainsi que des objets portatifs sans contact à circuit intégré. Le procédé selon l'invention se caractérise en ce qu'il comporte des étapes suivantes selon lesquelles : - on fournit un support (6) d'antenne diélectrique muni d'un circuit d'antenne (7) présentant au moins une spire (7-1, 7-2, 7-3, 7-4) et deux bornes de contact (8-1, 8-2); - on fournit un pont (5) comprenant un support (1) de pont diélectrique et une puce (3) à circuit intégré; et - on reporte ledit pont (5), muni de ladite puce (3), sur ledit support (6) d'antenne diélectrique, de manière que ce pont (5) soit positionné à cheval sur ladite au moins une spire (7-1, 7-2, 7-3, 7-4) et réalise une connexion électrique entre, d'une part, ladite puce (3) et, d'autre part, ledit circuit d'antenne (7). L'invention s'applique, en particulier, à des objets RFID HF.
PCT/FR2009/001340 2008-11-24 2009-11-24 Procede de fabrication d'objets portatifs sans contact avec pont dielectrique et objets portatifs WO2010058109A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/130,938 US8723744B2 (en) 2008-11-24 2009-11-24 Method for making contactless portable devices with dielectric bridge and portable devices
EP09784348A EP2350930A2 (fr) 2008-11-24 2009-11-24 Procede de fabrication d'objets portatifs sans contact avec pont dielectrique et objets portatifs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0806592A FR2938954B1 (fr) 2008-11-24 2008-11-24 Procede de fabrication d'objets portatifs sans contact avec pont dielectrique.
FR08/06592 2008-11-24

Publications (2)

Publication Number Publication Date
WO2010058109A2 WO2010058109A2 (fr) 2010-05-27
WO2010058109A3 true WO2010058109A3 (fr) 2010-07-15

Family

ID=40791543

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2009/001340 WO2010058109A2 (fr) 2008-11-24 2009-11-24 Procede de fabrication d'objets portatifs sans contact avec pont dielectrique et objets portatifs

Country Status (4)

Country Link
US (1) US8723744B2 (fr)
EP (1) EP2350930A2 (fr)
FR (1) FR2938954B1 (fr)
WO (1) WO2010058109A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246630B (zh) 2012-04-11 2017-09-12 英频杰公司 在多个表面上具有天线触点的rfid集成电路和标签
US9053400B2 (en) 2012-04-11 2015-06-09 Impinj, Inc. RFID integrated circuits with antenna contacts on multiple surfaces
US10311351B1 (en) 2012-04-11 2019-06-04 Impinj, Inc. RFID integrated circuits with antenna contacts on multiple surfaces
FR2992761B1 (fr) * 2012-07-02 2015-05-29 Inside Secure Procede de fabrication d'un microcircuit sans contact
US20140070010A1 (en) * 2012-09-10 2014-03-13 Impinj, Inc. Rfid integrated circuits with antenna contacts on multiple surfaces

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998048378A2 (fr) * 1997-04-21 1998-10-29 Siemens Aktiengesellschaft Revetement pour cartes a puce
WO2009043511A1 (fr) * 2007-09-27 2009-04-09 Polyic Gmbh & Co. Kg Transpondeur rfid

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
US6549176B2 (en) * 2001-08-15 2003-04-15 Moore North America, Inc. RFID tag having integral electrical bridge and method of assembling the same
EP1376658B1 (fr) * 2002-06-25 2011-07-06 Kabushiki Kaisha Toshiba Méthode et appareil de fabrication de dispositif semiconducteur
US6665193B1 (en) * 2002-07-09 2003-12-16 Amerasia International Technology, Inc. Electronic circuit construction, as for a wireless RF tag
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998048378A2 (fr) * 1997-04-21 1998-10-29 Siemens Aktiengesellschaft Revetement pour cartes a puce
WO2009043511A1 (fr) * 2007-09-27 2009-04-09 Polyic Gmbh & Co. Kg Transpondeur rfid

Also Published As

Publication number Publication date
FR2938954A1 (fr) 2010-05-28
EP2350930A2 (fr) 2011-08-03
US20110242779A1 (en) 2011-10-06
WO2010058109A2 (fr) 2010-05-27
US8723744B2 (en) 2014-05-13
FR2938954B1 (fr) 2011-06-24

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