WO2010052045A1 - Porte-circuit et utilisation - Google Patents

Porte-circuit et utilisation Download PDF

Info

Publication number
WO2010052045A1
WO2010052045A1 PCT/EP2009/061528 EP2009061528W WO2010052045A1 WO 2010052045 A1 WO2010052045 A1 WO 2010052045A1 EP 2009061528 W EP2009061528 W EP 2009061528W WO 2010052045 A1 WO2010052045 A1 WO 2010052045A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
substrate
circuit
components
sintered
Prior art date
Application number
PCT/EP2009/061528
Other languages
German (de)
English (en)
Inventor
Andreas Fix
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2010052045A1 publication Critical patent/WO2010052045A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon

Definitions

  • Circuit carriers are known in the art known in the art. For example, printed circuit boards made of composite materials, usually of polymer and ceramic composites, are widely used in practice. However, these have a very limited
  • Epoxy resins which result from their relatively low glass transition temperature T g and decomposition temperature, this group of materials in the field of power electronics can be used only limited, as they would have to be exposed to a high ambient temperature (T> 150 0 C).
  • LTCC Low temperature co-fired ceramics
  • a circuit carrier which consists of a ceramic component, on the surface of which metallic conductor tracks are arranged.
  • the ceramic of the ceramic component is usually made of densely fired ceramic, with “densely burned” always “non-porous” is to be understood.
  • the ceramic of the ceramic component according to the document is advantageously an oxide, carbide, and / or nitride ceramic.
  • EP 0 463 872 B1 discloses a method for producing a printed circuit board and a printed circuit board produced by said method itself.
  • Manufacturing method of the circuit board is formed on an insulating substrate, a trench, which is shaped similar to a conductor pattern. This trench is filled with an electrically conductive metal. It is proposed in this teaching to produce the substrate from a sintered aluminum nitride body.
  • the previously known substrates of the circuit carriers reach their limits when the load is increased by the ambient temperature and temperature fluctuations at their place of use.
  • the invention makes it possible to provide a circuit carrier that works reliably even under difficult conditions of use and thus avoids a malfunction.
  • the circuit carrier according to the invention for supporting components basically has a substrate which comprises a sintered material, wherein the sintered material of the substrate is sintered carbon.
  • Sintered carbon is very advantageous as a substrate material of a circuit substrate, since the thermal resistance of this material is given even at high ambient temperatures.
  • the sintered material of the substrate is a one-component system made entirely of sintered carbon. This causes difficulties that are typically at one Multicomponent system present and have already been described above, avoided.
  • the components that are carried by the circuit carrier comprise electrical conductor tracks. Also, the components may include electronic components.
  • Electronic components may be, for example, capacitors, resistors and / or coils.
  • the electronic components may comprise high performance components. Since the substrate of the circuit substrate is also suitable for high ambient temperatures, the combination of the circuit substrate according to the invention with electronic high-performance components is technically possible and useful.
  • circuit carrier according to the invention can be used very advantageously in automotive electronics and / or in power electronics and / or in high-performance electronics.
  • circuit carrier is used in a control unit.
  • circuit carrier could be used in a control unit for recordable power steering.
  • ABS anti-lock braking system
  • the circuit carrier can be used in an environment in which there is a so-called “harsh environment”.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un porte-circuit destiné à porter des composants. Le porte-circuit présente un substrat contenant un matériau fritté. Selon l'invention, le matériau fritté du substrat est du carbone fritté. L'invention concerne également l'utilisation d'un tel porte-circuit.
PCT/EP2009/061528 2008-11-07 2009-09-07 Porte-circuit et utilisation WO2010052045A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008043565.1 2008-11-07
DE200810043565 DE102008043565A1 (de) 2008-11-07 2008-11-07 Schaltungsträger und dessen Verwendung

Publications (1)

Publication Number Publication Date
WO2010052045A1 true WO2010052045A1 (fr) 2010-05-14

Family

ID=41667257

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/061528 WO2010052045A1 (fr) 2008-11-07 2009-09-07 Porte-circuit et utilisation

Country Status (3)

Country Link
DE (1) DE102008043565A1 (fr)
TW (1) TW201019803A (fr)
WO (1) WO2010052045A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1055650A1 (fr) * 1998-11-11 2000-11-29 Advanced Materials International Company, Ltd. Materiau composite metallique a base de carbone, et procedes de preparation et d'utilisation correspondants
EP1139703A1 (fr) * 1999-09-06 2001-10-04 SUZUKI SOGYO Co., Ltd. Substrat de carte a circuits
JP2003209329A (ja) * 2002-01-11 2003-07-25 Suzuki Sogyo Co Ltd 配線板用基板
JP2005167131A (ja) * 2003-12-05 2005-06-23 Suzuki Sogyo Co Ltd 高熱伝導性プリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461293A (ja) 1990-06-29 1992-02-27 Toshiba Corp 回路基板及びその製造方法
AT402135B (de) 1994-03-30 1997-02-25 Electrovac Schaltungsträger

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1055650A1 (fr) * 1998-11-11 2000-11-29 Advanced Materials International Company, Ltd. Materiau composite metallique a base de carbone, et procedes de preparation et d'utilisation correspondants
EP1139703A1 (fr) * 1999-09-06 2001-10-04 SUZUKI SOGYO Co., Ltd. Substrat de carte a circuits
JP2003209329A (ja) * 2002-01-11 2003-07-25 Suzuki Sogyo Co Ltd 配線板用基板
JP2005167131A (ja) * 2003-12-05 2005-06-23 Suzuki Sogyo Co Ltd 高熱伝導性プリント配線板

Also Published As

Publication number Publication date
TW201019803A (en) 2010-05-16
DE102008043565A1 (de) 2010-05-12

Similar Documents

Publication Publication Date Title
DE3324933A1 (de) Keramische mehrschicht-leiterplatte
DE102015102866A1 (de) Elektrischer Anschlusskontakt für ein keramisches Bauelement, keramisches Bauelement und Bauelementanordnung
DE10207109B4 (de) Keramische Leiterplatte
DE3929789C2 (de) Schaltkreissubstrat für Dickfilmschaltung und Verfahren zu dessen Herstellung
EP1100297A2 (fr) Connexion amovible d'un élément de contact sur une piste d'une plaquette de circuit
DE102009000882B4 (de) Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats
WO2010052045A1 (fr) Porte-circuit et utilisation
WO2002032199A1 (fr) Carte de circuits et procede pour produire une telle carte de circuits et un materiau composite en couche pour produire une telle carte de circuits
EP0006444B1 (fr) Structure multicouche diélectrique
DE102011076773A1 (de) Verfahren zur Herstellung einer integrierten Schaltung
EP3351061B1 (fr) Bloc électronique pour module de commande de transmission
EP2312288A1 (fr) Capteur de température doté d'une platine conductrice multicouche
EP2768293A1 (fr) Carte de circuit imprimé pour circuits électriques
DE60209712T2 (de) Gedruckte leiterplatte
EP0209776B1 (fr) Emaux à structures hétérogène
DE10230712B4 (de) Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger
WO2006134006A1 (fr) Connexion electroconductrice a flexibilite mecanique, entre des composants electriques ou electroniques
DE202015001441U1 (de) Leistungshalbleitermodul mit kombinierten Dickfilm- und Metallsinterschichten
DE102017114442B4 (de) Modul mit Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Moduls
WO2001009060A1 (fr) Pate pour la serigraphie de structures electriques sur des substrats de support
DE102007039536B4 (de) Mehrfach-Bonddrahtverbund und simultanes Bonden
DE102017209297A1 (de) Verfahren zur Herstellung einer elektrischen Leiterbahn auf einem Kunststoffträger und Sensorbaugruppe umfassend einen Kunststoffträger mit einer derartig hergestellten Leiterbahn
JP2506281B2 (ja) 低温焼結多層基板
AT404207B (de) Verfahren zum herstellen elektrischer schaltkreise
DE10330754B4 (de) Verfahren zur Herstellung einer elektrischen Schaltung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09782672

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 09782672

Country of ref document: EP

Kind code of ref document: A1