WO2010043638A3 - Formulation d'époxyde durcissable contenant de la silice - Google Patents
Formulation d'époxyde durcissable contenant de la silice Download PDFInfo
- Publication number
- WO2010043638A3 WO2010043638A3 PCT/EP2009/063381 EP2009063381W WO2010043638A3 WO 2010043638 A3 WO2010043638 A3 WO 2010043638A3 EP 2009063381 W EP2009063381 W EP 2009063381W WO 2010043638 A3 WO2010043638 A3 WO 2010043638A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- preparation
- organosilane
- composition containing
- modified silica
- coated articles
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/145—Preparation of hydroorganosols, organosols or dispersions in an organic medium
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/146—After-treatment of sols
- C01B33/149—Coating
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/146—After-treatment of sols
- C01B33/151—After-treatment of sols by progressively adding a sol to a different sol, i.e. "build-up" of particles using a "heel"
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Composite Materials (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
Abstract
La présente invention porte sur de nouvelles formulations de revêtement d'époxyde durcissables contenant de la silice, sur des procédés pour leur préparation et sur leur utilisation.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08166626 | 2008-10-15 | ||
EP08166626.5 | 2008-10-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010043638A2 WO2010043638A2 (fr) | 2010-04-22 |
WO2010043638A3 true WO2010043638A3 (fr) | 2010-07-22 |
Family
ID=42106965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2009/063381 WO2010043638A2 (fr) | 2008-10-15 | 2009-10-14 | Formulation d'époxyde durcissable contenant de la silice |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2010043638A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102471938B (zh) | 2009-06-30 | 2014-08-13 | 巴斯夫欧洲公司 | 包含可染色颗粒的聚酰胺纤维及其生产方法 |
CN103347925A (zh) * | 2010-12-17 | 2013-10-09 | 陶氏环球技术有限责任公司 | 可固化组合物 |
CN110526636B (zh) * | 2019-09-19 | 2022-02-15 | 重庆兴渝新材料研究院有限公司 | 一种疏水硅溶胶及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6210790B1 (en) * | 1998-07-15 | 2001-04-03 | Rensselaer Polytechnic Institute | Glass-like composites comprising a surface-modified colloidal silica and method of making thereof |
WO2003101164A1 (fr) * | 2002-05-23 | 2003-12-04 | 3M Innovative Properties Company | Remplissage sous-jacent de nanoparticules |
US20040102529A1 (en) * | 2002-11-22 | 2004-05-27 | Campbell John Robert | Functionalized colloidal silica, dispersions and methods made thereby |
US20050008865A1 (en) * | 2003-07-07 | 2005-01-13 | General Electric Company | Curable epoxy compositions and articles made therefrom |
US20050049334A1 (en) * | 2003-09-03 | 2005-03-03 | Slawomir Rubinsztain | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
DE102007032886A1 (de) * | 2007-07-14 | 2009-01-15 | Bayer Materialscience Ag | Hydrophile Hardcoatbeschichtungen |
-
2009
- 2009-10-14 WO PCT/EP2009/063381 patent/WO2010043638A2/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6210790B1 (en) * | 1998-07-15 | 2001-04-03 | Rensselaer Polytechnic Institute | Glass-like composites comprising a surface-modified colloidal silica and method of making thereof |
WO2003101164A1 (fr) * | 2002-05-23 | 2003-12-04 | 3M Innovative Properties Company | Remplissage sous-jacent de nanoparticules |
US20040102529A1 (en) * | 2002-11-22 | 2004-05-27 | Campbell John Robert | Functionalized colloidal silica, dispersions and methods made thereby |
US20050008865A1 (en) * | 2003-07-07 | 2005-01-13 | General Electric Company | Curable epoxy compositions and articles made therefrom |
US20050049334A1 (en) * | 2003-09-03 | 2005-03-03 | Slawomir Rubinsztain | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
DE102007032886A1 (de) * | 2007-07-14 | 2009-01-15 | Bayer Materialscience Ag | Hydrophile Hardcoatbeschichtungen |
Also Published As
Publication number | Publication date |
---|---|
WO2010043638A2 (fr) | 2010-04-22 |
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