WO2010035594A1 - Imprint mold and information recording medium substrate manufacturing method using the same - Google Patents

Imprint mold and information recording medium substrate manufacturing method using the same Download PDF

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Publication number
WO2010035594A1
WO2010035594A1 PCT/JP2009/064550 JP2009064550W WO2010035594A1 WO 2010035594 A1 WO2010035594 A1 WO 2010035594A1 JP 2009064550 W JP2009064550 W JP 2009064550W WO 2010035594 A1 WO2010035594 A1 WO 2010035594A1
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WO
WIPO (PCT)
Prior art keywords
mold
imprint
substrate
hole
imprint mold
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PCT/JP2009/064550
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French (fr)
Japanese (ja)
Inventor
誉之 岡野
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コニカミノルタオプト株式会社
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Publication of WO2010035594A1 publication Critical patent/WO2010035594A1/en

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer

Definitions

  • the present invention relates to an imprint mold for transferring a microstructure pattern and a method for manufacturing an information recording medium substrate using the same.
  • patterned media in which a magnetic layer is patterned and the magnetic layer is physically divided into a plurality of regions have been proposed.
  • the fine structure for PM is on the order of several tens of nm, which is a pattern size equivalent to the diffraction limit of light. For this reason, it is difficult to produce a PM pattern with a fine structure by general photolithography. Therefore, as a method capable of further fine processing, for example, a method of forming a pattern by a nanoimprint method has been proposed.
  • Patent Document 1 discloses a step of forming a transfer target (imprint material layer) on a flat substrate, a step of bringing a mold (mold) having a concavo-convex structure into contact with the transfer target, and pressurizing.
  • Magnetic having a step of transferring a concavo-convex structure to the transferred body, a step of peeling the mold from the transferred body, and a step of depositing a magnetic recording layer on the transferred body having the concavo-convex structure of the mold transferred.
  • a pin module is inserted between a mold and a substrate after imprint molding is completed, and a slit is formed by separating a part of the mold and the substrate, and external air is passed between the mold and the substrate through this slit. Describes a method of separating the substrate from the mold by flowing it into the mold.
  • Patent Document 3 in an imprint mold (mold) for forming a concavo-convex pattern, a plurality of through holes are formed outside the concavo-convex pattern region on the surface on which the concavo-convex pattern is formed, and the substrate and the imprint mold A method is described in which a mold is peeled off by applying pressure from a through-hole to a substrate with a pin or gas after forming a pattern between them.
  • the present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an imprint mold that can be easily peeled off without scratching the substrate, and a method for manufacturing an information recording medium substrate using the same. Is to provide.
  • the imprint mold according to the present invention has a through hole formed at a position corresponding to the central hole of the substrate base material when pressed against the molding material, and the through hole is smaller than the central hole.
  • substrate concerning this invention uses the above-mentioned imprint type
  • FIG. 2 is a diagram showing manufacturing steps of an information recording medium substrate using the imprint mold shown in FIG. 1, and FIGS. 2A to 2E are diagrams showing each step. It is sectional drawing which shows the structure of the imprint type
  • FIGS. 4A to 4G are diagrams showing manufacturing steps of the information recording medium substrate using the imprint mold shown in FIG. 3, and FIGS. It is a figure for demonstrating the imprint mold release in the comparative example 1.
  • FIG. FIGS. 6A and 6B are diagrams for explaining an imprint mold in Comparative Example 2, in which FIG. 6A is a plan view of the imprint mold, and FIG. 6B is a view taken along the line BB ′ in FIG.
  • FIG. 6C is a cross-sectional view, and FIG. 6C is a view for explaining mold release.
  • FIG. 1 is a cross-sectional view showing the configuration of an imprint mold according to an embodiment of the present invention.
  • an imprint mold 10 according to the present embodiment includes an upper mold 1 and a lower mold 2.
  • the upper mold 1 and the lower mold 2 are formed with transfer patterns 1b and 2b, which are fine structures for forming an uneven pattern on the imprint material (molding material).
  • transfer patterns 1b and 2b are fine structures for forming an uneven pattern on the imprint material (molding material).
  • through holes 1 a are formed at locations corresponding to the center holes of the substrate base material in the pattern forming process of the information recording medium substrate on which the uneven pattern is formed by the imprint mold 10.
  • the pattern forming process is a process in which the imprint mold 10 is pressed against the imprint material, and the imprint material is transferred with the transfer patterns 1b and 2b, so that the imprint material has a concavo-convex pattern. It is in a state.
  • the through-hole 1a should just be located in the range of the location which hits the center hole of a board
  • the through-hole 1a may be plural.
  • a through hole may be formed in the lower mold 2. In either case, both the upper mold 1 and the lower mold 2 can be easily peeled off. Note that only one of the transfer patterns 1b and 2b may be formed. However, since the transfer patterns 1b and 2b are transferred as an uneven pattern on the information recording medium substrate, when only one of the transfer patterns 1b and 2b is formed, the uneven pattern is formed only on one side. An unrecorded information recording medium substrate is manufactured.
  • the imprint mold 10 may be manufactured by a known technique such as injection molding, dry etching, wet etching, photolithography, electron beam drawing (electron beam lithography), imprint method, or the like.
  • the through-hole 1a may be formed simultaneously when forming the transfer patterns 1b and 2b.
  • the through holes 1a may be formed by machining or the like.
  • FIG. 2 is a diagram showing manufacturing steps of the information recording medium substrate using the imprint type according to the present embodiment
  • FIGS. 2A to 2E are diagrams showing each step.
  • the upper mold 1 and the lower mold 2 are arranged so as to sandwich a glass substrate 3 as a substrate base material.
  • the transfer patterns 1b and 2b are arranged on the glass substrate 3 side.
  • a substrate base material is a base material which can form a board
  • a quartz substrate or the like may be used instead of the glass substrate.
  • the glass substrate 3 include a 2.5-inch glass substrate for HDD.
  • imprinting is performed on the upper surface of the glass substrate 3 where the uneven pattern is formed and on the upper surface of the lower mold 2 where the transfer pattern 2b is formed.
  • Material 4 is applied.
  • the imprint material 4 for example, a spin-on-glass (SOG) material is used.
  • the coating method may be a known coating method, for example, drop coating with a dispenser or the like, spin coating or dip coating, or a wire bar and applicator. It may be a method of spreading.
  • the glass substrate 3 including the imprint material 4 is sandwiched from above and below by the upper mold 1 and the lower mold 2 with a predetermined pressing force. Then, the imprint material 4 is dried. By doing so, the imprint material 4 is solidified, and the transfer patterns 1 b and 2 b are transferred to the imprint material 4. That is, an uneven pattern is formed on the imprint material 4.
  • the drying method is not particularly limited, and a known drying method can be used. For example, although it may be allowed to stand at room temperature, it is preferable to further reduce the pressure, blow, and heat from the viewpoint of faster drying. In addition, when heating is performed, it is preferable that the heating temperature does not exceed the boiling point of the solvent of the imprint material 4.
  • the through-hole 1a is located in the location which hits the center hole 7 of the glass substrate 3 which is a base material board
  • the glass substrate 3 is a 2.5-inch glass substrate for HDD, it has a donut shape with an outer diameter of 65 mm and an inner diameter of 20 mm. Therefore, the diameter of the center hole 7 is 20 mm.
  • the through hole 1a is formed in a region corresponding to the 20 mm diameter portion of the central hole 7.
  • the through-hole 1a is a circle having a size smaller than the diameter 20 mm of the center hole 7.
  • the through hole 1 may have a shape other than a circle.
  • a plurality of through holes 1 a may be formed within the area of the center hole 7.
  • the size of the through hole 1a may change in the middle, or a plurality of through holes 1a may be coupled to one through hole 1a in the middle.
  • the through-hole 1a only needs to penetrate the center hole 7 and the outside of the imprint mold 10, for example, in the upper mold 1 and the lower mold 2 as in the side surfaces of the upper mold 1 and the lower mold 2
  • the center hole 7 may be penetrated between the surface on which the transfer patterns 1b and 2b are formed and a surface other than the surface facing the surface.
  • the through hole 1a is preferably linear without meandering. Therefore, the through hole 1 a is preferably formed so as to penetrate between the center hole 7 and the outer main surface of the upper mold 1.
  • a gas 5 as a fluid flows into the through hole 1a.
  • pressure is applied to the through-hole 1a and the center hole 7, and pressure is applied to the interface between the upper mold 1 and the lower mold 2 and the imprint material 4, so that the upper mold 1 and the lower mold 2 are imprint material 4 Is peeled off.
  • pressure is also applied to the surface facing the center hole 7.
  • the upper mold 1 and the lower mold 2 are peeled off with a uniform force, and are released from the center hole 7 in a concentric manner. Thereby, the concavo-convex pattern formed on the imprint material 4 is not destroyed or deformed.
  • the gas 5 is preferably a gas that can be easily used in any facility, such as air or nitrogen.
  • the gas 5 other gases may be used as long as they do not erode the microstructure formed on the glass substrate 3 and the imprint material 4.
  • a liquid that is a fluid may be used instead of the gas 5. Even in that case, since the pressure is uniformly applied to each part, the same effect as the gas 5 is obtained.
  • water is preferable because it can be easily obtained, but is not particularly limited as long as it does not erode the microstructure formed on the glass substrate 3 and the imprint material 4.
  • a magnetic film 6 is formed on the imprint material 4 to manufacture an information recording medium substrate 8 having an uneven pattern 6a formed on the surface.
  • the magnetic film 6 for example, CoCrPt or FePt is used.
  • FIG. 3 is a cross-sectional view showing the configuration of an imprint mold according to another embodiment of the present invention.
  • FIG. 4 is a diagram showing a manufacturing process of an information recording medium substrate using an imprint type according to another embodiment of the present invention, and FIGS. 4 (A) to 4 (G) are diagrams showing each process. It is. 3 and 4, the same reference numerals as those in FIGS. 1 and 2 indicate the same configuration, and the description thereof is omitted.
  • an imprint mold 20 according to another embodiment of the present invention includes an upper mold 11 and a lower mold 12.
  • the upper mold 11 and the lower mold 12 are formed with transfer patterns 11b and 12b, which are fine structures for forming an uneven pattern on the imprint material.
  • transfer patterns 11b and 12b are fine structures for forming an uneven pattern on the imprint material.
  • through holes 11a and 12a are formed at locations corresponding to the center hole of the substrate base material in the pattern forming process of the information recording medium substrate in which the uneven pattern is formed by the imprint mold 20. Has been.
  • the through holes 11a and 12a are formed in the upper mold 11 and the lower mold 12, in a state where the imprint material and the imprint mold 20 are in close contact with each other in the pattern forming process, the through holes 11a and 12a
  • the through holes 11a and 12a only need to be located within the range of the location corresponding to the center hole of the substrate base material, and the size thereof is smaller than that of the center hole. Further, there may be a plurality of through holes 11a and 12a. Note that only one of the transfer patterns 11b and 12b may be formed. However, since the transfer patterns 11b and 12b are transferred as an uneven pattern of the information recording medium substrate, when only one of the transfer patterns 11b and 12b is formed, the uneven pattern is formed only on one side. An information recording medium substrate that is not formed is manufactured.
  • the imprint mold 20 may be manufactured by a known technique such as injection molding, dry etching, wet etching, photolithography, electron beam drawing (electron beam lithography).
  • the through holes 11a and 12a may be formed by the same process as the transfer patterns 11b and 12b, or may be formed by machining or the like after the transfer patterns 11b and 12b are formed.
  • an optical imprint method is used.
  • the upper mold 11 and the lower mold 12 are arranged so as to sandwich the glass substrate 3 which is a substrate base material having a magnetic film 14 formed on both main surfaces.
  • the transfer patterns 11b and 12b are arranged so as to be on the magnetic film 14 side.
  • the magnetic film 14 for example, CoCrPt or FePt is used.
  • the transfer pattern 12b is formed on the upper surface of the glass substrate 3 including the magnetic film 14 where the concave / convex pattern is formed and on the upper surface of the lower mold 12.
  • the imprint material 15 is applied to the location. Since the photoimprint method is used, as the imprint material 15, for example, a photocurable resin material is used.
  • the coating method may be a known coating method, for example, drop coating with a dispenser or the like, spin coating or dip coating, or a wire bar and applicator. It may be a method of spreading.
  • the glass substrate 3 including the imprint material 15 and the magnetic film 14 is sandwiched from above and below by the upper mold 11 and the lower mold 12 with a predetermined pressing force. Then, light such as ultraviolet light is irradiated to cure the imprint material 15. By doing so, the imprint material 15 is solidified, and the transfer patterns 11b and 12b are transferred to the imprint material 15 (optical imprint method). That is, an uneven pattern is formed on the imprint material 15. Moreover, as shown in FIG.4 (C), the through-holes 11a and 12a are located in the location which hits the center hole 17 of the glass substrate 3 which is a substrate base material.
  • the glass substrate 3 when the glass substrate 3 is a 2.5-inch glass substrate for HDD, it has a donut shape with an outer diameter of 65 mm and an inner diameter of 20 mm. Therefore, the diameter of the center hole 17 is 20 mm.
  • the through holes 11a and 12a are formed in a region corresponding to the 20 mm diameter portion of the center hole 17.
  • the through holes 11a and 12a have a circular shape smaller than the diameter 20 mm of the center hole 17.
  • the through holes 11a and 12a may have a shape other than a circle. Further, a plurality of through holes 11 a and 12 a may be formed in each of the upper mold 11 and the lower mold 12 within this region.
  • the sizes of the through holes 11a and 12a may be changed in the middle, and the plurality of through holes 11a and 12a may be coupled to one through hole 11a and 12a in the middle.
  • the through holes 11a and 12a since the through holes 11a and 12a only need to penetrate the center hole 17 and the outside of the imprint mold 20, the upper mold 11 and the lower mold, for example, as the side surfaces of the upper mold 11 and the lower mold 12 are used. 12 may be formed between the center hole 17 and a surface other than the surface on which the transfer patterns 11b and 12b are formed and the surface facing the surface.
  • the through holes 11a and 12a are preferably linear without meandering. Therefore, the through holes 11a and 12a are preferably formed to penetrate between the center hole 17 and the outer main surfaces of the upper mold 11 and the lower mold 12, respectively.
  • a gas 16 that is a fluid flows into the through holes 11a and 12a.
  • pressure is applied to the through holes 11 a and 12 a and the center hole 17, and pressure is also applied to the surfaces of the upper mold 11 and the lower mold 12 facing the center hole 17.
  • pressure is applied to the interface between the upper mold 11 and the lower mold 12 and the imprint material 15, so that the upper mold 11 and the lower mold 12 are peeled from the imprint material 15.
  • the upper mold 11 and the lower mold 12 are peeled off with a uniform force, and are released from the central hole 17 uniformly in a concentric manner.
  • the concavo-convex pattern formed on the imprint material 15 is not destroyed or deformed. Further, since pressure is applied from the center hole 17, the upper mold 1 and the lower mold 12 are peeled off substantially simultaneously.
  • the gas 16 is preferably a gas that can be easily used in any facility, such as air or nitrogen.
  • the gas 16 may be other gas as long as it does not erode the microstructure formed on the glass substrate 3 and the imprint material 15.
  • a liquid that is a fluid may be used instead of the gas 16. Even in such a case, since the pressure is uniformly applied to each part, the same effect as the gas 16 is obtained.
  • the liquid for example, water is preferable because it can be easily obtained.
  • the liquid is not particularly limited and may be any liquid that does not erode the fine structure formed on the glass substrate 3, the magnetic film 14, and the imprint material 15. That's fine.
  • the gas 16 may flow from either one and be discharged from the other.
  • the imprint material 15 which is a photocurable resin and has a fine structure is dry-etched using, for example, a gas containing oxygen, so that the magnetic film 14 is formed. Exposed.
  • the magnetic film 14 is etched by dry etching using, for example, argon using the imprint material 15 remaining on the magnetic film 14 as a mask. A fine structure is formed.
  • the imprint material 15 is removed, and the information recording medium substrate 18 having the uneven pattern 14a formed on the magnetic film 14 on the surface is manufactured.
  • an imprint mold according to the above-described embodiment of the present invention and a method of manufacturing an information recording medium substrate using the same, an imprint mold according to another embodiment of the present invention, and an information recording medium substrate using the same An example (Examples 1 to 3) in which the manufacturing method is specifically implemented will be described. Further, examples (Comparative Examples 1 and 2) in which an imprint type as a comparative example and an information recording medium substrate manufacturing method using the same are specifically described.
  • Example 1 will be described with reference to FIGS. 1 and 2.
  • an imprint mold 10 including an upper mold 1 and a lower mold 2 in which a fine structure was formed by injection molding using polymethylpentene resin was used.
  • the upper mold 1 and the lower mold 2 were each disk-shaped with an outer diameter of 65 mm.
  • a through-hole 1a having a diameter of 10 mm is formed at the center of the upper mold 1, and the upper mold 1 has a donut shape.
  • the transfer patterns 1b and 2b having a fine structure are formed on one side of each of the upper mold 1 and the lower mold 2, and are formed in a region having a radius of 10 mm or more from the center.
  • the through holes 1a and the transfer patterns 1b and 2b are formed by injection molding.
  • a 2.5-inch glass substrate 3 for HDD (outer diameter 65 mm, inner diameter 20 mm) was prepared, and the glass substrate 3 was disposed so as to be sandwiched between the upper mold 1 and the lower mold 2 (see FIG. 2A).
  • a solution of OCD T-12 900-V (manufactured by Tokyo Ohka Kogyo Co., Ltd.) which is an SOG material as the imprint material 4 is applied on the glass substrate 3 and the lower mold 2 with a dispenser of 100 microliters each. (See FIG. 2B).
  • the imprint material 4 was applied on the lower mold 2 with the transfer pattern 2b, and on the glass substrate 3, it was applied to a location corresponding to the transfer pattern 1b in the pattern forming step.
  • the imprint material 4 was dried and cured in a state where the glass substrate 3 was pressed at 1 MPa with the upper mold 1 and the lower mold 2 (see FIG. 2C). After the imprint material 4 was cured, compressed air as the gas 5 was sealed through the through-hole 1a, and the mold was released. As a result, the upper mold 1 and the lower mold 2 could be uniformly released (see FIG. 2D). ).
  • transferred to the imprint material 4 after mold release was observed.
  • SEM scanning electron microscope
  • AFM atomic force microscope
  • a magnetic film 6 was formed on the imprint material 4 to form a patterned media hard disk drive substrate (information recording medium substrate 8) (see FIG. 2E).
  • Example 2 will be described with reference to FIGS. 3 and 4.
  • an imprint mold 20 including an upper mold 11 and a lower mold 12 in which a microstructure is formed by injection molding using a polycarbonate resin was used.
  • Each of the upper mold 11 and the lower mold 12 was a disk having an outer diameter of 65 mm.
  • Through holes 11a and 12a having a diameter of 10 mm are formed at the centers of the upper mold 11 and the lower mold 12, and the upper mold 11 and the lower mold 12 have a donut shape.
  • the transfer patterns 11b and 12b having a fine structure are formed on one side of each of the upper mold 1 and the lower mold 2, and are formed in a region having a radius of 10 mm or more from the center.
  • the imprint material 4 is applied to the transfer pattern 2b on the lower mold 2 and applied to the portion corresponding to the transfer pattern 11b in the pattern forming process on the glass substrate 3 including the magnetic film 14. It was. Thereafter, the imprint material 15 is irradiated with light in a state where the glass substrate 3 including the imprint material 15 and the magnetic film 14 is sandwiched between the upper mold 11 and the lower mold 12, and the imprint material 15 is cured (FIG. 4 ( C)). After the imprint material 4 was cured, nitrogen as the gas 5 was sealed through the through holes 11a and 12a, and release was performed. As a result, the upper mold 11 and the lower mold 12 were uniformly released (FIG. 4D). reference).
  • transferred to the imprint material 15 after mold release was observed.
  • SEM scanning electron microscope
  • AFM atomic force microscope
  • the fine structure layer of the imprint material 15 which is a photocurable resin was etched by dry etching until the magnetic film 14 was exposed on the bottom surface of the fine structure layer (see FIG. 4E). Then, the magnetic film 14 is etched by dry etching using the imprint material 15 that is the remaining photocurable resin as a mask (see FIG. 4F). Finally, the imprint material 15 that is the photocurable resin is removed.
  • the hard disk drive substrate for patterned media was removed (see FIG. 4G).
  • Embodiment 3 will be described with reference to FIGS. 1 and 2.
  • a zeonore made by Nippon Zeon Co., Ltd.
  • the imprint mold 10 was used.
  • the upper mold 1 and the lower mold 2 were each disk-shaped with an outer diameter of 65 mm.
  • a through hole 1a having a diameter of 10 mm is formed in the center of the upper mold 1 by machining, and the upper mold 1 has a donut shape.
  • the transfer patterns 1b and 2b having a fine structure are formed on one side of each of the upper mold 1 and the lower mold 2, and are formed in a region having a radius of 10 mm or more from the center.
  • a 2.5-inch glass substrate 3 (outer diameter 65 mm, inner diameter 20 mm) for HDD was prepared, and the glass substrate 3 was disposed so as to be sandwiched between the upper mold 1 and the lower mold 2 (see FIG. 2A).
  • a solution of OCD T-12 900-V manufactured by Tokyo Ohka Kogyo Co., Ltd.
  • SOG material as the imprint material 4 is applied on the glass substrate 3 and the lower mold 2 with a dispenser of 100 microliters each.
  • the imprint material 4 was applied to the transfer pattern 2b on the lower mold 2 and applied to the portion corresponding to the transfer pattern 1b in the pattern forming process on the glass substrate 3.
  • the imprint material 4 was dried and cured in a state where the glass substrate 3 including the imprint material 4 was pressed at 1 MPa with the upper mold 1 and the lower mold 2 (see FIG. 2C). After the imprint material 4 was cured, pure water was sealed in place of the gas 5 through the through-hole 1a, and the mold was released. As a result, the upper mold 1 and the lower mold 2 could be uniformly released (FIG. 2D). reference).
  • transferred to the imprint material 4 after mold release was observed.
  • SEM scanning electron microscope
  • AFM atomic force microscope
  • a magnetic film 6 was formed on the imprint material 4 to obtain a patterned media hard disk drive substrate (information recording medium substrate 8) (see FIG. 2E).
  • Comparative Example 1 An imprint type of Comparative Example 1 and an information recording medium substrate manufacturing method using the same will be described with reference to FIG.
  • FIG. 5 is a view for explaining imprint mold release in Comparative Example 1.
  • FIG. FIG. 5 is a diagram corresponding to FIG. In Comparative Example 1, release is performed using a pin module.
  • Comparative Example 1 an imprint mold 101 having a disk-shaped upper mold and a lower mold having an outer diameter of 65 mm, in which a microstructure was formed by injection molding using a polycarbonate resin, was used. On one main surface of the upper mold and the lower mold of the imprint mold 101, a transfer pattern having a fine structure is formed in a region having a radius of 10 mm or more from each center.
  • a 2.5-inch glass substrate 103 for HDD (outer diameter 65 mm, inner diameter 20 mm) is prepared by forming a magnetic film 104 on both main surfaces, and the glass substrate 103 including the magnetic film 104 is an imprint mold 101. It is arranged so as to be sandwiched between the upper mold and the lower mold.
  • a solution of PAK-02 (manufactured by Toyo Gosei Co., Ltd.), which is a photocurable resin, is used as the imprint material 105 on the glass substrate 103 including the magnetic film 104 and the lower mold of the imprint mold 101, respectively. Microliters were applied with a dispenser.
  • the imprint material 105 was applied to the transfer pattern on the lower mold, and the glass substrate 103 including the magnetic film 104 was applied to a location corresponding to the transfer pattern in the pattern forming process. Thereafter, the imprint material 105 is cured by irradiating the imprint material 105 with light while the glass substrate 103 including the imprint material 105 and the magnetic film 104 is sandwiched between the upper mold and the lower mold of the imprint mold 101.
  • the pin module 102 is inserted into the interface between the imprint mold 101 and the imprint material 105, and a gap is generated between the mold and the substrate by physical force. The mold was peeled off.
  • the fine structure transferred to the imprint material 105 after release was observed.
  • an abnormality in interference fringes which is considered to be caused by scratches when the pin module 102 was inserted, was found in the portion where the pin module was inserted in the outer peripheral portion.
  • a Nomarski microscope it was found that the magnetic film 104 including the imprint material 105 and the glass substrate 103 were damaged.
  • FIG. 6A and 6B are diagrams for explaining the imprint type in Comparative Example 2.
  • FIG. 6A is a plan view of the imprint type
  • FIG. It is B 'arrow sectional drawing
  • FIG.6 (C) is a figure for demonstrating mold release.
  • a through hole is formed in the imprint mold of Comparative Example 2, but the position is within the transfer pattern region.
  • the upper mold 111 of the imprint mold in Comparative Example 2 is a disc shape having an outer diameter of 65 mm formed by injection molding of polymethylpentene resin.
  • Four through-holes 117 are formed at a position 20 mm from the center of the mold 111 so as to be 90-degree rotationally symmetric. The diameter of these through holes 117 is 5 mm.
  • the through hole 117 penetrates between the transfer pattern forming region formed on one main surface of the upper mold 111 and the other main surface.
  • the lower mold 112 (see FIG. 6C) has a disk shape with an outer diameter of 65 mm formed by injection molding of polymethylpentene resin, similarly to the upper mold 111.
  • the transfer pattern having a fine structure is formed on one surface of each of the upper mold 111 and the lower mold 112, and is formed in a region having a radius of 10 mm or more from the center.
  • the through holes 117 and these transfer patterns are formed by injection molding.
  • a 2.5-inch glass substrate 113 (outer diameter 65 mm, inner diameter 20 mm) for HDD is prepared, and the glass substrate 113 is disposed so as to be sandwiched between the upper mold 111 and the lower mold 112.
  • a solution of OCD T-12 900-V (manufactured by Tokyo Ohka Kogyo Co., Ltd.), which is an SOG material, was applied as an imprint material 114 on each 112 by a dispenser.
  • the imprint material 114 was applied to the transfer pattern on the lower mold 112, and was applied to the portion corresponding to the transfer pattern in the pattern forming process on the glass substrate 113.
  • the imprint material 114 was dried and cured in a state where the glass substrate 113 including the imprint material 114 was pressed at 1 MPa with the upper mold 111 and the lower mold 112. Then, as shown in FIG. 6C, after the imprint material 114 was cured, compressed air as the gas 115 was sealed through the through hole 117, and the mold release was performed. However, although the upper mold 111 in which the through hole 117 was formed was released, the lower mold 112 in which the through hole was not formed was not released. Further, a fine structure transferred to the released imprint material 114 on the upper mold 111 side was observed.
  • An imprint mold is an imprint mold that forms a concavo-convex pattern on a molding material that forms a substrate substrate having a center hole, and is pressed against the molding material, whereby the concavo-convex pattern is formed on the molding material. And a through hole is formed at a position corresponding to the center hole when pressed against the molding material, and the through hole is smaller than the center hole.
  • an imprint mold that does not damage the formed pattern or the like by, for example, flowing a fluid such as gas or liquid into the through-hole when peeling from the molding material is realized. Since this imprint mold can be peeled off by applying pressure to the interface between the imprint mold and the molding material with a fluid, the pattern formed by the transfer is not damaged. In addition, since pressure can be uniformly applied to the interface between the imprint mold and the molding material, the imprint mold is less likely to be deformed or broken. In addition, since pressure is applied uniformly and concentrically from the center hole of the substrate base material to the outer periphery, pressure is applied in order from the center of the substrate base material to the outer periphery. Peel evenly.
  • the molding material on both main surfaces of the substrate base material since pressure is applied by the fluid from the center hole, the molding material on both main surfaces of the substrate base material, even if the imprint mold has a structure in which the substrate base material on which the molding material is formed on both main surfaces is sandwiched The imprint mold is peeled off uniformly. Therefore, the pattern is hardly damaged.
  • An information recording medium substrate manufacturing method is an information recording medium substrate manufacturing method using the imprint mold, wherein the molding is performed on a surface of the substrate base material or a pattern surface of the imprint mold.
  • a step of applying a material; a step of pressing the imprint mold against the substrate base material with the molding material interposed therebetween; and the center hole and the through hole after pressing the imprint mold against the molding material And a step of peeling the imprint mold from the molding material by injecting a fluid into the mold and applying pressure to the surface of the imprint mold facing the center hole.
  • the imprint mold when the imprint mold is peeled off from the molding material, it is peeled off by applying a pressure to the interface between the imprint mold and the molding material, so that the pattern formed by the transfer may be damaged. Absent.
  • pressure can be uniformly applied to the interface between the imprint mold and the molding material, this manufacturing method is unlikely to cause pattern deformation or destruction.
  • pressure is applied uniformly and concentrically from the center hole of the substrate base material toward the outer periphery, pressure is applied in order from the center of the substrate base material to the outer periphery. The imprint mold is peeled uniformly.
  • the molding material on both main surfaces of the substrate base material since pressure is applied by the fluid from the center hole, the molding material on both main surfaces of the substrate base material, even if the imprint mold has a structure in which the substrate base material on which the molding material is formed on both main surfaces is sandwiched The imprint mold is peeled off uniformly. Therefore, in this manufacturing method, the pattern is hardly damaged.
  • a pattern can be formed on both surfaces of the substrate base material by transfer.
  • the imprint mold is used to simultaneously form an uneven pattern of the molding material on one surface of the substrate base material with the imprint mold. Is to form a concavo-convex pattern of the molding material on the other surface of the substrate base material by a second imprint mold which is different in that no through hole is formed.
  • a pattern can be formed on both surfaces of the substrate base material by transfer.
  • the fluid is water.
  • the fluid is air or nitrogen.

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  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

Provided is an imprint mold having a through hole at a position corresponding to a center hole of a substrate base when the imprint mold is pressed to a molding material.  The through hole is smaller than the center hole. Provided also is an information recording medium substrate manufacturing method using the aforementioned imprint mold.  After the imprint mold is pressed to the molding material, a fluid is introduced into the center hole and the through hole and pressure is applied to the surface of the imprint mold facing the center hole so as to separate the imprint mold from the molding material.  Thus, the imprint mold and the information recording medium substrate manufacturing method using the imprint mold enable easy separation of the mold without scratching the substrate.

Description

インプリント型およびそれを用いた情報記録媒体基板の製造方法Imprint type and information recording medium substrate manufacturing method using the same
　本発明は、微細構造のパターン転写するためのインプリント型およびそれを用いた情報記録媒体基板の製造方法に関する。 The present invention relates to an imprint mold for transferring a microstructure pattern and a method for manufacturing an information recording medium substrate using the same.
　磁気記録媒体において、記録密度をより高度化するために、磁性層をパターニングして磁性層を複数の領域に物理的に分割したパターンドメディア（以下、ＰＭという）が提案されている。ＰＭ用の微細構造は数十ｎｍ程度のオーダーであり、これは光の回折限界と同等のパターンサイズである。そのため、一般的なフォトリソグラフィによる微細構造では、ＰＭのパターンの作製は困難である。そこで、さらに微細加工が可能な方法として、例えば、ナノインプリント法によってパターンを形成する方法が提案されている。ナノインプリント法は、表面に凹凸形状を有する型を、基板基材上に塗布したインプリント材料に押し付けること等によって、上記型の凹凸形状をインプリント材料に転写させ、凹凸形状の転写されたインプリント材料を固化させた後に型を剥離することによって、表面に凹凸形状を有する基板を得る方法である。ナノインプリント法は、例えば、特許文献１に記載されている。特許文献１には、平坦な基板上に被転写体（インプリント材料の層）を形成する工程と、凹凸構造を有するモールド（型）を被転写体に接触させ加圧する工程と、前記モールドの凹凸構造を前記被転写体に転写する工程と、前記モールドを被転写体から剥離する工程と、前記モールドの凹凸構造が転写された被転写体上に磁気記録層を堆積する工程とを有する磁気記録媒体の製造方法が記載されている。 In order to further increase the recording density of magnetic recording media, patterned media (hereinafter referred to as PM) in which a magnetic layer is patterned and the magnetic layer is physically divided into a plurality of regions have been proposed. The fine structure for PM is on the order of several tens of nm, which is a pattern size equivalent to the diffraction limit of light. For this reason, it is difficult to produce a PM pattern with a fine structure by general photolithography. Therefore, as a method capable of further fine processing, for example, a method of forming a pattern by a nanoimprint method has been proposed. In the nanoimprint method, by pressing a mold having a concavo-convex shape on the surface against an imprint material applied on a substrate substrate, the concavo-convex shape of the mold is transferred to the imprint material, and the concavo-convex shape transferred imprint This is a method for obtaining a substrate having a concavo-convex shape on the surface by peeling the mold after solidifying the material. The nanoimprint method is described in Patent Document 1, for example. Patent Document 1 discloses a step of forming a transfer target (imprint material layer) on a flat substrate, a step of bringing a mold (mold) having a concavo-convex structure into contact with the transfer target, and pressurizing. Magnetic having a step of transferring a concavo-convex structure to the transferred body, a step of peeling the mold from the transferred body, and a step of depositing a magnetic recording layer on the transferred body having the concavo-convex structure of the mold transferred. A method for manufacturing a recording medium is described.
　このように、ナノインプリント法を用いることで、ＰＭにおいて必要とされる、光の回折限界を超えた領域のパターンサイズであっても加工できる。しかし、ナノインプリント法においては、被転写体に型を転写した際に、型と被転写体とが強固に密着しているため、型を剥離することが困難である。また、剥離時の力のかかり方によっては、せっかく転写した微細構造が破壊されたり、変形したりする可能性がある。そこで、このような問題が生じないような型の剥離方法が種々提案されており、例えば、特許文献２および特許文献３に記載の方法がある。 As described above, by using the nanoimprint method, it is possible to process even a pattern size in a region exceeding the diffraction limit of light, which is required in PM. However, in the nanoimprint method, when the mold is transferred to the transfer target, the mold and the transfer target are in close contact with each other, so that it is difficult to peel off the mold. Depending on how the force is applied at the time of peeling, the transferred fine structure may be destroyed or deformed. Accordingly, various types of peeling methods that do not cause such problems have been proposed. For example, there are methods described in Patent Document 2 and Patent Document 3.
　特許文献２には、ピンモジュールをインプリント成形完成後の型と基板の間に挿入し、型と基板の局部を分離させてスリットを形成し、外界の空気をこのスリットより型と基板の間に流入させることにより、型から基板を分離させる方法が記載されている。また、特許文献３には、凹凸パターンを形成するためのインプリントモールド（型）において、凹凸パターンが形成されている面の凹凸パターン領域外に複数の貫通孔が形成され、基板とインプリントモールドとの間でパターン形成した後に、ピンあるいはガスにより、貫通孔から基板に圧力を加えることにより型を剥離する方法が記載されている。 In Patent Document 2, a pin module is inserted between a mold and a substrate after imprint molding is completed, and a slit is formed by separating a part of the mold and the substrate, and external air is passed between the mold and the substrate through this slit. Describes a method of separating the substrate from the mold by flowing it into the mold. Further, in Patent Document 3, in an imprint mold (mold) for forming a concavo-convex pattern, a plurality of through holes are formed outside the concavo-convex pattern region on the surface on which the concavo-convex pattern is formed, and the substrate and the imprint mold A method is described in which a mold is peeled off by applying pressure from a through-hole to a substrate with a pin or gas after forming a pattern between them.
　しかし、上述の特許文献２に記載の方法は、インプリント成形完成後の型と基板との間にピンモジュールを挿入し、物理的な力で、型と基板の間に隙間を発生させて型の剥離を行うため、ピンモジュールが基板に接触した際に、ピンモジュールによって基板に傷が入る可能性が高い。特に、ＰＭが用いられるハードディスクドライブ（以下、ＨＤＤという）においては、ＨＤＤ基板とデータの読み取りヘッドとの間隔が１０ｎｍ程度しかなく、ＨＤＤ基板の表面に傷などによる突起が存在すると、その部分でヘッドと接触し、ヘッドやＨＤＤ基板が破壊される、いわゆるヘッドクラッシュが起こる。そのため、基板上の傷は、たとえ微小な傷であっても、問題になる場合が多い。 However, in the method described in Patent Document 2 described above, a pin module is inserted between the mold after imprint molding is completed and the substrate, and a gap is generated between the mold and the substrate by physical force. Therefore, when the pin module comes into contact with the substrate, there is a high possibility that the substrate is damaged by the pin module. In particular, in a hard disk drive (hereinafter referred to as HDD) using PM, the distance between the HDD substrate and the data reading head is only about 10 nm, and there is a protrusion due to scratches on the surface of the HDD substrate. The head and the HDD substrate are destroyed, so-called head crash occurs. Therefore, the scratches on the substrate are often a problem even if they are minute scratches.
　また、特許文献３に記載の方法では、複数の貫通孔から基板に加える圧力を均一しなければバランスが悪くなり、パターンの破損や変形が生じる可能性がある。複数の貫通孔から均一な圧力をかけることは、容易ではなく、この点に課題がある。 Further, in the method described in Patent Document 3, if the pressure applied to the substrate from the plurality of through holes is not uniform, the balance is deteriorated, and the pattern may be damaged or deformed. It is not easy to apply uniform pressure from a plurality of through holes, and there is a problem in this respect.
特開２００７－９５１６２号公報JP 2007-95162 A 特開２００７－１１８５５２号公報JP 2007-118552 A 特開２００８－７８５５０号公報JP 2008-78550 A
　本発明は、上述の事情に鑑みて為された発明であり、その目的は、基板に傷を付けることが無く、容易に剥離可能なインプリント型およびそれを用いた情報記録媒体基板の製造方法を提供することである。 The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an imprint mold that can be easily peeled off without scratching the substrate, and a method for manufacturing an information recording medium substrate using the same. Is to provide.
　本発明にかかるインプリント型は、成形材料に押し付けられた際に基板基材の中心孔に対応する箇所に貫通孔が形成されており、当該貫通孔は、前記中心孔よりも小さい。そして、本発明にかかる情報記録媒体基板の製造方法は、上述のインプリント型を用い、成形材料にこのインプリント型を押し付けた後に、前記中心孔及び前記貫通孔に流体を流入させて、前記中心孔に面する前記インプリント型の表面に圧力をかけることで、成形材料からインプリント型を剥離させる。このため、本発明にかかるインプリント型、および、これを用いた情報記録媒体基板の製造方法は、基板に傷を付けることが無く、容易に剥離することができる。 The imprint mold according to the present invention has a through hole formed at a position corresponding to the central hole of the substrate base material when pressed against the molding material, and the through hole is smaller than the central hole. And the manufacturing method of the information recording medium board | substrate concerning this invention uses the above-mentioned imprint type | mold, presses this imprint type | mold against a molding material, makes a fluid flow in into the said center hole and the said through-hole, The imprint mold is peeled from the molding material by applying pressure to the surface of the imprint mold facing the central hole. For this reason, the imprint type according to the present invention and the method for manufacturing an information recording medium substrate using the same can be easily peeled without scratching the substrate.
　上記並びにその他の本発明の目的、特徴及び利点は、以下の詳細な記載と添付図面から明らかになるであろう。 The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.
本発明の実施形態に係るインプリント型の構成を示す断面図である。It is sectional drawing which shows the structure of the imprint type | mold which concerns on embodiment of this invention. 図１に示すインプリント型を用いた情報記録媒体基板の製造工程を示す図であって、図２（Ａ）～図２（Ｅ）は各工程を示す図である。FIG. 2 is a diagram showing manufacturing steps of an information recording medium substrate using the imprint mold shown in FIG. 1, and FIGS. 2A to 2E are diagrams showing each step. 本発明の他の実施形態に係るインプリント型の構成を示す断面図である。It is sectional drawing which shows the structure of the imprint type | mold which concerns on other embodiment of this invention. 図３に示すインプリント型を用いた情報記録媒体基板の製造工程を示す図であって、図４（Ａ）～図４（Ｇ）は各工程を示す図である。FIGS. 4A to 4G are diagrams showing manufacturing steps of the information recording medium substrate using the imprint mold shown in FIG. 3, and FIGS. 比較例１におけるインプリント型の離型について説明するための図である。It is a figure for demonstrating the imprint mold release in the comparative example 1. FIG. 比較例２におけるインプリント型について説明するための図であって、図６（Ａ）はインプリント型の平面図であり、図６（Ｂ）は図６（Ａ）のＢ－Ｂ’矢視断面図であり、図６（Ｃ）は離型について説明するための図である。FIGS. 6A and 6B are diagrams for explaining an imprint mold in Comparative Example 2, in which FIG. 6A is a plan view of the imprint mold, and FIG. 6B is a view taken along the line BB ′ in FIG. FIG. 6C is a cross-sectional view, and FIG. 6C is a view for explaining mold release.
　以下、本発明にかかる実施の一形態を図面に基づいて説明する。なお、各図において同一の符号を付した構成は、同一の構成であることを示し、適宜、その説明を省略する。 Hereinafter, an embodiment according to the present invention will be described with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted suitably.
　まず、本発明の実施の形態に係るインプリント型について、図１を用いて説明する。図１は、本発明の実施形態に係るインプリント型の構成を示す断面図である。図１に示すように、本実施の形態に係るインプリント型１０は、上型１および下型２を有して構成される。上型１および下型２には、インプリント材料（成形材料）に凹凸パターンを形成するための微細構造である転写用パターン１ｂおよび２ｂが形成されている。また、上型１は、このインプリント型１０でその凹凸パターンが形成される情報記録媒体基板のパターン形成工程において、基板基材の中心孔に当たる箇所に貫通孔１ａが形成されている。上型１に貫通孔１ａが形成されているため、パターン形成工程において、インプリント材料とインプリント型１０とが密着している状態において、この貫通孔１ａから流体である液体あるいは気体等を流入させることで、インプリント材料からインプリント型１０を均一に剥離し、容易にインプリント型１０を離型できる。なお、パターン形成工程とは、インプリント型１０がインプリント材料に押し付けられている工程であり、インプリント材料に転写用パターン１ｂおよび２ｂが転写されて、インプリント材料が凹凸パターン状となっている状態である。なお、貫通孔１ａは、基板基材の中心孔に当たる箇所の範囲内に位置していればよく、その大きさは中心孔よりも小さい。中心孔とインプリント型１０の外部との間を貫通させるものであればよい。また、貫通孔１ａは複数であってもよい。また、下型２にも貫通孔が形成されていてもよい。いずれの場合も、上型１および下型２共に容易に剥離することができる。なお、転写用パターン１ｂおよび２ｂは、どちらか一方のみ形成されていてもよい。ただし、転写用パターン１ｂおよび２ｂは、情報記録媒体基板の凹凸パターンとして転写されるので、転写用パターン１ｂおよび２ｂのどちらか一方のみが形成されている場合には、片面のみしか凹凸パターンが形成されていない情報記録媒体基板が製造される。 First, an imprint type according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view showing the configuration of an imprint mold according to an embodiment of the present invention. As shown in FIG. 1, an imprint mold 10 according to the present embodiment includes an upper mold 1 and a lower mold 2. The upper mold 1 and the lower mold 2 are formed with transfer patterns 1b and 2b, which are fine structures for forming an uneven pattern on the imprint material (molding material). Further, in the upper mold 1, through holes 1 a are formed at locations corresponding to the center holes of the substrate base material in the pattern forming process of the information recording medium substrate on which the uneven pattern is formed by the imprint mold 10. Since the through-hole 1a is formed in the upper mold 1, in the pattern forming process, in a state where the imprint material and the imprint mold 10 are in close contact with each other, a liquid or gas that is a fluid flows from the through-hole 1a. By doing so, the imprint mold 10 can be uniformly peeled from the imprint material, and the imprint mold 10 can be easily released. The pattern forming process is a process in which the imprint mold 10 is pressed against the imprint material, and the imprint material is transferred with the transfer patterns 1b and 2b, so that the imprint material has a concavo-convex pattern. It is in a state. In addition, the through-hole 1a should just be located in the range of the location which hits the center hole of a board | substrate base material, and the magnitude | size is smaller than a center hole. What is necessary is just to penetrate between the center hole and the outside of the imprint mold 10. Moreover, the through-hole 1a may be plural. Moreover, a through hole may be formed in the lower mold 2. In either case, both the upper mold 1 and the lower mold 2 can be easily peeled off. Note that only one of the transfer patterns 1b and 2b may be formed. However, since the transfer patterns 1b and 2b are transferred as an uneven pattern on the information recording medium substrate, when only one of the transfer patterns 1b and 2b is formed, the uneven pattern is formed only on one side. An unrecorded information recording medium substrate is manufactured.
　なお、インプリント型１０は射出成形、ドライエッチング、ウェットエッチング、フォトリソグラフィ、電子線描画（電子線リソグラフィ）、インプリント法等の公知の技術により作製すればよい。なお、例えば、射出成型等を用いる場合は、転写用パターン１ｂおよび２ｂを形成する際に、同時に貫通孔１ａが形成されればよい。また、転写用パターン１ｂおよび２ｂを形成後に、機械加工等により貫通孔１ａが形成されてもよい。 The imprint mold 10 may be manufactured by a known technique such as injection molding, dry etching, wet etching, photolithography, electron beam drawing (electron beam lithography), imprint method, or the like. For example, when injection molding or the like is used, the through-hole 1a may be formed simultaneously when forming the transfer patterns 1b and 2b. Further, after forming the transfer patterns 1b and 2b, the through holes 1a may be formed by machining or the like.
　次に、本実施形態に係るインプリント型を用いた情報記録媒体基板の製造方法について説明する。図２は、本実施形態に係るインプリント型を用いた情報記録媒体基板の製造工程を示す図であって、図２（Ａ）～図２（Ｅ）は各工程を示す図である。図２（Ａ）に示すように、上型１および下型２が基板基材であるガラス基板３を挟むように配置される。転写用パターン１ｂおよび２ｂは、ガラス基板３側となるように配置されている。なお、基板基材は、表面上に微細な複数の凹凸形状を有する構造材料からなる表面部を備えることによって、ＰＭ用の基板等の基板を形成することができる基材であれば、特に制限されない。例えば、ガラス基板の代わりに石英基板等が用いられてもよい。ガラス基板３としては、例えば、ＨＤＤ用２．５インチガラス基板等が挙げられる。 Next, a method for manufacturing an information recording medium substrate using the imprint mold according to this embodiment will be described. FIG. 2 is a diagram showing manufacturing steps of the information recording medium substrate using the imprint type according to the present embodiment, and FIGS. 2A to 2E are diagrams showing each step. As shown in FIG. 2A, the upper mold 1 and the lower mold 2 are arranged so as to sandwich a glass substrate 3 as a substrate base material. The transfer patterns 1b and 2b are arranged on the glass substrate 3 side. In addition, especially if a substrate base material is a base material which can form a board | substrate, such as a board | substrate for PM, by providing the surface part which consists of a structural material which has several fine uneven | corrugated shape on the surface, it will restrict | limit. Not. For example, a quartz substrate or the like may be used instead of the glass substrate. Examples of the glass substrate 3 include a 2.5-inch glass substrate for HDD.
　次に、図２（Ｂ）に示すように、ガラス基板３の上面であって凹凸パターンが形成される箇所および下型２の上面であって転写用パターン２ｂが形成されている箇所にインプリント材料４が塗布される。インプリント材料４としては、例えば、スピンオングラス(ＳＯＧ)材料が用いれる。塗布方法は、公知の塗布方法を用いればよく、例えば、ディスペンサ等による滴下塗布であってもよいし、スピンコート法やディップコート法等であってもよいし、ワイヤーバー及びアプリケータ等を用いて塗り広げる方法であってもよい。 Next, as shown in FIG. 2B, imprinting is performed on the upper surface of the glass substrate 3 where the uneven pattern is formed and on the upper surface of the lower mold 2 where the transfer pattern 2b is formed. Material 4 is applied. As the imprint material 4, for example, a spin-on-glass (SOG) material is used. The coating method may be a known coating method, for example, drop coating with a dispenser or the like, spin coating or dip coating, or a wire bar and applicator. It may be a method of spreading.
　次に、図２（Ｃ）に示すように、上型１および下型２により、上下からインプリント材料４を含むガラス基板３が所定の押圧力で挟み込まれる。そして、インプリント材料４が乾燥される。そうすることによって、インプリント材料４が固化され、転写用パターン１ｂおよび２ｂがインプリント材料４に転写される。つまり、凹凸パターンがインプリント材料４に形成される。乾燥方法は、特に制限なく、公知の乾燥方法を用いることができる。例えば、室温で放置してもよいが、さらに、減圧、送風及び加熱等を行うと、乾燥をより早める点から好ましい。また、加熱を行う場合、加熱温度をインプリント材料４の溶媒の沸点を超えないようにすることが好ましい。そうすることによって、インプリント材料４が沸騰せず、インプリント材料４内部に気泡が残存する可能性が低くなるため、凹凸形状の転写不良の発生が抑制される。また、図２（Ｃ）に示すように、貫通孔１ａは、基材基板であるガラス基板３の中心孔７に当たる箇所に位置する。なお、例えば、ガラス基板３がＨＤＤ用２．５インチガラス基板である場合は、外径が６５ｍｍであり、内径が２０ｍｍであるドーナッツ形状をしている。したがって、中心孔７の径は２０ｍｍである。貫通孔１ａはこの中心孔７の径２０ｍｍの箇所に対応した領域に形成されている。貫通孔１ａは中心孔７の径２０ｍｍよりも小さい大きさの円形とされる。なお、貫通孔１は円形以外の形でもよい。また、この中心孔７の領域内であれば複数の貫通孔１ａが形成されていてもよい。また、貫通孔１ａは、途中で大きさが変わってもよいし、複数の貫通孔１ａが途中で１つの貫通孔１ａに結合されてもよい。また、貫通孔１ａは中心孔７とインプリント型１０との外部とを貫通させればよいことから、例えば、上型１および下型２の側面のように、上型１および下型２における転写用パターン１ｂおよび２ｂが形成された面およびその面と対向する面以外の面と中心孔７との間を貫通させてもよい。なお、製造のしやすさを考慮すると、貫通孔１ａは蛇行せずに直線状が好ましい。したがって、貫通孔１ａは中心孔７と上型１の外側主面との間を貫通するように形成されることが好ましい。 Next, as shown in FIG. 2C, the glass substrate 3 including the imprint material 4 is sandwiched from above and below by the upper mold 1 and the lower mold 2 with a predetermined pressing force. Then, the imprint material 4 is dried. By doing so, the imprint material 4 is solidified, and the transfer patterns 1 b and 2 b are transferred to the imprint material 4. That is, an uneven pattern is formed on the imprint material 4. The drying method is not particularly limited, and a known drying method can be used. For example, although it may be allowed to stand at room temperature, it is preferable to further reduce the pressure, blow, and heat from the viewpoint of faster drying. In addition, when heating is performed, it is preferable that the heating temperature does not exceed the boiling point of the solvent of the imprint material 4. By doing so, the imprint material 4 does not boil, and the possibility that bubbles remain inside the imprint material 4 is reduced, so that the occurrence of uneven transfer defects is suppressed. Moreover, as shown in FIG.2 (C), the through-hole 1a is located in the location which hits the center hole 7 of the glass substrate 3 which is a base material board | substrate. For example, when the glass substrate 3 is a 2.5-inch glass substrate for HDD, it has a donut shape with an outer diameter of 65 mm and an inner diameter of 20 mm. Therefore, the diameter of the center hole 7 is 20 mm. The through hole 1a is formed in a region corresponding to the 20 mm diameter portion of the central hole 7. The through-hole 1a is a circle having a size smaller than the diameter 20 mm of the center hole 7. The through hole 1 may have a shape other than a circle. Further, a plurality of through holes 1 a may be formed within the area of the center hole 7. In addition, the size of the through hole 1a may change in the middle, or a plurality of through holes 1a may be coupled to one through hole 1a in the middle. Further, since the through-hole 1a only needs to penetrate the center hole 7 and the outside of the imprint mold 10, for example, in the upper mold 1 and the lower mold 2 as in the side surfaces of the upper mold 1 and the lower mold 2 The center hole 7 may be penetrated between the surface on which the transfer patterns 1b and 2b are formed and a surface other than the surface facing the surface. In consideration of ease of manufacture, the through hole 1a is preferably linear without meandering. Therefore, the through hole 1 a is preferably formed so as to penetrate between the center hole 7 and the outer main surface of the upper mold 1.
　次に、図２（Ｄ）に示すように、貫通孔１ａに流体である気体５が流入される。それにより、貫通孔１ａおよび中心孔７に圧力がかかり、上型１および下型２と、インプリント材料４との界面に圧力がかかることから、上型１および下型２がインプリント材料４から剥離される。特に、上型については、中心孔７に面する表面にも圧力がかかることによる。このとき、気体５により、各部に圧力がかかるため、上型１および下型２が均一な力で剥離され、中心孔７から同心円状に均一に離型される。それにより、インプリント材料４に形成された凹凸パターンが破壊されたり、変形したりすることがない。また、中心孔７から圧力がかかるため、上型１および下型２が略同時に剥離される。なお、気体５は、例えば空気、窒素のように、いずれの設備においても容易に使用することができる気体が好ましい。なお、気体５は、その他の気体が用いられてもよく、ガラス基板３およびインプリント材料４に形成された微細構造を侵食しないものであればよい。また、気体５の代わりに流体である液体が用いられてもよい。その場合であっても、均一に各部に圧力がかかるため、気体５と同様の効果を奏する。液体としては、容易に手に入ることから、例えば水が好ましいが、特に限定されることはなく、ガラス基板３およびインプリント材料４に形成された微細構造を侵食しないものであればよい。 Next, as shown in FIG. 2 (D), a gas 5 as a fluid flows into the through hole 1a. Thereby, pressure is applied to the through-hole 1a and the center hole 7, and pressure is applied to the interface between the upper mold 1 and the lower mold 2 and the imprint material 4, so that the upper mold 1 and the lower mold 2 are imprint material 4 Is peeled off. In particular, for the upper mold, pressure is also applied to the surface facing the center hole 7. At this time, since pressure is applied to each part by the gas 5, the upper mold 1 and the lower mold 2 are peeled off with a uniform force, and are released from the center hole 7 in a concentric manner. Thereby, the concavo-convex pattern formed on the imprint material 4 is not destroyed or deformed. Further, since pressure is applied from the center hole 7, the upper mold 1 and the lower mold 2 are peeled off substantially simultaneously. The gas 5 is preferably a gas that can be easily used in any facility, such as air or nitrogen. As the gas 5, other gases may be used as long as they do not erode the microstructure formed on the glass substrate 3 and the imprint material 4. Further, a liquid that is a fluid may be used instead of the gas 5. Even in that case, since the pressure is uniformly applied to each part, the same effect as the gas 5 is obtained. As the liquid, water is preferable because it can be easily obtained, but is not particularly limited as long as it does not erode the microstructure formed on the glass substrate 3 and the imprint material 4.
　次に、図２（Ｅ）に示すように、インプリント材料４上に磁性膜６を成膜することで、表面に凹凸パターン６ａが形成された情報記録媒体基板８が製造される。なお、磁性膜６としては、例えばＣｏＣｒＰｔやＦｅＰｔが用いられる。 Next, as shown in FIG. 2 (E), a magnetic film 6 is formed on the imprint material 4 to manufacture an information recording medium substrate 8 having an uneven pattern 6a formed on the surface. As the magnetic film 6, for example, CoCrPt or FePt is used.
　次に、上記説明した本発明の実施形態とは異なる、本発明の他の実施形態に係るインプリント型およびそれを用いた情報記録媒体基板の製造方法について説明する。図３は、本発明の他の実施形態に係るインプリント型の構成を示す断面図である。図４は、本発明の他の実施形態に係るインプリント型を用いた情報記録媒体基板の製造工程を示す図であって、図４（Ａ）～図４（Ｇ）は各工程を示す図である。なお、図３および図４において、図１および図２と同一の符号を付した構成は、同一の構成であることを示し、その説明を省略する。 Next, an imprint mold according to another embodiment of the present invention, which is different from the above-described embodiment of the present invention, and an information recording medium substrate manufacturing method using the same will be described. FIG. 3 is a cross-sectional view showing the configuration of an imprint mold according to another embodiment of the present invention. FIG. 4 is a diagram showing a manufacturing process of an information recording medium substrate using an imprint type according to another embodiment of the present invention, and FIGS. 4 (A) to 4 (G) are diagrams showing each process. It is. 3 and 4, the same reference numerals as those in FIGS. 1 and 2 indicate the same configuration, and the description thereof is omitted.
　まず、本発明の他の実施形態に係るインプリント型の構成について、図３を用いて説明する。図３に示すように、本発明の他の実施形態に係るインプリント型２０は、上型１１および下型１２を有して構成される。上型１１および下型１２には、インプリント材料に凹凸パターンを形成するための微細構造である転写用パターン１１ｂおよび１２ｂが形成されている。また、上型１１および下型１２は、このインプリント型２０でその凹凸パターンが形成される情報記録媒体基板のパターン形成工程において、基板基材の中心孔に当たる箇所に貫通孔１１ａおよび１２ａが形成されている。上型１１および下型１２に貫通孔１１ａおよび１２ａが形成されているため、パターン形成工程において、インプリント材料とインプリント型２０とが密着している状態において、この貫通孔１１ａおよび１２ａから、例えば液体あるいは気体等の流体を流入させることで、インプリント材料からインプリント型２０を均一に剥離し、容易にインプリント型２０を離型できる。なお、貫通孔１１ａおよび１２ａは、基板基材の中心孔に当たる箇所の範囲内に位置していればよく、その大きさは中心孔よりも小さい。また、貫通孔１１ａおよび１２ａはそれぞれ複数であってもよい。なお、転写用パターン１１ｂおよび１２ｂは、どちらか一方のみ形成されていてもよい。ただし、転写用パターン１１ｂおよび１２ｂは、情報記録媒体基板の凹凸パターンとして転写されるので、転写用パターン１１ｂおよび１２ｂのどちらか一方のみが形成されている場合には、片面のみにしか凹凸パターンが形成されていない情報記録媒体基板が製造される。 First, an imprint configuration according to another embodiment of the present invention will be described with reference to FIG. As shown in FIG. 3, an imprint mold 20 according to another embodiment of the present invention includes an upper mold 11 and a lower mold 12. The upper mold 11 and the lower mold 12 are formed with transfer patterns 11b and 12b, which are fine structures for forming an uneven pattern on the imprint material. Further, in the upper mold 11 and the lower mold 12, through holes 11a and 12a are formed at locations corresponding to the center hole of the substrate base material in the pattern forming process of the information recording medium substrate in which the uneven pattern is formed by the imprint mold 20. Has been. Since the through holes 11a and 12a are formed in the upper mold 11 and the lower mold 12, in a state where the imprint material and the imprint mold 20 are in close contact with each other in the pattern forming process, the through holes 11a and 12a For example, by flowing a fluid such as liquid or gas, the imprint mold 20 can be uniformly peeled from the imprint material, and the imprint mold 20 can be easily released. The through holes 11a and 12a only need to be located within the range of the location corresponding to the center hole of the substrate base material, and the size thereof is smaller than that of the center hole. Further, there may be a plurality of through holes 11a and 12a. Note that only one of the transfer patterns 11b and 12b may be formed. However, since the transfer patterns 11b and 12b are transferred as an uneven pattern of the information recording medium substrate, when only one of the transfer patterns 11b and 12b is formed, the uneven pattern is formed only on one side. An information recording medium substrate that is not formed is manufactured.
　なお、インプリント型２０は、射出成形、ドライエッチング、ウェットエッチング、フォトリソグラフィ、電子線描画（電子線リソグラフィ）等の公知の技術により作製すればよい。なお、貫通孔１１ａおよび１２ａは転写用パターン１１ｂおよび１２ｂと同一の工程により形成されてもよいし、転写用パターン１１ｂおよび１２ｂを形成後に、機械加工等により形成されてもよい。 The imprint mold 20 may be manufactured by a known technique such as injection molding, dry etching, wet etching, photolithography, electron beam drawing (electron beam lithography). The through holes 11a and 12a may be formed by the same process as the transfer patterns 11b and 12b, or may be formed by machining or the like after the transfer patterns 11b and 12b are formed.
　次に、本発明の他の実施形態に係るインプリント型を用いた情報記録媒体基板の製造方法について図４を用いて説明する。なお、この製造方法においては、光インプリント法が用いられている。図４（Ａ）に示すように、上型１１および下型１２が、両主面に磁性膜１４が成膜された基板基材であるガラス基板３を挟むように配置される。転写用パターン１１ｂおよび１２ｂは、磁性膜１４側となるように配置されている。なお、磁性膜１４としては、例えばＣｏＣｒＰｔやＦｅＰｔが用いられる。 Next, a method for manufacturing an information recording medium substrate using an imprint type according to another embodiment of the present invention will be described with reference to FIG. In this manufacturing method, an optical imprint method is used. As shown in FIG. 4A, the upper mold 11 and the lower mold 12 are arranged so as to sandwich the glass substrate 3 which is a substrate base material having a magnetic film 14 formed on both main surfaces. The transfer patterns 11b and 12b are arranged so as to be on the magnetic film 14 side. As the magnetic film 14, for example, CoCrPt or FePt is used.
　次に、図４（Ｂ）に示すように、磁性膜１４を含むガラス基板３の上面であって凹凸パターンが形成される箇所および下型１２の上面であって転写用パターン１２ｂが形成されている箇所にインプリント材料１５が塗布される。光インプリント法を用いていることから、インプリント材料１５としては、例えば、光硬化性樹脂材料が用いられる。塗布方法は、公知の塗布方法を用いればよく、例えば、ディスペンサ等による滴下塗布であってもよいし、スピンコート法やディップコート法等であってもよいし、ワイヤーバー及びアプリケータ等を用いて塗り広げる方法であってもよい。 Next, as shown in FIG. 4B, the transfer pattern 12b is formed on the upper surface of the glass substrate 3 including the magnetic film 14 where the concave / convex pattern is formed and on the upper surface of the lower mold 12. The imprint material 15 is applied to the location. Since the photoimprint method is used, as the imprint material 15, for example, a photocurable resin material is used. The coating method may be a known coating method, for example, drop coating with a dispenser or the like, spin coating or dip coating, or a wire bar and applicator. It may be a method of spreading.
　次に、図４（Ｃ）に示すように、上型１１および下型１２により、上下からインプリント材料１５、磁性膜１４を含むガラス基板３が所定の押圧力で挟み込まれる。そして、紫外光等の光が照射され、インプリント材料１５が硬化される。そうすることによって、インプリント材料１５が固化され、転写用パターン１１ｂおよび１２ｂがインプリント材料１５に転写される（光インプリント法）。つまり、凹凸パターンがインプリント材料１５に形成される。また、図４（Ｃ）に示すように、貫通孔１１ａおよび１２ａは、基板基材であるガラス基板３の中心孔１７に当たる箇所に位置する。なお、例えば、ガラス基板３がＨＤＤ用２．５インチガラス基板である場合は、外径が６５ｍｍであり、内径が２０ｍｍであるドーナッツ形状をしている。したがって、中心孔１７の径は２０ｍｍである。貫通孔１１ａおよび１２ａはこの中心孔１７の径２０ｍｍの箇所に対応した領域に形成されている。貫通孔１１ａおよび１２ａは中心孔１７の径２０ｍｍよりも小さい円形とされる。なお、貫通孔１１ａおよび１２ａは、円形以外の形であってもよい。また、この領域内であれば上型１１および下型１２のそれぞれに複数の貫通孔１１ａおよび１２ａが形成されていてもよい。また、貫通孔１１ａおよび１２ａは、途中で大きさが変わってもよいし、それぞれ複数の貫通孔１１ａおよび１２ａが途中で１つの貫通孔１１ａおよび１２ａに結合されてもよい。また、貫通孔１１ａおよび１２ａは中心孔１７とインプリント型２０との外部とを貫通させればよいことから、例えば、上型１１および下型１２の側面のように、上型１１および下型１２における転写用パターン１１ｂおよび１２ｂが形成された面およびその面と対向する面以外の面と中心孔１７との間を貫通させていてもよい。なお、製造のしやすさを考慮すると、貫通孔１１ａおよび１２ａは蛇行せずに直線状が好ましい。したがって、貫通孔１１ａおよび１２ａはそれぞれ中心孔１７と上型１１および下型１２の外側主面との間を貫通するように形成されることが好ましい。 Next, as shown in FIG. 4C, the glass substrate 3 including the imprint material 15 and the magnetic film 14 is sandwiched from above and below by the upper mold 11 and the lower mold 12 with a predetermined pressing force. Then, light such as ultraviolet light is irradiated to cure the imprint material 15. By doing so, the imprint material 15 is solidified, and the transfer patterns 11b and 12b are transferred to the imprint material 15 (optical imprint method). That is, an uneven pattern is formed on the imprint material 15. Moreover, as shown in FIG.4 (C), the through- holes 11a and 12a are located in the location which hits the center hole 17 of the glass substrate 3 which is a substrate base material. For example, when the glass substrate 3 is a 2.5-inch glass substrate for HDD, it has a donut shape with an outer diameter of 65 mm and an inner diameter of 20 mm. Therefore, the diameter of the center hole 17 is 20 mm. The through holes 11a and 12a are formed in a region corresponding to the 20 mm diameter portion of the center hole 17. The through holes 11a and 12a have a circular shape smaller than the diameter 20 mm of the center hole 17. The through holes 11a and 12a may have a shape other than a circle. Further, a plurality of through holes 11 a and 12 a may be formed in each of the upper mold 11 and the lower mold 12 within this region. Further, the sizes of the through holes 11a and 12a may be changed in the middle, and the plurality of through holes 11a and 12a may be coupled to one through hole 11a and 12a in the middle. Further, since the through holes 11a and 12a only need to penetrate the center hole 17 and the outside of the imprint mold 20, the upper mold 11 and the lower mold, for example, as the side surfaces of the upper mold 11 and the lower mold 12 are used. 12 may be formed between the center hole 17 and a surface other than the surface on which the transfer patterns 11b and 12b are formed and the surface facing the surface. In consideration of ease of manufacture, the through holes 11a and 12a are preferably linear without meandering. Therefore, the through holes 11a and 12a are preferably formed to penetrate between the center hole 17 and the outer main surfaces of the upper mold 11 and the lower mold 12, respectively.
　次に、図４（Ｄ）に示すように、貫通孔１１ａおよび１２ａに流体である気体１６が流入される。それにより、貫通孔１１ａおよび１２ａと、中心孔１７とに圧力がかかり、上型１１および下型１２の中心孔１７に面する表面にも圧力がかかることになる。したがって、上型１１および下型１２と、インプリント材料１５との界面に圧力がかかることから、上型１１および下型１２がインプリント材料１５から剥離される。このとき、気体１６により、各部に圧力がかかるため、上型１１および下型１２が均一な力で剥離され、中心孔１７から同心円状に均一に離型される。それにより、インプリント材料１５に形成された凹凸パターンが破壊されたり、変形したりすることがない。また、中心孔１７から圧力がかかるため、上型１および下型１２が略同時に剥離される。なお、気体１６は、例えば空気、窒素のように、いずれの設備においても容易に使用することができる気体であることが好ましい。なお、気体１６は、その他の気体が用いられてもよく、ガラス基板３およびインプリント材料１５に形成された微細構造を侵食しないものであればよい。また、気体１６の代わりに流体である液体としてもよい。その場合であっても、均一に各部に圧力がかかるため、気体１６と同様の効果を奏する。液体としては、容易に手に入ることから、例えば水が好ましいが、特に限定されることはなく、ガラス基板３、磁性膜１４およびインプリント材料１５に形成された微細構造を侵食しないものであればよい。なお、気体１６は貫通孔１１ａおよび１２ａの両方から流入されなくても、中心孔１７内に圧力がかかるのであれば、どちらか一方から流入させ、他方から排出させる構成であってもよい。 Next, as shown in FIG. 4D, a gas 16 that is a fluid flows into the through holes 11a and 12a. Thereby, pressure is applied to the through holes 11 a and 12 a and the center hole 17, and pressure is also applied to the surfaces of the upper mold 11 and the lower mold 12 facing the center hole 17. Accordingly, pressure is applied to the interface between the upper mold 11 and the lower mold 12 and the imprint material 15, so that the upper mold 11 and the lower mold 12 are peeled from the imprint material 15. At this time, since pressure is applied to each part by the gas 16, the upper mold 11 and the lower mold 12 are peeled off with a uniform force, and are released from the central hole 17 uniformly in a concentric manner. Thereby, the concavo-convex pattern formed on the imprint material 15 is not destroyed or deformed. Further, since pressure is applied from the center hole 17, the upper mold 1 and the lower mold 12 are peeled off substantially simultaneously. Note that the gas 16 is preferably a gas that can be easily used in any facility, such as air or nitrogen. The gas 16 may be other gas as long as it does not erode the microstructure formed on the glass substrate 3 and the imprint material 15. Further, a liquid that is a fluid may be used instead of the gas 16. Even in such a case, since the pressure is uniformly applied to each part, the same effect as the gas 16 is obtained. As the liquid, for example, water is preferable because it can be easily obtained. However, the liquid is not particularly limited and may be any liquid that does not erode the fine structure formed on the glass substrate 3, the magnetic film 14, and the imprint material 15. That's fine. In addition, even if the gas 16 does not flow in from both the through holes 11a and 12a, as long as pressure is applied to the center hole 17, the gas 16 may flow from either one and be discharged from the other.
　次に、図４（Ｅ）に示すように、光硬化性樹脂であり、微細構造が形成されたインプリント材料１５を、例えば酸素を含むガスを用いてドライエッチングすることにより、磁性膜１４が露呈される。 Next, as shown in FIG. 4E, the imprint material 15 which is a photocurable resin and has a fine structure is dry-etched using, for example, a gas containing oxygen, so that the magnetic film 14 is formed. Exposed.
　次に、図４（Ｆ）に示すように、磁性膜１４上に残っているインプリント材料１５をマスクとして、例えばアルゴンを用いたドライエッチングにより、磁性膜１４をエッチングすることで、磁性膜１４に微細構造が形成される。 Next, as shown in FIG. 4F, the magnetic film 14 is etched by dry etching using, for example, argon using the imprint material 15 remaining on the magnetic film 14 as a mask. A fine structure is formed.
　次に、図４（Ｇ）に示すように、インプリント材料１５が除去され、表面の磁性膜１４に凹凸パターン１４ａが形成された情報記録媒体基板１８が製造される。 Next, as shown in FIG. 4 (G), the imprint material 15 is removed, and the information recording medium substrate 18 having the uneven pattern 14a formed on the magnetic film 14 on the surface is manufactured.
　以下に、上述の本発明の実施形態に係るインプリント型およびそれを用いた情報記録媒体基板の製造方法と、本発明の他の実施形態に係るインプリント型およびそれを用いた情報記録媒体基板の製造方法とについて具体的に実施した例（実施例１～３）について説明する。さらに、比較例としてのインプリント型およびそれを用いた情報記録媒体基板の製造方法を具体的に実施した例（比較例１、２）について説明する。 Hereinafter, an imprint mold according to the above-described embodiment of the present invention and a method of manufacturing an information recording medium substrate using the same, an imprint mold according to another embodiment of the present invention, and an information recording medium substrate using the same An example (Examples 1 to 3) in which the manufacturing method is specifically implemented will be described. Further, examples (Comparative Examples 1 and 2) in which an imprint type as a comparative example and an information recording medium substrate manufacturing method using the same are specifically described.
　（実施例１）
　図１および図２を参照しながら、実施例１について説明する。図１に示すように、まず、ポリメチルペンテン樹脂を用いて、射出成型にて微細構造を形成した上型１および下型２を備えて構成されるインプリント型１０が用いられた。上型１および下型２はそれぞれ外径６５ｍｍの円盤状とした。上型１の中心には、直径が１０ｍｍの貫通孔１ａが形成されていて、上型１はドーナッツ形状とした。微細構造である転写パターン１ｂおよび２ｂは上型１および下型２それぞれの片面に形成され、中心から半径１０ｍｍ以上の領域に形成されている。なお、貫通孔１ａおよび転写パターン１ｂおよび２ｂは射出成型により形成している。 Example 1
Example 1 will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, first, an imprint mold 10 including an upper mold 1 and a lower mold 2 in which a fine structure was formed by injection molding using polymethylpentene resin was used. The upper mold 1 and the lower mold 2 were each disk-shaped with an outer diameter of 65 mm. A through-hole 1a having a diameter of 10 mm is formed at the center of the upper mold 1, and the upper mold 1 has a donut shape. The transfer patterns 1b and 2b having a fine structure are formed on one side of each of the upper mold 1 and the lower mold 2, and are formed in a region having a radius of 10 mm or more from the center. The through holes 1a and the transfer patterns 1b and 2b are formed by injection molding.
　次に、ＨＤＤ用２．５インチガラス基板３(外径６５ｍｍ、内径２０ｍｍ)が用意され、このガラス基板３を上型１および下型２で挟むように配置された（図２（Ａ）参照）。そして、ガラス基板３上および下型２上に、インプリント材料４としてＳＯＧ材料であるＯＣＤ　Ｔ－１２　９００－Ｖ(東京応化工業株式会社製)の溶液が、それぞれ１００マイクロリットルずつディスペンサで塗布された（図２（Ｂ）参照）。なお、インプリント材料４は、下型２上については、転写用パターン２ｂが塗布され、ガラス基板３上については、パターン形成工程において転写用パターン１ｂに対応する箇所に塗布された。その後、上型１および下型２でガラス基板３を１ＭＰａで押圧した状態でインプリント材料４が乾燥、硬化された（図２（Ｃ）参照）。インプリント材料４が硬化後、貫通孔１ａを通して気体５である圧縮空気を封入し、離型を行ったところ、上型１および下型２が均一に離型できた（図２（Ｄ）参照）。 Next, a 2.5-inch glass substrate 3 for HDD (outer diameter 65 mm, inner diameter 20 mm) was prepared, and the glass substrate 3 was disposed so as to be sandwiched between the upper mold 1 and the lower mold 2 (see FIG. 2A). ). Then, a solution of OCD T-12 900-V (manufactured by Tokyo Ohka Kogyo Co., Ltd.) which is an SOG material as the imprint material 4 is applied on the glass substrate 3 and the lower mold 2 with a dispenser of 100 microliters each. (See FIG. 2B). The imprint material 4 was applied on the lower mold 2 with the transfer pattern 2b, and on the glass substrate 3, it was applied to a location corresponding to the transfer pattern 1b in the pattern forming step. Thereafter, the imprint material 4 was dried and cured in a state where the glass substrate 3 was pressed at 1 MPa with the upper mold 1 and the lower mold 2 (see FIG. 2C). After the imprint material 4 was cured, compressed air as the gas 5 was sealed through the through-hole 1a, and the mold was released. As a result, the upper mold 1 and the lower mold 2 could be uniformly released (see FIG. 2D). ).
　離型後のインプリント材料４に転写された凹凸パターンである微細構造が観察された。干渉計にてインプリント材料４の表面形状を観察した結果、特に物理的な傷等に起因する欠陥は見つからなかった。また、走査型電子顕微鏡（ＳＥＭ）、原子間力顕微鏡（ＡＦＭ）で微細構造を観察した結果、観察領域で微細構造の破壊等の欠陥は見つからなかった。 The fine structure which was the uneven | corrugated pattern transcribe | transferred to the imprint material 4 after mold release was observed. As a result of observing the surface shape of the imprint material 4 with an interferometer, no defects caused by physical scratches or the like were found. Moreover, as a result of observing the fine structure with a scanning electron microscope (SEM) or an atomic force microscope (AFM), no defects such as destruction of the fine structure were found in the observation region.
　最後に、このインプリント材料４上に磁性膜６が成膜され、パターンドメディア用ハードディスクドライブ基板（情報記録媒体基板８）とされた（図２（Ｅ）参照）。 Finally, a magnetic film 6 was formed on the imprint material 4 to form a patterned media hard disk drive substrate (information recording medium substrate 8) (see FIG. 2E).
　（実施例２）
　図３および図４を参照しながら、実施例２について説明する。図３に示すように、まず、ポリカーボネート樹脂を用いて、射出成型にて微細構造を形成した上型１１および下型１２を備えて構成されるインプリント型２０が用いられた。上型１１および下型１２はそれぞれ外径６５ｍｍの円盤状とした。上型１１および下型１２の中心には、直径が１０ｍｍの貫通孔１１ａおよび１２ａが形成されていて、上型１１および下型１２はドーナッツ形状とした。微細構造である転写パターン１１ｂおよび１２ｂは上型１および下型２それぞれの片面に形成され、中心から半径１０ｍｍ以上の領域に形成されている。 (Example 2)
Example 2 will be described with reference to FIGS. 3 and 4. As shown in FIG. 3, first, an imprint mold 20 including an upper mold 11 and a lower mold 12 in which a microstructure is formed by injection molding using a polycarbonate resin was used. Each of the upper mold 11 and the lower mold 12 was a disk having an outer diameter of 65 mm. Through holes 11a and 12a having a diameter of 10 mm are formed at the centers of the upper mold 11 and the lower mold 12, and the upper mold 11 and the lower mold 12 have a donut shape. The transfer patterns 11b and 12b having a fine structure are formed on one side of each of the upper mold 1 and the lower mold 2, and are formed in a region having a radius of 10 mm or more from the center.
　次に、ＨＤＤ用２．５インチガラス基板３(外径６５ｍｍ、内径２０ｍｍ)の両主面に磁性膜１４を成膜したものが用意され、この磁性膜１４を含むガラス基板３が上型１１および下型１２で挟むように配置された（図４（Ａ）参照）。そして、磁性膜１４を含むガラス基板３上および下型２上に、インプリント材料４として光硬化性樹脂であるＰＡＫ－０２（東洋合成工業株式会社製）の溶液が、それぞれ１００マイクロリットルずつディスペンサで塗布された（図４（Ｂ）参照）。なお、インプリント材料４は、下型２上については、転写用パターン２ｂに塗布され、磁性膜１４を含むガラス基板３上については、パターン形成工程において転写用パターン１１ｂに対応する箇所に塗布された。その後、上型１１および下型１２でインプリント材料１５、磁性膜１４を含むガラス基板３を挟み込んだ状態でインプリント材料１５に光が照射され、インプリント材料１５が硬化される（図４（Ｃ）参照）。インプリント材料４が硬化後、貫通孔１１ａおよび１２ａを通して気体５である窒素を封入し、離型を行ったところ、上型１１および下型１２が均一に離型できた（図４（Ｄ）参照）。 Next, what prepared the magnetic film 14 on both main surfaces of the 2.5-inch glass substrate 3 (outer diameter 65 mm, inner diameter 20 mm) for HDD is prepared, and the glass substrate 3 including this magnetic film 14 is the upper mold 11. And it arrange | positioned so that it may pinch | interpose with the lower mold | type 12 (refer FIG. 4 (A)). Then, on the glass substrate 3 including the magnetic film 14 and the lower mold 2, 100 μL each of a solution of PAK-02 (manufactured by Toyo Gosei Co., Ltd.), which is a photocurable resin, is used as the imprint material 4. (See FIG. 4B). The imprint material 4 is applied to the transfer pattern 2b on the lower mold 2 and applied to the portion corresponding to the transfer pattern 11b in the pattern forming process on the glass substrate 3 including the magnetic film 14. It was. Thereafter, the imprint material 15 is irradiated with light in a state where the glass substrate 3 including the imprint material 15 and the magnetic film 14 is sandwiched between the upper mold 11 and the lower mold 12, and the imprint material 15 is cured (FIG. 4 ( C)). After the imprint material 4 was cured, nitrogen as the gas 5 was sealed through the through holes 11a and 12a, and release was performed. As a result, the upper mold 11 and the lower mold 12 were uniformly released (FIG. 4D). reference).
　離型後のインプリント材料１５に転写された凹凸パターンである微細構造が観察された。干渉計にてインプリント材料１５の表面形状を観察した結果、特に物理的な傷等に起因する欠陥は見つからなかった。また、走査型電子顕微鏡（ＳＥＭ）、原子間力顕微鏡（ＡＦＭ）で微細構造を観察した結果、観察領域で微細構造の破壊等の欠陥は見つからなかった。 The fine structure which was the uneven | corrugated pattern transcribe | transferred to the imprint material 15 after mold release was observed. As a result of observing the surface shape of the imprint material 15 with an interferometer, no defect caused by a physical scratch or the like was found. Moreover, as a result of observing the fine structure with a scanning electron microscope (SEM) or an atomic force microscope (AFM), no defects such as destruction of the fine structure were found in the observation region.
　その後、光硬化性樹脂であるインプリント材料１５の微細構造層がドライエッチングによって、微細構造層の底面において、磁性膜１４が露出するまでエッチングされた（図４（Ｅ）参照）。そして、残りの光硬化性樹脂であるインプリント材料１５をマスクとして、ドライエッチングによって磁性膜１４がエッチングされ（図４（Ｆ）参照）、最後に、光硬化性樹脂であるインプリント材料１５を除去してパターンドメディア用ハードディスクドライブ基板（情報記録媒体基板１８）とされた（図４（Ｇ）参照）。 Thereafter, the fine structure layer of the imprint material 15 which is a photocurable resin was etched by dry etching until the magnetic film 14 was exposed on the bottom surface of the fine structure layer (see FIG. 4E). Then, the magnetic film 14 is etched by dry etching using the imprint material 15 that is the remaining photocurable resin as a mask (see FIG. 4F). Finally, the imprint material 15 that is the photocurable resin is removed. The hard disk drive substrate for patterned media (information recording medium substrate 18) was removed (see FIG. 4G).
　（実施例３）
　図１および図２を参照しながら、実施例３について説明する。図１に示すように、まず、シクロオレフィン系の樹脂であるゼオノア（日本ゼオン株式会社製）に、熱インプリント法を用いて微細構造を形成した上型１および下型２を備えて構成されるインプリント型１０が用された。上型１および下型２はそれぞれ外径６５ｍｍの円盤状とした。そして、上型１の中心には、直径が１０ｍｍの貫通孔１ａが機械加工により形成され、上型１はドーナッツ形状とした。微細構造である転写パターン１ｂおよび２ｂは上型１および下型２それぞれの片面に形成され、中心から半径１０ｍｍ以上の領域に形成されている。 (Example 3)
Embodiment 3 will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, first, a zeonore (made by Nippon Zeon Co., Ltd.), which is a cycloolefin resin, is provided with an upper mold 1 and a lower mold 2 formed with a fine structure using a thermal imprint method. The imprint mold 10 was used. The upper mold 1 and the lower mold 2 were each disk-shaped with an outer diameter of 65 mm. A through hole 1a having a diameter of 10 mm is formed in the center of the upper mold 1 by machining, and the upper mold 1 has a donut shape. The transfer patterns 1b and 2b having a fine structure are formed on one side of each of the upper mold 1 and the lower mold 2, and are formed in a region having a radius of 10 mm or more from the center.
　次に、ＨＤＤ用２．５インチガラス基板３(外径６５ｍｍ、内径２０ｍｍ)が用意され、このガラス基板３が上型１および下型２で挟むように配置された（図２（Ａ）参照）。そして、ガラス基板３上および下型２上に、インプリント材料４としてＳＯＧ材料であるＯＣＤ　Ｔ－１２　９００－Ｖ(東京応化工業株式会社製)の溶液が、それぞれ１００マイクロリットルずつディスペンサで塗布された（図２（Ｂ）参照）。なお、インプリント材料４は、下型２上については、転写用パターン２ｂに塗布され、ガラス基板３上については、パターン形成工程において転写用パターン１ｂに対応する箇所に塗布された。その後、上型１および下型２でインプリント材料４を含むガラス基板３を１ＭＰａで押圧した状態でインプリント材料４が乾燥、硬化された（図２（Ｃ）参照）。インプリント材料４が硬化後、貫通孔１ａを通して気体５の代わりに純水を封入し、離型を行ったところ、上型１および下型２が均一に離型できた（図２（Ｄ）参照）。 Next, a 2.5-inch glass substrate 3 (outer diameter 65 mm, inner diameter 20 mm) for HDD was prepared, and the glass substrate 3 was disposed so as to be sandwiched between the upper mold 1 and the lower mold 2 (see FIG. 2A). ). Then, a solution of OCD T-12 900-V (manufactured by Tokyo Ohka Kogyo Co., Ltd.) which is an SOG material as the imprint material 4 is applied on the glass substrate 3 and the lower mold 2 with a dispenser of 100 microliters each. (See FIG. 2B). The imprint material 4 was applied to the transfer pattern 2b on the lower mold 2 and applied to the portion corresponding to the transfer pattern 1b in the pattern forming process on the glass substrate 3. Thereafter, the imprint material 4 was dried and cured in a state where the glass substrate 3 including the imprint material 4 was pressed at 1 MPa with the upper mold 1 and the lower mold 2 (see FIG. 2C). After the imprint material 4 was cured, pure water was sealed in place of the gas 5 through the through-hole 1a, and the mold was released. As a result, the upper mold 1 and the lower mold 2 could be uniformly released (FIG. 2D). reference).
　離型後のインプリント材料４に転写された凹凸パターンである微細構造が観察された。干渉計にてインプリント材料４の表面形状を観察した結果、特に物理的な傷等に起因する欠陥は見つからなかった。また、走査型電子顕微鏡（ＳＥＭ）、原子間力顕微鏡（ＡＦＭ）で微細構造を観察した結果、観察領域で微細構造の破壊等の欠陥は見つからなかった。 The fine structure which was the uneven | corrugated pattern transcribe | transferred to the imprint material 4 after mold release was observed. As a result of observing the surface shape of the imprint material 4 with an interferometer, no defects caused by physical scratches or the like were found. Moreover, as a result of observing the fine structure with a scanning electron microscope (SEM) or an atomic force microscope (AFM), no defects such as destruction of the fine structure were found in the observation region.
　最後に、このインプリント材料４上に磁性膜６を成膜し、パターンドメディア用ハードディスクドライブ基板（情報記録媒体基板８）とした（図２（Ｅ）参照）。 Finally, a magnetic film 6 was formed on the imprint material 4 to obtain a patterned media hard disk drive substrate (information recording medium substrate 8) (see FIG. 2E).
　（比較例１）
　比較例１のインプリント型およびそれを用いた情報記録媒体基板の製造方法について、図５を用いて説明する。図５は、比較例１におけるインプリント型の離型について説明するための図である。なお、図５は図４（Ｄ）と対応する図である。比較例１においては、ピンモジュールを用いて離型を行っている。 (Comparative Example 1)
An imprint type of Comparative Example 1 and an information recording medium substrate manufacturing method using the same will be described with reference to FIG. FIG. 5 is a view for explaining imprint mold release in Comparative Example 1. FIG. FIG. 5 is a diagram corresponding to FIG. In Comparative Example 1, release is performed using a pin module.
　比較例１においては、ポリカーボネート樹脂を用いて、射出成型にて微細構造を形成した、外径６５ｍｍの円盤状である上型および下型を備えて構成されるインプリント型１０１が用いられた。インプリント型１０１の上型および下型の片主面には微細構造である転写パターンが、それぞれの中心から半径１０ｍｍ以上の領域に形成されている。 In Comparative Example 1, an imprint mold 101 having a disk-shaped upper mold and a lower mold having an outer diameter of 65 mm, in which a microstructure was formed by injection molding using a polycarbonate resin, was used. On one main surface of the upper mold and the lower mold of the imprint mold 101, a transfer pattern having a fine structure is formed in a region having a radius of 10 mm or more from each center.
　まず、ＨＤＤ用２．５インチガラス基板１０３(外径６５ｍｍ、内径２０ｍｍ)の両主面に磁性膜１０４を成膜したものが用意され、この磁性膜１０４を含むガラス基板１０３がインプリント型１０１の上型および下型で挟むように配置される。そして、磁性膜１０４を含むガラス基板１０３上およびインプリント型１０１の下型上に、インプリント材料１０５として光硬化性樹脂であるＰＡＫ－０２（東洋合成工業株式会社製）の溶液が、それぞれ１００マイクロリットルずつディスペンサで塗布された。なお、インプリント材料１０５は、下型上については、転写用パターンに塗布され、磁性膜１０４を含むガラス基板１０３上については、パターン形成工程において転写用パターンに対応する箇所に塗布された。その後、インプリント型１０１の上型および下型でインプリント材料１０５、磁性膜１０４を含むガラス基板１０３を挟み込んだ状態でインプリント材料１０５に光が照射され、インプリント材料１０５が硬化される。 First, a 2.5-inch glass substrate 103 for HDD (outer diameter 65 mm, inner diameter 20 mm) is prepared by forming a magnetic film 104 on both main surfaces, and the glass substrate 103 including the magnetic film 104 is an imprint mold 101. It is arranged so as to be sandwiched between the upper mold and the lower mold. A solution of PAK-02 (manufactured by Toyo Gosei Co., Ltd.), which is a photocurable resin, is used as the imprint material 105 on the glass substrate 103 including the magnetic film 104 and the lower mold of the imprint mold 101, respectively. Microliters were applied with a dispenser. The imprint material 105 was applied to the transfer pattern on the lower mold, and the glass substrate 103 including the magnetic film 104 was applied to a location corresponding to the transfer pattern in the pattern forming process. Thereafter, the imprint material 105 is cured by irradiating the imprint material 105 with light while the glass substrate 103 including the imprint material 105 and the magnetic film 104 is sandwiched between the upper mold and the lower mold of the imprint mold 101.
　そして、図５に示すように、ピンモジュール１０２をインプリント型１０１とインプリント材料１０５との界面にピンモジュール１０２が挿入され、物理的な力で、型と基板の間に隙間を発生させて型の剥離が行われた。 Then, as shown in FIG. 5, the pin module 102 is inserted into the interface between the imprint mold 101 and the imprint material 105, and a gap is generated between the mold and the substrate by physical force. The mold was peeled off.
　離型後のインプリント材料１０５に転写された微細構造が観察された。干渉計にて表面形状を観察した結果、外周部分のピンモジュールを挿入した部分に、ピンモジュール１０２を挿入した際についた傷によるものと見られる干渉縞の異常が見られた。ノマルスキー顕微鏡にて該当部分を観察した結果、インプリント材料１０５を含む磁性膜１０４、ガラス基板１０３に傷がついていることがわかった。 The fine structure transferred to the imprint material 105 after release was observed. As a result of observing the surface shape with an interferometer, an abnormality in interference fringes, which is considered to be caused by scratches when the pin module 102 was inserted, was found in the portion where the pin module was inserted in the outer peripheral portion. As a result of observing the corresponding portion with a Nomarski microscope, it was found that the magnetic film 104 including the imprint material 105 and the glass substrate 103 were damaged.
　（比較例２）
　比較例２のインプリント型およびそれを用いた情報記録媒体基板の製造方法について、図６を用いて説明する。図６は、比較例２におけるインプリント型について説明するための図であって、図６（Ａ）はインプリント型の平面図であり、図６（Ｂ）は図６（Ａ）のＢ－Ｂ’矢視断面図であり、図６（Ｃ）は離型について説明するための図である。比較例２のインプリント型には貫通孔が形成されているが、その位置は転写パターン領域内である。 (Comparative Example 2)
An imprint type of Comparative Example 2 and an information recording medium substrate manufacturing method using the same will be described with reference to FIG. 6A and 6B are diagrams for explaining the imprint type in Comparative Example 2. FIG. 6A is a plan view of the imprint type, and FIG. It is B 'arrow sectional drawing, FIG.6 (C) is a figure for demonstrating mold release. A through hole is formed in the imprint mold of Comparative Example 2, but the position is within the transfer pattern region.
　比較例２におけるインプリント型の上型１１１は、図６（Ａ）および図６（Ｂ）に示されるように、ポリメチルペンテン樹脂を射出成型により形成した外径６５ｍｍの円盤状であり、上型１１１の中心から２０ｍｍの位置に９０度回転対称となるように４つの貫通孔１１７が形成されている。これら貫通孔１１７の直径は５ｍｍである。そして、図６（Ｂ）に示すように、貫通孔１１７は、上型１１１の一方の主面に形成された転写パターンの形成領域と他方の主面との間を貫通している。なお、下型１１２（図６（Ｃ）参照）も上型１１１と同様に、ポリメチルペンテン樹脂を射出成型により形成した外径６５ｍｍの円盤状である。なお、微細構造である転写パターンは上型１１１および下型１１２それぞれの片面に形成され、中心から半径１０ｍｍ以上の領域に形成されている。なお、貫通孔１１７およびこれら転写パターンは射出成型により形成されている。 As shown in FIGS. 6A and 6B, the upper mold 111 of the imprint mold in Comparative Example 2 is a disc shape having an outer diameter of 65 mm formed by injection molding of polymethylpentene resin. Four through-holes 117 are formed at a position 20 mm from the center of the mold 111 so as to be 90-degree rotationally symmetric. The diameter of these through holes 117 is 5 mm. As shown in FIG. 6B, the through hole 117 penetrates between the transfer pattern forming region formed on one main surface of the upper mold 111 and the other main surface. Note that the lower mold 112 (see FIG. 6C) has a disk shape with an outer diameter of 65 mm formed by injection molding of polymethylpentene resin, similarly to the upper mold 111. Note that the transfer pattern having a fine structure is formed on one surface of each of the upper mold 111 and the lower mold 112, and is formed in a region having a radius of 10 mm or more from the center. The through holes 117 and these transfer patterns are formed by injection molding.
　次に、ＨＤＤ用２．５インチガラス基板１１３(外径６５ｍｍ、内径２０ｍｍ)が用意され、このガラス基板１１３が上型１１１および下型１１２で挟むように配置され、ガラス基板１１３上および下型１１２上に、インプリント材料１１４としてＳＯＧ材料であるＯＣＤ　Ｔ－１２　９００－Ｖ(東京応化工業株式会社製)の溶液が、それぞれ１００マイクロリットルずつディスペンサで塗布された。なお、インプリント材料１１４は、下型１１２上については、転写用パターンに塗布され、ガラス基板１１３上については、パターン形成工程において転写用パターンに対応する箇所に塗布された。その後、上型１１１および下型１１２でインプリント材料１１４を含むガラス基板１１３を１ＭＰａで押圧した状態でインプリント材料１１４が乾燥、硬化された。そして、図６（Ｃ）に示すように、インプリント材料１１４が硬化後、貫通孔１１７を通して気体１１５である圧縮空気を封入し、離型が行われた。しかし、貫通孔１１７が形成された上型１１１は離型されたが、貫通孔が形成されていない下型１１２は離型されなかった。また、離型された上型１１１側のインプリント材料１１４に転写された微細構造が観察された。干渉計にて表面状態を観察した結果、上型１１１の貫通孔１１７の１つに対応する場所付近で干渉縞の異常が見られた。ノマルスキー顕微鏡にて当該部分を観察した結果、インプリント材料１１４に傷がついていることがわかった。これは、上型１１１の離型時に、４つの貫通孔１１７から封入する圧縮空気のバランスが崩れた結果、１つの貫通孔１１７に対応する場所付近の離型が他の場所よりも遅れ、バランスが崩れた離型力がその場所に集中して働いたものと推測される。 Next, a 2.5-inch glass substrate 113 (outer diameter 65 mm, inner diameter 20 mm) for HDD is prepared, and the glass substrate 113 is disposed so as to be sandwiched between the upper mold 111 and the lower mold 112. A solution of OCD T-12 900-V (manufactured by Tokyo Ohka Kogyo Co., Ltd.), which is an SOG material, was applied as an imprint material 114 on each 112 by a dispenser. The imprint material 114 was applied to the transfer pattern on the lower mold 112, and was applied to the portion corresponding to the transfer pattern in the pattern forming process on the glass substrate 113. Thereafter, the imprint material 114 was dried and cured in a state where the glass substrate 113 including the imprint material 114 was pressed at 1 MPa with the upper mold 111 and the lower mold 112. Then, as shown in FIG. 6C, after the imprint material 114 was cured, compressed air as the gas 115 was sealed through the through hole 117, and the mold release was performed. However, although the upper mold 111 in which the through hole 117 was formed was released, the lower mold 112 in which the through hole was not formed was not released. Further, a fine structure transferred to the released imprint material 114 on the upper mold 111 side was observed. As a result of observing the surface state with an interferometer, an abnormality of interference fringes was observed near the location corresponding to one of the through holes 117 of the upper mold 111. As a result of observing the portion with a Nomarski microscope, it was found that the imprint material 114 was damaged. This is because when the upper mold 111 is released, the balance of the compressed air sealed from the four through holes 117 is lost, and the release near the place corresponding to the one through hole 117 is delayed from the other places. It is presumed that the release force that collapsed worked concentrated on the place.
　本明細書は、上記のように様々な態様の技術を開示しているが、そのうち主な技術を以下に纏める。 This specification discloses various modes of technology as described above, and the main technologies are summarized below.
　一態様にかかるインプリント型は、中心孔を有する基板基材を形成する成形材料に凹凸パターンを形成するインプリント型であって、前記成形材料に押し付けられることで、前記成形材料に前記凹凸パターンを転写によって形成する転写用パターンを有し、前記成形材料に押し付けられた際に前記中心孔に対応する箇所に貫通孔が形成されており、当該貫通孔は、前記中心孔よりも小さい。 An imprint mold according to one aspect is an imprint mold that forms a concavo-convex pattern on a molding material that forms a substrate substrate having a center hole, and is pressed against the molding material, whereby the concavo-convex pattern is formed on the molding material. And a through hole is formed at a position corresponding to the center hole when pressed against the molding material, and the through hole is smaller than the center hole.
　この構成によれば、成形材料から剥離する際に、例えば、気体や液体等の流体を貫通孔に流入することで、形成されたパターン等を傷つけることがない、インプリント型が実現される。このインプリント型は、インプリント型と成形材料との界面に流体により圧力をかけて剥離することができるので、転写により形成されたパターン等を傷つけることがない。また、インプリント型と成形材料との界面に均一に圧力をかけることができるので、このインプリント型は、パターンの変形や破壊が生じにくい。また、基板基材の中心孔から外周に向かって、均一に、かつ同心円状に圧力がかけられるため、基板基材の中心から外周に向かって、順に圧力がかかることとなり、インプリント型は、均一に剥離される。また、中心孔から流体により、圧力がかかるため、両主面に成形材料が形成される基板基材を挟むような構造のインプリント型であっても、基板基材の両主面における成形材料からインプリント型が均一に剥離される。したがって、パターンの破損が生じにくい。 According to this configuration, an imprint mold that does not damage the formed pattern or the like by, for example, flowing a fluid such as gas or liquid into the through-hole when peeling from the molding material is realized. Since this imprint mold can be peeled off by applying pressure to the interface between the imprint mold and the molding material with a fluid, the pattern formed by the transfer is not damaged. In addition, since pressure can be uniformly applied to the interface between the imprint mold and the molding material, the imprint mold is less likely to be deformed or broken. In addition, since pressure is applied uniformly and concentrically from the center hole of the substrate base material to the outer periphery, pressure is applied in order from the center of the substrate base material to the outer periphery. Peel evenly. Further, since pressure is applied by the fluid from the center hole, the molding material on both main surfaces of the substrate base material, even if the imprint mold has a structure in which the substrate base material on which the molding material is formed on both main surfaces is sandwiched The imprint mold is peeled off uniformly. Therefore, the pattern is hardly damaged.
　また、一態様にかかる情報記録媒体基板の製造方法は、上記インプリント型を用いた情報記録媒体基板の製造方法であって、前記基板基材の表面又は前記インプリント型のパターン面に前記成形材料を与える工程と、前記成形材料を間に介して前記基板基材に対して前記インプリント型を押し付ける工程と、前記成形材料に前記インプリント型を押し付けた後に、前記中心孔及び前記貫通孔に流体を流入させて、前記中心孔に面する前記インプリント型の表面に圧力をかけることにより、前記成形材料からインプリント型を剥離させる工程とを備える。 An information recording medium substrate manufacturing method according to an aspect is an information recording medium substrate manufacturing method using the imprint mold, wherein the molding is performed on a surface of the substrate base material or a pattern surface of the imprint mold. A step of applying a material; a step of pressing the imprint mold against the substrate base material with the molding material interposed therebetween; and the center hole and the through hole after pressing the imprint mold against the molding material And a step of peeling the imprint mold from the molding material by injecting a fluid into the mold and applying pressure to the surface of the imprint mold facing the center hole.
　この構成によれば、インプリント型を成形材料から剥離する際に、インプリント型と成形材料との界面に流体により圧力がかかることで剥離するので、転写により形成されたパターン等を傷つけることがない。また、インプリント型と成形材料との界面に均一に圧力をかけることができるので、この製造方法は、パターンの変形や破壊が生じにくい。また、基板基材の中心孔から外周に向かって、均一に、かつ同心円状に圧力がかけられるため、基板基材の中心から外周に向かって、順に圧力がかかることとなり、この製造方法では、インプリント型が均一に剥離される。また、中心孔から流体により、圧力がかかるため、両主面に成形材料が形成される基板基材を挟むような構造のインプリント型であっても、基板基材の両主面における成形材料からインプリント型が均一に剥離される。したがって、この製造方法では、パターンの破損が生じにくい。 According to this configuration, when the imprint mold is peeled off from the molding material, it is peeled off by applying a pressure to the interface between the imprint mold and the molding material, so that the pattern formed by the transfer may be damaged. Absent. In addition, since pressure can be uniformly applied to the interface between the imprint mold and the molding material, this manufacturing method is unlikely to cause pattern deformation or destruction. In addition, since pressure is applied uniformly and concentrically from the center hole of the substrate base material toward the outer periphery, pressure is applied in order from the center of the substrate base material to the outer periphery. The imprint mold is peeled uniformly. Further, since pressure is applied by the fluid from the center hole, the molding material on both main surfaces of the substrate base material, even if the imprint mold has a structure in which the substrate base material on which the molding material is formed on both main surfaces is sandwiched The imprint mold is peeled off uniformly. Therefore, in this manufacturing method, the pattern is hardly damaged.
　また、一態様では、上述の情報記録媒体基板の製造方法において、好ましくは、前記インプリント型を同時に２つ用い、前記基板基材の両面に前記成形材料による凹凸パターンを形成するものである。 Also, in one aspect, in the above-described method for manufacturing an information recording medium substrate, preferably, two imprint molds are used at the same time, and an uneven pattern made of the molding material is formed on both surfaces of the substrate base material.
　この構成によれば、基板基材の両面に、転写によりパターンを形成することができる。 According to this configuration, a pattern can be formed on both surfaces of the substrate base material by transfer.
　また、一態様では、上述の情報記録媒体基板の製造方法において、好ましくは、前記インプリント型によって前記基板基材の一方の面に前記成形材料による凹凸パターンを形成すると同時に、前記インプリント型とは貫通孔が形成されていない点で異なる第２のインプリント型によって前記基板基材の他方の面に前記成形材料による凹凸パターンを形成するものである。 Moreover, in one aspect, in the above-described method for manufacturing an information recording medium substrate, preferably, the imprint mold is used to simultaneously form an uneven pattern of the molding material on one surface of the substrate base material with the imprint mold. Is to form a concavo-convex pattern of the molding material on the other surface of the substrate base material by a second imprint mold which is different in that no through hole is formed.
　この構成によれば、基板基材の両面に、転写によりパターンを形成することができる。 According to this configuration, a pattern can be formed on both surfaces of the substrate base material by transfer.
　また、一態様では、上述の情報記録媒体基板の製造方法において、好ましくは、前記流体が水である。 In one aspect, in the above-described method for manufacturing an information recording medium substrate, preferably, the fluid is water.
　この構成によれば、流体として、比較的容易に入手可能であり、かつ基板基材等を浸食するおそれが少ない水を用いるので、低コストで離型を行うことができる。 According to this configuration, water that is relatively easily available and less likely to erode the substrate substrate or the like is used as the fluid, so that the mold can be released at low cost.
　また、一態様では、上述の情報記録媒体基板の製造方法において、好ましくは、前記流体が空気または窒素である。 In one aspect, in the above-described method for manufacturing an information recording medium substrate, preferably, the fluid is air or nitrogen.
　この構成によれば、流体として、容易に入手可能であり、かつ基板基材等を浸食するおそれが少ない空気または窒素を用いることから、低コストで離型を行うことができる。 According to this configuration, since air or nitrogen that can be easily obtained as a fluid and is less likely to erode the substrate base material or the like is used, mold release can be performed at low cost.
　この出願は、２００８年９月２６日に出願された日本国特許出願特願２００８－２４８９７７を基礎とするものであり、その内容は、本願に含まれるものである。 This application is based on Japanese Patent Application No. 2008-248977 filed on Sep. 26, 2008, the contents of which are included in this application.
　本発明を表現するために、上述において図面を参照しながら実施形態を通して本発明を適切且つ十分に説明したが、当業者であれば上述の実施形態を変更および／または改良することは容易に為し得ることであると認識すべきである。したがって、当業者が実施する変更形態または改良形態が、請求の範囲に記載された請求項の権利範囲を離脱するレベルのものでない限り、当該変更形態または当該改良形態は、当該請求項の権利範囲に包括されると解釈される。 In order to express the present invention, the present invention has been properly and fully described through the embodiments with reference to the drawings. However, those skilled in the art can easily change and / or improve the above-described embodiments. It should be recognized that this is possible. Accordingly, unless the modifications or improvements implemented by those skilled in the art are at a level that departs from the scope of the claims recited in the claims, the modifications or improvements are not covered by the claims. It is interpreted that it is included in
　本発明によれば、インプリント型およびそれを用いた情報記録媒体基板の製造方法を提供することができる。 According to the present invention, it is possible to provide an imprint type and an information recording medium substrate manufacturing method using the same.

Claims (6)

  1. 　中心孔を有する基板基材を形成する成形材料に凹凸パターンを形成するインプリント型であって、
    　前記成形材料に押し付けられることで、前記成形材料に前記凹凸パターンを転写によって形成する転写用パターンを有し、
    　前記成形材料に押し付けられた際に前記中心孔に対応する箇所に貫通孔が形成されており、当該貫通孔は、前記中心孔よりも小さいことを特徴とするインプリント型。     An imprint mold for forming a concavo-convex pattern on a molding material for forming a substrate substrate having a central hole,
    By being pressed against the molding material, it has a transfer pattern that forms the uneven pattern on the molding material by transfer,
    A through hole is formed at a position corresponding to the center hole when pressed against the molding material, and the through hole is smaller than the center hole.
  2. 　請求項１に記載のインプリント型を用いた情報記録媒体基板の製造方法であって、
    　前記基板基材の表面又は前記インプリント型のパターン面に前記成形材料を与える工程と、
    　前記成形材料を間に介して前記基板基材に対して前記インプリント型を押し付ける工程と、
    　前記成形材料に前記インプリント型を押し付けた後に、前記中心孔及び前記貫通孔に流体を流入させて、前記中心孔に面する前記インプリント型の表面に圧力をかけることにより、前記成形材料からインプリント型を剥離させる工程とを備える、情報記録媒体基板の製造方法。     A method of manufacturing an information recording medium substrate using the imprint mold according to claim 1,
    Providing the molding material on the surface of the substrate substrate or the pattern surface of the imprint mold; and
    Pressing the imprint mold against the substrate substrate with the molding material in between,
    After the imprint mold is pressed against the molding material, a fluid is caused to flow into the central hole and the through hole, and pressure is applied to the surface of the imprint mold facing the central hole to remove the molding material from the molding material. A method for producing an information recording medium substrate, comprising: removing the imprint mold.
  3. 　前記インプリント型を同時に２つ用い、前記基板基材の両面に前記成形材料による凹凸パターンを形成する、請求項２に記載の情報記録媒体基板の製造方法。 3. The method for manufacturing an information recording medium substrate according to claim 2, wherein two imprint molds are used simultaneously to form a concavo-convex pattern of the molding material on both surfaces of the substrate base material.
  4. 　前記インプリント型によって前記基板基材の一方の面に前記成形材料による凹凸パターンを形成すると同時に、前記インプリント型とは貫通孔が形成されていない点で異なる第２のインプリント型によって前記基板基材の他方の面に前記成形材料による凹凸パターンを形成する、請求項２に記載の情報記録媒体基板の製造方法。 A concave / convex pattern made of the molding material is formed on one surface of the substrate base material by the imprint mold, and at the same time, the substrate differs depending on the second imprint mold which is different from the imprint mold in that a through hole is not formed. The method for producing an information recording medium substrate according to claim 2, wherein the uneven pattern made of the molding material is formed on the other surface of the base material.
  5. 　前記流体は水である、請求項２に記載の情報記録媒体基板の製造方法。 The method for manufacturing an information recording medium substrate according to claim 2, wherein the fluid is water.
  6. 　前記流体は空気または窒素である、請求項２に記載の情報記録媒体基板の製造方法。 3. The method of manufacturing an information recording medium substrate according to claim 2, wherein the fluid is air or nitrogen.
PCT/JP2009/064550 2008-09-26 2009-08-20 Imprint mold and information recording medium substrate manufacturing method using the same WO2010035594A1 (en)

Applications Claiming Priority (2)

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JP2008-248977 2008-09-26
JP2008248977 2008-09-26

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0247011A (en) * 1988-08-10 1990-02-16 Hitachi Ltd Manufacture of base for optical disk
JPH08255376A (en) * 1995-01-28 1996-10-01 Samsung Electron Co Ltd Mod and sd using integrated substrate and their manufacture
JPH09219041A (en) * 1996-02-13 1997-08-19 Sony Corp Production of optical recording medium and apparatus for production using the same
JP2000222786A (en) * 1999-02-03 2000-08-11 Origin Electric Co Ltd Production of optical disk and producing device of optical disk
JP2003331481A (en) * 2002-05-13 2003-11-21 Sony Disc Technology Inc Manufacturing method of optical recording medium
JP2006031848A (en) * 2004-07-16 2006-02-02 Toshiba Corp Magnetic disk and magnetic disk device equipped with the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0247011A (en) * 1988-08-10 1990-02-16 Hitachi Ltd Manufacture of base for optical disk
JPH08255376A (en) * 1995-01-28 1996-10-01 Samsung Electron Co Ltd Mod and sd using integrated substrate and their manufacture
JPH09219041A (en) * 1996-02-13 1997-08-19 Sony Corp Production of optical recording medium and apparatus for production using the same
JP2000222786A (en) * 1999-02-03 2000-08-11 Origin Electric Co Ltd Production of optical disk and producing device of optical disk
JP2003331481A (en) * 2002-05-13 2003-11-21 Sony Disc Technology Inc Manufacturing method of optical recording medium
JP2006031848A (en) * 2004-07-16 2006-02-02 Toshiba Corp Magnetic disk and magnetic disk device equipped with the same

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