WO2010008205A3 - 쐐기형 서브마운트를 가지는 양방향 통신용 광모듈 패키지 - Google Patents

쐐기형 서브마운트를 가지는 양방향 통신용 광모듈 패키지 Download PDF

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Publication number
WO2010008205A3
WO2010008205A3 PCT/KR2009/003899 KR2009003899W WO2010008205A3 WO 2010008205 A3 WO2010008205 A3 WO 2010008205A3 KR 2009003899 W KR2009003899 W KR 2009003899W WO 2010008205 A3 WO2010008205 A3 WO 2010008205A3
Authority
WO
WIPO (PCT)
Prior art keywords
wedge
mount
diode chip
optical module
beam splitter
Prior art date
Application number
PCT/KR2009/003899
Other languages
English (en)
French (fr)
Other versions
WO2010008205A2 (ko
Inventor
김정수
Original Assignee
Kim Jeong Soo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kim Jeong Soo filed Critical Kim Jeong Soo
Publication of WO2010008205A2 publication Critical patent/WO2010008205A2/ko
Publication of WO2010008205A3 publication Critical patent/WO2010008205A3/ko

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

본 발명은 레이저 다이오드 칩과 빔스플리터 및 수신용 포토 다이오드 칩이 하나의 패키지 하우징에 내장되어 광신호의 전송과 수신을 동시에 수행하는 양방향 통신용 광모듈 패키지에 있어서 상부에 레이저 다이오드 칩이 설치되는 서브마운트의 측면에 쐐기형 홈을 형성하여 빔스플리터를 결합시킬 수 있도록 하는 쐐기형 서브마운트를 가지는 양방향 통신용 광모듈 패키지에 관한 것이다. 본 발명에 따른 양방향 통신용 광모듈 패키지는 레이저 다이오드 칩(100)과 빔스플리터(200)와 수신용 포토 다이오드 칩(400)이 하나의 패키지 하우징에 내장되는 양방향 통신용 광모듈 패키지에 있어서, 상기 레이저 다이오드 칩(100)은 서브마운트(300)의 상부에 결합되고, 이 서브마운트(300)의 일측면에는 쐐기형 홈(310)이 형성되어 이 쐐기형 홈(310)에 상기 빔스플리터(200)가 끼움 결합되고, 상기 수신용 포토 다이오드 칩(400)은 서브마운트(300)의 쐐기형 홈(310)에 결합된 빔스플리터(200)의 하부에 설치되는 것을 특징으로 한다.
PCT/KR2009/003899 2008-07-15 2009-07-15 쐐기형 서브마운트를 가지는 양방향 통신용 광모듈 패키지 WO2010008205A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0068475 2008-07-15
KR1020080068475A KR100960745B1 (ko) 2008-07-15 2008-07-15 쐐기형 서브마운트를 가지는 양방향 통신용 광모듈 패키지

Publications (2)

Publication Number Publication Date
WO2010008205A2 WO2010008205A2 (ko) 2010-01-21
WO2010008205A3 true WO2010008205A3 (ko) 2010-05-14

Family

ID=41550845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003899 WO2010008205A2 (ko) 2008-07-15 2009-07-15 쐐기형 서브마운트를 가지는 양방향 통신용 광모듈 패키지

Country Status (2)

Country Link
KR (1) KR100960745B1 (ko)
WO (1) WO2010008205A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119491B1 (ko) * 2010-05-13 2012-02-28 주식회사 포벨 양방향 통신용 광모듈 패키지 구조

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485538A (en) * 1994-06-30 1996-01-16 The Whitaker Corporation Bidirectional wavelength division multiplex transceiver module
US5799644A (en) * 1995-04-19 1998-09-01 Komatsu Electronic Metals Co., Ltd. Semiconductor single crystal ingot cutting jig
US20070286549A1 (en) * 2004-02-17 2007-12-13 Yoshihisa Warashina Optical Transmitting /Receiving Module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485538A (en) * 1994-06-30 1996-01-16 The Whitaker Corporation Bidirectional wavelength division multiplex transceiver module
US5799644A (en) * 1995-04-19 1998-09-01 Komatsu Electronic Metals Co., Ltd. Semiconductor single crystal ingot cutting jig
US20070286549A1 (en) * 2004-02-17 2007-12-13 Yoshihisa Warashina Optical Transmitting /Receiving Module

Also Published As

Publication number Publication date
KR20100008077A (ko) 2010-01-25
KR100960745B1 (ko) 2010-06-01
WO2010008205A2 (ko) 2010-01-21

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