WO2010007656A1 - Organic el panel and its manufacturing method - Google Patents

Organic el panel and its manufacturing method Download PDF

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Publication number
WO2010007656A1
WO2010007656A1 PCT/JP2008/062703 JP2008062703W WO2010007656A1 WO 2010007656 A1 WO2010007656 A1 WO 2010007656A1 JP 2008062703 W JP2008062703 W JP 2008062703W WO 2010007656 A1 WO2010007656 A1 WO 2010007656A1
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WO
WIPO (PCT)
Prior art keywords
sealing
organic
blocking wall
support substrate
wall portion
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Application number
PCT/JP2008/062703
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French (fr)
Japanese (ja)
Inventor
真滋 中嶋
雄司 齋藤
Original Assignee
パイオニア株式会社
東北パイオニア株式会社
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Application filed by パイオニア株式会社, 東北パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2008/062703 priority Critical patent/WO2010007656A1/en
Publication of WO2010007656A1 publication Critical patent/WO2010007656A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to an organic EL panel and a manufacturing method thereof.
  • An organic EL panel includes an organic EL element as a light emitting element on a panel substrate.
  • an organic EL element as a light emitting element on a panel substrate.
  • a display screen of a mobile phone for example, a monitor screen of a vehicle-mounted or household electronic device, an information display screen of a personal computer or a television receiver,
  • various display devices used in advertising lighting panels, etc. as various light sources used in scanners, printers, etc., as lighting devices used in general illumination, backlights of liquid crystal display devices, etc., or light utilizing a photoelectric conversion function
  • the organic EL element Since the organic EL element has a property that the light emission characteristic deteriorates when exposed to moisture in the atmosphere, the organic EL element is sealed to block the organic EL element from the atmosphere in order to operate the organic EL panel stably for a long time. Structure is indispensable.
  • a sealing structure of an organic EL panel a substrate on which an organic EL element is formed and a metal or glass sealing member are bonded together to form a sealing space surrounding the organic EL element, and the inside of the sealing space
  • a structure (hollow sealing structure) in which a desiccant is disposed on the surface has been adopted.
  • Step (b) a step of immersing the sealing port J20 of the transparent container J2 in the sealing material solution with the vacuum chamber J1 set to a high vacuum (FIG. (B)), Introducing an inert gas that does not contain moisture into J1, and injecting the liquid sealing material into the transparent container J2 by a pressure difference (FIG. (C)), the vacuum chamber J1 is returned to normal pressure, and transparent
  • the process includes taking out the container J2 from the vacuum chamber J1 and sealing the sealing port J20 with a sealing material ((d) in the figure).
  • the resin adhesive has a low function of blocking moisture entry even after curing, so that the adhesive layer Deterioration factors such as moisture enter the organic EL panel through the organic EL element, and the black frame of the organic EL element (a phenomenon in which the non-light-emitting portion spreads from the periphery of the pixel formed of the organic EL element) or dark spot (organic EL element) The phenomenon in which the non-light emitting portions are scattered in the pixels formed in (a) progresses and the panel life is reduced.
  • the outer wall of the panel container can be formed of a material having a high moisture blocking function, and the liquid adhesive is injected from the sealing port formed in a part of the outer wall. Compared with the case of forming with a layer, it is possible to reduce the degree of penetration of deterioration factors such as moisture, and to suppress the lifetime reduction of the organic EL panel.
  • the present invention is an example of a problem to deal with such a problem. That is, by adopting a solid sealing structure that does not have a sealing space, it is possible to reduce the thickness of the panel and improve the panel strength, omitting the step of deploying a desiccant in the sealing space, An object of the present invention is to improve the productivity of the panel, to prevent the deterioration of the organic EL element due to the intrusion of the deterioration factor into the panel, and to extend the life of the organic EL panel.
  • the organic EL panel and the manufacturing method thereof according to the present invention include at least the configurations according to the following independent claims.
  • a light emitting section having a plurality of organic EL elements, a support substrate section on which the light emission section is formed, and a seal disposed so as to face the support substrate section and cover the light emission section.
  • An organic EL panel wherein the inner blocking wall is formed so as to face the opening of the blocking wall, and an adhesive is filled in the gap inside the outer blocking wall.
  • a sealing cell in a gap between the support substrate portion and the sealing substrate portion by forming an inner blocking wall portion that shields the inner side from the outer side so as to partially surround the light emitting portion. And a method of filling the sealing cell with an adhesive, and a step of curing the adhesive filled in the sealing cell.
  • FIG. 2 is an explanatory view showing the structure of an organic EL panel according to an embodiment of the present invention.
  • FIG. 2 (a) is a sectional view taken along line XX in FIG. 2 (b), and FIG. The YY sectional view in (a) is shown.
  • An organic EL panel 1A includes a light emitting unit 10 having a plurality of organic EL elements, a support substrate unit 20 having the light emitting unit 10 formed on one surface, and light emission facing the support substrate unit 20.
  • the sealing substrate portion 21 is disposed so as to cover the portion 10, and is formed along the outer edge of the supporting substrate portion 20 and the sealing substrate portion 21.
  • the sealing substrate portion 21 has at least one opening portion 22 A and is supported by other than the opening portion 22 A.
  • An outer blocking wall portion 22 that blocks the gap G between the substrate portion 20 and the sealing substrate portion 21 from the outside, and is formed so as to partially surround the light emitting portion 10 inside the outer blocking wall portion 22,
  • An inner blocking wall portion 23 for blocking the outer side, the inner blocking wall portion 23 is formed so as to face the opening 22A of the outer blocking wall portion 22, and an adhesive 24 is provided in the gap G inside the outer blocking wall portion 22. Is filled.
  • the outer blocking wall portion 22 has one opening 22 ⁇ / b> A along one side 20 a in the support substrate portion 20, and the inner blocking wall portion 23 faces the one side 20 a in the support substrate portion 20.
  • One opening 23A is provided along the side 20b.
  • the opening 22A may be provided anywhere and any number, but it is a requirement that the inner blocking wall 23 be formed so as to face the opening 22A.
  • the inner blocking wall portion 23 may be one in which the light emitting portion 10 is partially surrounded, and both ends thereof may be widely opened (for example, see the embodiment shown in FIG. 6).
  • a deterioration factor such as moisture that tries to enter the gap G from the opening 22A of the outer blocking wall 22 is blocked by the inner blocking wall 23 and reaches the light emitting unit 10 directly. Therefore, the deterioration of the organic EL element in the light emitting unit 10 can be suppressed.
  • the outer blocking wall portion 22 and the inner blocking wall portion 23 need to prevent deterioration factors such as moisture from entering the inside, and the blocking performance of the deterioration factors such as moisture is higher than that of the adhesive layer. It is preferably formed of an inorganic material such as a high glass material. Deterioration factors that have entered the inside of the outer blocking wall portion 22 from the opening 22 ⁇ / b> A must be diverted along the inner blocking wall portion 23, and thus directly reach the light emitting unit 10 surrounded by the inner blocking wall portion 23. Can not do it.
  • a sealing cell for sealing the light emitting unit 10 is formed in the gap G between the support substrate unit 20 and the sealing substrate unit 21 by the outer blocking wall unit 22.
  • an inflow path from the opening 22A to the inner gap of the inner blocking wall 23 is necessary. Form a pathway.
  • the detour paths R1 and R2 can prevent the deterioration factor such as moisture from reaching the light emitting unit 10 after the adhesive 24 is cured while allowing the adhesive 24 to be filled.
  • FIG. 3 is an explanatory view showing the structure of an organic EL panel according to another embodiment of the present invention.
  • FIG. 3 (a) is a sectional view taken along line XX in FIG. 3 (b), and FIG. A YY cross-sectional view in FIG.
  • the organic EL panel 1B includes a light emitting unit 10 having a plurality of organic EL elements, and a support substrate unit on which the light emitting unit 10 is formed on one surface. 20, a sealing substrate portion 21 disposed so as to face the support substrate portion 20 so as to cover the light emitting portion 10, and an opening 22 ⁇ / b> A ⁇ b> 1, formed along the outer edge of the support substrate portion 20 and the sealing substrate portion 21.
  • the outer blocking wall portion 22 having 22A2 and blocking the gap G between the support substrate portion 20 and the sealing substrate portion 21 outside the openings 22A1 and 22A2, and the light emitting portion 10 inside the outer blocking wall portion 22.
  • An inner blocking wall portion 23 is formed so as to partially surround the inner blocking wall portion 23 to block the inner side thereof from the outer side thereof, and the inner blocking wall portion 23 is formed to face the openings 22A1 and 22A2 of the outer blocking wall portion 22.
  • the outer barrier wall 22 It is obtained by filling the adhesive 24 in the gap G in the side.
  • the outer blocking wall portion 22 has openings 22 ⁇ / b> A ⁇ b> 1 and 22 ⁇ / b> A ⁇ b> 2 along the opposing sides 20 a and 20 b of the support substrate portion 20, respectively. Openings 23A1 and 23A2 are provided along sides 20c and 20d different from the opposing sides 20a and 20b.
  • the deterioration factor such as moisture that tries to enter the gap G from the openings 22A1 and 22A2 of the outer blocking wall portion 22 is removed.
  • the light emitting unit 10 cannot be directly reached by blocking, so that deterioration of the organic EL element in the light emitting unit 10 can be suppressed.
  • an inflow path in which the adhesive 24 is opened from the opening 22A1 to the opening 23A1 and from the opening 23A2 to the opening 22A2 can be formed.
  • the natural adhesive 24 can be filled using the capillary action in the atmosphere.
  • the sealed cell is filled with the adhesive 24 after the sealed cell is depressurized. .
  • detour paths such as R11, R12, R13, and R14 shown in the figure are formed in the inflow path of the adhesive 24.
  • the detour paths R11 to R14 allow the adhesive 24 to be filled, while suppressing deterioration factors such as moisture from reaching the light emitting unit 10 after the adhesive 24 is cured.
  • the detour paths R11 to R14 do not necessarily have a long distance, and a black frame or dark spot is generated in the organic EL element only by preventing the intrusion of the deterioration factor that linearly reaches the light emitting unit 10 from the openings 22A1 and 22A2. And has the effect of slowing the progression.
  • FIG. 4 is an explanatory diagram (manufacturing flow diagram) showing a method for manufacturing an organic EL panel according to an embodiment of the present invention.
  • the manufacturing method of the organic EL panel according to the embodiment of the present invention includes a supporting substrate unit side process applied to the supporting substrate unit 20 alone and a sealing substrate unit side process applied to the sealing substrate unit 21 and support. It consists of a bonding / sealing process by the substrate part 20 and the sealing substrate part 21.
  • the support substrate part side process and the sealing substrate part side process can be executed in different lines or in different time series.
  • a light emitting part (organic EL element) forming step S10 for forming a light emitting part having an organic EL element on one surface on the supporting substrate part 20, and a protective film on the organic EL element as necessary.
  • a protective film forming step S11 to be formed is performed.
  • FIG. 5 is an explanatory view showing a configuration example of an organic EL element to be formed.
  • FIG. 4A shows an example of an active drive element having independent pixel electrodes
  • FIG. 4B shows an example of a passive drive element in which elements are formed at the intersections of stripe-shaped electrodes. ing.
  • a planarizing film 31 is formed on the support substrate portion 20 on which the driving element (TFT or the like) 30 is formed so as to cover the driving element 30, and the pixel electrode is formed on the planarizing film 31.
  • a lower electrode 32 is formed.
  • the lower electrode 32 can be formed by forming an electrode material on the planarizing film 31 and then patterning it by a photolithography process.
  • a connection line 30A for connecting the lower electrode 32 and the driving element 30 is formed, an insulating film 33 is formed in the peripheral portion thereof, and an opening pattern of the insulating film 33 on the lower electrode 32 is formed.
  • the organic layer 34 including the light emitting layer 34A is formed so as to cover it.
  • the organic layer 34 can be obtained by mask vapor deposition in which the mask opening is combined with the opening of the insulating film 33. Thereafter, the upper electrode 34 is formed so as to cover the entire organic layer 34.
  • the lower electrode 40 is formed in a stripe shape on the support substrate portion 20, and the insulating film 41 is formed thereon to form a stripe pattern so as to intersect the lower electrode 40.
  • stripe-shaped partition walls 42 are formed on the insulating film 41 as necessary. More preferably, the partition wall 42 has a side wall with a reverse taper inclined downward.
  • the organic layer 43 including the light emitting layer 43A is formed along the stripe-shaped opening portions of the insulating film 41 and the partition wall 42, and the stripe-shaped upper electrode 44 is formed thereon.
  • the partition wall 42 becomes a mask pattern when the upper electrode 44 is formed.
  • the organic material deposition layer 43R and the upper electrode material deposition layer 44R are deposited on the upper surface of the partition wall 42.
  • the lower electrodes 32 and 40 can be formed of a transparent electrode such as ITO.
  • a hole injection layer such as copper phthalocyanine (CuPc) is formed on the lower electrodes 32 and 40, and, for example, NPB (N, N-di (naphtalence) -N, N-dipheneyl-benzidene) is deposited as a hole transport layer.
  • the hole transport layer has a function of transporting holes injected from the lower electrodes 32 and 40 to the light emitting layers 34A and 43A.
  • the hole transport layer may be a single layer or a stack of two or more layers.
  • the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.
  • red (R), green (G), and blue (B) light emitting layers 34A and 43A are formed in the respective film formation regions by using a resistance masking method by using a coating mask.
  • red (R) an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4′-dimethylaminostyryl) -4H-pyran) is used.
  • An organic material that emits green light such as an aluminum quinolinol complex (Alq 3 ) is used as green (G).
  • an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used.
  • a distyryl derivative or a triazole derivative is used.
  • other materials or a host-guest layer structure may be used, and the emission form may be a fluorescent material or a phosphorescent material.
  • the electron transport layer formed on the light emitting layers 34A and 43A is formed using various materials such as an aluminum quinolinol complex (Alq 3 ) by various film forming methods such as resistance heating vapor deposition.
  • the electron transport layer has a function of transporting electrons injected from the upper electrodes 35 and 44 to the light emitting layers 34A and 43A.
  • This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked.
  • the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.
  • the insulating films 33 and 41 and the partition wall 42 are made of polyimide or a resist material.
  • a material having a work function lower than that of the anode is used so as to have an electron injection function.
  • ITO indium gallium
  • Al aluminum
  • Mg—Ag magnesium alloy
  • Al since Al has a low electron injection capability, it is preferable to provide an electron injection layer such as LiF between Al and the electron transport layer.
  • a moisture-proof inorganic film or organic film is formed on the organic EL element by a method such as vapor deposition, coating, or chemical vapor deposition (CD).
  • a method such as vapor deposition, coating, or chemical vapor deposition (CD).
  • an organic material film containing CaO or the like can be formed by vapor deposition, and a metal oxide film such as SiO 2 can be formed by CVD or the like.
  • a wall pattern is formed on the sealing substrate portion 21.
  • the pattern of the outer blocking wall portion 22 is formed so as to have at least an opening 22A1 along the outer edge of the sealing substrate portion 21.
  • the pattern of the inner blocking wall portion 23 is formed so as to partially surround the light emitting unit 10 inside the outer blocking wall portion 22.
  • the inner side blocking wall part 23 is formed so that all the opening parts of the outer side blocking wall part 22 may be opposed.
  • a glass paste can be used as a material for forming the wall, and pattern formation techniques such as screen printing can be used for pattern formation.
  • wall pattern formation process S20 by glass welding using glass paste is explained.
  • the glass paste is a general glass welding material, and is V 2 O 5 or SnO-based glass.
  • the glass paste is uniformly formed to a predetermined size, and heated to dry and remove the solvent of the glass paste. Thereafter, the binder component of the glass paste is removed in a degreasing and firing furnace, and the glass paste is baked and hardened on the sealing substrate portion 21 and calcined. Thereafter, the sealing substrate portion 21 is cleaned as necessary.
  • the material for forming the wall portion is not limited to glass paste, and a resin material having a high blocking property against deterioration factors such as moisture can also be used.
  • the bonding / sealing step includes a sealing cell forming step S30 in which a sealing cell is formed by the support substrate portion 20 and the sealing substrate portion 21, an adhesive filling step S31 in which an adhesive is filled in the sealing cell, sealing An adhesive curing step S32 for curing the adhesive filled in the stop cell is included.
  • Sealing cell formation process S30 bonds together the support substrate part 20 in which the light emission part 10 was formed, and the sealing substrate part 21 in which the wall part was patterned so that a wall part might interpose between both.
  • necessary alignment adjustment is performed, and when the adjustment is completed, the positional relationship between the support substrate portion 20 and the sealing substrate portion 21 is fixed.
  • the wall part is hardened
  • a sealed cell in which the light emitting unit 10 is accommodated in the gap between the support substrate unit 20 and the sealing substrate unit 21 is formed.
  • the wall portion is irradiated with laser through the support substrate portion 20 or the sealing substrate portion 21 to weld the glass paste.
  • a laser welding machine is used.
  • the laser light source a semiconductor laser or a YAG laser is used, and laser light with a wavelength of 800 to 1100 nm is irradiated.
  • the support substrate part 20 and the sealing substrate part 21 needs to be a transparent member.
  • the welded glass paste is cured with a decrease in temperature to join the support substrate part 20 and the sealing substrate part 21, and the sealing cell in which the light emitting part 10 is housed in the gap between the support substrate part 20 and the sealing substrate part 21. Is formed.
  • the sealing cell is filled with an adhesive in a vacuum chamber or in the atmosphere.
  • the process in the vacuum chamber is the same as that of the prior art shown in FIG.
  • the inside of the sealed cell is evacuated and the opening 22A is immersed in the adhesive liquid, and the ambient pressure is increased by increasing the ambient pressure. The pressure difference is used to fill the sealing cell with the adhesive.
  • a third step of introducing an inert gas into the tank and injecting the adhesive into the sealed cell with a pressure difference, and a fourth step of returning the inside of the vacuum tank to normal pressure and filling the sealed cell with the adhesive have.
  • a highly fluid adhesive is suitable.
  • an ultraviolet curable adhesive having a low viscosity can be used.
  • those that do not contain fillers or spacer particles are preferable.
  • a suitable example is an ultraviolet curable epoxy resin.
  • the sealing cell in which an adhesive inflow path from the opening 22A1 to the opening 23A1 and from the opening 23A2 to the opening 22A2 is formed is formed.
  • the adhesive can be injected into the sealed cell even in the atmosphere.
  • the sealing cell is filled with the adhesive while gradually replacing the air in the sealing cell with the adhesive by utilizing capillary action in the atmosphere.
  • the adhesive filled in the sealing cell is cured and the light emitting unit 10 is sealed.
  • the adhesive is cured by irradiating the adhesive with ultraviolet rays through one or both of the support member 20 and the sealing member 21.
  • the adhesive has thermosetting properties, it is cured by applying a heat treatment.
  • the desiccant is not disposed between the support substrate part 20 and the sealing substrate part 21, so that a space in the thickness direction for disposing the desiccant can be omitted, and the panel Thinning is possible.
  • the step of disposing the desiccant itself and the step of disposing the desiccant can be omitted from the manufacturing process, the manufacturing cost of the panel can be reduced, and the productivity can be further improved.
  • the space between the support substrate portion 20 and the sealing substrate portion 21 is filled with an adhesive layer, sufficient panel strength can be ensured even if the thickness of the support substrate portion 20 and the sealing substrate portion 21 is reduced. The desired panel strength can be obtained while reducing the thickness of the panel.
  • the outer blocking wall 22 has one opening 22 ⁇ / b> A along one side of the support substrate 20, and the inner blocking wall 23 has the one side of the support substrate 20.
  • the intrusion detour formed along the inner blocking wall portion 23 Since the path is secured sufficiently long, it is possible to sufficiently delay the deterioration factor from reaching the light emitting unit 10.
  • the outer blocking wall portion 22 has openings 22 ⁇ / b> A ⁇ b> 1 and 22 ⁇ / b> A ⁇ b> 2 along the opposing sides of the support substrate portion 20.
  • the above-described intrusion bypass path is shortened, but the bonding from the opening 22A1 to the opening 23A1 and further from the opening 23A2 to the opening 22A2 is performed. Since the inflow path in which the agent is released can be formed, the adhesive can be quickly filled, and the productivity of the panel can be improved.
  • the outer blocking wall 22 and the inner blocking wall 23 have a reliable blocking function against deterioration factors such as moisture.
  • the adhesive filled in the sealing cell it is preferable to use an ultraviolet curable adhesive having a desired fluidity when uncured. Thereby, filling of the adhesive into the sealing cell and curing of the adhesive after filling the adhesive into the sealing cell can be easily performed.
  • one or both of the support substrate part 20 and the sealing substrate part 21 needs to be a transparent substrate.
  • FIG. 6 is an explanatory view showing the structure of an organic EL panel according to an embodiment of the present invention.
  • FIG. 6 (a) is a YY sectional view of FIG. 6 (b), and FIG. An XX cross-sectional view in FIG.
  • the organic EL panel 1C according to the embodiment of the present invention includes the light emitting unit 10 having a plurality of organic EL elements, the support substrate unit 20 having the light emitting unit 10 formed on one surface, and the support substrate unit 20.
  • the sealing substrate portion 21 is disposed so as to face the light emitting portion 10, and is formed along the outer edge of the support substrate portion 20 and the sealing substrate portion 21, and has at least one opening portion 22 ⁇ / b> A.
  • the outer blocking wall portion 22 that blocks the gap G between the support substrate portion 20 and the sealing substrate portion 21 from the outside, and the light emitting portion 10 is partially enclosed inside the outer blocking wall portion 22.
  • an inner blocking wall portion 23 that blocks the inner side from the outer side, the inner blocking wall portion 23 is formed so as to face the opening 22A of the outer blocking wall portion 22, and a gap inside the outer blocking wall portion 22 is formed.
  • G is filled with an adhesive 24.
  • the light emitting unit 10 is covered with a protective film 11 made of an inorganic material, and the gap 24 on the light emitting unit 10 is filled with the adhesive 24 via the protective film 11.
  • the outgas generated from the adhesive 24 is blocked by the protective layer 11, thereby preventing the light emitting unit 10 from being adversely affected by the outgas.
  • the inner blocking wall portion 23 is formed so as to surround the substantially half circumference of the light emitting portion 10.
  • the filling time of the adhesive 24 injected from the opening 22A is shortened by relatively shortening the length of the inner blocking wall portion 23, thereby shortening the manufacturing process time.

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Abstract

In an organic EL panel, a light emitting part (10) consisting of organic EL elements is formed in a sealing cell consisting of a support substrate part (20) and a sealing substrate part (21), and adhesive is filled from an opening part (22A) of the sealing cell and cured. An inner shielding wall part (23) facing the opening part (22A) is formed on an inner side of an outer shielding wall part (22) having the opening part (22A) in order to prevent a deterioration factor such as moisture intruded through the opening part (22A) from reaching the organic EL elements of the light emitting part (10).

Description

有機ＥＬパネル及びその製造方法Organic EL panel and manufacturing method thereof
　本発明は、有機ＥＬパネル及びその製造方法に関するものである。 The present invention relates to an organic EL panel and a manufacturing method thereof.
　有機ＥＬパネルは、有機ＥＬ素子を発光素子としてパネル基板上に備えるもので、例えば携帯電話の表示画面，車載用或いは家庭用電子機器のモニタ画面，パーソナルコンピュータやテレビジョン受像装置の情報表示画面，宣伝用点灯パネル等に用いられる各種表示装置として、スキャナやプリンタ等に用いられる各種光源として、一般照明や液晶表示装置のバックライト等に用いられる照明装置として、或いは、光電変換機能を利用した光通信用デバイスとして、各種用途に利用可能な自発光パネルである。 An organic EL panel includes an organic EL element as a light emitting element on a panel substrate. For example, a display screen of a mobile phone, a monitor screen of a vehicle-mounted or household electronic device, an information display screen of a personal computer or a television receiver, As various display devices used in advertising lighting panels, etc., as various light sources used in scanners, printers, etc., as lighting devices used in general illumination, backlights of liquid crystal display devices, etc., or light utilizing a photoelectric conversion function It is a self-luminous panel that can be used for various purposes as a communication device.
　有機ＥＬ素子は大気に含まれる水分等に触れると発光特性が劣化する性質があるので、有機ＥＬパネルを長時間安定的に作動させるためには、有機ＥＬ素子を大気から遮断するための封止構造が必要不可欠になっている。有機ＥＬパネルの封止構造としては、有機ＥＬ素子が形成された基板と金属製又はガラス製の封止部材とを貼り合わせて有機ＥＬ素子を囲う封止空間を形成し、その封止空間内に乾燥剤を配備する構造（中空封止構造）が一般に採用されてきた。しかし、パネルの更なる薄型化や強度向上等を図ると共に、乾燥剤の配備工程を省いて製造工程の簡略化を図るため、基板上の有機ＥＬ素子を空間無く直接封止材料で被覆する固体封止構造の検討が進められている。 Since the organic EL element has a property that the light emission characteristic deteriorates when exposed to moisture in the atmosphere, the organic EL element is sealed to block the organic EL element from the atmosphere in order to operate the organic EL panel stably for a long time. Structure is indispensable. As a sealing structure of an organic EL panel, a substrate on which an organic EL element is formed and a metal or glass sealing member are bonded together to form a sealing space surrounding the organic EL element, and the inside of the sealing space In general, a structure (hollow sealing structure) in which a desiccant is disposed on the surface has been adopted. However, in order to further reduce the panel thickness and improve the strength, etc., and to simplify the manufacturing process by omitting the desiccant deployment process, a solid that directly covers the organic EL element on the substrate with a sealing material without a space Investigation of the sealing structure is underway.
　下記特許文献１に記載された従来技術では、図１に示すように、真空槽Ｊ１の中に、有機ＥＬ素子を形成した封入口Ｊ２０を有する透明容器Ｊ２と液状封止材料を入れた容器Ｊ３を分離して配置する工程（同図（ａ））、真空槽Ｊ１を高真空として、透明容器Ｊ２の封入口Ｊ２０を封止材料溶液中に浸漬する工程（同図（ｂ））、真空槽Ｊ１の中に、水分を含有しない不活性ガスを導入し、液状封止材料を透明容器Ｊ２中に圧力差によって注入する工程（同図（ｃ））、真空槽Ｊ１を常圧に戻し、透明容器Ｊ２を真空槽Ｊ１から取り出し、封入口Ｊ２０をシール材によって封止する工程（同図（ｄ））を含むものである。 In the prior art described in Patent Document 1 below, as shown in FIG. 1, a transparent container J2 having a sealing port J20 in which an organic EL element is formed and a container J3 containing a liquid sealing material in a vacuum chamber J1. (Step (b)), a step of immersing the sealing port J20 of the transparent container J2 in the sealing material solution with the vacuum chamber J1 set to a high vacuum (FIG. (B)), Introducing an inert gas that does not contain moisture into J1, and injecting the liquid sealing material into the transparent container J2 by a pressure difference (FIG. (C)), the vacuum chamber J1 is returned to normal pressure, and transparent The process includes taking out the container J2 from the vacuum chamber J1 and sealing the sealing port J20 with a sealing material ((d) in the figure).
特開平７－２１１４５６号公報Japanese Patent Laid-Open No. 7-21456
　有機ＥＬ素子を形成した基板と封止部材とを樹脂製の接着剤で貼り合わせた場合、樹脂製の接着剤は硬化後であっても水分の浸入を遮断する機能が低いので、接着剤層を通過して水分等の劣化因子が有機ＥＬパネルの中に侵入し、有機ＥＬ素子の黒枠（有機ＥＬ素子で形成された画素の周辺から非発光部が広がる現象）やダークスポット（有機ＥＬ素子で形成された画素中に非発光部が点在する現象）が進行してパネル寿命が低下することになる。これに対しては、中空の封止空間を形成してその中に乾燥剤を配備しておくことで、接着剤層を通過して侵入する水分の悪影響を少なくすることができる。しかし、封止空間を形成するものでは、パネル厚を薄型化することが困難になる。またパネルを薄型化するほど強度を確保することができない問題があると共に、乾燥剤を配備する工程がコストアップになるといった問題がある。 When the substrate on which the organic EL element is formed and the sealing member are bonded to each other with a resin adhesive, the resin adhesive has a low function of blocking moisture entry even after curing, so that the adhesive layer Deterioration factors such as moisture enter the organic EL panel through the organic EL element, and the black frame of the organic EL element (a phenomenon in which the non-light-emitting portion spreads from the periphery of the pixel formed of the organic EL element) or dark spot (organic EL element) The phenomenon in which the non-light emitting portions are scattered in the pixels formed in (a) progresses and the panel life is reduced. On the other hand, by forming a hollow sealed space and disposing a desiccant therein, the adverse effect of moisture entering through the adhesive layer can be reduced. However, it is difficult to reduce the panel thickness if the sealing space is formed. In addition, there is a problem that the strength cannot be ensured as the panel is made thinner, and there is a problem that the process of arranging the desiccant increases the cost.
　前述した従来技術では、パネル容器の外壁を水分遮断機能の高い材質で形成することができ、その外壁の一部に形成した封入口から液状接着剤を注入するので、周囲を樹脂製の接着剤層で形成する場合と比較して、水分等の劣化因子の侵入度合いを低下させることが可能になり、有機ＥＬパネルの寿命低下を抑制することが可能になる。 In the above-described prior art, the outer wall of the panel container can be formed of a material having a high moisture blocking function, and the liquid adhesive is injected from the sealing port formed in a part of the outer wall. Compared with the case of forming with a layer, it is possible to reduce the degree of penetration of deterioration factors such as moisture, and to suppress the lifetime reduction of the organic EL panel.
　しかしながら、パネル容器内に封入口から液状接着剤を注入した後は、最終的に封入口をシール材で塞ぐことが必要になり、このシール材としてはやはり樹脂製の接着剤を用いざるを得ないことから、注入口を塞いだ接着剤層から水分等の劣化因子が侵入することになり、有機ＥＬ素子の寿命を更に長期化することができない問題があった。 However, after injecting the liquid adhesive into the panel container from the sealing port, it is necessary to finally close the sealing port with a sealing material, and it is necessary to use a resin adhesive as the sealing material. Therefore, there is a problem that deterioration factors such as moisture enter from the adhesive layer blocking the injection port, and the life of the organic EL element cannot be further prolonged.
　本発明は、このような問題に対処することを課題の一例とするものである。すなわち、封止空間を有さない固体封止構造を採用することで、パネルの薄型化を可能にすると共にパネル強度を向上させること、封止空間に乾燥剤を配備する工程を省くことで、パネルの生産性を向上させること、パネル内へ劣化因子が侵入することによる有機ＥＬ素子の劣化を防ぎ有機ＥＬパネルの長寿命化を図ること、等が本発明の目的である。 The present invention is an example of a problem to deal with such a problem. That is, by adopting a solid sealing structure that does not have a sealing space, it is possible to reduce the thickness of the panel and improve the panel strength, omitting the step of deploying a desiccant in the sealing space, An object of the present invention is to improve the productivity of the panel, to prevent the deterioration of the organic EL element due to the intrusion of the deterioration factor into the panel, and to extend the life of the organic EL panel.
　このような目的を達成するために、本発明による有機ＥＬパネル及びその製造方法は、以下の各独立請求項に係る構成を少なくとも具備するものである。
　［請求項１］複数の有機ＥＬ素子を有する発光部と、該発光部が一面上に形成された支持基板部と、前記支持基板部に対面して前記発光部を覆うように配置された封止基板部と、前記支持基板部と前記封止基板部の外縁に沿って形成され、少なくとも一つの開口部を有して該開口部以外で前記支持基板部と前記封止基板部との間隙を外部と遮断する外側遮断壁部と、前記外側遮断壁部の内側で前記発光部を部分的に囲うように形成され、その内側をその外側と遮断する内側遮断壁部とを備え、前記外側遮断壁部の開口部に対向するように前記内側遮断壁部を形成し、前記外側遮断壁部の内側における前記間隙に接着剤を充填したことを特徴とする有機ＥＬパネル。
　［請求項６］支持基板部上の一面に、下部電極と有機層と上部電極を備えた有機ＥＬ素子を有する発光部を形成する工程と、前記支持基板部と封止基板部の外縁に沿って、少なくとも一つの開口部を有して該開口部以外で前記支持基板部と前記封止基板部との間隙を外部と遮断する外側遮断壁部を形成すると共に、前記外側遮断壁部の内側で前記発光部を部分的に囲うように、その内側をその外側と遮断する内側遮断壁部を形成して、前記支持基板部と前記封止基板部との間隙に封止セルを形成する工程と、前記封止セル内に接着剤を充填させる工程と、前記封止セル内に充填された接着剤を硬化させる工程とを有することを特徴とする有機ＥＬパネルの製造方法。 In order to achieve such an object, the organic EL panel and the manufacturing method thereof according to the present invention include at least the configurations according to the following independent claims.
[Claim 1] A light emitting section having a plurality of organic EL elements, a support substrate section on which the light emission section is formed, and a seal disposed so as to face the support substrate section and cover the light emission section. A stop substrate portion, and a gap between the support substrate portion and the sealing substrate portion formed along the outer edge of the support substrate portion and the sealing substrate portion, having at least one opening, and other than the opening. An outer shielding wall portion that shields the outside from the outside, and an inner shielding wall portion that is formed so as to partially surround the light emitting portion inside the outer shielding wall portion and shields the inside from the outside. An organic EL panel, wherein the inner blocking wall is formed so as to face the opening of the blocking wall, and an adhesive is filled in the gap inside the outer blocking wall.
[Claim 6] A step of forming a light emitting part having an organic EL element including a lower electrode, an organic layer, and an upper electrode on one surface of the supporting substrate part, and along an outer edge of the supporting substrate part and the sealing substrate part And forming an outer blocking wall portion having at least one opening portion and blocking a gap between the support substrate portion and the sealing substrate portion from the outside other than the opening portion, and inside the outer blocking wall portion. Forming a sealing cell in a gap between the support substrate portion and the sealing substrate portion by forming an inner blocking wall portion that shields the inner side from the outer side so as to partially surround the light emitting portion. And a method of filling the sealing cell with an adhesive, and a step of curing the adhesive filled in the sealing cell.
従来技術の説明図である。It is explanatory drawing of a prior art. 本発明の実施形態に係る有機ＥＬパネルの説明図である。It is explanatory drawing of the organic electroluminescent panel which concerns on embodiment of this invention. 本発明の他の実施形態に係る有機ＥＬパネルの説明図である。It is explanatory drawing of the organic electroluminescent panel which concerns on other embodiment of this invention. 本発明の実施形態に係る有機ＥＬパネルの製造方法を示した説明図である。It is explanatory drawing which showed the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention. 本発明の実施形態に係る有機ＥＬパネルの発光部を示した説明図である。It is explanatory drawing which showed the light emission part of the organic electroluminescent panel which concerns on embodiment of this invention. 本発明の実施例に係る有機ＥＬパネルを示す説明図である。It is explanatory drawing which shows the organic electroluminescent panel which concerns on the Example of this invention.
　以下、本発明の実施形態を図面に基づいて説明する。図２は本発明の一実施形態に係る有機ＥＬパネルの構造を示した説明図であり、同図（ａ）は同図（ｂ）におけるＸ－Ｘ断面図、同図（ｂ）は同図（ａ）におけるＹ－Ｙ断面図を示している。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2 is an explanatory view showing the structure of an organic EL panel according to an embodiment of the present invention. FIG. 2 (a) is a sectional view taken along line XX in FIG. 2 (b), and FIG. The YY sectional view in (a) is shown.
　本発明の実施形態に係る有機ＥＬパネル１Ａは、複数の有機ＥＬ素子を有する発光部１０と、発光部１０が一面上に形成された支持基板部２０と、支持基板部２０に対面して発光部１０を覆うように配置された封止基板部２１と、支持基板部２０と封止基板部２１の外縁に沿って形成され、少なくとも一つの開口部２２Ａを有して開口部２２Ａ以外で支持基板部２０と封止基板部２１との間隙Ｇを外部と遮断する外側遮断壁部２２と、外側遮断壁部２２の内側で発光部１０を部分的に囲うように形成され、その内側をその外側と遮断する内側遮断壁部２３とを備え、外側遮断壁部２２の開口部２２Ａに対向するように内側遮断壁部２３を形成し、外側遮断壁部２２の内側における間隙Ｇに接着剤２４を充填したものである。 An organic EL panel 1A according to an embodiment of the present invention includes a light emitting unit 10 having a plurality of organic EL elements, a support substrate unit 20 having the light emitting unit 10 formed on one surface, and light emission facing the support substrate unit 20. The sealing substrate portion 21 is disposed so as to cover the portion 10, and is formed along the outer edge of the supporting substrate portion 20 and the sealing substrate portion 21. The sealing substrate portion 21 has at least one opening portion 22 A and is supported by other than the opening portion 22 A. An outer blocking wall portion 22 that blocks the gap G between the substrate portion 20 and the sealing substrate portion 21 from the outside, and is formed so as to partially surround the light emitting portion 10 inside the outer blocking wall portion 22, An inner blocking wall portion 23 for blocking the outer side, the inner blocking wall portion 23 is formed so as to face the opening 22A of the outer blocking wall portion 22, and an adhesive 24 is provided in the gap G inside the outer blocking wall portion 22. Is filled.
　図２に示した実施形態では、外側遮断壁部２２は支持基板部２０における一辺２０ａに沿って一つの開口部２２Ａを有し、内側遮断壁部２３は支持基板部２０における一辺２０ａと対向する辺２０ｂに沿って一つの開口部２３Ａを有している。本発明の実施形態としては、開口部２２Ａは何処に設けてもいくつ設けてもよいが、その開口部２２Ａに対向するように内側遮断壁部２３が形成されていることが要件となる。内側遮断壁部２３としては、発光部１０が部分的に囲まれていればよく、その両端が広く開放されているものであってもよい（例えば、図６に示した実施例参照）。 In the embodiment shown in FIG. 2, the outer blocking wall portion 22 has one opening 22 </ b> A along one side 20 a in the support substrate portion 20, and the inner blocking wall portion 23 faces the one side 20 a in the support substrate portion 20. One opening 23A is provided along the side 20b. As an embodiment of the present invention, the opening 22A may be provided anywhere and any number, but it is a requirement that the inner blocking wall 23 be formed so as to face the opening 22A. The inner blocking wall portion 23 may be one in which the light emitting portion 10 is partially surrounded, and both ends thereof may be widely opened (for example, see the embodiment shown in FIG. 6).
　このような本発明の実施形態によると、外側遮断壁部２２の開口部２２Ａから間隙Ｇ内に侵入しようとする水分等の劣化因子を、内側遮断壁部２３で遮って発光部１０に直接到達できないようにしているので、発光部１０における有機ＥＬ素子の劣化を抑制することができる。ここで外側遮断壁部２２と内側遮断壁部２３は水分等の劣化因子が内側に侵入するのを阻止するものである必要があり、接着剤層に比べて水分等の劣化因子の遮断性能が高いガラス材等の無機材料によって形成されることが好ましい。開口部２２Ａから外側遮断壁部２２の内側に侵入してきた劣化因子は、内側遮断壁部２３に沿って迂回せざるを得ないので、内側遮断壁部２３で囲まれた発光部１０に直接到達することができない。 According to such an embodiment of the present invention, a deterioration factor such as moisture that tries to enter the gap G from the opening 22A of the outer blocking wall 22 is blocked by the inner blocking wall 23 and reaches the light emitting unit 10 directly. Therefore, the deterioration of the organic EL element in the light emitting unit 10 can be suppressed. Here, the outer blocking wall portion 22 and the inner blocking wall portion 23 need to prevent deterioration factors such as moisture from entering the inside, and the blocking performance of the deterioration factors such as moisture is higher than that of the adhesive layer. It is preferably formed of an inorganic material such as a high glass material. Deterioration factors that have entered the inside of the outer blocking wall portion 22 from the opening 22 </ b> A must be diverted along the inner blocking wall portion 23, and thus directly reach the light emitting unit 10 surrounded by the inner blocking wall portion 23. Can not do it.
　外側遮断壁部２２によって支持基板部２０と封止基板部２１との間隙Ｇに発光部１０を封止する封止セルが形成されることになる。封止セル全体に接着剤２４を充填させるためには、開口部２２Ａから内側遮断壁部２３の内側間隙に至る流入経路が必要になるが、この流入経路に図示のＲ１，Ｒ２のような迂回経路を形成する。この迂回経路Ｒ１，Ｒ２によって、接着剤２４の充填を可能にしながら、接着剤２４の硬化後に水分等の劣化因子が発光部１０に到達するのを抑制することができる。 A sealing cell for sealing the light emitting unit 10 is formed in the gap G between the support substrate unit 20 and the sealing substrate unit 21 by the outer blocking wall unit 22. In order to fill the entire sealing cell with the adhesive 24, an inflow path from the opening 22A to the inner gap of the inner blocking wall 23 is necessary. Form a pathway. The detour paths R1 and R2 can prevent the deterioration factor such as moisture from reaching the light emitting unit 10 after the adhesive 24 is cured while allowing the adhesive 24 to be filled.
　図３は本発明の他の実施形態に係る有機ＥＬパネルの構造を示した説明図であり、同図（ａ）は同図（ｂ）におけるＸ－Ｘ断面図、同図（ｂ）は同図（ａ）におけるＹ－Ｙ断面図を示している。 FIG. 3 is an explanatory view showing the structure of an organic EL panel according to another embodiment of the present invention. FIG. 3 (a) is a sectional view taken along line XX in FIG. 3 (b), and FIG. A YY cross-sectional view in FIG.
　この実施形態に係る有機ＥＬパネル１Ｂは、前述した実施形態に係る有機ＥＬパネル１Ａと同様に、複数の有機ＥＬ素子を有する発光部１０と、発光部１０が一面上に形成された支持基板部２０と、支持基板部２０に対面して発光部１０を覆うように配置された封止基板部２１と、支持基板部２０と封止基板部２１の外縁に沿って形成され、開口部２２Ａ１，２２Ａ２を有して開口部２２Ａ１，２２Ａ２以外で支持基板部２０と封止基板部２１との間隙Ｇを外部と遮断する外側遮断壁部２２と、外側遮断壁部２２の内側で発光部１０を部分的に囲うように形成され、その内側をその外側と遮断する内側遮断壁部２３とを備え、外側遮断壁部２２の開口部２２Ａ１，２２Ａ２に対向するように内側遮断壁部２３を形成し、外側遮断壁部２２の内側における間隙Ｇに接着剤２４を充填したものである。 Similar to the organic EL panel 1A according to the above-described embodiment, the organic EL panel 1B according to this embodiment includes a light emitting unit 10 having a plurality of organic EL elements, and a support substrate unit on which the light emitting unit 10 is formed on one surface. 20, a sealing substrate portion 21 disposed so as to face the support substrate portion 20 so as to cover the light emitting portion 10, and an opening 22 </ b> A <b> 1, formed along the outer edge of the support substrate portion 20 and the sealing substrate portion 21. The outer blocking wall portion 22 having 22A2 and blocking the gap G between the support substrate portion 20 and the sealing substrate portion 21 outside the openings 22A1 and 22A2, and the light emitting portion 10 inside the outer blocking wall portion 22. An inner blocking wall portion 23 is formed so as to partially surround the inner blocking wall portion 23 to block the inner side thereof from the outer side thereof, and the inner blocking wall portion 23 is formed to face the openings 22A1 and 22A2 of the outer blocking wall portion 22. The outer barrier wall 22 It is obtained by filling the adhesive 24 in the gap G in the side.
　図３に示した実施形態では、外側遮断壁部２２は支持基板部２０の対向する辺２０ａ，２０ｂに沿ってそれぞれ開口部２２Ａ１，２２Ａ２を有し、内側遮断壁部２３は支持基板部２０の対向する辺２０ａ，２０ｂと異なる辺２０ｃ，２０ｄに沿って開口部２３Ａ１，２３Ａ２を有している。 In the embodiment shown in FIG. 3, the outer blocking wall portion 22 has openings 22 </ b> A <b> 1 and 22 </ b> A <b> 2 along the opposing sides 20 a and 20 b of the support substrate portion 20, respectively. Openings 23A1 and 23A2 are provided along sides 20c and 20d different from the opposing sides 20a and 20b.
　このような本発明の実施形態によると、前述した実施形態と同様に、外側遮断壁部２２の開口部２２Ａ１，２２Ａ２から間隙Ｇ内に侵入しようとする水分等の劣化因子を、内側遮断壁部２３で遮って発光部１０に直接到達できないようにしているので、発光部１０における有機ＥＬ素子の劣化を抑制することができる。 According to such an embodiment of the present invention, in the same manner as the above-described embodiment, the deterioration factor such as moisture that tries to enter the gap G from the openings 22A1 and 22A2 of the outer blocking wall portion 22 is removed. 23, the light emitting unit 10 cannot be directly reached by blocking, so that deterioration of the organic EL element in the light emitting unit 10 can be suppressed.
　この実施形態では、例えば、開口部２２Ａ１から開口部２３Ａ１に至り、更に開口部２３Ａ２から開口部２２Ａ２に至る接着剤２４の開放された流入経路を形成することができる。これによって、大気中での毛細管現象を利用して自然な接着剤２４の充填が可能になる。これに対して、図２に示した実施形態では、接着剤２４の開放された流入経路が形成されないので、封止セル内を減圧状態にした後、封止セル内に接着剤２４を充填させる。 In this embodiment, for example, an inflow path in which the adhesive 24 is opened from the opening 22A1 to the opening 23A1 and from the opening 23A2 to the opening 22A2 can be formed. As a result, the natural adhesive 24 can be filled using the capillary action in the atmosphere. On the other hand, in the embodiment shown in FIG. 2, since the inflow path where the adhesive 24 is opened is not formed, the sealed cell is filled with the adhesive 24 after the sealed cell is depressurized. .
　この実施形態では、接着剤２４の流入経路に図示のＲ１１，Ｒ１２，Ｒ１３，Ｒ１４のような迂回経路を形成している。この迂回経路Ｒ１１～Ｒ１４によって、接着剤２４の充填を可能にしながら、接着剤２４の硬化後に水分等の劣化因子が発光部１０に到達するのを抑制している。この迂回経路Ｒ１１～Ｒ１４は必ずしも長い距離にする必要はなく、開口部２２Ａ１，２２Ａ２から直線的に発光部１０に到達する劣化因子の侵入を阻止するだけで有機ＥＬ素子における黒枠やダークスポットの発生や進行を遅らせる効果がある。 In this embodiment, detour paths such as R11, R12, R13, and R14 shown in the figure are formed in the inflow path of the adhesive 24. The detour paths R11 to R14 allow the adhesive 24 to be filled, while suppressing deterioration factors such as moisture from reaching the light emitting unit 10 after the adhesive 24 is cured. The detour paths R11 to R14 do not necessarily have a long distance, and a black frame or dark spot is generated in the organic EL element only by preventing the intrusion of the deterioration factor that linearly reaches the light emitting unit 10 from the openings 22A1 and 22A2. And has the effect of slowing the progression.
　図４は、本発明の実施形態に係る有機ＥＬパネルの製造方法を示した説明図（製造フロー図）である。本発明の実施形態に係る有機ＥＬパネルの製造方法は、支持基板部２０に対して単独で施す支持基板部側工程と封止基板部２１に対して単独で施す封止基板部側工程と支持基板部２０と封止基板部２１による貼り合わせ・封止工程からなる。支持基板部側工程と封止基板部側工程は別ライン又は異なる時系列での実行が可能である。 FIG. 4 is an explanatory diagram (manufacturing flow diagram) showing a method for manufacturing an organic EL panel according to an embodiment of the present invention. The manufacturing method of the organic EL panel according to the embodiment of the present invention includes a supporting substrate unit side process applied to the supporting substrate unit 20 alone and a sealing substrate unit side process applied to the sealing substrate unit 21 and support. It consists of a bonding / sealing process by the substrate part 20 and the sealing substrate part 21. The support substrate part side process and the sealing substrate part side process can be executed in different lines or in different time series.
　支持基板部側工程としては、支持基板部２０上の一面に有機ＥＬ素子を有する発光部を形成する発光部（有機ＥＬ素子）形成工程Ｓ１０と、必要に応じて有機ＥＬ素子上に保護膜を形成する保護膜形成工程Ｓ１１が実行される。 As the supporting substrate part side process, a light emitting part (organic EL element) forming step S10 for forming a light emitting part having an organic EL element on one surface on the supporting substrate part 20, and a protective film on the organic EL element as necessary. A protective film forming step S11 to be formed is performed.
　発光部（有機ＥＬ素子）形成工程Ｓ１０は、基本的には、支持基板部２０上に直接又は他の層を介して下部電極を形成し、その上に発光層を含む有機層及び上部電極を形成する。図５は、形成される有機ＥＬ素子の構成例を示した説明図である。同図（ａ）が独立した画素電極を備えるアクディブ駆動素子の例を示しており、同図（ｂ）が交差するストライプ状の電極の交差部に素子が形成されるパッシブ駆動素子の例を示している。 In the light emitting part (organic EL element) forming step S10, basically, a lower electrode is formed on the support substrate part 20 directly or via another layer, and an organic layer and an upper electrode including the light emitting layer are formed thereon. Form. FIG. 5 is an explanatory view showing a configuration example of an organic EL element to be formed. FIG. 4A shows an example of an active drive element having independent pixel electrodes, and FIG. 4B shows an example of a passive drive element in which elements are formed at the intersections of stripe-shaped electrodes. ing.
　同図（ａ）の例では、駆動素子（ＴＦＴ等）３０が形成された支持基板部２０上に駆動素子３０を覆うように平坦化膜３１を形成し、その平坦化膜３１上に画素電極となる下部電極３２を形成する。下部電極３２は平坦化膜３１上に電極材料を成膜した後、フォトリソ工程でパターニングして形成することができる。下部電極３２を形成した後は、下部電極３２と駆動素子３０を接続する接続線３０Ａを形成し、その周辺部分に絶縁膜３３を形成して、下部電極３２上の絶縁膜３３の開口パターンを覆うように発光層３４Ａを含む有機層３４を形成する。有機層３４は、マスク開口部を絶縁膜３３の開口部と併せたマスク蒸着によって得ることができる。その後有機層３４全体を覆うように上部電極３４が形成される。 In the example of FIG. 5A, a planarizing film 31 is formed on the support substrate portion 20 on which the driving element (TFT or the like) 30 is formed so as to cover the driving element 30, and the pixel electrode is formed on the planarizing film 31. A lower electrode 32 is formed. The lower electrode 32 can be formed by forming an electrode material on the planarizing film 31 and then patterning it by a photolithography process. After forming the lower electrode 32, a connection line 30A for connecting the lower electrode 32 and the driving element 30 is formed, an insulating film 33 is formed in the peripheral portion thereof, and an opening pattern of the insulating film 33 on the lower electrode 32 is formed. The organic layer 34 including the light emitting layer 34A is formed so as to cover it. The organic layer 34 can be obtained by mask vapor deposition in which the mask opening is combined with the opening of the insulating film 33. Thereafter, the upper electrode 34 is formed so as to cover the entire organic layer 34.
　同図（ｂ）の例では、支持基板部２０上にストライプ状に下部電極４０を形成し、その上に絶縁膜４１を成膜して下部電極４０と交差するようにストライプ状のパターンを形成する。更に、必要に応じて絶縁膜４１上にストライプ状の隔壁４２を形成する。隔壁４２は側壁に下向き傾斜の逆テーパを付けたものがより好ましい。そして、絶縁膜４１及び隔壁４２のストライプ状開口部に沿って発光層４３Ａを含む有機層４３を形成し、その上にストライプ状の上部電極４４を形成する。隔壁４２は上部電極４４形成時のマスクパターンになる。有機層４３と上部電極４４を成膜する際に隔壁４２の上面には有機材料堆積層４３Ｒと上部電極材料堆積層４４Ｒが堆積されることになる。 In the example of FIG. 5B, the lower electrode 40 is formed in a stripe shape on the support substrate portion 20, and the insulating film 41 is formed thereon to form a stripe pattern so as to intersect the lower electrode 40. To do. Further, stripe-shaped partition walls 42 are formed on the insulating film 41 as necessary. More preferably, the partition wall 42 has a side wall with a reverse taper inclined downward. Then, the organic layer 43 including the light emitting layer 43A is formed along the stripe-shaped opening portions of the insulating film 41 and the partition wall 42, and the stripe-shaped upper electrode 44 is formed thereon. The partition wall 42 becomes a mask pattern when the upper electrode 44 is formed. When the organic layer 43 and the upper electrode 44 are formed, the organic material deposition layer 43R and the upper electrode material deposition layer 44R are deposited on the upper surface of the partition wall 42.
　下部電極３２，４０を陽極として、上部電極３５，４４を陰極とした場合の有機層３４，４３の形成例を以下に示す。下部電極３２，４０はＩＴＯ等の透明電極によって形成することができ、下部電極３２，４０上に銅フタロシアニン（ＣｕＰｃ）等の正孔注入層を形成し、その上に、例えば、ＮＰＢ（N,N-di(naphtalence)-N,N-dipheneyl-benzidene）を正孔輸送層として成膜する。この正孔輸送層は、下部電極３２，４０から注入される正孔を発光層３４Ａ，４３Ａに輸送する機能を有する。この正孔輸送層は、１層だけ積層したものでも２層以上積層したものであってもよい。また正孔輸送層は、単一の材料による成膜ではなく、複数の材料により一つの層を形成しても良く、電荷輸送能力の高いホスト材料に電荷供与（受容）性の高いゲスト材料をドーピングしてもよい。 An example of forming the organic layers 34 and 43 when the lower electrodes 32 and 40 are used as anodes and the upper electrodes 35 and 44 are used as cathodes is shown below. The lower electrodes 32 and 40 can be formed of a transparent electrode such as ITO. A hole injection layer such as copper phthalocyanine (CuPc) is formed on the lower electrodes 32 and 40, and, for example, NPB (N, N-di (naphtalence) -N, N-dipheneyl-benzidene) is deposited as a hole transport layer. The hole transport layer has a function of transporting holes injected from the lower electrodes 32 and 40 to the light emitting layers 34A and 43A. The hole transport layer may be a single layer or a stack of two or more layers. In addition, the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.
　次に、正孔輸送層の上に発光層３４Ａ，４３Ａを成膜する。一例としては、抵抗加熱蒸着法により、赤（Ｒ）、緑（Ｇ）、青（Ｂ）の発光層３４Ａ，４３Ａを、塗分け用マスクを利用してそれぞれの成膜領域に成膜する。赤（Ｒ）としてＤＣＭ１（４－（ジシアノメチレン）－２－メチル－６－（４’－ジメチルアミノスチリル）－４Ｈ－ピラン）等のスチリル色素等の赤色を発光する有機材料を用いる。緑（Ｇ）としてアルミキノリノール錯体（Ａｌｑ3） 等の緑色を発光する有機材料を用いる。青（Ｂ）としてジスチリル誘導体、トリアゾール誘導体等の青色を発光する有機材料を用いる。勿論、他の材料でも、ホスト-ゲスト系の層構成でも良く、発光形態も蛍光発光材料を用いてもりん光発光材料を用いたものであってもよい。 Next, the light emitting layers 34A and 43A are formed on the hole transport layer. As an example, red (R), green (G), and blue (B) light emitting layers 34A and 43A are formed in the respective film formation regions by using a resistance masking method by using a coating mask. As the red (R), an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4′-dimethylaminostyryl) -4H-pyran) is used. An organic material that emits green light such as an aluminum quinolinol complex (Alq 3 ) is used as green (G). As the blue (B), an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used. Of course, other materials or a host-guest layer structure may be used, and the emission form may be a fluorescent material or a phosphorescent material.
　発光層３４Ａ，４３Ａの上に成膜される電子輸送層は、抵抗加熱蒸着法等の各種成膜方法により、例えばアルミキノリノール錯体（Ａｌｑ3 ）等の各種材料を用いて成膜する。電子輸送層は、上部電極３５，４４から注入される電子を発光層３４Ａ，４３Ａに輸送する機能を有する。この電子輸送層は、１層だけ積層したものでも２層以上積層した多層構造を有してもよい。また、電子輸送層は、単一の材料による成膜ではなく、複数の材料により一つの層を形成しても良く、電荷輸送能力の高いホスト材料に電荷供与（受容）性の高いゲスト材料をドーピングして形成してもよい。 The electron transport layer formed on the light emitting layers 34A and 43A is formed using various materials such as an aluminum quinolinol complex (Alq 3 ) by various film forming methods such as resistance heating vapor deposition. The electron transport layer has a function of transporting electrons injected from the upper electrodes 35 and 44 to the light emitting layers 34A and 43A. This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked. In addition, the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.
　絶縁膜３３，４１や隔壁４２はポリイミドやレジスト材料から構成される。上部電極３５，４４は、陰極として機能する場合には、電子注入機能を有するように、陽極より仕事関数の低い材料を用いる。例えば、陽極としてＩＴＯを用いた場合には、アルミニウム（Ａｌ）やマグネシウム合金（Ｍｇ-Ａｇ）を利用するのが好ましい。但し、Ａｌは電子注入能力が低いためにＡｌと電子輸送層との間にＬｉＦのような電子注入層を設けることが好ましい。 The insulating films 33 and 41 and the partition wall 42 are made of polyimide or a resist material. When the upper electrodes 35 and 44 function as cathodes, a material having a work function lower than that of the anode is used so as to have an electron injection function. For example, when ITO is used as the anode, it is preferable to use aluminum (Al) or a magnesium alloy (Mg—Ag). However, since Al has a low electron injection capability, it is preferable to provide an electron injection layer such as LiF between Al and the electron transport layer.
　図４に戻って、保護膜形成工程Ｓ１１は、蒸着や塗布，化学的気相蒸着（ＣＤ）等の方法で防湿性の無機膜や有機膜を有機ＥＬ素子上に形成する。例えば、ＣａＯ等を含む有機材料膜を蒸着によって形成することがき、ＳｉＯ２等の金属酸化膜をＣＶＤ等で形成することができる。 Returning to FIG. 4, in the protective film forming step S <b> 11, a moisture-proof inorganic film or organic film is formed on the organic EL element by a method such as vapor deposition, coating, or chemical vapor deposition (CD). For example, an organic material film containing CaO or the like can be formed by vapor deposition, and a metal oxide film such as SiO 2 can be formed by CVD or the like.
　封止基板部側工程である壁部パターン形成工程Ｓ２０は、封止基板部２１上に壁部のパターンを形成する。外側遮断壁部２２のパターンとしては、封止基板部２１の外縁に沿って少なくとも開口部２２Ａ１を有するように形成される。内側遮断壁部２３のパターンとしては、外側遮断壁部２２の内側で発光部１０を部分的に囲うように形成される。また、外側遮断壁部２２の全ての開口部に対向するように内側遮断壁部２３が形成される。 In the wall pattern forming step S <b> 20, which is a sealing substrate portion side process, a wall pattern is formed on the sealing substrate portion 21. The pattern of the outer blocking wall portion 22 is formed so as to have at least an opening 22A1 along the outer edge of the sealing substrate portion 21. The pattern of the inner blocking wall portion 23 is formed so as to partially surround the light emitting unit 10 inside the outer blocking wall portion 22. Moreover, the inner side blocking wall part 23 is formed so that all the opening parts of the outer side blocking wall part 22 may be opposed.
　壁部の形成材料としては、ガラスペーストを用いることができ、パターン形成はスクリーン印刷などのパターン形成技術を用いることができる。以下、ガラスペーストを用いたガラス溶着による壁部パターン形成工程Ｓ２０を説明する。ガラスペーストは、一般的なガラス溶接材料であり、Ｖ２Ｏ５やＳｎＯ系のガラスである。スクリーン印刷機により、ガラスペーストを所定のサイズに均一に形成し、加熱してガラスペーストの溶剤を乾燥・除去する。その後脱脂焼成炉にて、ガラスペーストのバインダ成分を除去し、ガラスペーストを封止基板部２１上に焼き固め仮焼する。その後は、封止基板部２１を必要に応じて洗浄する。壁部の形成材料はガラスペーストに限定されるものではなく、水分等の劣化因子の遮断性が高い樹脂材料等を用いることもできる。 A glass paste can be used as a material for forming the wall, and pattern formation techniques such as screen printing can be used for pattern formation. Hereinafter, wall pattern formation process S20 by glass welding using glass paste is explained. The glass paste is a general glass welding material, and is V 2 O 5 or SnO-based glass. Using a screen printer, the glass paste is uniformly formed to a predetermined size, and heated to dry and remove the solvent of the glass paste. Thereafter, the binder component of the glass paste is removed in a degreasing and firing furnace, and the glass paste is baked and hardened on the sealing substrate portion 21 and calcined. Thereafter, the sealing substrate portion 21 is cleaned as necessary. The material for forming the wall portion is not limited to glass paste, and a resin material having a high blocking property against deterioration factors such as moisture can also be used.
　貼り合わせ・封止工程は、支持基板部２０と封止基板部２１とによって封止セルを形成する封止セル形成工程Ｓ３０、封止セル内に接着剤を充填する接着剤充填工程Ｓ３１、封止セル内に充填した接着剤を硬化させる接着剤硬化工程Ｓ３２を有する。 The bonding / sealing step includes a sealing cell forming step S30 in which a sealing cell is formed by the support substrate portion 20 and the sealing substrate portion 21, an adhesive filling step S31 in which an adhesive is filled in the sealing cell, sealing An adhesive curing step S32 for curing the adhesive filled in the stop cell is included.
　封止セル形成工程Ｓ３０は、発光部１０が形成された支持基板部２０と壁部がパターニングされた封止基板部２１とを両者間に壁部が介在するように貼り合わせる。貼り合わせ時には、必要な位置合わせ調整を行い、調整が完了した時点で支持基板部２０と封止基板部２１との位置関係を固定する。そして、その状態を保持しながら壁部を硬化させて外側遮断壁部２２と内側遮断壁部２３を形成する。これによって、発光部１０を支持基板部２０と封止基板部２１との間隙内に収めた封止セルが形成される。 Sealing cell formation process S30 bonds together the support substrate part 20 in which the light emission part 10 was formed, and the sealing substrate part 21 in which the wall part was patterned so that a wall part might interpose between both. At the time of bonding, necessary alignment adjustment is performed, and when the adjustment is completed, the positional relationship between the support substrate portion 20 and the sealing substrate portion 21 is fixed. And the wall part is hardened | cured, hold | maintaining the state, and the outer side blocking wall part 22 and the inner side blocking wall part 23 are formed. As a result, a sealed cell in which the light emitting unit 10 is accommodated in the gap between the support substrate unit 20 and the sealing substrate unit 21 is formed.
　壁部材料としてガラスペーストを用いる場合には、位置合わせ調整が完了した後に支持基板部２０又は封止基板部２１を介して壁部にレーザを照射し、ガラスペーストを溶着する。この際、レーザ溶接機が用いられる。レーザ光源としては半導体レーザやＹＡＧレーザが用いられ、波長８００～１１００ｎｍのレーザ光が照射される。この場合は、支持基板部２０と封止基板部２１の一方又は両方は透明部材であることが必要になる。溶着したガラスペーストは温度低下と共に硬化して支持基板部２０と封止基板部２１とを接合し、支持基板部２０と封止基板部２１との間隙内に発光部１０を収めた封止セルが形成される。 When a glass paste is used as the wall portion material, after the alignment adjustment is completed, the wall portion is irradiated with laser through the support substrate portion 20 or the sealing substrate portion 21 to weld the glass paste. At this time, a laser welding machine is used. As the laser light source, a semiconductor laser or a YAG laser is used, and laser light with a wavelength of 800 to 1100 nm is irradiated. In this case, one or both of the support substrate part 20 and the sealing substrate part 21 needs to be a transparent member. The welded glass paste is cured with a decrease in temperature to join the support substrate part 20 and the sealing substrate part 21, and the sealing cell in which the light emitting part 10 is housed in the gap between the support substrate part 20 and the sealing substrate part 21. Is formed.
　接着剤充填工程Ｓ３１では、真空槽内又は大気中で封止セル内に接着剤を充填する。真空槽内での工程は、図１に示した従来技術と同様である。図２に示すような構造の封止セルを採用する場合には、封止セル内を減圧状態にして接着剤の液中に開口部２２Ａを浸漬し、周囲圧力を上げて封止セル内外の圧力差を利用して封止セル内に接着剤を充填させる。すなわち、真空槽内に封止セルを導入して真空槽内を真空状態にする第１工程と、真空槽内の接着剤容器内に封止セルの開口部を浸漬する第２工程と、真空槽内に不活性ガスを導入して接着剤を封止セル内に圧力差で注入する第３工程と、真空槽内を常圧に戻して封止セル内に接着剤を充填させる第４工程とを有する。 In the adhesive filling step S31, the sealing cell is filled with an adhesive in a vacuum chamber or in the atmosphere. The process in the vacuum chamber is the same as that of the prior art shown in FIG. When a sealed cell having a structure as shown in FIG. 2 is employed, the inside of the sealed cell is evacuated and the opening 22A is immersed in the adhesive liquid, and the ambient pressure is increased by increasing the ambient pressure. The pressure difference is used to fill the sealing cell with the adhesive. That is, a first step of introducing a sealing cell into the vacuum chamber to make the vacuum chamber in a vacuum state, a second step of immersing the opening of the sealing cell in an adhesive container in the vacuum chamber, and a vacuum A third step of introducing an inert gas into the tank and injecting the adhesive into the sealed cell with a pressure difference, and a fourth step of returning the inside of the vacuum tank to normal pressure and filling the sealed cell with the adhesive And have.
　封止セル内に充填される接着剤としては、流動性の高いものが適する。例えば、粘度の低い紫外線硬化型接着剤等を用いることができる。接着剤の流動性を高めるためには、フィラーやスペーサ粒子を含まないものが好ましい。適当な例としては紫外線硬化型のエポキシ樹脂を挙げることができる。 As the adhesive filled in the sealing cell, a highly fluid adhesive is suitable. For example, an ultraviolet curable adhesive having a low viscosity can be used. In order to improve the fluidity of the adhesive, those that do not contain fillers or spacer particles are preferable. A suitable example is an ultraviolet curable epoxy resin.
　図３に示した例のように、開口部２２Ａ１から開口部２３Ａ１に至り、更に開口部２３Ａ２から開口部２２Ａ２に至る接着剤の開放された流入経路が形成されている封止セルの場合には、大気中でも封止セル内に接着剤を注入させることができる。この場合には、大気中での毛細管現象を利用して封止セル内の空気を徐々に接着剤に置換しながら接着剤を封止セル内に充填させる。 As in the example shown in FIG. 3, in the case of a sealed cell in which an adhesive inflow path from the opening 22A1 to the opening 23A1 and from the opening 23A2 to the opening 22A2 is formed is formed. The adhesive can be injected into the sealed cell even in the atmosphere. In this case, the sealing cell is filled with the adhesive while gradually replacing the air in the sealing cell with the adhesive by utilizing capillary action in the atmosphere.
　接着剤硬化工程Ｓ３２では、封止セル内に充填した接着剤を硬化させて、発光部１０を封止する。接着剤として紫外線硬化型接着剤を用いた場合には、支持部材部２０，封止部材部２１の一方又は両方を介して接着剤に紫外線を照射して接着剤を硬化させる。接着剤が熱硬化性を有する場合には熱処理を加えて硬化させる。 In the adhesive curing step S32, the adhesive filled in the sealing cell is cured and the light emitting unit 10 is sealed. When an ultraviolet curable adhesive is used as the adhesive, the adhesive is cured by irradiating the adhesive with ultraviolet rays through one or both of the support member 20 and the sealing member 21. When the adhesive has thermosetting properties, it is cured by applying a heat treatment.
　このような本発明の実施形態は、支持基板部２０と封止基板部２１との間に乾燥剤を配置しないので、乾燥剤配置のための厚さ方向のスペースを省くことができ、パネルの薄型化が可能になる。また、乾燥剤自体を省くと同時に乾燥剤を配置する工程を製造工程から省くことができるので、パネルの製造コストを低減させることができ、更に生産性を向上させることができる。更には、支持基板部２０と封止基板部２１との間を接着剤層で埋めるので、支持基板部２０及び封止基板部２１の板厚を薄くしても十分なパネル強度を確保することができ、パネルの薄型化を図りながら所望のパネル強度を得ることができる。 In such an embodiment of the present invention, the desiccant is not disposed between the support substrate part 20 and the sealing substrate part 21, so that a space in the thickness direction for disposing the desiccant can be omitted, and the panel Thinning is possible. In addition, since the step of disposing the desiccant itself and the step of disposing the desiccant can be omitted from the manufacturing process, the manufacturing cost of the panel can be reduced, and the productivity can be further improved. Furthermore, since the space between the support substrate portion 20 and the sealing substrate portion 21 is filled with an adhesive layer, sufficient panel strength can be ensured even if the thickness of the support substrate portion 20 and the sealing substrate portion 21 is reduced. The desired panel strength can be obtained while reducing the thickness of the panel.
　そして、外側遮断壁部２２と内側遮断壁部２３の多重壁構造を有するので、封止セル内に接着剤を充填させるために必要な開口部から封止セル内に劣化因子が侵入したとしても、この劣化因子が発光部１０に到達するには、内側遮断壁部２３の外側を迂回せざるを得ない。これによって侵入した水分等の劣化因子が直接発光部１０に到達して有機ＥＬ素子の寿命を短縮させる不具合を回避することができる。 And since it has the multiple wall structure of the outer side blocking wall part 22 and the inner side blocking wall part 23, even if a deterioration factor penetrate | invades in a sealing cell from the opening part required in order to fill an adhesive agent in a sealing cell. In order for this deterioration factor to reach the light emitting part 10, the outside of the inner blocking wall part 23 must be detoured. As a result, it is possible to avoid a problem that deterioration factors such as moisture that has entered directly reach the light emitting unit 10 and shorten the life of the organic EL element.
　図２に示す封止セルのように、外側遮断壁部２２が支持基板部２０における一辺に沿って一つの開口部２２Ａを有し、内側遮断壁部２３が支持基板部２０における前記の一辺と対向する辺に沿って一つの開口部２３Ａを有するものでは、開口部２２Ａから水分等の劣化因子が封止セル内に侵入した場合にも、内側遮断壁部２３に沿って形成される侵入迂回経路を十分長く確保しているので、発光部１０に劣化因子が到達するのを十分に遅らせることができる。 As shown in FIG. 2, the outer blocking wall 22 has one opening 22 </ b> A along one side of the support substrate 20, and the inner blocking wall 23 has the one side of the support substrate 20. In the case of having one opening portion 23A along the opposite side, even when a deterioration factor such as moisture enters the sealed cell from the opening portion 22A, the intrusion detour formed along the inner blocking wall portion 23 Since the path is secured sufficiently long, it is possible to sufficiently delay the deterioration factor from reaching the light emitting unit 10.
　図３に示す封止セルのように、外側遮断壁部２２が支持基板部２０の対向する辺に沿ってそれぞれ開口部２２Ａ１，２２Ａ２を有し、内側遮断壁部２３は支持基板部２１の前記対向する辺と異なる辺に沿って開口部２３Ａ１，２３Ａ２を有するものでは、前述した侵入迂回経路は短くなるが、開口部２２Ａ１から開口部２３Ａ１に至り、更に開口部２３Ａ２から開口部２２Ａ２に至る接着剤の開放された流入経路を形成することができるので、速やかに接着剤を充填させることができ、パネルの生産性を向上させることができる。 As in the sealing cell shown in FIG. 3, the outer blocking wall portion 22 has openings 22 </ b> A <b> 1 and 22 </ b> A <b> 2 along the opposing sides of the support substrate portion 20. In the case of having the openings 23A1 and 23A2 along different sides from the opposite sides, the above-described intrusion bypass path is shortened, but the bonding from the opening 22A1 to the opening 23A1 and further from the opening 23A2 to the opening 22A2 is performed. Since the inflow path in which the agent is released can be formed, the adhesive can be quickly filled, and the productivity of the panel can be improved.
　支持基板部２０及び封止基板部２１をガラス板材にして、外側遮断壁部２２及び内側遮断壁部２３を、支持基板部２０と封止基板部２１との間に溶着・硬化されたガラス壁とすることで、水分等の劣化因子に対して外側遮断壁部２２と内側遮断壁部２３が確実な遮断機能を有する。これによって、前述した外側遮断壁部２２と内側遮断壁部２３による劣化因子の迂回機能をより有効に得ることができ、ダークスポットや黒枠の発生・進行を抑制したパネルの長寿命化が可能になる。 A glass wall in which the support substrate portion 20 and the sealing substrate portion 21 are made of a glass plate, and the outer blocking wall portion 22 and the inner blocking wall portion 23 are welded and cured between the support substrate portion 20 and the sealing substrate portion 21. Thus, the outer blocking wall 22 and the inner blocking wall 23 have a reliable blocking function against deterioration factors such as moisture. As a result, it is possible to more effectively obtain the detouring function of the deterioration factor by the outer blocking wall portion 22 and the inner blocking wall portion 23 described above, and it is possible to extend the life of the panel while suppressing the occurrence and progression of dark spots and black frames. Become.
　封止セル内に充填される接着剤としては、未硬化時に所望の流動性を有する紫外線硬化型接着剤を用いることが好ましい。これによって、封止セル内への接着剤の充填及び封止セル内に接着剤を充填した後の接着剤の硬化を簡易に行うことができる。この場合には、支持基板部２０と封止基板部２１の一方又は両方を透明基板にすることが必要になる。 As the adhesive filled in the sealing cell, it is preferable to use an ultraviolet curable adhesive having a desired fluidity when uncured. Thereby, filling of the adhesive into the sealing cell and curing of the adhesive after filling the adhesive into the sealing cell can be easily performed. In this case, one or both of the support substrate part 20 and the sealing substrate part 21 needs to be a transparent substrate.
　壁部材料としてガラスペーストを用いる場合には、外側遮断壁部２２と内側遮断壁部２３を形成時にレーザ照射が必要になる。先に支持基板部２０又は封止基板部２１上に接着剤の層を形成し、その後に外側遮断壁部２２及び内側遮断壁部２３のパターンを支持基板部２０又は封止基板部２１上に形成する場合、接着剤層と外側遮断壁部２２及び内側遮断壁部２３のパターンとの間に空間を形成する必要があるなど製造プロセス上問題があった。本発明の実施形態のように、封止セル形成工程Ｓ３０の後に接着剤充填工程Ｓ３１を行うことで、外側遮断壁部２２及び内側遮断壁部２３と接着剤が接触しても外側遮断壁部２２及び内側遮断壁部２３の遮断機能に影響が無く、パネルの封止性能を劣化させない効果を有している。 When glass paste is used as the wall material, laser irradiation is required when forming the outer barrier wall 22 and the inner barrier wall 23. First, an adhesive layer is formed on the support substrate portion 20 or the sealing substrate portion 21, and then the pattern of the outer blocking wall portion 22 and the inner blocking wall portion 23 is formed on the support substrate portion 20 or the sealing substrate portion 21. In the case of forming, there has been a problem in the manufacturing process, for example, it is necessary to form a space between the adhesive layer and the pattern of the outer blocking wall portion 22 and the inner blocking wall portion 23. As in the embodiment of the present invention, by performing the adhesive filling step S31 after the sealing cell forming step S30, the outer blocking wall portion even if the outer blocking wall portion 22 and the inner blocking wall portion 23 are in contact with the adhesive. The blocking function of the inner blocking wall 22 and the inner blocking wall 23 is not affected, and the panel sealing performance is not deteriorated.
　図６は、本発明の一実施例に係る有機ＥＬパネルの構造を示した説明図であり、同図（ａ）は同図（ｂ）におけるＹ－Ｙ断面図、同図（ｂ）は同図（ａ）におけるＸ－Ｘ断面図を示している。本発明の実施例に係る有機ＥＬパネル１Ｃは、前述したように、複数の有機ＥＬ素子を有する発光部１０と、発光部１０が一面上に形成された支持基板部２０と、支持基板部２０に対面して発光部１０を覆うように配置された封止基板部２１と、支持基板部２０と封止基板部２１の外縁に沿って形成され、少なくとも一つの開口部２２Ａを有して開口部２２Ａ以外で支持基板部２０と封止基板部２１との間隙Ｇを外部と遮断する外側遮断壁部２２と、外側遮断壁部２２の内側で発光部１０を部分的に囲うように形成され、その内側をその外側と遮断する内側遮断壁部２３とを備え、外側遮断壁部２２の開口部２２Ａに対向するように内側遮断壁部２３を形成し、外側遮断壁部２２の内側における間隙Ｇに接着剤２４を充填したものである。 FIG. 6 is an explanatory view showing the structure of an organic EL panel according to an embodiment of the present invention. FIG. 6 (a) is a YY sectional view of FIG. 6 (b), and FIG. An XX cross-sectional view in FIG. As described above, the organic EL panel 1C according to the embodiment of the present invention includes the light emitting unit 10 having a plurality of organic EL elements, the support substrate unit 20 having the light emitting unit 10 formed on one surface, and the support substrate unit 20. The sealing substrate portion 21 is disposed so as to face the light emitting portion 10, and is formed along the outer edge of the support substrate portion 20 and the sealing substrate portion 21, and has at least one opening portion 22 </ b> A. Other than the portion 22A, the outer blocking wall portion 22 that blocks the gap G between the support substrate portion 20 and the sealing substrate portion 21 from the outside, and the light emitting portion 10 is partially enclosed inside the outer blocking wall portion 22. And an inner blocking wall portion 23 that blocks the inner side from the outer side, the inner blocking wall portion 23 is formed so as to face the opening 22A of the outer blocking wall portion 22, and a gap inside the outer blocking wall portion 22 is formed. G is filled with an adhesive 24.
　より具体的には、発光部１０は無機材料の保護膜１１で覆われており、保護膜１１を介して発光部１０上の間隙Ｇに接着剤２４が充填されている。これによって、接着剤２４から発生するアウトガスが保護層１１で遮断され、このアウトガスによって発光部１０に悪影響が及ぶのを防いでいる。 More specifically, the light emitting unit 10 is covered with a protective film 11 made of an inorganic material, and the gap 24 on the light emitting unit 10 is filled with the adhesive 24 via the protective film 11. As a result, the outgas generated from the adhesive 24 is blocked by the protective layer 11, thereby preventing the light emitting unit 10 from being adversely affected by the outgas.
　また、この実施例では、内側遮断壁部２３が発光部１０の略半周を囲むように形成されている。このように内側遮断壁部２３の長さを比較的短くすることで開口部２２Ａから注入される接着剤２４の充填時間を短くし、製造工程の時間短縮を図っている。 Further, in this embodiment, the inner blocking wall portion 23 is formed so as to surround the substantially half circumference of the light emitting portion 10. Thus, the filling time of the adhesive 24 injected from the opening 22A is shortened by relatively shortening the length of the inner blocking wall portion 23, thereby shortening the manufacturing process time.

Claims (8)

  1. 　複数の有機ＥＬ素子を有する発光部と、
    　該発光部が一面上に形成された支持基板部と、
    　前記支持基板部に対面して前記発光部を覆うように配置された封止基板部と、
    　前記支持基板部と前記封止基板部の外縁に沿って形成され、少なくとも一つの開口部を有して該開口部以外で前記支持基板部と前記封止基板部との間隙を外部と遮断する外側遮断壁部と、
    　前記外側遮断壁部の内側で前記発光部を部分的に囲うように形成され、その内側をその外側と遮断する内側遮断壁部とを備え、
    　前記外側遮断壁部の開口部に対向するように前記内側遮断壁部を形成し、前記外側遮断壁部の内側における前記間隙に接着剤を充填したことを特徴とする有機ＥＬパネル。     A light emitting unit having a plurality of organic EL elements;
    A support substrate part having the light emitting part formed on one surface;
    A sealing substrate portion arranged to face the support substrate portion and cover the light emitting portion;
    It is formed along the outer edge of the support substrate part and the sealing substrate part, has at least one opening, and blocks the gap between the support substrate part and the sealing substrate part from outside except the opening. An outer barrier wall,
    An inner blocking wall portion that is formed so as to partially surround the light emitting portion inside the outer blocking wall portion, and that blocks the inside from the outside;
    The organic EL panel, wherein the inner blocking wall portion is formed so as to face the opening of the outer blocking wall portion, and an adhesive is filled in the gap inside the outer blocking wall portion.
  2. 　前記外側遮断壁部は前記支持基板部における一辺に沿って一つの前記開口部を有し、前記内側遮断壁部は前記支持基板部における前記一辺と対向する辺に沿って一つの開口部を有することを特徴とする請求項１に記載された有機ＥＬパネル。 The outer blocking wall has one opening along one side of the support substrate, and the inner blocking wall has one opening along a side facing the one side of the support substrate. The organic EL panel according to claim 1.
  3. 　前記外側遮断壁部は前記支持基板部の対向する辺に沿ってそれぞれ開口部を有し、前記内側遮断壁部は前記支持基板部の前記対向する辺と異なる辺に沿って開口部を有することを特徴とする請求項１に記載された有機ＥＬパネル。 The outer blocking wall has openings along opposite sides of the support substrate, and the inner blocking wall has openings along sides different from the opposite sides of the support substrate. The organic EL panel according to claim 1.
  4. 　前記支持基板部及び前記封止基板部はガラス板材からなり、
    　前記外側遮断壁部及び前記内側遮断壁部は、前記支持基板部と前記封止基板部との間に溶着・硬化されたガラス壁からなることを特徴とする請求項１～３のいずれかに記載された有機ＥＬパネル。     The support substrate portion and the sealing substrate portion are made of a glass plate material,
    4. The outer barrier wall portion and the inner barrier wall portion are each formed of a glass wall that is welded and cured between the support substrate portion and the sealing substrate portion. The described organic EL panel.
  5. 　前記接着剤は、未硬化時に流動性を有する紫外線硬化型接着剤であることを特徴とする請求項１～４のいずれかに記載された有機ＥＬパネル。 The organic EL panel according to any one of claims 1 to 4, wherein the adhesive is an ultraviolet curable adhesive having fluidity when uncured.
  6. 　支持基板部上の一面に、下部電極と有機層と上部電極を備えた有機ＥＬ素子を有する発光部を形成する工程と、
    　前記支持基板部と封止基板部の外縁に沿って、少なくとも一つの開口部を有して該開口部以外で前記支持基板部と前記封止基板部との間隙を外部と遮断する外側遮断壁部を形成すると共に、前記外側遮断壁部の内側で前記発光部を部分的に囲うように、その内側をその外側と遮断する内側遮断壁部を形成して、前記支持基板部と前記封止基板部との間隙に封止セルを形成する工程と、
    　前記封止セル内に接着剤を充填させる工程と、
    　前記封止セル内に充填された接着剤を硬化させる工程と
    　を有することを特徴とする有機ＥＬパネルの製造方法。     Forming a light emitting unit having an organic EL element including a lower electrode, an organic layer, and an upper electrode on one surface of the support substrate;
    An outer blocking wall having at least one opening along an outer edge of the support substrate and the sealing substrate, and blocking a gap between the support substrate and the sealing substrate from the outside except the opening And forming an inner blocking wall portion that blocks the inside from the outer side so as to partially surround the light emitting portion inside the outer blocking wall portion, and sealing the support substrate portion and the sealing Forming a sealing cell in a gap with the substrate portion;
    Filling the sealing cell with an adhesive;
    Curing the adhesive filled in the sealing cell. A method for producing an organic EL panel, comprising:
  7. 　前記外側遮断壁部と前記内側遮断壁部は、前記封止基板部上に壁部を外側と内側にそれぞれパターン形成し、当該壁部を介して前記支持基板部と前記封止基板部とを対面させた後に、前記壁部を溶着・硬化させることによって形成することを特徴とする請求項６に記載された有機ＥＬパネルの製造方法。 The outer blocking wall portion and the inner blocking wall portion are formed by patterning a wall portion on the sealing substrate portion on the outer side and the inner side, respectively, and the support substrate portion and the sealing substrate portion are interposed via the wall portion. The method of manufacturing an organic EL panel according to claim 6, wherein the wall portion is formed by welding and curing after facing each other.
  8. 　前記封止セル内に接着剤を充填させる工程は、
    　真空状態の充填室内に前記封止セルを導入する第１工程と、
    　前記第１工程後に前記封止セルを接着剤の溶液中に浸漬させ、前記充填室内に不活性ガスを導入する第２工程と、
    　前記第２工程後に前記充填室内を常圧に戻す第３工程とを有することを特徴とする請求項６又は７に記載された有機ＥＬパネルの製造方法。     The step of filling the sealing cell with an adhesive includes:
    A first step of introducing the sealing cell into a vacuum filling chamber;
    A second step of immersing the sealing cell in an adhesive solution after the first step and introducing an inert gas into the filling chamber;
    A method for manufacturing an organic EL panel according to claim 6 or 7, further comprising a third step of returning the filling chamber to normal pressure after the second step.
PCT/JP2008/062703 2008-07-14 2008-07-14 Organic el panel and its manufacturing method WO2010007656A1 (en)

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