WO2009155866A1

WO2009155866A1 - Led liiumination system

Info

Publication number: WO2009155866A1
Application number: PCT/CN2009/072439
Authority: WO
Inventors: Yu-Chao Wu
Original assignee: Chou, Cheng-Te
Priority date: 2008-06-25
Filing date: 2009-06-25
Publication date: 2009-12-30
Also published as: CN101319760A; CN101319760B

Abstract

A light emitting diode illumination system includes a light emitting diode module (100) and a substrate (240) supporting the light emitting diode module (100). A lamp holder is combined with the substrate (240). A first electrode (261) and a second electrode (263) are electrically connected to the light emitting diode module (100) and are constructed to form at least an enclosed structure on or below the substrate (240).

Description

LED ILLUMINATION SYSTEM

This Application claims priority of China Patent Application No. 200810127515.2, filed on June 25, 2008, the entirety of which is incorporated by reference herein.

FIELD OF THE INVENTION

The present invention relates to an illumination system, and in particular, to an illumination system having a light emitting diode module.

BACKGROUND OF THE INVENTION

Light emitting diodes (LED) have been widely applied in many display products because of their high brightness, small size, durability, low power consumption and long operating lifespan characteristics. The principle operation of an LED is described as follows. A voltage is applied to a diode to drive a combination of electrons and holes in the diode, and releases energy in the form of a photon. Additionally, fluorescent features may be added into the LED to adjust wavelength (color) or intensity of the emitted light.

White light LEDs have been widely applied in illumination products. Compared with the conventional incandescent lamps and fluorescent lamps, white light LEDs have advantages of lower heat, lower power consumption, longer operating lifespan, faster response time and smaller size. Therefore, white light LEDs are expected to be the mainstream products used in illumination products moving forward.

The current illumination systems formed by light emitting modules, however, are not convenient for consumers due to manipulation and assembly difficulties. Therefore, a new illumination system is needed. SUMMARY OF THE INVENTION

To solve the above-described problems, an illumination system is provided. An exemplary embodiment of an illumination system comprises a light emitting diode module and a substrate supporting the light emitting diode module. A lamp holder is combined with the substrate. A first electrode and a second electrode are electrically connected to the light emitting diode module and are constructed to form at least an enclosed structure on or below the substrate.

A further exemplary embodiment of an illumination system comprises a light emitting diode module and a substrate supporting the light emitting diode module, having a heat conductive region under the light emitting diode module. A lamp holder is combined with the substrate and a heat conducting pillar is disposed under the heat conductive region, sandwiched between the substrate and the lamp holder. A first electrode and a second electrode electrically are connected to the light emitting diode module and are disposed on at least an enclosed zone surrounding the heat conducting pillar.

A detailed description is given in the following embodiments with reference to the accompanying drawings.

DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIG. IA is a cross section showing a portion of an embodiment of a light emitting diode module of the invention.

FIG. IB shows an arrangement of an embodiment of light emitting chips in light emitting rows as shown in FIG. IA.

FIG. 1C shows an arrangement of another embodiment of light emitting chips in light emitting rows as shown in FIG. IA.

FIG. 2 shows a diagram of an embodiment of an illumination system of the invention.

FIG. 3 shows a diagram of another embodiment of an illumination system of the invention.

FIG. 4 shows a diagram of yet another embodiment of an illumination system of the invention.

FIG. 5 shows an assembly diagram of an embodiment of an illumination system of the invention.

FIGS. 6 A to 6B show top views of an embodiment of an electrode structure of the invention.

FIG. 7 shows a top view of an embodiment of a heat dissipating part of the invention.

FIGS. 8 A to 8B show diagrams of an illumination system having a reflective cup.

FIGS. 9A to 9B show top views of another embodiment of an electrode structure of an illumination system of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of a mode for carrying out the invention.

This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims. Wherever possible, the same reference numbers are used in the drawings and the descriptions to refer the same or like parts.

Embodiments of the invention herein incorporate PCT patent application Ser. number PCT/CN 2007/002570 by the inventor for reference.

The following embodiments describe an illumination system constructed by light emitting modules, wherein it is to be understood that the invention is not limited to the disclosed embodiments.

Light emitting diode module having a reflective structure

FIG. IA shows an embodiment of a light emitting diode module having a reflective structure of the invention. A light emitting diode module 100 comprises a substrate 102 used to support a plurality of light emitting chips 104. In this embodiment, the light emitting chips 104 are arranged to form at least one light emitting row 130. Each light emitting row 130 is surrounded by a reflective structure 110. The reflective structure 110 comprises a row space corresponding to the reflective structure to mount the light emitting chips 104 on the substrate 102 in the row space. Additionally, the light emitting chips may be arranged in many light emitting rows, and each light emitting row may be surrounded by a reflective structure. When compared with several light emitting rows being surrounded by a single ring-shaped reflective structure, a single light emitting row surrounded by a corresponding reflective structure may have a shorter distance between each chip of the row and the corresponding reflective structure. Also, a light emitted from a light emitting chip may irradiate to the adjacent reflective structure more easily, without being blocked by other light emitting chips. Each light emitting chip 104 of the light emitting row 130 may electrically connect to electrodes 161 and 163 in the substrate 102, thereby connecting to the external power supply while being subsequently combined with a lamp holder.

Additionally, at least one light emitting row may optionally comprise a light emitting material layer 106 in at least one of the light emitting rows, covering the light emitting chips 104. For example, the light emitting material layer 106 may be constructed of fluorescent powders. In one embodiment, the light emitting material layer 106 may continuously cover the light emitting chips 104, and extend to an inner wall of the reflective structure 110. In one embodiment, at least one part of the light emitting material layer 106 may be clotted without adhesive. For example, at least one part of the light emitting material layer 106 may be clotted by a Van der Waals force through a baking method. In one embodiment, the light emitting material layer 106 may totally cover a top surface and sides of the light emitting chips 104 in a light emitting row. In another embodiment, the light emitting diode module may further comprise an inner covering layer 108 covering the light emitting material layer 106. The inner covering layer 108 may serve as a protective layer. Generally speaking, the protective layer is not higher than the reflective structure, and is held with a planarized layer in a region above the chip.

A region surrounded by the reflective structure 110 may have a polygonal shape, for example, a rectangular shape or pentagonal shape. The region surrounded by the reflective structure 110 may also have a circular shape or elliptic shape.

A direction of emitted light from the light emitting chip 104 may be adjusted by the reflective structure 110 using, for example, blocking, reflecting, collecting or focusing methods. Therefore, when the light emitting material layer 106 does not totally cover the sides of the light emitting chips 104, light leakage on the sides of the light emitting chips 104 may not be an issue, and color shift problem of the light emitting chips 104 may be improved.

The reflective structure 110 may generally comprise a metal material with a reflective plane, a plastic or ceramic feature with a reflective material layer formed thereon. For example, the reflective structure 110 may comprise a plastic feature with Cr, Ni, Ag, ZnF or MgSO4 formed thereon using a selective electroplating method.

Because the reflective structure 110 and the light emitting chip 104 are disposed on a plane, the heat dissipation efficiency of the light emitting diode module may be improved if the reflective structure 110 is a material of better heat dissipation efficiency, for example, a metal layer with a reflective plane formed by surface polishing.

The reflective structure 110 may comprise metal, for example, stainless steel. The reflective structure 110 may comprise plastic or resin, for example, silicon. Additionally, the reflective structure 110 may comprise other materials, for example, PC, PE, acrylic, glass, and polycarbonate. A coating layer may be selectively formed on a surface of the reflective structure 110 for reflection.

In one embodiment, there is no need to employ glue for adhering the fluorescent powders in the light emitting material layer 106. Therefore, the light emitting efficiency may be improved. The number of light emitting chips 104 may be defined by requirements. In this embodiment, the light emitting chips 104 is a light emitting diode.

Additionally, in other embodiments, a region surrounded by the reflective structure 110 may have a shape that is defined by requirements, for example, a rectangular shape, circular shape or the like. The shape of the reflective structure 110 may be arbitrarily designed, and the shape of the cross section of the reflective structure 110 may comprise of, for example, a trapezoid, triangle, arc or the like. In other embodiments, a region surrounded by the reflective structure 110 may have arbitrary shapes. For example, a stripe-shaped reflective structure 110 may be formed to match space for back light modules.

Interface between a reflective structure and a substrate

Referring to the light emitting diode module as shown in FIG. IA, in one embodiment, a bottom of the reflective structure 110 is bonded on the substrate 102 by an adhesive 150. The adhesive 150, however, has a specific height after curing. Side light emitted from sides of the light emitting chip 104 may be incident into an interface between the reflective structure 110 and the substrate 102. Therefore, it does not matter whether the adhesive 150 is formed of transparent or opaque materials, light incident into the interface between the reflective structure 110 and the substrate 102 will not be reflected by the reflective structure 110. Thus, reducing light emitting efficiency of the light emitting row.

In one embodiment, a plurality of light emitting powders, for example, fluorescent powders, may be mixed into the adhesive 150, for example, a transparent resin. Thus, the side light emitting into the interface between the reflective structure 110 and the substrate 102 may react with the light emitting powders in the adhesive 150 to generate another light incident into the light emitting row. Therefore, improving light emitting efficiency of the light emitting row.

Arrangement of light emitting chips

FIG. IB illustrates an arrangement of an embodiment of light emitting chips in light emitting rows. The conventional light emitting diode module is formed by a package of a single light emitting chip surrounded by a reflective cup. A multi-chip arrangement is not adopted by the conventional light emitting diode module because sides of each light emitting chip would block the light emitted from sides of other light emitting chips. Therefore, reducing light emitting efficiency of the light emitting row.

For light emitting efficiency to increase, one embodiment of an arrangement of the unassembled light emitting chips may be used for the aforementioned light emitting module. Additionally, the light emitting chips are not limited to the bare chips or packaged chips.

The light emitting diode module may comprise light emitting rows 130a and 130b. Each of the light emitting rows is surrounded by a reflective structure 110. For example, the light emitting row 130b may comprise light emitting chips, for example, light emitting chips 104a and 104b, and are supported by a substrate 102. A side of the reflective structure 110 may comprise a reflective plane to reflect light L emitted from the light emitting chips. Concerning the relationship between two adjacent light emitting chips in the light emitting row 130b, for example, the light emitting chips 104a and 104b have at least one side 124a and 124b, respectively. The side 124a of the light emitting chip 104a has a projection plane substantially, but not fully, overlapped with that of the corresponding side 124b of the light emitting chip 104b. In another embodiment, for high light emitting efficiency requirements, the side 124a of the light emitting chip 104a has a projection plane substantially not overlapped with that of the corresponding side 124b of the light emitting chip 104b. Therefore, achieving maximum light emitting efficiency.

Additionally, the light emitting chip may be formed by a polygonal light emitting chip, for example, a rectangular or hexagonal light emitting chip, which is dependant upon chip cutting technology.

In one embodiment, concerning the relationship between the light emitting chips and the reflective structure, greater light emitting efficiency can be achieved if an incident light L is emitted from as much sides of the light emitting chip as possible and substantially faces to a side of the reflective structure with a tilted angle and without being blocked by other light emitting chips. Further, maximum light emitting efficiency can be achieved if an incident light L is emitted from every side of the light emitting chip as possible and substantially faces to a side of the reflective structure with a tilted angle and without being blocked by other light emitting chips.

As shown in FIG. IB, the two adjacent light emitting chips 104a and 104b may have a minimum distance P, for example, a distance between the two adjacent light emitting chips 104a and 104b. The minimum distance P may be adjusted so that a projection plane Al of the side of the light emitting chip 104b is substantially not overlapped with a projection plane A2 of the side of the light emitting chip 104a. In another embodiment, an arrangement of the light emitting chips may comprise arranging the light emitting chips with proper spacing, and making incident light from every side of at least two adjacent light emitting chips face a side of the reflective structure with a tilted angle. Therefore, achieving greater light emitting efficiency. In another embodiment, the light emitting chip 104a may be arranged in a diamond arrangement to avoid the projection planes of the adjacent two light emitting chips to be too overlapped and block emitting light. When the light emitting chips are polygonal light emitting chips, the light emitting chips may be arranged in a row diagonally, and are respectively formed by extending lines joining two nonadjacent vertices of the light emitting chip which are parallel to the side of the reflective structure 110.

The arrangement of the light emitting chips may guide the light emitted from the sides of a light emitting chip to substantially face the reflective plane of the reflective structure without being blocked by other light emitting chips. Therefore, improving light emitting efficiency.

Referring to FIG. 1C, in another embodiment, to further reduce the area of the substrate 102, raise arrangement density of the light emitting chips or enhance the light emitting intensity of a specific light emitting row, at least two rows of light emitting chips 130a and 130b are surrounded by the reflective structure 110 for heat dissipation and the light emitted from one light emitting chip is not blocked by other light emitting chips. Number of chips, chip density, brightness or color temperature of the two rows of light emitting chips 130a and 130b may be different. The arrangement of a light emitting chip 104e of the two rows of light emitting chips 130a and 130b may be in, for example, dislocation, and are not limited to a side by side or symmetric arrangement. An arrangement of an embodiment of light emitting chips in light emitting rows has other advantages, which are as follows. Sides of two adjacent light emitting chips are not fully overlapped with each other. Therefore, thermal radiation emitted from the side of one light emitting chip may not be a heat source to the adjacent light emitting chip. Additionally, a space between the two adjacent light emitting chips may not be formed as a confined space. Therefore, a thermal budget associated with the two adjacent light emitting chips can be reduced.

Illumination system having a light emitting diode module FIG. 2 shows a diagram of an embodiment of an illumination system of the invention. In one embodiment, the illumination system may comprise a light emitting diode module 100 having a defined heat conductive region underlying the light emitting diode module 100. The heat conductive region is generally a region adjacent to a light emitted diode, thereby conducting heat away from the light emitted diode in a short period of time.

The illumination system further comprises a substrate 200 supporting the light emitting diode module 100. Note that the substrate may be the substrate 102 as shown in FIG. 2 serving as a part of the light emitting diode module 100, or additionally disposed. A lamp holder 300 may be combined with the substrate 200, by using a collapsible or a disassembly-enabling method. In one embodiment, a heat conducting pillar 500 may be disposed under the heat conductive region and sandwiched between the substrate 200 and the lamp holder 300 to speed up the heat conduction from the light emitting diode module 100. Additionally, a plurality of electrodes, for example, a pair of electrodes 261 and 263 is used to electrically connect to the light emitting diode module 100, wherein the pair of electrodes 261 and 263 may be disposed on at least an enclosed zone surrounding the heat conducting pillar. In one embodiment, the electrodes 261 and 263 may surround the heat conducting pillar 500 along a circular zone or a concentric zone as shown in FIGS. 6A-6B and 9B. In one embodiment, the electrodes 261 and 263 are sandwiched between the substrate 200 and the lamp holder 300, having a main function of electrically connecting to the light emitting diode module, for example, anode or cathode, of a light emitting chip.

Next, the illumination system may further comprise a plurality of contact pads, for example, contact pads 461 and 463, disposed outside of the heat conducting pillar 500 to electrically connect to the electrodes 261 and 263. In one embodiment, the contact pads 461 and 463 may also be disposed on the circular zone or the concentric zone, thereby keeping electrical connection to the first and second electrodes 261 and 263. Thus, a poor contact problem between the electrodes and the contact pads in the following assembly processes can be avoided.

In one embodiment as shown in FIG. 2, the electrodes 261 and 263 are on the substrate 200, and the contact pads 461 and 463 are in a corresponding position on the lamp holder 300, electrically connected to power traces 400. For example, the power traces 400 connecting to a power supply may be formed through the lamp holder 300 to a top surface of the lamp holder 300.

The heat conducting pillar 500 may be respectively insert into hollow portions

210 and 310 of the substrate 200 and the lamp holder 300, thereby conducting a heat flow from the light emitting diode module 100 to the lamp holder 300. A lamp cover 600 may be combined with the substrate 200 to cover the light emitting diode module 100.

FIG. 3 illustrates another embodiment of an illumination system of the invention, wherein a substrate 220 and a heat conducting pillar 520 are building-integrated, and the lamp holder 300 comprises a hollow portion 310 accommodating the heat conducting pillar 520. Additionally, when the heat conducting pillar 520 is inserted into the hollow portion 310 of the lamp holder 300, an air gap isolating the heat flow may be existed between a bottom of the hollow portion 310 and the heat conducting pillar 520. In one embodiment, a sidewall or a bottom of the hollow portion 310 may further comprises one or more air outlets 330 to exhaust air in the hollow portion 310 while the heat conducting pillar 520 is being inserted into the hollow portion 310 of the lamp holder 300.

FIG. 4 illustrates yet another embodiment of an illumination system of the invention, wherein a lamp holder 320 and a heat conducting pillar 560 are building-integrated, and a substrate 240 comprises a hollow portion 540 accommodating the heat conducting pillar 560. Additionally, when the heat conducting pillar 560 is inserted into the hollow portion 540 of the substrate 240, an air gap isolating the heat flow may be existed between a bottom of the hollow portion 540 and the heat conducting pillar 560. The resulting air gap is remained under the heat conductive region. In one embodiment, one or more air outlets 542 may be disposed on a bottom or a sidewall of the hollow portion 540. Also, at least one air outlet 562 may be disposed in a proper position of the heat conducting pillar 560, for example, a central region. Therefore, air in the hollow portion 540 may be exhausted while the heat conducting pillar 560 is being inserted into the hollow portion 540 under the substrate 240. Generally, the hollow portion 540 may further comprise an extension portion protruding out of the substrate 240.

FIG. 5 shows an assembly diagram of an embodiment of an illumination system of the invention. In one embodiment, a frame 620 may be used to cover the light emitting diode module 100 and the substrate 240. The lamp cover 600 is mounted on the frame 620. It is noted that the electrodes 261 and 263 described in the aforementioned embodiments are on the substrate, and the contact pads 461 and 463 are in corresponding positions of the lamp holder while being electrically connected to the power traces 400. The invention, however, is not limited to the disclosed embodiments. Alternatively, the contact pads 461 and 463 may be disposed on the substrate 240 to electrically connect to the light emitting diode module 100, and the electrodes 261 and 263 may be disposed on the lamp holder to electrically connect to the power traces 400.

FIGS. 6 A to 6B show top views of an embodiment of an electrode structure of the illumination system of the invention, wherein the electrodes

261 and 263 may be constructed to form at least an enclosed structure on or below the substrate. In one embodiment, the electrodes 261 and 263 may be disposed on a circuit board 260. Generally speaking, the circuit board 260 may be directly disposed on the substrate 240 or the lamp holder 260. Alternatively, the circuit board 260 may be individually provided, sandwiched between the substrate 240 and the lamp holder 320, wherein a central portion of the circuit board 260 is hollow for the heat conducting pillar 560 to pass through. Alternatively, conductive patterns are provided, for example, metal layers, as the electrodes 261 and 263, and are used as an anode and a cathode, disposed on the circuit board 260 along the concentric zone. In this embodiment, the anode pattern may be disposed in an outer region, and the cathode pattern may be disposed in an inner region, thereby forming a concentric pattern. The pattern disposed on the inner circle may be a ring-shaped or circular pattern, and the pattern disposed on the outer circle may be a ring-shaped pattern. In FIG. 6A, conductive layers 261 and 263 serving as the electrodes 261 and 263 may be continuous circular patterns or enclosed ring-shaped pattern. As shown in FIG. 6B, however, conductive layers 261 and 263 serving as the electrodes 261 and 263 may be constructed by a plurality of discontinuous patterns having fixed spacing, wherein lengths of the contact pads 461 and 463 are only needed to be larger than that of the spacing. Therefore, the contact pads 461 and 463 may keep electrical connection to the electrodes 261 and 263 even if the contact pads 461 and 463 are not precisely aligned with the electrodes 261 and 263 due to a rotation displacement between the lamp holder 320 and the substrate 240.

In one embodiment, a rotation locking structure may be disposed using the aforementioned electrode structure design, thereby allowing combination of the lamp holder and the substrate with the rotation locking structure by rotating the lamp holder 320 or the substrate. As shown in FIG. 2, the rotation locking structure may comprise a screw thread disposed on the heat conducting pillar 500, thereby locking the heat conducting pillar 500 on the hollow portion 210. As shown in FIG. 3. the rotation locking structure may comprise a screw thread disposed on the heat conducting pillar 500 building-integrated with the substrate 220, thereby locking the heat conducting pillar 500 on the hollow portion 310 of the lamp holder. Alternatively, as shown in FIG. 4, the rotation locking structure may comprise a screw thread disposed on the heat conducting pillar 560 building-integrated with the lamp holder 320, thereby locking the heat conducting pillar 560 on the hollow portion 540 of the substrate 240. Sidewalls of the aforementioned hollow portions may comprise a corresponding screw thread to lock the heat conducting pillar. In one embodiment, the screw thread on the bottom or the sidewall of the hollow portion, and a central or surrounding portion of the heat conducting pillar may have one or more air outlets to exhaust air in the hollow portion while the heat conducting pillar is being inserted into the hollow portion under the heat conductive region. Additionally, in one embodiment as shown in FIG. 4, the gap 542 serving as an air outlet connecting to the bottom of the hollow portion may be formed transversely protruding the sidewall of the hollow portion or formed vertically along the screw thread on the sidewall.

FIG. 7 shows a top view of an embodiment of a heat dissipating part 340 of the invention. In this embodiment, the heat dissipating part 340 may be combined with the lamp holder or may serve as a portion of the lamp holder, thereby forming a continuous heat conducting path with heat dissipating path. Additionally, in one embodiment, the heat conducting pillar 560 and the substrate have a contact area occupying a one-fourth to two-third of an area of the substrate. Therefore, heat generated from the heat conducting pillar flowing back to the light emitting diode module can be decreased. Alternatively, the heat conducting pillar may be a ladder-shaped or taper-shaped structure having an end-face with a smaller area facing the substrate, thereby having an improved effect of preventing the heat from flowing back to the light emitting diode module.

FIGS. 8 A to 8B show diagrams of an illumination system having a reflective cup, wherein the lamp cover 600 is disposed on the reflective cup 700. In FIG. 8A, the reflective cup 700 is disposed on an inner side of the substrate 240, surrounding the light emitting diode module 100. In FIG. 8B, the reflective cup 700 is disposed on an outer side of the substrate 240, encapsulating the substrate 240.

FIGS. 9A to 9B show top views of another embodiment of an electrode structure of an illumination system of the invention. The electrodes 281 and 283, which usually serve as an anode and a cathode, constructed by, for example, two conductive layers, may be disposed along a circular zone. In this embodiment, the anode or the cathode patterns may be constructed by two opposite semicircular or semi-annular metal layers isolated from each other. If a rotation displacement between the lamp holder and the substrate is controlled to less than half-circle, the contact pads are only needed to be respectively disposed in a region corresponding to the two semicircular metal layers. Therefore, the contact pads may keep electrical connection to the electrodes even if the contact pads are not precisely aligned with the electrodes.

While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims

1. A light emitting diode illumination system, comprising:

a light emitting diode module;

a substrate supporting the light emitting diode module, having a heat conductive region under the light emitting diode module;

a lamp holder combined with the substrate;

a heat conducting pillar disposed under the heat conductive region, sandwiched between the substrate and the lamp holder;

a first electrode and a second electrode electrically connected to the light emitting diode module, wherein the first electrode and the second electrode are disposed on at least an enclosed zone surrounding the heat conducting pillar.

2. The light emitting diode illumination system as claimed in claim 1, wherein the at least an enclosed zone comprises a circular zone or a concentric zone disposed to surround the heat conducting pillar, and further comprises:

a first and a second contact pad disposed outside of the heat conducting pillar, on the circular zone or the concentric zone, keeping electrical connection to the first and second electrodes while the lamp holder or the substrate is in rotation displacement.

3. The light emitting diode illumination system as claimed in claim 2, wherein the first and second electrodes are on the substrate, and the first and second contact pads are on the lamp holder.

4. The light emitting diode illumination system as claimed in claim 2, wherein the first and second electrodes are on a circuit board disposed on or between the substrate and the lamp holder, and the first and second electrodes, and are constructed by a first conductive layer and a second conductive layer on the circuit board along the circular zone or the concentric zone.

5. The light emitting diode illumination system as claimed in claim 4, further comprising:

a rotation locking structure, wherein the lamp holder and the substrate are combined with the rotation locking structure by rotating the lamp holder or the substrate.

6. The light emitting diode illumination system as claimed in claim 5, wherein the first conductive layer and the second conductive layer are semicircular or semi-annular patterns on the circular zone, isolated from each other.

7. The light emitting diode illumination system as claimed in claim 5, wherein the first conductive layer and the second conductive layer are semicircular or semi-annular patterns on the concentric zone, isolated with each other.

8. The light emitting diode illumination system as claimed in claim 5, wherein the first conductive layer and the second conductive layer are constructed to form at least an enclosed structure.

9. The light emitting diode illumination system as claimed in claim 5, wherein the first conductive layer and the second conductive layer are constructed by a plurality of discontinuous patterns.

10. The light emitting diode illumination system as claimed in claim 1, wherein the heat conducting pillar and the substrate are building-integrated, and the lamp holder comprises a hollow portion accommodating the heat conducting pillar.

11. The light emitting diode illumination system as claimed in claim 10, wherein a bottom of the hollow portion further comprises an air outlet to exhaust air in the hollow portion while the heat conducting pillar is inserted into the hollow portion of the lamp holder.

12. The light emitting diode illumination system as claimed in claim 1, wherein the substrate comprises a hollow portion accommodating the heat conducting pillar.

13. The light emitting diode illumination system as claimed in claim 12, wherein a sidewall of the hollow portion or the heat conducting pillar further comprises an air outlet to exhaust air in the hollow portion while the heat conducting pillar is inserted into the hollow portion under the heat conductive region.

14. The light emitting diode illumination system as claimed in claim 1, wherein the heat conducting pillar and the lamp holder are building-integrated.

15. The light emitting diode illumination system as claimed in claim 1, wherein the heat conducting pillar and the substrate have a contact area occupying one-fourth to two-third of an area of the substrate.

16. The light emitting diode illumination system as claimed in claim 6, wherein the rotation locking structure comprises a screw thread disposed on the heat conducting pillar, thereby locking the rotation locking structure on the substrate or the lamp holder.

17. The light emitting diode illumination system as claimed in claim 16, wherein the substrate or the lamp holder comprises a hollow portion accommodating the heat conducting pillar, and a sidewall of the hollow portion comprises a corresponding screw thread to lock the heat conducting pillar, wherein the sidewall of the hollow portion or the screw thread of the heat conducting pillar has a gap serving as an air outlet to exhaust air in the hollow portion while the heat conducting pillar is inserted into the hollow portion under the heat conductive region.

18. The light emitting diode illumination system as claimed in claim 1, wherein the heat conducting pillar is a ladder-shaped or taper-shaped structure having an end-face with a smaller area facing the substrate.

19. A light emitting diode illumination system, comprising:

a light emitting diode module;

a substrate supporting the light emitting diode module;

a lamp holder combined with the substrate;

a first electrode and a second electrode electrically connected to the light emitting diode module, wherein the first electrode and the second electrode are constructed to form at least an enclosed structure on or below the substrate.

20. The light emitting diode illumination system as claimed in claim 19, further comprises:

a first and a second contact pad disposed below the enclosed structure, keeping electrical connection to the first and second electrodes while the lamp holder or the substrate is in rotation displacement.

21. The light emitting diode illumination system as claimed in claim 20, further comprising:

22. The light emitting diode illumination system as claimed in claim 20, wherein the enclosed structure is disposed on a circular zone or a concentric zone below the substrate.