WO2009153850A1 - 車両用交流発電機の整流装置 - Google Patents
車両用交流発電機の整流装置 Download PDFInfo
- Publication number
- WO2009153850A1 WO2009153850A1 PCT/JP2008/060959 JP2008060959W WO2009153850A1 WO 2009153850 A1 WO2009153850 A1 WO 2009153850A1 JP 2008060959 W JP2008060959 W JP 2008060959W WO 2009153850 A1 WO2009153850 A1 WO 2009153850A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bent
- rectifier
- connection lead
- diode
- chip
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
- H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
- H02K11/05—Rectifiers associated with casings, enclosures or brackets
Definitions
- the present invention relates to a rectifier for a vehicle alternator that is built in a vehicle alternator and rectifies an AC output voltage of the vehicle alternator into a DC voltage.
- a field current is supplied to an exciting coil via a brush and a slip ring, and at the same time, rotational torque of the engine is applied to a rotating shaft via a pulley and a belt. Then, the rotor is driven to rotate. Thereby, the stator generates an alternating voltage. And the rectifier is attached to the rear bracket, is connected to the output terminal of the stator coil, and converts the AC output voltage generated by the stator into a DC voltage.
- the IC chip is solder-bonded to the copper base
- the copper relay lead is solder-bonded to the IC chip
- the copper connection lead is solder-bonded to the relay lead. It is molded by.
- connection lead is provided with a bent portion or a bent portion so that the stress generated in the IC chip is relieved by vibration generated when attached to the vehicle.
- bent parts cause stress concentration, and because they are close to the joints with IC chips and relay leads, displacement of the joints due to vibration generates large stresses, which causes breakage at the bent and bent parts There is.
- the present invention has been made to solve the above-described problems, and an object thereof is to obtain a rectifier for a vehicle alternator that can improve the vibration resistance of a diode.
- the present invention includes a heat sink, a connection board arranged to be orthogonal to the heat sink, a circuit board arranged in parallel to the heat sink, a metal base bonded on one side to the heat sink, and the metal base.
- An IC chip bonded to the other surface, a sealing resin body molded with the IC chip, a connection lead having one end electrically connected to the IC chip and the other end bonded to the connection terminal of the circuit board;
- a rectifier for a vehicle alternator that rectifies the AC output voltage into a DC voltage, and the connection lead of the diode extends in parallel from the metal base.
- Bending radius R of the serial bending portion is set to a distance w greater than in the horizontal direction of the tip portion of the exposed base portion and the connection lead from the sealing resin of the straight line portion.
- the bending radius R of the bent portion of the diode connection lead can be increased, the stress concentration generated in the bent portion of the diode connection lead is alleviated even if the rectifier is downsized. Breakage can be suppressed, and a highly reliable vehicle alternator rectifier can be obtained.
- FIG. 1 is a perspective view showing a rectifier according to Embodiment 1.
- FIG. 3 is a schematic side view of a diode applied to the rectifier according to Embodiment 1.
- FIG. 3 is a schematic explanatory diagram for explaining a lead shape of a diode in the first embodiment. It is a schematic side view of the diode applied to the conventional rectifier. It is a schematic side view which shows the other example of the diode applied to the conventional rectifier.
- FIG. 6 is a schematic side view showing another example of a diode applied to the rectifier according to Embodiment 1.
- FIG. 1 is a cross-sectional view showing an automotive alternator incorporating a rectifier according to Embodiment 1 of the present invention
- FIG. 2 is a perspective view showing the rectifier in FIG.
- the stator 1 includes a stator core 2 and a stator coil 3 wound around the stator core 2.
- the rotor 4 includes a pair of pole cores 5 and 6 facing each other, an excitation coil 7 interposed between the cores 5 and 6, a rotating shaft 8, and a slip ring 9 fixed to the rotating shaft 8.
- the rear bracket 13 is fixed to the front bracket 12 by fastening bolts 14, and the stator 1 is supported between the front bracket 12 and the rear bracket 13.
- the rotating shaft 8 is supported by the front bracket 12 and the rear bracket 13 via bearings 15 and 16.
- a pulley 17 is fixed to one end of the rotating shaft 8.
- the rectifier 18 is attached to the rear bracket 13, is connected to the output terminal of the stator coil 3, and converts the AC voltage generated in the stator 1 into a DC voltage.
- the voltage regulator 19 is attached to the rear bracket 13 together with the brush holder 20.
- the brush holder 20 supports the brush 21 so that the brush 21 contacts the slip ring 9.
- a field current is supplied to the exciting coil 7 via the brush 21 and the slip ring 9, and at the same time, the rotational torque of the engine rotates via the pulley 17 and a belt (not shown).
- the rotation is transmitted to the shaft 8 and the rotor 4 is driven to rotate.
- the stator 1 generates an alternating voltage.
- the AC voltage is converted into a DC voltage by the rectifier 18.
- the rectifier 18 includes a + heat sink 30 on which a plurality of + diodes 33 are mounted, a ⁇ heat sink 31 on which a plurality of ⁇ diodes 34 are mounted, and a circuit board assembly 32.
- the + side heat sink 30 is made of aluminum, and includes a missing annular portion 30a and a plurality of heat radiation fins 30b standing on the back surface of the missing annular portion 30a.
- positioning guide portions 30c are extended radially outward from both ends and the central three portions of the notched ring portion 30a, and the + side diode mounting portion 30d is circumferentially provided on the main surface of the notched ring portion 30a.
- a plurality of recesses are provided.
- a plurality of + side diodes 33 are joined to each + side diode mounting portion 30d and mounted in the circumferential direction on the main surface of the notched ring portion 30a.
- the minus-side heat sink 31 is made of aluminum, and is formed in a circumferential direction on a notched ring portion 31a, guide portions 31b provided at both ends and the center of the notched ring portion 31a, and a main surface of the notched ring portion 31a.
- a plurality of negative-side diode mounting portions 31c are provided.
- a plurality of -side diodes 34 are joined to the respective -side diode mounting portions 31c and mounted in the circumferential direction on the main surface of the notched ring portion 31a.
- the circuit board 32 includes a resin body 36 in which an iron circuit board is molded with polyphenylene sulfide (PPS) resin to form a ring shape, and guide portions provided at three ends of the resin body 36 and at the center. 36a.
- the connection terminals 37 of the circuit board protrude downward from the resin body 36 at a plurality of positions in the circumferential direction.
- FIG. 3 is a schematic side view of a diode applied to the rectifier according to the first embodiment.
- an IC chip 33a is solder-bonded to a copper metal base 33b
- a copper relay lead 33c is solder-bonded to the IC chip 33a
- a copper connection lead 33d is connected to the relay lead 33c.
- the connection lead 33d is bent at a substantially right angle while forming a bent portion 33g bent at 90 ° or more in a substantially arc shape from a straight portion 33f extending in parallel to the metal base 33b from the sealing resin body 33e.
- the joint portion 33h to be joined to the connection terminal 37 of the circuit board is formed at the tip portion.
- the bending radius R of the bending portion 33g of the connection lead 33d is set to a value larger than the separation distance w in the horizontal direction between the end of the straight portion 33f and the tip of the connection lead 33d.
- the ⁇ side diode 34 is configured in the same manner as the + side diode 33.
- the bending portion 33 g Since the bending radius R can be further increased, the stress concentration generated in the bending portion 33g can be reduced, and the breakage of the bending portion 33g can be suppressed. Further, since the bent portion 33g has a spring structure, vibration can be absorbed and stress generated in the IC chip 33a can be reduced.
- the stress generated in the bending portion 33g is relieved as the bending radius R is larger.
- the stress is relieved when the bending portion 33g is provided.
- the distance from the root of the connection lead 33d to the neutral line bent at a right angle is l [mm]
- the distance from the neutral line of the straight line 33f to the joint 33h at the tip of the connection lead is h [mm. ] (See FIG. 4), h> 2l.
- h the distance from the neutral line of the straight line 33f to the joint 33h at the tip of the connection lead
- the bending portion 40 plays the role of a damper that absorbs vibration when attached to the vehicle. Since R ′ is small, the damper effect is small and the stress generated in the IC chip 33a cannot be reduced. Further, since the bending radius R ′ is small, the stress concentration generated there is large, and the bending portion breaks.
- FIG. 6 when the bent portion 41 is provided in the straight portion, the bent portion 41 becomes a damper, so that the stress generated in the IC chip 33a can be reduced.
- both the bent portion 40 and the bent portion 41 are provided between [mm], the bending radius R of the bent portion has to be reduced, and stress is concentrated on the bent portion. Further, the stress generated in the bent portion 41 due to the displacement of the joint portion 33h is inversely proportional to the distance from the joint portion 33h, but as shown in the figure, the distance between the joint portion 33h and the bent portion 41 is small, so the displacement of the joint portion 33h. As a result, a large stress is generated in the bent portion 41. For the two reasons described above, the bent portion 40 or the bent portion 41 is broken by vibration.
- the bending portion 33g has a spring structure, so that the stress generated in the IC chip 33a can be reduced. Further, since the bending radius R of the bent portion is large, the stress concentration generated in the bent portion can be relaxed. In addition, since the distance between the joint portion 33h and the bent portion 33g is large compared to FIG. 6, the stress generated by the displacement of the joint portion can be reduced. As a result, the stress generated in the IC chip 33a can be reduced without breaking the connection lead 33d.
- the straight portion 33F is bent as shown in FIG.
- the maximum stress generated in the connection lead 33d is 1.5 and the stress generated in the IC chip 33a is 0.6
- the bending portion 33g as shown in FIG. 3 is provided.
- the maximum stress generated in the connection lead 33d was 0.7
- the stress generated in the IC chip 33a was 0.5, confirming the effect of the present invention.
- the shape is not limited to the shape of the connection lead 33d shown in FIG. 3, but the same effect can be obtained by a shape bent at a right angle from the bent portion 33g through the inclined portion 33i as shown in FIG.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Synchronous Machinery (AREA)
Abstract
Description
そして、整流装置を構成するダイオードは、ICチップが銅ベース上に半田接合され、銅製の中継リードがICチップに半田接合され、さらに銅製の接続リードが中継リードに半田接合され、封止樹脂体によりモールドされている。
18:整流装置
30:ヒートシンク
32:サーキットボード
33:ダイオード
33a:ICチップ
33b:金属ベース
33c:中継リード
33d:接続リード
33e:封止樹脂体
33f:直線部
33g:曲げ部
33h:接合部
33i:傾斜部
34:ダイオード
37:接続端子
図1は、この発明の実施の形態1に係る整流装置を内蔵した車両用交流発電機を示す断面図、図2は、図1における整流装置を示す斜視図である。
図1において、固定子1は、固定子コア2と、この固定子コア2に巻回された固定子コイル3とから構成されている。回転子4は、互いに対向する一対のポールコア5、6と、コア5、6間に介装された励磁コイル7と、回転軸8と、この回転軸8に固着されたスリップリング9とから構成されている。そして、リアブラケット13が締着ボルト14によりフロントブラケット12に固着されて、固定子1がフロントブラケット12とリアブラケット13との間に支持されている。回転軸8は、ベアリング15、16を介してフロントブラケット12とリアブラケット13とに支持されている。プーリ17が回転軸8の一端に固着されている。
整流装置18は、リアブラケット13に取り付けられており、固定子コイル3の出力端子に接続されて、固定子1で発生した交流電圧を直流電圧に変換する。電圧調整器19は、ブラシホルダ20とともにリアブラケット13に取り付けられている。ブラシホルダ20はブラシ21がスリップリング9に当接するようにブラシ21を支持している。
整流装置18は、複数の+側ダイオード33が実装された+側ヒートシンク30、複数の-側ダイオード34が実装された-側ヒートシンク31およびサーキットボードアッセンブリ32から構成されている。
+側ヒートシンク30は、アルミニウム製で、欠円環部30aおよびこの欠円環部30aの裏面に複数立設された放熱フィン30bを有する。また、位置決め用のガイド部30cがこの欠円環部30aの両端および中央の3ケ所から径方向外方に延設され、+側ダイオード実装部30dが欠円環部30aの主面に周方向に複数凹設されている。そして、+側ダイオード33が各+側ダイオード実装部30dに接合されて欠円環部30aの主面に周方向に複数実装されている。
-側ヒートシンク31は、アルミニウム製で、欠円環部31a、この欠円環部31aの両端および中央の3ケ所に設けられたガイド部31bおよびこの欠円環部31aの主面に周方向に複数凹設された-側ダイオード実装部31cを有している。そして、-側ダイオード34が各-側ダイオード実装部31cに接合されて欠円環部31aの主面に周方向に複数実装されている。
サーキットボード32は、鉄製のサーキットボードがポリフェニレンサルファイド(PPS)樹脂によりモールドされて欠円環形状に成形された樹脂体36と、この樹脂体36の両端および中央の3ケ所に設けられたガイド部36aとから構成されている。そして、サーキットボードの接続端子37が周方向の複数の位置で樹脂体36から下方に突出されている。
図3において、+側ダイオード33は、ICチップ33aが銅製の金属ベース33b上に半田接合され、銅製の中継リード33cがICチップ33aに半田接合され、さらに銅製の接続リード33dが中継リード33cに半田接合され、封止樹脂体33eによりモールドされて構成されている。
そして、接続リード33dは、封止樹脂体33eから上記金属ベース33bに平行に延出された直線部33fから略円弧状に90°以上に曲げられた曲げ部33gを形成しながらほぼ直角に曲げられた形状を有し、その先端部にはサーキットボードの接続端子37に接合される接合部33hが形成されている。
ここで、接続リード33dの曲げ部33gの曲げ半径Rは、直線部33fの終端と接続リード33dの先端部の水平方向における離間距離wより大きい値に設定されている。
なお、-側ダイオード34も+側ダイオード33と同様に構成されている。
また、曲げ部33gがバネ構造になるために、振動を吸収でき、ICチップ33aに発生する応力を低減できる。
次に、図6に示すように、屈曲部41を直線部に設けた場合には、その屈曲部41がダンパーとなるため、ICチップ33aに発生する応力を低減することができるが、距離h[mm]の間に曲げ部40と屈曲部41の両方を設けるので、屈曲部の曲げ半径Rが小さくならざるを得ず、屈曲部に応力が集中してしまう。また接合部33hの変位によって屈曲部41に発生する応力は、接合部33hとの距離に反比例するが、図から解るように接合部33hと屈曲部41の距離が小さいため、接合部33hの変位によって屈曲部41には大きな応力が発生してしまう。上記の二つの理由で振動により曲げ部40あるいは屈曲部41で破断してしまう。
応力解析を実施した結果では、従来の曲げ部40の場合の、接続リード33dに発生する最大応力を1、ICチップ33aに発生する応力を1とすると、図6のように直線部33Fに屈曲部41を設けた場合では、接続リード33dに発生する最大応力は1.5、ICチップ33aに発生する応力は0.6であるのに対し、図3に示すような曲げ部33gを設けた場合には、接続リード33dに発生する最大応力は0.7、ICチップ33aに発生する応力は0.5となり、本発明の効果を確認できた。
Claims (3)
- ヒートシンクと、
このヒートシンクに直交するように配置された接続端子を有し、上記ヒートシンクに平行に配置されたサーキットボードと、
片面が上記ヒートシンクと接合された金属ベース、この金属ベースの他方の面に接合されたICチップ、このICチップをモールドした封止樹脂体、及び一端を上記ICチップに電気的に接続され、他端を上記サーキットボードの接続端子に接合された接続リードとを有するダイオードとを備え、
車両用交流発電機に内蔵され、その交流出力電圧を直流電圧に整流する車両用交流発電機の整流装置において、
上記ダイオードの接続リードは、上記金属ベースから平行に延出され上記封止樹脂体から露出した直線部と、この直線部から略円弧状に90°以上曲げられた曲げ部とを有し、
上記曲げ部の曲げ半径Rは、上記直線部の終端と上記接続リードの先端部との水平方向における離間距離wより大きい値に設定されていることを特徴とする車両用交流発電機の整流装置。 - 上記接続リードは、上記直線部の露出根元から、直角に折り曲げられた部位の中立線までの距離をl[mm]、上記直線部の中立線から、上記接続端子と上記接続リードの接合点までの距離をh[mm]とした場合、h>2lの関係を有することを特徴とする請求項1記載の車両用交流発電機の整流装置。
- 上記接続リードは、上記曲げ部から傾斜部を経て直角に折り曲げられた形状を有することを特徴とする請求項1または2記載の車両用交流発電機の整流装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/060959 WO2009153850A1 (ja) | 2008-06-16 | 2008-06-16 | 車両用交流発電機の整流装置 |
US12/936,846 US8803382B2 (en) | 2008-06-16 | 2008-06-16 | Rectifying device of vehicle alternator |
EP08765642.7A EP2290789B1 (en) | 2008-06-16 | 2008-06-16 | Rectifier of ac generator for vehicle |
JP2010517575A JP5116848B2 (ja) | 2008-06-16 | 2008-06-16 | 車両用交流発電機の整流装置 |
CN2008801276581A CN101960694B (zh) | 2008-06-16 | 2008-06-16 | 车用交流发电机的整流装置 |
KR1020107020512A KR101126404B1 (ko) | 2008-06-16 | 2008-06-16 | 차량용 교류 발전기의 정류 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/060959 WO2009153850A1 (ja) | 2008-06-16 | 2008-06-16 | 車両用交流発電機の整流装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009153850A1 true WO2009153850A1 (ja) | 2009-12-23 |
Family
ID=41433781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/060959 WO2009153850A1 (ja) | 2008-06-16 | 2008-06-16 | 車両用交流発電機の整流装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8803382B2 (ja) |
EP (1) | EP2290789B1 (ja) |
JP (1) | JP5116848B2 (ja) |
KR (1) | KR101126404B1 (ja) |
CN (1) | CN101960694B (ja) |
WO (1) | WO2009153850A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011120830A3 (de) * | 2010-03-31 | 2012-06-21 | Robert Bosch Gmbh | Gleichrichter für wechselstromgeneratoren |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8803382B2 (en) * | 2008-06-16 | 2014-08-12 | Mitsubishi Electric Corporation | Rectifying device of vehicle alternator |
CN104953298A (zh) * | 2015-06-02 | 2015-09-30 | 成都国光电气股份有限公司 | 一种电极引线的保护件 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11252877A (ja) * | 1998-02-26 | 1999-09-17 | Mitsubishi Electric Corp | 車両用交流発電機の整流器 |
JP2001175194A (ja) * | 1999-12-21 | 2001-06-29 | Ise Electronics Corp | 蛍光表示管および電子部品 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3540494A (en) * | 1968-05-31 | 1970-11-17 | Magnavox Co | Machine for treating electrical components |
DE2714145C2 (de) * | 1976-03-31 | 1985-01-10 | Mitsubishi Denki K.K., Tokio/Tokyo | Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen |
US4489374A (en) * | 1981-09-21 | 1984-12-18 | Mitsubishi Denki Kabushiki Kaisha | Rectifying apparatus for automotive A.C. generator |
JPS61150255A (ja) * | 1984-12-24 | 1986-07-08 | Toshiba Corp | 半導体装置とその製造方法 |
US4862929A (en) * | 1988-02-29 | 1989-09-05 | Honeywell Inc. | Single camel hump die |
US5234363A (en) * | 1989-04-10 | 1993-08-10 | Sanshin Kogyo Kabushiki Kaisha | Battery charging device installing structure for outboard motor |
US5339218A (en) * | 1993-05-20 | 1994-08-16 | Microsemi Corporation | Surface mount device |
JP3342987B2 (ja) * | 1995-06-28 | 2002-11-11 | 三菱電機株式会社 | 車両用交流発電機 |
FR2768870B1 (fr) * | 1997-09-25 | 2003-09-26 | Denso Corp | Alternateur pour un vehicule automobile |
JPH11307708A (ja) * | 1998-04-23 | 1999-11-05 | Nec Corp | 半導体装置 |
US6275404B1 (en) * | 1999-03-30 | 2001-08-14 | Denso Corporation | Rectifier arrangement of vehicle AC generator |
JP4106852B2 (ja) * | 2000-04-14 | 2008-06-25 | 株式会社デンソー | 車両用交流発電機 |
JP3894413B2 (ja) * | 2000-06-08 | 2007-03-22 | 三菱電機株式会社 | 車両用交流発電機 |
DE60123715T2 (de) * | 2000-08-09 | 2007-08-23 | Denso Corp., Kariya | Rotierende elektrische Maschine für Fahrzeuge |
JP3905300B2 (ja) * | 2000-10-30 | 2007-04-18 | 三菱電機株式会社 | 車両用交流発電機 |
US6661662B2 (en) * | 2001-02-21 | 2003-12-09 | Transpo Electronics, Inc. | Vehicular modular design multiple application rectifier assembly |
JP3775235B2 (ja) * | 2001-03-29 | 2006-05-17 | 株式会社デンソー | 車両用交流発電機 |
US8803382B2 (en) * | 2008-06-16 | 2014-08-12 | Mitsubishi Electric Corporation | Rectifying device of vehicle alternator |
-
2008
- 2008-06-16 US US12/936,846 patent/US8803382B2/en active Active
- 2008-06-16 CN CN2008801276581A patent/CN101960694B/zh not_active Expired - Fee Related
- 2008-06-16 WO PCT/JP2008/060959 patent/WO2009153850A1/ja active Application Filing
- 2008-06-16 EP EP08765642.7A patent/EP2290789B1/en active Active
- 2008-06-16 KR KR1020107020512A patent/KR101126404B1/ko active IP Right Grant
- 2008-06-16 JP JP2010517575A patent/JP5116848B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11252877A (ja) * | 1998-02-26 | 1999-09-17 | Mitsubishi Electric Corp | 車両用交流発電機の整流器 |
JP3839576B2 (ja) | 1998-02-26 | 2006-11-01 | 三菱電機株式会社 | 車両用交流発電機の整流器 |
JP2001175194A (ja) * | 1999-12-21 | 2001-06-29 | Ise Electronics Corp | 蛍光表示管および電子部品 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2290789A4 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011120830A3 (de) * | 2010-03-31 | 2012-06-21 | Robert Bosch Gmbh | Gleichrichter für wechselstromgeneratoren |
Also Published As
Publication number | Publication date |
---|---|
KR101126404B1 (ko) | 2012-03-28 |
JPWO2009153850A1 (ja) | 2011-11-17 |
JP5116848B2 (ja) | 2013-01-09 |
US20110037356A1 (en) | 2011-02-17 |
KR20100120210A (ko) | 2010-11-12 |
US8803382B2 (en) | 2014-08-12 |
EP2290789B1 (en) | 2020-04-01 |
EP2290789A4 (en) | 2017-04-19 |
EP2290789A1 (en) | 2011-03-02 |
CN101960694B (zh) | 2013-05-01 |
CN101960694A (zh) | 2011-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3839576B2 (ja) | 車両用交流発電機の整流器 | |
US6429556B1 (en) | AC generator for vehicle | |
CN108352771B (zh) | 交流发电机 | |
JP4404112B2 (ja) | 車両用交流発電機 | |
JP4506820B2 (ja) | 車両用交流発電機の整流装置 | |
JP2008072793A (ja) | 車両用交流発電機 | |
JP4790049B2 (ja) | 車両用交流発電機およびそれに搭載される整流装置の製造方法 | |
WO2016079866A1 (ja) | 車両用交流発電機 | |
JP2009065744A (ja) | 車両用交流発電機 | |
JP5116848B2 (ja) | 車両用交流発電機の整流装置 | |
US7535137B2 (en) | Alternator | |
JP4575385B2 (ja) | 交流発電機の整流器 | |
JP2010022113A (ja) | 交流発電機 | |
JP6324531B2 (ja) | 車両用交流発電機 | |
JP4869386B2 (ja) | 回転電機 | |
WO2016079867A1 (ja) | 車両用交流発電機 | |
JP2010074877A (ja) | 回転電機および整流器用ヒートシンクの製造方法 | |
JP5062864B2 (ja) | 交流発電機 | |
JP2003169457A (ja) | 車両用交流発電機の整流装置 | |
JP5496272B2 (ja) | 交流発電機 | |
JP2001292547A (ja) | 車両用交流発電機 | |
JP2010080482A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880127658.1 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08765642 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010517575 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008765642 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20107020512 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12936846 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 7923/CHENP/2010 Country of ref document: IN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |