WO2009152672A1 - Encapsulating apparatus for solar cells and encapsulating method for solar cells - Google Patents

Encapsulating apparatus for solar cells and encapsulating method for solar cells Download PDF

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Publication number
WO2009152672A1
WO2009152672A1 PCT/CN2008/073436 CN2008073436W WO2009152672A1 WO 2009152672 A1 WO2009152672 A1 WO 2009152672A1 CN 2008073436 W CN2008073436 W CN 2008073436W WO 2009152672 A1 WO2009152672 A1 WO 2009152672A1
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WO
WIPO (PCT)
Prior art keywords
substrate
package
back cover
packaging
base
Prior art date
Application number
PCT/CN2008/073436
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French (fr)
Chinese (zh)
Inventor
范振华
Original Assignee
东莞宏威数码机械有限公司
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Publication of WO2009152672A1 publication Critical patent/WO2009152672A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes

Definitions

  • the present invention relates to a package preparation apparatus for a solar cell, and more particularly to a package preparation device for a thin film solar cell.
  • the invention also relates to a method for packaging solar cells, in particular thin film solar cells. Background technique
  • the preparation of solar cells, especially thin film solar cells, is inseparable from packaging.
  • packaging operation is one of the most important aspects.
  • the quality of the package directly affects the battery's ability to block moisture and oxygen intrusion. Moisture and oxygen entering the outside world can destroy the inherent properties and durability of the film material in thin-film solar cells, thereby shortening the life of the device and reducing the stability of the device.
  • the main problems in the packaging of solar cells are as follows: First, there are more bubbles or wormholes formed by the sealant between the cover glass and the device substrate, so that the sealant will be lowered.
  • the barrier to moisture and oxygen to the outside world that is, the external moisture and oxygen easily pass through the sealant through the wormhole or the bubble formed into the package panel, which will affect the normal operation of the battery.
  • the uneven force on the device causes the fluctuation of the width of the glue line of the device to be too large, which affects the effect of the package.
  • Third, in the high temperature test of the device volatile substances such as organic solvents contained in the sealant are released, which may It is a gas harmful to the device. For example, the volatile substance may damage the battery film material, thereby reducing the yield of the device. Summary of the invention
  • Another object of the present invention is to provide a package preparation apparatus for a solar cell, and more particularly to a package preparation apparatus for a thin film solar cell. Another object of the present invention is to provide a method for packaging a solar cell using the above-described package preparation apparatus, and more particularly to provide a packaging method for a thin film solar cell.
  • the above packaging device and packaging method can fundamentally avoid bubbles or wormholes formed by sealing in the packaging process, solve the problem of poor uniformity of the width of the glue line, and eliminate volatile substances in the sealing glue, thereby improving the yield of the device. .
  • a package preparation apparatus for a solar cell comprising a back cover and a substrate, the back cover and the substrate being bonded together by glue
  • the package is prepared
  • the device comprises: a package pretreatment chamber for pretreating the back cover before packaging; a substrate temporary storage chamber for temporarily storing the coated substrate; a packaging working chamber for using the substrate and The back cover is packaged together; and a hardening device for curing the glue; wherein the operation between the package pretreatment chamber, the substrate temporary storage chamber, the package working chamber, and the hardening device is performed by a robot get on.
  • the package pretreatment chamber may include: a housing for defining a sealed operating environment; a pulley assembly for carrying a back cover thereon; a heating assembly for heating to degas the glue; a lifting mechanism for lifting; and a cooling assembly for cooling the back cover; wherein the pulley assembly, the heating assembly, the lifting mechanism, and the cooling assembly operate in the sealed operating environment.
  • the heating assembly is preferably an infrared heating assembly, preferably using cooling water to achieve a cooling effect.
  • the substrate temporary storage chamber includes a housing for defining a sealed operating environment, and a pulley assembly for carrying a coated substrate in the substrate temporary storage chamber, wherein the pulley assembly and the substrate are The non-coated zone contacts, the pulley assembly operates in the sealed operating environment.
  • the packaging studio may include:
  • a housing for defining a sealed operating environment
  • An upper cover plate for carrying a substrate having a smooth adsorption surface on the adsorption surface Forming a vacuum chamber for adsorbing the substrate, the upper cover plate comprising at least one suction pipe communicating with the vacuum chamber;
  • a base for carrying a back cover having a carrying platform for carrying a back cover
  • the upper cover may be closed with the base to define a sealed cavity, and the sealed cavity defined is at least a vacuum pump connection for pumping and inflating the sealed chamber
  • a guiding positioning device for positioning a substrate and a cover plate conveyed into the package working chamber; a lifting device for lifting the upper cover;
  • the upper cover, the base, the guiding and positioning device, the lifting device for lifting the upper cover, and the lifting device for lifting the base are operated in the sealing operation environment .
  • the mutually closed surfaces of the upper cover and the base are provided with a sealing jaw and a guide post and a pole for positioning.
  • the base may include a base frame and quartz glass, and the quartz glass is fixed on the base frame, and the periphery thereof is sealed by a sealing ring.
  • the hardening device is disposed directly below the base of the packaging working chamber, which cures the glue through the quartz glass.
  • the glue is preferably a UV glue, and the hardening device consists essentially of a UV light source.
  • a method of packaging a solar cell, particularly a thin film solar cell, using the above package preparation apparatus includes the following steps:
  • Pre-package pre-treatment The back cover coated with the encapsulation glue is transferred from the pulley assembly of the encapsulation pre-treatment chamber to the package pre-treatment chamber for pre-treatment, ie the back cover is heated in a vacuum environment to eliminate the glue Bubbles and volatiles; the cover is then cooled by a cooling assembly to prevent deformation and stabilize The role of performance; wherein the back cover is coated with the glue side up.
  • the coated substrate is transferred from the roller assembly of the temporary storage chamber to the coated substrate temporary storage chamber, and then sent by the robot to the benchmark of the packaging studio, followed by alignment
  • the guide post of the device is positioned; after the positioning is completed, it is adsorbed on the upper cover plate and raised to a certain position through the vacuum groove of the adsorption surface of the upper cover plate; wherein the substrate is coated with the film side facing down, the pulley block
  • the piece and the robot are in contact with the uncoated area of the substrate.
  • the vacuum of the vacuum environment is preferably 10" 3 Torr, and the heating temperature is preferably less than 200 °C.
  • the inert gas is typically nitrogen.
  • the present invention can obtain such technical effects: As described above, according to the packaging method of the solar cell according to the present invention and the package preparation device thereof, the glue on the back cover is heated and degassed in a vacuum environment by the package pretreatment chamber. The possibility of forming bubbles in the sealant is fundamentally reduced, and the adverse effects of volatile substances on the device can also be eliminated in advance. Packer in an inert gas (usually nitrogen) environment The chamber is pressed and packaged, and the substrate and the back cover are precisely positioned by the guiding and positioning device, and then the lifting device capable of precisely adjusting the lifting speed is used to adjust the position of the substrate and the back cover package before pressing, and finally to the sealing cavity.
  • an inert gas usually nitrogen
  • the body is inflated with air pressure to achieve the package press of the substrate and the back cover, which can effectively control the magnitude and uniformity of the force acting on the substrate and the cover sheet, and reduce the fluctuation of the width of the device glue line, thereby achieving a good The packaging effect.
  • FIG. 1 is a flow chart of a method for packaging a solar cell of the present invention
  • Figure 2 is a cross-sectional view showing a substrate temporary storage chamber of a package manufacturing apparatus for a solar cell according to the present invention.
  • Figure 2 (b) is a top view of Figure 2 (a);
  • Figure 3 is a cross-sectional view showing a package pretreatment chamber of a package manufacturing apparatus for a solar cell according to the present invention
  • Figure 4 is a cross-sectional view showing a package working chamber and a UV curing device of a package preparation device for a solar cell according to the present invention.
  • the package device provided by the present invention includes a substrate temporary storage chamber 100 (Fig. 2), a package pretreatment chamber 200 (Fig. 3), a package working chamber 300 (Fig. 4), and a hardening device 22 (Fig. 4).
  • the substrate temporary storage room package 100 includes: a housing 3, To form a sealed operating environment; a roller assembly 2 for carrying and transporting the coated substrate 1.
  • the coated substrate 1 comprises a non-coated region 4 and a coated region 5 (shown with the coated side facing down).
  • the package pretreatment chamber 200 includes: a housing 7 for forming a sealed operating environment; a roller assembly 10 for transporting the rear cover 9; and a lifting device 11 for lifting the rear cover 9 to the heating assembly 8 a suitable distance for heating; a heating assembly 8 for heating the glue applied on the back cover 9 to remove air bubbles and volatile substances; and a cooling assembly 6 which can cool the back cover 9 with cooling water and stabilize The deformation of the back cover.
  • the entire heating and cooling process is carried out under vacuum.
  • the package working chamber 300 includes: a housing 18 for forming a sealed operating environment; an upper cover 16 for carrying the coated substrate, the upper cover having an adsorption surface 17 (generally planar), A vacuum chamber for adsorbing the substrate is formed on the adsorption surface 17.
  • the upper cover 16 is formed with an exhaust pipe communicating with the vacuum chamber, and the suction pipe is connected to a vacuum pump for generating a negative pressure to adsorb the substrate.
  • a base for carrying a back cover the base having a carrying platform 20 for carrying a back cover
  • the base comprising a base frame and quartz glass, the quartz glass being fixed on the bottom of the base frame, the periphery of which is sealed by, for example, a seal
  • the guiding and positioning device is disposed between the upper cover and the base, and includes a guide post 19 and a pole fixed on the base; and lifting devices 13 and 14, respectively, for lifting and lowering the upper cover and the base of the base to adjust the coating base
  • the distance between the sheet and the back cover is also used to achieve the positional treatment of the coated substrate and the back cover before the press-fit package.
  • the upper cover may be closed to the base to define a sealed cavity, and the sealed cavity formed is coupled to at least one vacuum pump for pumping and inflating the sealed cavity.
  • the hardening device 11 is mounted under the base of the packaging working chamber 300, generally consisting of a UV light source for curing the glue, and the UV light is passed through the quartz glass to effect the curing of the glue.
  • Figure 1 shows the overall package flow diagram.
  • the robot takes out the coated substrate 1 from the substrate temporary storage chamber 100 and feeds it to the packaging working chamber 300; Then, the robot takes out the back cover 9 from the package pretreatment chamber 200 and feeds it to the package working chamber 300, and then the substrate 1 and the back cover 9 realize the press-fit package in the package working chamber 300; finally, the glue is applied by the UV curing device 11. Curing, the robot takes the device out of the package studio and outputs it from the finished output.
  • the operation of the substrate temporary storage chamber in the packaging method and packaging apparatus of the present invention and the alignment (positioning) of the plating substrate in the packaging working chamber will be specifically described below in conjunction with Figs.
  • the coated substrate facing downwardly is coated by the roller assembly 1 into the housing 3 of the substrate temporary storage chamber, wherein the area of the roller assembly 2 contacting the substrate is the uncoated region 4, and the coating region 5 of the substrate is not touched.
  • the film layer protects the coating area of the substrate 1; then the coated substrate 1 is fed by a robot to the holder 21 in the housing 18 of the package working chamber 300; the coated substrate is aligned by the guide post 19 in the positioning device After the alignment is completed, the upper cover 16 is lowered by the upper cover lifting assembly 13 under the control of the motor, and the upper cover 16 is lowered.
  • the suction is started by a suction device such as a vacuum pump, and is negative. Under the action of the pressure, the suction mechanism 15 of the adsorption surface 17 adsorbs the coated substrate 1, and then rises to a certain position by the lifting mechanism 13.
  • the operation of the package pre-treatment chamber and the alignment of the back cover in the package working chamber and the package press-fitting operation are specifically illustrated in conjunction with FIGS. 3 and 4.
  • the back cover 9 to which the glue is applied (the glue face up) is transferred by the roller assembly 10 into the casing 7 of the package pretreatment chamber, and then the lifter 11 drives the jack to raise the back cover 9 to the heating assembly 8 appropriately.
  • the vacuum reaches l (T 3 Tor r or so, the heating assembly 8 is turned on to heat and degas the back cover 9 and the temperature is controlled at 20 Below ⁇ TC, the heating is stopped after a few minutes, and then the cooling unit 6 is turned on to cool the back cover 9.
  • the package pretreatment chamber 200 is filled with an inert (usually nitrogen) gas, and then the back cover 9 is fed by the robot to the holder 21 in the housing 18 of the package working chamber 300, followed by alignment
  • the guide post 19 of the device is placed (positioned) and placed on the base carrier 20; then, the back cover 9 is raised by the carrier lift assembly 14 to a certain position, so that the back cover 9 and the substrate 1 are opposite each other.
  • the distance is between 2 ⁇ but not limited to this distance. At this point, the back cover stops at this position, and the upper cover rises.
  • the descending component 13 is lowered again with the coated substrate 1 so that the distance between the coated substrate 1 and the back cover 9 is about 0.02 ⁇ , but is not limited to this distance, the drop is stopped, and then the suction device is closed (such as a vacuum pump). , not shown), and the opening of the inflator (not shown) is inflated through the vacuum chamber of the adsorption surface of the upper cover, at which time the air pressure in the sealed chamber defined by the closure of the upper cover and the base is gradually increased, and the device The internal air pressure cannot rise, so that the pressure difference between the inside and the outside forces the substrate 1 and the back cover 9 to be tightly bonded, and the glue line is gradually pressed.
  • the suction device such as a vacuum pump
  • UV lamp assembly 22 of the hardening device is turned on, the glue is solidified, and the device is taken out by the robot to output from the finished product outlet, as shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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Abstract

An encapsulating apparatus for solar cells is provided. The apparatus includes a packaging-pretreating chamber (200) for preheating a substrate before the packaging, a wafer provisional storage chamber (100) for storing wafers temporarily, a packaging chamber (300) for packaging the substrate and the wafer together, and a curing device (22) for curing adhesive. A method for encapsulating solar cells is also provided. The apparatus and method of the invention could eliminate bubbles and evaporable material in the adhesive, control the stress between the wafer and the substrate effectively, and improve the effect of the package.

Description

太阳电池的封装制备装置和封装太阳电池的方法  Solar cell package preparation device and method for packaging solar cell
技术领域  Technical field
本发明涉及一种太阳电池的封装制备装置， 特别是薄膜太阳电池的封装制 备装置。 本发明还涉及一种用于封装太阳电池， 尤其是薄膜太阳电池的方法。 背景技术  The present invention relates to a package preparation apparatus for a solar cell, and more particularly to a package preparation device for a thin film solar cell. The invention also relates to a method for packaging solar cells, in particular thin film solar cells. Background technique
太阳电池， 尤其是薄膜太阳电池的制备， 离不开封装。 在制作薄膜太阳电 池的工艺过程中， 封装操作是其中非常重要的环节之一， 封装的好坏直接影响 到电池阻碍水分及氧气侵入的能力。 外界进入的水分和氧气能够破坏薄膜太阳 电池中的薄膜材料的固有性能和耐久性， 从而缩短器件的寿命、 降低器件的稳 定性。  The preparation of solar cells, especially thin film solar cells, is inseparable from packaging. In the process of making thin-film solar cells, packaging operation is one of the most important aspects. The quality of the package directly affects the battery's ability to block moisture and oxygen intrusion. Moisture and oxygen entering the outside world can destroy the inherent properties and durability of the film material in thin-film solar cells, thereby shortening the life of the device and reducing the stability of the device.
在现有技术中， 在太阳电池的封装中存在的主要问题有： 一是玻璃盖片和 器件基片之间的封胶形成的气泡或虫洞较多， 如此一来， 将会降低封胶对外界 的水分及氧气的阻隔性， 即外界的水分与氧气容易经由虫洞或形成的气泡处穿 过封胶进入封装面板， 从而会影响电池的正常运作； 二是作用在基片和后盖上 的作用力的不均匀造成了器件胶线宽度的波动过大， 影响了封装的效果； 三是 在器件的高温测试中， 封胶中含有的挥发性物质如有机溶剂会释放出来， 其可 能是对器件有害的气体， 例如该挥发性物质会破坏电池薄膜材料， 从而降低器 件的良品率。 发明内容  In the prior art, the main problems in the packaging of solar cells are as follows: First, there are more bubbles or wormholes formed by the sealant between the cover glass and the device substrate, so that the sealant will be lowered. The barrier to moisture and oxygen to the outside world, that is, the external moisture and oxygen easily pass through the sealant through the wormhole or the bubble formed into the package panel, which will affect the normal operation of the battery. Second, it acts on the substrate and the back cover. The uneven force on the device causes the fluctuation of the width of the glue line of the device to be too large, which affects the effect of the package. Third, in the high temperature test of the device, volatile substances such as organic solvents contained in the sealant are released, which may It is a gas harmful to the device. For example, the volatile substance may damage the battery film material, thereby reducing the yield of the device. Summary of the invention
针对上述问题， 本发明的一个目的是提供一种用于太阳电池的封装制备装 置， 特别是提供一种用于薄膜太阳电池的封装制备装置。 本发明的另一个目的是提供一种釆用上述的封装制备装置来封装太阳电池 的方法， 特别是提供一种用于薄膜太阳电池的封装方法。 In view of the above problems, it is an object of the present invention to provide a package preparation apparatus for a solar cell, and more particularly to a package preparation apparatus for a thin film solar cell. Another object of the present invention is to provide a method for packaging a solar cell using the above-described package preparation apparatus, and more particularly to provide a packaging method for a thin film solar cell.
上述封装装置和封装方法能够从根本上避免封装过程中封胶形成的气泡或 虫洞， 解决胶线宽度均匀性较差的问题， 以及消除封胶中的挥发性物质， 从而 提高器件的良品率。  The above packaging device and packaging method can fundamentally avoid bubbles or wormholes formed by sealing in the packaging process, solve the problem of poor uniformity of the width of the glue line, and eliminate volatile substances in the sealing glue, thereby improving the yield of the device. .
根据本发明， 一种用于太阳电池， 尤其是薄膜太阳电池的封装制备装置， 该太阳电池包括后盖和基片， 该后盖和基片通过胶水结合在一起， 其特征在于， 该封装制备装置包括： 封装预处理室， 用于在封装前对所述后盖进行预处 理； 基片暂存室， 用于暂存镀膜后的基片； 封装工作室， 用于将所述基片和所 述后盖封装在一起； 以及用于固化胶水的硬化装置； 其中， 所述封装预处理室、 所述基片暂存室、 所述封装工作室和所述硬化装置之间的操作通过机械手进行。  According to the present invention, a package preparation apparatus for a solar cell, particularly a thin film solar cell, comprising a back cover and a substrate, the back cover and the substrate being bonded together by glue, characterized in that the package is prepared The device comprises: a package pretreatment chamber for pretreating the back cover before packaging; a substrate temporary storage chamber for temporarily storing the coated substrate; a packaging working chamber for using the substrate and The back cover is packaged together; and a hardening device for curing the glue; wherein the operation between the package pretreatment chamber, the substrate temporary storage chamber, the package working chamber, and the hardening device is performed by a robot get on.
所述封装预处理室可以包括： 壳体， 用于限定一密封操作环境； 用于在其 上承载后盖的滑轮组件； 用于加热以对胶水进行除气的加热组件； 用于使后盖 升降的升降机构； 以及用于冷却后盖的冷却组件； 其中， 所述滑轮组件、 所述 加热组件、 所述升降机构和所述冷却组件在所述密封操作环境中进行操作。  The package pretreatment chamber may include: a housing for defining a sealed operating environment; a pulley assembly for carrying a back cover thereon; a heating assembly for heating to degas the glue; a lifting mechanism for lifting; and a cooling assembly for cooling the back cover; wherein the pulley assembly, the heating assembly, the lifting mechanism, and the cooling assembly operate in the sealed operating environment.
所述加热组件优选地为红外加热组件 , 所述冷却组件优选地采用冷却水来 达到冷却效果。  The heating assembly is preferably an infrared heating assembly, preferably using cooling water to achieve a cooling effect.
所述基片暂存室包括一壳体， 该壳体用于限定一密封操作环境， 在所述基 片暂存室内具有用于承载镀膜基片的滑轮组件， 其中该滑轮组件与基片的非镀 膜区接触， 该滑轮组件在所述密封操作环境中进行操作。  The substrate temporary storage chamber includes a housing for defining a sealed operating environment, and a pulley assembly for carrying a coated substrate in the substrate temporary storage chamber, wherein the pulley assembly and the substrate are The non-coated zone contacts, the pulley assembly operates in the sealed operating environment.
所述封装工作室可以包括：  The packaging studio may include:
壳体， 用于限定一密封操作环境；  a housing for defining a sealed operating environment;
用于承载基片的上盖板， 所述上盖板具有一光滑的吸附面， 在该吸附面上 形成有用于吸附基片的真空槽， 所述上盖板包括至少一个与所述真空槽连通的 抽气管； An upper cover plate for carrying a substrate, the upper cover plate having a smooth adsorption surface on the adsorption surface Forming a vacuum chamber for adsorbing the substrate, the upper cover plate comprising at least one suction pipe communicating with the vacuum chamber;
用于承载后盖的底座， 所述底座具有一用于承载后盖的承载台， 所述上盖 板可以与所述底座相互闭合以限定一个密封的腔体， 所限定的密封腔体至少与 一个真空泵连接， 用于对密封腔体进行抽气和充气；  a base for carrying a back cover, the base having a carrying platform for carrying a back cover, the upper cover may be closed with the base to define a sealed cavity, and the sealed cavity defined is at least a vacuum pump connection for pumping and inflating the sealed chamber;
导向定位装置， 用于对传送进入封装工作室中的基片和盖板进行定位； 用于使上盖板升降的升降装置； 以及  a guiding positioning device for positioning a substrate and a cover plate conveyed into the package working chamber; a lifting device for lifting the upper cover; and
用于使底座升降的升降装置；  a lifting device for lifting the base;
其中， 所述上盖板、 所述底座、 所述导向定位装置、 所述用于使上盖板升 降的升降装置和所述用于使底座升降的升降装置在所述密封操作环境中进行操 作。  Wherein, the upper cover, the base, the guiding and positioning device, the lifting device for lifting the upper cover, and the lifting device for lifting the base are operated in the sealing operation environment .
优选地， 所述上盖板与所述底座的相互闭合的表面上设置有密封圏以及用 于定位的导柱和标杆。  Preferably, the mutually closed surfaces of the upper cover and the base are provided with a sealing jaw and a guide post and a pole for positioning.
所述底座可以包括底座框架和石英玻璃， 所述石英玻璃固定在底座框架上， 其***通过密封圈密封。  The base may include a base frame and quartz glass, and the quartz glass is fixed on the base frame, and the periphery thereof is sealed by a sealing ring.
所述硬化装置设置在封装工作室的底座的正下方 , 其透过石英玻璃对胶水 进行固化。  The hardening device is disposed directly below the base of the packaging working chamber, which cures the glue through the quartz glass.
所述胶水优选地为 UV胶水， 所述硬化装置主要由 UV光源组成。  The glue is preferably a UV glue, and the hardening device consists essentially of a UV light source.
根据本发明的另一方面， 一种釆用上述的封装制备装置来封装太阳电池， 尤其是薄膜太阳电池的方法， 包括如下步骤：  According to another aspect of the present invention, a method of packaging a solar cell, particularly a thin film solar cell, using the above package preparation apparatus includes the following steps:
a) 封装前的预处理： 被涂有封装胶水的后盖由封装预处理室的滑轮组件传 送到封装预处理室中进行预处理， 即在真空环境下对后盖进行加热以消除胶水 中的气泡和挥发性物质； 然后由冷却组件冷却该盖片， 防止变形， 并起到稳定 性能的作用； 其中， 后盖涂有胶水的一面朝上。 a) Pre-package pre-treatment: The back cover coated with the encapsulation glue is transferred from the pulley assembly of the encapsulation pre-treatment chamber to the package pre-treatment chamber for pre-treatment, ie the back cover is heated in a vacuum environment to eliminate the glue Bubbles and volatiles; the cover is then cooled by a cooling assembly to prevent deformation and stabilize The role of performance; wherein the back cover is coated with the glue side up.
b) 镀膜基片的定位 （对位）： 镀膜基片由暂存室的滚轮组件传送到镀膜基 片暂存室中， 然后由机械手将其送至封装工作室的标杆处， 接着由对位装置的 导柱对其定位； 定位完毕后， 通过上盖板的吸附面的真空槽将其吸附在上盖板 上并上升至一定位置； 其中， 基片镀有膜的一面朝下， 滑轮组件和机械手与基 片的非镀膜区接触。  b) Positioning (alignment) of the coated substrate: The coated substrate is transferred from the roller assembly of the temporary storage chamber to the coated substrate temporary storage chamber, and then sent by the robot to the benchmark of the packaging studio, followed by alignment The guide post of the device is positioned; after the positioning is completed, it is adsorbed on the upper cover plate and raised to a certain position through the vacuum groove of the adsorption surface of the upper cover plate; wherein the substrate is coated with the film side facing down, the pulley block The piece and the robot are in contact with the uncoated area of the substrate.
c) 后盖的定位： 经过预处理后的后盖， 由机械手将其传送至封装工作室的 标杆处， 接着由对位装置的导柱对其定位； 定位完毕后， 将其放置在封装工作 室的底座承载台上。  c) Positioning of the back cover: The pre-processed back cover is transported by the robot to the pole of the packaging studio, and then positioned by the guide post of the alignment device; after positioning, it is placed in the package work The base of the room is on the loading platform.
d) 后盖和基片的压合封装： 后盖和基片经对位后， 通过封装工作室中的升 降机构将它们送至快要接触的位置， 然后， 向密封腔体内充气， 后盖与基片在 外界气压下被压合在一起， 胶水被均勾挤压； 其中， 整个封装过程是在惰性气 体的环境下进行， 以降低密封腔体内的水分和氧气含量， 后盖和基片为被压合 之前， 后盖和基片的两个表面之间的距离大于 0. 02mm。  d) Press-fit package of the back cover and the substrate: After the back cover and the substrate are aligned, they are sent to the position to be contacted by the lifting mechanism in the package working chamber, and then inflated into the sealed cavity, the back cover is The substrate is pressed together under the external air pressure, and the glue is uniformly pressed; wherein, the entire packaging process is performed under an inert gas atmosphere to reduce the moisture and oxygen content in the sealed cavity, and the back cover and the substrate are 2毫米。 The distance between the two surfaces of the back cover and the substrate is greater than 0. 02mm.
e) 使用硬化装置对胶水进行固化， 完成固化后， 打开密封腔体， 取出封装 好的器件。  e) Curing the glue with a hardening device. After curing, open the sealed cavity and remove the packaged device.
在所述封装前的预处理步骤中， 真空环境的真空度优选地为 10"3Torr , 加热温度优选地小于 200 °C。 In the pretreatment step before the encapsulation, the vacuum of the vacuum environment is preferably 10" 3 Torr, and the heating temperature is preferably less than 200 °C.
所述惰性气体通常是氮气。  The inert gas is typically nitrogen.
本发明可以获得这样的技术效果： 如上所述， 采用根据本发明的太阳电池 的封装方法及其封装制备装置， 先通过封装预处理室在真空环境下对后盖上的 胶水进行加热除气， 从根本上减少了封胶形成气泡的可能， 同时也可以预先消 除挥发性物质对器件的不利影响。 在惰性气体（通常为氮气） 环境下的封装工 作室进行压合封装， 通过导向定位装置对基片和后盖精确定位后， 然后由可以 精密调控升降速度的升降装置来调整基片与后盖封装压合前的位置， 最后通过 向密封腔体充气用气压来实现基片和后盖的封装压合， 这样能够有效控制作用 在基片和盖片的作用力的大小和均匀性， 减少器件胶线宽度的波动性， 从而达 到了很好的封装效果。 附图说明 The present invention can obtain such technical effects: As described above, according to the packaging method of the solar cell according to the present invention and the package preparation device thereof, the glue on the back cover is heated and degassed in a vacuum environment by the package pretreatment chamber. The possibility of forming bubbles in the sealant is fundamentally reduced, and the adverse effects of volatile substances on the device can also be eliminated in advance. Packer in an inert gas (usually nitrogen) environment The chamber is pressed and packaged, and the substrate and the back cover are precisely positioned by the guiding and positioning device, and then the lifting device capable of precisely adjusting the lifting speed is used to adjust the position of the substrate and the back cover package before pressing, and finally to the sealing cavity. The body is inflated with air pressure to achieve the package press of the substrate and the back cover, which can effectively control the magnitude and uniformity of the force acting on the substrate and the cover sheet, and reduce the fluctuation of the width of the device glue line, thereby achieving a good The packaging effect. DRAWINGS
通过本发明的太阳电池的封装制备装置和用于封装太阳电池的方法的优选 的、 非限制性实施例的详细说明， 本发明的其他特征和优点将更明显， 参考附 图， 下面将对本发明非限制性实施例进行说明， 其中：  Other features and advantages of the present invention will become more apparent from the detailed description of the preferred <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; A non-limiting embodiment is described in which:
图 1为本发明的用于封装太阳电池的方法的流程图；  1 is a flow chart of a method for packaging a solar cell of the present invention;
图 2 为根据本发明的太阳电池的封装制备装置的基片暂存室的剖视图。 其 中图 2 ( b ) 为图 2 ( a ) 的俯视图；  Figure 2 is a cross-sectional view showing a substrate temporary storage chamber of a package manufacturing apparatus for a solar cell according to the present invention. Figure 2 (b) is a top view of Figure 2 (a);
图 3为根据本发明的太阳电池的封装制备装置的封装预处理室的剖视图； 图 4为根据本发明的太阳电池的封装制备装置的封装工作室及 UV固化装置 的剖视图。 具体实施方式  Figure 3 is a cross-sectional view showing a package pretreatment chamber of a package manufacturing apparatus for a solar cell according to the present invention; and Figure 4 is a cross-sectional view showing a package working chamber and a UV curing device of a package preparation device for a solar cell according to the present invention. detailed description
以下将参照相关附图， 说明根据本发明的优选实施例的薄膜太阳电池的封 装制备装置。  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a package preparation apparatus for a thin film solar cell according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
本发明提供的封装装置包括基片暂存室 100 (图 2 )、 封装预处理室 200 (图 3 ), 封装工作室 300 (图 4 ) 以及硬化装置 22 (图 4 )。  The package device provided by the present invention includes a substrate temporary storage chamber 100 (Fig. 2), a package pretreatment chamber 200 (Fig. 3), a package working chamber 300 (Fig. 4), and a hardening device 22 (Fig. 4).
其中， 如图 2 , 尤其是图 2 ( a )所示， 基片暂存室包 100包括： 壳体 3 , 用 于形成密封操作环境； 滚轮组件 2 , 用于承载和传输镀膜基片 1。 如图 1 ( b )所 示， 该镀膜基片 1包括非镀膜区 4和镀膜区 5 (图中显示为镀膜面朝下）。 Wherein, as shown in FIG. 2, especially shown in FIG. 2(a), the substrate temporary storage room package 100 includes: a housing 3, To form a sealed operating environment; a roller assembly 2 for carrying and transporting the coated substrate 1. As shown in Fig. 1 (b), the coated substrate 1 comprises a non-coated region 4 and a coated region 5 (shown with the coated side facing down).
参见图 3， 封装预处理室 200包括： 壳体 7 , 用于形成密封操作环境； 滚轮 组件 10 , 用于传输后盖 9 ; 升降装置 11 , 用于将后盖 9托起至离加热组件 8适 当的距离以便进行加热； 加热组件 8， 用于对后盖 9上涂布的胶水进行加热以便 除去气泡和挥发性物质； 冷却组件 6 , 其可以使用冷却水对后盖 9进行冷却， 并 稳定后盖的变形。 整个加热和冷却过程中是在真空环境下进行的。  Referring to FIG. 3, the package pretreatment chamber 200 includes: a housing 7 for forming a sealed operating environment; a roller assembly 10 for transporting the rear cover 9; and a lifting device 11 for lifting the rear cover 9 to the heating assembly 8 a suitable distance for heating; a heating assembly 8 for heating the glue applied on the back cover 9 to remove air bubbles and volatile substances; and a cooling assembly 6 which can cool the back cover 9 with cooling water and stabilize The deformation of the back cover. The entire heating and cooling process is carried out under vacuum.
参见图 4 , 封装工作室 300 包括： 壳体 18 , 用于形成密封操作环境； 上盖 板 16， 用于承载镀膜后的基片， 上盖板具有吸附面 1 7 (通常为平面的）， 在该 吸附面 17上形成有用于吸附基片的真空槽， 上盖板 1 6上形成有与所述真空槽 连通的抽气管， 该抽气管与真空泵连接， 用于产生负压来吸附基片； 用于承载 后盖的底座， 该底座具有一用于承载后盖的承载台 20 , 底座包括底座框架和石 英玻璃， 该石英玻璃被固定在底座框的底部上， 其***用例如密封圏密封； 导 向定位装置，设置在上盖板与底座之间， 包括固定在底座上的导柱 19以及标杆； 升降装置 1 3， 14， 分别用于升降上盖板和底座的承载台来调整镀膜基片与后盖 的距离， 同时用来实现镀膜基片和后盖的压合封装前的位置处理。 所述上盖板 可以与所述底座相互闭合以限定一个密封的腔体， 所形成的密封腔体至少与一 个真空泵连接， 用于对密封腔体进行抽气和充气。  Referring to FIG. 4, the package working chamber 300 includes: a housing 18 for forming a sealed operating environment; an upper cover 16 for carrying the coated substrate, the upper cover having an adsorption surface 17 (generally planar), A vacuum chamber for adsorbing the substrate is formed on the adsorption surface 17. The upper cover 16 is formed with an exhaust pipe communicating with the vacuum chamber, and the suction pipe is connected to a vacuum pump for generating a negative pressure to adsorb the substrate. a base for carrying a back cover, the base having a carrying platform 20 for carrying a back cover, the base comprising a base frame and quartz glass, the quartz glass being fixed on the bottom of the base frame, the periphery of which is sealed by, for example, a seal The guiding and positioning device is disposed between the upper cover and the base, and includes a guide post 19 and a pole fixed on the base; and lifting devices 13 and 14, respectively, for lifting and lowering the upper cover and the base of the base to adjust the coating base The distance between the sheet and the back cover is also used to achieve the positional treatment of the coated substrate and the back cover before the press-fit package. The upper cover may be closed to the base to define a sealed cavity, and the sealed cavity formed is coupled to at least one vacuum pump for pumping and inflating the sealed cavity.
仍然参见图 4 , 硬化装置 11被安装在封装工作室 300的底座的下面， 一般 由 UV光源组成， 用来固化胶水， UV光通过石英玻璃来实现对胶水的固化。  Still referring to Fig. 4, the hardening device 11 is mounted under the base of the packaging working chamber 300, generally consisting of a UV light source for curing the glue, and the UV light is passed through the quartz glass to effect the curing of the glue.
下面描述本发明的釆用上述的封装装置来封装太阳电池的方法和过程。 参照图 1所示来说明封装工艺是如何实现的。 图 1示出了总体的封装流程 图。 首先， 机械手从基片暂存室 100中取出镀膜基片 1送入到封装工作室 300; 接着， 机械手从封装预处理室 200中取出后盖 9送入到封装工作室 300 , 然后基 片 1和后盖 9在封装工作室 300中实现压合封装； 最后通过 UV硬化装置 11对 胶水进行固化， 机械手从封装工作室取出器件由成品输出口输出。 The method and process for packaging a solar cell using the above described packaging device will now be described. How the packaging process is implemented will be described with reference to FIG. 1. Figure 1 shows the overall package flow diagram. First, the robot takes out the coated substrate 1 from the substrate temporary storage chamber 100 and feeds it to the packaging working chamber 300; Then, the robot takes out the back cover 9 from the package pretreatment chamber 200 and feeds it to the package working chamber 300, and then the substrate 1 and the back cover 9 realize the press-fit package in the package working chamber 300; finally, the glue is applied by the UV curing device 11. Curing, the robot takes the device out of the package studio and outputs it from the finished output.
下面结合图 2、 4所示来具体地详细说明本发明的封装方法和封装装置中的 基片暂存室的操作以及镀基片在封装工作室中的对位（定位）。 镀膜面朝下的镀 膜基片 1 由滚轮组件 1传送到基片暂存室的壳体 3内， 其中滚轮组件 2接触基 片的区域为非镀膜区 4 , 未触及基片的镀膜区 5的膜层以保护基片 1的镀膜区； 接着通过机械手把镀膜基片 1送入到封装工作室 300的壳体 18内的支架 21上； 通过定位装置中的导柱 19对镀膜基片对位， 对位完毕后， 上盖板 16在电机的 控制下通过上盖板升降组件 1 3带着上盖板 16下降 ， 接触镀膜基片 1时， 通过 抽气装置比如真空泵开始抽气， 在负压的作用下， 吸附面 17 的吸取机构 1 5吸 附着镀膜基片 1 , 接着再由升降机构 1 3上升到一定位置。  The operation of the substrate temporary storage chamber in the packaging method and packaging apparatus of the present invention and the alignment (positioning) of the plating substrate in the packaging working chamber will be specifically described below in conjunction with Figs. The coated substrate facing downwardly is coated by the roller assembly 1 into the housing 3 of the substrate temporary storage chamber, wherein the area of the roller assembly 2 contacting the substrate is the uncoated region 4, and the coating region 5 of the substrate is not touched. The film layer protects the coating area of the substrate 1; then the coated substrate 1 is fed by a robot to the holder 21 in the housing 18 of the package working chamber 300; the coated substrate is aligned by the guide post 19 in the positioning device After the alignment is completed, the upper cover 16 is lowered by the upper cover lifting assembly 13 under the control of the motor, and the upper cover 16 is lowered. When the coated substrate 1 is contacted, the suction is started by a suction device such as a vacuum pump, and is negative. Under the action of the pressure, the suction mechanism 15 of the adsorption surface 17 adsorbs the coated substrate 1, and then rises to a certain position by the lifting mechanism 13.
结合图 3、 4所示来具体说明封装预处理室的操作以及后盖在封装工作室中 的对位以及封装压合操作。 被涂布了胶水的后盖 9 (胶水面朝上） 由滚轮组件 10传送到封装预处理室的壳体 7内，接着由升降组件 11带动顶杆将后盖 9升至 离加热组件 8适当的位置， 然后关闭壳体的闸阀 12 , 对封装预处理室进行抽真 空， 当真空度达到 l (T3Tor r左右时， 开启加热组件 8对后盖 9进行加热除气， 温度控制在 20{TC以下，几分钟后停止加热，接着开启冷却组件 6对后盖 9冷却。 The operation of the package pre-treatment chamber and the alignment of the back cover in the package working chamber and the package press-fitting operation are specifically illustrated in conjunction with FIGS. 3 and 4. The back cover 9 to which the glue is applied (the glue face up) is transferred by the roller assembly 10 into the casing 7 of the package pretreatment chamber, and then the lifter 11 drives the jack to raise the back cover 9 to the heating assembly 8 appropriately. The position, then close the gate valve 12 of the casing, and vacuum the package pretreatment chamber. When the vacuum reaches l (T 3 Tor r or so, the heating assembly 8 is turned on to heat and degas the back cover 9 and the temperature is controlled at 20 Below {TC, the heating is stopped after a few minutes, and then the cooling unit 6 is turned on to cool the back cover 9.
等温度冷却下来后， 对封装预处理室 200 充入惰性 （通常是氮气） 气体， 然后通过机械手把后盖 9送入到封装工作室 300的壳体 18 内的支架 21上， 接 着由对位装置的导柱 19对其进行对位 （定位）后放置于底座承载台 20上； 然 后， 由承载台升降组件 14带着后盖 9上升到一定位置， 使得后盖 9和基片 1的 相对距离在 2誦 之间但不限于此距离。 此时， 后盖停在这个位置， 而上盖板升 降组件 1 3带着镀膜基片 1再次下降， 使得镀膜基片 1和后盖 9即将接触时即距 离在 0. 02匪左右但不限于此距离，停止下降， 然后关闭抽气装置（比如真空泵， 未示出）， 并打开充气装置 （未示出） 经由上盖板的吸附面的真空槽充气， 此时 由上盖板与底座相互闭合而限定的密封腔体内的气压逐渐上升， 而器件内部的 气压无法上升， 这样内外的压强差迫使基片 1和后盖 9 紧密粘合， 胶线逐渐被 压开。 After the temperature is cooled down, the package pretreatment chamber 200 is filled with an inert (usually nitrogen) gas, and then the back cover 9 is fed by the robot to the holder 21 in the housing 18 of the package working chamber 300, followed by alignment The guide post 19 of the device is placed (positioned) and placed on the base carrier 20; then, the back cover 9 is raised by the carrier lift assembly 14 to a certain position, so that the back cover 9 and the substrate 1 are opposite each other. The distance is between 2诵 but not limited to this distance. At this point, the back cover stops at this position, and the upper cover rises. The descending component 13 is lowered again with the coated substrate 1 so that the distance between the coated substrate 1 and the back cover 9 is about 0.02 但, but is not limited to this distance, the drop is stopped, and then the suction device is closed (such as a vacuum pump). , not shown), and the opening of the inflator (not shown) is inflated through the vacuum chamber of the adsorption surface of the upper cover, at which time the air pressure in the sealed chamber defined by the closure of the upper cover and the base is gradually increased, and the device The internal air pressure cannot rise, so that the pressure difference between the inside and the outside forces the substrate 1 and the back cover 9 to be tightly bonded, and the glue line is gradually pressed.
最后， 打开硬化装置的 UV灯组件 22， 固化胶水， 经机械手取出器件由成品 输出口输出， 如图 1所示。  Finally, the UV lamp assembly 22 of the hardening device is turned on, the glue is solidified, and the device is taken out by the robot to output from the finished product outlet, as shown in FIG.
尽管已经参考附图， 对本发明的封装装置的结构和封装方法进行了说明， 但是上述公开内容仅是为了更好地理解本发明， 而不是以任何方式限制权利要 求的范围。 故凡依本发明专利申请范围所述的构造、 特征及原理所做的等效变 化或修饰， 均包括于本发明的保护范围内。  Although the structure and packaging method of the packaged device of the present invention have been described with reference to the accompanying drawings, the above disclosure is only for the purpose of better understanding of the present invention and is not intended to limit the scope of the claims. Equivalent changes or modifications made to the structures, features and principles described in the scope of the present invention are included in the scope of the invention.

Claims

权 利 要 求 Rights request
1、 一种用于太阳电池的封装制备装置， 该太阳电池包括后盖和 基片， 该后盖和基片通过胶水结合在一起， 其特征在于， 该封装制备 装置包括： A package preparation apparatus for a solar cell, comprising: a back cover and a substrate, the back cover and the substrate being bonded together by glue, wherein the package preparation device comprises:
封装预处理室， 用于在封装前对所述后盖进行预处理；  Packaging a pretreatment chamber for pretreating the back cover prior to packaging;
基片暂存室， 用于暂存镀膜后的基片；  a substrate temporary storage chamber for temporarily storing the coated substrate;
封装工作室， 用于将所述基片和所述后盖封装在一起； 以及 用于固化胶水的硬化装置；  a packaging working chamber for packaging the substrate and the back cover together; and a hardening device for curing the glue;
其中， 所述封装预处理室、 所述基片暂存室、 所述封装工作室和 所述硬化装置之间的操作通过机械手进行。  The operation between the package pretreatment chamber, the substrate temporary storage chamber, the package working chamber, and the hardening device is performed by a robot.
2、 根据权利要求 1所述的封装制备装置， 其特征在于： 所述封 装预处理室包括：  2. The package preparation apparatus according to claim 1, wherein: said package pretreatment chamber comprises:
壳体， 用于限定一密封操作环境；  a housing for defining a sealed operating environment;
用于在其上承载后盖的滑轮组件；  a pulley assembly for carrying a back cover thereon;
用于加热以对胶水进行除气的加热组件；  a heating assembly for heating to degas the glue;
用于使后盖升降的升降机构； 以及  a lifting mechanism for lifting the back cover;
用于冷却后盖的冷却组件；  a cooling assembly for cooling the back cover;
其中， 所述滑轮组件、 所述加热组件、 所述升降机构和所述冷却 组件在所述密封操作环境中进行操作。  Wherein the pulley assembly, the heating assembly, the lifting mechanism and the cooling assembly are operated in the sealed operating environment.
3、 根据权利要求 2所述的封装制备装置， 其特征在于： 所述加 热组件为红外加热组件， 所述冷却组件采用冷却水来达到冷却效果。  3. The package preparation apparatus according to claim 2, wherein: the heating assembly is an infrared heating assembly, and the cooling assembly uses cooling water to achieve a cooling effect.
4、 根据权利要求 2所述的封装制备装置， 其特征在于： 所述基 片暂存室包括一壳体， 该壳体用于限定一密封操作环境， 在所述基片 暂存室内具有用于承载镀膜基片的滑轮组件， 其中该滑轮组件与基片 的非镀膜区接触， 该滑轮组件在所述密封操作环境中进行操作。 4. The package preparation apparatus according to claim 2, wherein: said base The wafer temporary storage chamber includes a housing for defining a sealed operating environment, and a pulley assembly for carrying the coated substrate in the substrate temporary storage chamber, wherein the pulley assembly and the non-coated region of the substrate In contact, the pulley assembly operates in the sealed operating environment.
5、 根据权利要求 4中所述的封装制备装置， 其特征在于： 所述 封装工作室包括：  5. The package preparation apparatus according to claim 4, wherein: the package working chamber comprises:
壳体， 用于限定一密封操作环境；  a housing for defining a sealed operating environment;
用于承载基片的上盖板， 所述上盖板具有一光滑的吸附面， 在该 吸附面上形成有用于吸附基片的真空槽 ，所述上盖板包括至少一个与 所述真空槽连通的抽气管；  An upper cover plate for carrying a substrate, the upper cover plate has a smooth adsorption surface, and a vacuum groove for adsorbing the substrate is formed on the adsorption surface, the upper cover plate includes at least one and the vacuum groove Connected suction pipe;
用于承载后盖的底座， 所述底座具有一用于承载后盖的承载台， 所述上盖板可以与所述底座相互闭合以限定一个密封的腔体， 所限定 的密封腔体至少与一个真空泵连接，用于对密封腔体进行抽气和充气； 导向定位装置， 用于对传送进入封装工作室中的基片和盖板进行 定位；  a base for carrying a back cover, the base having a carrying platform for carrying a back cover, the upper cover may be closed with the base to define a sealed cavity, and the sealed cavity defined is at least a vacuum pump connection for pumping and inflating the sealed chamber; a guiding and positioning device for positioning the substrate and the cover plate conveyed into the package working chamber;
用于使上盖板升降的升降装置； 以及  a lifting device for lifting the upper cover; and
用于使底座升降的升降装置；  a lifting device for lifting the base;
其中， 所述上盖板、 所述底座、 所述导向定位装置、 所述用于使 上盖板升降的升降装置和所述用于使底座升降的升降装置在所述密封 操作环境中进行操作。  Wherein, the upper cover, the base, the guiding and positioning device, the lifting device for lifting the upper cover, and the lifting device for lifting the base are operated in the sealing operation environment .
6、 根据权利要求 5所述的封装制备装置， 其特征在于： 所述上 盖板与所述底座的相互闭合的表面上设置有密封圈以及用于定位的导 柱和标杆。  6. The package preparation apparatus according to claim 5, wherein: a sealing ring and a guide post and a rod for positioning are disposed on the mutually closed surfaces of the upper cover and the base.
7、 根据权利要求 5或 6所述的封装制备装置， 其特征在于： 所 述底座包括底座框架和石英玻璃， 所述石英玻璃固定在底座框架上， 其***通过密封圈密封。 7. The package preparation apparatus according to claim 5 or 6, wherein: The base includes a base frame and quartz glass, and the quartz glass is fixed on the base frame, and the periphery thereof is sealed by a sealing ring.
8、 根据权利要求 5或 6所述的封装制备装置， 其特征在于： 所 述硬化装置设置在封装工作室的底座的正下方， 其透过石英玻璃对胶 水进行固化。  The package preparation apparatus according to claim 5 or 6, wherein the hardening means is disposed directly under the base of the package working chamber, and the glue is cured by the quartz glass.
9、 根据权利要求 8所述的封装制备装置， 其特征在于： 所述胶 水为 UV胶水， 所述硬化装置主要由 UV光源组成。  9. The package preparation apparatus according to claim 8, wherein: the glue is a UV glue, and the hardening device is mainly composed of a UV light source.
10、 根据权利要求 1-6中任一项所述的封装制备装置， 其特征在 于： 所述太阳电池为薄膜太阳电池。  The package preparation apparatus according to any one of claims 1 to 6, wherein the solar cell is a thin film solar cell.
11、 一种采用上述权利要求中限定的封装制备装置来封装太阳电 池的方法， 包括如下步骤：  11. A method of packaging a solar cell using the package preparation apparatus defined in the above claims, comprising the steps of:
a) 封装前的预处理： 被涂有封装胶水的后盖由封装预处理室的 滑轮组件传送到封装预处理室中进行预处理， 即在真空环境下对后盖 进行加热以消除胶水中的气泡和挥发性物质； 然后由冷却组件冷却该 盖片， 防止变形， 并起到稳定性能的作用； 其中， 后盖涂有胶水的一 面朝上。  a) Pre-package pre-treatment: The back cover coated with the encapsulation glue is transferred from the pulley assembly of the encapsulation pre-treatment chamber to the package pre-treatment chamber for pre-treatment, ie the back cover is heated in a vacuum environment to eliminate the glue Air bubbles and volatile materials; the cover sheet is then cooled by a cooling assembly to prevent deformation and function as a stabilizing energy; wherein the back cover is coated with the glue side facing up.
b) 镀膜基片的定位： 镀膜基片由暂存室的滚轮组件传送到镀膜 基片暂存室中， 然后由机械手将其送至封装工作室的标杆处， 接着由 定位装置的导柱对其定位； 定位完毕后， 通过上盖板的吸附面的真空 槽将其吸附在上盖板上并上升至一定位置； 其中， 基片镀有膜的一面 朝下， 滑轮组件和机械手与基片的非镀膜区接触。  b) Positioning of the coated substrate: The coated substrate is transferred from the roller assembly of the temporary storage chamber to the coated substrate temporary storage chamber, and then sent by the robot to the benchmark of the packaging studio, followed by the guide post of the positioning device Positioning; after positioning, it is adsorbed on the upper cover by the vacuum groove of the adsorption surface of the upper cover plate and raised to a certain position; wherein the substrate is coated with the film side facing down, the pulley assembly and the robot and the base The uncoated area of the sheet is in contact.
c) 后盖的定位： 经过预处理后的后盖， 由机械手将其传送至封 装工作室的标杆处， 接着由定位装置的导柱对其定位； 定位完毕后， 将其放置在封装工作室的底座承载台上。 c) Positioning of the back cover: The pre-processed back cover is transported by the robot to the pole of the packaging studio, and then positioned by the guide post of the positioning device; after positioning, Place it on the base platform of the packaging studio.
d) 后盖和基片的压合封装： 后盖和基片经对位后， 通过封装工 作室中的升降机构将它们送至快要接触的位置， 然后， 向密封腔体内 充气， 后盖与基片在外界气压下被压合在一起， 胶水被均匀挤压； 其 中， 整个封装过程是在惰性气体的环境下进行， 以降低密封腔体内的 水分和氧气含量， 后盖和基片为被压合之前， 后盖和基片的两个表面 之间的距离大于 0. 02  d) Press-fit package of the back cover and the substrate: After the back cover and the substrate are aligned, they are sent to the position to be contacted by the lifting mechanism in the package working chamber, and then inflated into the sealed cavity, the back cover is The substrate is pressed together under ambient pressure, and the glue is uniformly extruded; wherein the entire packaging process is carried out under an inert gas atmosphere to reduce the moisture and oxygen content in the sealed chamber, and the back cover and the substrate are The distance between the back cover and the two surfaces of the substrate is greater than 0.02.
e) 使用硬化装置对胶水进行固化， 完成固化后， 打开密封腔体， 取出封装好的器件。  e) Curing the glue with a hardening device. After curing, open the sealed cavity and remove the packaged device.
12、 根据权利要求 11中所述的方法， 其特征在于： 在所述封装前 的预处理步骤中，真空环境的真空度为 10_3Torr,加热温度小于 200°C12. The method according to claim 11, wherein: in the pre-packaging pretreatment step, the vacuum environment has a vacuum of 10 _3 Torr and a heating temperature of less than 200 ° C.
13、 根据权利要求 11或 12中所述的方法， 其特征在于： 所述惰 性气体通常是氮气。 13. Method according to claim 11 or 12, characterized in that the inert gas is usually nitrogen.
14、 根据权利要求 11或 12中所述的方法， 其特征在于： 所述太 阳电池为薄膜太阳电池。  14. Method according to claim 11 or 12, characterized in that the solar cell is a thin film solar cell.
PCT/CN2008/073436 2008-06-16 2008-12-10 Encapsulating apparatus for solar cells and encapsulating method for solar cells WO2009152672A1 (en)

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