WO2009152301A3 - Low ion content, nanoparticle-containing resin systems - Google Patents

Low ion content, nanoparticle-containing resin systems Download PDF

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Publication number
WO2009152301A3
WO2009152301A3 PCT/US2009/047000 US2009047000W WO2009152301A3 WO 2009152301 A3 WO2009152301 A3 WO 2009152301A3 US 2009047000 W US2009047000 W US 2009047000W WO 2009152301 A3 WO2009152301 A3 WO 2009152301A3
Authority
WO
WIPO (PCT)
Prior art keywords
ion content
low ion
nanoparticle
containing resin
resin systems
Prior art date
Application number
PCT/US2009/047000
Other languages
French (fr)
Other versions
WO2009152301A2 (en
Inventor
Emily S. Goenner
Travis Q. Gregar
Brant U. Kolb
William J. Schultz
Kristin L. Thunhorst
Andrew M. Hine
James M. Nelson
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of WO2009152301A2 publication Critical patent/WO2009152301A2/en
Publication of WO2009152301A3 publication Critical patent/WO2009152301A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3081—Treatment with organo-silicon compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3063—Treatment with low-molecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3072—Treatment with macro-molecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

Various methods of treating surface-modified nanoparticles are described. Dual-ion exchange procedures (anion exchange and cation exchange), as well-as subsequent end-capping are described. Both ionically-bonded and covalently-bonded end-capping agents are discussed. The resulting low ion content, particularly low alkali metal and alkaline metal oxide ion content, treated, surface-modified nanoparticles, including such nanoparticles in a resin system, are also disclosed. Effects of low ion content on various properties of the resulting resin system, including blister-resistance, optical clarity, and rheology are included.
PCT/US2009/047000 2008-06-12 2009-06-11 Low ion content, nanoparticle-containing resin systems WO2009152301A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6088108P 2008-06-12 2008-06-12
US61/060,881 2008-06-12

Publications (2)

Publication Number Publication Date
WO2009152301A2 WO2009152301A2 (en) 2009-12-17
WO2009152301A3 true WO2009152301A3 (en) 2010-02-11

Family

ID=41050339

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2009/047000 WO2009152301A2 (en) 2008-06-12 2009-06-11 Low ion content, nanoparticle-containing resin systems
PCT/US2009/046992 WO2009152296A1 (en) 2008-06-12 2009-06-11 End-capped curable resin sols

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2009/046992 WO2009152296A1 (en) 2008-06-12 2009-06-11 End-capped curable resin sols

Country Status (1)

Country Link
WO (2) WO2009152301A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102574678B (en) 2009-10-21 2014-09-10 3M创新有限公司 Solventless functionalization, milling, and compounding process with reactive diluents
CN103124775B (en) * 2010-10-22 2014-12-10 惠普发展公司，有限责任合伙企业 Oxide pigment dispersion for inkjet ink
RU2596826C2 (en) 2011-02-02 2016-09-10 Ашленд Лайсенсинг Энд Интеллектчуал Проперти Ллк. Scratch resistant gel-like coating
CA2855858A1 (en) 2011-11-16 2013-05-23 3M Innovative Properties Company Nanosilica containing polycyanate ester compositions
US20150118409A1 (en) * 2013-10-25 2015-04-30 Nano And Advanced Materials Institute Limited Release film with enhanced mechanical properties and method in preparing thereof
CN105133422B (en) * 2015-07-16 2017-10-10 吉翔宝（太仓）离型材料科技发展有限公司 A kind of anti-scratch high-temperature resistant and antistatic release liners and preparation method thereof
US10329460B2 (en) 2016-09-14 2019-06-25 3M Innovative Properties Company Fast curing optical adhesive
CN109890750B (en) 2016-11-07 2022-05-10 3M创新有限公司 Curable resins comprising nanoparticles containing surface-bonded hydrophobically modified alkyl groups
CN110526636B (en) * 2019-09-19 2022-02-15 重庆兴渝新材料研究院有限公司 Hydrophobic silica sol and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030035888A1 (en) * 2000-01-28 2003-02-20 Yuichi Eriyama Method for manufacturing hydrophobic colloidal silica
US20050159001A1 (en) * 2003-12-23 2005-07-21 Taewan Kim Insulating film composition having improved mechanical property
US20070295446A1 (en) * 2006-06-09 2007-12-27 3M Innovative Properties Company Bonding method with flowable adhesive composition
US20080057300A1 (en) * 2004-10-12 2008-03-06 3M Innovative Properties Company Protective Film Wear Layer
WO2008027979A2 (en) * 2006-08-29 2008-03-06 3M Innovative Properties Company Resin systems including reactive surface-modified nanoparticles

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2254559A1 (en) * 1998-11-20 2000-05-20 Ahti August Koski Process for hydrophobicizing particles, and their use in dispersions
JP3970702B2 (en) * 2001-09-27 2007-09-05 関東化学株式会社 Method for producing ODS silica gel filler for liquid chromatography
CA2458133C (en) * 2003-02-18 2011-12-20 Daiso Co., Ltd. Packings for liquid chromatography, process for preparing and usage
US20060147177A1 (en) * 2004-12-30 2006-07-06 Naiyong Jing Fluoropolymer coating compositions with olefinic silanes for anti-reflective polymer films
US7767736B2 (en) * 2005-12-05 2010-08-03 3M Innovative Properties Company Flame retardant polymer composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030035888A1 (en) * 2000-01-28 2003-02-20 Yuichi Eriyama Method for manufacturing hydrophobic colloidal silica
US20050159001A1 (en) * 2003-12-23 2005-07-21 Taewan Kim Insulating film composition having improved mechanical property
US20080057300A1 (en) * 2004-10-12 2008-03-06 3M Innovative Properties Company Protective Film Wear Layer
US20070295446A1 (en) * 2006-06-09 2007-12-27 3M Innovative Properties Company Bonding method with flowable adhesive composition
WO2008027979A2 (en) * 2006-08-29 2008-03-06 3M Innovative Properties Company Resin systems including reactive surface-modified nanoparticles

Also Published As

Publication number Publication date
WO2009152296A1 (en) 2009-12-17
WO2009152301A2 (en) 2009-12-17

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