WO2009113003A3 - Luminescent component and manufacturing method - Google Patents

Luminescent component and manufacturing method Download PDF

Info

Publication number
WO2009113003A3
WO2009113003A3 PCT/IB2009/050963 IB2009050963W WO2009113003A3 WO 2009113003 A3 WO2009113003 A3 WO 2009113003A3 IB 2009050963 W IB2009050963 W IB 2009050963W WO 2009113003 A3 WO2009113003 A3 WO 2009113003A3
Authority
WO
WIPO (PCT)
Prior art keywords
transparent
luminescent component
manufacturing
substrate
luminescent
Prior art date
Application number
PCT/IB2009/050963
Other languages
French (fr)
Other versions
WO2009113003A2 (en
Inventor
Viet Nguyen Hoang
Radu Surdeanu
Benoit Bataillou
Original Assignee
Nxp B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp B.V. filed Critical Nxp B.V.
Priority to US12/922,127 priority Critical patent/US8376801B2/en
Priority to EP09719995A priority patent/EP2272304A2/en
Publication of WO2009113003A2 publication Critical patent/WO2009113003A2/en
Publication of WO2009113003A3 publication Critical patent/WO2009113003A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24298—Noncircular aperture [e.g., slit, diamond, rectangular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

The present invention relates to a luminescent component (30) and a manufacturing method thereof. The luminescent component (30) comprises a first transparent carrier (18), a second transparent carrier (24), a substrate (10) sandwiched between said transparent carriers (18; 24), the substrate (10) comprising a conduit from the first transparent layer (18) to the second transparent carrier (24), the conduit being filled with a luminescent solution (20). This facilitates the use of colloidal solutions of quantum dots in such a luminescent component (30). Preferably, the substrate (10) is direct bonded to the transparent carriers (18, 24) using direct wafer bonding techniques.
PCT/IB2009/050963 2008-03-13 2009-03-09 Luminescent component and manufacturing method WO2009113003A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/922,127 US8376801B2 (en) 2008-03-13 2009-03-09 Luminescent component and manufacturing method
EP09719995A EP2272304A2 (en) 2008-03-13 2009-03-09 Luminescent component and manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08102588.4 2008-03-13
EP08102588 2008-03-13

Publications (2)

Publication Number Publication Date
WO2009113003A2 WO2009113003A2 (en) 2009-09-17
WO2009113003A3 true WO2009113003A3 (en) 2009-11-05

Family

ID=40933203

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2009/050963 WO2009113003A2 (en) 2008-03-13 2009-03-09 Luminescent component and manufacturing method

Country Status (3)

Country Link
US (1) US8376801B2 (en)
EP (1) EP2272304A2 (en)
WO (1) WO2009113003A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11439018B2 (en) * 2020-12-29 2022-09-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier and method of manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0550062A2 (en) * 1991-12-30 1993-07-07 Eastman Kodak Company Organic electroluminescent multicolor image display device and process for its fabrication
EP0606093A2 (en) * 1993-01-07 1994-07-13 Nec Corporation Semiconductor optical integrated circuits and method for fabricating the same
WO1996041501A1 (en) * 1995-06-07 1996-12-19 American International Pacific Industries Corp. Method for manufacturing electroluminescent lamp systems
EP0767599A2 (en) * 1995-10-06 1997-04-09 Pioneer Electronic Corporation Organic electroluminescent display panel and method for manufacturing the same
US6221194B1 (en) * 1998-03-30 2001-04-24 Denso Corporation Manufacturing method of electroluminescent display panel
WO2005038882A2 (en) * 2003-10-15 2005-04-28 Koninklijke Philips Electronics N.V. Electronic device and method of manufacturing thereof
WO2007012992A1 (en) * 2005-07-28 2007-02-01 Nxp B.V. A package and manufacturing method for a microelectronic component

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614435A (en) * 1994-10-27 1997-03-25 The Regents Of The University Of California Quantum dot fabrication process using strained epitaxial growth
US5869929A (en) * 1997-02-04 1999-02-09 Idemitsu Kosan Co., Ltd. Multicolor luminescent device
US6501091B1 (en) * 1998-04-01 2002-12-31 Massachusetts Institute Of Technology Quantum dot white and colored light emitting diodes
EP1042775A2 (en) * 1998-09-22 2000-10-11 Fed Corporation Inorganic-based color conversion matrix element for organic color display devices and method of fabrication
KR100301116B1 (en) * 1998-12-02 2001-10-20 오길록 Method for producing a compound semiconductor substrate having a quantum dot structure
DE10133685B4 (en) * 2001-07-11 2006-05-18 Osram Opto Semiconductors Gmbh Organic electroluminescent display and its manufacture
US6927422B2 (en) 2002-10-17 2005-08-09 Astralux, Inc. Double heterojunction light emitting diodes and laser diodes having quantum dot silicon light emitters
US6967112B2 (en) 2003-12-23 2005-11-22 Sharp Laboratories Of America, Inc. Three-dimensional quantum dot structure for infrared photodetection
US20050282975A1 (en) * 2004-06-22 2005-12-22 Gelcore Llc. Silicone epoxy formulations
US20060071593A1 (en) * 2004-10-05 2006-04-06 Tan Kheng L Light emitting device with controlled thickness phosphor
US7807550B2 (en) * 2005-06-17 2010-10-05 Dalsa Semiconductor Inc. Method of making MEMS wafers
US7488680B2 (en) * 2005-08-30 2009-02-10 International Business Machines Corporation Conductive through via process for electronic device carriers
US20070057274A1 (en) 2005-09-09 2007-03-15 Atomic Energy Council - Institute Of Nuclear Energy Research White-light luminescent silicon-nitride component with silicon quantum dots and fabricating method thereof
KR101109195B1 (en) 2005-12-19 2012-01-30 삼성전자주식회사 Three dimensional light emitting device and preparation method thereof
CA2678798C (en) * 2007-03-19 2017-06-20 Nanosys, Inc. Methods for encapsulating nanocrystals
US8264777B2 (en) * 2007-06-26 2012-09-11 Qd Vision, Inc. Portable electronic device having an electro wetting display illuminated by quantum dots
US8021008B2 (en) * 2008-05-27 2011-09-20 Abl Ip Holding Llc Solid state lighting using quantum dots in a liquid

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0550062A2 (en) * 1991-12-30 1993-07-07 Eastman Kodak Company Organic electroluminescent multicolor image display device and process for its fabrication
EP0606093A2 (en) * 1993-01-07 1994-07-13 Nec Corporation Semiconductor optical integrated circuits and method for fabricating the same
WO1996041501A1 (en) * 1995-06-07 1996-12-19 American International Pacific Industries Corp. Method for manufacturing electroluminescent lamp systems
EP0767599A2 (en) * 1995-10-06 1997-04-09 Pioneer Electronic Corporation Organic electroluminescent display panel and method for manufacturing the same
US6221194B1 (en) * 1998-03-30 2001-04-24 Denso Corporation Manufacturing method of electroluminescent display panel
WO2005038882A2 (en) * 2003-10-15 2005-04-28 Koninklijke Philips Electronics N.V. Electronic device and method of manufacturing thereof
WO2007012992A1 (en) * 2005-07-28 2007-02-01 Nxp B.V. A package and manufacturing method for a microelectronic component

Also Published As

Publication number Publication date
EP2272304A2 (en) 2011-01-12
US8376801B2 (en) 2013-02-19
WO2009113003A2 (en) 2009-09-17
US20110103039A1 (en) 2011-05-05

Similar Documents

Publication Publication Date Title
WO2006127163A3 (en) Method of detachable direct bonding at low temperatures
EP2996140A3 (en) Multiple bonding layers for thin-wafer handling
EP1988575A3 (en) Semiconductor device
EP1978553A3 (en) SOI substrate, method for manufacturing the same, and semiconductor device
WO2009126351A3 (en) Silicon laser-quantum well intermixing wafer bonded integration platform
TW200739969A (en) Light emitting diode package
WO2005079198A3 (en) Wafer bonded virtual substrate and method for forming the same
WO2007117265A3 (en) Stably passivated group iv semiconductor nanoparticles and methods and compositions thereof
SG144124A1 (en) Copper wire bonding on organic solderability preservative materials
WO2007130471A3 (en) Systems and methods for high density multi-component modules
WO2009092799A3 (en) Object comprising a graphics element transferred onto a support wafer and method of producing such an object
WO2012021196A3 (en) Method for manufacturing electronic devices and electronic devices thereof
WO2010077082A3 (en) Light-emitting-device package and a method for producing the same
UA103022C2 (en) Reflective article
WO2009148253A3 (en) Supporting substrate for fabrication of semiconductor light emitting device and semiconductor light emitting device using the same
TW200727461A (en) Semiconductor device and production method thereof
TW200705603A (en) Dicing die adhesive film for semiconductor
TW200703706A (en) Light emitting diode and manufacturing method thereof
WO2009075183A1 (en) Light emitting diode and method for manufacturing the same
TW200802985A (en) Radiation-emitting semiconductor body with carrier substrate and the method for fabricating the same
WO2008152945A1 (en) Semiconductor light-emitting device and method for manufacturing the same
WO2009060693A1 (en) Device and device manufacturing method
CN103887218A (en) Preparation method for GaN-based white-light flip chip
TW200725818A (en) Wafer-level chip package process
WO2011129548A3 (en) Substrate assembly for crystal growth and fabricating method for light emitting device using the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09719995

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2009719995

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12922127

Country of ref document: US