WO2009106051A3 - Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse - Google Patents

Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse Download PDF

Info

Publication number
WO2009106051A3
WO2009106051A3 PCT/DE2009/000248 DE2009000248W WO2009106051A3 WO 2009106051 A3 WO2009106051 A3 WO 2009106051A3 DE 2009000248 W DE2009000248 W DE 2009000248W WO 2009106051 A3 WO2009106051 A3 WO 2009106051A3
Authority
WO
WIPO (PCT)
Prior art keywords
housing
miniature housing
miniature
connecting devices
substantially perpendicular
Prior art date
Application number
PCT/DE2009/000248
Other languages
English (en)
French (fr)
Other versions
WO2009106051A2 (de
Inventor
Charles Lee
Feng Sheng
Jenny Zhou
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to EP09714225A priority Critical patent/EP2248190A2/de
Priority to CN2009801066588A priority patent/CN101960620B/zh
Priority to JP2010547949A priority patent/JP2011513956A/ja
Priority to US12/920,305 priority patent/US8633408B2/en
Publication of WO2009106051A2 publication Critical patent/WO2009106051A2/de
Publication of WO2009106051A3 publication Critical patent/WO2009106051A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Led Device Packages (AREA)

Abstract

Ein Miniaturgehäuse, in dessen Gehäusekörper sich ein elektromagnetische Strahlung emittierendes bzw. empfangendes Element befindet, weist mindestens zwei seitlich über den Gehäusekörper überstehende elektrische Anschlusseinrichtungen auf. Die Durchgangsseite des Miniaturgehäuses, durch die das Element emittiert bzw. empfängt, ist im wesentlichen senkrecht zur Montageebene des Miniaturgehäuses ausgerichtet. Die seitlich über den Gehäusekörper überstehenden elektrischen Anschlusseinrichtungen des Miniaturgehäuses sind elektrisch leitend verbunden mit Leitern, die die direkte Kontaktierung zum emittierenden bzw. empfangenden Element bewerkstelligen. Die Kontaktierungsflächen der Anschlusseinrichtungen sind also im wesentlichen senkrecht zur Durchgangsseite des Miniaturgehäuses angeordnet. Durch diese Anordnung kann das Miniaturgehäuse mindestens zum Teil in einem Träger eingebettet werden, so dass das Miniaturgehäuse für die Dicke einer Beleuchtungseinrichtung nicht mehr signifikant ist.
PCT/DE2009/000248 2008-02-29 2009-02-18 Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse WO2009106051A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP09714225A EP2248190A2 (de) 2008-02-29 2009-02-18 Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse
CN2009801066588A CN101960620B (zh) 2008-02-29 2009-02-18 小型壳体和带有至少一个小型壳体的支承装置
JP2010547949A JP2011513956A (ja) 2008-02-29 2009-02-18 小型ケーシングおよび少なくとも１つの小型ケーシングを備えた支持体装置
US12/920,305 US8633408B2 (en) 2008-02-29 2009-02-18 Miniature housing and support arrangement having at least one miniature housing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008011862.1 2008-02-29
DE102008011862A DE102008011862A1 (de) 2008-02-29 2008-02-29 Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung

Publications (2)

Publication Number Publication Date
WO2009106051A2 WO2009106051A2 (de) 2009-09-03
WO2009106051A3 true WO2009106051A3 (de) 2009-12-30

Family

ID=40874967

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/000248 WO2009106051A2 (de) 2008-02-29 2009-02-18 Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse

Country Status (7)

Country Link
US (1) US8633408B2 (de)
EP (1) EP2248190A2 (de)
JP (1) JP2011513956A (de)
KR (1) KR20100127758A (de)
CN (1) CN101960620B (de)
DE (1) DE102008011862A1 (de)
WO (1) WO2009106051A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2792128B2 (ja) * 1989-08-02 1998-08-27 株式会社豊田自動織機製作所 ジェットルームにおける緯入れ制御方法
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US8486761B2 (en) 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
DE102011004508A1 (de) * 2011-02-22 2012-08-23 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips
DE102011079708B4 (de) * 2011-07-25 2022-08-11 Osram Gmbh Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser
DE102013101260A1 (de) 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
EP3239665A1 (de) * 2016-04-25 2017-11-01 Weickmann & Weickmann PartmbB Sensorgehäuse

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19508284A1 (de) * 1994-06-24 1996-01-04 Hewlett Packard Co Optisches Sende-Empfangs-Modul
EP1217291A2 (de) * 2000-12-21 2002-06-26 Gamesman Limited Leuchten
US20040248332A1 (en) * 2003-06-03 2004-12-09 Joon Ho Yoon Method of manufacturing light-emitting diode device
US20050063183A1 (en) * 2001-06-29 2005-03-24 Jagath Swaris Modular mounting arrangement and method for light emitting diodes
US20050269589A1 (en) * 2004-06-04 2005-12-08 Lite-On It Technology Corporation Power LED package module
US20060131602A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
EP1998380A2 (de) * 2007-05-29 2008-12-03 Iwatani International Corporation and Iwatani Electronics Corporation Lichtemittierendes Halbleiterbauelement

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01100561A (ja) 1987-10-14 1989-04-18 Canon Inc 圧力定着性カプセルトナー
JPH0339863A (ja) 1989-07-07 1991-02-20 Arusu Japan:Kk 太陽熱温水装置
JPH0339863U (de) * 1989-08-30 1991-04-17
JP2802411B2 (ja) * 1992-05-26 1998-09-24 シャープ株式会社 光学装置
DE59402033D1 (de) 1993-09-30 1997-04-17 Siemens Ag Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
DE19751911A1 (de) * 1997-11-22 1999-06-02 Vishay Semiconductor Gmbh Leuchtdiode mit einem hermetisch dichten Gehäuse und Verfahren zu deren Herstellung
JP4178653B2 (ja) 1999-02-26 2008-11-12 日立化成工業株式会社 電気泳動用チップとその製造方法、該電気泳動用チップを用いた電気泳動装置及び荷電性物質の分離方法
WO2001059851A1 (en) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Light source
DE10122705B4 (de) * 2000-05-11 2012-07-26 Mitutoyo Corp. Einrichtung mit funktionalem Bauelement und Verfahren zu seiner Herstellung
DE10140831A1 (de) * 2001-08-21 2003-03-13 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP3699414B2 (ja) 2002-03-29 2005-09-28 ローム株式会社 バックライトモジュールの接続構造
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
US7531844B2 (en) 2002-09-30 2009-05-12 Sanyo Electric Co., Ltd. Light emitting element
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
KR100586944B1 (ko) * 2003-12-26 2006-06-07 삼성전기주식회사 고출력 발광다이오드 패키지 및 제조방법
DE102004047061B4 (de) * 2004-09-28 2018-07-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
WO2006123917A1 (en) * 2005-05-20 2006-11-23 Luxpia Co., Ltd. Light emitting diode package having a reflector cup by metal thin film and its manufacturing method
WO2006126809A1 (en) * 2005-05-26 2006-11-30 Luxpia Co., Ltd. Very small light emitting diode package and manufacturing methods of it
KR100593945B1 (ko) * 2005-05-30 2006-06-30 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
KR100691179B1 (ko) 2005-06-01 2007-03-09 삼성전기주식회사 측면 발광형 엘이디 패키지 및 그 제조 방법
KR100638874B1 (ko) * 2005-07-06 2006-10-27 삼성전기주식회사 Ｌｅｄ 광원이 도광판에 삽입된 백라이트 장치의광원-도광판 구조 및 이를 포함하는 백라이트 장치
JP4739851B2 (ja) * 2005-07-29 2011-08-03 スタンレー電気株式会社 表面実装型半導体装置
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
US20070230182A1 (en) * 2006-03-28 2007-10-04 Yun Tai Led module
KR100757826B1 (ko) * 2006-09-29 2007-09-11 서울반도체 주식회사 측면 발광 다이오드 패키지
DE102007006583A1 (de) * 2007-02-09 2008-08-28 Wen-Kung Sung Verfahren zum Herstellen einer seitlich leuchtenden Diode und deren Aufbau
TWM329243U (en) * 2007-08-29 2008-03-21 Harvatek Corp LED chip package structure with a high-efficiency light-emitting effect

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19508284A1 (de) * 1994-06-24 1996-01-04 Hewlett Packard Co Optisches Sende-Empfangs-Modul
EP1217291A2 (de) * 2000-12-21 2002-06-26 Gamesman Limited Leuchten
US20050063183A1 (en) * 2001-06-29 2005-03-24 Jagath Swaris Modular mounting arrangement and method for light emitting diodes
US20040248332A1 (en) * 2003-06-03 2004-12-09 Joon Ho Yoon Method of manufacturing light-emitting diode device
US20050269589A1 (en) * 2004-06-04 2005-12-08 Lite-On It Technology Corporation Power LED package module
US20060131602A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
EP1998380A2 (de) * 2007-05-29 2008-12-03 Iwatani International Corporation and Iwatani Electronics Corporation Lichtemittierendes Halbleiterbauelement

Also Published As

Publication number Publication date
CN101960620A (zh) 2011-01-26
JP2011513956A (ja) 2011-04-28
KR20100127758A (ko) 2010-12-06
US8633408B2 (en) 2014-01-21
EP2248190A2 (de) 2010-11-10
US20110100707A1 (en) 2011-05-05
CN101960620B (zh) 2013-06-12
DE102008011862A1 (de) 2009-09-03
WO2009106051A2 (de) 2009-09-03

Similar Documents

Publication Publication Date Title
WO2009106051A3 (de) Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse
NO20076100L (no) Hydraulisk koplingselement med elektrisk jording.
WO2013028011A3 (en) Lighting device
TW200642173A (en) Electrical connecting member capable of achieving stable connection with a simple structure and connector using the same
ATE538514T1 (de) Elektrischer kontakt
WO2012154510A3 (en) Low inductance light source module
MX2010002989A (es) Elemento de conexion electrica y disco equipado con ese elemento.
WO2011059872A3 (en) Attachment system for electrical connector
BR112014005207A2 (pt) conector elétrico, plugue de inserção para conector elétrico e conjunto elétrico
AR088277A1 (es) Terminales electricos y metodos para su fabricacion
ATE535964T1 (de) Elektrischer verbinder
WO2011146630A3 (en) Fuse assembly
EP2672535A3 (de) Gehäuse für elektrische Teile
MX2013006272A (es) Tarjeta electronica que tiene un conector externo.
FR2969836B1 (fr) Circuit electronique comportant des connexions electriques resistantes a un environnement severe.
TWM373022U (en) Electrical contact
WO2011117468A3 (en) Light stripe and manufacturing of light stripe
EP1848072A3 (de) Elektrische Verbindung und elektrische Komponente
JP2011513956A5 (de)
ES2572091T3 (es) Separador de posicionamiento, módulo de almacenamiento de energía que lo utiliza y procedimiento de ensamblaje del módulo
TW200642214A (en) Poke-in wire connector and contact therefor
TWM386674U (en) Electrical connector
WO2010062132A3 (ko) 부분 발열체
WO2014025991A3 (en) Electrical connector for attachment to vehicle glass
TW200638047A (en) Electrical connection device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980106658.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09714225

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2009714225

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20107018290

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2010547949

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 12920305

Country of ref document: US