WO2009099310A2 - Led module and illuminator using the same - Google Patents

Led module and illuminator using the same Download PDF

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Publication number
WO2009099310A2
WO2009099310A2 PCT/KR2009/000574 KR2009000574W WO2009099310A2 WO 2009099310 A2 WO2009099310 A2 WO 2009099310A2 KR 2009000574 W KR2009000574 W KR 2009000574W WO 2009099310 A2 WO2009099310 A2 WO 2009099310A2
Authority
WO
WIPO (PCT)
Prior art keywords
led
led module
lighting device
body portion
module unit
Prior art date
Application number
PCT/KR2009/000574
Other languages
French (fr)
Korean (ko)
Other versions
WO2009099310A3 (en
Inventor
Young Wook Ko
Choong Yong Sohn
Original Assignee
Egnics Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Egnics Co., Ltd filed Critical Egnics Co., Ltd
Publication of WO2009099310A2 publication Critical patent/WO2009099310A2/en
Publication of WO2009099310A3 publication Critical patent/WO2009099310A3/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F21S8/061—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension with a non-rigid pendant, i.e. a cable, wire or chain
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
    • F21V2200/20—Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/30—Lighting for domestic or personal use
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting device, and more particularly to an LED lighting device.
  • An LED illuminating device is an illuminating device using LED which emits a specific color with light by supply of electricity.
  • LEDs are being used for signs, advertising, indoor and outdoor interiors, and lighting for specific companies.
  • Such a lighting device may include an LED, a circuit device for power supply, and a lighting device body.
  • the LED lighting apparatus includes a heat dissipation unit 110, a bracket fastening groove 115, a function unit 120, a reflective sheet protective plate 125, a reflective sheet 130, and a light guide plate 135. , Diffusion sheet 140, diffusion sheet protection plate 145, LED damage prevention step 150, light guide plate support 153, PCB 155, and LED 160.
  • the heat dissipation unit 110 has a structure for dissipating heat emitted from the LED 160.
  • the bracket fastening groove 115 may be used as a coupling groove between the frames, and may also serve to fasten the lighting device to another object.
  • the function unit 120 is provided for a coupling function with an external object such as a wire groove, a ceiling support line connection, a ceiling attachment mechanism, and the like.
  • the reflective sheet protective plate 125, the reflective sheet 130, the light guide plate 135, the diffusion sheet 140, and the diffusion sheet protective plate 145 are formed in a structure for emitting light generated from the LED 160 in a predetermined direction. do.
  • the LED damage prevention step 150 maintains the distance between the LED 160 and the light guide plate 135 to a certain degree to prevent damage to the LED 160.
  • a plurality of LEDs 160 are mounted on the PCB 155 to receive a predetermined current.
  • the light guide plate support part 153 and the LED damage prevention member 150 are formed of a heat dissipation unit 110 and one body, and thus are not removable, so that the LED 160 may not be replaced. Therefore, the lighting device has to be replaced entirely according to the life of the LED 160, the user has a problem that can not obtain the benefit of implementing a new color or a variety of energy efficiency lighting through the replacement of the LED (160).
  • the present invention provides an LED module and a LED lighting device using the same that can be attached and detached several LED module unit at a small cost.
  • the present invention provides an LED module and an LED lighting device using the same that can provide a variety of colors according to the user's convenience through the removable function of the LED module unit.
  • At least one surface of the central portion is open, the body portion forming a body of the lighting device;
  • An LED module unit coupled to a shape corresponding to the shape of the body unit and including an LED emitting light;
  • an optical sheet positioned at a front surface of the LED and irradiating light emitted from the LED toward an open one surface of the body portion.
  • the LED module unit the heat sink formed in parallel with the open one surface; And a printed circuit board positioned in a direction perpendicular to the heat sink and mounted with the LED.
  • the LED module unit may further include a printed circuit board supporter which supports the printed circuit board and is formed perpendicular to the heat sink.
  • the LED module unit may be inserted and coupled in the side direction of the body portion.
  • the LED module unit may be inserted and coupled in the open other surface direction in which the light is not emitted.
  • the LED module unit may be screwed to the body portion.
  • the LED lighting device may further include a skin unit surrounding the body portion to be detachably coupled.
  • the body portion may be circular or polygonal.
  • the LED damage prevention step for separating the LED from the optical sheet may be formed in the body portion.
  • the LED lighting device is attached to the lower pendant pendant body; A body support for coupling the body to another object; A pendant upper attachment to the body support; And a pendant wire connecting the pendant lower attachment and the pendant upper attachment to each other.
  • the optical sheet may include at least one of a light guide plate, a reflective sheet, a reflective sheet protective plate, a diffusion sheet, and a diffusion protective plate.
  • the LED lighting device may further include a photoexcited film between the LED and the optical sheet.
  • the optical excitation film a matrix resin layer which is a thermosetting resin;
  • At least one surface of the central portion is open, LED module for detachably coupled to the lighting device using the LED comprising a body portion forming the body of the lighting device, the open one surface of the body and Heat sinks formed in parallel; A printed circuit board positioned in a direction perpendicular to the heat sink and mounted with the LED; And a module coupling part detachably coupled to correspond to a shape of the body part.
  • the LED module unit may further include a printed circuit board support unit supporting the printed circuit board and formed perpendicular to the heat sink.
  • the LED module unit may be inserted and coupled in the side direction of the body portion.
  • the LED module unit may be inserted and coupled in the open other surface direction in which the light is not emitted.
  • the module coupling portion may be screwed to the body portion.
  • LED module and the LED lighting device using the same according to the present invention has the effect that can be attached and detached several LED module unit at a small cost.
  • the LED module and the LED lighting device using the same according to the present invention has an effect that can provide a lighting device having a variety of colors or various energy efficiency according to the user's convenience through the detachable function of the LED module unit.
  • FIG. 1 is a cross-sectional view of an LED lighting device according to the prior art.
  • FIG. 2 is a cross-sectional view of the LED lighting apparatus according to the embodiment of the present invention.
  • FIG. 3 is a perspective view of an LED module unit of the LED lighting apparatus according to the embodiment of the present invention.
  • FIG. 4 is a side view of the LED lighting apparatus according to the embodiment of the present invention.
  • FIG. 5 is a perspective view of the LED lighting apparatus according to the first embodiment of the present invention.
  • FIG. 6 is an exploded side view of the LED lighting apparatus according to the first embodiment of the present invention.
  • FIG. 7 is a perspective view of an LED lighting apparatus according to a second embodiment of the present invention.
  • FIG. 8 is a frame structure diagram of an LED lighting apparatus according to a second embodiment of the present invention.
  • FIG 9 is an exploded side view of the LED lighting apparatus according to the third embodiment of the present invention.
  • the LED lighting apparatus includes an LED module portion and a body portion 230 (partially shown).
  • the LED module part includes a heat dissipation part 210, a module coupling part 213, a printed circuit board 215, an LED 220, and a printed circuit board support part 225, and the body part 230 includes an LED damage prevention jaw 235. ), And may include an optical sheet supporter 240.
  • the LED module unit is coupled to the LED body 230 to be removable according to the shape of the body 230.
  • the LED module portion module coupling portion 213 In combination with the body portion 230, the printed circuit board support 225 may be formed between the optical sheet support 240 and the LED damage prevention jaw 235.
  • the printed circuit board support 225 may be formed perpendicular to the heat dissipation unit 210 to support the printed circuit board 215 in the LED module unit.
  • vertical does not mean only vertically mathematically, but generally vertically.
  • the printed circuit board 215 is supported by the printed circuit board support 225 to receive a necessary current from an external power supply and a circuit.
  • the printed circuit board 215 may be directly inserted into and supported in a predetermined groove formed in the heat dissipation unit 210 without the printed circuit board support 225.
  • the printed circuit board support 225 is not necessary separately, a simpler device can be implemented.
  • At least one surface of the central portion 230 is open, and the body portion 230 forms a body of the lighting device.
  • the body portion 230 may be provided with an LED damage prevention jaw 235 for separating the LED 220 from the optical sheet, and an optical sheet support 240 for supporting the optical sheet.
  • 2 illustrates a structure in which the body 230 is opened in the extending direction of the optical sheet support 240.
  • Body portion 230 may be formed entirely in one injection molding, it may be formed by combining a plurality of frames.
  • Coupling means may be screw 250 coupling, bracket coupling (protrusion into the groove is coupled) and the like. 2 illustrates a case in which the body portion 230 and the module coupling portion 213 couple screws 250 together. By this structure, the LED module unit can be inserted and coupled in the open other surface direction of the body portion 230 is not emitted light.
  • FIG. 3 is a perspective view of an LED module unit of the LED lighting apparatus according to the embodiment of the present invention.
  • a heat dissipation unit 210 a printed circuit board 215, an LED 220, and a printed circuit board support 225 are illustrated. The differences from the above will be explained mainly.
  • the printed circuit board support part 225 of the LED module part corresponding to this shape has a rectangular shape long in one direction.
  • the LED module may be formed to correspond to the shape of the lighting device. For example, when the body portion of the lighting device is circular, the LED module portion may have a shape having a curvature.
  • the LED module unit may be inserted and coupled in the lateral direction of the body portion of the lighting device, or may be inserted and coupled in the open other surface direction of the body portion of the lighting device that is not irradiated with light emitted from the optical sheet.
  • the body portion 230 may have a structure in which a hole into which the LED module portion is inserted is formed, and portions not inserted are connected to each other.
  • An optical sheet is inserted into a space having the heat dissipation unit 210 and the printed circuit board support unit 225 on one side and the other side.
  • a photoexcited film is inserted between the optical sheet and the LED 220.
  • the photoexcited film may be attached to and bonded to the optical sheet or LED 220. Such photoexcited film will be described later in detail.
  • FIG. 4 is a side view of the LED lighting apparatus according to the embodiment of the present invention.
  • an LED module unit including a heat radiating unit 210, a printed circuit board 215, an LED 220, and a printed circuit board support 225, an LED damage prevention jaw 235, and an optical sheet support 240
  • a body portion 230, a skin portion 410, a body support 420, a coupling portion 430 and an optical sheet 440 are shown. The differences from the above will be explained mainly.
  • the skin part 410 surrounds the circumference of the body part 230 of the lighting device and has a housing structure that is detachably coupled to the body part 230.
  • Body support 420 serves to support the skin unit 410 to be coupled to other objects.
  • the body support 420 is formed in a flat shape to be attached to the ceiling by the coupling part 430 (for example, a screw). Can be.
  • the optical sheet 440 may include at least one of a light guide plate, a reflective sheet, a reflective sheet protective plate, a diffusion sheet, and a diffusion protective plate.
  • the photoexcited film 450 is inserted between the LED 220 and the optical sheet 440.
  • the optical sheet 440 is formed in a structure for emitting light generated from the LED 220 in a predetermined direction.
  • the heat dissipation unit 210 of the LED module unit is positioned at an upper portion thereof, and a structure in which light is radiated downward is illustrated.
  • FIG. 5 is a perspective view of the LED lighting apparatus according to the first embodiment of the present invention
  • Figure 6 is an exploded side view. 5 and 6, the lighting device body 510, the body support 520, and the body coupling structure 610 are shown.
  • the lighting device body 510 is circular.
  • the cross-sectional curve of the lighting device body 510 may be formed so that the cross-section curve and curvature of the body support 520 correspond to each other. .
  • the body portion coupling structure 610 is formed in the lighting device body portion 510.
  • the body coupling structure 610 has a predetermined protrusion formed to couple the lighting device body 510 to the body support 520, and the protrusion is correspondingly inserted into a groove formed in the body support 520. Therefore, the body coupling structure 610 is pivotally coupled to the body support 520.
  • the user inserts the protrusion of the body coupling structure 610 into the groove formed in the body support 520 and then rotates the lighting device body 510 to attach the lighting device body 510 to the body support 520.
  • the user may detach the body coupling structure 610 from the body support 520 by rotating the lighting device body 510 in the opposite direction.
  • the LED lighting device according to the embodiment of the present invention may have a polygonal or circular shape such as square, triangle, and rectangle.
  • LED module frame unit 720 720 (a), 720 (b), 720 (c), 720 (d), 720 (e), 720 (f)) for supplying power to the LED
  • a lighting device is shown that includes a power supply 730 and a skin 750 surrounding the lighting device. Accordingly, the lighting device may be directly attached to the ceiling or wall, or may be connected to the pendant wire and be suspended from the top.
  • the LED module frame part 720 is six in total, and when assembled all form the above-described LED module part.
  • the LED module frame portion 720 is inserted and coupled in the side direction of the body portion. The coupling relationship between the body portion and the LED module portion is shown in detail in FIG. 8.
  • each LED module frame portion 720 may be inserted and coupled in the side direction of each body frame portion 710.
  • the user removes the skin portion 750 for the lighting device attached directly to the ceiling or wall or suspended in the form of a pendant, and by a simple procedure to replace each LED module frame portion 720 in the lateral direction.
  • the module can be replaced.
  • FIG. 9 is an exploded side view of the LED lighting apparatus according to the third embodiment of the present invention. Referring to FIG. 9, a lighting device body 910, a pendant bottom attachment 920, a pendant top attachment 930, a body support 940 and a pendant wire 950 are shown.
  • the pendant lower attachment 920 is coupled to the lighting device body 910, and the pendant upper attachment 930 is coupled to the body support 940.
  • the lighting device body 910, the pendant lower attachment 920, the pendant upper attachment 930, and the body support 940 are connected to each other by a pendant wire 950.
  • the body support 940 is attached to the indoor ceiling which is another object in a state where it is coupled with the pendant upper attachment 930, and the lighting device body 910 is pendant when it is coupled with the pendant lower attachment 920.
  • Hanging on the wire 950 can be attached to the room.
  • This pendant shape has the advantage of increasing the aesthetics of the LED lighting device according to an embodiment of the present invention.
  • Photoexcitation film according to an embodiment of the present invention may include a red phosphor, a phosphor such as a green phosphor, a matrix resin layer, a protective film.
  • the photoexcited film has a form in which phosphors are evenly dispersed in the matrix resin layer of the thin film.
  • a curing agent may be included in the matrix resin layer.
  • a hardener is used for the hardening of liquid thermosetting resin.
  • the protective film serves to protect the matrix resin layer.
  • thermosetting resin may be a silicone resin.
  • Thermoplastic resins are easy to handle, but have a high brittleness and low moisture resistance, and thus have a disadvantage in that they are difficult to use in photoexcited films requiring uniformity of the surface.
  • Silicone resin has good ductility and good adhesion when printing on film.
  • Preferred properties of the silicone resin usable in the present invention are those having a light transmittance of 85% or more, a viscosity of 3000 cps or more and drying (curing) at 120 or less.
  • the mixing with the phosphor and the like should be good, the lower the volatility is better, the better the adhesion to the protective film.
  • the silicone resin can be added with an antifoaming agent itself, it is possible to solve the bubble problem that is a problem in the screen printing method. Therefore, the silicone resin described below may be regarded as a small amount of a substance which improves the properties of the silicone resin such as an antifoaming agent rather than a pure silicone resin.
  • the material incorporated into the silicone resin of the present invention to perform a photoexcitation function is as follows.
  • the phosphor may be an inorganic phosphor.
  • a representative inorganic phosphor for emitting red color is SrB 4 O 7 : SM 2+ .
  • SM 2+ mainly contributes to the red wavelength.
  • such a red inorganic phosphor absorbs the entire visible light region of 600 nm or less to generate light having a deep red color, that is, a wavelength of 650 nm or more.
  • Phosphors of 620 nm wavelength in the SrS: Eu series may also be used.
  • the inorganic phosphor for emitting green light may be SrGa 2 S 4 : Eu 2+ .
  • the red phosphor may use one of CaS: Eu, SrS: Eu, and SrB 4 O 7 : Sm.
  • the resin that can be used as the protective film of the present invention is excellent in light transmittance and uses a colorless transparent synthetic resin, but is not particularly limited, for example, polyethylene terephthalate (PET), polyethylene naphthalate (Polyethylene naphthalate) , Acrylic resins, polycarbonates, polystyrenes, and the like.
  • PET polyethylene terephthalate
  • PET polyethylene naphthalate
  • Acrylic resins polycarbonates
  • polystyrenes and the like.
  • PET polyethylene terephthalate
  • PET polyethylene naphthalate
  • Acrylic resins polycarbonates
  • polystyrenes and the like.
  • PET polyethylene terephthalate
  • PET polyethylene naphthalate
  • Acrylic resins polycarbonates
  • polystyrenes and the like.
  • PET film is excellent in transparency, and excellent in strength and warpage.
  • the thickness of a protective film uses the film within 5-50 micrometers. This is because a film of 10
  • the curing agent serves to cure the liquid silicone, and in the embodiment of the present invention, various curing agents may be used.
  • the LED according to the embodiment of the present invention may be an LED that generates white light.
  • the photoexcited film may include a red or green phosphor to compensate for insufficient color. According to an embodiment of the present invention, there is an advantage that various whites in the 2500K to 7000K region can be realized by including the phosphor as described above.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

This invention relates to an illuminator, particularly to an LED illuminator. The LED illuminator disclosed in an embodiment of the invention comprises: a body unit which forms a body of the illuminator and wherein a side of a central portion is open; an LED module unit which is attached to and detached from a body unit in correspondence to the shape of the body unit and includes an LED emitting light; and an optical sheet which is placed at a front side of the LED and irradiates the light emitted from the LED toward the open side of the body unit. According to the invention, various LED modules can be attached to and detached from the illuminator at a low cost.

Description

LED 모듈 및 이를 이용한 LED 조명 장치LED module and LED lighting device using the same
본 발명은 조명 장치에 관한 것으로, 특히 LED 조명 장치에 관한 것이다.The present invention relates to a lighting device, and more particularly to an LED lighting device.
LED 조명 장치는 전기의 공급에 의해 특정의 색을 빛으로 발광하는 LED를 이용한 조명 장치이다. 현재 LED는 그 발광 수명이 증가하면서 특정 업체 등의 광고를 위한 사인, 실내외 인테리어, 조명 등에 사용되고 있다. 이러한 조명 장치는 LED, 전원공급을 위한 회로장치 및 조명 장치 몸체부를 포함하여 구성될 수 있다. An LED illuminating device is an illuminating device using LED which emits a specific color with light by supply of electricity. Currently, LEDs are being used for signs, advertising, indoor and outdoor interiors, and lighting for specific companies. Such a lighting device may include an LED, a circuit device for power supply, and a lighting device body.
도 1은 종래 기술에 따른 LED 조명 장치의 단면도이다. 도 1을 참조하면, 종래 기술에 따른 LED 조명 장치는 방열부(110), 브라켓 체결홈(115), 기능부(120), 반사시트 보호판(125), 반사시트(130), 도광판(135), 확산시트(140), 확산시트 보호판(145), LED 손상 방지턱(150), 도광판 지지부(153), PCB(155), LED(160)를 포함한다. 1 is a cross-sectional view of an LED lighting apparatus according to the prior art. Referring to FIG. 1, the LED lighting apparatus according to the related art includes a heat dissipation unit 110, a bracket fastening groove 115, a function unit 120, a reflective sheet protective plate 125, a reflective sheet 130, and a light guide plate 135. , Diffusion sheet 140, diffusion sheet protection plate 145, LED damage prevention step 150, light guide plate support 153, PCB 155, and LED 160.
방열부(110)는 LED(160)에서 방출되는 열을 방열시키는 구조를 가진다. 브라켓 체결홈(115)은 프레임간의 결합용 홈으로 이용될 수 있으며 또한, 조명 장치를 다른 물체에 체결하는 역할을 수행할 수도 한다. The heat dissipation unit 110 has a structure for dissipating heat emitted from the LED 160. The bracket fastening groove 115 may be used as a coupling groove between the frames, and may also serve to fasten the lighting device to another object.
기능부(120)는 전선 홈, 천정 지지선 연결, 천정취부 기구 체결 등과 같이 외부 물체와의 결합 기능을 위해 마련된다. The function unit 120 is provided for a coupling function with an external object such as a wire groove, a ceiling support line connection, a ceiling attachment mechanism, and the like.
반사시트 보호판(125), 반사시트(130), 도광판(135), 확산시트(140), 확산시트 보호판(145)은 LED(160)로부터 발생된 광을 소정의 방향으로 방출하기 위한 구조로 형성된다. LED 손상 방지턱(150)은 LED(160)와 도광판(135)의 거리를 일정정도 유지하여 LED(160)의 손상을 방지할 수 있도록 한다. PCB(155)에는 복수의 LED(160)가 실장되어, 소정의 전류를 제공받는다. The reflective sheet protective plate 125, the reflective sheet 130, the light guide plate 135, the diffusion sheet 140, and the diffusion sheet protective plate 145 are formed in a structure for emitting light generated from the LED 160 in a predetermined direction. do. The LED damage prevention step 150 maintains the distance between the LED 160 and the light guide plate 135 to a certain degree to prevent damage to the LED 160. A plurality of LEDs 160 are mounted on the PCB 155 to receive a predetermined current.
여기서, 종래 기술에 따른 조명 장치는 도광판 지지부(153) 및 LED 손상 방지턱(150)이 방열부(110)와 하나의 몸체로 형성되어 탈착가능하지 않기 때문에 LED(160)의 교체가 불가능하다. 따라서 조명 장치는 LED(160)의 수명에 따라 전체가 교체되어야 하며, 사용자는 LED(160)의 교체를 통해 새로운 색감이나 다양한 에너지 효율을 갖는 조명을 구현하는 편익을 얻을 수 없는 문제점이 있다.Here, in the lighting apparatus according to the related art, the light guide plate support part 153 and the LED damage prevention member 150 are formed of a heat dissipation unit 110 and one body, and thus are not removable, so that the LED 160 may not be replaced. Therefore, the lighting device has to be replaced entirely according to the life of the LED 160, the user has a problem that can not obtain the benefit of implementing a new color or a variety of energy efficiency lighting through the replacement of the LED (160).
본 발명은 작은 비용으로 여러 LED 모듈부를 탈부착할 수 있는 LED 모듈 및 이를 이용한 LED 조명 장치를 제공한다. The present invention provides an LED module and a LED lighting device using the same that can be attached and detached several LED module unit at a small cost.
또한, 본 발명은 LED 모듈부의 탈부착 기능을 통해 사용자의 편익에 따라 여러 가지 색감을 제공할 수 있는 LED 모듈 및 이를 이용한 LED 조명 장치를 제공한다.In addition, the present invention provides an LED module and an LED lighting device using the same that can provide a variety of colors according to the user's convenience through the removable function of the LED module unit.
본 발명이 제시하는 이외의 기술적 과제들은 하기의 설명을 통해 쉽게 이해될 수 있을 것이다.Technical problems other than the present invention will be easily understood through the following description.
본 발명의 일 측면에 따르면, 중앙부의 적어도 일면이 개방되며, 조명 장치의 몸체를 형성하는 몸체부; 상기 몸체부의 형상에 상응하여 탈부착 가능하도록 결합하며, 광을 출사하는 LED를 포함하는 LED 모듈부; 및 상기 LED의 전면에 위치하며, 상기 LED에서 출사된 광을 상기 몸체부의 개방된 일면 방향으로 조사하는 광학 시트를 포함하는 LED 조명 장치가 개시된다. According to an aspect of the invention, at least one surface of the central portion is open, the body portion forming a body of the lighting device; An LED module unit coupled to a shape corresponding to the shape of the body unit and including an LED emitting light; And an optical sheet positioned at a front surface of the LED and irradiating light emitted from the LED toward an open one surface of the body portion.
여기서, 상기 LED 모듈부는, 상기 개방된 일면과 평행하게 형성된 방열판; 및 상기 방열판과 수직한 방향으로 위치하며, 상기 LED가 실장되는 인쇄회로기판을 포함할 수 있다. Here, the LED module unit, the heat sink formed in parallel with the open one surface; And a printed circuit board positioned in a direction perpendicular to the heat sink and mounted with the LED.
여기서, 상기 LED 모듈부는, 상기 인쇄회로기판을 지지하고 상기 방열판과 수직으로 형성된 인쇄회로기판 지지부를 더 포함할 수 있다. The LED module unit may further include a printed circuit board supporter which supports the printed circuit board and is formed perpendicular to the heat sink.
여기서, 상기 LED 모듈부는, 상기 몸체부의 측면 방향에서 삽입 결합될 수 있다. Here, the LED module unit may be inserted and coupled in the side direction of the body portion.
여기서, 상기 LED 모듈부는, 상기 광이 출사되지 않는 개방된 타면 방향에서 삽입 결합될 수 있다. Here, the LED module unit may be inserted and coupled in the open other surface direction in which the light is not emitted.
여기서, 상기 LED 모듈부는 상기 몸체부에 나사 결합할 수 있다. Here, the LED module unit may be screwed to the body portion.
여기서, 본 발명의 실시예에 따른 LED 조명 장치는 상기 몸체부를 둘러싸며 탈부착 가능하도록 결합하는 스킨부를 더 포함할 수 있다. Here, the LED lighting device according to an embodiment of the present invention may further include a skin unit surrounding the body portion to be detachably coupled.
여기서, 상기 몸체부는 원형 또는 다각형일 수 있다. Here, the body portion may be circular or polygonal.
여기서, 상기 몸체부에는, 상기 LED를 상기 광학 시트로부터 이격시키기 위한 LED 손상 방지턱이 형성될 수 있다. Here, the LED damage prevention step for separating the LED from the optical sheet may be formed in the body portion.
여기서, 본 발명의 실시예에 따른 LED 조명 장치는 상기 몸체부와 결합하는 펜던트 하측 부착물; 상기 몸체부를 타 물체에 결합하기 위한 몸체 지지부; 상기 몸체 지지부에 결합하는 펜던트 상측 부착물; 및 상기 펜던트 하측 부착물 및 상기 펜던트 상측 부착물을 서로 연결하는 펜던트 와이어를 더 포함할 수 있다. Here, the LED lighting device according to an embodiment of the present invention is attached to the lower pendant pendant body; A body support for coupling the body to another object; A pendant upper attachment to the body support; And a pendant wire connecting the pendant lower attachment and the pendant upper attachment to each other.
여기서, 상기 광학 시트는 도광판, 반사시트, 반사시트보호판, 확산시트 및 확산 보호판 중 어느 하나 이상을 포함할 수 있다. Here, the optical sheet may include at least one of a light guide plate, a reflective sheet, a reflective sheet protective plate, a diffusion sheet, and a diffusion protective plate.
여기서, 본 발명의 실시예에 따른 LED 조명 장치는 상기 LED와 상기 광학 시트 사이에 광여기 필름을 더 포함할 수 있다. Here, the LED lighting device according to an embodiment of the present invention may further include a photoexcited film between the LED and the optical sheet.
여기서, 상기 광여기 필름은, 열경화성 수지인 매트릭스 수지층; 상기 매트릭스 수지층에 포함되며, 상기 LED로부터 조사된 광의 파장을 변환하는 형광체; 상기 매트릭스 수지층 내부에 포함되며, 액상의 열경화성 수지를 경화시키는 경화제를 포함할 수 있다. Here, the optical excitation film, a matrix resin layer which is a thermosetting resin; A phosphor contained in the matrix resin layer and converting a wavelength of light irradiated from the LED; It is included in the matrix resin layer, it may include a curing agent for curing the liquid thermosetting resin.
본 발명의 다른 측면에 따르면, 중앙부의 적어도 일면이 개방되며, 조명 장치의 몸체를 형성하는 몸체부를 포함하는 LED를 이용한 조명 장치에 탈부착 가능하도록 결합하는 LED 모듈에 있어서, 상기 몸체부의 개방된 일면과 평행하게 형성된 방열판; 상기 방열판과 수직한 방향으로 위치하며, 상기 LED가 실장되는 인쇄회로기판; 및 상기 몸체부의 형상에 상응하여 탈부착 가능하도록 결합가능한 모듈 결합부를 포함하는 LED 모듈부가 개시된다. According to another aspect of the invention, at least one surface of the central portion is open, LED module for detachably coupled to the lighting device using the LED comprising a body portion forming the body of the lighting device, the open one surface of the body and Heat sinks formed in parallel; A printed circuit board positioned in a direction perpendicular to the heat sink and mounted with the LED; And a module coupling part detachably coupled to correspond to a shape of the body part.
여기서, 본 발명의 실시예에 따른 LED 모듈부는 상기 인쇄회로기판을 지지하고 상기 방열판과 수직으로 형성된 인쇄회로기판 지지부를 더 포함할 수 있다. Here, the LED module unit according to an embodiment of the present invention may further include a printed circuit board support unit supporting the printed circuit board and formed perpendicular to the heat sink.
여기서, 상기 LED 모듈부는, 상기 몸체부의 측면 방향에서 삽입 결합될 수 있다. Here, the LED module unit may be inserted and coupled in the side direction of the body portion.
여기서, 상기 LED 모듈부는, 상기 광이 출사되지 않는 개방된 타면 방향에서 삽입 결합될 수 있다. Here, the LED module unit may be inserted and coupled in the open other surface direction in which the light is not emitted.
여기서, 상기 모듈 결합부는 상기 몸체부에 나사 결합할 수 있다.Here, the module coupling portion may be screwed to the body portion.
본 발명에 따른 LED 모듈 및 이를 이용한 LED 조명 장치는 작은 비용으로 여러 LED 모듈부를 탈부착할 수 있는 효과가 있다. LED module and the LED lighting device using the same according to the present invention has the effect that can be attached and detached several LED module unit at a small cost.
또한, 본 발명에 따른 LED 모듈 및 이를 이용한 LED 조명 장치는 LED 모듈부의 탈부착 기능을 통해 사용자의 편익에 따라 여러 가지 색감이나 다양한 에너지 효율을 갖는 조명 장치를 제공할 수 있는 효과가 있다.In addition, the LED module and the LED lighting device using the same according to the present invention has an effect that can provide a lighting device having a variety of colors or various energy efficiency according to the user's convenience through the detachable function of the LED module unit.
도 1은 종래 기술에 따른 LED 조명 장치의 단면도. 1 is a cross-sectional view of an LED lighting device according to the prior art.
도 2는 본 발명의 실시예에 따른 LED 조명 장치의 단면도. 2 is a cross-sectional view of the LED lighting apparatus according to the embodiment of the present invention.
도 3은 본 발명의 실시예에 따른 LED 조명 장치의 LED 모듈부의 사시도. 3 is a perspective view of an LED module unit of the LED lighting apparatus according to the embodiment of the present invention.
도 4는 본 발명의 실시예에 따른 LED 조명 장치의 측면도. 4 is a side view of the LED lighting apparatus according to the embodiment of the present invention.
도 5는 본 발명의 제1 실시예에 따른 LED 조명 장치의 사시도. 5 is a perspective view of the LED lighting apparatus according to the first embodiment of the present invention.
도 6은 본 발명의 제1 실시예에 따른 LED 조명 장치의 분해 측면도. 6 is an exploded side view of the LED lighting apparatus according to the first embodiment of the present invention.
도 7은 본 발명의 제2 실시예에 따른 LED 조명 장치의 사시도. 7 is a perspective view of an LED lighting apparatus according to a second embodiment of the present invention.
도 8은 본 발명의 제2 실시예에 따른 LED 조명 장치의 프레임 구조도.8 is a frame structure diagram of an LED lighting apparatus according to a second embodiment of the present invention.
도 9는 본 발명의 제3 실시예에 따른 LED 조명 장치의 분해 측면도.9 is an exploded side view of the LED lighting apparatus according to the third embodiment of the present invention.
본 발명은 다양한 변경을 가할 수 있고 여러 가지 실시예를 가질 수 있는 바, 특정 실시예들을 도면에 예시하고 상세한 설명에 상세하게 설명하고자 한다. 그러나 이는 본 발명을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다.As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.
어떤 구성요소가 다른 구성요소에 "연결되어" 있다거나 "접속되어" 있다고 언급된 때에는, 그 다른 구성요소에 직접적으로 연결되어 있거나 또는 접속되어 있을 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에, 어떤 구성요소가 다른 구성요소에 "직접 연결되어" 있다거나 "직접 접속되어" 있다고 언급된 때에는, 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다. When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.
본 출원에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 출원에서, "포함하다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.
다르게 정의되지 않는 한, 기술적이거나 과학적인 용어를 포함해서 여기서 사용되는 모든 용어들은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미를 가지고 있다. 일반적으로 사용되는 사전에 정의되어 있는 것과 같은 용어들은 관련 기술의 문맥 상 가지는 의미와 일치하는 의미를 가지는 것으로 해석되어야 하며, 본 출원에서 명백하게 정의하지 않는 한, 이상적이거나 과도하게 형식적인 의미로 해석되지 않는다.Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.
또한, 첨부 도면을 참조하여 설명함에 있어, 도면 부호에 관계없이 동일한 구성 요소는 동일한 참조부호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다. 본 발명을 설명함에 있어서 관련된 공지 기술에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다. In addition, in the description with reference to the accompanying drawings, the same components regardless of reference numerals will be given the same reference numerals and duplicate description thereof will be omitted. In the following description of the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.
도 2는 본 발명의 실시예에 따른 LED 조명 장치의 단면도이다. 도 2를 참조하면, 본 발명의 실시예에 따른 LED 조명 장치는 LED 모듈부와 몸체부(230)(일부분 도시)를 포함한다. LED 모듈부는 방열부(210), 모듈 결합부(213), 인쇄회로기판(215), LED(220) 및 인쇄회로기판 지지부(225)를 포함하며, 몸체부(230)는 LED 손상 방지턱(235), 광학 시트 지지부(240)를 포함할 수 있다. 2 is a cross-sectional view of the LED lighting apparatus according to the embodiment of the present invention. Referring to FIG. 2, the LED lighting apparatus according to the embodiment of the present invention includes an LED module portion and a body portion 230 (partially shown). The LED module part includes a heat dissipation part 210, a module coupling part 213, a printed circuit board 215, an LED 220, and a printed circuit board support part 225, and the body part 230 includes an LED damage prevention jaw 235. ), And may include an optical sheet supporter 240.
LED 모듈부는 몸체부(230)의 형상에 상응하여 탈부착 가능하도록 LED 몸체부(230)에 결합한다. 예를 들면, 몸체부(230)가 일방향으로 LED 모듈부와 결합구조를 가지고, 타방향으로 LED 손상 방지턱(235)과 광학 시트 지지부(240)를 포함하는 경우 LED 모듈부는 모듈 결합부(213)에서 몸체부(230)와 결합하고, 광학 시트 지지부(240)와 LED 손상 방지턱(235) 사이에 인쇄회로기판 지지부(225)가 위치할 수 있도록 형성될 수 있다. The LED module unit is coupled to the LED body 230 to be removable according to the shape of the body 230. For example, when the body portion 230 has a coupling structure with the LED module portion in one direction, and the LED damage prevention jaw 235 and the optical sheet support portion 240 in the other direction, the LED module portion module coupling portion 213 In combination with the body portion 230, the printed circuit board support 225 may be formed between the optical sheet support 240 and the LED damage prevention jaw 235.
인쇄회로기판 지지부(225)는 LED 모듈부에 인쇄회로기판(215)을 지지하기 위해 방열부(210)와 수직으로 형성될 수 있다. 여기서, 수직은 수학적으로 정확히 수직만을 의미하지 않고, 대체적인 수직을 의미한다. 인쇄회로기판(215)은 인쇄회로기판 지지부(225)에 지지되어 외부 전원 및 회로로부터 필요한 전류를 제공받는다. The printed circuit board support 225 may be formed perpendicular to the heat dissipation unit 210 to support the printed circuit board 215 in the LED module unit. Here, vertical does not mean only vertically mathematically, but generally vertically. The printed circuit board 215 is supported by the printed circuit board support 225 to receive a necessary current from an external power supply and a circuit.
또한, 다른 실시예에 의하면 인쇄회로기판(215)은 인쇄회로기판 지지부(225) 없이 방열부(210)에 형성된 소정의 홈에 바로 끼워져서 지지될 수도 있다. 이 경우 별도로 인쇄회로기판 지지부(225)가 필요하지 않으므로, 보다 간단한 장치가 구현될 수 있다. In addition, according to another exemplary embodiment, the printed circuit board 215 may be directly inserted into and supported in a predetermined groove formed in the heat dissipation unit 210 without the printed circuit board support 225. In this case, since the printed circuit board support 225 is not necessary separately, a simpler device can be implemented.
몸체부(230)는 중앙부의 적어도 일면이 개방되며, 조명 장치의 몸체를 형성한다. 몸체부(230)에는 LED(220)를 광학 시트로부터 이격시키기 위한 LED 손상 방지턱(235), 광학 시트를 지지하기 위한 광학 시트 지지부(240)가 형성될 수 있다. 도 2에서는 광학 시트 지지부(240)의 연장 방향으로 몸체부(230)가 개방되어 있는 구조가 도시된다. 몸체부(230)는 전체가 하나의 사출물로 형성될 수도 있고, 여러 프레임이 결합되어 전체로 형성될 수도 있다. At least one surface of the central portion 230 is open, and the body portion 230 forms a body of the lighting device. The body portion 230 may be provided with an LED damage prevention jaw 235 for separating the LED 220 from the optical sheet, and an optical sheet support 240 for supporting the optical sheet. 2 illustrates a structure in which the body 230 is opened in the extending direction of the optical sheet support 240. Body portion 230 may be formed entirely in one injection molding, it may be formed by combining a plurality of frames.
결합 수단은 나사(250) 결합, 브라켓 결합(홈에 돌출부가 끼워져 결합함) 등이 될 수 있다. 도 2에서는 몸체부(230)와 모듈 결합부(213)가 서로 나사(250) 결합하는 경우가 도시된다. 이러한 구조에 의해서, LED 모듈부는 광이 출사되지 않는 몸체부(230)의 개방된 타면 방향에서 삽입 결합될 수 있다. Coupling means may be screw 250 coupling, bracket coupling (protrusion into the groove is coupled) and the like. 2 illustrates a case in which the body portion 230 and the module coupling portion 213 couple screws 250 together. By this structure, the LED module unit can be inserted and coupled in the open other surface direction of the body portion 230 is not emitted light.
도 3은 본 발명의 실시예에 따른 LED 조명 장치의 LED 모듈부의 사시도이다. 도 3을 참조하면, 방열부(210), 인쇄회로기판(215), LED(220) 및 인쇄회로기판 지지부(225)가 도시된다. 상술한 바와의 차이점을 위주로 설명한다. 3 is a perspective view of an LED module unit of the LED lighting apparatus according to the embodiment of the present invention. Referring to FIG. 3, a heat dissipation unit 210, a printed circuit board 215, an LED 220, and a printed circuit board support 225 are illustrated. The differences from the above will be explained mainly.
조명 장치가 사각형의 형태를 가지는 경우 이러한 형태에 상응하는 LED 모듈부의 인쇄회로기판 지지부(225)는 일방향으로 긴 사각형 형태를 가진다. 만약, 조명 장치가 원, 삼각형 등의 다른 형태를 가지는 경우 LED 모듈부는 이러한 조명 장치의 형태에 상응되도록 형성될 수 있다. 예를 들면, 조명 장치의 몸체부가 원형인 경우 LED 모듈부는 곡률을 가지는 형상을 가질 수 있다. When the lighting device has a rectangular shape, the printed circuit board support part 225 of the LED module part corresponding to this shape has a rectangular shape long in one direction. If the lighting device has a different shape such as a circle or a triangle, the LED module may be formed to correspond to the shape of the lighting device. For example, when the body portion of the lighting device is circular, the LED module portion may have a shape having a curvature.
LED 모듈부는 조명 장치의 몸체부의 측면 방향에서 삽입 결합되거나, 광학 시트에서 출사된 광이 조사되지 않는 조명 장치의 몸체부의 개방된 타면 방향에서 삽입 결합될 수 있다. LED 모듈부가 측면 방향에서 삽입되는 경우 몸체부(230)는 LED 모듈부가 삽입되는 부분은 홀이 형성되고, 삽입되지 않은 부분은 서로 연결되는 구조를 가질 수 있다.The LED module unit may be inserted and coupled in the lateral direction of the body portion of the lighting device, or may be inserted and coupled in the open other surface direction of the body portion of the lighting device that is not irradiated with light emitted from the optical sheet. When the LED module portion is inserted in the lateral direction, the body portion 230 may have a structure in which a hole into which the LED module portion is inserted is formed, and portions not inserted are connected to each other.
방열부(210)와 인쇄회로기판 지지부(225)를 일면 및 타면으로 가지는 공간에는 광학 시트가 삽입된다. 광학 시트와 LED(220) 사이에는 광여기 필름이 삽입된다. 광여기 필름은 광학 시트 또는 LED(220)에 부착되어 결합할 수 있다. 이러한 광여기 필름에 대해서는 이하에서 자세히 후술한다. An optical sheet is inserted into a space having the heat dissipation unit 210 and the printed circuit board support unit 225 on one side and the other side. A photoexcited film is inserted between the optical sheet and the LED 220. The photoexcited film may be attached to and bonded to the optical sheet or LED 220. Such photoexcited film will be described later in detail.
도 4는 본 발명의 실시예에 따른 LED 조명 장치의 측면도이다. 도 4를 참조하면, 방열부(210), 인쇄회로기판(215), LED(220) 및 인쇄회로기판 지지부(225)를 포함하는 LED 모듈부, LED 손상 방지턱(235), 광학 시트 지지부(240)를 포함하는 몸체부(230), 스킨부(410), 몸체 지지부(420), 결합부(430) 및 광학 시트(440)가 도시된다. 상술한 바와의 차이점을 위주로 설명한다. 4 is a side view of the LED lighting apparatus according to the embodiment of the present invention. Referring to FIG. 4, an LED module unit including a heat radiating unit 210, a printed circuit board 215, an LED 220, and a printed circuit board support 225, an LED damage prevention jaw 235, and an optical sheet support 240 A body portion 230, a skin portion 410, a body support 420, a coupling portion 430 and an optical sheet 440 are shown. The differences from the above will be explained mainly.
스킨부(410)는 조명 장치의 몸체부(230)의 주위를 둘러싸며, 몸체부(230)에 탈부착 가능하도록 결합되는 하우징 구조를 가진다. The skin part 410 surrounds the circumference of the body part 230 of the lighting device and has a housing structure that is detachably coupled to the body part 230.
몸체 지지부(420)는 스킨부(410)가 타 물체가 결합되도록 지지하는 역할을 한다. 예를 들면, 본 발명의 실시예에 따른 LED 조명 장치가 실내 천정에 부착되는 경우 몸체 지지부(420)는 평판형으로 형성되어 결합부(430)(예를 들면, 나사)에 의해 천정에 부착될 수 있다. Body support 420 serves to support the skin unit 410 to be coupled to other objects. For example, when the LED lighting device according to the embodiment of the present invention is attached to the indoor ceiling, the body support 420 is formed in a flat shape to be attached to the ceiling by the coupling part 430 (for example, a screw). Can be.
광학 시트(440)는 도광판, 반사시트, 반사시트보호판, 확산시트 및 확산 보호판 중 어느 하나 이상을 포함할 수 있다. 광여기 필름(450)은 LED(220)와 광학 시트(440) 사이에 삽입된다. The optical sheet 440 may include at least one of a light guide plate, a reflective sheet, a reflective sheet protective plate, a diffusion sheet, and a diffusion protective plate. The photoexcited film 450 is inserted between the LED 220 and the optical sheet 440.
광학 시트(440)는 LED(220)로부터 발생된 광을 소정의 방향으로 방출하기 위한 구조로 형성된다. 도 2에서는 LED 모듈부의 방열부(210)가 상부에 위치하며, 광은 하부로 조사되는 구조가 도시된다. The optical sheet 440 is formed in a structure for emitting light generated from the LED 220 in a predetermined direction. In FIG. 2, the heat dissipation unit 210 of the LED module unit is positioned at an upper portion thereof, and a structure in which light is radiated downward is illustrated.
이상에서 본 발명의 실시예에 따른 LED 모듈 및 이를 이용한 LED 조명 장치를 일반적으로 도시한 단면도 또는 사시도를 설명하였으며, 이하에서는 첨부 도면을 참조하여, 본 발명에 따른 LED 모듈 및 이를 이용한 LED 조명 장치를 구체적인 실시예를 기준으로 설명하기로 한다. 다만, 본 발명이 이러한 실시예에 한정되지 않음은 당연하다.In the above description, a cross-sectional view or a perspective view of an LED module and an LED lighting apparatus using the same according to an embodiment of the present invention have been described in general. It will be described based on the specific embodiment. However, it is obvious that the present invention is not limited to these examples.
도 5는 본 발명의 제1 실시예에 따른 LED 조명 장치의 사시도이고, 도 6은 분해 측면도이다. 도 5 및 도 6을 참조하면, 조명 장치 몸체부(510), 몸체 지지부(520), 몸체부 결합 구조(610)가 도시된다. 5 is a perspective view of the LED lighting apparatus according to the first embodiment of the present invention, Figure 6 is an exploded side view. 5 and 6, the lighting device body 510, the body support 520, and the body coupling structure 610 are shown.
본 발명의 제1 실시예에 따른 LED 조명 장치는 조명 장치 몸체부(510)가 원형이다. 조명 장치 몸체부(510)가 몸체 지지부(520)와 결합할 때 조명 장치 몸체부(510)의 단면 곡선은 몸체 지지부(520)의 단면 곡선과 곡률이 대응되어 자연스럽게 서로 만날 수 있도록 형성될 수 있다. In the LED lighting device according to the first embodiment of the present invention, the lighting device body 510 is circular. When the lighting device body 510 is coupled to the body support 520, the cross-sectional curve of the lighting device body 510 may be formed so that the cross-section curve and curvature of the body support 520 correspond to each other. .
또한, 조명 장치 몸체부(510)에는 몸체부 결합 구조(610)가 형성된다. 몸체부 결합 구조(610)는 조명 장치 몸체부(510)를 몸체 지지부(520)에 결합하기 위해서 소정의 돌출부가 형성되며, 이러한 돌출부는 이에 상응하여 몸체 지지부(520)에 형성된 홈에 삽입된다. 따라서 몸체부 결합 구조(610)는 몸체 지지부(520)에 회동 결합한다. In addition, the body portion coupling structure 610 is formed in the lighting device body portion 510. The body coupling structure 610 has a predetermined protrusion formed to couple the lighting device body 510 to the body support 520, and the protrusion is correspondingly inserted into a groove formed in the body support 520. Therefore, the body coupling structure 610 is pivotally coupled to the body support 520.
이 경우 사용자는 몸체부 결합 구조(610)의 돌출부를 몸체 지지부(520)에 형성된 홈에 삽입시킨 후 조명 장치 몸체부(510)를 회전시켜서 조명 장치 몸체부(510)를 몸체 지지부(520)에 고정시킬 수 있다. 또한, 사용자는 조명 장치 몸체부(510)를 반대 방향으로 회전시켜서 몸체 지지부(520)로부터 몸체부 결합 구조(610)를 탈착시킬 수 있다. In this case, the user inserts the protrusion of the body coupling structure 610 into the groove formed in the body support 520 and then rotates the lighting device body 510 to attach the lighting device body 510 to the body support 520. Can be fixed In addition, the user may detach the body coupling structure 610 from the body support 520 by rotating the lighting device body 510 in the opposite direction.
이외에도 본 발명의 실시예에 따른 LED 조명 장치는 정사각형, 삼각형, 직사각형과 같은 다각형 또는 원형의 형태를 가질 수 있다. In addition, the LED lighting device according to the embodiment of the present invention may have a polygonal or circular shape such as square, triangle, and rectangle.
도 7은 본 발명의 제2 실시예에 따른 LED 조명 장치의 사시도이다. 도 7을 참조하면, LED 모듈 프레임부(720 : 720(a), 720(b), 720(c), 720(d), 720(e), 720(f)), LED에 전원을 공급하는 전원 공급부(730), 조명 장치를 둘러싸는 스킨부(750)를 포함하는 조명 장치가 도시된다. 이에 따른 조명 장치는 천장 또는 벽에 직접 부착될 수도 있고, 펜던트 와이어에 연결되어 상부에 매달려 설치될 수도 있다. 7 is a perspective view of the LED lighting apparatus according to the second embodiment of the present invention. Referring to Figure 7, LED module frame unit 720: 720 (a), 720 (b), 720 (c), 720 (d), 720 (e), 720 (f)) for supplying power to the LED A lighting device is shown that includes a power supply 730 and a skin 750 surrounding the lighting device. Accordingly, the lighting device may be directly attached to the ceiling or wall, or may be connected to the pendant wire and be suspended from the top.
LED 모듈 프레임부(720)는 모두 6개이며, 전부 조립되는 경우 상술한 LED 모듈부를 형성한다. LED 모듈 프레임부(720)는 몸체부의 측면 방향에서 삽입 결합된다. 이러한 몸체부와 LED 모듈부의 결합관계는 도 8에 상세하게 도시된다. The LED module frame part 720 is six in total, and when assembled all form the above-described LED module part. The LED module frame portion 720 is inserted and coupled in the side direction of the body portion. The coupling relationship between the body portion and the LED module portion is shown in detail in FIG. 8.
도 8을 참조하면, 몸체 프레임부(710)의 측면도(a) 및 평면도(b), LED 모듈 프레임부(720)의 측면도(a) 및 평면도(b)가 도시된다. 6개의 몸체 프레임부(710)는 LED 모듈 프레임부(720)와 같이 전부 조립되는 경우 상술한 몸체부를 형성할 수 있다. 몸체 프레임부(710)에는 일측에 체결 돌기(715)가 형성되어, LED 모듈 프레임부(720)의 일측에 형성된 체결 홀(725)에 삽입 결합된다. 따라서 각 LED 모듈 프레임부(720)는 각 몸체 프레임부(710)의 측면 방향에서 삽입 결합될 수 있다. Referring to FIG. 8, a side view (a) and a plan view (b) of the body frame part 710, and a side view (a) and a plan view (b) of the LED module frame part 720 are shown. The six body frame parts 710 may form the above-described body parts when all of the six body frame parts 710 are assembled like the LED module frame part 720. A fastening protrusion 715 is formed at one side of the body frame part 710, and is inserted and coupled to the fastening hole 725 formed at one side of the LED module frame part 720. Therefore, each LED module frame portion 720 may be inserted and coupled in the side direction of each body frame portion 710.
이에 따르면, 사용자는 천정 또는 벽에 직접 부착되거나 펜던트 형태로 매달린 상기 조명 장치에 대해 스킨부(750)를 제거하고, 측면 방향에서 각각의 LED 모듈 프레임부(720)를 교체하는 간단한 절차에 의해 LED 모듈부를 교체할 수 있는 장점이 있다. According to this, the user removes the skin portion 750 for the lighting device attached directly to the ceiling or wall or suspended in the form of a pendant, and by a simple procedure to replace each LED module frame portion 720 in the lateral direction. There is an advantage that the module can be replaced.
도 9는 본 발명의 제3 실시예에 따른 LED 조명 장치의 분해 측면도이다. 도 9를 참조하면, 조명 장치 몸체부(910), 펜던트 하측 부착물(920), 펜던트 상측 부착물(930), 몸체 지지부(940) 및 펜던트 와이어(950)가 도시된다. 9 is an exploded side view of the LED lighting apparatus according to the third embodiment of the present invention. Referring to FIG. 9, a lighting device body 910, a pendant bottom attachment 920, a pendant top attachment 930, a body support 940 and a pendant wire 950 are shown.
펜던트 하측 부착물(920)은 조명 장치 몸체부(910)와 결합하면, 펜던트 상측 부착물(930)은 몸체 지지부(940)와 결합한다. 그리고 조명 장치 몸체부(910), 펜던트 하측 부착물(920), 펜던트 상측 부착물(930) 및 몸체 지지부(940)는 펜던트 와이어(950)에 의해 서로 연결된다. 예를 들면, 몸체 지지부(940)는 펜던트 상측 부착물(930)과 결합된 상태에서 타 물체인 실내 천정에 부착되고, 조명 장치 몸체부(910)는 펜던트 하측 부착물(920)과 결합된 상태에서 펜던트 와이어(950)에 매달려 실내에 부착될 수 있다. The pendant lower attachment 920 is coupled to the lighting device body 910, and the pendant upper attachment 930 is coupled to the body support 940. The lighting device body 910, the pendant lower attachment 920, the pendant upper attachment 930, and the body support 940 are connected to each other by a pendant wire 950. For example, the body support 940 is attached to the indoor ceiling which is another object in a state where it is coupled with the pendant upper attachment 930, and the lighting device body 910 is pendant when it is coupled with the pendant lower attachment 920. Hanging on the wire 950 can be attached to the room.
이러한 펜던트 형상은 본 발명의 실시예에 따른 LED 조명 장치의 미감을 상승시킬 수 있는 장점이 있다. This pendant shape has the advantage of increasing the aesthetics of the LED lighting device according to an embodiment of the present invention.
이하에서는 본 발명의 실시예에 따른 LED 조명 장치에 사용될 수 있는 광여기 필름에 대해 설명한다. Hereinafter, a light excitation film that can be used in an LED lighting device according to an embodiment of the present invention will be described.
본 발명의 실시예에 따른 광여기 필름은 적색 형광체, 녹색 형광체와 같은 형광체, 매트릭스 수지층, 보호 필름을 포함할 수 있다. Photoexcitation film according to an embodiment of the present invention may include a red phosphor, a phosphor such as a green phosphor, a matrix resin layer, a protective film.
광여기 필름은 박막의 매트릭스 수지층 내부에 형광체가 고르게 분산된 형태를 가진다. 또한, 매트릭스 수지층 내부에는 경화제가 포함될 수 있다. 경화제는 액상의 열경화성 수지를 경화하는 용도로 사용된다. 보호 필름은 매트릭스 수지층을 보호하는 역할을 한다.The photoexcited film has a form in which phosphors are evenly dispersed in the matrix resin layer of the thin film. In addition, a curing agent may be included in the matrix resin layer. A hardener is used for the hardening of liquid thermosetting resin. The protective film serves to protect the matrix resin layer.
본 발명에 사용될 수 있는 재료에 대하여 설명하면 다음과 같다.Referring to the materials that can be used in the present invention are as follows.
- 매트릭스 수지층Matrix resin layer
본 발명에서 매트릭스 수지층을 이루는 것은 열경화성 수지이며, 특히 실리콘 수지가 될 수 있다. 열가소성 수지는 다루기는 쉬우나 취성이 강하고 방습능력이 낮으므로, 표면의 균일성이 필요한 광여기 필름에는 사용하기 어려운 단점이 있다. What constitutes the matrix resin layer in the present invention is a thermosetting resin, and in particular, may be a silicone resin. Thermoplastic resins are easy to handle, but have a high brittleness and low moisture resistance, and thus have a disadvantage in that they are difficult to use in photoexcited films requiring uniformity of the surface.
실리콘 수지는 연성이 좋고 필름에 인쇄시 접착력이 우수하다. 본 발명에서 사용가능한 실리콘 수지의 바람직한 특성은 광투과도가 85% 이상이고, 점도가 3000cp이상이며 120이하에서 건조(경화)되는 것이다. 또한 형광체 등과의 혼합이 양호하여야 하며 휘발성은 낮을수록 좋고, 보호 필름과의 접착성이 좋아야 한다. Silicone resin has good ductility and good adhesion when printing on film. Preferred properties of the silicone resin usable in the present invention are those having a light transmittance of 85% or more, a viscosity of 3000 cps or more and drying (curing) at 120 or less. In addition, the mixing with the phosphor and the like should be good, the lower the volatility is better, the better the adhesion to the protective film.
이러한 실리콘 수지는 자체적으로 소포제가 첨가될 수 있으므로, 스크린인쇄 방식에서 문제가 되는 기포문제를 해결할 수 있다. 따라서 이하에서 설명하는 실리콘 수지는 순수 실리콘 수지라기보다는 소포제 등의 실리콘 수지의 성질을 개선하는 물질이 미량 첨가된 것이라 볼 수 있다. Since the silicone resin can be added with an antifoaming agent itself, it is possible to solve the bubble problem that is a problem in the screen printing method. Therefore, the silicone resin described below may be regarded as a small amount of a substance which improves the properties of the silicone resin such as an antifoaming agent rather than a pure silicone resin.
-형광체Phosphor
본 발명의 상기 실리콘 수지에 혼입되어 광여기 기능을 수행하는 물질은 다음과 같다. 형광체는 무기 형광체가 될 수 있다. The material incorporated into the silicone resin of the present invention to perform a photoexcitation function is as follows. The phosphor may be an inorganic phosphor.
적색을 발광시키기 위한 대표적인 무기 형광체는 SrB4O7:SM2+ 이다. SM2+는 주로 적색의 파장을 나타내는데 기여한다. 특히 상기와 같은 적색 무기 형광체는 600 nm 이하의 가시광 영역 전체를 흡수하여 심적색 즉, 650nm 이상의 파장을 갖는 광을 발생시킨다. SrS:Eu계열의 620nm 파장대의 형광체를 사용될 수도 있다. 또한, 녹색을 발광시키기 위한 무기 형광체는 SrGa2S4:Eu2+ 이 될 수 있다. 적색 형광체는 CaS:Eu, SrS:Eu 및 SrB4O7:Sm 중 하나를 사용할 수도 있다.A representative inorganic phosphor for emitting red color is SrB 4 O 7 : SM 2+ . SM 2+ mainly contributes to the red wavelength. In particular, such a red inorganic phosphor absorbs the entire visible light region of 600 nm or less to generate light having a deep red color, that is, a wavelength of 650 nm or more. Phosphors of 620 nm wavelength in the SrS: Eu series may also be used. In addition, the inorganic phosphor for emitting green light may be SrGa 2 S 4 : Eu 2+ . The red phosphor may use one of CaS: Eu, SrS: Eu, and SrB 4 O 7 : Sm.
- 보호 필름-Protective film
본 발명의 보호 필름으로 사용가능한 수지로는 광 투과도가 우수한 것으로서 무색 투명한 합성 수지를 사용하는데, 특별히 한정되는 것은 아니나 예를 들면, 폴리에틸렌 테레프탈레이트( Polyethylene terephthalate : PET), 폴리에틸렌 나프탈레이트(Polyethylene naphthalate), 아크릴 수지, 폴리카보네이트(Polycarbonate), 폴리스틸렌(Polystyrene) 등이 있다. 이중에 폴리에틸렌 테레프탈레이트( Polyethylene terephthalate : PET)필름은 투명성이 우수하고, 강도 및 휨성이 뛰어나다. 또한 내열성, 내화학성이 필요한 경우에는 보호 필름을 폴리카보네이트(Polycarbonate)로 하는 것이 바람직하다. 보호 필름의 두께는 5 ~ 50㎛ 이내의 필름을 사용하는 것이 바람직하다. 10㎛ 이하의 필름은 취급이 난해하고, 50㎛ 이상의 필름은 광 투과도가 떨어지기 때문이다.The resin that can be used as the protective film of the present invention is excellent in light transmittance and uses a colorless transparent synthetic resin, but is not particularly limited, for example, polyethylene terephthalate (PET), polyethylene naphthalate (Polyethylene naphthalate) , Acrylic resins, polycarbonates, polystyrenes, and the like. Among them, polyethylene terephthalate (PET) film is excellent in transparency, and excellent in strength and warpage. Moreover, when heat resistance and chemical resistance are needed, it is preferable to make a protective film polycarbonate. It is preferable that the thickness of a protective film uses the film within 5-50 micrometers. This is because a film of 10 µm or less is difficult to handle, and a film of 50 µm or more is inferior in light transmittance.
경화제는 액상의 실리콘을 경화시키는 역할을 하며, 본 발명의 실시예에서는 다양한 경화제를 사용할 수 있다. The curing agent serves to cure the liquid silicone, and in the embodiment of the present invention, various curing agents may be used.
본 발명의 실시예에 따른 LED는 백색광을 발생시키는 LED가 될 수 있다. 이 경우 광여기 필름은 부족한 색감을 보상하기 위해 적색 또는 녹색의 형광체를 포함할 수 있다. 본 발명의 실시예에 따르면, 상술한 바와 같은 형광체를 포함시켜서 2500K ~ 7000K 영역의 여러 가지 백색을 구현할 수 있는 장점이 있다. The LED according to the embodiment of the present invention may be an LED that generates white light. In this case, the photoexcited film may include a red or green phosphor to compensate for insufficient color. According to an embodiment of the present invention, there is an advantage that various whites in the 2500K to 7000K region can be realized by including the phosphor as described above.
상기에서는 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진 자라면 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be appreciated that modifications and variations can be made.

Claims (18)

  1. 중앙부의 적어도 일면이 개방되며, 조명 장치의 몸체를 형성하는 몸체부;At least one surface of the central portion is open, the body portion forming a body of the lighting device;
    상기 몸체부의 형상에 상응하여 탈부착 가능하도록 결합하며, 광을 출사하는 LED를 포함하는 LED 모듈부; 및An LED module unit coupled to a shape corresponding to the shape of the body unit and including an LED emitting light; And
    상기 LED의 전면에 위치하며, 상기 LED에서 출사된 광을 상기 몸체부의 개방된 일면 방향으로 조사하는 광학 시트를 포함하는 LED 조명 장치.Located in the front of the LED, LED lighting device comprising an optical sheet for irradiating the light emitted from the LED in the direction of the open surface of the body portion.
  2. 제1항에 있어서, The method of claim 1,
    상기 LED 모듈부는, The LED module unit,
    상기 개방된 일면과 평행하게 형성된 방열판; 및A heat sink formed in parallel with the open one surface; And
    상기 방열판과 수직한 방향으로 위치하며, 상기 LED가 실장되는 인쇄회로기판을 포함하는 것을 특징으로 하는 LED 조명 장치.Located in a direction perpendicular to the heat sink, LED lighting device comprising a printed circuit board on which the LED is mounted.
  3. 제2항에 있어서, The method of claim 2,
    상기 LED 모듈부는, The LED module unit,
    상기 인쇄회로기판을 지지하고 상기 방열판과 수직으로 형성된 인쇄회로기판 지지부를 더 포함하는 것을 특징으로 하는 LED 조명 장치.And a printed circuit board supporter supporting the printed circuit board and formed perpendicular to the heat sink.
  4. 제1항에 있어서, The method of claim 1,
    상기 LED 모듈부는, The LED module unit,
    상기 몸체부의 측면 방향에서 삽입 결합되는 것을 특징으로 하는 LED 조명 장치.LED lighting apparatus characterized in that the insert is coupled in the side direction of the body portion.
  5. 제1항에 있어서, The method of claim 1,
    상기 LED 모듈부는, The LED module unit,
    상기 광이 출사되지 않는 개방된 타면 방향에서 삽입 결합되는 것을 특징으로 하는 LED 조명 장치.LED lighting device, characterized in that the light is inserted and coupled in the other direction of the open direction is not emitted.
  6. 제1항에 있어서, The method of claim 1,
    상기 LED 모듈부는 상기 몸체부에 나사 결합하는 것을 특징으로 하는 LED 조명 장치.LED module is characterized in that the screw coupled to the body portion.
  7. 제1항에 있어서, The method of claim 1,
    상기 몸체부를 둘러싸며 탈부착 가능하도록 결합하는 스킨부를 더 포함하는 것을 특징으로 하는 LED 조명 장치.LED lighting device further comprises a skin surrounding the body portion to be detachably coupled.
  8. 제1항에 있어서, The method of claim 1,
    상기 몸체부는 원형 또는 다각형인 것을 특징으로 하는 LED 조명 장치.LED body, characterized in that the body portion is circular or polygonal.
  9. 제1항에 있어서, The method of claim 1,
    상기 몸체부에는, The body portion,
    상기 LED를 상기 광학 시트로부터 이격시키기 위한 LED 손상 방지턱이 형성된 것을 특징으로 하는 LED 조명 장치.LED damage apparatus is formed for separating the LED from the optical sheet LED damage device.
  10. 제1항에 있어서, The method of claim 1,
    상기 몸체부와 결합하는 펜던트 하측 부착물;A pendant lower attachment to the body portion;
    상기 몸체부를 타 물체에 결합하기 위한 몸체 지지부;A body support for coupling the body to another object;
    상기 몸체 지지부에 결합하는 펜던트 상측 부착물; 및 A pendant upper attachment to the body support; And
    상기 펜던트 하측 부착물 및 상기 펜던트 상측 부착물을 서로 연결하는 펜던트 와이어를 더 포함하는 LED 조명 장치.And a pendant wire connecting the pendant lower attachment and the pendant upper attachment to each other.
  11. 제1항에 있어서, The method of claim 1,
    상기 광학 시트는 도광판, 반사시트, 반사시트보호판, 확산시트 및 확산 보호판 중 어느 하나 이상을 포함하는 것을 특징으로 하는 LED 조명 장치.The optical sheet includes a light guide plate, a reflective sheet, a reflective sheet protective plate, a diffusion sheet and a diffusion protective plate any one or more of the LED lighting apparatus.
  12. 제1항에 있어서, The method of claim 1,
    상기 LED와 상기 광학 시트 사이에 광여기 필름을 더 포함하는 것을 특징으로 하는 LED 조명 장치.LED lighting device further comprises a photoexcited film between the LED and the optical sheet.
  13. 제12항에 있어서, The method of claim 12,
    상기 광여기 필름은, The photoexcitation film,
    열경화성 수지인 매트릭스 수지층;Matrix resin layer which is a thermosetting resin;
    상기 매트릭스 수지층에 포함되며, 상기 LED로부터 조사된 광의 파장을 변환하는 형광체; 및A phosphor contained in the matrix resin layer and converting a wavelength of light irradiated from the LED; And
    상기 매트릭스 수지층 내부에 포함되며, 액상의 열경화성 수지를 경화시키는 경화제를 포함하는 것을 특징으로 하는 LED 조명 장치.It is contained in the matrix resin layer, LED lighting apparatus comprising a curing agent for curing the liquid thermosetting resin.
  14. 중앙부의 적어도 일면이 개방되며, 조명 장치의 몸체를 형성하는 몸체부를 포함하는 LED를 이용한 조명 장치에 탈부착 가능하도록 결합하는 LED 모듈에 있어서, In at least one surface of the central portion is open, the LED module for detachably coupling to the lighting device using the LED comprising a body portion forming a body of the lighting device,
    상기 몸체부의 개방된 일면과 평행하게 형성된 방열판;A heat sink formed in parallel with the open one surface of the body portion;
    상기 방열판과 수직한 방향으로 위치하며, 상기 LED가 실장되는 인쇄회로기판; 및A printed circuit board positioned in a direction perpendicular to the heat sink and mounted with the LED; And
    상기 몸체부의 형상에 상응하여 탈부착 가능하도록 결합가능한 모듈 결합부를 포함하는 LED 모듈부.LED module unit including a module coupling portion detachably coupled corresponding to the shape of the body portion.
  15. 제14항에 있어서,The method of claim 14,
    상기 인쇄회로기판을 지지하고 상기 방열판과 수직으로 형성된 인쇄회로기판 지지부를 더 포함하는 것을 특징으로 하는 LED 모듈부.And a printed circuit board support part supporting the printed circuit board and formed perpendicular to the heat sink.
  16. 제14항에 있어서, The method of claim 14,
    상기 LED 모듈부는, The LED module unit,
    상기 몸체부의 측면 방향에서 삽입 결합되는 것을 특징으로 하는 LED 모듈부.LED module unit characterized in that the insert is coupled in the side direction of the body portion.
  17. 제14항에 있어서, The method of claim 14,
    상기 LED 모듈부는, The LED module unit,
    상기 광이 출사되지 않는 개방된 타면 방향에서 삽입 결합되는 것을 특징으로 하는 LED 모듈부.The LED module unit, characterized in that the light is inserted and coupled in the other direction of the open direction is not emitted.
  18. 제14항에 있어서, The method of claim 14,
    상기 모듈 결합부는 상기 몸체부에 나사 결합하는 것을 특징으로 하는 LED 모듈부.LED module unit, characterized in that the module coupling portion screwed to the body.
PCT/KR2009/000574 2008-02-05 2009-02-05 Led module and illuminator using the same WO2009099310A2 (en)

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KR10-2008-0011993 2008-02-05

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KR101358736B1 (en) * 2012-09-12 2014-02-07 플러스웰주식회사 Lighting apparatus using light guide plate
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JP6353698B2 (en) * 2014-05-16 2018-07-04 明拓工業株式会社 Luminescent panel
KR200494250Y1 (en) * 2019-03-05 2021-09-03 엘이디라이팅 주식회사 Edge type LED lightint device
KR102118316B1 (en) * 2020-01-21 2020-06-04 김응석 Temperature control apparatus and method of combine box
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WO2009099310A3 (en) 2009-11-05
KR20090086003A (en) 2009-08-10

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