WO2009092480A1 - Heat sink and method for producing a heat sink - Google Patents
Heat sink and method for producing a heat sink Download PDFInfo
- Publication number
- WO2009092480A1 WO2009092480A1 PCT/EP2008/066290 EP2008066290W WO2009092480A1 WO 2009092480 A1 WO2009092480 A1 WO 2009092480A1 EP 2008066290 W EP2008066290 W EP 2008066290W WO 2009092480 A1 WO2009092480 A1 WO 2009092480A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- preform
- main extension
- produced
- composite material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0036—Matrix based on Al, Mg, Be or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00241—Physical properties of the materials not provided for elsewhere in C04B2111/00
- C04B2111/00405—Materials with a gradually increasing or decreasing concentration of ingredients or property from one layer to another
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00439—Physico-chemical properties of the materials not provided for elsewhere in C04B2111/00
- C04B2111/00465—Heat conducting materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the invention is based on a heat sink according to the preamble of claim 1.
- Such heat sinks are well known.
- JP 2005 044 841 A, WO 2004/005 566 A2, EP 1 168 438 A2, US Pat. No. 5,886,407 A and EP 0 859 410 A2 disclose cooling bodies which consist of homogeneous metal-carbon composite materials and in particular metal-ceramic Composites (MMC).
- MMC metal-ceramic Composites
- the composites include a matrix consisting of metals such as copper or aluminum and carbon particles dispersed in the matrix.
- These homogeneous composite materials are provided for dissipating the power waste heat, in particular of a semiconductor component, which is arranged on a first side of the heat sink.
- modules with MMC baseplate structure of the semiconductor device is electrically contacted by copper on an insulating layer, wherein the insulating layer is disposed on the MMC heat sink and in particular glued, so that an adjustment of the coefficient of thermal expansion of the heat sink to the thermal expansion coefficient of the insulating layer is sought.
- the heat sink is a composite body, wherein the material content of the insulating first material is greater at the first side than at the second side, so that the first side of the heat sink is preferably an insulation layer of the first material and the second side comprises predominantly the second material ,
- a combination of a comparatively good thermal conductivity of the second material with a comparatively low electrical conductivity of the first material is made possible in that a comparatively good adaptation of the thermal expansion coefficients is realized within the composite body and thus the thermomechanical stresses within the composite body compared to the prior art Technology are significantly lower.
- the material content of the second material in the composite material in the region of the second side is greater than the material content of the second material in the region of the first side, wherein preferably the first side substantially only the first material and / or the second side substantially only the second material, so that particularly advantageous the first side as insulating layer has a minimum electrical conductivity and the second side has a maximum thermal conductivity and at the same time a maximum thermal coupling between the first and the second side and a maximum adjustment of the thermal expansion coefficient of the first side with the thermal expansion coefficient of the second side are realized.
- particularly advantageous thermal stresses are minimized within the composite material, as occur by a preferably continuous transition from a high material content of the first material to a high material content of the second material in a direction perpendicular to the main extension direction no comparatively pronounced discontinuities of the thermal expansion coefficients in this direction at the same time the thermal coupling between the first and second material is maximized.
- the first material has a porosity, wherein the porosity increases perpendicularly to the main extension direction from the first side to the second side and wherein preferably the pore size and / or the pore density of the first material in the middle from the first side to second side perpendicular to
- Main extension direction increases, more preferably, the pores are filled with the second material.
- a different proportion of material of the first material between the first and the second side by a variation of the pore size and / or the pore density in the first material can be realized in a particularly simple and inexpensive to produce.
- a variation of the porosity of the second material, in particular with regard to the pore size and / or the pore density perpendicular to the main extension direction conceivable.
- the composite matehal has a plurality of composite material layers perpendicular to the main extension direction, wherein in particular the ratio of first material to second material is different between the composite material layers, so that in a particularly simple and cost effective manner a composite body with a different Material portion of the first material between the first and the second side can be produced.
- a composite body with a plurality of composite material layers is conceivable, wherein the ratio of the first material to the second material of a
- the first material is connected to the second material in a form-locking and / or non-positive manner and / or that the first material forms interpenetrating networks with the second material.
- a positive and / or non-positive connection between the first and the second material preferably results from filling in the pores of the first material by the second material.
- the mechanical strength within the heat sink in comparison to the prior art is increased to a considerable extent.
- the first material perpendicular to the main extension plane has a profile of the degree of porosity preferably from 0 vol% to 95 vol% and more preferably from 0 vol% to 65 vol%, most preferably the first side of a composite material layer essentially completely made of the first material of at least 50 .mu.m thickness perpendicular to the main extension plane, so that the properties of the low electrical conductivity of the insulating layer, the good thermal conductivity of the heat sink, as well as the good adaptation of the thermal expansion coefficients are realized comparatively well.
- the first material is a ceramic material, preferably oxides, nitrides and / or carbides, particularly preferably Al 2 O 3 , AlN, SiN 4 and / or SiC and very particularly preferably Al 2O 3, and the second material a metallic material, preferably copper, copper alloys, aluminum and / or aluminum alloys.
- a ceramic material preferably oxides, nitrides and / or carbides, particularly preferably Al 2 O 3 , AlN, SiN 4 and / or SiC and very particularly preferably Al 2O 3
- the second material a metallic material, preferably copper, copper alloys, aluminum and / or aluminum alloys.
- Particularly advantageous ceramic material has a comparatively low electrical conductivity, so that the requirements for a high insulating ability of the insulating layer are met, wherein metallic material has a comparatively good thermal conductivity, so that at the same time the requirements for the good cooling ability of the heat sink can be fulfilled.
- Another object of the present invention is an arrangement with a heat sink, wherein on the first side of the heat sink at least one electrical, electronic and / or micromechanical device and / or a conductor track and / or a connection layer is arranged, wherein preferably the first side at least partially is covered with a metal layer and particularly preferably at least partially covered with an aluminum and / or copper layer. Due to the electrically insulating insulating layer of the heat sink, it is particularly advantageously possible to apply printed conductors directly to the insulating layer for contacting electrical, electronic and / or micromechanical components, so that the implementation of a DBC stack becomes obsolete due to the described arrangement.
- Another object of the present invention is a method for producing a heat sink, wherein in a first process step, a preform with a porosity gradient is made perpendicular to the main plane of the first material, wherein in a second process step, the pores of the preform are filled with the second material.
- the preform is produced in the first process step by a negative impression, in particular by a negative impression of foams pressed together by means of ceramic slurry, preferably polyurethane foams are used, or that the preform in the first process step by a slip-pressure filtration and subsequently sintering, wherein preferably first a slurry mold is filled with two slips of different composition, wherein the ratio between the two slips is changed continuously and wherein subsequently the preform is produced by a pressure filtration and a sintering process, or that the preform in the first process step is produced by a Pulververpressung, wherein preferably powdered compositions of different compositions in a die one above the other and then
- the preform body is produced by layering and sintering a plurality of greenbody plates, wherein green body plates are preferably stacked on one another, which produce different porosities during sintering, or if the preform body in the first method step is
- the production of the heat sink by a plurality of manufacturing methods is particularly advantageous, whereby a comparatively flexible and cost-optimized production can be realized.
- the manufacturing processes are all relatively easy to control and cost feasible.
- Figure 1 is a schematic side view of an arrangement of a heat sink according to a first exemplary embodiment of the present invention
- Figure 2a is a schematic side view of a preform for producing a heat sink according to an exemplary second embodiment of the present invention
- Figure 2b is a schematic side view of a heat sink according to the exemplary second embodiment of the present invention.
- heat sink 1 shows a schematic side view of an arrangement 20 of a heat sink 1 according to a first exemplary embodiment of the present invention, wherein heat sink 1 comprises a composite material 2 having a first material 3 and a second material 4, the first material 3 comprising an electrical insulator, preferably a ceramic material, and the second material 4 comprise an electrical conductor, preferably a metal, wherein the heat sink 1 has a first side 5 parallel to a main extension plane 100 of the heat sink 1 and wherein the heat sink 1 is one of the first side 5 perpendicular to the main extension plane 100 opposite second side 6 has substantially parallel to the first side 5 and wherein the material content of the first material
- the material content of the first material 3 in the composite material 2 increases perpendicular to the main extension direction 100 from the first side 5 to the second side 6 in particular stepwise, while the material content of the second material 4 in the composite material 2 increases perpendicularly to the main extension direction 100 from the first side 5 to the second side 6 in particular gradually, so that the composite material 2 perpendicular to the main extension direction has a plurality of composite material layers 7 and the ratio of the first Material 3 to second material 4 between the composite material layers 7 is different in each case.
- the first material 3 has a porosity, wherein the porosity increases perpendicularly to the main extension direction 100 from the first side 5 to the second side 6 and in particular the pore size and the pore density of the first material 3 in the middle from the first side 5 to the second side. 6 increases perpendicular to the main extension direction 100 and wherein the pores 10 are filled with the second material 4.
- the composite material layer 7 in the area of the first side 5, which essentially has only the first material 3 has a thickness perpendicular to the main extension direction 100 of at least 50 ⁇ m.
- Semiconductor components 11 are arranged on the first side 5 of the heat sink 1, with a conductor 11 'made of copper in particular being arranged between the first side 5 and the semiconductor components 11.
- FIG. 2 a shows a schematic side view of a preform 1 'for producing a heat sink 1 according to an exemplary second embodiment of the present invention, wherein the preform V comprises only first material 3, wherein the preform V has a plurality of pores 10 and wherein the pore density perpendicular to the main extension plane 100 from the first side 5 to the second side 6 continuously or gradually increases, so that the material density of the first material 1 from the first to the second side 5, 6 decreases continuously or stepwise.
- the preform 1 ' is produced by a negative impression of polyurethane foams pressed together by ceramic slip or by a graded slip pressure filtration, preferably from two reservoirs with slurry of different composition, for example with respect to the pore formers or the grain sizes, a slip mold is filled, said Ratio of the two slip is changed in particular continuously and wherein subsequently a green body is produced therefrom by means of pressure filtration, which has a gradient, for example in the pore-forming agent fraction, so that after a subsequent sintering process the preform 1 'is formed with a porosity gradient.
- the preform 1 ' is prepared by a graded / stepped powder injection, wherein preferably powder of different composition in a die are scribed on each other and then pressed, with powder variations in the grain size or the pore formers are possible, or the preform 1' is formed by stacking Green body plates resulting in the same sintering conditions due to variations in the particle sizes or the Porenchanneranteile different porosities and subsequent sintering of the green body plates produced.
- FIG. 2b shows a schematic side view of a heat sink 1 according to the exemplary second embodiment of the present invention, wherein the heat sink 1 consists of the preform 1 'illustrated in FIG. 2a and produced in the first process step, which infiltrates pressure-assisted with a molten metal in a second process step was, preferably by means of squeeze cast technique or by gas pressure infiltration, so that the pores 10 are filled with the second material 4 and the heat sink preferably on the second side 6 has a composite material layer 7, which comprises substantially only the second material 4.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/811,332 US20100282459A1 (en) | 2008-01-22 | 2008-11-27 | Heat sink and method for manufacturing a heat sink |
EP08871587A EP2248166A1 (en) | 2008-01-22 | 2008-11-27 | Heat sink and method for producing a heat sink |
JP2010543403A JP2011510502A (en) | 2008-01-22 | 2008-11-27 | Heat sink and method for manufacturing the heat sink |
CN2008801252680A CN101925999A (en) | 2008-01-22 | 2008-11-27 | Heat sink and method for producing heat sink |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008005529A DE102008005529A1 (en) | 2008-01-22 | 2008-01-22 | Heat sink and method of manufacturing a heat sink |
DE102008005529.8 | 2008-01-22 |
Publications (1)
Publication Number | Publication Date |
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WO2009092480A1 true WO2009092480A1 (en) | 2009-07-30 |
Family
ID=40433955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/066290 WO2009092480A1 (en) | 2008-01-22 | 2008-11-27 | Heat sink and method for producing a heat sink |
Country Status (8)
Country | Link |
---|---|
US (1) | US20100282459A1 (en) |
EP (1) | EP2248166A1 (en) |
JP (1) | JP2011510502A (en) |
KR (1) | KR20100105734A (en) |
CN (1) | CN101925999A (en) |
DE (1) | DE102008005529A1 (en) |
TW (1) | TW200947643A (en) |
WO (1) | WO2009092480A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014016085A3 (en) * | 2012-07-25 | 2014-03-27 | Conti Temic Microelectronic Gmbh | Cooling device and method for producing a cooling device and circuit assembly having a cooling device |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102010001565A1 (en) * | 2010-02-04 | 2011-08-04 | Robert Bosch GmbH, 70469 | Power module with a circuit arrangement, electrical / electronic circuit arrangement, method for producing a power module |
JP5732798B2 (en) * | 2010-09-29 | 2015-06-10 | 住友大阪セメント株式会社 | Ceramic material |
DE112012005867B4 (en) | 2012-02-14 | 2021-10-07 | Mitsubishi Electric Corporation | Semiconductor device |
TWM441213U (en) * | 2012-04-12 | 2012-11-11 | Jin-Huan Ni | The porous heat dissipation module |
CN104703442A (en) * | 2012-06-28 | 2015-06-10 | 蔡州 | Efficient radiating device |
CN104764350B (en) * | 2014-01-08 | 2017-04-26 | 江苏格业新材料科技有限公司 | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core |
JP6405758B2 (en) * | 2014-07-11 | 2018-10-17 | 株式会社デンソー | Thermal conduction member |
DE102014216994B4 (en) * | 2014-08-26 | 2018-12-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for the preparation of a tempering element and tempering element produced by the process |
DE102015215571A1 (en) * | 2015-08-14 | 2017-02-16 | Siemens Aktiengesellschaft | Heat sink for an electronic component and method for its production |
JP2017041479A (en) * | 2015-08-18 | 2017-02-23 | セイコーエプソン株式会社 | Junction material, electronic device, projector, and manufacturing method of junction material |
DE102016115183A1 (en) * | 2016-08-16 | 2018-02-22 | Heraeus Sensor Technology Gmbh | Porous material, powder for producing a porous material, process for producing a porous material and component |
DE102018221160A1 (en) * | 2018-12-06 | 2020-06-10 | Siemens Aktiengesellschaft | Insulating ceramics for electrical circuits and related applications |
US11508641B2 (en) * | 2019-02-01 | 2022-11-22 | Toyota Motor Engineering & Manufacturing North America, Inc. | Thermally conductive and electrically insulative material |
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2008
- 2008-01-22 DE DE102008005529A patent/DE102008005529A1/en not_active Withdrawn
- 2008-11-27 WO PCT/EP2008/066290 patent/WO2009092480A1/en active Application Filing
- 2008-11-27 JP JP2010543403A patent/JP2011510502A/en active Pending
- 2008-11-27 KR KR1020107016429A patent/KR20100105734A/en not_active Application Discontinuation
- 2008-11-27 EP EP08871587A patent/EP2248166A1/en not_active Withdrawn
- 2008-11-27 CN CN2008801252680A patent/CN101925999A/en active Pending
- 2008-11-27 US US12/811,332 patent/US20100282459A1/en not_active Abandoned
-
2009
- 2009-01-20 TW TW098101973A patent/TW200947643A/en unknown
Patent Citations (7)
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Also Published As
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DE102008005529A1 (en) | 2009-07-23 |
TW200947643A (en) | 2009-11-16 |
KR20100105734A (en) | 2010-09-29 |
JP2011510502A (en) | 2011-03-31 |
US20100282459A1 (en) | 2010-11-11 |
CN101925999A (en) | 2010-12-22 |
EP2248166A1 (en) | 2010-11-10 |
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