WO2009081539A1 - 光送受信モジュール - Google Patents
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- WO2009081539A1 WO2009081539A1 PCT/JP2008/003766 JP2008003766W WO2009081539A1 WO 2009081539 A1 WO2009081539 A1 WO 2009081539A1 JP 2008003766 W JP2008003766 W JP 2008003766W WO 2009081539 A1 WO2009081539 A1 WO 2009081539A1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/14—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices
- H01L31/147—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
- H01L31/153—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers formed in, or on, a common substrate
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- G—PHYSICS
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- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29346—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by wave or beam interference
- G02B6/29361—Interference filters, e.g. multilayer coatings, thin film filters, dichroic splitters or mirrors based on multilayers, WDM filters
- G02B6/29362—Serial cascade of filters or filtering operations, e.g. for a large number of channels
- G02B6/29365—Serial cascade of filters or filtering operations, e.g. for a large number of channels in a multireflection configuration, i.e. beam following a zigzag path between filters or filtering operations
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- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
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- H01—ELECTRIC ELEMENTS
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- H01S5/00—Semiconductor lasers
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- H01S5/00—Semiconductor lasers
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
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- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
- H01S5/0687—Stabilising the frequency of the laser
Definitions
- the present invention relates to an optical transceiver module, and more particularly, to a structure of a bidirectional optical transceiver module that multiplexes or demultiplexes light having a plurality of wavelengths.
- Each subscriber side has an ONU (Optical Network Unit) installed as a terminal device, and a downstream signal (wavelength 1.5 ⁇ m) from the accommodation station to the subscriber side and an upstream signal (wavelength from the subscriber side to the accommodation station) 1.3 ⁇ m) is wavelength multiplexed (WDM) to transmit upstream and downstream signals using the same optical fiber.
- WDM wavelength multiplexed
- a two-wavelength bidirectional optical module is mounted in the ONU, and a light emitting element for transmitting an upstream signal (LD: Laser Diode) and a light receiving element for receiving a downstream signal (PD: Photo Detect). or), which basically consists of a WDM filter that separates upstream / downstream signals.
- Fig. 9 shows the conventional module system.
- a basic configuration of a single-core bidirectional (BIDI: Bi-Directional) module in which optical components of a light emitting element 175, a light receiving element 172, and a wavelength selection filter 177 are spatially arranged in a package 178 is shown.
- BIDI Bi-Directional
- the optical elements 175 and 172 mounted on the CAN packages 173 and 176 in which the lenses 171 and 174 are integrated are operated, the optical connection with the optical fiber 170 is performed, so that the optical connection can be performed.
- the optical coupling efficiency can be obtained.
- the number of parts and the number of processing steps are large, and it is a disadvantage that it is disadvantageous for reduction in size and cost.
- FIG. 10 shows the second method of the single-core bidirectional module disclosed in Non-Patent Document 1 (Science Technical Report, vol. 107, no. 7, R2007-2, pp. 7-10). A basic configuration is shown. The light emitting element 182, the light receiving element 186, and the wavelength selection filter 183 are arranged in the CAN package 187 to reduce the size.
- the light emitting element 182, the light receiving element 186, and the wavelength selection filter 183 need to be arranged three-dimensionally, as in the first example. There is a problem that it is complicated. Furthermore, considering expandability, for example, in the case of a three-wavelength bidirectional optical module, it is necessary to at least double the number of optical components and the mounting area, and it becomes increasingly difficult to reduce the size and cost.
- an object of the present invention is to provide a low-loss optical characteristic and high performance for an optical module used as a terminal for wavelength division multiplexing optical transmission or single-core bidirectional optical transmission, in which light of a plurality of wavelengths is transmitted through a single optical fiber.
- An object of the present invention is to provide an optical module that can significantly reduce the number of mounting steps while maintaining reliability, and can achieve a reduction in size and a high yield.
- an optical element mounting substrate in which one light emitting element and at least one light receiving element are mounted on the same plane, and typically wavelength selection on the front and back surfaces of a transparent substrate
- a wavelength multiplexer / demultiplexer equipped with a filter and a mirror is prepared, and these two components are mounted in a package such that the optical element mounting surface and the filter surface are at non-parallel angles.
- optical elements having different working wavelengths are mounted at desired positions.
- the optical multiplexer / demultiplexer uses a substrate having a desired thickness made of a material transparent to the wavelength of light having a pair of parallel opposing surfaces as a support substrate, and at least one kind of the pair of parallel surfaces is provided on one of the pair of parallel surfaces.
- the wavelength selection filter is provided with a mirror for reflecting light having a wavelength not selected by the first filter on the other surface.
- the filters and mirrors are provided with windows for light to enter and exit.
- the first lens is provided in the vicinity of the light emitting element or monolithically integrated, and the second lens that condenses the light emitted from the optical multiplexer / demultiplexer onto the optical fiber.
- the diameter of the second lens is It is characterized by being larger than the diameter of one lens.
- FIG. 2 is a diagram schematically showing functions when the present invention is applied to a module called an optical triplexer.
- the light of wavelength ⁇ 1 emitted from the light emitting element 11 is connected to an optical fiber (not shown) provided outside the module, and the light of wavelengths ⁇ 2 and ⁇ 3 emitted from the optical fiber is respectively predetermined.
- the light receiving elements 12 and 13 have a function of being incident. Since the wavelength multiplexer / demultiplexer 2 is mounted at an angle that is not perpendicular to the incident light from the optical fiber and the optical axis of the light emitting element 11, the light is obliquely incident on the wavelength selection filter array and the mirror array. The light of a specific wavelength is removed or added at the intersection of the optical axis.
- the optical axis of each wavelength is determined by the thickness d of the glass substrate and the angle ⁇ 1 and is aligned on a straight line on the horizontal plane. Therefore, if each element is arranged on this optical axis that is uniquely determined by design, the optical fiber and the optical element can be coupled.
- the light of wavelength ⁇ 1 emitted from the light emitting element 1 becomes a light beam whose diffusion is suppressed by the lens 1001 provided in the vicinity of the light emitting element 1 or monolithically integrated, and after passing through the wavelength multiplexer / demultiplexer 2, 4 is focused and incident on an optical fiber (not shown). At this time, the diameter of the lens 4 is made larger than the diameter of the lens 1001.
- the light emitted from the optical fiber (not shown) is condensed by the lens 4 onto one of the light receiving element 12 or the light receiving element 13.
- the distance from the lens 4 to the light emitting element 11 lens 1001 is shorter than the distance from the lens 4 to the light receiving element 12 or 13 as shown in FIG. That is, the optical system of the present invention is characterized in that the distance from the lens 4 to the light emitting element 11 and the lens 1001 is shorter than the distance from the point where the light emitted from the optical fiber is collected by the lens 4 to the lens 4.
- the first feature of the present invention is that a plurality of filters are automatically aligned only by aligning the glass substrate once, so that the mounting process is greatly reduced.
- the second feature is that the LD and PD are mounted in a planar manner on the optical element mounting substrate, so that the mounting is greatly simplified compared to the case of mounting three-dimensionally and high-precision mounting is possible.
- the number of processes can be reduced as compared with the case where alignment is performed individually for each element.
- the angle of the substrate is ⁇ 1
- the incident angle (incident angle) of light from the optical fiber or the optical element 11 with respect to the vertical direction of the substrate surface is ⁇ 1
- the multiple reflection period y inside the substrate is given by 2dtan ⁇ 2 where d is the thickness of the transparent substrate.
- the period z is given by 2dtan ⁇ 2 ⁇ cos ⁇ 1 . Since the period z corresponds to the interval between the elements mounted on the element mounting substrate, it is necessary to select d and ⁇ 1 so as to maintain an appropriate element interval. Since the element size never falls below 100 ⁇ m, the value of z needs to be 100 ⁇ m or more.
- the third feature is that the tolerance of the displacement of the light emitting element 1 can be greatly increased by making the diameter of the lens 4 larger than the diameter of the lens 1001.
- an optical transmission module that multiplexes and transmits light of a plurality of wavelengths, or an optical reception module that multiplexes and receives combined light for each wavelength, or single-core bidirectional.
- the optical transceiver module it is possible to provide an optical module that can reduce the number of optical components and the number of mounting steps while maintaining low-loss optical characteristics and high reliability, and that can achieve a reduction in size and a high yield, and a method for manufacturing the same.
- FIG. 1 is a sectional view of an optical module according to a first embodiment of the present invention.
- FIG. 1 shows an example in which the present invention is applied to a so-called optical triplexer module of a bidirectional optical transceiver module using three wavelengths.
- FIG. 1 shows an example of mounting in a CAN package.
- An optical element mounting substrate 1 in which a light emitting element 11 and light receiving elements 12 and 13 are mounted on a submount 10 is mounted on a CAN stem 14, and an optical multiplexer / demultiplexer 2 is connected to a CAN.
- the lens 1001 is provided in the vicinity of the light emitting element 1 or by being monolithically integrated.
- the operating wavelengths of the light emitting element 11 and the light receiving elements 12 and 13 are ⁇ 1 , ⁇ 2 , and ⁇ 3 , respectively, and the wavelength length relationship is ⁇ 1 ⁇ 2 ⁇ 3 .
- the light emitting element and the light receiving element are arranged from the shortest wavelength to the longest wavelength in FIG. However, in FIG. 1, it is also possible to arrange from the longest wavelength to the shortest wavelength.
- the optical multiplexer / demultiplexer 2 uses a transparent glass substrate 5 as a supporting substrate, and a first wavelength selection filter 6 and a second wavelength selection filter 7 are mounted adjacent to each other on one surface. A first mirror 8 and a second mirror 9 are mounted. Note that amorphous glass, sapphire crystal, crystalline quartz, or silicon can be used as the transparent glass substrate.
- the optical multiplexer / demultiplexer was mounted by aligning the outer shape of the CAN cap with the concaves and convexes and bonded with UV curable resin.
- the glass substrate was made of BK7 and had a thickness of 1136 ⁇ m.
- the glass substrate is mounted so that the angle with respect to the plane is 20 °, and the projection onto the plane of z in FIG. 2, that is, the pitch of multiple reflection, is 500 ⁇ m.
- the wavelength selection filter is composed of a dielectric multilayer film or a diffraction grating.
- the wavelength selective filter is a dielectric multilayer film made of Ta 2 O 5 and SiO 2 .
- the first wavelength selection filter 6 has a separation wavelength ⁇ th of ⁇ 1 ⁇ th ⁇ 2, a filter having a property of transmitting light having a wavelength shorter than ⁇ th and reflecting light having a longer wavelength (so-called Short pass filter).
- the second filter 7 was a short-pass filter with a separation wavelength of ⁇ 2 ⁇ th ⁇ 3 .
- the first wavelength selection filter 6 has a separation wavelength ⁇ th satisfying ⁇ 2 ⁇ th ⁇ 3 , transmits light having a wavelength longer than ⁇ th, and reflects light having a short wavelength
- the second filter 7 may be a short-pass filter with a separation wavelength of ⁇ 1 ⁇ th ⁇ 2 .
- the first mirror 8 was the same as the first wavelength selection filter 6, and the second mirror 9 was the same as the second wavelength selection filter 7.
- a vertical emission LD in which microlenses are integrated is used.
- an end emission LD can be used for the light emitting element 11
- a vertical emission type is desirable for ease of mounting
- a lens integrated type is desirable from the viewpoint of ease of optical coupling and reduction of the number of components.
- An amplifier and a capacitor are also mounted in the CAN, but they are not shown because they are the same as usual.
- the material of the transparent substrate 5 is not particularly limited as long as it is transparent to the wavelength used, but is preferably inexpensive and good in processing accuracy.
- BK7 is used to satisfy this condition, but other glass materials, dielectrics, and semiconductors may be used.
- the operation of this configuration example will be described.
- the light having the wavelength ⁇ 1 emitted from the light emitting element 11 reaches the first wavelength selection filter 6.
- the first wavelength selective filter 6 transmits the wavelength of lambda 1, it is refracted by the transparent substrate by translating the optical path is optically connected to an external optical fiber through the package lens 4.
- the light combined with the wavelengths ⁇ 2 and ⁇ 3 emitted from the optical fiber enters the transparent glass substrate, undergoes refraction, and reaches the first wavelength selection filter 6.
- the wavelengths ⁇ 2 and ⁇ 3 are reflected and reach the first mirror 8 facing each other. Since the first mirror 8 is the same as the first wavelength selection filter 6, the wavelengths ⁇ 2 and ⁇ 3 are reflected again.
- the reason why the mirror 8 is the same as that of the filter 6 is to improve the stopping power with respect to the wavelength ⁇ 1 .
- the light of wavelength ⁇ 1 emitted from the light emitting element 11 is slightly reflected on the surface of the lens 4, the end face of the optical fiber, and other places, and is incident again as return light. Even this wavelength lambda 1 of the return light is a slight amount of light, the noise made incident on the light receiving elements 12 and 13.
- the return light of ⁇ 1 is transmitted through the filter 6, but a small amount is reflected. Therefore, the light is transmitted again by the mirror 8 to further reduce the amount of light.
- the same mirror 6 as the filter 6 is used.
- the wavelength separation specification is not strict, it is sufficient to use a normal mirror having no wavelength dependency.
- the light reflected by the mirror 8 is incident on the filter surface again.
- the light reflected once by the mirror 8 is incident on the second filter, but in this configuration, the reflected light from the mirror 8 is incident on the filter 6 again. It is designed to reciprocate between the mirrors 8. This is to make the interval between the light emitting element 11 and the light receiving element 12 larger than the projection of the multiple reflection pitch. This is because a light emitting element driven at high speed may become a noise source (referred to as electrical crosstalk) for the light receiving element side.
- electrical crosstalk noise source
- the light that has reciprocated twice between the filter 6 and the mirror 8 enters the second wavelength selection filter 7.
- the wavelength ⁇ 2 and the wavelength ⁇ 3 are separated, pass through the wavelength ⁇ 2 filter, undergo refraction, and enter the light receiving element 12 perpendicularly.
- the wavelength ⁇ 3 is reflected and enters the mirror 9.
- the same dielectric multilayer filter as the filter 7 is used for the mirror 9 for the same reason as the case of the mirror 8.
- the light reflected by the mirror 9 passes through an interface without a filter (but with an AR coating) and enters the light receiving element 13.
- light emitted from an optical fiber (not shown) is condensed by the lens 4 onto one of the light receiving element 12 or the light receiving element 13.
- FIG. 8 shows the result of calculating the positional deviation of the light emitting element and the coupling efficiency with the optical fiber by optical simulation.
- FIG. 8A shows the result in the case of the conventional module system shown in FIG.
- the diameters of the lens 171 and the lens 174 are the same.
- FIG. 8B shows the result in the case of the modular system according to the present invention.
- the misalignment tolerance of the light emitting element is only 1.1 ⁇ m in the conventional module, but the misalignment tolerance can be expanded to approximately 11 ⁇ m in the module according to the present invention. Recognize.
- FIG. 3 is a cross-sectional view of the optical module of the second embodiment of the present invention.
- the present embodiment is a configuration example in which the present invention is applied to a two-wavelength single-core bidirectional (BIDI) module.
- the basic configuration and function are the same as in the first embodiment, but only one light receiving element is 30 and the number of wavelengths used is two. Therefore, each of the wavelength separation filter and the mirror is one of 26 and 27. It has become.
- FIG. 4 is a cross-sectional view of an optical module according to a third embodiment of the present invention.
- the present embodiment is a diagram showing a module configuration when a CAN package 92 equipped with the optical system shown in the first embodiment of the present invention is joined to a single mode fiber 93.
- Example 4 5 and 6 are diagrams showing an optical module according to a fourth embodiment of the present invention.
- a CAN package 101 on which a light emitting element and a light receiving element are mounted, an optical demultiplexer 102, a lens 103, and a single mode fiber 104 are mounted on a planar package 110.
- the CAN package has an optical element mounting substrate 112 on which a light emitting element 113 and light receiving elements 114 and 115 are mounted.
- the CAN package 101 is not limited to the form shown in FIG. 6 and can be a CAN package in which other combinations of LD and PD are mounted.
- FIG. 7 is a diagram showing an optical module according to the fifth embodiment of the present invention.
- an optical element mounting substrate 126 on which a light receiving element is surface-mounted is mounted in a form that stands vertically from the bottom surface of the planar package.
- the form shown in FIG. 7 is compatible with three wavelengths, the feature of this mounting form is that it can be handled relatively easily even if the number of wavelengths is further increased.
- FIG. 11 is a diagram showing a sixth embodiment of the present invention.
- FIG. 11 shows an example in which the present invention is applied to a three-wavelength bidirectional optical transceiver module for PON (Passive Optical Network).
- an optical element mounting substrate 1000 on which a light emitting element 191 and light receiving elements 192 and 193 are mounted on a submount 1007 is mounted on a CAN stem 194, and wavelength selection filters 196 and 197, and a mirror 198,
- An optical multiplexer / demultiplexer 1002 provided with 199 and a package lens 1004 are mounted on a CAN cap 1003.
- a single mode optical fiber 1006 is connected by a fiber holder 1005 mounted on the upper part of the CAN cap.
- the CAN cap 1003 is provided with recesses and projections for mounting the optical multiplexer / demultiplexer, and a holder portion for mounting the package lens 1004 is provided.
- the optical multiplexer / demultiplexer 1002 has a transparent glass substrate 195 as a supporting substrate, and a first wavelength selection filter 196 and a second wavelength selection filter 197 are mounted adjacent to each other on one surface.
- a first mirror 198 and a second mirror 199 are mounted.
- As the first wavelength selection filter 196 a filter having a transmittance of 96% for a wavelength of 1310 nm, a reflectance of 99% or more for a wavelength of 1490 nm, and a reflectance of 99% or more for a wavelength of 1555 nm is used.
- the mirror 198 is the same as the wavelength selection filter 196, and the mirror 199 is the same as the wavelength selection filter 197.
- the glass substrate was made of transparent glass having a refractive index of 1.5, and the thickness was 697 ⁇ m.
- the glass substrate is mounted so that the angle with respect to the plane is 30 °.
- the package lens has a focal length of 1.98 mm, an optical intensity on the multiplexer / demultiplexer side of 0.04 for NA at 1 / e 2 , and an optical intensity on the fiber side of 1 / e 2 for 0.09. A thing was used.
- the light emitting element 191 on the optical integrated substrate has a oscillation wavelength of 1.3 ⁇ m band produced on an InP substrate, and uses a vertical emission LD in which a lens 1008 is monolithically integrated.
- the lens 1008 has a laser beam radiation angle of 4 from the LD. The one that gave a ° was used.
- the wafer With respect to an optical module used as a terminal for wavelength multiplexing optical transmission or single-core bidirectional optical transmission that transmits light of a plurality of wavelengths using a single optical fiber, while maintaining low loss optical characteristics and high reliability, the wafer
- the number of optical components and the number of mounting processes can be greatly reduced by batch production of processes and the like, and an optical module that can be miniaturized and can achieve a high yield and a manufacturing method thereof can be provided.
- (A) is a sectional view of a three-wavelength bidirectional optical transceiver module according to the first embodiment of the present invention
- (B) is a sectional view of an integrated lens mounted in (A)
- (C ) Is a cross-sectional view of an installation type lens mounted on (A). It is the figure explaining the effect
- Optical element mounting substrate 2, 22, 102, 122, 1002 ... wavelength multiplexer / demultiplexer, 3,23,1003 ... CAN cap, 4, 24, 103, 111, 123, 171, 174, 181, 1001, 1004, 1008 ... lens, 124 ... Lens holder, 5, 25, 105, 184, 195 ... glass substrate, 185 ... Filter holder, 6, 7, 26, 106, 107, 131, 132, 133, 177, 183, 196, 197 ... Wavelength selection filter, 8,9,27,108,109,135,136,198,199 ... mirror, 10, 28, 112, 126, 1007 ... submount, 11, 29, 113, 175, 182, 191 ...
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Abstract
Description
or)、上り/下り信号を分離するWDMフィルタで基本的に構成されている。
図1は、本発明の第一の実施例である光モジュールの断面図である。図1は本発明を、三波長を用いた双方向光送受信モジュールのいわゆる光トリプレクサーと呼ばれるモジュールに応用した例である。
ミラー8で反射された光は再びフィルタ面へと入射する。最も素朴な設計では、ミラー8で一回反射された光は第二のフィルタに入射する構成となるが、本構成ではミラー8からの反射光は再びフィルタ6上へと入射し、フィルタ6とミラー8の間をもう一往復させる設計としている。これは、発光素子11と受光素子12の間隔を多重反射のピッチの射影より大きくするためである。高速で駆動する発光素子は、受光素子側に対するノイズ源(これを電気的クロストークと呼ぶ)となる恐れがあるためである。電気的クロストークその他特段の理由がない場合は、ガラス基板内の多重反射のピッチと素子の実装ピッチを一致させて反射回数を最小にする構成が望ましい。
図3は、本発明の第二の実施例の光モジュールの断面図である。本実施形態は、本発明を2波長一芯双方向(BIDI: Bi-Directional)モジュールに応用した構成例である。基本的な構成、機能は第一の実施例と同様であるが、受光素子は30の一つのみで、使う波長数は二つなので、波長分離フィルタとミラーは26と27の各一つずつとなっている。
図4は、本発明の第三の実施例の光モジュールの断面図である。本実施形態は、本発明の第一の実施例に示す光学系を搭載したCANパッケージ92をシングルモードファイバ93に接合する場合のモジュール構成を示した図である。
図5、図6は、本発明の第四の実施形態の光モジュールを示す図である。本実施形態に於いては、平面型パッケージ110に、発光素子および受光素子が実装されたCANパッケージ101、光号分波器102、レンズ103、シングルモードファイバ104が実装されている。CANパッケージの構成は図6に示すように、発光素子113、受光素子114,115が搭載された光素子搭載基板112が実装されている。CANパッケージ101は図6の形態に限らず、LD及びPDの他の組合わせを実装したCANパッケージでも可能である。
図7は、本発明の第五の実施形態の光モジュールを示す図である。本実施形態に於いては、平面型パッケージ137に、発光素子11、光受光素子128、129をサブマウント126上に実装した光素子搭載基板121と、波長選択フィルタ131、132、133およびミラー135、136を備えた光号分波器122、レンズ123、シングルモードファイバ125が実装されている。図7に示されるように本実施形態では、光受光素子を表面実装した光素子搭載基板126を、平面型パッケージの底面から垂直に屹立する形態で実装する。図7に示した形態では3波長対応になっているが、更に波長数を増やしても比較的容易に対応できるのが本実装形態の特徴である。
図11は本発明の第六の実施の形態を示す図である。図11は本発明をPON(Passive Optical Network)用三波長双方向光送受信モジュールに応用した例である。本実施形態に於いては、発光素子191と受光素子192、193をサブマウント1007上に搭載した光素子搭載基板1000がCANステム194上に実装され、波長選択フィルタ196、197、およびミラー198、199を備えた光合分波器1002およびパッケージレンズ1004がCANキャップ1003に実装されている。また、シングルモード光ファイバ1006がCANキャップ上部に実装されたファイバホルダ1005により接続されている。CANキャップ1003内部には光合分波器の実装を可能にするための凹凸が設けられており、またパッケージレンズ1004を実装するためのホルダ部が設けられている。光合分波器1002は透明ガラス基板195を支持基板とし、一方の面に第1の波長選択フィルタ196と第2の波長選択フィルタ197が隣接して実装され、この面と平行な対向する面に第1のミラー198と第2のミラー199が実装されている。第1の波長選択フィルタ196には波長1310nmに対する透過率が96%、波長1490nmに対する反射率が99%以上、波長1555nmに対する反射率が99%以上のものを用い、第2の波長選択フィルタ197には波長1310nmに対する透過率が40%、波長1490nmに対する透過率が99%以上、波長1555nmに対する反射率が99%以上のものを用いた。本実施例では、ミラー198は波長選択フィルタ196と同じものを用い、ミラー199には波長選択フィルタ197と同じものを用いた。
2,22,102,122,1002…波長合分波器、
3,23,1003…CANキャップ、
4,24,103,111,123,171,174、181、1001,1004,1008…レンズ、
124…レンズホルダ、
5,25,105,184,195…ガラス基板、
185…フィルタホルダ、6,7,26,106,107,131,132,133,177,183,196,197…波長選択フィルタ、
8,9,27,108,109,135,136,198,199…ミラー、
10,28,112,126,1007…サブマウント、
11,29, 113, 175,182,191…発光素子、
12,13,30,114,115,128,129,172,186,192,193…受光素子、
14,31,194…CANステム、
91,110,137,178…パッケージ、
92,173,176,187…CANパッケージ、
93,104,125,170,180,1006…シングルモードファイバ、101,141,142…光受信CANモジュール
1005…ファイバホルダ。
Claims (20)
- 外部に設けられた光ファイバの光軸と光学的に接続される使用波長がそれぞれ異なる一つの発光素子と、少なくとも一つの受光素子とを備え、
前記発光素子と前記受光素子のそれぞれが、実装基板表面上の同一方向に搭載された光素子搭載基板と、
前記発光素子の近傍に設けられた、あるいは前記発光素子と一体化されてモノリシック集積された第1のレンズと、
少なくとも一種類の波長選択フィルタと、前記波長選択フィルタに対して所定の間隔を保って対向して配置されたミラーとから構成される光合分波器と、
前記光素子搭載基板と前記光合分波器とを所望の位置に固定し収納するパッケージと、
前記光合分波器から出射した光を前記光ファイバに集光する第2のレンズと、を有し、
前記第2のレンズの直径を、前記第1のレンズの直径よりも大きくし、
前記光合分波器を、前記光ファイバの光軸に対して所定の角度を有するように前記パッケージに固定することにより、
前記光ファイバから出射された光が、前記第2のレンズにより前記受光素子のいずれか一つに集光され、
前記光ファイバ、あるいは前記発光素子から出射された光が、前記波長選択フィルタ面に非垂直な角度で入射され、前記非垂直な角度で入射した光が前記波長選択フィルタと前記ミラーとの間を多重反射していく過程で波長の異なる光を分離あるいは重畳し合分波されることを特徴とする光送受信モジュール。 - 前記発光素子は、前記光ファイバから出射した光が前記第2のレンズにより結像する焦点位置よりも、前記第2のレンズに近い側に設けられていることを特徴とする請求項1に記載の光送受信モジュール。
- 前記光合分波器が、使用波長に対して透明な材質からなる一対の平行面を持つ基板を有し、
前記一対の平行面の一方に、前記波長選択フィルタの少なくとも一種類が設けられ、
もう一方の平行面に、前記ミラーが設けられていることを特徴とする請求項1に記載の光送受信モジュール。 - 前記光合分波器は、前記光ファイバから出射された光が、前記波長選択フィルタで反射され、前記ミラーで再度反射される過程において、前記ミラーの透過・反射特性が、前記波長選択フィルタの透過帯域の光を透過する特性を有することを特徴とする請求項1に記載の光送受信モジュール。
- 前記ミラーが、前記光合分波器内の光路上で前記ミラーの手前に位置する波長選択フィルタと同一の波長選択フィルタであることを特徴とする請求項4に記載の光送受信モジュール。
- 前記波長選択フィルタが、誘電体多層膜で構成されることを特徴とする請求項1に記載の光送受信モジュール。
- 前記波長選択フィルタが、回折格子で構成されることを特徴とする請求項1に記載の光送受信モジュール。
- 前記波長選択フィルタが設けられた基板の部材が、非晶質ガラス、サファイア結晶、結晶石英、シリコンのいずれかであることを特徴とする請求項1に記載の光送受信モジュール。
- 前記パッケージが、メタルキャンパッケージであり、
内壁部分に凹凸形状が設けられたキャンキャップを用いることにより、前記波長選択フィルタが設けられた基板を所望の角度に固定することを特徴とする請求項1に記載の光送受信モジュール。 - 前記発光素子から出射される第1の波長の光を前記光ファイバに結合して送信し、
前記光ファイバから出射される第2の波長の光を前記受光素子に導き受信する二波長双方向光送受信機能を有することを特徴とする請求項1に記載の光送受信モジュール。 - 前記発光素子が、前記実装基板に対して垂直に光を出射するレーザーダイオードであることを特徴とする請求項1に記載の光送受信モジュール。
- 外部に設けられた光ファイバの光軸と光学的に接続される使用波長がそれぞれ異なる一つの発光素子と、少なくとも二つの受光素子とを備え、
前記発光素子と前記受光素子のそれぞれが、実装基板表面上の同一方向に搭載された光素子搭載基板と、
前記発光素子の近傍に設けられた、あるいは前記発光素子と一体化されてモノリシック集積された第1のレンズと、
少なくとも二種類の波長選択フィルタが、前記波長選択フィルタの表面が同一平面上に並ぶように配置された波長選択フィルタアレイと、前記波長選択フィルタアレイに対して所定の距離を保って対向して配置されたミラーあるいはミラーアレイとから構成される光合分波器と、
前記光素子搭載基板と前記光合分波器とを所望の位置に固定し収納するパッケージと、
前記光合分波器から出射した光を前記光ファイバに集光する第2のレンズと、を有し、
前記第2のレンズの直径を、前記第1のレンズの直径よりも大きくし、
前記光合分波器を、前記光ファイバの光軸に対して所定の角度を有するように前記パッケージに固定することにより、
前記光ファイバから出射された光が、前記第2のレンズにより前記受光素子のいずれか一つに集光され、
前記光ファイバ、あるいは前記発光素子から出射された光が、前記波長選択フィルタアレイ面に非垂直な角度で入射され、前記非垂直な角度で入射した光が、前記波長選択フィルタアレイと前記ミラーあるいはミラーアレイとの間を多重反射していく過程で波長の異なる光を分離あるいは重畳し合分波されることを特徴とする光送受信モジュール。 - 前記発光素子は、前記光ファイバから出射した光が前記第2のレンズにより結像する焦点位置よりも、前記第2のレンズに近い側に設けられていることを特徴とする請求項12に記載の光送受信モジュール。
- 前記光合分波器が、使用波長に対して透明な材質からなる一対の平行面を持つ筐体を有し、
前記一対の平行面の一方に、前記波長選択フィルタアレイの少なくとも二種類が設けられ、
もう一方の平行面に、前記ミラーあるいはミラーアレイが設けられていることを特徴とする請求項12に記載の光送受信モジュール。 - 前記光合分波部品は、前記光ファイバから出射された光が、前記波長選択フィルタアレイで反射され、前記ミラーで再度反射される過程において、前記ミラーの透過・反射特性が、前記波長選択フィルタの透過帯域の光を透過する特性を有することを特徴とする請求項12に記載の光送受信モジュール。
- 前記ミラーが、前記光合分波器内の光路上で前記ミラーの手前に位置する波長選択フィルタアレイと同一の波長選択フィルタであることを特徴とする請求項15に記載の光送受信モジュール。
- 前記発光素子が、前記実装基板に対して垂直に光を出射するレーザーダイオードであることを特徴とする請求項12に記載の光送受信モジュール。
- 前記実装基板表面上の同一方向に実装された前記発光素子および少なくとも二つの前記受光素子は、それぞれの素子の使用波長が大きくなる順あるいは小さくなる順に配置されていることを特徴とする請求項12に記載の光送受信モジュール。
- 前記合分波器のフィルタアレイを構成する各フィルタが、前記発光素子および前記受光素子のそれぞれの使用波長範囲内で所望の分離波長以上あるいは以下の波長の光のいずれかを透過し、それ以外の光を反射する特性を持つ、所謂エッジフィルタであって、
前記フィルタアレイ上のエッジフィルタの並び順が、分離波長の昇順あるいは降順に実装されていることを特徴とする請求項12に記載の光送受信モジュール。 - 前記発光素子から出射される第1の波長の光を前記光ファイバに結合して送信し、
前記光ファイバから波長多重されて出射される光から第2の波長の光と第3の波長の光を波長分離し、それぞれに対応した前記受光素子に導き受信する三波長双方向光送受信機能を有することを特徴とする請求項12に記載の光送受信モジュール。
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Also Published As
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JPWO2009081539A1 (ja) | 2011-05-06 |
CN101918872A (zh) | 2010-12-15 |
CN101918872B (zh) | 2014-03-26 |
JP5439191B2 (ja) | 2014-03-12 |
EP2226661A1 (en) | 2010-09-08 |
US20100278482A1 (en) | 2010-11-04 |
US8303195B2 (en) | 2012-11-06 |
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